Middle frame structural member and electronic device

Abstract

The present application relates to the technical field of electronic products, and provides a middle frame structural member and an electronic device, for use in solving the problem of low stability of welding a metal piece into a narrow gap of a middle plate. The middle frame structural member may comprise a middle plate and a conductive member; the middle plate comprises a first surface and a second surface which are opposite to each other; a mounting groove is formed in the middle plate and comprises an opening and a first side wall; the opening is formed in a first surface, and the first side wall is connected to the first surface; the conductive member is grounded and comprises a fixed plate and a connecting plate; the fixed plate is fixed to the first surface and is electrically connected to the first surface; the connecting plate has one end connected to the fixed plate, and the other end located in the mounting groove; and the connecting plate is opposite to the first side wall. The middle frame structural member provided by the present application is used for improving the stability of welding a metal piece into a narrow gap of a middle plate.

Description

Middle frame structural component and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on July 31, 2023, with application number 202322067042.4 and invention name “A middle frame structural component and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a middle frame structure and an electronic device. Background Art

[0003] The electronic device includes a circuit board with integrated electronic components. The circuit board with integrated electronic components needs to be grounded. In the prior art, the grounding of the circuit board is achieved by welding a metal sheet on the midboard and electrically connecting the ground circuit on the circuit board to the metal sheet.

[0004] However, the spatial layout of electronic equipment is relatively tight, and the metal sheet used for grounding needs to be welded in the narrow gap of the middle plate. Due to the limitations of the width of the narrow gap, welding angle and other conditions, the stability of the metal sheet welded to the inside of the narrow gap cannot be guaranteed, the product quality requirements cannot be met, and the product yield is low.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a middle frame structure and an electronic device for improving the stability of welding metal sheets in narrow gaps in a middle plate.

[0007] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0008] In a first aspect, a middle frame structural member is provided, which includes: a middle plate and a conductive member, the middle plate includes a first surface and a second surface opposite to each other, a mounting groove is provided on the middle plate, the mounting groove includes an opening and a first side wall, the opening is located on the first surface, and the first side wall is connected to the first surface; the conductive member is grounded, the conductive member includes a fixed plate and a connecting plate, the fixed plate is fixed to the first surface, one end of the connecting plate is connected to the fixed plate, and the other end is located in the mounting groove, and the connecting plate is arranged opposite to the first side wall.

[0009] Among them, the fixing plate is fixed on the first surface, and the fixing position of the fixing plate is located outside the mounting groove, so the fixation of the fixing plate is not restricted by the mounting groove, thereby ensuring the stability of the fixing plate fixed to the first surface; thus, the conductive sheet is set as a fixing plate and a connecting plate, and the fixing plate is set to meet the fixation of the conductive part; the electrical connection between the grounding contact and the conductive part is achieved by setting the connecting plate, and due to the grounding treatment of the conductive part, the grounding of the grounding circuit on the circuit board is met.

[0010] In a possible implementation of the first aspect, the first surface includes a first grounding area, and the fixing plate is electrically connected to the first grounding area. In this way, the conductive member is grounded through the electrical connection between the fixing member and the first grounding area.

[0011] In one possible implementation of the first aspect, a positioning groove is provided on the first surface, with the side of the positioning groove closest to the opening being open. The first grounding region is located on the bottom wall of the positioning groove, with the bottom wall oriented in the same direction as the first surface. Thus, the positioning groove provides a mounting location for the fixing plate of the conductive member, achieving a pre-positioning effect and ensuring the accuracy of the welding of the fixing member to the first grounding region.

[0012] In a possible implementation of the first aspect, a surface of the fixing plate facing away from the first grounding region is flush with the first surface, thereby ensuring the overall flatness of the middle plate on the first surface and providing a relatively flat fitting surface for the back cover to fit.

[0013] In one possible implementation of the first aspect, a second grounding region is provided on the first sidewall, and the connecting plate is electrically connected to the second grounding region. Thus, by providing the second grounding region and electrically connecting the connecting plate to the second grounding region, the contact area between the conductive member and the midboard can be increased, thereby improving the electrical connection between the conductive member and the midboard, and also improving the electrical connection between the ground circuit on the circuit board and the midboard.

[0014] In one possible implementation of the first aspect, a conductive protrusion is provided on the first side wall, the conductive protrusion protruding from the first side wall, and the second grounding region is located on a surface of the conductive protrusion facing away from the first side wall. Thus, by providing the conductive protrusion, the distance between the connecting plate and the circuit board can be reduced, thereby increasing the contact pressure between the conductive spring and the connecting plate, thereby reducing the contact resistance between the conductive spring and the connecting plate.

[0015] In one possible implementation of the first aspect, the first surface includes a first grounding region, the fixing plate is electrically connected to the first grounding region, the first grounding region extends to an edge of the opening, and a second grounding region is provided on the first sidewall, the first grounding region and the second grounding region being connected. Thus, by connecting the first grounding region and the second grounding region, the contact area between the conductive member and the midplane can be maximized, thereby maximizing the electrical connection between the conductive member and the midplane, and thereby maximizing the electrical connection between the ground circuit on the circuit board and the midplane.

[0016] In a possible implementation of the first aspect, the fixing plate and the connecting plate are integrally formed, thereby reducing the number of production lines for the conductive parts and shortening the production time of the conductive parts.

[0017] In one possible implementation of the first aspect, the connecting plate includes a fixed end and a free end, the fixed end being connected to the fixing plate; and the connecting plate is inclined in a direction away from the first sidewall in a direction from the first surface to the second surface. Thus, by arranging the connecting plate in an inclined manner, the function of the conductive spring can be replaced, allowing the free end of the connecting plate to be directly electrically connected to the ground circuit on the circuit board, thereby reducing the number of components in the mounting slot.

[0018] In a possible implementation of the first aspect, a contact protrusion is provided on a surface of the connecting plate facing away from the first side wall, and the contact protrusion is provided near the free end. Thus, by providing the contact protrusion near the free end of the connecting plate, it is used to abut against the ground contact on the circuit board.

[0019] In a possible implementation of the first aspect, the impedance of the conductive member is less than or equal to 0.5 ohms. Thus, the impedance of the conductive member is less than or equal to 0.5 ohms, which can meet the electrical connection requirements of the ground circuit on the circuit board.

[0020] In one possible implementation of the first aspect, the conductive element includes a metal body and a metal film layer, the metal film layer covering an outer surface of the metal body, and the impedance of the metal film layer is lower than the impedance of the metal body. Generally, metals with lower impedance are more expensive. To control the cost of the conductive element, the metal body can be made of a common metal with lower cost, and the metal film layer with lower impedance can be provided on the surface of the metal body. Thus, by covering the common metal body with the metal film layer made of a precious metal, the conductive element can meet impedance requirements while controlling costs.

[0021] In a possible implementation manner of the first aspect, the metal body is made of copper, or the metal body is made of stainless steel; and the metal film layer is made of gold, or the metal film layer is made of nickel.

[0022] In a possible implementation of the first aspect, the middle frame structure further includes: a circuit board; the mounting groove further includes a second side wall opposite to the first side wall, and the circuit board is disposed on the second side wall.

[0023] In one possible implementation of the first aspect, a groove is provided on the second sidewall. The groove is formed by a portion of the second sidewall being recessed in a direction away from the first sidewall. The groove is open toward a side of the first surface. The circuit board is disposed in the groove. Thus, the groove provided on the second sidewall provides an assembly position for the circuit board.

[0024] In one possible implementation of the first aspect, a ground contact is provided on a surface of the circuit board facing away from the second side wall. The middle frame structure further includes a conductive spring that abuts between the ground contact and the connecting plate. Thus, the conductive spring achieves electrical connection between the ground contact and the connecting plate.

[0025] In a possible implementation of the first aspect, the device further includes a frame disposed around the periphery of the middle plate. Thus, the frame protects the internal structure of the electronic device and acts as a shock absorber when the electronic device is accidentally bumped or dropped.

[0026] In a possible implementation of the first aspect, an equipment compartment is provided on the middle frame structure, and the mounting groove is located on the circumferential outer side of the equipment compartment.

[0027] In a second aspect, an electronic device is further provided. The electronic device includes a back cover and the middle frame structure described in any one of the solutions in the first aspect, wherein the back cover is assembled on the middle frame structure.

[0028] Since the electronic device provided in the present application includes the middle frame structure described in any one of the technical solutions of the first aspect above, the two can solve the same technical problems and achieve the same effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic diagram of the structure of an electronic device provided in some embodiments of the present application;

[0030] FIG2 is a partial schematic diagram of the middle frame structure shown in FIG1 ;

[0031] FIG3 is a schematic structural diagram of the middle plate shown in FIG2 ;

[0032] FIG4 is a partial schematic diagram of the middle plate shown in FIG3 ;

[0033] FIG5 is a partial schematic diagram of the first side wall shown in FIG4 ;

[0034] FIG6 is a schematic diagram of a metal sheet welded to a grounding area in some embodiments of the present application;

[0035] FIG7 is a schematic diagram of laser welding in some embodiments of the present application;

[0036] FIG8 is a schematic diagram of metal sheets welded to a grounding area in some other embodiments of the present application;

[0037] FIG9 is a schematic diagram of a middle plate provided in some other embodiments of the present application;

[0038] FIG10 is a schematic diagram of the assembly of the middle plate and the conductive member shown in FIG9 ;

[0039] FIG11 is a partial schematic diagram of the first grounding area shown in FIG10 ;

[0040] FIG12 is a cross-sectional view of the conductive member shown in FIG11;

[0041] FIG13 is a schematic diagram of a groove in some embodiments of the present application;

[0042] FIG14 is a schematic diagram of a middle frame structure provided in some other embodiments of the present application;

[0043] FIG15 is a schematic diagram of the conductive member shown in FIG14 in a free state;

[0044] FIG. 16 is a schematic diagram of the conductive member shown in FIG. 14 in a compressed state.

[0045] Figure 10: Electronic device; 100: Middle frame structure; 110: Middle plate; 111: Equipment compartment; 112: First surface; 1121: First grounding area; 1122: Second grounding area; 1123: Conductive protrusion; 1124: Positioning groove; 113: Second surface; 114: Mounting groove; 1141: Opening; 1142: First side wall; 1143: Second side wall; 115: Grounding area; 116: Metal sheet; 1161: Fixing sheet; 1162: Connecting plate Contact piece; 120, frame; 130, circuit board; 131, first board surface; 140, conductive spring; 141, fixing portion; 142, abutting portion; 150, conductive member; 151, fixing plate; 152, connecting plate; 1521, contact protrusion; 1523, free end; 1524, fixed end; 160, groove; 161, first inner groove surface; 163, third inner groove surface; 164, fourth inner groove surface; 170, adhesive layer; 180, solder joint; 200, back cover; 300, display cover. DETAILED DESCRIPTION

[0046] In the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," or "third" may explicitly or implicitly include one or more of the features.

[0047] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0048] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0049] In the embodiments of the present application, unless otherwise specified, the term "parallel" means approximately parallel within a certain error range, which may be a range of 5° or less relative to absolute parallelism. The term "perpendicular" means approximately perpendicular within a certain error range, which may be a range of 5° or less relative to absolute perpendicularity.

[0050] The present application provides an electronic device, which is an electronic device having a middle frame structure. For example, the electronic device can be a tablet computer (portable Android device, PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self-driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home) and other mobile terminals or fixed terminals. In the embodiments of the present application, the form of the electronic device is not specifically limited.

[0051] Please refer to Figure 1, which is a schematic diagram of the structure of an electronic device provided in some embodiments of the present application; this embodiment and the embodiments below are exemplified by taking the electronic device 10 as a mobile phone. The electronic device 10 is approximately in the shape of a rectangular plate. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, defining the width direction of the electronic device 10 as the X-axis direction, the length direction of the electronic device 10 as the Y-axis direction, and the thickness direction of the electronic device 10 as the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 10 can be flexibly set according to actual needs and is not specifically limited here.

[0052] In some other embodiments, the shape of the electronic device 10 may also be a square flat plate, a circular flat plate, an elliptical flat plate, etc., which is not specifically limited here.

[0053] In some embodiments of the present application, please continue to refer to Figure 1. The electronic device 10 may include a middle frame structure 100, a display cover 300 and a back cover 200. The middle frame structure 100 is located between the display cover 300 and the back cover 200. The middle frame structure 100, the display cover 300 and the back cover 200 jointly define the internal space of the electronic device 10. For example, as shown in Figure 1, in the Z-axis direction, the display cover 300, the middle frame structure 100 and the back cover 200 are stacked, the display cover 300 is assembled on the side of the middle frame structure 100 in the positive direction of the Z-axis, and the back cover 200 is assembled on the side of the middle frame structure 100 in the negative direction of the Z-axis, wherein the middle frame structure 100 is the main frame of the electronic device 10.

[0054] Please refer to Figure 2, which is a partial schematic diagram of the middle frame structure shown in Figure 1; the middle frame structure 100 may include a frame 120 and a middle plate 110, the middle plate 110 may be made of metal, exemplarily, the material of the middle plate 110 is aluminum alloy, and an equipment compartment 111 is provided on the middle plate 110, specifically, the equipment compartment 111 can be used to assemble batteries, or the equipment compartment 111 can also be used to assemble a camera module, the frame 120 is arranged around the periphery of the middle plate 110, exemplarily, the frame 120 is injection molded on the outer periphery of the middle plate 110, the plastic frame 120 can protect the display screen, when the electronic device falls, the plastic frame 120 can increase the buffer between the middle plate and the external environment, and reduce the possibility of the display screen being broken.

[0055] The electronic device also includes a functional circuit board with integrated electronic components. Specifically, the functional circuit board can be a functional circuit board for power management, a functional circuit board for signal transmission, or a functional circuit board for storage. During the use of the electronic device, in order to ensure the stability of the circuit in the functional circuit board, the functional circuit board generally needs to be provided with a grounding circuit. The grounding of the functional circuit board can effectively reduce the floating potential and interference signals that may appear in the circuit, and can also effectively shield electromagnetic interference, prevent the signal from being interfered with by the outside world, and prevent the signal from interfering with other systems. Generally, a metal middle plate is used as a ground reference, and the grounding circuit on the functional circuit board is grounded by being electrically connected to the middle plate.

[0056] Please refer to Figures 3 and 4. Figure 3 is a schematic diagram of the structure of the middle plate shown in Figure 2; Figure 4 is a partial schematic diagram of the middle plate shown in Figure 3. Middle plate 110 includes a first surface 112 and a second surface 113 facing each other. In some embodiments, first surface 112 may face the back cover, and second surface 113 may face the display cover. In other embodiments, first surface 112 may face the display cover, and second surface 113 may face the back cover. The middle plate 110 is provided with a mounting groove 114, which is located on the circumferential outer side of the equipment compartment 111 (for example, the mounting groove 114 shown in Figure 4 is located on the side of the equipment compartment 111 in the positive direction of the X-axis), the mounting groove 114 includes an opening 1141, and the opening 1141 is located on the first surface 112. The mounting groove 114 can also include a first side wall 1142 and a second side wall 1143 arranged opposite to each other, the first side wall 1142 is connected to the first surface 112, the second side wall 1143 is connected to the first surface 112, the second side wall 1143 is close to the equipment compartment 111, and a circuit board 130 is provided on the second side wall 1143. The grounding circuit on the circuit board 130 includes a grounding contact, and a grounding area is provided on the first side wall 1142. The grounding area is the metal surface exposed between the middle plate and the frame. The grounding contact on the circuit board 130 is electrically connected to the grounding area on the first side wall 1142, thereby realizing grounding of the circuit on the circuit board 130.

[0057] The grounding circuit of the circuit board 130 in the mounting slot 114 can be electrically connected to the grounding circuit of the functional circuit board. Thus, by grounding the circuit board 130 in the mounting slot 114, the grounding circuit in the functional circuit board is grounded. Both the functional circuit board and the circuit board 130 in the mounting slot 114 provided in this application can be printed circuit boards (PCBs) or flexible printed circuits (FPCs).

[0058] Please refer to Figures 4 and 5. Figure 5 is a partial schematic diagram of the first side wall shown in Figure 4. In the process of realizing the electrical connection between the circuit board 130 of the mounting groove 114 and the grounding area 115 on the first side wall 1142, a conductive spring 140 is generally provided on the circuit board 130. The conductive spring 140 generally includes a fixing portion 141 and an abutting portion 142. The fixing portion 141 is fixed on the circuit board 130 and is electrically connected to the grounding contact on the circuit board 130. Specifically, the fixing portion 141 is electrically connected to the grounding contact through surface mount technology (SMT), and the abutting portion 142 abuts against the grounding area 115, thereby realizing the electrical connection between the grounding contact on the circuit board 130 and the grounding area 115, thereby achieving the grounding purpose of the grounding circuit in the circuit board 130.

[0059] However, in order to meet the requirement of electrical connection between the abutment portion 142 and the grounding area 115, it is necessary to spot-weld a low-impedance metal sheet 116 on the grounding area 115 corresponding to the abutment portion 142. Please refer to Figures 6 and 7. Figure 6 is a schematic diagram of metal sheet welding on the grounding area in some embodiments of the present application, and Figure 7 is a schematic diagram of laser welding in some embodiments of the present application. Among them, the impedance of the metal sheet 116 is required to be less than 0.5 ohms. In the actual operation process, the metal sheet 116 is generally welded to the grounding area 115 of the first side wall 1142 by laser welding. Laser welding is to melt the corresponding positions of the metal sheet 116 and the grounding area 115 by emitting a high-energy laser beam, and then the metals of the metal sheet 116 and the corresponding positions of the grounding area are fused with each other, and then cooled to achieve the welding effect.

[0060] Since current electronic devices have very high requirements for their internal spatial layout, the width of the mounting groove 114, that is, the distance between the first side wall 1142 and the second side wall 1143, is relatively small. Laser welding cannot fully weld the metal sheet 116 on the first side wall 1142, and can only partially weld the metal sheet 116 near the opening (for example, the position of the welding point 180 on the metal sheet 116 shown in Figure 6), resulting in unstable electrical connection between the metal sheet 116 and the grounding area 115, affecting the overall quality of the product.

[0061] For example, please continue to refer to Figures 6 and 7. Under normal circumstances, the welding angle of laser welding (such as the angle a shown in Figure 7) is 60°-70°, and the laser beam propagates in a straight line. Taking the welding of the metal sheet 116 on the first side wall 1142 as an example, the laser beam is emitted from one side of the second side wall 1143. Only when the laser beam moves to the upper side of the second side wall 1143, the laser beam welds the metal sheet 116, which results in a limited welding area on the metal sheet 116, and the stability of the connection between the metal sheet 116 and the grounding area 115 cannot be guaranteed.

[0062] For another example, in some other embodiments of the present application, please refer to FIG8 , which is a schematic diagram of a metal sheet welded to a grounding area in some other embodiments of the present application. The grounding area 115 is set at the bottom of the mounting groove 114 , and the metal sheet 116 includes a fixing sheet 1161 and a connecting sheet 1162 . The fixing sheet 1161 is welded to the grounding area 115 by laser welding, and the connecting sheet 1162 is connected to the fixing sheet 1161 . The connecting sheet 1162 is opposite to the first side wall 1142 . Since the connecting sheet 1162 cannot be fixed to the first side wall 1142 , the connecting sheet 1162 is prone to warping during the assembly of the circuit board, affecting the assembly efficiency and failing to ensure the product yield.

[0063] To address the above issues, please refer to Figures 9 and 10. Figure 9 is a schematic diagram of a middle plate provided in yet another embodiment of the present application; Figure 10 is a schematic diagram of the assembly of the middle plate and the conductive member shown in Figure 9. The conductive member 150 provided in the present application is grounded and includes a fixing plate 151 and a connecting plate 152. The fixing plate 151 is fixed to the first surface 112. One end of the connecting plate 152 is connected to the fixing plate 151, and the other end is located in the mounting groove 114. The connecting plate 152 is disposed opposite the first side wall 1142.

[0064] The fixing plate 151 can be welded to the first surface 112 or glued to the first surface 112. The fixing plate 151 is fixed to the first surface 112 at a position outside the mounting slot 114. Therefore, the fixing of the fixing plate 151 is not restricted by the mounting slot 114, thereby ensuring the stability of the fixing plate 151 fixed to the first surface 112. Thus, the conductive member 150 is fixed to the middle plate 110 via the fixing plate 151. The connection plate 152 is provided to achieve an electrical connection between the grounding contact and the conductive member 150. Since the conductive member 150 is grounded, the grounding circuit on the circuit board 130 is grounded. This ensures the grounding of the circuit board 130 while reducing the difficulty of fixing the conductive member 150.

[0065] In some embodiments, the first surface 112 includes a first grounding region 1121, and the fixing plate 151 is electrically connected to the first grounding region 1121. Exemplarily, the fixing plate 151 is electrically connected to the first grounding region 1121 by laser welding.

[0066] Among them, the first grounding area 1121 is located on the first surface 112, and the first surface 112 is located outside the mounting groove 114. During the laser welding process, the laser beam can hit all positions of the first surface 112, so the laser beam can hit all positions of the first grounding area 1121. The projection of the fixing plate 151 on the surface where the first grounding area 1121 is located is completely located within the first grounding area 1121, and the laser beam of laser welding can cover the fixing plate 151.

[0067] It should be noted, referring to Figures 9 and 10 , that laser welding is a type of spot welding. The laser beam used for laser welding is directed onto the fixed plate 151. The high-energy laser beam melts the corresponding locations on the fixed plate 151 and the corresponding locations on the first grounding region 1121. The two melt together and then cool, forming weld spots 180 on the fixed plate 151. By moving the laser beam, weld spots 180 are formed at different locations on the fixed plate 151. By forming multiple weld spots 180 at different locations on the fixed plate 151, electrical connection and fixation between the fixed plate 151 and the first grounding region 1121 are achieved. This solves the problem of unstable fixation of the conductive member 150 and reduces the difficulty of the laser welding process.

[0068] Thus, the conductive member 150 is electrically connected to the first grounding area 1121 by setting the fixing plate 151, thereby achieving electrical connection between the conductive member 150 and the grounding contact on the circuit board 130. By setting the connecting plate 152 relative to the first side wall 1142, it can be understood that the circuit board 130 is located on the side of the connecting plate 152 away from the first side wall 1142, and the grounding contact is located on the side surface of the circuit board 130 facing the first side wall 1142 (for example, the side surface of the circuit board 130 in the positive direction of the X-axis shown in Figure 9), that is, the connecting plate 152 and the grounding contact are set relative to each other.

[0069] 9 and 10 , the fixing plate 151 and the connecting plate 152 are integrally formed. This can reduce the number of production lines for the conductive member 150 and reduce the production time of the conductive member 150 .

[0070] In other embodiments of the present application, please continue to refer to Figures 9 and 10. A second grounding area 1122 is provided on the first side wall 1142, and the connecting plate 152 is electrically connected to the second grounding area 1122. The second grounding area 1122 is a portion of the metal surface of the middle plate 110 exposed to the frame. When the connecting plate 152 contacts the second grounding area 1122, the connecting plate 152 is electrically connected to the second grounding area 1122. Therefore, the area of ​​the electrical connection between the conductive member 150 and the middle plate 110 is: the sum of the contact area between the fixed plate 151 and the first grounding area 1121 and the contact area between the connecting plate 152 and the second grounding area 1122. In this way, the area of ​​the electrical connection between the conductive member 150 and the middle plate 110 can be greatly expanded. Increasing the area of ​​the electrical connection between the conductive member 150 and the middle plate 110 can reduce the impedance between the conductive member 150 and the middle plate 110, thereby ensuring the electrical connection effect between the conductive member 150 and the middle plate 110.

[0071] In other embodiments of the present application, referring to Figures 9 and 10 , a conductive protrusion 1123 is provided on the first sidewall 1142. The conductive protrusion 1123 protrudes from the first sidewall 1142. The surface of the conductive protrusion 1123 facing away from the first sidewall 1142 serves as a second grounding region 1122. The distance between the second grounding region 1122 and the second sidewall 1143 is smaller than the distance between the first sidewall 1142 and the second sidewall 1143. The provision of the conductive protrusion 1123 can reduce the distance between the circuit board 130 and the connecting plate 152, increase the contact pressure between the grounding contact and the connecting plate 152, improve the contact pressure between the grounding contact and the connecting plate 152, reduce the contact resistance between the grounding contact and the connecting plate 152, and thereby reduce the impedance between the grounding contact and the connecting plate 152, thereby improving the electrical connection between the grounding contact and the connecting plate 152 and meeting the grounding requirements of the grounding circuit on the circuit board.

[0072] Specifically, when the grounding contact and the connecting plate 152 are electrically connected through the conductive spring clip 140, the distance between the connecting plate 152 and the grounding contact is shortened due to the provision of the conductive protrusion 1123, so that the compression amount of the abutting portion 142 is increased. It can be understood that the abutting portion 142 is an elastic member. The greater the compression amount of the abutting portion 142, the greater the contact pressure between the abutting portion 142 and the connecting plate 152, the smaller the contact resistance between the grounding contact and the connecting plate 152, and the better the electrical connection effect between the grounding contact and the connecting plate.

[0073] Among them, the first grounding area 1121 can extend to the edge of the opening of the mounting groove 114, and the first grounding area 1121 is connected to the second grounding area 1122. In this way, the side surface of the fixing plate 151 facing the first grounding area 1121 ensures that the area electrically connected to the first grounding area 1121 is maximized, and the side surface of the connecting plate 152 facing the second grounding area 1122 ensures that the area electrically connected to the second grounding area 1122 is maximized. It can be understood that the connection between the first grounding area 1121 and the second grounding area 1122 can make the connection position between the fixing plate 151 and the connecting plate 152 electrically connected to the middle plate 110, thereby ensuring that the electrical contact area between the middle plate 110 and the conductive member 150 is maximized, thereby achieving the purpose of improving the electrical connection effect between the conductive member 150 and the middle plate 110.

[0074] In some embodiments of the present application, please refer to FIG11 , which is a partial schematic diagram of the first grounding region shown in FIG10 . A positioning groove 1124 is provided on the first surface 112 . The positioning groove 1124 is open on the side adjacent to the mounting slot 114 , and the first grounding region 1121 is located on the bottom wall of the positioning groove 1124 (e.g., the bottom wall of the positioning groove 1124 facing the positive direction of the Z axis as shown in FIG11 ). Thus, when welding the fixing plate 151 of the conductive member 150 , the fixing plate 151 is first placed in the positioning groove 1124 to pre-position the fixing plate 151 and ensure the accuracy of the welding position of the fixing plate 151 .

[0075] The surface of the fixing plate 151 facing away from the first grounding area 1121 is flush with the first surface 112. It is understood that the surface of the fixing plate 151 facing away from the first grounding area 1121 is flush with the first surface 112. "Flush" means approximately flush within a certain tolerance range. This tolerance range can be a range with an angle deviation of less than or equal to 5° relative to absolute flushness, or a step difference of less than or equal to 0.02mm relative to absolute flushness. It should be noted that ensuring that the surface of the fixing plate 151 facing away from the first grounding area 1121 is flush with the first surface 112 ensures the flatness and aesthetics of the first surface 112 of the middle plate 110, improves the overall product quality of the middle frame structure, and provides a flat bonding surface for the installation of the back cover.

[0076] In some implementations of the present application, the impedance of the conductive member 150 is less than 0.5 ohms. It should be noted that the impedance of the conductive member 150 being less than 0.5 ohms can meet the electrical connection requirements between the ground contact and the midplane 110. Specifically, the impedance of the conductive member 150 can be 0.1 ohms, 0.2 ohms, 0.3 ohms, 0.4 ohms, or 0.5 ohms.

[0077] In some embodiments of the present application, please refer to FIG12, which is a cross-sectional view of the conductive member shown in FIG11. The conductive member 150 includes a metal body 153 and a metal film layer 154. The metal film layer 154 covers the outer surface of the metal body 153. The impedance of the metal film layer 154 is lower than the impedance of the metal body 153. In consideration of the cost of the conductive member 150, the metal body 153 is generally a common metal, and the material of the metal film layer 154 is generally a precious metal, such as gold. Precious metals have low impedance. By cooperating with the metal body 153 and the metal film layer 154, the cost of the conductive member 150 can be reduced while meeting the impedance requirements of the conductive member 150.

[0078] In some embodiments, the conductive element 150 may be a gold-plated copper sheet, the metal body 153 may be copper, and the metal film layer 154 may be gold. The conductive element 150 may also be nickel-plated stainless steel, the metal body 153 may be stainless steel, and the metal film layer 154 may be nickel. The conductive element 150 may be gold-plated stainless steel, the metal body 153 may be stainless steel, and the metal film layer 154 may be gold. The conductive element 150 may be a nickel-plated copper sheet, the metal body 153 may be copper, and the metal film layer 154 may be nickel.

[0079] In some implementations of the present application, please refer to Figure 13, which is a schematic diagram of a groove in some embodiments of the present application. A groove 160 is provided on the second sidewall 1143. Groove 160 is formed by recessing a portion of the second sidewall 1143 away from the first sidewall 1142. Groove 160 is open toward the side of the first surface 112. The circuit board 130 is positioned within groove 160. Thus, by providing groove 160 on the second sidewall 1143, an assembly position for the circuit board 130 is provided, enabling pre-positioning of the circuit board 130 during assembly and ensuring the accuracy of the assembly position of the circuit board 130.

[0080] The groove 160 includes a first inner groove surface 161 and a second inner groove surface that oppose each other. The first inner groove surface 161 is connected to the second sidewall 1143, and the second inner groove surface is connected to the second sidewall 1143. The circuit board 130 includes a first board surface 131 that opposes the first inner groove surface 161 and a second board surface that opposes the second inner groove surface. The distance between the first inner groove surface 161 and the second inner groove surface is greater than the distance between the first board surface 131 and the second board surface. In other words, in the direction from the first board surface 131 toward the second board surface, the groove 160 and the circuit board 130 have a clearance fit. This reduces the difficulty of assembling the circuit board 130 into the mounting groove 114, reduces the workload of the assembler, and improves the product yield.

[0081] The groove 160 may further include a third inner groove surface 163, which is parallel to the second sidewall 1143. "Parallel" means approximately parallel within a certain tolerance range, which may be a deviation angle of less than or equal to 5° relative to absolute parallelism. An adhesive layer 170 is disposed between the circuit board 130 and the third inner groove surface 163. Specifically, the adhesive layer 170 may be disposed on the side of the circuit board 130 facing the third inner groove surface 163, or the adhesive layer 170 may be disposed on the third inner groove surface 163. Thus, by disposing the adhesive layer 170 between the circuit board 130 and the third inner groove surface 163, the circuit board 130 is secured to the third inner groove surface 163.

[0082] Please continue to refer to Figure 13. The groove 160 also includes a fourth inner groove surface 164, which is respectively connected to the first inner groove surface 161, the second inner groove surface and the third inner groove surface 163. When the circuit board 130 is assembled to the mounting groove 114, the bottom surface of the circuit board 130 abuts against the fourth inner groove surface 164 to ensure the position accuracy of the circuit board 130 in the Z-axis direction.

[0083] In other embodiments of the present application, please refer to Figures 14 to 16. Figure 14 is a schematic diagram of a middle frame structure provided in other embodiments of the present application; Figure 15 is a schematic diagram of the conductive member shown in Figure 14 in a free state; and Figure 16 is a schematic diagram of the conductive member shown in Figure 14 in a compressed state. The connecting plate 152 includes a fixed end 1524 and a free end 1523. The fixed end 1524 is connected to the fixed plate 151.

[0084] In a direction from the first surface 112 to the second surface 113 , the connecting plate 152 is inclined toward a direction away from the first sidewall 1142 . Among them, the distance between the free end 1523 and the second side wall 1143 is smaller than the distance between the free end 1523 and the second side wall 1143; it can be understood that when the circuit board 130 is assembled to the second side wall 1143 through the opening of the mounting groove 114, the free end 1523 of the connecting plate 152 abuts against the side surface of the circuit board 130 facing the first side wall 1142, and when the circuit board 130 is installed to the preset position of the mounting groove 114, the free end 1523 abuts against the grounding contact of the circuit board 130, realizing the electrical connection between the connecting plate 152 and the grounding contact, and the conductive member 150 switches from a free state (for example, the state of the conductive member 150 shown in Figure 15, in which the free end 1523 is not squeezed) to a compressed state (for example, the state of the conductive member 150 shown in Figure 16, in which the free end 1523 is squeezed by the circuit board 130).

[0085] It should be noted that the connecting plate 152 is elastic. When the circuit board 130 is installed in the mounting groove 114, the circuit board 130 squeezes the free end 1523 of the connecting plate 152, and the free end 1523 of the connecting plate 152 moves toward the first side wall 1142. The connecting plate 152 has a tendency to return to a free state. Therefore, the free end 1523 of the connecting plate 152 applies pressure on the circuit board 130 in the direction of the circuit board 130, thereby achieving the fit between the free end 1523 of the connecting plate 152 and the grounding contact, and then achieving electrical connection between the free end 1523 of the connecting plate 152 and the grounding contact.

[0086] In this way, by configuring the connecting plate 152 to have an inclined structure, the use of conductive springs can be reduced, thereby reducing the number of components inside the mounting slot 114 and simplifying the structure inside the mounting slot 114 .

[0087] In some embodiments of the present application, referring to Figures 14 to 16 , a contact protrusion 1521 is provided on the connecting plate 152. The contact protrusion 1521 is disposed near the free end 1523 and is disposed on a surface of the connecting plate 152 facing away from the first side wall 1142. Specifically, the contact protrusion 1521 may be hemispherical, semi-elliptical, or the like. This allows for electrical connection between the contact protrusion 1521 and the ground contact while preventing the connecting plate 152 from scratching the circuit board 130 during assembly of the circuit board 130 into the mounting slot 114.

[0088] It is understandable that the contact protrusion 1521 may also be provided in other embodiments described above.

[0089] 15 and 16 , the contact protrusion 1521 is disposed close to the free end 1523 , which means that the distance between the free end 1523 and the contact protrusion 1521 is smaller than the distance between the fixed end 1524 and the contact protrusion 1521 .

[0090] The first grounding area in the above embodiment can also be a side surface of the antenna radiating part. The antenna signal inside the electronic device is electrically connected to the first grounding area through a conductive part, and the antenna signal is transmitted to the antenna radiating part, and then the antenna signal is radiated through the antenna radiating part on one side of the surface of the electronic device.

[0091] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A middle frame structural member, characterized in that: include: A middle plate, the middle plate comprising a first surface and a second surface opposite to each other, a mounting groove being provided on the middle plate, the mounting groove comprising an opening and a first side wall, the opening being located on the first surface, and the first side wall being connected to the first surface; A conductive member is grounded and includes a fixing plate and a connecting plate. The fixing plate is fixed to the first surface. One end of the connecting plate is connected to the fixing plate and the other end is located in the mounting groove. The connecting plate is arranged opposite to the first side wall.

2. The middle frame structure according to claim 1, characterized in that: The first surface includes a first grounding area, and the fixing plate is electrically connected to the first grounding area.

3. The middle frame structure according to claim 2, characterized in that: A positioning groove is provided on the first surface, and a side of the positioning groove close to the opening is open. The first grounding area is located on a bottom wall of the positioning groove, and the bottom wall faces the same direction as the first surface.

4. The middle frame structure according to claim 3, characterized in that: A surface of the fixing plate facing away from the first grounding area is flush with the first surface.

5. The middle frame structural member according to any one of claims 1 to 4, characterized in that: A second grounding area is provided on the first side wall, and the connecting plate is electrically connected to the second grounding area.

6. The middle frame structure according to claim 5, characterized in that: A conductive protrusion is disposed on the first side wall, and the conductive protrusion protrudes from the first side wall. The second grounding region is located on a side surface of the conductive protrusion that is away from the first side wall.

7. The middle frame structure according to claim 5 or 6, characterized in that: The first surface includes a first grounding area, the fixing plate is electrically connected to the first grounding area, the first grounding area extends to the edge of the opening, and the first grounding area is connected to the second grounding area.

8. The middle frame structural member according to any one of claims 1 to 7, characterized in that: The fixing plate and the connecting plate are integrally formed.

9. The middle frame structural member according to any one of claims 1 to 4, characterized in that: The connecting plate comprises a fixed end and a free end, and the fixed end is connected to the fixing plate; In a direction from the first surface to the second surface, the connecting plate is inclined toward a direction away from the first side wall.

10. The middle frame structure according to claim 9, characterized in that: A contact protrusion is provided on a surface of the connecting plate on one side facing away from the first side wall, and the contact protrusion is arranged close to the free end.

11. The middle frame structural member according to any one of claims 1 to 10, characterized in that: The impedance of the conductive member is less than or equal to 0.5 ohms.

12. The middle frame structure according to claim 11, characterized in that: The conductive component includes a metal body and a metal film layer, wherein the metal film layer covers the outer surface of the metal body, and the impedance of the metal film layer is smaller than the impedance of the metal body.

13. The middle frame structure according to claim 12, characterized in that: The material of the metal body is copper, or the material of the metal body is stainless steel; The material of the metal film layer is gold, or the material of the metal film layer is nickel.

14. The middle frame structure according to claim 1, characterized in that: Also includes: Circuit boards; The mounting slot further includes a second side wall opposite to the first side wall, and the circuit board is disposed on the second side wall.

15. The middle frame structure according to claim 14, characterized in that: The second side wall is provided with a groove, the groove is formed by a portion of the second side wall being recessed in a direction away from the first side wall, the groove is open toward one side of the first surface, and the circuit board is arranged in the groove.

16. The middle frame structure according to claim 14 or 15, characterized in that: A grounding contact is provided on a surface of the circuit board on one side facing away from the second side wall; The middle frame structure also includes a conductive spring sheet, which is abutted between the ground contact and the connecting plate.

17. The middle frame structural member according to any one of claims 1 to 16, characterized in that: Also includes: A frame is arranged around the outer periphery of the middle plate.

18. The middle frame structural member according to any one of claims 1 to 17, characterized in that: The middle plate is provided with an equipment bin, and the mounting groove is located on the circumferential outer side of the equipment bin.

19. An electronic device, characterized in that: include: The middle frame structural member according to any one of claims 1 to 18; A back cover is assembled on the middle frame structure.

Images