Light-emitting plate and preparation method therefor, backlight module and display apparatus

Abstract

A light-emitting plate (10) and a preparation method therefor, a backlight module and a display apparatus. The light-emitting plate (10) comprises: a circuit board (11), comprising a substrate layer (111) and a circuit layer (112), wherein the circuit layer (112) is attached to one side surface of the substrate layer (111), the other side surface of the substrate layer (111) is a light-emitting surface (13), and through holes (113) are formed in the circuit board (11); and light-emitting devices (12), each comprising a fixed part (21) and an LED light-emitting unit (122), wherein the LED light-emitting unit (122) is fixed on the fixed part (21), the light-emitting devices (12) are arranged corresponding to the through holes (113), the fixed parts (21) are arranged on one side of the circuit layer (112), and the LED light-emitting units (122) face the light-emitting surface (13) by means of the through holes (113).

Description

Luminescent panel and preparation method thereof, backlight module, and display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 3, 2023, with application number 202310978268.1 and invention name “Luminous panel and preparation method thereof, backlight module, display device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a light-emitting panel and a preparation method thereof, a backlight module, and a display device. Background Art

[0003] As display devices become thinner and lighter, the light mixing distance of light-emitting devices decreases, placing increasing demands on the reflective properties of light-emitting panels. In existing light-emitting panel manufacturing processes, light-emitting devices and other components are placed on the same side of the substrate. This interference with the light-emitting device's light path affects the light mixing effect and brightness uniformity of the panel. Furthermore, as zoning control becomes increasingly sophisticated, components such as ICs, resistors, and capacitors are increasingly densely packed onto panels, making this impact even more pronounced. Technical issues

[0004] The existing solution is to apply highly reflective white glue on the components or cover them with reflective paper. However, this still cannot completely eliminate the impact of the components on the mixed light effect. In addition, the methods of applying white glue and applying reflective paper are relatively cumbersome, affecting production efficiency and cost. Technical Solutions

[0005] In a first aspect, an embodiment of the present application provides a light-emitting panel, comprising:

[0006] A circuit board, comprising a substrate layer and a circuit layer, wherein the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole;

[0007] A light-emitting device, comprising a fixing portion and an LED light-emitting unit, wherein the LED light-emitting unit is fixed on the fixing portion, the light-emitting device is arranged corresponding to the through hole, the fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit passes through the through hole toward the light-emitting surface.

[0008] In a second aspect, the present invention also provides a method for preparing a light-emitting panel, which comprises:

[0009] A circuit board is provided, comprising a substrate layer and a circuit layer, wherein the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole;

[0010] A light emitting device is provided, comprising a fixing portion and an LED light emitting unit, wherein the LED light emitting unit is fixed on the fixing portion;

[0011] Arrange the light emitting device corresponding to the through hole;

[0012] The fixing portion is fixed to one side of the circuit layer so that the LED light-emitting unit passes through the through hole toward the light-emitting surface.

[0013] In a third aspect, an embodiment of the present application further provides a backlight module, which includes a light-emitting panel, wherein the light-emitting panel includes:

[0014] A circuit board, comprising a substrate layer and a circuit layer, wherein the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole;

[0015] A light-emitting device, comprising a fixing portion and an LED light-emitting unit, wherein the LED light-emitting unit is fixed on the fixing portion, the light-emitting device is arranged corresponding to the through hole, the fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit passes through the through hole toward the light-emitting surface.

[0016] In a fourth aspect, an embodiment of the present application further provides a backlight module, comprising a light-emitting panel prepared by the light-emitting panel preparation method, wherein the light-emitting panel preparation method comprises:

[0017] A circuit board is provided, comprising a substrate layer and a circuit layer, wherein the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole;

[0018] A light emitting device is provided, comprising a fixing portion and an LED light emitting unit, wherein the LED light emitting unit is fixed on the fixing portion;

[0019] Arrange the light emitting device corresponding to the through hole;

[0020] The fixing portion is fixed to one side of the circuit layer so that the LED light-emitting unit passes through the through hole toward the light-emitting surface.

[0021] In a fifth aspect, an embodiment of the present application further provides a display device, comprising a backlight module; the backlight module comprises a light-emitting panel, and the light-emitting panel comprises:

[0022] A circuit board, comprising a substrate layer and a circuit layer, wherein the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole;

[0023] A light-emitting device, comprising a fixing portion and an LED light-emitting unit, wherein the LED light-emitting unit is fixed on the fixing portion, the light-emitting device is arranged corresponding to the through hole, the fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit passes through the through hole toward the light-emitting surface. Beneficial effects

[0024] In the light-emitting board and its preparation method, backlight module, and display device provided in the embodiments of the present application, the light-emitting board includes a circuit board and a light-emitting device. Specifically, the circuit board includes a substrate layer and a circuit layer. The circuit layer is attached to one side of the substrate layer, and the other side of the substrate layer is a light-emitting surface. The circuit board has a through hole. The light-emitting device includes a fixing portion and an LED light-emitting unit. The light-emitting device is arranged corresponding to the through hole. The fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit is directed toward the light-emitting surface through the through hole. It can be understood that the light-emitting surface and components of the light-emitting board are respectively formed on both sides of the substrate layer of the circuit board, completely eliminating the influence of the components on the light mixing effect. There is no need to apply white glue or reflective paper on the components, thereby improving the uniformity of the light emission of the light-emitting substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a schematic diagram of the first structure of the light-emitting panel provided in an embodiment of the present application.

[0026] FIG2 is a schematic diagram of a second structure of a light-emitting panel provided in an embodiment of the present application.

[0027] FIG3 is a schematic diagram of the first structure of the circuit board provided in an embodiment of the present application.

[0028] FIG4 is a schematic diagram of the first structure of the light-emitting device provided in an embodiment of the present application.

[0029] FIG5 is a schematic diagram of a second structure of a light-emitting device provided in an embodiment of the present application.

[0030] FIG6 is a second structural schematic diagram of a circuit board provided in an embodiment of the present application.

[0031] FIG7 is a schematic diagram of a third structure of a light-emitting device provided in an embodiment of the present application.

[0032] FIG8 is a schematic diagram of a first process of a method for preparing a light-emitting panel provided in an embodiment of the present application.

[0033] FIG9 is a schematic diagram of a first process for producing a light-emitting panel according to an embodiment of the present application.

[0034] FIG10 is a schematic diagram of a second process of the method for preparing the light-emitting panel provided in an embodiment of the present application.

[0035] FIG11 is a schematic diagram of a third process of the method for preparing a light-emitting panel provided in an embodiment of the present application.

[0036] FIG12 is a fourth flow chart of the method for preparing a light-emitting panel provided in an embodiment of the present application.

[0037] FIG13 is a schematic diagram of a second process flow of the light-emitting panel provided in an embodiment of the present application.

[0038] FIG14 is a fifth flow chart of the method for preparing the light-emitting panel provided in an embodiment of the present application.

[0039] Implementation Methods of the Application

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0041] Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of this application.

[0042] As display devices become thinner and lighter, the light mixing distance of light-emitting devices is getting smaller and smaller, and the requirements for the reflective conditions of the light-emitting panels are getting higher and higher. In the preparation process of existing light-emitting panels, the light-emitting devices and other components are all on the same side of the substrate. The components will interfere with the light output path of the light-emitting devices, affecting the light mixing effect and brightness uniformity of the light-emitting panels. As the zone light control becomes more and more sophisticated, the ICs, resistors, capacitors and other components on the light-emitting panels are becoming more and more dense, and this impact is becoming increasingly significant. The existing solution is to apply white glue with high reflectivity on the components, or to cover the components with reflective paper, but it is still impossible to completely eliminate the influence of the components on the light mixing effect. In addition, the method of applying white glue and applying reflective paper is relatively cumbersome, affecting production efficiency and cost.

[0043] The manufacturing method of the light-emitting board in the related art is to weld the light-emitting LED and other components on the same side of the light-emitting board. The protrusion of the components affects the overall reflection effect of the light-emitting board, and this effect will become increasingly greater as the light mixing distance decreases. The solution in the related art is to cover the other components by applying white glue or sticking reflective paper, but it still cannot completely eliminate the impact of the components on the light mixing effect. The method of applying white glue and sticking reflective paper is relatively cumbersome, affecting production efficiency and cost. Therefore, this application proposes a light-emitting board and its preparation method, a backlight module, and a display device, which are described in detail below with reference to the accompanying drawings.

[0044] 1 and 2 , FIG1 is a schematic diagram of a first structure of a light-emitting panel provided in an embodiment of the present application, and FIG2 is a schematic diagram of a second structure of a light-emitting panel provided in an embodiment of the present application. This embodiment of the present application provides a light-emitting panel 10 , which includes a circuit board 11 and a light-emitting device 12 .

[0045] Please refer to Figure 3, which is a schematic diagram of the first structure of a circuit board provided in an embodiment of the present application. The circuit board 11 has a multi-layer structure. The circuit board 11 includes a substrate layer 111 and a circuit layer 112, with the circuit layer 112 attached to the substrate layer 111. The circuit layer 112 is attached to one side of the substrate layer 111, and the other side of the substrate layer 111 serves as a light-emitting surface 13. The circuit board 11 has a through hole 113 that extends through the substrate layer 111 and the circuit layer 112. The circuit layer 112 is used to secure components 14, that is, components 14 are secured to the circuit layer 112. Components 14 may be resistors, capacitors, integrated circuits (ICs), or jumpers, for example. The circuit layer 112 may be made of copper. The formation process of the circuit layer 112 may include first coating the substrate layer 111 with a copper layer, then etching the copper layer, and finally forming the circuit layer 112. The circuit layer 112 can provide power or electrical signals to the components 14 electrically connected thereto.

[0046] The substrate layer 111 may be an aluminum substrate, an FR4 substrate or a BT substrate.

[0047] Please refer to Figures 4 and 5. Figure 4 is a schematic diagram of a first structural embodiment of a light-emitting device provided in an embodiment of the present application, and Figure 5 is a schematic diagram of a second structural embodiment of a light-emitting device provided in an embodiment of the present application. The light-emitting device 12 includes a fixing portion 21 and an LED light-emitting unit 122. The LED light-emitting unit 122 is fixed to the fixing portion 21. The light-emitting device 12 is positioned corresponding to the through-hole 113. The fixing portion 21 is positioned on one side of the circuit layer 112, and the LED light-emitting unit 122 passes through the through-hole 113 toward the light-emitting surface 13. The fixing portion 21 is fixed to the side of the circuit layer 112 away from the substrate layer 111, and the LED light-emitting unit 122 is located on the side of the fixing portion 21 closer to the circuit layer 112. The LED light-emitting unit 122 is electrically connected to the circuit layer 112, and power is supplied to the LED light-emitting unit 122 through the circuit layer 112. Light generated by the LED light-emitting unit 122 passes through the through-hole 113 and is emitted from the side of the substrate layer 111 away from the circuit layer 112, so that the side of the substrate layer 111 away from the circuit layer 112 forms the light-emitting surface 13. The fixing portion 21 may be a structure such as a lamp bracket, a lamp support, or a lamp holder for supporting or fixing the LED light-emitting unit 122. The LED light-emitting unit 122 may be an LED (light-emitting diode), a mini LED (mini light-emitting diode), or a micro LED (micro light-emitting diode).

[0048] The component 14 is disposed on the side of the circuit layer 112 away from the substrate layer 111. The component 14 can be spaced apart from the light emitting device 12. Furthermore, on the circuit layer 112, the component 14 can be spaced apart from the fixing portion 21 to prevent charged bodies from interfering with each other or even causing a short circuit.

[0049] It can be understood that the light-emitting surface 13 of the light-emitting board 10 and the components 14 are respectively formed on both sides of the substrate layer 111 of the circuit board 11, completely eliminating the influence of the components 14 on the mixed light effect. There is no need to apply white glue and reflective paper on the components 14, thereby improving the light uniformity of the light-emitting substrate.

[0050] Please refer to Figure 6, which is a schematic diagram of the second structure of the circuit board provided in an embodiment of the present application. In order to improve the reflectivity of the circuit board 11 to light, the circuit board 11 also includes a white ink layer 114. The white ink layer 114 is arranged on the side of the substrate layer 111 away from the circuit layer 112. Thus, the circuit board 11 includes the circuit layer 112, the substrate layer 111, and the white ink layer 114 stacked in sequence. As mentioned above, a through hole 113 is formed on the circuit board 11, and the through hole 113 passes through the circuit layer 112, the substrate layer 111, and the white ink layer 114 in sequence. When the light generated by the LED light-emitting unit 122 passes through the through hole 113 and is emitted from the side of the substrate layer 111 away from the circuit layer 112, the side of the white ink layer 114 away from the circuit layer 112 forms a light-emitting surface 13. The light that hits the white ink layer 114 can be reflected and emitted again, avoiding being absorbed by the substrate layer 111, which helps to increase the light intensity of the light-emitting surface.

[0051] In some embodiments, please continue to refer to Figures 4 and 5. The fixing portion 21 has a cup mouth 1211, and the LED light-emitting unit 122 is arranged in the cup mouth 1211, or it can be arranged in the center of the cup mouth 1211. It can be understood that the fixing portion 21 can be a groove formed on the base, and the groove serves as the cup mouth 1211. In this case, the LED light-emitting unit 122 is arranged in the center of the cup mouth 1211, which means that the LED light source is arranged in the center of the base and at the deepest part of the groove. The cup mouth 1211 is connected to the through hole 113. In other words, the fixing portion 21 includes a base 1212 and a side wall 1213, the side wall 1213 is connected to the base 1212, and the side wall 1213 and the base 1212 are surrounded to form the cup mouth 1211.

[0052] The light-emitting device 12 also includes a solder pad 123, which is disposed on the fixing portion 21. The solder pad 123 can be disposed on an end of the side wall 1213 of the fixing portion 21 away from the base 1212. The fixing portion 21 is fixed to the circuit layer 112 by welding the solder pad 123, that is, the solder pad 123 is connected to the circuit layer 112 and the fixing portion 21 respectively. Since the material of the solder pad 123 is metal, when the solder pad 123 is connected to the circuit layer 112, the solder pad 123 also acts as a wire. The LED light-emitting unit 122 is also electrically connected to the solder pad 123, so that the LED light-emitting unit 122 is indirectly electrically connected to the circuit layer 112, thereby reducing jumpers, saving costs and saving space.

[0053] Therefore, in the embodiment of the present application, the solder pad 123 is connected between the fixing part 21 and the circuit layer 112, and the solder pad 123 is also electrically connected to the LED light-emitting unit 122. The solder pad 123 can not only fix the fixing part 21 on the circuit layer 112, but also use its conductivity to transmit the electrical signal transmitted by the circuit layer 112 to the LED light-emitting unit 122, so that the LED light-emitting unit 122 can be turned on or off.

[0054] The light-emitting device 12 further includes a gold wire 124, which is electrically connected to the LED light-emitting unit 122 and the solder pad 123. The gold wire 124 has excellent conductivity and is used to transmit electrical signals to the LED light-emitting unit 122. It is understood that since the LED light-emitting unit 122 has a cup 1211, it can accommodate the gold wire 124, so that the gold wire 124 does not occupy additional space. The LED light-emitting unit 122 has a positive electrode and a negative electrode. Correspondingly, the number of the gold wires 124 is also two, and the number of the pads 123 is also two, which are recorded as the first gold wire 124 and the second gold wire 124, the first pad 123 and the second pad 123. The first pad 123 and the second pad 123 are respectively arranged on the fixing part 21 at intervals. One end of the first gold wire 124 is electrically connected to the first pad 123, and the other end is electrically connected to the positive electrode of the LED light-emitting unit 122. The first pad 123 is electrically connected to the circuit layer 112. One end of the second gold wire 124 is electrically connected to the second pad 123, and the other end is electrically connected to the negative electrode of the LED light-emitting unit 122. The second pad 123 is electrically connected to the circuit layer 112.

[0055] In some embodiments, see Figure 7, which is a schematic diagram of a third structure of a light emitting device according to an embodiment of the present application. The light emitting device 12 further includes a lens 125, which is disposed over the LED light emitting unit 122 and is used to expand the light emission angle of the LED light emitting unit 122.

[0056] In some cases, referring to FIG. 7 , LED light-emitting unit 122 is a blue light-emitting unit configured to emit blue light; lens 125 is made of a resin polymer 1251 and white phosphor 1252, which is dispersed in resin polymer 1251 and is used to convert the blue light emitted by LED light-emitting unit 122 into white light. In other cases, LED light-emitting unit 122 is a blue light-emitting unit configured to emit blue light; lens 125 is made of a resin polymer 1251 and yellow phosphor, which is dispersed in resin polymer 1251 and is used to convert part of the blue light emitted by LED light-emitting unit 122 into yellow light, which is then combined with the blue light to form white light. In some cases, the LED light-emitting unit 122 is an ultraviolet light-emitting unit for emitting ultraviolet light; the material of the lens 125 includes a resin polymer 1251, red phosphor, green phosphor and blue phosphor, and the red phosphor, green phosphor and blue phosphor are dispersed in the resin polymer 1251. The red phosphor, green phosphor and blue phosphor are excited by ultraviolet light to form red light, green light and blue light, and the red light, green light and blue light are combined to form white light.

[0057] Among them, the resin polymer 1251 is a thermosetting resin or a photocurable resin. When the resin polymer 1251 is a photocurable resin, the resin polymer 1251 can be cured by ultraviolet light irradiation; when the resin polymer 1251 is a thermosetting resin, the resin polymer 1251 can be cured by heating. Thermosetting resins and photocurable resins each have advantages. During use, the thermosetting resin has excellent heat resistance and can prevent the LED light-emitting unit 122 from heating up during use and causing deformation of the resin polymer 1251. During the curing process of the photocurable resin, the process temperature is relatively low, and it is not easy for the LED light-emitting unit 122 and the fixing part 21 to be damaged by heat.

[0058] The material composition of lens 125, in terms of mass percentage, includes: 80%-90% resin polymer 1251 and 10%-20% phosphor. The phosphor can be a combination of various phosphors. In some cases, the phosphor can be solely white phosphor 1252; in other cases, the phosphor can be solely yellow phosphor; and in still other cases, the phosphor can also include red, green, and blue phosphors. When the material composition of lens 125 is within the aforementioned ratios, the phosphor can be evenly mixed in the resin polymer 1251, and has good light transmittance and light excitation.

[0059] Please refer to Figures 8 and 9. Figure 8 is a first flow chart of the method for preparing the light-emitting panel provided in an embodiment of the present application, and Figure 9 is a first process chart of the light-emitting panel provided in an embodiment of the present application.

[0060] The embodiment of the present application also provides a method for preparing a light-emitting panel 10, which includes the following steps. It should be noted that the method steps provided in this application are not limited to the steps provided in this embodiment, and the steps in some embodiments can be performed simultaneously.

[0061] S1. Provide a circuit board 11. The circuit board 11 includes a substrate layer 111 and a circuit layer 112. The circuit layer 112 is attached to one side of the substrate layer 111. The other side of the substrate layer 111 is a light emitting surface 13. The circuit board 11 has a through hole 113.

[0062] S2. Provide a light emitting device 12 . The light emitting device 12 includes a fixing portion 21 and an LED light emitting unit 122 . The LED light emitting unit 122 is fixed on the fixing portion 21 .

[0063] S3 , disposing the light emitting device 12 corresponding to the through hole 113 .

[0064] S4 , fixing the fixing portion 21 on one side of the circuit layer 112 so that the LED light emitting unit 122 passes through the through hole 113 toward the light emitting surface 13 .

[0065] The light generated by the LED light emitting unit 122 passes through the through hole 113 and is emitted from the side of the substrate away from the circuit layer 112 , so that the side of the substrate away from the circuit layer 112 forms a light emitting surface 13 .

[0066] The circuit layer 112 can be made of copper. The formation process of the circuit layer 112 can be to first coat the substrate layer 111 with a copper layer, then etch the copper layer to form the circuit layer 112. The circuit layer 112 is used to secure components 14, which can be resistors, capacitors, ICs, or jumpers. The circuit layer 112 can provide power or electrical signals to the components 14 electrically connected thereto. The substrate layer 111 can be an aluminum substrate, an FR4 substrate, or a BT substrate.

[0067] The LED light-emitting unit 122 is electrically connected to the circuit layer 112, and power is supplied to the LED light-emitting unit 122 through the circuit layer 112. Light generated by the LED light-emitting unit 122 passes through the through hole 113 and is emitted from the side of the substrate layer 111 away from the circuit layer 112, so that the side of the substrate layer 111 away from the circuit layer 112 forms a light-emitting surface 13.

[0068] It can be understood that the light-emitting board 10 prepared by the above-mentioned method of preparing the light-emitting board 10 has a light-emitting surface 13 and components 14 formed on both sides of the substrate layer 111 of the circuit board 11, respectively, which completely eliminates the influence of the components 14 on the mixed light effect, and there is no need to apply white glue and stick reflective paper on the components 14, thereby improving the luminous uniformity of the light-emitting substrate, improving production efficiency and reducing costs.

[0069] In some embodiments, please refer to Figure 10, which is a second flow diagram of a method for preparing a light-emitting panel according to an embodiment of the present application. In the step of providing a circuit board 11, the method for preparing the light-emitting panel 10 includes: S101, providing a substrate layer 111; S102, forming a circuit layer 112 on the substrate layer 111; S103, forming a through hole 113 in the substrate layer 111 and the circuit layer 112, wherein the through hole 113 extends through the substrate layer 111 and the circuit layer 112.

[0070] Please refer to Figure 11, which is a schematic diagram of a third process flow of the method for preparing a light-emitting panel provided in an embodiment of the present application. After forming the circuit layer 112 on the substrate layer 111, the method for preparing the light-emitting panel 10 further includes: S104, forming a white ink layer 114 on a side of the substrate layer 111 away from the circuit layer 112; forming through holes 113 in the substrate layer 111 and the circuit layer 112, including: S105, forming through holes 113 in the substrate layer 111, the circuit layer 112, and the white ink layer 114, wherein the through holes 113 sequentially penetrate the circuit layer 112, the substrate layer 111, and the white ink layer 114.

[0071] In order to improve the reflectivity of the circuit board 11 to light, the circuit board 11 also includes a white ink layer 114. The white ink layer 114 is arranged on the side of the substrate layer 111 away from the circuit layer 112. Therefore, the circuit board 11 includes the circuit layer 112, the substrate layer 111, and the white ink layer 114 stacked in sequence. As mentioned above, a through hole 113 is formed on the circuit board 11. The through hole 113 passes through the circuit layer 112, the substrate layer 111, and the white ink layer 114 in sequence. When the light generated by the LED light-emitting unit 122 passes through the through hole 113 and is emitted from the side of the substrate layer 111 away from the circuit layer 112, the side of the white ink layer 114 away from the circuit layer 112 forms a light-emitting surface 13. The light that hits the white ink layer 114 can be reflected and emitted again, avoiding being absorbed by the substrate layer 111, which helps to increase the light intensity of the light-emitting surface.

[0072] In some embodiments, please refer to FIG12 , which is a fourth flow chart of a method for preparing a light-emitting panel provided in an embodiment of the present application. In the step of providing a light-emitting device 12, the method for preparing the light-emitting panel 10 includes: S201, providing a fixing portion 21, the fixing portion 21 including a base 1212 and a side wall 1213, the side wall 1213 being connected to the base 1212, and the side wall 1213 and the base 1212 forming a cup opening 1211; S202, forming a soldering pad 123 at an end of the side wall 1213 away from the base 1212; S203, providing an LED light-emitting unit 122; S204, fixing the LED light-emitting unit 122 in the cup opening 1211; S205, electrically connecting the LED light-emitting unit 122 to the soldering pad 123.

[0073] The steps of fixing the fixing portion 21 on the side of the circuit layer 112 away from the substrate layer 111 and electrically connecting the LED light-emitting unit 122 to the circuit layer 112 are performed. The preparation method of the light-emitting board 10 includes: S5, fixing the pad 123 on the circuit layer 112 through a welding process so that the cup mouth 1211 is connected to the through hole 113.

[0074] It can be understood that the fixing portion 21 can be a groove formed on the base, and the groove serves as the cup mouth 1211. In this case, the LED light-emitting unit 122 is arranged in the center of the cup mouth 1211, which means that the LED light source is arranged in the center of the base and at the deepest part of the groove. The cup mouth 1211 is connected to the through hole 113. In other words, the fixing portion 21 includes a base 1212 and a side wall 1213, and the side wall 1213 is connected to the base 1212. The side wall 1213 and the base 1212 are surrounded to form the cup mouth 1211. The light-emitting device 12 also includes a solder pad 123, which is arranged on the fixing portion 21. The solder pad 123 can be arranged at one end of the side wall 1213 of the fixing portion 21 away from the base 1212. The fixing portion 21 is fixed to the circuit layer 112 by welding the solder pad 123, that is, the solder pad 123 is connected to the circuit layer 112 and the fixing portion 21 respectively. Since the solder pad 123 is made of metal, it also functions as a conductor when connected to the circuit layer 112. The LED light-emitting unit 122 is also electrically connected to the solder pad 123, thereby indirectly connecting the LED light-emitting unit 122 to the circuit layer 112, thereby reducing jumper wires, saving cost and space.

[0075] Therefore, in the embodiment of the present application, the solder pad 123 is connected between the fixing part 21 and the circuit layer 112, and the solder pad 123 is also electrically connected to the LED light-emitting unit 122. The solder pad 123 can not only fix the fixing part 21 on the circuit layer 112, but also use its conductivity to transmit the electrical signal transmitted by the circuit layer 112 to the LED light-emitting unit 122, so that the LED light-emitting unit 122 can be turned on or off.

[0076] The light-emitting device 12 further includes a gold wire 124, which is electrically connected to the LED light-emitting unit 122 and the soldering pad 123. The gold wire 124 has excellent conductivity and is used to transmit electrical signals to the LED light-emitting unit 122. In other words, in the step of electrically connecting the LED light-emitting unit 122 and the soldering pad 123, the method for preparing the light-emitting board 10 includes providing the gold wire 124, and connecting the two ends of the gold wire 124 to the soldering pad 123 and the LED light-emitting unit 122, respectively.

[0077] It is understood that since the LED light-emitting unit 122 has a cup 1211, it can accommodate at least a portion of the gold wire 124, so that the gold wire 124 does not occupy additional space. The LED light-emitting unit 122 has a positive electrode and a negative electrode. Accordingly, the number of the gold wires 124 is also two, and the number of the pads 123 is also two, which are denoted as a first gold wire 124 and a second gold wire 124, a first pad 123 and a second pad 123. The first pad 123 and the second pad 123 are respectively arranged on the fixing portion 21 at intervals. One end of the first gold wire 124 is electrically connected to the first pad 123, and the other end is electrically connected to the positive electrode of the LED light-emitting unit 122. The first pad 123 is electrically connected to the circuit layer 112. The second gold wire 124 is electrically connected to the second pad 123 at one end, and the other end is electrically connected to the negative electrode of the LED light-emitting unit 122. The second pad 123 is electrically connected to the circuit layer 112.

[0078] Please refer to Figure 14, which is a schematic diagram of a fifth process flow of the method for preparing a light-emitting panel provided in an embodiment of the present application. Prior to the step of securing the pads 123 to the circuit layer 112 via soldering, the method for preparing the light-emitting panel 10 further includes: using the adsorption device 30 to adsorb the base 1212 of the fixing portion 21 away from the cup opening 1211; and moving the light-emitting device 12 onto the circuit board 11 so that the through hole 113 is in communication with the cup opening 1211.

[0079] It is understood that the adsorption device 30 uses vacuum adsorption to adsorb the fixing portion 21, so that the light emitting device 12 is moved to the circuit board 11, facilitating the subsequent soldering process. By using the adsorption device 30 to transfer the light emitting device 12, manual labor can be effectively replaced, thereby improving efficiency.

[0080] Please refer to Figure 13, which is a schematic diagram of the second process flow for the light-emitting board provided in an embodiment of the present application. After electrically connecting the LED light-emitting unit 122 to the solder pad 123, the method for preparing the light-emitting board 10 further includes: using a dispensing head 40 to apply a resin mixture to the LED light-emitting unit 122, the resin mixture including a resin material and white phosphor 1252, with the white phosphor 1252 dispersed in the resin mixture; and curing the resin mixture to form a lens 125, which is disposed over the LED light-emitting unit 122. The lens 125 is used to expand the light output angle of the LED light-emitting unit 122.

[0081] Since the LED lens 125 is arranged in the cup mouth 1211 of the fixing part 21, when the resin mixture is coated on the LED light-emitting unit 122, it can be directly filled in the cup mouth 1211 and can also cover part of the solder pad 123. The lens 125 formed after the resin mixture is cured can not only expand the light output angle of the LED light-emitting unit 122, but also can encapsulate the LED light-emitting unit 122, protect the LED light-emitting unit 122, and help improve the stability of the light-emitting unit.

[0082] In some embodiments, referring to Figure 14 , which is a fifth flow diagram of a method for manufacturing a light-emitting panel according to embodiments of the present application, after connecting the fixing portion 21 to the circuit layer 112 , the method for manufacturing the light-emitting panel 10 further includes: S6 , providing a component 14 ; S7 , securing the component 14 to the circuit layer 112 .

[0083] The component 14 can be soldered to the side of the circuit layer 112 away from the substrate layer 111. The component 14 can be spaced apart from the light-emitting device 12. Furthermore, on the circuit layer 112, the component 14 can be spaced apart from the fixing portion 21. It is understood that the component 14 is soldered to the side of the circuit layer 112 away from the substrate layer 111 so that the light-emitting surface 13 of the light-emitting board 10 and the component 14 are respectively formed on both sides of the substrate layer 111 of the circuit board 11, completely eliminating the influence of the component 14 on the light mixing effect, eliminating the need to apply white glue or reflective paper on the component 14, and improving the light uniformity of the light-emitting substrate. In some scenarios for preparing a light-emitting panel 10, a circuit board 11 is first provided. The circuit board 11 includes a substrate layer 111 and a circuit layer 112. The circuit layer 112 is attached to the substrate layer 111. The circuit board 11 has a through hole 113 that passes through the substrate layer 111 and the circuit layer 112. Then, a light-emitting device 12 is provided. The light-emitting device 12 includes a fixing portion 21 and an LED light-emitting unit 122. The LED light-emitting unit 122 is fixed to the fixing portion 21. Next, the fixing portion 21 is fixed to a side of the circuit layer 112 away from the substrate layer 111. Finally, the LED light-emitting unit 122 is electrically connected to the circuit layer 112. The light generated by the LED light-emitting unit 122 passes through the through hole 113 and is emitted from the side of the substrate away from the circuit layer 112, so that the side of the substrate away from the circuit layer 112 forms a light-emitting surface 13.

[0084] In other scenarios for preparing the light-emitting panel 10, the first step is to apply a white ink layer 114 to one side of the substrate layer 111 to form a reflective surface, and to prepare a circuit layer 112 on the other side to form a soldering surface, and to drill through holes 113 at specific locations. The substrate layer 111 can be made of aluminum, FR4, BT, etc. The second step is to design and manufacture a light-emitting device 12, wherein a properly mounted LED light-emitting unit 122 is fixed within a fixing portion 21, and the LED light-emitting unit 122 and the fixing portion 21 are electrically connected via a gold wire 124. The third step is to apply a resin mixture on the fixing portion 21 and cure it to form a resin polymer 1251. The resin polymer 1251 encapsulates the LED light-emitting unit 122 to form a lens 125, which protects the LED chip and expands the light output angle of the LED. The resin mixture can be a thermosetting resin or a light-curing resin. The resin mixture can be mixed with white phosphor 1252 in a certain mass ratio (10:1 to 20:1) to convert the blue light emitted by the LED light-emitting unit 122 into white light. Step 4: Print solder paste on the side of the circuit board 11 having the circuit layer 112, and mount the light-emitting device 12 and components 14 (resistors, capacitors, ICs, jumpers, etc.) on the circuit layer 112, wherein the cup mouth 1211 of the light-emitting device 12 faces downward and is aligned with the through hole 113 set on the circuit board 11.

[0085] The present application also provides a backlight module, including the above-mentioned light-emitting panel 10 or the light-emitting panel 10 prepared by the method for preparing the light-emitting panel 10. The backlight module may further include a light guide plate, a lower diffuser, a prism sheet, and an upper diffuser. The light generated by the light-emitting panel 10 is adjusted in sequence by the light guide plate, the lower diffuser, the prism sheet, and the upper diffuser, ultimately forming uniform, uniformly oriented output light.

[0086] The present application also provides a display device comprising the aforementioned backlight module and a liquid crystal module. Light generated by the backlight module is emitted to the liquid crystal module, enabling the liquid crystal module to display an image. The display device can be a functional device such as a television, mobile phone, computer, tablet computer, or wearable device.

[0087] In the light-emitting panel 10 and its preparation method, backlight module, and display device provided in the embodiments of the present application, the light-emitting panel 10 includes a circuit board 11 and a light-emitting device 12. Specifically, the circuit board 11 includes a substrate layer 111 and a circuit layer 112. The circuit layer 112 is attached to one side of the substrate layer 111, and the other side of the substrate layer 111 serves as a light-emitting surface 13. The circuit board 11 has a through hole 113. The circuit layer 112 is used for soldering components 14. The light-emitting device 12 includes a fixing portion 21 and an LED light-emitting unit 122. The light-emitting device 12 is provided corresponding to the through hole 113. The fixing portion 21 is provided on one side of the circuit layer 112. The LED light-emitting unit 122 passes through the through hole 113 toward the light-emitting surface 13. That is, the light generated by the LED light-emitting unit 122 passes through the through hole 113 and is emitted from the side of the substrate layer 111 away from the circuit layer 112, so that the side of the substrate layer 111 away from the circuit layer 112 forms the light-emitting surface 13. It can be understood that the light-emitting surface 13 of the light-emitting board 10 and the components 14 are respectively formed on both sides of the substrate layer 111 of the circuit board 11, completely eliminating the influence of the components 14 on the mixed light effect. There is no need to apply white glue and reflective paper on the components 14, thereby improving the light uniformity of the light-emitting substrate.

[0088] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more features.

[0090] The above describes in detail the light-emitting panel and its preparation method, backlight module, and display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the present application. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concepts of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. A light-emitting panel, comprising: A circuit board, the circuit board comprising a substrate layer and a circuit layer, the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole; A light-emitting device, comprising a fixing portion and an LED light-emitting unit, wherein the LED light-emitting unit is fixed on the fixing portion, the light-emitting device is arranged corresponding to the through hole, the fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit passes through the through hole toward the light-emitting surface.

2. The light-emitting panel according to claim 1, wherein The light-emitting device also includes a solder pad, which is arranged on the fixed part, and the solder pad is respectively connected to the circuit layer and the fixed part, and the solder pad is also electrically connected to the LED light-emitting unit, and the solder pad is used to fix the fixed part on the circuit layer; the fixed part has a cup mouth, the LED light-emitting unit is arranged in the cup mouth, and the cup mouth is connected to the through hole.

3. The light-emitting panel according to claim 2, wherein: The fixing portion includes a base and a side wall, wherein the side wall is connected to the base, the side wall and the base are arranged to surround the cup mouth, and the solder pad is arranged at an end of the side wall away from the base.

4. The light-emitting panel according to claim 2, wherein: The light emitting device further comprises gold wires, and the gold wires are electrically connected to the LED light emitting unit and the pads respectively.

5. The light-emitting panel according to claim 1, wherein The circuit board also includes a white ink layer, which is arranged on a side of the substrate layer away from the circuit layer. The through hole sequentially penetrates the circuit layer, the substrate layer and the white ink layer, and the white ink layer is used to reflect the light generated by the LED light-emitting unit.

6. The light-emitting panel according to claim 1, wherein The light emitting device further comprises a lens, wherein the lens cover is arranged on the LED light emitting unit, and the lens is used for expanding the light emission angle of the LED light emitting unit.

7. The light-emitting panel according to claim 6, wherein: The LED light-emitting unit is a blue light-emitting unit. The material of the lens includes a resin polymer and white phosphor. The white phosphor is dispersed in the resin polymer. The white phosphor is used to convert the blue light emitted by the LED light-emitting unit into white light.

8. The light-emitting panel according to claim 7, wherein: The resin polymer is a thermosetting resin or a photocurable resin.

9. The light-emitting panel according to claim 7, wherein: The material composition of the lens includes, by mass percentage, 80%-90% of the resin polymer and 10%-20% of the white fluorescent powder.

10. The light-emitting panel according to claim 1, wherein The substrate layer is an aluminum substrate, a FR4 substrate or a BT substrate.

11. A method for preparing a light-emitting panel, comprising: A circuit board is provided, the circuit board comprising a substrate layer and a circuit layer, the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole; A light emitting device is provided, the light emitting device comprising a fixing portion and an LED light emitting unit, wherein the LED light emitting unit is fixed on the fixing portion; Arrange the light emitting device corresponding to the through hole; The fixing portion is fixed to one side of the circuit layer so that the LED light-emitting unit passes through the through hole toward the light-emitting surface.

12. The method for preparing a luminescent plate according to claim 11, wherein: A circuit board is provided, comprising: providing a substrate layer; forming a circuit layer on the substrate layer; forming through holes on the substrate layer and the circuit layer, wherein the through holes penetrate the substrate layer and the circuit layer.

13. The method for preparing a luminescent plate according to claim 12, wherein: After forming the circuit layer on the substrate layer, the method further includes: forming a white ink layer on a side of the substrate layer away from the circuit layer; Forming through holes on the substrate layer and the circuit layer includes: forming the through holes on the substrate layer, the circuit layer and the white ink layer, wherein the through holes sequentially penetrate the circuit layer, the substrate layer and the white ink layer.

14. The method for preparing a luminescent plate according to claim 11, wherein: A light emitting device is provided, comprising: providing a fixing part, the fixing part comprising a base and a side wall, the side wall being connected to the base, the side wall and the base being arranged to form a cup mouth; forming a soldering pad at an end of the side wall away from the base; providing an LED light emitting unit; fixing the LED light emitting unit in the cup mouth; and electrically connecting the LED light emitting unit to the soldering pad; The fixing part is fixed on a side of the circuit layer away from the substrate layer and the LED light-emitting unit is electrically connected to the circuit layer, including: fixing the pad on the circuit layer by a welding process so that the cup mouth is connected to the through hole.

15. The method for preparing a luminescent plate according to claim 14, wherein: Before fixing the pad on the circuit layer by welding, the method further includes: adsorbing the base of the fixing portion away from the cup mouth by an adsorption device; and moving the light-emitting device to the circuit board so that the through hole is connected to the cup mouth.

16. The method for preparing a luminescent plate according to claim 14, wherein: After the LED light-emitting unit is electrically connected to the soldering pad, the method further includes: using a dispensing head to coat a resin mixture on the LED light-emitting unit, wherein the resin mixture includes a resin material and white phosphor, and the white phosphor is dispersed in the resin mixture; curing the resin mixture to form a lens, and the lens cover is disposed on the LED light-emitting unit.

17. The method for preparing a luminescent plate according to claim 11, wherein: After the fixing part is connected to the circuit layer, the method further includes: providing components; and welding the components to a side of the circuit layer away from the substrate layer.

18. A backlight module, comprising a light-emitting panel, wherein the light-emitting panel comprises: A circuit board, the circuit board comprising a substrate layer and a circuit layer, the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole; A light-emitting device, comprising a fixing portion and an LED light-emitting unit, wherein the LED light-emitting unit is fixed on the fixing portion, the light-emitting device is arranged corresponding to the through hole, the fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit passes through the through hole toward the light-emitting surface.

19. A backlight module, comprising a light-emitting panel prepared by a method for preparing a light-emitting panel, the method for preparing the light-emitting panel comprising: A circuit board is provided, the circuit board comprising a substrate layer and a circuit layer, the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole; A light emitting device is provided, the light emitting device comprising a fixing portion and an LED light emitting unit, wherein the LED light emitting unit is fixed on the fixing portion; Arrange the light emitting device corresponding to the through hole; The fixing portion is fixed to one side of the circuit layer so that the LED light-emitting unit passes through the through hole toward the light-emitting surface.

20. A display device, comprising a backlight module, wherein the backlight module comprises a light-emitting panel, and the light-emitting panel comprises: A circuit board, the circuit board comprising a substrate layer and a circuit layer, the circuit layer is attached to one side of the substrate layer, the other side of the substrate layer is a light emitting surface, and the circuit board has a through hole; A light-emitting device, comprising a fixing portion and an LED light-emitting unit, wherein the LED light-emitting unit is fixed on the fixing portion, the light-emitting device is arranged corresponding to the through hole, the fixing portion is arranged on one side of the circuit layer, and the LED light-emitting unit passes through the through hole toward the light-emitting surface.

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