Electronic assembly and electronic device

Abstract

Provided in the embodiments of the present application are an electronic assembly and an electronic device. The electronic assembly comprises a printed circuit board and a flexible circuit board, wherein first bonding pads are provided on a first surface of the printed circuit board, second bonding pads are provided on a second surface of the flexible circuit board, and the first bonding pads and the second bonding pads are connected by means of welding, such that a physical connection and a signal connection between the printed circuit board and the flexible circuit board can be realized. In order to improve a welding effect, supporting structures are provided between the printed circuit board and the flexible circuit board, such that a preset gap is provided between the printed circuit board and the flexible circuit board. The preset gap is formed into a gas output channel, and gas generated by a welding process is discharged from a space between the printed circuit board and the flexible circuit board by means of the gas output channel, such that solder is not pressed, thus improving the reliability of welding the first bonding pad and the second bonding pad, and improving the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board.

Description

Electronic component and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on August 3, 2023, with application number 202310972699.7 and application name “An electronic component and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic equipment, and in particular to an electronic component and an electronic device. Background Art

[0004] Flexible circuit boards (FPCs) offer advantages such as high density and thinness. They can be soldered to printed circuit boards (PCBs), connecting the two and enabling signal transmission across the board. To ensure reliable signal transmission between the PCB and FPC, soldering quality control is essential to achieve high-yield, high-quality soldering between the PCB and FPC.

[0005] Figure 1 illustrates a cross-sectional structure of an electronic component in the prior art. As shown in Figure 1, the prior art electronic component includes an FPC1 and a PCB2 connected by soldering. For soldering FPC1 and PCB2, a pressure head is typically added to the surface of FPC1 facing away from PCB2 to ensure that the surface of FPC1 facing PCB2 and the surface of PCB2 facing FPC1 are in contact throughout the soldering process, thereby facilitating soldering between the FPC pads and the PCB pads. Gas is generated during the soldering process. If this gas squeezes the molten solder, various defects may occur in the solder joints, resulting in a low soldering yield and poor signal transmission reliability between the PCB and FPC.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide an electronic component and an electronic device, which improve the welding strength between a printed circuit board and a flexible circuit board, and improve the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board.

[0008] In a first aspect, the present application provides an electronic component. The electronic component includes a printed circuit board and a flexible circuit board. A first solder pad is provided on the first surface of the printed circuit board, and a second solder pad is provided on the second surface of the flexible circuit board. The first solder pad and the second solder pad are connected by welding, thereby achieving a physical connection and a signal connection between the printed circuit board and the flexible circuit board. To improve the welding effect, a support structure is provided between the printed circuit board and the flexible circuit board, so that a preset gap is formed between the printed circuit board and the flexible circuit board. The preset gap is formed into an air outlet channel. The gas generated by the welding process is discharged between the printed circuit board and the flexible circuit board through the air outlet channel, thereby preventing the solder from being squeezed, improving the welding reliability of the first solder pad and the second solder pad, and improving the efficiency and reliability of signal transmission between the printed circuit board and the flexible circuit board.

[0009] When forming the above-mentioned support structure, the support structure can be a single-piece structure. The support structure can be fixed to a printed circuit board or a flexible circuit board. For example, the support structure can be fixedly mounted on the first surface of the printed circuit board, with the end of the support structure away from the printed circuit board abutting against the second surface of the flexible circuit board. Alternatively, the support structure can be fixedly mounted on the second surface of the flexible circuit board, with one end of the support structure facing the flexible circuit board abutting against the first surface of the printed circuit board. In this solution, the support structure is relatively simple, and the precision requirements for the manufacturing and design of the support structure's position are relatively low.

[0010] In another possible technical solution, the support structure is a split structure, for example, comprising two parts. Specifically, the support structure comprises a first support structure and a second support structure, with the first support structure fixedly mounted on the first surface of the printed circuit board, and the second support structure fixedly mounted on the second surface of the flexible circuit board. The first and second support structures abut against each other, supporting the flexible circuit board and the printed circuit board to form the aforementioned predetermined gap. In this solution, the first and second support structures can be made relatively short, simplifying the support structure manufacturing process.

[0011] A plurality of supporting structures may be provided between the flexible circuit board and the printed circuit board, and the plurality of supporting structures may be evenly distributed between the printed circuit board and the flexible circuit board to form a relatively uniform air outlet channel.

[0012] Furthermore, the position of the support structure can be designed based on the actual distribution of solder joints between the flexible circuit board and the printed circuit board. For example, support structures can be provided on at least two sides of the first solder pad. This solution can create targeted gas outlet channels around the solder joints between the printed circuit board and the flexible circuit board to exhaust gas generated by the solder joints.

[0013] The specific material forming the support structure is also not limited. For example, the support structure may include at least one of a copper layer, a green oil layer, a white oil layer, a cover film, and an adhesive film. The support structure formed on the surface of a printed circuit board is preferably made of materials commonly used in the manufacture of printed circuit boards, while the support structure formed on the surface of a flexible circuit board is preferably made of materials commonly used in the manufacture of flexible circuit boards to simplify the support structure manufacturing process.

[0014] Another possible arrangement for the support structure is to place it within the solder between the first and second pads. This solution eliminates the need to form the support structure when forming the printed circuit board or flexible circuit board; instead, the support structure can be added during soldering. This simplifies the manufacturing process for the printed circuit board and the flexible circuit board, and placing the support structure directly at the solder joints is more targeted.

[0015] In this solution, the shape of the support structure can have multiple options. For example, the support structure can be a gasket, a ball, or an irregular block.

[0016] To ensure reliable attachment of the support structure to the solder, at least the surface of the support structure is metallic. For example, the support structure can be metallic, which provides increased support strength. Alternatively, the support structure can have a metallic surface layer and a polymer core within, which is more cost-effective.

[0017] In a second aspect, the present application further provides an electronic device. The electronic device includes a housing and the electronic component provided in the first aspect, wherein the electronic component is disposed in the housing. The electronic device has high signal transmission efficiency and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a schematic diagram of a cross-sectional structure of an electronic component in the prior art;

[0019] FIG2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

[0020] FIG3 is a schematic structural diagram of an electronic component in an embodiment of the present application;

[0021] FIG4 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0022] FIG5 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0023] FIG6 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0024] FIG7 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0025] FIG8 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0026] FIG9 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0027] FIG10 is another schematic diagram of the structure of the electronic component in the embodiment of the present application;

[0028] FIG11 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;

[0029] FIG12 is another schematic diagram of the structure of the flexible circuit board in an embodiment of the present application;

[0030] FIG13 is a schematic diagram of a partial cross-sectional structure of an electronic component in an embodiment of the present application;

[0031] FIG14 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application;

[0032] FIG15 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application;

[0033] FIG16 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application;

[0034] FIG17 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application;

[0035] FIG18 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application;

[0036] FIG19 is another partial cross-sectional structural diagram of an electronic component in an embodiment of the present application;

[0037] FIG20 is another partial cross-sectional structural schematic diagram of the electronic component in the embodiment of the present application.

[0038] Reference numerals:

[0039] 1-Printed circuit board;

[0040] 11- first surface;

[0041] 12-first pad;

[0042] 13-First line;

[0043] 2-Flexible circuit board;

[0044] 21- second surface;

[0045] 22- second pad;

[0046] 23-Second line;

[0047] 3- Connector;

[0048] 4-Packaging structure;

[0049] 5-Support structure;

[0050] 51-first supporting structure;

[0051] 52- second supporting structure;

[0052] 6-Preset gap;

[0053] 100-housing;

[0054] 200-Electronic components. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0056] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0057] References in this specification to "one embodiment" or "a specific embodiment" mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. The terms "including," "comprising," "having," and their variations all mean "including but not limited to," unless otherwise specifically stated.

[0058] To facilitate understanding of the electronic components and electronic devices provided in the embodiments of the present application, the following first introduces their application scenarios.

[0059] The electronic devices in the embodiments of the present application can be electronic devices such as communication devices (such as routers), computing devices (such as servers), network devices (such as switches), or storage devices (such as storage arrays), or can also be electronic devices such as optical modules, vehicle-mounted devices, or terminal devices. The present application does not limit the specific type of electronic device. As long as the electronic device includes electronic components connected to a flexible circuit board and a printed circuit board, the technical solutions provided in the present application can be used.

[0060] For ease of description, the embodiment of the present application is described by taking the electronic device as a server as an example. Figure 2 is a structural diagram of an electronic device in an embodiment of the present application. As shown in Figure 2, the above-mentioned electronic device may include a housing 100, and an electronic component 200 arranged in the housing 100. Specifically, when the above-mentioned electronic device is a cabinet server, the above-mentioned housing 100 can be understood as a cabinet of the cabinet server, and the electronic component 200 may include a node. As shown in Figure 2, the above-mentioned electronic component 200 specifically includes a flexible circuit board 2 and a printed circuit board 1. The flexible circuit board 2 is welded to the printed circuit board 1 to achieve physical connection and signal connection between the flexible circuit board 2 and the printed circuit board 1.

[0061] The above-mentioned electronic components can be applied to different application scenarios, or the electronic components can include different component forms. For example, Figure 3 is a structural schematic diagram of an electronic component in an embodiment of the present application. As shown in Figure 3, in a specific embodiment, the flexible circuit board 2 in the above-mentioned electronic component is used to realize the single-board jumper of the printed circuit board 1. Specifically, both ends of the flexible circuit board 2 are welded to the printed circuit board 1 to realize the transmission of signals at two positions in the printed circuit board 1. Figure 4 is another structural schematic diagram of the electronic component in an embodiment of the present application. As shown in Figure 4, in another specific embodiment, the above-mentioned electronic component may include two printed circuit boards 1, and the two printed circuit boards 1 are approximately located in the same plane. The two ends of the flexible circuit board 2 are respectively welded to the two printed circuit boards 1, so that the flexible circuit board 2 is connected between the two printed circuit boards 1, so that the signals between the two printed circuit boards 1 can be transmitted through the flexible circuit board 2 to realize inter-board interconnection. Figure 5 is another structural schematic diagram of the electronic component in an embodiment of the present application. As shown in Figure 5, in another specific embodiment, the above-mentioned electronic component may include two printed circuit boards 1, and the two printed circuit boards 1 are located in different planes. The two ends of the flexible circuit board 2 are respectively welded to the two printed circuit boards 1, so that the flexible circuit board 2 is connected between the two printed circuit boards 1, so that the signals between the two printed circuit boards 1 can be transmitted through the flexible circuit board 2, realizing cross-board connection. Figure 6 is another structural schematic diagram of the electronic component in the embodiment of the present application. As shown in Figure 6, in another specific embodiment, one end of the flexible circuit board 2 in the electronic component is welded to the printed circuit board 1, and the other end is connected to the connector 3, so that the connector 3 and the printed circuit board 1 can be transmitted through the flexible circuit board 2, and then the printed circuit board 1 can be connected to the external device through the connector 3, and the flexible circuit board 2, the printed circuit board 1 and the connector 3 form an electronic module. Figure 7 is another structural schematic diagram of the electronic component in the embodiment of the present application. As shown in Figure 7, in another specific embodiment, the flexible circuit board 2 realizes the connection between the packaging structure 4 and the printed circuit board 1, so that signals can be transmitted between the packaging structure 4 and the printed circuit board 1. Specifically, one end of the flexible circuit board 2 is connected to the packaging structure 4, and the other end is connected to the printed circuit board 1.

[0062] FIG8 is another schematic diagram of the structure of an electronic assembly according to an embodiment of the present application. As shown in FIG8 , in another specific embodiment, a single-layer flexible circuit board 2 can be welded to the surface of a printed circuit board 1. FIG9 is another schematic diagram of the structure of an electronic assembly according to an embodiment of the present application. As shown in FIG9 , in another specific embodiment, a multi-layer stacked flexible circuit board 2 can be welded to the surface of a printed circuit board 1. In addition, a flexible circuit board 2 can be connected to a single side of a printed circuit board 1, as shown in FIG8 and FIG9 . Alternatively, FIG10 is another schematic diagram of the structure of an electronic assembly according to an embodiment of the present application. As shown in FIG10 , in another specific embodiment, a flexible circuit board 2 can be connected to both sides of a printed circuit board 1.

[0063] The specific form of the flexible circuit board 2 in the embodiment of the present application is not limited. Figure 11 is a schematic diagram of one structure of the flexible circuit board 2 in the embodiment of the present application, and Figure 12 is a schematic diagram of another structure of the flexible circuit board 2 in the embodiment of the present application. In a possible embodiment, as shown in Figure 11, the flexible circuit board 2 can be a one-to-one type flexible circuit board 2, that is, the flexible circuit board 2 is used to achieve signal transmission between two points. Specifically, the flexible circuit board 2 includes two second soldering pads 22, each located at one end of the flexible circuit board 2. As shown in Figure 12, the flexible circuit board 2 can be a one-to-many type flexible circuit board 2, that is, the flexible circuit board 2 is used to achieve signal transmission between one point and multiple points. Specifically, the flexible circuit board 2 includes multiple second soldering pads 22, one of which is located at one end of the flexible circuit board 2, and at least two of which are located at the other end of the flexible circuit board 2.

[0064] Figure 13 is a partial cross-sectional view of an electronic assembly according to an embodiment of the present application. As shown in Figure 13 , the surface of the printed circuit board 1 facing the flexible circuit board 2 is a first surface 11. First solder pads 12 are provided on first surface 11 of the printed circuit board 1. The printed circuit board 1 also includes a first circuit 13, to which the first solder pads 12 are connected. The surface of the flexible circuit board 2 facing the printed circuit board 1 is a second surface 21. Second solder pads 22 are provided on second surface 21 of the flexible circuit board 2. The flexible circuit board 2 also includes a second circuit 23, to which the second solder pads 22 are connected. The first solder pads 12 and the second solder pads 22 are soldered together, connecting the first circuit 13 and the second circuit 23, thereby achieving a physical and signal connection between the printed circuit board 1 and the flexible circuit board 2. A support structure 5 is provided between the printed circuit board 1 and the flexible circuit board 2. The support structure 5 supports the printed circuit board 1 and the flexible circuit board 2, thereby defining a predetermined gap 6 between the printed circuit board 1 and the flexible circuit board 2. The above-mentioned preset gap 6 forms an air outlet channel. When welding the first welding pad 12 and the second welding pad 22, the gas generated by the welding process is discharged from between the printed circuit board 1 and the flexible circuit board 2 through the above-mentioned air outlet channel, thereby not squeezing the solder, improving the welding reliability of the first welding pad 12 and the second welding pad 22, and improving the efficiency and reliability of signal transmission between the printed circuit board 1 and the flexible circuit board 2.

[0065] In a specific embodiment, the width of the predetermined gap 6 can be between 10 and 500 microns, for example, 15, 50, 60, 80, 100, 120, 150, 160, 200, 230, 250, 300, 350, 380, 400, 420, 450, or 490 microns. A width of at least 10 microns for the predetermined gap 6 reduces manufacturing process requirements and allows gases generated during the soldering process to escape through the predetermined gap 6, preventing residual gases from squeezing the solder. Furthermore, a width of no more than 500 microns for the predetermined gap 6 reduces the thickness of the solder between the pads, resulting in increased strength and a more reliable connection between the first and second pads 12, 22. In short, the gap should be designed to allow for sufficient gas escape and ensure a reliable connection between the first and second pads 12, 22.

[0066] FIG14 is another partial cross-sectional view of an electronic assembly according to an embodiment of the present application. As shown in FIG13 and FIG14 , when forming the support structure 5, the support structure 5 located between the printed circuit board 1 and the flexible circuit board 2 can be a separate, integral structure, secured to either the printed circuit board 1 or the flexible circuit board 2. Specifically, as shown in FIG13 , in one possible implementation, the support structure 5 is secured to the first surface 11 of the printed circuit board 1. During soldering, the end of the support structure 5 facing away from the printed circuit board 1 abuts against the second surface 21 of the flexible circuit board 2. This support structure 5 can be understood as comprising two opposing ends, one end secured to the printed circuit board 1 and the other end abutting against the flexible circuit board 2. In another possible implementation, as shown in FIG14 , the support structure 5 is secured to the second surface 21 of the flexible circuit board 2. During soldering, the end of the support structure 5 facing away from the flexible circuit board 2 abuts against the first surface 11 of the printed circuit board 1. This support structure 5 can be understood as comprising two opposing ends, one end secured to the flexible circuit board 2 and the other end abutting against the printed circuit board 1. In the above two implementations, the requirements for the position of the supporting structure 5 against each other are relatively low, and the requirements for the precision of the manufacturing and design of the position of the supporting structure 5 are relatively low. In addition, preparing the supporting structure 5 on only one side can simplify the preparation process.

[0067] Figure 15 is a schematic partial cross-sectional view of another embodiment of the electronic assembly of the present application. As shown in Figure 15 , in another possible embodiment, the support structure 5 located between the printed circuit board 1 and the flexible circuit board 2 can be a split structure, comprising two parts, specifically a first support structure 51 and a second support structure 52. The first support structure 51 is fixedly mounted on the first surface 11 of the printed circuit board 1, and the second support structure 52 is fixedly mounted on the second surface 21 of the flexible circuit board 2. During soldering of the printed circuit board 1 and the flexible circuit board 2, the first support structure 51 and the second support structure 52 abut against each other to form the support structure 5, supporting the printed circuit board 1 and the flexible circuit board 2 to form a predetermined gap 6, which serves as an air outlet. In this embodiment, the support structure 5 comprises two parts. When forming a support structure 5 of a certain height, particularly a taller support structure 5, the first support structure 51 and the second support structure 52 can be made shorter, simplifying the fabrication process of the support structure 5.

[0068] FIG16 is another partial cross-sectional view of an electronic component according to an embodiment of the present application. As shown in FIG16 , in a specific application, the printed circuit board 1 may include a plurality of first solder pads 12, and correspondingly, the flexible circuit board 2 may also be provided with a plurality of second solder pads 22. The first solder pads are soldered to the second solder pads to form a plurality of solder joints between the printed circuit board 1 and the flexible circuit board 2. A plurality of support structures 5 may be provided between the printed circuit board 1 and the flexible circuit board 2. When providing the plurality of support structures 5, there may be various possible numbers and arrangements of the support structures 5. In one possible embodiment, the support structures 5 are evenly distributed between the printed circuit board 1 and the flexible circuit board 2, thereby forming a relatively uniform air outlet channel.

[0069] Alternatively, in another possible embodiment, the position of the support structure can be designed based on the actual distribution of the solder joints between the printed circuit board 1 and the flexible circuit board 2. For example, support structures 5 can be provided on both sides of the first solder pad 12 along a certain direction, that is, support structures 5 can be provided on both sides of the solder joints along a certain direction. Gas outlet channels are formed around the solder joints between the printed circuit board 1 and the flexible circuit board 2 to exhaust gas generated by the solder joints.

[0070] In another possible embodiment, the support structure 5 may be arranged in a ring or other predetermined shape to support between the printed circuit board 1 and the flexible circuit board 2 .

[0071] The specific material forming the support structure 5 is also not limited. For example, the support structure 5 can be at least one of a copper layer (copper wire or copper foil), a green oil layer, a white oil layer, a cover film, and an adhesive film. The materials of different support structures 5 can be the same or different, and can be selected and designed based on the specific form of the product, which is not limited in this application. Specifically, the support structure 5 formed on the surface of the printed circuit board 1 is preferably made of materials required for the production of the printed circuit board 1, and the support structure 5 formed on the surface of the flexible circuit board 2 is preferably made of materials required for the production of the flexible circuit board 2, so as to simplify the production process of the support structure 5.

[0072] FIG17 is a schematic diagram of a partial cross-sectional structure of an electronic component in an embodiment of the present application. As shown in FIG17 , in another possible embodiment, the support structure 5 can also be arranged in the solder between the first pad 12 and the second pad 22. Specifically, the first pad 12 and the second pad 22 are connected by solder, and the support structure 5 is arranged in the solder to form a preset gap 6. This solution does not require the formation of the support structure 5 when preparing the printed circuit board 1 or the flexible circuit board 2. The support structure 5 can be added during welding. The process of preparing the printed circuit board 1 and the process of preparing the flexible circuit board 2 are both relatively simple, and the support structure 5 is directly arranged at the solder point, which is more targeted. It is worth noting that the support structure 5 is arranged in the solder, which does not mean that the solder completely covers the support structure 5. It can be understood that the support structure 5 is fixed between the printed circuit board 1 and the flexible circuit board 2 by solder.

[0073] In this embodiment, the shape of the support structure 5 is not limited, and can be a gasket shape, a spherical shape, or an irregular shape, and can be set according to actual needs.

[0074] Furthermore, in an optional implementation, the support structure 5 can be a metal support structure, meaning that the entire support structure 5 is made of metal. Metal support structures are relatively strong and provide better support. In another optional implementation, the support structure 5 can have only a metal layer on the surface and a non-metallic core inside. This solution reduces the cost of the support structure 5. In short, the support structure 5 needs to be weldable, with at least the outer surface being made of metal.

[0075] Specifically, the printed circuit board 1 includes a plurality of first solder pads 12, and correspondingly, the flexible circuit board 2 may also be provided with a plurality of second solder pads 22. Each group of first and second solder pads 12, 22 soldered together forms a solder joint, thereby forming multiple solder joints between the printed circuit board 1 and the flexible circuit board 2. Figures 18 to 20 are schematic partial cross-sectional views of electronic components in different embodiments of the present application, illustrating a layout diagram of a support structure 5 provided at the solder joints. As shown in Figure 18, in one possible implementation, a support structure 5 may be provided at each solder joint, or between each first solder pad 12 and second solder pad 22. Alternatively, as shown in Figure 19, in another possible embodiment, a support structure 5 may be provided at every other solder joint. Alternatively, a support structure 5 may be provided at every other first solder pad 12. Alternatively, as shown in Figure 20, a support structure 5 may be provided at every other two or more solder joints. This reduces the number of support structures 5 and simplifies the soldering process.

[0076] The number of support structures 5 provided between a welding point can also be selected according to demand. In order to simplify the welding process and improve the supporting effect, only one support structure 5 can be provided in a welding point.

[0077] Obviously, those skilled in the art may make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include these modifications and variations.

Claims

1. An electronic component, characterized in that: It comprises a printed circuit board and a flexible circuit board, wherein a first solder pad is arranged on a first surface of the printed circuit board, and a second solder pad is arranged on a second surface of the flexible circuit board, and the first solder pad and the second solder pad are connected by welding; A supporting structure is arranged between the printed circuit board and the flexible circuit board, so that a preset gap is formed between the printed circuit board and the flexible circuit board.

2. The electronic component according to claim 1, wherein: The support structure is fixedly disposed on the first surface of the printed circuit board and abuts against the second surface of the flexible circuit board; or, the support structure is fixedly disposed on the second surface of the flexible circuit board and abuts against the first surface of the printed circuit board.

3. The electronic component according to claim 1, wherein: The support structure includes a first support structure and a second support structure. The first support structure is fixedly disposed on the first surface of the printed circuit board, and the second support structure is fixedly disposed on the second surface of the flexible circuit board. The first support structure and the second support structure are against each other.

4. The electronic component according to any one of claims 1 to 3, characterized in that: The supporting structure is evenly distributed between the printed circuit board and the flexible circuit board.

5. The electronic component according to any one of claims 1 to 4, characterized in that: The supporting structure is disposed on at least two sides of the first pad.

6. The electronic component according to any one of claims 1 to 4, characterized in that: The support structure includes at least one of a copper layer, a green oil layer, a white oil layer, a covering film and an adhesive film.

7. The electronic component according to claim 1, wherein: The support structure is disposed in the solder between the first pad and the second pad.

8. The electronic component according to claim 7, wherein: The supporting structure is a gasket or a ball.

9. The electronic component according to claim 7 or 8, characterized in that: The support structure is a metal support structure, or the surface of the support structure has a metal layer.

10. An electronic device, characterized in that: The invention comprises a housing and the electronic component according to any one of claims 1 to 9, wherein the electronic component is arranged in the housing.

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