Composition for heat transfer fluids, device for heat transfer, and heat transfer method

Abstract

The present invention provides a composition for heat transfer fluids, the composition containing: a hexafluoropropene trimer which is represented by C9F18; and (i) CmF2m and / or CnF(2n-2) (wherein m is an integer of 4 to 12 excluding 9, and n is an integer of 4 to 12), (ii) water (provided that the content of the water is 0.0001 to 0.1 part by mass relative to a total of 100 parts by mass of the hexafluoropropene trimer which is represented by C9F18), and / or (iii) fluoride ions (provided that the content of the fluoride ions is 0.0000001 to 5 parts by mass relative to a total of 100 parts by mass of the hexafluoropropene trimer which is represented by C9F18).

Description

HEAT TRANSFER FLUID COMPOSITION, HEAT TRANSFER DEVICE, AND HEAT TRANSFER METHOD

[0001] FIELD OF THE DISCLOSURE The present disclosure relates to heat transfer fluid compositions, heat transfer devices and heat transfer methods.

[0002] It is known that a trimer of hexafluoropropene (HFP) can be used as a heat transfer fluid composition (Patent Document 1).

[0003] The trimer of HFP has a low global warming potential (GWP) and low toxicity, and is therefore attracting attention as a substitute for chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs).

[0004] WO 2018 / 172919

[0005] In view of the above circumstances, an object of the present disclosure is to provide a heat transfer fluid composition in the form of a novel mixture.

[0006] As a result of extensive research aimed at solving the above problems, the present inventors have found that a heat transfer fluid composition can be provided as a novel mixture by allowing a predetermined fluorocarbon to coexist with an HFP trimer, a predetermined amount of water, and / or a predetermined amount of fluoride ions.

[0007] That is, the present disclosure includes the following aspects. [Item 1] C ９ F １８ and (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） (wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less.) (ii) water (wherein the content of such water is determined by the above-mentioned C ９ F １８ and / or (iii) fluoride ions (wherein the content of such fluoride ions is 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the total amount of hexafluoropropene trimer represented by C ９ F １８[Item 2] The heat transfer fluid composition according to Item 1, wherein the hexafluoropropene trimer comprises at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III): [Chemical Formula 1] [Item 3] The heat transfer fluid composition according to Item 2, wherein the compound represented by formula (I) is present in an amount of 85 mass% or more based on the total amount of hexafluoropropene trimer. [Item 4] The heat transfer fluid composition according to Item 2, wherein the compound represented by formula (I) is present in an amount of less than 85 mass% based on the total amount of hexafluoropropene trimer. [Item 5] The heat transfer fluid composition according to Item 2, wherein the compound represented by formula (I) is present in an amount of 50 mass% or more but less than 85 mass% based on the total amount of hexafluoropropene trimer. [Item 6] C ９ F １８ and (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） [wherein m is an integer of 4 or more and 12 or less, other than 9, and n is an integer of 4 or more and 12 or less.] [Item 7] The heat transfer fluid composition according to Item 1, wherein m is an integer of 6 or more and 11 or less, other than 9, and n is an integer of 6 or more and 11 or less. [Item 8] C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of C ９ F １８ Item 9. The heat transfer fluid composition according to item 1, wherein the amount of the hexafluoropropene trimer represented by the formula (I) is 0.0001 to 10 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (I). ９ F １８ Item 10. The heat transfer fluid composition according to item 1, comprising a hexafluoropropene trimer represented by the formula: ９ F １８ Item 11. The heat transfer fluid composition according to item 1, comprising a hexafluoropropene trimer represented by the formula: １２ F ２４Item 12. The heat transfer fluid composition according to Item 1, further comprising a hexafluoropropene tetramer represented by the formula: wherein the content of the hexafluoropropene trimer is 80 mass % or more based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer. [Item 13] The heat transfer fluid composition according to Item 11, further comprising a hexafluoropropene tetramer represented by the formula: [Item 14] The heat transfer fluid composition according to Item 1, further comprising an electrically conductive substance, the content of which is 100 ppm by mass or less. [Item 15] The heat transfer fluid composition according to Item 1, further comprising an electrically conductive substance, the content of insoluble matter of 5 μm or more being 10 particles / mL or less. [Item 16] A heat transfer fluid comprising the heat transfer fluid composition according to Item 1 or 2. [Item 17] Use of the heat transfer fluid composition according to Item 1 or 2 as a heat transfer fluid. [Item 18] A heat transfer apparatus comprising a device and a mechanism for transferring heat to or from the device, the mechanism comprising the heat transfer fluid composition according to Item 1 or 2. [Item 19] A heat transfer method comprising the steps of preparing a device and transferring heat to or from the device using the heat transfer fluid composition according to Item 1 or 2.

[0008] The composition according to the present disclosure obtained as described above can provide a heat transfer fluid composition in the form of a novel mixture.

[0009] In this specification, the term "containing" is a concept that encompasses all of "comprise," "consist essentially of," and "consist only of." Furthermore, in this specification, when a numerical range is expressed as "A to B," it means A or more and B or less.

[0010] (1. Heat Transfer Fluid Composition) The heat transfer fluid composition of the present disclosure comprises: (i) C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） (wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less.) (ii) water (wherein the content of such water is determined by the above-mentioned C ９ F １８ and / or (iii) fluoride ions (wherein the content of such fluoride ions is 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the total amount of hexafluoropropene trimer represented by C ９ F １８ The amount of the hexafluoropropene trimer represented by the formula (I) is 0.0000001 to 5 parts by mass relative to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (I).

[0011] The hexafluoropropene trimer includes C ９ F １８ Any known material represented by the following formula can be widely used, and there is no particular limitation.

[0012] Specific examples of such hexafluoropropene trimers include trimers containing at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III).

[0013]

[0014] In this specification, the compound represented by the above formula (I) includes both E and Z diastereomers unless otherwise specified.

[0015] The hexafluoropropene trimer contained in the heat transfer fluid composition of the present disclosure may contain only one of the compounds represented by the above formulas (I) to (III), or may be a mixture containing two or three of these compounds.

[0016] The content of the compound represented by formula (I) in the total amount of HFP trimer (i.e., the total of the compounds represented by formulae (I), (II), and (III)) is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and particularly preferably 50% by mass or more, based on the total amount of HFP trimer. The content of the compound represented by formula (I) may be 85% by mass or more based on the total amount of HFP trimer. In this case, the viscosity of the HFP trimer mixture is reduced. The content of the compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less (or less), even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less, based on the total amount of HFP trimer. The blending ratio of the compound represented by formula (I) above, relative to the total amount of HFP trimer, may be, for example, 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and less than 80% by mass, 55% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 5 ... The content may be from 30% to 90% by mass, preferably from 40% to less than 85% by mass, more preferably from 40% to 80% by mass, even more preferably from 45% to 70% by mass, and still more preferably from 50% to 60% by mass.

[0017] Similarly, the compound of formula (II) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the HFP trimer. The compound of formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less, based on the total amount of the HFP trimer.

[0018] Similarly, the content of each compound represented by formula (III) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more, based on the total amount of the HFP trimer. Furthermore, the content of the compound represented by formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less, based on 100% by mass of the total amount of the HFP trimer.

[0019] In the heat transfer fluid composition of the present disclosure, the mass ratio of the compound represented by formula (II) to the compound represented by formula (III) is not particularly limited, and may be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0020] The compounds represented by the formulas (I) to (III) may be produced by a conventional method, for example, by the method described in International Publication No. 2018 / 172919, but are not limited thereto. They may also be obtained by trimerization using HFP as a raw material, but are not limited thereto, and may be obtained by a wide variety of known methods.

[0021] The heat transfer fluid composition of the present disclosure may further comprise any of the compounds represented by formulas (I) to (III) other than C ９ F １８ The hexafluoropropene may contain a hexafluoropropene trimer represented by the following formula:

[0022] The heat transfer fluid compositions of the present disclosure may include hexafluoropropene dimer.

[0023] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0024] In one embodiment, the heat transfer fluid composition of the present disclosure may include hexafluoropropene tetramer.

[0025] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0026] In the heat transfer fluid composition of the present disclosure, the content of the hexafluoropropene trimer may be 80% by mass or more, preferably 85% by mass or more, more preferably 90% by mass or more, for example, 95% by mass or more, 98% by mass or more, 99% by mass or more, or 99.9% by mass or more, based on the total amount of the hexafluoropropene trimer and hexafluoropropene tetramer.

[0027] In the heat transfer fluid composition of the present disclosure, the content of hexafluoropropene trimer, based on the total of hexafluoropropene trimer and hexafluoropropene tetramer, may be preferably 99.999% by mass or less, more preferably 99.99% by mass or less, for example 99.9% by mass or less, 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less.

[0028] In the heat transfer fluid composition of the present disclosure, the content of hexafluoropropene trimer, based on the total amount of hexafluoropropene trimer and hexafluoropropene tetramer, is preferably 80% by mass or more and 99.999% by mass or less, more preferably 85% by mass or more and 99.99% by mass or less, for example, 90% by mass or more and 99.99% by mass or less, 95% by mass or more and 99.99% by mass or less, 99% by mass or more and 99.99% by mass or less, or 99% by mass or more and 99.9% by mass or less.

[0029] The total amount of hexafluoropropene trimer and hexafluoropropene tetramer in the heat transfer fluid composition is preferably 80% by mass or more, more preferably 85% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more, for example, 98% by mass or more, 99% by mass or more, or 99.9% by mass or more. The total amount of hexafluoropropene trimer and hexafluoropropene tetramer in the heat transfer fluid composition may be substantially 100% by mass. In other words, the heat transfer fluid composition of the present disclosure may be a mixture of hexafluoropropene trimer and hexafluoropropene tetramer.

[0030] (1-1.C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） In one embodiment, the heat transfer fluid composition of the present disclosure comprises C ９ F １８ Hexafluoropropene (HFP) trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） [In the formula, m is an integer of 4 or more and 12 or less except for 9, and n is an integer of 4 or more and 12 or less.]

[0031] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Furthermore, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. However, m does not include 9. Furthermore, it is particularly preferable that m is 8.

[0032] n is an integer of 4 or greater, preferably an integer of 5 or greater, and more preferably an integer of 6 or greater. Furthermore, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0033] C ｍ F ２ｍmay be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called alkene, and may be linear or branched.

[0034] C ｎ F （２ｎ－２） may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a diene or an alkyne, and may be linear or branched.

[0035] This disclosure relates to C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The present invention is based on the discovery that a composition in which C is present in combination with an HFP trimer surprisingly functions as a heat transfer fluid. ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The inclusion of improves the stability of the HFP trimer.

[0036] Also, C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of is preferably 0.0001 mass % or more based on the total amount of the heat transfer fluid composition of the present disclosure.

[0037] On the other hand, C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less, based on the entire heat transfer fluid composition of the present disclosure.

[0038] In one embodiment, in the heat transfer fluid composition, ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, relative to 100 parts by mass of the total of the HFP trimer.

[0039] On the other hand, in the heat transfer fluid composition, C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total HFP trimer.

[0040] In addition, C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） When a plurality of types are contained, the above content means the total amount of these.

[0041] C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） By setting the content of C in the above range, ９ F １８ This can suppress the decomposition of the HFP trimer represented by the formula (I), and thus can suppress the increase in fluoride ions and the increase in acidity.

[0042] (1-2. Water) In one aspect, the heat transfer fluid composition of the present disclosure may contain water. The content of water in the heat transfer fluid composition may be 1 ppm by mass or more, and is preferably 5 ppm by mass or more. By setting the water content to a certain level or more, for example 1 ppm by mass or more, it is possible to suppress charging of the composition due to a decrease in the stability of the heat transfer fluid composition. Furthermore, the content of water in the heat transfer fluid composition is 1000 ppm by mass or less, preferably 500 ppm by mass or less, more preferably 100 ppm by mass or less, and even more preferably 20 ppm by mass or less. By setting the water content to a certain level or less, for example 1000 ppm by mass or less, it is possible to reduce the C ９ F １８ This can suppress the decomposition of the HFP trimer represented by the following formula (1), and thus can suppress an excessive increase in fluoride ions and an increase in acidity.

[0043] In one embodiment, the water content is C ９ F １８The amount is preferably 0.0001 part by mass or more, more preferably 0.0005 part by mass or more, and even more preferably 0.001 part by mass or more, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0044] On the other hand, the water content is ９ F １８ The amount is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0045] The heat transfer fluid composition of the present disclosure contains a predetermined amount of water, which improves the dielectric strength of the heat transfer fluid composition of the present disclosure. The dielectric strength of the heat transfer fluid composition of the present disclosure may be preferably 40 kV or more, more preferably 50 kV or more, and even more preferably 60 kV or more.

[0046] (1-3. Fluoride Ions) In one embodiment, the heat transfer fluid composition of the present disclosure may contain fluoride ions in an amount of 0.0000001% by mass or more, based on the total amount of the composition. The amount of fluoride ions is preferably 0.000001% by mass or more, more preferably 0.0001% by mass or more, and even more preferably 0.001% by mass or more, based on the total amount of the composition. By setting the fluoride ion concentration to 0.0000001% by mass or more, the stability of the heat transfer fluid composition can be maintained and the composition can be prevented from becoming electrically charged.

[0047] The amount of fluoride ions contained in the heat transfer fluid composition of the present disclosure is 5% by mass or less, preferably 1% by mass or less, and more preferably 0.1% by mass or less, based on the total amount of the composition. By keeping the fluoride ion content at 5% by mass or less, the C ９ F １８ The decomposition of the compound represented by the formula (I) can be suppressed.

[0048] In one embodiment, the amount of fluoride ions is C ９ F １８The amount is preferably 0.0000001 parts by mass or more, more preferably 0.000001 parts by mass or more, still more preferably 0.0001 parts by mass or more, and even more preferably 0.001 parts by mass or more, relative to 100 parts by mass of the total of the compounds represented by the formula (I).

[0049] On the other hand, the content of water is C ９ F １８ The amount is preferably 5 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0050] The amount of fluoride ions can be measured, for example, by adding one volume (by weight) of distilled water to the sample, shaking for about 20 seconds to extract F ions into the aqueous layer, then extracting 2.5 to 3.0 mL of the aqueous layer with a dropper and mixing it with twice the volume of TISAB solution (total ionic strength adjustment buffer solution).

[0051] As the fluoride ion source, a wide variety of known fluoride ion sources can be used, and there is no particular limitation. Specific examples include hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride ions. Only one of these may be contained, or multiple types may be contained. Preferably, the fluoride ion source is hydrogen fluoride.

[0052] (1-4. Other Components) The heat transfer fluid composition of the present disclosure may contain perfluorotripropylamine in addition to hexafluoropropene trimer. A heat transfer fluid composition containing hexafluoropropene trimer and perfluorotripropylamine may be a pseudo-azeotropic liquid. When the heat transfer fluid composition is a pseudo-azeotropic liquid, even when the heat transfer fluid composition vaporizes, the change in composition is small, making it easy to handle.

[0053] Here, the term "quasi-azeotropic liquid" refers to a liquid in which the difference in molar fraction between the vapor phase and the liquid phase of each component contained in the quasi-azeotropic liquid is within 10%.

[0054] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)amine and has the general formula: N(CF ２ CF ２ CF ３ ) ａ (CF (CF ３ )CF ３ ) ３－ａ (a is an integer of 0 to 3). Perfluorotripropylamine may contain only one type of compound represented by the above general formula, or may contain multiple types. N(CF ２ CF ２ CF ３ ) ３ is preferred, but N(CF ２ CF ２ CF ３ ) ａ (CF (CF ３ )CF ３ ) ３－ａ (where a is an integer of 0 to 2). Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0055] The heat transfer fluid composition of the present disclosure may further include perfluoropolyether, a methoxytridecafluoroheptene isomer mixture, perfluorotributylamine, and the like.

[0056] The perfluoropolyether preferably has the general formula: RO-Rf １ -R', wherein R and R' are the same or different and are represented by -C ｍ F ２ｍ＋１ where m is an integer of 1 to 8, and Rf １ is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, said repeating units being: (i) -CFXO-, where X is F or CF ３ (ii) -CF２ CFXO- (wherein X is F or CF ３ (iii) -CFXCF ２ O— (wherein X is F or CF ３ (iv) -CF ２ CF ２ CF ２ O-; or (v) -CF ２ CF ２ CF ２ CF ２ O-, or Rf １ (vi) -(CF ２ ) ｎ -CFY-O- (wherein n is an integer of 0 to 3, and Y is a group represented by the general formula -ORf ２ A monovalent group represented by Z, wherein Rf ２ is -CFXO-, -CF ２ CFXO-, -CF ２ CF ２ CF ２ O- or -CF ２ CF ２ CF ２ CF ２ A divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by O—, where each X is the same or different and is F or CF ３ and Z is a monovalent C １－５ is a divalent group represented by the formula (a perfluoroalkyl group).

[0057] Specific examples of perfluoropolyethers include those with the product names GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0058] The methoxytridecafluoroheptene isomer mixture is specifically methyl-perfluoroheptene ether (MPHE) (C ７ F １３ OCH ３ ) Specifically, a product name "Opteon SF10" (manufactured by Chemours) can be mentioned.

[0059] When the heat transfer fluid composition of the present disclosure contains perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, these and C ９ F １８ Since the properties as a heat transfer fluid are similar to those of the compound represented by the formula (I), the properties as a heat transfer fluid of the entire heat transfer fluid composition are basically unchanged regardless of the content ratio of these compounds. ９ F １８ The compound represented by the formula (I) is preferably contained in an amount of 40% by mass to 99.9% by mass, more preferably 60% by mass to 99.9% by mass, and even more preferably 80% by mass to 99.9% by mass.

[0060] (1-5. Impurities)

[0061] The heat transfer fluid composition of the present disclosure may contain a conductive substance. The content of the conductive substance is 100 ppm by mass or less, preferably 75 ppm by mass or less, more preferably 50 ppm by mass or less, and even more preferably 10 ppm by mass or less. Note that, since metals and metal ions in particular are likely to cause circuit shorts when conductive substances penetrate through gaps in a device, the content of the conductive substance in the present disclosure can also be considered, if necessary, by focusing on "at least one of metals and metal ions."

[0062] In another aspect, the heat transfer fluid composition of the present disclosure preferably has a content of insoluble matter of 5 μm or more (including solid matter such as resin pieces from the container, dust particles mixed in from the air, and the like, regardless of whether they are conductive or not) of 10 particles / mL or less, more preferably 5 particles / mL or less, and even more preferably 3 particles / mL or less.

[0063] (1-6. Method for Producing a Heat Transfer Fluid Composition with Reduced Impurities) The present disclosure provides a method for producing a heat transfer fluid composition with reduced impurities. The method for producing a heat transfer fluid composition of the present disclosure includes a step of purifying a composition containing a heat transfer fluid compound and a conductive substance to obtain a heat transfer fluid composition with reduced impurities from the composition, wherein: (1) the heat transfer fluid compound is C９ F １８ (1) the composition contains at least one selected from the group consisting of a compound represented by the formula (I), perfluoroalkene ether, and perfluoropolyether, and (2) the purification treatment is a treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption. In the present disclosure, "reduction" in the purification refers to reducing the content of the conductive substance in the composition.

[0064] According to research by the present inventors, conventionally known so-called heat transfer fluids contain conductive substances (e.g., metals, metal ions, carbon, conductive polymers, superconducting ceramics, etc.). These conductive substances are not only inevitably mixed in during the manufacturing process of the heat transfer fluid, but also include substances that are mixed in later during use after manufacturing. When these heat transfer fluids are used to transfer heat to or from devices, the conductive substances may penetrate through gaps in the device, causing a short circuit. Furthermore, repeated use of the heat transfer fluid may cause blockage of the pipes through which the heat transfer fluid circulates. Because conventionally known heat transfer fluids contain a conductive substance, they can also be referred to as "compositions containing a heat transfer fluid and a conductive substance." The method for producing a heat transfer fluid composition disclosed herein is characterized by subjecting a composition containing a heat transfer fluid and a conductive substance (hereinafter also referred to as a "pre-purification composition") to a specific purification treatment to obtain a heat transfer fluid composition with reduced conductive substances.

[0065] (1-6-1) Composition containing a heat transfer fluid compound and a conductive substance (pre-purification composition) The pre-purification composition may contain a heat transfer fluid compound and a conductive substance. Here, the heat transfer fluid compound may be C ９ F １８ The composition contains at least one selected from the group consisting of a compound represented by the formula (I), a perfluoroalkene ether, and a perfluoropolyether.

[0066] (1-6-2) C ９ F １８ Compound C represented by９ F １８ The compound represented by the formula (I) is the hexafluoropropene trimer described above.

[0067] (1-6-3) Perfluoroalkene ether The perfluoroalkene ether is preferably a perfluoroalkene ether represented by the following formula (V): ７ F １３ A wide range of known compounds represented by the formula: OR (V) (wherein R is Me or Et) can be used.

[0068] The perfluoroalkene ether represented by the formula (V) includes, for example, CF ３ (CF ２ ) ｘ CF=CFCF(OR)(CF ２ ) ｙ CF ３ , C.F. ３ (CF ２ ) ｘ C(OR)=CFCF ２ (CF ２ ) ｙ CF ３ , C.F. ３ CF=CFCF(OR)(CF ２ ) ｘ (CF ２ ) ｙ CF ３ , and CF ３ (CF ２ ) ｘ CF=C(OR)CF ２ (CF ２ ) ｙ CF ３ and (wherein R is Me or Et, x and y are independently 0, 1, 2, or 3, and x+y=1, 2, or 3).

[0069] Specific examples of perfluoroalkene ethers represented by the above formula (V) include 5-methoxyperfluoro-3-heptene, 3-methoxyperfluoro-3-heptene, 4-methoxyperfluoro-2-heptene, 3-methoxyperfluoro-2-heptene, 4-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-2-pentene, 3-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-3-pentene, cis- and trans-2-methoxyperfluoro-2-octene, and 2-methoxyperfluoro-3-octene.

[0070] A preferred structure of the perfluoroalkene ether represented by formula (V) above is methyl perfluoroheptene ether. This methyl perfluoroheptene ether may contain a mixture of two or more structures and / or stereoisomers. Specific examples of methyl perfluoroheptene ether include a mixture of about 48 to about 52% by mass of 5-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 3-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 4-methoxyperfluoro-2-heptene, and about 6 to about 10% by mass of 4-methoxyperfluoro-3-heptene.

[0071] The perfluoroalkene ether is specifically methyl-perfluoroheptene ether (MPHE) (C ７ F １３ OCH ３ ) Specifically, a product name "Opteon SF10" (manufactured by Chemours) can be mentioned.

[0072] (1-6-4) Perfluoropolyether The perfluoropolyether (PFPE) is preferably a perfluoropolyether represented by the following formula (IV): RO-Rf １ -R' (IV), wherein R and R' are the same or different and are -C ｍ F ２ｍ +1, where m is an integer from 1 to 8, and Rf １is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, said repeating units being: (i) -CFXO-, where X is F or CF ３ (ii) -CF ２ CFXO- (wherein X is F or CF ３ (iii) -CFXCF ２ O— (wherein X is F or CF ３ (iv) -CF ２ CF ２ CF ２ O-; or (v) -CF ２ CF ２ CF ２ CF ２ O-, or Rf １ (vi) -(CF ２ ) ｎ -CFY-O- (wherein n is an integer of 0 to 3, and Y is a group represented by the general formula -ORf ２ A monovalent group represented by Z, wherein Rf ２ is -CFXO-, -CF ２ CFXO-, -CF ２ CF ２ CF ２ O- or -CF ２ CF ２ CF ２ CF ２ A divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by O—, where each X is the same or different and is F or CF ３ and Z is a monovalent C １－５ A wide range of known PFPEs can be used as the PFPE represented by formula (IV).

[0073] A preferred structure of PFPE represented by the above formula (IV) is one in which m is an integer of 1 to 3 and Rf is selected from the following: (1)-(CF ２ O) ａ -(CF ２ CF ２ O) ｂ -(CF ２ -(CF ２ ) ｚ’-CF ２ O) ｃ (wherein a, b, and c are integers of 100 or less; z' is an integer of 1 or 2; a≧0, b≧0, c≧0, and a+b>0. Among these conditions, it is particularly preferable that a, b, and c are integers of 50 or less, a and b are each >0, and b / a is between 0.1 and 10.); (2)-(C ３ F ６ O) ｃ’ -(C ２ F ４ O) ｂ -(CFXO) ｔ wherein each occurrence of X is independently —F and —CF ３ b, c', and t are integers of 100 or less, and c'>0, b≧0, and t≧0. Among these conditions, it is particularly preferable that b and t>0, c' / b is between 0.2 and 5.0, and (c'+b) / t is between 5 and 50. ); or (3)-(C ３ F ６ O) ｃ’ -(CFXO) ｔ wherein each occurrence of X is independently —F and —CF ３ The formula is selected from the following. c' and t are integers of 100 or less, and c'>0 and t≧0. Among these conditions, t>0 is particularly preferred, and c' / t is preferably between 5 and 50.

[0074] Specific examples of perfluoropolyethers include those with the product names GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0075] (1-6-5) Additional Heat Transfer Fluid Compounds The heat transfer fluid in the present disclosure may contain the above-mentioned three components (C ９ F １８The heat transfer fluid may contain at least one compound selected from the group consisting of a compound represented by the formula (I), a perfluoroalkene ether, and a perfluoropolyether, which are collectively referred to as the "three components of the present disclosure." The heat transfer fluid may contain an additional heat transfer fluid compound different from the three components, which is also referred to as the "additional component." The additional component may be one or more types, and examples of the additional component include hexafluoropropene dimer, hexafluoropropene tetramer, perfluorotripropylamine, and perfluorotributylamine.

[0076] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0077] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0078] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)amine and has the general formula: N(CF ２ CF ２ CF ３ ) ｎ (CF (CF ３ )CF ３ ) ３－ｎ (n is an integer of 0 to 3). Perfluorotripropylamine may contain only one type of compound represented by the above general formula, or may contain multiple types. N(CF ２ CF ２ CF ３ ) ３ is preferred, but N(CF ２ CF ２ CF ３ ) ｎ (CF (CF ３ )CF ３ )３－ｎ (n is an integer of 0 to 2). Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0079] When the heat transfer fluid composition of the present disclosure contains the three components of the present disclosure and the additional component, it preferably contains 80 mass% or more of the three components of the present disclosure, more preferably 85 mass% or more, even more preferably 90 mass% or more, and most preferably 95 mass% or more of the three components of the present disclosure relative to the entire heat transfer fluid. In the production method of the present disclosure, the kinematic viscosity, freezing point, and boiling point characteristics of the composition (pre-purification composition) containing the heat transfer fluid compound and the conductive substance affect the efficiency of removing the conductive substance from the pre-purification composition in relation to a predetermined purification treatment (treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption). Therefore, the heat transfer fluid compound is preferably composed essentially of the three components of the present disclosure. However, when the additional component is contained, it is preferable that the heat transfer fluid compound contains 80 mass% or more of the three components of the present disclosure relative to the entire heat transfer fluid, as described above.

[0080] In both cases where additional components are included in addition to the three components of the present disclosure, and in cases where additional components are not included, for example, as a composition containing a heat transfer fluid compound and a conductive substance (pre-purification composition), a wide variety of synthetic or commercially available products of each of the three components of the present disclosure as described above, and / or products in which a conductive substance is subsequently mixed in by using them as a heat transfer fluid for a certain period of time, can be used.

[0081] (1-6-6) Conductive Substances Examples of conductive substances include at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics. When a heat transfer fluid containing a conductive substance is used to transfer heat to or from a device, the conductive substance may penetrate through gaps in the device, causing a short circuit. Furthermore, repeated use of the heat transfer fluid may cause blockage of the pipes through which the heat transfer fluid circulates. Therefore, in order to improve the performance of the heat transfer fluid, it is important to reduce the content of these conductive substances. The shape and size of the conductive substance vary depending on the type of conductive substance, but are generally approximately 0.001 to 10 μm.

[0082] Examples of metal species in metals, metal ions, metal oxides, and metal nitrides as conductive substances include Al, Ba, Be, Bi, Ca, Co, Cr, Cu, Fe, Ga, K, Li, Mg, Mn, Na, Ni, Pb, Sr, V, and Zn.

[0083] The metal as the conductive material may be a simple substance or an alloy, and is typically contained in the form of fine particles.

[0084] The ions as conductive substances include all ionic forms that each metal species can take. The ions as conductive substances may exist in a dissolved form as ions having any valence, or may exist in a form in which the ions exist as ions in a substance, for example, in a coordinated form.

[0085] The metal oxide serving as the conductive material may be an oxide of one type of metal, or an oxide of multiple types of metals (i.e., a composite oxide).

[0086] The metal nitride as the conductive material may be a nitride of one kind of metal, or may be a nitride of multiple kinds of metals (i.e., a composite nitride).

[0087] An example of carbon as a conductive material is carbon black.

[0088] Examples of conductive polymers that serve as conductive substances include polyacetylene and polythiophene.

[0089] The content of the conductive substance in the pre-purification composition is not limited, but for example, if it is 150 mass ppm or more (even 500 mass ppm or more), the content of the conductive substance can be effectively reduced in the production method of the present disclosure. The content of the conductive substance can be measured using an inductively coupled plasma mass spectrometer (ICP-MS) as described in the Examples.

[0090] Furthermore, the pre-purification composition may contain insoluble matter, including solid matter such as resin fragments from the container and dust and dirt mixed in from the air, regardless of whether the composition is conductive or not. However, if the content of insoluble matter of 5 μm or more is 50 particles / mL or more (even 100 particles / mL or more), the purification treatment of the present disclosure that reduces the content of conductive material can effectively reduce the content of insoluble matter at the same time. The number of insoluble matter (fine particles) of conductive material contained in the composition can be measured using a liquid particle counter as described in the Examples.

[0091] (1-6-7) Physical Properties of Pre-purification Composition The pre-purification composition is a composition containing a heat transfer fluid and a conductive substance, and in the production method of the present disclosure, is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption.

[0092] When the content of the conductive substance in the pre-purification composition is reduced by the above-mentioned purification treatment, it is preferable from the viewpoint of purification efficiency that the pre-purification composition has a low kinematic viscosity, a low freezing point, and a high boiling point. By using the heat transfer fluid as the main component (preferably 80 mass% or more) of the three components of the present disclosure, the pre-purification composition is likely to have the physical properties of a low kinematic viscosity, a low freezing point, and a high boiling point.

[0093] The kinematic viscosity of the pre-purification composition at -40°C is preferably 15 cSt or less, more preferably 10 cSt or less, and even more preferably 7 cSt or less. A low kinematic viscosity of 15 cSt or less improves filterability, thereby increasing the efficiency of purification treatments, particularly those using filtration filters, metal ion removal filters, etc. In the present disclosure, the kinematic viscosity at -40°C is measured according to the method described in the Examples.

[0094] The freezing point of the pre-purification composition is preferably −35° C. or lower, more preferably −50° C. or lower, even more preferably −70° C. or lower, and most preferably −100° C. or lower. A freezing point of −35° C. or lower allows the purification process to be carried out at low temperatures, thereby reducing loss of heat transfer fluid due to evaporation and the like and increasing the efficiency of the purification process. The method for measuring the freezing point in the present disclosure is the method described in the Examples.

[0095] The boiling point of the pre-purification composition is preferably 90°C or higher, more preferably 95°C or higher, and even more preferably 105°C or higher. A high boiling point of 90°C or higher can reduce loss of heat transfer fluid due to evaporation, etc., for the same reason as a low freezing point, and can increase the efficiency of the purification process. Note that the boiling point in the present disclosure is measured by the method described in the Examples.

[0096] (1-6-8) Purification Treatment of Pre-purification Composition In the production method of the present disclosure, the pre-purification composition is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption.

[0097] These purification methods may be applied according to conventional methods, but in the manufacturing method of the present disclosure, purification treatment using a filter is particularly preferred. When a filter is used, the upper and lower limits of the filter pore size are not limited, but for example, the upper limit can be set to 5 μm or less, 1 μm or less, 0.5 μm or less, or 0.1 μm or less. Furthermore, for example, the lower limit can be set to 1.0 nm or more, 0.5 nm or more, 0.2 nm or more, or 0.1 nm or more.

[0098] The ion exchange resin may be either a cation exchange resin or an anion exchange resin. For example, an ion exchange resin having an amino group and / or a quaternary ammonium group as a functional group can be used as the anion exchange resin. The ion exchange resin is preferably a strongly basic anion exchange resin. The basicity of the anion exchange resin can be varied depending on the type of polymer skeleton and / or functional group. Commercially available anion exchange resins may be used, such as the "Diaion (registered trademark) SA" series manufactured by Mitsubishi Chemical Corporation, "A200" manufactured by Purolite Corporation, or the "Amberlite (registered trademark)" series manufactured by Organo Corporation. For example, an ion exchange resin having a carboxylic acid group and / or a sulfonic acid group as a functional group can be used as the cation exchange resin. The acidity of the cation exchange resin can be varied depending on the type of polymer skeleton and / or functional group. The cation exchange resin may be a commercially available product, such as the "Diaion (registered trademark) SK" series manufactured by Mitsubishi Chemical Corporation, "C100" manufactured by Purolite Corporation, or the "Amberlite (registered trademark)" series manufactured by Organo Corporation.

[0099] Examples of the metal ion remover include chelating agents, activated carbon, etc. Examples of the chelating agent that can be used include CRB03, CRB05, and CR20 (all manufactured by Mitsubishi Chemical Corporation), Si-Thiol, Si-Thiourea, Si-TMT, Si-DMT, Si-SCX-2, Si-Amine, Si-Trisamine, Si-Imidazole, Si-TBD, and Si-PHI (all manufactured by SiliCycle Corporation), MuromacXMS-5418 (manufactured by Muromachi Chemical Co., Ltd.), IRC76-HG, IRC748, and IRC747UPS (all manufactured by Organo Corporation), S910 (manufactured by Purolite Co., Ltd.), and MPA (manufactured by Reaxa QuadraPure). Examples of activated carbon include "Shirasagi (registered trademark)" manufactured by Osaka Gas Chemicals Co., Ltd., "Filtrasorb (registered trademark) CAL," "Diahope (registered trademark)," and "Diasorb (registered trademark)" manufactured by Calgon Carbon Japan Co., Ltd., and the "Evadia (registered trademark)" series manufactured by Suing Corporation.

[0100] By undergoing the above purification treatment, a heat transfer fluid composition (purified composition) having a reduced content of conductive substances can be obtained.

[0101] The above-mentioned production method includes the purification step, but may also include other steps, such as a step of blending an additive such as a stabilizer into the heat transfer fluid composition.

[0102] (2. Heat Transfer Fluid) The heat transfer fluid composition of the present invention can be used in combination with components other than the heat transfer fluid composition (hereinafter, a fluid containing a heat transfer fluid composition and components other than the heat transfer fluid composition is referred to as a heat transfer fluid). The heat transfer fluid of the present disclosure contains the compounds represented by the above formulas (I) to (III), as well as C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） In addition to water and / or fluoride ions, the heat transfer fluid composition may contain any additive other than the heat transfer fluid composition, as long as the additive does not impair the effects and purposes of the heat transfer fluid composition. Examples of such optional additives include stabilizers.

[0103] The stabilizer functions as a so-called acid acceptor or antioxidant by exhibiting a stabilizing effect, which mainly includes an effect of preventing decomposition of the HFP trimer by capturing radicals generated in the system, and an acid-accepting effect of preventing further decomposition of the HFP trimer by the acid by capturing acid generated in the system.

[0104] As the stabilizer, a wide variety of known stabilizers can be used, but among them, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers, because they can effectively suppress the occurrence of metal corrosion due to the composition.

[0105] A wide variety of known unsaturated alcohol stabilizers can be used, including, for example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol.

[0106] A wide variety of known nitro stabilizers can be used. Examples of aliphatic nitro compounds include nitromethane, nitroethane, 1-nitropropane, and 2-nitropropane. Examples of aromatic nitro compounds that can be used include one or more selected from the group consisting of nitrobenzene, o-, m-, or p-dinitrobenzene, o-, m-, or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m-, or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole.

[0107] A wide variety of known amine stabilizers can be used as the amine stabilizer. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxylamine can be used.

[0108] A wide variety of known phenolic stabilizers can be used, including, for example, one or more selected from the group consisting of 2,6-ditertiarybutyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol.

[0109] A wide variety of known epoxy stabilizers can be used, including, for example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane.

[0110] The use of a combination of stabilizers having different stabilizing effects more effectively prevents decomposition of the HFP trimer, which may occur for various reasons. For this reason, the stabilizer is preferably one or more selected from the group consisting of the above-mentioned epoxy-based stabilizer, as well as unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0111] From the viewpoint of effectively suppressing acid liberation from the HFP trimer and suppressing metal corrosion by the liquid composition, the content of the stabilizer relative to the entire heat transfer fluid is preferably 0.0001% by mass or more, more preferably 0.01% by mass or more. On the other hand, from the viewpoint of avoiding undesirable changes in the physical properties of the liquid composition due to excessive addition of the stabilizer, the content of the stabilizer relative to the entire heat transfer fluid is preferably 10% by mass or less, more preferably 5% by mass or less.

[0112] (3. Use of Heat Transfer Fluid Composition or Heat Transfer Fluid) The heat transfer fluid composition or heat transfer fluid of the present disclosure is used to remove heat from or supply heat to various heat-transfer-receiving objects. The heat-transfer-receiving objects in the present disclosure include articles, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Such heat-transfer-receiving objects include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of heat-transfer-receiving objects in the present disclosure include, but are not limited to, wafers used in manufacturing semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile parts.

[0113] The heat transfer fluid composition or heat transfer fluid of the present disclosure can also be used as a two-phase immersion cooling, chiller fluid, or Rankine cycle working fluid.

[0114] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be used in place of the heat transfer fluid currently used in equipment designed to use them to transfer heat.

[0115] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be a drop-in replacement, a near drop-in replacement, or a retrofit replacement for heat transfer fluids currently in use. Note that "drop-in replacement" means that it can be replaced without requiring any changes to the equipment. "Near drop-in replacement" means that it can be replaced with almost no changes to the equipment. "Retrofit replacement" means that it can be replaced with minimal changes (no major changes) to the equipment. The heat transfer fluid composition or heat transfer fluid of the present disclosure is preferably a drop-in replacement or a near drop-in replacement for the above-mentioned heat transfer fluids.

[0116] Whether a new heat transfer fluid can be used as a drop-in replacement, near drop-in replacement, or retrofit replacement can be determined by whether all of the following conditions are met: (i) The boiling point of the heat transfer fluid is at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement. (ii) The pour point of the heat transfer fluid is equal to or lower than the pour point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is compatible with the heat transfer fluid before replacement in any proportion.

[0117] By setting the boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but it may be, for example, at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0118] By setting the pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure to be equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use the composition at temperatures lower than the conventional use temperature, thereby widening the use temperature range. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but may be, for example, a temperature 30°C higher than the pour point of the heat transfer fluid before replacement.

[0119] By adjusting the kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure to at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. The kinematic viscosity is preferably compared at the operating temperature, but is not limited thereto, and can be compared at any temperature between −20° C. and −40° C., specifically at −20° C.

[0120] The heat transfer fluid composition or heat transfer fluid of the present disclosure is compatible with the heat transfer fluid before replacement in any proportion, making replacement easy.

[0121] Furthermore, the heat transfer fluid composition or heat transfer fluid of the present disclosure is more suitable as a drop-in replacement, near drop-in replacement, or retrofit replacement if it satisfies the following conditions: (v) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a dielectric constant of 120% or less of the heat transfer fluid before replacement. (vi) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a dielectric strength of 90% or more of the heat transfer fluid before replacement. (vii) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a specific heat of 90% or more of the heat transfer fluid before replacement. (viii) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a thermal conductivity of 90% or more of the heat transfer fluid before replacement.

[0122] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure can be set to 120% or less of the dielectric constant of the heat transfer fluid before replacement, so that the composition or heat transfer fluid can be suitably used as a replacement composition. The lower limit of the dielectric constant of the heat transfer fluid is not particularly limited, but may be, for example, 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0123] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by adjusting the dielectric strength of the heat transfer fluid to 90% or more of the dielectric strength of the heat transfer fluid before replacement. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but it may be, for example, 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0124] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by adjusting the specific heat thereof to 90% or more of the specific heat of the heat transfer fluid before replacement. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, but it may be, for example, 120% or less of the specific heat of the heat transfer fluid before replacement.

[0125] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by setting the thermal conductivity of the heat transfer fluid to 90% or more of the thermal conductivity of the heat transfer fluid before replacement. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, but it may be, for example, 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0126] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 105° C. or higher, more preferably 108° C. or higher. The upper limit of the boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 150° C. or lower, 130° C. or lower, or 120° C. or lower.

[0127] The pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably −80° C. or lower, more preferably −100° C. or lower, and even more preferably −110° C. or lower. There is no particular lower limit to the pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure, but it may be, for example, −180° C. or higher, or −160° C. or higher.

[0128] The kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 6.0 cSt or less, more preferably 5.0 cSt or less, even more preferably 4.0 cSt or less, and even more preferably 3.5 cSt or less at −20° C. There is no particular lower limit to the kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure, but it may be, for example, 1.0 cSt or more.

[0129] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. The lower limit of the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 1.1 or more.

[0130] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 40 kV or more, more preferably 50 kV or more. The upper limit of the dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 150 kV or less, or 100 kV or less.

[0131] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 800 J / kg K or more, more preferably 900 J / kg K or more, and even more preferably 1000 J / kg K or more at 30° C. Furthermore, the upper limit of the specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 2000 J / kg K or less, or 1500 J / kg K or less.

[0132] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 0.055 W / mK or more, more preferably 0.060 W / mK or more, and even more preferably 0.065 W / mK or more at 30° C. Furthermore, the upper limit of the thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 0.090 W / mK or less, or 0.080 W / mK or less.

[0133] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the temperature at which a peak resulting from endothermic heat is observed when the temperature is increased from 25°C at a rate of 5°C / min using DSC (differential scanning calorimetry).

[0134] The pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the temperature at which an endothermic peak is observed when the composition is cooled to below the freezing point with liquid nitrogen and then heated at a rate of 5°C / min using DSC.

[0135] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value observed at a frequency of 1 kHz in an environment of a temperature of 25° C. and a humidity of 60% using a capacitance method.

[0136] The kinematic viscosity and density of the heat transfer fluid composition or heat transfer fluid of the present disclosure are values ​​measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0137] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined distance and the voltage is increased at a constant rate. The measurement conditions are as follows: Electrode shape: spherical (φ12.5 mm) Electrode spacing: 2.5 mm Voltage increase rate: 2 kV / sec Measurement atmosphere: air (22°C, 57% RH)

[0138] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value obtained using DSC under the following conditions: Measuring device: Perkin-Elmer DSC8500 differential scanning calorimeter Heating rate: 10°C / min Standard sample: sapphire (-Al2O3) Atmosphere: in a dry nitrogen stream Sample container: aluminum sealed container

[0139] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value that can be obtained by the transient thin wire method.

[0140] The compatibility of the heat transfer fluid composition or heat transfer fluid of the present disclosure is determined by whether or not it is compatible with the target solvent when mixed. Here, compatibility means that the two become homogeneous when mixed, i.e., the phase separation does not occur.

[0141] 4. Heat Transfer Apparatus The present disclosure further discloses a heat transfer apparatus comprising a device and a mechanism for transferring heat to or from the device, the mechanism comprising the heat transfer fluid composition described above.

[0142] Devices include, for example, computers, servers including server computers and blade servers; disk arrays / storage systems; storage area networks; network attached storage; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical and wireless communication devices; cell processing devices; printers; power supplies; displays; optical devices; measurement systems including handheld systems; military electronics, and the like.

[0143] A semiconductor element is a heat-generating element mounted on a device, such as a CPU, a GPU, or an SSD. The semiconductor element is made of, for example, a single element such as silicon or germanium, or a compound semiconductor such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), or silicon carbide (SiC).

[0144] When the device is a server computer, one or more logic boards are disposed within the interior space. The logic boards include a number of heat-generating electronic components, including at least one processor, such as a CPU, a GPU, etc. In addition, other heat-generating computer components may be used, such as a chipset; memory, graphics chips, network chips, RAM, power supplies, daughter cards; and storage drives, such as solid-state drives and mechanical hard disks.

[0145] The heat transfer device is a heat transfer device for transferring heat between the heat transfer object and the heat transfer target object using the heat transfer fluid, and transfers heat by thermal contact with the heat transfer target object. For example, when removing heat from the heat transfer target object, it is called cooling, and when supplying heat, it is called heating. Different mechanisms may be used depending on the case, but one heat transfer device may also be used for both cooling and heating.

[0146] Examples of heat transfer devices include, but are not limited to, pumps, valves, fluid containment systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0147] More specifically, these include temperature-controlled wafer chucks in plasma-enhanced chemical vapor deposition (PECVD) tools, temperature-controlled test heads for die performance testing, temperature-controlled work areas in semiconductor processing equipment, thermal shock test bath fluid reservoirs, constant temperature chambers, and the like.

[0148] The heat transfer target that is brought into thermal contact with the heat transfer device is an article, device, or atmosphere that is to be cooled, heated, or maintained at a temperature to be controlled. Examples of such heat transfer targets include electrical components, mechanical components, and optical components, as well as processed and assembled products thereof. Specific examples of heat transfer targets in this disclosure include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, packaged and unpackaged semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0149] 5. Heat Transfer Methods The present disclosure further discloses methods of heat transfer, including providing a device and transferring heat to or from the device using the heat transfer fluid composition described above. Here, heat can be transferred by placing a heat transfer apparatus in thermal contact with the device. When placed in thermal contact with the device, the heat transfer apparatus removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer apparatus.

[0150] Although the embodiments of the present invention have been described above, the present invention is not limited to these examples, and it goes without saying that the present invention can be embodied in various forms without departing from the spirit of the present invention.

[0151] Hereinafter, the embodiments of the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

[0152] (Preparation Example 1) HFP trimer was obtained according to the method described in Chem. Bar (1973), Vol. 106, pp. 2950-2959. The obtained HFP trimer was purified by distillation to remove impurities such as hexafluoropropene dimers and tetramers. The purified HFP trimer was then separated by distillation into compounds represented by formulas (I), (II), and (III). Each of the separated HFP trimers was dehydrated using silica gel.

[0153] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II), and (III) were as shown in the table below, thereby obtaining trimer mixtures 1 to 4.

[0154]

[0155] (Production Example 2) Based on the method described in Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1981), Vol. 4, pp. 1064-1067, C ９ F １６ was synthesized.

[0156] (Manufacturing example 3) C ８ F １６ was purchased as a reagent from Wako Pure Chemical Industries, Ltd.

[0157] (Examples 1 to 43) Trimer mixtures 1 to 4 and C of Production Example 2 as an additive ９ F １６ Or C of Production Example 3 ８ F １６ These were mixed in the proportions shown in the table below to obtain heat transfer fluid compositions of Examples 1 to 43.

[0158] (Stability Test) The obtained heat transfer fluid composition was placed in an SUS autoclave, which was then sealed and heated and maintained under the conditions shown in the table below.

[0159] (Measurement of Fluoride Ion Concentration) One volume (by weight) of distilled water was added to the sample, and the sample was shaken for approximately 20 seconds to extract F ions into the aqueous layer. Next, 2.5 to 3.0 mL of the aqueous layer was extracted with a dropper, and this liquid was mixed with twice the volume of TISAB solution (total ionic strength adjustment buffer solution: manufactured by HORIBA). This liquid was used as a sample and measured with a fluoride ion meter (manufactured by HORIBA). Note that because the sample was diluted with TISAB solution, the fluoride ion concentration was three times the measured value. The results are shown in the table below.

[0160]

[0161]

[0162] From the above results, C ９ F １６ or C ８ F １６ It was confirmed that Examples 1 to 43 containing the compound (I) showed no increase in fluorine concentration even after long-term storage at high temperature, and were stable.

[0163] <Measurement of boiling point, pour point and dielectric constant> The boiling point of the trimer mixture was measured using differential scanning calorimetry (DSC) at the temperature at which an endothermic peak was observed when the mixture was heated from 25°C at 5°C / min. The pour point was measured using DSC at the temperature at which an endothermic peak was observed when the mixture was cooled to below the freezing point with liquid nitrogen and then heated at 5°C / min. The dielectric constant was measured at a frequency of 1 kHz by a capacitance method in an environment of 25°C and 60% humidity.

[0164] <Measurement of Kinematic Viscosity and Density> The kinematic viscosity and density of the trimer mixture were measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0165] <Specific Heat Measurement> The specific heat of the trimer mixture was measured using DSC. The measurement conditions were as follows: Measurement device: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10°C / min Standard sample: sapphire (-Al2O3) Atmosphere: in dry nitrogen gas flow Sample container: aluminum sealed container

[0166] <Measurement of Thermal Conductivity> The thermal conductivity of the trimer mixture was measured by the transient hot wire method.

[0167] <Compatibility> The compatibility of the trimer mixtures was evaluated by mixing equal amounts of the following three solvents with each trimer mixture: Galden HT135 (manufactured by Solvay), SF-10 (manufactured by Chemours), and FC3283 (manufactured by 3M).

[0168]

[0169] Examples 44 to 59 Trimer mixtures 1 to 4 and water were mixed in the amounts shown in the table below to obtain compositions of Examples 44 to 59.

[0170]

[0171] (Stability Test) The compositions of Examples 44 to 59 and Comparative Examples 3 to 6 were placed in an SUS autoclave, which was then sealed and heated and maintained under the conditions shown in the table below.

[0172] (Dielectric Strength Measurement) A liquid sample was immersed between spherical electrodes adjusted to a predetermined distance, and the dielectric strength was measured as the breakdown voltage when the voltage was increased at a constant rate. The detailed measurement conditions were as follows: Electrode shape: spherical (φ12.5 mm) Electrode spacing: 2.5 mm Voltage increase rate: 2 kV / sec Measurement atmosphere: air (22°C, 57% RH)

[0173]

[0174] From the above results, it was confirmed that Examples 44 to 59, which contained a predetermined amount of water, were stable, showing no increase in fluorine concentration even after long-term storage at high temperatures. It was also confirmed that Examples 44 to 59 had high dielectric strength.

[0175] (Examples 60 to 83) Anhydrous hydrofluoric acid was added to trimer mixtures 1 to 4 to prepare a reference solution, which was then diluted with each trimer mixture to obtain compositions of Examples 60 to 83 having fluoride ion concentrations as shown in the table below.

[0176] (Stability Test) The sample was placed in an SUS autoclave, which was then sealed and heated and maintained under the conditions shown in the table below.

[0177] (Measurement of Purity of Hexafluoropropene Trimer) The purity of the hexafluoropropene trimer was measured by gas chromatography before and after the stability test.

[0178]

[0179]

[0180] From the above results, it was confirmed that in Examples 60 to 83 containing a predetermined amount of fluoride ions, the purity of the hexafluoropropene trimer was maintained at a high level even after long-term storage at high temperatures.

[0181] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II), and (III) were as shown in the table below, to obtain trimer mixtures 5 and 6.

[0182]

[0183] (Production of Hexafluoropropene Tetramer) (Production Example 4) Hexafluoropropene tetramer was obtained according to the method described in Tetrahedron Lett. 1974, 24, 2129-2132.

[0184] By mixing trimer mixture 5 or 6 with the hexafluoropropene tetramer obtained in Production Example 4, the heat transfer fluid of the present disclosure can be obtained.

[0185] <Evaluation Method> (Boiling Point) The boiling point was measured using a DSC as the temperature at which an endothermic peak was observed when the temperature was raised from 25° C. at a rate of 5° C. / min.

[0186] (Kinematic Viscosity) The kinematic viscosity was measured at 25° C. using an Ubbelohde viscometer in accordance with JIS K 2283.

[0187] (Dielectric Constant) The dielectric constant was measured at a frequency of 1 kHz by a capacitance method in an environment of a temperature of 25° C. and a humidity of 60%.

[0188] (Examples 84 and 85) Trimer mixture 5:hexafluoropropene tetramer were mixed at a weight ratio of 91:9 (Example 84), and trimer mixture 6:hexafluoropropene tetramer were mixed at a weight ratio of 91:9 (Example 85). Physical properties were measured, and the results are shown in Table 2.

[0189]

[0190] Examples 86 to 87 In Examples 86 to 87, a pre-purification composition (composition 1 containing a heat transfer fluid and a conductive material; 6FT) was prepared for the purification step. Specifically, 750 g of DMF and 7.2 g of cesium fluoride were placed in an SUS autoclave and sealed. After evacuating the autoclave, 2268 g of hexafluoropropylene was added over 4.5 hours while maintaining the temperature inside the autoclave at 70 to 110°C. The lower layer was separated from the resulting reaction solution and washed with ultrapure water to obtain 2219 g of a composition containing an HFP trimer (composition 1, which is the pre-purification composition). GCFID and GC-MS analyses were carried out, and it was confirmed by the area percentage method that the HFP trimer was contained in an amount of 87% by mass relative to 100% by mass of the total amount of the composition, and that the compounds represented by formulas (I), (II), and (III) described herein were contained in amounts of 78%, 9%, and 13% by mass, respectively, relative to 100% by mass of the total amount of the HFP trimer.

[0191] Example 88 The same operations as in Examples 86 and 87 were carried out to isolate the compounds represented by formulae (I), (II), and (III), and these compounds were mixed so that the concentrations of the compounds represented by formulae (I), (II), and (III) were 55 mass%, 15 mass%, and 30 mass%, respectively, to prepare 2200 g of a composition.

[0192] Example 89 The same operations as in Examples 86 and 87 were carried out to isolate the compounds represented by formulae (I), (II), and (III), and these compounds were mixed so that the concentrations of the compounds represented by formulae (I), (II), and (III) were 3% by mass, 33% by mass, and 64% by mass, respectively, to prepare 2200 g of a composition.

[0193] Example 90 The same operations as in Examples 86 and 87 were carried out to isolate the compounds represented by formulae (I), (II), and (III), and these compounds were mixed so that the concentrations of the compounds represented by formulae (I), (II), and (III) were 90 mass%, 5 mass%, and 5 mass%, respectively, to prepare 2200 g of a composition.

[0194] (Measurement of Metal and Metal Ion Contents in Pre-Purification Composition) The content of conductive materials (in this example, particular attention was paid to the content of metals and metal ions) in the pre-purification composition was determined by the following procedure using an inductively coupled plasma mass spectrometer (ICP-MS) (the same procedure was followed for the purified composition). The measured values ​​were as shown in Table 1 below. (1) 2000 g of the pre-purification composition was poured into a polytetrafluoroethylene (PTFE) beaker, and the beaker was placed on a hot plate at 250°C to volatilize the volatile components. (2) 70% nitric acid for ultratrace precision analysis (manufactured by Wako Pure Chemical Industries, Ltd.) was diluted with ultrapure water to obtain nitric acid with a concentration of approximately 4% by mass, and approximately 50 mL of this was then placed in a PTFE beaker. (3) The PTFE beaker was placed on a hot plate at 150°C for 1 hour to dissolve the metals remaining in the beaker. (4) The amount of metal ions dissolved in the nitric acid was measured using ICP-MS. The metal and metal ion contents in the solution were calculated using the amount of metal ions in the nitric acid, the amount of nitric acid, and the amount of the evaporated solution. (5) All of the work related to the above measurements was carried out in a class 10,000 clean room equipped with a table coach manufactured by Koken Co., Ltd., and the working environment was equivalent to class 1.

[0195] (Measurement of the number of insoluble matter (fine particles) in the composition before purification) The number of particles with a particle size of 5.0 μm or more, the number of particles with a particle size of 1.0 μm or more but less than 5.0 μm, the number of particles with a particle size of 0.5 μm or more but less than 1.0 μm, and the number of particles with a particle size of 0.3 μm or more but less than 0.5 μm in the composition before purification was measured at a temperature of 23° C. using a liquid particle counter ("KL-22" manufactured by RION Corporation) (the same was true for the composition after purification). All work related to the measurement was carried out in a class 10,000 clean room equipped with a table coach manufactured by Koken Co., Ltd., and the working environment was equivalent to class 1.

[0196] (Measurement of boiling point, freezing point, and kinematic viscosity of pre-purification composition) The boiling point was determined using DSC, and was taken as the temperature at which an endothermic peak was observed when the composition was heated from 25°C at 5°C / min. The freezing point was determined using DSC, and was taken as the temperature at which an endothermic peak was observed when the composition was cooled with liquid nitrogen to -150°C or below (the temperature at which it was confirmed that the composition became solid) and then heated at 5°C / min. The kinematic viscosity was measured using an Ubbelohde viscometer in accordance with JIS K 2283. The measured values ​​were as shown in Table 1 below.

[0197] (Purification Treatment) As a filtration device, a unit, in which one filter was packed in one container, was prepared for each filter, and a required number of such units were connected in series to prepare a multi-stage filtration device.

[0198] The pre-purification composition was placed in a pressure vessel and cooled to -5°C or below, and then filtered under a high-purity argon atmosphere using the filtration device under pressure up to 0.02 MPa to obtain a purified composition. The filters packed into each unit of the filtration device were: Filter A (Nihon Pall Corporation's "Ion Clean SL," filtration area: 0.58 m2), Filter B (Nihon Pall Corporation's "Wurtz Pleats P-Nylon," pore size: 0.15 μm, filtration area: 1.2 m2), and Filter C (Nihon Pall Corporation's "Wurtz Pleats P-Nylon," pore size: 40 nm, filtration area: 1.2 m2), each as shown in Table 1. The results are shown in Table 1.

[0199] The results in Table 1 show that the content of conductive substances (particularly metals and metal ions) can be reduced by subjecting the pre-purification composition to a predetermined purification treatment.

[0200]

[0201]

Claims

1. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） [wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less], (ii) water (wherein the content of such water is determined by the above-mentioned C ９ F １８ and / or (iii) fluoride ions (wherein the content of such fluoride ions is within the range of C ９ F １８ and 0.0000001 to 5 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula:

2. The heat transfer fluid composition according to claim 1, wherein the hexafluoropropene trimer comprises at least one compound selected from the group consisting of compounds represented by the following formulas (I) to (III):

3. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 85 mass % or more based on the total amount of the hexafluoropropene trimer.

4. The heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of less than 85 mass % based on the total amount of the hexafluoropropene trimer.

5. A heat transfer fluid composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer.

6. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） 2. The heat transfer fluid composition of claim 1, comprising: wherein m is an integer between 4 and 12, inclusive, except for 9; and n is an integer between 4 and 12, inclusive.

7. The heat transfer fluid composition according to claim 1, wherein m is an integer between 6 and 11, other than 9, and n is an integer between 6 and 11.

8. C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of C ９ F １８ The heat transfer fluid composition according to claim 1, wherein the amount of the hexafluoropropene trimer represented by the formula (1) is 0.0001 to 10 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (1).

9. C ９ F １８ 2. The heat transfer fluid composition of claim 1, comprising: (i) a hexafluoropropene trimer represented by the formula:

10. C ９ F １８ 2. The heat transfer fluid composition of claim 1, comprising a hexafluoropropene trimer represented by the formula:

11. C １２ F ２４ 2. The heat transfer fluid composition according to claim 1, further comprising a hexafluoropropene tetramer represented by the formula:

12. The heat transfer fluid composition according to claim 11, wherein the content of the hexafluoropropene trimer is 90 mass % or more and 99.99 mass % or less based on the total content of the hexafluoropropene trimer and the hexafluoropropene tetramer.

13. The heat transfer fluid composition of claim 11, wherein the hexafluoropropene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

14. The heat transfer fluid composition according to claim 1, further comprising an electrically conductive material, the content of said electrically conductive material being 100 ppm by mass or less.

15. The heat transfer fluid composition according to claim 1, further comprising a conductive substance, and having a content of insoluble matter of 5 μm or more of 10 particles / mL or less.

16. A heat transfer fluid comprising the heat transfer fluid composition according to claim 1 or 2.

17. Use of the heat transfer fluid composition according to claim 1 or 2 as a heat transfer fluid.

18. An apparatus for heat transfer comprising a device and a mechanism for transferring heat to or from said device, said mechanism comprising the heat transfer fluid composition of claim 1 or 2.

19. A method of heat transfer comprising the steps of providing a device and transferring heat to or from said device using a heat transfer fluid composition according to claim 1 or 2.

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