Electronic device including acoustic module

Abstract

An electronic device according to an embodiment of the present invention may comprise a housing and an acoustic module disposed inside the housing. The acoustic module may include: a speaker unit including a vibrating plate; a speaker enclosure for accommodating the speaker unit; a porous air-adsorbing member disposed inside the speaker enclosure; and an air-permeable shock-absorbing member that is disposed inside the speaker enclosure and stacked with the air-adsorbing member.

Description

Electronic device including an acoustic module

[0001] One embodiment of the present invention relates to an electronic device including an acoustic module.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as audio or video.

[0004] An electronic device may include at least one speaker module for outputting various sounds. The speaker module may convert an electrical signal generated by the electronic device into a sound signal audible to the user by utilizing the vibration of a diaphragm and output the converted signal.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing and an acoustic module disposed within the housing. The acoustic module may include a speaker unit including a diaphragm, a speaker enclosure accommodating the speaker unit, a porous air-absorbing member disposed within the speaker enclosure, and a breathable cushioning member disposed within the speaker enclosure and laminated with the air-absorbing member.

[0007] An electronic device according to one embodiment of the present disclosure may include a housing and an acoustic module disposed inside the housing. The acoustic module may include a speaker unit including a diaphragm, a speaker enclosure accommodating the speaker unit, a resonance space formed inside the speaker enclosure, a porous air absorption member disposed inside the speaker enclosure and configured to negatively or positively absorb air in the resonance space by vibration of the diaphragm, and a breathable cushioning member disposed inside the speaker enclosure and including a foaming agent disposed between the air absorption member and the speaker enclosure.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment disclosed in this document.

[0010] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 3 according to one embodiment disclosed in this document.

[0011] FIG. 4A is a front exploded perspective view of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0012] FIG. 4b is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0013] FIG. 5 is an exploded perspective view of an acoustic module according to one embodiment disclosed in this document.

[0014] FIG. 6 is a cross-sectional view of the acoustic module of FIG. 5 taken along line A-A' according to one embodiment disclosed in this document.

[0015] FIG. 7 is an enlarged view of a portion of an acoustic module according to one embodiment disclosed in this document.

[0016] FIG. 8 is a drawing showing the molecular structure of an air absorption member according to various embodiments of the present invention.

[0017] FIGS. 9, 10 and 11 are cross-sectional views showing an air absorption member and a buffer member inside an acoustic module according to one embodiment disclosed in this document.

[0018] FIGS. 12, 13 and 14 are cross-sectional views showing a portion of an electronic device in which a speaker enclosure and a housing are integrally formed according to one embodiment disclosed in the present document.

[0019] Electronic devices according to the embodiments disclosed in this document may be one type of device. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0020] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0021] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0022] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0023] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) may store data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data may include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) may include a volatile memory (132) or a non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0043] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0044] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] An electronic device according to one embodiment disclosed in this document may be a device of one type. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0047] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0048] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0049] Embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0050] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0051] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0052] FIG. 2 is a perspective view showing the front of an electronic device (101) according to one embodiment disclosed in this document.

[0053] FIG. 3 is a perspective view showing the rear side of the electronic device (101) illustrated in FIG. 3 according to one embodiment disclosed in this document.

[0054] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0055] In one embodiment, the first side (110A) may be formed by a front plate (122) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (122) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0056] In one embodiment, the front plate (122) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (122) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (122)) at one edge of the first surface (110A). In one embodiment, the front plate (122) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (122) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0057] According to one embodiment, the electronic device (101) may include at least one of a display (115), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (124), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (128), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include other components.

[0058] The display (115) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (122)). In one embodiment, at least a portion of the display (115) may be visually exposed through the front plate (122) forming the first surface (110A) or through a portion of the side surface (110C). In one embodiment, the edge of the display (115) may be formed to be substantially the same as the adjacent outer shape of the front plate (122). In one embodiment (not shown), in order to expand the area in which the display (115) is visually exposed, the gap between the outer edge of the display (115) and the outer edge of the front plate (122) may be formed to be substantially the same.

[0059] According to one embodiment, a recess or opening (333) may be formed in a part of a screen display area of ​​the display (115), and at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included that are aligned with the recess or opening (333). In one embodiment (not shown), at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (124)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (115). In one embodiment (not shown), the display (115) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0060] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0061] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (124) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (115)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (124).

[0062] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0063] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (115). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0064] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0065] According to one embodiment, the connector hole (e.g., the first connector hole (128), the second connector hole (109)) may include a first connector hole (128) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0066] FIG. 4A is a front view of an electronic device (101) illustrated in FIG. 2, in an exploded perspective view according to one embodiment disclosed in this document.

[0067] FIG. 4b is an exploded perspective view showing the rear side of the electronic device (101) illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0068] Referring to FIGS. 4A and 4B , an electronic device (101) (e.g., the electronic device (101) of FIG. 1 , 2 , or 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (122) of FIG. 2 ), a display (230) (e.g., the display (115) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0069] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0070] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0071] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear side of the housing (201)' may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0072] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0073] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0074] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0075] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (260b) may be arranged corresponding to the audio module (e.g., the microphone hole (103) or the speaker hole (e.g., the external speaker hole (107), the call receiver hole (114))) or the connector hole (e.g., the first connector hole (128), the second connector hole (109)) of FIG. 2.

[0076] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0077] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0078] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0079] Fig. 5 is an exploded perspective view of an acoustic module (300) according to one embodiment disclosed in this document. Fig. 6 is a cross-sectional view of the acoustic module (300) of Fig. 5 taken along line A-A' according to one embodiment disclosed in this document. Fig. 7 is an enlarged view of a portion of the acoustic module (300) according to one embodiment disclosed in this document.

[0080] Referring to FIGS. 5 to 7, the electronic device (101) may include a housing (301) and an acoustic module (300) disposed inside the housing (301). The configuration of the housing (301) and the acoustic module (300) of FIGS. 5 to 7 may be the same as all or part of the configuration of the housing (110, 201) of FIGS. 2 to 4b and the acoustic output module (155) of FIG. 1. The structure of FIGS. 5 to 7 may be optionally combined with the structure of FIGS. 2 to 4b.

[0081] According to one embodiment, the acoustic module (300) may include a speaker unit (310) configured to generate sound based on an electrical signal and a speaker enclosure (330) that accommodates the speaker unit (310).

[0082] According to one embodiment, the speaker unit (310) can convert an electrical signal into sound. According to one embodiment, the speaker unit (310) may include at least one of a coil (e.g., a voice coil) (not shown) configured to vibrate a diaphragm (311) based on pulse width modulation (PWM), a diaphragm (311) configured to vibrate (e.g., a diaphragm), a damping member (e.g., a spring) (not shown) formed of a conductive material and configured to transmit a signal (e.g., power) transmitted from the outside of the acoustic module (300) to the coil, a magnet (not shown), or a conductive plate (not shown) for concentrating a magnetic field generated by the magnet.

[0083] According to one embodiment, the diaphragm (311) may be positioned toward the lower side (-Z-axis direction) of the speaker unit (310).

[0084] In one embodiment, the speaker enclosure (330) may form at least a portion of the outer surface of the acoustic module (300). For example, the speaker enclosure (330) may accommodate the speaker unit (310). For example, the inner space and the outer space of the speaker enclosure (330) that accommodate the speaker unit (310) may be acoustically separated. For example, the speaker enclosure (330) may prevent a sound that goes in the direction in which the diaphragm (311) of the speaker unit (310) is arranged from overlapping with a sound that goes in the opposite direction to the direction in which the diaphragm (311) of the speaker unit (310) is arranged. In one embodiment, the speaker enclosure (330) may include a first enclosure housing (331) arranged in a downward direction (-Z direction), and a second enclosure housing (332) coupled with the first enclosure housing (331) and arranged in an upward direction (+Z direction). For example, the first enclosure housing (331) and the second enclosure housing (332) may have a structure that is coupled by vibration. For example, the first enclosure housing (331) and the second enclosure housing (332) may have a structure that is coupled by adhesion. For example, the first enclosure housing (331) and the second enclosure housing (332) may be coupled by external force.

[0085] According to one embodiment, the speaker enclosure (330) may further include a protective cover (not shown) for protecting the diaphragm (311), a yoke for protecting a component (e.g., a magnet) of the speaker unit (310), or a radiation hole (not shown) for transmitting vibration generated in the speaker unit (310) to the outside of the electronic device. For example, the speaker enclosure (330) may mean a housing or casing that surrounds the speaker unit (310).

[0086] According to one embodiment, the second enclosure housing (332) may further include an opening (333) at a portion that contacts the speaker unit (310). The opening (333) may be covered by the diaphragm (311), and may be a soundproofing hole that provides a space for the diaphragm (311) to easily vibrate, while allowing sound to escape to the outside of the acoustic module (300).

[0087] In one embodiment, at least a portion of the speaker enclosure (330) may be used as a resonance chamber to accumulate at least a portion of the sound generated from the speaker unit (310). In one embodiment, the acoustic module (300) may include a resonance space (320) formed inside the speaker enclosure (330). In one embodiment, the resonance space (320) may be a space surrounded by the inner surface of the speaker enclosure (330) and the speaker unit (310) inside the speaker enclosure (330). In one embodiment, the resonance space (320) is an empty space inside the speaker enclosure (330), and sound resonance may be generated in the empty space. The amplitude of at least a portion of the vibration generated from the speaker unit (310) may be increased in the resonance space (320).

[0088] According to one embodiment, the acoustic module (300) is placed inside the speaker enclosure (330) and may further include an air absorption member (340) capable of minimizing air resistance to vibration of the diaphragm (311).

[0089] According to one embodiment, the air adsorption member (340) may be disposed in either the first enclosure housing (331) or the second enclosure housing (332). For example, the air adsorption member (340) may be disposed on the first enclosure housing (331). For example, the air adsorption member (340) may be disposed on the second enclosure housing (332). The air adsorption member (340) may be disposed spaced apart from the speaker unit (310) on the same plane (XY plane). For example, the speaker unit (310) may be disposed in the left direction (-X-axis direction) within the speaker enclosure (330), and the air adsorption member (340) may be disposed in the right direction (+X-axis direction) within the speaker enclosure (330).

[0090] According to one embodiment, when the air in the internal resonance space (320) of the acoustic module (300) is compressed by the vibration of the diaphragm (311) of the speaker unit (310), the air absorption member (340) can absorb the air to minimize the resistance of the diaphragm (311) to the air.

[0091] According to one embodiment, when the air in the internal resonance space (320) of the acoustic module (300) is relaxed and / or expanded by the vibration of the diaphragm (311) of the speaker unit (310), the air absorption member (340) can absorb the air to minimize the resistance of the diaphragm (311) to the air.

[0092] According to one embodiment, the acoustic module (300) may further include a buffer member (350) disposed between the air absorbing member (340) and the second enclosure housing (332). According to one embodiment, the buffer member (350) may absorb and / or suppress vibrations coming from the outside of the acoustic module (300). According to one embodiment, the buffer member (350) may support the air absorbing member (340). By disposing the buffer member (350) between the air absorbing member (340) and the speaker enclosure (330), the amount of vibration energy coming through the speaker enclosure (330) transferred to the air absorbing member (340) may be minimized, and damage to the air absorbing member (340) may be prevented.

[0093] In one embodiment, the buffer member (350) may be a breathable member. By using a breathable buffer member (350), a reduction in the volume of the resonance space (320) inside the speaker housing (301) can be prevented.

[0094] In one embodiment, the cushioning member (350) may include a gas-foaming admixture. A gas-foaming admixture may be a substance added to materials such as rubber, plastic, or concrete to create a sponge-like or cellular structure, thereby generating bubbles and causing expansion. For example, the cushioning member (350) may include either melamine foam or high-density polyurethane foam (poron).

[0095] According to one embodiment, the acoustic module (300) may further include a first adhesive member (360) for position fixation between the air absorption member (340) and the buffer member (350), and a second adhesive member (370) for position fixation between the buffer member (350) and the lower plate of the speaker housing (301). For example, the first adhesive member (360) and the second adhesive member (370) may be adhesive materials such as adhesive tape or bonding.

[0096] FIG. 8 is a drawing showing the molecular structure of an air absorption member (340) according to various embodiments of the present invention.

[0097] According to one embodiment, the air adsorption member (340) may be a porous member. According to one embodiment, the air adsorption member (340) may have a fine structure that facilitates adsorption and / or desorption of nitrogen and oxygen constituting air. Referring to FIG. 8, the air adsorption member (340) according to one embodiment of the present invention may include a mixture composed of particles configured to perform positive and negative adsorption of air and a molecular structure of a binder.

[0098] In one embodiment, the air adsorption member (340) may include a zeolite composite. In one embodiment, the air adsorption member (340) may be configured by mixing at least one of granular activated carbon, powdered activated carbon, or ARCP of the activated carbon series with a binder. In one embodiment, the air adsorption member (340) may be configured by mixing Cu, Po1, Zr1, Zr2, or Al particles having a metal organic frameworks structure with a binder. In one embodiment, the air adsorption member (340) may be configured by mixing at least one of diatomaceous earth series elements, pearlite or silicon dioxide series elements, or zeolite series elements with a binder. In one embodiment, the air adsorption member (340) may be configured to have a specific surface area greater than the surface area of ​​a single solid. The air adsorption member (340) may be configured with a structure capable of increasing the adsorption efficiency of specific elements such as nitrogen (N2) and / or oxygen (O2) that constitute air. According to one embodiment, the air adsorption member (340) may include a porous surface polymer structure of an activated carbon polymer or a metal organic frame structure.

[0099] According to one embodiment, in order to overcome the effect of limited space when the diaphragm (311) of the speaker unit (310) moves inside the acoustic module (300), an air absorption member (340) that is easy to absorb air and sound may be placed in the resonance space (320) inside the acoustic module (300), thereby minimizing the resistance to reproduction by air (e.g., resistance to the movement of the diaphragm (311)) during speaker reproduction. By minimizing the air resistance inside the acoustic module (300), the movement of the diaphragm (311) becomes smooth, and performance can be secured.

[0100] FIGS. 9 to 11 are cross-sectional views showing an air absorption member (340) and a buffer member (350) inside an acoustic module (300) according to one embodiment disclosed in this document.

[0101] Referring to FIGS. 9 to 11, the electronic device (101) may include a housing (301) and an acoustic module (300) disposed inside the housing (301). The configuration of the housing (301) and the acoustic module (300) of FIGS. 5 to 7 may be the same as all or part of the configuration of the housing (301) and the acoustic module (300) of FIGS. 5 to 7. The structure of FIGS. 9 to 11 may be optionally combined with the structure of FIGS. 5 to 7.

[0102] According to one embodiment, the air adsorption member (440, 540) may include a first air adsorption member (441, 541) disposed on the first enclosure housing (331), and a second air adsorption member (442, 542) disposed on the second enclosure housing (332). The first air adsorption member (441, 541) and the second air adsorption member (442, 542) may face each other.

[0103] According to one embodiment, the buffer members (450, 550, 650) may include a first buffer member (451, 551) disposed between the first enclosure housing (331) and the first air absorption member (441, 541), and a second buffer member (452, 552) disposed between the second enclosure housing (332) and the second air absorption member (442, 542). When the number of air absorption members (440, 540) increases, the effect of minimizing air-induced regeneration resistance (e.g., resistance to movement of the diaphragm (311)) may be enhanced compared to when there is only one air absorption member (e.g., FIG. 6).

[0104] According to one embodiment, the buffer member (450) may have a rectangular parallelepiped shape similar in size to the air absorption member (340) as shown in FIG. 9.

[0105] According to one embodiment, the buffer member (550) may be formed of a film material for volume reduction, as shown in FIG. 10. The buffer member (550) made of a film material may be alternately folded in a first direction and a second direction opposite to the first direction. For example, the buffer member (550) made of a film material may be arranged in a state of being folded in a zigzag shape (W shape). When folded in a zigzag shape, air may flow through the empty space formed between the folded portions.

[0106] According to one embodiment, the buffer member (650) may be configured in the form of a plurality of pouches forming an empty space therein, as shown in FIG. 11. For example, the buffer member (650) may have a pocket-like shape containing air. For example, the buffer member (650) may have a structure that surrounds both the upper and lower surfaces of the air absorption member (640). For example, it may be configured with a first-first buffer member (651) disposed on the lower surface of the air absorption member (640), and a first-second buffer member (652) disposed on the upper surface of the air absorption member (640).

[0107] FIGS. 12 to 14 are cross-sectional views showing a portion of an electronic device in which a speaker enclosure (330) and a housing (301) are integrally formed according to one embodiment disclosed in this document.

[0108] Referring to FIGS. 12 to 14, the electronic device (101) may include a housing (301) and an acoustic module (300) disposed inside the housing (301). The configuration of the housing (301) and the acoustic module (300) of FIGS. 12 to 14 may be the same as all or part of the configuration of the housing (301) and the acoustic module (300) of FIGS. 5 to 11. The structure of FIGS. 12 to 14 may be optionally combined with the structure of FIGS. 5 to 11.

[0109] In one embodiment, the speaker enclosure (330) and the housing (301) of the electronic device may be formed integrally. In one embodiment, referring to FIG. 12, the first enclosure housing (331) may be formed integrally with the second surface (or rear surface) (301b) of the housing (301) (e.g., 110B of FIG. 2). The lower surface of the first enclosure housing (331) may be substantially flush with the lower surface of the second surface (301b). In one embodiment, referring to FIG. 13, the second enclosure housing (332) may be formed integrally with the first surface (or front surface) (301a) of the housing (301) (e.g., 110A of FIG. 2). The upper surface of the second enclosure housing (332) may be substantially flush with the lower surface of the second surface (301b). The lower surface of the first enclosure housing (331) may be in contact with the second surface (301b) of the housing. The second surface (301b) of the housing may include an opening (333) having the same size and shape as the opening (333) of the first enclosure housing (331). The opening (333) may be formed to penetrate both the first enclosure housing (331) and the second surface (301b). For example, the opening (333) may be formed at a position corresponding to the position of a diaphragm of the speaker unit (310) (e.g., the diaphragm (311) of FIG. 5). For example, the opening (333) may be covered by the diaphragm (311), and may be a soundproofing hole that provides a space for the diaphragm (311) to easily vibrate, while allowing sound to escape to the outside of the acoustic module (300). According to one embodiment, with reference to FIG. 14, the first enclosure housing (331) may be formed integrally with the second side (or rear side) (301b) of the housing (301) (e.g., 110B of FIG. 2), and the second enclosure housing (332) may be formed integrally with the first side (or front side) (301a) of the housing (301) (e.g., 110A of FIG. 2).

[0110] An electronic device according to one embodiment of the present disclosure may include a housing (e.g., housings 110A and 110B of FIGS. 2 to 3, housing 201 of FIG. 4, housing 301 of FIGS. 12 to 14), and an acoustic module (300) disposed inside the housing (301). The acoustic module (300) may include a speaker unit (310) including a diaphragm (311), a speaker enclosure (330) accommodating the speaker unit (310), a porous air-absorbing member (340) disposed inside the speaker enclosure (330), and a breathable buffer member (350) disposed inside the speaker enclosure (330) and laminated with the air-absorbing member (340).

[0111] According to one embodiment, the speaker enclosure (330) may include a first enclosure housing (331), and a second enclosure housing (332) coupled with the first enclosure housing (331) and positioned in an upper direction of the first enclosure housing (331).

[0112] According to one embodiment, the acoustic module (300) may further include a resonance space (320) formed inside the speaker enclosure (330).

[0113] According to one embodiment, when the air in the resonance space (320) is compressed by the vibration of the diaphragm (311), the air absorption member (340) may be configured to negatively absorb the air, and when the air in the resonance space (320) is expanded by the vibration of the diaphragm (311), the air absorption member (340) may be configured to positively absorb the air.

[0114] According to one embodiment, the buffer member (350) may be placed between the air absorption member (340) and the speaker enclosure (330).

[0115] According to one embodiment, the buffer member (350) may include a foaming agent.

[0116] According to one embodiment, the buffer member (350) may include at least one of melamine foam and high-density polyurethane foam (poron).

[0117] According to one embodiment, the buffer member (350) may be formed of a film material.

[0118] According to one embodiment, a first adhesive member (360) may be further included between the air absorption member (340) and the buffer member (350), and a second adhesive member (370) may be further included between the buffer member (350) and the speaker enclosure (330).

[0119] According to one embodiment, the air adsorption member (340) may be a mixture composed of particles configured to perform positive and negative adsorption of air and a molecular structure of a binder.

[0120] In one embodiment, the air adsorption member may include any one of a zeolite composite, an activated carbon polymer, and a porous surface material of a metal organic frame structure.

[0121] According to one embodiment, the air absorption member (340) may include a first air absorption member (441, 451) disposed on the first enclosure housing (331) and a second air absorption member (442, 542) disposed on the second enclosure housing (332), and the buffer member (350) may include a first buffer member (350) disposed between the first enclosure housing (331) and the first air absorption member (441, 451), and a second buffer member (350) disposed between the second enclosure housing (332) and the second air absorption member (442, 542).

[0122] According to one embodiment, the buffer member (350) may include a plurality of pouches forming an empty space therein.

[0123] According to one embodiment, the buffer member (350) may include a first-first buffer member (350) disposed on the upper surface of the air absorption member (340), and a first-second buffer member (350) disposed on the lower surface of the air absorption member (340).

[0124] According to one embodiment, the speaker enclosure (330) may be formed integrally with the housing (301).

[0125] An electronic device according to one embodiment of the present disclosure may include a housing (301) and an acoustic module (300) disposed inside the housing (301). The acoustic module (300) may include a speaker unit (310) including a diaphragm (311), a speaker enclosure (330) accommodating the speaker unit (310), a resonance space (320) formed inside the speaker enclosure (330), a porous air absorption member (340) disposed inside the speaker enclosure (330) and configured to negatively or positively absorb air in the resonance space (320) by vibration of the diaphragm (311), and a breathable buffer member (350) disposed inside the speaker enclosure (330) and including a foaming agent disposed between the air absorption member (340) and the speaker enclosure (330).

[0126] According to one embodiment, the speaker enclosure (330) may include a first enclosure housing (331), and a second enclosure housing (332) coupled with the first enclosure housing (331) and positioned in an upper direction of the first enclosure housing (331).

[0127] According to one embodiment, the buffer member (350) may include at least one of melamine foam and high-density polyurethane foam (poron).

[0128] According to one embodiment, the buffer member (350) may be formed of a film material.

[0129] According to one embodiment, a first adhesive member (360) may be further included between the air absorption member (340) and the buffer member (350), and a second adhesive member (370) may be further included between the buffer member (350) and the speaker enclosure (330).

[0130] Typically, the acoustic module (300) includes an air absorption member (340) capable of absorbing and / or desorbing air to ensure that the vibration of the diaphragm (311) is not restricted. However, the air absorption member (340) can be easily damaged when vibration occurs or by pressure (external force). A separate structure can be added to the air absorption member (340) to minimize vibration transmission. However, when a separate structure is added, the volume of the internal space of the speaker is reduced, which may result in a decrease in performance.

[0131] An acoustic module (300) according to one embodiment of the present disclosure can provide an acoustic module (300) and an electronic device including the acoustic module (300) that can minimize, reduce, and / or limit air resistance to a diaphragm (311) without limiting vibration of the diaphragm (311) by using an air absorption member (340) that facilitates compression and relaxation of air.

[0132] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0133] In order to overcome the effect of limited space when the diaphragm (311) of the speaker unit (310) moves inside the acoustic module (300), an air absorption member (340) that is easy to absorb air and sound is disposed in a resonance space (320) inside the acoustic module (300), thereby minimizing air resistance during speaker playback (e.g., resistance to the movement of the diaphragm (311). By minimizing air resistance inside the acoustic module (300), the diaphragm (311) moves smoothly, and performance can be secured.

[0134] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0135] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In electronic devices, Housing (301); and Including an acoustic module (300) placed inside the housing, The above sound module, A speaker unit (310) including a diaphragm (311); A speaker enclosure (330) accommodating the above speaker unit; A porous air absorption member (340) arranged inside the speaker enclosure; and An electronic device comprising a breathable cushioning member (350) disposed inside the speaker enclosure and laminated with the air absorbing member.

2. In paragraph 1, An electronic device, wherein the speaker enclosure comprises a first enclosure housing (331), and a second enclosure housing (332) coupled with the first enclosure housing (331) and positioned in an upper direction of the first enclosure housing.

3. In either of paragraphs 1 and 2, An electronic device in which the above-mentioned acoustic module (300) further includes a resonance space (320) formed inside the speaker enclosure.

4. In paragraph 3, When the air in the resonance space is compressed by the vibration of the above-mentioned diaphragm, the air absorption member is configured to negatively absorb the air. An electronic device configured such that when the air in the resonance space expands due to the vibration of the vibration plate, the air absorption member absorbs air.

5. In any one of paragraphs 1 to 4, The above-mentioned buffer member is an electronic device disposed between the above-mentioned air absorption member and the above-mentioned speaker enclosure.

6. In any one of paragraphs 1 to 5, An electronic device wherein the above-mentioned cushioning member comprises a foaming agent.

7. In any one of paragraphs 1 to 6, An electronic device wherein the above-mentioned buffer member comprises at least one of melamine foam and high-density polyurethane foam (poron).

8. In any one of paragraphs 1 to 7, The above-mentioned buffer member is an electronic device formed of a film material.

9. In any one of paragraphs 1 to 8, A first adhesive member (360) is further included between the air absorption member and the buffer member, An electronic device further comprising a second adhesive member (370) between the buffer member and the speaker enclosure.

10. In any one of paragraphs 1 to 9, An electronic device in which the above air adsorption member is a mixture composed of a molecular structure of particles and a binder configured to perform positive and negative adsorption of air.

11. In any one of paragraphs 1 to 9, An electronic device wherein the air absorption member comprises one of a zeolite composite, an activated carbon polymer, and a porous surface material of a metal organic frame structure.

12. In paragraph 2, The air absorption member includes a first air absorption member (441, 451) arranged on the first enclosure housing, and a second air absorption member (442, 542) arranged on the second enclosure housing. An electronic device comprising a first buffer member (451, 551) disposed between the first enclosure housing and the first air absorption member, and a second buffer member (452, 552) disposed between the second enclosure housing and the second air absorption member.

13. In any one of paragraphs 1 to 12, An electronic device wherein the above-mentioned buffer member includes a plurality of pouches forming a hollow space therein.

14. In any one of paragraphs 1 to 13, An electronic device in which the above-mentioned buffer member includes a first-first buffer member (652) arranged on an upper surface of the above-mentioned air absorption member, and a first-2nd buffer member (651) arranged on a lower surface of the above-mentioned air absorption member.

15. In any one of paragraphs 1 to 13, The above speaker enclosure is an electronic device formed integrally with the housing.

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