Heat dissipation device and server

Abstract

The embodiments of the present application relate to the technical field of heat dissipation of serves. Disclosed are a heat dissipation device and a server. The heat dissipation device is configured to dissipate heat from a heating component in a server, and comprises a CPU liquid cooling plate, a memory-module heat transfer assembly and a heat transfer support, wherein the CPU liquid cooling plate comprises: a first surface and a second surface, which are arranged opposite each other, an inner channel, through which a liquid flows to take away heat transferred to the first surface and the second surface, and an inlet and an outlet, which are in communication with the inner channel, the first surface being configured to be in contact with a CPU; the memory-module heat transfer assembly comprises a heat collector configured to be in heat transfer contact with a memory module, a heat conductor in contact with the second surface, and a heat transfer element for transferring heat from the heat collector to the heat conductor; and the heat transfer support is configured to be in contact with a power supply module, and is further in contact with the CPU liquid cooling plate. By means of the heat dissipation device and the server provided in the embodiments of the present application, the heat dissipation of the heating component in the server is realized, and the integration level of the heat dissipation device can also be ensured.

Description

Cooling device and server

[0001] Cross-references

[0002] This application claims priority to the Chinese patent application entitled “Heat Dissipation Device and Server” and application number 202311049280.0 filed on August 18, 2023, which is incorporated herein by reference in its entirety. Technical Field

[0003] The embodiments of the present application relate to the technical field of server heat dissipation, and in particular to a heat dissipation device and a server. Background Art

[0004] With the continuous advancement of electronic integration technology, more and more electronic components are being integrated into electronic devices. Heat dissipation issues are becoming increasingly prominent, especially for devices with high heat fluxes. Timely heat dissipation is crucial to ensure proper functioning. Servers, as electronic devices providing computing and application services, generate significant amounts of heat during operation. If this heat is not dissipated promptly through cooling devices, it can lead to server overheating and various failures.

[0005] However, servers contain many heat-generating components, and the installation space for heat sinks is limited, making it difficult to independently dissipate heat for each component. Therefore, how to dissipate heat for these components while ensuring the integration of the heat sink is a critical issue.

[0006] Summary of the Invention

[0007] The purpose of the embodiments of the present application is to provide a heat dissipation device and a server, which can achieve the purpose of dissipating heat from heat-generating components in the server while ensuring the integration of the heat dissipation device.

[0008] To solve the above technical problems, an embodiment of the present application provides a heat dissipation device, which includes a CPU liquid cooling plate, a memory module heat transfer assembly, and a heat transfer bracket; the CPU liquid cooling plate includes a first surface and a second surface arranged opposite to each other, an inner channel for liquid to flow and carry away the heat conducted to the first surface and the second surface, and an inlet and an outlet connected to the inner channel, and the first surface is used to contact the CPU; the memory module heat transfer assembly includes a heat collecting member for heat transfer contact with the memory module, a heat conducting member in contact with the second surface, and a heat conducting member for conducting heat from the heat collecting member to the heat conducting member; the heat transfer bracket is used to contact the power supply module, and the heat transfer bracket is also in contact with the CPU liquid cooling plate

[0009] An embodiment of the present application further provides a server, comprising a PCB board and the above-mentioned heat dissipation device; the PCB board is provided with a CPU, a memory module, and a power supply module; the CPU liquid cooling plate of the heat dissipation device is connected to the PCB board, the first surface of the CPU liquid cooling plate is in contact with the CPU, the heat collecting element of the heat dissipation device is in heat transfer contact with the memory module, and the heat transfer bracket of the heat dissipation device is connected to the PCB board and in contact with the power supply module.

[0010] The heat dissipation device and server provided by the embodiments of the present application achieve centralized heat dissipation through a CPU liquid cooling plate. The heat generated by the CPU in the server when it is working can be conducted to the first surface of the CPU liquid cooling plate, and the heat generated by the memory module when it is working can be conducted from the heat collecting member and the heat transfer member to the heat conducting member, and then conducted to the second surface of the CPU liquid cooling plate via the heat conducting member. At the same time, the heat generated by the power supply module when it is working can be conducted to the surface of the CPU liquid cooling plate via the heat transfer bracket. In this way, there is no need to set up independent liquid cooling and heat dissipation components for each heat-generating component in the server. The centralized heat dissipation method can achieve the heat dissipation purpose of the heat-generating components in the server while ensuring the integration of the heat dissipation device.

[0011] In some embodiments, the CPU liquid cooling plate includes a cavity with a plurality of parallel fins disposed along a predetermined direction within the cavity, with internal channels formed between adjacent fins within the cavity. This channel, separated by the fins, allows for more uniform flow of coolant within the cavity, resulting in more comprehensive and uniform heat dissipation.

[0012] In some embodiments, the cavity is provided with reinforcing ribs distributed perpendicularly along a predetermined direction. The ribs divide the cavity into a first portion and a second portion, which are interconnected. The inlet is connected to the starting end of the inner channel in the first portion, and the outlet is connected to the ending end of the inner channel in the second portion. In this way, the ribs can extend the length of the inner channel, ensuring the effectiveness and integrity of heat exchange.

[0013] In some embodiments, a baffle, perpendicular to the fins, is installed within the cavity. The baffle divides the cavity into a first and second interconnected layer. The inlet connects to the starting end of the inner channel in the first layer, and the outlet connects to the terminal end of the inner channel in the second layer. This stratification effect of the baffle allows the coolant to dissipate heat preferentially for the CPU, ensuring that heat from the CPU is dissipated promptly.

[0014] In some embodiments, two heat-collecting elements are provided, symmetrically arranged about the heat-conducting element. The heat-transferring element is tubular, with the ends of the heat-transferring element embedded in the two heat-collecting elements one-on-one, and the heat-conducting element embedded in the middle of the heat-transferring element. This arrangement of multiple heat-collecting elements allows heat transfer to memory modules located in different areas of the server motherboard.

[0015] In some embodiments, there are multiple heat transfer elements, which are spaced apart from each other along the symmetrical direction of the two heat collecting elements. In this way, the heat collected at each heat collecting element can be promptly and effectively transferred to the heat transfer element through the multiple heat transfer elements, achieving efficient heat transfer.

[0016] In some embodiments, the memory module heat transfer assembly further includes a first heat conducting plate and a second heat conducting plate connected to each other. The first and second heat conducting plates are used to sandwich the memory modules, and the heat collecting member contacts the first and second heat conducting plates. In this way, the heat generated by each memory module during operation can be effectively transferred to the heat collecting member via the heat conducting plates, which are in direct contact with the memory modules.

[0017] In some embodiments, the heat transfer bracket includes a base and a heat dissipation portion extending from the base. The base is provided with a heat-conducting surface for contacting the power supply module, and the heat dissipation portion contacts the CPU liquid cooling plate. In this way, the base absorbs heat generated by the power supply module during operation, and the heat dissipation portion then conducts the heat to the CPU liquid cooling plate for cooling, thereby achieving heat dissipation of the power supply module.

[0018] In some embodiments, the heat transfer bracket further includes a support portion disposed on the base, the support portion being connected to the heat collecting element. In this way, the support portion can provide a mounting and fixing foundation for the heat collecting element, thereby facilitating the integrated arrangement of the entire heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] FIG1 is a schematic diagram of the three-dimensional structure of a heat dissipation device provided in some embodiments of the present application;

[0021] FIG2 is a schematic side view of the heat dissipation device provided in some embodiments of the present application;

[0022] FIG3 is a schematic diagram of the front view of the heat dissipation device provided in some embodiments of the present application;

[0023] FIG4 is a schematic top view of the heat dissipation device provided in some embodiments of the present application;

[0024] FIG5 is a schematic top view of the structure of a CPU liquid cooling plate in a heat dissipation device provided in some embodiments of the present application;

[0025] FIG6 is a schematic cross-sectional view of the structure along the AA direction in FIG5 ;

[0026] FIG7 is a schematic cross-sectional view of the structure along line BB in FIG5 ;

[0027] FIG8 is an enlarged structural diagram of point C in FIG7;

[0028] FIG9 is a schematic top view of another CPU liquid cooling plate in the heat dissipation device provided in some embodiments of the present application;

[0029] FIG10 is a schematic cross-sectional view of the structure along the DD direction in FIG9;

[0030] FIG11 is a schematic cross-sectional view of the structure along the line EE in FIG9 ;

[0031] FIG12 is a schematic cross-sectional view of the structure along the FF direction in FIG9;

[0032] FIG13 is an enlarged structural diagram of point G in FIG12;

[0033] FIG14 is a schematic diagram of the front view of the heat transfer assembly of a memory module in a heat dissipation device provided in some embodiments of the present application;

[0034] FIG15 is a schematic top view of a heat transfer assembly of a memory module in a heat dissipation device provided in some embodiments of the present application;

[0035] FIG16 is a side view schematic diagram of a heat transfer assembly of a memory module in a heat dissipation device provided in some embodiments of the present application;

[0036] FIG17 is a schematic diagram of the front view of the heat dissipation device provided by some embodiments of the present application when the memory module vest and the memory module are matched;

[0037] FIG18 is a schematic top view of the structure of a memory module vest and a memory module in a heat dissipation device provided by some embodiments of the present application;

[0038] FIG19 is a side view of the structure of a memory module vest and a memory module in a heat dissipation device provided by some embodiments of the present application;

[0039] FIG20 is a schematic diagram of the front view of the heat transfer bracket in the heat dissipation device provided in some embodiments of the present application;

[0040] FIG21 is a schematic top view of the structure of a heat transfer bracket in a heat dissipation device provided in some embodiments of the present application;

[0041] FIG22 is a schematic diagram of the bottom-up structure of the heat transfer bracket in the heat dissipation device provided in some embodiments of the present application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below with reference to the accompanying drawings. However, it will be understood by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can be implemented. The division of the following embodiments is for convenience of description and should not constitute any limitation on the specific implementation of the present application. The various embodiments can be combined with each other and referenced to each other under the premise of no contradiction.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0044] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0045] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0046] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections, or electrical connections; direct connections, or indirect connections through an intermediate medium; and can refer to internal connectivity between two components or interaction between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0047] With the rapid development of servers, traditional air cooling technology can no longer meet the growing heat dissipation needs of data centers. Liquid cooling will become the mainstream cooling method for servers in the future. Liquid cooling technology uses a cooling medium instead of air to dissipate heat. The liquid can efficiently exchange heat with the server's heat-generating components, improving heat dissipation efficiency and reducing PUE (Power Usage Effectiveness). PUE is a metric used to evaluate data center energy efficiency. A value greater than 1 indicates that non-IT (Information Technology) equipment consumes less energy, indicating better energy efficiency. Furthermore, using liquid cooling technology for heat dissipation can save electricity, which is in line with market trends towards carbon reduction and energy conservation.

[0048] Currently, single-phase cold plate liquid cooling in servers primarily dissipates heat from the CPU (Central Processing Unit). To increase the proportion of liquid cooling in liquid-cooled servers and reduce power usage effectiveness (PUE), liquid cooling is also being adopted for DIMMs (Dual Inline Memory Modules) and VRs (Voltage Regulators).

[0049] DIMMs (memory modules) are typically cooled using an ultra-thin cold plate solution. However, due to limited space and the need for easy installation and maintenance of DIMMs, the DIMM count is often under-configured. Furthermore, ultra-thin cold plates require high soldering precision, pose a risk of leakage, and exhibit poor reliability. Alternatively, DIMMs can be cooled using a single-sided cooling solution. However, in this solution, the DIMMs are not in contact with the hot surface of the cold plate, resulting in poor heat dissipation and a large temperature difference between the two sides of the DIMM.

[0050] Alternatively, DIMM cooling can be achieved using heat pipes, with heat pipes placed between the two DIMMs to transfer heat to cold plates in front and behind the DIMMs. However, independent cold plates take up a lot of server space, require a large number of them, and provide limited cooling performance.

[0051] The VR power supply unit usually uses heat pipes or metal blocks to transfer heat to the CPU cold plate for heat dissipation. This solution is relatively simple and reliable.

[0052] Therefore, servers using liquid cooling typically employ independent liquid cooling for each heat-generating component. This not only complicates the layout of the cooling system, creates the risk of leakage, but also takes up a large amount of space. This independent cooling approach makes it difficult to achieve heat dissipation for the server's heat-generating components while ensuring the integrity of the cooling system.

[0053] To this end, some embodiments of the present application provide a heat dissipation device that can dissipate heat for components such as the CPU, DIMM, and VR power supply unit in the server. The heat dissipation device is designed to be integrated, and the heat generated by each heat-generating component during operation can be concentrated and transferred to the CPU liquid cooling plate. The proportion of centralized heat dissipation achieved through liquid cooling can reach up to more than 80%, reducing PUE. At the same time, the integrated heat dissipation design takes up less space in the server. In addition, the heat of the main heat-generating components is concentrated on the CPU liquid cooling plate for cooling, which can reduce the number of liquid cooling pipelines and simplify the layout. Fewer pipe joints can reduce the risk of leakage, increase reliability, and also make the cost of the liquid cooling device lower.

[0054] The heat dissipation devices provided by some embodiments of the present application are described below in conjunction with Figures 1 to 22. The heat dissipation devices are used to dissipate heat from heat-generating components in a server.

[0055] As shown in Figures 1 to 13, some embodiments of the present application provide a heat dissipation device including a CPU liquid cooling plate 11, a memory module heat transfer assembly 12, and a heat transfer bracket 13. The CPU liquid cooling plate 11 includes a first surface 111 and a second surface 112 (shown in Figure 6) disposed opposite each other, an internal channel 113 (shown in Figure 11) for liquid to flow and remove heat transferred to the first and second surfaces 111, 112, and an inlet 114 and an outlet 115 (shown in Figure 5) connected to the internal channel 113. The first surface 111 is configured to contact the CPU. The memory module heat transfer assembly 12 includes a heat collecting member 121 for heat transfer contact with the memory module 30, a heat conducting member 122 in contact with the second surface 112, and a heat transfer member 123 for transferring heat from the heat collecting member 121 to the heat conducting member 122. The heat transfer bracket 13 is configured to contact the power supply module 40 and is also configured to contact the CPU liquid cooling plate 11.

[0056] The CPU liquid cooling plate 11 utilizes liquid cooling. Both surfaces of the CPU liquid cooling plate 11 can receive heat generated by the server's heat-generating components. The first surface 111, which can be the bottom surface of the CPU liquid cooling plate 11, is used to dissipate heat from the server's CPU. The second surface 112, which can be the top surface of the CPU liquid cooling plate 11, is used to cool heat generated by the memory module heat transfer assembly 12. Coolant can enter the internal channel 113 of the CPU liquid cooling plate 11 through the inlet 114 of the CPU liquid cooling plate 11. As the coolant flows through the internal channel 113 of the CPU liquid cooling plate 11, it removes heat transferred to the surface of the CPU liquid cooling plate 11. Finally, the coolant can flow out through the outlet 115 of the CPU liquid cooling plate 11, achieving recirculation. The inlet 114 and outlet 115 of the CPU liquid cooling plate 11 can each be connected to a liquid cooling pipe 1101, connecting to the liquid cooling circuit in the heat dissipation system to achieve circulating heat dissipation. The CPU liquid cooling plate 11 can be provided with mounting holes 1102 for screw fastening to the server motherboard. The coolant may be deionized water, propylene glycol aqueous solution or ethylene glycol aqueous solution.

[0057] The heat dissipation of the memory stick 30 is achieved by using the memory stick heat transfer assembly 12, which conducts the heat to the CPU liquid cooling plate 11 through the memory stick heat transfer assembly 12, thereby achieving centralized heat dissipation. The heat collecting part 121 of the memory stick heat transfer assembly 12 can collect the heat generated by each memory stick 30 during operation, and the heat transfer part 123 can conduct the heat from the heat collecting part 121 to the heat conducting part 122, which can be installed in a fit with the CPU liquid cooling plate 11. The heat generated by the memory stick 30 during operation is then conducted to the CPU liquid cooling plate 11 for cooling. The heat collecting part 121 and the heat conducting part 122 of the memory stick heat transfer assembly 12 can be made of metal materials with good thermal conductivity, such as copper or aluminum, and have no internal flow channel structure, which can reduce the risk of leakage and improve reliability. The heat conducting part 123 of the memory stick heat transfer assembly 12 can be a heat pipe, a metal sheet, a metal bar or other heat transfer components.

[0058] The power supply module 40 uses a heat transfer bracket 13 to transfer heat to the CPU liquid cooling plate 11, also achieving centralized heat dissipation. The heat transfer bracket 13 can be made of a metal material with good thermal conductivity, such as copper or aluminum. Furthermore, the use of a bracket provides a convenient mounting location for the heat collector 121, ensuring secure attachment of the heat collector 121.

[0059] The heat dissipation device provided in some embodiments of the present application realizes centralized heat dissipation through the CPU liquid cooling plate 11. The heat generated by the CPU in the server when it is working can be conducted to the first surface 111 of the CPU liquid cooling plate 11, and the heat generated by the memory module 30 when it is working can be conducted from the heat collecting member 121 and the heat transfer member 123 to the heat conducting member 122, and then conducted to the second surface 112 of the CPU liquid cooling plate 11 via the heat conducting member 122. At the same time, the heat generated by the power supply module 40 when it is working can be conducted to the surface of the CPU liquid cooling plate 11 via the heat transfer bracket 13. In this way, there is no need to set up independent liquid cooling and heat dissipation components for each heat-generating component in the server. The centralized heat dissipation can achieve the heat dissipation purpose of the heat-generating components in the server while ensuring the integration of the heat dissipation device.

[0060] In some embodiments, the CPU liquid cooling plate 11 may be provided with a cavity 116 , in which a plurality of fins 14 parallel to each other are arranged along a preset direction, and an inner channel 113 is formed between two adjacent fins 14 in the cavity 116 .

[0061] Fins 14 can divide the cavity 116 of the CPU liquid cooling plate 11, thereby forming different internal channels 113 for liquid flow. This allows the coolant to flow more evenly within the cavity 116 of the CPU liquid cooling plate 11, effectively removing heat conducted to the surface of the CPU liquid cooling plate 11. The preset direction can be the length or width of the CPU liquid cooling plate 11.

[0062] In practice, the CPU liquid cooling plate 11 can be formed into an integrated structure by vacuum brazing or friction stir welding of a pipe joint 101, a liquid cooling plate base plate 102, a liquid cooling plate fixing plate 103, and a liquid cooling plate cover plate 104. The pipe joint 101 includes an inlet pipe joint for connecting to a liquid cooling line 1101 for inputting coolant, and an outlet pipe joint for connecting to a liquid cooling line 1101 for outputting coolant. The inlet pipe joint forms an inlet 114 for the CPU liquid cooling plate 11, and the outlet pipe joint forms an outlet 115 for the CPU liquid cooling plate 11. A gap exists between the liquid cooling plate base plate 102 and the liquid cooling plate cover plate 104; together with the liquid cooling plate fixing plate 103, they form a cavity 116.

[0063] In addition, threaded holes 105 may be provided on the liquid cooling plate cover 104 to provide a fixed foundation for the installation of the heat conducting member 122 of the memory module heat transfer assembly 12 .

[0064] As shown in Figures 5 to 8, the cavity 116 of the CPU liquid cooling plate 11 can be provided with reinforcing ribs 117 distributed in a vertical direction along a preset direction. The reinforcing ribs 117 separate the cavity 116 into a first part 1161 and a second part 1162 that are interconnected. The inlet 114 is connected to the starting end of the inner channel 113 located in the first part 1161, and the outlet 115 is connected to the ending end of the inner channel 113 located in the second part 1162.

[0065] The starting end of the inner channel 113 is the end where the coolant flows in, and the ending end of the inner channel 113 is the end where the coolant flows out. The ending end of the inner channel 113 located in the first portion 1161 is connected to the starting end of the inner channel 113 located in the second portion 1162. After flowing through the inner channel 113 located in the first portion 1161, the coolant will enter the inner channel 113 located in the second portion 1162 through the connection between the first portion 1161 and the second portion 1162. It will eventually flow back from the outlet 115 of the CPU liquid cooling plate 11. As an illustration, the dotted arrows in FIG5 indicate the specific flow direction of the coolant in the cavity 116 of the CPU liquid cooling plate 11, and the dotted arrows in FIG6 indicate the flow direction of the coolant from the inlet 114 to the cavity 116.

[0066] Reinforcing ribs 117 divide the cavity 116 horizontally from front to back, leaving a connecting area at the end. This allows the coolant to form a U-shaped flow within the cavity 116, extending the coolant's flow length within the cavity 116 of the CPU liquid cooling plate 11. The coolant enters the internal channel 113 of the CPU liquid cooling plate 11 through the inlet pipe joint, passes through the fins 14 located in a portion between the liquid cooling plate base plate 102 and the liquid cooling plate cover plate 104, bypasses the reinforcing ribs 117, and then passes through the fins 14 located in another portion between the liquid cooling plate base plate 102 and the liquid cooling plate cover plate 104. Finally, it returns through the outlet pipe joint. As the coolant flows through the internal channel 113 of the CPU liquid cooling plate 11, it simultaneously removes heat conducted to the first surface 111 and the second surface 112, achieving simultaneous heat dissipation.

[0067] In addition, the reinforcing rib 117 can be provided in the middle of the cavity 116, dividing the cavity 116 into two equal parts, thereby making the heat conduction process more uniform. Moreover, the reinforcing rib 117 can improve the pressure resistance of the CPU liquid cooling plate 11 after the CPU liquid cooling plate 11 is welded and formed.

[0068] As shown in Figures 9 to 13, a baffle 118 perpendicular to the fin 14 can also be set in the cavity 116. The baffle 118 separates the cavity 116 into a first layer 1163 and a second layer 1164 that are interconnected. The inlet 114 is connected to the starting end of the inner channel 113 located in the first layer 1163, and the outlet 115 is connected to the ending end of the inner channel 113 located in the second layer 1164.

[0069] The terminal end of the inner channel 113 on the first layer 1163 is connected to the starting end of the inner channel 113 on the second layer 1164. After flowing through the inner channel 113 on the first layer 1163, the coolant enters the inner channel 113 on the second layer 1164 through the connection between the first layer 1163 and the second layer 1164, and finally flows back through the outlet 115 of the CPU liquid cooling plate 11.

[0070] When the first layer 1163 is close to the first surface 111, the coolant can preferentially remove the heat generated by the CPU during operation, and then remove the heat generated by the memory modules 30 during operation. The cavity 116 of the CPU liquid cooling plate 11 is divided into upper and lower sections in cross section by a baffle 118. The overall flow pattern of the inner channels 113 corresponding to the first layer 1163 and the second layer 1164 is U-shaped. The inlet pipe connector is inserted into the cavity 116 below the baffle 118. The coolant first flows through the fins 14 between the liquid cooling plate base plate 102 and the baffle 118, then bypasses the baffle 118 and flows upward through the fins 14 between the liquid cooling plate cover plate 104 and the baffle 118. It finally flows back out of the outlet pipe connector. For illustration, the dashed arrows in Figure 9 indicate the specific flow direction of the coolant in the cavity 116 of the CPU liquid cooling plate 11. In FIG10 , dashed arrows indicate the direction of coolant flow from inlet 114 through inner channel 113 located in first layer 1163 to inner channel 114 located in second layer 1164. In FIG11 , dashed arrows indicate the direction of coolant flow from inner channel 113 located in first layer 1163 to inner channel 114 located in second layer 1164 and back out of outlet 115.

[0071] It should be noted that, since the memory stick 30 has low power consumption, the inner channel 113 formed by the fins 14 in the second layer 1164 near the liquid cooling plate cover 104 can also be replaced by a traditional serpentine flow channel machined by CNC (Computer Numerical Control).

[0072] In addition, reinforcing ribs 117 may be provided between the liquid cooling plate base plate 102 and the liquid cooling plate cover plate 104, and the reinforcing ribs 117 are perpendicular to the baffle 118. The reinforcing ribs 117 ensure the overall pressure resistance of the CPU liquid cooling plate 11.

[0073] As shown in Figures 14 to 16, there can be two heat collecting parts 121, and the two heat collecting parts 121 are symmetrically arranged about the heat conducting part 122. The heat transfer part 123 is tubular, and the two ends of the heat transfer part 123 are buried in the two heat collecting parts 121 one by one, and the middle part of the heat transfer part 123 is buried in the heat conducting part 122.

[0074] Two heat collectors 121 are arranged corresponding to the memory modules 30 installed in two different areas on the server motherboard. This allows heat from the memory modules 30 located at different locations on the server motherboard to be transferred to the CPU liquid cooling plate 11, achieving centralized heat dissipation. Heat collectors 121 can be provided with vias 1211 to securely connect them to other components, thus completing the installation of heat collectors 121.

[0075] In addition, the tubular heat transfer element 123 is embedded in the heat collecting element 121 and the heat conducting element 122 to conduct heat between the heat collecting element 121 and the heat conducting element 122. A working medium can be added to the tubular interior of the heat transfer element 123 so that heat conduction can be quickly achieved through the flow of the working medium.

[0076] In some embodiments, there may be multiple heat transfer elements 123 , and the multiple heat transfer elements 123 are arranged at intervals along the symmetrical direction of the two heat collecting elements 121 .

[0077] That is, in order to effectively achieve heat conduction between the heat collecting member 121 and the heat conducting member 122, a plurality of tubular heat conducting members 123 can be provided. Each heat conducting member 123 can be independent of each other and can jointly conduct the heat collected on the heat collecting member 121 to the heat conducting member 122.

[0078] In the scenarios shown in Figures 15 and 16, the memory stick heat transfer assembly 12 can be composed of three heat sinks and six heat pipes welded together. The heat sink located in the middle with a smaller area is used to fit with the CPU liquid cooling plate 11 to form a heat conducting member 122, and the two can be fastened with screws. Thermal pads can be affixed to the contact surface between the heat sink and the CPU liquid cooling plate 11 to fill the air gap between them and play a role in assisting heat conduction. The heat sinks located on both sides with larger areas are used to fit with the memory stick vest to form a heat collecting member 121. Among them, the heat sink and heat pipe located at the upper end of the memory stick 30 can be installed on both sides using a deep-buried pipe process. The heat sink and heat pipe located at the upper end of the CPU liquid cooling plate 11 can be installed on one side using a shallow-buried pipe process. In addition, the heat pipe can also be flattened and milled at the same time as the heat sink.

[0079] In some embodiments, as shown in Figures 17 to 19, the memory bar heat transfer assembly 12 may also include a first heat conducting plate 124 and a second heat conducting plate 125 connected to each other. The first heat conducting plate 124 and the second heat conducting plate 125 are used to clamp the memory bar 30 in the middle, and the heat collecting member 121 is in contact with the first heat conducting plate 124 and the second heat conducting plate 125.

[0080] In other words, a memory module shield formed by two connected heat conducting plates can be placed on the memory module 30, with the heat collecting member 121 in heat transfer contact with the memory module through the memory module shield. Heat generated by the memory module 30 during operation is transferred from the memory module shield to the heat collecting member 121, and then to the heat conducting member 122 located on the top surface of the CPU liquid cooling plate 11 via the heat conducting member 123, thereby dissipating heat from the memory module 30.

[0081] As shown in Figure 17, a first screw hole 1241 can be provided on the first heat conducting plate 124. At the same time, a corresponding second screw hole can be provided on the second heat conducting plate 125. In this way, the tops of the two heat conducting plates forming the memory bar vest are respectively provided with screw holes, and assembly can be achieved by tightening the screws. As shown in Figure 19, a thermal gasket 15 can be affixed to the contact surface between the inner side of the first heat conducting plate 124 and the memory bar 30, and the contact surface between the inner side of the second heat conducting plate 125 and the memory bar 30, so as to fill the air gap between the first heat conducting plate 124 and the memory bar 30, and between the second heat conducting plate 125 and the second memory bar 30. The thermal gasket 15 can play a role in assisting heat conduction.

[0082] In addition, thermal gaskets can also be affixed to the contact surface between the memory bar vest and the heat collecting part 121, that is, the contact surface between the first heat conducting plate 124, the second heat conducting plate 125 and the heat collecting part 121, to fill the air gap between the two and play a role in assisting heat conduction. The thermal gasket can be appropriately thickened to adapt to the height difference when the heat collecting part 121 and the heat conducting part 122 are installed and positioned. A PI (Polyimide) film can be attached to the thermal gasket and then fitted with the memory bar vest. The use of PI film can increase the toughness of the thermally conductive silicone to ensure that the material will not break easily during construction and repair.

[0083] The design of the memory stick vest not only plays a role in heat conduction, but also reduces the risk of components falling off during the insertion and removal of the memory stick 30, thereby reducing the failure rate of the memory stick 30.

[0084] As shown in Figures 20 to 22, the heat transfer bracket 13 may include a base 131 and a heat dissipation portion 132 bent and extended from the surface of the base 131. The base 131 is provided with a heat conductive surface 1311 for contacting the power supply module 40, and the heat dissipation portion 132 is in contact with the CPU liquid cooling plate 11.

[0085] The heat generated by the power supply module 40 when it is working can be conducted to the CPU liquid cooling plate 11 through the base 131 of the heat transfer bracket 13, thereby achieving heat dissipation of the power supply module 40. The base 131 can be fixed to the server motherboard, and the heat conduction surface 1311 of the base 131 is close to the motherboard and can form contact with the power supply module 40 on the motherboard. In order to ensure the heat transfer effect between the base 131 and the power supply module 40, a thermal pad can also be added to the heat conduction surface 1311. The heat dissipation portion 132 is bent and extended from the surface of the base 131, and the edge of the heat dissipation portion 132 can be fixed on the edge step of the CPU liquid cooling plate 11. Through the contact relationship formed between the heat dissipation portion 132 and the CPU liquid cooling plate 11, the heat generated by the power supply module 40 when it is working can be conducted to the CPU liquid cooling plate 11 for cooling.

[0086] In practice, heat pipes 134 can be welded to the heat transfer bracket 13, and the number of heat pipes 134 can be one or more. Heat pipes 134 can be flattened and embedded in the heat-conducting surface 1311 of the main body, and milled simultaneously with the main body. Heat pipes 134 can improve heat conduction efficiency, facilitating the timely transfer of heat generated by the power supply module 40 during operation to the surface of the CPU liquid cooling plate 11.

[0087] In some embodiments, the heat transfer bracket 13 may further include a support portion 133 disposed on the base 131 , and the support portion 133 is connected to the heat collecting element 121 .

[0088] The support portion 133 provides a mounting base for the heat collector 121. The support portion 133 comprises two intermediate rods and a connecting rod. One end of each intermediate rod is fixed to the base 121, and the other end is fixed to the connecting rod. The connecting rod is provided with fixing holes 1331 for fasteners such as screws. In other words, the heat sinks on both sides of the memory module heat transfer assembly 12 can be mounted on the support portion 133 of the heat transfer bracket 13 and secured with screws.

[0089] In addition, there may be two heat transfer brackets 13 , and the two heat transfer brackets 13 are symmetrically arranged about the CPU liquid cooling plate 11 .

[0090] In this way, the heat collecting element 121 can be supported from the opposite sides of the heat collecting element 121, and the installation and fixation of the heat collecting element 121 can be effectively achieved.

[0091] Some embodiments of the present application also provide a server, comprising a PCB (Printed Circuit Board) and the above-mentioned heat dissipation device; the PCB is provided with a CPU, a memory module, and a power supply module; the CPU liquid cooling plate of the heat dissipation device is connected to the PCB, the first surface of the CPU liquid cooling plate is in contact with the CPU, the heat collecting element of the heat dissipation device is in heat transfer contact with the memory module, and the heat transfer bracket of the heat dissipation device is connected to the PCB and in contact with the power supply module.

[0092] This allows the heat sink to dissipate heat for the server's CPU, memory modules, and power supply modules. The integrated design of the heat sink allows the heat generated by each heat-generating component to be concentrated and transferred to the CPU liquid cooling plate, minimizing server space. Furthermore, the heat from the main heat-generating components is concentrated at the CPU liquid cooling plate, reducing the number of liquid cooling pipes and simplifying the layout. Fewer pipe joints reduces the risk of leakage, improves reliability, and reduces the cost of the liquid cooling system.

[0093] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and that in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims

1. A heat dissipation device for dissipating heat for a heat generating component in a server, the heat dissipation device comprising: The CPU liquid cooling plate comprises a first surface and a second surface arranged opposite to each other, an inner channel for liquid to flow and take away the heat conducted to the first surface and the second surface, and an inlet and an outlet connected to the inner channel, wherein the first surface is used to contact the CPU; A memory module heat transfer assembly, comprising a heat collecting member for heat transfer contact with the memory module, a heat conducting member in contact with the second surface, and a heat transfer member for transferring heat from the heat collecting member to the heat conducting member; The heat transfer bracket is used to contact the power supply module, and the heat transfer bracket is also in contact with the CPU liquid cooling plate.

2. The heat dissipation device according to claim 1, wherein: The CPU liquid cooling plate is provided with a cavity, a plurality of fins parallel to each other are arranged in the cavity along a preset direction, and the inner channel is formed between two adjacent fins in the cavity.

3. The heat dissipation device according to claim 2, wherein: The cavity is provided with reinforcing ribs distributed in a direction perpendicular to the preset direction, the reinforcing ribs divide the cavity into a first part and a second part which are interconnected, the inlet is connected to the starting end of the inner channel located in the first part, and the outlet is connected to the terminal end of the inner channel located in the second part.

4. The heat dissipation device according to claim 2, wherein: A baffle plate perpendicular to the fin is arranged in the cavity, and the baffle plate separates the cavity into a first layer and a second layer which are interconnected. The inlet is connected to the starting end of the inner channel located in the first layer, and the outlet is connected to the terminal end of the inner channel located in the second layer.

5. The heat dissipation device according to claim 1, wherein: There are two heat collecting members, which are symmetrically arranged about the heat conducting member. The heat transfer member is tubular, and the two ends of the heat transfer member are buried in the two heat collecting members one by one, and the middle part of the heat transfer member is buried in the heat conducting member.

6. The heat dissipation device according to claim 5, wherein: There are a plurality of heat transfer elements, and the plurality of heat transfer elements are arranged at intervals from each other along a symmetric direction of the two heat collecting elements.

7. The heat dissipation device according to any one of claims 1 to 6, wherein: The memory bar heat transfer assembly further includes a first heat conducting plate and a second heat conducting plate connected to each other, wherein the first heat conducting plate and the second heat conducting plate are used to clamp the memory bar in the middle, and the heat collecting member is in contact with the first heat conducting plate and the second heat conducting plate.

8. The heat dissipation device according to claim 1, wherein: The heat transfer bracket includes a base and a heat dissipation portion bent and extended from the surface of the base. The base is provided with a heat conduction surface for contacting the power supply module, and the heat dissipation portion is in contact with the CPU liquid cooling plate.

9. The heat dissipation device according to claim 8, wherein: The heat transfer bracket also includes a support portion arranged on the base, and the support portion is connected to the heat collecting element.

10. A server, comprising: PCB board, equipped with CPU, memory module and power supply module ； The heat dissipation device according to any one of claims 1 to 9, wherein the CPU liquid cooling plate of the heat dissipation device is connected to the PCB board, the first surface of the CPU liquid cooling plate is in contact with the CPU, the heat collecting part of the heat dissipation device is in heat transfer contact with the memory bar, and the heat transfer bracket of the heat dissipation device is connected to the PCB board and in contact with the power supply module.

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