Power module with liquid-cooling radiator, motor controller, powertrain, and vehicle

Abstract

The present application provides a power module with a liquid-cooling radiator, a motor controller, a powertrain, and a vehicle. The power module comprises a substrate, a liquid-cooling radiator, and a sealing member; the substrate is used for fixing a power switching transistor; the liquid-cooling radiator comprises a groove structure, the groove structure comprises a bottom plate and a side plate, and the bottom plate and the substrate are spaced apart in the thickness direction of the substrate; the sealing member is used for fixing the peripheral side surface of the substrate and the end surface of the side plate facing away from the bottom plate, and the material of the sealing member is different from the material of the substrate. The side plate and the substrate are connected by means of the sealing member, so that the connection stability between the substrate and the side plate is improved, and the structural strength of the power module is enhanced. According to the present application, when the side plate, the sealing member, and the substrate are fixed, the installation area for installing other devices in the substrate is not occupied, so that more devices for cooling and heat dissipation are additionally arranged in the power module, and the contact area between the substrate and a cooling liquid is enlarged, thereby improving the cooling efficiency of the power module and the motor controller.

Description

Power modules with liquid cooling radiators, motor controllers, powertrains, and vehicles

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 31, 2023, with application number 202311128374.7 and application name “Power module, motor controller, powertrain and vehicle with liquid cooling radiator”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of motor controllers, and in particular to a power module with a liquid-cooled radiator, a motor controller, a powertrain, and a vehicle. Background Art

[0003] In a vehicle's powertrain, the motor controller converts direct current (DC) power from the battery pack into alternating current (AC) and transmits it to the motor. During operation, the power modules within the motor controller frequently switch between on and off states, causing the motor controller to generate significant heat.

[0004] To control the temperature rise of the power module, a heat sink is typically installed, through which coolant is passed. As motor power and battery pack voltage increase, the heat generated by the motor controller also gradually increases. However, the heat transfer performance of current heat sinks still needs to be improved, and they are unable to meet the heat dissipation requirements of the power module, which in turn has a negative impact on the operating efficiency and safety performance of the motor controller.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a power module, a motor controller, a powertrain, and a vehicle with a liquid-cooled radiator that can enhance heat exchange performance and structural strength.

[0007] In the first aspect, an embodiment of the present application provides a power module with a liquid-cooled radiator, the power module including a substrate, a liquid-cooled radiator and a seal, the substrate is used to fix at least one power switching tube, the liquid-cooled radiator includes a groove structure, the groove structure includes a bottom plate and a side plate, the bottom plate and the substrate are arranged at intervals along the thickness direction of the substrate, the seal is used to fix the peripheral side surface of the substrate and the end surface of the side plate facing away from the bottom plate, and the material of the seal is different from the material of the substrate.

[0008] In an embodiment of the present application, there is a gap between the substrate and the bottom plate in the groove structure along the thickness direction, and the groove structure is used to pass the cooling liquid. One of the functions of the substrate is to fix the power module, and the other function is to realize energy transfer from the power module to the liquid-cooled radiator.

[0009] In an embodiment of the present application, the seal is used to fix the substrate and the side plate. Specifically, the seal is located on the peripheral side of the substrate, the thickness direction of the substrate is perpendicular to the maximum surface of the substrate, the inner peripheral surface of the seal surrounds the thickness direction of the substrate, and the outer peripheral side surface of the substrate surrounds the thickness direction of the substrate. The inner peripheral surface of the seal is fixedly connected to the outer peripheral side surface of the substrate, so that the seal does not occupy the maximum surface of the substrate, and more area is reserved for fixing devices with heat dissipation function. Exemplarily, the device with heat dissipation function can be a heat dissipation tooth.

[0010] In an embodiment of the present application, the outer peripheral side surface of the substrate is connected to the inner peripheral surface of the seal so that the connection position between the two is on the side. For example, when a separation force perpendicular to the thickness direction of the substrate is applied to the local one of the seal on one side of the substrate, since the seal surrounds the outer peripheral side surface of the substrate, the local two of the seal located on the other side of the substrate is opposite to the local one, and the local two of the seal applies a reaction force to the other side of the substrate, making it difficult for the seal to detach from the substrate.

[0011] In an embodiment of the present application, along the thickness direction of the substrate, the surface of the seal facing the bottom plate is fixedly connected to the end surface of the side plate facing away from the bottom plate, thereby achieving the fixation of the side plate and the substrate, and improving the structural stability of the side plate and the substrate. If the power module does not include a seal, then part of the surface of the substrate facing the bottom plate needs to be used for fixed connection with the bottom plate. Exemplarily, the surfaces of the substrate and the side plate opposite to each other along the thickness direction of the substrate are provided with a fixed structure of matching shape. At this time, the fixed structure will occupy part of the surface of the substrate for installing other devices. When the largest surface of the substrate needs to be arranged with heat dissipation teeth, the fixed structure will result in the number of heat dissipation teeth on the substrate being limited, thereby having a negative impact on the cooling efficiency of the coolant on the power module. In comparison, the seal in the embodiment of the present application is located on the peripheral side of the substrate, and the area on the substrate for fixing the heat dissipation teeth is relatively larger, which is also conducive to expanding the contact area between the coolant and the substrate, and improving the heat exchange performance of the power module.

[0012] In the embodiment of the present application, the main functions played by the substrate and the seal are different. Among them, the substrate is used to realize heat transfer between the liquid-cooled radiator and the power module, so the material of the substrate needs to have good thermal conductivity. The seal is used to fix the substrate and the side panel, so the material of the seal needs to meet the requirement of high connection strength with the substrate and the side panel. In general, the material of the side panel in the liquid-cooled radiator is different from that of the substrate. When the side panel is directly in contact with the substrate, the connection strength between the side panel and the substrate is low. After the side panel is connected to the seal, it is connected to the outer peripheral side of the substrate through the seal, which can comprehensively improve the connection strength between the side panel, the seal and the substrate. In the embodiment of the present application, the material of the substrate and the material of the seal are different, which is conducive to the substrate and the seal to play their respective functions, taking into account the heat exchange performance and structural strength of the motor controller.

[0013] In the embodiments of this application, coolant is used to cool and dissipate heat from the power module, ensuring that the power module operates at an appropriate temperature. The base plate and side plates are fixedly connected by seals around the base plate, eliminating the need for additional fixing structures on the base plate's largest surface. This helps expand the installation area for the heat dissipation teeth and the contact area between the base plate and the coolant, further improving the coolant's heat dissipation efficiency and preventing safety accidents caused by overheating of the power module and motor controller.

[0014] In one embodiment, the bottom plate includes two through holes arranged at intervals, each through hole is used to connect the two sides of the bottom plate along the thickness direction of the substrate, the spacing distance between the two through holes is smaller than the length of the substrate along the arrangement direction of the two through holes, and the aperture of the two through holes is larger than the thickness of the side plate or the bottom plate.

[0015] In the embodiments of the present application, the coolant flows sequentially through the through-holes into the groove structure, and then exchanges heat with the power switch tube through the substrate. The distance between the two through-holes is less than the length of the substrate along the direction of the two through-holes, making it difficult for the coolant to leak out of the through-holes, which helps improve the utilization rate of the coolant. The aperture of the two through-holes is larger than the thickness of the side plate or bottom plate, which can increase the flow rate of the coolant, reduce the flow resistance of the coolant into the groove structure, and reduce the loss of the coolant along the transmission path.

[0016] In one embodiment, the substrate includes two surfaces disposed opposite to each other along the thickness direction of the substrate. One of the two surfaces faces away from the base plate and is used to secure at least one power switch. The other surface faces toward the base plate and is used to secure a plurality of heat dissipation tines.

[0017] In an embodiment of the present application, when the power switch tube is in an operating state, the power switch tube frequently switches between the on and off states, resulting in a large amount of heat generated by the power module. A plurality of heat dissipation teeth are located within the groove structure and are located on both sides of the substrate along the thickness direction with the power switch tube. The gaps between the plurality of heat dissipation teeth constitute a water channel for the circulation of coolant. When coolant is introduced into the groove structure, the heat dissipation teeth are used to enhance the turbulence of the coolant and increase the heat dissipation area. The heat generated by the power switch tube is transferred to the heat dissipation teeth through the substrate. The coolant located between the plurality of heat dissipation teeth removes the heat from the power switch tube, reducing the temperature of the power switch tube in the steady state of operation, thereby achieving temperature control of the motor controller.

[0018] In one embodiment, the difference in melting temperature between the side panel material and the sealing material is less than 50°C, or the sealing material is the same as the side panel material. In the embodiment of the present application, the side panel and the sealing material need to be fixedly connected. The melting temperature of the side panel material and the sealing material is lower than that of the sealing material, or the sealing material is the same as the side panel material. Both of these are conducive to forming an integrated structure between the side panel and the sealing material, thereby improving the connection strength and sealing effect between the two.

[0019] In one embodiment, the seal is made of a polymer material, which is injection-molded onto the peripheral side of the substrate to form the seal. In this embodiment of the present application, the seal and the peripheral side of the substrate are integrally formed by injection molding, which is beneficial to strengthening the connection reliability between the seal and the substrate.

[0020] In one embodiment, the side panels are made of a polymer material, which is injection-molded onto the surface of the seal facing the bottom plate to form the side panels. In the embodiment of the present application, both the side panels and the seal are made of a polymer material, which helps to enhance the stability of the connection between the side panels and the seal. The side panels and the seal can be made of the same polymer material or different polymer materials.

[0021] In one embodiment, a portion of one of the substrate and the sealant is embedded in the other of the substrate and the sealant in a direction perpendicular to the thickness of the substrate. In this embodiment of the present application, a direction perpendicular to the thickness of the substrate is parallel to the largest surface of the substrate, and a portion of the substrate is embedded in the sealant, or a portion of the sealant is embedded in the substrate. The substrate and the sealant cooperate with each other to achieve a tighter connection between the two.

[0022] In one embodiment, the substrate includes one of the boss and the groove, one of the boss and the groove surrounds the outer peripheral side of the substrate, the seal includes the other of the boss and the groove, the other of the boss and the groove surrounds the inner peripheral side of the seal, and the protruding direction of the boss and the recessed direction of the groove are the same and are both perpendicular to the thickness direction of the substrate.

[0023] In the embodiments of the present application, the outer peripheral side of the substrate and the inner peripheral side of the seal are fixedly connected by a concave-convex fit, which helps to strengthen the connection stability between the substrate and the seal. The boss and groove structure are simple, and the protrusion direction of the boss and the depression direction of the groove are the same and perpendicular to the thickness direction of the substrate, which helps to reduce the difficulty of processing.

[0024] In one embodiment, the substrate includes a boss, which protrudes from the peripheral side surface of the substrate, and the protruding direction of the boss is perpendicular to the thickness direction of the substrate. The seal covers the boss, and the seal is connected to the surface and peripheral side surface of the boss, wherein, along the direction perpendicular to the thickness direction of the substrate, the projection of the seal covers the projection of the boss.

[0025] In the embodiment of the present application, the seal is used to accommodate the boss, and the boss of the substrate is embedded in the seal. In conjunction with the injection molding process, it is conducive to achieving a stable connection between the substrate and the seal. In the embodiment of the present application, the boss is used to increase the connection area between the substrate and the seal, and improve the stability of the connection between the substrate and the seal.

[0026] In one embodiment, the boss is part of the substrate, and the boss is an integrally formed part of the substrate. This embodiment of the application is conducive to ensuring the structural reliability of the boss and the substrate as a whole.

[0027] In one embodiment, along the thickness direction of the substrate, the ratio of the thickness of the boss to the thickness of the substrate is greater than or equal to 0.1 and less than 1. The embodiment of the present application is conducive to reducing the material used for the substrate while ensuring the structural strength of the substrate.

[0028] In one embodiment, the substrate further comprises a substrate body, the boss is connected to the peripheral side surface of the substrate body, and the direction perpendicular to the thickness direction of the substrate comprises the length direction of the substrate and the width direction of the substrate, and along the length direction of the substrate, the ratio of the length of the boss to the length of the substrate body is less than 1 / 30. Along the width direction of the substrate, the ratio of the width of the boss to the width of the substrate body is less than 1 / 30, wherein the length direction of the substrate is perpendicular to the width direction of the substrate. The embodiment of the present application is conducive to reducing the material used for the substrate while meeting the structural strength of the substrate, and can also reduce the overall volume of the motor controller.

[0029] In one embodiment, the substrate includes a groove, the groove is recessed from the peripheral side surface of the substrate, the recessed direction of the groove is perpendicular to the thickness direction of the substrate, the groove is used to accommodate a portion of the seal, the seal is connected to the groove wall surface and the peripheral side surface of the groove, wherein, along the direction perpendicular to the thickness direction of the substrate, the projection of the seal covers the projection of the groove. In an embodiment of the present application, the peripheral side surface of the substrate is connected to the groove wall surface of the groove, the opening of the groove faces the seal, the groove is used to accommodate a portion of the seal, and the seal is embedded in the groove of the substrate, which is conducive to achieving a stable connection between the substrate and the seal in conjunction with the injection molding process. In an embodiment of the present application, the groove is used to increase the connection area between the substrate and the seal, thereby improving the connection stability between the substrate and the seal.

[0030] In one embodiment, along the thickness direction of the substrate, the ratio of the thickness of the groove to the thickness of the substrate is greater than or equal to 0.1 and less than 1. The embodiment of the present application is conducive to reducing the material used for the substrate while ensuring the structural strength of the substrate.

[0031] In one embodiment, along the concave direction of the groove, the ratio of the length of the groove to the length of the substrate is less than 1 / 30. In the embodiment of the present application, the ratio of the length of the groove to the substrate is within the range of less than 1 / 30, which is beneficial for reducing the material used for the substrate while ensuring the structural strength of the substrate, and can also reduce the overall volume of the power module and motor controller.

[0032] In one embodiment, the substrate includes a boss and a groove, the boss protrudes from the peripheral side of the substrate, the groove is recessed from the peripheral side of the substrate, the protrusion direction of the boss is opposite to the recessed direction of the groove, part of the seal covers the boss, and part of the seal is located in the groove, wherein, along the direction perpendicular to the thickness direction of the substrate, the projection of the seal covers the projection of the boss and the groove. In an embodiment of the present application, the shape of the seal matches the shape of the boss and the groove, so that the seal and the substrate can be tightly connected. Among them, the boss and the groove can be located on the same peripheral side of the substrate, or on different peripheral sides of the substrate, and can be flexibly arranged according to actual needs.

[0033] In one embodiment, the length of the side plate along the first direction is greater than the length of the boss or the groove, the first direction is perpendicular to the thickness direction of the substrate, the length of the side plate along the first direction is greater than the thickness of at least one of the substrate or the bottom plate, and the length of the seal along the first direction is greater than the thickness of the substrate.

[0034] In the embodiments of the present application, the first direction may be the length or width of the largest surface of the substrate. If the length of the boss or groove in the first direction is greater than the length of the side plate in the first direction, to ensure the structural strength of the seal, the length of the seal in the first direction needs to be greater than the length of the side plate. This reduces the contact area between the seal and the side plate, potentially weakening the connection strength between the seal and the side plate.

[0035] In the embodiment of the present application, the length of the side panels along the first direction is greater than the thickness of at least one of the base plate or the bottom plate, and the length of the seal along the first direction is greater than the thickness of the base plate. This helps to enhance the structural strength of the side panels and the seal, thereby improving the connection stability between the base plate and the liquid-cooled radiator. The thickness of the base plate and the thickness of the bottom plate refer to the dimensions of the base plate and the bottom plate in the thickness direction.

[0036] In one embodiment, the peripheral side surface of the substrate, the surface of the boss or the groove wall surface of the groove include nanopores, and the nanopores are used to accommodate part of the sealing member. Nanopores refer to holes with a pore size of the nanometer order. In an embodiment of the present application, the peripheral side surface of the substrate, the surface of the boss and the groove wall surface have nanopores and are used to be fixedly connected with the sealing member. The sealing member is a polymer material, and the sealing member and the substrate can be fixed by nano injection molding. First, the peripheral side surface of the substrate, the surface of the boss and the groove wall surface are nano-processed to obtain nanopores, and then part of the sealing member is injection-molded into the nanopores, so that the sealing member and the substrate are injection-molded together, thereby increasing the bonding area between the substrate and the polymer material, thereby improving the connection strength between the substrate and the sealing member and achieving a dense bond.

[0037] In one embodiment, the power module further includes a plurality of heat dissipation teeth, and the minimum distance between the heat dissipation teeth and the outer peripheral side surface of the substrate is less than the sum of the tooth width of the heat dissipation teeth and the distance between every two heat dissipation teeth.

[0038] In an embodiment of the present application, the heat dissipation teeth and the power switch tube are respectively fixed to two opposite surfaces of the substrate in the thickness direction. The heat dissipation teeth are used to increase the turbulence of the coolant, increase the heat dissipation area, and improve the cooling efficiency. The more heat dissipation teeth there are, the higher the cooling efficiency. A plurality of heat dissipation teeth are arranged at intervals on the surface of the substrate. A plurality of heat dissipation teeth need to occupy a larger area of ​​the substrate. Since the mounting area of ​​the substrate is not occupied when the substrate is fixed to the side plate, the minimum distance between the heat dissipation teeth and the seal can be less than the sum of the column width of the heat dissipation teeth and the spacing between each two heat dissipation teeth, thereby making full use of the mounting area on the substrate, increasing the number of heat dissipation teeth, and enabling the operating temperature of the power module to be controlled within an appropriate range.

[0039] In one embodiment, the power module includes multiple substrates arranged in an intermittent manner. Along the arrangement direction of the multiple substrates, the seal between each two adjacent substrates is used to secure the seal to the two adjacent substrates and to secure the seal to the two side panels on either side of the two adjacent substrates. In this embodiment of the present application, the power module includes multiple substrates, which increases the number of heat dissipation teeth and power modules connected to both sides of the substrates, thereby increasing the area covered by the heat dissipation teeth and allowing more power modules to be cooled and dissipated.

[0040] In one embodiment, the power module includes a substrate and multiple power modules, the multiple power modules are arranged in an interval, and the seal is connected to the peripheral side surface of the substrate and the surface of the side plate facing the substrate along the thickness direction. In this embodiment of the application, multiple power modules are fixed on a single substrate, simplifying the process and improving production efficiency.

[0041] In one embodiment, the power module further includes a packaging structure for packaging at least one power switch tube, a substrate and a sealant, wherein the other surface of the substrate and the surface of the sealant facing away from the power switch tube are both exposed to the packaging structure.

[0042] In an embodiment of the present application, the packaging structure and the power switch are fixed to the same side of the substrate, protecting the power switch from mechanical damage, chemical corrosion, and other external factors. The packaging structure and the seal are connected, with the other surface of the substrate and the surface of the seal facing away from the power switch exposed to the packaging structure. This allows the projection of the packaging structure along the thickness of the substrate and the projection of the seal along the thickness of the substrate to partially overlap, and the substrate and power module are connected and fixed along the thickness direction.

[0043] In one embodiment, the power module also includes a partition, a top frame and multiple diverter columns. The partition, top frame and bottom plate enclose a diverter cavity. Multiple diverter columns are located in the diverter cavity. The partition and the top frame are integrally formed and fixedly connected to the side plates. Along the thickness direction of the substrate, the two ends of the top frame and the diverter column are respectively fixedly connected to the bottom plate and the partition. The end of the heat dissipation tooth facing away from the substrate is fixedly connected to the partition. The bottom plate, diverter column, partition, heat dissipation tooth and substrate are arranged in sequence. The distribution density of the diverter column is less than the distribution density of the heat dissipation tooth. The partition and the top frame are made of polymer material.

[0044] In an embodiment of the present application, the coolant entering the power module is first dispersed by the diverter column, and then flows to the space between the multiple heat dissipation teeth in the groove structure. The diverter column can pre-divert the coolant flowing to the heat dissipation teeth, thereby reducing the flow resistance. The distribution density of the diverter column is less than that of the heat dissipation teeth, so that the loss of coolant between the diverter columns is small. In addition, the end of the heat dissipation teeth away from the substrate is connected to the partition, which is conducive to reducing the tooth top bypass of the heat dissipation teeth and improving the heat exchange performance of the power module. The partition and the top frame are both made of polymer materials, which is conducive to improving the connection strength between the two.

[0045] In a second aspect, embodiments of the present application provide a motor controller comprising a coolant channel and a power module according to any one of the embodiments of the first aspect. The coolant channel is connected to two through-holes in a base plate. In this embodiment, coolant flows sequentially through the coolant channel and through-holes into the groove structure, and then cools and dissipates heat from the power switching tube through the base plate and heat dissipation teeth, ensuring that the power module and motor controller operate within a suitable temperature range.

[0046] In a third aspect, embodiments of the present application provide a powertrain comprising a motor and a motor controller as described in the second aspect, the motor controller being configured to drive the motor. In embodiments of the present application, applying the motor controller described in any one of the first aspects to the powertrain improves the heat dissipation and structural strength of the motor controller, thereby enhancing the efficiency and safety of the powertrain.

[0047] In a fourth aspect, an embodiment of the present application provides a vehicle comprising a vehicle body, a battery pack, and the powertrain described in the third aspect. The battery pack and powertrain are mounted on the vehicle body, and a power module in a motor controller is configured to convert the direct current (DC) power output by the battery pack into alternating current (AC) power, which is then supplied to the motor to drive the vehicle. In this embodiment of the present application, the powertrain described in the second aspect is applied to the vehicle, thereby improving overall vehicle performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0049] FIG1 is a schematic structural diagram of a vehicle provided in one embodiment of the present application;

[0050] FIG2 is a schematic structural diagram of a powertrain according to an embodiment of the present application;

[0051] FIG3 is a schematic diagram of the structure of a motor controller provided in one embodiment of the present application;

[0052] FIG4 is a schematic structural diagram of a power module in a motor controller provided in an embodiment of the present application;

[0053] FIG5 is a schematic diagram of a partial structure of a power module in a motor controller provided in an embodiment of the present application;

[0054] FIG6 is a top view of a power module in a motor controller provided in one embodiment of the present application;

[0055] FIG7 is a schematic structural diagram of a power module in a motor controller provided in an embodiment of the present application;

[0056] FIG8 is a schematic diagram of a partial structure of a power module in a motor controller provided in an embodiment of the present application;

[0057] FIG9 is a top view of a power module in a motor controller provided in one embodiment of the present application;

[0058] FIG10 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0059] FIG11 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0060] FIG12 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0061] FIG13 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0062] FIG14 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0063] FIG15 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0064] FIG16 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0065] FIG17 is a schematic structural diagram of a power module in a motor controller provided in one embodiment of the present application;

[0066] FIG18 is a schematic structural diagram of a power module in a motor controller provided in an embodiment of the present application. DETAILED DESCRIPTION

[0067] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0068] In this article, directional terms such as "upper" and "lower" are defined relative to the orientation of the structure schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the structure.

[0069] In addition, references to "embodiments" or "implementations" herein mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of such phrases in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0070] For ease of understanding, the following first explains and describes the relevant technical terms involved in the embodiments of this application.

[0071] Parallel: The parallelism defined in the embodiments of the present application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism, which allows for situations where the absolute parallelism is not caused by factors such as assembly tolerance, design tolerance, and the influence of structural flatness.

[0072] Vertical: The vertical defined in the embodiments of the present application is not limited to an absolute vertical intersection relationship (an angle of 90 degrees). It allows for non-absolute vertical intersection relationships caused by factors such as assembly tolerance, design tolerance, and the influence of structural flatness. It allows for errors in a small angle range. For example, the assembly error range of 80 to 100 degrees can be understood as a vertical relationship.

[0073] Existing power modules suffer from low heat exchange efficiency. The present invention provides a power module with a liquid-cooled heat sink. The power module includes a base plate, a liquid-cooled heat sink, and a seal. The base plate is used to secure at least one power switching transistor, which performs AC-DC conversion. The liquid-cooled heat sink is used to pass coolant. The liquid-cooled heat sink includes a groove structure comprising a bottom plate and side plates. The groove structure is used to accommodate components such as heat dissipation gears. The bottom plate and base plate are spaced apart along the thickness of the base plate. The seal is used to securely connect the peripheral side surface of the base plate and the end surface of the side plate facing away from the bottom plate, leaving more area on the base plate facing the bottom plate for securing other components, such as heat dissipation gears. The seal is made of a different material from the base plate. Connecting the side plate and base plate through the seal improves the connection stability between the base plate and the side plate, thereby enhancing the structural strength of the power module. In the present invention, when the side plate, seal, and base plate are secured, the mounting area of ​​the base plate that would otherwise be used for other components is not occupied. This facilitates the addition of more cooling and heat dissipation components to the power module while also increasing the contact area between the base plate and the coolant, thereby improving the cooling efficiency of the power module and motor controller.

[0074] The power module provided in the embodiment of the present application can be applied to a motor controller, and the motor controller including the power module in the embodiment of the present application can be applied to a powertrain and a vehicle.

[0075] Please refer to Figure 1, which is a schematic structural diagram of a vehicle 1 provided in one embodiment of the present application. In one embodiment, vehicle 1 includes a vehicle body 20, a battery pack 30, and a powertrain 10. The battery pack 30 and powertrain 10 are mounted on vehicle body 20. Powertrain 10 is used to convert electrical energy output by battery pack 30 into mechanical energy to drive vehicle 1. Vehicle 1 refers to a wheeled device driven or towed by a power unit.

[0076] Please refer to Figure 2, which is a schematic diagram of the structure of a powertrain 10 provided in one embodiment of the present application. In one embodiment, the powertrain 10 includes a motor controller 100, a motor 200, and a reducer 300, wherein the motor controller 100 is electrically connected to the battery pack 30 and the motor 200, respectively. The motor controller 100 receives the direct current output by the battery pack 30, and converts the direct current into alternating current and transmits it to the motor 200. The motor 200 is fixedly connected to the reducer 300. The motor 200 converts electrical energy into mechanical energy and further transmits the mechanical energy to the reducer 300. In one embodiment, the vehicle 1 also includes wheels 40. The reducer 300 is fixedly connected to the wheels 40, and the reducer 300 is used to drive the wheels 40 to rotate.

[0077] Please refer to Figure 3, which is a schematic diagram of the structure of a motor controller 100 provided in one embodiment of the present application. In one embodiment, the motor controller 100 includes a housing 102, a circuit board 103, and a power module 101. The housing 102 is used to accommodate the circuit board 103 and the power module 101. The circuit board 103 is electrically connected to the power module 101. The housing 102 includes a DC input interface 1021 and an AC output interface 1022. The power module 101 is electrically connected between the DC input interface 1021 and the AC output interface 1022. The motor controller 100 is electrically connected to the battery pack 30 through the DC input interface 1021 (not shown) and to the motor 200 through the AC output interface 1022 (not shown). The power module 160 in the power module 101 is used to convert AC power into DC power.

[0078] In one embodiment, the motor controller 100 further includes a bus capacitor connected between the DC input interface 1021 and the power module 101. In one embodiment, the motor controller 100 further includes a coolant channel for passing cooling water into the water channel in the power module 101. It should be noted that FIG3 schematically illustrates the power module 101 and the circuit board 103 in the motor controller 100, and does not represent the actual positional relationship between the circuit board 103 and the power module 101. The specific arrangement can be determined as needed.

[0079] In motor controllers, power modules are used to convert DC power into AC power. During operation, these modules generate heat, which significantly impacts their operating efficiency. To maintain a suitable temperature, coolant is introduced into the modules. However, current cooling solutions struggle to keep pace with the heat generated.

[0080] In the embodiment of the present application, by improving the power module, the heat dissipation effect of the power module can be enhanced, ensuring that the power module operates within an appropriate temperature range.

[0081] The power module provided in the embodiments of the present application will be described in detail below.

[0082] Please refer to Figure 4, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the power module 101 includes a substrate 110, a liquid-cooled heat sink, and a seal 140. The substrate 110 is used to fix at least one power switch tube 161. The liquid-cooled heat sink 104 includes a groove structure 105, which includes a bottom plate 130 and a side plate 120. The bottom plate 130 and the substrate 110 are arranged in a spaced relationship along the thickness direction A of the substrate 110. The seal 140 is used to securely connect the peripheral side surface of the substrate 110 and the end surface of the side plate 120 facing away from the bottom plate. The material of the seal 140 is different from that of the substrate 110.

[0083] In an embodiment of the present application, there is a gap between the substrate 110 and the bottom plate 130 in the groove structure 105 along the thickness direction A. The substrate 110 and the groove structure 105 are jointly arranged to form a receiving cavity S1, and the receiving cavity S1 is used to pass the cooling liquid. Among them, one of the functions of the substrate 110 is to fix the power module 160, and the other function is to realize energy transfer from the power module 160 to the liquid-cooled radiator 104.

[0084] In an embodiment of the present application, the seal 140 is used to fix the substrate 110 and the side plate 120. Specifically, the seal 140 is located on the peripheral side of the substrate 110, the thickness direction A of the substrate 110 is perpendicular to the maximum surface of the substrate 110, the inner peripheral surface of the seal 140 surrounds the thickness direction A of the substrate 110, and the outer peripheral side surface of the substrate 110 surrounds the thickness direction A of the substrate 110. The inner peripheral surface of the seal 140 is fixedly connected to the outer peripheral side surface of the substrate 110, so that the seal 140 does not occupy the maximum surface of the substrate 110, and more area is reserved for fixing devices with heat dissipation function. For example, the device with heat dissipation function can be a heat dissipation tooth.

[0085] In an embodiment of the present application, the outer peripheral side surface of the substrate 110 is connected to the inner peripheral surface of the sealing member 140, so that the connection position between the two is on the side. For example, when a separation force perpendicular to the thickness direction of the substrate 110 is applied to a part 1 of the sealing member 140 on one side of the substrate 110, since the sealing member 140 surrounds the outer peripheral side surface of the substrate 110, the part 2 of the sealing member 140 located on the other side of the substrate 110 is opposite to the part 1, and the part 2 of the sealing member 140 applies a reaction force to the other side of the substrate 110, so that the sealing member 140 is not easily detached from the substrate 110.

[0086] In the embodiment of the present application, along the thickness direction A of the substrate 110, the surface of the seal 140 facing the bottom plate 130 is fixedly connected to the end surface of the side plate 120 facing away from the bottom plate 130, thereby achieving fixation between the side plate 120 and the substrate 110 and improving the structural stability of the side plate 120 and the substrate 110. If the power module 101 does not include the seal 140, then a portion of the surface of the substrate 110 facing the bottom plate 130 needs to be fixedly connected to the bottom plate 130. Exemplarily, the opposing surfaces of the substrate 110 and the side plate 120 along the thickness direction A of the substrate 110 are provided with a fixing structure of matching shape. In this case, the fixing structure will occupy a portion of the surface of the substrate 110 used for mounting other components. When the largest surface of the substrate 110 needs to be arranged with heat dissipation teeth, the fixing structure will result in a limited number of heat dissipation teeth on the substrate 110, thereby negatively affecting the cooling efficiency of the coolant on the power module 160. In comparison, the seal 140 in the embodiment of the present application is located on the peripheral side of the substrate 110, and the area on the substrate 110 for fixing the heat dissipation teeth is relatively larger, which is also beneficial to expanding the contact area between the coolant and the substrate, thereby improving the heat exchange performance of the power module 101.

[0087] In the embodiment of the present application, the main functions of the substrate 110 and the seal 140 are different. The substrate 110 is used to achieve heat transfer between the liquid-cooled radiator 104 and the power module 160. Therefore, the material of the substrate 110 needs to have good thermal conductivity. For example, the substrate 110 is made of metal. The seal 140 is used to fix the substrate 110 and the side plate 120. Therefore, the material of the seal 140 needs to meet the requirements of high connection strength with the substrate 110 and the side plate 120. For example, the material of the seal 140 is the same as that of the side plate 120, which is conducive to enhancing the thermal compression connection strength between the seal 140 and the side plate 120. Typically, the material of the side plate 120 in the liquid-cooled radiator 104 is different from that of the base plate 110. When the side plate 120 and the base plate 110 are directly connected, the connection strength between the side plate 120 and the base plate 110 is low. However, after the side plate 120 is connected to the seal 140 and then to the outer peripheral side of the base plate 110 via the seal 140, the connection strength among the side plate 120, the seal 140, and the base plate 110 can be comprehensively improved. In the embodiment of the present application, the material of the base plate 110 and the seal 140 are different, which helps the base plate 110 and the seal 140 perform their respective functions while taking into account the heat exchange performance and structural strength of the motor controller 100.

[0088] In the embodiment of the present application, coolant is used to cool and dissipate heat from the power module 101, ensuring that the power module 101 operates at an appropriate temperature. The base plate 110 and the side plate 120 are fixedly connected via a seal 140 around the base plate 110, eliminating the need for additional fixing structures on the largest surface of the base plate 110. This helps expand the installation area for the heat dissipation teeth and the contact area between the base plate 110 and the coolant, further improving the heat dissipation efficiency of the coolant and preventing safety accidents caused by overheating of the power module 101 and the motor controller 100.

[0089] It should be noted that in the embodiments of the present application, the coolant is non-conductive pure water. In other embodiments, the coolant may be any one of fluoride, methyl silicone oil, silicone oil, and mineral oil. Those skilled in the art may select the type of cooling medium based on actual needs, and the embodiments of the present application do not limit this.

[0090] In one embodiment, the bottom plate 130 includes two through holes (not shown) arranged at intervals, each through hole being used to connect the two sides of the bottom plate 130 along the thickness direction A of the substrate 110, the spacing distance between the two through holes is less than the length of the substrate 110 along the arrangement direction of the two through holes, and the aperture of the two through holes is greater than the thickness of the side plate 120 or the bottom plate 130.

[0091] In the embodiment of the present application, the through hole is used to connect the coolant channel of the motor controller 100. The coolant flows into the groove structure 105 through the coolant channel and the through hole in sequence, and then exchanges heat with the power switch tube 161 through the substrate 110. The distance between the two through holes is less than the length of the substrate 110 along the direction in which the two through holes are arranged, making it difficult for the coolant to leak out of the through holes, which is beneficial to improving the utilization rate of the coolant. The aperture of the two through holes is larger than the thickness of the side plate 120 or the bottom plate 130, which can increase the flow rate of the coolant, reduce the flow resistance of the coolant flowing into the groove structure 105, and reduce the loss of the coolant in the transmission path.

[0092] Continuing with FIG. 4 , in one embodiment, the substrate 110 includes two surfaces disposed opposite to each other along a thickness direction A of the substrate 110 . One of the surfaces faces away from the base plate 130 and is used to secure at least one power switch 161 . The other surface faces the base plate 130 and is used to secure a plurality of heat dissipation tines 150 .

[0093] Among them, the power switch tube 161 refers to a combination of power electronic devices that can realize the power conversion function, and the power electronic devices include at least one of an insulated gate bipolar transistor (IGBT), a silicon carbide power tube, a silicon tube, a metal-oxide semiconductor field-effect transistor (MOSFET) and a diode.

[0094] In an embodiment of the present application, one or more power switch tubes 161 constitute a power module 160. When the power module 160 is in operation, the power switch tube 161 frequently switches between the on and off states, causing the power module 101 to generate a large amount of heat. A plurality of heat dissipation teeth 150 are located in the receiving cavity S1 and are located on both sides of the substrate 110 along the thickness direction A with the power module 160. The gaps between the plurality of heat dissipation teeth 150 constitute a water channel for the circulation of the coolant. When the coolant is introduced into the receiving cavity S1, the heat dissipation teeth 150 are used to enhance the turbulence of the coolant and increase the heat dissipation area. The heat generated by the power module 160 is transferred to the heat dissipation teeth 150 through the substrate 110. The coolant located between the plurality of heat dissipation teeth 150 takes away the heat of the power module 160, reduces the temperature of the power module 160 in the steady state of operation, and realizes the temperature control of the motor controller 100.

[0095] In one embodiment, the difference between the melting temperature of the material of the side panel 120 and the melting temperature of the material of the seal 140 is less than 50°C, or the material of the seal 140 is the same as the material of the side panel 120. In the embodiment of the present application, the side panel 120 and the seal 140 need to be fixedly connected, and the melting temperature of the material of the side panel 120 and the material of the seal 140 is lower, or the material of the seal 140 is the same as the material of the side panel 120, which is beneficial for the side panel 120 and the seal 140 to form an integrated structure, thereby improving the connection strength and sealing effect between the two. Among them, the method of forming an integrated structure can be a welding method without solder paste or other third material, such as hot compression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-high frequency welding.

[0096] In one embodiment, the seal 140 is made of a polymer material, which is injection-molded onto the peripheral side surface 111 of the substrate 110 to form the seal 140. In the embodiment of the present application, the seal 140 and the peripheral side surface 111 of the substrate 110 are integrally formed by injection molding, which helps to strengthen the connection reliability between the seal 140 and the substrate 110.

[0097] In one embodiment, the side panels 120 are made of a polymer material, which is injection-molded onto the surface of the seal 140 facing the bottom plate 130 to form the side panels 120. In this embodiment of the present application, both the side panels 120 and the seal 140 are made of a polymer material, which helps to enhance the stability of the connection between the side panels 120 and the seal 140. The side panels 120 and the seal 140 can be made of the same polymer material or different polymer materials. In one embodiment, the side panels 120 and the seal 140 can be fixedly connected by laser welding or gluing.

[0098] In one embodiment, the polymer material of the side panel 120 or the seal 140 can withstand a temperature greater than or equal to 200 degrees Celsius, so that when the power module 160 generates heat during operation, the side panel 120 will not melt and separate from the seal 140, thereby ensuring the reliability of the connection between the side panel 120 and the seal 140. In one embodiment, the pressure that the side panel 120 or the seal 140 can withstand is greater than or equal to 10 MPa, and it is not easy to chemically react with the coolant. Exemplarily, the polymer material in the embodiment of the present application may be polyphthalamide (PPA), polyphenylene sulfone resin (PPSU), polyetheretherketone (PEEK), etc. Exemplary materials of the substrate 110 are aluminum or copper, etc. Exemplarily, the polymer material in the embodiment of the present application may also be other polymer materials that can achieve nano-level high-strength connection with the substrate 110.

[0099] Continuing with FIG. 4 , in one embodiment, along a direction perpendicular to the thickness direction A of the substrate 110, a portion of one of the substrate 110 and the sealing member 140 is embedded in the other of the substrate 110 and the sealing member 140. In this embodiment of the present application, the direction perpendicular to the thickness direction A of the substrate 110 is parallel to the largest surface of the substrate 110, and a portion of the substrate 110 is embedded in the sealing member 140, or a portion of the sealing member 140 is embedded in the substrate 110. The substrate 110 and the sealing member 140 cooperate with each other, making the connection between the two more compact.

[0100] In one embodiment, a direction perpendicular to the thickness direction A of the substrate 110 includes the left-right direction in FIG. 4 and the direction perpendicular to the paper in FIG. 4 . Exemplarily, a direction perpendicular to the thickness direction A of the substrate 110 includes the length direction and the width direction of the substrate 110. In one embodiment, along the length direction of the substrate 110, a portion of one of the substrate 110 and the sealing member 140 is embedded in the other of the substrate 110 and the sealing member 140. In one embodiment, along the width direction of the substrate 110, a portion of one of the substrate 110 and the sealing member 140 is embedded in the other of the substrate 110 and the sealing member 140.

[0101] In one embodiment, the substrate 110 includes a boss 112 and a groove 114, one of which surrounds the outer peripheral side of the substrate 110. The seal 140 includes the other of the boss 112 and the groove 114, the other of which surrounds the inner peripheral side of the seal 140. The protrusion direction of the boss 112 and the depression direction of the groove 114 are the same and are both perpendicular to the thickness direction A of the substrate 110. In this embodiment of the present application, the outer peripheral side of the substrate 110 and the inner peripheral side of the seal 140 are fixedly connected through a concave-convex fit, which helps to enhance the stability of the connection between the substrate 110 and the seal 140. The protrusion direction of the boss 112 and the depression direction of the groove 114 are the same and are both perpendicular to the thickness direction A of the substrate 110, which helps to reduce the difficulty of processing.

[0102] The following specifically describes an embodiment in which the substrate 110 includes a boss 112. Continuing with FIG4 , in one embodiment, the substrate 110 includes a boss 112, which protrudes from a peripheral side surface 111 of the substrate 110. The boss 112 protrudes in a direction perpendicular to the thickness direction A of the substrate 110. The seal 140 covers the boss 112. The seal 140 is connected to the surface of the boss 112 and the peripheral side surface 111. The projection of the seal 140 covers the projection of the boss 112 in a direction perpendicular to the thickness direction A of the substrate 110.

[0103] In the embodiment of the present application, the seal 140 is used to accommodate the boss 112. The boss 112 of the substrate 110 is embedded in the seal 140. In conjunction with the injection molding process, this facilitates a stable connection between the substrate 110 and the seal 140. In the embodiment of the present application, the boss 112 is used to increase the connection area between the substrate 110 and the seal 140, thereby improving the stability of the connection between the substrate 110 and the seal 140.

[0104] It should be noted that, in the embodiment of the present application, the projection along the direction perpendicular to the thickness direction A of the substrate 110 refers to the projection along the direction perpendicular to the thickness direction A of the substrate 110 onto a projection plane parallel to the thickness direction A of the substrate 110. The projection plane of the projection along the direction perpendicular to the thickness direction A of the substrate 110 is perpendicular to the thickness direction A of the substrate 110.

[0105] In the embodiment of the present application, the bosses 112 surround the peripheral side surfaces of the substrate 110. Exemplarily, the bosses 112 are fixed to the sides of the substrate 110 that are oppositely arranged along the length direction, and the bosses 112 are fixed to the sides of the substrate 110 that are oppositely arranged along the width direction.

[0106] In one embodiment, the boss 112 is a part of the substrate 110 . The boss 112 is an integrally formed part of the substrate 110 , thereby ensuring the structural reliability of the boss 112 and the substrate 110 as a whole.

[0107] Please refer to Figure 5, which is a schematic diagram of a partial structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, along the thickness direction A of the substrate 110, the ratio of the thickness of the boss 112 to the thickness of the substrate 110 is greater than or equal to 0.1 and less than 1. In this embodiment of the present application, the thickness of the substrate 110 is denoted as H1, and the thickness of the boss 112 is denoted as H2. The ratio of H2 to H1 is within the range of 0.1 to 1, which is beneficial for reducing the material used for the substrate 110 while ensuring the structural strength of the substrate 110.

[0108] Please refer to FIG6 , which is a top view of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the substrate 110 further includes a substrate body 113 , and the boss 112 is connected to the peripheral side surface of the substrate body 113 . The direction perpendicular to the thickness direction A of the substrate 110 includes the length direction B of the substrate 110 and the width direction C of the substrate 110 . Along the length direction B of the substrate 110 , the ratio of the length of the boss 112 to the length of the substrate body 113 is less than 1 / 30. Along the width direction C of the substrate 110 , the ratio of the width of the boss 112 to the width of the substrate body 113 is less than 1 / 30, wherein the length direction B of the substrate 110 and the width direction C of the substrate 110 are perpendicular. In the embodiment of the present application, the length of the substrate body is recorded as L1, the length of the boss is recorded as L2, the width of the substrate body is recorded as W1, and the width of the boss is recorded as W2. The ratio of L2 to L1 and the ratio of W2 to W1 are less than 1 / 30, which is beneficial to reducing the material used in the substrate 110 while meeting the structural strength of the substrate 110, and at the same time can also reduce the overall volume of the motor controller 100.

[0109] The following specifically describes an embodiment in which the substrate 110 includes a groove 114. Referring to FIG. 7 , FIG. 7 is a schematic structural diagram of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the substrate 110 includes a groove 114, which is recessed from a peripheral side surface 111 of the substrate 110. The recessed direction of the groove 114 is perpendicular to the thickness direction A of the substrate 110. The groove 114 is used to accommodate a portion of a sealing member 140, which is connected to the groove wall surface and the peripheral side surface 111 of the groove 114. The projection of the sealing member 140 overlaps the projection of the groove 114 along a direction perpendicular to the thickness direction A of the substrate 110. In the embodiment of the present application, the peripheral side surface 111 of the substrate 110 is connected to the groove wall surface of the groove 114. The opening of the groove 114 faces the seal 140. The groove 114 is used to accommodate a portion of the seal 140. The seal 140 is embedded in the groove 114 of the substrate 110. In conjunction with the injection molding process, this facilitates a stable connection between the substrate 110 and the seal 140. In the embodiment of the present application, the groove 114 is used to increase the connection area between the substrate 110 and the seal 140, thereby improving the stability of the connection between the substrate 110 and the seal 140.

[0110] In the embodiment of the present application, the groove 114 surrounds the peripheral side of the substrate 110. Exemplarily, the grooves 114 are formed on the sides of the substrate 110 that are opposite to each other along the length direction, and the grooves 114 are formed on the sides of the substrate 110 that are opposite to each other along the width direction.

[0111] Please refer to FIG8 , which is a schematic diagram of a partial structure of a power module 101 in a motor controller 100 provided in an embodiment of the present application. In one embodiment, along the thickness direction A of the substrate 110 , the ratio of the thickness of the groove 114 to the thickness of the substrate 110 is greater than or equal to 0.1 and less than 1. In the embodiment of the present application, the groove wall surface of the groove 114 includes two sidewalls arranged opposite to each other along the thickness direction A of the substrate 110 . The thickness of the groove 114 refers to the distance between the two sidewalls along the thickness direction A of the substrate 110 . The thickness of the groove 114 is denoted as H3, and the thickness of the substrate 110 is denoted as H1. The ratio of H3 to H1 is in the range of 0.1 to 1, which is beneficial for reducing the material used for the substrate 110 while ensuring the structural strength of the substrate 110 .

[0112] Please refer to Figure 9, which is a top view of the power module 101 in the motor controller 100 according to one embodiment of the present application. In one embodiment, along the recessed direction of the recess 114, the ratio of the length of the recess 114 to the length of the substrate 110 is less than 1 / 30. In this embodiment of the present application, a ratio of the length of the recess 114 to the length of the substrate 110 within a range of less than 1 / 30 helps reduce the material used in the substrate 110 while ensuring the structural strength of the substrate 110, while also reducing the overall volume of the power module 101 and the motor controller 100. In one embodiment, when the recess 114 is recessed along the longitudinal direction B of the substrate 110, the ratio L4:L3 of the length of the recess 114 to the length of the substrate 110 along the longitudinal direction B is less than 1 / 30. When the recess 114 is recessed along the width direction C of the substrate 110, the ratio W4:W3 of the width of the recess 114 to the width of the substrate 110 along the width direction C is less than 1 / 30.

[0113] In one embodiment, the substrate 110 includes a boss 112 and a groove 114, wherein the boss 112 protrudes from the peripheral side surface 111 of the substrate 110, and the groove 114 is recessed from the peripheral side surface 111 of the substrate 110. The protrusion direction of the boss 112 is opposite to the recess direction of the groove 114. A portion of the seal 140 covers the boss 112, and a portion of the seal 140 is located in the groove 114. In the direction perpendicular to the thickness direction A of the substrate 110, the projection of the seal 140 covers the projection of the boss 112 and the projection of the groove 114. In the embodiment of the present application, the shape of the seal 140 matches that of the boss 112 and the groove 114, so that the seal 140 and the substrate 110 can be tightly connected. The boss 112 and the groove 114 can be located on the same peripheral side surface 111 of the substrate 110, or on different peripheral side surfaces 111 of the substrate 110, and can be flexibly arranged according to actual needs.

[0114] Exemplarily, the sides of the substrate 110 oppositely arranged along the width direction include bosses 112, and the sides of the substrate 110 oppositely arranged along the length direction include grooves 114. Exemplarily, the sides of the substrate 110 oppositely arranged along the length direction include bosses 112, and the sides of the substrate 110 oppositely arranged along the width direction include grooves 114.

[0115] Exemplarily, the sides of the substrate 110 arranged opposite to each other along the width direction include both bosses 112 and grooves 114 , which are arranged along the thickness direction A to increase the connection area between the sides of the substrate 110 and the seal 140 , thereby improving the structural strength of the substrate 110 and the seal 140 .

[0116] In one embodiment, the boss 112 or the groove 114 may be discontinuous along the direction surrounding the peripheral side surface of the substrate 110. For example, the boss 112 includes a plurality of sub-bosses arranged at intervals, and the groove 114 includes a plurality of sub-grooves arranged at intervals, with the sub-bosses located within the sub-grooves, thereby achieving connection between the sealing member 140 and the peripheral side surface of the substrate 110.

[0117] Please continue to refer to Figures 4 and 7. In one embodiment, the length of the side plate 120 along the first direction D is greater than the length of the boss 112 or the groove 114. The first direction D is perpendicular to the thickness direction A of the substrate 110. The length of the side plate 120 along the first direction D is greater than the thickness of at least one of the substrate 110 or the bottom plate 130. The length of the sealing member 140 along the first direction D is greater than the thickness of the substrate 110.

[0118] In the embodiment of the present application, the first direction D may be the length direction B or the width direction C of the largest surface of the substrate 110. If the length of the boss 112 or the groove 114 in the first direction D is greater than the length of the side plate 120 in the first direction D, to ensure the structural strength of the seal 140, the length of the seal 140 along the first direction D needs to be greater than the length of the side plate 120. This will reduce the contact area between the seal 140 and the side plate 120, which may weaken the connection strength between the seal 140 and the side plate 120.

[0119] In the embodiment of the present application, the length of the side plate 120 along the first direction D is greater than the thickness of at least one of the substrate 110 or the bottom plate 130, and the length of the seal 140 along the first direction D is greater than the thickness of the substrate 110. This helps to enhance the structural strength of the side plate 120 and the seal 140, thereby improving the connection stability between the substrate 110 and the liquid-cooled radiator 104. The thickness of the substrate 110 and the thickness of the bottom plate 130 refer to the dimensions of the substrate 110 and the bottom plate 130 in the thickness direction A.

[0120] In one embodiment, the peripheral side surface of the substrate 110, the surface of the boss 112, or the groove wall surface of the groove 114 includes nano-micropores (not shown), and the nano-micropores are used to accommodate part of the sealing member 140. Nano-micropores refer to holes with a pore size of the nanometer order. In the embodiment of the present application, the peripheral side surface 111 of the substrate 110, the surface of the boss 112, and the groove wall surface of the groove 114 have nano-micropores and are used to be fixedly connected to the sealing member 140. The sealing member 140 is a polymer material, and the sealing member 140 and the substrate 110 can be fixed by nano-injection molding. Exemplarily, the peripheral side surface 111 of the substrate 110, the surface of the boss 112 and the wall surface of the groove 114 are first nano-processed to obtain nano-pores, and then part of the seal 140 is injection-molded into the nano-pores, so that the seal 140 and the substrate 110 are injection-molded together, increasing the bonding area between the substrate 110 and the polymer material, thereby improving the connection strength between the substrate 110 and the seal 140 and achieving a dense bond.

[0121] Exemplarily, the T treatment technology or the E treatment technology can be used to achieve nano-micropores on the surface of the substrate 110. The T treatment technology includes the following steps in sequence: water washing, alkali washing, water washing, acid washing, water washing, 8 T treatments, water washing and drying. Among them, the alkali washing is to immerse the substrate in 20 to 100 g / L alkali solution for 30 to 60 seconds to remove impurities such as surface grease. The acid washing is to immerse the substrate in 100 to 200 g / L acid solution for 40 to 90 seconds to form preliminary holes. The 8 T treatments are to place the substrate in 8 T liquid treatment tanks and soak them for about 3 minutes in succession, so that the holes obtained by the previous acid treatment are further formed into nano-micropores. The water washing is to clean the liquid remaining on the surface of the substrate in the previous step with pure water. The E treatment technology includes the following steps in sequence: water washing, alkali washing, water washing, acid washing, water washing. Pre-oxidation, water washing, 4 E treatments, water washing and drying. The E treatment differs from the T treatment in that the E treatment includes a pre-oxidation step and replaces eight T treatments with four E treatments. The pre-oxidation step involves oxidizing the substrate using sulfuric acid (H2SO4 concentration of 150 to 180 g / L, Al ion concentration of 5 to 15 g / L) for 5 to 10 minutes. The four E treatments involve immersing the substrate in four E solution treatment tanks for 0.5 to 2 minutes.

[0122] Please continue to refer to Figure 4. In one embodiment, the projection of the side plate 120 along the thickness direction A of the substrate 110 partially overlaps with the projection of the boss 112 and the projection of the seal 140. In the embodiment of the present application, the side plate 120, the substrate 110 and the seal 140 are arranged in a regular manner, which makes it easy for the seal 140 to fix the side plate 120 and the substrate 110. The side plate 120, the substrate 110 and the seal 140 overlap along the thickness direction A of the substrate 110. When the side plate 120 and the seal 140 are separated, a force along the thickness direction A needs to be applied to the side plate 120. The side plate 120 generates a force along the thickness direction A on the seal 140, and the portion where the boss 112 overlaps with the seal 140 along the thickness direction A has a reaction force on the seal 140, so that the seal 140 and the substrate 110 are structurally stable.

[0123] In one embodiment, the projection of the side plate 120 along the thickness direction A of the substrate 110 completely overlaps with the projection of the seal 140 , so that the connection area between the side plate 120 and the seal 140 is larger, ensuring connection stability.

[0124] Please continue to refer to Figures 4, 6 and 9. In one embodiment, the power module 101 further includes a plurality of heat dissipation teeth 150, and the minimum distance between the heat dissipation teeth 150 and the outer peripheral side surface of the substrate 110 is less than the sum of the tooth width of the heat dissipation teeth 150 and the distance between every two heat dissipation teeth 150.

[0125] In the embodiment of the present application, the heat dissipation teeth 150 and the power switch tube 161 are respectively fixed to two opposite surfaces of the substrate 110 along the thickness direction A. The heat dissipation teeth 150 are used to increase the turbulence of the coolant, increase the heat dissipation area, and improve the cooling efficiency. The more heat dissipation teeth 150 there are, the higher the cooling efficiency. A plurality of heat dissipation teeth 150 are arranged at intervals on the surface of the substrate 110. The plurality of heat dissipation teeth 150 need to occupy a larger area of ​​the substrate 110. Since the substrate 110 and the side plate 120 do not occupy the installation area of ​​the substrate 110 when they are fixed, the minimum distance between the heat dissipation teeth 150 and the seal 140 can be less than the sum of the column width of the heat dissipation teeth 150 and the distance between each two heat dissipation teeth 150, thereby making full use of the installation area on the substrate 110, increasing the number of heat dissipation teeth 150, and enabling the operating temperature of the power module 101 to be controlled within an appropriate range. Among them, the outermost heat dissipation teeth 150 enclose a heat dissipation tooth area M (as shown in the dotted area in Figures 6 and 9), and the minimum distance between the heat dissipation teeth 150 and the outer peripheral side surface of the substrate 110 refers to half of the difference between the size value of the substrate 110 and the size value of the heat dissipation tooth area M along the length direction B or width direction C of the substrate 110.

[0126] Please refer to Figure 10, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in an embodiment of the present application. In one embodiment, the power module 101 includes a plurality of substrates 110, which are arranged at intervals. Along the arrangement direction of the plurality of substrates 110, the seal 140 between each two adjacent substrates 110 is used to fix to the two adjacent substrates 110 and to fix to the two side plates 120 on one side of the two adjacent substrates 110. In the embodiment of the present application, the power module 101 includes multiple substrates 110, so that the number of heat dissipation teeth 150 and power modules connected to both sides of the substrates 110 is increased, which is conducive to increasing the area covered by the heat dissipation teeth 150, so that more power modules can be cooled and dissipated.

[0127] Please refer to Figure 11, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the seals 140 between each two adjacent substrates 110 are connected to each other and are commonly used to fix to the two side plates 120 on one side of the two adjacent substrates 110. In one embodiment, the seals 140 between each two adjacent substrates 110 are integrally injection-molded to improve the structural reliability between the two adjacent substrates 110.

[0128] Please refer to Figure 12, which is a schematic diagram of the structure of a power module 101 in a motor controller 100 provided in an embodiment of the present application. In one embodiment, the power module 101 includes a substrate 110 and multiple power modules 160. The multiple power modules 160 are arranged in an alternating pattern. The seal 140 is connected to the peripheral side surface of the substrate 110 and the surface of the side plate 120 facing the substrate 110 along the thickness direction A. In this embodiment of the present application, multiple power modules 160 are fixed to a single substrate 110, simplifying the process and improving production efficiency.

[0129] Please refer to Figure 13, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the bottom plate 130 and the side plate 120 are integrally formed. This embodiment of the present application helps to enhance the structural stability of the bottom plate 130 and the side plate 120, thereby improving the connection strength between the bottom plate 130 and the base plate 110.

[0130] Please refer to Figure 14, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the seal 140 and the side panel 120 are integrally formed. This embodiment of the present application helps to enhance the structural stability of the seal 140 and the side panel 120, thereby improving the connection strength between the side panel 120 and the base plate 110. For example, the seal 140 and the side panel 120 can be integrated by laser welding, gluing, or other methods.

[0131] Please refer to Figure 15, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the seal 140, side plate 120, and bottom plate 130 are integrally formed. The integral formation of the seal 140, side plate 120, and bottom plate 130 in the embodiment of the present application helps to enhance the structural strength of the power module 101 and the motor controller 100.

[0132] Please refer to Figure 16, which is a structural schematic diagram of the power module 101 in the motor controller 100 provided in an embodiment of the present application. In one embodiment, the power module 101 also includes a packaging structure 162, which is used to encapsulate at least one power switch tube 161, a substrate 110 and a seal 140. The other surface of the substrate 110 and the surface of the seal 140 facing away from the power switch tube 161 are both exposed to the packaging structure 162.

[0133] In an embodiment of the present application, the packaging structure 162 and the power switch 161 are fixed to the same side of the substrate 110. The packaging structure 162 can protect the power switch 161 from mechanical damage, chemical corrosion, and other external factors. The packaging structure 162 is connected to the seal 140. The other surface of the substrate 110 and the surface of the seal 140 facing away from the power switch 161 are both exposed to the packaging structure 162, so that the projection of the packaging structure 162 in the thickness direction A of the substrate 110 and the projection of the seal 140 in the thickness direction A of the substrate 110 partially overlap. The substrate 110 and the power module 160 are connected and fixed along the thickness direction A. In one embodiment, the substrate 110 and the seal 140 are first fixed by nano-injection molding, and then the substrate 110 and the power switch 161 are fixed by welding or other methods. Finally, the packaging structure 162 is formed by injection molding to connect the packaging structure 162 and the seal 140, thereby achieving the overall packaging of the substrate 110, the seal 140, and the power switch 161. Furthermore, before fixing the substrate 110 and the power switch tube 161 , the side plate 120 and the bottom plate 130 may be integrally injection-molded around the substrate 110 before proceeding with subsequent steps.

[0134] Continuing with FIG4 , in one embodiment, the packaging structure 162 is not connected to the substrate 110, and the projection of the packaging structure 162 along the thickness direction A of the substrate 110 does not overlap with the projection of the seal 140. In the embodiment of the present application, the substrate 110 and the seal 140 are first fixed by nano-injection molding, and the power module 160 pre-encapsulates the power switch tube 161 with the packaging structure 162. Finally, the substrate 110 with the seal 140 fixed thereto and the power switch tube 161 with the packaging structure 162 fixed thereto are welded. Furthermore, before fixing the substrate 110 and the power switch tube 161, the substrate 110 can be processed and fixed to the side plate 120 and the bottom plate 130 before proceeding to the subsequent steps.

[0135] It should be noted that the processes of the substrate and the power module in the power module in the embodiment of the present application are not limited to those described above, and can be specifically designed according to needs.

[0136] Continuing with FIG. 16 , in one embodiment, the power module 160 further includes a metal-clad substrate 163. The metal-clad substrate 163 includes an insulating substrate 1631 and metal layers 1632 located on either side of the insulating substrate 1631. The two metal layers 1632 are insulated by the insulating substrate 1631. The insulating substrate 1631 can be any one of an Al2O3 ceramic substrate, an AlN ceramic substrate, and a SiN ceramic substrate. The metal layer 1632 (e.g., copper foil) is directly bonded to the insulating substrate 1631 at a high temperature. In one embodiment, the metal-clad substrate 163 can be a direct bond copper (DBC) substrate, an active metal brazed copper (AMB) substrate (e.g., Al2O3-AMB, Si3N4-AMB, or AlN-AMB), or an insulated metal substrate (IMS).

[0137] Please refer to Figure 17, which is a structural diagram of the power module 101 in the motor controller 100 provided in an embodiment of the present application. In one embodiment, the power module 101 further includes a partition 170, a top frame 190 and a plurality of diverter columns 180. The partition 170, the top frame 190 and the bottom plate 130 enclose a diverter cavity S2. The plurality of diverter columns 180 are located in the diverter cavity S2. The partition 170 is integrally formed with the top frame and is fixedly connected to the side plate 120. In the thickness direction A of the substrate 110, the two ends of the top frame 190 and the diverter column 180 are fixedly connected to the bottom plate 130 and the partition 170 respectively, and the end of the heat dissipation tooth 150 facing away from the substrate 110 is fixedly connected to the partition 170. The bottom plate 130, the diverter column 180, the partition 170, the heat dissipation tooth 150 and the substrate 110 are arranged in sequence. The distribution density of the diverter column 180 is less than the distribution density of the heat dissipation tooth 150. The partition 170 and the top frame 190 are made of polymer materials.

[0138] In the embodiment of the present application, the coolant introduced into the power module 101 is first dispersed through the diverter column 180, and then flows to the space between the multiple heat dissipation teeth 150 in the receiving chamber S1. The diverter column 180 can divert the coolant flowing to the heat dissipation teeth 150 in advance, thereby reducing the flow resistance. The distribution density of the diverter column 180 is less than the distribution density of the heat dissipation teeth 150, so that the loss of coolant between the diverter columns 180 is small. In addition, the end of the heat dissipation tooth 150 away from the substrate 110 is connected to the partition 170, which is conducive to reducing the tooth top bypass of the heat dissipation tooth 150 and improving the heat exchange performance of the power module 101. The partition 170 and the top frame 190 are both made of polymer materials, which is conducive to improving the connection strength between the two.

[0139] In one embodiment, as shown in Figures 10, 11 and 12, when the power module 101 includes multiple substrates 110, the diverter cavity S2 and the receiving cavity S1 are stacked along the thickness direction A, and the cooling liquid is transported to the receiving cavity S1 on one side of the multiple substrates 110 through the diverter cavity S2. The receiving cavity S1 on one side of the multiple substrates 110 can be a parallel flow channel or a series flow channel, and the diverter cavity S2 can be designed according to the parallel flow channel or the series flow.

[0140] Please refer to Figure 18, which is a schematic diagram of the structure of the power module 101 in the motor controller 100 provided in one embodiment of the present application. In one embodiment, the top frame 190 is integrally formed with the bottom plate 130. In this embodiment of the present application, since the top frame 190 is fixed to the partition 170, and the diverter column 180 is fixed to the partition 170 and the bottom plate 130, the top frame 190 and the bottom plate 130 are integrally formed. This helps to improve the structural strength of the partition 170 and the diverter column 180, ensuring that the diverter column 180 can stably divert the coolant.

[0141] In one embodiment, the power module 101 includes two liquid cooling radiators, which are distributed on both sides of the power switch tube. The structure of the liquid cooling radiator is the same as that of the liquid cooling radiator in the previous embodiment.

[0142] The above is a detailed introduction to the motor controller, powertrain and vehicle provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there will be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A power module with a liquid cooling radiator, characterized in that: The power module comprises: A substrate, the substrate being used to fix at least one power switch tube; A liquid-cooled radiator, the liquid-cooled radiator comprising a groove structure, the groove structure comprising a bottom plate and a side plate, the bottom plate and the base plate being arranged at intervals along a thickness direction of the base plate; A sealing member is used for fixedly connecting the peripheral side surface of the substrate and the end surface of the side plate facing away from the bottom plate, and the material of the sealing member is different from the material of the substrate.

2. The power module according to claim 1, characterized in that: The bottom plate includes two through holes arranged at intervals, each of the through holes is used to connect the two sides of the bottom plate along the thickness direction of the substrate, the interval distance between the two through holes is smaller than the length of the substrate along the arrangement direction of the two through holes, and the aperture of the two through holes is larger than the thickness of the side plate or the bottom plate.

3. The power module according to claim 1, characterized in that: The substrate comprises two surfaces, which are arranged opposite to each other along the thickness direction of the substrate, wherein: One of the surfaces is away from the bottom plate, and the one surface is used to fix the at least one power switch tube; The other surface faces the bottom plate, and the other surface is used for fixing a plurality of heat dissipation teeth.

4. The power module according to claim 1, characterized in that: The difference between the melting temperature of the material of the side plate and the melting temperature of the material of the sealing member is less than 50° C., or the material of the sealing member is the same as the material of the side plate.

5. The power module according to claim 1, characterized in that: The sealing member is made of a polymer material, and the polymer material is injection-molded on the peripheral side surface of the substrate to form the sealing member.

6. The power module according to claim 1, characterized in that: The side plate is made of a polymer material, and the polymer material is injection-molded onto the surface of the sealing component facing the bottom plate to form the side plate.

7. The power module according to any one of claims 1 to 6, characterized in that: A portion of one of the substrate and the sealing member is embedded in the other of the substrate and the sealing member in a direction perpendicular to a thickness direction of the substrate.

8. The power module according to claim 7, characterized in that: The substrate includes one of a boss and a groove, wherein the one of the boss and the groove surrounds the outer peripheral side surface of the substrate, and the seal includes the other of the boss and the groove, wherein the other of the boss and the groove surrounds the inner peripheral side surface of the seal, and the protruding direction of the boss and the recessed direction of the groove are the same and are both perpendicular to the thickness direction of the substrate.

9. The power module according to claim 8, characterized in that: The length of the side plate along the first direction is greater than the length of the boss or the groove, the first direction is perpendicular to the thickness direction of the substrate, the length of the side plate along the first direction is greater than the thickness of at least one of the substrate or the bottom plate, and the length of the seal along the first direction is greater than the thickness of the substrate.

10. The power module according to claim 8, characterized in that: The peripheral side surface of the substrate, the surface of the boss, or the groove wall surface of the groove comprises nano-micropores, and the nano-micropores are used to accommodate part of the sealing member.

11. The power module according to claim 3, characterized in that: The power module further includes a plurality of heat dissipation teeth, and the minimum distance between the heat dissipation teeth and the outer peripheral side surface of the substrate is less than the sum of the tooth width of the heat dissipation teeth and the distance between every two heat dissipation teeth.

12. The power module according to claim 3, characterized in that: The power module further comprises a packaging structure, which is used to package the at least one power switch tube, the substrate and the seal, wherein the other surface of the substrate and the surface of the seal facing away from the power switch tube are both exposed to the packaging structure.

13. A motor controller, characterized in that: The motor controller comprises a cooling liquid channel and a power module as claimed in any one of claims 1 to 12, wherein the cooling liquid channel is connected to two through holes in the base plate.

14. A powertrain, characterized in that: The powertrain includes a motor and a motor controller as claimed in claim 13, wherein the motor controller is used to drive the motor.

15. A vehicle, characterized in that: It includes a vehicle body, a battery pack and a powertrain as described in claim 14, wherein the battery pack and the powertrain are mounted on the vehicle body, and the power module in the motor controller is used to convert the direct current output by the battery pack into alternating current, and provide the alternating current to the motor to drive the vehicle.

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