Method for manufacturing glass panel unit

Abstract

To provide a manufacturing method with which when, during manufacture of a glass panel unit, a first glass plate and a second glass plate are joined by irradiating a heat-meltable peripheral wall with infrared light in a state in which clips are installed on an assembly having the two glass plates and the peripheral wall, it is possible to inhibit the occurrence of a defect in joining. In the manufacturing method, an assembly 100 is readied. A plurality of clips 1 are installed on the assembly 100. The method includes irradiating the peripheral wall 410 of the assembly 100 with infrared light to join a first glass plate 200 and a second glass plate 300. The assembly 100 is sandwiched between a first member 4A and a second member 4B of the clip 1. An elastic mechanism 5 of the clip 1 applies an elastic force to the first member 4A and the second member 4B. A contact part 6 comes into contact with the assembly 100 only at a position on the opposite side from the outer periphery of the assembly 100 with respect to the peripheral wall 410. A connecting part 8 has a transmission part 81 having infrared transmissivity.

Description

Glass panel unit manufacturing method

[0001] The present disclosure relates to a method for manufacturing a glass panel unit. More particularly, the present disclosure relates to a method for manufacturing a glass panel unit including two glass panels and a peripheral wall interposed between the glass panels.

[0002] Patent Document 1 discloses a vacuum insulation member including a first substrate, a second substrate disposed opposite the first substrate with a gap therebetween, and a sealing portion provided on the periphery of an internal space formed between the first substrate and the second substrate, the sealing portion including a glass phase and a metal phase, the metal phase being formed closer to the internal space than the glass phase. Patent Document 1 discloses a method for manufacturing the vacuum insulation member, in which the first substrate and the second substrate secured with heat-resistant clips are placed in a vacuum heating furnace connected to a vacuum pump and heated, thereby hermetically sealing the periphery with a sealing material. Patent Document 1 discloses the use of an infrared lamp for heating.

[0003] JP 2018-058709 A

[0004] The object of the present disclosure is to provide a method for manufacturing a glass panel unit that can suppress poor bonding when, during the manufacture of the glass panel unit, clips are installed on an assembly comprising two glass plates and a heat-fusible peripheral wall, and the two glass plates are bonded by irradiating the peripheral wall with infrared rays.

[0005] A method for manufacturing a glass panel unit according to one aspect of the present disclosure includes preparing an assembly including a first glass plate, a second glass plate facing the first glass plate, and a peripheral wall between the first and second glass plates, the peripheral wall including a heat-fusible sealing material arranged in a frame shape along the outer peripheries of the first and second glass plates, the first glass plate having a first outer surface opposite to the second glass plate, and the second glass plate having a second outer surface opposite to the first glass plate. The manufacturing method also includes installing a plurality of clips on the outer periphery of the assembly so that each of the clips sandwiches the assembly. The manufacturing method also includes irradiating the peripheral wall with infrared rays to join the first glass plate and the second glass plate by the peripheral wall. Each of the clips includes a first member, a second member, and an elastic mechanism. In an installed state in which the clip is installed on the assembly, the assembly is sandwiched between the first member and the second member with the first member contacting the first outer surface and the second member contacting the second outer surface, respectively. The elastic mechanism applies an elastic force to the first member and the second member to sandwich the assembly. Each of the first member and the second member has a base portion connected to the elastic mechanism and an operating portion connected to the base, and the operating portion has a contact portion that contacts the assembly in the installed state and a connecting portion that does not contact the assembly in the installed state and is interposed between the contact portion and the base. In one or both of the operating portion of the first member and the operating portion of the second member, the contact portion contacts the assembly only at a position on the opposite side of the peripheral wall from the outer periphery of the assembly, and the connecting portion has a transparent portion that is infrared transparent.

[0006] FIG. 1 is a plan view of a first member of a clip according to one embodiment. FIG. 2 is a side view of the first member of the clip according to the embodiment. FIG. 3 is a plan view of a second member of the clip according to the embodiment. FIG. 4 is a side view of the second member of the clip according to the embodiment. FIG. 5A is a side view of the clip according to the embodiment. FIG. 5B is a partially cutaway side view of the clip according to the embodiment. FIG. 6 is a plan view of an assembled glass panel unit according to the embodiment. FIG. 7 is a cross-sectional view taken along line A-A in FIG. 6. FIG. 8 is an explanatory diagram of an installation step in a manufacturing method according to the embodiment. FIG. 9 is an explanatory diagram of an installation step in the manufacturing method according to the embodiment. FIG. 10 is an explanatory diagram of a joining step in the manufacturing method according to the embodiment. FIG. 11 is a plan view of a glass panel unit according to the embodiment. FIG. 12 is a cross-sectional view taken along line B-B in FIG. 11. FIG. 13 is a side view of a clip according to a modified example. FIG. 14 is a perspective view of a clip according to a modified example. FIG. 15 is a cross-sectional view of a main part according to a modified example. FIG. 16 is a cross-sectional view of a main part according to a modified example. Fig. 17 is an explanatory diagram of the bonding step in the manufacturing method according to the modified example of the same, Fig. 18 is an explanatory diagram of the bonding step in the manufacturing method according to one modified example, and Fig. 19 is an explanatory diagram of the bonding step in the manufacturing method according to one modified example.

[0007] The following embodiments and modifications will be described with reference to the drawings. Note that the following embodiments and modifications are merely a portion of various embodiments of the present disclosure. Furthermore, the following embodiments and modifications can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Furthermore, the configurations of the modifications can be combined as appropriate.

[0008] The drawings referred to below are all schematic drawings, and the dimensional ratios of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0009] 1. Embodiment A manufacturing method of a glass panel unit 10 according to an embodiment (hereinafter simply referred to as a manufacturing method) includes preparing an assembly 100 (hereinafter also referred to as an assembly process). The assembly 100 includes a first glass plate 200, a second glass plate 300 facing the first glass plate 200, and a peripheral wall 410 between the first glass plate 200 and the second glass plate 300, the peripheral wall 410 including a heat-fusible sealing material arranged in a frame shape along the outer peripheries of the first glass plate 200 and the second glass plate 300. The first glass plate 200 has a first outer surface 2A opposite to the second glass plate 300 side, and the second glass plate 300 has a second outer surface 2B opposite to the first glass plate 200.

[0010] The manufacturing method also includes placing a plurality of clips 1 on the outer periphery of the assembly 100 so that each clip 1 sandwiches the assembly 100 (hereinafter also referred to as the placing step).

[0011] The manufacturing method also includes irradiating the peripheral wall 410 with infrared rays to bond the first glass plate 200 and the second glass plate 300 together at the peripheral wall 410 (hereinafter also referred to as a bonding step).

[0012] Each clip 1 includes a first member 4A, a second member 4B, and an elastic mechanism 5. When the clip 1 is installed on the assembly 100 (hereinafter also referred to as the installed state), the first member 4A contacts the first outer surface 2A, and the second member 4B contacts the second outer surface 2B, sandwiching the assembly 100 between the first member 4A and the second member 4B. The elastic mechanism 5 applies an elastic force to the first member 4A and the second member 4B to sandwich the assembly 100. Each of the first member 4A and the second member 4B has a base 7 connected to the elastic mechanism 5 and an action portion 9 connected to the base 7. The action portion 9 has a contact portion 6 that contacts the assembly 100 in the installed state and a connecting portion 8 that does not contact the assembly 100 in the installed state and is interposed between the contact portion 6 and the base 7. In one or both of the action portion 9 of the first member 4A and the action portion 9 of the second member 4B, the contact portion 6 contacts the assembly 100 only at a position opposite the outer periphery of the assembly 100 relative to the peripheral wall 410, and the connecting portion 8 has a transparent portion 81 that is infrared transparent.

[0013] That is, one or both of the contact portion 6 (hereinafter also referred to as contact portion 6A) in the acting portion 9 (hereinafter also referred to as acting portion 9A) of the first member 4A and the contact portion 6 (hereinafter also referred to as contact portion 6B) in the acting portion 9 (hereinafter also referred to as acting portion 9B) of the second member 4B contact the assembly 100 only at a position on the opposite side of the outer periphery of the assembly 100 with respect to the peripheral wall 410. When the contact portion 6A in the acting portion 9A of the first member 4A contacts the assembly 100 only at a position on the opposite side of the outer periphery of the assembly 100 with respect to the peripheral wall 410, the connecting portion 8 (hereinafter also referred to as connecting portion 8A) of the first member 4A has a transmitting portion 81 (hereinafter also referred to as transmitting portion 81B) that is infrared transparent. When the contact portion 6B of the action portion 9B of the second member 4B contacts the assembly 100 only at a position opposite the outer periphery of the assembly 100 with respect to the peripheral wall 410, the connecting portion 8 of the second member 4B (hereinafter also referred to as the connecting portion 8B) has a transparent portion 81 (hereinafter also referred to as the transparent portion 81B) that is infrared transparent. However, when the contact portion 6A of the action portion 9A of the first member 4A contacts the assembly 100 only at a position opposite the outer periphery of the assembly 100 with respect to the peripheral wall 410 and the contact portion 6B of the action portion 9B of the second member 4B contacts the assembly 100 only at a position opposite the outer periphery of the assembly 100 with respect to the peripheral wall 410, only one of the connecting portion 8A of the first member 4A and the connecting portion 8B of the second member 4B may have the transparent portion 81, or both may have the transparent portion 81.

[0014] According to the manufacturing method of the embodiment, by installing the clip 1 on the assembly 100, the relative positional relationship between the first glass plate 200, the second glass plate 300, and the peripheral wall 410 is easily maintained. Therefore, misalignment of the relative positions of the components constituting the glass panel unit 10 is unlikely to occur. Furthermore, when infrared rays are irradiated onto the peripheral wall 410, the contact portions 6 of one or both of the first and second members 4A and 4B of the clip 1 contact the assembly 100 only at positions on the opposite side of the peripheral wall 410 from the outer periphery of the assembly 100. The connecting portions 8 do not contact the assembly 100, and the connecting portions 8 have the transparent portions 81. Therefore, the clip 1 is unlikely to obstruct the irradiation of infrared rays onto the peripheral wall 410. Therefore, the first and second glass plates 200 and 300 can be efficiently joined. Furthermore, the occurrence of a portion between the first and second glass plates 200 and 300 that is not sufficiently blocked by the peripheral wall 410 is suppressed. This can prevent defects from occurring in the glass panel unit 10, such as a decrease in strength and failure to maintain the internal space 500 (described later) at a vacuum or reduced pressure.

[0015] The manufacturing method of the embodiment will be described in more detail.

[0016] First, the structure of the clip 1 will be described with reference to FIGS. 1 to 5B.

[0017] As described above, the clip 1 comprises a first member 4A, a second member 4B, and an elastic mechanism 5, and when the clip 1 is installed on the assembly 100, the assembly 100 is sandwiched between the first member 4A and the second member 4B.

[0018] In the following description of clip 1, the side of first member 4A relative to second member 4B is defined as the top, and the side of second member 4B relative to first member 4A is defined as the bottom. Furthermore, in the installed state, the side of assembly 100 relative to the position of elastic mechanism 5 is defined as the front, and the side of elastic mechanism 5 relative to the position of assembly 100 is defined as the rear. Furthermore, left and right as seen by an observer when it is assumed that up, down, front, and back coincide with up, down, front, and back in the description of clip 1 above. Note that these definitions of up, down, front, back, left, and right are merely for convenience and do not define the posture, etc., of clip 1 when in use.

[0019] As shown in Figures 1 and 2, the first member 4A has a base 7 (hereinafter also referred to as base 7A) connected to the elastic mechanism 5, and an action part 9 (hereinafter also referred to as action part 9A) located forward of the base 7A and connected to the base 7A.

[0020] The base portion 7A is in the form of a flat plate having a thickness in the vertical direction.

[0021] The first member 4A also has two connection portions 21A extending downward from the left and right edges of the base portion 7A. The base portion 7A is connected to the elastic mechanism 5 via the connection portions 21A. Each of the connection portions 21A has a support hole 22A penetrating in the left-right direction. The two connection portions 21A face each other in the left-right direction, and the two support holes 22A also face each other in the left-right direction. As will be described later, the support holes 22A support the elastic mechanism 5.

[0022] The base 7A has an operating portion 72A behind the position of the support hole 22A, that is, on the opposite side of the acting portion 9A with respect to the position of the elastic mechanism 5.

[0023] The action portion 9A has a first portion 91A extending forward from the front end of the base portion 7A, a second portion 92A extending from the front end of the first portion 91A obliquely downward toward the front with respect to the first portion 91A, and a third portion 93A extending from the front end of the second portion 92A obliquely upward toward the front with respect to the second portion 92A. Each of the first portion 91A, the second portion 92A, and the third portion 93A is flat.

[0024] The angular portion connecting the second portion 92A and the third portion 93A is the contact portion 6A. The combination of the first portion 91A and the second portion 92A forms the connecting portion 8A interposed between the contact portion 6A and the base portion 7A.

[0025] When viewed from above the first member 4A, the action portion 9A includes a central piece 94A and two side pieces 95A connected to the left and right side edges of the front end portion of the central piece 94A. The side piece 95A connected to the left edge of the central piece 94A extends leftward from the central piece 94A, while the side piece 95A connected to the right edge of the central piece 94A extends rightward from the central piece 94A. Each side piece 95A includes a portion of the second portion 92A, a portion of the third portion 93A, and a portion of the contact portion 6A and has a V-shaped bent shape. Each side piece 95A has a through-hole 96A in a portion that forms part of the third portion 93A.

[0026] As shown in Figures 3 and 4, the second member 4B has a base 7B connected to the elastic mechanism 5 and an acting portion 9 (hereinafter also referred to as acting portion 9B) located forward of the base 7 (hereinafter also referred to as base 7B). The second member 4B is rotatable relative to the first member 4A. However, hereinafter, the structure of the second member 4B will be described based on a state in which the base 7A of the first member 4A and the base 7B of the second member 4B are arranged parallel to each other and the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B are spaced apart. Note that when no external force is applied to the first member 4A and the second member 4B, the base 7B of the second member 4B is inclined downward toward its front end, and the contact portion 6B of the second member 4B is in contact with or close to the contact portion 6A of the first member 4A.

[0027] The base portion 7B is in the form of a flat plate having a thickness in the vertical direction.

[0028] The second member 4B also has two connection portions 21B extending upward from the left and right edges of the base portion 7B. The base portion 7B is connected to the elastic mechanism 5 via the connection portions 21B. Each of the connection portions 21B has a support hole 22B penetrating in the left-right direction. The two connection portions 21B face each other in the left-right direction, and the two support holes 22B also face each other in the left-right direction. As will be described later, the support holes 22B support the elastic mechanism 5.

[0029] The base 7B has an operating portion 72B behind the position of the support hole 22B, that is, on the opposite side of the acting portion 9B with respect to the position of the elastic mechanism 5.

[0030] The action portion 9B has a contact portion 6B and a connecting portion 8B that is interposed between the rear end of the contact portion 6B and the front end of the base portion 7B and connects the rear end of the contact portion 6B and the front end of the base portion 7B.

[0031] The contact portion 6B is a flat plate having a thickness in the vertical direction. The upward surface of the contact portion 6B (the surface facing the assembly 100 in the installed state) is a flat contact surface 62B.

[0032] The connecting portion 8B has a partially curved flat plate shape with a vertical thickness. The upward-facing surface of the connecting portion 8B has a recessed surface 82B. The recessed surface 82B is recessed relative to the contact surface 62B, forming a recessed portion that opens upward. The recessed surface 82B extends from the left end to the right end of the acting portion 9B. As described below, the recessed surface 82B can prevent contact between the outer periphery of the assembly 100 and the acting portion 9B in the installed state. The depth of the recessed portion formed by the recessed surface 82B is preferably 0.2 mm or more, and more preferably 0.3 mm or more. The depth of the recessed portion is, for example, less than half the thickness of the contact portion 6B.

[0033] Each of the first member 4A and the second member 4B is fabricated by processing a metal plate material, for example.

[0034] The first member 4A and the second member 4B are combined so that the acting portion 9A of the first member 4A and the acting portion 9B of the second member 4B face each other vertically, the right-side connecting portion 21A of the first member 4A overlaps with the right-side connecting portion 21B of the second member 4B, and the left-side connecting portion 21A of the first member 4A overlaps with the left-side connecting portion 21B of the second member 4B.

[0035] In this embodiment, the connecting portion 8A of the first member 4A has a transmissive portion 81A, and the connecting portion 8B of the second member 4B also has a transmissive portion 81B. The average width (average dimension in the left-right direction) of the transmissive portions 81A, 81B is preferably 50% or more of the average width (average dimension in the left-right direction) of the connecting portions 8A, 8B having each transmissive portion 81A, 81B. The average width of each transmissive portion 81A, 81B is also preferably 10 mm or more, and more preferably 15 mm or more. The width of the portions of the connecting portions 8A, 8B adjacent to the right and left sides of the transmissive portions 81A, 81B of the connecting portions 8A, 8B where the transmissive portions 81A, 81B are not formed is preferably 5 mm or less, and more preferably 4 mm or less.

[0036] In the embodiment, the connecting portion 8A of the first member 4A has an opening that is a transmissive portion 81A. The transmissive portion 81A penetrates the connecting portion 8A vertically. The transmissive portion 81A is formed from the first portion 91A to the second portion 92A of the connecting portion 8A. The average width (average dimension in the left-right direction) of the transmissive portion 81A is preferably 50% or more of the average width (average dimension in the left-right direction) of the connecting portion 8A. The average width of the transmissive portion 81A is also preferably 10 mm or more, and more preferably 15 mm or more. The width of the portions of the connecting portion 8A adjacent to the right and left sides of the transmissive portion 81A where the transmissive portion 81A is not formed is preferably 5 mm or less, and more preferably 4 mm or less.

[0037] In the embodiment, the connecting portion 8B of the second member 4B also has an opening that is a transparent portion 81B. The transparent portion 81B penetrates the connecting portion 8B vertically. In the embodiment, the transparent portion 81B is formed from a portion of the connecting portion 8B where the recessed surface 83B is located to the contact portion 6B. The average width (average dimension in the left-right direction) of the transparent portion 81B is preferably 70% or more of the average width (average dimension in the left-right direction) of the connecting portion 8A. The width of the portions of the connecting portion 8B adjacent to the right and left sides of the transparent portion 81B where the transparent portion 81B is not formed is preferably 5 mm or less, and more preferably 4 mm or less.

[0038] As shown in FIGS. 5A and 5B , the elastic mechanism 5 includes a shaft center 51 and a torsion coil spring wound around the shaft center 51. The shaft center 51 is cylindrical and has a length in the left-right direction. The left end of the shaft center 51 passes through the support holes 22A of the left connecting portion 21B of the first member 4A and the support holes 22B of the left connecting portion 21B of the second member 4B, while the right end of the shaft center 51 passes through the support holes 22A of the right connecting portion 21A of the first member 4A and the support holes 22B of the right connecting portion 21B of the second member 4B. This allows the first member 4A to rotate around the shaft center 51 relative to the second member 4B. The torsion coil spring applies an elastic force to the first member 4A and the second member 4B to clamp the assembly 100. That is, the torsion coil spring applies an elastic force to the first member 4A and the second member 4B so that the first member 4A rotates relative to the second member 4B and the action portion 9A of the first member 4A and the action portion 9B of the second member 4B move closer to each other.

[0039] When the clip 1 is not in an installed state and no external force is being applied to the clip 1, the elastic mechanism 5 applies an elastic force to the first member 4A and the second member 4B, causing the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B to come into contact with or come close to each other.

[0040] As shown in FIGS. 1, 2, 5A, and 5B, the clip 1 may include a buffer material 23 covering the contact portion 6A of the first member 4A. The buffer material 23 is, for example, a ring-shaped resin sheet. The buffer material 23 is attached to each of two side pieces 95A of the action portion 9A of the first member 4A. The buffer material 23 is attached to each side piece 95A so as to surround the side piece 95A, thereby covering the contact portion 6A with the buffer material 23. Attaching a fastener 97, such as a screw, to the side piece 95A so that the fastener 97 passes through the buffer material 23 and the through-hole 96A of the side piece 95A can prevent the buffer material 23 from falling off the side piece 95A.

[0041] Because the contact portion 6A of the first member 4A is angular, the pressure that the contact portion 6A of the first member 4A applies to the assembly 100 may be greater than the pressure that the contact portion 6B of the second member 4B applies to the assembly 100. However, when the contact portion 6A of the first member 4A is covered with the buffer material 23, the contact portion 6A comes into contact with the assembly 100 via the buffer material 23. Therefore, damage to the assembly 100 caused by the pressure that the contact portion 6A of the first member 4A applies to the assembly 100 can be suppressed.

[0042] An example of a method for manufacturing the glass panel unit 10 using the clip 1 will now be described.

[0043] As described above, the manufacturing method of the embodiment includes an assembly step, in which an assembly 100 is prepared. As described above, the assembly 100 includes a first glass plate 200, a second glass plate 300 facing the first glass plate 200, and a peripheral wall 410 between the first glass plate 200 and the second glass plate 300, the peripheral wall 410 including a heat-melting sealing material arranged in a frame shape along the outer peripheries of the first glass plate 200 and the second glass plate 300. The first glass plate 200 has a first outer surface 2A opposite to the second glass plate 300 side, and the second glass plate 300 has a second outer surface 2B opposite to the first glass plate 200.

[0044] The assembly 100 will now be described in detail. Figures 6 and 7 show the assembly 100 of this embodiment. As shown in Figures 6 and 7, the assembly 100 includes a first glass plate 200, a second glass plate 300, a peripheral wall 410, and an internal space 500. The assembly 100 also includes a gas adsorbent 60 and a plurality of pillars 70.

[0045] The first glass plate 200 and the second glass plate 300 are the base components of the first glass panel 20 and the second glass panel 30 in the glass panel unit 10, respectively. The first glass plate 200 and the second glass plate 300 have the same shape. Both the first glass plate 200 and the second glass plate 300 are rectangular flat plates. The first glass plate 200 and the second glass plate 300 are made of a material such as soda-lime glass, high strain point glass, chemically strengthened glass, alkali-free glass, quartz glass, Neoceram, or physically strengthened glass. A coating may be provided on one or both surfaces of the first glass plate 200 and the second glass plate 300.

[0046] The peripheral wall 410 is interposed between the first glass plate 200 and the second glass plate 300. The peripheral wall 410 is a component that forms the frame 40 of the glass panel unit 10. The peripheral wall 410 is frame-shaped as shown in FIG. 6 . In particular, the peripheral wall 410 is rectangular frame-shaped. The peripheral wall 410 is formed along the outer peripheries of the first and second glass plates 200, 300. As a result, in the assembly 100, an internal space 500 is formed that is surrounded by the peripheral wall 410, the first glass plate 200, and the second glass plate 300. In the assembly 100, the peripheral wall 410 does not perform the function of joining the first glass plate 200 and the second glass plate 300. The peripheral wall 410 contains a heat-fusible sealing material.

[0047] The sealing material contains, for example, glass frit. The glass frit is, for example, a low-melting-point glass frit. Examples of the low-melting-point glass frit include bismuth-based glass frit, lead-based glass frit, and vanadium-based glass frit.

[0048] The peripheral wall 410 may further contain a core material. The core material is used to define the height of the frame 40. The core material is, for example, spherical glass beads. The diameter of the glass beads is selected depending on the height of the frame 40. Such core material is dispersed in the sealing material at a predetermined ratio. As an example, glass beads with a diameter of 50 to 300 μm are contained in the sealing material at 0.01 to 1 mass % (0.03 to 3% by volume).

[0049] The peripheral wall 410 may contain a binder. The binder may be made of, for example, a resin. The binder can improve the applicability and formability of the sealing material.

[0050] The peripheral wall 410 may contain a solvent, such as an organic solvent.

[0051] The peripheral wall 410 includes a main portion 411 that occupies most of the peripheral wall 410, and a sealing portion 412. An opening 413 is formed in the main portion 411. The opening 413 is a portion of the outer periphery of the first glass plate 200 and the second glass plate 300 where the main portion 411 is not formed. The sealing portion 412 is disposed at a position inside the internal space 500 with respect to the opening 413. The sealing portion 412 is disposed in a position close to the opening 413 and facing the opening 413. Gaps 414 are formed between each of both ends of the sealing portion 412 and the main portion 411. As a result, two gaps 414 are formed in the peripheral wall 410, and these gaps 414 communicate between the internal space 500 and the outside of the assembly 100.

[0052] The gas adsorbent 60 is disposed within the internal space 500. Specifically, the gas adsorbent 60 has a long, flat plate shape and is disposed, for example, on the second glass plate 300. The gas adsorbent 60 is used to adsorb unnecessary gases (residual gases, etc.) during the manufacturing of the glass panel unit 10. The unnecessary gases are, for example, gases released from the sealing material forming the peripheral wall 410 when the sealing material is heated. The gas adsorbent 60 includes, for example, a getter. The getter is a material that has the property of adsorbing molecules smaller than a predetermined size. The getter is, for example, an evaporative getter. The evaporative getter has the property of releasing adsorbed molecules when heated to a predetermined temperature (activation temperature) or higher. Therefore, even if the adsorption capacity of the evaporative getter decreases, the adsorption capacity of the evaporative getter can be restored by heating the evaporative getter to a temperature above the activation temperature. The evaporative getter is, for example, a zeolite or an ion-exchanged zeolite (e.g., copper ion-exchanged zeolite). The gas adsorbent 60 contains, for example, getter powder. Specifically, the gas adsorbent 60 is formed by applying and solidifying a liquid containing the getter powder (for example, a dispersion obtained by dispersing getter powder in a liquid, or a solution obtained by dissolving getter powder in a liquid). In this case, the gas adsorbent 60 can be made small. Therefore, the gas adsorbent 60 can be placed even if the internal space 500 is narrow.

[0053] A plurality of pillars (spacers) 70 are disposed within the internal space 500. The plurality of pillars 70 are used to maintain the distance between the first glass plate 200 and the second glass plate 300. The size of the pillars 70, the number of pillars 70, the spacing between the pillars 70, and the arrangement pattern of the pillars 70 can be selected as appropriate. Each pillar 70 is cylindrical. For example, the pillar 70 has a diameter of 1 mm and a height of 100 μm. Each pillar 70 may have an appropriate shape, such as a rectangular column or a sphere. Each pillar 70 may be formed from a material that can withstand the temperature of the bonding process described below, such as metal, ceramic, or resin.

[0054] To fabricate the assembly 100, for example, a peripheral wall 410, a gas adsorbent 60, and a plurality of pillars 70 are formed on the second glass plate 300. Then, the first glass plate 200 is placed facing the second glass plate 300, and the first glass plate 200 is brought into contact with the peripheral wall 410, thereby fabricating the assembly 100. The peripheral wall 410 is formed by applying a composition containing components of the peripheral wall 410, such as a sealing material, to the second glass plate 300 using any application device, such as a dispenser. The pillars 70 are placed on the second glass plate 300 using a chip mounter or the like. The pillars 70 may be formed using photolithography and etching techniques. The pillars 70 may be formed using thin film formation techniques. The gas adsorbent 60 is formed by applying a solution in which getter powder is dispersed to a predetermined position on the second glass plate 300 using, for example, a dispenser, and then drying the solution.

[0055] As described above, the manufacturing method of the embodiment includes an installation step in which a plurality of clips 1 are installed on the outer periphery of the assembly 100, with each clip 1 sandwiching the assembly 100, as shown in Figures 8 and 9. It is preferable that the plurality of clips 1 are installed at intervals around the entire outer periphery of the assembly 100.

[0056] When installing the clip 1, a user pinches the two operating portions 72A, 72B of the clip 1 with their fingers, for example, and applies force to move the two operating portions 72A, 72B toward each other. This force causes the first member 4A to rotate relative to the second member 4B against the elastic force applied by the elastic mechanism 5, causing the action portion 9A of the first member 4A to move away from the action portion 9B of the second member 4B, creating a gap between the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B. In this state, at the outer periphery of the assembly 100, the action portion 9A of the first member 4A faces the first outer surface 2A of the first glass plate 200, and the action portion 9B of the second member 4B faces the second outer surface 2B of the second glass plate 300. In this state, when the user releases the force applied to the operating portions 72A and 72B, the first member 4A rotates relative to the second member 4B due to the elastic force applied by the elastic mechanism 5, so that the action portion 9A of the first member 4A and the action portion 9B of the second member 4B approach each other. As a result, the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B come into contact with the first outer surface 2A and the second outer surface 2B of the assembly 100, respectively, and the assembly 100 is sandwiched between the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B. This installs the clip 1 on the assembly 100, i.e., the installed state is realized.

[0057] 8 and 9 , in the installed state, the contact portion 6A of the first member 4A is positioned forward of the peripheral wall 410 at the outer periphery of the assembly 100, so that the contact portion 6A contacts the assembly 100 only at a position on the opposite side of the peripheral wall 410 from the outer periphery of the assembly 100. In other words, the peripheral wall 410 and the contact portion 6A are spaced apart in the front-to-rear direction. This leaves a gap in the vertical direction between the connecting portion 8A of the action portion 9A of the first member 4A and the assembly 100, so that portions of the first member 4A other than the contact portion 6A do not contact the assembly 100. Furthermore, the peripheral wall 410 at the outer periphery of the assembly 100 and the transmitting portion 81A of the connecting portion 8A of the first member 4A face each other in the vertical direction.

[0058] In addition, in the installed state, the contact portion 6B of the second member 4B is positioned forward of the peripheral wall 410 at the outer periphery of the assembly 100, so that the contact portion 6B contacts the assembly 100 only at a position on the opposite side of the peripheral wall 410 from the outer periphery of the assembly 100. In other words, the peripheral wall 410 and the contact portion 6B are spaced apart in the front-to-rear direction. The recessed surface 82B of the connecting portion 8B faces the outer periphery of the assembly 100. This leaves a gap between the connecting portion 8B of the action portion 9B of the second member 4B and the assembly 100 in the vertical direction, so that portions of the second member 4B other than the contact portion 6B do not contact the assembly 100. In addition, the peripheral wall 410 at the outer periphery of the assembly 100 and the transmitting portion 81B of the connecting portion 8B of the second member 4B face each other in the vertical direction.

[0059] As described above, the manufacturing method of the embodiment includes a bonding step in which, in an installed state, infrared rays are irradiated onto the peripheral wall 410 to bond the first glass sheet 200 and the second glass sheet 300 at the peripheral wall 410. In the bonding step, an infrared heating device is used, as shown in FIG. 10 , for example. The infrared heating device includes a vacuum chamber 31 and an infrared light source 32 installed within the vacuum chamber 31. The vacuum chamber 31 is a chamber in which the internal space can be depressurized using a vacuum pump or the like. The vacuum chamber 31 includes an entrance 33, an exit 35, a door 34 for opening and closing the entrance 33, and a door 36 for opening and closing the exit 35. A conveyor 37 is installed within the vacuum chamber 31 to support and move the assembly 100 between the entrance 33 and the exit 35. A conveyor 37 for transporting the assembly 100 is also installed outside the entrance 33 and outside the exit 35 of the vacuum chamber 31. Each of the conveyors 37 is, for example, a roller conveyor. The infrared light source 32 is, for example, a planar infrared lamp. For example, two infrared light sources 32 are installed above and below the transporter 37 in the vacuum chamber 31.

[0060] With the door 34 of the entrance 33 of the vacuum chamber 31 open, the installed assembly 100 is transported by the transporter 37 and placed into the vacuum chamber 31 through the entrance 33. With the assembly 100 resting on the transporter 37 inside the vacuum chamber 31, the door 34 of the entrance 33 and the door 36 of the exit 35 are closed to seal the vacuum chamber 31. In this state, the space inside the vacuum chamber 31 is depressurized to form a depressurized space. A depressurized space is a vacuum space or a space whose pressure is reduced below atmospheric pressure. Thus, the assembly 100 is placed in the depressurized space. In this state, infrared rays are irradiated from the infrared light source 32 toward the assembly 100. The infrared rays are irradiated onto at least the peripheral wall 410. As a result, the peripheral wall 410 is heated and melted. Subsequently, the irradiation of infrared rays from the infrared light source 32 is stopped, and the peripheral wall 410 is cooled. In this manner, the glass panel unit 10 is produced. Next, the door 36 at the exit 35 of the vacuum chamber 31 is opened, and the glass panel unit 10 is moved by a conveyor 37 through the exit 35 to the outside of the vacuum chamber 31 .

[0061] In the above-described joining process, the assembly 100 is placed in a reduced-pressure space, and gas within the internal space 500 is discharged to the outside through the gap 414 between the main portion 411 and the sealing portion 412 of the peripheral wall 410 and the opening 413 (see FIG. 6 ). This places the internal space 500 in a reduced-pressure state. The reduced-pressure state refers to a vacuum state or a state where the pressure is reduced below atmospheric pressure. When the peripheral wall 410 is heated by infrared radiation in this state, the sealing material constituting the peripheral wall 410 softens or melts. At this time, since the clip 1 is installed in the assembly 100, compressive forces are applied to the peripheral wall 410 from the first glass plate 200 and the second glass plate 300. As a result, the peripheral wall 410 is expanded, and the gap 414 between the main portion 411 and the sealing portion 412 in the peripheral wall 410 is filled and closed (see FIG. 11 ). At this time, the pillars 70 maintain the distance between the first glass plate 200 and the second glass plate 300. This seals the internal space 500 under reduced pressure. Subsequently, when the peripheral wall 410 is cooled, the sealing material solidifies, forming a frame 40 containing the molten and solidified sealing material. This frame 40 bonds the first glass plate 200 and the second glass plate 300. This completes the production of the glass panel unit 10 (see FIGS. 11 and 12 ). The user then pinches the two operating portions 72A, 72B of the clip 1 with their fingers, for example, to widen the gap between the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B, and removes the clip 1 from the glass panel unit 10.

[0062] When heating the peripheral wall 410 in the bonding step, particularly when the peripheral wall 410 contains a sealing material and a binder, it is preferable to first heat the peripheral wall 410 to a temperature lower than the temperature at which the sealing material softens or melts but at which the binder can thermally decompose, and then heat the peripheral wall 410 to a temperature higher than the temperature at which the sealing material softens or melts, thereby softening or melting the sealing material. In this case, the binder can be first thermally decomposed and removed from the peripheral wall 410, making it difficult for the binder to remain in the internal space 500. In this case, the heating temperature and heating time can be appropriately set depending on the types of sealing material and binder and other conditions.

[0063] In the embodiment, in the joining step, as described above, the connecting portion 8A of the first member 4A has a transparent portion 81A at the outer peripheral edge of the assembly 100, and infrared light can be irradiated onto the peripheral wall 410 through this transparent portion 81A. Furthermore, the connecting portion 8B of the second member 4B has a transparent portion 81B, and infrared light can be irradiated onto the peripheral wall 410 through this transparent portion 81B. Furthermore, the contact portion 6A of the action portion 9A of the first member 4A in the clip 1 contacts the first outer surface 2A forward of the peripheral wall 410 of the assembly 100, and does not contact the first outer surface 2A at any point other than the contact portion 6A. Therefore, infrared light can pass through the gap between the first outer surface 2A and the first member 4A and be irradiated onto the peripheral wall 410. Furthermore, the contact portion 6B of the action portion 9B of the second member 4B in the clip 1 contacts the second outer surface 2B forward of the peripheral wall 410 of the assembly 100, and does not contact the second outer surface 2B at any point other than the contact portion 6B. Therefore, infrared rays can pass through the gap between the second outer surface 2B and the second member 4B and be irradiated onto the peripheral wall 410. Therefore, the clip 1 is less likely to obstruct the irradiation of infrared rays onto the peripheral wall 410. This allows the peripheral wall 410 to be heated efficiently, and reduces the likelihood of uneven heating of the peripheral wall 410. This allows the first glass plate 200 and the second glass plate 300 to be efficiently joined. Furthermore, this prevents a portion between the first glass plate 200 and the second glass plate 300 from being insufficiently sealed by the frame 40 made from the peripheral wall 410. This can prevent defects from occurring in the glass panel unit 10, such as a decrease in strength or an inability to maintain the vacuum space 50 formed from the internal space 500 in a reduced pressure state.

[0064] In the installed state, the position of the transmitting portion 81A of the first member 4A preferably overlaps with the peripheral wall 410 when the assembly 100 is viewed from above in a direction perpendicular to the first outer surface 2A (see FIGS. 8 and 9). In particular, as shown in FIG. 9, it is preferable that the position of the transmitting portion 81A overlaps with the peripheral wall 410 so that the peripheral wall 410 crosses the transmitting portion 81A. In this case, infrared radiation irradiation to the peripheral wall 410 is particularly unlikely to be obstructed.

[0065] Similarly, in the installed state, the position of the transmitting portion 81B of the second member 4B preferably overlaps with the peripheral wall 410 when the assembly 100 is viewed from below in a direction perpendicular to the second outer surface 2B. In particular, it is preferable that the position of the transmitting portion 81B overlaps with the peripheral wall 410 so that the peripheral wall 410 crosses the transmitting portion 81B. In this case, infrared radiation irradiation to the peripheral wall 410 is particularly unlikely to be obstructed.

[0066] A glass panel unit 10 manufactured by the manufacturing method of the embodiment will be described with reference to Figures 11 and 12. The glass panel unit 10 is a vacuum insulated glass unit. The glass panel unit 10 includes a first glass panel 20 derived from a first glass plate 200, a second glass panel 30 derived from a second glass plate 300, a frame 40 derived from a peripheral wall 410, and a vacuum space 50 derived from an internal space 500. The glass panel unit 10 also includes a gas adsorbent 60 and a plurality of pillars 70.

[0067] The first glass panel 20 has the same shape as the second glass panel 30. Both the first glass panel 20 and the second glass panel 30 are rectangular flat plates. The first glass panel 20 and the second glass panel 30 are made of the same material as the first glass plate 200 and the second glass plate 300. In this embodiment, the first glass panel 20 is the first glass plate 200 itself, and the second glass panel 30 is the second glass plate 300 itself.

[0068] The frame body 40 is located between the first glass panel 20 and the second glass panel 30 and hermetically bonds the first glass panel 20 and the second glass panel 30. The frame body 40 is made of the peripheral wall 410 as described above. The frame body 40 has a rectangular frame shape. The frame body 40 is formed along the outer peripheries of the first and second glass panels 200, 300. As a result, in the glass panel unit 10, a vacuum space 50 is formed that is surrounded by the frame body 40, the first glass panel 20, and the second glass panel 30. The frame body 40 surrounds the entire outer periphery of the vacuum space 50 and is in close contact with the first glass panel 20 and the second glass panel 30. Therefore, the vacuum space 50 is sealed. The vacuum space 50 is in a reduced pressure state, i.e., it is a vacuum or is reduced in pressure below atmospheric pressure.

[0069] The gas adsorbent 60 is disposed within the vacuum space 50. Specifically, the gas adsorbent 60 has a long, flat plate shape and is disposed on the second glass panel 30. The gas adsorbent 60 adsorbs unnecessary gas (residual gas, etc.) within the vacuum space 50. For example, the gas adsorbent 60 can adsorb gas that is released from the peripheral wall 410 when the frame body 40 is fabricated from the peripheral wall 410 in the bonding process.

[0070] A plurality of pillars (spacers) 70 are disposed within the vacuum space 50. The plurality of pillars 70 can maintain the distance between the first glass panel 20 and the second glass panel 30.

[0071] 2. Modifications In the clip 1 of the embodiment, the first member 4A and the second member 4B both have a base portion 7 connected to the elastic mechanism 5 and an acting portion 9 connected to the base portion 7, and the acting portion 9 has a contact portion 6 that contacts the assembly 100 in the installed state and a connecting portion 8 that does not contact the assembly 100 in the installed state and is interposed between the contact portion 6 and the base portion 7. Furthermore, in both the acting portion 9A of the first member 4A and the acting portion 9B of the second member 4B, the contact portion 6 contacts the assembly 100 only at a position on the opposite side of the peripheral wall 410 from the outer periphery of the assembly 100, and the connecting portion 8 has a transmitting portion 81 that is infrared transparent. However, in only one of the first member 4A and the second member 4B, the contact portion 6 may be in contact with the assembly 100 only at a position on the opposite side of the periphery of the assembly 100 with respect to the peripheral wall 410, and the connecting portion 8 may have the infrared-transparent transparent portion 81. Also, in both the first member 4A and the second member 4B, the contact portion 6 may be in contact with the assembly 100 only at a position on the opposite side of the periphery of the assembly 100 with respect to the peripheral wall 410, and the connecting portion 8 may have the infrared-transparent transparent portion 81.

[0072] Although the transmitting portion 81 in the embodiment is an opening, the transmitting portion 81 is not limited to an opening as long as it has infrared transmittance. For example, the transmitting portion 81 may be a notched portion formed in the connecting portion 8. The transmitting portion 81 may be made of a resin material that has infrared transmittance.

[0073] The clip 1 of the embodiment is configured by combining a first member 4A and a second member 4B, which are separate members, and is provided with an elastic mechanism 5 including a torsion coil spring. However, the first member 4A and the second member 4B may be integrated into a single member. Furthermore, the elastic mechanism 5 is not limited to including a torsion coil spring as long as it can apply an elastic force to the first member 4A and the second member 4B to clamp the assembly 100.

[0074] 13 and 14 show a modified clip 1. In the description of the modified clip 1, the side of the first member 4A relative to the second member 4B is defined as the top, and the side of the second member 4B relative to the first member 4A is defined as the bottom. Furthermore, the side of the assembly 100 relative to the position of the elastic mechanism 5 in the installed state is defined as the front, and the side of the elastic mechanism 5 relative to the position of the assembly 100 is defined as the rear. Furthermore, the left and right of the observer are defined as the left and right of the observer when the up, down, front, and back of the observer are considered to be the same as the up, down, front, and back in the description of the clip 1. These definitions of up, down, front, back, left, and right are merely for convenience and do not define the posture of the clip 1 when it is in use. The structure of the clip 1 when no external force is applied to the clip 1 will be described below.

[0075] In the clip 1 of the modified example, the first member 4A, the second member 4B, and the elastic mechanism 5 form a single member that cannot be separated without being destroyed.

[0076] The first member 4A has a base portion 7A connected to the elastic mechanism 5 and an action portion 9A located in front of the base portion 7A.

[0077] The base portion 7A is in the form of a flat plate that is inclined downwards towards the front end.

[0078] The action portion 9A has a first portion 91A extending obliquely upward and forward from the front end of the base portion 7A, a second portion 92A extending obliquely downward and forward from the front end of the first portion 91A relative to the first portion 91A, and a third portion 93A extending obliquely upward and forward from the front end of the second portion 92A. Each of the first portion 91A, the second portion 92A, and the third portion 93A is flat. An angular portion connecting the second portion 92A and the third portion 93A constitutes the contact portion 6A. The combination of the first portion 91A and the second portion 92A constitutes the connecting portion 8A. The second portion 92A of the connecting portion 8A has an opening which is the transmission portion 81A.

[0079] The second member 4B in the clip 1 of the modified example does not have the connecting portion 21B or the transmitting portion 81B, but otherwise has the same configuration as the second member 4B in the clip 1 of the example. That is, the second member 4B has an action portion 9B having a contact portion 6B with a contact surface 62B and a linking portion 8B with a recessed surface 82B, which are the same configuration as in the embodiment. The second member 4B also has a base portion 7B which has the same configuration as in the embodiment, except that it does not have the connecting portion 21B.

[0080] The elastic mechanism 5 is a flat plate having a thickness in the front-to-rear direction. The upper end of the elastic mechanism 5 is connected to the rear end of the base 7A of the first member 4A, and the lower end of the elastic mechanism 5 is connected to the rear end of the base 7B of the second member 4B. The base 7A of the first member 4A, the elastic mechanism 5, and the base 7B of the second member 4B are made by processing, for example, a single metal plate.

[0081] When using the modified clip 1, a user applies force to the first member 4A and the second member 4B of the clip 1 so that the action portion 9A of the first member 4A and the action portion 9B of the second member 4B move apart. This force deforms the clip 1, causing the action portion 9A of the first member 4A to move away from the action portion 9B of the second member 4B, creating a gap between the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B. An elastic force generated by the deformation of the clip 1 is applied from the elastic mechanism 5 to the first member 4A and the second member 4B. In this state, the outer periphery of the assembly 100 is positioned between the action portion 9A of the first member 4A and the action portion 9B of the second member 4B. When the user releases the force applied to the first member 4A and the second member 4B, the elastic force applied from the elastic mechanism 5 brings the action portion 9A of the first member 4A and the action portion 9B of the second member 4B closer together. As a result, the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B come into contact with the assembly 100, and the assembly 100 is sandwiched between the contact portion 6A of the first member 4A and the contact portion 6B of the second member 4B. As a result, the clip 1 is installed on the assembly 100, i.e., the installed state is realized.

[0082] In the above embodiment, the glass panel unit 10 is rectangular, but the glass panel unit 10 may have any desired shape, such as a circular or polygonal shape. That is, the first glass panel 20, the second glass panel 30, and the frame 40 may have any desired shape, such as a circular or polygonal shape, instead of a rectangular shape. The shapes of the first glass plate 200, the second glass plate 300, the peripheral wall 410, and the partition 420 are not limited to those in the above embodiment, and may be any shape that allows a glass panel unit 10 of a desired shape to be obtained. The shape and size of the glass panel unit 10 are determined depending on the application of the glass panel unit 10.

[0083] The first and second glass panels 20, 30 do not have to have the same planar shape and planar size, or the same thickness, and the first and second glass panels 20, 30 do not have to be made of the same material. These points also apply to the first and second glass plates 200, 300.

[0084] Furthermore, in the assembly 100, the peripheral wall 410 is simply located between the first and second glass plates 200, 300 and does not bond them together. However, at the stage of the assembly 100, the peripheral wall 410 may bond the first and second glass plates 200, 300 together to some extent.

[0085] In the above embodiment, the getter of the gas adsorbent 60 is an evaporative getter, but the getter may be a non-evaporative getter.

[0086] In the above embodiment, the gas adsorbent 60 is in the shape of a long, flat plate, but may have other shapes. Furthermore, the gas adsorbent 60 does not necessarily have to be located at the end of the vacuum space 50. Furthermore, in the above embodiment, the gas adsorbent 60 is formed by applying a liquid containing getter powder (for example, a dispersion obtained by dispersing getter powder in a liquid, or a solution obtained by dissolving getter powder in a liquid). However, the gas adsorbent 60 may also include a substrate and a getter adhered to the substrate. Such a gas adsorbent 60 can be obtained by immersing a substrate in a liquid containing getter powder and drying it. The substrate may have any desired shape, such as a long, rectangular shape. Alternatively, the gas adsorbent 60 may be a film formed entirely or partially on the surface of the second glass plate 300. Such a gas adsorbent 60 can be obtained by coating the surface of the second glass plate 300 with a liquid containing getter powder. Alternatively, the gas adsorbent 60 may be included in a pillar 70. For example, if the pillar 70 is formed from a material containing a getter, it is possible to obtain the pillar 70 containing the gas adsorbent 60. Alternatively, the gas adsorbent 60 may be a solid material formed from a getter.

[0087] In the embodiment, one glass panel unit 10 is produced from one assembly 100, but multiple glass panel units 10 may be produced from one assembly 100. In this case, for example, a partition containing a sealing material similar to the peripheral wall 410 is installed within the internal space 500, and the partition divides the internal space 500 into multiple spaces. The partition may have openings, sealing portions, and gaps similar to the openings 413, sealing portions 412, and gaps 414 in the peripheral wall 410 of the embodiment formed in appropriate locations to ensure gas flow between the spaces within the internal space 500. In the joining process, gas is discharged from each space within the internal space 500 through the gaps and openings in the partition and the gaps 414 and openings 413 in the peripheral wall 410, thereby reducing the pressure of each space. In this state, the partition and the peripheral wall 410 are melted and solidified. At this time, the gaps in the partition are also closed, as in the case of the peripheral wall 410. As a result, a vacuum space 50 is formed inside the molten and solidified material of the peripheral wall 410, and the vacuum space 50 is divided into a plurality of spaces by partition walls, which are the molten and solidified material that serve as partitions. This produces a work-in-progress. By cutting the work-in-progress so as to separate the partition walls, a plurality of glass panel units 10 can be produced.

[0088] In the embodiment, the gas in the internal space 500 is exhausted through the gap 414 and the opening 413 in the peripheral wall 410, but other methods may also be used to exhaust the gas in the internal space 500. For example, as in the modified examples shown in Figures 15, 16, and 17, one or both of the first glass plate 200 and the second glass plate 300 may have an exhaust hole 50C, and in the bonding step, the gas in the internal space 500 may be exhausted through the exhaust hole 50C to reduce the pressure in the internal space 500. Subsequently, with the internal space 500 in a reduced-pressure state, infrared rays may be irradiated onto the peripheral wall 410, thereby bonding the first glass plate 200 and the second glass plate 300 together with the peripheral wall 410, and the exhaust hole 50C may also be sealed.

[0089] 15, 16, and 17, an exhaust and sealing jig is used to exhaust the gas from the internal space 500 through the exhaust hole 50C, and then seal the exhaust hole 50C. This jig includes a pressure reducing mechanism 71C configured using an exhaust head 75C pressed against the assembly 100, and a pressing mechanism 73C installed on the exhaust head 75C.

[0090] The exhaust hole 50C is formed in the first glass plate 200. The exhaust hole 50C penetrates the first glass plate 200 in the thickness direction, connecting the internal space 500 to the outside of the assembly 100. A dam portion 47C is arranged in the internal space 500 to surround the exhaust hole 50C. The dam portion 47C is formed, for example, using glass frit. The dam portion 47C is formed, for example, from the same material as the peripheral wall 410. The dam portion 47C has a partially cutout shape, and this cutout portion allows communication between the inside and outside of the dam portion 47C in the internal space 500. Note that the dam portion 47C may not be provided.

[0091] The exhaust head 75C has an opening 72C that connects the exhaust hole 50C formed in the assembly 100 with the outside of the assembly 100, and is configured so that gas within the internal space 500 can be exhausted to the outside of the assembly 100 through the exhaust hole 50C and the opening 72C. The exhaust head 75C includes a cylindrical head main body 751C with a bottom and an opening 72C that connects the inside of the head main body 751C with the outside of the assembly 100. The head main body 751C has a space 752C formed therein and an opening 754C that opens the space 752C to the outside. An elastic O-ring 755C is disposed in the head main body 751C at a location surrounding the opening 754C.

[0092] The pressing mechanism 73C includes a block-shaped holding portion 731C and a spring 733C that connects the holding portion 731C to the inner bottom surface of the head main body 751C. The spring 733C is located within the space 752C. The pressing mechanism 73C is configured to press the sealing portion 420C inserted into the exhaust hole 50C toward the second glass plate 300 when the internal space 500 is depressurized. Note that the pressing mechanism 73C is not limited to the above configuration as long as it is a mechanism that can press the sealing portion 420C toward the second glass plate 300.

[0093] The venting and sealing fixtures may be attached to the assembly 100 before the installation process or after the installation process.

[0094] When attaching the jig, first, the assembly 100 is set so that the exhaust hole 50C opens upward (i.e., so that the first glass plate 200 is positioned above the second glass plate 300). The exhaust head 75C is set above the exhaust hole 50C with the opening 754C facing downward. A holder 731C is positioned above the exhaust hole 50C.

[0095] At this time, a sealing portion 420C and a pressing member 60C are inserted into the exhaust hole 50C of the assembly 100. The sealing portion 420C includes a solid sealing material such as glass frit. The softening or melting temperature of the sealing material included in the sealing portion 420C is preferably the same as or slightly higher than the softening or melting temperature of the sealing material forming the peripheral wall 410. The pressing member 60C is formed using, for example, a metal.

[0096] Both the sealing portion 420C and the pressing member 60C have an outer diameter smaller than the diameter of the exhaust hole 50C. The pressing member 60C has an outer diameter larger than that of the sealing portion 420C. The pressing member 60C disposed in the exhaust hole 50C is located on the opposite side of the sealing portion 420C from the second glass plate 300.

[0097] 15 , the exhaust head 75C is lowered to press the lower surface of the holding portion 731C against the upper surface of the pressing member 60C. The O-ring 755C of the exhaust head 75C presses airtightly against a portion of the upper surface of the first glass plate 200 that completely surrounds the exhaust hole 50C.

[0098] An O-ring 755C that is elastically deformed by the force of the head body 751C pressing against it is interposed between the first glass plate 200 and the head body 751C, thereby preventing the first glass plate 200 from being damaged by contact with the head body 751C.

[0099] At this time, the sealing portion 420C and the pressing member 60C placed thereon are sandwiched vertically between the second glass plate 300 and the holding portion 731C by the biasing force (restoring force) of the spring 733C. In the bonding process, the pressing mechanism 73C functions as a holding mechanism that elastically holds the sealing portion 420C in a state where it is inserted into the exhaust hole 50C.

[0100] As in the embodiment, the assembled product 100 in an installed state with the jig attached is transported by the transporter 37 and placed in the vacuum chamber 31 during the bonding process. During the bonding process, the vacuum chamber 31 is depressurized to create a decompressed space, and gas within the space 752C of the head main body 751C is exhausted through the opening 72C. A sealing portion 420C and a pressing member 60C are inserted into the exhaust hole 50C. A gap exists between the inner circumferential surface of the exhaust hole 50C and the sealing portion 420C, and a gap exists between the exhaust hole 50C and the pressing member 60C, and these gaps are in communication with each other. Therefore, gas within the internal space 500 is exhausted through the exhaust hole 50C of the first glass plate 200 and the notch 475C of the weir portion 47C disposed in the internal space 500.

[0101] When the internal space 500 is decompressed, the infrared light source 32 irradiates and heats the peripheral wall 410 with infrared rays, and the sealing portion 420C inserted into the exhaust hole 50C is also irradiated and heated with infrared rays from the infrared light source 32. The heated sealing portion 420C melts and softens. The softened sealing portion 420C is pressed toward the second glass plate 300 and deformed by the biasing force (elastic force) exerted by the spring 733C of the pressing mechanism 73C via the pressing member 60C. The sealing portion 420C is expanded in a direction perpendicular to the thickness direction D1 and deforms in the internal space 500 until it contacts the inner peripheral surface of the dam portion 47C. Further expansion of the sealing portion 420C is suppressed by contact with the dam portion 47C. The notch in the dam portion 47C is sealed by the sealing portion 420C expanded until it contacts the dam portion 47C. This closes the exhaust hole 50C.

[0102] At this stage, the exhaust hole 50C is sealed by the sealing portion 420C, and the internal space 500 is hermetically sealed while maintaining the reduced pressure. As shown in Fig. 16 , the sealing portion 420C is bonded to both the first glass plate 200 and the second glass plate 300 in the internal space 500, and is also bonded to the pressing member 60C.

[0103] Even when a partition is provided in the assembly 100 and multiple glass panel units are produced from the assembly 100, one or both of the first glass plate 200 and the second glass plate 300 may have an exhaust hole 50C without using the gap 414 in the peripheral wall 410 and the gap in the partition. In this case, in the bonding step, gas within the internal space 500 may be exhausted through the exhaust hole 50C to reduce the pressure in the internal space 500. Subsequently, with the internal space 500 in a reduced pressure state, infrared rays may be irradiated onto the peripheral wall 410 to bond the first glass plate 200 and the second glass plate 300 together with the peripheral wall 410, and the exhaust hole 50C may be sealed. In this case, for example, one or both of the first glass plate 200 and the second glass plate 300 may each have multiple exhaust holes 50C that communicate with multiple spaces within the internal space 500. An exhaust and sealing jig is attached to each of these exhaust holes 50C, and using this jig, the gas in the internal space 500 can be exhausted through the exhaust hole 50C during the joining process, and then the exhaust hole 50C can be sealed, as in the modified examples shown in Figures 15, 16, and 17.

[0104] In the embodiment, in the joining process, the peripheral wall 410 is heated only by infrared radiation, but infrared radiation may be used in combination with a heating method other than infrared radiation to heat the peripheral wall 410. An example of a heating method other than infrared radiation is a method in which the assembly 100 is placed in an atmosphere heated by an electric heater 42 or the like, but is not limited to this.

[0105] For example, in the modified example shown in FIG. 18 , in the bonding process, the peripheral wall 410 is first heated by placing the assembled product 100 in an atmosphere heated by the electric heater 42 without reducing the pressure in the internal space 500 (hereinafter, this heating process is also referred to as the first heating process). Next, the peripheral wall 410 is heated by irradiating it with infrared rays while reducing the pressure in the internal space 500 (hereinafter, this heating process is also referred to as the second heating process). In the first heating process, for example, if the peripheral wall 410 contains a sealing material and a binder, the peripheral wall 410 is heated to a temperature at which the binder can be thermally decomposed, thereby thermally decomposing the binder in the peripheral wall 410. Next, in the second heating process, the peripheral wall 410 is heated to a temperature higher than the temperature at which the sealing material softens or melts, thereby softening or melting the sealing material. In this case, the binder can be first thermally decomposed and removed from the peripheral wall 410, making it less likely that the binder will remain in the internal space 500. In this case, the heating temperature and heating time in each of the first heating step and the second heating step can be appropriately set depending on the types of sealing material and binder, and other conditions.

[0106] The modified example shown in Fig. 18 will be described in more detail. Fig. 18 shows a heating device used in the bonding process in the modified example. This heating equipment includes an electric heating device, an infrared heating device, and a conveyor 37.

[0107] The electric heating device includes a chamber 41 and an electric heater 42 installed in the chamber 41. The chamber 41 includes an entrance 43, an exit 45, a door 44 for opening and closing the entrance 43, and a door 46 for opening and closing the exit 45. A conveyor 37 is installed inside the chamber 41 to support and move the assembly 100 between the entrance 43 and the exit 45. For example, two electric heaters 42 are installed above and below the conveyor 37 within the chamber 41. The electric heating device also includes an air circulation device (not shown), which can circulate air within the chamber 41 to uniform the temperature within the chamber 41.

[0108] The infrared heating apparatus has the same configuration as the infrared heating apparatus shown in Fig. 10. That is, the infrared heating apparatus includes a vacuum chamber 31 and an infrared light source installed in the vacuum chamber 31. The vacuum chamber 31 includes an entrance 33, an exit 35, a door 34 for opening and closing the entrance 33, and a door 36 for opening and closing the exit 35. A transport machine 37 is installed inside the vacuum chamber 31 to support and move the assembly 100 between the entrance 33 and the exit 35.

[0109] A transport device 37 for transporting the assembly 100 is also installed outside the entrance 43 of the chamber 41, between the exit 45 of the chamber 41 and the entrance 33 of the vacuum chamber 31, and outside the exit 35 of the vacuum chamber 31.

[0110] Each of the conveyors 37 is, for example, a roller conveyor, but is not limited to this.

[0111] In the bonding process in this modified example, first, with the door 44 of the entrance 43 of the chamber 41 of the electric heating device open, the installed assembly 100 is transported by the transport device 37 and placed into the chamber 41 through the entrance 43. With the assembly 100 resting on the transport device 37 inside the chamber 41, the door 44 of the entrance 43 and the door 46 of the exit 45 are closed to seal the chamber 41. In this state, the space inside the chamber 41 is kept at atmospheric pressure, and the atmosphere inside the chamber 41 is heated by the electric heater 42 to a temperature higher than the temperature at which the sealing material of the peripheral wall 410 softens or melts, but not to such a degree that the peripheral wall 410 deforms so much that the gap 414 in FIG. 6 closes. This heats the peripheral wall 410, and while maintaining the gap 414, the binder contained in the peripheral wall 410 is thermally decomposed and the peripheral wall 410 is melted, bonding the first glass sheet 200 and the second glass sheet 300 together at the peripheral wall 410. Next, the door 46 at the exit 45 of the chamber 41 is opened, and the assembly 100 is transported by the transporter 37 toward the vacuum chamber 31 of the infrared heating device.

[0112] Next, with the door 34 of the entrance 33 of the vacuum chamber 31 of the infrared heating device open, the assembly 100 is transported by the transporter 37 and placed into the vacuum chamber 31 through the entrance 33. With the assembly 100 resting on the transporter 37 within the vacuum chamber 31, the door 34 of the entrance 33 and the door 36 of the exit 35 are closed to seal the vacuum chamber 31. In this state, the space within the vacuum chamber 31 is depressurized to create a decompressed space. In this state, infrared rays are irradiated from the infrared light source 32 toward the assembly 100. The infrared rays are irradiated onto at least the peripheral wall 410. As a result, the peripheral wall 410 is reheated and melted, and the peripheral wall 410 is expanded, filling and closing the gap 414 between the main portion 411 and the sealing portion 412 in the peripheral wall 410 (see FIG. 11 ). Next, the infrared radiation from the infrared light source 32 is stopped, and the peripheral wall 410 is cooled. In this manner, the glass panel unit 10 is produced. Next, the door 36 at the exit 35 of the vacuum chamber 31 is opened, and the glass panel unit 10 is moved by a conveyor 37 through the exit 35 to the outside of the vacuum chamber 31 .

[0113] 18 , one or both of the first glass plate 200 and the second glass plate 300 may have an exhaust hole 50C, and in the bonding step, the gas in the internal space 500 may be exhausted through the exhaust hole 50C to reduce the pressure in the internal space 500. Subsequently, with the internal space 500 in a reduced pressure state, infrared rays may be irradiated onto the peripheral wall 410, thereby bonding the first glass plate 200 and the second glass plate 300 together at the peripheral wall 410 and sealing the exhaust hole 50C.

[0114] In the modification shown in FIG. 19 , one or both of the first glass sheet 200 and the second glass sheet 300 each have an exhaust hole 50C. In the bonding process, the peripheral wall 410 is heated by placing the assembly 100 in an atmosphere heated by an electric heater 42 without reducing the pressure in the internal space 500 (first heating process). Next, the gas in the internal space 500 is exhausted through the exhaust hole 50C to reduce the pressure in the internal space 500, and the peripheral wall 410 is heated by infrared radiation (second heating process). In the first heating process, for example, if the peripheral wall 410 contains a sealing material and a binder, the peripheral wall 410 is heated to a temperature higher than the temperature at which the sealing material softens or melts, thereby thermally decomposing the binder in the peripheral wall 410 and bonding the first glass sheet 200 and the second glass sheet 300 together via the peripheral wall 410. Subsequently, in the secondary heating step, the sealing portion 420C inserted into the exhaust hole 50C is heated to a temperature at which it softens or melts.

[0115] The modified example shown in Fig. 19 will be described in more detail. Fig. 19 shows heating equipment used in the bonding process in the modified example. This heating equipment includes an electric heating device, an infrared heating device, and a conveyor 37. The configuration of the heating device is the same as that of the modified example shown in Fig. 18.

[0116] In this variant, the clip 1 is placed in the assembly 100 and placed in an installed state before the joining step.

[0117] Next, in the bonding process, first, the door 44 of the entrance 43 of the chamber 41 of the electric heating device is opened, and the installed assembly 100 is transported by the transporter 37 and placed into the chamber 41 through the entrance 43. With the assembly 100 resting on the transporter 37 inside the chamber 41, the door 44 of the entrance 43 and the door 46 of the exit 45 are closed to seal the chamber 41. In this state, the space within the chamber 41 is maintained at atmospheric pressure, and the atmosphere within the chamber 41 is heated by the electric heater 42. This heats the peripheral wall 410, thereby thermally decomposing, for example, the binder contained in the peripheral wall 410. Next, the door 46 of the exit 45 of the chamber 41 is opened, and the assembly 100 is transported by the transporter 37 toward the infrared heating device. At this stage, the sealing portion 420C is inserted into the exhaust hole 50C, and the exhaust and sealing jig shown in FIG. 15 is attached to the assembly 100. The sealing material contained in the sealing portion 420C is a sealing material that softens or melts at a temperature lower than the temperature at which the sealing material of the peripheral wall 410 softens or melts.

[0118] Next, with the door 34 of the entrance 33 of the vacuum chamber 31 of the infrared heating device open, the assembly 100 is transported by the transporter 37 and placed into the vacuum chamber 31 through the entrance 33. With the assembly 100 resting on the transporter 37 inside the vacuum chamber 31, the door 34 of the entrance 33 and the door 36 of the exit 35 are closed to seal the vacuum chamber 31. In this state, the space inside the vacuum chamber 31 is depressurized to create a decompressed space. In this state, infrared rays are irradiated from the infrared light source 32 toward the assembly 100. The infrared rays are irradiated at least onto the portions of the exhaust and sealing jig. As a result, the sealing material of the sealing portion 420C is heated and melted, thereby closing the exhaust hole 50C as already described (see FIG. 16 ).

[0119] Next, the irradiation of infrared rays from infrared light source 32 is stopped to cool sealing portion 420C, thereby producing glass panel unit 10. Next, door 36 at exit 35 of vacuum chamber 31 is opened, and glass panel unit 10 is moved by conveyor 37 through exit 35 to the outside of vacuum chamber 31.

[0120] 3. Aspect A method for manufacturing a glass panel unit (10) of a first aspect includes preparing an assembly (100) including a first glass plate (200), a second glass plate (300) facing the first glass plate (200), and a peripheral wall (410) between the first glass plate (200) and the second glass plate (300) and including a heat-melt sealing material arranged in a frame shape along the outer peripheries of the first glass plate (200) and the second glass plate (300), wherein the first glass plate (200) has a first outer surface (2A) opposite to the second glass plate (300) side, and the second glass plate (300) has a second outer surface (2B) opposite to the first glass plate (200). The manufacturing method also includes installing a plurality of clips (1) around the outer periphery of the assembly (100) so that each of the clips (1) clamps the assembly (100). The manufacturing method also includes joining the first glass plate (200) and the second glass plate (300) at the peripheral wall (410) by irradiating the peripheral wall (410) with infrared rays. Each clip (1) includes a first member (4A), a second member (4B), and an elastic mechanism (5). When the clip (1) is installed on the assembly (100), the assembly (100) is sandwiched between the first member (4A) and the second member (4B) so that the first member (4A) contacts the first outer surface (2A) and the second member (4B) contacts the second outer surface (2B). The elastic mechanism (5) applies an elastic force to the first member (4A) and the second member (4B) to sandwich the assembly (100). Each of the first member (4A) and the second member (4B) has a base (7) connected to the elastic mechanism (5) and an action portion (9) connected to the base (7). The action portion (9) has a contact portion (6) that contacts the assembly (100) in the installed state and a linking portion (8) that does not contact the assembly (100) in the installed state and is interposed between the contact portion (6) and the base (7). In one or both of the action portion (9) of the first member (4A) and the action portion (9) of the second member (4B), the contact portion (6) contacts the assembly (100) only at a position on the opposite side of the peripheral wall (410) from the outer periphery of the assembly (100), and the linking portion (8) has a transparent portion (81) that is infrared transparent.

[0121] According to this aspect, when manufacturing a glass panel unit (10), a clip (1) is installed on an assembly (100) comprising two glass plates and a heat-fusible peripheral wall (410), and infrared rays are irradiated onto the peripheral wall (410) to join the first glass plate (200) and the second glass plate (300), thereby reducing poor joining.

[0122] In the second aspect, in the first aspect, in each of the action portion (9A) of the first member (4A) and the action portion (9B) of the second member (4B), the contact portion (6) contacts the assembly (100) only at a position opposite the outer periphery of the assembly (100) with respect to the peripheral wall (410), and the connecting portion (8) has a transparent portion (81) that is infrared transparent.

[0123] According to this aspect, when manufacturing a glass panel unit (10), a clip (1) is installed on an assembly (100) comprising two glass plates and a heat-fusible peripheral wall (410), and when infrared rays are irradiated onto the peripheral wall (410) to join the first glass plate (200) and the second glass plate (300), poor joining can be further suppressed.

[0124] In a third aspect, in the first or second aspect, the transmitting portion (81) is a notch or an opening formed in the connecting portion (8).

[0125] According to this aspect, when manufacturing a glass panel unit (10), a clip (1) is installed on an assembly (100) comprising two glass plates and a heat-fusible peripheral wall (410), and when infrared rays are irradiated onto the peripheral wall (410) to join the first glass plate (200) and the second glass plate (300), poor joining can be further suppressed.

[0126] In a fourth aspect, in any one of the first to third aspects, the assembly (100) is placed in a reduced pressure space, thereby reducing the pressure in the internal space (500) surrounded by the peripheral wall (410), the first glass plate (200), and the second glass plate (300), and while the internal space (500) is in a reduced pressure state, infrared rays are irradiated onto the peripheral wall (410), thereby joining the first glass plate (200) and the second glass plate (300) at the peripheral wall (410).

[0127] According to this embodiment, a glass panel unit (10) having a vacuum space (50) therein is manufactured.

[0128] In a fifth aspect, in any one of the first to third aspects, one or both of the first glass plate (200) and the second glass plate (300) each have an exhaust hole (50C). Gas in an internal space (500) surrounded by the peripheral wall (410), the first glass plate (200), and the second glass plate (300) is exhausted through the exhaust hole (50C) to reduce the pressure in the internal space (500), and while the internal space (500) is in the reduced pressure state, infrared rays are irradiated onto a sealing portion (420C) including a heat-melt sealing material inserted into the exhaust hole (50C), thereby sealing the exhaust hole (50C).

[0129] According to this embodiment, a glass panel unit (10) having a vacuum space (50) therein is manufactured.

[0130] REFERENCE SIGNS LIST 1 Clip 2A First outer surface 2B Second outer surface 4A First member 4B Second member 5 Elastic mechanism 6 Contact portion 6A Contact portion 6B Contact portion 7 Base 7A Base 7B Base 8 Joint portion 8A Joint portion 8B Joint portion 81 Transmitting portion 81A Transmitting portion 81B Transmitting portion 10 Glass panel unit 100 Assembly 200 First glass plate 300 Second glass plate 410 Peripheral wall 420C Sealing portion 500 Internal space 50C Exhaust hole

Claims

1. A method for manufacturing a glass assembly comprising: preparing an assembly comprising a first glass plate, a second glass plate facing the first glass plate, and a peripheral wall between the first glass plate and the second glass plate, the peripheral wall including a heat-melting sealing material arranged in a frame shape along the outer peripheries of the first glass plate and the second glass plate, the first glass plate having a first outer surface opposite to the second glass plate, and the second glass plate having a second outer surface opposite to the first glass plate; installing a plurality of clips on an outer periphery of the assembly such that each of the clips sandwiches the assembly; and joining the first glass plate and the second glass plate by the peripheral wall by irradiating the peripheral wall with infrared rays, each of the clips comprising a first member, a second member, and an elastic mechanism; and in an installed state in which the clips are installed on the assembly, the assembly is sandwiched between the first member and the second member such that the first member is in contact with the first outer surface and the second member is in contact with the second outer surface, a first member and a second member that are spaced apart from each other by a first elastic mechanism and a second elastic mechanism that applies an elastic force to the first member and the second member to clamp the assembly; each of the first member and the second member having a base connected to the elastic mechanism and an acting portion connected to the base, the acting portion having a contact portion that contacts the assembly in the installed state and a connecting portion that does not contact the assembly in the installed state and is interposed between the contact portion and the base; and in each of either or both of the acting portion of the first member and the acting portion of the second member, the contact portion contacts the assembly only at a position opposite to the outer periphery of the assembly with respect to the peripheral wall, and the connecting portion has a transparent portion that is infrared transparent.

2. A method for manufacturing a glass panel unit as described in claim 1, wherein in each of the action portion of the first member and the action portion of the second member, the contact portion contacts the assembly only at a position opposite the outer periphery of the assembly with respect to the peripheral wall, and the connecting portion has the transparent portion that is infrared transparent.

3. The method for manufacturing a glass panel unit according to claim 1 or 2, wherein the transmissive portion is a notch or an opening formed in the connecting portion.

4. A method for manufacturing a glass panel unit as described in any one of claims 1 to 3, comprising placing the assembly in a reduced pressure space to reduce the pressure in the internal space surrounded by the peripheral wall, the first glass plate, and the second glass plate, and irradiating the peripheral wall with infrared rays while the internal space is in a reduced pressure state to join the first glass plate and the second glass plate by the peripheral wall.

5. A method for manufacturing a glass panel unit as described in any one of claims 1 to 3, wherein one or both of the first glass plate and the second glass plate have an exhaust hole, gas within an internal space surrounded by the peripheral wall and the first and second glass plates is exhausted through the exhaust hole to reduce the pressure in the internal space, and while the internal space is in a reduced pressure state, the exhaust hole is sealed by irradiating infrared rays to a sealing portion including a heat-fusible sealing material inserted into the exhaust hole.

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