Transfer film, method for manufacturing laminate, and method for manufacturing circuit wiring board

Abstract

Provided is a transfer film having a temporary support, an intermediate layer, and a photosensitive layer in this order, the average thickness of the intermediate layer being 2–5 μm, the average thickness of the photosensitive layer being 18–30 μm, and the melt viscosity of the photosensitive layer at 25°C being 1.0 × 106 Pa•s or more. Also provided are a method for manufacturing a laminate and a method for manufacturing a circuit wiring board using the transfer film.

Description

Transfer film, laminate manufacturing method, and circuit wiring board manufacturing method

[0001] The present disclosure relates to a transfer film, a method for manufacturing a laminate, and a method for manufacturing a circuit wiring board.

[0002] Because the number of steps required to obtain a desired pattern is small, a widely used method involves placing a photosensitive layer on a substrate of your choice using a transfer film, exposing the photosensitive layer through a mask, and then developing it.

[0003] An example of a photosensitive resin composition used in the photosensitive layer of a conventional transfer film is described in Patent Document 1. Patent Document 1 (JP 2012-252320 A) describes a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, in which the component (A) contains 50 to 80 mass% of (a1) structural units derived from a benzyl (meth)acrylate derivative, 5 to 40 mass% of (a2) structural units derived from a styrene derivative, 1 to 20 mass% of (a3) ​​structural units derived from a (meth)acrylic acid alkyl ester, and 5 to 30 mass% of (a4) structural units derived from (meth)acrylic acid.

[0004] Further, an example of a conventional transfer film is the photosensitive resin laminate described in Patent Document 2 (WO 2007 / 125992). Patent Document 2 describes a photosensitive resin laminate comprising a support film, and an intermediate layer and a photosensitive resin layer, each having a layer thickness of 0.1 μm to 10 μm, in this order, on the support film, wherein the intermediate layer contains polyvinyl alcohol and one or more compounds selected from the group consisting of compounds represented by the following general formula (I): １ -O-(CH ２ CH ２ O)n １ -R ２ (I) (R １ and R ２ is H or CH ３ These may be the same or different, and n １is an integer of 3 to 25.) Patent Document 1: JP 2012-252320 A Patent Document 2: WO 2007 / 125992

[0005] The problem to be solved by one embodiment of the present disclosure is to provide a transfer film that is excellent in surface stability and resolution after peeling off the temporary support. The problem to be solved by another embodiment of the present disclosure is to provide a method for producing a laminate and a method for producing a circuit wiring board using the transfer film.

[0006] Means for solving the above problems include the following aspects: <1> A temporary support, an intermediate layer, and a photosensitive layer are provided in this order, the intermediate layer has an average thickness of 2 μm to 5 μm, the photosensitive layer has an average thickness of 18 μm to 30 μm, and the photosensitive layer has a melt viscosity of 1.0×10 at 25° C. ６A transfer film having a viscosity of Pa·s or higher. <2> The transfer film according to <1>, wherein both the intermediate layer and the photosensitive layer contain a water-soluble solvent. <3> The transfer film according to <2>, wherein the content of the water-soluble solvent in both the intermediate layer and the photosensitive layer is 0.001% by mass or more, relative to the total mass of each layer. <4> The transfer film according to <2> or <3>, wherein the content of the water-soluble solvent in both the intermediate layer and the photosensitive layer is 0.005% by mass or more, relative to the total mass of each layer. <5> The transfer film according to any one of <2> to <4>, wherein the content of the water-soluble solvent in both the intermediate layer and the photosensitive layer is 0.01% by mass to 1% by mass, relative to the total mass of each layer. <6> The transfer film according to any one of <2> to <5>, wherein the water-soluble solvent in both the intermediate layer and the photosensitive layer contains a solvent having a boiling point of 101°C or higher. <7> The transfer film according to <6>, wherein the solvent having a boiling point of 101°C or higher is an alcohol compound or an ester compound. <8> The transfer film according to any one of <2> to <7>, wherein the water-soluble solvents in the intermediate layer and the photosensitive layer both contain a solvent having a boiling point of 101°C or higher. <9> The transfer film according to any one of <2> to <8>, wherein the intermediate layer and the photosensitive layer both contain a water-soluble solvent A that is the same compound. <10> The transfer film according to any one of <1> to <9>, wherein the adhesion between the intermediate layer and the photosensitive layer is 1.0 gf / cm or more. <11> A method for producing a laminate, comprising, in this order: laminating the transfer film according to any one of <1> to <10> and a substrate; peeling off the temporary support; and performing an exposure treatment and, further, performing a development treatment after the exposure to form a pattern. <12> A method for manufacturing a circuit wiring board, comprising, in this order: a step of manufacturing a laminate by the manufacturing method according to <11>; a step of plating an area where the pattern is not formed to form a conductive pattern; and a step of removing the pattern.

[0007] According to one embodiment of the present disclosure, it is possible to provide a transfer film that is excellent in surface stability and resolution after peeling off the temporary support. According to another embodiment of the present disclosure, it is possible to provide a method for manufacturing a laminate and a method for manufacturing a circuit wiring board using the transfer film.

[0008] FIG. 1 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 2 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 3 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 4 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 5 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 6 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 7 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 8 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 9 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 10 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 11 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. FIG. 12 is a schematic cross-sectional view illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package. 13 and 14 are schematic cross-sectional views illustrating an embodiment of a method for manufacturing a circuit wiring board that is a semiconductor package.

[0009] The present disclosure will be described in detail below. In this disclosure, a numerical range expressed using "to" means a range that includes the numerical values ​​written before and after "to" as the upper and lower limits. In this disclosure, in numerical ranges described in stages, the upper or lower limit value described in a certain numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in numerical ranges described in this specification, the upper or lower limit value described in a certain numerical range may be replaced with a value shown in the examples. In this disclosure, the term "process" includes not only an independent process, but also a process that cannot be clearly distinguished from other processes, as long as the intended purpose of that process is achieved. In this disclosure, "transparent" means that the average transmittance of visible light in the wavelength range of 400 to 700 nm is 80% or more, and preferably 90% or more. In this disclosure, the average transmittance of visible light is a value measured using a spectrophotometer, and can be measured using, for example, a spectrophotometer U-3310 manufactured by Hitachi, Ltd. In this disclosure, unless otherwise specified, the weight average molecular weight (Mw) and number average molecular weight (Mn) are values ​​converted using a gel permeation chromatography (GPC) analyzer using a TSKgel GMHxL, TSKgel G4000HxL, or TSKgel G2000HxL (all trade names manufactured by Tosoh Corporation) column, THF (tetrahydrofuran) as an eluent, a differential refractometer as a detector, and polystyrene as a standard substance. Furthermore, in this specification, unless otherwise specified, the molecular weight of a compound having a molecular weight distribution is the weight average molecular weight (Mw). In the present disclosure, "(meth)acrylic" is a concept that encompasses both acrylic and methacrylic, "(meth)acryloyloxy group" is a concept that encompasses both acryloyloxy group and methacryloyloxy group, "(meth)acrylamide group" is a concept that encompasses both acrylamide group and methacrylamide group, and "(meth)acrylate" is a concept that encompasses both acrylate and methacrylate.

[0010] In the present disclosure, "alkali-soluble" means that the solubility in 100 g of a 1% by mass aqueous sodium carbonate solution at a liquid temperature of 22°C is 0.1 g or more. Therefore, for example, an alkali-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions. In the present disclosure, "water-soluble" means that the solubility in 100 g of water at a pH of 7.0 at a liquid temperature of 22°C is 0.1 g or more. Therefore, for example, a water-soluble resin refers to a resin that satisfies the above-mentioned solubility conditions. In the present disclosure, the "solid content" of a composition refers to the components that form a composition layer formed using the composition. If the composition contains a solvent (organic solvent, water, etc.), it refers to all components excluding the solvent. Furthermore, liquid components that form a composition layer are also considered to be solids. In the present disclosure, the average thickness of a temporary support, intermediate layer, photosensitive layer, etc. is calculated as the average value of any five points measured by cross-sectional observation using a SEM (scanning electron microscope). In the present disclosure, the dielectric loss tangent of the substrate at 24 GHz is measured by a resonator method. As a device for measuring the dielectric loss tangent, a 24 GHz split cylinder resonator manufactured by Kanto Electronics Application Development Co., Ltd. or a device of the same level can be used.

[0011] (Transfer Film) The transfer film according to the present disclosure has a temporary support, an intermediate layer, and a photosensitive layer in this order, the intermediate layer having an average thickness of 2 μm to 5 μm, the photosensitive layer having an average thickness of 18 μm to 30 μm, and the photosensitive layer having a melt viscosity of 1.0×10 at 25° C. ６ It is Pa·s or more.

[0012] In a conventional transfer film having a temporary support, an intermediate layer, and a photosensitive layer, when the temporary support is peeled off after lamination, the intermediate layer absorbs moisture, causing wrinkles in the intermediate layer, deteriorating the surface condition, and the wrinkles cause light scattering during exposure, resulting in a decrease in resolution. Furthermore, when the photosensitive layer is a thick film with an average thickness of 18 μm to 30 μm, the wrinkles are more likely to occur, and the thickness increases the exposure gap, resulting in a decrease in resolution. The transfer film according to the present disclosure has excellent surface condition stability and resolution after peeling off the temporary support. The mechanism by which the above effects are achieved is unclear, but is presumed to be as follows. The transfer film according to the present disclosure has an average thickness of the intermediate layer of 2 μm to 5 μm, an average thickness of the photosensitive layer of 18 μm to 30 μm, and a melt viscosity of the photosensitive layer at 25° C. of 1.0 × 10 ６ When the viscosity is 1.0×10 or more, the intermediate layer itself becomes appropriately thick. Therefore, deformation of the intermediate layer can be suppressed, and the occurrence of wrinkles can be suppressed. Furthermore, when the melt viscosity of the photosensitive layer is 1.0×10 or more, the intermediate layer itself becomes appropriately thick. ６ It is presumed that the hardness of the photosensitive layer, which is at least Pa·s, follows the photosensitive layer and suppresses deformation and wrinkles in the intermediate layer, and that even in the case of a thick photosensitive layer such as that described above, the surface stability and resolution after peeling off the temporary support are excellent.

[0013] The transfer film may have a thermoplastic resin layer between the temporary support and the intermediate layer. The transfer film may have a protective film on the surface of the photosensitive layer opposite to the intermediate layer side. The transfer film according to the present disclosure is suitably used as a transfer film for temporary support peeling exposure.

[0014] <Average Thickness of Intermediate Layer> The average thickness of the intermediate layer is 2 μm to 5 μm, and from the viewpoints of surface stability after peeling off the temporary support and resolution, it is preferably 3 μm to 5 μm, and more preferably 3.5 μm to 4.5 μm.

[0015] <Average Thickness of Photosensitive Layer> The average thickness of the photosensitive layer is 18 μm to 30 μm, and from the viewpoints of crack resistance, surface stability after peeling off the temporary support, and resolution, it is preferably 18 μm to 28 μm, more preferably 18 μm to 25 μm, and even more preferably 18 μm to 22 μm. The value of the average thickness of the photosensitive layer / the average thickness of the intermediate layer is preferably 3.6 to 16, more preferably 4.0 to 13, and even more preferably 4.5 to 10, from the viewpoints of surface stability after peeling off the temporary support and resolution.

[0016] <Melt Viscosity of Photosensitive Layer> The melt viscosity of the photosensitive layer at 25°C is 1.0 x 10 ６ The melt viscosity is 1.0×10 Pa s or more. ６ If the viscosity is less than Pa s, wrinkles will occur on the surface of the intermediate layer after transfer and peeling off the temporary support, which will cause problems during exposure. In addition, the melt viscosity of the photosensitive layer at 25°C should be 1.0 x 10 or less from the viewpoints of transferability, crack resistance, surface stability after peeling off the temporary support, and resolution. ６ Pa・s~1.0×10 ９ Pa s, and preferably 2.0 × 10 ６ Pa・s~5.0×10 ８ Pa s is more preferable, and 4.0 × 10 ６ Pa・s~1.0×10 ８ It is more preferably Pa·s.

[0017] In the present disclosure, the melt viscosity is measured using a rheometer (for example, an Anton Paar MCR302 rheometer) with a 12 mm diameter parallel plate and a Peltier plate (gap: approximately 0.8 mm) under the following conditions. The melt viscosity specified in the present disclosure is the melt viscosity at 25°C. (1) Temperature: 20°C to 125°C (2) Heating rate: 3°C / min (3) Frequency: 0.1 Hz (4) Strain: 0.02%

[0018] <Adhesion Strength Between Intermediate Layer and Photosensitive Layer> From the viewpoints of surface stability after peeling off the temporary support and resolution, the adhesion strength between the intermediate layer and the photosensitive layer is preferably 0.5 gf / cm or more, more preferably 1.0 gf / cm or more, even more preferably 1.0 gf / cm to 20 gf / cm, and particularly preferably 1.0 gf / cm to 4.0 gf / cm, where 1 gf / cm = 9.8 mN / cm.

[0019] In the present disclosure, the adhesion between layers is measured by the following method. A 4.5 cm x 15 cm cutout of Printac C (manufactured by Nitto Denko Corporation) is attached to one side of a measurement sample, and a 4.5 cm x 9 cm cutout is then made so that the width of the tape matches that of the sample. The cutout is subjected to a 90° peel at a peel rate of 100 mm / min at 25°C using a Tensilon universal testing machine manufactured by A&D Corporation, and the adhesion (gf / cm) between layers, for example, between the intermediate layer and the photosensitive layer, is measured.

[0020] <Water-soluble solvent in intermediate layer and photosensitive layer> The intermediate layer preferably contains a water-soluble solvent from the viewpoints of surface stability after peeling off the temporary support and resolution. The photosensitive layer preferably contains a water-soluble solvent from the viewpoints of transferability, crack resistance, surface stability after peeling off the temporary support, and resolution, and it is more preferable that both the intermediate layer and the photosensitive layer contain a water-soluble solvent. When either the intermediate layer or the photosensitive layer, preferably both, contain a water-soluble solvent, the solvents mix with each other near the interface between the intermediate layer and the photosensitive layer, and the hardness of the photosensitive layer allows the solvent to follow the photosensitive layer, suppressing deformation and wrinkles in the intermediate layer and improving adhesion between layers.

[0021] When the intermediate layer and the photosensitive layer contain a water-soluble solvent, each layer may contain one water-soluble solvent alone or two or more water-soluble solvents. In particular, from the viewpoints of transferability, crack resistance, surface stability after peeling off the temporary support, and resolution, it is particularly preferable that both the intermediate layer and the photosensitive layer contain a water-soluble solvent that is the same compound. The water-soluble solvent that is the same compound contained in both the intermediate layer and the photosensitive layer is referred to as "water-soluble solvent A".

[0022] From the viewpoints of surface stability and resolution after peeling off the temporary support, the water-soluble solvent in the intermediate layer preferably contains a solvent having a boiling point of 101°C or higher. From the viewpoints of surface stability and resolution after peeling off the temporary support, the water-soluble solvent in the photosensitive layer preferably contains a solvent having a boiling point of 101°C or higher, and it is more preferable that both the water-soluble solvents in the intermediate layer and the photosensitive layer contain a solvent having a boiling point of 101°C or higher. That is, the water-soluble solvent A is preferably selected from solvents having a boiling point of 101°C or higher. From the viewpoints of surface stability and resolution after peeling off the temporary support, the solvent having a boiling point of 101°C or higher is preferably an alcohol compound or an ester compound, more preferably an alkylene glycol monoether compound or a hydroxycarboxylic acid ester compound, and particularly preferably an alkylene glycol monoether compound or a lactic acid ester compound. Furthermore, from the viewpoints of surface stability after peeling off the temporary support and resolution, the solvent having a boiling point of 101° C. or higher is preferably a solvent having a boiling point of 101° C. to 250° C., more preferably a solvent having a boiling point of 110° C. to 200° C., and particularly preferably a solvent having a boiling point of 120° C. to 180° C. Depending on the method for forming each layer, such as drying conditions, the water-soluble solvent used when forming the intermediate layer or the photosensitive layer, or the water-soluble solvent contained in the intermediate layer or the photosensitive layer, may migrate to the other layer.

[0023] The water-soluble solvent may be any water-soluble solvent other than water, and examples thereof include alcohol compounds, ketone compounds, ester compounds, etc. Among these, from the viewpoints of surface stability after peeling off the temporary support and resolution, the water-soluble solvent is preferably an alcohol compound or an ester compound, more preferably an alkylene glycol monoether compound or a hydroxycarboxylic acid ester compound, and particularly preferably an alkylene glycol monoether compound or a lactic acid ester compound. Examples of the alcohol compound include monoalcohol compounds and polyhydric alcohol compounds, such as monoalcohol compounds such as methanol, ethanol, 1-propanol, isopropyl alcohol, 1-butanol, isobutanol, s-butanol, t-butanol, 1-pentanol, 1-hexanol, cyclohexanol, 1-heptanol, 1-octanol, 2-octanol, 2-ethylhexanol, 2-propyl-1-hexanol, 1-nonanol, and 1-decanol; polyhydric alcohol compounds such as ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, glycerin, 1,2,6-hexanetriol, trimethylolpropane, 1,3-butanediol, 1,4-butanediol, 2-butene-1,4-diol, 2-ethyl-1,3-hexanediol, 2-methyl-2,4-pentanediol, 1,2-octanediol, 1,2-hexanediol, 1,2-pentanediol, 4-methyl-1,2-pentanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, pentaethylene glycol, dipropylene glycol, and polyoxyethylene polyoxypropylene glycol; Examples thereof include (poly)alkylene glycol monoether compounds such as ethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, triethylene glycol monoalkyl ether, tripropylene glycol monoalkyl ether, and polyoxypropylene glyceryl ether; and ethyl lactate, which is a lactate ester of ethanol.Other water-soluble solvents include dimethylaminoethanol, 2-amino-2-methyl-1-propanol, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, sugars, sugar alcohols, hyaluronic acids, etc. Furthermore, from the viewpoints of surface stability after peeling off the temporary support and resolution, the water-soluble solvent in the present disclosure is preferably a compound having a molecular weight of 500 or less, more preferably a compound having a molecular weight of 300 or less, and particularly preferably a compound having a molecular weight of 200 or less. Among these, it is particularly preferable to include a water-soluble solvent selected from the group consisting of propylene glycol monomethyl ether (propylene glycol monomethyl ether) and ethyl lactate.

[0024] From the viewpoints of surface stability after peeling off the temporary support and resolution, the content of the water-soluble solvent in the intermediate layer is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, even more preferably 0.005% by mass to 0.5% by mass, and particularly preferably 0.01% by mass to 0.3% by mass, relative to the total mass of the intermediate layer.

[0025] From the viewpoints of transferability, crack resistance, surface stability after peeling off the temporary support, and resolution, the content of the water-soluble solvent in the photosensitive layer is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, even more preferably 0.005% by mass to 1% by mass, and particularly preferably 0.05% by mass to 0.8% by mass, relative to the total mass of the photosensitive layer. Furthermore, from the viewpoints of transferability, crack resistance, surface stability after peeling off the temporary support, and resolution, the content of the water-soluble solvent in both the intermediate layer and the photosensitive layer is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, and even more preferably 0.01% by mass to 1% by mass. Furthermore, from the viewpoints of surface stability after peeling off the temporary support and resolution, the content of the water-soluble solvent in the photosensitive layer is preferably greater than the content of the water-soluble solvent in the intermediate layer.

[0026] The configuration of the transfer film other than that described above will be described in detail below.

[0027] <Temporary Support> The temporary support is a member that supports the photosensitive layer and the like, and is ultimately removed by a peeling treatment.

[0028] The temporary support may have a single-layer structure or a multi-layer structure. The temporary support is preferably a film, more preferably a resin film. The temporary support is preferably a film that is flexible and does not undergo significant deformation, shrinkage, or elongation under pressure, or under pressure and heat. Examples of the film include polyethylene terephthalate film, polymethyl methacrylate film, cellulose triacetate film, polystyrene film, polyimide film, polycarbonate film, etc. The resin film may be a stretched film or a non-stretched film, but is preferably a stretched film, and more preferably a biaxially stretched film. Among these, polyethylene terephthalate film is preferred as the temporary support. Furthermore, it is preferable that the film used as the temporary support is free of deformation such as wrinkles, scratches, etc.

[0029] The thickness of the temporary support is not particularly limited, but is preferably 5.0 μm to 200.0 μm, and from the viewpoint of ease of handling and versatility, is more preferably 5.0 μm to 150.0 μm, still more preferably 5.0 μm to 50.0 μm, and particularly preferably 5.0 μm to 25.0 μm.

[0030] To improve handling properties, a layer containing fine particles (lubricant layer) may be provided on the surface of the temporary support. The lubricant layer may be provided on one side or both sides of the temporary support. The diameter of the particles contained in the lubricant layer is preferably 0.05 μm to 0.8 μm. The film thickness of the lubricant layer is preferably 0.05 μm to 1.0 μm.

[0031] From the viewpoint of releasability and resolution of the temporary support, the surface free energy of the surface of the temporary support on the intermediate layer side is 66.0 mJ / m ２ Preferably, 63.0 mJ / m or less ２ More preferably, it is 60.0 mJ / m or less. ２From the viewpoint of adhesion of the coating film, the lower limit of the surface free energy is more preferably 35 mJ / m or less. ２ It is preferable that the concentration is 40 mJ / m or more. ２ More preferably, 45 mJ / m or more ２ More preferably, it is equal to or greater than this.

[0032] In one embodiment, the temporary support may be one consisting of only a substrate; a laminate comprising a substrate and a particle-containing layer disposed on one surface of the substrate; or a laminate comprising a substrate and particle-containing layers disposed on both surfaces of the substrate.

[0033] Examples of the substrate constituting the temporary support include the above-mentioned resin film, glass, paper, etc. The substrate constituting the temporary support is preferably a resin film from the viewpoints of strength, flexibility, and light transmittance. The resin film is preferably a polyethylene terephthalate film, more preferably a biaxially stretched polyethylene terephthalate film.

[0034] When a particle-containing layer is disposed on one or both surfaces of the substrate, the particle-containing layer may be one layer or two or more layers.

[0035] The particle-containing layer can be formed, for example, by applying a composition for the particle-containing layer onto a substrate and drying the composition. Alternatively, the particle-containing layer can be disposed by co-extrusion when forming a resin film.

[0036] The particle-containing layer composition preferably contains a binder polymer and particles. The type of binder polymer is not particularly limited and can be appropriately selected depending on the purpose. Examples of binder polymers include acrylic resins, urethane resins, olefin resins, styrene-butadiene resins, ester resins, vinyl chloride resins, and vinylidene chloride resins. When the particle-containing layer is disposed by co-extrusion, polyethylene terephthalate is preferably used as the binder polymer.

[0037] The particle-containing layer may contain one kind of binder polymer and one kind of particles, or may contain two or more kinds of binder polymer and one kind of particles.

[0038] The particles contained in the particle-containing layer are not particularly limited and can be appropriately selected depending on the purpose. The content of particles in the particle-containing layer can be appropriately adjusted by the amount of particles added to the composition for the particle-containing layer. In this specification, the particles contained in the particle-containing layer are referred to as "added particles."

[0039] The additive particles are to be distinguished from impurities unexpectedly mixed in during the manufacturing process of the temporary support and particles formed during the manufacturing process of the temporary support. The additive particles are preferably particles that do not melt at 200°C.

[0040] Whether or not the temporary support contains additive particles can be determined, for example, by the following method: Additive particles usually have uniform shape and distribution, and therefore can be determined by observation with an optical microscope.

[0041] Examples of the additive particles include inorganic particles and organic particles. Examples of the inorganic particles include particles of inorganic oxides such as silicon oxide (silica), titanium oxide (titania), zirconium oxide (zirconia), magnesium oxide (magnesia), and aluminum oxide (alumina). Examples of the organic particles include particles of polymers such as acrylic resin, polyester, polyurethane, polycarbonate, polyolefin, and polystyrene. When the temporary support has a particle-containing layer, the additive particles contained in the particle-containing layer are preferably particles of inorganic oxides.

[0042] The average particle size of the additive particles is not particularly limited, but is, for example, 0.1 μm to 10 μm. The average particle size is measured by cutting a 100 nm thick slice with an ultramicrotome and using a TEM (transmission electron microscope).

[0043] In the transfer film according to the present disclosure, the thermal deformation rate of the temporary support is 1.0% or less, preferably 0.5% or less. The lower limit of the thermal deformation rate is not particularly limited, and is preferably 0%. By making the thermal deformation rate of the temporary support 1.0% or less, deformation of the substrate to be bonded to the transfer film is suppressed.

[0044] In the present disclosure, the thermal deformation rate is measured by the following method. The direction parallel to one of two pairs of opposing sides on the main surface of the temporary support is defined as the A direction, and the direction perpendicular to the A direction is defined as the B direction. A test piece cut to a length of 30 mm in the A direction and a length of 4 mm in the B direction, and another test piece cut to a length of 30 mm in the B direction and a length of 4 mm in the A direction, are prepared. The following measurements are performed using the two test pieces. A thermal expansion measurement device (for example, product name "TMA450EM", manufactured by TA Instruments) is used as the measurement device. The measurement conditions are as follows: Measurement mode: Tensile mode; Grip distance: 16 mm; Set load: Vary from 0.05 N to 0.48 N at a rate of 6.00 N / min; Each test piece is heated from 25°C to 100°C at a heating rate of 20°C / min, and the elongation of each test piece is measured five times, and the average value is calculated. The larger average value of the elongation percentages of the two test pieces is used as the thermal deformation percentage.

[0045] Examples of methods for reducing the thermal deformation rate of the temporary support include increasing the thickness of the temporary support and incorporating particles into the temporary support to increase the amount of particles contained in the temporary support.

[0046] In the transfer film according to the present disclosure, the haze of the temporary support is preferably greater than 2.0%, from the viewpoint of suppressing deformation of the substrate to which the transfer film is attached.

[0047] From the above viewpoint, the haze of the temporary support is more preferably 2.5% or more. The upper limit of the haze is not particularly limited, and is, for example, 10%.

[0048] When forming a pattern using the transfer film according to the present disclosure, it is preferable to peel off the temporary support after laminating the transfer film to a substrate and before exposure. If the temporary support is peeled off before exposure, it is not necessary to consider the influence of high haze on the temporary support on exposure.

[0049] In the present disclosure, haze is measured using a haze meter in accordance with JIS K7136: 2000. For example, a haze meter manufactured by Nippon Denshoku Industries Co., Ltd. under the product name "NDH-2000" is used.

[0050] In addition, in the transfer film according to the present disclosure, from the viewpoint of suppressing deformation of the substrate to which the transfer film is attached, the total number of particles having a diameter of 5 μm or more and aggregates having a diameter of 5 μm or more contained in the temporary support is set to 30 particles / mm ２ More is preferable.

[0051] From the above viewpoint, the total number of particles and aggregates is 40 / mm ２ The upper limit of the total number is not particularly limited, and is, for example, 50 pieces / mm ２ is.

[0052] The particles and aggregates referred to here mean those having an area in which a difference in polarization from the surrounding area can be observed when the temporary support is observed under a polarizing microscope. Examples of particles and aggregates include carbonized resins formed during the production of the substrate and catalysts used in the production of the substrate. In addition, when a particle-containing layer such as that described above is provided, the added particles contained in the particle-containing layer also fall under the category of the above particles.

[0053] In the present disclosure, the total number of particles and aggregates contained in the temporary support is measured by the following method.

[0054] First, the temporary support is observed with a polarizing microscope (a simple polarizing microscope formed by inserting a "U-POT" filter and a "U-AN360" filter into a product name "BX60", 10x objective lens, manufactured by Olympus Corporation), and the portion where the polarization is disturbed is identified as a foreign substance (particle or aggregate). The identified foreign substance is observed with an incident-light laser microscope (product name "confocal laser microscope VL2000D", manufactured by Lasertec Corporation). In addition, the diameter of the foreign substance is measured with an optical microscope (product name "BX60", 100x objective lens, manufactured by Olympus Corporation), and the diameter of the foreign substance is measured over an observation area of ​​1 mm. ２ The number of foreign particles with a diameter of 5 μm or more contained in the foreign particle is counted. If the foreign particle contains a void, the diameter is measured including the void. If the foreign particle is not circular, the longest diameter is measured.

[0055] When forming a pattern using the transfer film according to the present disclosure, it is preferable to peel off the temporary support after laminating the transfer film to the substrate and before exposure. If the temporary support is peeled off before exposure, it is not necessary to consider the influence on exposure of the large amount of particles and aggregates contained in the temporary support.

[0056] In addition, in the transfer film according to the present disclosure, from the viewpoint of suppressing deformation of the substrate to which the transfer film is bonded, the temporary support is 13.5 mm when measured by an incident-light laser microscope. ２ It is preferable that the total area ratio of the optically abnormal region when observed over an area of ​​100 ppm or more is greater than 300 ppm.

[0057] From the above viewpoint, the total area ratio of the optically abnormal region is more preferably 350 ppm or more. The upper limit of the total area ratio is not particularly limited, and is, for example, 500 ppm.

[0058] In the present disclosure, the area of ​​the optically abnormal region means the area of ​​the optically abnormal region observed in a region extending from the center position of the thickness of the temporary support to 2 μm in one direction or the other in the thickness direction.

[0059] In the present disclosure, an optically abnormal region is a region whose optical properties are different from those of the main region of the temporary support (the resin constituting the temporary support) (specifically, a region whose reflectance or refractive index is different from that of the main region, or a region in which optical phenomena such as scattering and diffraction occur more strongly than in the main region). When the temporary support contains, for example, particles, the optically abnormal region may include both a light-shielding portion caused by the particles and an optically abnormal region other than the particles (for example, an abnormal refractive index region having a refractive index different from that of the particles and the main region of the temporary support). Examples of the optically abnormal region include a region whose orientation and / or crystallinity is different from that of the main region of the temporary support, an air region, a region of gas other than air, a void region where gas is almost absent, etc.

[0060] In the present disclosure, the total area of ​​the optically abnormal region is measured in the following manner.

[0061] A polarizing filter (OLS4000-QWP) is inserted above the objective lens of an incident-light laser microscope (OLS-4100, manufactured by Olympus). Next, a temporary support cut to 30 mm x 30 mm is horizontally suction-fixed onto the stage of the laser microscope using a porous suction plate (65F-HG, manufactured by Universal Giken) and a vacuum pump. The suction-fixed temporary support is observed under conditions of a 50x objective lens and a laser light intensity of 60 (laser wavelength: 405 nm). At this time, the measurement area is defined as an area extending 2 μm from the center position of the thickness of the temporary support to one side or the other in the thickness direction, and measurements are performed at 200 measurement points over a measurement area of ​​259 μm x 260 μm. Therefore, the total measurement area is 0.259 mm x 0.26 mm x 200 = 13.5 mm ２ This becomes:

[0062] The difference in light intensity between the pixel with the maximum light intensity and the pixel with the minimum light intensity in the measured image is divided into 4096 gradations (the maximum light intensity value is 4095 and the minimum light intensity value is 0). A histogram (horizontal axis: light intensity gradation (minimum value 0, maximum value 4095), vertical axis: number of pixels) is created, graphing the light intensity distribution of the pixels in the image. The measured image is binarized using a gradation obtained by adding 400 gradations to the value of the larger of the two base values ​​of the created histogram as the threshold, and the areas of pixels with a light intensity greater than the threshold are summed up, and this total area is taken as the total area of ​​the optical anomalous regions. The ratio of the total area of ​​the optical anomalous regions to the measured area is calculated.

[0063] From the viewpoint of improving adhesion to the intermediate layer, the surface of the temporary support that comes into contact with the intermediate layer may be subjected to a surface treatment such as ultraviolet irradiation, corona discharge, plasma treatment, etc. When the surface treatment is performed by ultraviolet irradiation, the exposure dose is 10 mJ / cm ２ ~2,000mJ / cm ２ and preferably 50 mJ / cm ２ ~1,000mJ / cm ２ It is more preferable that:

[0064] Examples of light sources for ultraviolet irradiation include light sources that emit light in the wavelength band of 150 nm to 450 nm (e.g., low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, high-pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, electrodeless discharge lamps, and light-emitting diodes (LEDs)). There are no particular limitations on the output and illuminance.

[0065] The intermediate layer is preferably in contact with the surface of the temporary support. From the viewpoint of transferring the irregularities of the temporary support to the intermediate layer, the surface roughness Rmax of the temporary support on the intermediate layer side is preferably 0.5 μm or less, and more preferably 0.01 μm to 0.5 μm.

[0066] The surface roughness Rmax of the intermediate layer side surface of the temporary support is measured by the following method. In the present disclosure, the surface roughness Rmax is measured using a three-dimensional optical profiler (e.g., New View 7300, manufactured by Zygo). First, the temporary support is peeled off from the transfer film. A surface profile of the intermediate layer side surface of the temporary support is obtained. As the measurement and analysis software, Microscope Application of MetroPro ver. 8.3.2 is used. Next, a Surface Map screen is displayed using the measurement and analysis software, and histogram data is obtained on the Surface Map screen. The surface roughness Rmax is obtained from the obtained histogram data. The surface roughness Rmax corresponds to the maximum height of the roughness curve in the reference length.

[0067] The temporary support may be a recycled product. Examples of recycled products include those obtained by cleaning used films and then chipping them, and then forming the chips into a film. Specific examples of recycled products include the Ecouse series from Toray Industries, Inc.

[0068] <Intermediate Layer> The transfer film according to the present disclosure has an intermediate layer between the temporary support and the photosensitive layer. The intermediate layer preferably has oxygen blocking ability. When the intermediate layer has oxygen blocking ability, the sensitivity during exposure is improved, the time load on the exposure machine can be reduced, and productivity can be improved. Furthermore, when the photosensitive layer in the transfer film is a negative photosensitive layer containing a radical polymerizable compound, there is also the advantage that oxygen inhibition is less likely to occur in the polymerization reaction during exposure.

[0069] The intermediate layer may contain one or more water-soluble resins, such as polyvinyl alcohol, polyvinylpyrrolidone, water-soluble cellulose compounds, (meth)acrylamide, polyether compounds, gelatin, vinyl ether compounds, polyamides, phenolic compounds, and copolymers thereof.

[0070] From the viewpoints of the releasability of the temporary support, resolution, oxygen blocking ability, and defect suppression in the pattern (hereinafter also simply referred to as "defect suppression"), the intermediate layer preferably contains at least one of polyvinyl alcohol and polyvinylpyrrolidone, more preferably contains polyvinyl alcohol, and even more preferably contains polyvinyl alcohol and polyvinylpyrrolidone.

[0071] When the intermediate layer contains polyvinyl alcohol, from the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the content of polyvinyl alcohol relative to the total mass of the intermediate layer is preferably 5% by mass to 95% by mass, more preferably 15% by mass to 90% by mass, even more preferably 25% by mass to 80% by mass, particularly preferably 50% by mass to 75% by mass, and most preferably 55% by mass to 70% by mass. When the intermediate layer contains polyvinylpyrrolidone, from the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the content of polyvinylpyrrolidone relative to the total mass of the intermediate layer is preferably 20% by mass to 98% by mass, more preferably 23% by mass to 90% by mass, even more preferably 25% by mass to 75% by mass, and particularly preferably 25% by mass to 50% by mass. When the intermediate layer contains polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, etc., the sum of the contents of polyvinyl alcohol and polyvinylpyrrolidone relative to the total mass of the intermediate layer is preferably 50% by mass to 99% by mass, more preferably 70% by mass to 99% by mass, and even more preferably 75% by mass to 99% by mass.

[0072] From the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the intermediate layer preferably contains one or more compounds X selected from the group consisting of water-soluble cellulose compounds, polyether compounds, phenol compounds, and polyhydric alcohol compounds. Examples of water-soluble cellulose compounds include hydroxyethyl cellulose, hydroxypropyl methylcellulose, hydroxypropyl cellulose, methyl cellulose, ethyl cellulose, etc. Examples of polyether compounds include polyethylene glycol and polypropylene glycol. Examples of phenol compounds include bisphenol A and bisphenol S, etc. Examples of polyhydric alcohol compounds include glycerin, diglycerin, diethylene glycol, etc. From the viewpoints of releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the intermediate layer preferably contains one or more compounds X selected from the group consisting of hydroxypropyl methylcellulose, polyethylene glycol, bisphenol A, and glycerin, more preferably one or more compounds X selected from the group consisting of hydroxypropyl methylcellulose and polyethylene glycol, and even more preferably hydroxypropyl methylcellulose.

[0073] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression ability, and the like, when the intermediate layer contains compound X, the sum of the contents of compound X relative to the total mass of the intermediate layer is preferably 0.1% by mass to 36% by mass, more preferably 0.5% by mass to 20% by mass, and even more preferably 1% by mass to 15% by mass.

[0074] From the viewpoints of temporary support releasability, resolution, oxygen blocking ability, defect suppression, etc., the intermediate layer preferably contains at least one of polyvinyl alcohol and polyvinylpyrrolidone and compound X, more preferably polyvinyl alcohol and compound X, and even more preferably polyvinyl alcohol, polyvinylpyrrolidone, and compound X. When the intermediate layer has the above-mentioned composition, compound X is more likely to be unevenly distributed on the surface of the intermediate layer facing the temporary support, and the formation of a WBL (weak boundary layer) layer due to mixing of the intermediate layer and the photosensitive layer can be suppressed. As a result, the surface free energy of the intermediate layer facing the temporary support is adjusted to an appropriate value, thereby further improving temporary support releasability and resolution.

[0075] From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression ability, etc. of the temporary support, the weight average molecular weight (Mw) of the water-soluble resin is preferably 5,000 to 200,000, more preferably 7,000 to 100,000, and even more preferably 7,000 to 50,000. From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression ability, etc. of the temporary support, the dispersity (Mw / Mn) of the water-soluble resin is preferably 1 to 10, and more preferably 1 to 5.

[0076] From the viewpoints of the releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, etc., the content of the water-soluble resin relative to the total mass of the intermediate layer is preferably 60 mass% or more, preferably 80 mass% or more, preferably 95 mass% or more, and may be 100 mass%.

[0077] The intermediate layer may contain a surfactant. The intermediate layer may contain two or more types of surfactants. The surfactant preferably contains one or more selected from the group consisting of nonionic surfactants, fluorine-based surfactants, and silicone-based surfactants. From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression, etc. of the temporary support, the surfactant preferably contains a silicone-based surfactant. Silicon-based surfactants are also preferred from the viewpoint of improving the adhesion (hereinafter also referred to as "interlayer adhesion") between the intermediate layer and adjacent layers (photosensitive layer, thermoplastic resin, etc.). From the viewpoints of the releasability, resolution, oxygen blocking ability, defect suppression, interlayer adhesion, etc. of the temporary support, the content of the silicone-based surfactant relative to the total mass of the surfactants is preferably 60% by mass or more, preferably 80% by mass or more, preferably 95% by mass or more, and even 100% by mass. Examples of silicone-based surfactants include linear polymers composed of siloxane bonds and modified siloxane polymers in which an organic group has been introduced into at least one of the side chains and the terminals.

[0078] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, defect suppression, interlayer adhesion, and the like, the content of the surfactant relative to the total mass of the intermediate layer is preferably 0.1 mass % to 10 mass %, more preferably 0.5 mass % to 7 mass %, and even more preferably 1 mass % to 5 mass %.

[0079] The intermediate layer may contain a water-insoluble resin. Examples of the water-insoluble resin include polyester resin and (meth)acrylic resin. When the intermediate layer contains a water-insoluble resin, the content of the water-insoluble resin relative to the total mass of the intermediate layer is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less.

[0080] The intermediate layer may contain additives such as colorants, flame retardants, antioxidants, anti-rust agents, dispersants, and the like.

[0081] <Photosensitive Layer> The photosensitive layer may be a positive photosensitive layer or a negative photosensitive layer, but in the transfer film according to the present disclosure, it is preferably a negative photosensitive layer. A negative photosensitive layer is a photosensitive layer in which the solubility of the exposed portion in a developer decreases upon exposure. When the photosensitive layer is a negative photosensitive layer, the formed pattern corresponds to a cured layer.

[0082] The photosensitive layer preferably contains a polymer (binder polymer). The photosensitive layer may contain one or more types of polymer. The polymer is preferably an alkali-soluble resin. The polymer may contain a structural unit formed by a monomer having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphate group, and a phosphonic acid group. Examples of the monomer having an acid group include (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, and maleic anhydride. The polymer may contain a structural unit formed by a monomer not having an acid group. Examples of the monomer not having an acid group include (meth)acrylic acid esters, ester compounds of vinyl alcohol, (meth)acrylonitrile, and aromatic vinyl compounds. Examples of (meth)acrylic acid esters include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and benzyl (meth)acrylate. Examples of vinyl alcohol ester compounds include vinyl acetate. Examples of aromatic vinyl compounds include styrene and styrene derivatives. The non-acidic monomer is preferably one or more monomers selected from the group consisting of methyl (meth)acrylate, n-butyl (meth)acrylate, styrene, styrene derivatives, and benzyl (meth)acrylate.

[0083] From the viewpoint of resolution, the alkali-soluble resin preferably contains at least one of a structural unit derived from styrene and a structural unit derived from a styrene derivative. Specific examples of the styrene derivative include vinyltoluene, p-methylstyrene, and p-chlorostyrene.

[0084] The copolymerization ratio of the styrene-derived structural unit and the styrene derivative-derived structural unit in the alkali-soluble resin is preferably 5% by mass to 60% by mass, more preferably 10% by mass to 50% by mass, and even more preferably 15% by mass to 40% by mass, relative to the total mass of the alkali-soluble resin.

[0085] From the viewpoint of adhesion, the alkali-soluble resin preferably contains a structural unit derived from a (meth)acrylic acid ester. When the alkali-soluble resin contains at least one of a structural unit derived from styrene and a structural unit derived from a styrene derivative, and a structural unit derived from a (meth)acrylic acid ester, when the content of the structural unit derived from styrene and the structural unit derived from a styrene derivative is taken as 1, from the viewpoint of achieving both resolution and adhesion, the content of the structural unit derived from a (meth)acrylic acid ester is preferably 0.3 to 2.5, more preferably 0.5 to 2.0, and even more preferably 0.7 to 1.7.

[0086] From the viewpoints of resolution, developability, and the like, the weight average molecular weight (Mw) of the polymer is preferably 5,000 to 500,000, more preferably 10,000 to 100,000, and even more preferably 30,000 to 60,000. The dispersity (Mw / Mn) of the polymer is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, even more preferably 1.0 to 4.0, and particularly preferably 1.0 to 3.0.

[0087] From the viewpoint of resolution, developability, and the like, the acid value of the polymer is preferably 60 mgKOH / g to 220 mgKOH / g, more preferably 120 mgKOH / g to 200 mgKOH / g, and even more preferably 150 mgKOH / g to 190 mgKOH / g.

[0088] The acid value (mg KOH / g) is the mass (mg) of potassium hydroxide required to neutralize 1 g of sample. The acid value can be determined, for example, according to the method described in JIS K0070:1992. The acid value of the polymer can be adjusted by changing the type of constituent unit and the content of the constituent unit containing an acid group.

[0089] From the viewpoints of resolution, developability, and the like, the content of the polymer relative to the total mass of the photosensitive layer is preferably 30% by mass to 70% by mass, more preferably 40% by mass to 60% by mass, and even more preferably 45% by mass to 57% by mass.

[0090] The photosensitive layer may contain one or more polymerizable compounds. The polymerizable compound is not limited, and known polymerizable compounds can be used. The polymerizable compound is preferably an ethylenically unsaturated compound. The ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups. The ethylenically unsaturated group is preferably a (meth)acryloyl group. The ethylenically unsaturated compound is preferably a (meth)acrylate compound. As the ethylenically unsaturated compound, an ethylenically unsaturated compound having a bisphenol structure is also preferably used. As the ethylenically unsaturated compound having a bisphenol structure, alkylene oxide-modified bisphenol A di(meth)acrylate can be used. Examples of alkylene oxide-modified bisphenol A di(meth)acrylates include ethylene glycol dimethacrylates in which an average of 5 moles of ethylene oxide have been added to each end of bisphenol A, ethylene glycol dimethacrylates in which an average of 2 moles of ethylene oxide have been added to each end of bisphenol A, ethylene glycol dimethacrylates in which an average of 5 moles of ethylene oxide have been added to each end of bisphenol A, alkylene glycol dimethacrylates in which an average of 6 moles of ethylene oxide and an average of 2 moles of propylene oxide have been added to each end of bisphenol A, and alkylene glycol dimethacrylates in which an average of 15 moles of ethylene oxide and an average of 2 moles of propylene oxide have been added to each end of bisphenol A. Specific examples of alkylene oxide-modified bisphenol A di(meth)acrylates include 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane and 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane.

[0091] The molecular weight of the polymerizable compound is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200. When the polymerizable compound is a compound having a molecular weight distribution (for example, a polymer), the weight average molecular weight of the polymerizable compound is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200.

[0092] The content of the polymerizable compound is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, and even more preferably 20% by mass to 50% by mass, relative to the total mass of the photosensitive layer.

[0093] From the viewpoints of resolution, oxygen blocking ability, etc., the photosensitive layer preferably contains one or more of the above surfactants. Preferred aspects of the surfactant are as explained for the intermediate layer, and will not be explained here. From the viewpoints of resolution, oxygen blocking ability, etc., the content of the surfactant relative to the total mass of the photosensitive layer is preferably 0.05% by mass to 5% by mass, more preferably 0.1% by mass to 3% by mass, and even more preferably 0.2% by mass to 1% by mass.

[0094] The photosensitive layer may contain one or more polymerization initiators, such as conventionally known radical polymerization initiators and cationic polymerization initiators.

[0095] The content of the polymerization initiator relative to the total mass of the photosensitive layer is not particularly limited, and in one embodiment, it can be, for example, 1% by mass to 10% by mass.

[0096] The photosensitive layer may contain additives such as colorants, sensitizers, chain transfer agents (N-phenylcarbamoylmethyl-N-carboxymethylaniline, N,N-tetraethyl-4,4-diaminobenzophenone, etc.), polymerization inhibitors, plasticizers, flame retardants, antioxidants, rust inhibitors, dispersants, and thermally crosslinkable compounds (methylol compounds, blocked isocyanate compounds, etc.).

[0097] <Thermoplastic Resin Layer> The transfer film may have a thermoplastic resin layer between the temporary support and the intermediate layer. The thermoplastic resin layer may contain one or more surfactants. Preferred aspects of the surfactant are as described for the intermediate layer, and will not be described here. From the viewpoints of temporary support releasability, resolution, oxygen blocking ability, etc., the content of the surfactant relative to the total mass of the thermoplastic resin layer is preferably 0.01% by mass to 3% by mass, more preferably 0.02% by mass to 1% by mass, and even more preferably 0.03% by mass to 0.3% by mass.

[0098] The thermoplastic resin layer may contain one or more thermoplastic resins. The thermoplastic resin is not particularly limited as long as it is a resin that plasticizes when heated, but examples include acrylic resins, polystyrene resins, styrene-acrylic copolymers, polyurethane resins, polyvinyl alcohol, polyvinyl formal, polyamide resins, polyester resins, polyamide resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimine, polyallylamine, and polyalkylene glycols. Among these, from the viewpoint of developability and transferability, the thermoplastic resin is preferably an acrylic resin. Here, the acrylic resin refers to a resin having at least one structural unit selected from the group consisting of structural units formed from (meth)acrylic acid, structural units formed from (meth)acrylic acid esters, and structural units formed from (meth)acrylic acid amides, and the content of the structural unit is preferably 50% by mass or more relative to the total amount of the resin.

[0099] From the viewpoint of developability, the thermoplastic resin preferably has an acid group.

[0100] From the viewpoints of resolution, developability, and the like, the weight average molecular weight (Mw) of the thermoplastic resin is preferably 5,000 to 500,000, more preferably 10,000 to 100,000, and even more preferably 30,000 to 60,000. The dispersity (Mw / Mn) of the thermoplastic resin is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, even more preferably 1.0 to 4.0, and particularly preferably 1.0 to 3.0.

[0101] From the viewpoint of resolution, developability, and the like, the acid value of the thermoplastic resin is preferably 60 mgKOH / g to 220 mgKOH / g, more preferably 120 mgKOH / g to 200 mgKOH / g, and even more preferably 150 mgKOH / g to 190 mgKOH / g.

[0102] From the viewpoint of film strength, the content of the thermoplastic resin relative to the total mass of the thermoplastic resin layer is preferably 10% by mass to 80% by mass, more preferably 30% by mass to 75% by mass, and even more preferably 50% by mass to 65% by mass.

[0103] The thermoplastic resin layer may contain one or more plasticizers. The plasticizer is not particularly limited as long as it is a compound that is compatible with the thermoplastic resin and exhibits plasticity. From the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and is more preferably a polyalkylene glycol compound. The alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure. The plasticizer is preferably a (meth)acrylate compound.

[0104] From the viewpoint of lamination properties, the content of the plasticizer relative to the total mass of the thermoplastic resin layer is preferably 15% by mass to 60% by mass, more preferably 25% by mass to 50% by mass, and even more preferably 35% by mass to 40% by mass.

[0105] The thermoplastic resin layer may contain additives such as colorants, dyes, acid generators, flame retardants, antioxidants, rust inhibitors, and dispersants.

[0106] From the viewpoints of releasability of the temporary support, resolution, oxygen blocking ability, etc., the average thickness of the thermoplastic resin layer is preferably 1.0 μm to 20.0 μm, and more preferably 2.0 μm to 15.0 μm.

[0107] <Protective Film> The transfer film may have a protective film on the surface opposite to the intermediate layer side of the photosensitive layer. A resin film can be used as the protective film. Examples of the resin film include polyolefin films such as polypropylene film and polyethylene film, polyester films such as polyethylene terephthalate film, polycarbonate film, and polystyrene film. Among these, from the viewpoint of heat resistance, the protective film is preferably a polyolefin film, more preferably a polypropylene film or a polyethylene film, and even more preferably a polyethylene film.

[0108] The average thickness of the protective film is not particularly limited. From the viewpoint of mechanical strength, the average thickness of the protective film is preferably 1.0 μm to 100.0 μm, more preferably 5.0 μm to 50.0 μm, and even more preferably 5.0 μm to 40.0 μm.

[0109] <Uses of Transfer Film> The transfer film according to the present disclosure is preferably used for forming circuit wiring arranged on a support substrate such as a sheet, a metal substrate, a ceramic substrate, or glass in a manufacturing process film for a semiconductor package, a printed circuit board, a flexible printed wiring board, or an interposer rewiring layer.

[0110] <Method for Manufacturing Transfer Film> The method for manufacturing a transfer film according to the present disclosure is not particularly limited. For example, in one embodiment, the method for manufacturing a transfer film according to the present disclosure preferably includes a step of applying an intermediate layer-forming composition to the surface of a temporary support and drying it to form an intermediate layer (hereinafter referred to as an intermediate layer-forming step), and a step of applying a photosensitive layer-forming composition to the surface of the intermediate layer and drying it to form a photosensitive layer (hereinafter referred to as a photosensitive layer-forming step). Furthermore, the method for manufacturing a transfer film according to the present disclosure preferably includes a step of applying a thermoplastic resin-forming composition to the surface of a temporary support and drying it to form a thermoplastic resin layer (hereinafter referred to as a thermoplastic resin layer-forming step), a step of applying an intermediate layer-forming composition to the surface of the thermoplastic resin layer and drying it to form an intermediate layer, and a step of applying a photosensitive layer-forming composition to the surface of the intermediate layer and drying it to form a photosensitive layer. The two methods for manufacturing a transfer film according to the present disclosure described above may also include a step of providing a protective film on the surface of the photosensitive layer (hereinafter referred to as a protective film-arranging step). In this specification, "drying" refers to removing at least a portion of the solvent contained in the composition. Examples of drying methods include natural drying, heat drying, and reduced pressure drying. The above methods can be applied alone or in combination.

[0111] <<Intermediate Layer Forming Step>> The intermediate layer forming composition used in the intermediate layer forming step can be prepared by dissolving or dispersing the materials (surfactants, etc.) to be contained in the intermediate layer in a solvent. Examples of the solvent include water and the water-soluble solvents described above. Examples of methods for applying the intermediate layer forming composition include printing, spraying, roll coating, bar coating, curtain coating, spin coating, and die coating (i.e., slit coating). The drying temperature can be 80°C to 130°C. The drying temperature refers to the temperature of the environment in which the intermediate layer forming composition is dried. The drying time can be 20 seconds to 600 seconds.

[0112] <<Photosensitive Layer Forming Step>> The photosensitive layer forming composition used in the photosensitive layer forming step can be prepared by dissolving or dispersing the materials to be contained in the photosensitive layer described above in a solvent. Examples of the solvent include the water-soluble solvents described above, alkylene glycol ethers, alkylene glycol ether acetates, ketone solvents (methyl ethyl ketone, etc.), aromatic hydrocarbon solvents (toluene, etc.), aprotic polar solvents (N,N-dimethylformamide, etc.), ether solvents (diethyl ether, etc.), ester solvents (n-propyl acetate, etc.), amide solvents, and lactone solvents. The coating method, drying temperature, and drying time of the photosensitive layer forming composition are the same as those in the intermediate layer forming step, and therefore will not be described here.

[0113] <<Thermoplastic Resin Layer Forming Step>> The thermoplastic resin layer forming composition used in the thermoplastic resin layer forming step can be prepared by dissolving or dispersing the materials to be contained in the thermoplastic resin layer described above in a solvent. Examples of the solvent include the water-soluble solvents described above, alkylene glycol ethers, alkylene glycol ether acetates, ketone solvents (e.g., methyl ethyl ketone), aromatic hydrocarbon solvents (e.g., toluene), aprotic polar solvents (e.g., N,N-dimethylformamide), ether solvents (e.g., diethyl ether), ester solvents (e.g., n-propyl acetate), amide solvents, and lactone solvents. The coating method, drying temperature, and drying time of the thermoplastic resin layer forming composition are the same as those in the intermediate layer forming step, and therefore will not be described here.

[0114] <<Protective Film Disposing Step>> The protective film disposing step can include laminating a protective film on the surface of the photosensitive layer. The protective film can be attached using a known laminator such as a vacuum laminator or an auto-cut laminator. The laminator is preferably equipped with any heatable roller such as a rubber roller and is capable of applying pressure and heat.

[0115] (Method for manufacturing laminate) The method for manufacturing a laminate according to the present disclosure is not particularly limited, but preferably includes the steps of bonding the transfer film according to the present disclosure to a substrate (hereinafter also referred to as the "transfer film bonding step"), peeling off the temporary support (hereinafter also referred to as the "temporary support peeling step"), and performing an exposure process after peeling off the temporary support, and then performing a development process after exposure to form a pattern (hereinafter also referred to as the "pattern formation step"). It is more preferable to have the steps of bonding the transfer film to a substrate so that the surface opposite to the intermediate layer side of the photosensitive layer of the transfer film according to the present disclosure contacts the substrate, peeling off the temporary support, and then performing an exposure process, and then performing a development process after exposure to form a pattern, in this order. The preferred embodiments of the transfer film used in the method for manufacturing a laminate according to the present disclosure are as described above, and therefore will not be described here.

[0116] Hereinafter, the method for producing a laminate according to the present disclosure will be described in detail for each step. Note that the following description of the constituent elements may be based on a representative embodiment of the method for producing a laminate according to the present disclosure, but the present disclosure is not limited to such an embodiment.

[0117] <Transfer film laminating step> In the transfer film laminating step, the transfer film, which has a temporary support, an intermediate layer, and a photosensitive layer, is laminated to the substrate so that the surface of the transfer film opposite the intermediate layer side of the photosensitive layer is in contact with the substrate. The transfer film may have a thermoplastic resin layer between the temporary support and the intermediate layer. The transfer film may have a protective film on the surface opposite the intermediate layer side of the photosensitive layer. Note that, when the transfer film has a protective film, the protective film is peeled off before the laminating step is carried out.

[0118] The method for laminating the transfer film and the substrate is not particularly limited, and known transfer methods and lamination methods can be used. Among these, it is preferable to laminate the transfer film and the substrate by placing the surface of the transfer film opposite the intermediate layer side of the photosensitive layer on the substrate and applying pressure and heat using a roll or the like. For lamination, known laminators such as a vacuum laminator or an auto-cut laminator can be used. It is preferable that the laminator is equipped with any heatable roller such as a rubber roller and is capable of applying pressure and heat. The lamination temperature is not particularly limited, and in one embodiment, for example, it can be 70°C to 130°C.

[0119] The substrate is preferably a conductive substrate (wiring substrate) having a support substrate and a conductive layer disposed on the support substrate.

[0120] Examples of the support substrate include a resin substrate, a glass substrate, and a semiconductor substrate. A preferred embodiment of the support substrate is described in, for example, paragraph 0140 of International Publication No. 2018 / 155193, the contents of which are incorporated herein by reference. Furthermore, when the support substrate is a resin substrate, the material of the resin substrate is preferably a substrate containing a cycloolefin polymer, polyethylene terephthalate, or polyimide. The thickness of the support substrate is not particularly limited, and can be, for example, 5.0 μm to 200.0 μm in one embodiment.

[0121] From the viewpoint of conductivity and fine line formability, the conductive layer is preferably at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer. Furthermore, only one conductive layer may be disposed on the support substrate, or two or more conductive layers may be disposed. When two or more conductive layers are disposed, it is preferable to have conductive layers made of different materials. A preferred embodiment of the conductive layer is described, for example, in paragraph 0141 of International Publication No. 2018 / 155193, the contents of which are incorporated herein by reference.

[0122] The conductive substrate is preferably a substrate having at least one of a transparent electrode and a routed wiring. A conductive substrate having such a configuration can be suitably used as a touch panel substrate. The transparent electrode can suitably function as a touch panel electrode. The transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) and IZO (indium zinc oxide), a metal mesh, a metal nanowire, or other thin metal wire. Examples of the thin metal wire include thin wires of silver, copper, etc. Among these, silver conductive materials such as silver mesh and silver nanowire are preferred.

[0123] The material of the lead wiring is preferably a metal. Examples of the metal that can be used for the lead wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, manganese, and alloys of two or more of these metal elements. The material of the lead wiring is preferably copper, molybdenum, aluminum, or titanium, and particularly preferably copper.

[0124] The substrate may be a substrate incorporating an element for interconnecting semiconductor elements, such as an element having a wiring pattern formed on a silicon substrate for interconnecting semiconductor elements.

[0125] The substrate may have a seed layer on its surface. Examples of materials constituting the seed layer include copper, chromium, lead, nickel, gold, silver, tin, and zinc. The thickness of the seed layer is not particularly limited, and in one embodiment, it can be, for example, 50 nm to 2 μm. The method for forming the seed layer is not particularly limited, and examples include a method of applying a dispersion liquid in which metal fine particles are dispersed and sintering the coating film, a sputtering method, and a vapor deposition method.

[0126] From the viewpoint of reducing transmission loss, the dielectric loss tangent of the substrate at 24 GHz is preferably 0.05 or less, and more preferably 0.03 or less.

[0127] <Temporary Support Peeling Step> The method for peeling off the temporary support is not particularly limited and can be carried out based on a known method. For example, a mechanism similar to the cover film peeling mechanism described in paragraphs 0161 and 0162 of JP-A 2010-072589 can be used.

[0128] In one embodiment, the pattern is formed by bringing the exposed intermediate layer or thermoplastic resin into contact with a mask, performing an exposure treatment, and then performing a development treatment.

[0129] In the exposure treatment, the photosensitive layer of the laminate is exposed to light in a pattern. The pattern exposure means exposure that generates exposed and unexposed areas in the photosensitive layer.

[0130] Furthermore, when the photosensitive layer is a negative photosensitive layer, the exposure light source can be appropriately selected and used as long as it can irradiate light in at least a wavelength range capable of curing the photosensitive layer (for example, 365 nm or 405 nm). Among these, the dominant wavelength of the exposure light for pattern exposure is preferably 365 nm. The dominant wavelength is the wavelength with the highest intensity. Examples of the light source include various lasers, light-emitting diodes (LEDs), ultra-high pressure mercury lamps, high pressure mercury lamps, and metal halide lamps. The exposure dose is not particularly limited, and in one embodiment, for example, 5 mJ / cm ２ ~200 mJ / cm ２ It can be said that:

[0131] After the exposure process and before the development process, it is preferable to remove the mask used in the exposure process.

[0132] The development process is a process of developing the pattern-shaped photosensitive layer obtained by the exposure process to form a pattern. The development of the photosensitive layer can be carried out using a developer. For example, when the photosensitive layer is a negative photosensitive layer, the unexposed areas of the photosensitive layer are removed by the development process using an alkaline developer, and the photosensitive layer remaining in the exposed areas forms a pattern.

[0133] In the development treatment, an alkaline aqueous solution is preferably used as the developer. Examples of alkaline compounds that can be contained in the alkaline aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide).

[0134] Examples of the development method include puddle development, shower development, spin development, and dip development.

[0135] <Other Steps> When the transfer film has a protective film, the method for producing a laminate according to the present disclosure may include a step of peeling off the protective film before bonding to the substrate. The method for peeling off the protective film is not particularly limited, and can be performed by a conventionally known method.

[0136] The method for producing a laminate according to the present disclosure may include at least one of a step of exposing the formed pattern (hereinafter also referred to as a "post-exposure step") and a step of heating the formed pattern (hereinafter also referred to as a "post-bake step"). When the method for producing a laminate according to the present disclosure includes both the post-exposure step and the post-bake step, it is preferable to carry out the post-bake step after the post-exposure step. The exposure dose of the post-exposure is 100 mJ / cm. ２ ~5,000mJ / cm ２ is preferred, and 200 mJ / cm ２ ~3,000mJ / cm ２ The post-baking temperature is preferably 80° C. to 250° C., more preferably 90° C. to 160° C. The post-baking time is preferably 1 minute to 180 minutes, more preferably 10 minutes to 60 minutes.

[0137] (Method for Manufacturing Circuit Wiring Board) The method for manufacturing a circuit wiring board according to the present disclosure is not particularly limited, but preferably includes, in this order: a step of manufacturing a laminate using the method for manufacturing a laminate according to the present disclosure; a step of plating an area where no pattern is formed to form a conductive pattern (hereinafter also referred to as a "conductive pattern forming step"); and a step of removing the pattern (hereinafter also referred to as a "pattern removing step"). The method for manufacturing a circuit wiring board according to the present disclosure may include a step of forming a protective layer on the surface of the plating layer after the conductive pattern forming step and before the pattern removing step (hereinafter also referred to as a "protective layer forming step"). If the substrate has a seed layer on its surface, the method for manufacturing a circuit wiring board according to the present disclosure may include a step of removing the seed layer (hereinafter also referred to as a "seed layer removing step"). Note that the step of manufacturing a laminate using the method for manufacturing a laminate according to the present disclosure has been described above, so a description thereof will be omitted here.

[0138] The circuit wiring board may be a semiconductor package. When the circuit wiring board is a semiconductor package, the manufacturing method for the circuit wiring board can include, after the seed layer removal step, a step of forming a solder resist layer having openings on the surface of the substrate using a solder resist (hereinafter also referred to as a "solder resist layer forming step"), a step of forming bump electrodes in the openings (hereinafter also referred to as a "bump electrode forming step"), and a step of mounting a semiconductor element to be connected to the bump electrodes (hereinafter also referred to as a "semiconductor element mounting step").

[0139] <Conductive Pattern Forming Step> The method for producing a circuit wiring board includes a step of plating an area of ​​the laminate where no pattern has been formed by the method for producing a laminate according to the present disclosure, to form a conductive pattern. Examples of plating methods include electroplating and electroless plating, and electroplating is preferred from the viewpoint of productivity.

[0140] The metal used for plating is not particularly limited, and known metals can be used. Usable metals include copper, chromium, lead, nickel, gold, silver, tin, zinc, and alloys of these metals. From the viewpoint of electrical conductivity, copper or its alloys are preferred.

[0141] The thickness of the plating layer formed by the plating process is not particularly limited, and in one embodiment, it can be, for example, 0.1 μm to 20.0 μm.

[0142] <Pattern Removal Step> The method for removing the pattern is not particularly limited, but includes methods using chemical treatment, and preferably uses a removal solution. Examples of the removal solution include a removal solution obtained by dissolving an inorganic alkali component or an organic alkali component in water, dimethyl sulfoxide, N-methylpyrrolidone, a mixed solution thereof, or the like. Examples of the inorganic alkali component include sodium hydroxide and potassium hydroxide. Examples of the organic alkali component include primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds.

[0143] The temperature of the remover is preferably 30° C. to 80° C., and more preferably 50° C. to 80° C. One preferred embodiment of the removal method is a method in which the laminate having the pattern to be removed is immersed for 1 minute to 30 minutes in a stirred remover having a temperature of 50° C. to 80° C. Alternatively, the pattern may be removed using the remover by a known method such as a spray method, a shower method, or a puddle method.

[0144] <Protective Layer Forming Step> The method for manufacturing a circuit wiring board according to the present disclosure may include a step of forming a protective layer on the surface of the plating layer after the conductive pattern forming step and before the pattern removing step. The material constituting the protective layer is preferably a material that is insoluble in the removal solution or etching solution used in the pattern removing step or seed layer removing step. Examples of materials constituting the protective layer include nickel, chromium, tin, zinc, magnesium, gold, silver, alloys thereof, and resins. Nickel or chromium is preferred as the material constituting the protective layer.

[0145] Methods for forming the protective layer include electroless plating and electroplating, with electroplating being preferred.

[0146] The thickness of the protective layer is not particularly limited, and in one embodiment, it can be, for example, 0.3 μm to 3.0 μm.

[0147] <Seed Layer Removal Step> When the substrate has a seed layer on its surface, the method for manufacturing a circuit wiring board according to the present disclosure may include a step of removing the seed layer. The seed layer removal step is a step of removing the exposed seed layer to obtain conductive thin wires.

[0148] The method for removing the seed layer is not particularly limited, and may be a method using a known etching solution, such as a ferric chloride solution, a cupric chloride solution, an ammonia alkali solution, a sulfuric acid-hydrogen peroxide mixture, or a phosphoric acid-hydrogen peroxide mixture.

[0149] <Solder Resist Layer Forming Step> The method for manufacturing a circuit wiring board according to the present disclosure may include a step of using a solder resist to form a solder resist layer having openings on the surface of the substrate from which the seed layer has been removed. The openings preferably expose the conductive pattern formed on the surface of the substrate. As the solder resist, a conventionally known solder resist may be used. Examples of solder resists include azide-cyclized polyisoprene resins, azide-phenol resins, and chloromethyl polystyrene resins. The thickness of the solder resist layer is not particularly limited, and in one embodiment, for example, can be 5 μm to 50 μm. The method for forming the solder resist layer is not particularly limited, and may be a conventionally known method.

[0150] <Bump Electrode Forming Step> The method for manufacturing a circuit wiring board according to the present disclosure includes a step of forming bump electrodes in openings in the solder resist layer. The bump electrodes are preferably connected to the conductive patterns exposed in the openings.

[0151] <Semiconductor Element Mounting Step> The manufacturing method of a circuit wiring board according to the present disclosure can include a step of mounting a semiconductor element to be connected to the bump electrodes. The mounted semiconductor preferably has electrodes, which are preferably connected to the bump electrodes. After mounting the semiconductor, it is preferable to encapsulate the semiconductor using a conventional encapsulant.

[0152] An embodiment of a method for manufacturing a semiconductor package will be described below with reference to FIGS.

[0153] As shown in Fig. 1, a support substrate on which a conductive layer 11 is formed is prepared as a wiring substrate 10. Next, as shown in Fig. 2, a recess is formed in the wiring substrate 10 using a laser drill or the like. As shown in Fig. 3, an element 12 for connecting semiconductor elements to each other is placed in the recess. As shown in Fig. 4, a dielectric material 13 is attached to the substrate. The attachment method is not particularly limited, and can be performed by the method described above for attaching a transfer film to a substrate. As shown in Fig. 5, a via hole 14 is formed in the dielectric material 13 attached to the wiring substrate 10. The via hole is formed by CO ２The via holes 14 can be formed by using a laser, a UV (ultraviolet) laser, or the like. As shown in FIG. 6 , a seed layer 15 is formed on the surface of the dielectric material 13 in which the via holes 14 have been formed. As shown in FIG. 7 , the surface of the transfer film (transfer film 20) according to the present disclosure, opposite the intermediate layer side of the photosensitive layer, is bonded to the seed layer 15 formed on the surface of the wiring substrate 10. After peeling the temporary support from the transfer film 20, an exposure process is performed, and further, a development process is performed after the exposure to form a pattern 21 as shown in FIG. 8 . As shown in FIG. 9 , a plating process is performed in the areas where the pattern is not formed, forming a conductive pattern 22. As shown in FIG. 10 , the pattern 21 is removed. As shown in FIG. 11 , the seed layer is removed. After removing the seed layer, a solder resist layer 30 having openings is formed on the surface of the wiring substrate 10 using a solder resist as shown in FIG. 12 . As shown in FIG. 13 , a bump electrode 31 is formed in the opening of the solder resist layer 30. As shown in FIG. 14, electrodes 40A and 41A of semiconductor elements 40 and 41 are connected to bump electrodes 31 and sealed, whereby a semiconductor package 100 can be obtained.

[0154] <Circuit Wiring Board> The circuit wiring board according to the present disclosure is a circuit wiring board manufactured by the above-described method for manufacturing a circuit wiring board.

[0155] <Semiconductor Package> A semiconductor package according to the present disclosure includes the circuit wiring board.

[0156] <Method for manufacturing a printed wiring board> The transfer film according to the present disclosure can be used in the manufacture of a printed wiring board. The method for manufacturing a printed wiring board includes a step of subjecting a substrate having a pattern in the method for manufacturing a laminate described above to at least one treatment selected from the group consisting of an etching treatment and a plating treatment. Here, the etching or plating of the substrate can be performed by etching or plating the surface of the substrate using a known method using the developed pattern as a mask. Furthermore, before etching or plating, a residual film removal step may be performed using resin etching with a chemical solution containing a permanganate component, resin ashing with plasma, or the like.

[0157] Examples of the etching solution used for etching include a cupric chloride solution, a ferric chloride solution, and an alkaline etching solution. Examples of plating include copper plating, solder plating, nickel plating, and gold plating.

[0158] After etching or plating, the pattern can be stripped, for example, with an aqueous solution that is more strongly alkaline than the aqueous solution used for development. Examples of such strongly alkaline aqueous solutions include a 1% to 10% by mass aqueous solution of sodium hydroxide and a 1% to 10% by mass aqueous solution of potassium hydroxide. Examples of stripping methods include immersion and spraying. The printed wiring board on which the pattern is formed may be a multilayer printed wiring board and may have small-diameter through-holes.

[0159] When plating is performed on a substrate having a conductive layer, etc., it is necessary to remove the conductive layer other than the pattern. Examples of this removal method include a method in which the pattern is peeled off and then lightly etched, and a method in which solder plating or the like is performed following the plating, and then the pattern is peeled off to mask the wiring portion with solder, and then a treatment is performed using an etching solution that can etch only the conductive layer in the portion not masked with solder.

[0160] The present disclosure will be described in more detail below based on examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present disclosure. Therefore, the scope of the present disclosure should not be interpreted as being limited by the examples shown below. Unless otherwise specified, "parts" and "%" are based on mass. In the following examples, the weight average molecular weight of the resin is the weight average molecular weight calculated in terms of polystyrene by gel permeation chromatography (GPC). The theoretical acid value was used as the acid value.

[0161] [Various Components of Transfer Film] First, various components used in producing the transfer film will be described below.

[0162] [Intermediate Layer] The compositions of intermediate layers A to E are shown in Table 1.

[0163] <Various Components of Intermediate Layer> The abbreviations for the components of the intermediate layer shown in Table 1 are as follows. <Binder polymer> PVA 4-88LA: (Polyvinyl alcohol: product name "Kuraray Poval PVA 4-88LA" (manufactured by Kuraray Co., Ltd.)) PVA 205: (Polyvinyl alcohol: product name "Kuraray Poval PVA-205" (manufactured by Kuraray Co., Ltd.)) PVP K30: (Polypyrrolidone: product name "Polyvinylpyrrolidone K-30" (manufactured by Nippon Shokubai Co., Ltd.)) PVP K90: (Polypyrrolidone: product name "Polyvinylpyrrolidone K-90" (manufactured by Nippon Shokubai Co., Ltd.)) HPMC: (Hydroxypropyl methylcellulose: product name "Metolose 60SH-03", manufactured by Shin-Etsu Chemical Co., Ltd.) <Additives> F-444: Fluorine-based surfactant, Megafac (registered trademark) F-444, manufactured by DIC Corporation BYK-348: Silicone-based surfactant, manufactured by BYK Japan KK <Solvent> MFG: propylene glycol monomethyl ether

[0164] <Preparation of Composition for Forming Intermediate Layer> A composition for forming an intermediate layer was prepared by mixing the components according to the description in Table 1. The values ​​in Table 1 represent the content of each component in parts by mass.

[0165]

[0166] [Photosensitive Layer] The compositions of the photosensitive layers A to I are shown in Table 2. The values ​​relating to the polymers in Table 2 are the solid content amounts.

[0167] <Various Components of Photosensitive Layer> The components of the photosensitive layer shown in Table 2 are as follows.

[0168] <<Polymer (Binder Polymer)>> Polymers A-1 to A-4 were synthesized by known methods. The weight average molecular weight (Mw) of the synthesized polymers was measured by gel permeation chromatography (GPC) under the following conditions.

[0169] - GPC conditions - Apparatus: Tosoh high-speed GPC apparatus HLC-8420GPC (trade name), manufactured by Tosoh Corporation Guard column: HZ-L, manufactured by Tosoh Corporation Separation column: Three columns connected in series, each with a TSK gel Super HZM-N (trade name), manufactured by Tosoh Corporation Measurement temperature: 40°C Eluent: THF (tetrahydrofuran) Flow rate: Sample pump 0.35 mL / min, reference pump 0.175 mL / min Injection volume: 10 μL Detector: Differential refractometer Standard substance solution for GPC column calibration: Standard polystyrene, manufactured by Tosoh Corporation

[0170] - Polymer Synthesis - The monomers used in polymer synthesis are as follows: St: styrene (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) MAA: methacrylic acid (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) MMA: methyl methacrylate (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) MAA-GMA: a structural unit in which glycidyl methacrylate is added to a structural unit derived from methacrylic acid BzMA: (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.)

[0171] Polymer A-1: ​​Structure shown below, weight average molecular weight (Mw) was 20,000, and acid value was 124 mgKOH / g. Polymer A-2: Structure shown below, Mw was 30,000, and acid value was 130 mgKOH / g. Polymer A-3: Structure shown below, Mw was 40,000, and acid value was 130 mgKOH / g. Polymer A-4: Same structure as polymer A-1, Mw was 40,000, and acid value was 124 mgKOH / g. The numbers in parentheses to the bottom right of the following polymers indicate the mass ratio.

[0172]

[0173] <Other Components> Other components contained in the photosensitive layer shown in Table 2 are shown below. <<Polymerizable Compounds>> BPE-500: 2,2-bis(4-((meth)acryloxypentaethoxy)phenyl)propane, manufactured by Shin-Nakamura Chemical Co., Ltd. M-270: Polypropylene glycol diacrylate (n≈12), manufactured by Toagosei Co., Ltd. BPE-100: 2,2-bis(4-(methacryloylethoxy)phenyl)propane, manufactured by Shin-Nakamura Chemical Co., Ltd. A-TMPT: Trimethylolpropane triacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd. <<Polymerization Initiator>> B-CIM: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbiimidazole, manufactured by Hampford Chemical Co., Ltd. <<Sensitizer>> EAB-F: 4,4'-bis(diethylamino)benzophenone, obtained from Sanyo Trading Co., Ltd. <<Chain Transfer Agent>>・Leuco Crystal Violet: manufactured by Tokyo Chemical Industry Co., Ltd. ・N-Phenylcarbamoylmethyl-N-carboxymethylaniline: manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. <<Rust inhibitor>> ・CBT-1: Carboxybenzotriazole, manufactured by Johoku Chemical Co., Ltd. <<Polymerization inhibitor>> ・TDP-G: Phenothiazine, manufactured by Kawaguchi Chemical Co., Ltd. <<Surfactant>> F552: Fluorine-based surfactant, Megafac (registered trademark) F-552, manufactured by DIC Corporation S-506: Silicone-based surfactant, manufactured by DIC Corporation, EXP. S-506 <<Solvent>> PGMEA: Propylene glycol monomethyl ether acetate MEK: Methyl ethyl ketone

[0174] <Preparation of Composition for Forming Photosensitive Layer> Compositions for forming photosensitive layer were prepared by mixing the components according to the description in Table 2. The values ​​in Table 2 indicate the content of each component in parts by mass.

[0175]

[0176] (Examples 1 to 18 and Comparative Examples 2 to 4) [Production of Transfer Films] Transfer films each composed of a temporary support, an intermediate layer, and a photosensitive layer were prepared to have the configurations shown in Tables 3 to 5. Specifically, the process is as follows. An intermediate layer-forming composition shown in Tables 3 to 5 was applied onto a temporary support (16 μm thick, 16KS40 manufactured by Toray Industries, Inc.) using a slit nozzle so that the coating width after drying would be 1.0 m and the film thickness after drying would be the numerical values ​​shown in Tables 3 to 5. The coating was then passed through a drying zone at 100°C for 40 seconds to form an intermediate layer. Furthermore, a photosensitive layer-forming composition shown in Tables 3 to 5 was applied onto the intermediate layer using a slit nozzle so that the coating width after drying would be 1.0 m and the film thickness after drying would be the numerical values ​​shown in Tables 3 to 5. The coating was then passed through a drying zone at 80°C for 40 seconds to form a negative photosensitive layer. A polypropylene film (Oji F-Tex Co., Ltd., Alphan E200C3) having a thickness of 18 μm was pressed onto the film as a protective film to prepare a transfer film, which was then wound into a roll and left to stand for 24 hours or more.

[0177] [Laminate Production] A 5 nm thick nickel-chromium (8 / 2) layer and a 200 nm thick copper layer were deposited in this order on a 25 μm thick polyimide substrate by vapor deposition to prepare a copper-layered polyimide substrate. After peeling off the protective film from the prepared transfer film, the film was laminated to the copper-layered polyimide substrate under lamination conditions of a roll temperature of 100°C, a linear pressure of 1.0 MPa, and a linear speed of 1.0 m / min, so that the copper layer and the photosensitive layer were in contact (transfer film lamination process). Next, the temporary support was peeled off at a 180° angle (temporary support peeling process). Next, a photomask with a pattern of predetermined line width (μm) / space width (μm) was used, and exposure was performed by bringing the intermediate layer into contact with the mask. A high-pressure mercury lamp with i-line (365 nm) as the dominant exposure wavelength was used for exposure. The exposure dose was set arbitrarily so that the top shape of each pattern matched the mask opening. Shower development was carried out with a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 25° C., followed by rinsing with water, to form a predetermined pattern on the copper, thereby obtaining a laminate (pattern formation step).

[0178] [Interlayer Adhesion] In the examples and comparative examples, a laminate before pattern formation was prepared as a test specimen. The temporary support of the transfer film was peeled off, and a laminate in which a photosensitive layer was laminated on a copper layer was produced. A 4.5 cm x 15 cm cut-out of Printac C (manufactured by Nitto Denko Corporation) was attached to the laminate, and a 4.5 cm x 9 cm cut-out was made so that the width of the tape matched the width of the support. The cut-out was subjected to 90° peeling at a peeling rate of 100 mm / min at 25°C using a Tensilon universal testing machine manufactured by A&D Corporation, and the adhesion strength (gf / cm) between the intermediate layer and the photosensitive layer was measured.

[0179] [Content of Water-Soluble Solvent] The prepared transfer film was accurately punched to a size of 10 cm x 10 cm, and the transfer film was attached to a polyimide substrate having a copper layer whose mass had been measured in advance, followed by the steps of attaching the transfer film and peeling off the temporary support, to obtain a laminate. After measuring the mass of the laminate, the laminate was cut into small pieces, placed in a 22 cc vial containing 10 cc of THF, sealed, and mixed well to extract the solvent. The THF from which the solvent had been extracted was injected into a gas chromatograph (trade name: Gas Chromatograph Mass Spectrometer (Model: QP2010Ultra) manufactured by Shimadzu Corporation) and a column (trade name: Capillary Column (Volatile Compound Analysis Column) (Model: DB-VRX) manufactured by J&W SCIENTIFIC), and the contents of MFG, methanol, and ethyl lactate were measured using a pre-measured calibration curve. Next, the prepared transfer film was accurately punched out to a 10 cm x 10 cm size, and the transfer film laminating step and temporary support peeling step were carried out on a copper layer-attached polyimide substrate whose mass had been measured in advance, thereby obtaining a laminate. A Printac C (manufactured by Nitto Denko Corporation) cut to a size of 11 cm x 11 cm was attached to the surface of the laminate facing the intermediate layer, and then peeled off to separate the Printac C with the intermediate layer attached and the copper layer-attached polyimide substrate with the photosensitive layer attached. After measuring the mass of the copper-layered polyimide substrate with the photosensitive layer attached, the polyimide substrate was cut into small pieces and placed in a 22 cc vial containing 10 cc of tetrahydrofuran (THF), which was then sealed and mixed thoroughly to extract the solvent. The THF from which the solvent had been extracted was injected into a gas chromatograph [(trade name: Gas Chromatograph Mass Spectrometer (Model: QP2010Ultra) manufactured by Shimadzu Corporation)) and a column (trade name: Capillary Column (Volatile Compound Analysis Column) (Model: DB-VRX) manufactured by J&W SCIENTIFIC], and the contents of MFG, methanol, and ethyl lactate were measured using a pre-measured calibration curve. The masses of the transfer film and photosensitive layer were calculated by subtracting the mass of the copper-layered polyimide substrate from the mass of the laminate placed in the vial and the mass of the copper-layered polyimide substrate with the photosensitive layer attached, and the mass of the intermediate layer was calculated from this difference. The contents of MFG, methanol and ethyl lactate in the intermediate layer were calculated from the difference between the contents of MFG, methanol and ethyl lactate in the transfer film and the contents of MFG, methanol and ethyl lactate in the photosensitive layer.From these values, the concentration of the water-soluble solvent contained in each layer was calculated.

[0180] Comparative Example 1 A transfer film and a laminate were produced in the same manner as in Example 1, except that the intermediate layer was not formed and the photosensitive layer was changed to the configuration shown in Table 5.

[0181] [Various Evaluations] <Evaluation 1: Stability after Temporary Support Peeling> After the temporary support was peeled off from the laminates of the above Examples and Comparative Examples, the laminates were left in a yellow light environment at 23°C and 55% RH, and the surface condition was evaluated based on the following evaluation criteria. -Evaluation criteria- "A": No change in surface condition even after 24 hours have passed since the temporary support was peeled off. "B": No change in surface condition until 5 hours have passed since the temporary support was peeled off, and a change in surface condition was observed within 24 hours. "C": No change in surface condition until 1 hour have passed since the temporary support was peeled off, and a change in surface condition was observed within 5 hours. "D": Change in surface condition within 1 hour since the temporary support was peeled off.

[0182] <Evaluation 2: Resolution> The resolution of the patterns formed on the laminates of the above Examples and Comparative Examples was evaluated based on the following evaluation criteria. The evaluation results are summarized in Tables 3 to 5. -Evaluation Criteria- "A": A pattern with an aspect ratio (pattern height / line width) of 2.0 or more could be formed without residue or pattern collapse. "B": Residue or pattern collapse occurred when forming a pattern with an aspect ratio of 2.0 or more, but patterns with an aspect ratio of 1.8 or more and less than 2.0 could be formed without residue or pattern collapse. "C": Residue or pattern collapse occurred when forming a pattern with an aspect ratio of 1.8 or more and less than 2.0, but patterns with an aspect ratio of 1.5 or more and less than 1.8 could be formed without residue or pattern collapse. "D": Residue or pattern collapse occurred when forming a pattern with an aspect ratio of 1.5.

[0183]

[0184]

[0185]

[0186] In the transfer films of Examples 1 to 5 and 8 to 14, migration of water-soluble solvents, particularly water-soluble solvents with a boiling point of 101°C or higher, from the photosensitive layer to the intermediate layer was observed. Furthermore, in the transfer films of Examples 16 and 18, migration of water-soluble solvents, particularly water-soluble solvents with a boiling point of 101°C or higher, from the intermediate layer to the photosensitive layer was observed. The transfer films of Examples 16 and 18 contain methanol as water-soluble solvent A in both the intermediate layer and the photosensitive layer. In the transfer films of Examples 6, 7, 15, and 17, the same water-soluble solvent with a boiling point of 101°C or higher (i.e., MFG or ethyl lactate as water-soluble solvent A) is used in both the intermediate layer and the photosensitive layer, and therefore, although the migration was not confirmed, it is assumed that the water-soluble solvent also migrated between the layers.

[0187] The results in Tables 3 to 5 show that the transfer films of Examples 1 to 18 are excellent in surface stability and resolution after the temporary support is peeled off.

[0188] Example 100: Manufacturing of a circuit wiring board (semiconductor package) As shown in FIG. 1, a support substrate on which a conductive layer 11 was formed was prepared as a wiring board 10. Next, as shown in FIG. 2, a recess was formed in the wiring board 10 using a laser drill. As shown in FIG. 3, an element 12 for connecting semiconductor elements to each other was placed in the recess. As shown in FIG. 4, a dielectric material 13 was attached to the substrate. As shown in FIG. 5, a CO ２A via hole 14 was formed using a laser and a UV laser. As shown in FIG. 6 , a 0.2 μm-thick seed layer 15 was formed on the surface of the dielectric material 13 on which the via hole 14 was formed by Cu / Ti sputtering. The dielectric loss tangent at 24 GHz of the substrate on which the seed layer was formed was measured using a 24 GHz split cylinder resonator manufactured by Kanto Application Development Co., Ltd., and was found to be 0.029. As shown in FIG. 7 , the surface of the transfer film (transfer film 20) of Example 1 opposite the intermediate layer of the photosensitive layer was bonded to the seed layer 15 formed on the surface of the wiring substrate 10 (transfer film bonding process). After peeling the temporary support from the transfer film 20 (temporary support peeling process), an exposure process was performed, and further, a development process was performed after the exposure to form a pattern 21 as shown in FIG. 8 (pattern formation process). Specifically, an ultra-high pressure mercury lamp was used for the exposure process, and a 30-second development process was performed using a 1% by mass aqueous solution of sodium carbonate (30°C) as the developer. After development, the substrate was rinsed with a polishing cloth for 30 seconds, and then air was blown to remove moisture and form a pattern. As shown in FIG. 9 , plating was performed on the areas where no pattern was formed to form a conductive pattern 22 (conductive pattern formation process). Specifically, electrolytic plating was performed using a copper sulfate aqueous solution. As shown in FIG. 10 , the pattern 21 was removed using a removal solution (3.0 mass% sodium hydroxide aqueous solution, 50°C) (pattern removal process). As shown in FIG. 11 , the seed layer was removed using an etching solution (aqueous solution containing 0.1 mass% sulfuric acid and 0.1 mass% hydrogen peroxide, 28°C) (seed layer removal process). After removing the seed layer, as shown in FIG. 12 , a solder resist was laminated on the surface of the wiring substrate 10, exposed to light using an ultra-high pressure mercury lamp, and then developed using a 1 mass% sodium carbonate aqueous solution (30°C). After development, the developed solder resist layer was heated at 180°C for 30 minutes to thermally harden the developed solder resist layer, forming a solder resist layer 30 with openings (solder resist layer formation process). The conductive pattern 22 was exposed in the opening. As shown in Fig. 13, a bump electrode 31 was formed in the opening of the solder resist layer 30 (bump electrode forming step). The bump electrode was connected to the exposed conductive pattern 22.14, electrodes 40A, 41A of semiconductor elements 40, 41 were connected to bump electrodes 31 and sealed (semiconductor element mounting step), thereby obtaining a semiconductor package 100. It was confirmed that the manufactured semiconductor package operated normally.

[0189] Example 101: Production of flexible printed wiring board A polyimide substrate with a copper layer was prepared by forming a 300 nm thick copper layer on both sides of a 25 μm thick polyimide substrate (Kapton 100H, manufactured by Toray Industries, Inc.) by vapor deposition.

[0190] <Exposure method 1> The transfer film of Example 1 was laminated on both sides of the copper-layered polyimide substrate so that the copper layer and the photosensitive layer were in contact with each other under lamination conditions of a roll temperature of 100°C, a linear pressure of 1.0 MPa, and a linear speed of 1.0 m / min, to produce a laminate for evaluation. Next, the temporary supports on both sides were peeled off in a 180° direction.

[0191] Next, a photomask having a pattern with a predetermined line width (μm) / space width (μm) was used, and the intermediate layer was brought into contact with the mask and exposed simultaneously on both sides. A high-pressure mercury lamp with i-line (365 nm) as the dominant exposure wavelength was used for exposure. The exposure dose was set arbitrarily so that the top shape of each pattern matched the mask opening. Both sides were shower-developed with a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 30°C, and then washed with water, to obtain a laminate with a predetermined pattern formed on the copper on both sides. The laminate was then acid-degreased, washed with water, and dipped in sulfuric acid, and plated at 1 A / dm using a copper sulfate plating solution. ２ Copper plating was performed under the conditions of

[0043] until the plating thickness reached 15 μm. After rinsing with water and drying, the resist was stripped using a 3.0 mass % sodium hydroxide aqueous solution at 50°C, and the seed layer was then removed with an etching solution (aqueous solution containing 0.1 mass % sulfuric acid and 0.1 mass % hydrogen peroxide at 28°C), followed by rinsing with water to produce a flexible printed wiring board. The manufactured flexible printed wiring board was confirmed to function normally.

[0192] <Exposure Method 2> The transfer film of Example 1 was laminated on both sides of a polyimide substrate with a copper layer so that the copper layer and the photosensitive layer were in contact under lamination conditions of a roll temperature of 100°C, a linear pressure of 1.0 MPa, and a linear speed of 1.0 m / min, to produce a laminate for evaluation. Next, the temporary support on one side was peeled off at an angle of 180°, and the peeled surface was exposed. Exposure was performed using a projection exposure machine with a high-pressure mercury lamp using i-line (365 nm) through a mask, with reduced projection exposure. The mask used had a pattern with a predetermined line width (μm) / space width (μm). The exposure amount was set arbitrarily so that the top shape of each pattern matched the mask opening.

[0193] Next, the temporary support of the transfer film on the side opposite to the exposed side was peeled off at a 180° angle, and the peeled side was exposed under the same conditions as the first exposed side. Both sides were shower-developed with a 1% by mass aqueous solution of sodium carbonate at a liquid temperature of 30°C, and then washed with water to obtain a laminate with a predetermined pattern formed on the copper on both sides. The laminate was then acid-degreased, washed with water, and dipped in sulfuric acid, and plated at 1 A / dm using a copper sulfate plating solution. ２ Copper plating was performed under the conditions of

[0043] until the plating thickness reached 15 μm. After rinsing with water and drying, the resist was stripped using a 3.0 mass % sodium hydroxide aqueous solution at 50°C, and the seed layer was then removed with an etching solution (aqueous solution containing 0.1 mass % sulfuric acid and 0.1 mass % hydrogen peroxide at 28°C), followed by rinsing with water to produce a flexible printed wiring board. The manufactured flexible printed wiring board was confirmed to function normally.

[0194] (Examples 102 to 118) Flexible printed wiring boards were produced using the transfer films of Examples 2 to 18, respectively, in the same manner as in Example 101. It was confirmed that the flexible printed wiring boards produced by either exposure method 1 or exposure method 2 functioned normally.

[0195] [Explanation of symbols] 10: wiring substrate, 11: conductive layer, 12: element, 13: dielectric material, 14: via hole, 15: seed layer, 20: transfer film, 21: pattern, 22: conductive pattern, 30: solder resist layer, 31: bump electrode, 40, 41: semiconductor element, 40A, 41A: electrode, 100: semiconductor package

[0196] The disclosure of Japanese Patent Application No. 2023-137557, filed on August 25, 2023, is incorporated herein by reference. All documents, patent applications, and technical standards mentioned in this disclosure are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. A photosensitive layer having a temporary support, an intermediate layer, and a photosensitive layer in this order, the intermediate layer having an average thickness of 2 μm to 5 μm, the photosensitive layer having an average thickness of 18 μm to 30 μm, and the photosensitive layer having a melt viscosity of 1.0×10 at 25° C. ６ A transfer film having a viscosity of Pa·s or more.

2. The transfer film according to claim 1, wherein both the intermediate layer and the photosensitive layer contain a water-soluble solvent.

3. The transfer film according to claim 2, wherein the content of the water-soluble solvent in each of the intermediate layer and the photosensitive layer is 0.001% by mass or more relative to the total mass of each layer.

4. The transfer film according to claim 2, wherein the content of the water-soluble solvent in each of the intermediate layer and the photosensitive layer is 0.005% by mass or more relative to the total mass of each layer.

5. The transfer film according to claim 2, wherein the content of the water-soluble solvent in each of the intermediate layer and the photosensitive layer is 0.01% by mass to 1% by mass relative to the total mass of each layer.

6. The transfer film according to claim 2, wherein the water-soluble solvents in the intermediate layer and the photosensitive layer each contain a solvent having a boiling point of 101° C. or higher.

7. The transfer film according to claim 6, wherein the solvent having a boiling point of 101° C. or higher is an alcohol compound or an ester compound.

8. The transfer film according to claim 2, wherein the water-soluble solvents in the intermediate layer and the photosensitive layer each contain a solvent having a boiling point of 101° C. or higher.

9. The transfer film according to claim 2, wherein the intermediate layer and the photosensitive layer both contain a water-soluble solvent A that is the same compound.

10. A transfer film according to claim 1 or 2, wherein the adhesion between the intermediate layer and the photosensitive layer is 1.0 gf / cm or more.

11. A method for manufacturing a laminate, comprising the steps of: bonding the transfer film according to claim 1 or 2 to a substrate; peeling off the temporary support; carrying out an exposure process, and further carrying out a development process after the exposure to form a pattern, in that order.

12. A method for manufacturing a circuit wiring board, comprising the steps of: manufacturing a laminate by the manufacturing method according to claim 11; plating an area where the pattern is not formed to form a conductive pattern; and removing the pattern, in that order.

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