Photoelectric conversion device

Abstract

The present application discloses a photoelectric conversion device. The photoelectric conversion device comprises: a photoelectric conversion unit; and a first packaging layer, at least arranged on one side surface of the photoelectric conversion unit, wherein the first packaging layer comprises a protection layer, a first organic layer and a first inorganic layer which are successively arranged on one side surface of the photoelectric conversion unit, and the first inorganic layer covers the surface of the first organic layer facing away from the photoelectric conversion unit. The photoelectric conversion device provided by the present application can effectively prevent external water and oxygen invasion, thereby ensuring the stability.

Description

Photoelectric conversion devices

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority based on Chinese patent application 202311240048.5 filed on September 22, 2023, and all its contents are incorporated herein by reference.

Technical field

[0003] The present application relates to the field of optoelectronic technology, and in particular to a photoelectric conversion device. [Background Technology]

[0004] Photoelectric conversion devices can convert light energy into electrical energy and are currently a hot topic in the field of environmentally friendly energy. However, the inventors of this application have discovered that current photoelectric conversion devices are easily invaded by water and oxygen from the outside world, and their stability needs to be improved.

[0005] Application Contents

[0006] The present application provides a photoelectric conversion device that can effectively prevent the invasion of external water and oxygen and ensure stability.

[0007] The first technical solution provided in the present application is: providing a photoelectric conversion device, which includes: a photoelectric conversion unit; a first encapsulation layer, which is arranged on at least one side surface of the photoelectric conversion unit, and the first encapsulation layer includes a protective layer, a first organic layer and a first inorganic layer arranged in sequence on one side surface of the photoelectric conversion unit, wherein the first inorganic layer covers the surface of the first organic layer facing away from the photoelectric conversion unit.

[0008] The beneficial effect is: the present application sets a first encapsulation layer on one side surface of the photoelectric conversion unit, and uses the first encapsulation layer to encapsulate the photoelectric conversion unit, wherein the first encapsulation layer includes a protective layer, a first organic layer and a first inorganic layer arranged in sequence, wherein the protective layer can protect the surface of the photoelectric conversion unit to avoid damage to the surface of the photoelectric conversion unit, and the first organic layer can cover the dust in the production process to prevent the dust from piercing the protective layer. At the same time, the first inorganic layer covers the surface of the first organic layer away from the photoelectric conversion unit, which can prevent the first organic layer from absorbing water, effectively preventing external water and oxygen from invading the photoelectric conversion unit, and ensuring the stability of the photoelectric conversion device.

Brief Description of the Drawings

[0009] FIG1 is a schematic structural diagram of a first embodiment of a photoelectric conversion device of the present application;

[0010] FIG2 is a schematic structural diagram of a second embodiment of a photoelectric conversion device of the present application;

[0011] 3 is a schematic structural diagram of a third embodiment of a photoelectric conversion device of the present application;

[0012] FIG4 is a schematic structural diagram of a fourth embodiment of a photoelectric conversion device of the present application;

[0013] FIG5 is a schematic structural diagram of a fifth embodiment of a photoelectric conversion device of the present application;

[0014] 6 is a schematic structural diagram of a sixth embodiment of a photoelectric conversion device of the present application;

[0015] FIG. 7 is a schematic structural diagram of a seventh embodiment of a photoelectric conversion device of the present application. [Specific implementation method]

[0016] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0017] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and should not be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0018] 1 , a photoelectric conversion device 100 includes a photoelectric conversion unit 110 and a first encapsulation layer 120 .

[0019] The photoelectric conversion unit 110 is a core unit of the photoelectric conversion device 100 , and is capable of converting light energy into electrical energy or converting electrical energy into light energy.

[0020] The first encapsulation layer 120 is arranged on at least one side surface of the photoelectric conversion unit 110, and the first encapsulation layer 120 includes a protective layer 121, a first organic layer 122 and a first inorganic layer 123 arranged in sequence on one side surface of the photoelectric conversion unit 110, wherein the first inorganic layer 123 covers the surface of the first organic layer 122 facing away from the photoelectric conversion unit 110.

[0021] Specifically, the first encapsulation layer 120 is used to encapsulate the photoelectric conversion unit 110 and can be provided on a portion of the surface of the photoelectric conversion unit 110 or on the entire surface of the photoelectric conversion unit 110. The protective layer 121, the first organic layer 122, and the first inorganic layer 123 are sequentially stacked on the photoelectric conversion unit 110. The material of the first organic layer 122 includes an organic material, and the material of the first inorganic layer 123 includes an inorganic material.

[0022] The protective layer 121 is used to protect the surface of the photoelectric conversion unit 110 to prevent the surface of the photoelectric conversion unit 110 from being damaged during the preparation or use process. The first organic layer 122 can cover the dust in the production process. When dust in the production environment falls on the surface of the protective layer 121, the first organic layer 122 can fix it to prevent the dust from piercing the protective layer 121 and forming a water vapor leakage channel. At the same time, considering that organic materials easily absorb water and inorganic materials have a good barrier effect on water and oxygen, a first inorganic layer 123 is also provided to cover the surface of the first organic layer 122 away from the photoelectric conversion unit 110, that is, the first inorganic layer 123 wraps the first organic layer 122, so that no surface of the first organic layer 122 is in contact with the outside world, thereby preventing the first organic layer 122 from absorbing water and preventing external water and oxygen from invading the photoelectric conversion unit 110, ultimately ensuring the stable performance of the photoelectric conversion device 100.

[0023] Considering that polymers in organic materials have good film-forming properties and a dense surface that is less prone to pinhole formation, polymers can be selected as the material for forming the first organic layer 122. Examples of polymers used to form the first organic layer 122 include acrylic, epoxy, and silicone polymers. It should be noted that this application does not limit the material of the first organic layer 122; any organic material may be used.

[0024] The material of the first inorganic layer 123 includes at least one of a metal oxide and a compound. The metal oxide includes at least one of aluminum oxide (Al2O3), zirconium oxide (ZrO2), zinc oxide (ZnO), titanium dioxide (TiO2), and tin oxide (SnO2); the compound includes at least one of silicon nitride (SiNx) and silicon dioxide (SiO2). In short, this application does not impose any restrictions on the material of the first inorganic layer 123; any inorganic material may be used.

[0025] In one embodiment, in order to effectively block the external water and oxygen, the ability of the first inorganic layer 123 to isolate water vapor is less than 10 -4 g / (m 2 ·sky).

[0026] 1 , in one embodiment, the photoelectric conversion unit 110 includes an active region 1101 and an inactive region 1102 spaced apart from each other. The photoelectric conversion unit 110 includes a first electrode 111 , a second electrode 112 , and a functional layer 113 located between the first electrode 111 and the second electrode 112 and located in the active region 1101 .

[0027] Specifically, the active region 1101 refers to the region of the photoelectric conversion unit 110 that performs photoelectric conversion. It is the core region of the photoelectric conversion unit 110 and is also a key protected area. The inactive region 1102 can be disposed outside the active region 1101, or the active region 1101 and the inactive region 1102 can be disposed side by side. This application does not limit the relative positions of the active region 1101 and the inactive region 1102.

[0028] The first electrode 111 and the second electrode 112 may be located only in the active region 1101, or may extend from the active region 1101 to the inactive region 1102. In one application scenario, the photoelectric conversion unit 110 further includes a first conductive member 114 and a second conductive member 115. The first conductive member 114 is electrically connected to the first electrode 111, and the second conductive member 115 is electrically connected to the second electrode 112, for achieving electrical connection between the first electrode 111 and the second electrode 112 and the outside world.

[0029] At least one of the first electrode 111 and the second electrode 112 is a transparent electrode, which can be made of at least one transparent conductive material selected from the group consisting of indium tin oxide (ITO), fluorine-doped tin oxide (FTO), and indium zinc oxide (IZO). In one application scenario, one of the first electrode 111 and the second electrode 112 is a transparent electrode, and the other is a counter electrode, which can also be made of a transparent conductive material or a metal conductive film material.

[0030] The functional layer 113 is the core film layer in the photoelectric conversion unit 110, which is used to realize the photoelectric conversion function. In one application scenario, the functional layer package 113 includes an N-type material sublayer (not shown), a perovskite semiconductor sublayer (not shown) and a P-type material sublayer (not shown) stacked in sequence. In this case, the photoelectric conversion device 100 is a perovskite battery. It should be noted that the present application does not limit the specific structure of the functional layer 113. For example, in other embodiments, a passivation sublayer can be added between the perovskite semiconductor sublayer and the N-type material sublayer, and between the perovskite semiconductor sublayer and the P-type material sublayer.

[0031] Considering that the photoelectric conversion unit 110 performs photoelectric conversion in the active region 1101, which is relatively more important than the inactive region 1102, a protective layer 121 is provided to cover the active region 1101 to prevent damage to the surface of the photoelectric conversion device 100 in the active region 1101. The protective layer 121 may or may not cover the inactive region 1102, and the specific configuration can be determined based on actual needs.

[0032] In one embodiment, the protective layer 121 is attached to the first electrode 111 and / or the second electrode 112. That is, the protective layer 121 is tightly attached to the first electrode 111 and / or the second electrode 112, and no other film layer exists between the two. Specifically, the protective layer 121 can be attached only to the first electrode 111, or only to the second electrode 112, or to both the first electrode 111 and the second electrode 112. The specific selection can be based on actual needs. It should be noted that in other embodiments, other film layers may also exist between the protective layer 121 and the first electrode 111, and between the protective layer 121 and the second electrode 112.

[0033] In one embodiment, the protective layer 121 includes an inorganic material. Specifically, considering that inorganic materials have a good barrier effect against water and oxygen, the protective layer 121 includes an inorganic material. This can further improve the ability of the first encapsulation layer 120 to block external water and oxygen, thereby further ensuring the stability of the photoelectric conversion device 100.

[0034] In one embodiment, in order to effectively block the external water and oxygen, the ability of the protective layer 121 to isolate water vapor is less than 10 -4 g / (m 2 ·sky).

[0035] In one embodiment, the material of the protective layer 121 is the same as that of the first inorganic layer 123. Specifically, using the same material for the protective layer 121 and the first inorganic layer 123 can reduce the number of materials used during the preparation process, thereby simplifying the process. Of course, the materials of the protective layer 121 and the first inorganic layer 123 can also be different, depending on the specific needs.

[0036] In one embodiment, the thickness of the protective layer 121 is equivalent to the thickness of the first inorganic layer 123, that is, the thickness of the protective layer 121 is equal to or approximately equal to the thickness of the first inorganic layer 123 (approximately equal means that the difference in thickness between the two is less than a difference threshold). Specifically, setting the thickness of the protective layer 121 and the first inorganic layer 123 to be equivalent allows the protective layer 121 and the first inorganic layer 123 to be prepared using the same process during the preparation process, thereby improving production efficiency. Among them, the protective layer 121 and the first inorganic layer 123 can be prepared using processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD).

[0037] In one embodiment, the thickness of the protective layer 121 and the first inorganic layer 123 ranges from 5 nm to 5000 nm, for example, 5 nm, 10 nm, 50 nm, 100 nm, 300 nm, 500 nm, 800 nm, 1000 nm, 1500 nm, 2000 nm, 2500 nm, 3000 nm, 3500 nm, 4000 nm, 4500 nm, or 5000 nm. The thickness of the protective layer 121 and the first inorganic layer 123 can be set according to specific needs and is not limited here.

[0038] 1 , in one embodiment, the protective layer 121 and the first inorganic layer 123 extend from the active region 1101 to the inactive region 1102 , and the protective layer 121 and the first inorganic layer 123 are attached to the inactive region 1102 .

[0039] Specifically, the protective layer 121 and the first inorganic layer 123 both cover the active area 1101 and extend into the inactive area 1102. Furthermore, in the inactive area 1102, the protective layer 121 and the first inorganic layer 123 are attached and tightly adhered to each other, with no first organic layer 122 between them. This arrangement effectively prevents the first organic layer 122 between the protective layer 121 and the first inorganic layer 123 from absorbing external water and oxygen.

[0040] In particular, when the material of the protective layer 121 includes an inorganic material, the dense connectivity between inorganic materials is stronger than the dense connectivity between organic materials. Therefore, compared with the presence of the first organic layer 122 everywhere between the protective layer 121 and the first inorganic layer 123, the protective layer 121 and the first inorganic layer 123 are attached and arranged, which can effectively prevent water absorption at the edge of the first organic layer 122.

[0041] The first organic layer 122 covers the active area 1101 , at least preventing the protective layer 121 located in the active area 1101 from being pierced by dust.

[0042] Referring to FIG. 2 , unlike the embodiment shown in FIG. 1 , the first organic layer 122 now covers the surface of the protective layer 121 facing away from the photoelectric conversion unit 110. Specifically, the first organic layer 122 covers the protective layer 121, while the first inorganic layer 123 covers the first organic layer 122. This arrangement allows the first organic layer 122 to fully protect the protective layer 121, preventing any portion of the protective layer 121 from being pierced by dust.

[0043] 2 and 3 , the photoelectric conversion device 100 further includes a first substrate 130 .

[0044] The photoelectric conversion unit 110 is arranged on a side surface of the first substrate 130, and the first encapsulation layer 120 extends from the side surface of the photoelectric conversion unit 110 away from the first substrate 130 to the first substrate 130. Specifically, the first substrate 130 can be a rigid substrate or a flexible substrate. When the first substrate 130 is a rigid substrate, it can be a rigid glass. When the first substrate 130 is a flexible substrate, it can be a flexible carrier, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate PEN, etc., or the first substrate 130 can also be a metal foil, such as copper foil, aluminum foil, etc.

[0045] Among them, when the first substrate 130 is a rigid substrate, during the preparation process, the photoelectric conversion unit 110 is first placed on the first substrate 130, and then the protective layer 121, the first organic layer 122 and the first inorganic layer 123 are formed in sequence on the photoelectric conversion unit 110; and when the first substrate 130 is a flexible substrate, during the preparation process, the first inorganic layer 123, the first organic layer 122 and the protective layer 121 can be formed in sequence first, and then the photoelectric conversion unit 110 and the first substrate 130 are placed, so as to encapsulate the photoelectric conversion unit 110.

[0046] It should be noted that, in other embodiments, the first substrate 130 may not be provided.

[0047] Continuing to refer to FIG. 3 , the photoelectric conversion device 100 further includes a dam 140 .

[0048] The dam 140 is disposed on the first substrate 130 and surrounds the photoelectric conversion unit 110. The first inorganic layer 123 extends to the outside of the dam 140, and the first organic layer 122 is located inside the dam 140. Specifically, the dam 140 has a fully enclosed structure, surrounding the photoelectric conversion unit 110. The first organic layer 122 is only disposed inside the dam 140, while the first inorganic layer 123 extends from the inside of the dam 140 to the outside of the dam 140. Among them, on the one hand, the dam 140 can be used to prevent external water vapor from invading the photoelectric conversion unit 110 along the surface of the first substrate 130. On the other hand, during the preparation process, the dam 140 can also prevent the flow of organic materials, ensuring that the orthographic projection of the first inorganic layer 123 on the first substrate 130 completely covers the orthographic projection of the first organic layer 122 on the first substrate 130, and even the orthographic projection of the first inorganic layer 123 on the first substrate 130 extends to the outside of the orthographic projection of the first organic layer 122 on the first substrate 130, thereby preventing the edge of the first organic layer 122 from absorbing water.

[0049] Of course, in other embodiments, the dam 140 may not be provided, as shown in FIG. 2 .

[0050] Continuing with FIG3 , the protective layer 121 extends to the outside of the dam 140, and is attached to the first inorganic layer 123 on the outside of the dam 140. Specifically, the protective layer 121 also extends to the outside of the dam 140, and to further prevent water absorption at the edge of the first organic layer 122, the protective layer 121 is attached to the first inorganic layer 123 on the outside of the dam 140, and the two are closely connected.

[0051] Of course, in other embodiments, as shown in FIG4 , the protective layer 121 may also be located only on the inner side of the dam 140 . In this case, in the embodiment of FIG4 , the protective layer 121 and the first organic layer 122 are both located on the inner side of the dam 140 , and only the first inorganic layer 123 extends from the inner side of the dam 140 to the outer side of the dam 140 .

[0052] Continuing with Figures 3 and 4 , multiple dams 140 are provided, spaced apart and arranged around the periphery of the photoelectric conversion unit 110. Specifically, the multiple dams 140 are arranged in concentric rings. Compared to a single dam 140, multiple dams 140 provide better barrier properties against external water and oxygen, as well as preventing the flow of organic materials, thereby further ensuring the stability of the photoelectric conversion device 100.

[0053] Continuing to refer to Figure 3, the orthographic projections of the first inorganic layer 123 and the protective layer 121 on the first substrate 130 cover the orthographic projections of the multiple dams 140 on the first substrate 130, and the orthographic projection of the first organic layer 122 on the first substrate 130 is located on one side of the orthographic projections of the multiple dams 140 on the first substrate 130.

[0054] Specifically, multiple dams 140 are arranged around the first organic layer 122, effectively preventing organic materials from flowing to the outside of the dams 140. At the same time, the orthographic projections of the first inorganic layer 123 and the protective layer 121 on the first substrate 130 cover the orthographic projections of the multiple dams 140 on the first substrate 130, that is, the first inorganic layer 123 and the protective layer 121 extend to the outside of the multiple dams 140. On the one hand, they can protect the dams 140, and on the other hand, they can also extend the path length of water vapor intrusion and improve the packaging effect.

[0055] Continuing with Figure 3 , between any two adjacent dams 140 , the first inorganic layer 123 , protective layer 121 , and first substrate 130 are sequentially attached. Specifically, between any two adjacent dams 140 , the first inorganic layer 123 , protective layer 121 , and first substrate 130 are tightly bonded, effectively blocking the intrusion of water and oxygen from the outside.

[0056] Specifically, considering the better connectivity between inorganic materials, the material of the first substrate 130 can be set to include inorganic materials, thereby effectively preventing external water and oxygen from invading the photoelectric conversion unit 110 from between the first substrate 130 and the protective layer 121.

[0057] 3 and 4 , the heights of the dams 140 increase sequentially from the center to the periphery of the photoelectric conversion device 100. Specifically, this arrangement allows the outer dams 140 to still prevent the flow of organic material even when the inner dams 140 are unable to prevent the flow of the organic material.

[0058] Of course, in other embodiments, the heights of the dams 140 may be comparable, that is, the heights of the dams 140 may be equal or substantially equal. Alternatively, the heights of the dams 140 may decrease sequentially from the center to the periphery of the photoelectric conversion device 100.

[0059] To ensure the blocking effect of the dam 140 and to achieve miniaturization of the photoelectric conversion device 100, the height of the dam 140 ranges from 1 micron to 100 microns. For example, the height of the dam 140 is 1 micron, 20 microns, 50 microns, 80 microns, or 100 microns. Of course, in other embodiments, the height of the dam 140 can be set to be greater than 100 microns, or the height of the dam 140 can be set to be less than 1 micron according to actual needs.

[0060] The material of the dam 140 includes at least one of an organic material and an inorganic material. Specifically, the dam 140 may include only organic material, only inorganic material, or a mixture of organic and inorganic materials. The material can be selected based on actual needs and is not limited here.

[0061] 5 , the photoelectric conversion device 100 further includes a second substrate 150 .

[0062] The second substrate 150 is disposed opposite the first substrate 130, wherein the photoelectric conversion unit 110 and the first encapsulation layer 120 are both located between the first substrate 130 and the second substrate 150. Specifically, the provision of the second substrate 150 can further improve the mechanical strength of the photoelectric conversion device 100 and ensure the stability of the photoelectric conversion device 100.

[0063] Similar to the first substrate 130, the second substrate 150 can be a flexible substrate, a rigid substrate, or a flexible substrate. When the second substrate 150 is a rigid substrate, it can be rigid glass. When the second substrate 150 is a flexible substrate, it can be a flexible carrier, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc., or the second substrate 150 can also be a metal foil, such as copper foil, aluminum foil, etc.

[0064] In one application scenario, in order to reduce the weight of the photoelectric conversion device 100, at least one of the first substrate 130 and the second substrate 150 is configured as a flexible substrate. For example, the first substrate 130 is a flexible substrate, or the second substrate 150 is a flexible substrate, or both the first substrate 130 and the second substrate 150 are flexible substrates.

[0065] In one application scenario, in order to avoid affecting the emission or incidence of light, at least one of the first substrate 130 and the second substrate 150 is a transparent substrate. For example, the first substrate 130 is a transparent substrate, or the second substrate 150 is a transparent substrate, or both the first substrate 130 and the second substrate 150 are transparent substrates.

[0066] It should be noted that in other embodiments, the second substrate 150 may not be provided as long as the requirements of packaging, mechanical strength, etc. are met.

[0067] 5 , the photoelectric conversion device 100 further includes a frame adhesive 160 .

[0068] The frame glue 160 is disposed between the first substrate 130 and the second substrate 150 and connects the first substrate 130 and the second substrate 150. Specifically, the frame glue 160 can improve the packaging effect and mechanical strength of the photoelectric conversion device 100, and can also prevent the intrusion of external water and oxygen.

[0069] 5 , the border glue 160 is disposed around the photoelectric conversion unit 110 and the first packaging layer 120. Specifically, the border glue 160 can fully protect the photoelectric conversion unit 110 and the first packaging layer 120, further ensuring the strength and stability of the photoelectric conversion device 100.

[0070] The material of the border glue 160 may include butyl glue, but it should be noted that the present application does not impose any specific restrictions on the material of the border glue 160 and the material may be selected according to actual needs.

[0071] It should be noted that, in other embodiments, the border glue 160 may also be disposed only on a portion of the periphery of the photoelectric conversion unit 110 and the first encapsulation layer 120 .

[0072] 2 and 5 , the photoelectric conversion device 100 further includes a second packaging layer 170 .

[0073] The second encapsulation layer 170 is disposed on a surface of the first encapsulation layer 120 facing away from the photoelectric conversion unit 110. Specifically, the second encapsulation layer 170 can block water vapor from contacting the first encapsulation layer 120, thereby achieving a better encapsulation effect.

[0074] Continuing with Figures 2 and 5 , second encapsulation layer 170 covers the surface of first encapsulation layer 120 facing away from photoelectric conversion unit 110. That is, second encapsulation layer 170 wraps around first encapsulation layer 120, further ensuring the encapsulation effect. It should be noted that in other embodiments, second encapsulation layer 170 may be disposed only on a portion of the surface of first encapsulation layer 120.

[0075] In one embodiment, the material of the second encapsulation layer 170 includes hot melt adhesive. Hot melt adhesive is a plastic adhesive whose physical state changes with temperature within a certain temperature range, while its chemical properties remain unchanged. It is non-toxic and odorless, making it an environmentally friendly chemical product. It is also highly sought after for its simple production process, high added value, strong bonding strength, and fast bonding speed. Therefore, considering the many advantages of hot melt adhesive, the material of the second encapsulation layer 170 is configured to include hot melt adhesive. Of course, in other embodiments, the material of the second encapsulation layer 170 can also be selected based on actual needs and performance.

[0076] As can be seen from the above, the first encapsulation layer 120 includes both an organic layer and an inorganic layer. However, this application does not limit the number of organic and inorganic layers in the first encapsulation layer 120. In addition to the first organic layer 122 and the first inorganic layer 123 described above, more organic and inorganic layers may be provided. For example, referring to Figures 6 and 7, the first encapsulation layer 120 further includes a second organic layer 124 and a second inorganic layer 125 sequentially disposed on the first inorganic layer 123. The structure of the second organic layer 124 can be the same as that of the first organic layer 122, and the structure of the second inorganic layer 125 can be the same as that of the first inorganic layer 123. For details, please refer to the above-mentioned relevant content.

[0077] 6 and 7 , the second inorganic layer 125 covers the surface of the second organic layer 124 facing away from the photoelectric conversion unit 110 , thereby preventing the second organic layer 124 from contacting with external water and oxygen.

[0078] 6 , the second inorganic layer 125 extends from the surface of the second organic layer 124 to the surface of the first inorganic layer 123 and is attached to the first inorganic layer 123 . The close connection between the two inorganic layers can effectively prevent the edge of the second organic layer 124 from absorbing water.

[0079] 7 , the second organic layer 124 may also cover the surface of the first inorganic layer 123 facing away from the first organic layer 122 , so as to fully protect the first inorganic layer 123 and prevent dust from penetrating the first inorganic layer 123 .

[0080] It should be noted that more organic layers and inorganic layers such as a third organic layer and a third inorganic layer may be provided with reference to the first organic layer 122 , the first inorganic layer 123 , the second organic layer 124 and the second inorganic layer 125 , which will not be described in detail here.

[0081] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

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