Display panel and display apparatus

Abstract

The present invention provides a display panel and a display apparatus. The display panel comprises: a substrate, the substrate comprising a display area and a peripheral area, and the peripheral area comprising a binding area and a transition area located between the binding area and the display area; a source / drain metal layer, which comprises a binding part at least located in the binding area and a connecting part located in the transition area; a planarization layer, which is provided on the substrate and is provided with a first opening located in the binding area and a first via located in the transition area, respectively; a first organic insulation layer, which is provided on the side of the planarization layer away from the substrate and is provided with a third via corresponding to the first via; a first metal structure, which is located in the peripheral area and is at least provided on the side of the first organic insulation layer away from the substrate, the orthographic projection of the first metal structure on the substrate at least covering the first opening and the first via; and a second metal structure, which is provided on the side of the first metal structure away from the substrate and is in contact with the first metal structure. According to the display panel provided by the present invention, the problem of short circuiting caused by metal residue during process manufacturing can be solved, and product yield is increased.

Description

Display panel and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 22, 2023, with application number 202311236720.3 and application name “A display panel and display device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present invention relates to the field of display technology, and more particularly to a display panel and a display device. Background Art

[0004] In recent years, the technology of fabricating a touchscreen structure directly on the encapsulation layer of an OLED (Organic Light-Emitting Diode) display panel (Flexible Multi-Layer On Cell, FMLOC) has gained widespread adoption due to its ability to produce lighter and thinner display devices. As demand for flexible screens grows, organic film layers are sometimes used as touchscreen insulation to meet market demands. However, this design also makes the touchscreen structure susceptible to short circuits in the peripheral area of ​​the display panel, resulting in a decrease in the display panel's yield rate.

[0005] Summary of the Invention

[0006] An object of the present invention is to provide a display panel and a display device to solve the problems existing in the related art.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] As one aspect of the present invention, the present invention provides a display panel, comprising a substrate, the substrate comprising a display area and a peripheral area, the peripheral area comprising a binding area spaced apart from the display area, and a transition area between the binding area and the display area; a source-drain metal layer, the source-drain metal layer comprising a binding portion at least partially located in the binding area and a connecting portion located in the transition area, the binding portion being electrically connected to the connecting portion; a planarization layer, the planarization layer being arranged on the substrate and provided with a first opening respectively located in the binding area and a first via located in the transition area, the first opening exposing the binding portion, the first via exposing the connecting portion; a first organic insulating layer, the first organic insulating layer comprising a first organic insulating layer having a first opening disposed on the substrate and a first organic insulating layer disposed on the substrate; An organic insulating layer is located in the display area and the peripheral area and is arranged on the side of the planarization layer away from the substrate and is provided with a third via corresponding to the first via; a first metal structure, the first metal structure is located in the peripheral area and is at least partially arranged on the side of the first organic insulating layer away from the substrate; the orthographic projection of the first metal structure on the substrate at least covers the orthographic projections of the first opening and the first via on the substrate, and the first metal structure is electrically connected to the connecting portion through the first via and the third via; a second metal structure, the second metal structure is located in the peripheral area and is arranged on the side of the first metal structure away from the substrate; the second metal structure is in direct contact with the first metal structure.

[0009] Exemplarily, the transition zone includes a first transition zone, a second transition zone and a bending zone located between the first transition zone and the second transition zone, the first transition zone is located between the bending zone and the display zone, and the second transition zone is located between the bending zone and the binding zone; the first via and the third via are located in the second transition zone; the connecting portion is located in the first transition zone, the bending zone and the second transition zone and is a continuous structure.

[0010] Exemplarily, the display panel also includes a second organic insulating layer, which is arranged on the side of the first organic insulating layer away from the substrate and is provided with a sixth via located in the display area; a first touch metal layer, which is arranged in the display area and at least partially extends to the transition area, and the first touch metal layer is located on the side of the second organic insulating layer away from the substrate; a second touch metal layer, which is located on the side of the second organic insulating layer close to the substrate; the first touch metal layer and the second touch metal layer are electrically connected through the sixth via.

[0011] Exemplarily, the first touch metal layer includes a first touch electrode located in the display area and a first touch trace located in the transition area; the planarization layer also includes a second via located in the first transition area and exposing the connecting portion; the first organic insulating layer is also provided with a fourth via corresponding to the second via, and the first touch trace is electrically connected to the connecting portion through the second via and the fourth via.

[0012] Exemplarily, the second organic insulating layer has a second boundary located in the transition area, and an orthographic projection of the second boundary on the substrate is located on a side of an orthographic projection of the first touch metal layer on the substrate away from the display area.

[0013] Illustratively, the orthographic projection of the second boundary on the substrate is located in the bending area.

[0014] Exemplarily, the distance between the second boundary and the display area is greater than or equal to 1600 μm.

[0015] Exemplarily, the first organic insulating layer has a first boundary, which is the boundary of the first organic insulating layer away from the display area; the distance between the orthographic projection of the first boundary on the substrate and the orthographic projection of the first opening on the substrate is greater than or equal to 50 μm.

[0016] Exemplarily, the first boundary is located on a side of the binding area away from the display area, and the orthographic projection of the first boundary on the substrate is located on a side of the orthographic projection of the first metal structure on the substrate away from the display area; the first organic insulating layer has a fifth via corresponding to the first opening, and the first metal structure is electrically connected to the binding part through the first opening and the fifth via.

[0017] Exemplarily, the source-drain metal layer includes a first source-drain metal layer and a second source-drain metal layer, the binding portion includes a first binding portion and a second binding portion, the first source-drain metal layer has a first binding portion, and the second source-drain metal layer has a second binding portion and a connecting portion; a passivation layer, the passivation layer is at least partially located in the binding area, the first source-drain metal layer, the passivation layer and the second source-drain metal layer are arranged in sequence along a direction away from the substrate; the passivation layer has a second opening located in the binding area, and the first binding portion and the second binding portion are electrically connected through the second opening.

[0018] Exemplarily, the first metal structure and the first touch metal layer are provided in the same layer and made of the same material, and the second metal structure and the second touch metal layer are provided in the same layer and made of the same material.

[0019] Exemplarily, the display panel also includes a pixel definition layer, which is arranged on the substrate and located in the display area, and the pixel definition layer has a sixth opening; a light-emitting layer, which is arranged in the sixth opening; an encapsulation layer, which is at least partially located in the display area and whose orthographic projection on the substrate covers the orthographic projections of the pixel definition layer and the light-emitting layer on the substrate; and the first organic insulating layer is at least partially arranged on the side of the encapsulation layer away from the substrate.

[0020] As another aspect of the present invention, the present invention provides a display panel, comprising a substrate, the substrate comprising a display area and a peripheral area surrounding the display area, the peripheral area comprising a binding area spaced apart from the display area, and a transition area located between the binding area and the display area; a source-drain metal layer, the source-drain metal layer comprising a binding portion at least partially located in the binding area and a connecting portion located in the transition area, the binding portion being electrically connected to the connecting portion; a planarization layer, the planarization layer being arranged on the substrate and provided with a first opening respectively located in the binding area and a first via located in the transition area, the first opening exposing the binding portion, and the first via exposing the connecting portion; a first organic insulating layer, the first organic insulating layer being located in the display area and the peripheral area and being arranged on the planarization layer A third via hole is provided on a side away from the substrate and corresponds to the first via hole; the first organic insulating layer has a first boundary, and the first boundary is the boundary of the first organic insulating layer away from the display area; a first metal structure, the first metal structure is located in the peripheral area, and is at least partially arranged on a side of the first organic insulating layer away from the substrate; the orthographic projection of the first metal structure on the substrate at least covers the orthographic projections of the first opening and the first via hole on the substrate, and is electrically connected to the connecting portion through the first via hole and the third via hole; a second metal structure, the second metal structure is located in the peripheral area, and is arranged on a side of the first metal structure away from the substrate; the orthographic projection of the first boundary on the substrate does not overlap with the orthographic projections of the first metal structure and the second metal structure on the substrate.

[0021] Exemplarily, the display panel also includes a second organic insulating layer, the second organic insulating layer includes a first organic sub-insulating portion arranged in the display area and extending at least partially to the transition area, the first organic sub-insulating portion is arranged on the side of the first organic insulating layer away from the substrate, and is provided with a sixth via located in the display area; a first touch metal layer, the first touch metal layer is arranged in the display area and extends at least partially to the transition area, the first touch metal layer is located on the side of the second organic insulating layer away from the substrate; a second touch metal layer, the second touch metal layer is located on the side of the second organic insulating layer close to the substrate; the first touch metal layer and the second touch metal layer are electrically connected through the sixth via.

[0022] Exemplarily, the transition zone includes a first transition zone, a second transition zone and a bending zone located between the first transition zone and the second transition zone, the first transition zone is located between the bending zone and the display zone, and the second transition zone is located between the bending zone and the binding zone; the connecting portion is located in the first transition zone, the bending zone and the second transition zone and is a continuous structure.

[0023] Exemplarily, the first touch metal layer includes a first touch electrode located in the display area and a first touch trace located in the transition area; the planarization layer also includes a second via located in the first transition area and exposing the connecting portion, the first organic insulating layer is also provided with a fourth via corresponding to the second via, and the first touch trace is also electrically connected to the connecting portion through the second via and the fourth via.

[0024] Exemplarily, the second organic insulating layer has a second organic sub-insulating portion at least partially located in the second transition region and a fourth opening located between the first organic sub-insulating portion and the second organic sub-insulating portion, and an orthographic projection of the fourth opening on the substrate at least partially overlaps with the bending region;

[0025] Exemplarily, a first metal structure is arranged in the binding area and the second transition area, and the first metal structure has a third opening in the second transition area; the orthographic projection of the first boundary on the substrate is located within the orthographic projection of the third opening on the substrate, that is, there is a first gap between the first boundary and the binding area.

[0026] Exemplarily, on the side of the third opening close to the display area, the first metal structure, the second organic sub-insulating part and the second metal structure are stacked in sequence in a direction perpendicular to the substrate; the second organic insulating layer also has a fifth opening located in the second transition area, and the first metal structure and the second metal structure are electrically connected through the fifth opening.

[0027] Exemplarily, the second organic sub-insulating portion has a third boundary and a fourth boundary, and the orthographic projection of the third boundary on the substrate is located on the side of the orthographic projection of the fourth boundary on the substrate away from the display area; the orthographic projections of the third boundary and the fourth boundary on the substrate are located between the orthographic projections of the first gap and the fourth opening on the substrate, and the orthographic projection of the third boundary on the substrate is located on the side of the orthographic projection of the first boundary on the substrate close to the display area.

[0028] Exemplarily, the first boundary is located on a side of the binding area away from the display area.

[0029] Exemplarily, the second organic insulating layer has a second organic sub-insulating portion at least partially located in the second transition zone and a fourth opening located between the first organic sub-insulating portion and the second organic sub-insulating portion, and the orthographic projection of the fourth opening on the substrate at least partially overlaps with the bending zone; the second organic sub-insulating portion includes a fifth opening located in the second transition zone and a seventh via located in the binding zone, and the first metal structure is electrically connected to the second metal structure through the fifth opening and the seventh via.

[0030] Exemplarily, the second organic sub-insulating portion has a third boundary and a fourth boundary, the orthographic projection of the third boundary on the substrate is located on the side of the orthographic projection of the fourth boundary on the substrate away from the display area, and the third boundary is located on the side of the binding area away from the display area.

[0031] Exemplarily, the orthographic projection of the third boundary on the substrate is located on a side of the orthographic projection of the first boundary on the substrate away from the display area.

[0032] Exemplarily, the orthographic projection of the fourth boundary on the substrate is located in the bending region.

[0033] Exemplarily, the first organic sub-insulating portion has a second boundary, and an orthographic projection of the second boundary on the substrate is located on a side of the fourth opening close to the display area.

[0034] Illustratively, the orthographic projection of the second boundary on the substrate is located in the bending region.

[0035] Exemplarily, a distance between an orthographic projection of the first boundary on the substrate and an orthographic projection of the first opening on the substrate is greater than or equal to 50 μm.

[0036] Exemplarily, the first metal structure and the first touch metal layer are provided in the same layer and made of the same material, and the second metal structure and the second touch metal layer are provided in the same layer and made of the same material.

[0037] Exemplarily, the source-drain metal layer includes a first source-drain metal layer and a second source-drain metal layer, the binding part includes a first binding part and a second binding part, the first source-drain metal layer has a first binding part, and the second source-drain metal layer has a second binding part and a connecting part; a passivation layer, the passivation layer is at least partially located in the binding area, the first source-drain metal layer, the passivation layer and the second source-drain metal layer are arranged in sequence along a direction away from the substrate, the passivation layer has a second opening located in the binding area, and the first binding part and the second binding part are electrically connected through the second opening.

[0038] Exemplarily, the display panel also includes a pixel definition layer, which is arranged on the substrate and located in the display area, and the pixel definition layer has a sixth opening; a light-emitting layer, which is arranged in the sixth opening; an encapsulation layer, which is at least partially located in the display area and whose orthographic projection on the substrate covers the orthographic projections of the pixel definition layer and the light-emitting layer on the substrate; and the first organic insulating layer is at least partially arranged on the side of the encapsulation layer away from the substrate.

[0039] The present invention further provides a display device comprising the above-mentioned display panel.

[0040] The beneficial effects brought about by the technical solution provided by the present invention include at least:

[0041] The present invention provides a display panel, comprising a substrate, the substrate comprising a display area and a peripheral area, the peripheral area comprising a binding area spaced apart from the display area, and a transition area located between the binding area and the display area; a source-drain metal layer, the source-drain metal layer comprising a binding portion at least partially located in the binding area and a connecting portion located in the transition area, the binding portion being electrically connected to the connecting portion; a planarization layer, the planarization layer being disposed on the substrate and having a first opening located in the binding area and a first via located in the transition area, the first opening exposing the binding portion, the first via exposing the connecting portion; a first organic insulating layer, the first organic insulating layer The invention also includes a first metal structure located in the display area and the peripheral area, disposed on a side of the planarization layer away from the substrate, and provided with a third via hole corresponding to the first via hole. The first metal structure is located in the peripheral area and at least partially disposed on a side of the first organic insulating layer away from the substrate. The orthographic projection of the first metal structure on the substrate at least covers the orthographic projections of the first opening and the first via hole on the substrate, and the first metal structure is electrically connected to the connecting portion through the first and third via holes. The second metal structure is located in the peripheral area and disposed on a side of the first metal structure away from the substrate. The second metal structure is in direct contact with the first metal structure. By eliminating the second organic insulating layer between the first and second metal structures, there is no step formed by the second organic insulating layer, thereby avoiding the generation of metal residue during the fabrication of the second metal structure. In this case, since the residue of the first metal structure originally generated at the boundary of the first organic insulating layer is not protected by the second organic insulating layer, the residue of the first metal structure generated at the boundary of the first organic insulating layer can be further etched during the patterning of the second metal structure, thereby avoiding short circuit problems caused by the metal residue at this location and ensuring product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings. Obviously, the drawings described below are some embodiments of the present invention, and those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0043] FIG1 shows a top view of a display panel;

[0044] FIG2 is a schematic cross-sectional view of a portion of the structure along section line Ⅰ Ⅰ ' in FIG1 according to the related art;

[0045] FIG3 is a schematic cross-sectional view showing a partial structure of an embodiment of the present invention along section line Ⅰ Ⅰ ' in FIG1;

[0046] FIG4 shows a schematic cross-sectional view of a portion of the structure along section line Ⅰ Ⅰ ' in FIG1 according to another embodiment of the present invention;

[0047] FIG5 is a schematic cross-sectional view showing a partial structure of another embodiment of the present invention along section line Ⅰ Ⅰ ' in FIG1;

[0048] FIG6 is a schematic cross-sectional view showing a partial structure of another embodiment of the present invention along section line Ⅰ Ⅰ ' in FIG1;

[0049] FIG7 shows a schematic cross-sectional view of a portion of the structure along section line Ⅰ Ⅰ ' in FIG1 according to another embodiment of the present invention;

[0050] FIG8 shows a top view of a portion of the structure corresponding to the area where the dotted box M in FIG2 is located;

[0051] FIG9 shows a top view of a portion of the structure corresponding to the area where the dotted box M in FIG3 is located;

[0052] FIG10 shows a top view of a portion of the structure corresponding to the area where the dotted box M in FIG5 is located;

[0053] FIG11 shows a top view of a portion of the structure corresponding to the area where the dotted box M in FIG6 is located;

[0054] FIG12 shows a top view of a portion of the structure corresponding to the area where the dotted box M in FIG7 is located. DETAILED DESCRIPTION

[0055] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0056] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; they may refer to direct connection or indirect connection through an intermediate medium; they may refer to internal communication between two elements or interaction between two elements. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0057] In the present invention, unless otherwise clearly stipulated and limited, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, or the first and second features not being in direct contact but being in contact through another feature between them.

[0058] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the term "exemplary" is intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms may refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be included in any appropriate manner in any one or more embodiments or examples.

[0059] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely for ease of description and simplified operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, terms such as "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0060] FIG1 shows a top view of a display panel. As shown in FIG1 , the display panel can be any device that displays either motion (e.g., video) or fixed (e.g., still images) and whether text or images. More specifically, it is expected that the embodiments described may be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, car displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc. FIG1 illustrates the display panel as a mobile phone as an example.

[0061] Figure 2 illustrates a cross-sectional structure of a portion of the structure along section line Ⅰ' in Figure 1 in a related art. As shown in Figure 2, the display panel includes a substrate 100. Substrate 100 includes a display area A and a peripheral area B. Peripheral area B includes a binding area B1 spaced apart from display area A, and a transition area B2 located between the binding area and the display area. The source / drain metal layer includes a binding portion 1051 / 1061 located at least partially in binding area B1 and a connecting portion 1062 located in the transition area. The binding portion 1051 / 1061 is electrically connected to the connecting portion 1062. A planarization layer 107 is disposed on substrate 100, and a first organic insulating layer 109 is disposed on the side of the planarization layer away from the substrate. The first metal structure 1081 is located in the peripheral area and is at least partially disposed on the side of the first organic insulating layer 109 away from the substrate 100. The second organic insulating layer 110 is at least partially located in the transition area B2 and is disposed on the side of the first metal structure 1081 away from the substrate, and has a fifth opening K5. The second metal structure 1082 is located in the peripheral area and is at least partially disposed on the side of the second organic insulating layer 110 away from the substrate, and is electrically connected to the first metal structure through the fifth opening K5.

[0062] Continuing to refer to Figures 2 and 8, Figure 8 shows a top view of the partial structure corresponding to the area where the dotted box M in Figure 2 is located. In related technologies, in order to meet the needs of flexible screens, the touch insulation layer of the OLED display panel will select organic materials. However, since the organic material is thicker than the original inorganic touch insulation layer, a more obvious step will be formed at the boundary position of the first organic insulation layer 109 and the second organic insulation layer 110, which will lead to metal residue 113 being easily generated at the step during the production process of the first metal structure 1081 and the second metal structure 1082. This part of the metal residue can easily cause electrical connection between adjacent metal structures, thereby causing a short circuit and affecting product yield.

[0063] In order to solve the problems existing in the related art, the present invention proposes a display panel, which may be a liquid crystal display panel (LCD); the display panel may also be an electroluminescent display panel or a photoluminescent display panel. In the case where the display panel is an electroluminescent display panel, the electroluminescent display panel may be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. In the case where the display panel is a photoluminescent display panel, the photoluminescent display device may be a quantum dot photoluminescent display panel. The present invention is described by taking the display panel as an organic light-emitting diode (OLED) display panel as an example.

[0064] Figures 3 to 7 illustrate schematic cross-sectional views of portions of the structure along section line Ⅰ' in Figure 1 according to some embodiments of the present invention. As shown in Figures 3 to 7, the display panel includes a substrate 100. Substrate 100 includes a display area A and a peripheral area B surrounding the display area. Peripheral area B includes a bonding area B1 spaced apart from display area A and a transition area B2 located between the bonding area and the display area. The source / drain metal layer includes a bonding portion 1051 / 1061 located at least partially within bonding area B1 and a connecting portion 1062 located within the transition area. The bonding portions 1051 / 1061 are electrically connected to the connecting portion 1062. A planarization layer 107 is disposed on substrate 100 and includes a first opening K1 located within the bonding area and a first via G1 located within the transition area. The first opening K1 exposes the bonding portions 1051 / 1061, while the first via G1 exposes the connecting portion. A first organic insulating layer 109 is located within the display area A and the peripheral area B and is disposed on the side of the planarization layer 107 away from the substrate. The first organic insulating layer 109 includes a third via G3 corresponding to the first via G1. The first metal structure 1081 is located in the peripheral region B and is at least partially disposed on a side of the first organic insulating layer 109 away from the substrate. The orthographic projection of the first metal structure 1081 on the substrate at least covers the orthographic projections of the first opening K1 and the first via G1 on the substrate. The first metal structure 1081 is electrically connected to the connecting portion 1062 via the first via G1 and the third via G3. The second metal structure 1082 is located in the peripheral region B and is disposed on a side of the first metal structure away from the substrate.

[0065] For example, referring again to Figures 3 to 7 , the transition region includes a first transition region B21, a second transition region B23, and a bend region B22 located between the first and second transition regions B21 and B23. The first transition region B21 is located between the bend region B22 and the display region A, and the second transition region B23 is located between the bend region B22 and the binding region B1. The first and third vias G1 and G3 are located in the second transition region B23. The planarization layer 107 also includes a second via G2 located in the first transition region B21, exposing the connection portion 1062. The connection portion 1062 is located in the first transition region B21, the bend region B22, and the second transition region B23, forming a continuous structure. The first organic insulating layer also includes a fourth via G4 corresponding to the second via G2. The display panel also includes a second organic insulating layer 110, which is disposed on the side of the first organic insulating layer 109 away from the substrate 100 and includes a sixth via G6 located in the display region A. The touch metal layer 111 includes a first touch metal layer 1111, which is disposed in the display area and at least partially extends into the transition area B2. The first touch metal layer 1111 is located on the side of the second organic insulating layer 110 away from the substrate 100. Furthermore, the first touch metal layer 1111 includes a first touch electrode located in the display area A and a first touch trace located in the transition area B2. The first touch trace is electrically connected to the connection portion 1062 via a second via G2 and a fourth via G4. The touch metal layer 111 also includes a second touch metal layer 1112, which is located on the side of the second organic insulating layer 110 closer to the substrate 100 and on the side of the first organic insulating layer 109 away from the substrate 100. The second touch metal layer 1112 is electrically connected to the first touch metal layer 1111 via a sixth via G6. Because the connection portion 1062 is located in the transition area, it avoids conflict with other traces in the display area, preventing interference between traces and improving product yield.

[0066] For example, as shown in FIG3 , the second metal structure 1082 is located in the peripheral region B and is disposed on the side of the first metal structure 1081 away from the substrate 100, and is in direct contact with the first metal structure 1081. In an embodiment of the present disclosure, as shown in FIG9 , FIG9 shows a top view of the portion of the structure corresponding to the area indicated by the dashed box M in FIG3 . By removing the second organic insulating layer in the transition region B2, the first metal structure 1081 and the second metal structure 1082 are in direct contact in the transition region B2. That is, there is no second organic insulating layer between the first metal structure 1081 and the second metal structure 1082, and thus no step formed by the second organic insulating layer. This prevents the generation of metal residue during the fabrication of the second metal structure 1082. At this point, since the residue of the first metal structure 1081 originally generated at the boundary of the first organic insulating layer is not protected by the second organic insulating layer, the residue of the first metal structure 1081 generated at the boundary of the first organic insulating layer 109 can be further etched during the patterning process of the second metal structure 1082, thereby avoiding short circuit problems caused by metal residue at this location and ensuring product yield.

[0067] For example, the second organic insulating layer 110 has a second boundary J2 located in the transition region B2. The orthographic projection of the second boundary J2 on the substrate 100 is located on the side of the orthographic projection of the first touch trace on the substrate away from the display area A. As shown in Figure 1, the orthographic projection of the second boundary J2 on the substrate is located in the first transition region B21. However, in actual manufacturing processes, due to certain process instabilities, there is a certain possibility that metal residue generated at the second boundary J2 will connect with the second touch metal layer 1112 in the display area, causing a short circuit.

[0068] To further address this issue, as an example, referring to Figure 4 , the orthographic projection of the second boundary J2 of the second organic insulating layer on the substrate is located at the bend region B22 . In this embodiment, the second boundary J2 of the second organic insulating layer is located farther from the display area. This prevents metal residue at the boundary from causing short circuits between the second touch metal layer 1112 in the display area and thereby improves product yield. Exemplarily, the distance from the second boundary J2 of the second organic insulating layer 110 to the display area A is greater than or equal to 1600 μm.

[0069] For example, as shown in Figures 4 to 7, the first organic insulating layer 109 has a first boundary J1, which is the boundary of the first organic insulating layer 109 away from the display area A. The distance between the orthographic projection of the first boundary J1 on the substrate and the orthographic projection of the first opening K1 on the substrate is greater than or equal to 50 μm.

[0070] For example, as shown in Figures 6 and 7 , the first boundary J1 is located on the side of the binding region B1 away from the display area A, and the orthographic projection of the first boundary J1 on the substrate is located on the side of the orthographic projection of the first metal structure 1081 on the substrate away from the display area A. By setting the spacing between the orthographic projection of the first boundary J1 on the substrate and the orthographic projection of the first opening K1 on the substrate to be greater than or equal to 50 μm, the spacing between the first organic insulating layer 109 and the metal structure 108 can be maintained during the fabrication of the metal structure 108, preventing metal residue formed at the first boundary J1 from causing a connection between the metal structures and resulting in a short circuit, thereby improving product yield.

[0071] In some other embodiments of the present invention, as shown in Figure 5, the orthographic projection of the first boundary J1 of the first organic insulating layer 109 on the substrate does not overlap with the orthographic projections of the first metal structure 1081 and the second metal structure 1082 on the substrate. The second organic insulating layer 110 includes a first organic sub-insulating portion 1101 disposed in the display area A and extending at least partially to the transition area B2. The first organic sub-insulating portion 1101 is disposed on the side of the first organic insulating layer 109 away from the substrate 100 and is provided with a sixth via G6 located in the display area. The second touch metal layer 1112 is electrically connected to the first touch metal layer 1111 through the sixth via G6. Furthermore, the second organic insulating layer 110 has a second organic sub-insulating portion 1102 at least partially located in the second transition area B23 and a fourth opening K4 located between the first organic sub-insulating portion 1101 and the second organic sub-insulating portion 1102. The orthographic projection of the fourth opening K4 on the substrate 100 at least partially overlaps with the bend area B22. That is, the second organic insulating layer 110 does not exist in at least part of the bending area B22, which can reduce the film thickness of the bending area B22, reduce the bending stress on the film when the bending area B22 bends, and improve the product yield.

[0072] For example, referring again to FIG. 5 , the first metal structure 1081 is disposed in the binding region B1 and the second transition region B23. The first metal structure 1081 has a third opening K3 in the second transition region B23. The orthographic projection of the first boundary J1 on the substrate lies within the orthographic projection of the third opening K3 on the substrate, i.e., a first gap exists between the first boundary J1 and the binding region B1. On the side of the third opening K3 proximate to the display region A, the first metal structure 1081, the second organic sub-insulating portion 1102, and the second metal structure 1082 are stacked in a direction perpendicular to the substrate. The second organic sub-insulating portion 1102 also has a fifth opening K5 in the second transition region B23, electrically connecting the first metal structure 1081 and the second metal structure 1082 via the fifth opening K5. The second organic sub-insulating portion 1102 has a third boundary J3 and a fourth boundary J4. The orthographic projection of the third boundary J3 on the substrate 100 lies on the side of the orthographic projection of the fourth boundary J4 on the substrate away from the display region A. The orthographic projections of the third boundary J3 and the fourth boundary J4 on the substrate are located between the orthographic projections of the first gap and the fourth opening K4 on the substrate, and the orthographic projection of the third boundary J3 on the substrate is located on a side of the orthographic projection of the first boundary J1 on the substrate 100 close to the display area A.

[0073] In this embodiment, as shown in FIG10 , which illustrates a top view of the portion of the structure corresponding to the area indicated by the dashed box M in FIG5 , the first metal structure 1081 is provided with a third opening K3, thereby creating a disconnected region in the second transition region B23. Furthermore, the orthographic projection of the third boundary J3 of the second organic sub-insulating portion 1102 on the substrate is positioned between the first gap and the orthographic projection of the fourth opening K4 on the substrate. This arrangement allows for a certain distance between the boundary of the second organic sub-insulating portion 1102 and both the first metal structure 1081 and the second metal structure 1082 located in the binding region B1 and the second transition region B23. This arrangement ensures electrical connection, and even if metal residue is generated at the boundary of the organic insulating layer, it prevents electrical connection between adjacent metal structures 108. This prevents short circuits caused by metal residue and improves product yield. In addition, by designing two via transfers in the second transition area B23, it is possible to avoid line interference between the binding part 1051 / 1061 and other lines (not shown in the figure) located in the second transition area B23 while ensuring electrical connection and isolation effects, thereby ensuring product performance.

[0074] For example, as shown in Figures 6 and 11 , the first boundary J1 is located on the side of the binding region B1 away from the display region A, and the orthographic projection of the first boundary J1 on the substrate is located on the side of the orthographic projection of the first metal structure 1081 on the substrate away from the display region A. The first organic insulating layer 109 has a fifth via G5 corresponding to the first opening K1. The first metal structure 1081 is electrically connected to the binding portion 1051 / 1061 via the first opening K1 and the fifth via G5. The second organic insulating layer 110 has a second organic sub-insulating portion 1102 at least partially located in the second transition region B23 and a fourth opening K4 located between the first and second organic sub-insulating portions 1101 and 1102. The orthographic projection of the fourth opening K4 on the substrate is at least partially aligned with the bend region B22. The second organic sub-insulating portion includes a fifth opening K5 located in the second transition region B23 and a seventh via G7 located in the binding region B1. The first metal structure 1081 is electrically connected to the second metal structure 1082 via the fifth opening and the seventh via. The second organic sub-insulating portion 1102 has a third boundary J3 and a fourth boundary J4. The orthographic projection of the third boundary J3 on the substrate is located on the side of the orthographic projection of the fourth boundary J4 on the substrate away from the display area A, and the orthographic projection of the third boundary J3 on the substrate is located on the side of the binding area B1 away from the display area A. By making the boundary of the organic insulating layer outside the binding area, it can play a certain protective role when etching the metal structure and avoid side etching.

[0075] Exemplarily, the orthographic projection of the third boundary J3 on the substrate is located on the side of the orthographic projection of the first boundary J1 on the substrate away from the display area A. This arrangement allows for a certain distance between the boundary of the organic insulating layer and the metal structure. This prevents the metal residue from causing a connection between the metal structure and a short circuit, even if metal residue is generated at the boundary of the organic insulating layer. Furthermore, because the orthographic projection of the third boundary J3 on the substrate is located on the side of the orthographic projection of the first boundary J1 on the substrate away from the display area A, that is, because the second organic insulating layer 110 covers the first organic insulating layer 109, this prevents the metal residue generated at the third boundary J3 of the second organic insulating layer 110 from connecting with the metal residue generated at the first boundary J1 of the first organic insulating layer 109, thereby preventing the risk of a short circuit, thereby further improving product yield. Furthermore, as shown in Figures 7 and 12, the second organic insulating layer 110 located at the second transition area B23 and the binding area B1 can also be eliminated. By removing the second organic insulating layer 110 located at the second transition area B23 and the binding area B1, the first metal structure 1081 and the second metal structure 1082 are in direct contact with the second transition area B23 and the binding area B1, and there is no step formed by the second organic insulating layer 110. Therefore, the generation of metal residue during the production process of the second metal structure 1082 can be avoided.

[0076] For example, the orthographic projection of the fourth boundary J4 of the second organic sub-insulating portion 1102 on the substrate is located at the bend region B22. In this embodiment, the fourth boundary J4 of the second organic sub-insulating portion 1102 is located farther from the metal structure. This prevents metal residue at the boundary from causing short circuits between metal structures, thereby improving product yield.

[0077] Illustratively, the first organic sub-insulating portion 1101 has a second boundary J2, the orthographic projection of which on the substrate 100 is located on the side of the fourth opening K4 closer to the display area A. Furthermore, the orthographic projection of the second boundary J2 on the substrate is located in the bend area B22. In this embodiment, the second boundary J2 of the first organic sub-insulating portion 1101 is located farther from the display area. This prevents metal residue at the boundary from causing short circuits between the second touch metal layer 1112 in the display area and thereby improves product yield.

[0078] Exemplarily, as shown in Figures 3 to 7, the source-drain metal layer includes a first source-drain metal layer 105 and a second source-drain metal layer 106, and the binding portion 1051 / 1061 includes a first binding portion 1051 and a second binding portion 1061. The first source-drain metal layer 105 has a first binding portion 1051, and the second source-drain metal layer 106 has a second binding portion 1061 and a connecting portion 1062. The passivation layer 104 is at least partially located in the binding area B1. The first source-drain metal layer 105, the passivation layer 104, and the second source-drain metal layer 106 are arranged in sequence in a direction away from the substrate. The passivation layer 104 has a second opening K2 located in the binding area B1, and the first binding portion 1051 and the second binding portion 1061 are electrically connected through the second opening K2.

[0079] For example, the first metal structure 1081 and the first touch metal layer 1111 are set in the same layer and the same material, and / or the second metal structure 1082 and the second touch metal layer 1112 are set in the same layer and the same material. In this way, the film layer of the metal structure and the film layer of the touch metal can be formed through a single patterning process, thereby reducing the number of patterning processes of the display panel, simplifying the manufacturing process of the display panel, and saving production costs.

[0080] Exemplarily, as shown in Figures 1 to 7, the display panel also includes a pixel definition layer 101 and a light-emitting layer 102 arranged on the substrate 100 and located in the display area A. The light-emitting layer may include a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, and a blue light-emitting layer that emits blue light. It should be noted that this is only an exemplary description of the light-emitting color of the light-emitting layer, but is not limited to this. The light-emitting layer can also be used to emit light of other colors, such as yellow light and white light, which will not be repeated here. The pixel definition layer 101 has a sixth opening K6 so that the light-emitting layer 102 is arranged in the sixth opening. The pixel definition layer 101 can prevent light-emitting layers of different colors from mixing. Optionally, the material of the pixel definition layer 101 may include a black material to absorb ambient light incident on the display panel to prevent the ambient light from being reflected and emitted and affecting the contrast of the display panel during display.

[0081] For example, as shown in Figures 1 to 7 , the display panel further includes an encapsulation layer 103 located on a side of the pixel definition layer 101 and the light-emitting layer 102 away from the substrate 100. Encapsulation layer 103 is at least partially located in the display area A, and its orthographic projection on substrate 100 covers the orthographic projections of the pixel definition layer 101 and the light-emitting layer 102 on the substrate. Encapsulation layer 103 can, for example, be a thin film encapsulation layer, i.e., a thin film encapsulation structure comprising an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer stacked together, which will not be described in detail here.

[0082] Illustratively, the first organic insulating layer 109 is at least partially disposed on a side of the encapsulation layer 103 away from the substrate.

[0083] It should be noted that those skilled in the art will understand that the display panel may also include other film layer structures such as an active layer, a gate layer, a source / drain layer, a passivation layer, etc., and Figures 1 to 7 of the present invention only show part of the film layer structure in the display panel.

[0084] Based on the same inventive concept, the present disclosure further provides a display device comprising the display panel described above in the embodiments of the present disclosure. Since the principles underlying the problems solved by the display device are similar to those of the display panel described above, the implementation of the display device can be referenced to the embodiments of the display panel described above, and any repetitions will not be repeated.

[0085] In some embodiments, the display device provided in the embodiments of the present disclosure may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a smart watch, a fitness wristband, a personal digital assistant, or the like. The display device provided in the embodiments of the present disclosure may also include, but is not limited to, components such as a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will appreciate that the composition of the display device described above does not constitute a limitation on the display device, and the display device may include more or fewer of the above components, or a combination of certain components, or a different arrangement of components.

[0086] It should be noted that the dimensions of the various film layers in the drawings of the embodiments of the present invention are adjusted for clarity of illustration only. The width, thickness and shape of the various film layers in the drawings are only for schematic display and do not limit the proportional relationship between the dimensions of the specific film layers.

[0087] It should be noted that the above are only some specific embodiments of the present disclosure, and these specific embodiments can be combined with each other to form other solutions. The scope of protection of the present disclosure is not limited thereto. After considering the specification and practicing the invention disclosed herein, those skilled in the art will easily think of other embodiments of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure.

Claims

1. A display panel, wherein: include: A substrate, the substrate comprising a display area and a peripheral area, the peripheral area comprising a binding area spaced apart from the display area, and a transition area between the binding area and the display area; a source-drain metal layer, the source-drain metal layer comprising a binding portion at least partially located in the binding region and a connecting portion located in the transition region, the binding portion being electrically connected to the connecting portion; a planarization layer, the planarization layer being disposed on the substrate and having a first opening located in the binding area and a first via hole located in the transition area, the first opening exposing the binding portion, and the first via hole exposing the connecting portion; A first organic insulating layer, wherein the first organic insulating layer is located in the display area and the peripheral area and is disposed on a side of the planarization layer away from the substrate and is provided with a third via hole corresponding to the first via hole; a first metal structure, the first metal structure being located in the peripheral region and at least partially disposed on a side of the first organic insulating layer away from the substrate; The orthographic projection of the first metal structure on the substrate at least covers the orthographic projections of the first opening and the first via hole on the substrate, and the first metal structure is electrically connected to the connecting portion through the first via hole and the third via hole, and the first metal structure is electrically connected to the binding portion through the first opening; The second metal structure is located in the peripheral area and is disposed on a side of the first metal structure away from the substrate; the second metal structure is in direct contact with the first metal structure.

2. The display panel according to claim 1, wherein: The transition zone includes a first transition zone, a second transition zone and a bending zone between the first transition zone and the second transition zone, the first transition zone is located between the bending zone and the display zone, and the second transition zone is located between the bending zone and the binding zone; The first via hole and the third via hole are located in the second transition area; The connecting portion is located in the first transition zone, the bending zone and the second transition zone and is a continuous structure.

3. The display panel according to claim 2, wherein: The display panel comprises: a second organic insulating layer, the second organic insulating layer being disposed on a side of the first organic insulating layer away from the substrate and having a sixth via hole located in the display area; A first touch metal layer, the first touch metal layer is disposed in the display area and at least partially extends to the transition area, and the first touch metal layer is located on a side of the second organic insulating layer away from the substrate; a second touch metal layer, wherein the second touch metal layer is located on a side of the second organic insulating layer close to the substrate, and the second touch metal layer is located on a side of the first organic insulating layer away from the substrate; The first touch metal layer and the second touch metal layer are electrically connected through a sixth via hole.

4. The display panel according to claim 3, wherein: The first touch metal layer includes a first touch electrode located in the display area and a first touch trace located in the transition area; The planarization layer further includes a second via hole located in the first transition region and exposing the connection portion; The first organic insulating layer is further provided with a fourth via hole corresponding to the second via hole, and the first touch control wiring is electrically connected to the connecting portion through the second via hole and the fourth via hole.

5. The display panel according to claim 4, wherein: The second organic insulating layer has a second boundary located in the transition area, and an orthographic projection of the second boundary on the substrate is located on a side of an orthographic projection of the first touch-control trace on the substrate away from the display area.

6. The display panel according to claim 5, wherein: The orthographic projection of the second boundary on the substrate is located in the bending area.

7. The display panel according to claim 5, wherein: A distance between the second boundary and the display area is greater than or equal to 1600 μm.

8. The display panel according to any one of claims 1 to 7, wherein: The first organic insulating layer has a first boundary, and the first boundary is a boundary of the first organic insulating layer away from the display area; A distance between an orthographic projection of the first boundary on the substrate and an orthographic projection of the first opening on the substrate is greater than or equal to 50 μm.

9. The display panel according to claim 8, wherein: The first boundary is located on a side of the binding area away from the display area, and an orthographic projection of the first boundary on the substrate is located on a side of an orthographic projection of the first metal structure on the substrate away from the display area; The first organic insulating layer has a fifth via hole corresponding to the first opening, and the first metal structure is electrically connected to the binding portion through the first opening and the fifth via hole.

10. The display panel according to claim 1, wherein: The source-drain metal layer includes a first source-drain metal layer and a second source-drain metal layer, the binding portion includes a first binding portion and a second binding portion, the first source-drain metal layer has the first binding portion, and the second source-drain metal layer has the second binding portion and a connecting portion; a passivation layer, wherein the passivation layer is at least partially located in the binding area, and the first source-drain metal layer, the passivation layer, and the second source-drain metal layer are arranged in sequence along a direction away from the substrate; The passivation layer has a second opening located in the binding area, and the first binding portion and the second binding portion are electrically connected through the second opening.

11. The display panel according to claim 3, wherein: The first metal structure and the first touch metal layer are provided in the same layer and made of the same material, and the second metal structure and the second touch metal layer are provided in the same layer and made of the same material.

12. The display panel according to claim 1, wherein: The display panel comprises: A pixel definition layer, the pixel definition layer is disposed on the substrate and located in the display area, and the pixel definition layer has a sixth opening; a light-emitting layer, wherein the light-emitting layer is disposed in the sixth opening; An encapsulation layer, wherein at least a portion of the encapsulation layer is located in the display area and an orthographic projection of the encapsulation layer on the substrate covers an orthographic projection of the pixel definition layer and the light-emitting layer on the substrate; The first organic insulating layer is at least partially disposed on a side of the encapsulation layer away from the substrate.

13. A display panel, wherein: include: A substrate, the substrate comprising a display area and a peripheral area surrounding the display area, the peripheral area comprising a binding area spaced apart from the display area, and a transition area between the binding area and the display area; a source-drain metal layer, the source-drain metal layer comprising a binding portion at least partially located in the binding region and a connecting portion located in the transition region, the binding portion being electrically connected to the connecting portion; A planarization layer, the planarization layer is disposed on the substrate and is provided with a first opening located in the binding area and a first via hole located in the transition area, the first opening exposes the binding portion, and the first via hole exposes the connection portion; A first organic insulating layer, the first organic insulating layer is located in the display area and the peripheral area and is disposed on a side of the planarization layer away from the substrate and is provided with a third via hole corresponding to the first via hole; the first organic insulating layer has a first boundary, and the first boundary is a boundary of the first organic insulating layer away from the display area; a first metal structure, the first metal structure is located in the peripheral area and is at least partially disposed on a side of the first organic insulating layer away from the substrate; the orthographic projection of the first metal structure on the substrate at least covers the orthographic projections of the first opening and the first via hole on the substrate, and the first metal structure is electrically connected to the connecting portion through the first via hole and the third via hole, and the first metal structure is electrically connected to the binding portion through the first opening; a second metal structure, the second metal structure being located in the peripheral region and disposed on a side of the first metal structure away from the substrate; The orthographic projection of the first boundary on the substrate does not overlap with the orthographic projections of the first metal structure and the second metal structure on the substrate.

14. The display panel according to claim 13, wherein: The display panel comprises: The second organic insulating layer includes a first organic sub-insulating portion disposed in the display area and at least partially extending to the transition area, wherein the first organic sub-insulating portion is disposed in the first A side of the organic insulating layer away from the substrate and provided with a sixth via hole located in the display area; A first touch metal layer, the first touch metal layer is disposed in the display area and at least partially extends to the transition area, and the first touch metal layer is located on a side of the second organic insulating layer away from the substrate; a second touch metal layer, wherein the second touch metal layer is located on a side of the second organic insulating layer close to the substrate, and the second touch metal layer is located on a side of the first organic insulating layer away from the substrate; The first touch metal layer and the second touch metal layer are electrically connected through a sixth via hole.

15. The display panel according to claim 14, wherein: The transition zone includes a first transition zone, a second transition zone and a bending zone between the first transition zone and the second transition zone, the first transition zone is located between the bending zone and the display zone, and the second transition zone is located between the bending zone and the binding zone; The connecting portion is located in the first transition zone, the bending zone and the second transition zone and is a continuous structure.

16. The display panel according to claim 15, wherein: The first touch metal layer includes a first touch electrode located in the display area and a first touch trace located in the transition area; The planarization layer also includes a second via hole located in the first transition region and exposing the connection portion. The first organic insulation layer is also provided with a fourth via hole corresponding to the second via hole. The first touch control trace is also electrically connected to the connection portion through the second via hole and the fourth via hole.

17. The display panel according to claim 16, wherein: The second organic insulating layer has a second organic sub-insulating portion at least partially located in the second transition region and a fourth opening located between the first organic sub-insulating portion and the second organic sub-insulating portion, and an orthographic projection of the fourth opening on the substrate at least partially overlaps with the bending region.

18. The display panel according to claim 17, wherein: The first metal structure is disposed in the binding area and the second transition area, and the first metal structure has a third opening in the second transition area; The orthographic projection of the first boundary on the substrate is located within the orthographic projection of the third opening on the substrate, that is, there is a first gap between the first boundary and the binding area.

19. The display panel according to claim 18, wherein: On a side of the third opening close to the display area, the first metal structure, the second organic sub-insulating portion and the second metal structure are stacked in sequence in a direction perpendicular to the substrate; The second organic insulating layer further has a fifth opening located in the second transition region, and the first metal structure and the second metal structure are electrically connected through the fifth opening.

20. The display panel according to claim 19, wherein: The second organic sub-insulating portion has a third boundary and a fourth boundary, and the orthographic projection of the third boundary on the substrate is located on a side of the orthographic projection of the fourth boundary on the substrate away from the display area; The orthographic projections of the third boundary and the fourth boundary on the substrate are located between the orthographic projections of the first gap and the fourth opening on the substrate, and the orthographic projection of the third boundary on the substrate is located on a side of the orthographic projection of the first boundary on the substrate close to the display area.

21. The display panel according to claim 16, wherein: The first boundary is located at a side of the binding area away from the display area.

22. The display panel according to claim 21, wherein: The second organic insulating layer comprises a second organic sub-insulating portion at least partially located in the second transition region and a fourth opening located between the first organic sub-insulating portion and the second organic sub-insulating portion, wherein an orthographic projection of the fourth opening on the substrate at least partially overlaps with the bending region; The second organic sub-insulating portion includes a fifth opening located in the second transition region and a seventh via located in the binding region, and the first metal structure is electrically connected to the second metal structure through the fifth opening and the seventh via.

23. The display panel according to claim 17, wherein: The second organic sub-insulating portion has a third boundary and a fourth boundary, the orthographic projection of the third boundary on the substrate is located on a side of the orthographic projection of the fourth boundary on the substrate away from the display area, and the third boundary is located on a side of the binding area away from the display area.

24. The display panel according to claim 23, wherein: The orthographic projection of the third boundary on the substrate is located on a side of the orthographic projection of the first boundary on the substrate away from the display area.

25. The display panel according to any one of claims 20 or 23, wherein: The orthographic projection of the fourth boundary on the substrate is located in the bending area.

26. The display panel according to claim 16, wherein: The first organic sub-insulating portion has a second boundary, and an orthographic projection of the second boundary on the substrate is located on a side of the fourth opening close to the display area.

27. The display panel according to claim 26, wherein: The orthographic projection of the second boundary on the substrate is located in the bending area.

28. The display panel according to claim 13, wherein: A distance between an orthographic projection of the first boundary on the substrate and an orthographic projection of the first opening on the substrate is greater than or equal to 50 μm.

29. The display panel according to claim 13, wherein: The first metal structure and the first touch metal layer are provided in the same layer and made of the same material, and the second metal structure and the second touch metal layer are provided in the same layer and made of the same material.

30. The display panel according to claim 13, wherein: The source-drain metal layer includes a first source-drain metal layer and a second source-drain metal layer, the binding portion includes a first binding portion and a second binding portion, the first source-drain metal layer has the first binding portion, and the second source-drain metal layer has the second binding portion and a connecting portion; a passivation layer, wherein the passivation layer is at least partially located in the binding area, and the first source-drain metal layer, the passivation layer, and the second source-drain metal layer are arranged in sequence along a direction away from the substrate; The passivation layer has a second opening located in the binding area, and the first binding portion and the second binding portion are electrically connected through the second opening.

31. The display panel according to claim 13, wherein: The display panel comprises: A pixel definition layer, the pixel definition layer is disposed on the substrate and located in the display area, and the pixel definition layer has a sixth opening; a light-emitting layer, wherein the light-emitting layer is disposed in the sixth opening; An encapsulation layer, wherein at least a portion of the encapsulation layer is located in the display area and an orthographic projection of the encapsulation layer on the substrate covers an orthographic projection of the pixel definition layer and the light-emitting layer on the substrate; The first organic insulating layer is at least partially disposed on a side of the encapsulation layer away from the substrate.

32. A display device comprising the display panel according to any one of claims 1 to 12 or claims 13 to 31.

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