Heat dissipation apparatus

Abstract

A heat dissipation apparatus according to the present invention comprises: a one-side heat-conducting panel provided as a metal panel member; an other-side heat-conducting panel forming the refrigerant flow space in which a refrigerant is phase-changed and flows between the one-side heat-conducting panel and the other-side heat-conducting panel, and being provided as a metal panel member; and a bonding medium frame body for mediating the bonding of edge ends of the one-side heat-conducting panel and the other-side heat-conducting panel, and thus the present invention maximizes heat dissipation performance and greatly enhances product productivity.

Description

heat dissipation device

[0001] The present invention relates to a heat dissipation apparatus, and more particularly, to a heat dissipation apparatus that prevents a change in the volume of a refrigerant flow space despite a change in internal pressure within the refrigerant flow space when a refrigerant, which is a phase change material, changes its phase, and is designed so that condensed liquid refrigerant can be evenly collected in the direction of gravity, thereby maximizing heat dissipation performance, and by forming sharp edges to be rounded, prevents injury to workers, and improves product productivity.

[0002] In diverse industries such as communications, electronics, and electrical engineering, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate cooling systems is essential.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving, advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues, and heat dissipation devices are being developed to address this issue.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009]

[0010] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation mechanism capable of maximizing heat dissipation performance.

[0011] In addition, another object of the present invention is to provide a heat dissipation mechanism that can improve the productivity of a product.

[0012] In addition, another object of the present invention is to provide a heat dissipation device that can prevent injury to installation workers.

[0013] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0014]

[0015] A heat dissipation device according to one embodiment of the present invention comprises a one-sided heat-conducting panel made of a metal panel member, a refrigerant flow space formed between the one-sided heat-conducting panel and the other-sided heat-conducting panel in which the refrigerant changes phase and flows, a second-sided heat-conducting panel made of a metal panel member, and a joint mediating frame body provided to mediate jointing of edge ends of the one-sided heat-conducting panel and the other-sided heat-conducting panel.

[0016] Here, the above-mentioned joint mediating frame body is formed between the one-side heat-conducting panel and the other-side heat-conducting panel, and can shield the refrigerant flow space.

[0017] Additionally, the one-side heat-conducting panel and the other-side heat-conducting panel may be made of the same metal material having a thermal conductivity of a predetermined level or higher.

[0018] In addition, the above-mentioned bonding mediation frame body can mediate the bonding lamination of surfaces along the edge ends of the one-side heat-conducting panel and the other-side heat-conducting panel.

[0019] In addition, the above-mentioned bonding intermediate frame body is disposed between the one-side heat-conducting panel and the other-side heat-conducting panel, and can provide a predetermined bonding surface for the inner surface among the edge ends of the one-side heat-conducting panel and the inner surface among the edge ends of the other-side heat-conducting panel.

[0020] Additionally, the above-mentioned joint mediation frame body may have a square pipe cross-section made of copper (Cu).

[0021] In addition, a first surface of the square pipe cross-section of the above-mentioned joint intermediate frame body may be face-bonded with an inner surface of the edge end of the one-sided heat-conducting panel, and a second surface of the square pipe cross-section of the above-mentioned joint intermediate frame body, which is opposite to the first surface, may be face-bonded with an inner surface of the edge end of the other-sided heat-conducting panel.

[0022] In addition, when defining an evaporation section as a section located relatively lower in the direction of gravity among the refrigerant flow spaces and relatively close to heating elements that store liquid refrigerant and supply heat among the refrigerants, the material of the first frame installed close to the evaporation section and the material of the second frame installed outside the evaporation section may be different.

[0023] In addition, the first frame may be formed to have a square pipe cross-section made of copper (Cu), and the second frame may be formed to have a square pipe cross-section made of SUS.

[0024] Additionally, it may further include a plurality of condensing sintered body columns arranged on the refrigerant flow space and connected to the bonding medium frame body.

[0025] Additionally, the plurality of condenser sintered body columns can be connected to the joint intermediate frame body via an evaporator sintered body base connecting each end.

[0026] In addition, the plurality of condenser sintered body columns are provided in a straight shape, and the lower part corresponding to one end may be positioned relatively lower than the upper part based on the direction of gravity.

[0027] Additionally, one end of the plurality of condenser sintered body columns may be connected to the inside of the bonding intermediate frame body, which is positioned relatively lower with respect to the direction of gravity.

[0028] Additionally, the other end of the plurality of condenser sintered body columns may be connected to the inside of the bonding intermediate frame body, which is positioned relatively upward based on the direction of gravity.

[0029] Additionally, the other end of the plurality of condenser sintered body columns may be spaced apart from the joint intermediate frame body, which is positioned relatively upward based on the direction of gravity, by a predetermined distance.

[0030] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel may be provided with a metal panel member made of SUS material.

[0031] In addition, the plurality of condensation sintered body columns and evaporation sintered body bases can be formed by sintering powder made of SUS material.

[0032] Additionally, an air vent hole may be formed in the above-described joint mediation frame body to which an air vent tube for vacuuming the refrigerant flow space or filling the refrigerant is connected.

[0033] Additionally, the air vent hole may be formed to communicate with the refrigerant flow space.

[0034] In addition, the one-side heat-conducting panel, the other-side heat-conducting panel, and the bonding medium frame body can be laminated and bonded by laser welding.

[0035] In addition, the one-side heat-conducting panel, the other-side heat-conducting panel, and the bonding medium frame body can be laminated and bonded by a brazing welding method.

[0036] Additionally, the plurality of condenser sintered body columns may be formed with a plurality of support protrusions that protrude and are supported by the inner surface of the one-side heat-conducting panel or the other-side heat-conducting panel within the refrigerant flow space.

[0037] Additionally, the plurality of support protrusions may have a cross-section that contacts the inner surface of one side of the heat-conducting panel or the other side of the heat-conducting panel.

[0038]

[0039] According to a heat dissipation mechanism according to one embodiment of the present invention, the following various effects can be achieved.

[0040] First, the present invention has the effect of significantly improving the overall heat dissipation performance by dissipating system heat through a phase change process in which a refrigerant is filled inside.

[0041] Second, the present invention has the effect of greatly improving the productivity of a product by forming a refrigerant flow space in which refrigerant is easily filled inside two metal panel members through a laser welding method or a brazing welding method.

[0042] Third, the present invention has the effect of improving work safety by preventing injury to workers by forming the sharp edge ends of the product to be rounded.

[0043]

[0044] Figure 1 is a perspective view showing a heat dissipation mechanism according to one embodiment of the present invention.

[0045] Figure 2 is an exploded perspective view showing a heat dissipation mechanism according to one embodiment of the present invention.

[0046] Figures 3a to 3d are individual exploded perspective views showing heat dissipation mechanisms according to embodiments of the present invention.

[0047] Figure 4 is an exploded perspective view showing a modified example of one embodiment of the present invention.

[0048] Figures 5a to 5d are perspective views showing the configuration of Figures 3a to 3d with one side heat-conducting panel and the other side heat-conducting panel removed.

[0049] Figure 6 is a perspective view showing various embodiments of the condensation sintered body column and the evaporation sintered body base among the configurations of Figure 2.

[0050] Fig. 7 is a perspective view showing a heat dissipation mechanism according to another embodiment of the present invention.

[0051] Figure 8 is an exploded perspective view of Figure 7.

[0052] Figure 9 is an exploded perspective view showing a modified example of another embodiment of the present invention.

[0053]

[0054] <Explanation of symbols>

[0055] 200: Heat dissipation device 200A: One-sided heat-conducting panel

[0056] 200B: Other side heat conduction panel 201: Evaporator

[0057] 203: Condensing section 205: Refrigerant flow space

[0058] 230: Strength reinforcement part 235: Column support protrusion

[0059] 250: Condenser sintered body column 255: Evaporator sintered body base

[0060] 280: Joint mediation frame body 285: Air vent hole

[0061] 290: Air vent tube

[0062]

[0063] Hereinafter, a heat dissipation mechanism according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0064] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0065] In describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0066]

[0067] FIG. 1 is a perspective view showing a heat dissipation mechanism according to embodiments of the present invention, and FIG. 2 is an exploded perspective view showing a heat dissipation mechanism according to embodiments of the present invention.

[0068] A heat dissipation device (200) according to one embodiment of the present invention, as shown in FIGS. 1 and 2, includes a one-side heat-conducting panel (200A) provided as a metal panel member, a refrigerant flow space (205) formed between the one-side heat-conducting panel (200A) and the one-side heat-conducting panel (200A) in which the refrigerant changes phase and flows, a second-side heat-conducting panel (200B) provided as a metal panel member, and a joint mediating frame body (280) that mediates jointing of edge ends of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B).

[0069] Here, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be made of the same metal material (metal panel material) having a thermal conductivity of a predetermined level or higher.

[0070] Preferably, the refrigerant may be provided with at least stainless steel (SUS) among the metal materials to facilitate phase change of the refrigerant through heat exchange with the outside air (in particular, phase change in which the refrigerant condenses from a gaseous state to a liquid state).

[0071] In this way, the specific reason for adopting SUS material as the metal material for forming one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) will be explained in more detail later.

[0072] In addition, in the heat dissipation device (200) according to one embodiment of the present invention, one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) can be formed by sheet metal processing using a press mold process.

[0073] For reference, although the press mold process is not shown, it is sufficient to understand that it is a process in which a metal base material panel made of SUS material is processed into sheet metal through a press mold device so that at least each edge end is mutually joined by a joining medium frame body (280). At this time, a plurality of strength reinforcing parts (230) of a heat dissipation device (200-5) according to another embodiment of the present invention described below can be formed simultaneously.

[0074] That is, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) may be sheet metal products made of a metal panel member made of SUS material. The thickness of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) may be set to be very thin, and may be set to a thickness not exceeding 0.15t.

[0075] In general, aluminum (Al) is well known as the most widely utilized metal material in terms of thermal conductivity and weight. In this case, the heat dissipation device itself, which actually performs the heat dissipation or heat exchange function, is in the form of a heat sink fin. In the case where heat transfer is performed solely through the material itself without using a phase-changeable refrigerant as a heat transfer medium, as in one embodiment of the present invention, aluminum can naturally be selected as the optimal material.

[0076] That is, aluminum material has excellent thermal conductivity of 230 and is one of the most widely used materials as a heat dissipation element because of its low specific gravity.

[0077] However, although the aluminum material has superior thermal conductivity and specific gravity to the SUS material, which is the material of the one-side thermal conductive panel (200A) and the other-side thermal conductive panel (200B) adopted in one embodiment of the present invention (actually, the thermal conductivity of the SUS material is 20), it has the problem that the price is relatively expensive compared to the cost, and when a refrigerant is filled inside, the refrigerant that can be filled is very limited.

[0078] For example, when distilled water (water) is selected as a refrigerant, there is a problem that distilled water must be excluded from the selectable refrigerants because aluminum causes a chemical reaction and makes it impossible to function as a refrigerant.

[0079] In order to solve the problem of aluminum material, in the heat dissipation device (1) according to one embodiment of the present invention, the metal material of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) was adopted as SUS material that hardly causes chemical reaction with distilled water.

[0080] Such one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can be laminated and bonded to each other along the edge ends thereof via a bonding medium frame body (280).

[0081] More specifically, the bonding intermediate frame body (280) is arranged to mediate a face-to-face laminated bond along the edge ends of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), as referenced in FIGS. 1 and 2, and is arranged between the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), so as to provide a predetermined bonding surface for the inner surface of the edge end of the one side heat-conducting panel (200A) and the inner surface of the edge end of the other side heat-conducting panel (200B).

[0082] Here, the joint intermediate frame body (280) can be formed to have a square pipe cross-section made of Cu material. More specifically, the joint intermediate frame body (280) can be formed by bending a metal plate made of Cu material to have a square cross-section.

[0083] The joint intermediate frame body (280) formed in a straight line shape to have a rectangular cross-section in this way can be formed by bending to correspond to the shape of the edges of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) using a banding mechanism not shown.

[0084] In addition, the joint mediation frame body (280) also serves to shield the refrigerant flow space (205) formed between the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B), as described above.

[0085] More specifically, the upper and lower surfaces corresponding to the mutually opposing cross-sections among the four cross-sections of the joint intermediate frame body (280) are laminated so as to be in contact with the lower surface corresponding to the edge end of one side heat-conducting panel (200A) arranged on the upper side in the drawing and the upper surface corresponding to the edge end of the other side heat-conducting panel (200B) arranged on the lower side thereof, respectively, and are laminated and bonded by a face-to-face contact through the laminated surfaces.

[0086] For example, the first side (not indicated by drawing symbol) of the square pipe cross-section of the joint intermediate frame body (280) may be face-bonded with the inner side of the edge end of one side heat-conducting panel (200A), and the second side (the side opposite to the first side) of the square pipe cross-section of the joint intermediate frame body (280) may be face-bonded with the inner side of the edge end of the other side heat-conducting panel (200B).

[0087] Here, the upper surface of the joint intermediate frame body (280) and the contact area of ​​one side heat conduction panel (200A) and the lower surface of the joint intermediate frame body (280) and the contact area of ​​the other side heat conduction panel (200B) can be joined by a welding method.

[0088] The welding joining method at this time may include either a joining method according to a brazing welding method or a joining method according to a laser welding method.

[0089] However, the welding joining method is not necessarily limited to either brazing welding or laser welding.

[0090] For example, for joining inside the refrigerant flow space (205), such as the multiple strength reinforcing members (230) described later, the brazing welding method is a more suitable joining method, and for joining the edge ends of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), the laser welding method is more suitable, and thus, it is possible to combine the above two methods.

[0091] FIGS. 3A to 3D are exploded perspective views showing individual heat dissipation mechanisms according to embodiments of the present invention, FIG. 4 is an exploded perspective view showing a modified example of one embodiment of the present invention, FIGS. 5A to 5D are perspective views showing a state in which one side heat conduction panel and the other side heat conduction panel of the configuration of FIGS. 3A to 3D are removed, and FIG. 6 is a perspective view showing various embodiments of the condensation sintered body column and the evaporation sintered body base of the configuration of FIG. 2.

[0092] A heat dissipation device (200) according to one embodiment of the present invention may further include a plurality of condenser sintered body columns (250) disposed on a refrigerant flow space (205) and connected to a joint intermediate frame body (280), as shown in FIGS. 3A to 6 .

[0093] Here, the plurality of condensing sintered body columns (250) and the evaporating sintered body base (255) described later can be formed by sintering powder made of SUS material. Hereinafter, the plurality of condensing sintered body columns (250) and the evaporating sintered body base (255) described later are different only in the features (functions) that contribute to the phase change of the refrigerant according to the installation position within the refrigerant flow space (205), and therefore, the manufacturing method thereof is assumed to be the same and described.

[0094] In addition, in the heat dissipation mechanism (200) according to one embodiment of the present invention, the joint intermediate frame body (280) is described as having an approximately rectangular (square) shape, as shown in FIGS. 3A to 3D.

[0095] However, the joint intermediate frame body (280) does not necessarily have to be formed in a rectangular shape like the outer shape of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) as referenced in FIGS. 1 to 6, and may be formed in a different shape for each product as referenced in FIGS. 7 to 9 described below.

[0096] For example, in the case of a heat dissipation device (200) according to one embodiment of the present invention, as shown in FIGS. 3A to 3D, it is illustrated as a rectangular shape with the width and length all being the same, but it will be understood that the width and length may be manufactured to be different to suit the shape and layout design of an actual electronic device (electronic device) requiring system heat dissipation.

[0097] In addition, it is possible to design a modified shape in which the condenser (203) is extended to have a wider area than the evaporator (201) area so as to perform system heat dissipation at a longer distance compared to the installation area of ​​an actual electronic device (electronic device), such as a heat dissipation device (200) according to another embodiment of the present invention described later.

[0098] However, in the heat dissipation mechanism (200) according to one embodiment of the present invention, for the sake of convenience of understanding, it will be explained assuming that the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) and the bonding intermediate frame body (280) formed correspondingly thereto are also designed and manufactured in a rectangular shape.

[0099] More specifically, the joint intermediate frame body (280) is formed in a rectangular shape, and the portions corresponding to one end and the other end in the width direction are defined as 'one long side (280L-1)' and 'the other long side (280L-2)', and the portions corresponding to one end and the other end in the length direction are defined as 'one short side (280S-1)' and 'the other short side (280S-2)'.

[0100] In general, in supplying heat generated from heating elements such as electronic devices (not shown) and exchanging heat with external air (outside air), not only a single heat dissipation device (200) according to an embodiment of the present invention is applied to a product (electronic device), and the number of optimal heat dissipation devices (200) required can be determined depending on the number of heating elements, which are heating elements, and their arrangement.

[0101] In particular, although not shown in the drawing, when the heating elements are arranged in an up-down direction with respect to the direction of gravity, the arrangement and combination structure of a single heat dissipation mechanism (200) for effectively dissipating heat can also be determined in various ways according to the optimal design.

[0102] In addition, as in the heat dissipation device (200) according to one embodiment of the present invention, the refrigerant flow space (205) may also be partially divided into an evaporation section and a condensation section in consideration of the gas-liquid circulation according to the influence of gravity of each phase of the refrigerant that has undergone a phase change (evaporation) from a liquid (liquid) refrigerant to a gaseous (gaseous) refrigerant or a phase change (condensation) from a gaseous (gaseous) refrigerant to a liquid (liquid) refrigerant.

[0103] At this time, the joint intermediate frame body (280) can be made entirely of copper (Cu) regardless of the functional distinction between the evaporator and the condenser as described above, as shown in FIG. 4. In addition, the evaporator side requiring higher thermal conductivity (e.g., see 'one long side (280L-1)' of FIG. 4) can be made of copper, while the remaining condenser side (e.g., see 'the other long side (280L-2), one short side (280S-1) and the other short side (280S-2)' of FIG. 4) can be made of SUS, which is the material of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B).

[0104] However, the joint intermediate frame body (280) manufactured separately from two different materials can be integrally formed by joining the boundary portions with each other by a butt welding method, and can also be laminated and joined to the respective portions of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) without separate joining.

[0105] Hereinafter, one side long side (280L-1) of the joint intermediate frame body (280) and the corresponding portions of the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) are defined as evaporation portions that receive heat from heating elements, and the remaining portions are defined as condensation portions.

[0106] Meanwhile, a plurality of condensation sintered body columns (250) can be directly connected to a bonding medium frame body (280) without a separate bonding medium component such as an evaporation sintered body base (255) described later, at least one of both ends, as shown in FIGS. 3a to 3d.

[0107] Here, one end of the joint intermediate frame body (280) and the plurality of condenser sintered columns (250) can be defined as the end (end) of one long side (280L-1) corresponding to the above-described evaporator, which is located approximately downward based on the direction of gravity.

[0108] Conversely, the other end of the joint intermediate frame body (280) and the plurality of condensation sintered body columns (250) can be defined as the end (end) of the other long side (280L-2) corresponding to the condensation section described above, which is located approximately upward based on the direction of gravity.

[0109] In a heat dissipation device (200) according to one embodiment of the present invention, one end of a plurality of condensing sintered body columns (250) may be connected to a bonding intermediate frame body (280) via an evaporating sintered body base (255), as shown in FIGS. 3a and 3c, and one end thereof may be directly connected to the bonding intermediate frame body (280), as shown in FIGS. 3b and 3d.

[0110] Here, as already described, a plurality of condensation sintered body columns (250) and an evaporation sintered body base (255) can be formed by sintering powder made of SUS material.

[0111] In this way, a plurality of condensation sintered body columns (250) and an evaporation sintered body base (255) formed by sintering a predetermined metal powder can perform the role of absorbing and dispersing liquid refrigerant through surface tension or capillary force through a plurality of pores naturally formed during sintering.

[0112] Here, the plurality of condensing sintered body columns (250) can perform a role of guiding the flow so that when the gaseous refrigerant is condensed and phase-changed into a liquid refrigerant through heat exchange with the outside air (outside air) in the area corresponding to the condensing section, the liquid refrigerant condensed relatively downward in the direction of gravity flows down toward the evaporating section, and the liquid refrigerant flows down evenly without being biased.

[0113] In addition, the evaporator sintered body base (255) can play a role in actively inducing a phase change (evaporation) of the liquid refrigerant absorbed through the numerous pores formed therein into a gaseous refrigerant by the heat supplied from the heating elements.

[0114] Additionally, an air vent hole (285) to which an air vent tube (290) is connected may be formed in the joint mediation frame body (280).

[0115] The air vent hole (285) can be formed to communicate with the refrigerant flow space (205) whose boundary is defined by the one-side heat-conducting panel (200A), the other-side heat-conducting panel (200B) and the joint intermediate frame body (280).

[0116] Meanwhile, the one-sided heat-conducting panel (200A), the other-sided heat-conducting panel (200B), and the bonding intermediate frame body (280) can be laminated and bonded by welding. The welding method herein may include laser welding in addition to general welding.

[0117] However, the method of joining the one-sided heat-conducting panel (200A), the other-sided heat-conducting panel (200B) and the bonding medium frame body (280) is not limited to the welding method described above, and a method of laminating and bonding by brazing is not excluded.

[0118] The heat dissipation device (200) according to one embodiment of the present invention configured as described above can be implemented in various modified examples depending on whether the evaporation sintered body base (255) is provided and the method of connecting the condensation sintered body column (250) to the bonding medium frame body (280), as referenced in FIGS. 3a to 3d.

[0119] That is, the heat dissipation mechanism (200) according to one embodiment of the present invention may include a first embodiment (200-1) and a third embodiment (200-3) implemented in a form that includes an evaporation sintered body base (255) connected to the inner end of a bonding intermediate frame body (280) located at the lower end of a plurality of condensation sintered body columns (250) corresponding to the lower side based on the gravity direction, as shown in FIGS. 3A and 3C, and the end of the edge of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) corresponding to the lower side based on the gravity direction.

[0120] Conversely, the heat dissipation mechanism (200) according to one embodiment of the present invention may include a second embodiment (200-2) and a fourth embodiment (200-4) implemented in a form in which each of the lower ends of a plurality of condensation sintered body columns (250) is connected to the inner end of a bonding intermediate frame body (280) located at the lower end of the edge of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) based on the direction of gravity, without interposing the evaporation sintered body base (255), as shown in FIGS. 3b and 3d.

[0121] In addition, the heat dissipation mechanism (200) according to one embodiment of the present invention may include a first embodiment (200-1) and a second embodiment (200-2) implemented in a form in which each of the upper ends of a plurality of condensation sintered body columns (250) is directly connected to an end corresponding to the upper side with respect to the direction of gravity among the edge ends of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), as referenced in FIGS. 3A and 3B.

[0122] Conversely, the heat dissipation mechanism (200) according to one embodiment of the present invention may include a third embodiment (200-3) and a fourth embodiment (200-4) in which each of the upper ends of the plurality of condensation sintered body columns (250) is not connected to the upper end of the edge of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) based on the direction of gravity, and is spaced apart from the upper end, as shown in FIGS. 3c and 3d.

[0123] Meanwhile, in the heat dissipation mechanism (200) according to one embodiment of the present invention, each of the condensation sintered body columns (250) of all the implementation examples (200-1 to 200-4) may be integrally formed with a plurality of support protrusions (251) that protrude to be supported on the inner surface of one side heat-conducting panel (200A) and the inner surface of the other side heat-conducting panel (200B).

[0124] More specifically, the condensation sintered body column (250) is formed by sintering in a square bar shape with four sides, and one side (hereinafter referred to as the 'first side') is supported or fixed so as to be in contact with the inner surface of one of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) (hereinafter referred to as the 'one-side heat-conducting panel (200A)'), and the front end surfaces of the plurality of support protrusions (251) are formed on a surface (hereinafter referred to as the 'second surface') opposite to the first surface of the condensation sintered body column (250) and can be supported or fixed so as to be in contact with the inner surface of the other-side heat-conducting panel (200B).

[0125] The condenser sintered column (250) of this type has a first surface supported on the inner surface of one side heat-conducting panel (200A), and the leading end surfaces of a plurality of support protrusions (251) formed on the second surface are supported on the inner surface of the other side heat-conducting panel (200B), thereby reinforcing the rigidity of the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) formed with a relatively thin thickness (0.15T), and by preventing the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) from shaking (or flowing) according to the change in internal pressure of the refrigerant flow space (205) when the refrigerant phase changes, it can perform the function of improving heat dissipation performance by preventing energy involved in the phase change of the refrigerant from being converted into physical energy unrelated to heat dissipation.

[0126] In addition, it plays a role in ensuring that the gaseous refrigerant or liquid refrigerant flows smoothly through the space between the plurality of support protrusions (251), so that the gas-liquid circulation is not biased to one side, but is evenly distributed and flows.

[0127] FIG. 7 is a perspective view showing a heat dissipation mechanism according to another embodiment of the present invention, FIG. 8 is an exploded perspective view of FIG. 6, and FIG. 9 is an exploded perspective view showing a modified example of a heat dissipation mechanism according to another embodiment of the present invention.

[0128] A heat dissipation device (200-5) according to another embodiment of the present invention, as shown in FIGS. 7 to 9, comprises: a one-sided heat-conducting panel (200A) formed by sheet metal processing using a press molding process as a metal panel member having a thermal conductivity of a predetermined level or higher; a coolant flow space (205) formed between the one-sided heat-conducting panel (200A) and the one-sided heat-conducting panel (200A) in which a coolant flows by phase change; a second-sided heat-conducting panel (200B) formed by sheet metal processing using a press molding process as the same metal panel member as the one-sided heat-conducting panel (200A); and a bonding intermediate frame body (280) arranged to mediate a face-to-face lamination bond along edge ends of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B).

[0129] Here, the heat dissipation mechanism (200-5) according to another embodiment of the present invention may be made of components that perform all the same functions as the heat dissipation mechanism (200) according to one embodiment of the present invention already described through FIGS. 1 to 6, except for the configuration of the plurality of strength reinforcing members (230) and column support protrusions (235) described later.

[0130] More specifically, a heat dissipation device (200-5) according to another embodiment of the present invention also forms a refrigerant flow space (205) in which refrigerant flows by changing phases between one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), and the refrigerant flow space (205) can be shielded by bonding the edge ends of the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) to be mutually laminated by a bonding medium frame body (280).

[0131] Additionally, an air vent tube (290) for vacuuming the refrigerant flow space (205) or filling the refrigerant may be additionally installed in the joint mediation frame body (280).

[0132] Therefore, in explaining a heat dissipation mechanism (200-5) according to another embodiment of the present invention below, differences from the heat dissipation mechanism (200) according to one embodiment of the present invention described above will be specifically explained.

[0133] According to another embodiment of the present invention, a heat dissipation mechanism (200-5), as shown in FIGS. 7 to 9, may be formed with a plurality of strength reinforcing parts (230) processed by sheet metal processing during a press mold process and a column support protrusion (235) that supports the installation of a condensation sintered body column (250) so as to be sunken into the refrigerant flow space (205) side of a heat-conducting panel (200A) on one side and a heat-conducting panel (200B) on the other side, respectively.

[0134] Here, the column support protrusions (235) are designed to be spaced apart by a width of a pair of approximately the same amount as that of the condensing sintered body columns (250), so that when the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are mutually joined, the width-wise ends of the condensing sintered body columns (250) are simultaneously supported on both sides inside the refrigerant flow space (205), thereby stably supporting the condensing sintered body columns (250), which are somewhat fragile sintered bodies.

[0135] Meanwhile, the plurality of strength reinforcing members (230) not only perform the function of reinforcing the strength of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) formed with a very thin thickness, but also perform the function of actively responding to changes in internal pressure that occur when the refrigerant phase changes by welding the mutually contacting portions within the refrigerant flow space (205).

[0136] Here too, the joint intermediate frame body (280) is formed to correspond to the outer shape of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B), and when a plurality of condensing sintered body columns (250) are arranged in an up-and-down direction based on the direction of gravity, it is natural that the evaporating sintered body base (255) can be arranged to be relatively positioned lower based on the direction of gravity.

[0137] However, while the implementation examples (200-1 to 200-4) of the heat dissipation device (200) according to one embodiment of the present invention described above are formed in a rectangular shape and one long side (280L-1) corresponding to the long side thereof functions as an evaporation part that is closely connected to the heating elements, in the case of the heat dissipation device (200-5) according to another embodiment of the present invention, only a part of the edge end of the evaporation part (201) is actually connected closely to the heating elements (not shown) that are the target of heat supply, and the design has been changed so that the remaining part can function as a condensation part (203).

[0138] More specifically, in the heat dissipation device (200-5) according to another embodiment of the present invention, if the lower side, based on the dotted line indicated by reference numeral 205C in FIG. 7, corresponds to the evaporation section (201) in which liquid refrigerant is stored, the portion excluding the evaporation section (201) can function as a condensation section (203) as a portion in which gaseous refrigerant disperses and flows or condensed liquid refrigerant flows down in the direction of gravity.

[0139] Here, it is preferable that the sintered body base (255) of the evaporator section is formed only on the evaporator section (201), but in the heat dissipation mechanism (200-5) according to another embodiment of the present invention, a sintered body first additional base (255-1) additionally extended toward the end of the condenser section (203) corresponding to the upper side of the evaporator section (201) as an end positioned relatively lower with respect to the direction of gravity among the condenser sections (203) and a sintered body second additional base (255-2) additionally extended toward the end of the condenser section (203) corresponding to the lower side of the evaporator section (201) may be further provided.

[0140] The first additional sintered body base (255-1) is positioned relatively higher than the evaporator (201), and serves to smoothly supply the liquid refrigerant, the flow of which is guided in the direction of gravity through a plurality of condenser sintered body columns (250), to the evaporator sintered body base (255) on the evaporator (201) side.

[0141] In contrast, the second additional sintered body base (255-1) is formed to extend so as to be in contact with the sintered body base (255) of the evaporation section that performs its original function, thereby indirectly expanding the area of ​​the evaporation section (201) whose heat transfer area of ​​heat generated from the heating element is somewhat narrow.

[0142] In this way, according to the heat dissipation mechanism (200, 200-5) according to the embodiments of the present invention, the mutual bonding of one side heat conduction panel (200A) and the other side heat conduction panel (200B) of two metal base panels made of stainless steel (SUS) material, which has a somewhat lower thermal conductivity and is cheaper than aluminum (Al) material among metal materials, and the flow of refrigerant through phase change in the refrigerant flow space (205) provided therebetween are made possible, thereby greatly improving the productivity of the product.

[0143] In addition, since the thickness of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can be minimized and manufactured, the heat generated from the heating elements can be quickly supplied and active gas-liquid circulation can be promoted through heat exchange with the outside air, thereby providing the advantage of greatly improving heat dissipation performance.

[0144] In addition, the heat dissipation device (200, 200-5) according to embodiments of the present invention can prevent injury to workers by rounding the sharp metal parts that occur along the ends during press mold processing of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) made of metal material by the joint intermediate frame body (280).

[0145]

[0146] Hereinafter, heat dissipation mechanisms according to embodiments of the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it will be understood that those skilled in the art to which the present invention pertains can make various modifications and implement equivalent embodiments. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0147] The present invention provides a heat dissipation device that can maximize heat dissipation performance and improve productivity.

Claims

1. One-sided heat-conducting panel equipped with a metal panel member; A refrigerant flow space is formed between the one-side heat-conducting panel and the other-side heat-conducting panel, in which the refrigerant flows by changing phases, and is provided with a metal panel member; and A heat dissipation device, comprising: a bonding mediation frame body provided to mediate bonding of edge ends of the one-side heat-conducting panel and the other-side heat-conducting panel; 2. In claim 1, The above-mentioned joint intermediate frame body is a heat dissipation mechanism that shields the refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel.

3. In claim 1, A heat dissipation device in which the one-sided heat-conducting panel and the other-sided heat-conducting panel are made of the same metal material having a thermal conductivity higher than a predetermined level.

4. In claim 1, The above-mentioned bonding mediation frame body is a heat dissipation mechanism that mediates the bonding lamination of surfaces along the edge ends of the one-side heat-conducting panel and the other-side heat-conducting panel.

5. In claim 1, A heat dissipation mechanism in which the above-mentioned bonding intermediate frame body is disposed between the one-side heat-conducting panel and the other-side heat-conducting panel, and provides a predetermined bonding surface for the inner surface among the edge ends of the one-side heat-conducting panel and the inner surface among the edge ends of the other-side heat-conducting panel.

6. In claim 1, The above-mentioned joint mediation frame body is a heat dissipation device having a square pipe cross-section made of copper (Cu).

7. In claim 6, The first side of the square pipe section of the above-mentioned joint intermediate frame body is face-joined with the inner side of the edge end of the one-sided heat-conducting panel, A heat dissipation mechanism in which a second surface of the square pipe section of the above-mentioned joint intermediate frame body, which is opposite to the first surface, is surface-bonded with an inner surface of the edge end of the other side heat-conducting panel.

8. In claim 1, When defining the evaporation section as a section located relatively lower in the direction of gravity among the above refrigerant flow spaces and relatively close to the heating elements that store the liquid refrigerant and supply heat among the above refrigerants, The above-mentioned joint intermediate frame body is a heat dissipation mechanism in which the first frame installed close to the evaporator and the second frame installed outside the evaporator have different materials.

9. In claim 8, The above first frame is formed to have a square pipe cross-section made of copper (Cu), The above second frame is a heat dissipation device formed to have a square pipe cross-section made of SUS material.

10. In claim 1, A heat dissipation device further comprising a plurality of condenser sintered body columns arranged on the refrigerant flow space and connected to the bonding medium frame body.

11. In claim 10, A heat dissipation mechanism in which the above plurality of condenser sintered body columns are connected to the bonding medium frame body via an evaporator sintered body base that connects each end.

12. In claim 11, A heat dissipation device in which the plurality of condenser sintered body columns are arranged in a straight shape, and the lower part corresponding to one end is positioned relatively lower than the upper part based on the direction of gravity.

13. In claim 10, A heat dissipation mechanism in which one end of the plurality of condenser sintered body columns is connected to the inside of the bonding medium frame body, which is positioned relatively lower with respect to the direction of gravity.

14. In claim 13, A heat dissipation mechanism in which the other end of the plurality of condenser sintered body columns is connected to the inside of the bonding medium frame body, which is positioned relatively upward with respect to the direction of gravity.

15. In claim 13, A heat dissipation mechanism in which the other end of the plurality of condenser sintered body columns is spaced apart from the bonding medium frame body by a predetermined distance relative to the direction of gravity.

16. In claim 3, The above one-sided heat-conducting panel and the other-sided heat-conducting panel are heat-dissipating devices equipped with metal panel members made of SUS material.

17. In claim 10, The above-mentioned plurality of condensation sintered body columns and evaporation sintered body bases are heat dissipation mechanisms formed by sintering SUS material powder.

18. In claim 1, A heat dissipation mechanism, wherein an air vent hole is formed in the above-mentioned joint intermediate frame body, to which an air vent tube for vacuuming the refrigerant flow space or filling the refrigerant is connected.

19. In claim 18, The above air vent hole is a heat dissipation mechanism formed to communicate with the refrigerant flow space.

20. In claim 1, A heat dissipation mechanism in which the one-side heat-conducting panel, the other-side heat-conducting panel, and the bonding medium frame body are laminated and bonded by laser welding.

21. In claim 1, A heat dissipation device in which the one-side heat-conducting panel, the other-side heat-conducting panel, and the bonding medium frame body are laminated and bonded by brazing.

22. In claim 10, A heat dissipation mechanism in which a plurality of condenser sintered columns are formed with a plurality of support protrusions that protrude and are supported by the inner surface of the one-side heat-conducting panel or the other-side heat-conducting panel within the refrigerant flow space.

23. In claim 22, A heat dissipation mechanism in which the plurality of support protrusions have a cross-section that contacts the inner surface of the one-side heat-conducting panel or the other-side heat-conducting panel.

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