Display screen package structure, display screen and manufacturing method for display screen package structure

Abstract

A display screen package structure, a display screen and a manufacturing method for the display screen packaging structure. The display screen package structure comprises a drive substrate, a plurality of light-emitting devices, a transparent layer, a light-shielding layer and an encapsulation layer; the drive substrate is provided with a display area and a non-display area surrounding the display area; the plurality of light-emitting devices are disposed at intervals in the display area; the transparent layer wraps the light-emitting devices and fills a peripheral area and spacer areas between the plurality of light-emitting devices; the light-shielding layer covers the top of the transparent layer in the spacer areas and covers the top of the transparent layer in the peripheral area, the surface of the light-shielding layer away from the drive substrate being not higher than light-emitting surfaces of the light-emitting devices; the encapsulation layer covers the light-shielding layer and the transparent layer over the light-emitting devices. The present application planarizes the drive substrate, improves the light extraction efficiency of side surfaces of the light-emitting devices, patterns the light-shielding layer, and avoids color shift at wide view angles caused by the position offset of the light-emitting devices or inconsistent distances between the light-shielding layer and the light-emitting devices.

Description

Display screen packaging structure, display screen, and manufacturing method of display screen packaging structure Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display screen packaging structure, a display screen, and a method for manufacturing the display screen packaging structure. Background Art

[0002] Micro LEDs (Micro Light Emitting Diodes) are a new type of light-emitting diode. They are extremely small, typically measuring only a few microns to a few millimeters, yet boast exceptionally high brightness and color saturation. Compared to traditional display devices like LCDs and OLEDs, Micro LEDs offer significant performance advantages, including high brightness, high response time, low power consumption, and long lifespan. Therefore, they hold great market potential in the field of optical display technology.

[0003] For non-transparent Micro LED displays, achieving better image quality requires relatively high ambient contrast and relatively low reflectivity. However, existing packaging methods for Micro LED displays involve creating a patterned BM on the upper cover, creating light-emitting holes on the top surface of the light-emitting device, and then bonding one side of the upper cover with the patterned BM to the top surface of the light-emitting device. This packaging method barely reduces the actual light output angle, but it cannot utilize light from the side of the light-emitting device. Moreover, the position of the light-emitting device is easily shifted, resulting in a large visual color shift. Technical issues

[0004] In order to improve the light energy utilization rate of the light-emitting device and reduce the color deviation of the large viewing angle, the present application provides a display screen packaging structure, a display screen, and a method for manufacturing the display screen packaging structure. Technical Solutions

[0005] In view of the above-mentioned problems and shortcomings of Micro LED displays in the prior art, the present application provides a display packaging structure, a display, and a method for manufacturing a display packaging structure. In the display packaging structure, a transparent layer encapsulates the light-emitting devices and fills the spacing areas and peripheral areas between the multiple light-emitting devices, thereby flattening the driver substrate. A light-shielding layer covers the transparent layer in the spacing areas and peripheral areas, and the surface of the light-shielding layer away from the driver substrate is no higher than the thickness of the light-emitting devices, thereby improving the light energy utilization rate of the light-emitting devices and avoiding large visual angle deviation caused by the displacement of the light-emitting devices or the inconsistent distance between the light-shielding layer and the light-emitting devices.

[0006] According to one embodiment of the present application, a display screen packaging structure is provided, including:

[0007] a driving substrate having a display area and a non-display area surrounding the display area;

[0008] a plurality of light-emitting devices, wherein the plurality of light-emitting devices are arranged at intervals in the display area of ​​the driving substrate, and a side of the light-emitting device away from the driving substrate serves as a light-emitting surface;

[0009] a transparent layer, the transparent layer wrapping the light-emitting devices and filling the interval areas and peripheral areas between the plurality of light-emitting devices;

[0010] a light shielding layer, the light shielding layer covering the transparent layer in the spacing area and the transparent layer in the peripheral area, wherein a surface of the light shielding layer away from the driving substrate is not higher than a light emitting surface of the light emitting device;

[0011] An encapsulation layer covers the light-shielding layer and the transparent layer above the light-emitting device.

[0012] In some embodiments, the display screen packaging structure further includes a dam, which is disposed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer, and the packaging layer.

[0013] In some embodiments, in the light emitting direction of the light emitting device, the sum of the thickness of the light shading layer and the thickness of the transparent layer covered by the light shading layer is less than the thickness of the light emitting device.

[0014] In some embodiments, the thickness of the transparent layer filling the spacer area and the peripheral area is between 1 and 7 μm; and the thickness of the light shielding layer is between 1 and 7 μm.

[0015] In some embodiments, the thickness of the encapsulation layer is between 10 and 200 μm.

[0016] In some embodiments, the refractive index of the light-emitting surface of the light-emitting device is greater than the refractive index of the transparent layer, and the refractive index of the transparent layer is greater than the refractive index of the encapsulation layer.

[0017] In some embodiments, the refractive index of the transparent layer is between 1.47 and 1.7; the refractive index of the encapsulation layer is between 1.3 and 1.52.

[0018] In some embodiments, the refractive index of the light shielding layer is between 1.3 and 1.52.

[0019] In some embodiments, scattering particles are dispersed in the encapsulation layer.

[0020] In some embodiments, a lens array is provided on a side of the encapsulation layer away from the driving substrate, and the lens array includes at least one microlens.

[0021] According to another embodiment of the present application, a method for manufacturing a display screen packaging structure is provided, comprising:

[0022] providing a driving substrate, the driving substrate having a display area and a non-display area surrounding the display area;

[0023] Providing a plurality of light-emitting devices, and disposing the plurality of light-emitting devices at intervals in the display area of ​​the driving substrate, wherein a side of the light-emitting device away from the driving substrate serves as a light-emitting surface;

[0024] forming a transparent layer, wherein the transparent layer wraps the light-emitting devices and fills the spaced areas between the light-emitting devices and the peripheral areas;

[0025] forming a light shielding layer, wherein the light shielding layer covers the transparent layer in the spacing area and the transparent layer in the peripheral area, and a surface of the light shielding layer away from the driving substrate is not higher than a light emitting surface of the light emitting device;

[0026] An encapsulation layer is formed, where the encapsulation layer covers the light-shielding layer and the transparent layer above the light-emitting device.

[0027] In some embodiments, the method further includes forming a dam, wherein the dam is formed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer, and the encapsulation layer.

[0028] According to yet another embodiment of the present application, a display screen is provided, comprising a housing and at least one display unit disposed in the housing, wherein the display unit comprises the display screen packaging structure provided in the present application. Beneficial effects

[0029] As described above, the display screen packaging structure, display screen, and method for manufacturing the display packaging structure of the present application have the following beneficial effects:

[0030] The display screen packaging structure of the present application wraps the light-emitting device with a transparent layer, and fills the spacing areas and peripheral areas between multiple light-emitting devices, thereby achieving flattening of the driving substrate and improving the side light output rate of the light-emitting device; a shading layer is provided above the transparent layer filling the spacing areas and peripheral areas to achieve patterning of the shading layer, and at the same time, the surface of the shading layer away from the driving substrate is not higher than the light-emitting surface of the light-emitting device, thereby avoiding large visual angle deviation caused by the displacement of the light-emitting device position or the inconsistent distance between the shading layer and the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 is a schematic cross-sectional view of a Micro LED display packaging structure in the prior art.

[0032] FIG2 is a schematic cross-sectional view of a display screen packaging structure provided in the first embodiment of the present application.

[0033] FIG3 is a schematic diagram showing a top view of the display screen packaging structure provided in the first embodiment of the present application.

[0034] FIG4 is a schematic cross-sectional view of another display screen packaging structure provided in the first embodiment of the present application.

[0035] FIG5 is a schematic cross-sectional view of another display screen packaging structure provided in the first embodiment of the present application.

[0036] FIG6 is a schematic cross-sectional view of a display screen packaging structure according to a second embodiment of the present application.

[0037] FIG7 is a schematic cross-sectional view of a display screen packaging structure provided in the third embodiment of the present application.

[0038] FIG8 is a schematic cross-sectional view of another display screen packaging structure provided in the third embodiment of the present application.

[0039] FIG9 is a schematic flow chart showing a method for manufacturing a display screen packaging structure according to the fourth embodiment of the present application.

[0040] 10 to 12 are schematic diagrams showing intermediate structures of the display screen packaging structure forming process provided in the fourth embodiment of the present application.

[0041] FIG13 is a schematic diagram showing a top view of the structure of the display screen provided in the fifth embodiment of the present application.

[0042] Component number description

[0043] 11. Driving substrate; 12. LED chip; 13. Packaging layer; 14. Upper substrate; 15. Transparent layer; 16. Shading layer; 100. Driving substrate; 101. Non-display area; 102. Display area; 110. Light-emitting device; 120. Transparent layer; 130. Shading layer; 140. Packaging layer; 150. Dam; 160. Lens array; 201. Housing; 202. Display unit; 1101. Light-emitting surface; 1021. Spacing area; 1022. Peripheral area. Best Mode for Carrying Out the Invention

[0044] Type here the best mode description paragraph of the invention. Modes for Carrying Out the Invention

[0045] The following describes the embodiments of the present application through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present application from the disclosure herein. The present application may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present application.

[0046] As shown in Figure 1, in the prior art, the Micro LED display includes a driving substrate 11 and an upper substrate 14 arranged opposite to each other, a plurality of LED chips 12 are arranged at intervals on a side of the driving substrate 11 close to the upper substrate 14, and the side of the LED chip 12 away from the driving substrate 11 is a light-emitting surface, and the packaging layer 13 wraps the plurality of LED chips 12 and covers the spacing area and the peripheral area of ​​the plurality of LED chips 12; a plurality of light-transmitting layers 15 are arranged at intervals on a side of the upper substrate 14 close to the driving substrate 11, and a light-shielding layer 16 is filled between the light-transmitting layers 15 and in the peripheral area of ​​the light-transmitting layers 15, forming a patterned BM on the upper cover 14; the driving substrate 11 is combined with the upper substrate 14, wherein the light-transmitting layer 15 corresponds one-to-one to the light-emitting surface of the LED chip 12, and the light-shielding layer 16 corresponds to the spacing area between the plurality of LED chips 12 and the packaging layer 13 in the peripheral area. This Micro LED display barely reduces the actual light output angle. However, since light from the sides of the LED chip 12 is reflected and absorbed by the light-shielding layer 16, the light from the sides of the LED chip 12 cannot be emitted, resulting in low light utilization. Furthermore, the position of the LED chip 12 relative to the light-shielding layer 16 is prone to deviation, resulting in a large color shift in the viewing angle. Furthermore, existing Micro LED display packaging requires rigid mounting and precise alignment, resulting in high manufacturing costs.

[0047] To address the above-mentioned drawbacks, the present application provides a display screen packaging structure, which is now described in detail through the following embodiments. Example 1

[0048] The present embodiment provides a display screen packaging structure, as shown in FIG2 , the display screen packaging structure of the present embodiment includes a driving substrate 100, a plurality of light-emitting devices 110, a transparent layer 120, a light-shielding layer 130, an encapsulation layer 140, and a dam 150. The driving substrate 100 has a display area 102 and a non-display area 101 surrounding the display area 102, and the plurality of light-emitting devices 110 are arranged at intervals in the display area 102, and the side of the light-emitting device 102 away from the driving substrate 100 is a light-emitting surface 1101. The driving substrate 100 is used to drive the above-mentioned light-emitting devices 110 to emit light, and the light-emitting device 110 is an LED chip. Optionally, the LED chip is a Micro-LED chip. The LED chip can be a vertical structure LED chip or a flip-chip structure LED chip.

[0049] As shown in Figures 2 and 3, the transparent layer 120 encapsulates the light-emitting devices 110 and fills the spacing regions 1021 and the peripheral regions 1022 between the multiple light-emitting devices 110. As shown in Figures 2, 4, and 5, the transparent layer 120 covering the light-emitting surfaces 1101 of the light-emitting devices can be formed into different shapes according to actual needs, such as an arc (as shown in Figure 2) or a rectangle. When the rectangle is formed, the two corners of the rectangle away from the light-emitting surfaces of the light-emitting devices 110 can be right angles (as shown in Figure 4) or rounded corners (as shown in Figure 5). The transparent layer 120 filling the spacing regions 1021 and the peripheral regions 1022 between the light-emitting devices 110 facilitates the planarization of the drive substrate 100.

[0050] As shown in Figures 2 and 3 , a light shielding layer 130 covers the transparent layer 120 in the spacing region 1021 and the transparent layer 120 in the peripheral region 1022, achieving patterning of the light shielding layer 130. Furthermore, the surface of the light shielding layer 130, which is distal to the driver substrate 100, is no higher than the light-emitting surface 1101 of the light-emitting device 110. This prevents positional shift of the light-emitting device 110 or inconsistent distances between the light shielding layer 130 and the light-emitting device 110, thereby preventing significant color shift in the viewing angle. The light shielding layer 130 may be a light-absorbing material layer, such as a vinyl layer. Because the transparent layer 120 surrounds the light-emitting device 110, meaning that the transparent layer 120 has a certain thickness around it, a certain gap is formed between the light-shielding layer 130 and the light-emitting device 110 in the horizontal direction. Due to this gap, the light-shielding layer 130 can reflect some light emitted from the side of the light-emitting device 110 through the light-shielding layer 130 into the transparent layer 120, where it is emitted from the transparent layer 120 (the light-emitting surface of the light-emitting device 110). Meanwhile, some light is emitted directly from the gap between the light-shielding layer 130 and the light-emitting device 110, thereby improving the utilization rate of light from the side of the light-emitting device 110. Furthermore, the light-shielding layer 130 prevents crosstalk between light from adjacent light-emitting devices 110. The width of the horizontal gap between the light-shielding layer 130 and the light-emitting device 110 can range from 0.1µm to 3µm, for example. Specifically, the gap width may be, for example, 0.1 µm, 0.5 µm, 1 µm, 1.5 µm, 2 µm, 2.5 µm, 3 µm, etc.

[0051] As shown in Figure 2, the encapsulation layer 140 covers the light-shielding layer 130 and the transparent layer 120 above the light-emitting device 110. The encapsulation layer 140 encapsulates the light-shielding layer 130 and the transparent layer 120, ensuring a sealed display screen. This provides water, dust, and corrosion resistance, thereby extending the display screen's service life. A dam 150 is disposed in the non-display area 101 of the driver substrate 100 and surrounds the transparent layer 120, light-shielding layer 130, and encapsulation layer 140. The dam 150 prevents fluid from overflowing during the formation of the transparent layer 120 and the light-shielding layer 130, facilitating the planarization of the driver substrate 100 and the patterning of the light-shielding layer 130. It also reflects light emitted from the side of the light-emitting device 110, improving its brightness. It is understood that the thickness of the dam 150 is greater than the combined thickness of the light-emitting device 110 and the transparent layer 120 above the light-emitting surface 1101 of the light-emitting device. The dam 150 can be made of silicone, for example. The encapsulation layer 140 encapsulates the display area 102 surrounded by the dam 150 and the side surface of the dam 150 close to the display area 102 .

[0052] In an optional embodiment, the transparent layer 120 and the light-shielding layer 130 can be completed by rapid inkjet printing, without the need for hard-stick and hard-precision vacuum alignment equipment, thereby reducing process costs and improving process efficiency.

[0053] In an optional embodiment, as shown in FIG2 , in the light-emitting direction of the light-emitting device 110, the sum of the thickness of the light-shielding layer 130 and the thickness of the transparent layer 120 covered by the light-shielding layer 130 is less than the thickness of the light-emitting device 110. This helps prevent positional displacement of the light-emitting device 110 or an inconsistent distance between the light-shielding layer 130 and the light-emitting device 110, thereby avoiding large visual color deviation and facilitating the planarization of the drive substrate 100. Optionally, the thickness of the transparent layer 120 filling the spacer region 1021 and the peripheral region 1022 is between 1 and 7 μm. Specifically, for example, the thickness of the transparent layer 120 filling the spacer region 1021 and the peripheral region 1022 can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, etc. Optionally, the thickness of the light-shielding layer 130 is between 1 and 7 μm. Specifically, the thickness of the light-shielding layer 130 can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, and 7 μm. Optionally, the thickness of the light-emitting device 110 is between 6 and 14 μm. Specifically, the thickness of the light-emitting device 110 can be between 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, and 14 μm. Optionally, the thickness of the encapsulation layer 140 is between 10 and 200 μm. Specifically, the thickness of the encapsulation layer 140 can be between 10 and 200 μm.

[0054] In an optional embodiment, the refractive index of the light-emitting surface 1101 of the light-emitting device 110 is greater than the refractive index of the transparent layer 120, and the refractive index of the transparent layer 120 is greater than the refractive index of the encapsulation layer 140, which is beneficial for improving the light-emitting effect of the light-emitting device 110. Optionally, the refractive index of the transparent layer 120 is between 1.47 and 1.7. Specifically, the refractive index of the transparent layer 120 can be 1.47, 1.5, 1.6, 1.7, etc. Optionally, the refractive index of the encapsulation layer 140 is between 1.3 and 1.52. Specifically, the refractive index of the encapsulation layer 140 can be 1.3, 1.4, 1.5, 1.52, etc. Optionally, the transparent layer 120 can be made of transparent organic silicone, epoxy resin, or the like. The encapsulation layer 140 can be made of silicone or epoxy resin doped with an antioxidant. The antioxidant can be one or more of antioxidant 168, antioxidant 245, antioxidant 816, antioxidant 1010, antioxidant 1076, antioxidant 1135, or antioxidant 1130 to provide an antioxidant effect. Optionally, the refractive index of the light-shielding layer 130 is between 1.3 and 1.52. Specifically, the refractive index of the light-shielding layer can be 1.3, 1.4, 1.5, or 1.52, among others. Because the refractive index of the light-emitting surface 1101 of the light-emitting device 110 is greater than that of the transparent layer 120, and the refractive index of the transparent layer 120 is greater than that of the light-shielding layer 130, some light emitted from the side of the light-emitting device 110 can be reflected by the light-shielding layer 130 and emitted from the light-emitting surface of the light-emitting device 110.

[0055] In an optional embodiment, scattering particles are dispersed in the encapsulation layer 140 to correct the light pattern and improve brightness at normal viewing angles. Different types of scattering particles can scatter light of different target wavelengths, and the different sizes of scattering particles also affect the scattering effect. Therefore, scattering particles can be selected according to actual needs. Optionally, the proportion of scattering particles in the encapsulation layer is between 1% and 20%. Specifically, the proportion of scattering particles in the encapsulation layer can be 1%, 5%, 10%, 15%, 20%, etc. Example 2

[0056] This embodiment also provides a display screen packaging structure. As shown in FIG6 , the display screen packaging structure of this embodiment also includes a driving substrate 100, a plurality of light-emitting devices 110, a transparent layer 120, a light-shielding layer 130, an encapsulation layer 140, and a dam 150. The similarities with the light-emitting module of the first embodiment will not be repeated here. The differences are as follows:

[0057] As shown in Figure 6, the transparent layer 120 only wraps the light-emitting device 110, and the shading layer 130 fills the spacing area 1021 and the peripheral area 1022 between the multiple light-emitting devices 110, and the surface of the light-shielding layer 130 away from the driving substrate 100 is not higher than the light-emitting surface 1101 of the light-emitting device 110, which can avoid the position displacement of the light-emitting device 110 or the inconsistent distance between the light-shielding layer 130 and the light-emitting device 110 and cause large visual color deviation.

[0058] Because the transparent layer 120 surrounds the light-emitting device 110, a certain gap exists between the light-shielding layer 130 and the light-emitting device 110. Specifically, the width of the gap in the horizontal direction is determined by the width of the transparent layer 120 surrounding the light-emitting device 110 (herein, the width of the transparent layer 120 refers to the width of the transparent layer 120 in the horizontal direction that fills a single side of the light-shielding layer 130 and the light-emitting device 110). Due to the certain gap between the light-emitting device 110 and the light-shielding layer 130, light from the side of the light-emitting device 110 is reflected by the light-shielding layer 130 and can be emitted from the transparent layer 120 in the gap, thereby improving the utilization rate of light from the side of the light-emitting device 110. Example 3

[0059] This embodiment also provides a display screen packaging structure, as shown in Figures 7 and 8. The display screen packaging structure of this embodiment also includes a driving substrate 100, a plurality of light-emitting devices 110, a transparent layer 120, a light-shielding layer 130, an encapsulation layer 140, and a dam 150. The similarities with the light-emitting module of the first embodiment will not be repeated here. The differences are as follows:

[0060] A lens array 160 is provided on a side of the encapsulation layer 140 away from the driving substrate 100. The lens array 160 includes at least one micro lens. The lens array has a light-collecting function and can collect light with a wide viewing angle.

[0061] As shown in FIG7 , the shape of the lenses in the lens array 160 can be a hemispherical structure, as shown in FIG8 , a pyramid structure, or a bun-like structure, etc. The size of each lens can be 1 to 10 μm. Example 4

[0062] This embodiment provides a method for manufacturing a display screen packaging structure, which can be used to form the display screen packaging structures provided in Embodiments 1 to 3. As shown in FIG9 , the manufacturing method may include the following steps:

[0063] Step 001 : Provide a driving substrate 100 . The driving substrate 100 has a display area 102 and a non-display area 101 surrounding the display area 102 .

[0064] In an optional embodiment, as shown in Figure 10, in order to prevent the materials forming the transparent layer 120 and the light-shielding layer 130 from flowing into the non-display area and the peripheral area of ​​the non-display area, before forming the transparent layer 120 and the light-shielding layer 130, a dam 150 surrounding the driving substrate 100 is first provided at the edge of the driving substrate 100. The area of ​​the driving substrate 100 where the dam 150 is located is defined as the non-display area 101, and the area surrounded by the dam 150 is defined as the display area 102.

[0065] Step 002 : providing a plurality of light emitting devices 110 . The plurality of light emitting devices 110 are spaced apart in the display area 102 of the driving substrate 100 , and a side of the light emitting device 110 away from the driving substrate 100 is a light emitting surface 1101 .

[0066] Specifically, multiple light-emitting devices 110 are spaced apart in the display area 102 of the driver substrate 100. The area formed between the light-emitting devices 110 is defined as a spacing area 1021. The area between the dam 150 and the light-emitting devices 110 disposed outside the driver substrate 100 is defined as a peripheral area 1022. The side of the light-emitting device 110 away from the driver substrate 100 is defined as a light-emitting surface 1101.

[0067] Step 003 : forming a transparent layer 120 , wherein the transparent layer 120 wraps the light emitting devices 110 and fills the spacing regions 1021 and the peripheral regions 1022 between the plurality of light emitting devices 110 .

[0068] Specifically, as shown in Figure 11 , a transparent layer 120 is coated on the light-emitting surfaces 1101 and side surfaces of multiple light-emitting devices 110, completely enveloping the light-emitting devices 110. The transparent layer 120 also fills the spacing regions 1021 and the peripheral regions 1022. The thickness of the transparent layer 120 filling the spacing regions 1021 and the peripheral regions 1022 is less than the thickness of the light-emitting devices 110. The transparent layer 120 can planarize the drive substrate 100. The transparent layer 120 can be formed using rapid inkjet printing. Optionally, the thickness of the light-emitting devices 110 ranges from 6 to 14 µm. Specifically, the thickness of the light-emitting devices 110 can range from 6 µm, 7 µm, 8 µm, 9 µm, 10 µm, 11 µm, 12 µm, 13 µm, or 14 µm, for example. The thickness of the transparent layer 120 filling the spacing regions 1021 and the peripheral regions 1022 ranges from 1 to 7 µm. Specifically, the thickness of the transparent layer 120 filling the spacer region 1021 and the peripheral region 1022 may be, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, etc.

[0069] Step 004: forming a light shielding layer 130, the light shielding layer 130 covers the transparent layer 120 in the spacing area 1021 and the transparent layer 120 in the peripheral area 1022, and the surface of the light shielding layer 130 away from the driving substrate 100 is not higher than the light emitting surface 1101 of the light emitting device 110.

[0070] Specifically, as shown in FIG12 , a light shielding layer 130 is formed above the transparent layer 120 in the spacing region 1021 and the peripheral region 1022. The sum of the thickness of the light shielding layer 130 and the thickness of the transparent layer 120 below the light shielding layer 130 is less than or equal to the thickness of the light emitting device 110. Preferably, the sum of the thickness of the light shielding layer 130 and the thickness of the transparent layer 120 below the light shielding layer 130 is less than the thickness of the light emitting device 110. This can avoid a large color shift in the viewing angle caused by positional displacement of the light emitting device 110 or an inconsistent distance between the light shielding layer 130 and the light emitting device 110. Because the transparent layer 120 wrapping the sides of the light-emitting device 110 has a certain thickness, a certain gap is formed horizontally between the light-shielding layer 130 and the light-emitting device 110. The size of the gap can be adjusted according to actual needs. Due to the presence of the gap, some light emitted from the side of the light-emitting device 110 is reflected by the light-shielding layer 130 and emitted from the light-emitting surface 1101 of the light-emitting device 110, while some light emitted from the side of the light-emitting device 110 is emitted directly from the transparent layer 120 in the gap, thereby improving the utilization of the light emitted from the side of the light-emitting device 110. Optionally, the light-shielding layer 130 is black. The light-shielding layer 130 can be formed using fast inkjet printing, eliminating the need for rigid lamination and precision vacuum alignment equipment, reducing process costs and improving process efficiency. The thickness of the light-shielding layer 130 can optionally range from 1 to 7 µm. Specifically, the thickness of the light-shielding layer 130 can be, for example, 1 µm, 2 µm, 3 µm, 4 µm, 5 µm, 6 µm, 7 µm, etc. In an optional embodiment, to improve the light extraction effect of the light-emitting device 110, the refractive index of the light-emitting surface 1101 of the light-emitting device 110 is greater than the refractive index of the transparent layer 120, and the refractive index of the transparent layer 120 is greater than the refractive index of the light-shielding layer 130. Optionally, the refractive index of the transparent layer 120 is between 1.47 and 1.7. Specifically, the refractive index of the transparent layer 120 can be 1.47, 1.5, 1.6, or 1.7. Optionally, the refractive index of the light-shielding layer 130 is between 1.3 and 1.52. Specifically, the refractive index of the light-shielding layer can be 1.3, 1.4, 1.5, or 1.52.

[0071] Step 005 : forming an encapsulation layer 140 , wherein the encapsulation layer 140 covers the light shielding layer 130 and the transparent layer 120 above the light emitting device 110 .

[0072] In an optional embodiment, as shown in Figures 2, 4, and 5, an encapsulation layer 140 is formed above the light-shielding layer 130, above the transparent layer 120 of the light-emitting surface 1101 of the light-emitting device 110, and between the dam 150. Optionally, scattering particles may be dispersed in the encapsulation layer 140 to achieve a corrected light pattern. Optionally, the thickness of the encapsulation layer 140 ranges from 10 to 200µm. Specifically, the thickness of the encapsulation layer 140 may be, for example, 10µm, 30µm, 50µm, 70µm, 90µm, 110µm, 130µm, 150µm, 170µm, and 200µm. Optionally, the refractive index of the encapsulation layer 140 ranges from 1.3 to 1.52. Specifically, the refractive index of the encapsulation layer 140 may be 1.3, 1.4, 1.5, or 1.52.

[0073] In an optional embodiment, as shown in Figures 7 and 8, a lens array 160 is formed on the side of the encapsulation layer 140 away from the drive substrate 100. The lens array 160 includes at least one microlens. The lens array has a light-collecting effect, which can achieve the effect of collecting light from a wide viewing angle. Optionally, as shown in Figure 7, the shape of the lenses in the lens array 160 can be a hemispherical structure; as shown in Figure 8, it can also be a pyramid structure; it can also be a bun-like structure, etc. The size of each lens can be 1 to 10 μm. Example 5

[0074] This embodiment provides a display screen, as shown in FIG13 , comprising a housing 201 and at least one display unit 202 disposed within the housing 201. The display unit 202 comprises the display screen packaging structure provided in any one of Embodiments 1 to 3. When there are multiple display units, the multiple display units can be connected to each other in series or in parallel.

[0075] Since the display screen of this embodiment can include the display screen packaging structure provided by Embodiments 1 to 3, the beneficial effects that can be achieved by the display screen packaging structure provided by this embodiment can be achieved. Please refer to Embodiments 1 to 3 for details and will not be repeated here.

[0076] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application. Industrial Applicability

[0077] Type your industrial applicability description paragraph here. Sequence Listing Free Content

[0078] Type your sequence listing free description paragraph here.

Claims

1. A display screen packaging structure, comprising: a driving substrate, wherein the driving substrate has a display area and a non-display area surrounding the display area; A plurality of light emitting devices, wherein the plurality of light emitting devices are arranged at intervals in the display area of ​​the driving substrate, and a side of the light emitting device away from the driving substrate is a light emitting surface; A transparent layer, the transparent layer wraps the light emitting device and fills the spacing area and the peripheral area between the plurality of light emitting devices; a light shielding layer, the light shielding layer covering the transparent layer in the spacing area and the transparent layer in the peripheral area, wherein a surface of the light shielding layer away from the driving substrate is not higher than a light emitting surface of the light emitting device; An encapsulation layer covers the light-shielding layer and the transparent layer above the light-emitting device. 2 . The display screen packaging structure according to claim 1 , further comprising a dam, wherein the dam is disposed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer and the packaging layer.

3. The display screen packaging structure according to claim 1 or 2, wherein: In the light emitting direction of the light emitting device, the sum of the thickness of the light shielding layer and the thickness of the transparent layer covered by the light shielding layer is smaller than the thickness of the light emitting device.

4. The display screen packaging structure according to claim 1 or 2, wherein: The thickness of the transparent layer filled in the spacer area and the peripheral area is between 1 and 7 μm; The thickness of the light shielding layer is between 1 and 7 μm.

5. The display screen packaging structure according to claim 1 or 2, wherein: The thickness of the encapsulation layer is between 10 and 200 μm.

6. The display screen packaging structure according to claim 1, wherein: The refractive index of the light emitting surface of the light emitting device is greater than the refractive index of the transparent layer, and the refractive index of the transparent layer is greater than the refractive index of the encapsulation layer.

7. The display screen packaging structure according to claim 1 or 6, wherein: The refractive index of the transparent layer is between 1.47 and 1.7; The refractive index of the encapsulation layer is between 1.3 and 1.

52.

8. The display screen packaging structure according to claim 1, wherein: A lens array is provided on a side of the encapsulation layer away from the driving substrate, and the lens array includes at least one microlens.

9. A method for manufacturing a display screen packaging structure, comprising: Providing a driving substrate, the driving substrate having a display area and a non-display area surrounding the display area; Providing a plurality of light emitting devices, and arranging the plurality of light emitting devices at intervals in the display area of ​​the driving substrate, wherein a side of the light emitting device away from the driving substrate is a light emitting surface; forming a transparent layer, wherein the transparent layer wraps the light emitting device and fills the spacing area and the peripheral area between the plurality of light emitting devices; forming a light shielding layer, wherein the light shielding layer covers the transparent layer in the spacing area and the transparent layer in the peripheral area, and the surface of the light shielding layer away from the driving substrate is not higher than the light emitting surface of the light emitting device; An encapsulation layer is formed, where the encapsulation layer covers the light shielding layer and the transparent layer above the light emitting device. 10 . The manufacturing method according to claim 9 , further comprising forming a dam, wherein the dam is formed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer and the encapsulation layer.

11. A display screen, comprising a housing and at least one display unit arranged in the housing, wherein the display unit comprises the display screen packaging structure according to any one of claims 1 to 8.

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