Molding mold, resin molding device, and production method for resin molded article

Abstract

The present invention makes it possible to stably and highly precisely operate a mobile pin and comprises an upper mold 2 that has a recess 21 that forms a cavity C, a lower mold 3 that is opposite the upper mold 2 and is closed with the upper mold 2, a mobile pin plate 62 to which is fixed a mobile pin 61 that can move into and out of the recess 21, a plurality of connection rods 63 that are fixed at one end to the mobile pin plate 62, and a plate driver 64 that moves the mobile pin plate 62 via the plurality of connection rods 63 such that the mobile pin 61 moves into and out of the recess 21. The plurality of connection rods 63 are connected and fixed to the mobile pin plate 62 on the outside of a resin molding region R formed by the upper mold 2 and the lower mold 3 as seen from the closing direction.

Description

Mold, resin molding device, and method for manufacturing resin molded product

[0001] The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product.

[0002] 2. Description of the Related Art As disclosed in Patent Document 1, there is a conventional resin molding apparatus that uses a movable pin that operates separately from a mold to fix and position a part, which is an object to be molded, placed in a cavity.

[0003] In this resin molding device, multiple movable pins are mounted on a mounting plate, and the mounting plate is configured to receive power from a power transmission mechanism to move the multiple movable pins simultaneously with the same stroke. Each movable pin slides within a guide hole provided in the mold, thereby moving back and forth within the cavity.

[0004] JP 2015-084755 A

[0005] However, when resin molding is performed, the resin material may get into the guide hole, which increases the sliding resistance between the movable pin and the guide hole, making it difficult to operate the movable pin stably and with high precision.

[0006] SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and its main object is to operate the movable pin stably and with high precision.

[0007] That is, the molding die of the present invention comprises a first die having a recess that forms a cavity into which resin material is filled, a second die arranged opposite the first die and clamped together with the first die, a movable pin plate provided on the opposite side of the first die from the second die and having fixed thereto movable pins that can move back and forth within the recess, a plurality of connecting rods provided on the opposite side of the movable pin plate from the first die and having one end fixed to the movable pin plate, and a plate drive unit that moves the movable pin plate via the plurality of connecting rods so that the movable pins move back and forth within the recess, and is characterized in that the plurality of connecting rods are connected and fixed to the movable pin plate outside the resin molding area formed by the first die and the second die when viewed from the clamping direction.

[0008] According to the present invention configured in this manner, the movable pin can be operated stably and with high precision.

[0009] FIG. 1 is a schematic diagram showing the configuration of a resin molding apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a specific configuration of a molding module according to the embodiment. FIG. 3 is a cross-sectional view showing a specific configuration of an upper mold fixing mechanism according to the embodiment. FIG. 4 is a plan view showing the positional relationship of connecting rods and the like with respect to a resin molding region according to the embodiment. FIG. 5 is a cross-sectional view showing a typical behavior of a movable pin plate with and without a distance regulating member according to the embodiment. FIG. 6 is a cross-sectional view showing a typical behavior of a movable pin plate with and without a deformation suppressing member according to the embodiment. FIG. 7 is a schematic view showing a change in the distance between the upper mold and the movable pin plate before and after mold opening begins according to the embodiment. FIG. 8 is a flowchart showing a method for manufacturing a resin molded product according to the embodiment. FIG. 9 is a cross-sectional view showing (a) setting of molding material and (b) mold clamping according to the embodiment. FIG. 10 is a cross-sectional view showing (c) upper movable pin protrusion and (d) resin material injection according to the embodiment. FIG. 11 is a cross-sectional view showing (e) movable pin retraction and (f) completion of resin material filling and curing completion according to the embodiment. FIG. 12 is a cross-sectional view showing (g) movable pin protrusion and mold opening begins according to the embodiment.

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] The molding die of Technology 1 according to the present invention comprises a first die having a recess that forms a cavity into which a resin material is filled; a second die that is arranged opposite the first die and is clamped together with the first die; a movable pin plate that is provided on the opposite side of the first die from the second die and has a movable pin fixed thereto that can move back and forth within the recess; a plurality of connecting rods that are provided on the opposite side of the movable pin plate from the first die and have one end fixed to the movable pin plate; and a plate drive unit that moves the movable pin plate via the plurality of connecting rods so that the movable pins move back and forth within the recess, and is characterized in that the plurality of connecting rods are connected and fixed to the movable pin plate outside the resin molding area formed by the first die and the second die when viewed from the clamping direction.

[0012] With this molding die, multiple connecting rods are connected and fixed to the movable pin plate outside the resin molding area, so even if the sliding resistance increases as the movable pin slides within the sliding hole formed in the first die, the movable pin plate can be moved stably and with high precision.

[0013] In addition to the configuration of the above-described technique 1, the molding die of technique 2 according to the present invention is preferably such that the movable pin plate has a rectangular shape when viewed from the mold clamping direction, and the plurality of connecting rods are connected and fixed to corresponding sides of the movable pin plate. With this configuration, the plurality of connecting rods are connected to opposing sides of the movable pin plate, so that the movable pin plate can be moved stably.

[0014] In addition to the configuration of the above-described technology 1 or 2, the mold of technology 3 according to the present invention is preferably such that the plate driving unit includes a movable plate to which the other ends of the plurality of connecting rods are connected and fixed, and the movable pin plate is moved via the plurality of connecting rods by moving the movable plate. With this configuration, no gap is created between the plate driving unit and the movable pin plate, so that the plurality of connecting rods can be moved simultaneously with the same stroke.

[0015] In any of the configurations of Techniques 1 to 3 described above, for example, when a movable pin is inserted into a recess and protruded, the movable pin plate may bend convexly toward the side opposite to the first mold due to the sliding resistance between the movable pin and the sliding hole formed in the first mold. In other words, the distance between the center and end of the movable pin plate may change. As a result, when multiple movable pins are provided on the movable pin plate, the amount of protrusion of each movable pin into the recess of the first mold varies. As a result, the position of the molded object within the cavity varies, adversely affecting the quality of the resin molded product. To effectively solve this problem, the molding die of Technique 4 according to the present invention preferably further includes, in addition to the configuration of Technique 3 described above, a distance determining member disposed between the movable plate and the movable pin plate, which determines the distance between the movable plate and the movable pin plate. With this configuration, the distance determining member can suppress deformation of the movable pin plate even if the sliding resistance of the movable pin against the sliding hole increases. Furthermore, when multiple movable pins are provided on the movable pin plate, the amount of protrusion of each movable pin relative to the recess of the first mold can be made uniform, allowing the molded object to be accurately positioned within the cavity and preventing deterioration in the quality of the resin molded product.

[0016] In addition to the configuration of the above-described technology 4, the molding die of technology 5 according to the present invention is preferably arranged such that the distance regulating member is provided inside the plurality of connecting rods as viewed from the mold clamping direction. With this configuration, the distance regulating member is provided at a portion where the movable pin plate is curved convexly toward the opposite side to the first die, thereby further suppressing deformation of the movable pin plate.

[0017] In a configuration for fixing a distance regulation member between the movable pin plate and the first die, a molding die according to Technique 6 of the present invention preferably has the configuration of Techniques 4 or 5 described above, and further has the distance regulation member connected and fixed to the movable plate, but not to the movable pin plate. With this configuration, the distance regulation member is connected and fixed to the movable plate, but not to the movable pin plate. This increases the degree of freedom in arranging the distance regulation member regardless of the position of the recess in the first die, and simplifies the fixing structure of the distance regulation member. Furthermore, it is easy to replace the first die and the movable pin plate. Note that, if the distance regulation member is connected and fixed to the movable pin plate, it will be affected by the position of surrounding structures such as the recess in the first die, reducing the degree of freedom in arrangement and complicating the fixing structure.

[0018] A molding die according to a seventh aspect of the present invention has the same configuration as any one of the first to sixth aspects, but preferably further includes a through hole formed outside the resin molding region, and one end of the connecting rod is connected to the movable pin plate via the through hole of the first mold from a surface of the first mold facing the second mold. With this configuration, since the connecting rod is connected and fixed from the mold surface side of the first mold, the connection between the connecting rod and the movable pin plate can be released from the mold surface side of the first mold, and the first mold and the movable pin plate can be easily attached and detached. As a result, the first mold and the movable pin plate can be easily replaced when switching between different types of resin molded products.

[0019] Furthermore, a resin molding apparatus according to Technology 8 of the present invention is characterized by including the molding die according to any one of Technology 1 to Technology 7 described above and a mold clamping mechanism that clamps the molding die. With this resin molding apparatus, the movable pin can be moved stably and with high precision, thereby improving the quality of the resin molded product.

[0020] Furthermore, a manufacturing method of a resin molded product according to Technology 9 of the present invention is a manufacturing method of a resin molded product using the molding die of any one of Technology 1 to Technology 7 described above, and is characterized by including a mold clamping step of clamping the first mold and the second mold together, and a resin molding step of switching the movable pin from a state in which it protrudes into the recess to a state in which it is retracted, and molding the resin into a molding object. With this manufacturing method of a resin molded product, the movable pin can be moved stably and with high precision, thereby improving the quality of the resin molded product.

[0021] <One Embodiment of the Invention> An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings. Generally, the entire replaceable portion of a resin molding apparatus depending on the type of molding object is referred to as a molding die. However, for ease of explanation, the portion having a cavity or the portion on which the molding object is placed will be referred to as a molding die. Furthermore, for ease of understanding, all of the drawings shown below are drawn in a schematic manner, with appropriate omissions or exaggerations. Identical components will be assigned the same reference numerals, and their explanations will be omitted where appropriate.

[0022] <Overall Configuration of Resin Molding Apparatus> The resin molding apparatus 100 of this embodiment resin-moldes a molding object W to which an electronic component (not shown) is connected by transfer molding using a resin material J.

[0023] Here, the molding object W may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a wiring board, a lead frame, or the like, with or without wiring. The resin material J for resin molding is, for example, a composite material containing a thermosetting resin, and the resin material J may be in the form of granules, powder, liquid, sheet, tablet, or the like. Furthermore, the electronic component (not shown) connected to the upper surface of the molding object W may be, for example, a bare chip or a resin-sealed chip.

[0024] 1, the resin molding apparatus 100 includes, as its components, a supply module 100A that supplies the molding object W and resin material J before molding, a molding module 100B that performs resin molding, and a storage module 100C that stores the molding object W (hereinafter referred to as a resin molded product P) after molding. The supply module 100A, molding module 100B, and storage module 100C can be attached to and detached from the other components, and can be replaced. It is also possible to increase the number of each component, for example by increasing the number of molding modules 100B to two or three.

[0025] The supply module 100A is provided with a molding object supply section 11 that supplies the molding object W, a resin material supply section 12 that supplies the resin material J, and a conveying device 13 (hereinafter referred to as loader 13) that receives the molding object W from the molding object supply section 11 and conveys it to the molding module 100B, and receives the resin material J from the resin material supply section 12 and conveys it to the molding module 100B.

[0026] The loader 13 moves between the supply module 100A and the molding module 100B, and moves along a rail (not shown) that is provided between the supply module 100A and the molding module 100B.

[0027] As shown in Figures 1 and 2, the molding module 100B has a molding mold that forms a cavity C into which a resin material J is filled, and has a first mold 2 (hereinafter referred to as upper mold 2) and a second mold 3 (hereinafter referred to as lower mold 3) arranged opposite each other, and a mold clamping mechanism 5 that clamps the upper mold 2 and the lower mold 3.

[0028] In this embodiment, recesses 21 and 31 that form a cavity C are formed in each of the upper mold 2 and the lower mold 3. Here, the recess 21 formed on the mold surface of the upper mold 2, i.e., the surface facing the lower mold 3, and the recess 31 formed on the mold surface of the lower mold 3, i.e., the surface facing the upper mold 2, face each other, thereby forming the cavity C. In addition, the lower mold 3 is provided with a resin injecting section 4 that injects a resin material J into the cavity C. The upper mold 2 is held by an upper mold holder 101, which is fixed to an upper platen 102. The lower mold 3 is held by a lower mold holder 103, which is fixed to a movable platen 104 that is raised and lowered by a mold clamping mechanism 5.

[0029] The resin injection section 4 is formed in the lower mold 3 and includes a pot 41 that contains the resin material J, and a transfer mechanism 42 that has a plunger 421 provided below the pot 41. The pot 41 is formed, for example, of a cylindrical member 43. The cylindrical member 43 is fitted into a through-hole formed in the lower mold 3.

[0030] The transfer mechanism 42 moves the plunger 421 while the upper mold 2 and the lower mold 3 are clamped together to inject the resin material J from the pot 41 into the cavity C. The transfer mechanism 42 pressure-feeds the resin material J, which has been heated and melted in the pot 41, into the cavity C using the plunger 421. A resin passage (not shown) that connects the pot 41 to the cavity C is formed in the upper mold 2 or the lower mold 3. In addition, an air vent (not shown) is formed in the upper mold 2 on the side opposite to the pot 41.

[0031] Then, when the plunger 421 is raised while the upper mold 2 and the lower mold 3 are clamped by the mold clamping mechanism 5, the molten resin material J is injected into the cavity C through the resin passage. As a result, the electronic components (not shown) of the molding object W accommodated in the cavity C are resin-sealed.

[0032] As shown in Figure 1, the storage module 100C is provided with a storage section 14 for storing the resin molded product P, and a conveying device 15 (hereinafter referred to as unloader 15) for receiving the resin molded product P from the molding module 100B and conveying it to the storage section 14.

[0033] The unloader 15 moves between the molding module 100B and the storage module 100C, and moves along a rail (not shown) that is provided between the molding module 100B and the storage module 100C.

[0034] <Specific Configuration of Molding Module 100B> Next, a specific configuration of the molding module 100B of this embodiment will be described.

[0035] 2, the upper mold 2 and the lower mold 3 of the molding module 100B have a fixing mechanism 6 that fixes the molding object W by moving a movable pin 61 back and forth within the cavity C during resin molding. The fixing mechanism 6 is provided for each of the upper mold 2 and the lower mold 3. Since the fixing mechanism 6 for the upper mold 2 and the fixing mechanism 6 for the lower mold 3 have the same configuration, the following will only describe the fixing mechanism 6 for the upper mold 2, and a description of the fixing mechanism 6 for the lower mold 3 will be omitted.

[0036] Specifically, as shown in Figure 3, the fixing mechanism 6 includes a movable pin plate 62 to which a movable pin 61 that can move back and forth within the recess 21 is fixed, a plurality of connecting rods 63 each having one end fixed to the movable pin plate 62, and a plate drive unit 64 that moves the movable pin plate 62.

[0037] The movable pin plate 62 is provided on the opposite side of the upper mold 2 from the lower mold 3. Specifically, the movable pin plate 62 is provided between the upper mold 2 and the upper platen 102. The movable pin plate 62 is provided with a plurality of movable pins 61. The plurality of movable pins 61 slide in slide holes 2h1 formed to penetrate the upper mold 2 in the thickness direction. Each slide hole 2h1 is connected to a recess 21 formed in the upper mold 2. When a plurality of movable pins 61 are moved forward and backward relative to one recess 21, a configuration is achieved in which a plurality of slide holes 2h1 are connected to one recess 21. The movable pin plate 62 corresponds to the shape of the upper mold 2 in a plan view (viewed from the mold clamping direction), and in this embodiment, it has, for example, a rectangular shape as shown in FIG. 4.

[0038] The multiple connecting rods 63 are provided on the movable pin plate 62 on the opposite side from the upper mold 2. Specifically, the multiple connecting rods 63 are provided so as to penetrate the upper platen 102. Note that the upper platen 102 has through holes formed therein corresponding to the respective connecting rods 63.

[0039] As shown in FIG. 4 , the multiple connecting rods 63 are connected and fixed to the movable pin plate 62 outside the resin molding region R defined by the upper mold 2 and the lower mold 3 in a plan view (viewed from the mold clamping direction). The resin molding region R includes at least the region where the cavity C of the upper mold 2 and the lower mold 3 is formed, and the outside of the resin molding region R is the outside of the cavity C. In this embodiment, the resin molding region R is approximately the same region as the molded object W placed in the mold in a plan view, and the outside of the resin molding region R is the outside of the molded object W to be resin molded. The multiple connecting rods 63 are arranged in point-symmetric positions on the movable pin plate 62. The multiple connecting rods 63 are connected and fixed to corresponding sides of the movable pin plate 62. In this embodiment, two connecting rods 63 are connected and fixed to each of the opposing short sides of the movable pin plate 62. Furthermore, in order to allow the movable pin plate 62 to move up and down while maintaining greater parallelism, it is preferable that the connecting rod 63 be provided near a position (plate moving section 642) where the driving force from the plate driving section 64 described below is transmitted, when viewed from the mold clamping direction.

[0040] Here, the connection structure between one end of the connecting rod 63 and the movable pin plate 62 will be described.

[0041] 3, one end of the connecting rod 63 and the movable pin plate 62 are connected and fixed from the mold surface side of the upper mold 2, i.e., the parting line surface side. Specifically, a through hole 2h2 is formed in the upper mold 2 outside the resin molding region R. This through hole 2h2 is formed at a position corresponding to the connecting rod 63.

[0042] One end of the connecting rod 63 is connected by a connecting member 7 inserted into the through-hole 2h2 of the upper mold 2. The connecting member 7 includes a bolt 71 and a collar 72 that regulates the tightening amount of the bolt 71. As shown in the partially enlarged cross-sectional view of FIG. 3 , the connecting member 7 is threadedly engaged with an internally threaded hole 631 formed in one end of the connecting rod 63 through a through-hole 62h1 formed in the movable pin plate 62, thereby connecting and fixing the one end of the connecting rod 63 to the movable pin plate 62. Note that reference numeral 73 denotes a washer. The collar 72 of the connecting member 7 has a tightening surface 7a that contacts the lower surface of the movable pin plate 62 (the surface facing the upper mold 2). By threading the bolt 71 of the connecting member 7 into the internally threaded hole 631, the tightening surface 7a contacts the lower surface of the movable pin plate 62, thereby tightly contacting the upper surface of the movable pin plate 62 (the surface opposite the upper mold 2) with the lower end surface of one end of the connecting rod 63.

[0043] The plate driving section 64 moves the movable pin plate 62 via a plurality of connecting rods 63 so that the movable pin 61 moves back and forth within the recess 21 .

[0044] Specifically, as shown in FIG. 3, the plate driving unit 64 includes a movable plate 641 to which the other ends of the multiple connecting rods 63 are connected and fixed, and a plate moving unit 642 that moves the movable plate 641.

[0045] The movable plate 641 is provided on the opposite side of the upper platen 102 from the movable pin plate 62 (above the upper platen 102). The other ends of the multiple connecting rods 63 are connected and fixed to this movable plate 641.

[0046] The plate moving unit 642 moves the movable plate 641 in the up-down direction (mold clamping direction). In this embodiment, it is provided above the movable plate 641 (on the opposite side of the movable plate 641 from the connecting rod 63). The plate moving unit 642 can be configured using, for example, a ball screw mechanism 642a. In this embodiment, a driving force from a drive motor 642b is transmitted to the ball screw mechanism 642a connected to the movable plate 641 via a transmission mechanism 642c such as a transmission belt. Note that the plate moving unit 642 may also be configured using other actuators such as an air cylinder or a linear motor.

[0047] When the plate moving section 642 moves the movable plate 641 in the vertical direction, the movable pin plate 62 moves in the vertical direction via the plurality of connecting rods 63 connected to the movable plate 641. As a result, the plurality of movable pins 61 move forward and backward within the recess 21, and switch between a state in which they protrude into the recess 21 (an advanced state) and a state in which they are pulled back from the recess 21 (an withdrawn state).

[0048] 3, 4, and 5A, the molding module 100B of this embodiment includes one or more distance regulating members 8 that regulate the distance between the movable plate 641 and the movable pin plate 62. In this embodiment, multiple distance regulating members 8 are provided.

[0049] 5B, if the distance regulating member 8 is not provided, the movable pin plate 62 may be curved convexly on the side opposite to the upper die 2 due to the sliding resistance when the movable pin 61 is inserted into the recess 21. In other words, the distance between the center and the end of the movable pin plate 62 changes, causing variations in the amount of protrusion of each movable pin 61 into the recess 21.

[0050] This distance regulating member 8 suppresses deflection of the movable pin plate 62 when the movable pin 61 is inserted into the recess 21. Specifically, when the movable pin 61 is inserted into the recess 21, the distance regulating member 8 suppresses the movable pin plate 62 from curving convexly upward (toward the opposite direction from the upper mold 2) due to sliding resistance between the movable pin 61 and the slide hole 2h1 formed in the upper mold 2, so that each of the multiple movable pins 61 is at the same position within the recess 21. This distance regulating member 8 ensures that the multiple movable pins 61 protrude the same amount within the recess 21.

[0051] The distance regulating member 8 is provided between the movable plate 641 and the movable pin plate 62. In order to suppress deflection, it is preferable that the distance regulating member 8 be provided more inward than the multiple connecting rods 63 when viewed from the mold clamping direction (see FIG. 4). More preferably, the distance regulating member 8 is provided closer to the portion where the recess 21 (cavity C) is formed when viewed from the mold clamping direction. Each distance regulating member 8 has a constant length and regulates a constant distance between the movable plate 641 and the movable pin plate 62 between one end face and the other end face in the axial direction.

[0052] The distance regulation members 8 are provided so as to penetrate the upper platen 102, similar to the connecting rods 63 described above. Note that through holes are formed in the upper platen 102 corresponding to each distance regulation member 8. The distance regulation members 8 of this embodiment are connected and fixed to the movable plate 641, but are not connected and fixed to the movable pin plate 62, and function as so-called tension rods between the movable plate 641 and the movable pin plate 62. Note that the distance regulation members 8 do not have to be connected and fixed to the movable plate 641. Furthermore, the distance regulation members 8 may be connected and fixed to the movable pin plate 62 instead of the movable plate 641.

[0053] <Deformation suppression members 9> Furthermore, the molding module 100B of this embodiment further includes a plurality of deformation suppression members 9 that suppress deformation of the movable pin plate 62 relative to the upper mold 2, as shown in Figures 3, 4 and 6(a).

[0054] 6(b), when the movable pins 61 are withdrawn from the recesses 21 and pulled back, the movable pin plate 62 may bend convexly toward the upper mold 2 due to the sliding resistance between the movable pins 61 and the sliding holes 2h1 formed in the upper mold 2. In other words, the distance between the center and the ends of the movable pin plate 62 changes, causing variations in the amount of retraction of each movable pin 61 relative to the recesses 21.

[0055] The deformation suppressing members 9 suppress deflection of the movable pin plate 62 when the movable pin 61 is withdrawn from the recess 21. The plurality of deformation suppressing members 9 are provided between the upper mold 2 and the movable pin plate 62.

[0056] As shown in FIG. 4 , the multiple deformation suppression members 9 are arranged in a balanced manner on the outside and inside of the resin molding region R defined by the upper mold 2 and the lower mold 3 when viewed from the mold clamping direction so as to appropriately suppress deflection of the movable pin plate 62. These multiple deformation suppression members 9 are fixed to the surface of the upper mold 2 opposite the mold surface and contact the surface of the movable pin plate 62 opposite the upper mold 2 to suppress deformation of the movable pin plate 62. The multiple deformation suppression members 9 of this embodiment suppress deformation of the movable pin plate 62 relative to the upper mold 2 when the movable pin 61 is retracted from the recess 21. As a result, the retracted positions (retracted positions) of each of the multiple movable pins 61 relative to the recess 21 are the same. In other words, the deformation suppression members 9 cause the multiple movable pins 61 to retract the recess 21 by the same amount.

[0057] Specifically, as shown in the enlarged cross-sectional views of Figures 3 and 6(a), the plurality of deformation suppressing members 9 have fixing portions 91 fixed to the surface of the upper mold 2 opposite the mold surface, and contact portions 92 provided on the fixing portions 91 and coming into contact with the surface of the movable pin plate 62 opposite the upper mold 2 when the movable pin plate 62 moves in a direction away from the upper mold 2. In this embodiment, the movable pin plate 62 has through holes 62h2 into which the fixing portions 91 are inserted, and the fixing portions 91 are fixed to the upper mold 2 in a state where they are inserted into the through holes 62h2 of the movable pin plate 62. Furthermore, an accommodating recess 621 for accommodating the contact portions 92 is formed above the through holes 62h2.

[0058] Here, the contact portion 92 forms a flange portion at the upper end of the fixed portion 91 (the end opposite the upper mold 2). In this embodiment, as shown in the enlarged cross-sectional view of FIG. 6A , the contact portion 92 is configured by an annular member 921, such as a washer, fixed to the upper end of the fixed portion 91. The lower surface of the annular member 921 contacts the bottom surface of the accommodating recess 621, thereby suppressing deformation of the movable pin plate 62. Here, an upper end fixing portion 91a for fixing the annular member 921 is provided at the upper end of the fixed portion 91. The contact of the annular member 921 with the upper end fixing portion 91a restricts movement of the movable pin plate 62. In this embodiment, the fixed portion 91 has a bolt 911 and a collar 912 provided around the bolt 911, and the upper end fixing portion 91a is configured by the head of the bolt 911. In this configuration, the annular member 921 is fixed by being sandwiched between the collar 912 and the head of the bolt 911. Note that the fixed portion 91 and the contact portion 92 may be an integral member.

[0059] As shown in FIG. 3 , multiple support pillars 10 are provided between the upper platen 102 and the upper mold 2 to maintain a constant flatness of the upper mold 2. As shown in FIG. 7A , the support pillars 10 contract when the upper mold 2 and the lower mold 3 are clamped together (the dimension of the support pillars 10 becomes L1). The deformation suppression member 9 functions when the movable pin 61 is pulled out of the cavity C (removed from the recess 21) while the upper mold 2 and the lower mold 3 are clamped together. That is, when the movable pin 61 is pulled back from the cavity C to complete the filling of the resin material J, the deformation suppression member 9 comes into contact with the movable pin plate 62. When the mold is opened after the resin material J has hardened, the support pillars 10 are released from their contraction and expand to their original size L2 (>L1), as shown in FIG. 7B . As a result, the upper mold 2 descends relative to the upper platen 102 (movable pin plate 62). In this case, a large load will be applied to the contact portion 92 of the deformation suppression member 9 as the support pillar 10 extends, and there is a possibility that the upper mold 2, the fixing portion 91 or the contact portion 92 will be damaged.

[0060] In order to solve the above problems, in this embodiment, as shown in Figures 3, 5, and 6, a load sensor LS is provided on at least one of the multiple connecting rods 63 to measure the load applied to the connecting rod 63. The controller CTL (see Figure 1) controls the plate driver 64 so that the load measured by the load sensor LS becomes a predetermined value (zero in this embodiment). The predetermined value can be set to a value suitable for resin molding based on the type of molding object W or resin material J, and can be set to a value that will not damage the upper mold 2, the fixing portion 91, or the contact portion 92, for example.

[0061] Specifically, the force applied to the connecting rod 63 when the upper mold 2 and the lower mold 3 are opened (the tensile force caused by the extension of the support pillar 10) is measured by the load sensor LS, and the movable pin plate 62 is moved up and down so that the load measured by the load sensor LS becomes zero for a predetermined period from the start of mold opening. In other words, the movable pin plate 62 is moved toward the cavity C by the amount by which it is pulled toward the cavity C, thereby creating no load or a low load. Here, the predetermined period from the start of mold opening refers to, for example, at least the time from the start of mold opening until the support pillar 10 extends and returns to its original size, or at least the time from the start of mold opening until the mold surfaces of the upper mold 2 and the lower mold 3 are no longer in contact with each other. Note that the movable pin plate 62 may be moved up and down so that the load measured by the load sensor LS becomes a predetermined value (zero in this embodiment) from the start of mold opening to the completion of mold opening.

[0062] Additionally, the upper mold 2 is provided with a plurality of ejector pins (not shown) for releasing the resin molded product P from the upper mold 2 after resin molding. These ejector pins penetrate required locations in the upper mold 2 and are provided so as to be movable up and down relative to the upper mold 2, and are fixed to an ejector pin plate (not shown) provided on the upper side of the upper mold 2. The ejector pin plate can be provided between the upper mold 2 and the movable pin plate 62. In this case, the ejector pin plate has through holes formed therein through which the movable pin 61, connecting rod 63, connecting member 7, distance regulating member 8, deformation suppressing member 9, support pillar 10, etc. are inserted.

[0063] The ejector pin plate further has a return pin. When the molds are closed, the return pin comes into contact with the outside of the resin molding region R of the molding object W in the lower mold 3, thereby lifting the ejector pin plate relative to the upper mold 2. As a result, when the molds are closed, the ejector pins are retracted into the mold surface of the upper mold 2. When the molds are opened, on the other hand, as the lower mold 3 descends, the ejector pin plate descends relative to the upper mold 2, and the resin molded product P is released from the upper mold 2 by the ejector pins.

[0064] <Method for manufacturing resin molded product P> Next, a description will be given of the operation of the resin molding apparatus 100 of this embodiment and a method for manufacturing the resin molded product P. Note that the following operation is performed by, for example, a control unit CTL provided in the supply module 100A controlling each part.

[0065] First, the loader 13 transports and sets the molding material, i.e., the workpiece W and the resin material J, into the opened lower mold 3 (step S1; setting molding material, see FIG. 9( a)). Specifically, the molding object W is aligned and placed on the lower mold 3, and the resin material J is supplied to the pot 41. In this embodiment, before placing the molding object W on the lower mold 3, the movable pins 61 of the lower mold 3 protrude into the recess 31, and the movable pins 61 of the lower mold 3 support the underside of the fixing portion of the molding object W. The distance regulating member 8 ensures that the movable pins 61 of the lower mold 3 protrude the same amount within the recess 31. Then, the upper mold 2 and the lower mold 3 are clamped together (step S2; clamping, see FIG. 9( b)).

[0066] Then, with the molds closed, the movable pins 61 of the upper mold 2 are protruded into the recess 21 so that the movable pins 61 come into contact with the upper surface of the fixing location of the work-piece W (step S3; protruding upper movable pins, see FIG. 10(c)). The distance regulating member 8 ensures that the movable pins 61 of the upper mold 2 protrude the same amount within the recess 21. As a result, the work-piece W is sandwiched between the movable pins 61 of the lower mold 3 and the movable pins 61 of the upper mold 2, and is positioned and fixed within the cavity C.

[0067] After the molding object W has been positioned and fixed (with the movable pins 61 inserted into the recesses 21 and 31), the transfer mechanism 42 is controlled to inject the molten resin material J in the pot 41 into the cavity C using the plunger 421 (step S4: resin material injection, see FIG. 10(d)). After the resin material J has been injected, the plate driver 64 moves the movable pin plate 62 out of the cavity C at an appropriate timing for molding. The movable pin plate 62 then comes into contact with the contact portion 92 of the deformation suppression member 9 and stops. This causes the movable pin 61 to be pulled back from the cavity C and stop at a predetermined position, retracting the movable pin 61 from the recesses 21 and 31 (step S5: movable pin retraction, see FIG. 11(e)). Here, if the movable pin plate 62 is bent, the deformation is corrected by the deformation suppression member 9, and the retracted positions of the movable pins 61 of the upper mold 2 and the lower mold 3 become the same.

[0068] The resin material J is also filled into the space formed after the movable pin 61 is pulled back, completing the filling of the resin material J into the cavity C (step S6: completion of filling of resin material). After that, as a predetermined curing time elapses, the resin material J hardens and is molded into the molding object W (step S7: completion of curing of resin material, see FIG. 11(f)).

[0069] After the predetermined curing time has elapsed, the mold opening operation begins. Before mold opening begins, the movable pin plate 62 is controlled to protrude the movable pin 61 into the cavity C (the movable pin 61 is inserted into the cavity C) (step S8: movable pin protrusion, see FIG. 12(g)). Here, it is determined whether the load measured by the load sensor LS is equal to or greater than a predetermined value (zero in this embodiment) (step S9: movable pin load equal to or greater than predetermined value). Before mold opening begins, the movable pin plate 62 is retracted, so the load measured by the load sensor LS is negative. When the load measured by the load sensor LS is zero, it is assumed that no load is applied to the movable pin plate 62 and the deformation suppression member 9. If the load measured by the load sensor LS is less than the predetermined value (NO in step S9), the plate driver 64 performs a protruding operation of the movable pin 61, causing the load measured by the load sensor LS to be equal to or greater than the predetermined value (see FIG. 12(g)). When the load measured by the load sensor LS reaches or exceeds a predetermined value (YES in step S9), the mold opening operation is started (step S10; mold opening start). Specifically, the mold clamping mechanism 5 lowers the lower mold 3.

[0070] During the mold opening operation, the plate driver 64 moves the movable pin plate 62 up and down so that the load measured by the load sensor LS becomes a predetermined value (zero in this embodiment) for a predetermined time (step S11; move the movable pin up and down so that the load on the movable pin becomes a predetermined value). In this way, mold opening is performed while controlling the plate driver 64 so that the load measured by the load sensor LS becomes the predetermined value. Mold opening is completed when the lower mold 3 descends to the mold opening completion position (step S12; mold opening completed), and then the unloader 15 receives the resin molded product P from the lower mold 3 and transports it to the storage section 14 (step S13; carry-out of resin molded product), completing the production of the resin molded product P.

[0071] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, multiple connecting rods 63 are connected and fixed to the movable pin plate 62, and multiple deformation suppression members 9 are provided to suppress deformation of the movable pin plate 62 relative to the upper mold 2 and the lower mold 3.Therefore, even if the sliding resistance between the movable pin 61 and the sliding hole 2h1 formed in the upper mold 2 and the lower mold 3 increases, the deformation of the movable pin plate 62 can be suppressed, and the movable pin 61 can operate stably and with high precision.

[0072] Furthermore, in this embodiment, since a plurality of deformation suppressing members 9 are provided on the outside and inside of the resin molding region R where the amount of deformation of the movable pin plate 62 increases as the movable pin plate 62 bends, it is possible to uniformly suppress deformation of the movable pin plate 62 in a balanced manner. Furthermore, since the deformation suppressing members 9 are provided outside the resin molding region R, they are also outside the recesses 21, 31 of the upper mold 2 and the lower mold 3, and therefore the plurality of deformation suppressing members 9 can be provided regardless of the positions of the recesses 21, 31 of the upper mold 2 and the lower mold 3.

[0073] Furthermore, the deformation suppressing members 9 of this embodiment suppress deformation of the movable pin plate 62 relative to the upper mold 2 when the movable pins 61 are retracted from the recesses 21, thereby preventing deterioration in the quality of the resin molded product P. Here, the multiple deformation suppressing members 9 come into contact with the surface of the movable pin plate 62 opposite to the molds 2 and 3 to suppress deformation of the movable pin plate 62, thereby preferably suppressing deformation of the movable pin plate 62 in a convex curve toward the molds 2 and 3.

[0074] Furthermore, in this embodiment, when the upper mold 2 and the lower mold 3 are opened by the mold clamping mechanism 5, the plate driving unit 64 is controlled so that the load obtained by the load sensor LS becomes zero, thereby eliminating problems (e.g., damage to the upper mold 2, damage to the deformation suppression member 9, etc.) caused by connecting a component whose dimensions or position change when the mold is opened (e.g., the support pillar 10 or the upper mold 2) with a component whose dimensions or position do not change (e.g., the deformation suppression member 9).

[0075] In addition, since the connecting rod 63 is connected and fixed to the movable pin plate 62 from the mold surface side of each of the upper mold 2 and the lower mold 3, i.e., the parting line surface side, the connection between the connecting rod 63 and the movable pin plate 62 can be released from the mold surface side of each of the upper mold 2 and the lower mold 3. As a result, it is possible to easily attach and detach the movable pin plate 62 provided on the upper mold 2 and the upper mold 2, or the movable pin plate 62 provided on the lower mold 3 and the lower mold 3. As a result, the work of replacing the molds 2, 3 and the movable pin plate 62 when changing the type of resin molded product P can be easily performed.

[0076] Other Modified Embodiments The present invention is not limited to the above-described embodiments.

[0077] For example, in the above embodiment, the movable pins 61 are provided on both the upper mold 2 and the lower mold 3, but they may be provided on only one of the upper mold 2 or the lower mold 3.

[0078] In addition, in the above embodiment, the recesses forming the cavity C were provided in both the upper mold 2 and the lower mold 3, but the recesses forming the cavity C may also be provided in one of the upper mold 2 or the lower mold 3.

[0079] Furthermore, in controlling the movable pin plate 62 during mold opening, if the load measured by the load sensor LS becomes smaller than zero, the lowering of the lower mold 3, which is the mold opening operation, may be stopped. Then, with the lowering of the lower mold 3 stopped, the plate driving unit 64 may perform a protruding operation of the movable pin 61, and when the load measured by the load sensor LS becomes equal to or greater than zero, the lowering of the lower mold 3 may be resumed.

[0080] Additionally, the deformation suppression member may be configured to allow adjustment of the height position of the contact portion 92. Specifically, as shown in FIG. 13 , the height position of the annular member 921 (contact portion 92) can be adjusted by providing a spacer 922, such as a separate washer, between the annular member 921 and the collar 912 in the fixed portion 91. Adjusting the height position of the annular member 921 (contact portion 92) in this manner can adjust the amount of deflection suppression of the movable pin plate 62 and the amount by which the movable pin 61 retracts from the cavity C (recess 21). Also, as shown in FIG. 13 , a bushing 923, such as an Oiles bushing, can be provided between the collar 912 of the fixed portion 91 and the through hole 62h2 of the movable pin plate 62 to allow smooth vertical movement of the movable pin plate 62. Alternatively, the fixed portion 91 can be fixed to the upper mold 2 using a spigot-joint structure.

[0081] Furthermore, in the above embodiment, the connecting rod 63 and the movable pin plate 62 are connected and fixed to each other from the mold surface side of the upper mold 2 and the mold surface side of the lower mold 3 using the connecting member 7, but they may be connected and fixed in other ways. For example, they may be connected and fixed to each other from the opposite side of the mold surface of the upper mold 2 and the opposite side of the mold surface of the lower mold 3. Also, they may be connected and fixed to each other from the side of the upper mold 2 and the side of the lower mold 3.

[0082] In the above embodiment, the movable pin plate 62 has a rectangular shape, but the shape is not limited thereto as long as it can hold the movable pin 61 and move it back and forth within the cavity C, and may be, for example, a polygonal shape or a circular shape. Also, the movable pin plate 62 may be made up of multiple plates.

[0083] In the above embodiment, the multiple connecting rods 63 were arranged at positions that were point-symmetric on the movable pin plate 62, but their arrangement is not particularly limited as long as the movable pin plate 62 can be moved up and down while maintaining parallelism.

[0084] Furthermore, in the above embodiment, before the molding object W is placed on the lower mold 3, the movable pin 61 of the lower mold 3 is protruded into the recess 31, and when the mold is closed, the movable pin 61 of the upper mold 2 is protruded into the recess 21 to fix the fixing point of the molding object W, but the timing of this fixation is not particularly limited, and it may be before the resin is injected.

[0085] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

[0086] According to the present invention, the movable pin can be operated stably with high precision.

[0087] REFERENCE SIGNS LIST 100... Resin molding device W... Molding object P... Resin molded product J... Resin material C... Cavity 2... First mold (upper mold) 21... Recess 2h2... Through hole 3... Second mold (lower mold) 31... Recess 5... Mold clamping mechanism 61... Movable pin 62... Movable pin plate 63... Connecting rod 64... Plate drive unit R... Resin molding area 641... Movable plate 8... Distance regulation member

Claims

1. A molding die comprising: a first die having a recess that forms a cavity into which a resin material is filled; a second die arranged opposite the first die and clamped together with the first die; a movable pin plate provided on the opposite side of the first die from the second die and having a movable pin fixed thereto that can move back and forth within the recess; a plurality of connecting rods provided on the opposite side of the movable pin plate from the first die and having one end fixed to the movable pin plate; and a plate drive unit that moves the movable pin plate via the plurality of connecting rods so that the movable pins move back and forth within the recess, wherein the plurality of connecting rods are connected and fixed to the movable pin plate outside the resin molding area formed by the first die and the second die when viewed from the clamping direction.

2. The mold according to claim 1, wherein the movable pin plate is rectangular when viewed from the mold clamping direction, and the multiple connecting rods are connected and fixed to corresponding two side portions of the movable pin plate.

3. A molding die as described in claim 1 or 2, wherein the plate driving unit includes a movable plate to which the other ends of the multiple connecting rods are connected and fixed, and by moving the movable plate, the movable pin plate is moved via the multiple connecting rods.

4. The mold according to claim 3, further comprising a distance determining member provided between said movable plate and said movable pin plate for determining the distance between said movable plate and said movable pin plate.

5. The mold according to claim 4, wherein the distance regulating member is provided on the inside of the plurality of connecting rods when viewed from the mold fastening direction.

6. The mold according to claim 4 or 5, wherein the distance regulation member is connected and fixed to the movable plate, but is not connected and fixed to the movable pin plate.

7. A molding die as claimed in any one of claims 1 to 6, wherein the first die has a through hole formed outside the resin molding area, and one end of the connecting rod is connected and fixed to the movable pin plate from the side of the first die facing the second die, via the through hole of the first die.

8. A resin molding device comprising: a molding die according to any one of claims 1 to 7; and a clamping mechanism for clamping said molding die.

9. A method for manufacturing a resin molded product using the molding die described in any one of claims 1 to 7, comprising: a mold clamping process for clamping the first mold and the second mold; and a resin molding process for switching the movable pin from a state in which it protrudes into the recess to a state in which it is retracted, and molding the resin into an object to be molded.

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