Laminating apparatus for laminating an electrochemical layer stack

Abstract

A laminating apparatus for laminating an electrochemical layer stack comprises: a movable first workpiece carrier for carrying a layer stack composed of individual substrates stacked on one another in a layer-like manner; a laminating press for applying pressure to the layer stack carried by the first workpiece carrier in such a way that the layer stack is pressed against the first workpiece carrier by means of the laminating press, in order to connect the substrates of the layer stack to form a laminate; and at least one holding-down device, in order to secure the layer stack against slipping. The laminating apparatus is configured to release the laminate by the holding-down device being removed from the laminate. To assist the release, the holding-down device has at least one fluid channel to which a pressurized fluid can be applied. A corresponding lamination method is also described.

Description

[0001] Laminating device for laminating an electrochemical layer stack

[0002] The present invention relates to a laminating device for laminating an electrochemical layer stack, as well as a method for laminating an electrochemical layer stack.

[0003] The electrochemical layer stack can, in particular, be an electrode stack with at least one anode electrode, at least one cathode electrode, and a respective separator between each anode electrode and a cathode electrode. Such a layer stack can, in particular, be an electrode stack for lithium-ion battery cells. For example, it can be an electrode stack for a battery cell for a vehicle battery, in particular a high-voltage battery, which is designed as an energy source for vehicle drives of so-called battery-electric vehicles (BEVs) or hybrid vehicles (HEVs).

[0004] Further examples of such a layer stack are a membrane electrode assembly (MEA) or a membrane electrode frame assembly (MEFA) for a fuel cell, particularly of the PEM type.

[0005] The individual layers of an electrochemical layer stack can consist, in particular, of individual plate-shaped, foil-shaped, or strip-shaped layers that are stacked on top of one another to produce the layer stack and then firmly bonded together by lamination. During lamination, the stacked layers are bonded to form a laminate under pressure and, depending on the lamination method, optionally with additional heat.

[0006] It is an object of the invention to further improve the lamination of electrochemical layer stacks, in particular with regard to a reduction of damage to the laminate to be produced.

[0007] This object is achieved according to the teaching of the independent claims. Various embodiments and further developments of the solution are the subject of the subclaims. A first aspect of the solution presented here relates to a laminating device for laminating an electrochemical layer stack. The laminating device comprises:

[0008] (i) a movable first workpiece carrier for supporting a layer stack of individual substrates stacked on top of one another in layers;

[0009] (ii) a laminating press for applying pressure, and optionally additionally heat, to the layer stack carried by the first workpiece carrier, such that the layer stack is pressed against the first workpiece carrier by means of the laminating press in order to bond the substrates of the layer stack into a laminate; and

[0010] (iii) at least one hold-down device, wherein the laminating device is configured to secure the layer stack against slipping from a point in time before or during the production of the laminate by the laminating press by means of at least some pressing of the layer stack against the first workpiece carrier by means of the hold-down device.

[0011] The laminating device is configured to release the layer stack or the laminate produced therefrom by removing the hold-down device from the layer stack or the laminate produced therefrom. Furthermore, the hold-down device has at least one fluid channel that can be supplied with a pressurized fluid to assist the release.

[0012] The term "laminating device," as used herein, refers to a device, in particular a system with one or more processing stations, designed to bond two or more substrates, in particular sheet- or film-like substrates, into a laminate by lamination. The term "lamination" refers to a joining process in which several overlapping layers (substrates) are joined together to form a multilayer composite material (laminate). Joining the layers can, in particular, comprise pressing the substrates together, applying heat, creating a material-to-material bond, and / or a welding process.

[0013] The term "electrochemical layer stack," as used herein, refers to a multilayer stack of various, overlapping substrates that are selected and arranged relative to one another such that together, at least after the laminate has been produced therefrom, they form at least one galvanic cell or an electrochemically active assembly thereof. A galvanic cell can, in particular, be a primary cell, a secondary cell (accumulator), a tertiary cell (fuel cell), or an electrolysis cell. Some examples of electrochemical layer stacks have already been mentioned above.

[0014] The term "workpiece carrier," as used herein, refers in particular to a carrier structure, in particular in the form of a plate or frame, into or on which one or more workpieces can be inserted or placed, in particular inserted or placed, in order to be able to transport them by a workpiece conveyor along a production device, in particular a production line, through several production stations and to be processed there. The workpiece carrier can in particular have a fixing device for fixing the at least one workpiece to the workpiece carrier. The laminating device according to the first aspect can be considered as such a production device. In the present case, the layer stack serves in particular as the workpiece.

[0015] The term "substrate," as used herein, refers in particular to a homogeneous or heterogeneous material layer. It can be present, in particular, as a solid at room temperature (25°C), so that several such substrates can be stacked by placing them one on top of the other. A substrate can, in particular, have a plate-like, film-like, or strip-like shape, at least in sections. Depending on the type of layer stack to be formed and the layer in question, the material considered can be, in particular, a cathode material, an anode material, a separator material, or a fuel cell membrane.

[0016] With the laminating device according to the first aspect, in particular by means of the hold-down device, the layer stack can be secured against slipping. The contact pressure exerted by the hold-down device should be sufficient to at least substantially prevent the layer stack from slipping, even during the actual lamination process performed by the laminating press. On the other hand, it is provided that the contact pressure exerted by the hold-down device is not so strong that the layer stack is significantly deformed or already laminated by the hold-down device. Preferably, the said time is selected such that the layer stack is already secured against slipping by pressing the layer stack against the first workpiece carrier by means of the hold-down device before the layer stack is pressed against the first workpiece carrier by the laminating press.Preferably, the hold-down device is configured to secure the layer stack against slipping throughout the entire processing operation performed by the laminating press. Thus, the laminating press is removed from the laminate produced from the layer stack while the hold-down device continues to press the layer stack or the laminate against the first workpiece carrier. Thus, the hold-down device is removed from the produced laminate only after the laminating press, in particular by lifting the hold-down device.

[0017] The inventor has recognized that removing a hold-down device from a layer stack or from a laminate produced therefrom can sometimes cause damage or manufacturing defects and / or disrupt the manufacturing process. For example, it is possible for the laminate to adhere to the hold-down device, at least temporarily, when it is lifted, even though the manufacturing process specifies that the laminate should remain on or in the workpiece carrier. This can disrupt the manufacturing process, particularly with regard to subsequent processing steps. Furthermore, after a phase of temporary adhesion to the hold-down device, the laminate can detach from it and possibly fall uncontrollably onto the workpiece carrier or other components of the manufacturing system, which could damage the laminate and / or the manufacturing system.To counteract this, the hold-down device according to the invention has at least one fluid channel to which a pressurized fluid can be applied. The fluid flow generated when the fluid emerges from the fluid channel can act on the laminate in such a way that the release of the laminate by the hold-down device is assisted. In particular, the fluid flow can exert a force on the laminate so that adhesion of the laminate to the hold-down device can be prevented or at least the likelihood and / or duration of such adhesion can be reduced. Ideally, the laminate therefore remains in the workpiece carrier when the hold-down device is removed from or lifted from the laminate, so that any subsequent production steps can be carried out without disrupting the production process and without damage to the laminate and the production system.The fluid to be used can, in particular, be a gas or gas mixture, in particular air. The fluid channel can be connected or connectable, in particular, to a compressed air source for supplying the fluid. Preferably, the fluid channel is only supplied with the pressurized fluid shortly before and / or during the removal of the hold-down device from the laminate.

[0018] In the following, various exemplary embodiments of the laminating device are described, which can each be combined with each other as desired and with the second aspect of the present solution described below, unless this is expressly excluded or is technically impossible.

[0019] In some embodiments, the at least one fluid channel runs in or on the hold-down device. A run in the hold-down device is particularly preferred because the fluid channel then does not take up any additional space (to the side or next to the hold-down device). This should be seen against the background that, in the interests of the most uniform lamination process possible, it is advantageous if the laminating press or its press ram applies pressure to the layer stack over as large an area of ​​the layer stack as possible. However, at the points where the layer stack is pressed against the workpiece carrier by means of the hold-down device, the laminating press cannot apply pressure to the layer stack. It is therefore advantageous if the hold-down device has the smallest possible extension in a plane parallel to the surface of the layer stack.

[0020] Nevertheless, it is also possible for the at least one fluid channel to extend along the hold-down device (i.e., viewed in a plane parallel to the surface of the layer stack, next to the hold-down device). This may simplify the manufacture of the laminating device. This may also make it possible to retrofit an existing laminating device, particularly in a potentially simpler manner than introducing a fluid channel into an existing hold-down device.

[0021] In some embodiments, the hold-down device has a first surface facing the workpiece carrier or the layer stack, which is in contact with the layer stack when the layer stack is pressed against it. This first surface is preferably designed such that it affects the surface of the layer stack to be contacted as little as possible or not at all, in particular does not react with it, and in particular is chemically neutral.

[0022] In some embodiments, the at least one fluid channel has an outlet opening arranged in the region of the first surface. The term "in the region of the first surface" is to be understood in the context of the present invention as meaning that the outlet opening is arranged on or in the first surface or close enough to this first surface that fluid exiting through the outlet opening can or does assist in the release of the laminate. In prototypes of the laminating device manufactured by the inventor, the inventor was able to achieve satisfactory or good results when the distance of the outlet opening from a plane in which the first surface lies was a maximum of 20 mm. Even better results were achieved when this distance was a maximum of 10 mm, 5 mm, or 3 mm.

[0023] In some embodiments, the outlet opening is not located in the first surface. In particular, in such embodiments, the outlet opening can be arranged on a lateral, second surface of the hold-down device. For example, if the hold-down device is approximately cylindrical, the first surface would correspond to a surface at an axial end of the cylinder, and the second surface would correspond to the (curved) cylindrical surface.

[0024] The arrangement of the outlet opening on a lateral, second surface of the hold-down device offers particular technical advantages over an arrangement of the outlet opening in the first surface. When the outlet opening is arranged on a lateral, second surface of the hold-down device, the fluid exiting through the outlet opening (hereinafter referred to simply as "compressed air," without this being considered a restriction of the term "fluid") can act on a comparatively large area, namely, if necessary, on the entire surface of the laminate not contacted by the hold-down device. This can create a relatively uniform pressure on the laminate. Thus, any deformation of the laminate caused by the compressed air can be avoided as far as possible.

[0025] Compared to arranging the outlet opening on or in the first surface, there is a further advantage, as explained below. It involves increased technical effort to precisely coordinate the beginning of the removal of the hold-down device from the laminate and the application of compressed air to the fluid channel, or the discharge of the compressed air at the outlet opening, so that both occur (exactly) simultaneously.If the outlet opening is arranged on or in the first surface, there is still a risk of damage to the laminate if the simultaneous action is not sufficient, because if the fluid channel is pressurized with compressed air while the hold-down device is still pressing the laminate against the first workpiece carrier, the compressed air could potentially damage the surface of the laminate because the surface of the laminate essentially still seals the outlet opening of the hold-down device in an airtight manner at this time.If, however, the fluid channel is only pressurized with compressed air after the removal of the hold-down device from the surface of the laminate has already begun, the above-described risk of the laminate temporarily adhering to the first surface of the hold-down device as well as possible damage to the laminate or the laminating device exists if the laminate is released from the hold-down device by the subsequent application of compressed air.

[0026] The potential problem described in the previous paragraph can be at least largely avoided by arranging the outlet opening on the second surface. With this arrangement, the fluid channel can be pressurized with compressed air while the hold-down device is still pressing the laminate against the first workpiece carrier. This generally does not result in damage, as the outlet opening is not hermetically sealed in such an arrangement. The compressed air can therefore flow out relatively unhindered through the outlet opening and causes only a comparatively light pressure on the laminate (which is still pressed down by the hold-down device at this point). As soon as the hold-down device lifts off the laminate, this comparatively light pressure is sufficient to release the laminate from the hold-down device.In other words, the laminate remains in its previous position in or on the first workpiece carrier while the hold-down device is removed from the surface of the laminate.

[0027] However, it is also conceivable to arrange the outlet opening in the first surface of the hold-down device, although in this case care should be taken to ensure that the fluid channel is pressurized with compressed air and the removal of the hold-down device from the laminate occurs as precisely as possible.

[0028] In some embodiments, the at least one fluid channel in the region of the first surface has a path that has a directional component parallel to the first surface. Such a path promotes the (lateral) outflow of compressed air and thus the exposure of a relatively large portion of the surface of the laminate. This, in turn, can ensure the most even pressure distribution possible.

[0029] In some embodiments, the course of the at least one fluid channel is inclined at least in the region of the first surface by an angle α relative to the first surface and by an angle β relative to a normal on the first surface or relative to the pressing direction of the hold-down device, wherein the angle α is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60° and / or wherein the angle β is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60°, in particular wherein the angle α has a value of 45° ± 10° or 45° ± 5° and / or the angle β has a value of 45° ± 10° or 45° ± 5°. A fluid channel with an inclination of approximately 45° relative to the first surface, and thus also relative to a normal on the first surface, has proven particularly advantageous in series of tests.The course of the fluid channel was directed outwards with respect to a central axis of the hold-down device - this represents the directional component parallel to the first surface - and at the same time was also oriented towards the workpiece carrier or the layer stack or laminate accommodated therein - this represents a directional component perpendicular to the first surface. As described above, the directional component parallel to the first surface distributes the pressure relatively evenly over the largest possible area of ​​the laminate, and the directional component perpendicular to the first surface promotes detachment of the laminate from the hold-down device.

[0030] In some embodiments, the at least one fluid channel has a first and an adjoining second section, wherein the second section opens into the outlet opening, wherein the course of the second section of the at least one fluid channel is inclined relative to the first surface and is inclined relative to a normal on the first surface or relative to the pressing direction of the hold-down device, and wherein the first section of the at least one fluid channel runs parallel or substantially parallel to a normal on the first surface or parallel to the pressing direction of the hold-down device. As described above, the second section promotes detachment of the laminate from the hold-down device and the most uniform pressure distribution possible over the largest possible area of ​​the laminate. The first section, on the other hand, serves to supply the compressed air to the second section.The first section can extend substantially along a longitudinal extent of the hold-down device (i.e., in a direction perpendicular to the first surface) from a first end of the first section to a second end of the first section, wherein the second end of the first section can be located at the transition from the first section to the second section, and the first end of the first section can be located at the end of the hold-down device oriented away from the first workpiece carrier. At this first end of the first section, the hold-down device can be connected or connectable to a compressed air source.

[0031] In some embodiments, the hold-down device has two or more fluid channels, in particular four or six or eight fluid channels, each with a first and an adjoining second section, wherein each of the second sections opens into a respective outlet opening, wherein the outlet openings are distributed, in particular uniformly or substantially uniformly, around the circumference of the hold-down device. The provision of a plurality of fluid channels in turn serves to ensure that the surface of the laminate is exposed as uniformly as possible to the compressed air emerging from the outlet openings. The distribution of the outlet openings, in particular a uniform or substantially uniform distribution of the outlet openings around the circumference of the hold-down device, further promotes this.For example, if the hold-down device has a generally cylindrical shape, the outlet openings can be distributed at regular angular intervals around the central longitudinal axis of the cylindrical hold-down device.

[0032] In some embodiments, the hold-down device has at least one fluid channel with a single first section and a plurality of adjoining second sections, in particular two or four or six or eight second sections, wherein each of the second sections opens into a respective outlet opening, wherein the outlet openings are distributed, in particular uniformly or substantially uniformly, around the circumference of the hold-down device. This configuration also serves to ensure that the surface of the laminate is exposed as uniformly as possible to the compressed air emerging from the outlet openings. In addition, this configuration can simplify the manufacture and operation of the hold-down device. The provision of a single first section is - with regard to the manufacture of the hold-down device - generally simpler and technically less complex than the provision of a plurality of first sections. E.g.As described above, the first section can extend along a large part of the longitudinal extent of the hold-down device, for example as a central bore in the hold-down device. The second sections can then be provided over a comparatively short distance, namely from this central bore to the outer circumference of the hold-down device. Advantageously, the cross-section of the first section can be larger than the cross-section of an individual second section. In particular, the cross-section of the first section can essentially correspond to the sum of the cross-sections of all second sections adjoining this first section. The operation of the hold-down device can also be simplified by providing a single first section, because only this one first section (instead of several first sections) needs to be connected to a compressed air source.

[0033] In some embodiments, several, in particular all, outlet openings are centered in a plane that extends, in particular substantially parallel to the first surface. This also promotes the most uniform possible exposure of the surface of the laminate to the compressed air exiting the outlet openings. Alternatively, however, it is also possible to provide the outlet openings in different planes parallel to the first surface, for example in two or three parallel planes, wherein the outlet openings are preferably evenly distributed around the circumference of the hold-down device within a plane. Depending on the position and orientation of the second sections, the compressed air flowing out of the outlet openings arranged at different planes could be directed onto different areas of the surface of the laminate.For example, the compressed air flowing out of outlet openings located near the first surface could be directed toward the immediate area around the hold-down device, while compressed air flowing out of outlet openings located farther away from the first surface could be directed toward more distant areas around the hold-down device. Such a configuration can therefore also promote the most uniform possible application of the compressed air emerging from the outlet openings to the surface of the laminate.

[0034] In some embodiments, the surface area of ​​the first surface or, if the laminating device has a plurality of hold-down devices, the sum of the surface areas of the first surfaces of the hold-down devices, is at most 20% or at most 15% or at most 10% or at most 5% or at most 3% and / or at least 1% or at least 2% or between approximately 1% and 3% or between approximately 2% and 3% of the surface area of ​​the workpiece carrier intended to support the layer stack or of the surface of the layer stack or of the surface of the laminating press. It has already been explained above that the smallest possible extension of the hold-down device in a plane parallel to the surface of the layer stack enables the largest possible extension of the laminating press or its press ram in a plane parallel to the surface of the layer stack. The advantage of the largest possible extension of the laminating press orwhose press ram in a plane parallel to the surface of the layer stack has already been explained.

[0035] In some embodiments, the first surface is provided with a non-stick coating, in particular with a ceramic non-stick coating and / or a non-stick coating comprising polytetrafluoroethylene (PTFE). This can also reduce the likelihood of the laminate sticking to the hold-down device.

[0036] A second aspect of the present solution relates to a method for laminating an electrochemical layer stack, the method comprising:

[0037] Providing a laminating apparatus according to the first aspect or any of the embodiments described herein;

[0038] Providing a layer stack of substrates to be bonded to form a laminate by lamination, stacked on top of one another in layers, on the movable workpiece carrier for supporting the layer stack; pressing the layer stack at least partially against the first workpiece carrier by means of the hold-down device in order to secure the layer stack against slipping,

[0039] Applying pressure to the layer stack carried by the workpiece carrier in such a way that the layer stack is pressed against the workpiece carrier by means of the laminating press in order to bond the substrates of the layer stack to form a laminate;

[0040] Removing the hold-down device from the layer stack or the laminate produced therefrom in order to release the layer stack or the laminate produced therefrom; and

[0041] Applying a pressurized fluid to the at least one fluid channel to assist in the release.

[0042] As already mentioned in connection with the first aspect, it is advantageous if the layer stack is already secured against slipping by pressing the layer stack against the first workpiece carrier by means of the hold-down device, before the layer stack is pressed against the first workpiece carrier by the laminating press. Furthermore, the hold-down device secures the layer stack against slipping, preferably during the entire processing operation carried out by the laminating press. It is therefore provided that the laminating press or its press ram is / are removed from the laminate produced from the layer stack, while the hold-down device continues to press the layer stack or the laminate against the first workpiece carrier. It is therefore provided that the hold-down device is only removed after the laminating press orwhose press ram is removed from the produced laminate, in particular by lifting the hold-down device.

[0043] Further optional features that may relate to both the first and second aspects or their embodiments are described below.

[0044] In some embodiments, the laminating device is configured to continuously secure the layer stack to the workpiece carrier by means of a clamp between its provision on the first workpiece carrier and its connection to the laminate on the laminating press. This allows for continuous securing of the layer stack against slippage and thus against resulting manufacturing defects during the processing of the layer stack up to its incorporation into the laminate.

[0045] In some embodiments, the first workpiece carrier has an activatable and deactivatable clamping device, by means of which the layer stack can be clamped to the first workpiece carrier. In this way, both the layer stack as a whole and the individual substrates stacked within it can be secured against slipping when the clamping device is activated. However, when the clamping device is deactivated, loading or unloading of the workpiece carrier is possible, since the layer stack is then not secured by the clamping device.

[0046] In particular, the laminating device can be configured to continuously clamp the layer stack carried by the first workpiece carrier after its production and before its transport through the laminating device by activating the clamping device, at least until either the entire processing of the layer stack up to the finished laminate by the laminating device is completed or until, during the production of the laminate in the laminating press, the individual substrates of the layer stack are otherwise secured against slipping by the laminating press and / or by their connection to the laminate before the clamping device is deactivated to release the laminate. In this way, the layer stack can be continuously secured against slipping and thus against resulting manufacturing defects during its processing up to its incorporation into the laminate.In embodiments that have a clamping device as described above, this can be deactivated, for example, when the hold-down device has taken over the fixation of the layer stack on the first workpiece carrier without interrupting the fixation of the layer stack. The hold-down device can, in particular, be designed such that it applies a higher clamping force to the layer stack than the clamping device in order to ensure particularly reliable fixation of the layer stack on or in the first workpiece carrier during the pressing process, which typically exerts strong forces on the layer stack.

[0047] In some embodiments, the laminating device further comprises a preheating device for heating the first workpiece carrier when it is loaded with the layer stack. The laminating device is further configured to: (i) feed the first workpiece carrier, when it is loaded with the layer stack, to the preheating device in order to heat the first workpiece carrier; and (ii) subsequently feed the heated and loaded first workpiece carrier to the laminating press for laminating the layer stack.

[0048] This can achieve several beneficial effects:

[0049] On the one hand, the layer stack carried by the first workpiece carrier can be indirectly preheated by the preheating device by heating the first workpiece carrier, so that the dwell time required for subsequent lamination in the laminating press can be reduced because only less additional heat needs to be introduced into the layer stack to bond the individual layers. Preheating can take place in the laminating device, particularly during the transport of the first workpiece carrier loaded with the layer stack to the laminating press, so that little or even no additional time is required for preheating.

[0050] Secondly, during preheating, due to the heat input into the layer stack emanating from the heated first workpiece carrier, the layers closer to the first workpiece carrier can be exposed to a greater heat input than the layers further away, resulting in a temperature gradient emanating from the first workpiece carrier. However, the subsequent lamination process in the lamination press can result in an opposite temperature gradient, since the more distant layers, which come into direct contact with the lamination press, can be heated more quickly by the lamination process (through pressure and / or heat input from the lamination press) than the layers closer to the first workpiece carrier, which are only in indirect contact with the lamination press via the first workpiece carrier.

[0051] If, in accordance with the laminating device, preheating precedes the pressing process in the laminating press, the two opposing temperature gradients can at least partially compensate for each other during lamination, so that the interaction of both heating processes (during preheating on the one hand and during laminating pressing on the other) quickly achieves a temperature profile across the entire stack of layers that is advantageous for forming the lamination between the layers, in particular an approximately constant one. This can counteract (viewed in the stacking direction) a lag in the heating of one side of the stack of layers compared to the other side, shortening the lamination process and thus achieving higher throughput.This is particularly crucial for shortening the overall throughput time of the lamination process when—as is often the case—the actual lamination process using the lamination press significantly influences the overall throughput time. This can be the case, for example, if the lamination process limits the possible cycle time for the synchronized serial processing of layer stacks (or groups of layer stacks that can be processed simultaneously).

[0052] In some embodiments, the preheating device comprises a heating element for dissipating heat to the first workpiece carrier. Furthermore, the preheating device is configured to bring the heating element into thermal contact with the first workpiece carrier in order to heat it when the first workpiece carrier is in a preheating position before being fed to the lamination press. In particular, the preheating device can be configured to preheat the heating element itself and bring it to the required temperature, so that it can immediately dissipate heat to the first workpiece carrier without any loss of time as soon as it is brought into thermal contact with it.

[0053] The term “thermal contact”, as used here, is to be understood in particular as a constellation in which a first body (e.g. first workpiece carrier) and a second body (e.g. heating element or cooling element) are brought into direct contact (touching) or into indirect contact via at least one medium located therebetween (e.g. third body) in such a way that a heat exchange (supply and / or removal of heat) is possible between the first body and the second body by means of heat conduction. The thermal conductivity along the heat conduction path for this heat exchange is preferably higher than that of air, preferably at least 1W / (m K), in particular at least 10W / (m K).

[0054] In some embodiments, the preheating device is designed such that the heating element is movable between a waiting position and a heating position, for example horizontally or with a horizontal movement component, wherein the heating element is not in thermal contact with the first workpiece carrier in the waiting position. If, on the other hand, the heating element is in a heating position, it comes into thermal contact with the first workpiece carrier, which is then in the preheating position, in order to be heated in the process. A heating element movable in this way offers the possibility, in particular, of only being introduced into the transport path of the first workpiece carrier and brought into thermal contact with it once the first workpiece carrier loaded with the layer stack has reached the preheating position.In this way, the transport path can be kept clear during the movement of the first workpiece carrier without affecting the subsequent or preceding heating of the first workpiece carrier by the heater.

[0055] In some embodiments, the laminating device further comprises a transport device for transporting the first workpiece carrier along a defined transport path through the laminating device starting from a starting position. The transport path extends over several spaced-apart, in particular parallel, such as horizontal, levels, and the transport device has a lifting device for transporting the first workpiece carrier between two or more of the levels. In this way, on the one hand, a design that is optimized (i.e. compact) with regard to the required footprint for the laminating device can be achieved, since individual processing stations or associated processing processes occurring along the transport path can be arranged one above the base.This also makes it easy to avoid intersections in the transport path on the same level, even with a highly compact laminating device, while still allowing sections of the transport path to be superimposed or intersecting at different levels. In some embodiments, the transport device is configured to move the loaded first workpiece carrier by means of the lifting device between one of the superimposed levels, in which the loaded first workpiece carrier can be fed to the lifting device, and another of the superimposed levels, in which the preheating position is located. This allows for level changes to be implemented in a confined space.In particular, the preheating device can be combined with the lifting device in such a way that the preheating position of the first workpiece carrier is arranged along a travel path of the lifting device, so that the heating of the first workpiece carrier loaded with the layer stack can take place during the level change and thus in a particularly time-saving manner.

[0056] In some embodiments, the preheating device for heating the first workpiece carrier comprises an induction heater. This is particularly advantageous with regard to short processing times due to the low thermal inertia of an induction heater. In particular, the induction heater can be accommodated in or on the aforementioned heating element. The first workpiece carrier can in particular be configured such that it has a current path, e.g. a conductor loop, for an eddy current subject to ohmic losses that can be generated by the induction heater along the current path, so that the eddy current losses associated with the eddy current, in particular ohmic losses, can be used to heat the first workpiece carrier.

[0057] In some embodiments, the first workpiece carrier has a thermal conductivity of at least 1 W / (m K), in particular at least 10 W / (m K), with respect to a heat conduction path which thermally connects at least one point in or on the first workpiece carrier, at which heat can be supplied to it by means of the preheating, to at least one support surface on the first workpiece carrier for receiving the layer stack. In this way, on the one hand, the preheating can quickly introduce heat into the first workpiece carrier and, on the other hand, can quickly release heat from the heated first workpiece carrier to the layer stack carried by it.

[0058] In some embodiments, the laminating device further comprises a cooling device for dissipating heat from the laminate after its production by means of the laminating press. The laminating device is configured to feed the first workpiece carrier, when loaded with the laminate after its production, to the cooling device in order to cool the first workpiece carrier (and thus indirectly via the first workpiece carrier the produced laminate). The cooling of the laminate carried by the first workpiece carrier, which can be effected by means of the cooling device, can in turn shorten the processing time until curing and dispensing of the laminate, which has cooled sufficiently after lamination.

[0059] In some embodiments, the cooling device comprises a first heat sink for cooling the first workpiece carrier. Furthermore, the cooling device is configured to bring the first heat sink into thermal contact with the first workpiece carrier in order to cool it when the first workpiece carrier loaded with the laminate is in a cooling position located downstream of the lamination press along the transport path.

[0060] In particular, in some of these embodiments, the cooling device is designed such that the first heat sink is movable between a waiting position and a cooling position, for example, horizontally or with a horizontal movement component, wherein the first heat sink is not in thermal contact with the first workpiece carrier in its waiting position, but is in thermal contact with the first workpiece carrier in its cooling position in order to cool it. Similar to the situation with the aforementioned heating element, such a movable heat sink also offers the possibility of being introduced into the transport path of the first workpiece carrier and brought into thermal contact with it only when the first workpiece carrier loaded with the laminate has reached the cooling position.In this way, the transport path can be kept clear during the movement of the first workpiece carrier without impairing the subsequent or preceding cooling of the first workpiece carrier by the heat sink.

[0061] In some embodiments, the cooling device further comprises a second heat sink, and the laminating device is configured to bring the laminate into thermal contact with the second heat sink on its side opposite the first workpiece carrier in order to cool the laminate. This allows for faster cooling of the laminate on both sides. This also serves to shorten the processing time.

[0062] In some embodiments, the preheating position and the cooling position of the first workpiece carrier are located on the same level. Furthermore, a position in which the first workpiece carrier is located during the lamination process performed by the lamination press can also be located on this same level. This allows for particularly fast transfers of the loaded first workpiece carrier between these positions, while maintaining the advantages resulting from the multi-level concept with regard to other sections of the transport path, due to the very short paths thus enabled between the preheating position, the lamination press, and the cooling position, without the need for a lift in between.

[0063] In some embodiments, the laminating device further comprises a stacking device configured to apply the layer stack, which is subsequently to be preheated and laminated, to the first workpiece carrier or to produce it by stacking its layers on top of one another while the first workpiece carrier is located at a stacking position, which may in particular be on a different plane than the preheating position and the cooling position. The stacking device is thus arranged upstream of the preheating device with respect to the transport path and may in particular be a processing station of the laminating device located as the first along the transport path. For example, the stacking device may be arranged entirely or partially below or above one of the other processing stations (preheating device, laminating press, cooling device, etc.).) and thus achieve an optimized (small) footprint of the lamination device, in particular because the empty workpiece carrier after the output of the fully processed layer stack can be transported back to the stacking device on a different level than the aforementioned processing stations in order to be reloaded with a new layer stack to be processed. The layer stack can be formed on the workpiece carrier using the stacking device and, after completion, immediately secured by clamping, in particular before further processing begins. It is also conceivable to load several workpiece carriers arranged one behind the other at the same time.

[0064] In some embodiments, the laminating device further comprises a welding device configured to weld conductor contacts of same-polarity electrodes of the laminate to one another, while the first workpiece carrier is located at a welding position, which may in particular be located on a different plane than the preheating position and the cooling position. Here, too, the aforementioned advantages of the multi-plane concept can be realized. The welding device can be located, in particular, downstream of the cooling position with respect to the transport path, so that welding takes place on the already cooled and thus mechanically more robust state of the laminate (compared to the heated state before cooling).

[0065] In some embodiments, the laminating device further comprises a movable transport carrier for carrying the first workpiece carrier. Furthermore, the laminating device is configured, on the one hand, to move the first workpiece carrier, carried by the transport carrier, through the laminating device during processing of the layer stack, but, on the other hand, to feed the first workpiece carrier loaded with the layer stack to the laminating press for producing the laminate without the transport carrier. In particular, the laminating device can further be configured to move the first workpiece carrier, carried by the transport carrier, through the laminating device before and / or after the laminate is produced by the laminating press.

[0066] Designs with a transport carrier can be used advantageously, particularly when a transport system is to be used for the section-by-section transport of the first workpiece carrier along the transport path. This transport system is designed to transport one or more of the transport carriers (which must be distinguished from the first workpiece carrier). In particular, this can be a transport system designed for a variety of different applications (particularly beyond laminating devices), such as a belt conveyor. The first workpiece carrier can thus be adapted, in particular, for the transport of the layer stack or the resulting laminate, while such adaptation is not required for the transport carrier.Since the transport carrier is not involved in the actual lamination process on the laminating press, unlike the first workpiece carrier, it does not have to be designed to withstand the pressure acting on the first workpiece carrier during lamination in the laminating press.

[0067] In some embodiments, at least one of the paths along which the first workpiece carrier can be moved along the transport path in sections by the laminating device, carried by the transport carrier, is located on a different plane than a laminating position in which the first workpiece carrier is located when the laminate is produced by means of the laminating press. For this purpose, the laminating device can be configured, in particular, while the first workpiece carrier is separated from the transport carrier, to move the transport carrier along a transport path running on the other plane and thus not through the laminating press to a receiving position at which, after the layer stack has been laminated on the laminating press, the first workpiece carrier loaded with the laminate is brought back together with the transport carrier in order to be transported further by the latter.The pick-up position can be located, in particular downstream of the cooling device (if present) in relation to the transport path of the first workpiece carrier. Here, too, the multi-level concept is advantageous, since the first workpiece carrier and the transport carrier can be moved one above the other on the different levels in a space-saving manner, particularly asynchronously, during their separation.

[0068] In some embodiments, the laminating device is further configured, after the laminate completely processed by the laminating device has been removed from the first workpiece carrier, to return the transport carrier together with the now empty first workpiece carrier carried by it along a return path to the starting position. In this way, a particularly periodic (e.g., clocked) circular process can be implemented to increase efficiency, in which the same first workpiece carrier or transport carrier can be used again for processing another layer stack. The return path can, in particular, be located on one of the levels that is not used for the transport path of the first workpiece carrier and / or the transport carrier to an unloading position at which the laminate completely processed by the laminating device is removed from the first workpiece carrier.In this way, the advantages of the multi-level concept can be utilized again, and collisions between them can be easily avoided, especially when multiple first workpiece carriers and transport carriers are moving simultaneously in the lamination device. The transport carrier can have the first heat sink.

[0069] In some embodiments, the laminating device comprises, in addition to the first workpiece carrier, a number N of further workpiece carriers, in particular of identical construction to the first workpiece carrier, each of which is configured to receive a respective layer stack. Here, N is a natural number, and the laminating device is configured to process each of the N+1 workpiece carriers, including the respective layer stack to be supported thereby, in the same way to produce a respective laminate from the respective layer stack, in particular as described in detail above in connection with the various embodiments of the laminating device for the first workpiece carrier.Thus, up to N+1 layer stacks can be processed simultaneously in the laminating device, each carried by one of the workpiece carriers, in the same way, in particular sequentially one after the other, or in groups simultaneously, or a combination of both. This allows the throughput and thus the efficiency of the laminating device to be further increased. In particular, according to some embodiments, the laminating device can be configured to process a plurality of layer stacks, each to be processed on an associated workpiece carrier, in parallel processing in order to produce a corresponding laminate from each of the layer stacks.In this case, the laminating device can in particular also be configured, within the scope of parallel processing, to hold the workpiece carriers to be processed in parallel in a predetermined relative arrangement to one another. However, the mutual spacing between the adjacent workpiece carriers in the arrangement can be varied such that this spacing for each pair of workpiece carriers is greater during the laminating process on the laminating press than during at least one common transport path of the workpiece carriers upstream or downstream of the laminating press. The relative arrangement can in particular be defined such that the workpiece carriers are arranged parallel to one another in the same orientation.

[0070] The designs of the laminating device mentioned herein, in which a transport device for transporting the first workpiece carrier along a defined transport path through the laminating device, starting from a starting position and extending over several spaced-apart, superimposed levels, and a lifting device are provided, are in principle also usable in a (different) laminating device for laminating an electrochemical layer stack if this (different) laminating device does not have the aforementioned preheating. This also applies to all other embodiments described herein and any combinations thereof, unless they themselves technically require the presence of preheating.

[0071] A further method for laminating an electrochemical layer stack is disclosed, the method comprising: (i) providing a layer stack of substrates stacked in layers on top of one another to be bonded to form a laminate by lamination on a movable first workpiece carrier for supporting the layer stack; and (ii) following the heating, applying pressure to the layer stack supported by the first workpiece carrier such that the layer stack is pressed against the first workpiece carrier by means of the laminating press in order to bond the substrates of the layer stack to form a laminate. The layer stack is continuously fixed to the workpiece carrier by means of a clamp between its provision on the workpiece carrier and its connection to the laminate on the laminating press.In particular, the method may further comprise: heating the first workpiece carrier loaded with the layer stack before the layer stack is joined to form the laminate by means of the laminating press.

[0072] The latter method can be configured, in particular, for execution using a laminating device described herein, in particular according to one of the embodiments of the laminating device described herein or a combination of two or more of these embodiments. The laminating devices described herein can be configured, in particular, for carrying out a method described herein.

[0073] The features and advantages explained with respect to a laminating device disclosed herein also apply accordingly to methods disclosed herein.

[0074] Further advantages, features and possible applications of the present solution will become apparent from the following detailed description in conjunction with the figures.

[0075] It shows:

[0076] Fig. 1 shows a schematic cross-sectional view of an exemplary embodiment of a laminating device and at the same time the corresponding sequence of process steps when laminating a layer stack by means of the laminating device;

[0077] Fig. 2 shows various views of an exemplary embodiment of a workpiece carrier loaded with a layer stack to be laminated or a laminate already produced therefrom;

[0078] Fig. 3 shows various views of an exemplary embodiment of a clamp of the workpiece carrier from Fig. 2;

[0079] Fig. 4 shows a perspective view of an exemplary embodiment of a transport carrier for receiving the workpiece carrier from Fig. 2;

[0080] Fig. 5 shows a cross-sectional view of an exemplary embodiment of a preheating arrangement in which the workpiece carrier loaded with the layer stack is located in a preheating position in the preheating device, where it can be heated by means of an induction heater;

[0081] Fig. 6A shows a plan view of an exemplary embodiment of an arrangement of several workpiece carriers for parallel processing;

[0082] Fig. 6B is a plan view of an exemplary embodiment of a gripping device for jointly gripping the workpiece carriers from Fig. 6A;

[0083] Fig. 6C is a perspective view of the gripping device of Fig. 6B;

[0084] Fig. 7A-C a sequence of positions of the laminating press during lamination;

[0085] Fig. 8 is a longitudinal section through an exemplary hold-down device of the laminating device;

[0086] Fig. 9 is a plan view of the hold-down device from Fig. 8; and

[0087] Fig. 10 schematically shows a flow diagram of an exemplary method for laminating an electrochemical layer stack.

[0088] In the figures, like reference numerals designate like, similar, or corresponding elements. Elements shown in the figures are not necessarily drawn to scale. Rather, the various elements shown in the figures are depicted in such a way that their function and general purpose will be understood by those skilled in the art. Connections and couplings between functional units and elements shown in the figures can also be implemented as indirect connections or couplings, unless expressly stated otherwise.

[0089] Fig. 1 illustrates a cross-sectional view (in a cross-sectional plane spanned by the coordinates X and Z) of a laminating device 100 according to an exemplary embodiment. The laminating device 100 has a plurality of processing stations 102 to 110 arranged along a production line.

[0090] The laminating device 100 has a transport system by means of which a workpiece carrier 200 (see Fig. 2) can be moved along the production line from processing station to processing station. The transport system is configured such that it can transport the workpiece carrier along the production line in sections, supported on another carrier, referred to herein as transport carrier 400 (see Fig. 4).

[0091] In Fig. 1, the forward transport path 114 of the workpiece carrier 200, which runs between the first processing station 102 and the last processing station 110, as well as the forward transport path 116 of the transport carrier 400, which partially coincides with it and also runs between the processing stations 102 and 110, are shown in the X-Z plane. However, it is also conceivable for the transport paths to also include paths that have at least one component along the Y-direction, which runs orthogonal to the X-Z plane. A common return transport path 118, which leads from the processing station 110 back to the first processing station 102 and is traversed by the workpiece carrier together with the transport carrier 400 carrying it during operation of the lamination device 100, is also shown.

[0092] The transport path 114 runs in one section in a first (upper) level 120 extending in the X / Y direction, while in other sections it runs in a lower, second (middle) level 122 also extending in the X / Y direction. The transport path 116 runs continuously in the middle level 122 up to the last processing station. The common return transport path 118 of the workpiece carrier 200 and the transport carrier 400 runs in a third (lower) level 124, which is still below the level 122 and also extends in the X / Y direction. To accomplish the level changes of the workpiece carrier 200 along the transport path 114 and both carriers down to the return transport path 118, the laminating device 100 has lifts designed for this purpose.

[0093] It is optionally possible for the laminating device 100 (as shown in Fig. 1) to have one or more further processing stations 112 along the production line of the processing station 110. In this case, deviating from the previous description of the transport paths, the outward transport paths 114 and 116 extend to the last of the processing stations 112, and the return transport path starts from this last of the processing stations 112. Such a processing station 112 could, for example, be an output device for the laminate that can be produced by the laminating device 100 or a laminate stacker for stacking such laminates after their respective production. At the beginning of the production line, there is a stacking device as the processing station 102, which is configured to stack several different substrates on top of one another to form an electrochemical layer stack 204 (see Fig. 2).For example, the layer stack 204 may comprise a multiple repeating sequence of an anode / cathode pair with a separator inserted between the anode and cathode.

[0094] Such layer stacks 204 are known in particular as electrode stacks for high-voltage batteries for supplying vehicle drives, such as electrode stacks for lithium-ion battery cells, particularly in the form of a pouch cell. Other examples of electrochemical layer stacks have already been mentioned above (e.g., MEA or MEAFA for a fuel cell).

[0095] During stacking on the stacking device 102, the individual substrates are placed on top of one another in the desired order, e.g., in the sequence anode-separator-cathode / anode-separator-cathode / etc., which is appropriate for a series connection of elementary cells (anode, separator, cathode) to form a battery cell. The layer stack is then already built up on a workpiece carrier 200 for further processing or, after the stack, is deposited on the workpiece carrier 200 as a whole or successively in partial stacks. For efficiency reasons, it may be advantageous to build the layer stack 204 directly on the workpiece carrier 200.

[0096] A further processing station along the production line is a preheating device 104, which is configured to heat the layer stack 204 carried by the workpiece carrier 200 (preheating) and thus to a desired target temperature before the actual lamination follows, in which the layer stack is joined together to form the laminate and bonded. Depending on the type of lamination to be performed (e.g., hot lamination), the preheating can serve, in particular, to bring adhesives present on one or more of the substrates or the substrate material itself to or close to a suitable joining temperature for the subsequent lamination.

[0097] The preheating device 104 has a heating element 126 which can be introduced, in particular pivoted or pushed into, the transport path 114 or below the first (upper) level 120, in particular between the first (upper) level 120 and the middle level 122, in such a way that it comes into the immediate vicinity of or even into heat-conducting contact (thermal contact) with the workpiece carrier 200 for heating in order to heat the latter and, via the resulting heating, also introduce heat into the layer stack 204 in order to bring the latter to the target temperature.

[0098] The heating element 126 can, in particular, be traversed by one or more channels through which a heated heating fluid can be passed to heat the heating element. Additionally or alternatively, the heating element 126 can, in particular, have an induction heater configured to generate an alternating magnetic field in the workpiece carrier 200 or parts thereof in order to cause lossy eddy currents there for heating the workpiece carrier. This will be explained in more detail below with reference to Fig. 5.

[0099] A further processing station along the production line is a laminating press 106, which is configured to combine the individual substrates of the layer stack 204 into a multilayer laminate by applying pressure (pressing) and optionally applying additional heat. The laminating press 206 will be explained in more detail below with reference to Figs. 7A-C.

[0100] During pressing, the layer stack is pressed by the press against the heated workpiece carrier 200 that supports it. This results, on the one hand, in a first temperature gradient emanating from the stack side facing away from the workpiece carrier 200 and in direct contact with the press, while, on the other hand, at the beginning of the pressing process, a second temperature gradient emanating from the workpiece carrier 200 is present due to the preheating. The two temperature gradients thus overlap during pressing, resulting overall in a modified, approximately homogeneous temperature profile along the stacking direction of the substrates.

[0101] Thus, two heating processes occurring at different times are available for heating the layer stack to the required joining temperature: preheating at the preheating device 104 and lamination at the laminating press 106. Since the layer stack 204 already has the target temperature, which is at least close to the joining temperature, due to its preheating at the preheating device 104, no or only a shortened period of time is required for the lamination process at the laminating press 106 to bring the layer stack 204 to the joining temperature. In this way, an efficiency gain can be realized, particularly if synchronized operation of the laminating device is provided, in which several layer stacks, each mounted on an associated workpiece carrier 200, are processed simultaneously at different processing stations in the same cycle.For example, a stack of layers can be joined together to form a laminate on the laminating press 106 while the next stack of layers to be laminated is being preheated in the preheating device 104.

[0102] A cooling device 108 follows as a further processing station along the production line. This cooling device is configured to cool the laminate created in the lamination press from the layer stacks 204, in particular to solidify any cohesive bonds created during lamination. For this purpose, the cooling device has a first cooling body 128, which is designed to be movable, in particular similar to the heating body 126, in order to be introduced into the transport path 114 and brought into thermal contact with the workpiece carrier 200 when the workpiece carrier 200 is in a cooling position for cooling on the cooling device 108. In addition, the cooling device 108 has a second cooling body 130, which can also be movable and is configured to be brought into direct thermal contact with the laminate, for example with the side of the laminate facing away from the workpiece carrier 200. Thus, the laminate can be cooled effectively and quickly on multiple sides.The first heat sink 128 and / or the second heat sink 130 can each be cooled in particular via a coolant that can be passed through one or more channels formed therein.

[0103] As can be seen in Fig. 1, the transport paths 114 and 116 run separately from one another in the area of ​​the preheating device 104, the laminating press 106, and the cooling device 108, while otherwise they coincide. This has the advantage that the transport carrier 400 does not have to be designed for the high thermal or mechanical loads that occur during preheating, pressing, and cooling. In particular, this allows the use of a transport system that can also be used for other applications and thus does not have to be specifically designed for a laminating process. In other embodiments, the use of the transport carrier 400 can be omitted.

[0104] Optionally (depending on the type of layer stack) a further processing station along the production line is a welding device 108, which is configured, in the case of an electrode stack as a layer stack 204, to electrically connect the same-pole electrode contacts of the electrode stack by welding. The electrode contacts can be formed, in particular, in a manner known to those skilled in the art as conductor lugs 206a (positive pole) and 206b (negative pole) projecting laterally from the laminate (see Fig. 2).

[0105] It is optionally possible for some of the processing stations, in particular the preheating device 104, the laminating press 106, and / or the cooling device 108, to be duplicated. In this case, the transport paths can also include paths that have at least one component along the Y-direction running orthogonal to the XZ plane in order to feed workpiece carriers 200 loaded with layer stacks 204 to these additional processing stations.

[0106] Fig. 2 shows various views (a) to (d) of an exemplary embodiment of the workpiece carrier 200, which, depending on the processing stage, is initially loaded with the layer stack 204 to be laminated or, after lamination, with the laminate already produced therefrom. Views (a) and (b) are lateral cross-sectional views along a long side and an end face, respectively, of the loaded workpiece carrier 200. View (c) is a top view of the layer stack 204 or the laminate and the workpiece carrier 200 loaded therewith, and view (d) is a corresponding perspective view.

[0107] The workpiece carrier 200 has a base plate 202 with good electrical conductivity, in particular a metallic base plate. One of its main sides is intended to receive the layer stack 204 or the laminate resulting from it during the process on a support surface and to support it along the production line. To secure the layer stack 204 or the laminate on the workpiece carrier against slipping, several clamps 208 are arranged laterally of the support surface, each of which is configured to press the layer stack 204 or the laminate against the workpiece carrier 200 in order to fix it by means of a clamping action. The clamps 208 will be explained in more detail below with reference to Fig. 3.

[0108] In addition, the workpiece carrier 200 has a plurality of gripping pins 210, in particular nailhead-shaped, on its base plate 202 to enable simple and secure gripping and handling of the workpiece carrier 200 by a gripping device (see Fig. 6B) during loading and / or unloading into or out of the laminating device 100 as well as during transport along the production line, in particular by the lifts. Fig. 3 shows, in various views (a) to (d), an exemplary embodiment of the clamp 208 of the workpiece carrier 200 from Fig. 2. Views (a) and (b) are each lateral cross-sectional views along a long side and an end face of the clamp 208, respectively. View (c) is a plan view of the clamp 208 in the direction of the workpiece carrier 200, and view (d) is a corresponding perspective view.

[0109] The clamp 208 has a base part 302, which serves to fasten the clamp 208 to the workpiece carrier 200 and as a (direct or indirect) holding structure for the other components of the clamp 208. A clamp lever 304 is pivotable about a pivot axis 306 and mounted on the base part 302. A spring 308, which can be designed in particular (as shown) as a leg spring mounted on a bolt-like spring carrier 314, is arranged such that it applies a torque to the clamp lever 304 with respect to the pivot axis 306. The spring carrier 314 can be secured to the base part in particular by means of a lock washer 316.

[0110] At one end of the clamping lever 304, a cylindrical roller 310 is mounted so as to rotate about its axis of symmetry. At the other end of the clamping lever 304, a clamping piece 312 is mounted so as to rotate about its central axis. It can, in particular, have a cylindrical basic shape, although flat partial surfaces are optionally formed on the outer surface of the clamping piece to enable it to be placed flat on the layer stack. The spring 308 is arranged such that the torque exerted by it on the clamping lever 304 presses the clamping piece at least partially in the direction of the base plate 202 in order to be able to effect a clamping effect on the layer stack when the latter is located between the support surface on the base plate 202 and the clamping piece.The roller 310 serves to temporarily open the clamp 308 during the lamination process in the laminating press 106 by means of a clamp opener 710 acting on the roller 310, as will be explained in more detail below with reference to Figures 7A-C.

[0111] Fig. 4 shows a perspective view of an exemplary embodiment of the transport carrier 400 for receiving the workpiece carrier 200 from Fig. 2. The transport carrier 400 has a carrier plate 402 in which one or more recesses 404 can optionally be formed (as shown), be it as through-openings, mere depressions, or a combination of both. The recesses can be configured in particular for weight reduction and / or, if present, for receiving protruding parts of the workpiece carrier 200. In addition, one or more stop pieces 406 can be provided for aligning and laterally securing the workpiece carrier 200 during its application and subsequent transport on the transport carrier 400.

[0112] Fig. 5 shows a cross-sectional view of an exemplary embodiment of a preheating arrangement 500, in which the workpiece carrier 200 loaded with the layer stack 204 is located in a preheating position in the preheating device 104 on the heating element 126. The heating element 126 has an induction heater 502 supported by a support structure 504, which is configured to induce lossy eddy currents in the base plate 202 of the workpiece carrier 200 by means of induction, which can heat the base plate 202 and thus indirectly also the layer stack. The heating element 126 can in particular be configured to accommodate a plurality of, for example four, six, or eight, workpiece carriers 200 loaded with a respective layer stack 204.

[0113] In addition, a lifting device with a vertically adjustable gripper can be provided, which lifts one or more workpiece carriers 200 on gripping pins formed thereon from the middle level 122 upwards above the travel plane of the heating element 126 and, after moving the heating element 126, places the workpiece carrier(s) 200 on the heating element 126.

[0114] Fig. 6A shows a top view of an exemplary embodiment of an arrangement 600 of a group of several, here four, workpiece carriers 200a to 200d, wherein the laminating device 100 is configured to transport this group of workpiece carriers 200a to 200d simultaneously along the production line in the sense of parallel processing and to simultaneously process the layer stacks 204 stored thereon or the laminates resulting therefrom. In particular, the workpiece carriers 200a to 200d of the group can be preheated simultaneously, then processed simultaneously in the laminating press, and subsequently cooled in the cooling device 108. Stacking at the stacking device 102 and / or welding in the welding device 110 can also be carried out simultaneously for the entire group, as can any processing in any further processing stations 112.

[0115] Depending on the design of the laminating device 100, the workpiece carriers 200a to 200d of the group can be transported on those paths where the transport paths 114 and 116 coincide, in particular each on a respective separate transport carrier 400 or jointly on a single transport carrier 400. Furthermore, at least in the first-mentioned case, it is possible to define or configure the laminating device 100 such that the movement of the transport carriers 400 and thus the workpiece carriers 200 of the group relative to one another can occur with a variable relative distance 602. For example, it can be achieved that the relative distance 602 in the area of ​​the laminating press is set differently, in particular larger, than in the area of ​​the preheating device 104 and / or the cooling device 108. This makes it possible, for example, to accommodate an increased space requirement of the laminating tools during the laminating process.

[0116] This is illustrated in more detail in Figures 6B and 6C, wherein Fig. 6B illustrates an exemplary embodiment of a gripping device 604 for jointly gripping one or simultaneously several workpiece carriers 200 to be processed together. More specifically, Fig. 6B shows, in a top view, an exemplary embodiment for simultaneously gripping the four parallel-aligned workpiece carriers 200a-d from Fig. 6A. The gripping device 604 consists of two assemblies 608a and 608b, respectively, which are identical in construction except for their mirrored design and are each aligned along the X-direction. In Fig. 6C, the assembly 608a is shown in more detail in a perspective view as an example.

[0117] Each of the assemblies 608a and 608b has one or more grippers 606 for each workpiece carrier to be gripped, in the present example, two grippers 606 per workpiece carrier. The grippers 606, each assigned to a single workpiece carrier 200, form a group and are spaced apart by a fixed distance 614 from one another, which is defined such that the grippers 606 of the group can grip the gripper pins 210 of the workpiece carrier 200 arranged on the side of the workpiece carrier 200 facing them in order to grasp the workpiece carrier 200 and move it in a controlled manner, in particular to raise and / or lower it. The distance 602 between any two adjacent groups, however, is, as already mentioned above, variably adjustable. This can be achieved, in particular, such that each group is mounted on a carriage that is mounted for translational movement in the X direction along a rail 610.To adjust the distance 602, a drive (not shown) arranged on the rail 610 can be provided, which moves the groups or their associated carriages in a translational manner. A drive 612, in particular a spindle drive, can be provided for the joint movement of all groups or grippers in the X direction.

[0118] In order to move the grippers 606 from the respective associated assembly 608a, b along the Y direction towards the respectively assigned gripper pins 210 (and later away from them again) (see movement arrow 616), so that the grippers 606 can grasp the gripper pins 210, the assemblies 608a, b each additionally have a bidirectional drive for this movement.

[0119] By means of the gripping device 604, the workpiece carriers 200 to be processed together (or, if applicable, the single workpiece carrier 200 if purely serial processing is omitted) can be grasped and moved together, in particular during raising or lowering by a lifting device. This can be used in particular to lift the workpiece carriers 200 from the respective assigned transport carriers 400 or, conversely, to place them thereon.

[0120] Figures 7A-C show a sequence 700 of positions of the laminating press 106 during lamination. Fig. 7A shows, in view (a), a starting position of the laminating process. The laminating press 106 has an upper tool 702 and a lower tool 704 as laminating tools. The workpiece carrier 200, with the layer stack 204 fixed thereto by means of the clamps 208, is mounted on the lower tool 704. The upper tool 702 is arranged, at least in part, to be movable relative to the lower tool in order to be able to press the layer stack 204 and workpiece carrier 200 onto the lower tool 704 in a pressing position. The upper tool 702 and / or the lower tool 704 can also be heatable, and one or both of the laminating tools can be spring-mounted (not shown), in particular to limit the maximum contact pressure.

[0121] The upper tool 702 has a press ram 714 for applying pressure to the layer stack 204 when the press ram 714 is moved against the layer stack 204, as will be described below. However, in the initial position according to view (a), the upper tool is not yet in contact with either the workpiece carrier 200 or the layer stack 204 supported thereon.

[0122] Furthermore, the upper tool 702 has one or more hold-down devices 706, each spring-mounted via a hold-down spring 708 (e.g., spiral spring, leaf spring element, gas spring, or pneumatic cylinder), and for each clamp 208 of the workpiece carrier 200, a clamp opener 710, each spring-mounted via a clamp opener spring 712 (e.g., spiral spring).

[0123] View (b) in Fig. 7A shows a subsequent position in which the lamination press 106, more precisely the upper tool 702, has left the starting position and moved toward the lower tool 704, so that the hold-down devices 706 have just come into contact with the layer stack 204. The clamp openers 710, on the other hand, have not yet made contact with the workpiece carrier 200.

[0124] View (c) in Fig. 7B shows a subsequent position in which the upper tool 702 has moved even further toward the lower tool 704, so that the hold-down devices 706 now apply a compressive force to the layer stack 204 and thus additionally fix it to the workpiece carrier 200. The clamp openers 710 have also just come into contact with the respective associated clamps 208 of the workpiece carrier 200, more precisely with their rollers 310. However, the clamps 208 are still closed and thus still contribute to the fixation of the layer stack 204 to the workpiece carrier 200.

[0125] View (d) in Fig. 7B shows a further subsequent position in which the upper tool 702 has moved even further in the direction of the lower tool 704, so that the hold-down devices 706 continue to apply a compressive force to the layer stack 204 and thus fix the workpiece carrier 200. Each of the clamp openers 710 now presses on the roller 310 of the clamp 208 assigned to it, thereby exerting a torque on the clamp lever 304 of the clamp 308 that counteracts the spring action of the spring 308 and is stronger than the spring 308, so that the clamp opens and its clamping effect on the layer stack is released. The task of fixing the layer stack 204 to the workpiece carrier 200 has thus been transferred without interruption from the clamps 308 to the hold-down devices 706.

[0126] View (e) in Fig. 7C shows a further subsequent position in which the upper tool 702 has moved even further in the direction of the lower tool 704, so that compared to the position in view (d), the clamp levers 304 of the clamps 308 have been pivoted open even further by the pressure effect of the clamp openers 710 and completely clear the way for the press ram 714 to the layer stack 204, which continues to be fixed by the hold-down devices 706.

[0127] View (f) in Fig. 7C finally shows a further subsequent position in which the upper tool 702 has moved even further toward the lower tool 704, so that the press ram 714 has rested on the layer stack 204 and presses it against the workpiece carrier held by the lower tool 704, joining the layer stack 204 to form the laminate under pressure and, if necessary, heat from the heatable laminating tools 702 and / or 704. The hold-down devices 706 and the clamp openers 710 are now strongly compressed. Preferably, the surface of the press ram 714 contacting the layer stack 204 is dimensioned such that it completely covers or overlaps the surface of the layer stack 204 facing it.

[0128] The laminating press can then be opened by raising the upper tool 702, and the workpiece carrier 200, along with the former layer stack 204 it carries and which has now been converted into a laminate, can be transported out and further processed along the production line. Transporting out can be carried out, in particular, using the gripping device 604 (see Figures 6B and 6c). In particular, the mutual distance 602 between the workpiece carriers can also be varied again, in particular reduced, before, during, or after reaching the subsequent processing station (cooling device 108).

[0129] The initial loading of the workpiece carrier 200 at the stacking device 102 can be carried out in a comparable manner with regard to the actuation of the clamps 308. This means that the stacking device 102 also has clamp openers of the same or a different design as the clamp openers 710 in order to initially open the clamps 308 at least far enough by exerting pressure on the respective rollers 310 and thereby bring them into a corresponding loading position so that the layer stack 204 can be applied to the support surface of the workpiece carrier without being obstructed by the clamps 308. The loading position can, in particular, correspond to the position of the clamps 308 shown in view (f) in Fig. 7C.

[0130] Fig. 8 shows a longitudinal sectional view of an exemplary embodiment of a hold-down device 706 of the laminating device 100. Fig. 9 shows a top view of the hold-down device 706 from Fig. 8. The section line "AA" in Fig. 9 indicates the plane in which the longitudinal sectional view of Fig. 8 is shown, i.e., in a plane in which the central longitudinal axis 725 of the hold-down device 706 also lies. The top view shown in Fig. 9 corresponds to a view of the hold-down device 706 from the end of the hold-down device 706 shown on the left in Fig. 8.

[0131] In the following, reference is made simultaneously to Fig. 8 and Fig. 9.

[0132] In the embodiment of Figs. 8 and 9, the hold-down device 706 has a generally cylindrical shape, although other shapes are also possible, for example, shapes with a rectangular or octagonal cross-section. As already shown in Figs. 7A-C, one axial end of the hold-down device 706, namely the end shown on the right in Fig. 8, is intended to press a layer stack 204 or a laminate 204 produced therefrom against a workpiece carrier 200 in order to secure the layer stack 204 against slipping, in particular before or during the actual lamination process. At the end of the hold-down device 706 shown on the right in Fig. 8, it has an end surface 722, also referred to herein as the "first surface" 722. The first surface 722 can be provided with a non-stick coating 722 to counteract adhesion of the laminate 204.The first surface 722 can be as smooth as possible or have a certain roughness, in particular a roughness of less than 10 μm. In the example shown, the first surface 722 extends in a plane perpendicular to the longitudinal axis 725 of the hold-down device 706.

[0133] In Fig. 8, to the left of the first surface 722 is an elongated shaft 721. The shaft 721 has a bore 731 arranged concentrically with respect to the central longitudinal axis 725 of the hold-down device 706, which represents a first section 731 of a fluid channel 720. The hold-down spring 708 (see Fig. 7A-C), which is not shown in Figs. 8 and 9, can also be arranged in this bore 731. The end of the hold-down device 706 shown on the left in Fig. 8, opposite the first surface 722, which is also referred to here as the first end of the first section 731 of the fluid channel 720, is intended to be connected to a fluid source, for example a compressed air source (not shown). The shaft 721 is slightly tapered compared to the first surface 722 in order to guide the shaft 721 (see Fig.7A-C) without taking up more space in a plane perpendicular to the longitudinal axis 725, so that as much space as possible remains for the press rams 714.

[0134] The first section 731 or bore 731 is essentially designed as a blind hole recess. The second end of the first section 731, opposite the first end, is located near the first surface 722 but does not reach it. At this second end of the first section 731, several second sections 732 of the fluid channel 720 adjoin the first section 731; in the example shown, there are eight such second sections 732. The second sections 732 lead obliquely outward into the vicinity of the first surface 722, but do not open into this first surface 722, but rather at or in the cylindrical surface 723, which is also referred to herein as the second surface 723. In the example shown, eight outlet openings 724 of the second sections 732 of the fluid channel 720 are thus located in this second surface 723.These outlet openings 724 are distributed at equal angular intervals around the circumference of the hold-down device 706, in this case offset by 45° each. The eight outlet openings 724 are all centered in a plane that runs a short distance from and parallel to the first surface 722.

[0135] Since the second sections 732 of the fluid channel 720 at the second end of the first section 731 are in fluid communication with this first section 731, compressed air which is introduced into the fluid channel 720 at the first end (left in Fig. 8) of the first section 731 can flow through the first section 731 and then also through the second sections 732 and finally exit through the outlet openings 724. Because the second sections 732 are inclined in the region of the first surface 722 relative to this and also relative to the longitudinal axis 725 - in the example shown by 45° in each case - the compressed air flowing out of the outlet openings 724 is directed radially outwards and can thus act on a relatively large area of ​​the laminate 204. In addition, the inclination of the second sections 732 (iein particular due to the axial direction component of the course of the second sections 732) also a pressure on the laminate 204, which promotes the detachment of the laminate 204 from the first surface 722 of the hold-down device 706 when the hold-down device 706 is raised.

[0136] When manufacturing the second sections 732 of the fluid channel 720, for example, by means of an oblique bore from the outside of the hold-down device 706, the taper of the shaft 721 and the inclined course of the second sections 732 should be taken into account if necessary. In particular, it should be ensured that the bores of the second sections 732 do not penetrate the second surface at any critical points present—one such point is indicated by a small circle in Figure 8. This means that the second sections 732 should only be connected to the first section 731 and penetrate the second surface 723 at the outlet openings 724, and otherwise be hermetically sealed.

[0137] While embodiments have been described herein in which individual substrates of a layer stack are aligned horizontally and the laminating press applies pressure to the layer stack from above, it should be understood that the laminating device could also be used in a different orientation, or that alternative embodiments of laminating devices are conceivable in which individual substrates of a layer stack are not aligned horizontally, or in which the laminating press applies pressure to the layer stack not from above, but rather, for example, from below. Accordingly, directional terms or similar terms used herein, such as "above," "horizontal," "lift," etc., are to be interpreted to encompass such alternative orientations or embodiments.

[0138] Fig. 10 schematically shows a flow diagram of an exemplary method for laminating an electrochemical layer stack. After starting the method (40), a laminating device 100 is provided as described above (41). Furthermore, a layer stack 204 consisting of substrates stacked in layers to be bonded to form a laminate 204 by lamination is provided on the movable workpiece carrier 200; 200a, ..., 200d of the laminating device 100 (42). The layer stack 204 is then pressed (43) at least in places against the workpiece carrier 200; 200a, ..., 200d by means of the hold-down device 706 of the laminating device 100 in order to secure the layer stack 204 against slipping. Subsequently or simultaneously, the workpiece carrier 200; 200a, ..., 200d is subjected to pressure (44) such that the layer stack 204 is pressed against the workpiece carrier 200, 200a,..., 200d by means of the laminating press 106 of the laminating device 100 in order to bond the substrates of the layer stack 204 to form a laminate 204. The hold-down device 706 is then removed from the layer stack 204 or the laminate 204 produced therefrom (45) in order to release the layer stack 204 or the laminate 204 produced therefrom. In this case, the at least one fluid channel 720 of the hold-down device 706 is pressurized with a fluid to assist the release. The method can then end (46).

[0139] While at least one exemplary embodiment has been described above, it should be appreciated that a large number of variations exist. It should also be noted that the described exemplary embodiments are only non-limiting examples and are not intended to limit the scope, applicability, or configuration of the devices and methods described herein. Rather, the foregoing description will provide a guide to implementing at least one exemplary embodiment, with the understanding that various changes in the operation and arrangement of the elements described in an exemplary embodiment may be made without departing from the subject matter defined in the appended claims, as well as their legal equivalents.

[0140] 100 Laminating device

[0141] 102 Stacking device

[0142] 104 Preheating device

[0143] 106 Laminating press

[0144] 108 Cooling device

[0145] 110 Welding device

[0146] 112 if necessary, further processing equipment for the laminate, e.g.

[0147] Output device for the produced laminate or laminate stacker

[0148] 114 Transport path (outward path) of the workpiece carrier

[0149] 116 Transport route (outward journey) of the transport carrier

[0150] 118 common return transport path (return path) for workpiece carriers and

[0151] Transport carrier

[0152] 120 upper level

[0153] 122 middle level

[0154] 124 lower level

[0155] 126 radiators

[0156] 128 first (lower) heat sink

[0157] 130 second (upper) heat sink

[0158] 200, 200a-d Workpiece carrier, loaded with layer stack or already produced laminate

[0159] 202 Base plate of the workpiece carrier

[0160] 204 layer stack or already manufactured laminate

[0161] 206a electrical connection lugs for the positive pole of the layer stack / laminate

[0162] 206b Electrical connection lugs for negative pole of the layer stack / laminate

[0163] 208 clamp with spring-loaded clamp

[0164] 210 gripper pin

[0165] 300 Different views of terminal 208

[0166] 302 base part

[0167] 304 clamp lever

[0168] 306 Swivel axis of the clamp lever 304

[0169] 308 spring

[0170] 310 roller

[0171] 312 clamping piece

[0172] 314 spring carrier

[0173] 316 lock washer

[0174] 400 Transport carrier 402 Carrier plate

[0175] 404 Recess in carrier plate (depression or continuous opening)

[0176] 406 Stop piece for aligning a workpiece carrier on the

[0177] Transport carrier

[0178] 500 Preheating arrangement

[0179] 502 Induction heating, in particular surface induction heating

[0180] 504 Support structure for induction heating

[0181] 600 Arrangement of several workpiece carriers for parallel processing

[0182] 602 mutual distance between adjacent workpiece carriers

[0183] 700 Sequence of positions of the laminating press during laminating

[0184] 702 upper tool

[0185] 704 Lower tool

[0186] 706 hold-down device

[0187] 708 hold-down spring

[0188] 710 Staple Opener

[0189] 712 staple opener spring

[0190] 714 press ram

[0191] 720 fluid channel

[0192] 721 shaft

[0193] 722 first surface, non-stick coating

[0194] 723 second surface

[0195] 724 Exit opening

[0196] 725 central (longitudinal) axis, contact pressure direction

[0197] 731 first section, borehole

[0198] 732 second section

Claims

CLAIMS 1. A laminating device (100) for laminating an electrochemical layer stack (204), the laminating device (100) comprising: a movable first workpiece carrier (200; 200a) for supporting a layer stack (204) of individual substrates stacked one on top of the other in layers; a laminating press (106) for applying pressure to the layer stack (204) supported by the first workpiece carrier (200; 200a) such that the layer stack (204) is pressed against the first workpiece carrier (200; 200a) by means of the laminating press (106) in order to bond the substrates of the layer stack (204) to form a laminate (204);and at least one hold-down device (706), wherein the laminating device (100) is configured to secure the layer stack (204) against slipping from a time before or during the production of the laminate (204) by the laminating press (106) by means of at least some pressing of the layer stack (204) by means of the hold-down device (706) against the first workpiece carrier (200; 200a), wherein the laminating device (100) is configured to release the layer stack (204) or the laminate (204) produced therefrom by removing the hold-down device (706) from the layer stack (204) or the laminate (204) produced therefrom, wherein the hold-down device (706) has at least one fluid channel (720) to which a pressurized fluid can be applied to assist the release; 2. Laminating device (100) according to claim 1, wherein the at least one fluid channel (720) runs in or on the hold-down device (706).

3. Laminating device (100) according to claim 1 or 2, wherein the hold-down device (706) has a first surface (722) facing the workpiece carrier (200; 200a) or the layer stack (204), which is in contact with the layer stack (204) when it is pressed against it.

4. Laminating device (100) according to claim 3, wherein the at least one fluid channel (720) has an outlet opening (724) arranged in the region of the first surface (722).

5. Laminating device (100) according to claim 4, wherein the outlet opening (724) is not located in the first surface (722), in particular wherein the outlet opening (724) is arranged on a lateral, second surface (723) of the hold-down device (706).

6. Laminating device (100) according to claim 4 or 5, wherein the at least one fluid channel (720) in the region of the first surface (722) has a course which has a directional component parallel to the first surface (722).

7. Laminating device (100) according to one of claims 4 to 6, wherein the course of the at least one fluid channel (720) is inclined at least in the region of the first surface (722) by an angle α relative to the first surface (722) and is inclined by an angle β relative to a normal (725) on the first surface (722) or relative to the pressing direction (725) of the hold-down device (706), wherein the angle α is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60° and / or wherein the angle β is at least 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60°, in particular wherein the angle α has a value of 45° ± 10° or 45° ± 5° and / or the angle β has a value of 45° ± 10° or 45° ± 5°.

8. Laminating device (100) according to one of claims 4 to 7, wherein the at least one fluid channel (720) has a first section (731) and an adjoining second section (732), wherein the second section (732) opens into the outlet opening (724), wherein the course of the second section (732) of the at least one fluid channel (720) is inclined relative to the first surface (722) and is inclined relative to a normal (725) on the first surface (722) or relative to the pressing direction (725) of the hold-down device (706), and wherein the first section (731) of the at least one fluid channel (720) runs parallel or substantially parallel to a normal (725) on the first surface (722) or parallel to the pressing direction (725) of the hold-down device (706).

9. Laminating device (100) according to claim 8, wherein the hold-down device (706) has two or more fluid channels (720), in particular four or six or eight fluid channels (720), each with a first and an adjoining second section (732), wherein each of the second sections (732) opens into a respective outlet opening (724), wherein the Outlet openings (724), in particular uniformly or substantially uniformly, are distributed around the circumference of the hold-down device (706).

10. Laminating device (100) according to claim 8, wherein the hold-down device (706) has at least one fluid channel (720) with a single first section (731) and a plurality of adjoining second sections (732), in particular two or four or six or eight second sections (732), wherein each of the second sections (732) opens into a respective outlet opening (724), wherein the outlet openings (724) are distributed, in particular uniformly or substantially uniformly, on the circumference of the hold-down device (706).

11. Laminating device (100) according to claim 9 or 10, wherein several, in particular all, outlet openings (724) are centered in a plane which extends, in particular substantially, parallel to the first surface (722).

12. Laminating device (100) according to one of the preceding claims, wherein the surface area of ​​the first surface (722) or, if the laminating device (100) has a plurality of hold-down devices (706), the sum of the surface areas of the first surfaces (722) of the hold-down devices (706), is at most 20% or at most 15% or at most 10% or at most 5% or at most 3% or at least 1% or at least 2% or between about 1% and 3% or between about 2% and 3% of the surface area of ​​the workpiece carrier (200; 200a) intended to support the layer stack (204) or of the surface area of ​​the layer stack (204) or of the surface area of ​​the laminating press (106).

13. Laminating device (100) according to one of the preceding claims, wherein the first surface (722) is provided with a non-stick coating (722), in particular with a non-stick coating (722) comprising polytetrafluoroethylene, PTFE.

14. A method for laminating an electrochemical layer stack (204), the method comprising: Providing a laminating apparatus (100) according to any one of the preceding claims; Providing a layer stack (204) of layers stacked on top of each other to be connected by lamination to form a laminate (204) Substrates on the movable workpiece carrier (200; 200a,..., 200d) for supporting the layer stack (204); at least partially pressing the layer stack (204) by means of the hold-down device (706) against the first workpiece carrier (200; 200a) in order to secure the layer stack (204) against slipping, Applying pressure to the layer stack (204) carried by the workpiece carrier (200; 200a,...,200d) such that the layer stack (204) is pressed against the workpiece carrier (200a,...,200d) by means of the laminating press (106) in order to join the substrates of the layer stack (204) to form a laminate (204); Removing the hold-down device (706) from the layer stack (204) or the laminate (204) produced therefrom in order to release the layer stack (204) or the laminate (204) produced therefrom; and Applying a pressurized fluid to the at least one fluid channel (720) to assist in the release.

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