Component for a system of semiconductor technology and method for producing a component for a system of semiconductor technology

Abstract

A component (36, Mi) for a system of semiconductor technology (1) is provided with at least one electronic component containing information with respect to the component (36, Mi), for the purpose of contactless data exchange (50). The electronic component for contactless data exchange (50) is reversibly attached to the component (36, Mi).

Description

[0001] Component for a semiconductor technology system and method for producing a component for a semiconductor technology system

[0002] This application claims priority from German patent application No. 10 2023 209 748.6, the contents of which are incorporated herein by reference.

[0003] The invention relates to a component for a semiconductor technology system, wherein the component is provided with at least one electronic component for contactless data exchange containing information relating to the component.

[0004] The invention also relates to a method for producing a component for a semiconductor technology system, wherein the component is provided with an electronic component for contactless data exchange containing information relating to the component.

[0005] In the state of the art, semiconductor technology systems refer to systems used to manufacture or test microstructured devices or the components required for them. An example of such a system is a projection exposure system for photolithography.

[0006] Photolithography is used to manufacture microstructured components, such as integrated circuits. The projection exposure system used in this process comprises an illumination system and a projection system. The image of a mask (also called a reticle) illuminated by the illumination system is projected in a reduced size onto a substrate coated with a light-sensitive layer and arranged in the image plane of the projection system, for example, a silicon wafer, by means of the projection system. This transfers the mask structure to a light-sensitive coating on the substrate.

[0007] DE 10 2020 201 264 A1 discloses a method for tracking and identifying components of lithography systems, as well as a corresponding lithography system. The components are provided with a transponder that has a data memory on which data relating to the respective component is stored. The transponder is configured to receive wirelessly incoming signals from a reader and respond with data from the data memory. The transponder's data memory can store a wide variety of information relating to the component.

[0008] The described method is fundamentally applicable in semiconductor technology systems and improves component tracking, which was previously performed on paper. However, it still has certain shortcomings, such as the fact that the transponder could be considered disruptive during subsequent use of the component. Therefore, the object of the present invention is to create a component for a semiconductor technology system and a method for producing such a component, which allows monitoring of the component while avoiding disruption during use.

[0009] According to the invention, this object is achieved by the features mentioned in claim 1.

[0010] The component according to the invention for a semiconductor lithography system is provided with at least one electronic component for contactless data exchange containing information relating to the component. The electronic component for contactless data exchange is reversibly attached to the component.

[0011] The electronic component for contactless data exchange, which can be designed as a transponder, for example, enables the exchange of data containing information about the component with different receivers in order to be able to read out, forward or otherwise electronically process data relating to the component.

[0012] A particular advantage of the inventive solution is that the information relating to the component can be obtained from the electronic component for contactless data exchange in a wide variety of ways and using a wide variety of devices, in particular without the need to approach the component within a certain distance or to hold a reader or similar device to it. Rather, the location of the component can be determined very easily using suitable devices.

[0013] For example, this can also make it easy to locate a component within a factory site. For this purpose, sensors can be installed throughout the factory site, for example, which contact the electronic component for contactless data exchange and obtain information from it.

[0014] Furthermore, such electronic components for contactless data exchange usually have a data memory on which all relevant information can be stored directly, so that information, for example, regarding maintenance, repair or certain processing steps can be retrieved immediately and on site, in particular without the need to leave a clean room and / or a vacuum environment.

[0015] Because, according to the present invention, the electronic component for contactless data exchange is reversibly attached to the component, it can be removed from the component, for example, before the component is delivered to a customer. This is advantageous, for example, if the information contained on the electronic component for contactless data exchange is internal company information that is not intended to be passed on to third parties. Furthermore, this solution avoids any malfunction that may arise during subsequent use of the component by a customer, since the electronic component for contactless data exchange can already be separated from the component at this time.

[0016] In a very advantageous development of the invention, the component can be made of a glass ceramic, in particular Zerodur®. The solution according to the invention can be particularly advantageously applied to a component made of a glass ceramic, in particular Zerodur®, since such components may require a particularly high level of information exchange.

[0017] A further advantageous embodiment of the invention can consist in the electronic component for contactless data exchange being arranged in a recess of the component and / or in a recess of a receiving element attached to the component that accommodates the electronic component for contactless data exchange. This provides particularly good protection for the electronic component for contactless data exchange, which is accommodated in a type of pocket, so that no damage to the electronic component for contactless data exchange is to be expected, especially during production.In particular, if the electronic component for contactless data exchange is arranged in a recess of a receiving element attached to the component that receives the electronic component for contactless data exchange, the electronic component for contactless data exchange can be attached to the component quickly and easily, with minimal effort and without leaving any residue.

[0018] The protection of the electronic component for contactless data exchange can be further increased if the recess containing the electronic component for contactless data exchange is sealed by means of a cover element. In particular, this provides protection for the electronic component for contactless data exchange from external influences that may occur during production, such as grinding, lapping, or washing processes performed on the component, or from paints or processing chemicals applied to the component.

[0019] Furthermore, in an advantageous embodiment of the invention, a cavity within the recess not occupied by the electronic component for contactless data exchange can be filled with a sealant. This prevents movement, vibration, and the like of the electronic component for contactless data exchange during transport or similar processes. Furthermore, this prevents air pockets. Air pockets can also be avoided by attaching the electronic component for contactless data exchange to the component in an evacuated environment.

[0020] In order not to impede either the manufacturing process of the component or its subsequent use, it can further be provided that the electronic component for contactless data exchange is mounted outside an optically relevant area of ​​the component. The solution according to the invention can be used particularly advantageously if the component is designed as an optical element, in particular a lens, a mirror, or a diffractive optical element, or a mechanical element, in particular a mount, a frame, or a holding element for an element to be processed using the semiconductor technology system.

[0021] Claim 8 specifies a method for producing a component of a semiconductor technology system.

[0022] In this process, the component is provided with an electronic component for contactless data exchange that contains information about the component. The electronic component for contactless data exchange is reversibly attached to the component.

[0023] With the method according to the invention, the component can be manufactured in a very simple manner, wherein, due to the reversibility of the process, it is particularly advantageous that the electronic component for contactless data exchange can be removed from the component, whereby the same no longer needs to be present on the component in situations in which it is considered to be disruptive.

[0024] In a very advantageous development of the method, the component can be made of a glass ceramic, in particular Zerodur. With a component made of a glass ceramic, in particular Zerodur, it is particularly complex to reversibly attach such electronic components for contactless data exchange to the component, which can, however, be achieved with the method according to the invention.

[0025] A further advantageous embodiment of the method can consist in connecting the electronic component for contactless data exchange to the component by means of additive manufacturing, bonding, or laser welding in such a way that the electronic component for contactless data exchange can be separated from the component. In a further embodiment of the method, the electronic component is fixed to the component by magnetic force, but without being connected to the component by creating chemical bonds.Connecting the electronic component for contactless data exchange to the component using additive manufacturing, bonding, magnetic force, or laser welding is particularly advantageous when the component is made of a glass ceramic, especially Zerodur, as this creates a secure yet reversible connection between the electronic component for contactless data exchange and the component. In this context, it is also possible to pre-fix the electronic component for contactless data exchange before connecting it to the component. Pre-fixing can be achieved, for example, using one or more magnets.

[0026] Furthermore, an advantageous embodiment of the method can consist in that the electronic component for contactless data exchange is arranged in a recess of the component and / or in a recess of a receiving element attached to the component which receives the electronic component for contactless data exchange, wherein the recess with the electronic component for contactless data exchange arranged therein is sealed by means of a cover element, and wherein the cover element or the receiving element attached to the component is connected to the component by means of adhesive bonding or laser welding. This enables particularly secure protection of the electronic component for contactless data exchange. The advantage of using a laser is, among other things, that no additional material is required, which prevents contamination, and that there is only minimal impact on the component.

[0027] In order to reliably prevent interference by the electronic component for contactless data exchange, it can further be provided that the cover element is separated from the recess and / or the electronic component for contactless data exchange is removed from the recess.

[0028] Furthermore, it can be provided that the electronic component for contactless data exchange is separated from the component by laser cutting after use. This method allows for a particularly simple separation of the electronic component for contactless data exchange and the component.

[0029] The invention further relates to a system for semiconductor technology comprising at least one component according to the invention. The invention also extends to an electronic component manufactured using a corresponding semiconductor technology system, wherein the component preferably has structures in the micrometer and / or nanometer range.

[0030] In the context of the present invention, "system for semiconductor technology" refers to any system that can be used to manufacture or inspect microstructured devices or the components required for them. In addition to projection exposure systems for photolithography, this also includes, in particular, inspection systems, especially for masks or wafers, as well as metrology systems with which masks, wafers, or other optical elements, such as mirrors, can be measured. Increased variability in illumination can improve measurement results.

[0031] Features described in connection with one of the subject matters of the invention, namely the component according to the invention, the method according to the invention, the system according to the invention for semiconductor technology, or the electronic component according to the invention, can also be advantageously implemented for the other subject matters of the invention. Likewise, advantages mentioned in connection with one of the subject matters of the invention can also be understood in relation to the other subject matters of the invention. It should also be noted that terms such as "comprising," "having," or "with" do not exclude other features or steps. Furthermore, terms such as "a" or "the," which refer to a singular number of steps or features, do not exclude a plurality of features or steps—and vice versa.

[0032] In a purist embodiment of the invention, however, it may also be provided that the features introduced in the invention with the terms "comprising," "having," or "with" are listed exhaustively. Accordingly, one or more lists of features may be considered complete within the scope of the invention, for example, for each claim. The invention may, for example, consist exclusively of the features mentioned in claim 1.

[0033] In the following, embodiments of the invention are described in more detail with reference to the drawing.

[0034] The figures each show preferred embodiments in which individual features of the present invention are illustrated in combination with one another. Features of one embodiment can also be implemented independently of the other features of the same embodiment and can therefore be readily combined by a person skilled in the art with features of other embodiments to form further useful combinations and subcombinations.

[0035] In the figures, functionally identical elements are provided with the same reference numerals.

[0036] They show:

[0037] Figure 1 is a schematic representation of a projection exposure system for photolithography with a component according to the invention;

[0038] Figure 2 shows a side view of a first embodiment of a component according to the invention in a first state;

[0039] Figure 3 shows the component according to the invention from Figure 2 in a second state;

[0040] Figure 4 is a plan view of a second embodiment of the component according to the invention; and

[0041] Figure 5 is a side view of a third embodiment of the component according to the invention.

[0042] Figure 1 shows a projection exposure system 1 for photolithography as an example of a system for semiconductor technology in a schematic meridional section. The projection exposure system 1 comprises an illumination system 10 and a projection system 20. With the aid of the illumination system 10, an object field 11 is illuminated in an object plane or reticle plane 12. The illumination system 10 for this purpose comprises an exposure radiation source 13, which, in the illustrated embodiment, emits illumination radiation at least comprising useful light in the EUV range, i.e., in particular, with a wavelength between 5 nm and 30 nm. The exposure radiation source 13 can be a plasma source, for example an LPP source (laser produced plasma, plasma generated by means of a laser) or a DPP source (gas discharge produced plasma, plasma generated by means of a gas discharge).It can also be a synchrotron-based radiation source. The exposure radiation source 13 can also be a free-electron laser (FEL).

[0043] The illumination radiation emanating from the exposure radiation source 13 is first focused in a collector 14. The collector 14 can be a collector with one or more ellipsoidal and / or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 14 can be exposed to the illumination radiation at grazing incidence (Gl), i.e., at angles of incidence greater than 45°, or at normal incidence (NI), i.e., at angles of incidence less than 45°. The collector 14 can be structured and / or coated, on the one hand, to optimize its reflectivity for the useful radiation and, on the other hand, to suppress stray light.

[0044] After the collector 14, the illumination radiation propagates through an intermediate focus in an intermediate focal plane 15. If the illumination system 10 is constructed in a modular design, the intermediate focal plane 15 can generally be used for the - also structural - separation of the illumination system 10 into a radiation source module, comprising the exposure radiation source 13 and the collector 14, and the illumination optics 16 described below. With such a separation, the radiation source module and illumination optics 16 then together form a modular illumination system 10.

[0045] The illumination optics 16 comprises a deflecting mirror 17. The deflecting mirror 17 can be a flat deflecting mirror or, alternatively, a mirror with a beam-influencing effect beyond the pure deflection effect. Alternatively or additionally, the deflecting mirror 17 can be designed as a spectral filter that separates a useful light wavelength of the illumination radiation from stray light of a different wavelength.

[0046] The deflecting mirror 17 deflects the radiation originating from the exposure radiation source 13 onto a first facet mirror 18. If the first facet mirror 18 is arranged—as in the present case—in a plane of the illumination optics 16 that is optically conjugated to the reticle plane 12 as a field plane, it is also referred to as a field facet mirror.

[0047] The first facet mirror 18 comprises a plurality of micromirrors 18', each of which can be individually pivoted about two mutually perpendicular axes, for the controllable formation of facets. Each micromirror 18' is preferably equipped with an orientation sensor (not shown) for determining the orientation of the micromirror 18'. The first facet mirror 18 is thus a microelectromechanical system (ME MS system), as described, for example, in DE 10 2008 009 600 A1.

[0048] In the beam path of the illumination optics 16, a second facet mirror 19 is arranged downstream of the first facet mirror 18, resulting in a double-faceted system whose basic principle is also referred to as a honeycomb condenser (fly's eye integrator). If the second facet mirror 19 is arranged in a pupil plane of the illumination optics 16—as in the illustrated embodiment—it is also referred to as a pupil facet mirror. However, the second facet mirror 19 can also be arranged at a distance from a pupil plane of the illumination optics 16, whereby the combination of the first and second facet mirrors 18, 19 results in a specular reflector, as described, for example, in US 2006 / 0132747 A1, EP 1 614 008 B1, and US 6,573,978.

[0049] The second facet mirror 19 does not necessarily have to be constructed from pivotable micromirrors, but can instead comprise individual facets formed from one or a manageable number of mirrors that are significantly larger than micromirrors, which are either fixed or can only be tilted between two defined end positions. However, as shown, it is also possible to provide the second facet mirror 19 with a microelectromechanical system comprising a plurality of micromirrors 19' that can each be individually pivoted about two mutually perpendicular axes, each preferably comprising an orientation sensor.

[0050] With the help of the second facet mirror 19, the individual facets of the first facet mirror 18 are imaged into the object field 11, which is usually only an approximate image. The second facet mirror 19 can be the last beam-forming mirror or actually the last mirror for the illumination radiation in the beam path before the object field 11.

[0051] Each facet of the second facet mirror 19 is assigned to exactly one of the facets of the first facet mirror 18 to form an illumination channel for illuminating the object field 11. This can, in particular, result in illumination according to the Köhler principle.

[0052] The facets of the first facet mirror 18 are each imaged by an associated facet of the second facet mirror 19, superimposed on one another, to illuminate the object field 11. The illumination of the object field 11 is as homogeneous as possible. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0053] By selecting the illumination channels used, which is easily possible by appropriately adjusting the micromirrors 18' of the first facet mirror 18, the intensity distribution in the entrance pupil of the projection system 20 described below can also be adjusted. This intensity distribution is also referred to as the illumination setting. It may also be advantageous not to arrange the second facet mirror 19 exactly in a plane that is optically conjugated to a pupil plane of the projection system 20. In particular, the pupil facet mirror 19 can be arranged tilted relative to a pupil plane of the projection system 20, as described, for example, in DE 10 2017 220 586 A1.

[0054] In the arrangement of the components of the illumination optics 16 shown in Figure 1, however, the second facet mirror 19 is arranged on a surface conjugated to the entrance pupil of the projection system 20. Deflecting mirror 17 and the two facet mirrors 18, 19 are tilted both relative to the object plane 12 and relative to each other.

[0055] In an alternative, not-shown embodiment of the illumination optics 16, a transmission optics comprising one or more mirrors can be provided in the beam path between the second facet mirror 19 and the object field 11. The transmission optics can, in particular, comprise one or two mirrors for normal incidence (NL mirrors, normal incidence mirrors) and / or one or two mirrors for grazing incidence (GL mirrors, grazing incidence mirrors). With an additional transmission optics, different positions of the entrance pupil for the tangential and sagittal beam path of the projection system 20 described below can be taken into account.

[0056] Alternatively, it is possible to dispense with the deflection mirror 17 shown in Figure 1, for which purpose the facet mirrors 18, 19 are then to be suitably arranged opposite the radiation source 13 and the collector 14.

[0057] With the help of the projection system 20, the object field 11 in the reticle plane 12 is transferred to the image field 21 in the image plane 22.

[0058] For this purpose, the projection system 20 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0059] In the example shown in Figure 1, the projection system 20 comprises six mirrors Mi to Me. Alternatives with four, eight, ten, twelve, or a different number of mirrors Mi are also possible. The penultimate mirror Me and the last mirror Me each have a passage opening for the illumination radiation, thus making the projection system 20 shown a doubly obscured optics. The projection system 20 has an image-side numerical aperture that is greater than 0.3 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0060] The reflection surfaces of the mirrors Mi can be designed as freeform surfaces without a rotational symmetry axis. Alternatively, the reflection surfaces of the mirrors Mi can also be designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape. The mirrors Mi, like the mirrors of the illumination optics 16, can have highly reflective coatings for the illumination radiation. These reflective coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0061] The projection system 20 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 11 and a y-coordinate of the center of the image field 21. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 12 and the image plane 22.

[0062] The projection system 20 can, in particular, be anamorphic, i.e., it has, in particular, different image scales ßx, ßy in the x and y directions. The two image scales ßx, ßy of the projection system 20 are preferably (ßx, ßy) = (+ / - 0.25, / +- 0.125). An image scale ß of 0.25 corresponds to a reduction in the ratio 4:1, while an image scale ß of 0.125 results in a reduction in the ratio 8:1. A positive sign for the image scale ß means an image without image inversion, a negative sign an image with image inversion.

[0063] Other magnifications are also possible. Magnifications ßx and ßy with the same sign and absolutely identical in the x and y directions are also possible.

[0064] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 11 and the image field 21 can be the same or different, depending on the design of the projection system 20. Examples of projection systems 20 with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.

[0065] The projection system 20 can, in particular, have a homocentric entrance pupil. This can be accessible. But it can also be inaccessible.

[0066] A reticle 30 (also called a mask) arranged in the object field 11 is illuminated by the illumination system 10 and transferred to the image plane 21 by the projection system 20. The reticle 30 is held by a reticle holder 31. The reticle holder 31 can be displaced, in particular in a scanning direction, via a reticle displacement drive 32. In the illustrated embodiment, the scanning direction runs in the y-direction.

[0067] A structure on the reticle 30 is imaged onto a light-sensitive layer of a wafer 35 arranged in the region of the image field 21 in the image plane 22. The wafer 35 is held by a wafer holder 36. The wafer holder 36 can be displaced, in particular along the y-direction, via a wafer displacement drive 37. The displacement of the reticle 30, on the one hand, via the reticle displacement drive 32 and, on the other hand, of the wafer 35, via the wafer displacement drive 37, can be synchronized with one another. Figure 2 shows a component, designed in the present case as the wafer holder 36 described above, for the semiconductor technology system, in this case the projection exposure system 1. The component described in more detail below could, however, also be one of the mirrors Mi, a lens (not shown), a mount (not shown), or another optically relevant component of the projection exposure system 1.Preferably, the component 36 or Mi consists of a glass ceramic, in particular Zerodur.

[0068] The component 36 is provided with at least one electronic component for contactless data exchange 50 containing information relating to the component 36. The electronic component for contactless data exchange 50 is reversibly attached to the component 36. As a result, the electronic component for contactless data exchange 50 can be removed from the component 36 at any time and with minimal effort.

[0069] The electronic component for contactless data exchange 50 can, for example, be designed as a transponder, in particular as an RFID or NFC transponder, and it can have a data memory in which complex or detailed data of the component 36 and, if applicable, also its subcomponents can be stored, in particular also with regard to an individualization of the component 36 and / or customer-specific features. A wide variety of data can be stored in the data memory, in particular: data for identifying the type of component 36; actual data for the production of the component 36; data relating to an individualization and / or a customer-specific adaptation of the component 36; data relating to the affiliation of the component 36 to a specific lithography system, in particular an individualized and / or customer-specific lithography system;Data concerning properties of component 36 which cause it to deviate within the specifications from other components of the same type; measurement data of component 36; data concerning a general overhaul, improvement, conversion, refurbishment or retrofitting of component 36; data concerning the service, commissioning, repair and / or maintenance of component 36; data concerning specific manufacturing steps of component 36, such as special manufacturing processes for individual or all process steps; data concerning process history; data concerning the material or materials of component 36; data concerning the calibration of component 36; data concerning the processing of component 36; data concerning production characteristics; data concerning product characteristics; data concerning subcomponents of component 36;Data relating to the hardware of component 36 and / or the type, configuration, arrangement, processing, or condition of the subcomponents of component 36; data relating to suppliers; data relating to customers; data relating to additional information; the number assigned to component 36 in an inventory management system. One, several, or all of the aforementioned data can also be stored on the data storage device for a subcomponent, several subcomponents, a group of subcomponents, or all subcomponents of component 36. Preferably, electronic component for contactless data exchange 50 is mounted outside an optically relevant area of ​​component 36. In the illustrated embodiment, in which the component is wafer holder 36, electronic component for contactless data exchange 50 can be mounted in an edge or corner area of ​​wafer holder 36.

[0070] In the embodiment of component 36 shown in Figures 2 and 3, the electronic component for contactless data exchange 50 is arranged in a recess 51 of component 36, which can be previously created by milling or another suitable method. The recess 51, with the electronic component for contactless data exchange 50 arranged therein, is closed by a cover element 52, preferably in a hermetically sealed manner. The cover element 52 is preferably connected to component 36 by gluing or laser welding. Furthermore, a cavity 53, which results in the recess 51 due to the fact that the electronic component for contactless data exchange 50 is smaller than the recess 51, is filled with a sealant or potting compound 54, whereby the electronic component for contactless data exchange 50 is cast into the recess 51.

[0071] In addition to the procedure described above, the electronic component for contactless data exchange 50 can be connected to the component 36, for example, by means of additive manufacturing, bonding, laser welding, or another suitable method. This connection is such that the electronic component for contactless data exchange 50 can be separated from the component 36. This separation or detachment can take place, for example, by laser cutting, in particular after the use of the electronic component for contactless data exchange 50, in particular before delivery to a customer. For both laser welding and laser cutting, an ultrashort pulse laser, for example, can be used. Separation by breaking out is also possible.For this purpose, a predetermined breaking point, which can be separated mechanically or thermally, for example, or something similar, can be provided in the area where the electronic component for contactless data exchange 50 is attached to the component 36. Furthermore, it is also possible to remove the electronic component for contactless data exchange 50 from the component 36 in such a way that the electronic component for contactless data exchange 50 is subsequently no longer functional or is destroyed. For example, this could be achieved by removing the electronic component for contactless data exchange 50 from the component 36 by grinding, lasering, or in a similar way. Furthermore, it is possible to render the electronic component for contactless data exchange 50 inoperable, for example by rendering it inoperable by the application of force, heat, acid, or in some other way.These possibilities are also encompassed by the "reversible attachment" of the electronic component for contactless data exchange 50 to the component 36. Of course, it must be ensured that the component 36 is not damaged.

[0072] If the use of the electronic component for contactless data exchange 50 also includes use during delivery or use by the customer, subsequent separation is also conceivable. Figure 3 shows the state in which the electronic component for contactless data exchange 50 is separated from the component 36. When separating the electronic component for contactless data exchange 50 from the component 36, for example, the cover element 52 can be separated from the recess 51.

[0073] In the embodiment shown in Figure 4 of the component, which is again designed as the wafer holder 36, a receiving element 55 is provided which has a recess 56 which, in terms of its function, essentially corresponds to the recess 51 according to Figures 2 and 3. Accordingly, the electronic component for contactless data exchange 50 is arranged in the recess 56 of the receiving element 55. In this embodiment, the receiving element 55 has a similar function to the cover element 52: The receiving element 55 is attached to the component 36 with the electronic component for contactless data exchange 50 arranged in the recess 56 of the receiving element 55, wherein the recess 56 is sealed by this connection. The connection of the receiving element 55 to the component 36 can again be achieved by means of laser welding. The use of the sealing agent or potting compound 54 described above is also possible.

[0074] When separating the electronic component for contactless data exchange 50 from the component 36, for example, the receiving element 55 can be separated from the component 36 in order to remove the electronic component for contactless data exchange 50 from the recess 56 and thereby separate it from the component 36. The separation of the receiving element 55 from the component 36 can be achieved, for example, by laser cutting.

[0075] Both the cover element 52 and the receiving element 55, like component 36, are preferably made of Zerodur. If component 36 is not made of Zerodur, the cover element 52 and the receiving element 55 should be made of a material with an expansion coefficient equal to or at least similar to that of the material of component 36.

[0076] Figure 5 shows a further embodiment of component 36, in which the reversible attachment of the electronic component for contactless data exchange 50 to component 36 is effected by magnetic force. The electronic component for contactless data exchange 50 is connected to a magnetic component 57 and enclosed in a receiving element 58. In this case, the receiving element 58 consists of two half-shells joined together by laser welding, which are preferably made of glass or another suitable material. The receiving element 58, with the electronic component for contactless data exchange 50 and the magnetic component 57 enclosed therein, is attached to component 36 by resting against the component, and by having a further magnetic component 57 arranged on the opposite side. One of the magnetic components 57 is a magnet.

[0077] I Projection exposure system

[0078] 10 Lighting system

[0079] II Object field

[0080] 12 Object plane or reticle plane

[0081] 13 Exposure radiation source

[0082] 14 Collector

[0083] 15 Intermediate focal plane

[0084] 16 Lighting optics

[0085] 17 Deflecting mirrors

[0086] 18 first facet mirror

[0087] 18' micromirror

[0088] 19 second facet mirror

[0089] 19' micromirror

[0090] 20 projection system

[0091] 21 image field

[0092] 22 Image plane

[0093] 30 reticles

[0094] 31 reticle holders

[0095] 32 Reticle displacement drive

[0096] 35 wafers

[0097] 36 wafer holders

[0098] 37 Wafer relocation drive

[0099] 50 electronic components for contactless data exchange

[0100] 51 recess

[0101] 52 Cover element

[0102] 53 Cavity

[0103] 54 Sealants

[0104] 55 receiving element

[0105] 56 recess

[0106] 57 Magnetic component

[0107] 58 receiving element

Claims

Patent claims:

1. Component (36, Mi) for a semiconductor technology system (1), wherein the component (36, Mi) is provided with at least one electronic component for contactless data exchange (50) having information relating to the component (36, Mi), characterized in that the electronic component for contactless data exchange (50) is reversibly attached to the component (36, Mi).

2. Component (36, Mi) according to claim 1, characterized in that the component (36, Mi) consists of a glass ceramic, in particular Zerodur.

3. Component (36, Mi) according to claim 1 or 2, characterized in that the electronic component for contactless data exchange (50) is arranged in a recess (51) of the component (36, Mi) and / or in a recess (56) of a receiving element (55) which receives the electronic component for contactless data exchange (50) and is attached to the component (36, Mi).

4. Component (36, Mi) according to claim 3, characterized in that the recess (51) with the electronic component for contactless data exchange (50) arranged therein is sealed by means of a cover element (52).

5. Component (36, Mi) according to claim 3 or 4, characterized in that a cavity (53) not occupied by the electronic component for contactless data exchange (50) within the recess (51, 56) is filled with a sealing agent (54).

6. Component (36, Mi) according to one of claims 1 to 5, characterized in that the electronic component for contactless data exchange (50) is mounted outside an optically relevant area of ​​the component (36, M).

7. Component (36, Mi) according to one of claims 1 to 6, characterized in that the component (36, M) is designed as an optical element, in particular a lens, a mirror or a diffractive optical element, or a mechanical element, in particular a mount, a frame or a holding element for an element to be processed by means of the semiconductor technology system (1).

8. A method for producing a component (36, Mi) for a semiconductor technology system (1), wherein the component (36, Mi) is provided with an electronic component for contactless data exchange (50) having information relating to the component (36, Mi), characterized in that the electronic component for contactless data exchange (50) is reversibly attached to the component (36, Mi).

9. Method according to claim 8, characterized in that the component (36, Mi) consists of a glass ceramic, in particular Zerodur.

10. The method according to claim 8 or 9, characterized in that the electronic component for contactless data exchange (50) is connected to the component (36, Mi) by means of additive manufacturing, gluing, laser welding or magnetic force in such a way that the electronic component for contactless data exchange (50) is separable from the component (36, Mi).

11. Method according to one of claims 8 to 10, characterized in that the electronic component for contactless data exchange (50) is arranged in a recess (51) of the component (36, Mi) and / or in a recess (56) of a receiving element (55) which is attached to the component (36, Mi) and which receives the electronic component for contactless data exchange (50), wherein the recess (51) with the electronic component for contactless data exchange (50) arranged therein is sealed by means of a cover element (52), and wherein the cover element (52) or the receiving element (55) attached to the component (36, Mi) is connected to the component (36, Mi) by means of gluing or laser welding.

12. The method according to claim 11, characterized in that the cover element (52) is separated from the recess (51) and / or the electronic component for contactless data exchange (50) is removed from the recess (51).

13. Method according to one of claims 8 to 12, characterized in that the electronic component for contactless data exchange (50) is separated from the component (36, M) by laser cutting after its use.

14. A semiconductor technology plant (1) comprising at least one component (36, Mi) according to one of claims 1 to 7.

15. Electronic component, characterized in that the component is manufactured using a semiconductor technology system (1) according to claim 14, wherein the component preferably has structures in the micrometer and / or nanometer range.

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