Heat dissipation device

Abstract

A heat dissipation device is disclosed. A heat dissipation device according to an aspect of the present invention may include: multiple micro-channels in which working fluids are respectively filled and which apply capillary forces to the working fluids; an evaporation part in which the ends of the multiple micro-channels are arranged and the working fluids are vaporized by receiving heat from an external heat source; and a condensation part, in which parts of the micro-channels are arranged, the parts being spaced apart from the evaporation part, in which the vaporized working fluids are liquefied, and which releases heat, wherein the ends of the multiple micro-channels meet in the evaporation part to form a merge area in which the working fluids are merged; in the merge area, the multiple micro-channels have a structure in which the micro-channels are concentrated toward the evaporation part; and the multiple micro-channels are divided and branched by multiple partition walls.

Description

heat sink

[0001] The present invention relates to a heat dissipation device. More specifically, it relates to a heat dissipation device using a vibrating heat pipe structure.

[0002]

[0003] For the stable operation of electronic devices, it is crucial to effectively dissipate localized heat generated by electronic components. Using a heat dissipating device can disperse localized heat without additional energy input, thereby increasing the surface area available for cooling.

[0004] Figure 1 is a drawing showing a heat dissipation device using a vibrating heat pipe according to the prior art.

[0005] Referring to Fig. 1, among the heat dissipation devices, pulsating heat pipes (PHPs) are formed by partially filling the inside of a microtube (1) with a working fluid while maintaining a vacuum, and when a portion of the pulsating heat pipe is heated, heat is transferred from the evaporation section (4) to the condensation section (5) through the vibration of a liquid slug (2) and a vapor plug (3).

[0006] However, conventional oscillating heat pipes with multiple, regularly arranged microtubular structures exhibit low thermal performance under localized heating conditions. To address this issue, a oscillating heat pipe with a structure incorporating integrated microchannels has been proposed.

[0007] However, the oscillating heat pipe with a structure in which microchannels are merged has a problem in that the thermal performance gradually deteriorates as the heat input increases under vertical conditions, and the thermal performance is low even under horizontal conditions.

[0008]

[0009] An embodiment of the present invention provides a heat dissipation device that uses a vibrating heat pipe and improves heat dissipation performance even for a local heat source.

[0010]

[0011] According to one aspect of the present invention, there is provided a heat dissipation device including a plurality of microchannels, each of which is filled with a working fluid and exerts a capillary force on the working fluid, an evaporation section in which ends of the plurality of microchannels are arranged and heat is received from an external heat source to vaporize the working fluid, and a condensation section in which a portion of the microchannels spaced apart from the evaporation section is arranged and the vaporized working fluid is liquefied and dissipates heat, wherein in the evaporation section, the ends of the plurality of microchannels meet to form a merging area in which the working fluids are merged, and in the merging area, the plurality of microchannels have a structure in which they are concentrated toward the evaporation section, and the plurality of microchannels are divided and branched by a plurality of partition walls.

[0012] At this time, the partition wall placed in the central region of the merged region may be placed further apart from the central region of the evaporation section than the partition walls placed in other parts.

[0013] At this time, the partition wall placed in the central area of ​​the merged area may have a structure surrounded by other partition walls adjacent to both sides.

[0014] Additionally, the ends of the other adjacent baffles on both sides may protrude further toward the center of the evaporation section than the ends of the baffles arranged in the central area of ​​the merged area.

[0015] Additionally, the microchannel may have a one-way path that starts from the evaporation section, passes through the condensation section, and returns.

[0016] At this time, in the plurality of microchannels, paths starting from the evaporation section, passing through the condensation section, and returning can be formed independently of each other.

[0017] In addition, the microchannel may be formed in a region adjacent to the condensation section so that the width of the path flowing from the evaporation section to the condensation section is greater than the width of the path returning from the condensation section to the evaporation section.

[0018] Meanwhile, in the path from the evaporation section to the condensation section, an expansion section whose width increases as it moves from the evaporation section to the condensation section may be formed.

[0019] In addition, the microchannel may be formed with a curved portion in the condensation section, one side of the curved portion may be connected to a path flowing from the evaporation section to the condensation section, and the other side of the curved portion may be connected to a path returning from the condensation section to the evaporation section.

[0020] In addition, each substrate has a flat structure and further includes a pair of substrates arranged facing each other, and the microchannel can be formed between the pair of substrates.

[0021] According to another aspect of the present invention, there is provided a heat dissipation device including a plurality of microtubes, each of which is filled with a working fluid and exerts a capillary force on the working fluid, an evaporation section in which both ends of the plurality of microtubes are arranged and heat is received from an external heat source to vaporize the working fluid, and a condensation section in which a portion of the microtubes spaced apart from the evaporation section is arranged and the vaporized working fluid is liquefied and dissipates heat, wherein in the evaporation section, the ends of the plurality of microtubes are connected to form a merging area in which the working fluids are merged, and in the merging area, the plurality of microtubes have a structure in which they are concentrated toward the evaporation section, and the plurality of microtubes branch out at a joining portion where tube walls are joined.

[0022] At this time, a heat dissipation device is provided in which the connecting portion arranged in the central region of the merging region is arranged further apart from the central region of the evaporation portion than the connecting portions arranged in other regions.

[0023] At this time, the connecting portion arranged in the central region of the merging region may have a structure surrounded by the tube walls of the microtubes adjacent on both sides.

[0024] Additionally, the microtube may be formed in a region adjacent to the condensation section so that the diameter of the path flowing from the evaporation section to the condensation section is larger than the diameter returning from the condensation section to the evaporation section.

[0025] At this time, an expansion section whose diameter increases as it moves from the evaporation section to the condensation section may be formed in the path flowing from the evaporation section to the condensation section.

[0026] Meanwhile, the microtube may have a bent portion formed in the condensation section, one side of the bent portion may be connected to a path flowing from the evaporation section to the condensation section, and the other side of the bent portion may be connected to a path returning from the condensation section to the evaporation section.

[0027]

[0028] According to an embodiment of the present invention, a heat dissipation device can secure high heat dissipation performance even under high heat input conditions of local heat generation.

[0029] Additionally, the heat sink can secure high heat dissipation performance regardless of the placement direction.

[0030]

[0031] Figure 1 is a drawing showing a heat dissipation device using a vibrating heat pipe according to the prior art.

[0032] Figure 2 is a drawing showing a heat dissipation device according to one embodiment of the present invention.

[0033] Figure 3 is a detailed drawing showing an evaporator in a heat dissipation device according to one embodiment of the present invention.

[0034] Figures 4 and 5 are detailed drawings showing a merged area in a heat dissipation device according to one embodiment of the present invention.

[0035] Figure 6 is a detailed drawing showing a condenser in a heat dissipation device according to one embodiment of the present invention.

[0036] FIG. 7 is a detailed drawing showing a path toward a condenser in a heat dissipation device according to one embodiment of the present invention.

[0037] Figure 8 is a graph evaluating the performance of a heat dissipation device according to one embodiment of the present invention.

[0038] Figures 9 and 10 are drawings showing a heat dissipation device according to another embodiment of the present invention.

[0039]

[0040] The terminology used in this application is solely for the purpose of describing specific embodiments and is not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

[0041] In this application, when a part is said to "include" a component, unless otherwise specifically stated, this does not exclude other components, but rather implies the inclusion of additional components. Furthermore, throughout the specification, the term "on" means located above or below the target part, and does not necessarily mean located above the direction of gravity.

[0042] In addition, the term "coupling" is used to refer not only to cases where each component is physically in direct contact with the other components in the contact relationship between the components, but also to encompass cases where another component is interposed between the components and the other components are in contact with each other.

[0043] Additionally, while terms such as first, second, etc. may be used to describe various components, these components should not be limited by these terms. These terms are used solely to distinguish one component from another.

[0044] The size and thickness of each component shown in the drawing are arbitrarily shown for convenience of explanation, and therefore the present invention is not necessarily limited to what is shown.

[0045] Hereinafter, an embodiment of a heat dissipation device according to the present invention will be described in detail with reference to the attached drawings. In describing with reference to the attached drawings, identical or corresponding components are assigned the same drawing numbers, and redundant descriptions thereof will be omitted.

[0046] Figure 2 is a drawing showing a heat dissipation device according to one embodiment of the present invention.

[0047] Referring to FIG. 2, a heat dissipation device (100) according to one embodiment of the present invention includes a plurality of microchannels (110), an evaporation section (120), and a condensation section (130).

[0048] The microchannel (110) is filled with a working fluid (10, see FIG. 5) and applies capillary force to the working fluid (10). Since the heat dissipation device (100) of the present invention performs heat dissipation by utilizing the principle of a vibrating heat pipe, a microchannel (110) that forms a capillary force on the working fluid (10) is required to form a slug unit in which a liquid phase and a gas phase appear alternately.

[0049] Referring to FIG. 2, a plurality of microchannels (110) of the present embodiment are formed, and may have a small width (or diameter) that generates a capillary phenomenon so as to form a capillary force in the working fluid (10). The microchannels (110) form a path connecting the evaporator (120) and the condenser (130), and in the microchannels (110), the liquid and gas phases of the working fluid (10) self-oscillate, thereby transferring heat from the evaporator (120) to the condenser (130). In the condenser (130) of the present embodiment, the path of the microchannels (110) that move the working fluid (10) from the evaporator (120) to the condenser (130) and the path of the microchannels (110) that move the working fluid (10) from the condenser (130) to the evaporator (120) may be connected to each other to form a circulation path of the working fluid (10).

[0050] At this time, the interior of the microchannel (110) is in a vacuum state, and the working fluid (10) can be partially filled into the interior of the microchannel (110).

[0051] In this embodiment, a plurality of microchannels (110) may have a closed loop structure that is connected to each other and sealed from the outside. When a vacuum is created inside the closed loop and an appropriate amount of working fluid is injected, an aligned slug-train unit composed of liquid slugs and vapor plugs is formed inside the closed loop. At this time, when heat is applied to one side of the closed loop, the aligned slug-train unit performs high-speed self-oscillation, and through this, heat can be transferred from the evaporator (120) to the condenser (130). A through-hole (115) that can inject or discharge working fluid (10) and can be closed may be formed in the closed loop structure. In this embodiment, by installing a pair of through holes (115), when injecting or discharging the working fluid (10), the working fluid (10) or air is injected from one side and sucked in by a vacuum device or the like from the other side, so that efficient filling and discharging can be achieved.

[0052] At this time, when the main operating temperature of the evaporator (120) is 100 degrees Celsius or less, FC-72 may be used as the working fluid (10), and when it is over 100 degrees Celsius, ethanol may be used.

[0053] In addition, in the present embodiment, the plurality of microchannels (110) may have a structure in which one side is gathered inside the evaporator (120) and the other side is widely spread outward in order to correspond to the evaporator (120) that receives heat from a local heat source. For example, in the evaporator (120) or an area adjacent to the evaporator (120), the plurality of microchannels (110) may have a structure in which the ends are concentrated toward the evaporator (120). At this time, at least some of the plurality of microchannels (110) may be formed in a structure in which the width of the path becomes narrower as they go toward the ends. The ends of the plurality of microchannels (110) with narrowed path widths may be concentrated and arranged at a high density in the evaporator (120) or around the evaporator (120).

[0054] In this embodiment, a plurality of microchannels (110) can be formed between a pair of substrates (105) of a flat structure arranged facing each other.

[0055] At this time, a silicon wafer or a glass plate such as Pyrex glass can be used as a pair of substrates (105). For example, a silicon wafer can be patterned and etched to form a plurality of microchannels (110) in the silicon wafer. Then, another silicon wafer or a glass plate can be bonded to the silicon wafer on which a plurality of microchannels (110) are formed to form a flat-plate oscillating heat pipe structure.

[0056]

[0057] The evaporator (120) receives heat from an external heat source and vaporizes the working fluid (10) of the microchannel (110). The ends of a plurality of microchannels (110) may be arranged in the evaporator (120).

[0058] FIG. 3 is a detailed drawing showing an evaporation section (120) in a heat dissipation device (100) according to one embodiment of the present invention, and FIGS. 4 and 5 are detailed drawings showing a merged area (140) in an evaporation section (120) of a heat dissipation device (100) according to one embodiment of the present invention.

[0059] In the evaporator (120) of the present embodiment, the ends of the plurality of microchannels (110) may meet to form a merging region (140) where the working fluid (10) merges. At this time, in the merging region (140), the ends of the plurality of microchannels (110) may have a structure in which they are concentrated toward the evaporator (120). For example, at least some of the plurality of microchannels (110) may be formed in a structure in which the width of the path becomes narrower as they go toward the evaporator (120). Accordingly, the plurality of microchannels (110) may be arranged to be concentrated at a high density in the evaporator (120) or around the evaporator (120).

[0060] Additionally, in the merged area (140), a plurality of microchannels (110) can be divided and branched by a plurality of partition walls (112a).

[0061] Referring to FIGS. 2 to 5, the evaporator (120) of the present embodiment may be disposed in the central portion of the substrate (105). The evaporator (120) disposed in the central portion of the substrate (105) may be formed by dividing into a plurality of merging regions (140), and a plurality of microchannels (110) may be disposed in each merging region (140). The plurality of microchannels (110) disposed in the same merging region (140) may meet each other in a structure with open ends. Accordingly, the working fluid (10) in each microchannel (110) may be gathered and merged. The working fluid (10) gathered in the merging region (140) may be vaporized by heat received from an external heat source to form a bubble plug.

[0062] Specifically, in the present embodiment, four ends (110a, 110b, 110c, 110d) of a microchannel (110) can be merged in one merging area (140). Accordingly, three partition walls (112a, 112b, 112c) can be formed to divide the four ends (110a, 110b, 110c, 110d) in the merging area (140) and branch the microchannel (110).

[0063] In particular, in the merging area (140) of the present embodiment, the partition wall (112a) arranged in the central area may be arranged further apart from the central portion (122) of the evaporator (120) than the partition walls (112b, 112c) arranged in other portions. That is, in the merging area (140), the partition wall (112a) arranged on the inside may be arranged further from the central portion (122) of the evaporator (120) than the partition walls (112b, 112c) arranged on the side surfaces. Here, the central portion (122) of the evaporator (120) refers to the central portion, not the peripheral portion, of the evaporator (120), regardless of the shape of the evaporator (120), and is generally a portion that receives a lot of heat.

[0064] Referring to Fig. 4, the ends of the other partition walls (112b, 112c) adjacent to both sides may have a structure in which they protrude further toward the center (122) of the evaporator (120) than the ends of the partition wall (112a) disposed in the central area of ​​the merging area (140). Alternatively, the partition wall (112a) disposed in the central area of ​​the merging area (140) may have a structure in which it is surrounded by other partition walls (112b, 112c) adjacent to both sides.

[0065] The arrangement of the partition walls (112a, 112b, 112c) in the merging area (140) of the present embodiment can form a flow of an efficient working fluid (10) in the evaporator (120) that receives heat from a local heat source.

[0066] Referring to FIG. 5, in the merging region (140) of the present embodiment, the working fluid can move in three or more paths without any flow interference between the microchannels (110). Accordingly, the liquid slug can smoothly penetrate into the evaporator (120), enabling sufficient liquid supply to the evaporator (120), and the heat dissipation device (100) of the present embodiment using a vibrating heat pipe can have its thermal performance gradually improved without deterioration as the heat input increases. In addition, since the liquid slug can continuously vibrate, the heat dissipation device (100) of the present embodiment can operate normally under horizontal conditions.

[0067] Meanwhile, in the merged area (140), the plurality of partition walls are not limited to the structure of the present embodiment, and the plurality of partition walls may have various arrangement structures. For example, in the merged area (140), a partition wall arranged in the central area among the plurality of partition walls may have a structure that protrudes more than the adjacent partition walls on both sides.

[0068]

[0069] The condenser (130) liquefies the vaporized working fluid (10) and thereby releases heat to the outside. A portion of the microchannel (110) spaced apart from the evaporator (120) may be arranged in the condenser (130).

[0070] FIG. 6 is a detailed drawing of a condenser (130) in a heat dissipation device (100) according to one embodiment of the present invention, and is an enlarged view of part A of FIG. 2.

[0071] Referring to FIGS. 2 and 6, the condensation section (130) of the present embodiment is formed at both longitudinal ends of the substrate (105) and can be positioned as far away from the evaporation section (120) as possible on the substrate (105). Each of the plurality of microchannels (110) can have a path that starts from the evaporation section (120), passes through the condensation section (130), and returns to the evaporation section (120).

[0072] At this time, the microchannel (110) of the present embodiment may have a single path that passes through the condenser (130) from the evaporator (120) and returns to the evaporator (120) and may have a path that moves in one direction. That is, the path of the microchannel (110) of the present embodiment may be a structure that does not merge or branch in the middle of going back and forth from the evaporator (120) to the condenser (130), and may be a path in which the working fluid (10) moves without being mixed or divided in the middle.

[0073] Accordingly, each of the plurality of microchannels (110) can independently form a path that starts from the evaporation section (120) and returns through the condensation section (130).

[0074] In comparison, the structure in which microchannels are merged in the condenser section may have a problem in that the liquid slugs cannot vibrate actively due to the presence of branching points in the microchannels in the condenser section. A phenomenon occurs in which the flow in some of the merged microchannels interferes with the flow in other microchannels, and as a result, the liquid slugs vibrate actively only in some of the merged microchannels, while in other microchannels the liquid slugs do not vibrate and remain stationary, which may cause a phenomenon in which the area in which actual phase change heat transfer occurs is reduced.

[0075] Accordingly, the microchannel (110) structure of the present embodiment can prevent the problem of the liquid slug not vibrating actively in the condenser (130) from occurring by forming the paths that reciprocate to and from the condenser (130) independently of each other.

[0076] Referring to FIG. 6, the microchannel (110) of the present embodiment may be formed with a curved portion (118) in the condensation portion (130). At this time, one side of the curved portion (118) may be connected to a path (114) that flows from the evaporation portion (120) to the condensation portion (130), and the other side of the curved portion (118) may be connected to a path (116) that returns from the condensation portion (130) to the evaporation portion (120). In the present embodiment, the curved portion (118) of the microchannel (110) may be an area where the liquid slug actively vibrates.

[0077] At this time, the microchannel (110) of the present embodiment may be formed so that the width of the path (114) flowing from the evaporator (120) to the condenser (130) is larger than the width of the path (116) returning from the condenser (130) to the evaporator (120) in the region adjacent to the condenser (130). Accordingly, the path (116) returning from the condenser (130) to the evaporator (120) may form a larger capillary force due to its narrow width, so that the one-way flow of the working fluid (10) flowing from a wide width to a narrow width in the vicinity of the condenser (130) may be formed.

[0078]

[0079] Meanwhile, in order to move the working fluid (10) from the narrow-area evaporation section (120) corresponding to the local heat source to the wide-area condensation section (130), an expansion section (113) with an expanded width may be formed in the microchannel (110) in this embodiment.

[0080] FIG. 7 is a detailed drawing showing a path (114) toward a condenser (130) in a heat dissipation device (100) according to one embodiment of the present invention.

[0081] Referring to FIG. 7, in the path (114) that flows from the evaporation section (120) to the condensation section (130) in the microchannel (110), an expansion section (113) whose width increases as it moves from the evaporation section (120) to the condensation section (130) can be formed.

[0082]

[0083] Figure 8 is a graph evaluating the performance of a heat dissipation device (100) according to one embodiment of the present invention.

[0084] Referring to FIG. 8, it can be confirmed that the heat dissipation device (100) of the present embodiment having the above-described structure has a lower thermal resistance as the heat input (input power) increases under vertical conditions. That is, it can be confirmed that the thermal performance does not deteriorate but continues to improve even as the heat input increases. In addition, it can be confirmed that the heat dissipation device (100) of the present embodiment has a thermal performance that continues to improve as the heat input increases even under horizontal conditions, and in particular, it has a thermal performance similar to the thermal performance under vertical conditions. Therefore, it can be confirmed that the heat dissipation device (100) of the present embodiment secures high heat dissipation performance regardless of the arrangement direction.

[0085]

[0086] FIG. 9 and FIG. 10 are drawings showing a heat dissipation device according to another embodiment of the present invention.

[0087] Referring to FIGS. 9 and 10, the heat dissipation device of the present embodiment is different from the above-described embodiment in that it has a structure in which a plurality of microtubes (210) are filled with a working fluid.

[0088] In the above-described embodiment, a plurality of microchannels (110) are integrally formed between a pair of substrates (105), whereas in the present embodiment, a plurality of microtubes (210) may be formed independently and have a structure in which they are connected to each other.

[0089] In the present embodiment, in the evaporation unit (220), the ends of a plurality of microtubes (210) may be connected to form a merging area (240) where the working fluids merge. At this time, in the merging area (240), the ends of the plurality of microtubes (210) may have a structure in which they are concentrated toward the evaporation unit (220). For example, at least some of the plurality of microtubes (210) may be formed in a structure in which the width of the path becomes narrower as they go toward the evaporation unit (220). Accordingly, the plurality of microtubes (210) may be arranged in a concentrated manner at a high density in the evaporation unit (220) or around the evaporation unit (220).

[0090] In addition, in the merging area (240), the tube walls (211) of the plurality of microtubules (210) are combined to form a joining portion (212a, 212b, 212c), and the plurality of microtubules (210) can branch from each other using the joining portion (212a, 212b, 212c) as a branching point.

[0091] Specifically, in this embodiment, four ends of a microtubule (210) can be merged in one merging region (240). At this time, three junctions (212a, 212b, 212c) branching from the merging region (240) to the microtubule (210) can be formed.

[0092] In particular, in the merging area (240) of the present embodiment, the connecting portion (212a) positioned in the central area may be positioned further away from the central portion (222) of the evaporation portion (220) than the connecting portions (212b, 212c) positioned in other portions. That is, in the merging area (240), the connecting portion (212a) positioned on the inner side based on both sides may be positioned further from the central portion (222) of the evaporation portion (220) than the connecting portions (212b, 212c) positioned on the side.

[0093] To explain in detail with reference to Fig. 9, the joining portion (212a) positioned in the central region of the merging region (240) can be a structure surrounded by the tube walls (211) of the microtubes (210) adjacent on both sides.

[0094] Meanwhile, in the merging area (240), the plurality of joints are not limited to the structure of the present embodiment, and the plurality of joints may have various arrangement structures. For example, in the merging area (240), the joints arranged in the central area among the plurality of joints may have a structure in which they are arranged closer to the center (222) of the evaporation section (220) than the other adjacent joints on both sides.

[0095]

[0096] In addition, a part of the microtube (210) spaced apart from the evaporator (220) is placed in the condenser (230) of the present embodiment, and the vaporized working fluid can be liquefied and emit heat.

[0097] Referring to FIG. 10, the microtube (210) of the present embodiment may be formed so that the diameter of the path (214) flowing from the evaporator (220) to the condenser (230) in the region adjacent to the condenser (230) is larger than the diameter of the path (216) returning from the condenser (230) to the evaporator (220). Accordingly, the path (216) returning from the condenser (230) to the evaporator (220) may form a larger capillary force due to its narrow diameter, so that one-way flow of the working fluid flowing from a wide diameter to a narrow diameter in the vicinity of the condenser (230) may be formed.

[0098] In addition, the microtube (210) of the present embodiment may also have a bent portion (218) formed in the condensation portion (230). At this time, one side of the bent portion (218) may be connected to a path (214) that flows from the evaporation portion (220) to the condensation portion (230), and the other side of the bent portion (218) may be connected to a path (216) that returns from the condensation portion (230) to the evaporation portion (220). The function and effect of the bent portion (218) in the present embodiment may be similar to those of the above-described embodiment.

[0099] Meanwhile, in order to move the working fluid from the narrow-area evaporation section (220) corresponding to the local heat source to the wide-area condensation section (230), an expansion section with an expanded width may be formed in the microtube (210) in this embodiment. The function and effect of the expansion section in this embodiment may be similar to those of the above-described embodiment.

[0100]

[0101] Above, the preferred embodiments of the present invention have been described, but those of ordinary skill in the art will be able to modify and change the present invention in various ways by adding, changing, deleting or adding components, etc., within the scope that does not depart from the spirit of the present invention described in the claims, and this will also be considered to be included within the scope of the rights of the present invention.

[0102]

[0103] 10: Working fluid

[0104] 100: Heat sink

[0105] 105: Substrate

[0106] 110: Microchannel

[0107] 112a, 112b, 112c: Bulkhead

[0108] 113: Extension

[0109] 118, 218: bend

[0110] 120: Evaporator

[0111] 130: Condenser

[0112] 140, 240: Merge area

[0113] 210: Microtubes

[0114] 212a, 212b, 212c: Joints

Claims

1. A plurality of microchannels, each filled with a working fluid and applying capillary force to the working fluid; An evaporator in which the ends of the plurality of microchannels are arranged and the working fluid is vaporized by receiving heat from an external heat source; and A part of the microchannel spaced from the above evaporation section is arranged, and includes a condensation section in which the vaporized working fluid is liquefied and heat is emitted. In the above evaporation section, the plurality of microchannels meet at the ends to form a merging region where the working fluids are merged, In the above merging area, the plurality of microchannels have a structure that is focused toward the evaporation section, A heat dissipation device in which a plurality of the above microchannels are divided and branched by a plurality of partitions.

2. In paragraph 1, A heat dissipation device in which the bulkhead positioned in the central region of the above-mentioned merged region is positioned further away from the central region of the evaporation section than the bulkheads positioned in other regions.

3. In paragraph 1, A heat dissipation device in which the bulkhead positioned in the central area of ​​the above-mentioned merged area has a structure surrounded by other bulkheads adjacent to both sides.

4. In paragraph 1, A heat dissipation device in which the ends of the other adjacent baffles on both sides protrude further toward the center of the evaporator than the end of the baffle disposed in the central area of ​​the merged area.

5. In paragraph 1, The above microchannel is, A heat dissipation device having a one-way path that starts from the above evaporation section, passes through the above condensation section, and returns.

6. In paragraph 5, In the above microchannels, A heat dissipation device in which the paths starting from the above evaporation section, passing through the above condensation section, and returning are formed independently of each other.

7. In paragraph 5, The above microchannel is, A heat dissipation device, wherein, in an area adjacent to the condensing section, the width of the path flowing from the evaporating section to the condensing section is formed to be larger than the width of the path returning from the condensing section to the evaporating section.

8. In paragraph 7, In the path from the above evaporation section to the above condensation section, A heat dissipation device having an expansion section formed therein, the width of which increases as it moves from the evaporation section to the condensation section.

9. In paragraph 5, The above microchannel is formed by a curved portion in the condensation portion, One side of the above-mentioned bend is connected to a path flowing from the evaporator to the condenser, The other side of the above-mentioned bend is a heat dissipation device connected to a path returning from the above-mentioned condenser to the above-mentioned evaporator.

10. In paragraph 1, Each of which has a flat structure and further includes a pair of substrates arranged facing each other, A heat dissipation device in which the microchannel is formed between a pair of the above substrates.

11. A plurality of microtubes, each filled with a working fluid and applying capillary force to the working fluid; An evaporator in which both ends of the plurality of above microtubes are arranged and the working fluid is vaporized by receiving heat from an external heat source; and A part of the microtube is arranged away from the evaporator, and includes a condenser in which the vaporized working fluid is liquefied and heat is emitted. In the above evaporation section, a plurality of the microtubes are connected at the ends to form a merging area where the working fluid is merged, A heat dissipation device in which, in the above-mentioned merged area, a plurality of the microtubes have a structure in which they are concentrated toward the evaporation section, and the plurality of the microtubes branch out from the joining section where the tube walls are joined.

12. In paragraph 11, A heat dissipation device in which the connecting portion arranged in the central region of the above-mentioned merging region is arranged further away from the central region of the evaporation portion than the connecting portions arranged in other regions.

13. In paragraph 11, A heat dissipation device having a structure in which the connecting portion, which is positioned in the central region of the above-mentioned merging region, is surrounded by the tube walls of the microtubes adjacent on both sides.

14. In paragraph 11, The above microtubules are, A heat dissipation device, wherein, in an area adjacent to the condensing section, the diameter of the path flowing from the evaporating section to the condensing section is formed to be larger than the diameter returning from the condensing section to the evaporating section.

15. In paragraph 14, In the path from the above evaporation section to the above condensation section, A heat dissipation device having an expansion section formed therein whose diameter increases as it moves from the evaporation section to the condensation section.

16. In paragraph 11, The above microtube is formed with a curved portion in the condensation portion, One side of the above-mentioned bend is connected to a path flowing from the evaporator to the condenser, The other side of the above-mentioned bend is a heat dissipation device connected to a path returning from the above-mentioned condenser to the above-mentioned evaporator.

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