Improved cutter retention

Abstract

A method may plate a Nickel (Ni)-plating layer on a radially outward surface of a carbide substrate of a cutting element to create a Ni-plated carbide substrate. A method may braze the Ni-plated carbide substrate to a cutting element pocket of the drill bit.

Description

IMPROVED CUTTER RETENTIONCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to and the benefit of United States Provisional Patent Application Serial No. 63 / 587,554, entitled IMPROVED CUTTER RETENTION and filed October s, 2023, which is hereby incorporated by reference in its entirety.BACKGROUND

[0002] This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present disclosure, which are described and / or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.

[0003] Drill bits are used during drilling to produce wellbores for the discovery and extraction of hydrocarbons such as crude oil and natural gas from the earth’s crust. Generally, the cutting element of a drill bit is made of polycrystalline diamond (PCD) and is joined to the bit body by brazing. The braze quality between the cutting element and the bit body is an important concern regarding drill bit performance. Subpar braze quality may cause premature wear to the drill bit due to cutter loss, which could cause bit ring-out and even bit damage beyond repair. Furthermore, significant corrosion has been observed in carbide substrates bonded to the PCD, which may lead to reliability issues.

[0004] Thus, there is a need to strengthen the bonding strength of the braze between the cutting element and the bit body, as well as improving the reliability of drill bits.SUMMARY

[0005] In some aspects, the techniques described herein relate to a method of producing a drill bit, including: plating a Nickel (Ni)-plating layer on a radially outward surface of a carbide substrate of a cutting element to create a Ni-plated carbide substrate; and brazing the Ni-plated carbide substrate to a cutting element pocket of the drill bit.

[0006] In some aspects, the techniques described herein relate to a cutting element including: a polycrystalline diamond (PCD) table; a carbide substrate coupled to the PCD table; and a Ni-plating layer contacting a radially outward surface of the carbide substrate.

[0007] In some aspects, the techniques described herein relate to a method of manufacturing a cutting element, the method including: obtaining a cutting element including a polycrystalline diamond (PCD) table and a carbide substrate coupled to the PCD table; plating an inner surface of a can with a Ni-plating layer; and connecting the can to a radially outward surface of the carbide substrate.

[0008] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0009] Additional features and advantages will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the teachings herein. Features and advantages of the disclosure may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. Features of the present disclosure will become more fully apparent from the following description and appended claims or may be learned by the practice of the disclosure as set forth hereinafter.BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The present disclosure is best understood from the following detailed description when read with the accompanying Figures. It is emphasized that, in accordance with the standard practice in the industry, various features are notdrawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0011] FIG. 1 is a scanning electron microscope (SEM) Micrograph showing Nickel plating on a carbide substrate, according to one or more examples of the disclosure.

[0012] FIG. 2 is an SEM Micrograph showing the diffusion of Nickel into a carbide substrate, according to one or more examples of the disclosure.

[0013] FIG. 3 is a chart comparing the braze strength between a PDC layer to Ni-plated carbide substrate and a PDC layer to a non-Ni-plated carbide substrate, according to one or more examples of the disclosure.

[0014] FIG. 4 is an SEM Micrograph showing the diffusion of Nickel into a carbide substrate with the presence of brazing filler, according to one or more examples of the disclosure.

[0015] FIG. 5 is an assembly of cutting element having a can, substrate, and a PDC layer, according to one or more examples of the disclosure.

[0016] FIG. 6 is a cross-sectional view of a cutting element, according to one or more examples of the disclosure.

[0017] FIG. 7 is a flowchart illustrating a method of manufacturing a drill bit, according to one or more examples of the disclosure.

[0018] FIG. 8 is a flowchart illustrating a method of manufacturing a cutting element for a drill bit, according to one or more examples of the disclosure.DETAILED DESCRIPTION

[0019] Illustrative examples of the subject matter claimed below will now be disclosed. In the interest of clarity, not all features of an actual implementation are described in this specification. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions may be made to achieve the developers’ specific goals, such as compliance with system- related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort, even ifcomplex and time-consuming, would be a routine undertaking forthose of ordinary skill in the art having the benefit of this disclosure.

[0020] Further, as used herein, the article “a” is intended to have its ordinary meaning in the patent arts, namely “one or more.” Moreover, examples herein are intended to be illustrative only and are presented for discussion purposes and not by way of limitation.

[0021] The present disclosure is generally related to methods of manufacture and systems and devices produced by such methods for improved retention of cutting elements in drill bits. In some embodiments, the present disclosure is directed towards methods for producing a drill bit with improved cutter retention. In one or more embodiments, a method may include ding a polycrystalline diamond (PCD) table to a carbide substrate and plating a Nickel (Ni) layer on a surface of a carbide substrate. In some embodiments, the present disclosure is directed towards a cutting element including a metal plating on a substrate thereof. For example, a cutting element according to the preset disclosure may have a nickel (Ni) plating layer on at least a portion of the substrate. In some examples, a cutting element according to the preset disclosure may have a plating layer of another metal, such as a cobalt (Co) plating layer, on at least a portion of the substrate.

[0022] In some embodiments, the metal plating layer is positioned on the entire outer surface of the substrate (e.g., all of the outer surface not contacted by the PCD table). In some embodiments, the metal plating layer is positioned on at least a portion of a radially outward surface of the substrate. For example, the metal plating layer may be positioned on an outer diameter (OD) surface of a substantially cylindrical carbide substrate. In some examples, the metal plating layer may be positioned on an outer diameter (OD) surface of a substantially square, hexagonal, octagonal, or other regular polyhedral carbide substrate.

[0023] In some embodiments, a metal plating layer, such as a Ni-plating layer may increase a corrosion resistance of the carbide substrate. For example, the metal plating layer may provide a substantially continuous barrier on the outer surface of the carbide substrate that limits or prevents corrosion of the carbide substrate. In some examples, at least a portion of the metal plating layer is diffusedinto a diffusion zone with the carbide substrate, such as by filling pores in a matrix of the carbide substrate, that limits or prevents corrosion of the carbide substrate.

[0024] In some embodiments, a metal plating layer, such as a Ni-plating layer may increase a brazing strength between the carbide substrate and a cutter pocket in a drill bit. For example, the metal plating layer may provide an intermediate medium between the outer surface of the carbide substrate and the brazing material that increases a strength and / or a toughness of a braze therebetween to improve cutting element retention in the drill bit. In some examples, the metal plating layer may provide diffusion zone between the outer surface of the carbide substrate and the brazing material that increases a strength and / or a toughness of a braze therebetween to improve cutting element retention in the drill bit.

[0025] In some embodiments, the present disclosure is directed towards a cutting element including a brazing layer affixed thereto. For example, a can assembly including or made of brazing material may be coupled, bonded, affixed, or otherwise connected to a substrate of the cutting element with a metal plating layer therebetween. In some embodiments, the can assembly is connected to the cutting element before the cutting element is positioned in a cutter pocket on a drill bit. In some embodiments, the metal plating layer is plated on the can assembly prior to the can assembly being connected to the substrate. For example, the plating layer may be plated on an inner surface of the can assembly to position the plating layer between the brazing material of the can assembly and the outer surface of the carbide substrate. In some examples, the plating layer may be plated on the inner surface and an outer surface of the can assembly to improve a braze strength between the brazing material and a surface of a cutting element pocket in a drill bit.

[0026] When the plating layer is plated on the carbide substrate, the plating layer may be applied by electroless plating. In one or more embodiments, to plate the Ni-plating layer on the surface of the carbide substrate, the carbide substrate may undergo a chemical plating process with a solution including water, Ni salt, and a phosphorus-containing reducing agent. The phosphorus-containing reducing agent may be a hypophosphite salt, such as sodium hypophosphite (NaH2PC>2). The chemical process may be represented by the chemical formula:NiCI2+ NaH2PO2+ H20 = Ni + 2HCI +Na2H2PO3

[0027] In one or more embodiments, the Ni-plating layer 102 plated on the carbide substrate 100 may be 10 micrometers (pm) thick, as shown in the scanning electron microscope (SEM) Micrograph depicted in Fig. 1. In some embodiments, the Ni-plating layer 102 plated on the carbide substrate may be greater than 10 pm thick. For example, the Ni-plating layer 102 may have a thickness 104 of 25 pm or greater. In some examples, the Ni-plating layer 102 may have a thickness 104 of 50 pm or greater. In some embodiments, a Ni-plating layer thickness 104 greater than 100 pm may increase a chance of spalling of the plating layer, reducing and / or limiting a braze strength when brazed to a drill bit. In some embodiments, the Ni- plating layer thickness 104 is between 10 pm and 100 pm.

[0028] In some embodiments, the chemical deposition of the Ni-plating layer 102 produces a residual phosphorus (P) in the Ni-plating layer 102. In some embodiments, the Ni-plating layer 102 contains at least 1 % P by atomic percentage (at%), as measured by EDS quantification analysis. In some embodiments, the Ni- plating layer 102 contains at least 2% P by at%, as measured by EDS quantification analysis. In some embodiments, the Ni-plating layer 102 contains at least 3% P by at%, as measured by EDS quantification analysis.

[0029] In some embodiments, at least a portion of the metal from the metal plating diffuses into the carbide substrate upon heating of the metal plating layer. For example, Ni may diffuse into a matrix of the carbide substrate upon heating of the cutting element and / or carbide substrate. In some examples, the Ni diffuses during brazing in a drill bit cutting element pocket. In some examples, the Ni diffuses during application of heat to the cutting element before brazing.

[0030] Fig. 2 shows a SEM micrograph capture of a section of a Ni-plated carbide substrate 200 heated at about 750°C for 5 minutes. The selected area in the SEM micrograph capture shows that diffusion has occurred between the Ni- plating layer 202 and the carbide substrate 200 to create a diffusion zone 206. An energy dispersive X-ray spectroscopy (EDS) quantification analysis was conducted on a sampling region between 15 pm and 30 pm radially within the carbide substrate 200 relative to the as-deposited boundary with the Ni-plating layer 202, which confirms that diffusion between the Ni-plating layer 202 and thecarbide substrate 200 has occurred through the diffusion zone 206. In some embodiments, the diffusion zone 206 is at least 10 pm deep within the carbide substrate 200 relative to the boundary with the as-deposited Ni-plating layer 202. The results of the EDS quantification are shown in the following table:Table 1

[0031] Advantageously, the presence of Ni in the diffusion zone 206 of the carbide substrate 200 may increase its corrosion resistance. During testing, a diffusion zone 206 of at least 10 pm provided effective corrosion resistance. During testing, an as-deposited Ni-plating layer 202 with a thickness at least 10 pm resulted in a diffusion zone having a depth of at least 10 pm during heating to brazing conditions. In some embodiments, an as-deposited Ni-plating layer 202 with a thickness at least 25 pm resulted in a diffusion zone having a depth of at least 100 pm during heating to brazing conditions.

[0032] In one or more embodiments, a PDC table may be bonded (e.g., sintered) to a carbide substrate that is subsequently Ni-plated. Brazing the cutting element having the Ni-plated carbide substrate may further include inserting a braze material between the Ni-plated carbide substrate and the cutting element pocket of a drill bit or reamer and applying heat to the braze material to bind the Ni-plated carbide substrate to the cutting element pocket. In one or more embodiments, Bag-24 (BR505) brazing filler may be used as the braze material to join the Ni-plated carbide substrate to the cutting element pocket.

[0033] Advantageously, the braze bond between the cutting element pocket and a cutting element having the Ni-plated carbide substrate during testing was observed to be approximately 25% stronger when compared to a braze bond between the cutting element pocket and a cutting element having a non-Ni-plated carbide substrate. Test results shown in FIG. 3 indicate that non-Ni-plated cuttingelement may sustain an average of 8,000 cycles of a push-out test before failing, whereas Ni-plated bits may sustain up to 12,000 cycles of the pushout test prior to failure.

[0034] FIG. 3 illustrates test results for three samples of a tungsten carbide (WC) substrate with no metal plating on an outer surface thereof and two samples of a WC substrate with a Ni plating layer on an outer surface thereof. The testing fixtures were heated first to expand the inner diameter (ID) of the fixtures. The carbide substrates were then placed in the ID of the fixture and rotated during brazing. BR 505 braze filler metals were used for the brazing. A push out test was performed to measure the braze bond strength of each carbide substrate with the fixture simulating the bond with a cutting element pocket. The push out fixtures were formed from A2 tool steel. The fixture heights were 0.200 inches, and the ID of the fixtures were 0.595 inches. The carbide substrate outer diameter (OD) was 0.590 inches ± 0.0001 inches. Average clearance between the OD of the carbide substrate and the ID of the fixture was approximately 0.0025 inches. The three non-plated WC samples (WC-1 , WC-2, WC-3) failed between approximately 8000 and 9000 cycles. The two Ni-plated carbide substrates (Ni Plated 1 , Ni plated 2) failed between approximately 11000 and 12000 cycles, exhibiting a greater than 25% increase in braze bond strength.

[0035] Further, testing was conducted to confirm the presence of Ni in the carbide substrate when brazing material is present. FIG. 4 shows an SEM micrograph capture of a section of a Ni-plated carbide substrate 400 heated at about 750 °C for 5 minutes during brazing of the carbide substrate 400 and Ni- plating layer 402. As shown in FIG. 4, the selected area between approximately 15 pm and 40 pm radially inward from the original boundary with the Ni-plating layer 402 shows that diffusion of at least a portion of the Ni-plating layer 402 into the carbide substrate 400 has occurred to form a diffusion zone 406. This is further confirmed with an EDS quantification analysis from inside the carbide substrate 400. The results from the EDS quantification analysis are shown in the following table:Table 2

[0036] The above result shows that even with the presence of brazing fillers (the dark region of the SEM micrograph), diffusion of Ni into the carbide substrate 400 in a diffusion zone 406 still occurs. Therefore, the benefit of increased corrosion resistance is retained while braze quality between cutter pocket and the Ni-plated carbide substrate of the cutting element is improved.

[0037] In one or more embodiments, the cutting element may be arranged within a can assembly formed of a brazing material, as shown in FIG. 5. A cutting element includes a carbide substrate 500 bonded to a PCD table 508. In some embodiments, the carbide substrate 500 is plated with Ni or another metal plating material on at least a radially outward surface thereof. In some embodiments, the can assembly 510 has one or more inner surfaces 512 electroplated with Ni or another metal plating material. The can assembly 510 with the cutting element may be inserted into a cutting element pocket of a bit or reamer, then heated (e.g., via a torch, oven) to braze the cutting element to the cutter pocket. In some embodiments, the Ni-plating layer between the can assembly 510 and the carbide substrate 500 aids the brazing of the cutting element to the cutting element pocket. As described herein, the Ni-plating layer (or other metal plating layer) may be initially plated on the can assembly 510 or the carbide substrate 500 before heating, during which the Ni or other metal may diffuse into a matrix of the carbide substrate 500. In some embodiments, the heating is performed before brazing. In some embodiments, the heating occurs during brazing and / or as a result of the brazing.

[0038] In some embodiments, the can assembly 510 is or includes brazing material. In embodiments in which the can assembly 510 is or includes brazing material, the brazing material may be at least partially plated (e.g., on a inner surface 512 thereof) with a Ni-plating layer by undergoing an electroless chemicalplating process. For example, the electroless chemical plating process may be similar to or the same as that described herein in relation to the carbide substrate. In some embodiments, the chemical plating process includes a solution including water, Ni salt, and a phosphorus-containing reducing agent.

[0039] The phosphorus-containing reducing agent may be a hypophosphite salt, such as sodium hypophosphite (NaH2PO2). The chemical process may be represented in the chemical formula:NhCI2+ NaH2PO2+ H2O = Ni + 2HCI +Na2H2PO3

[0040] In one or more embodiments, heat may be applied to the Ni-plated brazing material containing the PDC cutting element inserted into the bit pocket to braze the PDC cutting element to the cutter pocket of a bit or reamer.

[0041] In some embodiments, the can assembly 510 does not contain a brazing material. In some embodiments, the can assembly 510 has a Ni-plating layer applied to an inner surface 512 thereof to contact the carbide substrate 500. In some embodiments, after heating and subsequent diffusion of at least a portion of the Ni-plating layer into the carbide substrate 500, at least a portion of the can assembly 510 is removed, such as by milling or machining, to expose the Ni-plating layer for brazing. In some embodiments, the can assembly 510 is not removed from the Ni-plating layer, and a brazing material is further applied directly to an outer surface of the can assembly 510.

[0042] In some embodiments, a bit is rebuilt. During rebuilding, one or more cutting elements are removed from cutting element pockets of the drill bit. In some embodiments, old brazing material is removed from the cutting elements, and the cutting elements are reused. For example, old brazing material may be removed from a cutting element (such as by particle-blasting), and a carbide substrate of the cutting element may be plated with a Ni-plating layer (or other metal plating layer) before being brazed into the drill bit during a rebuilding process. In some examples, removing the old brazing material may leave the diffusion zone including Ni or another metal in the cutting element. In such examples, a new Ni-plating layer may be applied to the carbide substrate including the diffusion zone. In such examples, the new brazing material may be applied directly to the carbide substate including the diffusion zone of Ni or another metal in the cutting element.

[0043] FIG. 6 is a cross-sectional view of an embodiment of a cutting element including a carbide substrate 600 with a Ni-plating layer 602, such as that described in relation to FIG. 5. In some embodiments, the carbide substrate 600 is bonded to (e.g., sintered to) a PCD table 608. The carbide substrate 600 may be a tungsten carbide substrate. In some embodiments, a can assembly 610 is positioned circumferentially around at least a portion of the carbide substrate 600. A Ni-plating layer 602 (or other metal plating layer) is positioned contacting and / or proximate to the inner surface 612 of the can assembly 610 and the radially outward surface of the carbide substrate 600. In some embodiments, at least a portion of the Ni in the Ni-plating layer 602 diffuses into the carbide substrate 600 in a diffusion zone 606.

[0044] FIG. 7 is a flowchart illustrating a method 714 of manufacturing a drill bit. In some embodiments, the method 714 includes plating a Ni-plating layer on a radially outward surface of a carbide substrate of a cutting element at 716. In some embodiments, the Ni-plating layer is positioned on a substantially continuous circumferential surface of the carbide substrate. For example, the substantially continuous circumferential surface may be the radially outward surface of a cylindrical carbide substrate. In some embodiments, the Ni-plating layer is positioned on an end surface of the carbide substrate. For example, the end surface may be the longitudinal end of a cylindrical carbide substrate. In some embodiments, the Ni-plating layer is located on substantially all of the outer surface of the carbide substrate.

[0045] In some embodiments, plating the Ni-plating layer includes processing a surface of the carbide substrate with a chemical plating process with a solution including water, Ni salt, and a phosphorus-containing reducing agent. The phosphorus-containing reducing agent may be a hypophosphite salt, such as sodium hypophosphite (NaH2PO2). The chemical process may be represented by the chemical formula:NiCb + NaH2PO2+ H2O = Ni + 2HCI +Na2H2PO3

[0046] In one or more embodiments, the Ni-plating layer plated on the carbide substrate may be 10 pm thick. In some embodiments, the Ni-plating layer plated on the carbide substrate may be greater than 10 pm thick. For example, the Ni-plating layer may have a thickness of 25 pm or greater. In some examples, the Ni- plating layer may have a thickness of 50 pm or greater. In some embodiments, a Ni-plating layer thickness greater than 100 pm may increase a chance of spalling of the plating layer, reducing and / or limiting a braze strength when brazed to a drill bit. In some embodiments, the Ni-plating layer thickness is between 10 pm and 100 pm.

[0047] In some embodiments, the chemical deposition of the Ni-plating layer produces a residual P in the Ni-plating layer. In some embodiments, the Ni-plating layer contains at least 1 % P by at%, as measured by EDS quantification analysis. In some embodiments, the Ni-plating layer contains at least 2% P by at%, as measured by EDS quantification analysis. In some embodiments, the Ni-plating layer contains at least 3% P by at%, as measured by EDS quantification analysis.

[0048] In some embodiments, at least a portion of the metal from the metal plating diffuses into the carbide substrate upon heating of the metal plating layer. For example, Ni may diffuse into a matrix of the carbide substrate upon heating of the cutting element and / or carbide substrate. In some examples, the Ni diffuses during brazing in a drill bit cutting element pocket. In some examples, the Ni diffuses during application of heat to the cutting element before brazing.

[0049] In some embodiments, the method 714 further includes brazing the Ni- plated carbide substrate to a cutting element pocket of the drill bit at 718. In some embodiments, a brazing material is applied to the Ni-plating layer. In some embodiments, brazing the Ni-plated carbide substrate includes inserting a braze material between the cutting element pocket and the Ni-plated carbide substrate and applying heat to diffuse at least a portion of the Ni-plating layer into the carbide substrate. In some embodiments, the heat applied during the brazing results in diffusion of at least a portion of the Ni-plating layer into the carbide substrate.

[0050] FIG. 8 is a flowchart illustrating a method 820 of manufacturing a cutting element. In some embodiments, the method 820 includes obtaining a cutting element including a polycrystalline diamond (PCD) table and a carbide substrate coupled to the PCD table at 822. In some embodiments, obtaining the cutting element includes sintering the PCD and the carbide substrate together. In some embodiments, sintering the PCD and the carbide substrate together includessintering a PCD precursor powder and a carbide precursor power in a single high- pressure, high-temperature HPHT process to form the cutting element.

[0051] The method 820, in some embodiments, includes plating an inner surface of a can with a Ni-plating layer at 824 and connecting the can to a radially outward surface of the carbide substrate at 826. In some embodiments, plating the inner surface of the can includes electroplating the inner surface of the can. In some embodiments, plating the inner surface of the can includes electroless plating the inner surface of the can with a chemical plating process with a solution including water, such as described herein.

[0052] In some embodiments, connecting the can to the radially outward surface of the carbide substrate includes contacting the Ni-plating layer to the radially outward surface in a friction fit. In some embodiments, connecting the can to the radially outward surface of the carbide substrate includes heating the Ni- plating layer and diffusing at least a portion of the Ni into the carbide substrate in a diffusion zone. In some embodiments, the can is made of or includes brazing material.

[0053] The present disclosure generally relates to devices and methods of manufacturing said devices for improved cutting element retention in a drill bit and other downhole tools according to any of the clauses below:

[0054] Clause 1. A method of manufacturing a drill bit, comprising: plating a Nickel (Ni)-plating layer on a radially outward surface of a carbide substrate of a cutting element to create a Ni-plated carbide substrate; and brazing the Ni-plated carbide substrate to a cutting element pocket of the drill bit.

[0055] Clause 2. The method of clause 1 , wherein plating the Ni-plating layer on the radially outward surface of the carbide substrate comprises chemically processing the carbide substrate with a solution comprising water, Ni salt, and a reducing agent.

[0056] Clause 3. The method of clause 2, wherein the reducing agent is a hypophosphite salt.

[0057] Clause 4. The method of clause 3, wherein the hypophosphite salt is sodium hypophosphite (NaH2PO2).

[0058] Clause 5. The method of clause 4, wherein a chemical process between the carbide substrate and the solution is represented as NiCI2 + NaH2PO2 + H2O = Ni + 2HCI +Na2H2PO3.

[0059] Clause 6. The method of clause 1 , further comprising applying heat to diffuse the Ni-plating layer into the carbide substrate before brazing the Ni-plated carbide substrate to the cutting element pocket.

[0060] Clause 7. The method of clause 1 , wherein brazing the Ni-plated carbide substrate to a cutting element pocket of the drill bit comprises: inserting a braze material between the cutting element pocket and the Ni-plated carbide substrate; and applying heat to diffuse at least a portion of the Ni-plating layer into the carbide substrate.

[0061] Clause 8. The method of clause 7, wherein the braze material is Bag-24 brazing filler.

[0062] Clause 9. The method of clause 1 , wherein the carbide substrate is a tungsten carbide substrate.

[0063] Clause 10. A cutting element comprising: a polycrystalline diamond (PCD) table; a carbide substrate coupled to the PCD table; and a Ni-plating layer contacting a radially outward surface of the carbide substrate.

[0064] Clause 11 . The cutting element of clause 10, wherein the Ni-plating layer includes phosphorus.

[0065] Clause 12. The cutting element of clause 10, further comprising a diffusion zone including Ni in the carbide substrate proximate to the Ni-plating layer, wherein the diffusion zone is at least 10 micrometers deep from the radially outward surface of the carbide substrate.

[0066] Clause 13. The cutting element of clause 10, further comprising a can positioned circumferentially around the carbide substrate and wherein the Ni- plating layer is between at least a portion of an inner surface of the can and at least a portion of the radially outward surface of the carbide substrate.

[0067] Clause 14. The cutting element of clause 13, wherein the can is made of or includes a brazing material.

[0068] Clause 15. The cutting element of clause 13, wherein the Ni-plating layer is bonded to an inner surface of the can.

[0069] Clause 16. The cutting element of clause 10, wherein the carbide substrate is a tungsten carbide substrate.

[0070] Clause 17. A method of manufacturing a cutting element, the method comprising: obtaining a cutting element including a polycrystalline diamond (PCD) table and a carbide substrate coupled to the PCD table; plating an inner surface of a can with a Ni-plating layer; and connecting the can to a radially outward surface of the carbide substrate.

[0071] Clause 18. The method of clause 17, wherein plating an inner surface of a can with a Ni-plating layer includes electroplating the inner surface.

[0072] Clause 19. The method of clause 17, wherein plating an inner surface of a can with a Ni-plating layer includes electroless plating the inner surface by chemically processing the can with a solution comprising water, Ni salt, and a reducing agent.

[0073] Clause 20. The method of clause 17, further comprising applying heat to the Ni-plating layer and carbide surface to diffuse at least a portion of the Ni-plating layer into the carbide substrate.

[0074] The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one embodiment” or “an embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described in relation to an embodiment herein may be combinable with any element of any other embodiment described herein. Numbers, percentages, ratios, or other values stated herein are intended to include that value, and also other values that are “about” or “approximately” the stated value, as would be appreciated by one of ordinary skill in the art encompassed by embodiments of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to beexpected in a suitable manufacturing or production process, and may include values that are within 5%, within 1 %, within 0.1 %, or within 0.01 % of a stated value.

[0075] A person having ordinary skill in the art should realize in view of the present disclosure that equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made to embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional “means-plus-function” clauses are intended to cover the structures described herein as performing the recited function, including both structural equivalents that operate in the same manner, and equivalent structures that provide the same function. It is the express intention of the applicant not to invoke means-plus-function or other functional claiming for any claim except for those in which the words ‘means for’ appear together with an associated function. Each addition, deletion, and modification to the embodiments that falls within the meaning and scope of the claims is to be embraced by the claims.

[0076] It should be understood that any directions or reference frames in the preceding description are merely relative directions or movements. For example, any references to “front” and “back” or “top” and “bottom” or “left” and “right” are merely descriptive of the relative position or movement of the related elements.

[0077] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. Changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

CLAIMSWhat is claimed is:1 . A method of manufacturing a drill bit, comprising: plating a Nickel (Ni)-plating layer on a radially outward surface of a carbide substrate of a cutting element to create a Ni-plated carbide substrate; and brazing the Ni-plated carbide substrate to a cutting element pocket of the drill bit.

2. The method of claim 1 , wherein plating the Ni-plating layer on the radially outward surface of the carbide substrate comprises chemically processing the carbide substrate with a solution comprising water, Ni salt, and a reducing agent.

3. The method of claim 2, wherein the reducing agent is a hypophosphite salt.

4. The method of claim 3, wherein the hypophosphite salt is sodium hypophosphite (NaFLPC ).

5. The method of claim 4, wherein a chemical process between the carbide substrate and the solution is represented as NiCh + NaFbPC + H2O = Ni + 2HCI + N32H2PO3.

6. The method of claim 1 , further comprising applying heat to diffuse the Ni- plating layer into the carbide substrate before brazing the Ni-plated carbide substrate to the cutting element pocket.

7. The method of claim 1 , wherein brazing the Ni-plated carbide substrate to a cutting element pocket of the drill bit comprises: inserting a braze material between the cutting element pocket and the Ni- plated carbide substrate; and applying heat to diffuse at least a portion of the Ni-plating layer into the carbide substrate.

8. The method of claim 7, wherein the braze material is Bag-24 brazing filler.

9. The method of claim 1 , wherein the carbide substrate is a tungsten carbide substrate.

10. A cutting element comprising: a polycrystalline diamond (PCD) table; a carbide substrate coupled to the PCD table; and a Ni-plating layer contacting a radially outward surface of the carbide substrate.

11. The cutting element of claim 10, wherein the Ni-plating layer includes phosphorus.

12. The cutting element of claim 10, further comprising a diffusion zone including Ni in the carbide substrate proximate to the Ni-plating layer, wherein the diffusion zone is at least 10 micrometers deep from the radially outward surface of the carbide substrate.

13. The cutting element of claim 10, further comprising a can positioned circumferentially around the carbide substrate and wherein the Ni-plating layer is between at least a portion of an inner surface of the can and at least a portion of the radially outward surface of the carbide substrate.

14. The cutting element of claim 13, wherein the can is made of or includes a brazing material.

15. The cutting element of claim 13, wherein the Ni-plating layer is bonded to an inner surface of the can.

16. The cutting element of claim 10, wherein the carbide substrate is a tungsten carbide substrate.

17. A method of manufacturing a cutting element, the method comprising: obtaining a cutting element including a polycrystalline diamond (PCD) table and a carbide substrate coupled to the PCD table; plating an inner surface of a can with a Ni-plating layer; and connecting the can to a radially outward surface of the carbide substrate.

18. The method of claim 17, wherein plating an inner surface of a can with a Ni- plating layer includes electroplating the inner surface.

19. The method of claim 17, wherein plating an inner surface of a can with a Ni- plating layer includes electroless plating the inner surface by chemically processing the can with a solution comprising water, Ni salt, and a reducing agent.

20. The method of claim 17, further comprising applying heat to the Ni-plating layer and carbide surface to diffuse at least a portion of the Ni-plating layer into the carbide substrate.

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