Board-level structure, device, and electronic apparatus

Abstract

Provided in the present application are a board-level structure, a device and an electronic apparatus. The board-level structure comprises a second substrate and at least one first device. The first device comprises a first body and a first substrate, a first welding spot and a second welding spot being provided on the first substrate, and the first substrate being connected to the first body by means of the first welding spot. The second substrate is provided with an accommodation portion and a third welding spot, the third welding spot being located on the second substrate and close to the accommodation portion, and the first substrate being welded to the second substrate by means of the second welding spot and the third welding spot. The first substrate spans over the accommodation portion, and at least part of the first body extends into the accommodation portion. The present application uses the accommodation portion to accommodate part of the first body in the Z-direction, thus reducing space occupation; the first substrate can be directly welded to the second substrate by means of the second welding spot and the third welding spot, thus the first substrate can be connected simply by forming a pad on the surface of the second substrate in one process step, thereby simplifying the assembly process and ensuring assembling quality.

Description

Board-level structures, components, and electronic equipment

[0001] This invention claims priority to the Chinese patent application filed with the State Intellectual Property Office on October 18, 2023, with application number 202322802670.2 and application name “Board-level structures, devices and electronic equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic products, and in particular to a board-level structure, device and electronic equipment. Background Art

[0003] Electronic products achieve diverse functions by integrating various components onto circuit boards. The bottom of each component typically needs to be soldered to the board. For taller components, slots are typically created in the board, allowing the taller components to be soldered directly to the bottom of the slots. This allows the slots to absorb some of the component's height, reducing the space occupied by the taller components on the board. However, soldering components in the slots is limited by the process, preventing them from being soldered together with other components mounted on the board surface. These components must be soldered individually, resulting in a complex process.

[0004] Summary of the Invention

[0005] In view of this, the present application provides a board-level structure, device and electronic equipment to reduce the space occupied by devices with relatively high height on the external side of the circuit board, while simplifying the device installation process.

[0006] In the first aspect, an embodiment of the present application provides a board-level structure, which includes a second substrate and at least one first device. The first device includes a first body and a first substrate, and a first solder joint and a second solder joint are provided on the first substrate, and the first substrate is connected to the first body through the first solder joint. The second substrate includes a receiving portion and a third solder joint, and the third solder joint is located on the second substrate and close to the receiving portion. The first substrate is welded to the second substrate through the second solder joint and the third solder joint, and the first substrate is connected to the upper part of the receiving portion, and at least part of the first body extends into the receiving portion. Wherein, "above" refers to the outer side of the second substrate and a position that can be opposite to the receiving portion. For example, the first substrate can be connected to the surface of the second substrate, and the edge of the first substrate can overlap the second substrate around the receiving portion without extending into the receiving portion.

[0007] In this application, the accommodating portion on the second substrate can absorb part of the Z-direction height of the first body, reducing the Z-direction space occupied by the first body outside the second substrate, which is conducive to achieving a thin design of the electronic device. In addition, the accommodating portion is only used to accommodate the first body and is not used for soldering the first body. Therefore, there is no need to set up a separate solder pad in the accommodating portion, and the first substrate can be directly soldered to the second substrate via the second and third solder points. Therefore, it is only necessary to form solder points on the surface of the second substrate in a single process flow to connect to the first substrate. This can greatly simplify the assembly process and ensure assembly quality.

[0008] In one possible implementation, the receiving portion is a through-slot that extends through the second substrate along the thickness of the board-level structure. When the height of the first body is equal to or greater than the thickness of the second substrate, the height of the first body absorbed by the through-slot is equal to the thickness of the second substrate, thereby maximizing the height of the first body absorbed by the second substrate. Furthermore, the through-slot design eliminates the need for conventional solder joints at the bottom of the through-slot for soldering the first body.

[0009] In one possible implementation, a gap is provided between the inner wall of the housing portion and the first body. This gap can absorb installation tolerances of the first body, ensuring that the first body can be properly installed in the housing portion without interfering with or rubbing against the inner wall of the housing portion, potentially preventing installation failure or surface wear. Furthermore, this prevents vibration and heat from the second substrate from being directly transferred to the first body, reducing their impact on the first body.

[0010] In one possible implementation, the second substrate has a first surface and a second surface on both sides in the thickness direction. The board-level structure also includes at least one second component, which is connected to the first surface and / or the second surface. The first substrate is connected to the first surface and / or the second surface. As a result, the assembly between the first component, the second component, and the second substrate provided in the embodiments of the present application is relatively flexible and can be arranged according to the actual installation situation.

[0011] In one possible implementation, the first substrate is connected to the first surface, at least part of the second device is connected to the second surface, and along the thickness direction of the board-level structure, the height of the first body is less than or equal to the sum of the thickness of the second substrate and the height of the second device. Exemplarily, the accommodating portion is a through groove, and when the height of the first body is greater than the thickness of the second substrate and less than the sum of the thickness of the second substrate and the height of the second device, the first body is inserted into the through groove from the side of the second substrate having the first surface, and can pass through the through groove from the side of the second substrate having the second surface. Since the height of the first body is less than or equal to the sum of the thickness of the second substrate and the height of the second device, the part of the first body that passes through the through groove will not protrude from the end of the second device connected to the second surface, thereby allowing the second substrate and the second device to jointly absorb the overall height of the first body, thereby avoiding the first body occupying additional Z-direction space.

[0012] In one possible implementation, the first substrate and the second component are both connected to the first surface or the second surface, and along the thickness direction of the board-level structure, the height of the first body is less than or equal to the thickness of the second substrate. Exemplarily, the accommodating portion is a through-slot, the first substrate and the second component are both connected to the first surface, and the second surface is not provided with the second component. When the height of the first body is less than or equal to the thickness of the second substrate, the thickness of the second substrate can completely absorb the height of the first body, and the end of the first body away from the first substrate will not extend from the side of the second substrate having the second surface, thereby preventing the first body from occupying additional Z-direction space.

[0013] In addition, the design of the receiving portion as a through groove makes it impossible to set a welding point at the bottom of the through groove for welding the first body as in the prior art.

[0014] In a possible implementation, the accommodation portion is a groove.

[0015] In one possible implementation, the ratio of the thickness of the groove bottom to the thickness of the second substrate is less than 3 / 10. The solid material of the groove bottom has no strength requirements and can be thinner than in the prior art, thereby further expanding the groove space to accommodate the greater height of the first body.

[0016] In one possible implementation, the thickness of the second substrate is between 0.5 mm and 1.0 mm, and the thickness of the bottom of the groove is less than 0.3 mm. The thickness of the second substrate can be 0.5 mm, 0.6 mm, 1.0 mm, etc. Accordingly, if the bottom of the groove requires support, the thickness of the bottom of the groove needs to be greater than 0.3 mm to ensure support strength. In this embodiment, the first body does not require support from the bottom of the groove, and the thickness of the bottom of the groove can be further reduced to less than 0.3 mm, thereby further expanding the space of the groove to accommodate the greater height of the first body.

[0017] In a possible implementation manner, the second substrate is a printed circuit board.

[0018] In a second aspect, an embodiment of the present application further provides a first device, comprising a first substrate and a first body. The first substrate comprises a first surface and a second surface disposed opposite each other, a first solder joint and a second solder joint being provided on the first surface, the first substrate being connected to the first body via the first solder joint, and the second solder joint being used to connect to the second substrate. The second substrate is provided with a receiving portion, into which at least a portion of the first body extends.

[0019] Among them, the first device applied to the aforementioned board-level structure has a technical effect similar to that of the aforementioned board-level structure, which will not be repeated here.

[0020] In one possible implementation, a plurality of first bodies are provided, each of which is connected to the first substrate. The plurality of first bodies may perform the same function or different functions. By connecting the plurality of first bodies to one first substrate, the first device may be easily assembled onto the second substrate.

[0021] In one possible implementation, the first device further includes a second body disposed on the second surface. The first body and the second body are respectively connected to opposite sides of the first substrate. The first substrate provides more locations for connecting bodies capable of performing different functions, thereby enabling the arrangement of a greater number of functional devices on the second substrate, improving integration, saving space, and facilitating miniaturization of electronic devices.

[0022] In one possible implementation, along the thickness direction of the board-level structure, the height of the second body is less than the height of the first body. The first body, which is relatively large in height, is disposed on the side of the first substrate facing the second substrate, and the height of the first body can be absorbed by the accommodation portion of the second substrate, thereby reducing the space occupied outside the second substrate. The second body, which is relatively small in height, is disposed on the side of the first substrate facing away from the second substrate, forming a "forward-mounted" installation form. The height of the second body is comparable to the height of other second components and other devices, which can fully utilize the space above the first substrate without limiting the overall height of the board-level structure.

[0023] In one possible implementation, the first device further includes an encapsulation member, which is encapsulated around the first body. After the first body is soldered to the first substrate via the first solder joint, the encapsulation member can be fixedly encapsulated around the surface of the first device and can also encapsulate the first solder joint, thereby protecting the first body and the first solder joint from environmental impurities and moisture.

[0024] In a possible implementation manner, the first substrate is a printed circuit board.

[0025] In a third aspect, an embodiment of the present application further provides an electronic device, which includes the board-level structure provided in the first aspect of the present application. The electronic device including the aforementioned board-level structure has similar technical effects as the aforementioned board-level structure, which will not be described in detail here.

[0026] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] FIG1 is a schematic structural diagram of a first device provided by an embodiment of the present application;

[0029] FIG2 is a schematic diagram of a board-level structure provided by a first embodiment of the present application;

[0030] FIG3 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0031] FIG4 is a schematic diagram of a board-level structure provided by a second embodiment of the present application;

[0032] FIG5 is a schematic diagram of a board-level structure provided by a third embodiment of the present application;

[0033] FIG6 is a schematic diagram of a board-level structure provided by a fourth embodiment of the present application;

[0034] FIG7 is a schematic structural diagram of a first device provided in another embodiment of the present application;

[0035] FIG8 is a schematic diagram of a board-level structure provided by a fifth embodiment of the present application;

[0036] FIG9 is a schematic diagram of a board-level structure provided by a sixth embodiment of the present application;

[0037] FIG10 is a schematic structural diagram of a first device provided in yet another embodiment of the present application;

[0038] FIG11 is a schematic structural diagram of a first device provided in yet another embodiment of the present application.

[0039] Figure numerals: 1-first device; 11-first substrate; 111-first surface; 112-second surface; 12-first body; 13-first solder joint; 14-second solder joint; 15-second body; 2-second substrate; 21-accommodating portion; 22-physical material; 23-first surface; 24-second surface; 3-second device; 4-package; Z-thickness direction. DETAILED DESCRIPTION

[0040] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0041] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0042] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0043] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0044] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0045] Mobile phones, computers, and other electronic devices implement different functions by integrating various components on the circuit board. These components are usually soldered on the same plane on the circuit board, and their heights vary along the thickness direction of the electronic device. One or more components with higher heights on the circuit board affect the Z-direction space (the space along the thickness direction of the electronic device) occupied by the electronic device, thereby affecting the thickness of the electronic device. For example, on the same circuit board, there is a height difference between the tallest component and other smaller components. The space within the height difference is usually unusable, and due to the limitation of the tallest component, the space cannot be further compressed along the Z-direction, resulting in a thicker electronic device, which is not conducive to achieving a thinner design of the electronic device.

[0046] When considering reducing the Z-direction space occupied by components in electronic equipment, it is generally considered to open a groove on the circuit board and solder the components with a larger height at the bottom of the groove so that the groove absorbs part of the height of the component. However, setting a pad in the groove will be limited by the process flow. For example, a screen printing process is generally used to print pads on the surface of the circuit board, that is, a set gap is maintained between the screen and the surface of the circuit board. A pad with a preset thickness can be formed through the gap, but at the groove position, the distance between the bottom surface of the groove and the screen is relatively large, resulting in the groove being filled with tin material, and no effective pad can be formed, and the component cannot be installed. This requires a separate process for the pad in the groove. In other words, the pads on the surface of the circuit board and the pads in the groove require at least two processes to be realized. The process is complicated and it is easy for defects such as glue spots and foreign matter to appear on the pads processed in the groove.

[0047] Figure 1 is a schematic diagram of the structure of a first device 1 provided by an embodiment of the present application, and Figure 2 is a schematic diagram of the structure of a board-level structure provided by the first embodiment of the present application. Referring to Figure 1, the embodiment of the present application provides a first device 1, which can be used to be assembled into a board-level structure (refer to Figure 2). The board-level structure can be applied to electronic devices to realize various functions in electronic devices. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a smart home, a smart bracelet, a smart watch, a smart helmet, smart glasses, etc., a vehicle-mounted device, a smart city device, etc. The embodiment of the present application does not limit the specific type of electronic device. Figure 3 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application. Figure 3 only exemplarily shows that the electronic device is a mobile phone. The embodiment of the present application is described by taking the electronic device as a mobile phone as an example.

[0048] Referring to Figure 1, the first device 1 includes a first substrate 11 and at least one first body 12. The first body 12 can be an inductor, a capacitor, a chip component, or of course other components. These components may have pins or not have pins and can be soldered on the hard first substrate 11. The first substrate 11 can be a printed circuit board (PCB). In some embodiments, the printed circuit board PCB can use a flame-resistant material (FR-4) dielectric board, a Rogers dielectric board, a mixed dielectric board of Rogers and FR-4, and so on. Here, FR-4 is a code for a grade of flame-resistant material, and the Rogers dielectric board is a high-frequency board. In some embodiments, the second substrate 2 and the first substrate 11 can also be other plates, such as a silicon substrate. The first substrate 11 is a hard material and can be stably soldered and fixed on the second substrate.

[0049] 1 and 2 , the first substrate 11 includes a first surface 111 and a second surface 112 that are arranged opposite to each other, a first solder joint 13 and a second solder joint 14 being provided on the first surface 111, the first substrate 11 being connected to the first body 12 via the first solder joint 13, a third solder joint being provided on the second substrate 2, and the first substrate 11 being welded to the second substrate 2 via the second solder joint 14 and the third solder joint (not shown in the figure). The second substrate 2 can be made of the same sheet material as the first substrate 11, which will not be described in detail here. The second substrate 2 is used to install various devices, and a wiring layer is provided on the second substrate 2 to enable electrical connection of various devices. Among them, the second substrate 2 and the first device 1 can form a board-level structure after assembly, and the board-level structure can be installed as a whole in an electronic device. In one embodiment, the first device 1 in the board-level structure can be provided with one or more, and the specific number can be arranged according to actual conditions.

[0050] 2 , a receiving portion 21 is provided on the second substrate 2. A surface of the first substrate 11 connected to the first body 12 spans across both ends of the receiving portion 21, and at least a portion of the first body 12 extends into the receiving portion 21. The receiving portion 21 can be formed by reducing material from a portion of the second substrate 2. In one embodiment, FIG4 is a schematic diagram of the board-level structure provided in the second embodiment of the present application. Referring to FIG4 , the receiving portion 21 can be understood as a concave structure formed by a portion of the second substrate 2 being recessed from one side of the second substrate 2 toward another layer, such as a groove. In one embodiment, referring to FIG2 , the receiving portion 21 can also be understood as a through-slot opened on the first substrate 11. In other words, whether the receiving portion 21 is specifically a groove or a through-slot, it can provide space for accommodating the first body 12, allowing at least a portion of the first body 12 to be disposed in the receiving portion 21 to absorb part of the Z-direction height of the first body 12, reducing the Z-direction space occupied by the first body 12 outside the second substrate 2, and facilitating a thin design of the electronic device.

[0051] In addition, in this embodiment, the first substrate 11 can be connected to the surface of the second substrate 2 at either end of the accommodating portion 21, thereby allowing a solder pad to be formed on the surface of the second substrate 2 at one time through a screen printing process, so that the first substrate 11 is connected across the top of the accommodating portion 21, wherein "top" refers to the outside of the second substrate 2 and a position that can be opposite to the accommodating portion 21. For example, the first substrate 11 can be connected to the surface of the second substrate 2, and the edge of the first substrate 11 can overlap the second substrate 2 around the accommodating portion 21 without extending into the accommodating portion 21. The accommodating portion 21 is only used to accommodate the first body 12 and is not used for soldering the first body 12. Therefore, there is no need to set a separate solder pad in the accommodating portion 21. Therefore, when the first device 1 provided in this embodiment is assembled into a board-level structure with the second substrate 2, the assembly process can be greatly simplified to ensure assembly quality.

[0052] More other devices can also be connected to the second substrate 2. For the sake of convenience, the device with a smaller height connected to the second substrate 2 can be defined as the second device 3. The second device 3 can be provided with one or more. The second device 3 can be provided on one side of the second substrate 2 along the thickness direction Z, or on both sides of the second substrate 2. The height of the first device 1 is greater than the height of the second device 3. In one embodiment, the first substrate 11 and the second device 3 can be fixed on the surface of the same side of the second substrate 2, and the protruding directions of the first device 1 and the second device 3 are opposite. The second device 3 protrudes toward the outside of the second substrate 2 to form a "positive installation" form, while the first body 12 protrudes toward the inside of the second substrate 2 to form a "flip-chip" form, so that it can extend into the accommodating portion 21, and the height of the first device 1 is absorbed by the accommodating portion 21, thereby reducing the Z-direction space occupied by the first device 1 outside the second substrate 2. Among them, the solder pads for connecting the first substrate 11 and the second device 3 can be formed at one time on the surface of the second substrate 2 using a screen printing process, so that the first substrate 11 and the second device 3 can be connected to the second substrate 2 in the same process flow, thereby simplifying the process and ensuring the assembly quality of the first substrate 11 and the second device 3 on the second substrate 2.

[0053] In one embodiment, FIG5 is a schematic diagram of a board-level structure provided by the third embodiment of the present application. Referring to FIG5 , the second substrate 2 has a first surface 23 and a second surface 24 on both sides in the thickness direction Z. In one embodiment, the first surface 23 and the second surface 24 are both planes. The board-level structure also includes at least one second device 3, which is connected to the first surface 23 and / or the second surface 24. For example, the plurality of second devices 3 can all be connected to the first surface 23 or the second surface 24, or some of the second devices 3 can be connected to the first surface 23 and another portion of the second devices 3 can be connected to the second surface 24. The first substrate 11 is connected to the first surface 23 and / or the second surface 24. For example, the plurality of first substrates 11 can all be connected to the first surface 23 or the second surface 24, or some of the first substrates 11 can be connected to the first surface 23 and another portion of the first substrates 11 can be connected to the second surface 24. As a result, the assembly between the first device 1, the second device 3, and the second substrate 2 provided in the embodiment of the present application is relatively flexible and can be arranged according to the actual installation situation.

[0054] In one embodiment, referring to FIG5 , the first substrate 11 is connected to the first surface 23, and at least a portion of the second device 3 is connected to the second surface 24. Along the thickness direction Z of the board-level structure, the height of the first body 12 is less than or equal to the sum of the thickness of the second substrate 2 and the height of the second device 3. In one embodiment, the accommodating portion 21 is a through-slot, and when the height of the first body 12 is greater than the thickness of the second substrate 2 but less than the sum of the thickness of the second substrate 2 and the height of the second device 3, the first body 12 is inserted into the through-slot from the side of the second substrate 2 having the first surface 23 and can be passed through the through-slot from the side of the second substrate 2 having the second surface 24. Because the height of the first body 12 is less than or equal to the sum of the thickness of the second substrate 2 and the height of the second device 3, the portion of the first body 12 that passes through the through-slot does not protrude beyond the end of the second device 3 connected to the second surface 24. Thus, the entire height of the first body 12 can be absorbed by the second substrate 2 and the second device 3, thereby avoiding the first body 12 occupying additional Z-direction space.

[0055] In one embodiment, FIG6 is a schematic diagram of a board-level structure provided in a fourth embodiment of the present application. Referring to FIG6 , the first substrate 11 and the second device 3 are both connected to the first surface 23 or the second surface 24. Along the thickness direction Z of the board-level structure, the height of the first body 12 is less than or equal to the thickness of the second substrate 2. Exemplarily, the accommodating portion 21 is a through-slot, the first substrate 11 and the second device 3 are both connected to the first surface 23, and the second surface 24 is not provided with the second device 3. When the height of the first body 12 is less than or equal to the thickness of the second substrate 2, the thickness of the second substrate 2 can completely absorb the height of the first body 12. The end of the first body 12 away from the first substrate 11 will not extend from the side of the second substrate 2 having the second surface 24, thereby also preventing the first body 12 from occupying additional Z-direction space.

[0056] In one embodiment, the first body 12 may not be in contact with the second substrate 2. When the board-level structure is vibrated, the vibration of the second substrate 2 may be preferentially transmitted to the first substrate 11, and then transmitted to the first body 12 by the first substrate 11. That is to say, the vibration of the second substrate 2 will not be directly transmitted to the first body 12, but may first be buffered and shock-absorbed by the first substrate 11 to weaken the impact of the vibration, thereby significantly reducing the vibration received by the first body 12. As a result, it has a good buffering effect on the first body 12 that is sensitive to stress or vibration. In addition, the heat from the second substrate 2 will not be directly transmitted to the first body 12, but may be preferentially transmitted to the first substrate 11 and dissipated through the first substrate 11, thereby significantly reducing the heat transferred to the body, which has a positive benefit for the temperature-sensitive first body 12.

[0057] In some other embodiments, the second device 3 with a smaller height can also cooperate with the accommodating portion 21 on the above-mentioned second substrate 2, so that the height of the second device 3 can be absorbed by the accommodating portion 21, thereby releasing the external space of the second substrate 2 and improving the integration.

[0058] In one embodiment, referring to FIG2 , regarding heat transfer between the second substrate 2, the first substrate 11, and the first body 12, by providing the first solder joint 13 and the second solder joint 14, the heat transfer path of the second substrate 2 is, in order: the second substrate 2, the second solder joint 14, the first substrate 11, the first solder joint 13, and the first body 12. The portion of the first body 12 within the accommodating portion 21 does not contact the inner wall of the accommodating portion 21, i.e., the first body 12 does not contact the second substrate 2. Therefore, the heat of the second substrate 2 is not directly transferred to the first body 12. Instead, it is preferentially transferred to the second solder joint 14, the first substrate 11, and the first solder joint 13 in sequence, and dissipated through the second solder joint 14, the first substrate 11, and the first solder joint 13. The first substrate 11 has a larger area than the solder joints, allowing it to dissipate most of the heat, thereby significantly reducing the amount of heat transferred to the first body 12. This has a positive benefit for the temperature-sensitive first body 12.

[0059] In addition, by setting the first solder point 13 and the second solder point 14, when the board-level structure as a whole is subjected to a large vibration, the vibration can be preferentially buffered between the second solder point 14, the first substrate 11 and the first solder point 13, thereby reducing the vibration transmitted to the first body 12. This has a certain buffering effect on the first body 12 that is sensitive to stress or vibration, reducing the impact of vibration.

[0060] In one embodiment, the first substrate 11 and the first body 12 can be manufactured as an independent device product, namely the above-mentioned first device 1. The first device 1 can be fixed to the second substrate 2 as a whole through the first substrate 11, and can be welded and fixed to the second substrate 2 with other second devices 3 through the same process flow, thereby simplifying the welding process flow.

[0061] In one embodiment, as described above, the accommodating portion 21 can be a groove. For grooves on existing circuit boards that require soldering devices, the device needs to be soldered to the bottom of the groove and supported by the solid material 22 at the bottom of the groove. In order to ensure the reliability of the device support, this part of the solid material 22 at the bottom of the groove needs to have a certain thickness. Generally, this thickness needs to be greater than 30% of the thickness of the second substrate 2. As a result, the depth of the groove cannot be too large, and the absorption of the device height is very limited. The groove in the second substrate 2 of the present application is not used to support the device and there is no need for soldering. It is only used to provide space for accommodating the first body 12. In other words, during the molding process of the second substrate 2, the groove can be molded at the same time. Therefore, the solid material 22 at the bottom of the groove does not need to consider the strength of the device support. The depth of the groove can be increased, and the thickness of the solid material 22 at the bottom of the groove can be made smaller. In one embodiment, referring to Figure 4, the ratio of the thickness H3 of the solid material 22 at the bottom of the groove to the thickness H1 of the second substrate 2 is less than 3 / 10. That is to say, the thickness H2 of the solid material 22 at the bottom of the groove does not need to be greater than 30% of the thickness H1 of the second substrate 2, but can be further reduced to further expand the space of the groove to absorb a greater height of the first body 12. For example, referring to Figure 4, the thickness H1 of the second substrate 2 can be between 0.5mm and 1.0mm, and the thickness H1 of the solid material 22 at the bottom of the groove is less than 0.3mm. Among them, the thickness value of the second substrate can be 0.5mm, 0.6mm, 1.0mm, etc. Correspondingly, if the bottom of the groove requires a supporting device, then the thickness of the bottom of the groove needs to be greater than 0.3mm to ensure the supporting strength. In this embodiment, the first body does not need support from the bottom of the groove, and the thickness of the bottom of the groove can be further thinned to a range of less than 0.3mm, thereby further expanding the space of the groove to absorb a greater height of the first body.

[0062] In one embodiment, referring to FIG2 , as described above, the accommodating portion 21 may also be a through groove, which passes through the second substrate 2 along the thickness direction Z of the plate-level structure. That is to say, when the height of the first body 12 is greater than or equal to the thickness of the second substrate 2, the height value of the first body 12 absorbed by the through groove is equal to the thickness of the second substrate 2, thereby maximizing the height of the first body 12 absorbed by the second substrate 2. As for the aforementioned groove with support for welding devices, in order to provide support for the device, the entity part at the bottom of the groove cannot pass through, and it is impossible to design a through groove in the second substrate 2 of this application. Therefore, the entity part at the bottom of the aforementioned groove with support for welding devices limits the absorption of the height of the first body 12, while the through groove on the second substrate 2 of this application can maximize the absorption of the height of the first body 12.

[0063] In one embodiment, there is a gap between the inner wall of the accommodating portion 21 and the first body 12. When assembling the first body 12 to the second substrate 2, the first body 12 can be welded to the first substrate 11 first, and then the first body 12 can be inserted into the accommodating portion 21 on the second substrate 2, and the first substrate 11 can be welded to the second substrate 2. By providing a gap between the inner wall of the accommodating portion 21 and the first body 12, the installation tolerance of the first body 12 can be absorbed by the gap, ensuring that the first body 12 can be normally installed in the accommodating portion 21 without interfering with or rubbing against the inner wall of the accommodating portion 21, causing the first body 12 to be unable to be installed or the surface to be worn. In addition, it is also possible to prevent vibration and heat from the second substrate 2 from being directly transferred to the first body 12, thereby reducing the impact of vibration and heat on the first body 12.

[0064] In one embodiment, FIG7 is a schematic structural diagram of a first device 1 provided in another embodiment of the present application, and FIG8 is a schematic diagram of a board-level structure provided in a fifth embodiment of the present application. Referring to FIG7 and FIG8, a plurality of first bodies 12 may be provided, and the plurality of first bodies 12 are spaced apart on a first substrate 11. There may be two, three or more first bodies 12, and each first body 12 may be fixed to the same first substrate 11, so that one first substrate 11 and the plurality of first bodies 12 constitute a component as a whole. The first substrate 11 and the second substrate 2 may then be connected to achieve fixed assembly of the component as a whole, thereby facilitating process processing. In one embodiment, referring to FIG8, there may be one accommodating portion 21 on the second substrate 2, so that the accommodating portion 21 can accommodate multiple first bodies 12 at the same time. In one embodiment, there may also be multiple accommodating portions 21 on the second substrate 2, and each accommodating portion 21 can accommodate one first body 12. In some other embodiments, referring to FIG2, there may also be only one first body 12.

[0065] In one embodiment, Figure 9 is a schematic diagram of the board-level structure provided by the sixth embodiment of the present application. Referring to Figure 9, a plurality of first bodies 12 and first substrates 11 can be provided, and one first substrate 11 is connected to a corresponding first body 12. In other words, a first body 12 and a first substrate 11 can constitute a component, and there can be multiple such components, and they can be connected to the second substrate 2 respectively. The individual components can be arranged adjacent to each other, or they can be arranged in an interlaced manner with the second device 3. In addition, a first substrate 11 connected to multiple first bodies 12 and a first substrate 11 connected to only one first body 12 can also be assembled on the second substrate 2 at the same time, and the specific setting can be selectively determined according to the actual application.

[0066] In one embodiment, FIG10 is a schematic structural diagram of a first device 1 provided in yet another embodiment of the present application. Referring to FIG10 , the board-level structure further includes a second body 15, which is disposed on the second surface 112 of the first substrate 11. In other words, the first body 12 and the second body 15 are respectively connected to opposite sides of the first substrate 11. The first substrate 11 provides more locations for connecting bodies capable of performing different functions, thereby enabling the arrangement of a greater number of functional devices on the second substrate 2, improving integration, saving space, and facilitating the miniaturization of electronic devices.

[0067] In the thickness direction Z of the board-level structure, the height of the second body 15 is less than the height of the first body 12. The first body 12, which is relatively taller, is disposed on the side of the first substrate 11 facing the second substrate 2. The height of the first body 12 can be absorbed by the accommodation portion 21 of the second substrate 2, thereby reducing the space occupied outside the second substrate 2. The second body 15, which is relatively shorter, is disposed on the side of the first substrate 11 facing away from the second substrate 2, forming the aforementioned "upright" installation form. The height of the second body 15 is comparable to the height of other components, such as the second device 3, fully utilizing the space above the first substrate 11 without limiting the overall height of the board-level structure.

[0068] In one embodiment, FIG11 is a schematic structural diagram of a first device 1 provided in another embodiment of the present application. Referring to FIG11 , the board-level structure further includes a package 4, which is fixedly coated on the first body 12. The package 4 can be made of epoxy resin or silicone-based materials. After the first body 12 is welded to the first substrate 11 through the first solder joint 13, the package 4 can be fixedly coated on the surface of the first device 1, and the first solder joint 13 can also be coated therein, thereby protecting the first body 12 and the first solder joint 13, and preventing impurities and water vapor in the environment from corroding the first body 12 and the first solder joint 13.

[0069] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A board-level structure, characterized in that: include: at least one first device, the first device comprising a first body and a first substrate, the first substrate being provided with a first solder joint and a second solder joint, the first substrate being connected to the first body via the first solder joint; A second substrate, the second substrate comprising a receiving portion and a third welding point; the third welding point is located on the second substrate and close to the receiving portion; The first substrate is welded to the second substrate via the second welding point and the third welding point. The first substrate is connected across the top of the accommodating portion. At least a portion of the first body extends into the accommodating portion.

2. The board-level structure according to claim 1, characterized in that: The accommodation portion is a through groove, and the through groove penetrates the second substrate along the thickness direction of the board-level structure.

3. The board-level structure according to claim 1 or 2, characterized in that: A gap is defined between an inner wall of the accommodation portion and the first body.

4. The board-level structure according to claim 2 or 3, characterized in that: The second substrate has a first surface and a second surface on both sides in the thickness direction; The board-level structure further includes at least one second device, wherein the second device is connected to the first surface and / or the second surface; The first substrate is connected to the first surface and / or the second surface.

5. The board-level structure according to claim 4, characterized in that: The first substrate is connected to the first surface, at least part of the second device is connected to the second surface, and along the thickness direction of the board-level structure, the height of the first body is less than or equal to the sum of the thickness of the second substrate and the height of the second device.

6. The board-level structure according to claim 4, characterized in that: The first substrate and the second device are both connected to the first surface or the second surface, and along the thickness direction of the board-level structure, the height of the first body is less than or equal to the thickness of the second substrate.

7. The board-level structure according to claim 1, characterized in that: The accommodating portion is a groove.

8. The board-level structure according to claim 7, characterized in that: The ratio of the thickness of the bottom of the groove to the thickness of the second substrate is less than 3 / 10.

9. The board-level structure according to claim 8, characterized in that: The thickness of the second substrate is between 0.5 mm and 1.0 mm.

10. The board-level structure according to claim 7, characterized in that: The thickness of the bottom of the groove is less than 0.3 mm.

11. The board-level structure according to any one of claims 1 to 10, characterized in that: The second substrate is a printed circuit board.

12. A first device, characterized in that: The first device comprises: first ontology; A first substrate, the first substrate includes a first surface and a second surface arranged opposite to each other; the first surface is provided with a first welding point and a second welding point, the first substrate is connected to the first body through the first welding point, and the second welding point is used to connect to the second substrate; wherein a receiving portion is provided on the second substrate, and at least a portion of the first body extends into the receiving portion.

13. The first device according to claim 12, characterized in that A plurality of the first bodies are provided, and the plurality of the first bodies are all connected to the first substrate.

14. The first device according to claim 12 or 13, characterized in that It also includes a second body, wherein the second body is disposed on the second surface.

15. The first device according to claim 14, characterized in that Along a thickness direction of the first device, a height of the second body is smaller than a height of the first body.

16. The first device according to any one of claims 12 to 15, characterized in that: It also includes a packaging component, which is coated on the first body.

17. The first device according to any one of claims 12 to 16, characterized in that: The first substrate is a printed circuit board.

18. An electronic device, characterized in that: The board-level structure comprises the board-level structure described in any one of claims 1-11.

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