Side storage and substrate processing apparatus including same

Abstract

The present invention relates to a side storage and a substrate processing apparatus including same. According to an embodiment, a side storage may include: a housing for providing an accommodation space in which a substrate is accommodated; a support body for supporting the substrate in the accommodation space; and a gas spraying unit for spraying purge gas into the accommodation space, wherein the gas spraying unit includes: a body having an inner space, the front face of which is open; a baffle plate which is positioned in the front face of the inner space and has a spraying hole formed therethrough; and a gas supply line for supplying the purge gas into the inner space, the gas spraying unit dispersing gas for purging the inside of a side storage to control a vortex therein.

Description

Side storage and substrate processing device including the same

[0001] The present invention relates to a side storage and a substrate processing device including the same, and more particularly, to a side storage that controls a vortex by dispersing a gas that purges the inside of the side storage, and a substrate processing device that processes a substrate using the same.

[0002] Plasma is an ionized gas state composed of ions, electrons, and radicals, and is created by very high temperatures, strong electric fields, or high-frequency electromagnetic fields (RF electromagnetic fields).

[0003] Such plasma treatments are used in processes for manufacturing semiconductor devices, such as thin film deposition, cleaning, ashing or etching processes.

[0004] Typically, processed wafers generate fume due to the nature of the plasma process. Furthermore, heat is generated when ions accelerated by an electric field collide with the wafer. The processed wafers are transferred to side storage. The side storage then injects purge gas into its internal space. The internal space is purged by the purge gas, which cools the wafer and removes fumes. However, if eddies are created in the internal space during this process, the wafer cooling becomes uneven, and the fumes are not completely removed, resulting in wafer defects.

[0005] The present invention aims to provide a side storage capable of effectively removing fume generated after a plasma process and a substrate processing device including the same.

[0006] The present invention aims to provide a side storage capable of uniformly cooling the temperature of a substrate after a plasma process and a substrate processing device including the same.

[0007] The purpose of the present invention is not limited thereto, and other purposes not mentioned will be clearly understood by those skilled in the art from the description below.

[0008] A device for processing a substrate is disclosed. According to one embodiment of the present invention, the device comprises: an index module; a processing module for processing a substrate; and a load lock chamber disposed between the index module and the processing module and capable of controlling an internal pressure, wherein the index module comprises: a load port on which a storage container for storing the substrate is mounted; a side storage for temporarily storing a substrate processed in the processing module; and an index robot for transferring the substrate between the storage container placed on the load port, the side storage, and the load lock chamber, wherein the side storage comprises: a housing providing a storage space for storing the substrate; a support for supporting the substrate in the storage space; and a gas injection unit for injecting a purge gas into the storage space; wherein the gas injection unit may have a body having an internal space with an open front face; a baffle plate positioned at a front of the internal space and having an injection hole formed therein; and a gas supply line for supplying the purge gas into the internal space.

[0009] In one embodiment, the baffle plate includes a first plate that supplies the purge gas in a direction inclined toward a first side of the storage space; and a second plate that supplies the purge gas in a direction inclined toward a second side of the storage space, wherein the first side and the second side may be faces facing each other.

[0010] In one embodiment, the front region of the storage space is adjacent to the return space provided with the index robot, and the gas injection unit can be disposed in the rear region of the storage space.

[0011] In one embodiment, the baffle plate may further include a third plate disposed between the first plate and the second plate and supplying the purge gas in a direction toward the return space.

[0012] In one embodiment, the housing includes the first side, the second side, a rear surface, a first inclined surface, and a second inclined surface, the first inclined surface being positioned between the first side and the rear surface and being inclined in a direction away from one end of the rear surface, the second inclined surface being positioned between the second side and the rear surface and being inclined in a direction away from the other end of the rear surface, and the front region of the storage space may be a region defined by the first side and the second side, and the rear region of the storage space may be a region defined by the rear surface, the first inclined surface, and the second inclined surface.

[0013] In one embodiment, the length of the back surface may be shorter than the diameter of the substrate.

[0014] According to one embodiment, the support has a first support, a second support, and a third support provided in a vertical direction, and each of the first support, the second support, and the third support may be provided with a plurality of protrusions in a vertical direction for supporting an edge of the substrate.

[0015] In one embodiment, the injection holes formed in the first plate and the second plate may be provided in plurality to supply the purge gas to each space between adjacent substrates among the substrates placed on the support.

[0016] A side storage for temporarily storing a substrate is disclosed. According to one embodiment, the side storage comprises: a housing providing a storage space for storing a substrate; a support for supporting the substrate in the storage space; and a gas injection unit for injecting a purge gas into the storage space; wherein the gas injection unit may have a body having an internal space with an open front face; a baffle plate positioned at the front of the internal space and having an injection hole formed therein; and a gas supply line for supplying the purge gas into the internal space.

[0017] In one embodiment, the baffle plate includes a first plate that supplies the purge gas in a direction inclined toward a first side of the storage space; and a second plate that supplies the purge gas in a direction inclined toward a second side of the storage space, wherein the first side and the second side may be faces facing each other.

[0018] In one embodiment, the housing is provided in a form in which an entrance leading to the internal space is open, and the gas injection unit can be placed in a rear area in the storage space.

[0019] In one embodiment, the baffle plate may further include a third plate disposed between the first plate and the second plate and supplying the purge gas in a direction toward the front of the housing.

[0020] In one embodiment, the housing includes the first side, the second side, a rear surface, a first inclined surface, and a second inclined surface, the first inclined surface being positioned between the first side and the rear surface and being inclined in a direction away from one end of the rear surface, the second inclined surface being positioned between the second side and the rear surface and being inclined in a direction away from the other end of the rear surface, and the front region of the storage space may be a region defined by the first side and the second side, and the rear region of the storage space may be a region defined by the rear surface, the first inclined surface, and the second inclined surface.

[0021] In one embodiment, the length of the back surface may be shorter than the diameter of the substrate.

[0022] According to one embodiment, the support has a first support, a second support, and a third support provided in a vertical direction, and each of the first support, the second support, and the third support may be provided with a plurality of protrusions in a vertical direction for supporting an edge of the substrate.

[0023] In one embodiment, the injection holes formed in the first plate and the second plate may be provided in plurality to supply the purge gas to each space between adjacent substrates among the substrates placed on the support.

[0024] A device for processing a substrate is disclosed. According to one embodiment, the device comprises: an index module; a processing module for processing a substrate; a load lock chamber disposed between the index module and the processing module and capable of controlling an internal pressure, wherein the index module comprises: a load port on which a storage container for storing the substrate is mounted; a side storage for temporarily storing a substrate processed in the processing module; and an index robot for transferring the substrate between the storage container placed on the load port, the side storage, and the load lock chamber, wherein the side storage comprises: a housing providing a storage space for storing the substrate; a support for supporting the substrate in the storage space; and a gas injection unit for injecting a purge gas into the storage space. and the housing includes a first side, a second side, a rear surface, a first inclined surface, and a second inclined surface, wherein the first side and the second side are surfaces facing each other, the first inclined surface is positioned between the first side and the rear surface and is inclined in a direction away from one end of the rear surface, the second inclined surface is positioned between the second side and the rear surface and is inclined in a direction away from the other end of the rear surface, the length of the rear surface is shorter than the diameter of the substrate, the front region of the storage space is a region defined by the first side and the second side, the rear region of the storage space is a region defined by the rear surface, the first inclined surface, and the second inclined surface, and the support has a first support, a second support, and a third support, the length direction of which is provided in an up-down direction, and each of the first support, the second support, and the third support has a protrusion that supports an edge of the substrate. A plurality of gas injection units are provided in the direction, and the gas injection unit may have a body having an internal space with an open front face; a baffle plate positioned at the front of the internal space and having injection holes formed therein;A gas supply line for supplying the purge gas to the internal space is included, and the baffle plate includes: a first plate for supplying the purge gas in a direction inclined toward a first side of the storage space; a second plate for supplying the purge gas in a direction inclined toward a second side of the storage space; and a third plate disposed between the first plate and the second plate for supplying the purge gas in a direction toward the return space, and the injection holes formed in the first plate, the second plate, and the third plate may be provided in multiple numbers to supply the purge gas to each of spaces between adjacent substrates among substrates placed on the support.

[0025] According to one embodiment of the present invention, fume generated after a plasma process can be effectively removed.

[0026] Additionally, according to one embodiment of the present invention, the temperature of the substrate can be uniformly cooled after the plasma process.

[0027] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person skilled in the art to which the present invention pertains from this specification and the attached drawings.

[0028] The various features and advantages of the non-limiting embodiments of this disclosure will become more apparent upon review of the detailed description in conjunction with the accompanying drawings. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. The accompanying drawings are not to scale unless explicitly stated otherwise. Various dimensions in the drawings may be exaggerated for clarity.

[0029] FIG. 1 is a drawing showing a substrate manufacturing device according to one embodiment of the present invention.

[0030] FIG. 2 is a drawing showing side storage according to one embodiment of the present invention.

[0031] Figure 3 is a drawing showing a front view of a gas injection unit according to one embodiment of the present invention.

[0032] Fig. 4 is a cross-sectional view showing a cross-section of a baffle plate among the gas injection units of Fig. 3.

[0033] Fig. 5 is a drawing showing the gas injection unit of Fig. 3 as viewed from the rear side.

[0034] Figure 6 is a diagram showing the flow of air in a typical side storage.

[0035] FIG. 7 is a diagram showing the flow of air in a side storage according to one embodiment of the present invention.

[0036] FIG. 8 is a drawing showing side storage according to another embodiment of the present invention.

[0037] FIG. 9 is a drawing showing side storage according to another embodiment of the present invention.

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. These exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope of the present disclosure to those skilled in the art. To provide a thorough understanding of the embodiments of the present disclosure, numerous specific details, such as examples of specific components, devices, and methods, are set forth. It will be apparent to those skilled in the art that specific details are not necessarily required, and that the exemplary embodiments can be implemented in many different forms, and neither should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail.

[0039] The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the example embodiments. As used herein, the singular or non-plural forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are open-ended and thus specify the presence of stated features, elements, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, elements, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations herein are not necessarily to be construed as necessarily being performed in the particular order discussed or described, unless such order is explicitly stated. Additionally, additional or alternative steps may be selected.

[0040] When an element or layer is referred to as being "on," "connected," "joined," "attached," "adjacent," or "covering" another element or layer, it is intended that it is directly on, connected, joined, attached, adjacent, or covering said other element or layer, or that intermediate elements or layers may be present. Conversely, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, it should be understood that no intermediate elements or layers are present. Like reference numerals refer to like elements throughout the specification. The term "and / or" as used herein includes all combinations and subcombinations of one or more of the listed items.

[0041] Although terms such as first, second, third, etc. may be used herein to describe various elements, regions, layers, and / or sections, it should be understood that these elements, regions, layers, and / or sections are not limited by these terms. These terms are used merely to distinguish one element, region, layer, or section from another element, region, layer, or section. Thus, a first element, a first region, a first layer, or a first section discussed below could also be referred to as a second element, a second region, a second layer, or a second section without departing from the teachings of the exemplary embodiments.

[0042] Spatially relative terms (e.g., "beneath," "beneath," "lower," "above," "top," etc.) may be used for convenience of description to describe the relationship of one element or feature to other element(s) or features as depicted in the drawings. It should be understood that spatially relative terms are intended to encompass not only the orientation depicted in the drawings, but also other orientations of the device in use or operation. For example, if the device in the drawings were turned over, elements described as "beneath" or "below" other elements or features would then be oriented "above" the other elements or features. Thus, the term "beneath" can encompass both above and below orientations. The device can be oriented differently (rotated 90 degrees, or at other orientations), and the spatially relative descriptive phrases used herein can be interpreted accordingly.

[0043] When using the terms "same" or "same" in the description of embodiments, it should be understood that there may be some inaccuracy. Therefore, when one element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within manufacturing or operating tolerances (e.g., ±10%).

[0044] When the terms "approximately" or "substantially" are used herein in connection with a numerical value, it should be understood that the numerical value includes manufacturing or operating tolerances (e.g., ±10%) of the stated value. Furthermore, when the terms "typically" and "substantially" are used in connection with geometrical shapes, it should be understood that geometrical accuracy is not required, but that latitude in the shape is within the disclosed scope.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. Furthermore, terms, including terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with their meaning within the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0046] In this embodiment, a wafer is used as an example of a processing target. However, the technical concept of the present invention can also be applied to devices used for processing other types of substrates other than wafers.

[0047] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings.

[0048] FIG. 1 is a drawing showing a substrate manufacturing apparatus according to one embodiment of the present invention. Referring to FIG. 1, the substrate manufacturing apparatus (300) of the present invention includes a processing module (100) in which a wafer processing process is performed, and an index module (200) for taking out and inserting wafers from the processing module (100). Specifically, the processing module (100) includes a plurality of process chambers (110a, 110b, 110c, 110d), a transfer chamber (120), a first transfer robot (140), and a loadlock chamber (150).

[0049] The process chambers (110a, 110b, 110c, 110d) each receive a wafer and process the wafer by performing a semiconductor process using plasma. For example, the semiconductor process may be a process such as etching, cleaning, ashing, or surface modification.

[0050] The transfer chamber (120) has a generally polygonal shape when viewed from above and is connected to the process chambers (110a, 110b, 110c, 110d) and the load lock chamber (150). A first transfer robot (140) is installed inside the transfer chamber (120). The first transfer robot (140) loads wafers into each of the process chambers (110a, 110b, 110c, 110d) or unloads wafers from the process chambers (110a, 110b, 110c, 110d). In addition, the first transfer robot (140) transfers wafers between the process chambers (110a, 110b, 110c, 110d) and the load lock chamber (150).

[0051] A load lock chamber (150) is provided between the transfer chamber (120) and the index module (200). The load lock chamber (150) has a loading chamber (151) where wafers introduced into the process chambers (110a, 110b, 110c, 110d) temporarily stay, and an unloading chamber (155) where wafers taken out from the process chambers (110a, 110b, 110c, 110d) after completing a semiconductor process temporarily stay.

[0052] Here, the interior of the load lock chamber (150) is converted to vacuum and atmospheric pressure, and the transfer chamber (120) and the process chambers (110a, 110b, 110c, 110d) are maintained in vacuum. The load lock chamber (150) prevents external contaminants from entering the process chambers (110a, 110b, 110c, 110d) and the transfer chamber (120).

[0053] Meanwhile, the index module (200) includes a plurality of load ports, a frame (230), a second transfer robot (240), and a side storage (400). Generally, wafers are transported between substrate processing devices while being stored in a receiving container. A closed container (FOUP) can be used as the receiving container. The receiving container provides unprocessed wafers to the processing module (100) and stores wafers processed by the processing module (100) again. The receiving container is mounted on the load port (220). The load port (220) is provided on one side of the frame (230) and supports the receiving container. The frame (230) is positioned between the load port (220) and the load lock chamber (150), and a second transfer robot (240) is installed inside the frame (230). The second transfer robot (240) transports wafers between the receiving container mounted on the load port (220) and the processing module (100). That is, the second transport robot (240) takes out a wafer from the storage container and provides it to the processing module (100), and receives the processed wafer from the processing module (100) and stores it in the storage container.

[0054] FIG. 2 is a drawing showing a side storage according to one embodiment of the present invention. The side storage (400) temporarily stores a substrate (W). Referring to FIG. 2, the side storage (400) is located on one side of the index module (200). The side storage (400) includes a housing (410) that provides a storage space (S) for storing the substrate, a support (420) that supports the substrate (W) in the storage space, and a gas injection unit (430) that injects purge gas into the storage space (S).

[0055] The housing (410) provides a storage space (S). A substrate (W) enters and exits through the front surface (411) of the housing (410). The front surface (411) may be open. The housing (410) includes a first side surface (412), a second side surface (413), a rear surface (414), a first inclined surface (415), and a second inclined surface (416). The first side surface (412) and the second side surface (413) are opposite sides of the housing (410). The first side surface (412) and the second side surface (413) face each other.

[0056] The first inclined surface (415) is located between the first side surface (412) and the rear surface (414). The first inclined surface (415) connects the first side surface (412) and the rear surface (414). The first inclined surface (415) is inclined in a direction away from one end of the rear surface (414). The first inclined surface (415) is inclined in a direction from the first side surface (412) toward the rear surface (414). In one example, the angles formed by the first side surface (412) and the first inclined surface (415), and the first inclined surface (415) and the rear surface (414) may be acute angles.

[0057] The second inclined surface (416) is located between the second side surface (413) and the rear surface (414). The second inclined surface (416) connects the second side surface (413) and the rear surface (414). The second inclined surface (416) is inclined in a direction away from the other end of the rear surface (414). The second inclined surface (416) is inclined in a direction from the second side surface (413) toward the rear surface (414). In one example, the angles formed by the second side surface (413) and the second inclined surface (416), and the second inclined surface (416) and the rear surface (414) may be acute angles.

[0058] The storage space (S) is a space where the substrate (W) is stored. The storage space (S) includes a front region (Sf) and a rear region (Sb). The dotted line (d) in Fig. 2 is illustrated to facilitate distinction between the front region (Sf) and the rear region (Sb) and does not correspond to a component constituting the invention. The front region (Sf) is a region defined by the first side surface (412) and the second side surface (413). The rear region (Sb) is a region defined by the rear surface (414), the first inclined surface (415), and the second inclined surface (416).

[0059] A support (420) supports a substrate (W) within a storage space (S). The support (420) is provided in a vertical direction in a longitudinal direction. The support (420) includes a first support (421), a second support (422), and a third support (423). The first support (421), the second support (422), and the third support (423) are provided to surround the substrate (W). In addition, a plurality of protrusions for supporting edges of the substrate (W) are provided in a vertical direction on the first support (421), the second support (422), and the third support (423). Accordingly, the support (420) can store a plurality of substrates (W) in a stacked manner in the storage space (S).

[0060] The gas injection unit (430) purges the storage space (S). The gas injection unit (430) injects purge gas. The gas injection unit (430) is disposed in the rear region (Sb). The gas injection unit (430) injects purge gas toward the front region (Sf). Fig. 3 is a drawing showing a gas injection unit according to an embodiment of the present invention, Fig. 4 is a cross-sectional view showing a cross-section of a baffle plate among the gas injection units of Fig. 3, and Fig. 5 is a drawing showing a rear side view of the gas injection unit of Fig. 3. Referring to Figs. 3 to 5, the gas injection unit (430) includes a body (431), a gas supply line (432), and a baffle plate (433).

[0061] The body (431) has an internal space (A) with an open front. A purge gas supply port (431a) to which a purge gas supply line (432) is connected is provided at the rear of the body (431). The gas supply line (432) supplies purge gas to the internal space (A). A purge gas supply source (432a) and a valve (432b) are installed in the gas supply line (432).

[0062] The baffle plate (433) injects purge gas into the storage space (S). The baffle plate (433) is formed with injection holes through which the purge gas passes. A plurality of injection holes may be provided to supply the purge gas to each space between adjacent substrates among a plurality of substrates (W) placed on the support (420). The baffle plate (433) includes a first plate (433a), a second plate (433b), and a third plate (433c).

[0063] The first plate (433a) supplies purge gas in a direction inclined toward the first side (412). The first plate (433a) is provided on one side of the body (431). One side end of the first plate (433a) is connected to the body (431), and the other side end is connected to the third plate (433c). The angle between the first plate (433a) and the body (431) may be provided as an obtuse angle. The angle between the first plate (433a) and the third plate (433c) may be provided as an acute angle.

[0064] The second plate (433b) supplies purge gas inclined in a direction toward the second side (413). The second plate (433b) is provided on the other side of the body (431) where the first plate (433a) is not provided. One end of the second plate (433b) is connected to the body, and the other end is connected to the third plate (433c). The angle between the second plate (433b) and the body (431) may be provided as an obtuse angle. The angle between the second plate (433b) and the third plate (433c) may be provided as an acute angle.

[0065] The third plate (433c) supplies purge gas in a direction toward the return space. In addition, the third plate (433c) supplies purge gas in a direction toward the front of the housing (410). The third plate (433c) is provided between the first plate (433a) and the second plate (433b). The third plate (433c) is provided spaced apart from the body (431) toward the front region (Sf). The third plate (433c) is provided parallel to the body (431). The transverse length of the third plate (433c) may be provided shorter than the transverse length of the body (431) and the length of the substrate. In one example, when the substrate is a wafer, the third plate (433c) may be provided shorter than the diameter of the wafer.

[0066] The body (431), the first plate (433a), the second plate (433b), and the third plate (433c) are combined to form an internal space. In one example, when viewed from above, the body (431), the first plate (433a), the second plate (433b), and the third plate (433c) can be combined in an isosceles trapezoidal shape.

[0067] Fig. 6 is a drawing showing the direction of airflow in a typical side storage, and Fig. 7 is a drawing showing the direction of airflow in a side storage according to one embodiment of the present invention. The arrows shown in Figs. 6 and 7 indicate a flow of purge gas discharged from a gas injection unit.

[0068] Referring to Fig. 6, a gas injection unit (510) of a typical side storage (500) is provided in a columnar shape. A plurality of injection holes are formed on the side of the gas injection unit (510) to inject gas in one direction. In one example, the injection holes are formed to inject gas toward the front of the side storage (500) and are provided in a plurality of rows. The cross-sectional area of ​​the gas injection unit (510) is provided to be smaller than the cross-sectional area of ​​the side storage (500). Accordingly, in order to purge the storage space of the side storage (500), it is necessary to inject purge gas at a high injection pressure. The high injection pressure causes an increase in the flow rate of the purge gas. If the flow rate of the purge gas increases, it may stagnate in some areas of the side storage. While the purge gas stagnates, a vortex (T) may be formed. In one example, the purge gas injected at high pressure collides with the side wall of the side storage (500), is reflected, stagnates when it meets the supplied purge gas, and develops into a vortex (T). The formed vortex (T) causes the airflow (F1) formed on the substrate to become uneven. The uneven airflow (F1) causes the substrate to be cooled unevenly and prevents the fume generated from the substrate from being purged outside the side storage.

[0069] Referring to FIG. 7, the gas injection unit (430) of the side storage (400) according to one embodiment of the present invention includes a plate-shaped baffle plate (433). Since the cross-sectional area of ​​the gas injection unit (430) is not small compared to the cross-sectional area of ​​the side storage (400), the purge gas can be injected at a lower injection pressure compared to the gas injection unit of a general side storage (500) (510). Therefore, the generation of a vortex in the storage space (S) can be prevented.

[0070] The above example illustrates a substrate processing device provided with a processing module that processes a substrate using plasma. However, this is not limited to this, and side storage may also be provided in a substrate processing device provided with a processing module that generates fumes.

[0071] In addition, in the above-described example, it has been described as an example that a support (420) supporting the substrate (W) is provided separately in the storage space (S). However, it is not limited thereto, and a plurality of protrusions may be formed along the vertical direction on the first side (412) and the second side (413), and the protrusions may support the edge area of ​​the substrate.

[0072] In addition, in the above-described example, the rear area (Sb) of the side storage (400) is described as being defined by the first side (412), the second side (413), the rear side (414), the first slope (415), and the second slope (416). However, it is not limited thereto, and as in FIG. 8, the first slope (415) and the second slope (416) may be omitted, the rear side (414a) may have a curved shape and be connected to the first side (412) and the second side (413), and the rear area (Sb) may be defined by the first side (412), the second side (413), and the rear side (414a).

[0073] In addition, in the above-described example, the baffle plate (433) is described as being composed of a first plate (433a), a second plate (433b), and a third plate (433c). However, it is not limited thereto, and may be composed of only the first plate (433a) and the second plate (433b), as shown in FIG. 9.

[0074] In addition, in the above-described example, the front (411) of the side storage (400) is provided in an open state. However, the present invention is not limited thereto, and a door for opening and closing the front (411) and an exhaust line for exhausting the storage space (S) may be installed. Accordingly, the front (411) may be closed while supplying purge gas, and the storage space may be purged and exhausted at the same time.

Claims

1. In a device for processing a substrate, Index module; A processing module for processing the substrate; A load lock chamber is provided between the index module and the processing module and capable of controlling internal pressure. The above index module is, A load port in which a storage container for storing the above substrate is mounted; A side storage for temporarily storing substrates that have been processed in the above processing module; It includes an index robot that transfers substrates between the storage container placed on the load port, the side storage, and the load lock chamber. The above side storage is, A housing providing a storage space for storing the substrate; A support supporting the substrate in the storage space; and A gas injection unit for injecting purge gas into the above storage space; The above gas injection unit, A body having an interior space with an open front face; A baffle plate positioned at the front of the above internal space and having a spray hole formed therein; A substrate processing device having a gas supply line for supplying the purge gas to the internal space.

2. In paragraph 1, The above baffle plate, A first plate for supplying the purge gas in a direction inclined toward the first side of the storage space; A second plate is included that supplies the purge gas in a direction inclined toward the second side of the storage space, A substrate processing device wherein the first side and the second side are surfaces facing each other.

3. In paragraph 2, In the above storage space, the front area is adjacent to the return space provided by the above index robot, The above gas injection unit is a substrate processing device arranged in the rear area of ​​the storage space.

4. In paragraph 3, The above baffle plate, A substrate processing device further comprising a third plate disposed between the first plate and the second plate and supplying the purge gas in a direction toward the return space.

5. In paragraph 4, The housing includes the first side, the second side, the rear side, the first inclined surface, and the second inclined surface, The first inclined surface is positioned between the first side surface and the rear surface, and is inclined in a direction away from one end of the rear surface, The second inclined surface is located between the second side surface and the rear surface, and is inclined in a direction away from the other end of the rear surface, The front area of ​​the above storage space is an area defined by the first side and the second side, A substrate processing device in which the rear area of ​​the storage space is an area defined by the rear surface, the first inclined surface, and the second inclined surface.

6. In paragraph 5, A substrate processing device having a length of the rear surface shorter than the diameter of the substrate.

7. In paragraph 5, The above support is, Having a first support, a second support, and a third support provided in the vertical direction, In each of the first support, the second support, and the third support, A substrate processing device in which a plurality of protrusions for supporting the edges of the substrate are provided in an up-down direction.

8. In paragraph 7, A substrate processing device in which the injection holes formed in the first plate and the second plate are provided in plurality to supply the purge gas to each space between adjacent substrates among the substrates placed on the support.

9. In the side storage for temporary storage of the substrate, A housing providing a storage space for storing the substrate; A support supporting the substrate in the storage space; and A gas injection unit for injecting purge gas into the above storage space; The above gas injection unit, A body having an interior space with an open front face; A baffle plate positioned at the front of the above internal space and having a spray hole formed therein; A side storage having a gas supply line for supplying the purge gas to the internal space.

10. In paragraph 9, The above baffle plate, A first plate for supplying the purge gas in a direction inclined toward the first side of the storage space; A second plate is included that supplies the purge gas in a direction inclined toward the second side of the storage space, Side storage in which the first side and the second side are faces facing each other.

11. In paragraph 10, The above housing is provided in an open form with an entrance leading to the internal space, The above gas injection unit is a side storage placed in the rear area of ​​the above storage space.

12. In paragraph 11, The above baffle plate, A side storage further comprising a third plate disposed between the first plate and the second plate and supplying the purge gas in a direction toward the front of the housing.

13. In paragraph 12, The housing includes the first side, the second side, the rear side, the first inclined surface, and the second inclined surface, The first inclined surface is positioned between the first side surface and the rear surface, and is inclined in a direction away from one end of the rear surface, The second inclined surface is located between the second side surface and the rear surface, and is inclined in a direction away from the other end of the rear surface, The front area of ​​the above storage space is an area defined by the first side and the second side, The rear area of ​​the above storage space is a side storage area defined by the rear, the first slope, and the second slope.

14. In paragraph 13, Side storage with the length of the rear surface shorter than the diameter of the substrate.

15. In paragraph 13, The above support is, Having a first support, a second support, and a third support provided in the vertical direction, In each of the first support, the second support, and the third support, Side storage provided with multiple protrusions in the vertical direction to support the edges of the substrate.

16. In paragraph 15, A side storage in which the injection holes formed in the first plate and the second plate are provided in multiple numbers to supply the purge gas to each space between adjacent substrates among the substrates placed on the support.

17. In a device for processing a substrate, Index module; A processing module for processing the substrate; A load lock chamber is provided between the index module and the processing module and capable of controlling internal pressure. The above index module is, A load port in which a storage container for storing the above substrate is mounted; A side storage for temporarily storing substrates that have been processed in the above processing module; It includes an index robot that transfers substrates between the storage container placed on the load port, the side storage, and the load lock chamber. The above side storage is, A housing providing a storage space for storing the substrate; A support supporting the substrate in the storage space; and A gas injection unit for injecting purge gas into the above storage space; The above housing, Including a first side, a second side, a rear side, a first slope, and a second slope, The above first side and the above second side are sides facing each other, The first inclined surface is positioned between the first side surface and the rear surface, and is inclined in a direction away from one end of the rear surface, The second inclined surface is located between the second side surface and the rear surface, and is inclined in a direction away from the other end of the rear surface, The length of the above rear surface is shorter than the diameter of the substrate, The front area of ​​the above storage space is an area defined by the first side and the second side, The rear area of ​​the above storage space is an area defined by the rear surface, the first inclined surface, and the second inclined surface, The above support is, Having a first support, a second support, and a third support provided in the vertical direction, In each of the first support, the second support, and the third support, A plurality of protrusions are provided in the vertical direction to support the edge of the substrate, The above gas injection unit, A body having an interior space with an open front face; A baffle plate positioned at the front of the above internal space and having a spray hole formed therein; Including a gas supply line for supplying the purge gas to the internal space, The above baffle plate, A first plate for supplying the purge gas in a direction inclined toward the first side of the storage space; A second plate that supplies the purge gas in a direction inclined toward the second side of the storage space; and A third plate is disposed between the first plate and the second plate and supplies the purge gas in a direction toward the return space, A substrate processing device in which the injection holes formed in the first plate, the second plate, and the third plate are provided in plurality to supply the purge gas to each space between adjacent substrates among the substrates placed on the support.

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