Curable organopolysiloxane composition and use of same

Abstract

Provided are a new curable organopolysiloxane composition and the like that can be used for manufacturing semiconductor components and the like. 　This curable organopolysiloxane composition comprises: (A1) an organopolysiloxane that, in the molecule, does not have a functional group having curing reactivity and including an aliphatic unsaturated bond and that contains at least 20 mol% of a siloxane unit represented by SiO4 / 2 with respect to all siloxane units; (A2) an organopolysiloxane that has at least one monovalent hydrocarbon group including an aliphatic unsaturated bond per molecule; (B) an organohydrogen polysiloxane that has at least two hydrogen atoms bonded to a silicon atom per molecule; (C) a first hydrosilylation catalyst that exhibits activity through irradiation with high energy rays; and (D) a second hydrosilylation catalyst that is formed into a microcapsule by a thermoplastic resin having a softening point in the temperature range of 50-200°C.

Description

Curable organopolysiloxane compositions and uses thereof

[0001] The present invention relates to a curable organopolysiloxane composition containing two different types of hydrosilylation reaction catalysts, a method for producing a cured organopolysiloxane that is cured by a hydrosilylation reaction, and a method for producing semiconductor components or display devices.

[0002] In the manufacture of semiconductor components and the like, organopolysiloxane compositions having a curing mechanism via irradiation with high-energy rays such as UV or heating are known (e.g., Patent Documents 1 to 4). Dual-cure organopolysiloxane compositions having two curing mechanisms via irradiation with high-energy rays and heating are also known (e.g., Patent Document 5). Dual-cure organopolysiloxane compositions generally become a gel-like semi-cured product upon irradiation with high-energy rays and are temporarily fixed to a substrate. The semi-cured product is then heated to obtain a final cured product. Because of this two-step process, dual-cure organopolysiloxane compositions have the advantage that various processes, such as assembly, can be easily performed after temporary fixation to a substrate and before heating. However, it has been confirmed that the technology of Patent Document 5 leaves room for improvement in terms of temporary fixation strength to a substrate.

[0003] International Publication No. 2019 / 208756 Pamphlet Japanese Patent Application Laid-Open No. 2006-177989 Japanese Patent Application Laid-Open No. 2017-110137 Japanese Patent Application Laid-Open No. 9-67440 International Publication No. 2022 / 004463 Pamphlet

[0004] The present invention provides a novel curable organopolysiloxane composition that can be used in the production of semiconductor components and the like.

[0005] The present inventors conducted research based on the novel idea of ​​improving production efficiency in the production of semiconductor components and the like using a dual-cure organopolysiloxane composition by adjusting the adhesiveness of a semi-cured product of the composition, and as a result, discovered the following invention. That is, the present invention provides the following curable organopolysiloxane composition and the like: [1] (A1) An organopolysiloxane having no curable functional group containing an aliphatic unsaturated bond in the molecule and having SiO ４／２ (A1) is an organopolysiloxane containing siloxane units represented by the following average unit formula (1): (R 1 ３ SiO １／２ ) a (R 1 ２ SiO ２／２ ) b (R 1 SiO ３／２ ) c (SiO ４／２ ) d (R ２ O １／２ ) ｅ (1) (In the formula, each R 1 are independently a monovalent hydrocarbon group having 1 to 10 carbon atoms and no aliphatic unsaturated bond; R ２is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a, b, c, d, and e are numbers that satisfy the following: 0.35≦a≦0.70, 0≦b≦0.20, 0≦c≦0.20, 0.30≦d≦0.65, 0≦e≦0.05, and a+b+c+d=1. [3] The curable organopolysiloxane composition according to [1] or [2], wherein component (A1) is contained in an amount in the range of 20 to 70 mass% based on the total amount of components (A1), (A2), and (B). [4] The curable organopolysiloxane composition according to any one of [1] to [3], wherein component (C) and component (D) both contain platinum-based metals, and the molar ratio of the amounts of platinum-based metals in both components ((C) / (D)) is in the range of 0.01 to 200. [5] The curable organopolysiloxane composition according to any one of [1] to [3], wherein component (A2) contains at least a branched organopolysiloxane. [6] The curable organopolysiloxane composition according to [5], wherein the branched organopolysiloxane is contained in an amount in the range of 1 to 20 mass % relative to the total amount of components (A1), (A2), and (B). [7] The curable organopolysiloxane composition according to any one of [1] to [6], wherein the content of a hydrosilylation reaction inhibitor is less than 0.1 mass % based on the curable organopolysiloxane composition. [8] The curable organopolysiloxane composition according to any one of [1] to [7], which is a one-component composition. [9] The curable organopolysiloxane composition according to any one of [1] to [8], which is obtained by irradiating the curable organopolysiloxane composition according to any one of [1] to [8] with high-energy rays to cause a first hydrosilylation reaction, and which produces a semi-cured product having an adhesive strength of 0.1 MPa or more to a substrate.

[10] A cured product of the curable organopolysiloxane composition according to any one of [1] to [9].

[11] A semiconductor device or display device comprising the cured product according to

[10] .

[12] A method for producing a cured organopolysiloxane product, comprising: (i) irradiating the curable organopolysiloxane composition described in any one of [1] to [9] with high-energy rays to cause a first hydrosilylation reaction to proceed and obtain a semi-cured product; and (ii) heating the semi-cured product at a temperature at which component (D) is active and cause a second hydrosilylation reaction to proceed and obtain a cured product.

[13] The production method described in

[12] , in which the production of the semi-cured product is carried out in the presence of a shield or structure that partially blocks the high-energy rays.

[14] The production method described in

[12] or

[13] , in which (i) and (ii) are carried out simultaneously or separately.

[15] A method for producing a semiconductor device or display device, comprising the method described in any one of

[12] to

[14] .

[0006] According to one aspect of the present invention, there is provided a curable organopolysiloxane composition that can provide a semi-cured product that exhibits adhesion to a substrate after irradiation with high-energy rays. Another aspect of the present invention provides a curable organopolysiloxane composition that exhibits rapid curing properties and excellent curing properties in light-shielding areas. Another aspect of the present invention provides a curable organopolysiloxane composition that can improve the adhesion of the final cured product itself. The present invention, which has these effects, can improve the adhesive stability of the semi-cured product during temporary fixation in the production of semiconductor devices and the like, and the adhesive stability of the final cured product, thereby improving overall manufacturing efficiency.

[0007] The upper and lower limit values ​​of the numerical ranges described herein can be arbitrarily combined. For example, when a numerical range is described as "preferably 30 to 100, more preferably 40 to 80," the ranges "30 to 80" and "40 to 100" are also included in the numerical ranges described herein. Furthermore, when a numerical range is described as "preferably 30 or more, more preferably 40 or more, and preferably 100 or less, more preferably 80 or less," the ranges "30 to 80" and "40 to 100" are also included in the numerical ranges described herein. In addition, when a numerical range described herein as "60 to 100," for example, means a range of "60 or more and 100 or less."

[0008] 1. Curable Organopolysiloxane Composition One aspect of the present invention provides a curable organopolysiloxane composition (hereinafter also referred to as the "composition of the present invention"). The composition of the present invention comprises (A1) an organopolysiloxane having no curable functional group containing an aliphatic unsaturated bond in the molecule and having SiO ４／２ (A1) an organopolysiloxane containing siloxane units represented by the formula (I) above in an amount of at least 20 mol % of all siloxane units, (A2) an organopolysiloxane having at least one monovalent hydrocarbon group containing an aliphatic unsaturated bond per molecule, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) a first hydrosilylation catalyst that exhibits activity upon irradiation with high-energy rays, and (D) a second hydrosilylation catalyst microencapsulated in a thermoplastic resin having a softening point within the temperature range of 50 to 200° C. Each of the components that make up the composition of the present invention will be described in detail below.

[0009] 1.1 Component (A): Organopolysiloxane Component (A) is the organopolysiloxane that forms the basis of the present invention. The composition of the present invention comprises, as component (A), (A1) an organopolysiloxane that does not have a curing-reactive functional group containing an aliphatic unsaturated bond in the molecule and has SiO ４／２and (A2) an organopolysiloxane having at least one monovalent hydrocarbon group containing an aliphatic unsaturated bond per molecule. Conventional dual-cure curable organopolysiloxane compositions can be temporarily fixed to a substrate after semi-curing by irradiation with high-energy rays or the like, but semi-cured products cured under high-energy ray irradiation (e.g., room temperature of 15 to 30°C) do not exhibit adhesion to the substrate. In contrast, the composition of the present invention, containing component (A1), exhibits adhesion to the substrate at the semi-cured product stage cured by high-energy ray irradiation, thereby preventing peeling of the temporarily fixed semi-cured product from the substrate, for example, in the production of semiconductor devices and the like. Furthermore, because the composition of the present invention exhibits adhesion to the substrate at the semi-cured product stage, heating to exhibit adhesion is unnecessary. Therefore, the composition of the present invention can improve the production efficiency of semiconductor devices and the like. Furthermore, the composition of the present invention can also improve the adhesive strength of the final cured product obtained from the semi-cured product. The components (A1) and (A2) will be further described below.

[0010] 1.1.1 Component (A1) Component (A1) is a curing agent that does not have a curing reactive functional group containing an aliphatic unsaturated bond in the molecule and does not contain SiO ４／２ In one embodiment of the present invention, the branched siloxane unit is an organopolysiloxane containing siloxane units represented by the formula: ４／２ The proportion of the siloxane units represented by the formula (I) is at least 40 mol % or more, preferably 50 mol % or more, and more preferably in the range of 50 to 65 mol % based on the total siloxane units (100 mol %).

[0011] In one embodiment of the present invention, component (A1) is an organopolysiloxane having the following average composition formula (1): (R 1 ３ SiO １／２ ) a (R 1 ２ SiO ２／２ ) b (R1 SiO ３／２ ) c (SiO ４／２ ) d (R ２ O １／２ ) ｅ (1)

[0012] In the above average composition formula (1), each R 1 are independently a monovalent hydrocarbon group having 1 to 10 carbon atoms and no aliphatic unsaturated bonds; R ２ represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a, b, c, d, and e are numbers that satisfy the following: 0.35≦a≦0.70, 0≦b≦0.20, 0≦c≦0.20, 0.30≦d≦0.65, 0≦e≦0.05, and a+b+c+d=1.

[0013] R 1 Monovalent hydrocarbon groups having 1 to 10 carbon atoms and no aliphatic unsaturated bonds that can be selected as (R) specifically include, for example, alkyl groups and aryl groups. Specific examples of the alkyl groups include methyl, ethyl, propyl groups such as n-propyl and isopropyl, butyl groups such as n-butyl, isobutyl, s-butyl and t-butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. These groups also include structural isomers. Specific examples of the aryl groups include phenyl, tolyl, xylyl, and naphthyl groups. In one aspect of the present invention, the monovalent hydrocarbon group is preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably a methyl group.

[0014] In one embodiment of the present invention, preferably 70 to 100 mol % of the organic groups bonded to silicon atoms in component (A1) are methyl groups, more preferably 80 to 100 mol % are methyl groups, and even more preferably 88 to 100 mol % are methyl groups. By setting the content of methyl groups in component (A1) within this range, SiO ４／２ This can improve the reinforcing effect and adhesive strength of a cured product containing a siloxane unit represented by the formula:

[0015] In one embodiment of the present invention, component (A1) preferably contains aryl groups in a proportion of all silicon-bonded organic groups in the range of 0 to 5 mol %, more preferably 0 to 2 mol %, and even more preferably contains no aryl groups (i.e., 0 mol %). By ensuring that the aryl group content in component (A1) falls within the above range, component (A1) can be prevented from becoming a hot melt, making it easier to obtain the desired liquid composition. In addition, the SiO in the molecule ４／２ This can provide the effects of improving the reinforcing effect of the cured product derived from the siloxane unit represented by the following formula, improving adhesive strength, and improving the coloration resistance of the cured product at high temperatures.

[0016] R ２ The alkyl group having 1 to 10 carbon atoms that can be selected as R may be the same as those described above. ２ is preferably a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and even more preferably a hydrogen atom or a methyl group.

[0017] In the above average composition formula (1), a represents a group represented by the general formula R 1 ３ SiO １／２ a is a number indicating the proportion of siloxane units. a preferably satisfies 0.35≦a≦0.70, more preferably 0.35≦a≦0.55, and even more preferably 0.40≦a≦0.50. When a is within the above range, excellent adhesive properties and mechanical strength can be imparted to a cured product containing the composition of the present invention.

[0018] In the above average composition formula (1), b represents a group represented by the general formula R 1 ２ SiO ２／２ b is a number indicating the proportion of siloxane units. Preferably, b satisfies 0≦b≦0.20, more preferably 0≦b≦0.10. When b is within the above range, the viscosity of the composition of the present invention can be prevented from becoming too high. In one embodiment of the present invention, b may be 0, and is preferably 0.

[0019] In the above average composition formula (1), c represents a group represented by the general formula R 1 SiO ３／２is a number indicating the proportion of siloxane units. c preferably satisfies 0≦c≦0.20, more preferably 0≦c≦0.10. When c is within the above range, the viscosity of the composition of the present invention can be prevented from becoming too high, and the resulting cured product can be imparted with excellent mechanical strength. In one embodiment of the present invention, c may be 0, and is preferably 0.

[0020] In the above average composition formula (1), d represents SiO ４／２ d is a number indicating the proportion of siloxane units. d preferably satisfies 0.30≦d≦0.65, and more preferably 0.50≦d≦0.65. When d is within the above range, excellent adhesive properties and mechanical strength can be imparted to a cured product containing the composition of the present invention.

[0021] In the above average composition formula (1), e represents a group represented by the general formula R ２ O １／２ The unit is a number indicating the ratio of the unit R ２ Depending on the type of organopolysiloxane, the silicon atom may be a hydroxyl group or an alkoxy group bonded to the organopolysiloxane. That is, component (A1) may contain a small amount of hydroxyl groups or alkoxy groups. Specific examples of the alkoxy group include methoxy groups and ethoxy groups. e preferably satisfies 0≦e≦0.05, and more preferably 0≦e≦0.03.

[0022] In one embodiment of the present invention, component (A1) is an organopolysiloxane having the following average composition formula (1-1): (Me ３ SiO １／２ ) a (Me ２ SiO ２／２ ) b (MeSiO ３／２ ) c (SiO ４／２ ) d (HO １／２ ) ｅ (1-1)

[0023] In the above average composition formula (1-1), Me is a methyl group; a, b, c, d, and e are numbers that satisfy the following: 0.40≦a≦0.50, 0≦b≦0.10, 0≦c≦0.10, 0.50≦d≦0.65, 0≦e≦0.03, and a+b+c+d=1.

[0024] Component (A1) may be either liquid or solid at room temperature. In one embodiment of the present invention, the organopolysiloxane of component (A1) preferably has a weight average molecular weight (Mw) of 15,000 or more, and more preferably in the range of 15,000 to 100,000, as measured by gel permeation chromatography (GPC) using toluene as a solvent, from the viewpoint of imparting superior adhesive properties and mechanical strength to a cured product containing the composition of the present invention.

[0025] In one embodiment of the present invention, component (A1) is contained in an amount that is preferably 20 to 70 mass%, more preferably 25 to 60 mass%, and even more preferably 30 to 50 mass%, relative to the total amount (100 mass%) of components (A1), (A2), and (B), from the viewpoint of rapidly progressing the semi-curing and improving the adhesiveness of the semi-cured product.

[0026] In one embodiment of the present invention, the ratio of the content of component (A1) to the content of component (A2) described below [component (A1) / component (A2)] may be 0.10 or more, 0.30 or more, 0.50 or more, or 0.60 or more by mass, and may be 10.0 or less, 7.00 or less, 5.00 or less, 3.00 or less, 2.00 or less, 1.00 or less, or 0.80 or less.

[0027] 1.1.2 Component (A2) Component (A2) is an organopolysiloxane having at least one monovalent hydrocarbon group containing an aliphatic unsaturated bond per molecule, and contains an aliphatic unsaturated hydrocarbon group to which a hydrosilyl group (—SiH) is added during the hydrosilylation reaction.

[0028] In one embodiment of the present invention, component (A2) is an organopolysiloxane having the following average composition formula (2): ３ ｆ R４ ｇ SiO （４－ｆ―ｇ）／２ (2)

[0029] In the above average composition formula (2), R ３ is an alkenyl group having 2 to 12 carbon atoms; R ４ is a group selected from the group consisting of monovalent hydrocarbon groups having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, hydroxyl groups, and alkoxy groups; and f and g are numbers that satisfy the conditions 1≦f+g≦3 and 0.001≦f / (f+g)≦0.33.

[0030] R ３ Specific examples of the alkenyl group having 2 to 12 carbon atoms include vinyl, propenyl (including allyl), butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, and dodecenyl groups. These groups also include structural isomers. In one aspect of the present invention, the alkenyl group is preferably an alkenyl group having 2 to 10 carbon atoms, more preferably an alkenyl group having 2 to 8 carbon atoms, and even more preferably a group selected from the group consisting of vinyl, allyl, and hexenyl.

[0031] R ４ Monovalent hydrocarbon groups having 1 to 12 carbon atoms and no aliphatic unsaturated bonds that may be selected as (R) specifically include, for example, alkyl groups and aryl groups. Specific examples of the alkyl groups include methyl, ethyl, propyl groups such as n-propyl and isopropyl, butyl groups such as n-butyl, isobutyl, s-butyl and t-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl groups. These groups also include structural isomers. Specific examples of the aryl groups include phenyl, tolyl, xylyl, and naphthyl groups. In one aspect of the present invention, the monovalent hydrocarbon group is preferably an alkyl or aryl group having 1 to 10 carbon atoms, more preferably an alkyl or aryl group having 1 to 8 carbon atoms, and even more preferably a methyl or phenyl group.

[0032] R ４Specific examples of the alkoxy group that can be selected as include a methoxy group, an ethoxy group, and the like.

[0033] As described above, in the average composition formula (2), f and g are numbers that satisfy 1≦f+g≦3 and 0.001≦f / (f+g)≦0.33. When f+g is 1 or more, the flexibility of the cured product can be increased, and when f+g is 3 or less, the mechanical strength of the cured product can be increased. Furthermore, when f / (f+g) is 0.001 or more, the mechanical strength of the cured product can be increased, and when f / (f+g) is 0.33 or less, the flexibility of the cured product can be increased.

[0034] The molecular structure of the organopolysiloxane of component (A2) may be linear, branched, or cyclic. Furthermore, the organopolysiloxane of component (A2) may be a mixture of one or more compounds having such molecular structures. In one embodiment of the present invention, component (A2) contains at least a branched organopolysiloxane. In another embodiment of the present invention, component (A2) contains a linear organopolysiloxane and a branched organopolysiloxane. By including a branched organopolysiloxane as component (A2), a semi-cured product of the composition of the present invention can be obtained more quickly. Furthermore, the adhesive strength of the semi-cured product can also be improved.

[0035] The linear organopolysiloxane that may be contained as component (A2) may be one represented by the following general formula (3): ５ ３ SiO(R ５ ２ SiO) ｍ１ SiR ５ ３　 (3)

[0036] In the above general formula (3), each R ５ are independently unsubstituted or halogen-substituted monovalent hydrocarbon groups, and in one molecule, R ５ At least two of R are monovalent hydrocarbon groups containing an aliphatic unsaturated bond, and the remaining R ５is a methyl group or a phenyl group. Examples of the monovalent hydrocarbon group containing an aliphatic unsaturated bond include the above-mentioned alkenyl groups having 2 to 12 carbon atoms, and specific examples and preferred groups thereof are as described above. Furthermore, in the above general formula (3), m1 may be an integer in the range of 5 to 1000, from the viewpoint of improving fluidity and precision filling properties. Furthermore, m1 may be an integer greater than 1000. When m1 is an integer greater than 1000, the organopolysiloxane is gum-like at room temperature.

[0037] In one embodiment of the present invention, component (A2) comprises an organopolysiloxane having two monovalent hydrocarbon groups containing aliphatic unsaturated bonds per molecule. In another embodiment of the present invention, component (A2) comprises a linear organopolysiloxane having monovalent hydrocarbon groups containing aliphatic unsaturated bonds only at both ends of the molecular chain.

[0038] The branched organopolysiloxane that can be contained as component (A2) may be one represented by the following general formula (4): (R ６ ３ SiO １／２ ) ａ１ (R ６ ２ SiO ２／２ ) ｂ１ (R ６ SiO ３／２ ) ｃ１ (SiO ４／２ ) ｄ１ (R ７ O １／２）ｅ１　 (4)

[0039] In the above general formula (4), each R ６ are independently monovalent hydrocarbon groups having 1 to 10 carbon atoms (provided that the total number of R ６ 1 to 50 mol % of R are alkenyl groups; ７ represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a1, b1, c1, d1, and e1 are numbers that satisfy the following: 0.10≦a1≦0.90, 0≦b1≦0.70, 0≦c1≦0.80, 0≦d1≦0.65, 0≦e1≦0.05, with the proviso that c1+d1>0.20 and a1+b1+c1+d1=1.

[0040] In addition, in the general formula (4), R６ The monovalent hydrocarbon group having 1 to 10 carbon atoms that can be selected as R specifically includes, for example, an alkyl group, an alkenyl group, an aryl group, and the like, and specific examples and preferred groups thereof are as described above. ６ may be an aralkyl group such as a benzyl group. ６ It is preferable that 2 to 45 mol % of the total R ６ It is more preferable that 2 to 35 mol % of the alkenyl groups be alkenyl groups. By setting the alkenyl group content within this range, the mechanical strength (hardness, etc.) of the obtained cured product can be improved.

[0041] In the above general formula (4), R ７ Specific examples and preferred groups of the alkyl group having 1 to 10 carbon atoms that can be selected as are as described above. Furthermore, a1 is preferably a number that satisfies 0.15≦a1≦0.85; b1 is preferably a number that satisfies 0≦b1≦0.60; and c1 is preferably a number that satisfies 0≦c1≦0.75, more preferably 0. Furthermore, d1 is preferably a number that satisfies 0.15≦d1≦0.65, more preferably a number that satisfies 0.20≦d1≦0.65. Here, c1 or d1 may be 0, but as described above, c1+d1>0.20. Furthermore, e1 is preferably a number that satisfies 0≦e1≦0.03.

[0042] In one embodiment of the present invention, the branched organopolysiloxane is preferably contained in an amount ranging from 1 to 20% by mass, more preferably from 2 to 15% by mass, and even more preferably from 3 to 10% by mass, based on the total amount (100% by mass) of components (A1), (A2), and (B). This allows a semi-cured product of the composition of the present invention to be obtained more quickly. Furthermore, the adhesive strength of the semi-cured product may also be improved.

[0043] In one embodiment of the present invention, the ratio of the linear organopolysiloxane content to the branched organopolysiloxane content that may be contained in component (A2) [linear organopolysiloxane / branched organopolysiloxane] may be, in mass ratio, 20.0 or less, 18.0 or less, 16.0 or less, 14.0 or less, 12.0 or less, or 10.0 or less, or this content ratio may be 0.10 or more, 0.50 or more, 1.00 or more, 3.00 or more, 5.00 or more, or 6.00 or more.

[0044] Component (A2) may be liquid or solid at room temperature. Furthermore, component (A2) preferably has a weight average molecular weight (Mw) of 20,000 or less, more preferably 15,000 or less, and particularly preferably in the range of 100 to 15,000, as measured by gel permeation chromatography (GPC) using toluene as a solvent. Use of a relatively low molecular weight component (A2) can reduce the viscosity of the entire composition.

[0045] The amount of component (A2) added is preferably 1 to 50 mass%, more preferably 1 to 45 mass%, and even more preferably 1 to 40 mass%, based on the total amount (100 mass%) of components (A1) and (A2). By adding component (A2) in this range, it is possible to achieve a balance between the adhesive properties, mechanical strength, and hardness of the cured product obtained from the composition of one embodiment of the present invention. In particular, when the molecular weight and alkenyl group content of component (A2) are within the preferred ranges described above, it is possible to suppress the viscosity of the entire composition and the amount of component (A2) added, while relatively increasing the amount of component (A1) added, thereby further improving the adhesive properties and mechanical strength, such as hardness, of the cured product.

[0046] 1.2 Component (B): Organohydrogenpolysiloxane Component (B) is an organohydrogenpolysiloxane that serves as a crosslinking agent. The composition of the present invention contains, as component (B), an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule. Component (B) is a compound containing a hydrosilyl group (—SiH) that is added to the monovalent hydrocarbon group having an aliphatic unsaturated bond in component (A2) during the hydrosilylation reaction.

[0047] In one embodiment of the present invention, component (B) is an organohydrogenpolysiloxane having the following average composition formula (5): ｘ R ８ ｙ SiO （４－ｘ－ｙ）／２ (5)

[0048] In the above average composition formula (5), R ８ is a group selected from the group consisting of monovalent hydrocarbon groups having 1 to 12 carbon atoms and no aliphatic unsaturated bonds, hydroxyl groups, and alkoxy groups; and x and y are numbers that satisfy the conditions 1≦x+y≦3 and 0.01≦x / (x+y)≦0.33.

[0049] R ８ Monovalent hydrocarbon groups having 1 to 12 carbon atoms and no aliphatic unsaturated bonds that may be selected as (R) specifically include, for example, alkyl groups and aryl groups. Specific examples of the alkyl groups include methyl, ethyl, propyl groups such as n-propyl and isopropyl, butyl groups such as n-butyl, isobutyl, s-butyl and t-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl groups. These groups also include structural isomers. Specific examples of the aryl groups include phenyl, tolyl, xylyl, and naphthyl groups. In one aspect of the present invention, the monovalent hydrocarbon group is preferably an alkyl or aryl group having 1 to 10 carbon atoms, more preferably an alkyl or aryl group having 1 to 8 carbon atoms, and even more preferably a methyl or phenyl group.

[0050] R ８Specific examples of the alkoxy group that can be selected as include a methoxy group, an ethoxy group, and the like.

[0051] As described above, in the average composition formula (5), x and y are numbers that satisfy 1≦x+y≦3 and 0.01≦x / (x+y)≦0.33, and preferably 1.5≦x+y≦2.5 and 0.05≦x / (x+y)≦0.2. When x+y is 1 or more, the flexibility of a cured product containing the composition of the present invention can be increased. When x+y is 3 or less, the mechanical strength of a cured product containing the composition of the present invention can be increased. When x / (x+y) is 0.01 or more, the mechanical strength of a cured product containing the composition of the present invention can be increased. When x / (x+y) is 0.33 or less, the flexibility of a cured product containing the composition of the present invention can be increased.

[0052] Specific examples of the organohydrogenpolysiloxane of component (B) include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris(dimethylhydrogensiloxy)methylsilane, tris(dimethylhydrogensiloxy)phenylsilane, 1-(3-glycidoxypropyl)-1,3,5,7-tetramethylcyclotetrasiloxane, 1,5-di(3-glycidoxypropyl)-1,3,5,7-tetramethylcyclotetrasiloxane, 1-(3-glycidoxypropyl)-5-trimethoxysilylethyl-1,3,5,7-tetramethylcyclotetrasiloxane, and siloxanes having trimers at both ends of the molecular chain. Tylsiloxy-capped methylhydrogenpolysiloxane, dimethylsiloxane-methylhydrogensiloxane copolymer capped at both molecular chain ends with trimethylsiloxy groups, dimethylpolysiloxane capped at both molecular chain ends with dimethylhydrogensiloxy groups, dimethylsiloxane-methylhydrogensiloxane copolymer capped at both molecular chain ends with dimethylhydrogensiloxy groups, methylhydrogensiloxane-diphenylsiloxane copolymer capped at both molecular chain ends with trimethylsiloxy groups, methylhydrogensiloxane-diphenylsiloxane-dimethylsiloxane copolymer capped at both molecular chain ends with trimethylsiloxy groups, hydrolysis condensate of trimethoxysilane, (CH ３ )２ HSiO １ / ２ Units and SiO ４ / ２ a copolymer consisting of (CH ３ ) ２ HSiO １ / ２ Units and SiO ４ / ２ Units and (C ６ H ５ )SiO ３ / ２ The term "polyvinyl alcohol" includes copolymers consisting of these units, and mixtures of two or more of these units.

[0053] In one embodiment of the present invention, the viscosity of the organohydrogenpolysiloxane of component (B) at 25°C is preferably 1 to 10,000 mPa s, more preferably 1 to 5,000 mPa s, and even more preferably 1 to 1,000 mPa s. In this specification, viscosity (mPa s) refers to the value measured at 25°C using a Brookfield viscometer.

[0054] The content of component (B) may be such that the number of silicon-bonded hydrogen atoms in component (B) is within a range of 0.1 to 5.0 moles, preferably 0.5 to 3.0 moles, per mole of monovalent hydrocarbon groups having an aliphatic unsaturated bond in component (A2). When the content of component (B) is at least the lower limit of the above range, the mechanical strength of a cured product containing the composition of the present invention can be increased. When the content of component (B) is at most the upper limit of the above range, the flexibility of a cured product containing the composition of the present invention can be increased.

[0055] 1.3 Component (C): First Hydrosilylation Catalyst Component (C) is a first hydrosilylation catalyst that becomes active upon irradiation with high-energy rays, and is known as a high-energy ray-activated catalyst or photoactivated catalyst. Unlike component (D), which will be described later, component (C) is a non-microencapsulated catalyst. However, it is not activated unless irradiated with high-energy rays, and the curing reaction does not proceed, thereby maintaining the pot life of the composition of the present invention. Furthermore, component (C) is characterized by its rapid curing reaction triggered by irradiation with high-energy rays, achieving rapid curing in areas irradiated with high-energy rays, but by its gradual curing at room temperature in light-shielded areas that cannot be sufficiently irradiated with high-energy rays due to the structure of the object (e.g., the internal structure of a semiconductor component, the closed portion of a display device). The composition of the present invention is prepared by using component (C) having such characteristics in combination with component (D), which will be described later, to more reliably ensure the curing reaction to be spread throughout the entire composition. Furthermore, by containing the above-mentioned component (A1), the composition of the present invention can adhere a semi-cured product obtained after irradiation with high-energy rays to a substrate even if the curing reaction of component (C) is incomplete. This improves the stability of temporary fixation in the production of, for example, semiconductor devices, and as a result, can improve production efficiency.

[0056] Examples of high-energy rays include ultraviolet rays, X-rays, and electron beams. Among these, ultraviolet rays are preferred from the viewpoint of catalyst activation efficiency. The irradiation dose of high-energy rays varies depending on the type of catalyst. For example, in the case of ultraviolet rays, the cumulative irradiation dose at a wavelength of 365 nm is 100 mJ / cm. ２ ~10 J / cm ２ It is preferable that the range is within the range of

[0057] Specific examples of component (C) include (methylcyclopentadienyl)trimethylplatinum(IV), (cyclopentadienyl)trimethylplatinum(IV), (1,2,3,4,5-pentamethylcyclopentadienyl)trimethylplatinum(IV), (cyclopentadienyl)dimethylethylplatinum(IV), (cyclopentadienyl)dimethylacetylplatinum(IV), (trimethylsilylcyclopentadienyl)trimethylplatinum(IV), (methoxycarbonylcyclopentadienyl)trimethylplatinum(IV), (dimethylphenylsilylcyclopentadienyl)trimethylcyclopentadienylplatinum(IV), IV), trimethyl(acetylacetonato)platinum(IV), trimethyl(3,5-heptanedionato)platinum(IV), trimethyl(methylacetoacetate)platinum(IV), bis(2,4-pentanedionato)platinum(II), bis(2,4-hexanedionato)platinum(II), bis(2,4-heptanedionato)platinum(II), bis(3,5-heptanedionato)platinum(II), bis(1-phenyl-1,3-butanedionato)platinum(II), bis(1,3-diphenyl-1,3-propanedionato)platinum(II), and bis(hexafluoroacetylacetonato)platinum(II). Among these, (methylcyclopentadienyl)trimethylplatinum(IV) and bis(2,4-pentanedionato)platinum(II) are preferred from the viewpoints of versatility and ease of availability.

[0058] The content of component (C) is such that the metal atoms in the catalyst are in the range of preferably 1 to 50 ppm by mass, more preferably 5 to 30 ppm by mass, based on the total amount of the composition.

[0059] 1.4 Component (D): Second Hydrosilylation Catalyst Component (D) is a second hydrosilylation catalyst microencapsulated in a thermoplastic resin having a softening point within the temperature range of 50 to 200°C. As described above, component (D) is a component that, when used in combination with component (C), can achieve rapid and complete curing by catalyzing heating at or above the softening point, even in light-shielded areas that cannot be sufficiently irradiated with high-energy rays. Furthermore, because component (D) does not essentially function as a catalyst below the softening point of the thermoplastic resin, the curing reaction derived from component (D) does not proceed even when irradiated with high-energy rays. Thus, the composition of the present invention combines the different curing properties derived from two hydrosilylation catalysts. However, in the absence of each trigger (i.e., irradiation with high-energy rays or heating above the softening point), the catalyst remains inactive, preventing the curing reaction from proceeding, and maintaining a good pot life.

[0060] Specific examples of the second hydrosilylation catalyst used in component (D) include platinum-based catalysts, rhodium-based catalysts, palladium-based catalysts, nickel-based catalysts, iridium-based catalysts, ruthenium-based catalysts, and iron-based catalysts. Among these, platinum-based catalysts are preferred. Furthermore, the platinum-based catalysts include platinum compounds such as platinum fine powder, platinum black, platinum-supported silica fine powder, platinum-supported activated carbon, chloroplatinic acid, alcohol solutions of chloroplatinic acid, platinum olefin complexes, and platinum alkenylsiloxane complexes. Among these, platinum alkenylsiloxane complexes are preferred. Platinum-alkenylsiloxane complexes using 1,3-divinyl-1,1,3,3-tetramethyldisiloxane are particularly preferred due to their excellent stability.

[0061] In one embodiment of the present invention, the softening point of the thermoplastic resin used in the microcapsules constituting component (D) is preferably 80°C or higher and 160°C or lower. Examples of the thermoplastic resin include polyolefin resin, polystyrene resin, acrylic resin, cellulose resin, thermoplastic silicone resin, polycarbonate resin, etc. Microencapsulated hydrosilylation catalysts are described in JP-A-2-9448 and JP-A-2-14244, and can be prepared by the methods described therein.

[0062] Furthermore, component (D) exhibits catalytic activity by releasing or diffusing the catalyst at a temperature equal to or higher than the softening point of the thermoplastic resin used for microencapsulation. The temperature at which the catalyst exhibits activity varies depending on the type of thermoplastic resin, but is usually 80°C or higher, preferably 100°C or higher, and more preferably 120°C or higher.

[0063] The content of component (D) is an amount such that the metal atoms in the catalyst are in the range of 0.1 to 50 ppm by mass, preferably 0.5 to 30 ppm by mass, and more preferably 1 to 10 ppm by mass, based on the total amount of the composition.

[0064] In one embodiment of the composition of the present invention, both component (C) and component (D) contain a platinum-based metal. In this embodiment, the molar ratio of the amount of platinum-based metal in component (C) to component (D) ((C) / (D)) is typically in the range of 0.01 to 200, preferably 0.1 to 100. When this molar ratio is equal to or less than the upper limit, the curing reaction at high temperatures can be accelerated. When this molar ratio is equal to or greater than the lower limit, the curing reaction at low temperatures can be carried out in a short time. Of component (C) and component (D), when rapid curing by high-energy radiation is important, the content of component (C) is preferably greater than the content of component (D).

[0065] 1.5 Optional Components In addition to component (A) including component (A1) and component (A2), component (B), component (C), and component (D), the composition of one embodiment of the present invention may contain, as necessary, other organopolysiloxanes; adhesion promoters; inorganic fillers such as silica, glass, alumina, and zinc oxide; fine organic resin powders such as polymethacrylates; phosphors; heat-resistant additives; dyes; pigments; flame retardants; solvents; and the like.

[0066] In one embodiment of the present invention, the adhesion promoter may be, for example, one represented by the following structural formula (wherein Me is a methyl group):

[0067] In one embodiment of the present invention, the content of the adhesion promoter may be 0.01 to 5.0 mass%, 0.1 to 2.5 mass%, 0.4 to 1.5 mass%, or 0.5 to 1.0 mass%, based on the total amount (100 mass%) of the composition.

[0068] Furthermore, the composition of one embodiment of the present invention preferably is substantially free of a hydrosilylation reaction inhibitor. Typically, a hydrosilylation reaction inhibitor is added to a curable composition that cures via a hydrosilylation reaction to improve pot life and obtain a stable composition. However, the hydrosilylation reaction inhibitor also inhibits the curing reaction of the composition. However, in the composition of the present invention, components (C) and (D) are inactive as catalysts until their respective triggers are applied. Furthermore, in the composition of one embodiment of the present invention, the amount of curing-reactive functional groups in component (A) is also reduced. Therefore, the composition of one embodiment of the present invention has a practically sufficient pot life even without the use of a hydrosilylation reaction inhibitor. Specifically, the content of the hydrosilylation reaction inhibitor in the composition of one embodiment of the present invention is preferably less than 0.1% by mass, more preferably less than 0.01% by mass, based on the total amount of the composition (100% by mass), or preferably below the detection limit.

[0069] Specific examples of the hydrosilylation reaction inhibitor include acetylene compounds such as 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 3-phenyl-1-butyn-3-ol, and 1-ethynyl-1-cyclohexanol; enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; cycloalkenylsiloxanes such as 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane; methylvinylsiloxane oligomers terminated at both ends with hydroxyl groups or modified, and methylvinyldimethylsiloxane oligomers terminated at both ends with hydroxyl groups or modified; and triazole compounds such as benzotriazole.

[0070] 1.6 Production Method and Form of the Composition of the Present Invention The composition of one embodiment of the present invention can be produced by uniformly mixing component (A) including component (A1) and component (A2), component (B), component (C), and component (D), as well as any optional components used as needed, at room temperature using mechanical force such as a mixer. Furthermore, the composition of one embodiment of the present invention may be a one-component (single-liquid) composition that is at least hydrosilylation reaction-curable, or may be a multi-component composition of two or more components (two-liquid) or more. Even if the composition of one embodiment of the present invention is a one-component composition, it can be stored for long periods of time by sealing it in a sealed container at room temperature without the use of a hydrosilylation reaction inhibitor, and has a pot life sufficient for practical use.

[0071] 1.7 Properties of Semi-Cured Product Comprising the Composition of the Present Invention The semi-cured product obtained by irradiating the composition of one embodiment of the present invention with high-energy radiation and causing a first hydrosilylation reaction to proceed has an adhesive strength to a substrate (e.g., glass, aluminum plate, etc.) of preferably 0.1 MPa or more, more preferably 0.5 MPa or more, and even more preferably 1.0 MPa or more. A method for measuring this adhesive strength will be described in the Examples below. When the semi-cured product has an adhesive strength within the above range, the stability of temporary fixation in the production of, for example, semiconductor devices, can be improved, and as a result, production efficiency can be improved.

[0072] 1.8 Method for Applying the Composition of the Present Invention The composition of the present invention can be applied to an object using a known coating or injection method and cured by the method for producing a cured product described below. The composition of the present invention can be applied, for example, to bonding between members, and to the inside of members, between members that include light-shielding portions, such as the inside of members, and to structures with fine irregularities or narrow gaps. Therefore, it is preferable to apply or inject the composition of the present invention into an object using a dispenser. This allows for precise, fine, and / or small amounts of application or injection. The dispenser may be an air-type, valve-type, screw-type, positive displacement, or jet-type dispenser.

[0073] Furthermore, as described above, the catalyst in the composition of the present invention is not activated at temperatures below the softening point or glass transition point of the thermoplastic resin that forms the wall material of component (D). Therefore, to ensure the fluidity of the composition, when the composition of the present invention is applied to an object, it can be heated within a temperature range in which component (D) is not activated. This can improve the fluidity, close-packing property, and / or coatability of the composition of the present invention.

[0074] 2. Method for Producing Cured Organopolysiloxane Products One aspect of the present invention provides a method for producing a cured organopolysiloxane product (hereinafter also referred to as the "production method of the present invention") by curing the curable organopolysiloxane composition described above in "1. Curable Organopolysiloxane Composition." The production method of the present invention includes at least the following steps (i) and (ii): (i) irradiating the curable organopolysiloxane composition described above in "1. Curable Organopolysiloxane Composition" with high-energy rays to cause a first hydrosilylation reaction to proceed and obtain a semi-cured product, and (ii) heating the semi-cured product at a temperature at which component (D) exhibits activity and causes a second hydrosilylation reaction to proceed and obtain a cured product.

[0075] The above (i) and (ii) may be carried out simultaneously or separately. Carrying out the above (i) and (ii) "simultaneously" does not necessarily mean starting the high-energy ray irradiation and the heating at the same time. That is, the heating (ii) may be started during the high-energy ray irradiation (i). Furthermore, the high-energy ray irradiation (i) may be started during the heating (ii).

[0076] The phrase "separately" carrying out the above (i) and (ii) means that after one of the treatments (i) irradiation of high-energy rays and (ii) heating is completed, the other treatment is started. When carrying out the above (i) and (ii) separately, (i) may be carried out first, or (ii) may be carried out first. However, from the viewpoint of obtaining the effect of stability of temporary fixation by adhesion of the semi-cured product to the substrate, which is a feature of the present invention, it is preferable to carry out (i) first.

[0077] 2.1 Regarding (i) Above: In (i) above, when the composition of the present invention is irradiated with high-energy rays, only component (C) is activated, and the composition rapidly becomes a semi-cured product through a first hydrosilylation reaction. In (i) above, the timing of irradiation with high-energy rays is arbitrary; the composition may be irradiated with high-energy rays immediately before application to the object. Alternatively, the composition may be further irradiated with high-energy rays as a supplemental treatment thereafter. The irradiation dose of high-energy rays is as described above in "1. Curable organopolysiloxane composition," but is not limited to this irradiation dose, and may be any irradiation dose that results in a semi-cured product of the composition of the present invention.

[0078] In one embodiment of the present invention, the step (i) may be carried out in the presence of a shielding material or structure that partially blocks the irradiation of high-energy rays. Even when high-energy rays are irradiated in such an environment, the curing reaction can proceed even in the light-shielded areas by the step (ii). Furthermore, the step (i) may be carried out by irradiating high-energy rays using a light source that is less likely to produce light-shielded areas, such as a spot UV light source, thereby rapidly progressing the first hydrosilylation reaction in the step (i).

[0079] 2.2 Regarding (ii) Above: In (ii) above, the composition of the present invention, while component (C) is activated, is further heated at a temperature at which component (D) exhibits activity, resulting in a final cured product through a second hydrosilylation reaction. The heating temperature in (ii) must be higher than the softening point or glass transition point of the thermoplastic resin that forms the wall material of the microcapsules encapsulating the catalyst of component (D). Specifically, depending on the thermoplastic resin, the heating temperature may be, for example, 80°C or higher, 100°C or higher, or 120°C or higher, and 200°C or lower, 180°C or lower, or 160°C or lower. The heating time varies depending on the type and amount of each component of the composition of the present invention and the heating temperature, but is typically 1 minute to 10 hours, preferably 3 minutes to 5 hours, and more preferably 5 minutes to 2 hours.

[0080] 3. Semiconductor Device, Display Device One aspect of the present invention provides a semiconductor device or display device (hereinafter also referred to as the "semiconductor device or display device of the present invention"). The semiconductor device or display device of the present invention comprises a cured product of the curable organopolysiloxane composition described above in "1. Curable organopolysiloxane composition." Specific examples of the semiconductor device include any semiconductor device, such as optical semiconductors; light-emitting semiconductors; power semiconductors; and semiconductor members such as light-reflecting materials, semiconductor elements, and IC chips. The display device includes any display, etc.

[0081] 4. Method for Manufacturing a Semiconductor Device or Display Device One aspect of the present invention provides a method for manufacturing a semiconductor device or display device (hereinafter also referred to as the "method for manufacturing a semiconductor device or display device of the present invention"). The method for manufacturing a semiconductor device or display device of the present invention includes steps (i) and (ii) of the method for manufacturing a semiconductor device or display device of the present invention described above in "2. Method for Manufacturing a Cured Organopolysiloxane Product." In one aspect, the method for manufacturing a semiconductor device or display device of the present invention involves applying the composition of the present invention to an object, as described above in "1.8 Method for Applying the Composition of the Present Invention," and then performing steps (i) and (ii) of the method for manufacturing a semiconductor device or display device of the present invention described above in "2. Method for Manufacturing a Cured Organopolysiloxane Product." In the method for manufacturing a semiconductor device or display device of the present invention, since the composition of the present invention contains component (A1), even if the curing reaction by component (C) is incomplete, the semi-cured product obtained after irradiation with high-energy rays can be adhered to the substrate, thereby improving the stability of temporary fixation for aligning components, and as a result, improving manufacturing efficiency.

[0082] The present invention will be further described below based on examples, but the present invention is not limited to the following examples.

[0083] A curable organopolysiloxane composition containing the following components according to the formulation in Table 1 was obtained. The composition was then subjected to a curing reaction under the following conditions, and the UV rapid curing property and curability of the light-shielded area were evaluated. The semi-cured product obtained by UV rapid curing was also subjected to an adhesion test using the following method to evaluate its adhesion to the substrate. The results of these evaluations are shown in Table 1. In each average composition formula, Me, Vi, and Ph represent a methyl group, a vinyl group, and a phenyl group, respectively.

[0084] <Component (A)> Component (A1): Average unit formula: (Me ３ SiO １ / ２ ) ０.４４ (SiO ４ / ２ ) ０.５６ (HO １ / ２ ) ０.０２Component (A2-1): Average unit formula: ViMe (vinyl group content = 0 mol %, weight average molecular weight (Mw) measured by GPC using toluene as a solvent = 18,500) ２ SiO(Me ２ SiO) ３００ SiViMe ２ Component (A2-2): Average unit formula: ViMe ２ SiO(Me ２ SiO) １４０ SiViMe ２ Component (A2-3): A masterbatch of 80% by mass of the above-mentioned component (A2-1) and 20% by mass of silazane-treated dry silica (average primary particle size measured by laser diffraction / scattering method: 0.1 to 0.2 μm). Component (A2-4): Average unit formula: Si(OSiMe ２ Vi) ４ Component (A2-5): Average unit formula: PhSi(OSiMe) ２ Vi) ３ The component (A1) is a branched polydimethylsiloxane (vinyl group content: 21% by mass) having no curing reactive functional group containing an aliphatic unsaturated bond in the molecule and having SiO ４／２ The organopolysiloxane contains siloxane units represented by the formula (A2-1) in an amount of at least 20 mol % of all siloxane units. Furthermore, the components (A2-1) to (A2-5) above are all organopolysiloxanes having at least one monovalent hydrocarbon group containing an aliphatic unsaturated bond per molecule.

[0085] <Component (B)> Component (B1): methylhydrogensiloxane-dimethylsiloxane copolymer terminated at both molecular chain terminals by trimethylsiloxy groups (content of silicon-bonded hydrogen atoms = 0.7% by mass); Component (B2): dimethylsiloxane terminated at both molecular chain terminals by dimethylhydrogensiloxy groups (content of silicon-bonded hydrogen atoms = 0.13% by mass); Component (B3): average unit formula: (PhSiO ３／２ ) ０．４ (HMe ２ SiO １／２ ) ０．６ Component (B4): Average unit formula: (HMe ２ SiO １ / ２ ) ０.５２ (Me ２ SiO ２／２ ) ０．１５ (SiO ４ / ２ ) ０.３３ The components (B1) to (B4) are organohydrogenpolysiloxanes containing at least two silicon-bonded hydrogen atoms per molecule.

[0086] <Component (C)> Component (C1): (methylcyclopentadienyl)trimethylplatinum(IV) complex (a curing reaction catalyst that promotes a hydrosilylation reaction upon exposure to ultraviolet (UV) light) <Component (D)> Component (D1): platinum-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum atom content: 4000 ppm by mass) dispersed in polycarbonate microcapsules having an average particle size of 2 μm (softening point: 150°C) Component (D2): platinum-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum atom content: 4000 ppm by mass) dispersed in acrylic resin microcapsules having an average particle size of 2 μm (softening point: 100°C)

[0087] <Other Components> Adhesion promoter: an adhesion promoter represented by the following structural formula (wherein Me is a methyl group):

[0088] [UV Rapid Curing] 0.1 mL of the liquid composition of each sample prepared was dropped onto an aluminum plate, and UV light was irradiated at 4 J / cm from the following ultraviolet (UV) light source. ２ Light source: UV LED spot light: ULEDN-101 (NS-Lighting Co. Ltd.) Wavelength: 365 nm Irradiation dose: UV energy: 4000 mW / cm 2 Ten minutes after the start of UV irradiation, the surface of the composition (semi-cured product) after UV irradiation was touched with a hand, and if it was sticky it was evaluated as cured, and if it was not sticky it was evaluated as uncured.

[0089] [Curing property of light-shielded area] The liquid composition of each sample prepared was applied to an aluminum plate in an area of ​​25 mm in width, 75 mm in length, and 1.0 mm in thickness, and the aluminum plate was used as a lid to shield the light. The same UV light as above was applied at 4 J / cm. ２ The coating was then thermally cured in a circulating oven (150°C, 1 hour). The curing of the light-shielded area was evaluated as cured when the lid of the aluminum plate was removed and the composition (cured product) was in close contact with the coated aluminum plate. In addition, if the composition (cured product) was sticky and could be peeled off from the coated aluminum plate, it was evaluated as uncured.

[0090] [Curing property of light-shielded area] 0.1 mL of the liquid composition of each sample prepared was dropped onto an aluminum plate, and the same UV light as above was applied at 4 J / cm ２ The aluminum plate was placed on a glass substrate and aged for 30 minutes at room temperature. The adhesive strength of the composition (semi-cured product) was evaluated by a die shear test based on JIS K6854-2.

[0091]

[0092] As shown in Table 1, the compositions of Examples 1 and 2 containing both component (C) and component (D) exhibited good rapid curing properties and good curing properties in the light-shielding portion when irradiated with UV light. Furthermore, the compositions of Examples 1 and 2 containing component (A1) exhibited high adhesion to glass substrates after UV curing. On the other hand, the composition of Comparative Example 2, which did not contain component (D), exhibited poor curing properties in the light-shielding portion. Furthermore, the compositions of Comparative Examples 1 and 2, which did not contain component (A1), did not exhibit adhesion to glass substrates after UV curing. From the above, it can be seen that the compositions of the present invention containing components (A1), (A2), (B), (C), and (D) exhibited good rapid curing properties when irradiated with high-energy rays and good curing properties in the light-shielding portion after thermal curing, as well as excellent adhesion to substrates after UV curing, which can improve the stability of temporary fixation in the manufacture of semiconductor devices and the like.

Claims

1. (A1) A resin having no curing reactive functional group containing an aliphatic unsaturated bond in the molecule and having SiO ４／２ (A2) an organopolysiloxane having at least one monovalent hydrocarbon group containing an aliphatic unsaturated bond per molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms per molecule; (C) a first hydrosilylation catalyst that exhibits activity when irradiated with high-energy rays; and (D) a second hydrosilylation catalyst that is microencapsulated in a thermoplastic resin having a softening point within the temperature range of 50 to 200°C.

2. The component (A1) is represented by the following average unit formula (1): (R 1 ３ SiO １／２ ) a (R 1 ２ SiO ２／２ ) b (R 1 SiO ３／２ ) c (SiO ４／２ ) d (R ２ O １／２ ) ｅ (1) (In the formula, each R 1 each independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms and no aliphatic unsaturated bond; R ２ is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a, b, c, d, and e are numbers that satisfy the following: 0.35≦a≦0.70, 0≦b≦0.20, 0≦c≦0.20, 0.30≦d≦0.65, 0≦e≦0.05, and a+b+c+d=1.

3. The curable organopolysiloxane composition according to claim 1, wherein component (A1) is contained in an amount within the range of 20 to 70 mass % based on the total amount of components (A1), (A2) and (B).

4. The curable organopolysiloxane composition according to claim 1, wherein component (C) and component (D) both contain platinum-based metals, and the molar ratio of the amounts of platinum-based metals in both components ((C) / (D)) is in the range of 0.01 to 200.

5. The curable organopolysiloxane composition according to claim 1, wherein component (A2) comprises at least a branched organopolysiloxane.

6. The curable organopolysiloxane composition according to claim 5, wherein the branched organopolysiloxane is contained in an amount within the range of 1 to 20 mass % based on the total amount of components (A1), (A2) and (B).

7. The curable organopolysiloxane composition according to claim 1, wherein the content of the hydrosilylation reaction inhibitor is less than 0.1 mass % based on the curable organopolysiloxane composition.

8. The curable organopolysiloxane composition of claim 1 which is a one-part composition.

9. The curable organopolysiloxane composition according to claim 1, wherein the semi-cured product obtained by irradiating the curable organopolysiloxane composition according to claim 1 with high-energy rays and causing a first hydrosilylation reaction to proceed has an adhesive strength of 0.1 MPa or more to a substrate.

10. A cured product of the curable organopolysiloxane composition according to any one of claims 1 to 9.

11. A semiconductor device or display device comprising the cured product according to claim 10.

12. A method for producing a cured organopolysiloxane product, comprising: (i) irradiating the curable organopolysiloxane composition according to any one of claims 1 to 9 with high-energy rays to cause a first hydrosilylation reaction to proceed and obtain a semi-cured product; and (ii) heating the semi-cured product at a temperature at which component (D) shows activity and causes a second hydrosilylation reaction to proceed and obtain a cured product.

13. The method according to claim 12, wherein obtaining the semi-cured product is carried out in the presence of a shield or structure that partially blocks irradiation with high-energy rays.

14. The process of claim 12, wherein (i) and (ii) are carried out simultaneously or separately.

15. A method for manufacturing a semiconductor device or display device, comprising the method according to claim 12.

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