Optical module

Abstract

Disclosed is an optical module, comprising a circuit board, a laser and, located on the circuit board, a bias circuit, a power supply circuit, a voltage measurement circuit and an MCU. The laser comprises a light-emitting area connected to the bias circuit and an electro-absorption modulation area connected to the power supply circuit, the bias circuit supplying a bias current to the light-emitting area, and the power supply circuit supplying power to the electro-absorption modulation area; the voltage measurement circuit is connected to the electro-absorption modulation area so as to measure the voltage of the electro-absorption modulation area and convert the voltage into a current; the MCU is connected to a first end of the power supply circuit and the voltage measurement circuit, collects the current output by the voltage measurement circuit and, according to the current, adjusts the voltage output by the power supply circuit so as to reduce the voltage of the electro-absorption modulation area.

Description

optical modules

[0001] This application claims priority from application number 202311508340.0 filed with the China Patent Office on November 13, 2023; the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals and are one of the key components in optical communication equipment.

[0004] The lasers inside the optical module include directly modulated lasers and externally modulated lasers. Since directly modulated lasers are not suitable for long-distance and high-speed communication transmission, externally modulated lasers are usually used in long-distance optical communication transmission or high-speed optical communication transmission. For example, the more common electro-absorption modulated laser (EML) is used. The optical power detection circuit of the EML usually requires adding a monitor photodiode (Monitor PD Chip, MPD) to the optical transmitter optical subassembly (TOSA) to sample the backlight current. The current is then converted into a positive voltage through a conversion circuit and fed to the MCU for voltage sampling. The MCU monitors the optical power by monitoring the voltage.

[0005] Summary of the Invention

[0006] In a first aspect, the present disclosure provides an optical module, comprising:

[0007] circuit boards;

[0008] A laser is electrically connected to the circuit board, the laser comprising a light emitting region and an electro-absorption modulation region, and the laser is configured to emit a light signal;

[0009] A bias circuit is mounted on the circuit board, the bias circuit is connected to the light-emitting area, and the bias circuit is configured to provide a bias current to the light-emitting area so that the light-emitting area emits light;

[0010] a power supply circuit mounted on the circuit board, the power supply circuit being connected to the electro-absorption modulation area, and the power supply circuit being configured to supply power to the electro-absorption modulation area;

[0011] a voltage detection circuit mounted on the circuit board, the voltage detection circuit being connected to the electro-absorption modulation area, the voltage detection circuit being configured to detect the voltage of the electro-absorption modulation area and convert the voltage into a current;

[0012] The MCU is mounted on a circuit board, wherein a first end of the MCU is connected to a first end of a power supply circuit, and a second end of the MCU is connected to a voltage detection circuit. The MCU is configured to collect a current output by the voltage detection circuit and adjust a voltage output by the power supply circuit according to the current to reduce a voltage in the electro-absorption modulation area.

[0013] In a second aspect, the present disclosure provides an optical module, comprising:

[0014] circuit boards;

[0015] A laser is electrically connected to the circuit board, the laser comprising a light emitting region and an electro-absorption modulation region, and the laser is configured to emit a light signal;

[0016] A bias circuit is mounted on the circuit board, the bias circuit is connected to the light-emitting area, and the bias circuit is configured to provide a bias current to the light-emitting area so that the light-emitting area emits light;

[0017] a power supply circuit mounted on the circuit board, the power supply circuit being connected to the electro-absorption modulation area, and the power supply circuit being configured to supply power to the electro-absorption modulation area;

[0018] a voltage detection circuit mounted on the circuit board, the voltage detection circuit being connected to the electro-absorption modulation area, and the voltage detection circuit being configured to detect a voltage in the electro-absorption modulation area;

[0019] The MCU is mounted on a circuit board, wherein a first end of the MCU is connected to a first end of a power supply circuit, and a second end of the MCU is connected to a voltage detection circuit. The MCU is configured to collect a voltage output by the voltage detection circuit and adjust the voltage output by the power supply circuit according to the voltage to reduce the voltage in the electro-absorption modulation area. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0021] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0022] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0023] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0024] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0025] FIG5 is a circuit block diagram of the current conventional EML laser APC closed-loop control;

[0026] FIG6 is a structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure;

[0027] FIG7 is a first circuit block diagram of APC closed-loop control of an EML laser in an optical module according to some embodiments of the present disclosure;

[0028] FIG8 is a circuit schematic diagram of APC closed-loop control of an EML laser in an optical module according to some embodiments of the present disclosure;

[0029] FIG9 is a first diagram illustrating a power stabilization principle of an EML laser in an optical module according to some embodiments of the present disclosure;

[0030] FIG10 is an enlarged diagram of a partial circuit of an APC closed-loop control of an EML laser in an optical module according to some embodiments of the present disclosure;

[0031] FIG11 is a second diagram showing a power stabilization principle of an EML laser in an optical module according to some embodiments of the present disclosure;

[0032] FIG12 is a second circuit block diagram of APC closed-loop control of an EML laser in an optical module according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0033] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0034] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0035] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0036] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0037] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0038] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0039] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0040] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0041] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0042] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0043] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0044] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0045] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0046] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0047] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0048] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0049] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and the opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located on the side of the optical module 200. The opening 204 is an electrical port, from which the gold finger 301 of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0050] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0051] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0052] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0053] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0054] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0055] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0056] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0057] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0058] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0059] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0060] The optical transmission component 400 is configured to transmit an optical signal. Specifically, the optical transmission component 400 includes a laser. Lasers generally include directly modulated lasers and externally modulated lasers. Since directly modulated lasers are not suitable for long-distance and high-speed communication transmission, externally modulated lasers, such as the more common electro-absorption moduled laser (EML), are typically used for long-distance optical communication transmission or high-speed optical communication transmission.

[0061] When an EML laser is operating, its threshold current and other characteristics generally change with parameters such as temperature. Due to changes in characteristics such as the threshold current, the output optical power of the EML laser will inevitably change accordingly. In order to maintain the stability of the output optical power of the EML laser, the operating current of the EML laser needs to be adjusted accordingly.

[0062] Figure 5 is a block diagram of the APC closed-loop control circuit for a conventional EML laser. As shown in Figure 5, the optical module includes an EML laser, a monitor photo detector (mPD), a driver circuit, and an MCU. The EML laser is equipped with a distributed feedback laser diode (DFB LD) and an electro-absorption modulation region (EA). The luminescent region emits light under the action of a bias current. Under the action of a power supply signal, the electro-absorption modulation region converts a portion of the light emitted by the luminescent region into current and modulates the remaining light to generate an optical signal, thereby transmitting the optical signal.

[0063] To compensate for variations in EML laser characteristics and stabilize the output optical power, automatic power control (APC) technology is generally employed. The principle of APC closed-loop control is as follows: a laser driver circuit or an external power supply provides the bias current necessary for the DFB LD to emit light, causing the DFB LD to emit light; the modulation drive circuit 307 outputs a differential electrical signal. Since the EA modulator is a single-ended driver device, TXN is generally terminated using a "capacitor + 5lohm resistor" configuration. TXP drives the EA modulator, which modulates a portion of the light emitted from the light-emitting area under the action of the electrical signal to produce a modulated optical signal.

[0064] The mPD is placed in the backlight direction of the DFB LD. The light output of the DFB LD and the light intensity collected by the mPD are in a certain proportional relationship and remain relatively stable. The mPD collects a certain proportion of the DFB LD light and converts it into a detection current. The MCU can collect this detection current to monitor the DFB emission light power.

[0065] Since the cathode of the mPD is grounded, an external negative voltage is required to make the mPD work in reverse bias in the detection state. However, the laser drive circuit cannot receive negative voltage input. Therefore, a mirror current source or integrated operational amplifier is often used between the MCU and the mPD output to convert the detection current output by the mPD into a current or voltage signal that can be collected by the MCU.

[0066] The MCU monitors the current signal output by the mPD and adjusts the bias current output to the DFB LD to maintain the relative stability of the LD light emission and the stability of the EML laser's output optical power.

[0067] However, the relative position of the mPD and DFB LD determines the ratio of the collected optical power output. Since the mPD and DFB LD are two separate devices, their relative position is easily affected by parameters such as temperature and can change. This can cause the ratio of the light output collected by the mPD to the LD to change, resulting in inaccurate optical power monitoring and errors in the APC closed loop. In addition, because the EA is located in the forward direction of the DFB LD, aging of the EA will cause changes in the optical power output. When the mPD is used to monitor the optical power output of the EML laser, optical power compensation for EA aging cannot be achieved, resulting in inaccurate monitoring of the laser's optical power output.

[0068] To address the above problems, an embodiment of the present disclosure provides an optical module that adopts EA forward monitoring and a dual closed-loop control circuit of EA current monitoring and EA voltage monitoring to achieve automatic optical power control of the EML laser.

[0069] Figure 6 is a structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure, Figure 7 is a circuit block diagram of an APC closed-loop control circuit for an EML laser in an optical module according to some embodiments of the present disclosure, and Figure 8 is a circuit schematic diagram of an APC closed-loop control circuit for an EML laser in an optical module according to some embodiments of the present disclosure. As shown in Figures 6, 7, and 8, an MCU 302, a bias circuit 303, a power supply circuit 304, and a modulation drive circuit 307 are mounted on a circuit board 300, wherein:

[0070] MCU 302 is connected to bias circuit 303 and power supply circuit 304, respectively. Specifically, a first terminal of MCU 302 is connected to power supply circuit 304, and MCU 302 is configured to control power supply circuit 304 to output a modulation voltage to supply power to the electro-absorption modulation area; a third terminal of MCU 302 is connected to bias circuit 303, and MCU 302 is configured to control bias circuit 303 to generate a bias current.

[0071] A first terminal of bias circuit 303 is connected to a third terminal of MCU 302, and a second terminal of bias circuit 303 is connected to the light-emitting region of the EML laser. Bias circuit 303 is configured to provide a bias current to the light-emitting region to cause it to emit light. Specifically, bias circuit 303 generates a bias current under the action of MCU 302 and transmits the bias current to the light-emitting region, causing the light-emitting region to emit light under the action of the bias current.

[0072] In some embodiments, the bias circuit 303 may also be a power supply, which is electrically connected to the light-emitting area and provides a bias current to the light-emitting area to make the light-emitting area emit light; the power supply receives the control instructions sent by the MCU302, and the power supply adjusts the output bias current according to the control instructions to adjust the output optical power of the EML laser.

[0073] The first end of the power supply circuit 304 is connected to the first end of the MCU302, and the second end of the power supply circuit 304 is connected to the first end of the electro-absorption modulation zone. The power supply circuit 304 is configured to supply power to the electro-absorption modulation zone. The electro-absorption modulation zone modulates part of the light emitted by the light-emitting zone under the action of the electrical signal output by the modulation drive circuit 307 to obtain a modulated light signal.

[0074] In some embodiments, the second terminal of the electro-absorption modulation region is grounded, and the modulation voltage output by the power supply circuit 304 is a negative voltage, causing the electro-absorption modulation region to generate a modulation current under the action of the negative voltage. The operating principle of the power supply circuit 304 is as follows: the first terminal of the MCU 302 generates a positive voltage DAC_VEA control signal, and the power supply circuit 304 generates a negative voltage VEA based on the DAC_VEA control signal.

[0075] In some examples, the first terminal of the MCU 302 is a voltage output digital-to-analog converter VDAC, and the VDAC outputs a positive voltage DAC_VEA.

[0076] In some embodiments, the power supply circuit 304 may include an operational amplifier having an inverting function. The positive voltage DAC_VEA generated by the MCU 302 is converted into a negative voltage VEA through the inverting function of the operational amplifier, so that the power supply circuit 304 provides a negative voltage VEA to the electro-absorption modulation area.

[0077] Under the action of negative voltage, the electro-absorption modulation area absorbs part of the light emitted by the light-emitting area to generate current. The other part of the light emitted by the light-emitting area is modulated with the electrical signal output by the modulation drive circuit 307 to obtain a modulated light signal. The greater the absolute value of the negative voltage output by the power supply circuit 304, the more light is absorbed by the electro-absorption modulation area, and the greater the current generated on the electro-absorption modulation area. Because part of the light emitted by the light-emitting area is absorbed by the electro-absorption modulation area, the light modulated by the electro-absorption modulation area is reduced, resulting in a decrease in the output optical power of the EML laser. Therefore, the current on the electro-absorption modulation area is negatively correlated with the output optical power of the EML laser. The output optical power of the EML laser can be monitored by detecting the current in the electro-absorption modulation area.

[0078] The electro-absorption modulation area generates a current IEA under the action of the negative voltage output by the power supply circuit 304. The IEA is transmitted from the electro-absorption modulation area to the power supply circuit 304. The MCU302 can collect the current IEA flowing through the power supply circuit 304. The MCU302 can calibrate the output optical power of the EML laser based on the collected current IEA.

[0079] Figure 9 is a schematic diagram of the power stabilization principle of an EML laser in an optical module according to some embodiments of the present disclosure. As shown in Figure 9, the first terminal VDAC1 of MCU 302 provides a positive supply voltage DAC_VEA to the power supply circuit 304. The power supply circuit 304 inverts DAC_VEA to output a negative voltage VEA. The negative voltage VEA acts on the electro-absorption modulation region, which generates a modulation current IEA under the action of the negative voltage VEA. The first terminal of MCU 302 collects the modulation current IEA.

[0080] Because the modulation current IEA of the electro-absorption modulation region is negatively correlated with the output optical power of the EML laser, a lookup table of current IEA and output optical power can be stored in MCU302. MCU302 obtains the output optical power value based on the collected current IEA and compares the output optical power value with the preset optical power (average optical power). When the output optical power exceeds or does not reach the preset optical power, MCU302 adjusts the bias current output by bias circuit 303 to adjust the output optical power of the DFB LD so that the adjusted output optical power of the EML laser reaches the preset optical power, thereby forming an APC closed-loop control to keep the output optical power of the EML laser relatively stable.

[0081] In some embodiments, the MCU302 may also store a functional relationship between the current IEA and the output optical power. The MCU302 calculates the output optical power value based on the collected current IEA and the functional relationship, and compares the output optical power value with the preset optical power. When the output optical power exceeds or does not reach the preset optical power, the MCU302 adjusts the bias current output by the bias circuit 303 to adjust the output optical power of the DFB LD, so that the output optical power of the EML laser remains relatively stable.

[0082] For example, when the output optical power P obtained by MCU302 according to the current IEA is greater than the preset optical power P0, MCU302 controls to reduce the bias current output by the bias circuit 303 to reduce the output optical power P of the DFB LD, so that the adjusted output optical power P′ of the EML laser is equal to the preset optical power P0.

[0083] When the output optical power P obtained by MCU302 according to current IEA is less than the preset optical power P0, MCU302 controls to increase the bias current output by bias circuit 303 to increase the output optical power P of DFB LD, so that the adjusted output optical power P′ of EML laser is equal to the preset optical power P0.

[0084] In some embodiments, since the current IEA of the electro-absorption modulation region is negatively correlated with the output optical power of the EML laser, when the output optical power of the EML laser is the preset optical power P0, the current IEA of the electro-absorption modulation region has the preset modulation current I0. Therefore, the preset modulation current I0 may be stored in the MCU302. After the MCU302 acquires the current IEA, it compares the current IEA with the preset modulation current I0. When the current IEA is different from the preset modulation current I0, the MCU302 adjusts the bias current output by the bias circuit 303 to adjust the output optical power of the DFB LD so that the adjusted output optical power of the EML laser reaches the preset optical power, thereby maintaining the relative stability of the output optical power of the EML laser.

[0085] For example, after the MCU 302 collects the current IEA, if the current IEA is greater than the preset modulation current I0, the MCU 302 controls the reduction of the bias current output by the bias circuit 303 to reduce the output optical power of the DFB LD, so that the adjusted output optical power of the EML laser is equal to the preset optical power.

[0086] If the current IEA is less than the preset modulation current I0, the MCU 302 controls to increase the bias current output by the bias circuit 303 to increase the output optical power of the DFB LD, so that the adjusted output optical power of the EML laser is equal to the preset optical power.

[0087] Because the DFB LD and the electro-absorption modulation area EA are located in the same EML laser, their relative positions are fixed, and the electro-absorption modulation area EA is located in the front light-emitting direction of the LD. There is no error caused by coupling or TE, and the light-emitting status of the DFB LD can be more accurately acquired. The MCU 302, the power supply circuit 304, the electro-absorption modulation area EA, the bias circuit 303, and the DFB LD form an APC closed-loop control. The MCU 302 collects the current generated by the electro-absorption modulation area EA under the modulation voltage output by the power supply circuit 304. The MCU 302 controls the bias current provided to the DFB LD based on the collected current feedback to adjust the light output power of the EML laser, thereby automatically controlling the light output power of the EML laser and maintaining the relative stability of the light output power of the EML laser.

[0088] In some embodiments, when the optical module has been running for a certain period of time, the electro-absorption modulation region of the EML laser may experience aging problems. When the electro-absorption modulation region experiences aging problems, the current generated by the electro-absorption modulation region under the action of the modulation voltage will change, thereby causing the output optical power of the EML laser to fluctuate. Therefore, it is necessary to compensate for the loss of output optical power caused by the aging of the electro-absorption modulation region.

[0089] When MCU302 adopts the APC closed-loop control circuit with EA current monitoring to maintain the stability of the output optical power of the EML laser, the aging problem of the electro-absorption modulation area EA is not considered, and it is assumed that the electro-absorption modulation area EA has not aged. After the APC closed-loop control circuit with EA current monitoring is adopted to achieve the stability of the output optical power of the EML laser, the voltage change of the electro-absorption modulation area EA can be monitored to detect whether the electro-absorption modulation area EA is aged. When the electro-absorption modulation area EA is aged, MCU302 compensates for the loss of output optical power caused by EA aging by adjusting the negative voltage VEA output by the power supply circuit 304.

[0090] Figure 10 is an enlarged diagram of a partial circuit diagram of the APC closed-loop control of an EML laser in an optical module according to some embodiments of the present disclosure. Figure 11 is a second schematic diagram of the power stabilization principle of an EML laser in an optical module according to some embodiments of the present disclosure. As shown in Figures 10 and 11, the electro-absorption modulation area EA generates a current IEA under the influence of the negative voltage output by the power supply circuit 304. When the electro-absorption modulation area EA ages, the internal resistance of the electro-absorption modulation area EA increases. When the negative voltage output by the power supply circuit 304 remains unchanged, the internal resistance of the electro-absorption modulation area EA increases, resulting in a decrease in the current IEA generated by the power supply circuit 304. This reduces the voltage divider of the device connected in series with the electro-absorption modulation area EA, causing the voltage of the electro-absorption modulation area EA to increase. Therefore, EA aging can be determined by monitoring the increase in the voltage of the electro-absorption modulation area EA.

[0091] In order to monitor the voltage of the electro-absorption modulation area EA, a voltage detection circuit 305 is also installed on the circuit board 300. The first end of the voltage detection circuit 305 can be connected to the first end of the electro-absorption modulation area, the second end of the voltage detection circuit 305 can be connected to the second end of the electro-absorption modulation area, and the third end of the voltage detection circuit 305 is connected to the second end of the MCU302, so as to collect the voltage of the electro-absorption modulation area through the voltage detection circuit 305 and transmit the collected voltage to the MCU302.

[0092] In some embodiments, since the second end of the electro-absorption modulation zone is grounded, the voltage detection circuit 305 can be connected only to the first end of the electro-absorption modulation zone, that is, the first end of the voltage detection circuit 305 is connected to the first end of the electro-absorption modulation zone, and the second end of the voltage detection circuit 305 is connected to the second end of the MCU 302. The voltage detection circuit 305 is configured to detect the voltage of the first end of the electro-absorption modulation zone.

[0093] Since the second end of the electro-absorption modulation zone is grounded, the voltage at the first end of the electro-absorption modulation zone is negative, and the MCU 302 generally cannot collect negative voltages. Therefore, the negative voltage at the first end of the electro-absorption modulation zone can be converted into a positive current through the voltage detection circuit 305 .

[0094] After MCU302 collects the current I2 output by the voltage detection circuit 305, it determines whether the EA is aged based on the change of the current I2. For example, if the current I2 is the preset current I0 and has not changed, it means that the voltage of the electro-absorption modulation area has not changed, and the electro-absorption modulation area has not aged; if the current I2 is greater than the preset current I0, it means that the voltage of the electro-absorption modulation area has increased, the internal resistance of the electro-absorption modulation area has increased, and the electro-absorption modulation area has aged.

[0095] After MCU302 determines that the electro-absorption modulation region has aged, to compensate for the loss in output optical power caused by the aging of the electro-absorption modulation region, MCU302 controls the reduction of the negative voltage output by the power supply circuit 304 (reducing the absolute value of the negative voltage). This reduces the voltage divider applied to the electro-absorption modulation region, thereby reducing the electro-absorption modulation region's absorption of light emitted by the light-emitting region. While the output optical power of the DFB LD remains unchanged, the less light the electro-absorption modulation region absorbs, the more modulated optical signal it outputs, and the closer the actual output optical power of the EML laser is to the output optical power of the DFB LD.

[0096] In this way, the MCU 302, the voltage detection circuit 305, the power supply circuit 304 and the electro-absorption modulation area EA form an APC closed-loop control. The APC closed-loop control circuit using EA voltage monitoring compensates for the optical power loss caused by EA aging to maintain the stability of the output optical power of the EML laser.

[0097] 10 , in some embodiments, if the second end of the power supply circuit 304 is directly connected to the first end of the electro-absorption modulation zone, and the negative voltage output by the power supply circuit 304 remains unchanged, even if the electro-absorption modulation zone ages, the voltage change in the electro-absorption modulation zone is small due to the small resistance of the wire, and the MCU 302 may not be able to monitor the voltage change in the electro-absorption modulation zone based on the voltage detection circuit 305. Therefore, in order to enable the MCU 302 to monitor the voltage change in the electro-absorption modulation zone when the electro-absorption modulation zone ages, a first resistor R6 is further installed on the circuit board 300. The first end of the first resistor R6 is connected to the second end of the power supply circuit 304, the second end of the first resistor R6 is connected to the first end of the electro-absorption modulation zone, and the first end of the voltage detection circuit 305 is connected to the second end of the first resistor R6, so that the first resistor R6 is connected in series with the electro-absorption modulation zone, and the first resistor R6 is configured as a voltage divider.

[0098] Due to the voltage division of the first resistor R6, if the electro-absorption modulation area ages (increases its internal resistance) while the negative voltage output by the power supply circuit 304 remains unchanged, the current IEA generated by the electro-absorption modulation area under the action of the negative voltage will decrease, causing the voltage of the first resistor R6 to decrease. This will increase the voltage of the electro-absorption modulation area, and thus the voltage at the second end of the first resistor R6 (the first end of the first electro-absorption modulation area) will increase.

[0099] Because the voltage detection circuit 305 inputs the voltage at the second end of the first resistor R6 and outputs the current I2, when the electro-absorption modulation region ages, the voltage at the second end of the first resistor R6 increases, causing the current I2 output by the voltage detection circuit 305 to increase. For example, when the electro-absorption modulation region has not aged, the current I2 output by the voltage detection circuit 305 may be 5 mA; when the electro-absorption modulation region ages, the current I2 output by the voltage detection circuit 305 may be 7 mA.

[0100] 10 , in order to monitor the voltage change at the second end of the first resistor R6 by the change of the current I2 output by the voltage detection circuit 305, the voltage detection circuit 305 includes a second resistor R5, a third resistor R7, a fourth resistor R8, a fifth resistor R9, a sixth resistor R10 and an operational amplifier Q1, wherein,

[0101] A first end of the second resistor R5 is connected to a second end of the first resistor R6 , and a second end of the second resistor R5 is connected to an inverting input end of the operational amplifier Q1 .

[0102] A first end of the third resistor R7 is connected to the inverting input end of the operational amplifier Q1 , so that the first end of the third resistor R7 is connected to the second end of the second resistor R5 .

[0103] A first end of the fourth resistor R8 is connected to the positive input terminal of the operational amplifier Q1 , and a second end of the fourth resistor R8 can be connected to a negative power supply.

[0104] A first end of the fifth resistor R9 is connected to the positive input end of the operational amplifier Q1 , a second end of the fifth resistor R9 is connected to the second end of the third resistor R7 , and a first end of the fourth resistor R8 is connected to the first end of the fifth resistor R9 .

[0105] The inverting input terminal of the operational amplifier Q1 is connected to the second end of the second resistor R5 and the first end of the third resistor R7, the positive input terminal of the operational amplifier Q1 is connected to the first end of the fourth resistor R8 and the first end of the fifth resistor R9, and the output terminal of the operational amplifier Q1 is connected to the second end of the third resistor R7.

[0106] A first end of the sixth resistor R10 is connected to the second end of the third resistor R7 , and a second end of the sixth resistor R10 is connected to the second end of the MCU 302 .

[0107] The operating principle of the voltage detection circuit 305 is as follows: it samples the voltage Ui at the second end of the first resistor R6, converts it into a current I2 through differential amplification by the operational amplifier Q1, and then collects the current I2 through the MCU 302. If the voltage output by the power supply circuit 304 remains unchanged, if the electro-absorption modulation region ages, the voltage across the electro-absorption modulation region increases, causing the voltage Ui at the second end of the first resistor R6 to increase. This increases the current I2 output by the voltage detection circuit 305, and changes (increases) the current I2 collected by the MCU 302. The MCU 302 then adjusts the output optical power of the EML laser by adjusting the voltage output by the power supply circuit 304 to compensate for the optical power loss caused by the aging of the electro-absorption modulation region.

[0108] Due to the "virtual short and virtual open" of the positive input and negative input of the operational amplifier, the voltages at the positive input and negative input of the operational amplifier are equal, that is, V3=V4, and the currents at the positive input and negative input of the operational amplifier are both 0, that is, I3=I4.

[0109] Since the currents at both the positive and negative input terminals of the operational amplifier are zero, the second resistor R5 is connected in series with the third resistor R7, and the fourth resistor R8 is connected in series with the fifth resistor R9. Since the second resistor R5 is connected in series with the third resistor R7, and the fourth resistor R8 is connected in series with the fifth resistor R9, the current flowing through the second resistor R5 is equal to the current flowing through the third resistor R7, and the current flowing through the fourth resistor R8 is equal to the current flowing through the fifth resistor R9.

[0110] Let the voltage at the first end of the second resistor R5 be Ui. If the resistance relationship is selected as third resistor R7 / second resistor R5=fifth resistor R9 / fourth resistor R8, that is, the ratio of the third resistor R7 to the second resistor R5 is equal to the ratio of the fifth resistor R9 to the fourth resistor R8; then the current I2 collected by MCU302 is:

[0111] When the electro-absorption modulation area EA ages, the voltage Ui input to the first end of the second resistor R5 changes, and the current I2 output by the voltage detection circuit 305 also changes. The MCU 302 adjusts the output voltage of the power supply circuit 304 by monitoring the change of the current I2, thereby adjusting the voltage applied to the electro-absorption modulation area and further adjusting the output optical power of the EML laser.

[0112] Specifically, when the electro-absorption modulation area EA ages, the internal resistance of EA increases. When the output voltage of the power supply circuit 304 remains unchanged, the voltage Ui at the first end of the second resistor R5 becomes more negative (the absolute value of Ui becomes larger), and the voltage applied to the electro-absorption modulation area increases, resulting in an increase in the electro-absorption modulation area's absorption of the light emitted by the light-emitting area, and a decrease in the modulated light signal output by the electro-absorption modulation area, causing the actual output optical power of the EML laser to be less than the output optical power of the DFB LD.

[0113] When the absolute value of the voltage Ui at the first end of the second resistor R5 becomes larger, the current I2 collected by the MCU302 also becomes larger. In order to stabilize the actual output optical power of the EML laser, it is necessary to reduce the absorption of light emitted by the light-emitting area by the electro-absorption modulation area. At this time, the MCU302 needs to control the reduction of the output negative voltage of the power supply circuit 304 to reduce the negative voltage applied to the electro-absorption modulation area, thereby reducing the absorption of light emitted by the light-emitting area by the electro-absorption modulation area. In this way, the modulated light signal output by the electro-absorption modulation area increases, and the current I2 collected by the MCU302 will also decrease, maintaining the relative stability of the current I2, thereby maintaining the relative stability of the absorption of the electro-absorption modulation area and the relative stability of the output optical power of the EML laser.

[0114] After the MCU 302 collects the current I2 output by the voltage detection circuit 305, a preset current may be stored in the MCU 302 to determine whether the electro-absorption modulation area has aged based on the current I2. The collected current I2 is compared with the preset current. When the collected current I2 is greater than the preset current, it indicates that the electro-absorption modulation area has aged. The MCU 302 controls the voltage output by the power supply circuit 304 to adjust the voltage applied to the electro-absorption modulation area so that the adjusted output optical power of the electro-absorption modulation area reaches the preset optical power.

[0115] Specifically, when the current I2 output by the voltage detection circuit 305 is greater than the preset current, it indicates that the electro-absorption modulation area has an aging problem, and the light output power of the electro-absorption modulation area is less than the light output power of the light-emitting area (preset light power), resulting in light power loss. In order to reduce the light power loss caused by the aging of the electro-absorption modulation area, the MCU302 controls the reduction of the voltage output by the power supply circuit 304 to reduce the negative pressure applied to the electro-absorption modulation area, so that the electro-absorption modulation area reduces the absorption of the light emitted by the light-emitting area. In this way, the modulated light signal output by the electro-absorption modulation area increases, and the light output power of the electro-absorption modulation area is close to the preset light power, thereby maintaining the relative stability of the absorption of the electro-absorption modulation area and the relative stability of the light output power of the EML laser.

[0116] After reducing the negative voltage applied to the electro-absorption modulation area, the voltage at the second end of the first resistor R6 decreases, and the voltage input to the voltage detection circuit 305 decreases, causing the current I2 collected by the MCU302 to decrease, thereby maintaining the relative stability of the current I2 output by the voltage detection circuit 305.

[0117] In some embodiments, since the voltage detection circuit 305 includes an operational amplifier, due to the "virtual disconnection" of the operational amplifier, the current IEA generated in the electro-absorption modulation area will not flow through the voltage detection circuit 305, and the voltage detection circuit 305 will not affect the current IEA on the electro-absorption modulation area. In this way, when the output voltage of the power supply circuit 304 remains unchanged, then when the electro-absorption modulation area ages, the current IEA on the electro-absorption modulation area will decrease, and the voltage of the electro-absorption modulation area will change, so that the APC closed-loop control circuit using EA voltage monitoring can compensate for the optical power loss caused by EA aging.

[0118] 8 , in some embodiments, a matching circuit 306 is further mounted on the circuit board 300 , wherein a first end of the matching circuit 306 is connected to a second end of the first resistor R6 , and a second end of the matching circuit 306 is connected to a first end of the electro-absorption modulation region, and the matching circuit 306 is configured for filtering.

[0119] Specifically, the matching circuit 306 includes a seventh resistor R4, a first inductor L9, a second inductor L8 and a third inductor L7. The first end of the seventh resistor R4 is connected to the second end of the first resistor R6, and the second end of the seventh resistor R4 is connected to the second end of the first inductor L9.

[0120] The first end of the first inductor L9 is connected to the second end of the first resistor R6, and the second end of the first inductor L9 is connected to the second end of the seventh resistor R4. The primary function of the first inductor L9 is to prevent the power ripple on the first resistor R6 from entering the electro-absorption modulation region and affecting the laser eye diagram performance. It also prevents the power ripple from entering the modulation drive circuit 307 and affecting its operating performance.

[0121] In some embodiments, the seventh resistor R4 is connected in parallel with the first inductor L9, which can increase the bandwidth of the matching circuit and better prevent power ripple.

[0122] The first end of the second inductor L8 is connected to the second end of the first inductor L9. The second end of the second inductor L8 is connected to the first end of the third inductor L7. The second end of the third inductor L7 is connected to the first end of the electro-absorption modulation region. The second inductor L8 and the third inductor L7 are high-impedance inductors, which can be selected based on the actual data transmission rate of the optical module. The second inductor L8 and the third inductor L7 are connected in series to form a two-stage inductor network. Their main function is to prevent the high-speed data signal loaded on the electro-absorption modulation region from flowing toward the power supply circuit 304 through the high bandwidth and high impedance of the inductors, thereby reducing the impact of the high-speed signal bandwidth on the optical eye diagram.

[0123] In the above embodiment, the voltage Ui at the second end of the first resistor R6 is detected by the voltage detection circuit 305, and the voltage detection circuit 305 converts the negative voltage Ui into the current I2 to facilitate data acquisition by the MCU 302. Since the voltage at the second end of the first resistor R6 is a negative voltage, the MCU 302 cannot accept negative voltage input. Alternatively, an integrated operational amplifier method can be used to convert the negative voltage into a positive voltage, so that the MCU 302 can monitor the voltage change at the second end of the first resistor R6.

[0124] Figure 12 is a second circuit block diagram of an APC closed-loop control circuit for an EML laser in an optical module according to some embodiments of the present disclosure. As shown in Figures 6 and 12 , to enable MCU 302 to collect the voltage at the second end of first resistor R6, voltage detection circuit 305 is configured to detect the voltage in the electro-absorption modulation region. MCU 302 collects the voltage output by the voltage detection circuit and adjusts the voltage output by power supply circuit 304 based on the voltage change to maintain the optical power of the EML laser.

[0125] In some examples, the voltage detection circuit 305 may include an operational amplifier, which converts the negative voltage input to the voltage detection circuit 305 into a positive voltage according to the inverting action of the operational amplifier. A preset voltage may be stored in the MCU 302. When the voltage output by the voltage detection circuit 305 is greater than the preset voltage, it indicates that an aging problem has occurred in the electro-absorption modulation area, resulting in the output optical power of the electro-absorption modulation area being less than the output optical power of the light-emitting area (preset optical power). At this time, the MCU 302 controls the reduction of the voltage output by the power supply circuit 304 to reduce the voltage applied to the electro-absorption modulation area, thereby reducing the absorption of the electro-absorption modulation area, thereby making the output optical power of the electro-absorption modulation area close to the output optical power of the light-emitting area, so as to maintain the stability of the output optical power of the EML laser.

[0126] In the optical module provided by the present disclosure, the voltage of the first end of the electro-absorption modulation zone is collected through a voltage detection circuit, and the reduction in output optical power caused by aging of the electro-absorption modulation zone is fed back according to the change in the voltage of the first end of the electro-absorption modulation zone. The output voltage of the power supply circuit is adjusted to compensate for the loss in output optical power caused by aging of the electro-absorption modulation zone, thereby maintaining the output optical power of the EML laser.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Circuit boards; A laser, electrically connected to the circuit board, the laser comprising a light emitting region and an electro-absorption modulation region, the laser being configured to emit an optical signal; A bias circuit is mounted on the circuit board, the bias circuit is connected to the light-emitting area, and the bias circuit is configured to provide a bias current to the light-emitting area so that the light-emitting area emits light; A power supply circuit is installed on the circuit board, the power supply circuit is connected to the electro-absorption modulation area, and the power supply circuit is configured to supply power to the electro-absorption modulation area; A voltage detection circuit is mounted on the circuit board, the voltage detection circuit is connected to the electro-absorption modulation area, and the voltage detection circuit is configured to detect the voltage of the electro-absorption modulation area and convert the voltage into a current; An MCU is installed on the circuit board, a first end of the MCU is connected to a first end of the power supply circuit, a second end of the MCU is connected to the voltage detection circuit, and the MCU is configured to collect the current output by the voltage detection circuit and adjust the voltage output by the power supply circuit according to the current to reduce the voltage of the electro-absorption modulation area.

2. The optical module according to claim 1, further comprising: A first resistor is mounted on the circuit board, wherein the first end of the first resistor is connected to the power supply circuit, the second end of the first resistor is connected to the first end of the electro-absorption modulation area, the first end of the voltage detection circuit is connected to the second end of the first resistor, and the first resistor is configured for voltage division.

3. The optical module according to claim 2, wherein: The voltage detection circuit comprises: a second resistor, a first end of which is connected to the second end of the first resistor; a third resistor, a first end of which is connected to the second end of the second resistor; A fourth resistor, a second end of which is connected to a negative power supply; a fifth resistor, a first end of which is connected to the first end of the fourth resistor, and a second end of which is connected to the second end of the third resistor; a sixth resistor, a first end of which is connected to the second end of the third resistor, and a second end of which is connected to the second end of the MCU; An operational amplifier, wherein the inverting input terminal is connected to the second end of the second resistor, the positive input terminal of the operational amplifier is connected to the first end of the fourth resistor, and the output terminal of the operational amplifier is connected to the second end of the third resistor.

4. The optical module according to claim 3, wherein: A ratio of the third resistor to the second resistor is equal to a ratio of the fifth resistor to the fourth resistor.

5. The optical module according to claim 2, further comprising a matching circuit, wherein the matching circuit is configured to filter; wherein The matching circuit comprises: a seventh resistor, a first end of which is connected to the second end of the first resistor; a first inductor, a first end of which is connected to the second end of the first resistor, and a second end of the first inductor is connected to the second end of the seventh resistor; a second inductor, a first end of which is connected to the second end of the first inductor; A third inductor has a first end connected to the second end of the second inductor, and a second end of the third inductor is connected to the first end of the electric absorption modulation region.

6. The optical module according to claim 1, wherein: The MCU is also configured to: When the current output by the voltage detection circuit is greater than a preset current, the output optical power of the laser is less than a preset optical power, and the MCU controls the reduction of the voltage output by the power supply circuit to reduce the modulation voltage provided to the electro-absorption modulation area.

7. The optical module according to claim 1, wherein: The third end of the MCU is connected to the bias circuit. The MCU is further configured to collect the modulation current provided by the power supply circuit to the electric absorption modulation area, and determine whether the modulation current meets the preset modulation current according to the preset relationship between the modulation current and the output optical power of the laser. When the modulation current does not meet the preset modulation current, control and adjust the bias current output by the bias circuit to adjust the output optical power of the laser.

8. The optical module according to claim 7, wherein: The MCU is further configured to, when the collected modulation current is greater than the preset modulation current, control the increase of the bias current output by the bias circuit to increase the output optical power of the laser; When the collected modulation current is less than the preset modulation current, the bias current output by the bias circuit is controlled to be reduced so as to reduce the output optical power of the laser.

9. An optical module, comprising: Circuit boards; A laser, electrically connected to the circuit board, the laser comprising a light emitting region and an electro-absorption modulation region, the laser being configured to emit an optical signal; A bias circuit is mounted on the circuit board, the bias circuit is connected to the light-emitting area, and the bias circuit is configured to provide a bias current to the light-emitting area so that the light-emitting area emits light; A power supply circuit is installed on the circuit board, the power supply circuit is connected to the electro-absorption modulation area, and the power supply circuit is configured to supply power to the electro-absorption modulation area; a voltage detection circuit, mounted on the circuit board, the voltage detection circuit being connected to the electro-absorption modulation area, and the voltage detection circuit being configured to detect a voltage of the electro-absorption modulation area; An MCU is mounted on the circuit board, wherein a first end of the MCU is connected to a first end of the power supply circuit, and a second end of the MCU is connected to the voltage detection circuit. The MCU is configured to collect a voltage output by the voltage detection circuit, and adjust a voltage output by the power supply circuit according to the voltage to reduce a voltage in the electro-absorption modulation zone.

10. The optical module according to claim 9, wherein: The MCU is also configured to: When the voltage output by the voltage detection circuit is greater than a preset voltage, the output optical power of the laser is less than the preset optical power, and the MCU controls to reduce the voltage output by the power supply circuit to reduce the modulation voltage provided to the electro-absorption modulation area.

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