Edge deletion optical path device and edge deletion optical path system

Abstract

An edge deletion optical path device (100) and an edge deletion optical path system. The edge deletion optical path device (100) comprises: a laser emitting mechanism (10) used for emitting first laser and second laser; and a beam combining mechanism (20), the first laser and the second laser emitted by the laser emitting mechanism (10) being both capable of being emitted toward the beam combining mechanism (20), and the beam combining mechanism (20) being used for transmitting one of the first laser and the second laser and for reflecting the other one of the first laser and the second laser, such that the first laser and the second laser are emitted in parallel; wherein the first laser is used for marking division lines (2001) on a thin film layer of a product (2000) so as to divide the thin film layer of the product (2000) into deletion areas (2003) and a remaining area (2002), and the second laser is used for deleting the deletion areas (2003). When the first laser and the second laser are combined and emitted toward the thin film layer, marking lines of the second laser can partially overlap the division lines (2001) when the second laser deletes the deletion areas (2003), so as to ensure that the thin film layer in the deletion areas (2003) is fully deleted, ensuring an edge deletion effect.

Description

Edge cleaning optical path device and edge cleaning optical path system Technical Field

[0001] The present application relates to the technical field of solar cell manufacturing equipment, and in particular to an edge-clearing optical path device and an edge-clearing optical path system. Background Art

[0002] Before packaging, some products undergo edge cleaning along the substrate to remove the edges of the thin film layer attached to the substrate and ensure packaging reliability. For example, during the solar cell manufacturing process, edge cleaning is performed along the edges of the glass substrate to remove the edges of the thin film layer to prevent leakage and thus ensure the reliability of the solar cell after packaging.

[0003] When cleaning the edges of products, high-power lasers are often used. Due to the large thermal impact of high-power lasers, burrs appear on the edges of the thin film layer after cleaning, which in turn affects the packaging reliability of the product.

[0004] Summary of the Invention

[0005] Based on this, it is necessary to provide an edge cleaning optical path device and an edge cleaning optical path system that can avoid the occurrence of burrs on the edge of the thin film layer after edge cleaning of the product, which affects the packaging reliability.

[0006] An edge-clearing optical path device, comprising:

[0007] A laser emitting mechanism, configured to emit a first laser and a second laser;

[0008] a beam combining mechanism, wherein both the first laser and the second laser emitted by the laser emitting mechanism can be emitted toward the beam combining mechanism; the beam combining mechanism is configured to transmit one of the first laser and the second laser and to reflect the other of the first laser and the second laser so that the first laser and the second laser are emitted in parallel;

[0009] The first laser is used to draw an isolation line on the thin film layer of the product to divide the thin film layer of the product into a clearing area and a retaining area, and the second laser is used to clear the clearing area.

[0010] In one embodiment, the beam combining mechanism includes a beam combining body, a first coating and a second coating, wherein the first coating and the second coating are both provided on the beam combining body, the first coating is used to transmit one of the first laser and the second laser, and the second coating is used to reflect the other of the first laser and the second laser.

[0011] In one embodiment, the cross-section of the beam combining body is triangular, the first coating is provided on one side of the beam combining body, and the second coating is provided on the other side of the beam combining body.

[0012] In one embodiment, the cross-section of the beam combining body is an isosceles right triangle, the first coating is provided on a right-angled side of the beam combining body, and the second coating is provided on a hypotenuse of the beam combining body.

[0013] In one embodiment, the edge cleaning optical path device further includes a first galvanometer, which is arranged on the optical path of the first laser toward the beam combining mechanism, and the first galvanometer is used to enable the first laser to draw the isolation line on the thin film layer along a first preset trajectory.

[0014] In one embodiment, the edge cleaning optical path device further includes a second galvanometer, which is arranged on the optical path of the second laser toward the beam combining mechanism, and the second galvanometer is used to enable the second laser to clear the thin film layer in the cleaning area along a second preset trajectory.

[0015] In one embodiment, the laser emitting mechanism includes a first laser and a second laser, wherein the first laser is used to emit the first laser, and the second laser is used to emit the second laser.

[0016] In one embodiment, the laser emitting mechanism includes a laser, and the laser is a dual-channel laser, one channel of the laser is used to emit the first laser, and the other channel is used to emit the second laser.

[0017] In one embodiment, the edge cleaning optical path device further includes a first reflector group, the first reflector group includes at least one first reflector, and the first reflector group is arranged on the optical path of the first laser to the beam combining mechanism to reflect the first laser to the beam combining mechanism.

[0018] In one embodiment, the first reflector group includes two first reflectors.

[0019] In one embodiment, the edge cleaning optical path device further includes a second reflector group, the second reflector group includes at least one second reflector, and the second reflector group is arranged on the optical path of the second laser toward the beam combining mechanism to reflect the second laser to the beam combining mechanism.

[0020] In one embodiment, the second reflector group includes two second reflectors.

[0021] In one embodiment, the first laser is green light, and the second laser is red light.

[0022] In one embodiment, the power of the first laser is less than the power of the second laser.

[0023] In one embodiment, the power of the first laser is 10W-40W, and the power of the second laser is 100W-500W.

[0024] In one embodiment, the spot sizes of the first laser and the second laser are different.

[0025] A light path system for clearing edges includes at least one light path device for clearing edges as described above.

[0026] In one embodiment, the edge cleaning optical path system includes two edge cleaning optical path devices. The edge cleaning optical path system has a central axis, and the two edge cleaning optical path devices are symmetrically arranged on both sides of the central axis.

[0027] In the aforementioned edge cleaning optical path device and system, the first laser can divide the product's thin film layer into a removal area and a retention area, and the second laser can clear the removal area. Compared to the prior art method of directly cleaning the thin film layer using the same laser, the first laser has a smaller thermal impact on the retention area, and the second laser also has a smaller thermal impact on the retention area when clearing the removal area. Therefore, it can prevent the occurrence of burrs on the edge of the thin film layer after edge cleaning, ensuring the reliability of solar cell packaging. At the same time, after the first and second lasers are combined by a beam combining mechanism, the first and second lasers are emitted in parallel. In this way, the first and second laser beams can be controlled to be combined (parallel and partially overlapping) and directed at the thin film layer, clearing the removal area while marking an isolation line, thereby improving edge cleaning efficiency. Furthermore, when the first and second laser beams are combined and directed at the thin film layer, the marking line of the second laser when clearing the removal area can partially overlap with the isolation line, ensuring that the thin film layer in the removal area is completely removed and the edge cleaning effect is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG1 is a plan view of an edge cleaning optical path device provided in one embodiment of the present application;

[0029] FIG2 is an exploded view of the edge cleaning optical path device shown in FIG1 ;

[0030] FIG3 is a plan view of the product ( FIG3 illustrates the isolation line, retention area and clearance area);

[0031] FIG4 is a light path diagram of an edge cleaning light path system provided in an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 1000, edge-clearing optical path system; 100, edge-clearing optical path device; 10, laser emitting mechanism; 11, first laser; 12, second laser; 20, beam combining mechanism; 30, first galvanometer; 40, second galvanometer; 50, second reflector group; 51, second reflector; 2000, product; 2001, isolation line; 2002, retention area; 2003, clearing area. DETAILED DESCRIPTION

[0034] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0037] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0038] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0040] Referring to Figures 1 and 2, one embodiment of the present application provides an edge cleaning optical path device 100 for cleaning the edge portion of a thin film layer attached to a substrate of a product 2000. Specifically, the edge cleaning optical path device 100 is used to clean the edges of solar cells, thereby cleaning the edge portion of a thin film layer on a glass substrate of the solar cell to prevent leakage and thereby ensure the reliability of the solar cell packaging. It is contemplated that in other embodiments, there is no limitation on the type of product 2000 that the edge cleaning optical path device 100 is used to clean.

[0041] The edge cleaning optical path device 100 includes a laser emitting mechanism 10 and a beam combining mechanism 20. The laser emitting mechanism 10 is used to emit a first laser and a second laser, and both the first laser and the second laser emitted by the laser emitting mechanism 10 can be directed toward the beam combining mechanism 20. The beam combining mechanism 20 is used to transmit one of the first laser and the second laser and to reflect the other, so that the first laser and the second laser are emitted in parallel. Referring to FIG. 3 , the first laser is used to draw an isolation line 2001 on the thin film layer of the product 2000, thereby dividing the thin film layer of the product 2000 into a removal area 2003 and a retention area 2002. The second laser is used to clear the removal area 2003.

[0042] It should be noted that the aforementioned clearing area 2003 and retaining area 2002 are two areas formed by the first laser marking isolation line 2001 on the thin film layer. Retaining area 2002 is the area of ​​the thin film layer that needs to be retained, while clearing area 2003 is the area of ​​the thin film layer that needs to be removed. Typically, the power of the first laser is lower than the power of the second laser. When the lower-power first laser is used to mark isolation line 2001, the first laser does not need to operate over a large area for a long time, and thus does not significantly heat retaining area 2002. When the second laser is used to clear clearing area 2003, clearing area 2003 and retaining area 2002 are already separated by the first laser's marking, and the second laser does not significantly heat retaining area 2002.

[0043] In the edge cleaning optical path device 100 provided in the embodiment of the present application, the first laser can divide the thin film layer of the product 2000 into a cleaning area 2003 and a retention area 2002, and the second laser can clear the cleaning area 2003. Compared with the prior art method of directly cleaning the thin film layer by using the same laser, the first laser has a small thermal impact on the retention area 2002, and the second laser also has a small thermal impact on the retention area 2002 when clearing the cleaning area 2003. Therefore, it is possible to avoid the generation of edge burrs after the thin film layer is cleaned, thereby ensuring the reliability of the solar cell packaging. At the same time, after the first laser and the second laser are combined by the beam combining mechanism 20, the first laser and the second laser are emitted in parallel. In this way, the first laser and the second laser can be controlled to be combined (parallel and partially overlapping) and emitted toward the thin film layer, and the cleaning area 2003 can be cleared while the isolation line 2001 is drawn, thereby improving the edge cleaning efficiency. Furthermore, when the first laser beam and the second laser beam are combined and directed toward the thin film layer, the scribing line of the second laser beam can partially overlap with the isolation line 2001 to ensure that the clearing area 2003 is completely cleared, thereby ensuring the edge cleaning effect.

[0044] It should be noted here that after the first laser draws the isolation line 2001 or a part of the isolation line 2001 on the product 2000, the second laser controls the laser emitting mechanism 10 not to emit the first laser during the edge cleaning process. At this time, the first laser will not affect the edge cleaning of the second laser.

[0045] In some embodiments, the first laser is green and the second laser is red, with the wavelength of green light being shorter than that of red light. This allows the thermal effect of the first laser on the thin film layer to be smaller than that of the second laser. In other embodiments, the wavelengths of the first and second lasers are not limited, and the powers of the first and second lasers are set to be different so that the thermal effect of the first laser on the thin film layer is smaller than that of the second laser. For example, the power of the first laser is set to 10W-40W, while the power of the second laser is set to 100W-500W. In other embodiments, the thermal effect of the first laser on the thin film layer can be smaller than that of the second laser by setting the spot sizes of the first and second lasers to be different, which is not limited here.

[0046] In some embodiments, referring to FIG4 , a laser emitting mechanism 10 includes a first laser 11 and a second laser 12 . The first laser 11 is configured to emit a first laser beam, and the second laser 12 is configured to emit a second laser beam. Since the first laser beam and the second laser beam are emitted by two different lasers, the emission of the first laser beam and the second laser beam can be easily controlled.

[0047] In some other embodiments, the laser emitting mechanism 10 includes a laser, which is a dual-channel laser, one channel of the laser is used to emit a first laser, and the other channel is used to emit a second laser.

[0048] The beam combining mechanism 20 includes a beam combining body, a first coating, and a second coating. Both the first coating and the second coating are provided on the beam combining body. The first coating is used to transmit one of the first laser beam and the second laser beam, and the second coating is used to reflect the other of the first laser beam and the second laser beam. In some embodiments, the beam combining mechanism 20 is used to transmit the first laser beam and reflect the first laser beam. In this case, the first coating is used to transmit the first laser beam, and the second coating is used to reflect the second laser beam. In other embodiments, the beam combining mechanism 20 is used to reflect the first laser beam and transmit the second laser beam. In this case, the first coating is used to transmit the second laser beam, and the second coating is used to reflect the first laser beam.

[0049] Furthermore, the cross-sectional shape of the beam combining body is a triangle, the first coating is provided on one side of the beam combining body, and the second coating is provided on the other side of the beam combining body. This arrangement enables one of the first laser and the second laser to pass through the first coating and be emitted through the second coating. Since the other of the first laser and the second laser is reflected by the second coating, at this time, both the first laser and the second laser are emitted from the second coating, thereby ensuring that the first laser and the second laser are ultimately emitted in parallel. In some specific embodiments, the cross-sectional shape of the beam combining body is an isosceles right triangle, the first coating is provided on a right-angled side of the beam combining body, and the second coating is provided on the hypotenuse of the beam combining body. In other embodiments, the cross-sectional shape of the beam combining body may also be an ordinary triangle, which is not limited here.

[0050] It should be noted that when the beam combining mechanism 20 is configured to transmit the first laser beam and reflect the second laser beam, the second coating layer does not block the first laser beam after the first laser beam passes through the first coating layer. In other words, the second coating layer only reflects the second laser beam and does not interfere with the transmission of the first laser beam. This also applies when the beam combining mechanism 20 is configured to transmit the second laser beam and reflect the first laser beam, and further explanation is omitted here.

[0051] It should be understood that in other embodiments, the shape of the beam combining mechanism 20 is not limited.

[0052] In some embodiments, with continued reference to Figures 1, 2, and 4, the edge cleaning optical path device 100 further includes a first galvanometer 30, disposed on the optical path of the first laser beam directed toward the beam combining mechanism 20. The first galvanometer 30 is configured to cause the first laser beam to scribe an isolation line 2001 on the thin film layer along a first predetermined trajectory. The edge cleaning optical path device 100 further includes a second galvanometer 40, disposed on the optical path of the second laser beam directed toward the beam combining mechanism 20. The second galvanometer 40 is configured to cause the second laser beam to clear the thin film layer in a clearing area 2003 along a second predetermined trajectory. When scribing the isolation line 2001 on the thin film layer, no external drive mechanism is required to drive the edge cleaning optical path device 100. By controlling the first galvanometer 30, the first laser beam can be directed along the first predetermined trajectory to scribing the isolation line 2001 on the thin film layer, thereby improving scribing efficiency. Similarly, when the cleaning area 2003 needs to be cleared, no external driving mechanism is required to drive the edge cleaning optical path device 100 to move. By controlling the second galvanometer 40, the second laser can move along the second preset trajectory to clear the cleaning area 2003, thereby improving the cleaning efficiency.

[0053] In some embodiments, the edge cleaning optical path device 100 further includes a first reflector group, which includes at least one first reflector. The first reflector group is disposed on the optical path of the first laser beam toward the beam combining mechanism 20, and is used to reflect the first laser beam toward the beam combining mechanism 20. Specifically, the first reflector group is disposed between the first laser 11 and the first galvanometer mirror 30. The first laser 11 emits a first laser beam, which is directed toward the first reflector group. The first reflector group reflects the first laser beam, causing it to change its path and then be directed toward the first galvanometer mirror 30. Finally, the first laser beam is directed toward the beam combining mechanism 20 through the first galvanometer mirror 30. Because the first reflector group can change the path of the first laser beam, when the first laser beam emitted by the first laser 11 cannot be directed directly toward the first galvanometer mirror 30, the reflection of the first reflector group can ensure that the first laser beam is directed toward the first galvanometer mirror 30.

[0054] In one specific embodiment, the first reflector group includes two first reflectors, which work together to ensure that the first laser light emitted by the first laser 11 is directed toward the first galvanometer 30. It is understood that in other embodiments, the number of first reflectors included in the first reflector group is not limited, and the first reflector group may include one first reflector or more than two first reflectors.

[0055] The edge cleaning optical path device 100 also includes a second reflector group 50, which includes at least one second reflector 51. The second reflector 51 is disposed on the optical path of the second laser beam toward the beam combining mechanism 20, and is used to reflect the second laser beam toward the beam combining mechanism 20. Specifically, the second reflector 51 of the second reflector group 50 is disposed between the second laser 12 and the second galvanometer mirror 40. The second laser 12 emits a second laser beam, which is directed toward the second reflector group 50. The second reflector group 50 reflects the second laser beam, causing it to change its path and then be directed toward the second galvanometer mirror 40. Finally, the second laser beam is directed toward the beam combining mechanism 20 through the second galvanometer mirror 40. Because the second reflector group 50 can change the path of the second laser beam, when the second laser beam emitted by the second laser 12 cannot be directed directly toward the second galvanometer mirror 40, the reflection effect of the second reflector group 50 can ensure that the second laser beam is directed toward the second galvanometer mirror 40.

[0056] In one specific embodiment, the second reflector group 50 includes two second reflectors 51. Under the combined action of the two second reflectors 51, the second laser light emitted by the second laser 12 is ensured to be directed toward the second galvanometer 40. It is understood that in other embodiments, the number of second reflectors 51 included in the second reflector group 50 is not limited. For example, the second reflector group 50 may include one second reflector 51 or more than two second reflectors 51.

[0057] Continuing with FIG3 , another embodiment of the present application further provides an edge cleaning optical path system 1000, comprising at least one edge cleaning optical path device 100 as described above. Specifically, the edge cleaning optical path system 100 comprises at least two edge cleaning optical path devices 100, which work in conjunction with each other to improve edge cleaning efficiency.

[0058] Specifically, the edge cleaning optical path system 1000 includes two edge cleaning optical path devices 100. The edge cleaning optical path system 1000 has a central axis, and the two edge cleaning optical path devices 100 are symmetrically arranged on either side of the central axis. The two symmetrical edge cleaning optical path devices 100 can work together to simultaneously remove the edges of the film layer at both ends of the product 2000, thereby improving edge cleaning efficiency.

[0059] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A light path device for edge cleaning, characterized in that: include: A laser emitting mechanism (10), used for emitting a first laser and a second laser; a beam combining mechanism (20), wherein the first laser and the second laser emitted by the laser emitting mechanism (10) can both be emitted toward the beam combining mechanism (20); the beam combining mechanism (20) is used to transmit one of the first laser and the second laser, and to reflect the other of the first laser and the second laser, so that the first laser and the second laser are emitted in parallel; The first laser is used to draw an isolation line (2001) on the thin film layer of the product (2000) to divide the thin film layer of the product (2000) into a clearing area (2003) and a retaining area (2002), and the second laser is used to clear the clearing area (2003).

2. The edge cleaning optical path device according to claim 1, characterized in that: The beam combining mechanism (20) comprises a beam combining body, a first coating and a second coating, wherein the first coating and the second coating are both arranged on the beam combining body, the first coating is used to transmit one of the first laser and the second laser, and the second coating is used to reflect the other of the first laser and the second laser.

3. The edge cleaning optical path device according to claim 2, characterized in that: The cross-section of the beam combining body is in a triangular shape. The first coating layer is disposed on one side of the beam combining body, and the second coating layer is disposed on the other side of the beam combining body.

4. The edge cleaning optical path device according to claim 3, characterized in that: The cross-section of the beam combining body is an isosceles right triangle. The first coating layer is disposed on a right-angled side of the beam combining body, and the second coating layer is disposed on a hypotenuse of the beam combining body.

5. The edge cleaning optical path device according to claim 1, characterized in that: The edge cleaning optical path device also includes a first galvanometer (30), which is arranged on the optical path of the first laser toward the beam combining mechanism (20), and the first galvanometer (30) is used to allow the first laser to draw the isolation line (2001) on the film layer along a first preset trajectory.

6. The edge cleaning optical path device according to any one of claims 1 to 5, characterized in that: The edge clearing optical path device also includes a second galvanometer (40), which is arranged on the optical path of the second laser toward the beam combining mechanism (20), and the second galvanometer (40) is used to enable the second laser to clear the clearing area (2003) along a second preset trajectory.

7. The edge cleaning optical path device according to claim 1, characterized in that: The laser emitting mechanism (10) comprises a first laser (11) and a second laser (12); the first laser (11) is used for emitting the first laser, and the second laser (12) is used for emitting the second laser.

8. The edge cleaning optical path device according to claim 1, characterized in that: The laser emitting mechanism (10) comprises a laser, which is a dual-channel laser. One channel of the laser is used to emit the first laser, and the other channel is used to emit the second laser.

9. The edge cleaning optical path device according to claim 1, characterized in that: The edge cleaning optical path device also includes a first reflector group, which includes at least one first reflector. The first reflector group is arranged on the optical path of the first laser toward the beam combining mechanism (20) to reflect the first laser to the beam combining mechanism (20).

10. The edge cleaning optical path device according to claim 9, characterized in that: The first reflector group includes two first reflectors.

11. The edge cleaning optical path device according to claim 1, characterized in that: The edge clearing optical path device also includes a second reflector group (50), the second reflector group (50) includes at least one second reflector (51), and the second reflector group (50) is arranged on the optical path of the second laser toward the beam combining mechanism (20) to reflect the second laser to the beam combining mechanism (20).

12. The edge cleaning optical path device according to claim 11, characterized in that: The second reflector group (50) comprises two second reflectors (51).

13. The edge cleaning optical path device according to any one of claims 1 to 12, characterized in that: The first laser is green light, and the second laser is red light.

14. The edge cleaning optical path device according to claim 1, characterized in that: The power of the first laser is smaller than the power of the second laser.

15. The edge cleaning optical path device according to claim 14, characterized in that: The power of the first laser is 10W-40W, and the power of the second laser is 100W-500W.

16. The edge cleaning optical path device according to claim 1, characterized in that: The first laser and the second laser have different spot sizes.

17. A clear edge optical path system, characterized in that: It comprises at least one edge clearing optical path device as described in any one of claims 1-16.

18. The edge cleaning optical path system according to claim 17, characterized in that: The edge cleaning optical path system comprises two edge cleaning optical path devices. The edge cleaning optical path system has a central axis. The two edge cleaning optical path devices are symmetrically arranged on both sides of the central axis.

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