Coating and preparation method therefor

Abstract

Specific embodiments of the present invention provide a coating and a preparation method therefor. The coating comprises a coating I, wherein the coating I is a polymerized coating obtained by depositing, on the surface of a base material, by means of a chemical reaction, an organic monomer simultaneously having a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit or an epoxy structural unit, and an epoxy structural unit or an aromatic ring structural unit, and / or an organic monomer having at least two carbon-carbon unsaturated bonds and a parylene active monomer that has been subjected to high-temperature pyrolysis. The coating overcomes the problems of the relatively single range of surface energy and greatly limited application scenarios of existing parylene protective coatings.

Description

A coating and a preparation method thereof

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 15, 2023, with application number 202311528271.X and invention name “A coating and its preparation method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention belongs to the field of coating protection, and in particular relates to a protective coating formed by high-temperature decomposition of parylene and a preparation method thereof. Background Art

[0003] Parylene is a new conformal coating material developed and applied by UnionCarbide Co. in the United States in the mid-1960s. It is prepared using a vacuum vapor deposition process, where reactive small molecules form a conformal polymer film on the substrate surface. Parylene is a protective polymer material, known in Chinese as poly(p-xylene). Depending on its molecular structure, parylene can be classified into various types, including N, C, D, F, and HT. Parylene coatings are polymers of p-xylene. P-xylene is first heated to 680°C to form a reactive p-xylene dimer. After the temperature is lowered in the deposition chamber, this dimer is deposited on the substrate surface, forming a polymer film. Due to the highly symmetrical structure of p-xylene and its zero dipole moment, the presence of benzene rings gives the polymer molecules a large free volume. Furthermore, the relatively high molecular weight of the polymer results in a highly dense coating. These characteristics give parylene coatings low water and gas permeability, a high barrier effect, and resistance to moisture, water, rust, and acid and alkali corrosion. However, due to the characteristics of the molecular structure of parylene, the surface energy range of its coating is relatively single, and its application scenarios are greatly limited.

[0004] Summary of the Invention

[0005] In order to overcome the problem of the single surface energy range of existing parylene protective coatings, the specific embodiment of the present invention provides the following coating and preparation method thereof:

[0006] A coating, comprising coating I, wherein coating I is a polymeric coating deposited on a substrate surface by chemical reaction between a gaseous organic monomer and a parylene active monomer that has been decomposed at high temperature, wherein the organic monomer comprises monomer α and / or monomer β;

[0007] The monomer α includes a functional group A and a functional group B, wherein the functional group A is a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit or an epoxy structural unit, and the functional group B is an epoxy structural unit or an aromatic ring structural unit;

[0008] The monomer β has at least two carbon-carbon unsaturated bonds.

[0009] Optionally, the monomer α has a structure shown in the following formula (1):

[0010] In formula (1), M is a structural unit with an aromatic ring or a structural unit with an epoxy group, T1 is -OC(O)-, -C(O)-O- or a connecting bond, X1 is a connecting portion, Y1 is a connecting portion, R1, R2 and R3 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 The halogen atom replaces the alkyl group.

[0011] Optionally, M is phenyl, epoxycyclopentyl, epoxycyclohexyl or epoxy.

[0012] Optionally, the T1 is -OC(O)-, the Y1 is a connecting bond, the X1 is a connecting bond, C1-C 10 An alkylene group or a connecting group consisting of a C1-C4 alkylene group and an ether bond.

[0013] Optionally, R1, R2 and R3 are independently selected from hydrogen atom or methyl group.

[0014] Optionally, the monomer α is selected from at least one of 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate, glycidyl methacrylate, 1,2-epoxy-4-vinylcyclohexane, 2-phenoxyethyl methacrylate, 2-phenoxyethyl acrylate, phenyl acrylate, diallyl terephthalate or phenyl methacrylate.

[0015] Optionally, the monomer α has a structure shown in the following formula (2):

[0016] In formula (2), X2 is a connecting part.

[0017] Optionally, the monomer α has a structure shown in the following formula (3):

[0018] In formula (3), R4 and R6 are independently selected from the group consisting of a connecting bond, a C1-C 10 Alkylene or C1-C 10 The halogen atom is substituted with an alkylene group; R5 is C1-C 10 Alkylene or C1-C 10 The halogen atom replaces the alkylene group; X3 and Y3 are independently selected from a connecting bond, an oxygen atom, a carbonyl group or an ester group; A is a cyclohexyl group or a cyclopentyl group.

[0019] Optionally, the monomer α is selected from at least one of bis(2,3-epoxycyclopentyl) ether, vinylcyclohexene diepoxide, diisoprene diepoxide, bis((3,4-epoxycyclohexyl)methyl)adipate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate or dicyclopentadiene diepoxide.

[0020] Optionally, the monomer β has a structure shown in the following formula (4):

[0021] In formula (4), S is a connecting group, R7, R8, R9, R 10 、R 11 and R 12 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 The halogen atom replaces the alkyl group.

[0022] Optionally, the S contains more than one -OC(O)- or -C(O)-O-.

[0023] Optionally, the S has a structure shown in the following formula (5):

[0024] In formula (5), R 13 C2-C 10 Alkylene or C2-C 10 The alkylene group is substituted by a halogen atom, and y is an integer from 0 to 10.

[0025] Optionally, the R7, R8, R9, R 10 、R 11 and R 12 are independently selected from a hydrogen atom or a methyl group.

[0026] Optionally, the monomer β is selected from diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,4-butanediol diacrylate, divinyl adipate, neopentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, 1,6-hexanediol di(meth)acrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, polyethylene glycol di ... At least one of diol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol hexaacrylate, 1,5-pentanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, triallyl cyanurate, triallylamine, divinylbenzene, diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, pentaerythritol triallyl ether, 2,6-dimethyl-2,4,6-octatriene, 1,2,4-trivinylcyclohexane, and 1,4-cyclohexanedimethanol divinyl ether.

[0027] Optionally, the coating further includes a coating II, wherein the coating II is formed by chemical reaction between a gaseous hydrophobic organic monomer and a parylene active monomer that has been decomposed at high temperature and deposited on the surface of the coating I.

[0028] Optionally, the hydrophobic organic monomer includes a monomer having a structure shown in the following formula (6): Y4-R 14 -X4-R 15 -R 16 (6)

[0029] Wherein, Y4 is selected from the structure shown in the following formula (7) or (8),

[0030] R 14 is the connecting bond, C1-C 10 Alkylene or C1-C 10 The halogenated alkylene group, X4 is a connecting bond, -COO-, -OOC-, -O-, -NH-, -S- or -CO-, R 15 is the connecting bond, C1-C 10 Alkylene or C1-C 10 Substituted alkylene, R 16 C1-C 20 Alkyl or C1-C 20 The haloalkyl group,

[0031] R 17 、R 18 and R 19 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Hydrocarbon or C1-C 10 The halogenated hydrocarbon group, R 20 、R 21 and R 22 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Hydrocarbon, C1-C 10 Halogenated hydrocarbons, C1-C 10 Hydroxyl or C1-C 10 of a halogenated hydrocarbonoxy group.

[0032] Optionally, the R 16 C1-C 20 Perfluoroalkyl or C6-C 20 of alkyl.

[0033] Optionally, the R 16 It is a C3-C6 perfluoroalkyl group.

[0034] Optionally, the R 17 、R 18 and R 19 are independently selected from a hydrogen atom or a methyl group.

[0035] Optionally, the R 20 、R 21 and R 22 Each of the following groups is independently selected from a hydrogen atom, a C1-C4 alkyl group or a C1-C4 alkoxy group.

[0036] Optionally, the Y4 is selected from the structure shown in formula (7), R 14 is a connecting bond, and X4 is -COO-.

[0037] Optionally, the R 14 is the connection key, and X4 is the connection key.

[0038] Optionally, the R 15 is a connecting bond, methylene or ethylene.

[0039] Optionally, the monomer of the structure shown in formula (6) is selected from 3-(perfluoro-5-methylhexyl)-2-hydroxypropyl methacrylate, 2-(perfluorodecyl)ethyl methacrylate, 2-(perfluorodecyl)ethyl acrylate, 2-(perfluorohexyl)ethyl methacrylate, 2-(perfluorohexyl)ethyl acrylate, 2-(perfluorododecyl)ethyl methacrylate, 2-(perfluorododecyl)ethyl acrylate, 2-perfluorooctylethyl methacrylate, 2-perfluorooctylethyl acrylate, 2-(perfluorobutyl)ethyl methacrylate, 2-(perfluorobutyl)ethyl acrylate, (2H-perfluoropropyl)-2-acrylate, (perfluorocyclohexyl)methacrylate, tert-butyl acrylate, hexyl acrylate, cyclohexyl acrylate, ethylhexyl acrylate, At least one of octyl acrylate, decyl acrylate, isodecyl acrylate, dodecyl acrylate, tetradecyl acrylate, hexadecyl acrylate, octadecyl acrylate, isobornyl acrylate, tert-butyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, ethylhexyl methacrylate, octyl methacrylate, decyl methacrylate, isodecyl methacrylate, dodecyl methacrylate, tetradecyl methacrylate, hexadecyl methacrylate, octadecyl methacrylate, isobornyl methacrylate, perfluorodecyltrimethoxysilane, perfluorodecyltriethoxysilane, perfluorodecyltrichlorosilane, perfluorooctyltrimethoxysilane, perfluorooctyltriethoxysilane, perfluorooctyltrichlorosilane, perfluorohexyltrimethoxysilane, perfluorohexyltriethoxysilane or perfluorohexyltrichlorosilane.

[0040] Optionally, the hydrophobic organic monomer includes perfluoropolyether or a perfluoropolyether derivative.

[0041] Optionally, the mass ratio of the organic monomer to the parylene active monomer is 20:1 to 1:20.

[0042] Optionally, the mass ratio of the organic monomer to the parylene active monomer is 10:1 to 1:10.

[0043] Optionally, the parylene is at least one of parylene N powder, C powder, D powder, F powder or HT powder.

[0044] A method for preparing the above-mentioned coating, characterized in that it comprises:

[0045] providing a substrate, and placing the substrate in a vacuum deposition chamber;

[0046] Gaseous organic monomers and parylene active monomers after high-temperature cracking are introduced into the vacuum deposition chamber;

[0047] The organic monomer and the parylene active monomer react in a vacuum deposition chamber to form the coating I on the surface of the substrate.

[0048] Optionally, the preparation method further comprises: introducing a gaseous hydrophobic organic monomer and a parylene active monomer after high-temperature cracking into a vacuum deposition chamber, wherein the gaseous hydrophobic organic monomer and the parylene active monomer after high-temperature cracking are deposited on the surface of coating I through a chemical reaction to form coating II.

[0049] A device, at least part of the surface of which has the above-mentioned coating.

[0050] The coating of the specific embodiment of the present invention includes coating I, which is a polymer coating deposited on the surface of the substrate through a chemical reaction of an organic monomer having a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit or an epoxy structural unit and an epoxy structural unit or an aromatic ring structural unit, and / or an organic monomer having at least two carbon-carbon unsaturated bonds with a parylene active monomer after high-temperature cracking. The coating overcomes the problem that the surface energy range of existing parylene protective coatings is relatively single and the application scenarios are greatly limited. DETAILED DESCRIPTION

[0051] A specific embodiment of the present invention provides a coating, comprising coating I, wherein coating I is a polymeric coating deposited on a substrate surface by a chemical reaction between a gaseous organic monomer and a parylene active monomer that has been decomposed at high temperature, wherein the organic monomer comprises monomer α and / or monomer β;

[0052] The monomer α includes a functional group A and a functional group B, wherein the functional group A is a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit or an epoxy structural unit, and the functional group B is an epoxy structural unit or an aromatic ring structural unit;

[0053] The monomer β has at least two carbon-carbon unsaturated bonds.

[0054] Optionally, the monomer α has a structure shown in the following formula (1):

[0055] In formula (1), M is a structural unit with an aromatic ring or a structural unit with an epoxy group, T1 is -OC(O)-, -C(O)-O- or a connecting bond, X1 is a connecting portion, Y1 is a connecting portion, R1, R2 and R3 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 The halogen atom replaces the alkyl group.

[0056] The inventors of the present invention have discovered that the acid sweat resistance and wear resistance of the parylene coating can be improved by chemically reacting the parylene active monomers obtained after high-temperature pyrolysis with monomer α having an active functional group A of a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit, or an epoxy structural unit and a functional group B of an epoxy structural unit or an aromatic ring structural unit, and / or monomer β having at least two carbon-carbon unsaturated bonds and depositing them on the substrate surface.

[0057] In the coating of the specific embodiment of the present invention, in some specific embodiments, the aromatic ring is a benzene ring or a heteroaromatic ring with a substituent, and in other specific embodiments, the aromatic ring is a benzene ring or a heteroaromatic ring without a substituent.

[0058] In the coating of the specific embodiment of the present invention, in some specific embodiments, the epoxy structural unit is an epoxy group with an alicyclic ring, such as an epoxycyclohexyl group or an epoxycyclopentyl group, etc. In some specific embodiments, the alicyclic ring has no substituents, and in other specific embodiments, the alicyclic ring has one or more substituents, and the substituents can be, for example, alkyl substituents such as methyl, ethyl, propyl, and butyl.

[0059] In some embodiments of the coating of the present invention, the alkyl group includes a linear alkylene group, such as a methyl group, an ethyl group, a propyl group, or a butyl group, or a branched alkyl group, such as an isopropyl group or an isobutyl group.

[0060] In some embodiments of the coating of the present invention, the alkylene group includes a straight-chain alkylene group, such as methylene, ethylene, propylene or butylene, or a branched alkylene group, such as isopropylene or isobutylene.

[0061] In some embodiments of the coating of the present invention, the monomer α has a structure shown in the following formula (1):

[0062] In formula (1), M is a structural unit with an aromatic ring or a structural unit with an epoxy group, T1 is -OC(O)-, -C(O)-O- or a connecting bond, X1 is a connecting portion, Y1 is a connecting portion, R1, R2 and R3 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 In order to improve the acid sweat resistance and wear resistance of the parylene coating, in some embodiments, M is an epoxy structural unit. In some embodiments, the epoxy structural unit is an epoxy group with an alicyclic ring, such as epoxycyclohexyl or epoxycyclopentyl. In some embodiments, T1 is -OC(O)-, Y1 is a connecting bond, X1 is a connecting bond, C1-C10 In some embodiments, the T1 is a connecting bond, the Y1 is a connecting bond, the X1 is a connecting bond, the C1-C 10 The linking group consisting of a C1-C4 alkylene group and an ether bond means that the linking group consists of one or more C1-C4 alkylene groups and one or more ether bonds, such as -CH2OCH2-, -CH2 CH2OCH2 CH 22 OCH2 CH2-, etc. In some embodiments, R1, R2 and R3 are independently selected from hydrogen atom or methyl group.

[0063] In some embodiments of the coating of the specific embodiment of the present invention, the monomer α is selected from at least one of 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate, glycidyl methacrylate, 1,2-epoxy-4-vinylcyclohexane, 2-phenoxyethyl methacrylate, 2-phenoxyethyl acrylate, phenyl acrylate, diallyl terephthalate or phenyl methacrylate.

[0064] In some embodiments of the coating of the present invention, the monomer α has a structure shown in the following formula (2):

[0065] In formula (2), X2 is a connecting portion. That is, the monomer α includes at least two epoxy groups. In some embodiments, the epoxy structural unit is an epoxy group with an alicyclic ring, such as an epoxycyclohexyl group or an epoxycyclopentyl group. In some embodiments, the monomer α has a structure shown in the following formula (3):

[0066] In formula (3), R4 and R6 are independently selected from the group consisting of a connecting bond, a C1-C 10 Alkylene or C1-C 10 The halogen atom is substituted with an alkylene group; R5 is C1-C 10 Alkylene or C1-C 10 The halogen atom replaces the alkylene group; X3 and Y3 are independently selected from a connecting bond, an oxygen atom, a carbonyl group or an ester group; A is a cyclohexyl group or a cyclopentyl group.

[0067] In some embodiments of the coating of the specific embodiment of the present invention, the monomer α is selected from at least one of bis(2,3-epoxycyclopentyl) ether, vinylcyclohexene diepoxide, diisoprene diepoxide, bis((3,4-epoxycyclohexyl)methyl)adipate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate or dicyclopentadiene diepoxide.

[0068] In some embodiments of the coating of the present invention, the monomer β has a structure shown in the following formula (4):

[0069] In formula (4), S is a connecting group, R7, R8, R9, R 10 、R 11 and R 12 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 The halogen atom replaces the alkyl group.

[0070] In some specific embodiments of the coating of the present invention, the S contains two -OC(O)- or -C(O)-O-, that is, S contains two -OC(O)-, two -C(O)-O- or one -OC(O)- or -C(O)-O-.

[0071] In some embodiments of the coating of the present invention, S is a connecting bond, C1-C 10 Alkylene or C1-C 10 The substituent of the substituted alkylene group may be, for example, an olefin group, an ester group, an amine group, a hydroxyl group or a carboxyl group.

[0072] In some embodiments of the coating of the present invention, S has a structure shown in the following formula (5):

[0073] In formula (5), R 13 C2-C 10 Alkylene or C2-C 10 The halogen atom-substituted alkylene group is substituted with y, which is an integer from 0 to 10, specifically 0, 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10.

[0074] In some embodiments of the coating of the present invention, the R7, R8, R9, R 10 、R 11 and R 12 are independently selected from a hydrogen atom or a methyl group.

[0075] In some embodiments of the coating of the present invention, the monomer β is selected from diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,4-butanediol diacrylate, divinyl adipate, neopentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, 1,6-hexanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, At least one of diol diacrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol hexaacrylate, 1,5-pentanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, triallyl cyanurate, triallylamine, divinylbenzene, diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, pentaerythritol triallyl ether, 2,6-dimethyl-2,4,6-octatriene, 1,2,4-trivinylcyclohexane, and 1,4-cyclohexanedimethanol divinyl ether.

[0076] In the coating of the specific embodiment of the present invention, in some specific embodiments, the mass ratio of the organic monomer to the parylene active monomer is 20:1 to 1:20. In some specific embodiments, the mass ratio of the organic monomer to the parylene active monomer is 10:1 to 1:10. For example, it can be 10:1, 9:1, 8:1, 7:1, 6:1, 5:1, 4:1, 3:1, 2:1, 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1 or 10:1.

[0077] In the coating of the specific embodiment of the present invention, in some specific embodiments, the organic monomer is monomer α and monomer β. In some specific embodiments, the mass ratio of monomer α to monomer β is 10:1 to 1:10. In some specific embodiments, the mass ratio of monomer α to monomer β is 5:1 to 1:5, and specifically can be 5:1, 4:1, 3:1, 2:1, 1:1, 2:1, 3:1, 4:1, or 5:1. In some specific embodiments, the organic monomer is monomer α. In some specific embodiments, the organic monomer is monomer β. In other specific embodiments, the organic monomer includes other organic monomers other than monomer α and monomer β, without affecting the overall coating performance.

[0078] In some specific embodiments of the coating of the specific embodiment of the present invention, the coating further includes coating II, and coating II is deposited on the surface of coating I through a chemical reaction between a gaseous hydrophobic organic monomer and a parylene active monomer after high-temperature decomposition. By further forming coating II on the surface of coating I, the hydrophobic layer, acid sweat resistance or wear resistance of the coating can be further improved, thereby further improving the protective performance of the entire coating.

[0079] In some embodiments of the coating of the present invention, the hydrophobic organic monomer comprises a monomer having a structure shown in the following formula (6): Y4—R 14 -X4—R 15 -R 16 (6)

[0080] Wherein, Y4 is selected from the structure shown in the following formula (7) or (8),

[0081] R 14 is the connecting bond, C1-C 10 Alkylene or C1-C 10 The halogenated alkylene group, X4 is a connecting bond, -COO-, -OOC-, -O-, -NH-, -S- or -CO-, R 15 is the connecting bond, C1-C 10 Alkylene or C1-C 10 Substituted alkylene, R 16 C1-C 20 Alkyl or C1-C 20 The haloalkyl group,

[0082] R 17 、R 18 and R 19 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Hydrocarbon or C1-C 10 The halogenated hydrocarbon group, R 20 、R 21 and R 22 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Hydrocarbon, C1-C 10 Halogenated hydrocarbons, C1-C 10 Hydroxyl or C1-C 10 of a halogenated hydrocarbonoxy group.

[0083] In the coating of the specific embodiment of the present invention, CO and OC in the -COO-, -OOC- and -CO- are both carbonyl groups.

[0084] In the coating of the specific embodiment of the present invention, the hydrocarbon group can be a hydrocarbon group with a straight chain structure or a hydrocarbon group with a branched chain structure.

[0085] In the coating of the specific embodiment of the present invention, in some specific embodiments, the hydrocarbon group is an alkane group, and in some specific embodiments, the hydrocarbon group is an alkene group or an alkyne group.

[0086] The coating of the specific embodiment of the present invention is beneficial to improve the hydrophobicity of the parylene coating. In some specific embodiments, the R 16 C6-C 20 The long alkyl chain of the alkyl group is further C8-C 20 In some embodiments, the R 16 C1-C 20 Perfluoroalkyl, further C3-C 20 Perfluoroalkyl, considering the impact on the environment, in some embodiments, the R 16 It is a perfluoroalkyl group of C6 or less.

[0087] In some embodiments of the coating of the present invention, R 14 is a connecting bond. In some embodiments, R 14 is C1-C4 alkylene or C1-C4 halogenated alkylene. In some embodiments, R 14 It is methylene, ethylene, halogenated methylene or halogenated ethylene.

[0088] In some embodiments of the coating of the present invention, the R 15 is a connecting bond. In some embodiments, the R 15 C1-C 10 In some embodiments, R 15 is methylene or ethylene, in some embodiments, the R 15 C1-C 10 The substituent of the substituted alkylene group may be, for example, a halogen atom, a hydroxyl group, a carboxyl group, an ester group, an alkoxy group or a nitro group. In order to prevent the influence of the hydroxyl group, carboxyl group, ester group, alkoxy group or nitro group substituent on the hydrophobicity, in some specific embodiments, the number of the hydroxyl group, carboxyl group, ester group, alkoxy group or nitro group substituent is 2 or less, and further 1 or less.

[0089] In some embodiments of the coating of the present invention, Y4 is selected from the structure shown in formula (7), R 14 is a connecting bond, X4 is -COO-, in some embodiments, Y4 is selected from the structure shown in formula (8), R 14is a connecting bond, X4 is a connecting bond, in some embodiments, Y4 is selected from the structure shown in formula (7), R 14 is the connection key, and X4 is the connection key.

[0090] In some embodiments of the coating of the present invention, the R 17 、R 18 and R 19 are independently selected from a hydrogen atom or a methyl group.

[0091] In some embodiments of the coating of the present invention, the R 20 、R 21 and R 22 are independently selected from hydrogen, C1-C4 alkyl or C1-C4 alkoxy, wherein the alkoxy is specifically methoxy, ethoxy, propoxy or butoxy, and the alkyl is specifically methyl, ethyl, propyl or butyl. 20 、R 21 and R 22 Each is independently selected from methoxy or ethoxy.

[0092] In some embodiments of the coating of the present invention, the monomer of the structure represented by formula (6) is selected from 3-(perfluoro-5-methylhexyl)-2-hydroxypropyl methacrylate (CAS: 16083-81-1), 2-(perfluorodecyl)ethyl methacrylate (CAS: 2144-54-9), 2-(perfluorodecyl)ethyl acrylate (CAS: 17741-60-5), 2-(perfluorohexyl)ethyl methacrylate (CAS: 2144-53-8), 2-(perfluorohexyl)ethyl acrylate (CAS: 17527-29-6), 2-(perfluorododecyl)ethyl methacrylate (CAS: 6014-75-1), 2-(perfluorodec ...decyl)ethyl acrylate (CAS: 17527-29-6), 2-(perfluorododec 2-(Perfluorobutyl)ethyl methacrylate (CAS: 1799-84-4), 2-(Perfluorobutyl)ethyl acrylate (CAS: 52591-27-2), (2H-perfluoropropyl)-2-acrylate (CAS: 59158-81-5), (perfluorocyclohexyl) methacrylate (CAS: 40677-94-9), tert-butyl acrylate (CAS: 1663-39-4), hexyl acrylate (CAS: 2499-9 5-8), cyclohexyl acrylate (CAS: 3066-71-5), ethylhexyl acrylate (CAS: 103-11-7), octyl acrylate (CAS: 2499-59-4), decyl acrylate (CAS: 2156-96-9), isodecyl acrylate (CAS: 1330-61-6), dodecyl acrylate (CAS: 2156-97-0), tetradecyl acrylate (CAS: 21643-42-5), hexadecyl acrylate (CAS: 13402-02-3), octadecyl acrylate (CAS: 4813-57-4), isobornyl acrylate (CAS: 5888-33-5), tert-butyl methacrylate (CAS: 585- 07-9), hexyl methacrylate (CAS: 142-09-6), cyclohexyl methacrylate (CAS: 101-43-9), ethylhexyl methacrylate (CAS: 688-84-6), octyl methacrylate (CAS: 2157-01-9), decyl methacrylate (CAS: 3179-47-3), isodecyl methacrylate (CAS: 64283-60-9), dodecyl methacrylate (CAS: 142-90-5), tetradecyl methacrylate (CAS: 2549-53-3), hexadecyl methacrylate (CAS: 2495-27-4), octadecyl methacrylate (CAS: 32360-05-7),At least one of isobornyl methacrylate (CAS: 7534-94-3), perfluorodecyltrimethoxysilane (CAS: 83048-65-1), perfluorodecyltriethoxysilane (CAS: 101947-16-4), perfluorodecyltrichlorosilane (CAS: 78560-44-8), perfluorooctyltrimethoxysilane (CAS: 85857-16-5), perfluorooctyltriethoxysilane (CAS: 51851-37-7), perfluorooctyltrichlorosilane (CAS: 78560-45-9), perfluorohexyltrimethoxysilane (CAS: 85877-79-8), perfluorohexyltriethoxysilane (CAS: 102390-98-7) and perfluorohexyltrichlorosilane (CAS: 78560-47-1).

[0093] In some embodiments of the coating according to the present invention, the hydrophobic organic monomer comprises perfluoropolyether or a perfluoropolyether derivative.

[0094] In some embodiments of the coating of the present invention, the perfluoropolyether or perfluoropolyether derivative has a structure shown in the following formula (9):

[0095] In formula (9), R 23 It is a hydrogen atom, a halogen atom, a C1-C4 hydrocarbon group, a C1-C4 halogenated hydrocarbon group, a hydroxyl group, a carboxyl group, a silicon group represented by formula (8), or an acrylate group.

[0096] R 24 and R 25 are independently selected from at least one of a connecting bond, a C1-C4 alkylene group, a C1-C4 haloalkylene group, or a group of the following formula (10),

[0097] R 26 is a hydrogen atom, a halogen atom, a C1-C4 alkyl group, a C1-C4 haloalkyl group, a hydroxyl group, a carboxyl group or -COF, n is an integer from 1 to 10, m is an integer from 1 to 200, m C n F 2n The O groups are independent of each other. In formula (10), X is O, S or NH, k is an integer from 1 to 10, j is an integer from 1 to 20, and j C k F 2k The O groups are independent of each other.

[0098] In some embodiments of the coating of the present invention, in formula (9), R 23 is a fluorine atom, a C1-C4 perfluoroalkyl group, a hydroxyl group, a carboxyl group, a silicon group or an acrylate group.

[0099] In some embodiments of the coating of the present invention, the R 24 and R 25 Each of them is independently selected from a connecting bond, a C1-C2 alkylene group, i.e., a methylene group or an ethylene group, a C1-C2 perfluoroalkylene group or a group of formula (10).

[0100] In some embodiments of the coating of the present invention, the R 26 is a fluorine atom, -COF, a C1-C4 perfluoroalkyl group, a hydroxyl group or a carboxyl group.

[0101] In some specific embodiments of the parylene coating of the present invention, n is an integer of 1 to 3, and m is an integer of 5 to 50.

[0102] In the coating of the specific embodiment of the present invention, in formula (10), in some specific embodiments, k is an integer of 1 to 4, and j is an integer of 1 to 4. In some specific embodiments, k is an integer of 1 to 2, and j is an integer of 1 to 2.

[0103] In some embodiments of the coating of the present invention, the R 23 is a fluorine atom or a C1-C4 perfluoroalkyl group, R 24 and R 25 is a connecting bond or a C1-C2 perfluoroalkylene group, R 26 is a fluorine atom, -COF or a C1-C4 perfluoroalkyl group. For example, in some embodiments, the perfluoropolyether has the following structure: CF3CF2CF2O[CF(CF3)CF2O] x1 CF(CF3)COF, x1 is an integer greater than 1. In some embodiments, the perfluoropolyether has the following structure: CF3O(C3F6O) x2 (CF2O) x3 CF3, x2 and x3 are integers greater than 1. In some embodiments, the perfluoropolyether has the following structure: CF3O(C2F4O) x4 (CF2O) x5 CF3, x4 and x5 are integers greater than 1. In some embodiments, the perfluoropolyether has the following structure: C3F7O(CF2CF2CF2O) x6 C2F5,x6 is an integer greater than 1.

[0104] In some embodiments of the coating of the present invention, the R 23 and R 26 is hydroxyl group, R 24 and R 25are independently selected from at least one of a C1-C4 alkylene group and a group of formula (4). For example, in some embodiments, the perfluoropolyether derivative has the structural formula: HO-CH2CF2O(CF2O) y1 (CF2CF2O) y2 CF2CH2-OH, y1 and y2 are integers greater than 1. In some embodiments, the perfluoropolyether derivative has the structural formula: HO-(CH2CH2O) y3 CH2CF2O(CF2O) y4 (CF2CF2O) y5 CF2CH2(OCH2CH2) y3 -OH, y4 and y5 are integers greater than 1, and y3 is 1 or 2.

[0105] In some embodiments of the coating of the present invention, the R 23 is a carboxyl group or an acrylate group, R 24 is a connecting bond, or at least one of a C1-C4 alkylene group and a group of formula (4), R 25 is the connecting key, R 26 is a fluorine atom or a C1-C4 perfluoroalkyl group. Specifically, for example, in some embodiments, the perfluoropolyether derivative is perfluoropolyether methacrylate, perfluoropolyether acrylate or perfluoropolyether carboxylic acid.

[0106] In the coating of the specific embodiment of the present invention, in some specific embodiments, the perfluoropolyether derivative can also include perfluoropolyether methyl ester, perfluoropolyether dimethylamino propionamide, perfluoropolyether carbonyl n-butyl thioester, perfluoropolyether amide ethyl alcohol, perfluoropolyether isocyanate or perfluoropolyether amide acrylate, etc.

[0107] In some embodiments of the coating of the present invention, specific examples of perfluoropolyether or perfluoropolyether derivatives include and In some embodiments, the perfluoropolyether or perfluoropolyether derivative is selected from SOLVAY D7 0 0, or In some embodiments, the perfluoropolyether or perfluoropolyether derivative is selected from 3M's Novec fluorinated liquid.

[0108] In the coating of the specific embodiment of the present invention, in some specific embodiments, the mass ratio of the parylene active monomer to the hydrophobic organic monomer is 10:1 to 1:10. In some specific embodiments, the mass ratio of the parylene active monomer to the hydrophobic organic monomer is 5:1 to 1:5. Specifically, for example, it can be 5:1, 4:1, 3:1, 2:1, 1:1, 2:1, 3:1, 4:1 or 5:1.

[0109] In some embodiments of the coating according to the specific embodiment of the present invention, the parylene is at least one of parylene N powder, C powder, D powder, F powder or HT powder.

[0110] The coating of the specific embodiment of the present invention, in some specific embodiments, the thickness of the coating is 1 to 10,000 nm, in some specific embodiments, the thickness of the coating is 100 to 8,000 nm, in some specific embodiments, the thickness of the coating is 1,000 to 5,000 nm, and in some specific embodiments, the thickness of the coating is 2,000 to 4,000 nm.

[0111] In the coating of the specific embodiment of the present invention, in some specific embodiments, the substrate is a metal, specifically for example, iron, magnesium, aluminum, copper or their alloys. In other specific embodiments, the substrate is various plastics, fabrics, glass, ceramics, paper, electrical components or optical instruments. Specifically, the electrical component can be a printed circuit board (PCB), an electronic product or a semi-finished electronic assembly. When the substrate is an electronic product, examples include but are not limited to mobile phones, tablet computers, keyboards, e-readers, wearable devices, displays, etc. The substrate can also be any suitable electrical component of the electrical component, specifically, the electrical component can be a resistor, capacitor, transistor, diode, amplifier, relay, transformer, battery, fuse, integrated circuit, switch, LED, LED display, piezoelectric element, optoelectronic component or antenna or oscillator, etc.

[0112] In some embodiments of the coating of the present invention, the substrate is a substrate that has been surface treated, such as plasma surface treatment, thermal oxygen surface treatment, coating with other coatings, etc.

[0113] A specific embodiment of the present invention further provides a method for preparing the coating as described above, comprising:

[0114] providing a substrate, and placing the substrate in a vacuum deposition chamber;

[0115] Gaseous organic monomers and parylene active monomers after high-temperature cracking are introduced into the vacuum deposition chamber;

[0116] The organic monomer and the parylene active monomer react in a vacuum deposition chamber to form the coating I on the surface of the substrate.

[0117] In some specific embodiments of the method for preparing the coating according to a specific embodiment of the present invention, the preparation method further includes: introducing a gaseous hydrophobic organic monomer and a parylene active monomer after high-temperature cracking into a vacuum deposition chamber, and the gaseous hydrophobic organic monomer and the parylene active monomer after high-temperature cracking are deposited on the surface of coating I through a chemical reaction to form coating II.

[0118] The preparation method of the coating according to the specific embodiment of the present invention, the substrate, the organic monomer, the hydrophobic organic monomer, coating I, coating II and parylene are described above.

[0119] In the method for preparing the coating of a specific embodiment of the present invention, in some specific embodiments, the temperature in the vacuum deposition chamber is 20°C-80°C, for example, it can be 20°C, 30°C, 40°C, 50°C, 60°C, 70°C or 80°C, etc.

[0120] In the method for preparing the coating according to a specific embodiment of the present invention, in some specific embodiments, the pressure in the vacuum deposition chamber is 1-500 mTorr, and in some specific embodiments, the pressure in the vacuum deposition chamber is 5-100 mTorr.

[0121] In some specific embodiments of the method for preparing the coating according to a specific embodiment of the present invention, the organic monomer is vaporized and then enters the vacuum deposition chamber through an organic monomer inlet. The parylene active monomer is sublimated from parylene powder in a sublimation chamber and then enters a cracking chamber for cracking, and then enters the vacuum deposition chamber through a parylene active monomer inlet.

[0122] In the method for preparing the coating of a specific embodiment of the present invention, in some specific embodiments, the vaporization temperature of the organic monomer is 50°C-180°C, for example, it can be 50°C, 60°C, 70°C, 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C or 180°C, etc., and the vaporization occurs under vacuum conditions.

[0123] In the method for preparing the coating according to a specific embodiment of the present invention, in some specific embodiments, the sublimation temperature in the sublimation chamber is 80°C to 200°C, for example, it can be 80°C, 100°C, 120°C, 150°C, 180°C or 200°C, etc., and sublimation occurs under vacuum conditions.

[0124] In the method for preparing the coating according to a specific embodiment of the present invention, in some specific embodiments, the pyrolysis temperature in the pyrolysis chamber is 500-750°C, and the polymer can be, for example, 500°C, 600°C, 650°C, 700°C or 750°C, etc.

[0125] A specific embodiment of the present invention further provides a device, wherein at least a portion of the surface of the device has the above-mentioned coating. In some specific embodiments, the above-mentioned coating is deposited on a portion of the surface or the entire surface of the device.

[0126] The present invention is further described below with reference to specific examples.

[0127] Example

[0128] Test method description

[0129] Coating thickness test: The coating was applied to the silicon wafer and tested using the American Filmetrics F20-UV-film thickness gauge.

[0130] Water drop angle test: tested according to GB / T 30447-2013 standard.

[0131] 20.5V acid sweat immersion power-on duration test: 1. Supply 20.5V to the circuit board; 2. Soak the circuit board in acidic artificial sweat with a pH of 4.7±0.1; 3. Use a computer to detect the current; 4. Record the failure time (current > 0.6mA).

[0132] 20.5V acid sweat immersion power-on duration test (after friction): carried out on a wear resistance testing machine, the friction material is dust-free cloth, the load is 100g, the speed is 50r / min, and the 20.5V acid sweat immersion power-on duration test is carried out after 100 frictions.

[0133] Example 1

[0134] The silicon wafer and printed circuit board were placed in a vacuum deposition chamber. 200 g of parylene C powder was loaded into the sublimation chamber. A mixture of phenyl acrylate and 1,6-hexanediol diacrylate in a mass ratio of 5:4 was added to the organic monomer feed tank. The valve connecting the parylene cracking furnace and the chamber was opened. The chamber and the cracking furnace were continuously evacuated to below 20 mTorr. The chamber temperature was maintained at 48°C.

[0135] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder is sublimated and pyrolyzed before being introduced into the vacuum deposition chamber. Simultaneously, organic monomers are vaporized at 150°C at a monomer flow rate of 200 μl / min and then introduced into the vacuum deposition chamber. These react with the pyrolyzed parylene active monomer molecules and are deposited on the surfaces of silicon wafers and printed circuit board substrates.

[0136] After 4 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was restored to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The 20.5V acid sweat immersion power-on time test and the 20.5V acid sweat immersion power-on time test (after friction) of the printed circuit board after coating are listed in Table 1.

[0137] Example 2

[0138] The silicon wafer and printed circuit board were placed in a vacuum deposition chamber. 200 g of parylene C powder was loaded into the sublimation chamber. Phenyl acrylate, an organic monomer, was added to the organic monomer feed tank. The valve connecting the parylene cracking furnace and the chamber was opened. The chamber and the cracking furnace were continuously evacuated to below 20 mTorr. The chamber temperature was maintained at 48°C.

[0139] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder is sublimated and pyrolyzed before being introduced into the vacuum deposition chamber. Simultaneously, organic monomers are vaporized at 150°C at a monomer flow rate of 210 μl / min and then introduced into the vacuum deposition chamber. These react with the pyrolyzed parylene active monomer molecules and are deposited on the surfaces of silicon wafers and printed circuit board substrates.

[0140] After 4 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was restored to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The 20.5V acid sweat immersion power-on time test and the 20.5V acid sweat immersion power-on time test (after friction) of the printed circuit board after coating are listed in Table 1.

[0141] Example 3

[0142] A silicon wafer and a printed circuit board were placed in a vacuum deposition chamber. 200 g of parylene C powder was loaded into a sublimation chamber. A mixture of organic monomers, 1,6-hexanediol diacrylate and 3,4-epoxycyclohexyl methacrylate, in a mass ratio of 3:1 was added to an organic monomer feed tank. The valve connecting the parylene cracking furnace and the chamber was opened, and the chamber and the cracking furnace were continuously evacuated to below 20 mTorr. The chamber temperature was maintained at 48°C.

[0143] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder is sublimated and pyrolyzed before being introduced into the vacuum deposition chamber. Simultaneously, organic monomers are vaporized at 150°C at a monomer flow rate of 200 μl / min and then introduced into the vacuum deposition chamber. These react with the pyrolyzed parylene active monomer molecules and are deposited on the surfaces of silicon wafers and printed circuit board substrates.

[0144] After 4 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was restored to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The 20.5V acid sweat immersion power-on time test and the 20.5V acid sweat immersion power-on time test (after friction) of the printed circuit board after coating are listed in Table 1.

[0145] Example 4

[0146] A silicon wafer and a printed circuit board were placed in a vacuum deposition chamber. 220 g of parylene C powder was loaded into a sublimation chamber. A mixture of organic monomers, 1,6-hexanediol diacrylate and 3,4-epoxycyclohexyl methacrylate, in a mass ratio of 3:1 was added to organic monomer feed tank 1. Perfluoropolyether (meth)acrylate was added to feed tank 2. The valve connecting the parylene cracking furnace and the chamber was opened. The chamber and the cracking furnace were continuously evacuated to below 20 mTorr, and the chamber temperature was maintained at 48°C.

[0147] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder, after sublimation and pyrolysis, is introduced into the vacuum deposition chamber. Simultaneously, at a monomer flow rate of 200 μl / min from organic monomer feed tank 1, chemically reacts with the pyrolyzed parylene active monomer molecules and deposits them on the surfaces of silicon wafers and printed circuit board substrates.

[0148] After 4 hours, the organic monomer feed in monomer tank 1 was stopped, and the monomer in organic monomer feed tank 2 was vaporized at 120°C and introduced into the vacuum deposition chamber at a flow rate of 50 μl / min to undergo chemical reaction deposition together with the cracked parylene active monomer molecules;

[0149] After the reaction was continued for 2 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was returned to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the coated silicon wafer were tested. The 20.5 V acid sweat immersion power-on time test and the 20.5 V acid sweat immersion power-on time test (after friction) of the coated printed circuit board are listed in Table 1.

[0150] Example 5

[0151] The silicon wafer and printed circuit board were placed in a vacuum deposition chamber. 200 g of parylene C powder was loaded into the sublimation chamber. Glycidyl methacrylate, an organic monomer, was added to the organic monomer feed tank. The valve connecting the parylene cracking furnace and the chamber was opened. The chamber and the cracking furnace were continuously evacuated to below 20 mTorr. The chamber temperature was maintained at 48°C.

[0152] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder is sublimated and pyrolyzed before being introduced into the vacuum deposition chamber. Simultaneously, organic monomers are vaporized at 150°C at a monomer flow rate of 200 μl / min and then introduced into the vacuum deposition chamber. These react with the pyrolyzed parylene active monomer molecules and are deposited on the surfaces of silicon wafers and printed circuit board substrates.

[0153] After 4 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was restored to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The 20.5V acid sweat immersion power-on time test and the 20.5V acid sweat immersion power-on time test (after friction) of the printed circuit board after coating are listed in Table 1.

[0154] Example 6

[0155] The silicon wafer and printed circuit board were placed in a vacuum deposition chamber. 200 g of parylene C powder was loaded into the sublimation chamber. The organic monomer 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate was added to the organic monomer feed tank. The valve connecting the parylene cracking furnace and the chamber was opened. The chamber and the cracking furnace were continuously evacuated to below 20 mTorr. The chamber temperature was maintained at 48°C.

[0156] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder is sublimated and pyrolyzed before being introduced into the vacuum deposition chamber. Simultaneously, organic monomers are vaporized at 150°C at a monomer flow rate of 200 μl / min and then introduced into the vacuum deposition chamber. These react with the pyrolyzed parylene active monomer molecules and are deposited on the surfaces of silicon wafers and printed circuit board substrates.

[0157] After 4 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was restored to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The 20.5V acid sweat immersion power-on time test and the 20.5V acid sweat immersion power-on time test (after friction) of the printed circuit board after coating are listed in Table 1.

[0158] Example 7

[0159] The silicon wafer and printed circuit board were placed in a vacuum deposition chamber. 200 g of parylene C powder was loaded into the sublimation chamber. The organic monomer 1,6-hexanediol diacrylate was added to the organic monomer feed tank. The valve connecting the parylene cracking furnace and the chamber was opened. The chamber and the cracking furnace were continuously evacuated to below 20 mTorr. The chamber temperature was maintained at 48°C.

[0160] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C, respectively. Parylene C powder is sublimated and pyrolyzed before being introduced into the vacuum deposition chamber. Simultaneously, organic monomers are vaporized at 150°C at a monomer flow rate of 200 μl / min and then introduced into the vacuum deposition chamber. These react with the pyrolyzed parylene active monomer molecules and are deposited on the surfaces of silicon wafers and printed circuit board substrates.

[0161] After 4 hours, the deposition was completed. The monomer feed and the parylene powder feed system were closed, compressed air was introduced, and the chamber was restored to normal pressure. The vacuum chamber was opened, and the silicon wafer and printed circuit board substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The 20.5V acid sweat immersion power-on time test and the 20.5V acid sweat immersion power-on time test (after friction) of the printed circuit board after coating are listed in Table 1.

[0162] Comparative Example 1

[0163] Place the silicon wafer and printed circuit board in a vacuum deposition chamber, add 200g of parylene C powder into the sublimation chamber, open the valve at the connection between the parylene cracking furnace and the chamber, and continuously evacuate the chamber and the cracking furnace to below 20mTorr. The chamber temperature is 48°C.

[0164] After the pressure in the vacuum deposition chamber stabilizes, the pyrolysis chamber and sublimation chamber are heated to 650°C and 150°C respectively. After sublimation and pyrolysis, the Parylene C powder is introduced into the vacuum deposition chamber for chemical reaction and deposition on the surface of the silicon wafer and mobile phone screen substrate.

[0165] After 4 hours, the deposition was completed. The parylene powder feeding system was closed and compressed air was introduced to return the chamber to normal pressure. The vacuum chamber was opened, and the silicon wafer and mobile phone screen substrate were removed. The coating thickness and water drop angle of the silicon wafer after coating were tested. The color difference and transmittance of the mobile phone screen after coating are listed in Table 1.

[0166] Table 1 Test results of Examples 1-7 and Comparative Example 1

[0167] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A coating, characterized in that: The coating comprises coating I, wherein coating I is a polymerized coating deposited on the surface of the substrate by chemical reaction between gaseous organic monomers and parylene active monomers after high-temperature decomposition, wherein the organic monomers comprise monomer α and / or monomer β; The monomer α includes a functional group A and a functional group B, wherein the functional group A is a carbon-carbon double bond structural unit, a carbon-carbon triple bond structural unit or an epoxy structural unit, and the functional group B is an epoxy structural unit or an aromatic ring structural unit; The monomer β has at least two carbon-carbon unsaturated bonds.

2. The coating according to claim 1, characterized in that The monomer α has a structure represented by the following formula (1): In formula (1), M is a structural unit with an aromatic ring or a structural unit with an epoxy group, T1 is -OC(O)-, -C(O)-O- or a connecting bond, X1 is a connecting part, Y1 is a connecting part, R1, R2 and R3 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 The alkyl group is substituted with a halogen atom.

3. The coating according to claim 2, characterized in that The M is phenyl, epoxycyclopentyl, epoxycyclohexyl or epoxy.

4. The coating according to claim 2, characterized in that The T1 is -OC(O)-, the Y1 is a connecting bond, the X1 is a connecting bond, C1-C 10 An alkylene group or a connecting group consisting of a C1-C4 alkylene group and an ether bond.

5. The coating according to claim 2, characterized in that The R1, R2 and R3 are independently selected from hydrogen atom or methyl group.

6. The coating according to claim 2, characterized in that The monomer α is selected from at least one of 3,4-epoxycyclohexylmethyl methacrylate, 3,4-epoxycyclohexyl methacrylate, glycidyl methacrylate, 1,2-epoxy-4-vinylcyclohexane, 2-phenoxyethyl methacrylate, 2-phenoxyethyl acrylate, phenyl acrylate, diallyl terephthalate or phenyl methacrylate.

7. The coating according to claim 1, characterized in that The monomer α has a structure shown in the following formula (2): In formula (2), X2 is a connecting part.

8. The coating according to claim 7, characterized in that The monomer α has a structure shown in the following formula (3): In formula (3), R4 and R6 are independently selected from connecting bonds, C1-C 10 Alkylene or C1-C 10 The halogen atom is substituted with an alkylene group; R5 is C1-C 10 Alkylene or C1-C 10 The halogen atom replaces the alkylene group; X3 and Y3 are independently selected from a connecting bond, an oxygen atom, a carbonyl group or an ester group; A is a cyclohexyl group or a cyclopentyl group.

9. The coating according to claim 7, characterized in that The monomer α is selected from at least one of bis(2,3-epoxycyclopentyl) ether, vinyl cyclohexene diepoxide, diisoprene diepoxide, bis((3,4-epoxycyclohexyl)methyl)adipate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate or dicyclopentadiene diepoxide.

10. The coating according to claim 1, characterized in that The monomer β has a structure shown in the following formula (4): In formula (4), S is a connecting group, R7, R8, R9, R 10 , R 11 and R 12 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Alkyl or C1-C 10 The halogen atom replaces the alkyl group.

11. The coating according to claim 10, characterized in that S contains one or more -OC(O)- or -C(O)-O-.

12. The coating according to claim 11, characterized in that The S has a structure shown in the following formula (5), In formula (5), R 13 C2-C 10 Alkylene or C2-C 10 The halogen atom-substituted alkylene group is substituted with y, and y is an integer from 0 to 10.

13. The coating according to claim 10, characterized in that R7, R8, R9, R 10 , R 11 and R 12 are independently selected from a hydrogen atom or a methyl group.

14. The coating according to claim 10, characterized in that The monomer β is selected from diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate, 1,4-butanediol diacrylate, divinyl adipate, neopentyl glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, 1,6-hexanediol di(meth)acrylate, 1,6-hexanediol diacrylate, polyethylene glycol At least one of di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol hexaacrylate, 1,5-pentanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, triallyl cyanurate, triallylamine, divinylbenzene, diethylene glycol divinyl ether, triethylene glycol divinyl ether, 1,4-butanediol divinyl ether, pentaerythritol triallyl ether, 2,6-dimethyl-2,4,6-octatriene, 1,2,4-trivinylcyclohexane, and 1,4-cyclohexanedimethanol divinyl ether.

15. The coating according to claim 1, characterized in that The mass ratio of the organic monomer to the parylene active monomer is 20:1 to 1:

20.

16. The coating according to claim 15, characterized in that The mass ratio of the organic monomer to the parylene active monomer is 10:1 to 1:

10.

17. The coating according to claim 1, characterized in that The coating also includes coating II, which is formed by chemical reaction between gaseous hydrophobic organic monomers and parylene active monomers after high-temperature cracking and deposited on the surface of coating I.

18. The coating according to claim 17, characterized in that The hydrophobic organic monomer includes a monomer having a structure shown in the following formula (6): Y4—R 14 -X4-R 15 -R 16 (6) Wherein, Y4 is selected from the structure shown in the following formula (7) or (8), R 14 is the connecting key, C1-C 10 Alkylene or C1-C 10 The halogenated alkylene group, X4 is a connecting bond, -COO-, -OOC-, -O-, -NH-, -S- or -CO-, R 15 is the connecting key, C1-C 10 Alkylene or C1-C 10 Substituted alkylene, R 16 C1-C 20 Alkyl or C1-C 20 The halogenated alkyl group, R 17 , R 18 and R 19 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Hydrocarbon or C1-C 10 The halogenated hydrocarbon group, R 20 , R 21 and R 22 are independently selected from hydrogen atoms, halogen atoms, C1-C 10 Hydrocarbon, C1-C 10 Halogenated hydrocarbons, C1-C 10 Hydroxyl or C1-C 10 of a halogenated hydrocarbonoxy group.

19. The coating according to claim 18, characterized in that The R 16 C1-C 20 Perfluoroalkyl or C6-C 20 of alkyl.

20. The coating according to claim 19, characterized in that The R 16 It is a C3-C6 perfluoroalkyl group.

21. The coating according to claim 18, characterized in that The R 17 , R 18 and R 19 are independently selected from a hydrogen atom or a methyl group.

22. The coating according to claim 18, characterized in that The R 20 , R 21 and R 22 Each of them is independently selected from a hydrogen atom, a C1-C4 alkyl group or a C1-C4 alkoxy group.

23. The coating according to claim 18, characterized in that The Y4 is selected from the structure shown in formula (7), R 14 is a connecting bond, and X4 is -COO-.

24. The coating according to claim 18, characterized in that The R 14 is the connection key, and X4 is the connection key.

25. The coating of claim 18, wherein The R 15 is a connecting bond, a methylene group or an ethylene group.

26. The coating according to claim 18, characterized in that The monomer of the structure represented by the formula (6) is selected from 3-(perfluoro-5-methylhexyl)-2-hydroxypropyl methacrylate, 2-(perfluorodecyl)ethyl methacrylate, 2-(perfluorodecyl)ethyl acrylate, 2-(perfluorohexyl)ethyl methacrylate, 2-(perfluorohexyl)ethyl acrylate, 2-(perfluorododecyl)ethyl methacrylate, 2-(perfluorododecyl)ethyl acrylate, 2-perfluorooctylethyl methacrylate, 2-perfluorooctylethyl acrylate, 2-(perfluorobutyl)ethyl methacrylate, 2-(perfluorobutyl)ethyl acrylate, (2H-perfluoropropyl)-2-acrylate, (perfluorocyclohexyl)methacrylate, tert-butyl acrylate, hexyl acrylate, cyclohexyl acrylate, ethylhexyl acrylate, octyl acrylate , decyl acrylate, isodecyl acrylate, dodecyl acrylate, tetradecyl acrylate, hexadecyl acrylate, octadecyl acrylate, isobornyl acrylate, tert-butyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, ethylhexyl methacrylate, octyl methacrylate, decyl methacrylate, isodecyl methacrylate, dodecyl methacrylate, tetradecyl methacrylate, hexadecyl methacrylate, octadecyl methacrylate, isobornyl methacrylate, perfluorodecyltrimethoxysilane, perfluorodecyltriethoxysilane, perfluorodecyltrichlorosilane, perfluorooctyltrimethoxysilane, perfluorooctyltriethoxysilane, perfluorooctyltrichlorosilane, perfluorohexyltrimethoxysilane, perfluorohexyltriethoxysilane or perfluorohexyltrichlorosilane.

27. The coating according to claim 17, characterized in that The hydrophobic organic monomer includes perfluoropolyether or a perfluoropolyether derivative.

28. The coating according to claim 1, characterized in that The parylene is at least one of parylene N powder, C powder, D powder, F powder or HT powder.

29. A method for preparing a coating according to any one of claims 1 to 28, characterized in that: include: Providing a substrate, and placing the substrate in a vacuum deposition chamber; Introducing gaseous organic monomers and parylene active monomers after high-temperature cracking into the vacuum deposition chamber; The organic monomer and the parylene active monomer react in a vacuum deposition chamber to form the coating I on the surface of the substrate.

30. The preparation method according to claim 29, characterized in that: The preparation method further comprises: introducing gaseous hydrophobic organic monomers and parylene active monomers after high temperature cracking into a vacuum deposition chamber, wherein the gaseous hydrophobic organic monomers and the parylene active monomers after high temperature cracking are deposited on the surface of coating I through chemical reaction to form coating II.

31. A device, characterized in that At least part of the surface of the device has the coating according to any one of claims 1 to 28.

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