Panel assembly and electromagnetic heating apparatus

Abstract

A panel assembly (11) and an electromagnetic heating apparatus (1). The panel assembly (11) comprises: a flexible panel (10), the flexible panel (10) comprising a first surface (12) and a second surface (14); a non-magnetic rigid substrate (20), which is configured to support the flexible panel (10) in the thickness direction, the rigid substrate (20) comprising a third surface (22) and a fourth surface (24), and the rigid substrate (20) being fixed to the flexible panel (10) by means of the third surface (22) being in surface contact with the second surface (14); and a fastening device for fastening the flexible panel (10) and the rigid substrate (20) together, the fastening device comprising a plurality of through holes (26) arranged in the rigid substrate (20) and a first nail portion (162) arranged on the flexible panel (10), and the through holes (26) running through the rigid substrate (20) from the third surface (22) and extending to the fourth surface (24). The panel assembly (11) has a smaller thickness and better performance.

Description

Panel assemblies and electromagnetic heating equipment Technical Field

[0001] Embodiments of the present disclosure generally relate to an electromagnetic heating device, and more particularly to an electromagnetic heating device having an ultra-thin thickness. Background Art

[0002] Electromagnetic heating equipment such as induction cookers are widely used in kitchens for cooking food. For electromagnetic heating equipment, it is only necessary to provide electricity to conveniently heat items such as food; there is no need to provide complex gas supply pipelines and related complex ignition equipment like gas cookers. Electromagnetic heating equipment is usually provided with a microcrystalline panel, which has the advantages of good rigidity and easy cleaning and is widely used as a heating panel of electromagnetic heating equipment. The microcrystalline panel is usually fixed to a plastic shell and then fixed to the base. Traditional electromagnetic heating equipment uses a microcrystalline panel as a heating panel, resulting in high cost of the equipment and large thickness of the equipment (for example, up to about 5 cm). It is expected that traditional electromagnetic heating equipment can be further improved.

[0003] Summary of the Invention

[0004] Embodiments of the present disclosure provide a panel assembly and an electromagnetic heating device that aim to solve one or more of the above-mentioned problems and other potential problems.

[0005] According to a first aspect of the present disclosure, a panel assembly for an electromagnetic heating device is provided. The panel assembly includes: a flexible panel including a first surface and a second surface opposite to the first surface, the first surface including one or more furnace eyes suitable for supporting an appliance to be electromagnetically heated; a non-magnetic rigid substrate configured to support the flexible panel in a thickness direction, the rigid substrate including a third surface and a fourth surface opposite to the third surface, the rigid substrate being fixed to the flexible panel in a manner that the third surface is in surface contact with the second surface; and a fastening device for fastening the flexible panel and the rigid substrate together, the fastening device including a plurality of through holes provided on the rigid substrate and a first nail portion provided on the flexible panel, the through holes extending from the third surface through the rigid substrate to the fourth surface.

[0006] According to the present disclosure, the thickness of the panel assembly can be greatly reduced, thereby reducing the thickness of the device including the panel assembly. In addition, the panel assembly is easy to store and is not easily damaged.

[0007] In some embodiments, the through hole includes at least two hole segments formed with different sizes, the at least two hole segments include a first hole segment adjacent to the third surface and a second hole segment away from the third surface, the hole diameter of the second hole segment is larger than the hole diameter of the first hole segment, and the first nail portion includes a first fastening column arranged in the first hole segment and a second fastening column arranged in the second hole segment.

[0008] In some embodiments, the plurality of through holes are arranged throughout the third surface of the rigid substrate.

[0009] In some embodiments, the rigid substrate further includes a circumferential side edge, wherein the flexible panel further includes a covering portion configured to cover the rigid substrate at the circumferential side edge.

[0010] In some embodiments, the fastening device includes a plurality of circumferential notches arranged along the circumferential side edge and a second nail portion provided on the flexible panel and received in the circumferential notches, wherein the plurality of circumferential notches extend a distance from the outer side of the circumferential side edge toward the inner side in a plane parallel to the first surface.

[0011] In some embodiments, the circumferential notch includes a first notch segment on the outside of the circumferential side edge adjacent to the rigid substrate and a second notch segment on the outside away from the circumferential side edge, the aperture of the second notch segment is larger than the aperture of the first notch segment, and the second nail portion includes a third fastening column arranged in the first notch segment and a fourth fastening column arranged in the second notch segment.

[0012] In some embodiments, the circumferential notches are arranged at predetermined intervals around the entire circumference of the circumferential side edge.

[0013] In some embodiments, the circumferential side edge further comprises a bottom recess extending at the fourth surface, and the material of the flexible panel is configured to be at least partially received in the bottom recess so that the flexible panel wraps around the rigid substrate at the fourth surface of the rigid substrate.

[0014] In some embodiments, the flexible panel further includes an integrally formed mounting portion disposed at the furnace eye region and suitable for mounting a temperature sensor.

[0015] In some embodiments, the mounting portion includes: a mounting block configured to carry the temperature sensor and at least partially protrude from the first surface; and a connecting bridge configured to elastically connect the mounting block to the main body portion of the flexible panel, the connecting bridge having a reduced thickness relative to the mounting block and the main body portion, the connecting bridge, the mounting block and the main body portion being integrally formed; wherein the connecting bridge is configured to elastically deform in response to the pressure of the appliance placed on the surface of the furnace eye of the flexible panel so that the temperature sensor remains in contact with the bottom surface of the appliance.

[0016] In some embodiments, the connecting bridge comprises an at least partially upwardly protruding profile.

[0017] In some embodiments, the mounting block includes a receiving cavity recessed from its top surface, and the temperature sensor is suitable for being arranged in the receiving cavity; the receiving cavity includes a cable channel extending downward from the bottom surface of the receiving cavity, and the cable channel is suitable for arranging a cable for transmitting signals from the temperature sensor; the receiving cavity is configured to be filled with a curable colloid after the temperature sensor is installed in the receiving cavity.

[0018] In some embodiments, the mounting block is shaped so that a top thereof fits together with a cap, wherein the cap is configured to cover the receiving cavity after the temperature sensor is mounted to the receiving cavity, and the cap is formed of a non-electromagnetic and thermally conductive material.

[0019] In some embodiments, the rigid substrate further includes an extended connection post protruding from the fourth surface, the connection post being configured to receive a fastener for fastening the panel assembly.

[0020] In some embodiments, the panel assembly further includes an indication component, the flexible panel and the rigid substrate include indication holes extending through both, the indication holes include a first indication hole provided in the flexible panel and a second indication hole provided in the rigid substrate, wherein the size of the first indication hole is smaller than that of the second indication hole; the size of the first indication hole is determined to accommodate the indication portion with an interference fit.

[0021] In some embodiments, the rigid base further includes a fastening flange extending from the fourth surface away from the fourth surface adjacent a circumferential side edge of the rigid base.

[0022] In some embodiments, the flexible panel is made of a silicone material; and the flexible panel and the rigid substrate are manufactured in one piece via insert molding.

[0023] According to a second aspect of the present disclosure, an electromagnetic heating device is provided. The electromagnetic heating device includes: the panel assembly according to the first aspect; an electromagnetic heating assembly; a base including a cavity suitable for accommodating the electromagnetic heating assembly and assembled with the panel assembly; and a heat dissipation fan disposed in the cavity, the heat dissipation fan including a centrifugal fan and disposed a distance away from the electromagnetic heating assembly in a plane parallel to the first surface.

[0024] In some embodiments, the base further includes one or more partition plates extending upwardly from a bottom wall of the base, wherein the partition plates separate the air inlet and the air outlet of the centrifugal fan from each other.

[0025] According to a third aspect of the present disclosure, an electromagnetic heating device is provided. The electromagnetic heating device comprises: at least one panel assembly according to any one of the first aspects, each panel assembly comprising a plurality of furnace eyes, a heating unit mounted below each furnace eye, the heating unit comprising an electromagnetic heating assembly and a base adapted to accommodate the electromagnetic heating assembly; wherein the panel assembly is configured to be foldable at a location between two adjacent heating units. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other objects, features and advantages of the embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation.

[0027] FIG1 shows a perspective schematic diagram of an electromagnetic heating device according to an embodiment of the present disclosure.

[0028] FIG2 shows an exploded schematic diagram of an electromagnetic heating device according to an embodiment of the present disclosure.

[0029] FIG3 shows a cross-sectional view of an electromagnetic heating device according to an embodiment of the present disclosure.

[0030] FIG4 shows a perspective schematic diagram of a panel assembly according to an embodiment of the present disclosure.

[0031] FIG5 illustrates a schematic cross-sectional view of a panel assembly according to an embodiment of the present disclosure, taken along a plane parallel to the panel assembly and passing through a rigid substrate.

[0032] FIG. 6 shows a partially enlarged view of the cross-sectional view shown in FIG. 3 .

[0033] FIG7 is a partial cross-sectional schematic diagram of a panel assembly at a temperature sensor according to an embodiment of the present disclosure.

[0034] 8 illustrates a plan view of an electromagnetic heating apparatus according to an embodiment of the present disclosure, with the panel assembly removed.

[0035] FIG9 shows a perspective view of an electromagnetic heating device according to another embodiment of the present disclosure.

[0036] FIG10 shows a perspective view of an electromagnetic heating device according to another embodiment of the present disclosure, viewed from the bottom side.

[0037] In the various drawings, the same or corresponding reference numerals denote the same or corresponding parts. DETAILED DESCRIPTION

[0038] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0039] The term "including" and its variations used in this document indicate open inclusion, that is, "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one other embodiment". Terms such as "upper", "lower", "front", and "rear" indicating placement or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the principles of the present disclosure, and do not indicate or imply that the referred elements must have a specific orientation, be constructed or operate in a specific orientation, and therefore should not be understood as limiting the present disclosure.

[0040] As described in the background section, traditional electromagnetic heating equipment typically uses glass-ceramic panels. Glass-ceramic has excellent properties such as non-magnetic conductivity, good rigidity, ease of cleaning, and water resistance, making it a good material for stoves. However, devices that include glass-ceramic have the following drawbacks: First, the high cost of glass-ceramic increases the cost of the entire device; second, the glass-ceramic needs to be glued to plastic parts, which results in the entire device being thick, for example, up to 5 cm or more; and third, the glass-ceramic panel is fragile, which requires careful storage and storage of electromagnetic heating equipment to prevent damage to the glass-ceramic.

[0041] According to the present disclosure, a new flexible panel assembly is provided and a uniquely designed mounting structure is adopted to ensure that the flexible panel assembly can perform functions equivalent to or similar to those of microcrystalline glass, or even exceed the functions of microcrystalline panels. The structural details of the electromagnetic heating device according to the embodiment of the present disclosure are described in detail below with reference to the accompanying drawings. It is worth noting that in the following description, an induction cooker is used as an example of an electromagnetic heating device. It should be understood that the inventive concept according to the embodiment of the present disclosure can be applied to other types of electromagnetic heating devices.

[0042] Figures 1 and 2 respectively show a three-dimensional schematic diagram and an exploded schematic diagram of an electromagnetic heating device 1 according to an embodiment of the present disclosure. As shown in Figure 1, the electromagnetic heating device 1 includes a panel assembly 11 and a base 40. The panel assembly includes a flexible panel 10 and a non-magnetic rigid substrate 20 (see Figure 3, which will be described in detail later). The top surface of the flexible panel 10 defines a support surface 12, which may include a heating area (also called a furnace eye 19) on the support surface 12. In the illustrated embodiment, the support surface 12 is in the shape of a flat surface, which is beneficial for kitchen appliances and is easy to clean, clean and store. The base 40 can define a cavity, and various electrical components of the electromagnetic heating device 1 can be arranged in the cavity. The base 40 is assembled together with the panel assembly 11 to form an electromagnetic heating device.

[0043] The electromagnetic heating device 1 further includes an electromagnetic heating assembly 30 and a circuit board 50. The electromagnetic heating assembly 30 is located below the furnace eye 19. The circuit board 50 is used to drive the electromagnetic heating assembly 30 and to control the operation of the electromagnetic heating device. The electromagnetic heating assembly 30 and the circuit board 50 can be arranged in the cavity of the base 40, and when the base 40 is assembled with the panel assembly 11, these components are protected in the cavity.

[0044] In some embodiments, as shown in Figures 1 and 2, the support surface 12 further includes an indication and control area 13. The indication and control area may include buttons for selecting a heating temperature and / or heating mode, as well as indicator lights for indication. A user can operate and / or observe the operating status of the electromagnetic heating device 1 through the indication and control area 13. In some embodiments, as shown in Figures 1 and 2, the support surface 12 is further provided with a temperature sensor 17. The temperature sensor 17 is configured to sense the temperature of a heated object (e.g., a pot). The temperature sensor 17 can be communicatively connected to the circuit board 50 to transmit temperature sensing data to relevant components of the circuit board. The indication and control area 13 can be coupled to indicator lights and / or operating components on the circuit board 50. In some embodiments, the indication and control area 13 may include an indicator light, which is optically coupled to a light source on the circuit board 50, for example, via a light guide disposed in the panel assembly 11. In some embodiments, the indication and control area 13 may include a keypad. When a user presses the keypad, the user can activate an electrical component corresponding to the keypad on the circuit board 50 to implement control settings for the electromagnetic heating device 1.

[0045] According to the present disclosure, by replacing traditional rigid microcrystalline panels with flexible materials, a significant technological advancement is achieved compared to conventional devices. In particular, the use of flexible materials significantly reduces the thickness of the panel assembly, thereby reducing the cost of the entire device. The soft nature of the flexible material also makes it easier to store and accommodate the electromagnetic heating device.

[0046] However, there are still many technical challenges and difficulties in technical implementation of using flexible materials to replace rigid microcrystalline panels. First, flexible materials are easy to deform, so what kind of structure is used to ensure the rigidity required for the flexible material to support the appliance to be heated and how to achieve the installation strength required to fix the flexible material to the base. Secondly, as kitchen equipment requires the cover to have good waterproofness and stain resistance, how can the flexible material ensure waterproofness and stain resistance while achieving problems such as appliance support and fixation. Furthermore, the characteristic of flexible materials that are easy to deform is more significant when heated. How to prevent problems such as bulging caused by uneven local heating of the flexible material when heated. According to the present disclosure, the panel assembly 11 adopts the form of a combination of flexible materials and rigid materials, which can effectively solve one or more of the above-mentioned technical problems. Figures 3 to 6 show in detail the structural details of the panel assembly 11 according to an embodiment of the present disclosure.

[0047] In some embodiments, as shown in Figures 3-6, the panel assembly 11 includes a flexible panel 10 and a non-magnetic rigid substrate 20. The flexible panel 10 is made of a flexible material. Flexible materials are easily deformable and resistant to high-temperature heating. Examples of flexible materials are silicone, or materials with similar flexibility and high-temperature resistance. Silicone, for example, can withstand temperatures of 280 degrees Celsius or even higher. Furthermore, silicone has excellent anti-slip properties, preventing items such as pots and pans from moving on the supporting surface, further improving heating performance. As shown in Figures 3-6, and particularly in Figure 6, the flexible panel 10 includes a top surface 12 (also referred to as a support surface) and a bottom surface 14 opposite the top surface 14 (i.e., the surface adjacent to the base 30). The top surface 24 defines a burner eye 19 suitable for supporting an appliance to be heated. The rigid substrate 20 is made of a non-magnetic, rigid material, such as aluminum or plastic. The rigid substrate 20 includes a top surface 22 (i.e., the surface in contact with the bottom surface 14 of the flexible panel 10) and a bottom surface 24 opposite the top surface 22 (i.e., the surface adjacent to the base 30). The rigid substrate 20 is fixed to the flexible panel 10 with its top surface 22 in surface contact with the bottom surface 14 of the flexible panel 10. The bottom surface 24 of the rigid substrate 20 faces the surface of the base 30 and may cover the top of the cavity of the base 30.

[0048] The rigid substrate 20 can be fixed together with the flexible panel 10. In some embodiments, the rigid substrate 20 and the flexible panel 10 can be integrally formed using a mold. As an example, the rigid substrate can be preformed first. If the rigid substrate is plastic, it can be formed using injection molding. However, the rigid substrate is placed on a mold and molded with a flexible material that has been heated to a semi-fluid shape, thereby integrally forming the rigid substrate 20 and the flexible panel 10. The rigid material not only provides support rigidity for the heated appliance but also provides the rigidity required for securing the cover assembly to the base.

[0049] Given that the rigid substrate 20 and the flexible panel 10 are made of different materials and expand at different rates when heated, the flexible panel 10 is prone to bulging. To this end, anti-bulging structures are provided between the rigid substrate 20 and the flexible panel 10. In some embodiments, the flexible panel 10 and the rigid substrate 20 are secured together at the contact area by multiple rivets. These rivets utilize a unique structural design that does not damage the supporting surface 12 of the flexible panel 10 and ensures sufficient bonding strength between the flexible panel 10 and the rigid substrate 20.

[0050] In some embodiments, the flexible panel 10 and the rigid substrate 20 may be fastened together by a fastening device.

[0051] In some embodiments, the fastening device includes a surface fastening device. The surface fastening device may include a plurality of through-holes 26 disposed on the rigid substrate 20 and a first spike portion 162 disposed on the flexible panel 10. As shown in Figures 3-6, the rigid substrate 20 includes a plurality of through-holes 26. The through-holes 26 extend from the top surface 22 of the rigid substrate 20 through the thickness of the rigid substrate 20 to the bottom surface 24. In some embodiments, the through-holes 26 include at least two hole segments formed with different sizes. The material of the flexible panel 10 is at least partially disposed in the two hole segments, and the rigid substrate 20 and the flexible panel 10 are bonded together via the material located in the two hole segments. The material connecting the flexible panel 10 and the rigid substrate 20 can be formed into a shape that matches the hole segments. The first spike portion 162 includes a first fastening post 1622 disposed in the first hole segment 262 and a second fastening post 1624 disposed in the second hole segment 264. This is achieved, for example, through pressure and the fluidity of the flexible material when the flexible panel 10 and the rigid substrate 20 are integrally molded. The two hole sections may be formed into any appropriate shape as long as the bonding strength between the rigid substrate 20 and the flexible panel 10 can be enhanced.

[0052] In some embodiments, as shown in Figures 3 and 6, the through hole 26 may include two hole sections, namely a first hole section 262 adjacent to the top surface 22 and a second hole section 264 away from the top surface 22. The aperture of the second hole section 264 is larger than the aperture of the first hole section 262. When the flexible panel 10 is integrally molded, the material of the flexible panel 10 is filled in the second hole section 264. As an example, the second hole section 264 and the first hole section 262 may form a mushroom or screw shape. Thus, the material filling the second hole section 264 can prevent the flexible panel 10 from detaching from the rigid substrate 20 in the thickness direction around the entire circumference of the first hole section 262. It should be understood that the shape of the second hole section 264 does not have to be circular, but may be any other appropriate shape, as long as the material filling the second hole section 264 can prevent the flexible panel 10 from detaching from the rigid substrate 20.

[0053] In some embodiments, as shown in Figures 4 and 5, a plurality of through holes 26 are arranged at a distance away from the circumferential side edge 28 of the rigid substrate 20. A plurality of through holes 26 are arranged throughout the top surface 22 of the rigid substrate 20. In other embodiments, a plurality of through holes 26 may be arranged at predetermined intervals only in a portion of the top surface 22 of the rigid substrate 20. In some embodiments, a plurality of through holes 26 may be arranged in a high density and / or low density in a portion of the top surface 22 of the rigid substrate 20. It should be understood that a plurality of through holes 26 may be arranged in rows or in any pattern. Thus, a technical effect similar to that of rivets can be achieved by filling the material of the through holes 26.

[0054] According to the present disclosure, by providing a plurality of through holes 26 on the rigid substrate 20 , the rivet structure can be conveniently formed when the rigid substrate 20 and the flexible panel 10 are integrally molded on a mold.

[0055] In some embodiments, the flexible panel 10 is configured to wrap around the rigid substrate 20 at the circumferential side edge 28. In some embodiments, in addition to the anti-bulging device provided on the top surface 22 of the rigid substrate 20, multiple anti-bulging devices are also provided on the circumferential side edge 28 of the rigid substrate 20.

[0056] In some embodiments, the fastening device further comprises a side edge fastening device. The side edge fastening device comprises a plurality of circumferential notches 27 arranged along the circumferential side edge 28 and a second nail portion 164 disposed on the flexible panel 10 and received in the circumferential notches 27. In some embodiments, as shown in Figures 5 and 6, the circumferential side edge 28 comprises a plurality of circumferential notches 27 arranged along the circumferential side edge 28. The circumferential notches 27 extend a distance from the outer side of the circumferential side edge 28 toward the inner side of the circumferential side edge 28. For example, when the flexible panel 10 is integrally formed, the material of the flexible panel 10 is filled in the circumferential notches 27, and the rigid substrate 20 and the flexible panel 10 are circumferentially bonded together via the material located in the circumferential notches 27. The shape of the circumferential notches 27 can be formed in any suitable shape. Accordingly, the second nail portion comprises a third fastening post 1642 disposed in the first notch section 272 and a fourth fastening post 1644 disposed in the second notch section 274. In some embodiments, the circumferential notches 27 are formed in a shape that facilitates the filling of the material. In some embodiments, the circumferential notches 27 are formed to enhance the rivet effect. In some embodiments, the circumferential notches 27 may be T-shaped, L-shaped, or any other suitable shape, as viewed in a cross-section through the thickness of the panel assembly 11. In some embodiments, the circumferential notches 27 are arranged at predetermined intervals around the entire circumference of the circumferential side edge 28. In other embodiments, the circumferential notches 27 may be arranged at predetermined intervals around only a portion of the circumferential side edge 28.

[0057] In some embodiments, as shown in Figures 5 and 6, the circumferential notch 27 includes a first notch segment 272 adjacent to the outer side of the circumferential side edge 28 of the rigid substrate 20 and a second notch segment 274 further away from the outer side of the circumferential side edge 28. The aperture of the second notch segment 274 is larger than the aperture of the first notch segment 272, and the material of the flexible panel 10 is at least received in the second notch segment 274. Thus, the material filling the second notch segment 274 can prevent the flexible panel 10 from detaching from the rigid substrate 20 in the lateral direction (i.e., in a direction parallel to the support surface 12) along the entire circumference of the first notch segment 272. It should be understood that the shape of the second notch segment 274 does not need to be circular, and can also be any other suitable shape, as long as the material filling the second notch segment 274 can prevent the flexible panel 10 from detaching from the rigid substrate 20 in the lateral direction.

[0058] In some embodiments, as shown in Figures 4 and 6, the flexible material of the flexible panel 10 at least partially extends to the bottom surface 24 of the rigid substrate 20. The circumferential side edge 28 includes a bottom recess 29 extending at the fourth surface 24. The material of the flexible panel 10 is configured to be at least partially received in the bottom recess 29, so that the flexible panel 10 covers the rigid substrate 20 at the fourth surface 24 of the rigid substrate 20. For example, when the flexible panel 10 is integrally molded, the flexible material can flow along the bottom recess 29 and be conveniently molded.

[0059] The indication and control area 13 can be implemented in various forms. In some embodiments, both the flexible panel 10 and the rigid substrate 20 include an indication hole extending through both. For example, a light guide can be received in the indication hole. The indication hole includes a first indication hole provided in the flexible panel 10 and a second indication hole provided in the rigid substrate 20. The size of the first indication hole is smaller than that of the second indication hole. In particular, the size of the first indication hole is determined to accommodate the indication portion with an interference fit. This is beneficial for the waterproof performance of the supporting surface of the flexible panel 10. Considering that the flexible material of the flexible panel 10 is flexible, the flexibility of the material and the size of the indication hole can be used to prevent water intrusion.

[0060] The temperature sensor 17 can be implemented in various installation forms. Considering that the temperature sensor 17 is exposed on the surface of the flexible panel 10, it is necessary to prevent water and / or dirt from invading the flexible panel through the area of ​​the temperature sensor 17. In some embodiments, the flexible panel 10 includes a mounting portion 15 provided in the furnace eye 19 area and suitable for mounting the temperature sensor 17. The mounting portion 15 is integrally formed with the flexible panel 10. In some embodiments, as shown in Figure 7, the mounting portion 15 includes a mounting block 152 and a connecting bridge 154. The mounting block 152 is configured to carry the temperature sensor 17 and at least partially protrude from the first surface. The connecting bridge 154 is configured to elastically connect the mounting block 152 to the main body 153 of the flexible panel 10.

[0061] The connecting bridge 154 is configured to elastically deform in response to pressure from an appliance placed on the surface of the oven eye 19 of the flexible panel 10. This ensures that the temperature sensor 17 maintains contact with the bottom surface of the appliance. In some embodiments, the connecting bridge 154, the mounting block 152, and the main body 153 are integrally formed, for example, by designing an appropriate mold when the flexible panel 10 and the rigid substrate 20 are integrally formed.

[0062] In some embodiments, as shown in FIG7 , the connecting bridge 154 has a reduced thickness relative to the mounting block 152 and the main body 153. This structure can facilitate deformation of the connecting bridge 154. In some embodiments, the connecting bridge 154 is formed into an arcuate profile that protrudes upward or is recessed downward. In some embodiments, the connecting bridge 154 includes a profile that at least partially protrudes upward. This can reduce the area on the support surface 11 where dirt easily accumulates.

[0063] In some embodiments, as shown in FIG7 , the mounting block 152 includes a recessed receiving cavity 156 recessed from its top surface, and the temperature sensor 17 is adapted to be disposed in the receiving cavity 156. Mounting block 152 can provide reliable protection for the temperature sensor 17. In some embodiments, the receiving cavity 156 includes a cable channel 158 extending downward from the bottom surface of the receiving cavity 156. The cable channel is adapted to accommodate a cable used to transmit signals from the temperature sensor 17. Providing the cable channel on the bottom surface of the receiving cavity 156 prevents water on the support surface 11 from entering the flexible panel 10 through the receiving cavity 156.

[0064] 7 , the storage cavity 156 is configured to be filled with a curable colloid after the temperature sensor 17 is mounted in the storage cavity 156. In this case, the remaining space in the storage cavity 156 can be filled with the curable colloid, further improving the waterproof performance.

[0065] In some embodiments, as shown in FIG7 , the mounting block 152 can be protected by a cap 159. The mounting block 152 is shaped so that its top fits together with the cap 159. The cap 159 is configured to cover the receiving cavity 156 after the temperature sensor 17 is mounted in the receiving cavity 156. In some embodiments, the cap 159 is formed of a non-electromagnetic and thermally conductive material, such as aluminum.

[0066] In some embodiments, to facilitate fastening the face cover assembly 11 to the base 30, the rigid base 20 further includes an extended connecting post 23 protruding from the fourth surface 24. The connecting post 23 is configured to receive a fastener for fastening the panel assembly 11. As shown in Figures 3, 4, and 6, the connecting post 23 can extend into the internal cavity of the base 30. In some embodiments, the connecting post 23 can be provided with threads for threaded fastening.

[0067] In some embodiments, in order to further enhance the fastening strength between the face cover assembly 11 and the base 30, the rigid substrate 20 may include a fastening flange 27 extending from the bottom surface 24 away from the bottom surface 24 along the circumferential side edge 28 adjacent to the rigid substrate 20. As shown in Figure 6, the fastening flange 27 is configured to protrude from the bottom surface 24, thereby increasing the contact area between the rigid substrate 20 and the base 30. The fastening flange 27 can be integrally formed when the rigid substrate is preformed, for example, by integral injection molding. In some embodiments, the fastening flange 27 is arranged around the entire circumference of the rigid substrate 20. In other embodiments, the fastening flange 27 may be arranged around a portion of the rigid substrate 20.

[0068] In some embodiments, the electromagnetic heating device 1 further includes a heat dissipation fan 60 arranged in the cavity of the base 30. The heat dissipation fan 60 is configured to dissipate the heat generated by the heat-generating components on the circuit board 50. As shown in Figures 2 and 8, in order to further reduce the thickness of the electromagnetic heating device 1, the heat dissipation fan 60 adopts a horizontal layout scheme. In particular, the heat dissipation fan 60 is arranged at a distance from the electromagnetic heating component 30 in a plane parallel to the support surface 12. In addition, the fan adopts a centrifugal fan. This has advantages in terms of heat dissipation efficiency. With a centrifugal fan, the air duct enters the fan from the lateral side of the device and propagates across the plane, which facilitates increasing the heat dissipation area and improving the heat dissipation performance. In addition, according to the heat dissipation arrangement of the present disclosure, the centrifugal fan can rotate at a higher speed and has the advantage of reducing noise.

[0069] In some embodiments, as shown in FIG8 and FIG9 , the air inlet of the centrifugal fan is formed near the outer periphery of the base, and in the embodiment of FIG8 , at the lower side. The outer periphery of the base may include an air inlet grille 42. Wind from the lower side enters the centrifugal fan, and wind from the outlet side of the centrifugal fan flows out through air outlet grilles 44 provided on the outer periphery of the base 40. In the embodiment shown in FIG8 , air outlet grilles 44 are provided on the other three sides of the outer periphery of the base 40. It should be understood that the illustrated embodiment is merely exemplary, and the air outlet grilles 44 can be designed on one or both sides according to the heat dissipation performance requirements.

[0070] In some embodiments, as shown in Figures 2 and 8, the base 40 may further include one or more extending partitions 62, 64 that protrude upward from the bottom wall of the base 40. The partitions 62, 64 separate the air inlet and air outlet of the centrifugal fan from each other. This arrangement prevents crosstalk between the air inlet and air outlet. In some embodiments, as shown in Figures 2 and 8, the partitions may include an air inlet partition 62 and an air outlet partition 64, wherein the air inlet partition 62 is arranged near the air inlet grille of the base 40 and is shaped to guide air from the air inlet grille 42 into the air inlet of the fan, and the air outlet partition 64 is shaped to match the wall of the air outlet of the centrifugal fan.

[0071] In some embodiments, as shown in Figures 2 and 8, the layout of the circuit board 50 is also modified into a format compatible with the heat dissipation fan 60. The main heat-generating components of the circuit board 50 can be arranged on the main airflow path of the heat dissipation fan 60, which facilitates heat dissipation. In some embodiments, the circuit board 50 may include a notch 52, and the centrifugal fan is installed at the notch 52. With this arrangement, the thickness of the device can be further reduced. In some embodiments, the partitions 62 and 64 are arranged in the notch 52. In this case, the installation of the circuit board 50 can be unaffected.

[0072] In the embodiment shown in Figure 1, the electromagnetic heating device 1 includes a furnace eye 19. In other embodiments, the electromagnetic heating device 1 may include multiple furnace eyes 19. Figures 9 and 10 show schematic diagrams of an embodiment including multiple furnace eyes 19. As shown in Figures 9 and 10, the electromagnetic heating device 1 may include one or more integrated panel assemblies 11. The structure of the panel assembly 11 is similar to that of the panel assembly 11 of the aforementioned embodiment. The difference is that a panel assembly 11 may include multiple heating units corresponding to the number of furnace eyes 19. Each heating unit includes an electromagnetic heating assembly 30 and a base 40 suitable for accommodating the electromagnetic heating assembly 30. These components are similar to those in the aforementioned embodiment, and detailed description thereof is omitted.

[0073] In some embodiments, the panel assembly 11 is configured to be foldable at a location 70 between two adjacent heating units. Considering that the panel assembly 11 includes a flexible panel 10, a folding device for folding adjacent heating units can be implemented by the flexible panel 10. In some embodiments, the panel assembly 11 is connected at the connection location 70 via the material used to form the flexible panel 10. The connection location can have a reduced thickness relative to other parts of the panel assembly 11 to facilitate folding. It should be understood that the illustrated embodiment is merely exemplary, and the connection location 70 can be implemented as other hinge devices.

[0074] In addition, although adopting specific order to describe each operation, this should be understood as requiring such operation to be carried out in the specific order shown or in sequential order, or requiring that all illustrated operations should be carried out to obtain desired results. Under certain circumstances, multitasking and parallel processing may be advantageous. Similarly, although comprising some specific implementation details in the above discussion, these should not be interpreted as limiting the scope of the present disclosure. Some features described in the context of separate embodiment can also be implemented in a single implementation in combination. On the contrary, the various features described in the context of a single implementation also can be implemented in a plurality of implementations individually or in the mode of any suitable subcombination.

[0075] Although the subject matter has been described in language specific to structural features and / or methodological logical acts, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are merely example forms of implementing the claims.

[0076] While various embodiments of the present disclosure have been described above, the foregoing description is intended to be illustrative, non-exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or technological improvements in the marketplace, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A panel assembly for an electromagnetic heating device, characterized in that: include: A flexible panel (10) comprising a first surface (12) and a second surface (14) opposite to the first surface (12), the first surface (12) comprising one or more burner eyes (19) suitable for supporting an appliance to be electromagnetically heated; a non-magnetic rigid substrate (20) configured to support the flexible panel (10) in a thickness direction, the rigid substrate (20) comprising a third surface (22) and a fourth surface (24) opposite to the third surface (22), the rigid substrate (20) being fixed to the flexible panel (10) in a manner that the third surface (22) is in surface contact with the second surface (14); as well as A fastening device for fastening the flexible panel (10) and the rigid substrate (20) together, the fastening device comprising a plurality of through holes (26) arranged on the rigid substrate (20) and a first nail portion (162) arranged on the flexible panel (10), wherein the through holes (26) extend from the third surface (22) through the rigid substrate (20) to the fourth surface (24).

2. The panel assembly according to claim 1, characterized in that: The through hole (26) includes at least two hole segments formed into different sizes, the at least two hole segments include a first hole segment (262) adjacent to the third surface (22) and a second hole segment (264) away from the third surface (22), the hole diameter of the second hole segment (264) is larger than the hole diameter of the first hole segment (262), and the first nail portion (162) includes a first fastening column (1622) arranged in the first hole segment (262) and a second fastening column (1624) arranged in the second hole segment (264).

3. The panel assembly according to claim 2, characterized in that: The plurality of through holes (26) are arranged throughout the third surface (22) of the rigid substrate (20).

4. The panel assembly according to claim 1, characterized in that: The rigid substrate (20) further includes a circumferential side edge (28), wherein the flexible panel (10) further includes a covering portion configured to cover the rigid substrate (20) at the circumferential side edge (28).

5. The panel assembly according to claim 4, characterized in that: The fastening device includes a plurality of circumferential notches (27) arranged along the circumferential side edge (28) and a second nail portion (164) provided on the flexible panel (10) and received in the circumferential notches (27), wherein the plurality of circumferential notches (27) extend a distance from the outer side of the circumferential side edge (28) toward the inner side in a plane parallel to the first surface (12).

6. The panel assembly according to claim 5, characterized in that: The circumferential notch (27) includes a first notch segment (272) on the outer side of the circumferential side edge (28) adjacent to the rigid substrate (20) and a second notch segment (274) on the outer side away from the circumferential side edge (28), the aperture of the second notch segment (274) being larger than the aperture of the first notch segment (272), and the second nail portion includes a third fastening column (1642) arranged in the first notch segment (272) and a fourth fastening column (1644) arranged in the second notch segment (274).

7. The panel assembly according to claim 5 or 6, characterized in that: The circumferential notches (27) are arranged at predetermined intervals around the entire circumference of the circumferential side edge (28).

8. The panel assembly according to claim 4, characterized in that: The circumferential side edge (28) also includes a bottom recess (29) extending at the fourth surface (24), and the material of the flexible panel (10) is configured to be at least partially received in the bottom recess (29) so that the flexible panel (10) covers the rigid substrate (20) at the fourth surface (24) of the rigid substrate (20).

9. The panel assembly according to any one of claims 1 to 6 and 8, characterized in that: The flexible panel (10) further comprises an integrally formed mounting portion (15) arranged at the furnace eye (19) region and suitable for mounting a temperature sensor (17).

10. The panel assembly according to claim 9, characterized in that The mounting portion (15) comprises: a mounting block (152) configured to carry the temperature sensor (17) and at least partially protrude from the first surface; and A connecting bridge (154) is configured to elastically connect the mounting block (152) to the main body (153) of the flexible panel (10), wherein the connecting bridge (154) is relatively The mounting block (152) and the main body (153) have a reduced thickness, and the connecting bridge (154), the mounting block (152) and the main body (153) are integrally formed; The connecting bridge (154) is configured to elastically deform in response to pressure of the appliance placed on the surface of the oven eye (19) of the flexible panel (10) so that the temperature sensor (17) remains in contact with the bottom surface of the appliance.

11. The panel assembly according to claim 10, characterized in that: The connecting bridge (154) comprises a profile that at least partially protrudes upward.

12. The panel assembly according to claim 9, characterized in that The mounting block (152) includes a storage cavity (156) recessed from its top surface, and the temperature sensor (17) is suitable for being arranged in the storage cavity (156); the storage cavity (156) includes a cable channel (158) extending downward from the bottom surface of the storage cavity (156), and the cable channel is suitable for arranging a cable for transmitting signals from the temperature sensor (17); the storage cavity (156) is configured to be filled with a curable colloid after the temperature sensor (17) is installed in the storage cavity (156).

13. The panel assembly according to claim 10, characterized in that The mounting block (152) is shaped so that its top is fitted with a cap (159), wherein the cap (159) is configured to cover the receiving cavity (156) after the temperature sensor (17) is installed in the receiving cavity (156), and the cap (159) is formed of a non-electromagnetic and thermally conductive material.

14. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The rigid substrate (20) further includes an extended connection post (33) protruding from the fourth surface (24), the connection post (33) being configured to receive a fastener for fastening the panel assembly.

15. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: It also includes an indication component, wherein the flexible panel (10) and the rigid substrate (20) include indication holes extending through the two, and the indication holes include a first indication hole arranged in the flexible panel (10) and a second indication hole arranged in the rigid substrate (20), wherein the size of the first indication hole is smaller than that of the second indication hole; and the size of the first indication hole is determined to accommodate the indication part by interference fit.

16. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The rigid base plate (20) further includes a fastening flange (27) extending from the fourth surface (24) away from the fourth surface (24) adjacent to a circumferential side edge (28) of the rigid base plate (20).

17. The panel assembly according to any one of claims 1-6, 8, 10-13, characterized in that: The flexible panel (10) is made of a silicone material; and the flexible panel (10) and the rigid substrate (20) are manufactured in an integrated manner through insert molding.

18. An electromagnetic heating device, characterized in that: include: The panel assembly according to any one of claims 1 to 17; Electromagnetic heating assembly (30); A base (40), comprising a cavity suitable for accommodating the electromagnetic heating assembly (30) and assembled with the panel assembly; and A heat dissipation fan (60) is arranged in the cavity, wherein the heat dissipation fan (60) comprises a centrifugal fan and is arranged at a distance from the electromagnetic heating component (30) in a plane parallel to the first surface (12).

19. The electromagnetic heating device according to claim 18, characterized in that: The base (40) further comprises one or more partition plates (62, 64) extending and protruding upward from the bottom wall of the base (40), wherein the partition plates separate the wind inlet and the wind outlet of the centrifugal fan from each other.

20. An electromagnetic heating device, characterized in that: include: At least one panel assembly according to any one of claims 1 to 17, each of the panel assemblies comprising a plurality of furnace eyes (19), a heating unit being installed under each furnace eye, the heating unit comprising an electromagnetic heating assembly (30) and a base (40) suitable for accommodating the electromagnetic heating assembly (30); The panel assembly is configured to be foldable at a location (70) between two adjacent heating units.

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