Transport system and transport method

Abstract

This transport system includes: a transport module extending in a first direction; a plurality of processing modules provided along the direction in which the transport module extends; and a loader module connected to the transport module and extending along a second direction orthogonal to the first direction. The loader module includes: a main housing having a load port through which transported objects are carried into the loader module; and a sub-housing formed separately from the main housing and smaller than the main housing, connected to the main housing in the second direction, and connected to the transport module. The second direction is a direction parallel to a carrier transport line along which carriers accommodating the transported objects are transported.

Description

Transport system and transport method

[0001] The present disclosure relates to a transport system and a transport method.

[0002] Patent Document 1 discloses a transfer system (probe system) in which a carrier containing a plurality of wafers is transported by a transfer mechanism and the wafers are delivered to each of a plurality of processing modules (probe devices). This transfer system includes a loader module (transfer mechanism) for each of the processing modules. The loader module receives wafers from the carrier transported by the transfer mechanism and delivers the wafers to the processing modules, where each processing module inspects the wafers.

[0003] Japanese Patent Application Publication No. 6-69295

[0004] The present disclosure provides a technology that can efficiently transport items to multiple processing modules while improving the footprint.

[0005] According to one aspect of the present disclosure, there is provided a transport system including a transport module extending in a first direction, a plurality of processing modules connected to the transport module and arranged along the extension direction of the transport module, and a loader module connected to the transport module and extending along a second direction perpendicular to the first direction, wherein the loader module has a main housing having a load port for loading transported objects into the loader module, and a sub-housing that is separate from the main housing and smaller than the main housing, is connected to the main housing in the second direction and is connected to the transport module, and the second direction is a direction parallel to a carrier transport line that transports carriers containing the transported objects.

[0006] According to one aspect, it is possible to efficiently transport objects to a plurality of processing modules and to improve the footprint.

[0007] FIG. 1 is a plan view showing an example of a work site where a transport system according to an embodiment is installed; FIG. 2 is a plan view showing an enlarged view of a substrate inspection unit and a ceiling transport device; FIG. 3 is a plan view showing a further enlarged view of a loader module and an inspection device; FIG. 4 is a perspective view showing a main housing and a sub-housing of the loader module; FIG. 5 is a perspective view showing an enlarged view of the negative X-axis direction side of the transport module and the inspection device; FIG. 6 is a plan view illustrating a function for adjusting the length of the transport module in the extension direction; FIG. 7 is an enlarged plan view showing the connection between the divided frames; FIG. 8 is an enlarged side view showing the connection between the divided frames; FIG. 9 is a front view showing an energy management device; FIG. 10 is a side view showing the energy management device; FIG. 11 is a flowchart showing a transport method according to an embodiment.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0009] FIG. 1 is a plan view showing an example of a work site 2 in which a transfer system 1 according to an embodiment is installed. As shown in FIG. 1, the transfer system 1 is constructed in a work site 2 such as a semiconductor manufacturing facility or a semiconductor inspection facility. In the embodiment, the transfer system 1 will be described, which transfers a substrate W (see FIG. 2 ) to an inspection device 50 that inspects the substrate W. An example of a substrate W to be inspected by the inspection device 50 is a wafer (inspected wafer) on which a plurality of semiconductor devices, which are test devices (DUTs: Device Under Test), are arranged in a matrix. Note that the substrate W is not limited to a wafer, and may also be a carrier having semiconductor devices, a glass substrate, a single chip, an electronic circuit board, or the like.

[0010] The transport system 1 includes an overhead hoist transport (OHT) 10 that transports a carrier C, and a plurality of substrate inspection units 20. The carrier C is a container that can accommodate a plurality of substrates W (e.g., 25 substrates W). An example of this carrier C is a front-opening unified pod (FOUP), one side of which can be opened and closed. The overhead transport device 10 transports the carrier C, which may contain a plurality of substrates W or be empty.

[0011] The ceiling conveying device 10 includes a rail 11 fixed to the ceiling of the work site 2, and a hoist mechanism (not shown) that runs along the rail 11 while holding the carrier C and can move the carrier C up and down. For example, the hoist mechanism has the function of holding the carrier C in a suspended state and raising and lowering the carrier C using a belt. The ceiling conveying device 10 also includes a control device 19 that controls the operation of the ceiling conveying device 10, which is located at an appropriate position in the work site 2.

[0012] 1, for ease of understanding, the rails 11 are shown at a position separated from each substrate inspection unit 20, but the rails 11 are basically installed so as to pass above the loader module 30 of each substrate inspection unit 20 (see also FIG. 2). The hoist mechanism that moves along the rails 11 moves directly above the loader module 30 of the target substrate inspection unit 20 and lowers the carrier C, thereby automatically setting the carrier C in the loader module 30. Conversely, the hoist mechanism moves directly above the carrier C of the loader module 30 and holds and lifts the carrier C, thereby removing the carrier C from the substrate inspection unit 20.

[0013] For example, the rails 11 form a carrier transport line that extends longitudinally at the center of the short side of the work area 2, turns back at one end of the longitudinal direction, and then extends longitudinally again at the center of the short side of the work area 2. In Fig. 1, the longitudinal direction of the work area 2 refers to the horizontal direction on the paper, and the short side of the work area 2 refers to the vertical direction on the paper. By consolidating the rails 11 at the center of the short side in this way, the ceiling transport device 10 can efficiently transport the carriers C to all of the board inspection units 20 in the work area 2 while shortening the travel distance of the multiple carriers C.

[0014] The rail 11 may be endless so that multiple hoist mechanisms can be looped around it. The ceiling conveying device 10 may have a carrier exchange unit (not shown) at the other longitudinal end of the endless rail 11 for recovering or exchanging the carrier C. The ceiling conveying device 10 may have a point rail that branches off midway along the rail 11, and the carrier exchange unit may be provided on the point rail.

[0015] The control device 19 of the ceiling transport device 10 is a computer including a processor, memory, input / output interface, communication interface, etc. (not shown). The processor is one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a circuit made up of multiple discrete semiconductors, etc., and executes and processes programs stored in memory. The memory includes a main storage device made up of semiconductor memory, etc., and an auxiliary storage device made up of disks, drives, semiconductor memory (flash memory), etc.

[0016] The control device 19 moves the hoist mechanism to a target position on the rails 11 and controls the raising and lowering, holding, and release of the carriers C. The control device 19 also controls the carrier exchange unit to recover, exchange, and the like the carriers C, and manages the state of each substrate W in the carriers C. The control device 19 may be installed alongside a management computer that manages the entire transport system 1 (workplace 2).

[0017] Meanwhile, each board inspection unit 20 of the conveyance system 1 is installed so as to extend in a direction perpendicular to the extension direction of the rail 11 installed at the center in the short side direction. In other words, the longitudinal direction of each board inspection unit 20 extends from the center in the short side direction of the work area 2 toward the end in the short side direction (the side of the work area 2). In the work area 2, each board inspection unit 20 is arranged in pairs with the central rail 11 in between, and each board inspection unit 20 is installed side by side with a gap in between in the extension direction of the rail 11 (the long side direction of the work area 2).

[0018] Each substrate inspection unit 20 is constructed by combining a plurality of modules into a unit that efficiently transports each substrate W in a carrier C and performs inspection of the substrate W. Specifically, each substrate inspection unit 20 includes a loader module 30, a transport module 40 connected to the loader module 30, and a plurality of inspection devices 50 connected to the transport module 40. Each substrate inspection unit 20 removes a substrate W from a carrier C that has been transported to the loader module 30 by the ceiling transport device 10, transports the substrate W to the target inspection device 50 via the transport module 40, and inspects the substrate W in the inspection device 50.

[0019] FIG. 2 is an enlarged plan view showing the substrate inspection unit 20 and the ceiling transport device 10. Next, an example of the substrate inspection unit 20 will be described with reference to FIG. 2. In the description of the substrate inspection unit 20, the positions and directions of each component will be described based on the directions of the arrows in FIG. 2. The X-axis direction in FIG. 2 is the horizontal direction of the paper and is the direction along the extension direction of the transport module 40. The Y-axis direction in FIG. 2 is the vertical direction of the paper and is the direction along the extension direction of the loader module 30. The Z-axis direction in FIG. 2 is the front and rear direction of the paper and is the height direction of the substrate inspection unit 20.

[0020] The loader module 30 of the substrate inspection unit 20 is provided vertically below the rails 11 of the ceiling transport device 10. The longitudinal direction of the loader module 30 is along the Y-axis direction. In other words, the loader module 30 is installed so that the longitudinal direction of the loader module 30 coincides with the rails 11 extending in the Y-axis direction.

[0021] Fig. 3 is a further enlarged plan view showing the loader module 30 and the inspection device 50. Fig. 4 is a perspective view showing the main housing 35 and sub-housing 36 of the loader module 30. As shown in Figs. 3 and 4, the loader module 30 has a plurality of load ports 31 (four in Fig. 2) arranged side by side along the Y-axis direction, each capable of mounting a plurality of carriers C.

[0022] The load port 31 of the loader module 30 receives the carrier C from the hoist mechanism of the ceiling transport device 10 and hands over the carrier C to the hoist mechanism. The carrier C placed on the load port 31 is fixed by an engagement mechanism (not shown) of the load port 31. When the shutter 32 of the load port 31 is opened, the surface of the carrier C facing the positive X-axis direction is opened, allowing the carrier C to load and unload the substrate W.

[0023] The loader module 30 includes therein a loader-side transport device 33 for removing substrates W from the carriers C of each load port 31 and transporting them to the transport module 40. This loader-side transport device 33 is not particularly limited, but may include, for example, a base 331 that is movable in the longitudinal direction of the loader module 30, a plurality of arms 332 that are rotatable, extendable, and movable up and down relative to the base 331, and a fork (end effector) 333 provided on the distal arm 332. Note that, although Fig. 3 illustrates the loader-side transport device 33 having two forks 333, the present invention is not limited thereto, and the loader-side transport device 33 may have one or three or more forks 333.

[0024] A passage 30s is provided inside the loader module 30, allowing the loader-side transport device 33 to move in the Y-axis direction. The loader module 30 may be configured to downflow clean air into the passage 30s. An aligner device 34 may also be provided inside the loader module 30, which detects the position and circumferential orientation (posture) of the substrate W and adjusts the positional deviation and posture of the substrate W in cooperation with the loader-side transport device 33. The loader module 30 in FIG. 3 has the aligner device 34 installed on the positive Y-axis side connected to the transport module 40 and the negative X-axis side.

[0025] The loader module 30 is configured to include a main housing 35 having each load port 31, and a sub-housing 36 formed separately from the main housing 35 and acting as an intermediary between the main housing 35 and the transfer module 40. The main housing 35 and the sub-housing 36 are installed so as to be aligned in the Y-axis direction. For example, the sub-housing 36 is connected to one end of the main housing 35 in the longitudinal direction (positive direction of the Y-axis). Note that the loader module 30 may be configured such that the internal frames of the main housing 35 and the sub-housing 36 are formed separately, while the covers that cover the internal frames are integrally continuous.

[0026] The main housing 35 is formed by assembling multiple frames (not shown) into a box-like shape that is rectangular when viewed in the X-axis direction and L-shaped when viewed in the Y-axis direction. The main housing 35 has the load ports 31 on the upper surface of the stepped portion of the L-shape. A door 35d is provided on the side surface of the main housing 35 in the negative Y-axis direction, allowing access to the passage 30s inside the main housing 35 for maintenance and the like. The door 35d is a single-leaf door that opens and closes the opening of the main housing 35 with a single door panel. During maintenance and the like, an operator can easily access the loader-side transport device 33 by opening the door 35d.

[0027] The sub-housing 36 is formed by assembling a plurality of frames (not shown) into a rectangular shape that is long in the X-axis direction and short in the Y-axis direction in plan view, and is formed into a rectangular parallelepiped having a predetermined height in the Z-axis direction. The sub-housing 36 is formed smaller than the main housing 35. In the loader module 30 according to the embodiment, the length of the sub-housing 36 in the longitudinal direction (X-axis direction) and the width of the main housing 35 in the lateral direction (X-axis direction) are made to match each other. Furthermore, the width of the sub-housing 36 in the Y-axis direction is set to match the width of the transport module 40 (or to be greater than or equal to the width of the transport module 40).

[0028] The aligner device 34 is provided inside the sub-housing 36. A door 36d is provided on the side surface of the sub-housing 36 facing the positive direction of the Y axis, allowing the interior of the sub-housing 36 to be exposed for maintenance and other purposes. The door 36d is a double-hinged door that opens and closes the opening of the sub-housing 36. Specifically, the door 36d has a first door panel 36d1 located on the negative side of the X axis and a second door panel 36d2 located on the positive side of the X axis. The first door panel 36d1 is pivotally supported by a hinge on the edge on the negative side of the X axis, thereby opening and closing the opening by rotation. The second door panel 36d2 is pivotally supported by a hinge on the edge on the positive side of the X axis, thereby opening and closing the opening by rotation. A locking mechanism is provided at the boundary between the first door panel 36d1 and the second door panel 36d2, allowing the opening and closing of the opening to be switched between the closed and open positions.

[0029] 3 and 4, the width of the second door panel 36d2 (the length along the X-axis direction in the closed state) is shorter than the width of the first door panel 36d1 (the length along the X-axis direction in the closed state). In other words, the first door panel 36d1 can widen the opening of the sub-housing 36, while the second door panel 36d2 can narrow the opening of the sub-housing 36. This prevents the second door panel 36d2 from protruding outward significantly when open, ensuring that interference with the tester movement mechanism 54 (described below) is avoided. The door 36d is not limited to the double-swing door described above, and may be a folding door or the like.

[0030] A controller 90 is installed inside the sub-housing 36 to control the operation of each component of the board inspection unit 20. For example, the board inspection unit 20 has the controller 90 located adjacent to the door 36d (on the positive Y-axis side of the sub-housing 36), which allows an operator to easily access the controller 90 when the door 36d is opened.

[0031] Furthermore, the sub-housing 36 is provided with a user-operable control panel 37 on its side surface in the positive Y-axis direction. By installing the control panel 37 on the side surface in the positive Y-axis direction, the opportunity for an operator to work on the negative X-axis side where the load ports 31 are located can be reduced, and contact between the operator and the carrier C being transported by the ceiling transport device 10 can be reduced.

[0032] The main housing 35 and the sub-housing 36 each have a passage 30s for the loader-side transport device 33. The main housing 35 has an opening 35o on its side surface facing the positive Y-axis direction that communicates with the passage 30s. The sub-housing 36 has an opening 36o on its side surface facing the negative Y-axis direction that communicates with the passage 30s. The loader module 30 allows the loader-side transport device 33 to move between the housings by connecting the opening 35o of the main housing 35 and the opening 36o of the sub-housing 36 so that they communicate with each other.

[0033] In the loader module 30 described above, the main housing 35, one of the two housings, is versatile enough to be applicable to various board inspection units 20. In other words, the same main housing 35 can be applied even if the type of board inspection unit 20 changes. In contrast, the sub-housing 36, one of the two housings, of the loader module 30 is customizable so that the configuration and shape can be changed according to the needs of each customer. For example, if a customer does not need an aligner device 34, the sub-housing 36 can be changed to one that does not have the aligner device 34. In this way, by making the main housing 35 of the same standard while allowing the sub-housing 36 to be customized, the loader module 30 can meet the needs of various customers without having to change the specifications of the entire module.

[0034] The transport module 40 is connected to the side surface of the sub-housing 36 of the loader module 30 on the positive X-axis direction side, and extends linearly along the X-axis direction. In other words, the longitudinal extension direction of the transport module 40 is perpendicular to the longitudinal extension direction of the loader module 30. As shown in FIG. 2 , multiple (three) inspection devices 50 are connected to both sides of the extension direction of the transport module 40 (i.e., the side surface on the positive Y-axis direction and the side surface on the negative Y-axis direction). Each inspection device 50 is connected perpendicular to the extension direction of the transport module 40 (at a 90° angle). However, each inspection device 50 may also be connected to the transport module 40 at an angle of, for example, 45° to 90°.

[0035] The transport module 40 receives and transfers the substrate W between the loader module 30, transports the substrate W to a target inspection device 50 among the multiple inspection devices 50, and receives and transfers the substrate W to and from the stage 52 of the target inspection device 50.

[0036] Specifically, the transport module 40 includes a transport housing 41 extending in the X-axis direction, a buffer section 42 provided on the negative X-axis side of the transport housing 41, and a transport device 43 that reciprocates along the X-axis direction within the transport housing 41. The transport module 40 may be a vacuum transport module that transports the substrate W with the transport space 41s of the transport housing 41 depressurized to a vacuum atmosphere.

[0037] 5 is an enlarged perspective view showing the negative X-axis direction side of the transport module 40 and the inspection device 50. As shown in Fig. 5, the framework of the transport housing 41 is formed by assembling a base plate 411 and a plurality of frames 412. The transport housing 41 defines an enclosed transport space 41s by attaching panels (not shown) to the base plate 411 and the plurality of frames 412.

[0038] The base plate 411 of the transport housing 41 is fixed to the floor of the work site 2 via a plurality of legs 413. Each of the plurality of legs 413 has a level adjuster (not shown) that can adjust the height in the Z-axis direction. When the transport module 40 is installed, the level adjusters are adjusted so that the top surface of the base plate 411 is horizontal.

[0039] A slide mechanism 44 of the transport device 43 is provided on the base plate 411 of the transport housing 41. The slide mechanism 44 includes a pair of rails 441 extending in the X-axis direction, an endless belt 442 extending along the sides of the rails 441, a drive source 443 for rotating the belt 442, and a movable body 444 that moves in accordance with the movement of the belt 442. The movable body 444 bridges the pair of rails 441, and the transport device 43 is installed on its upper surface, thereby serving as a base that supports the transport device 43. The drive source 443 is connected to the controller 90 of the substrate inspection unit 20, and its drive is controlled by the controller 90 to rotate the belt 442 and move the movable body 444 back and forth along the extension direction of the pair of rails 441. Note that the transport device 43 is not limited to the slide mechanism 44 including the belt 442 and the drive source 443, and various mechanisms may be employed. As an example, the slide mechanism 44 may have a configuration in which the movable body 444 is slid by a linear motor.

[0040] Fig. 6A is a plan view illustrating the function of adjusting the length of the transport module 40 in the extension direction. Fig. 6B is an enlarged plan view showing the connection between the divided frames 415. Fig. 6C is an enlarged side view showing the connection between the divided frames 415. As shown in Fig. 6A, the transport module 40 according to the embodiment is configured to be expandable in the extension direction (X-axis direction).

[0041] Specifically, the transport housing 41 has base plates 411 and frames 412 (see FIG. 5 ) each having a split frame 415 corresponding to the number of installed inspection devices 50, and by connecting multiple split frames 415, a continuous series is formed. The belt 442 of the slide mechanism 44 can be replaced with one that matches the movement range of the transport device 43 (the number of split frames 415), allowing the transport device 43 to move over substantially the entire length in the X-axis direction. The pair of rails 441 are attached in advance to set positions on the base plates 411 of the split frames 415, for example, so that they are aligned linearly with the pair of rails 441 of the adjacent split frames 415. The rails 441 of one split frame 415 are connected to the rails 441 of the other split frame 415, for example, by a connecting rail 454.

[0042] Adjacent divided frames 415 are connected by an appropriate connecting structure 45. As shown in FIG. 6B , for example, one divided frame 415 is provided with a V-block 451, while the other divided frame 415 is provided with a pin 452 that is inserted into the V-block 451. In this case, the one divided frame 415 and the other divided frame 415 can be easily positioned by inserting the pin 452 into the V-shaped space in the V-block 451. The height of each divided frame 415 (base plate 411 and frame 412) can be adjusted using the level adjusters of the legs 413 described above.

[0043] 6C , the connecting structure 45 is provided with connecting plates 453 to eliminate joints between the base plates 411 supporting the pair of rails 441. The connecting structure 45 may be configured to connect each rail 441 and the connecting rail 454 in series by fixing the connecting plates 453 to the base plates 411 using the connecting plates 453 to which the above-described connecting rails 454 are attached in advance.

[0044] 5, the buffer section 42 provided in the transport housing 41 is arranged at an appropriate height position by a platform 421 placed on the base plate 411. The buffer section 42 temporarily stores the substrates W transported by the loader-side transport device 33 of the loader module 30 and transfers them to the transport device 43. The buffer section 42 also temporarily stores the substrates W transported by the transport device 43 and transfers them to the loader-side transport device 33. The buffer section 42 may have a load lock function that can switch the internal space between an air atmosphere and a vacuum atmosphere.

[0045] A gate valve 46 that opens and closes the mouth of the buffer section 42 is provided on a side surface on the negative X-axis direction side of the buffer section 42. The gate valve may be provided on a side surface on the positive X-axis direction side. The substrate inspection unit 20 allows the substrate W to be transported between the loader module 30 and the buffer section 42 by opening the gate valve 46 on the negative X-axis direction side, and allows the pressure inside the transport module 40 including the buffer section 42 to be reduced by closing each gate valve 46. Furthermore, the substrate inspection unit 20 allows the substrate W to be transported between the transport device 43 and the buffer section 42 by opening the gate valve on the positive X-axis direction side.

[0046] The transport device 43 of the transport module 40 loads and unloads the substrate W between the buffer section 42. The transport device 43 moves in the X-axis direction by the movable body 444 of the slide mechanism 44, and moves to a position facing a target inspection device 50 among the multiple inspection devices 50 connected to the transport module 40. The transport device 43 advances into the opposing inspection device 50, and loads and unloads the substrate W between the inspection device 50.

[0047] The transport device 43 is not particularly limited, but may include an end effector 431 that holds the substrate W and a moving unit 432 that moves the end effector 431. As an example, the moving unit 432 includes an extendable arm (not shown) and a shaft (not shown) that can rotate around an axis with the base end of the arm as a base point. The moving unit 432 also includes an elevating mechanism 433 that can move up and down in the Z-axis direction, and is configured to adjust the height position of the end effector 431. The moving unit 432 of the transport device 43 rotates the arm and the end effector 431 within a range of 180° or more. This allows the transport device 43 to advance the end effector 431 toward each of the inspection devices 50 connected to both side surfaces of the transport module 40.

[0048] The transport device 43 may also include a container 47 that travels integrally on a pair of rails 441 and temporarily stores substrates W. For example, the container 47 is mounted on the movable body 444 of the slide mechanism 44, and is arranged on the X-axis positive side of the moving part 432. The container 47 has one or more openings 471 that can load and unload substrates W on its side surface facing the X-axis negative side, facing the moving part 432. The transport device 43 rotates and raises and lowers the moving part 432 so that the end effector 431 faces the openings 471, and then extends and retracts the arm to load and unload substrates W into and from the container 47 via the openings 471.

[0049] The container 47 may also include an internal posture adjustment device (aligner device: not shown) that cooperates with the transport device 43 to adjust the position and posture of the accommodated substrate W. By providing the posture adjustment device adjacent to the transport device 43 in this manner, when a positional deviation or the like occurs in the substrate W, it is possible to reduce the time loss that would occur if the transport device 43 were to move and the aligner device 34 were to readjust the positional deviation of the substrate W. Alternatively, the substrate inspection unit 20 may not include the aligner device 34 of the loader module 30.

[0050] The container 47 may be configured to move integrally with the transport device 43, or may be installed at an appropriate position on the transport module 40. For example, the transport module 40 may be provided with the container 47 at the end on the positive side of the X-axis (the end opposite the loader module 30).

[0051] 2, the transport module 40 is provided with a plurality of detection sensors 48 so that the transport device 43 can recognize its position in the X-axis direction. The plurality of detection sensors 48 are installed, for example, at positions where the transport device 43 can transport the substrate W to each of the plurality of inspection devices 50. However, the positions of the detection sensors 48 are not limited to this, and for example, the detection sensors 48 may be installed at equal intervals along the X-axis direction. Furthermore, the number of detection sensors 48 is not limited to a plurality, and only one detection sensor 48 may be installed on the path of the transport device 43. This is because the position of the transport device 43 in the X-axis direction can be calibrated by using a single detection sensor 48 to detect the position of the transport device 43.

[0052] Each detection sensor 48 may be fixed to the ceiling, sidewall, floor, or the like of the transport housing 41. An optical sensor capable of optically detecting the presence or absence of the transport device 43 may be used as this detection sensor 48. For example, the detection sensor 48 has a light-emitting unit that irradiates inspection light and a light-receiving unit that receives reflected light of the inspection light, and outputs information on the presence or absence of the transport device 43 by detecting a detection surface (not shown) installed on the transport device 43. Note that the type of detection sensor 48 is not particularly limited as long as it can detect the position of the transport device 43, and may be a distance sensor or a contact sensor.

[0053] The controller 90 holds information on positions in the X-axis direction (X-axis coordinate) corresponding to the installation positions of the multiple detection sensors 48. The controller 90 recognizes the X-axis coordinate of the transport device 43 moving inside the transport casing 41 based on the timing at which the detection sensors 48 obtain information indicating the presence of the transport device 43 and the X-axis coordinate information it holds. Based on this recognition of the position of the transport device 43, the controller 90 can accurately control the position of the transport device 43 during its movement.

[0054] As shown in Fig. 5, an inspection device 50 connected to the above-described transfer module 40 inspects the electrical characteristics of the substrate W transferred by the transfer module 40. This inspection device 50 has an inspection device housing 51 (only the frame is shown in Fig. 5) and a stage 52 that supports the substrate W inside the inspection device housing 51. The stage 52 has a movement mechanism (not shown) that moves the substrate W to a target three-dimensional coordinate position.

[0055] 2 , the inspection device 50 has a tester 53 that holds a probe card (not shown) having a plurality of probes that contact the substrate W and inspects the substrate W, above an inspection device housing 51. The inspection device 50 also has a tester moving mechanism 54 that holds the tester 53 and moves the tester 53 between a test position (see dashed line in FIG. 2 ) and a retracted position (see two-dot chain line in FIG. 2 ). A support table 55 that supports the tester 53 is provided at the retracted position. The inspection device 50 also has various components, such as a chiller (not shown) that adjusts the temperature of the substrate W during inspection, and a suction mechanism (not shown) that reduces the pressure inside the inspection device housing 51, installed around the inspection device housing 51 and the tester moving mechanism 54.

[0056] The inspection device 50 is connected to the transport module 40 in an orthogonal direction (at a 90° angle) via a connection buffer 60. The connection buffer 60 positions the inspection device casing 51 away from the transport casing 41, allowing the tester movement mechanism 54 and other components to be installed without interfering with the transport casing 41. As shown in FIG. 5 , the connection buffer 60 is formed by assembling multiple frames 61 and panels (not shown). The connection buffer 60 is formed in a rectangular parallelepiped shape that is smaller than the moving part 432 of the transport device 43 of the transport module 40, allowing the moving part 432 to enter. Although not shown, a gate valve for closing the inspection device casing 51 may be provided inside the connection buffer 60.

[0057] The length of the divided frames 415 of the transport module 40 is set according to the overall size of the inspection device 50, including the inspection device housing 51 and the tester moving mechanism 54 connected to the connection buffer section 60. Therefore, the transport module 40 can install the inspection devices 50 at equal intervals by connecting the divided frames 415 along the X-axis direction.

[0058] Furthermore, the loader module 30, the transport module 40, and each inspection device 50 of the substrate inspection unit 20 require required energy such as electric power, gas supply (positive pressure), and gas suction (negative pressure) when transporting and inspecting the substrate W. Electric power is used for purposes such as operating various components of the substrate inspection unit 20 and supplying power and signals to the substrate W during inspection. Gas suction is used for purposes such as fixing the substrate W. Gas supply is used for purposes such as cleaning the loader module 30 and adjusting the pressure within the space. For this reason, the substrate inspection unit 20 has respective sources of power, gas suction, and gas supply, and is also equipped with an energy management device 70, as shown in FIG. 2 , for collectively managing (distributing, providing, cutting off, etc.) the various required energies. In other words, each generation source and each component of the substrate inspection unit 20 are connected via a path that first passes through the energy management device 70.

[0059] For example, one energy management device 70 is provided for each of the plurality of board inspection units 20, and is installed near the outside of the area where the plurality of inspection devices 50 are lined up (see also FIG. 1 ). However, the system in work area 2 may be configured such that one energy management device 70 manages the energy requirements of a plurality of (e.g., two) board inspection units 20. The installation location of the energy management device 70 is not particularly limited, and it may be installed, for example, on the loader module 30 side.

[0060] Fig. 7A is a front view showing an example of the energy management device 70. Fig. 7B is a side view showing an example of the energy management device 70. Note that Figs. 7A and 7B show a state in which an openable / closable door of the device is removed for ease of explanation. The energy management device 70 includes a management device housing 71 and an operation panel 72 that is provided in the management device housing 71 and can be accessed by an operator when the door is open.

[0061] The management device housing 71 is formed into a rectangular parallelepiped that is long in the Z-axis direction (vertical direction) by assembling multiple frames and multiple panels. The bottom of the management device housing 71 is provided with multiple casters 71a that facilitate movement of the management device housing 71 and multiple fixtures 71b that secure the management device housing 71 to the installation location. The management device housing 71 accommodates some of the cables and piping connected to the source of the required energy, as well as some of the cables and piping connected to each of the multiple inspection devices 50. The management device housing 71 also has openable doors (not shown) on the front and side. The doors of the energy management device 70 are closed during operation and are opened by an operator during installation, maintenance, etc.

[0062] The control panel 72 is equipped with various devices operated by an operator. The control panel 72 exposes the various devices when the front door of the management device housing 71 is open. The control panel 72 is fixed near the front of the management device housing 71 so that the operator can easily access it when the front door is open (see FIG. 7B ). The control panel 72 includes a power distribution panel 73 that distributes power, a gas supply distribution panel 74 that distributes the gas to be supplied, and a gas suction distribution panel 75 that distributes suction force. The position of the control panel 72 is not limited to the front of the management device housing 71, but may also be on the back, or on both the front and back.

[0063] The switchboard 73 is provided, for example, at approximately the vertical center of the management device housing 71. The switchboard 73 is connected to a power source (power supply) via a main cable 76, and is also connected to each component of the board inspection unit 20 via a plurality of distribution cables. In addition, power circuit breakers such as breakers provided on the main cable 76 and each distribution cable are provided on the front of the switchboard 73. The main cable 76 and each distribution cable housed in the management device housing 71 are routed through a vertical partition wall 711 that separates the operation panel 72 into spaces to the side of the operation panel 72. This allows the energy management device 70 to reduce interference between each cable and gas piping.

[0064] The gas supply distribution panel 74 is provided, for example, at a position adjacent to the lower side of the switchboard 73. The gas supply distribution panel 74 is connected to a gas generation source (such as a supply pump) via one primary side pipe 741, and is also connected to each component of the substrate inspection unit 20 via multiple secondary side pipes 742. In addition, on the front side of the gas supply distribution panel 74, there are provided a valve 743 that opens and closes the flow paths of the primary side pipe 741 and each secondary side pipe 742, a connector (not shown) for connecting each secondary side pipe 742, and the like. The primary side pipe 741 and each secondary side pipe 742 extend to the outside through the bottom of the management device housing 71.

[0065] The gas suction distribution panel 75 is provided, for example, at a position adjacent to the lower side of the gas supply distribution panel 74. The gas suction distribution panel 75 is connected to a suction source (such as a suction pump) via one primary side pipe 751, and is connected to each component of the substrate inspection unit 20 via multiple secondary side pipes 752. In addition, on the front side of the gas suction distribution panel 75, there are provided a valve 753 for opening and closing the flow paths of the primary side pipe 751 and each secondary side pipe 752, a connector (not shown) for connecting each secondary side pipe 752, and the like. The primary side pipe 751 and each secondary side pipe 752 extend to the outside through the bottom of the management device housing 71.

[0066] The energy management device 70 described above can centrally manage required energy (electricity, gas supply, and gas suction). For example, before installing the device main body, an operator can connect each cable and each pipe by accessing the operation panel 72 once. This reduces the number of work steps and shortens the construction period for starting operation of the device. The energy management device 70 also makes it possible to manage the cutoff and supply paths of dangerous energy such as electricity and gas from a single location. Furthermore, the energy management device 70 can shut off only a module when an abnormality occurs in that module, thereby avoiding a decrease in operation rate due to maintenance or troubleshooting.

[0067] 3, the controller 90 installed in the loader module 30 is configured as a computer having a processor, memory, input / output interface, and communication interface (not shown). The controller 90 is connected to the control panel 37, which is a user interface, via the input / output interface.

[0068] The control panel 37 has input devices operated by the user, such as a touch panel, buttons, a keyboard, etc. The control panel 37 also has output devices, such as a monitor including a touch panel, a speaker, and a lamp.

[0069] The controller 90 transports the substrate W within the substrate inspection unit 20 by controlling each component of the loader module 30 and the transport module 40 based on the contents input by the operator via the control panel 37. The controller 90 also issues commands to the inspection device 50 that transported the substrate W, thereby causing the inspection device 50 to inspect the substrate W.

[0070] The transport system 1 according to the embodiment is basically configured as described above, and its operation (transport method) will be described below with reference to Fig. 8. Fig. 8 is a flowchart showing the transport method according to the embodiment.

[0071] The conveyance system 1 executes the process flow of steps S101 to S110 shown in FIG. 8 based on the control of the control device 19 of the ceiling conveyance device 10 and the controller 90 of the substrate inspection unit 20.

[0072] Specifically, the control device 19 of the ceiling transport device 10 transports the carrier C using the hoist mechanism and sets the carrier C on the load port 31 of the target substrate inspection unit 20 (loader module 30) (step S101). For example, the control device 19 stores in advance the coordinate positions of each load port 31 of each substrate inspection unit 20, reads the coordinate position of the target load port 31, controls the movement of the hoist mechanism, and moves the carrier C directly above the load port 31. The control device 19 then lowers the carrier C using the hoist mechanism to place the carrier C on the target load port 31, and releases the carrier C from its hold. Furthermore, the controller 90 of the substrate inspection unit 20 acquires information from the load port 31 (or the control device 19) on which the carrier C is set that the carrier C has been set, and then proceeds to transporting the substrate W within the substrate inspection unit 20.

[0073] Specifically, the controller 90 controls the loader-side transport device 33 of the loader module 30 to remove the substrate W from the carrier C and load it into the main housing 35 (step S102). Furthermore, the controller 90 moves the loader-side transport device 33 to the sub-housing 36 and transports the held substrate W to the aligner device 34 (step S103). Then, the controller 90 controls the aligner device 34 and the loader-side transport device 33 to adjust the positional deviation and attitude of the substrate W (step S104).

[0074] Thereafter, the controller 90 causes the loader-side transport device 33 to take out the substrate W from the aligner device 34 and transport the substrate W to the buffer section 42 of the transport module 40 (step S105). Therefore, the buffer section 42 contains the substrate W whose positional deviation and attitude have been adjusted.

[0075] Next, the controller 90 controls the transport device 43 and the slide mechanism 44 of the transport module 40 to unload the substrate W from the buffer unit 42 and transport the substrate W to a position facing the target inspection device 50 (step S106). During the movement of the transport device 43, the detection sensors 48 aligned in the X-axis direction detect the presence or absence of the transport device 43 and transmit the detection information to the controller 90. The controller 90 can accurately recognize the position of the transport device 43 based on the detection information of the detection sensors 48, thereby appropriately controlling the movement of the transport device 43.

[0076] Then, at the position opposite the inspection device 50, the controller 90 causes the transport device 43 to advance the substrate W into the interior of the inspection device housing 51, and places the substrate W on the stage 52 of the inspection device 50 (step S107).

[0077] After the substrate W is placed, the controller 90 operates the tester 53 of the inspection device 50 to inspect the substrate W by the tester 53 (step S108).

[0078] After the inspection of the substrate W, the controller 90 again causes the end effector 431 of the transport device 43 to enter and receive the substrate W from the stage 52, and then unloads the substrate W from the inspection device 50 (step S109). Then, the controller 90 moves the transport device 43 to transport the substrate W to the buffer section 42, and operates the loader-side transport device 33 to receive the substrate W from the buffer section 42 and load the substrate W into an appropriate carrier C (step S110). This completes the inspection of the substrate W by the substrate inspection unit 20.

[0079] The substrate inspection unit 20 transports each of the multiple substrates W accommodated in the carrier C to each inspection device 50 for repeated inspection, thereby storing the inspected substrates W in the carrier C. Then, the control device 19 of the ceiling transport device 10 controls the hoist mechanism to hold the carrier C accommodating the multiple inspected substrates W, and raises (detaches) the carrier C from the substrate inspection unit 20 and transports it along the rails 11.

[0080] In the above-described conveyance system 1, the loader module 30 of the substrate inspection unit 20 is arranged along the extension direction of the rail 11, thereby enabling the carrier C to be smoothly set in the load port 31 at the target position. In particular, by adopting the same standard for the main housing 35 of the loader module 30, it is possible to reduce changes to the configuration of the ceiling conveyance device 10 and stabilize the conveyance of the carrier C. On the other hand, the sub-housing 36 of the loader module 30 is customizable, making it easy to meet customer needs.

[0081] The transport system 1 and transport method of the present disclosure are not limited to the above-described embodiment and may take various forms. For example, in the embodiment, the transport system 1 is described as being provided with a substrate inspection unit 20 having a plurality of inspection apparatuses 50, which are processing modules. However, the present disclosure is not limited to this. The transport system 1 may also employ substrate processing units having substrate processing apparatuses in place of some or all of the substrate inspection units 20. Examples of substrate processing apparatuses include processing modules that perform substrate processing such as film formation, etching, cleaning, bonding, and peeling on substrates W. Furthermore, the substrate processing apparatus may be an apparatus that processes substrates W in a process after the substrate W is manufactured, such as a repair apparatus, marking apparatus, reflow apparatus, or visual inspection apparatus. In other words, the transport system 1 may be configured to transport substrates W to processing modules that perform various actions on the substrates W during the manufacturing process of the substrates W.

[0082] Furthermore, the transported object transported by the transport system is not limited to the substrate W, but may be, for example, a probe card, a polishing plate, etc. Furthermore, the transported object may be a consumable part applied to a processing module. An example of such a consumable part is a ring (focus ring, edge ring, etc.) arranged around the substrate W in the processing module.

[0083] Furthermore, the device that transports the carrier C is not limited to the ceiling transport device 10 that transports directly above the loader module 30, but may be a device that slides at a position horizontally adjacent to the loader module 30. Furthermore, the transport module 40 is not limited to being connected to the X-axis positive side of the sub-housing 36, but may also be connected to the Y-axis positive side of the sub-housing 36, for example.

[0084] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0085] A first aspect of the present disclosure includes a transport module 40 extending in a first direction, a plurality of processing modules (inspection devices 50) connected to the transport module 40 and arranged along the extension direction of the transport module 40, and a loader module 30 connected to the transport module 40 and extending along a second direction perpendicular to the first direction, wherein the loader module 30 has a main housing 35 having a load port 31 for loading a substrate W into the loader module 30, and a sub-housing 36 that is separate from the main housing 35 and smaller than the main housing 35, is connected to the main housing 35 in the second direction, and is connected to the transport module 40, and the second direction is a direction parallel to a carrier transport line (rail 11) that transports a carrier C containing a substrate W.

[0086] As described above, the transfer system 1 can efficiently transport substrates W to multiple processing modules (inspection devices 50). Specifically, the transfer system 1 can stably transport the carrier C containing the substrate W to the load port 31 of the main housing 35 of the loader module 30. The substrate W can then be transported to the transfer module 40 via the sub-housing 36 connected to the main housing 35 in the second direction, allowing the substrate W to be smoothly directed to the target processing module. In particular, the transfer system 1 eliminates the need to install a mechanism for transferring substrates W from the carrier C to each of multiple processing modules, thereby improving the footprint of the entire system. Furthermore, by having the sub-housing 36 smaller than the main housing 35, the transfer system 1 can easily customize the loader module 30 within a small range, making it easier to apply to various systems.

[0087] Furthermore, the carrier transport line (rails 11) extends along the second direction, and a plurality of units (substrate inspection units 20) each having a transport module 40, a plurality of processing modules (inspection devices 50), and a loader module 30 are provided at positions on both sides of the carrier transport line. This allows the transport system 1 to shorten the transport distance of the carriers C, enabling more efficient transport of the carriers C to the units.

[0088] The sub-housing 36 also includes an aligner device 34 therein that adjusts the positional deviation or posture of the substrate W. This allows the transport system 1 to transport the substrate W, the positional deviation or posture of which has been adjusted in the sub-housing 36, to the transport module 40.

[0089] The sub-casing 36 also has a control panel 37 that can be operated by an operator, on the opposite side of the connection point with the main casing 35. This allows the transport system 1 to reduce the opportunities for operators to move toward the load port 31, thereby reducing contact between the carrier C and the operator.

[0090] Furthermore, the sub-housing 36 has a door 36d that can expose the inside of the sub-housing 36 on the side opposite to the connection point with the main housing 35. This allows the transport system 1 to easily access the inside of the loader module 30, allowing maintenance and the like to be performed efficiently.

[0091] Furthermore, the plurality of processing modules (inspection devices 50) are connected to both side surfaces of the transfer module 40 in the second direction, respectively. This allows the transfer system 1 to install many processing modules relative to the transfer module 40, further improving the footprint.

[0092] Furthermore, the plurality of processing modules (inspection devices 50) provided on both side surfaces in the second direction are connected to the transport module 40 while being shifted from each other in the first direction. This allows the inspection device 50 to further improve its footprint in the first direction compared to when the inspection devices 50 are installed facing both side surfaces of the transport module 40, even when the tester 53 and the tester moving mechanism 54 that moves the tester 53 between the test position and the retracted position are aligned in the first direction.

[0093] Furthermore, the plurality of processing modules are inspection devices 50 that inspect the substrates W, which are transported objects. This allows the transport system 1 to efficiently inspect the substrates W using the inspection devices 50.

[0094] A second aspect of the present disclosure is a transport method for a transport system 1 including a transport module 40 extending in a first direction, a plurality of processing modules (inspection devices 50) connected to the transport module 40 and arranged along the extension direction of the transport module 40, and a loader module 30 connected to the transport module 40 and extending along a second direction perpendicular to the first direction, the method comprising: (A) transporting a carrier C containing a substrate W along a direction parallel to the second direction by a carrier transport line (rail 11) to load a substrate W from a main housing of the loader module 30; (B) after the step (A), removing the substrate W from the carrier C on the load port 31 and transporting the substrate W to a sub-housing 36 that is separate from and smaller than the main housing 35, is connected to the main housing 35 in the second direction, and is connected to the transport module 40, thereby loading the substrate W into the transport module 40; and (C) after the step (B), transporting the substrate W in the transport module 40 to a processing module. Even in this case, the transport method can efficiently transport the substrate W to a plurality of processing modules and can improve the footprint.

[0095] The conveying system 1 and conveying method according to the presently disclosed embodiments are illustrative in all respects and are not limiting. The embodiments can be modified and improved in various ways without departing from the spirit and scope of the appended claims. The matters described in the above-described embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent.

[0096] This application claims priority to basic application No. 2023-196164, filed on November 17, 2023 with the Japan Patent Office, and to Japanese Patent Application No. 2024-110534, a domestic priority application filed on July 9, 2024 with the Japan Patent Office, the entire contents of which are incorporated herein by reference.

[0097] REFERENCE SIGNS LIST 1 conveyance system 11 rail 30 loader module 35 main housing 36 sub-housing 40 conveyance module 50 inspection device W substrate

Claims

1. A transport system comprising: a transport module extending in a first direction; a plurality of processing modules connected to the transport module and arranged along the extension direction of the transport module; and a loader module connected to the transport module and extending along a second direction perpendicular to the first direction, wherein the loader module has: a main housing having a load port for loading an object to be transported into the loader module; and a sub-housing that is separate from the main housing and smaller than the main housing, is connected to the main housing in the second direction and is connected to the transport module, wherein the second direction is a direction parallel to a carrier transport line that transports a carrier containing the object to be transported.

2. The transport system according to claim 1, wherein the carrier transport line extends along the second direction, and a unit having the transport module, the plurality of processing modules and the loader module is provided in multiple locations on both sides of the carrier transport line.

3. The transport system according to claim 1 or 2, wherein the sub-housing includes an aligner device therein for adjusting a positional deviation or posture of the transported object.

4. The conveying system according to claim 1 or 2, wherein the sub-housing has a control panel operable by an operator on the opposite side to the connection point with the main housing.

5. The transport system according to claim 1 or 2, wherein the sub-housing has a door capable of exposing the inside of the sub-housing on the opposite side to the connection point with the main housing.

6. The transfer system according to claim 1 or 2, wherein the plurality of processing modules are connected to both side surfaces of the transfer module in the second direction, respectively.

7. The transport system according to claim 6, wherein the plurality of processing modules provided on both sides in the second direction are connected to the transport module while being shifted from each other in the first direction.

8. The transport system according to claim 1 or 2, wherein the plurality of processing modules are inspection devices that inspect the substrates being the transported objects.

9. A transport method for a transport system including a transport module extending in a first direction, a plurality of processing modules connected to the transport module and arranged along the extension direction of the transport module, and a loader module connected to the transport module and extending along a second direction perpendicular to the first direction, comprising: (A) a step of transporting a carrier containing an object to be transported along a direction parallel to the second direction by a carrier transport line, and placing the carrier on a load port provided in a main housing of the loader module; (B) after the step (A), a step of removing the object from the carrier on the load port, and transporting the object to a sub-housing that is separate from the main housing and smaller than the main housing, that is connected to the main housing in the second direction and connected to the transport module, thereby loading the object into the transport module; and (C) after the step (B), a step of transporting the object in the transport module and transporting the object to the processing module.

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