Electronic device comprising heat dissipation member

Abstract

The present disclosure relates to an electronic device. An electronic device according to an embodiment of the present disclosure may include: a printed circuit board; a first electronic component mounted on the printed circuit board; a second electronic component arranged on a first region of the surface of the first electronic component; and a thermal reactive heat dissipation member which includes a heat dissipation material and is in contact with a second region of the surface of the first electronic component and the top surface of the second electronic component, wherein the heat dissipation member may be configured to be in a solid phase and may be configured to soften on the basis of the temperature of the heat dissipation member.

Description

Electronic devices including heat dissipation elements

[0001] The present disclosure relates to electronic devices, and for example, to electronic devices including a heat dissipation structure of an electronic component.

[0002] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0003] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0004] An electronic device according to one embodiment of the present disclosure includes a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component disposed on a first area of ​​a surface of the first electronic component, and a heat-reactive heat-dissipating member comprising a heat-dissipating material and contacting the second area of ​​the surface of the first electronic component and an upper surface of the second electronic component, wherein the heat-dissipating member may be configured to be solid and may be configured to soften based on a temperature of the heat-dissipating member.

[0005] An electronic device according to one embodiment of the present disclosure may include a printed circuit board, a first electronic component disposed on the printed circuit board, a second electronic component disposed on a first surface of the first electronic component, a heat dissipation member comprising a heat dissipation material and disposed on the first surface of the second electronic component, a first conductive sheet laminated on the first surface of the heat dissipation member, a shield can disposed on the printed circuit board, surrounding the first electronic component and the second electronic component, and including a first opening in which the heat dissipation member is accommodated, and a second conductive sheet disposed between the shield can and the first conductive sheet, including a second opening in which the heat dissipation member is accommodated, and having lower thermal conductivity than the first conductive sheet.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure, taken along line AA` illustrated in FIG. 2, illustrating a substrate assembly.

[0009] FIG. 4 is an exploded cross-sectional view of a substrate assembly according to one embodiment of the present disclosure illustrated in FIG. 3.

[0010] FIG. 5 is a graph showing a phase change according to temperature of a phase change material included in a heat dissipation member according to one embodiment of the present disclosure.

[0011] FIG. 6 illustrates views of an electronic component and a solid heat dissipation member disposed on the electronic component from two directions according to one embodiment of the present disclosure.

[0012] FIG. 7 illustrates views of a heat dissipating member and electronic components on a gel compressed by a conductive layer from two directions according to one embodiment of the present disclosure.

[0013] FIG. 8 is a drawing showing a manufacturing process of a heat dissipation member according to one embodiment of the present disclosure.

[0014] FIG. 9 illustrates a heat dissipation member and a conductive layer according to one embodiment of the present disclosure.

[0015] FIG. 10 is a perspective view of a heat dissipation member having a slot formed therein according to one embodiment of the present disclosure.

[0016] FIG. 11 is a cross-sectional view of a region in which a slot of a heat dissipation member is formed according to one embodiment of the present disclosure.

[0017] FIG. 12 is a cross-sectional view of a region in which a slot of a heat dissipation member is formed according to one embodiment of the present disclosure.

[0018] FIG. 13 is a cross-sectional view of a region in which a slot of a heat dissipation member is formed according to one embodiment of the present disclosure.

[0019] FIG. 14 is a perspective view of a heat dissipation member having a slot formed therein according to one embodiment of the present disclosure.

[0020] FIG. 15 is a perspective view of a heat dissipation member having a slot formed therein according to one embodiment of the present disclosure.

[0021] FIG. 16 is a perspective view of a heat dissipation member according to one embodiment of the present disclosure.

[0022] FIG. 17 is a perspective view of a heat dissipation member according to one embodiment of the present disclosure.

[0023] FIG. 18 illustrates views of an electronic component and a heat dissipation member of FIG. 17 arranged on the electronic component from two directions according to one embodiment of the present disclosure.

[0024] FIG. 19 is a perspective view of a heat dissipation member according to one embodiment of the present disclosure.

[0025] FIG. 20 illustrates the heat dissipation member and electronic components illustrated in FIG. 19 according to one embodiment of the present disclosure.

[0026] FIG. 21 is a cross-sectional view of a conductive layer according to one embodiment of the present disclosure.

[0027] FIG. 22 is a cross-sectional view of a portion of an electronic device, according to one embodiment of the present disclosure, illustrating a substrate assembly.

[0028] FIG. 23 is a cross-sectional view of the conductive layer illustrated in FIG. 22, according to one embodiment of the present disclosure.

[0029] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0031] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0032] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0033] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may include various processing circuits and / or multiple processors. For example, as used in this specification and claims, the term “processor” may include various processing circuits including at least one processor, one or more of which may be configured to individually and / or collectively perform the various functions described below in a distributed manner. As described below, when “processor,” “at least one processor,” and “one or more processors” are described as being configured to perform multiple functions, this includes, for example, instances where one processor performs some functions and another processor performs other functions, and instances where a single processor performs all of the stated functions. Furthermore, as an example, the at least one processor may include a combination of processors that perform the various functions described in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions.

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0060] FIG. 2 is an exploded perspective view showing the front of an electronic device (101) according to one embodiment of the present disclosure.

[0061] Referring to FIG. 2, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320), a display (330), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) may include at least one flexible printed circuit board (340c) to electrically connect different printed circuit boards. For example, the printed circuit board (340a, 340b) may include a first circuit board (340a) positioned above the battery (350) and a second circuit board (340b) positioned below the battery (350), and a flexible printed circuit board (340c) may electrically connect the first circuit board (340a) and the second circuit board (340b).

[0062] According to one embodiment of the present disclosure, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include another component. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1, and any redundant description will be omitted below.

[0063] According to one embodiment of the present disclosure, the first support member (311) may be provided in at least a portion in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. The printed circuit board (340a, 340b) may be equipped with an interposer, a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The processor may be the same as or similar to the processor (120) described above with reference to FIG. 1.

[0064] According to one embodiment of the present disclosure, the front plate (320) may be coupled to the support member (311) via an adhesive member. The front plate (320) may be referred to as a "cover" or a "front cover." The rear plate (380) may be referred to as a "cover" or a "rear cover." The edge of the cover (380) may be supported by the support member (311).

[0065] According to one embodiment of the present disclosure, the first support member (311) and the side structure (310) may be combined to form a front case or housing (301). The housing (301) may also be referred to as a frame (301). According to one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350).

[0066] In one embodiment of the present disclosure, the housing (301) may be understood to include structures that can be visually or tactilely perceived by a user on the exterior of the electronic device (101), for example, a side structure (310), a front plate (320), and / or a rear plate (380). The housing (301) may include the side structure (310), a first support member (311), a front plate (320), and a rear plate (380). In one embodiment of the present disclosure, the 'front or rear of the housing (301)' may refer to the front plate (320) or the rear cover (380). In one embodiment, the first support member (311) is disposed between the front plate (320) and the rear plate (380), and may function as a structure for arranging electrical / electronic components, such as printed circuit boards (340a, 340b) or a camera assembly (307).

[0067] In one embodiment of the present disclosure, the memory (e.g., memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0068] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0069] According to one embodiment of the present disclosure, the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) therebetween.

[0070] In one embodiment of the present disclosure, the lower support member (360b) of the second support member (360) may be disposed to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be disposed on the printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be disposed.

[0071] In one embodiment of the present disclosure, electrical / electronic components such as a speaker module, interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (311).

[0072] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0073] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0074] According to one embodiment of the present disclosure, the electronic device (101) may include a metal cover (M). As an example, the housing (301) may include a metal cover (M) covering a conductive layer (440, or a coating layer (450)). According to one embodiment of the present disclosure, the electronic device (101) may include a vapor chamber (V) that dissipates heat to the outside. The vapor chamber (V) may be disposed in the metal cover (M). Accordingly, heat generated in the substrate assembly (400) may be dissipated to the outside through the metal cover (M) and the vapor chamber (V).

[0075] Referring to FIG. 2, an electronic device (101) according to one embodiment of the present disclosure may include a substrate assembly (400). The substrate assembly (400) may include a printed circuit board and a plurality of electronic components (e.g., a processor, a memory, an interposer, etc.) mounted on the printed circuit board. The description of the substrate assembly (340a) described with reference to FIG. 2 may be equally applied to the substrate assembly (400).

[0076] According to one embodiment of the present disclosure, a substrate assembly (400) may include a printed circuit board (410), a shield can (420), a heat dissipation member (430, see FIG. 3), a conductive layer (440), and / or a coating layer (450). The substrate assembly (400) will be described in detail below with reference to FIGS. 3 and 4.

[0077] FIG. 3 is a cross-sectional view of a portion of an electronic device (101) according to one embodiment of the present disclosure taken along line AA` of FIG. 2, illustrating a substrate assembly (400).

[0078] Referring to FIG. 3, a substrate assembly (400) according to one embodiment of the present disclosure may include a printed circuit board (410). At least one electronic component (E1, E2) may be arranged on the printed circuit board (410).

[0079] According to one embodiment of the present disclosure, a substrate assembly (400) may include a first electronic component (E1) mounted on a printed circuit board (410). The first electronic component (E1) may perform a function of an electronic device (101). As an example, the first electronic component (E1) may include a processor (e.g., the processor (120) of FIG. 1). The first electronic component (E1) may be connected to an external power source (e.g., the battery (350) of FIG. 2).

[0080] According to one embodiment of the present disclosure, the first electronic component (E1) may include a heat generating block (B). The heat generating block (B) may be a portion of the first electronic component (E1) having a relatively large amount of heat generation. As an example, the first electronic component (E1) may include a processor (e.g., the processor (120) of FIG. 1), and the heat generating block (B) may be a CPU / GPU portion and include at least one processing core. As another example, the heat generating block (B) may include any one of a plurality of processing cores, or a plurality of cores adjacent to each other.

[0081] According to one embodiment of the present disclosure, a heating block (B) may be positioned at an edge of a first electronic component (E1) to be connected to a power source (e.g., a battery (350) of FIG. 2). The heating block (B) may at least partially overlap a second area (E112) (see FIG. 6 or FIG. 7) of a surface (E11, E12) of the first electronic component (E1). As an example, as illustrated in FIG. 3, the heating block (B) may overlap an edge of the second electronic component (E2) in a direction in which the first electronic component (E1) and the second electronic component (E2) are stacked. As another example, unlike as illustrated in FIG. 3, the heating block (B) may be positioned outside the edge of the second electronic component (E2) so as not to overlap an edge of the second electronic component (E2) in a direction in which the first electronic component (E1) and the second electronic component (E2) are stacked.

[0082] According to one embodiment of the present disclosure, a substrate assembly (400) may include a second electronic component (E2) disposed on a first electronic component (E1). The second electronic component (E2) may be mounted on a first surface (E11) of the first electronic component (E1). For example, the first surface (E11) of the first electronic component (E1) may be a top surface of the first electronic component (E1). For example, the second electronic component (E2) may be disposed on the first surface (E11) of the first electronic component (E1), and the printed circuit board (410), the first electronic component (E1), and the second electronic component (E2) may be stacked in a row.

[0083] According to one embodiment of the present disclosure, the second electronic component (E2) may be disposed on a portion of the first surface (E11) of the first electronic component (E1). As an example, the second electronic component (E2) may be disposed on a center portion of the first electronic component (E1). The remaining portion of the first surface (E11) of the first electronic component (E1) where the second electronic component (E2) is not disposed may be in contact with a heat dissipation member (430).

[0084] According to one embodiment of the present disclosure, the second electronic component (E2) may be electrically connected to the first electronic component (E1). The second electronic component (E2) may be operatively connected to the first electronic component (E1). As an example, the first electronic component (E1) may include a processor (e.g., the processor (120) of FIG. 1), and the second electronic component (E2) may be a memory (e.g., the memory (130) of FIG. 1) mounted on the first surface (E11) of the first electronic component (E1) via a solder ball.

[0085] For example, the first electronic component (E1) may be a processor including at least one processing core (e.g., processor (120) of FIG. 1), and the second electronic component (E2) may be a memory (e.g., memory (130) of FIG. 1) operatively connected to the at least one processing core and storing instructions to be executed by the at least one processing core.

[0086] According to one embodiment of the present disclosure, a substrate assembly (400) may include a heat dissipation member (430). The heat dissipation member (430) may include a heat dissipation material. The heat dissipation member (430) may be in contact with the first electronic component (E1) and the second electronic component (E2). Heat generated in the first electronic component (E1) and the second electronic component (E2) may be dissipated to the outside of the substrate assembly (400) by the heat dissipation member (430).

[0087] According to one embodiment of the present disclosure, a heat dissipation member (430) may include a first portion (433) that contacts a first surface (top surface, E21) of the second electronic component (E2). The first portion (433) of the heat dissipation member (430) may be disposed between the second electronic component (E2) and the first conductive sheet (441). Accordingly, heat of the second electronic component (E2) may be spread to the first conductive sheet (441) through the first portion (433). In addition, heat of the first electronic component (E1) may be spread to the first conductive sheet (441) through the second electronic component (E2) and the first portion (433).

[0088] According to one embodiment of the present disclosure, the heat dissipation member (430) may include a second portion (431, 432) that contacts the first surface (E11) of the first electronic component (E1). Accordingly, heat of the first electronic component (E1) may spread from the first surface (E11) to the second portion (431, 432) of the heat dissipation member (430).

[0089] According to one embodiment of the present disclosure, the second part (431, 432) of the heat dissipation member (430) may be adjacent to the heat dissipation block (B) of the first electronic component (E1). The second part (431, 432) of the heat dissipation member (430) may overlap the heat dissipation block (B) in the stacking direction of the second electronic component (E2) and the first part (433) of the heat dissipation member (430). Therefore, the heat of the heat dissipation block (B) of the first electronic component (E1) may be spread to the second part (431, 432) of the heat dissipation member (430).

[0090] According to one embodiment of the present disclosure, the second portion (431, 432) of the heat dissipation member (430) may extend from the first portion (433) toward the first surface (E11) of the first electronic component (E1). As an example, the second portion (431, 432) may protrude from the edge of the first portion (433) toward the first surface (E11) of the first electronic component (E1).

[0091] According to one embodiment of the present disclosure, the heat dissipation member (430) can cover the second electronic component (E2). The first portion (433) of the heat dissipation member (430) can cover at least a portion of the first surface (E21) of the second electronic component (E2). The second portions (431, 432) of the heat dissipation member (430) can cover at least a portion of the second surface (E22) of the second electronic component (E2). As an example, the first surface (E21) of the second electronic component (E2) can be a top surface, and the second surface (E22) can be a side surface.

[0092] According to one embodiment of the present disclosure, the substrate assembly (400) may include a shield can (420) disposed on a printed circuit board (410). The shield can (420) may surround a first electronic component (E1) and a second electronic component (E2). The shield can (420) may minimize and / or reduce penetration of an external magnetic field into the first electronic component (E1) and the second electronic component (E2). The shield can (420) may be connected to a ground layer (not shown) through the printed circuit board (410) or may be electrically connected to the printed circuit board (410) to ground a current formed by the external magnetic field to the outside of the substrate assembly (400).

[0093] According to one embodiment of the present disclosure, the substrate assembly (400) may include a conductive layer (440) disposed on a shield can (420). As an example, the conductive layer (440) may be in contact with the shield can (420) or may be bonded to the shield can (420) by a conductive adhesive. The conductive layer (440) and the shield can (420) may define a space that can minimize / reduce the influence of an external magnetic field. The shield can (420) and the conductive layer (440) may surround the first electronic component (E1), the second electronic component (E2), and the heat dissipation member (430). Therefore, the influence of the external magnetic field on the first electronic component (E1) and the second electronic component (E2) may be minimized or reduced.

[0094] According to one embodiment of the present disclosure, the conductive layer (440) may include a first conductive sheet (441) disposed on a first surface (top surface, 434) of a heat dissipation member (430). The first conductive sheet (441) may cover the first surface (434) of the heat dissipation member (430). For example, the first conductive sheet (441) may contact the first surface (434) of the heat dissipation member (430). Accordingly, heat may spread from the heat dissipation member (430) to the first conductive sheet (441). As an example, the first conductive sheet (441) may be a copper thin film.

[0095] According to one embodiment of the present disclosure, the substrate assembly (400) may include a metal cover (M). The metal cover (M) may reinforce the rigidity of the substrate assembly (400). The metal cover (M) may be laminated on the first conductive sheet (441). Accordingly, heat may spread from the first conductive sheet (441) to the metal cover (M).

[0096] According to one embodiment of the present disclosure, a coating layer (450) may be disposed between the first conductive sheet (441) and the metal cover (M). As an example, the coating layer (450) may be coated on one surface of the first conductive sheet (441) facing the metal cover (M). The coating layer (450) may include a heat dissipation material. Through the coating layer (450), heat may be diffused from the first conductive sheet (441) to the metal cover (M).

[0097] According to one embodiment of the present disclosure, the conductive layer (440) may be supported by the shield can (420). The conductive layer (440) may include a second conductive sheet (442) interposed between the first conductive sheet (441) and the shield can (420). The second conductive sheet (442) may surround a portion of the heat dissipation member (430). For example, the second conductive sheet (442) may contact a side surface of the heat dissipation member (430) (e.g., the outer surface (430o) of FIG. 4). Accordingly, heat may spread from the heat dissipation member (430) to the second conductive sheet (442). As an example, the second conductive sheet (442) may be a metal thin film having a lower thermal conductivity than the first conductive sheet (441).

[0098] According to one embodiment of the present disclosure, the shield can (420) and the first conductive sheet (441) can be electrically connected through the second conductive sheet (442). Accordingly, the first electronic component (E1) and the second electronic component (E2) can minimize or reduce the influence of an external magnetic field through the shield can (420), the second conductive sheet (442), and the first conductive sheet (441).

[0099] According to one embodiment of the present disclosure, a shield can (420) may include a first opening (opening 421, see FIG. 4). A heat dissipation member (430) may be positioned at least partially inside the first opening (421). The shield can (420) may surround at least a portion of a side surface (430o) of the heat dissipation member (430). The shield can (420) may contact the side surface (430o) of the heat dissipation member (430). Accordingly, heat may spread from the heat dissipation member (430) to the shield can (420).

[0100] According to one embodiment of the present disclosure, the second conductive sheet (442) may include a second opening (443, see FIG. 4) in which a heat dissipation member (430) is received. At least a portion of the heat dissipation member (430) may be positioned inside the second opening (443). The second conductive sheet (442) may surround at least a portion of a side surface (430o) of the heat dissipation member (430). The second conductive sheet (442) may contact the side surface (430o) of the heat dissipation member (430). Accordingly, heat may spread from the heat dissipation member (430) to the shield can (420).

[0101] FIG. 4 is an exploded cross-sectional view of a substrate assembly (400) according to one embodiment of the present disclosure illustrated in FIG. 3.

[0102] Referring to FIG. 4, according to one embodiment of the present disclosure, a substrate assembly (400) may have a structure in which a first electronic component (E1), a second electronic component (E2), a heat dissipation member (430), a conductive layer (440), and a metal cover (M) are sequentially laminated. The substrate assembly (400) may be manufactured in which the first electronic component (E1), the second electronic component (E2), the heat dissipation member (430), the conductive layer (440), and the metal cover (M) are sequentially laminated (or assembled) or adjacent components (e.g., the heat dissipation member (430) and the conductive layer (440)) are integrally assembled into another component (e.g., the second electronic component (E2)) (see FIG. 9).

[0103] According to one embodiment of the present disclosure, a width (W3) of the heat dissipation member (430) may be defined by an outer side surface (430o) of the heat dissipation member (430). The outer side surface (430o) of the heat dissipation member (430) may be referred to as an outer side surface (430o) of the heat dissipation member (430). A first opening (421) of the shield can (420) may have a predetermined diameter (D1). The width (W3) of the heat dissipation member (430) may be smaller than the diameter (D1) of the first opening (421) of the shield can (420). Therefore, the heat dissipation member (430) may be easily inserted into the inside of the shield can (420) through the first opening (421) of the shield can (420).

[0104] According to one embodiment of the present disclosure, a width (W1) of the second electronic component (E2) may be defined by a second surface (E22) of the second electronic component (E2). The width (W1) of the second electronic component (E2) may be smaller than a diameter (D1) of the first opening (421) of the shield can (420).

[0105] According to one embodiment of the present disclosure, the second portion (431, 432) of the heat dissipation member (430) and the second surface (435) of the first portion (433) of the heat dissipation member (430) may form an accommodation space (A) in which a second electronic component (E2) is accommodated. The distance between the second portions (431, 432) of the heat dissipation member (430) may be defined as the width (W2) of the accommodation space (A). The width (W2) of the accommodation space (A) may be referred to as the distance (W2) between the second portions (431, 432) of the heat dissipation member (430). The width (W2) of the accommodation space (A) may be referred to as the distance (W2) between the inner surfaces (430i) of the second portions (431, 432) of the heat dissipation member (430).

[0106] According to one embodiment of the present disclosure, the width (W1) of the second electronic component (E2) may be smaller than the distance (W2) between the second portions (431, 432) of the heat dissipation member (430). Accordingly, the second electronic component (E2) can be easily inserted into the receiving space (A) of the heat dissipation member (430), and the heat dissipation member (430) can be easily positioned on the second electronic component (E2).

[0107] According to one embodiment of the present disclosure, the second opening (443) of the second conductive sheet (442) may have a predetermined diameter (D2). The width (W3) of the heat dissipation member (430) may be smaller than the diameter (D2) of the second opening (443) of the second conductive sheet (442). Accordingly, a portion of the heat dissipation member (430) may be easily inserted into the inside of the second opening (443) of the second conductive sheet (442), and the conductive layer (440) may be easily positioned on the heat dissipation member (430).

[0108] FIG. 5 is a graph showing the phase change according to temperature of a phase change material included in a heat dissipation member (430) according to one embodiment of the present disclosure.

[0109] According to one embodiment of the present disclosure, the heat dissipation member (430) may exhibit thermally responsive behavior, in which properties such as phase or thermal conductivity change in response to temperature. For example, the heat dissipation member (430) may be in a solid state at room temperature, but may transition to a gel phase when heated by absorbing ambient heat. This phase transition may improve the heat dissipation efficiency of the heat dissipation member (430). The heat dissipation member (430) may include a heat dissipation material, a phase change material, and a matrix material. A more detailed description of the materials included in the heat dissipation member (430) will be described below.

[0110] Referring to FIG. 5, the phase change material may be a solid phase at a temperature lower than the phase transition temperature (Tc), and may be a liquid phase or a gel phase at a temperature higher than the phase transition temperature (Tc). The phase transition temperature (Tc) may be referred to as a threshold temperature. As an example, the phase change material may include a paraffin series material, which is a temperature-sensitive material, and the phase transition temperature (Tc) may be a temperature of 45 degrees Celsius to 65 degrees Celsius. The phase change material may be a thermoresponsive material according to temperature, and as an example, may be a thermoplastic polymer.

[0111] According to one embodiment of the present disclosure, the phase change material may be solid at room temperature (Tr). The heat dissipation member (430) may be solid at room temperature (Tr). As an example, room temperature (Tr) may be a temperature of 15 degrees Celsius to 25 degrees Celsius.

[0112] According to one embodiment of the present disclosure, when the heat dissipation member (430) is in a solid state, the transportation, placement, and assembly of the heat dissipation member (430) can be easier compared to when it is in a liquid or gel state. In addition, when the heat dissipation member (430) is in a solid state, it has a certain level of rigidity, so that defects such as dents or compression of the heat dissipation member (430) that may occur during the assembly and transportation process can be reduced. Accordingly, it is possible to prevent and / or reduce dents or compression that cause the shape of the heat dissipation member (430) to not be restored, and accordingly, the dispersion of the heat dissipation performance of the heat dissipation member (430) can be minimized and / or reduced.

[0113] According to one embodiment of the present disclosure, when the heat dissipation member (430) is solid, a material (e.g., a phase change material) included in the heat dissipation member (430) does not permeate into the gap of the shielding structure (e.g., the conductive layer (440) and the shield can (420) of FIG. 3) around the heat dissipation member (430), and thus the shielding performance of the shielding structure may not be impaired. Even if the heat dissipation member (430) becomes a gel phase after the electronic device (101) is operated, the heat dissipation member (430) becomes a gel phase when the phase transition temperature (Tc) is reached after the electronic device (101) is operated, and does not contain silicone resin or oil that causes bleeding, and thus the shielding performance of the surrounding shielding structure (e.g., the conductive layer (440) and the shield can (420) of FIG. 3) may not be impaired.

[0114] According to one embodiment of the present disclosure, the heat dissipation member (430) may include a matrix material configured to maintain the heat dissipation member (430) in a gel phase at a temperature higher than the phase transition temperature (Tc). The matrix material functions as a frame of the heat dissipation member (430), thereby substantially maintaining the shape of the heat dissipation member (430) even when the temperature of the heat dissipation member (430) rises to a temperature higher than the phase transition temperature (Tc). As an example, the matrix material may be a rubber-based material. The matrix material is not limited to a rubber-based material, and may be replaced with a material that can function as a frame.

[0115] According to one embodiment of the present disclosure, the heat dissipating member (430) may include heat dissipating particles. As an example, the heat dissipating particles may be aluminum oxide (Al2O3) or aluminum nitride (AlN). As another example, the heat dissipating particles may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0116] According to one embodiment of the present disclosure, the heat dissipation member (430) may include heat dissipation particles, a phase change material, and a matrix material. As an example, the heat dissipation member (430) may include about 75 to 90% of heat dissipation particles, about 5 to 15% of matrix material, and about 5 to 15% of phase change material. The composition ratio of the heat dissipation particles, the matrix material, and the phase change material included in the heat dissipation member (430) is not limited to the above examples.

[0117] According to one embodiment of the present disclosure, as the first electronic component (E1) and / or the second electronic component (E2) operates, the temperature of the heat dissipation member (430) may increase due to heat generation of the first electronic component (E1) and / or the second electronic component (E2). When the temperature of the heat dissipation member (430) increases after the first electronic component (E1) and / or the second electronic component (E2) operates, the heat dissipation member (430) may at least partially change into a gel phase.

[0118] According to one embodiment of the present disclosure, the phase transition temperature (Tc) may be lower than a throttling temperature (Tt) of the first electronic component (E1). The throttling temperature (Tt) of the first electronic component (E1) may include a throttling temperature of at least one processing unit (e.g., core) included in the first electronic component (E1). The throttling may be a method of controlling the electronic component to reduce the heat generation of the electronic component based on an increase in the temperature of the electronic component exceeding a specific threshold, in order to reduce power consumption of the electronic component or prevent and / or reduce a failure of the electronic component.

[0119] For example, the first electronic component (E1) may include a processor (e.g., the processor (120) of FIG. 1), and the processor (E1) may include a plurality of processing cores. The throttling temperature (Tt) of the first electronic component (E1) may include the throttling temperatures of the plurality of processing cores. The limit temperature (Tc) of the first electronic component (E1) may be lower than the throttling temperatures of the plurality of processing cores. According to one embodiment of the present disclosure, during the operation of the electronic device (e.g., the electronic device (101) of FIG. 2), the temperature of the first electronic component (E1) and / or the second electronic component (E2) may not increase beyond a predetermined range from the throttling temperature (Tt). At the throttling temperature (Tt) of the first electronic component (E1) and / or the second electronic component (E2), the phase change material may be in a liquid phase, and the heat dissipation member (430) may be in a gel phase.

[0120] FIG. 6 illustrates views of an electronic component (E1, E2) and a solid heat dissipation member (430) disposed on the electronic component (E1, E2) from two directions according to one embodiment of the present disclosure. FIG. 7 illustrates views of an electronic component (E1, E2) and a gel-like heat dissipation member (430) compressed by a conductive layer (440, see FIG. 3) from two directions according to one embodiment of the present disclosure.

[0121] Referring to FIG. 6, according to one embodiment of the present disclosure, a first portion (433) of a solid heat dissipation member (430) before changing into a gel state may have a first height (h1). A plurality of second portions (431, 432) may have a first thickness (t1) and a second thickness (t2), respectively. A distance between an inner surface (430i) and an outer surface (430o) of the plurality of second portions (431, 432) may be a first thickness (t1) and a second thickness (t2), respectively.

[0122] According to one embodiment of the present disclosure, the inner surface (430i) of the second part (431, 432) of the solid heat dissipation member (430) before changing into a gel state can be spaced apart from the second surface (E22) of the second electronic component (E2) for easy coupling of the heat dissipation member (430). Accordingly, the heat dissipation member (430) can be easily assembled to the second electronic component (E2).

[0123] Referring to FIG. 7, according to one embodiment of the present disclosure, after being changed into a gel state, a first portion (433) of the heat dissipation member (430) compressed by the conductive layer (440) may have a second height (h2) smaller than a first height (h1). A plurality of second portions (431, 432) of the heat dissipation member (430) compressed by the conductive layer (440) may have a third thickness (t3) larger than the first thickness (t1) and a fourth thickness (t4) larger than the second thickness (t2), respectively. The third thickness (t3) and the fourth thickness (t4) may be the largest thicknesses of each of the plurality of second portions (431, 432).

[0124] Referring to FIGS. 6 and 7, according to one embodiment of the present disclosure, the heat dissipation member (430) may be compressed by the conductive layer (440) after changing into a gel state. When compressed by the conductive layer (440), the height of the first portion (433) of the heat dissipation member (430) may decrease from the first height (h1) to the second height (h2). The difference between the first height (h1) and the second height (h2) may be due to an assembly tolerance that may occur during the manufacturing process of the substrate assembly (400). For example, tolerances such as an assembly tolerance that may occur during the process of assembling components (410, 420, 430, 440, E1, E2) of the substrate assembly (400), a component height tolerance of the printed circuit board (410) and electronic components (E1, E2), etc. may occur.

[0125] According to one embodiment of the present disclosure, the heat dissipation member (430) in the gel phase can have a higher compressibility compared to the heat dissipation member (430) in the solid phase. For example, the heat dissipation member (430) in the gel phase can have a compressibility of about 25 to 40%, for example, can have a compressibility of about 35 to 40%. Since the heat dissipation member (430) of the present disclosure has a higher compressibility in the gel phase compared to the solid phase, the above tolerances can be filled by the heat dissipation member (430). For example, when the heat dissipation member (430) becomes at least partially in the gel phase when the temperature is higher than the limit temperature (Tc), the heat dissipation member (430) can be configured to have a compressibility of about 35 to 40%, and the second height (h2) can be a value that is reduced by about 35 to 40% from the first height (h1).

[0126] According to one embodiment of the present disclosure, as the height of the first portion (433) of the heat dissipation member (430) decreases, the thickness of the second portion (431, 432) of the heat dissipation member (430) may increase. As the thickness of the second portion (431, 432) of the heat dissipation member (430) increases, the second portion (431, 432) may be brought into close contact with the second surface (E22) of the second electronic component (E2). As the thickness of the second portion (431, 432) of the heat dissipation member (430) increases, the inner surface (430i) of the second portion (431, 432) may be brought into close contact with the second surface (E22) of the second electronic component (E2). As the thickness of the second part (431, 432) of the heat dissipation member (430) increases, the second part (431, 432) can be brought into close contact with the shield can (420, see FIG. 3).

[0127] According to one embodiment of the present disclosure, a first surface (E11) of a surface (E11, E12) of a first electronic component (E1) may include a first area (E111) in which a second electronic component (E2) is disposed. Heat may diffuse from the first electronic component (E1) to the second electronic component (E2) through the first area (E111).

[0128] According to one embodiment of the present disclosure, a first surface (E11) of a surface (E11, E12) of a first electronic component (E1) may include a second region (E112) that contacts a second portion (431, 432) of a heat dissipation member (430). The second region (E112) may at least partially surround the first region (E111). Heat may diffuse from the first electronic component (E1) to the second portion (431, 432) of the heat dissipation member (430) through the second region (E112).

[0129] Referring to FIGS. 6 and 7, according to one embodiment of the present disclosure, the first electronic component (E1) may include a heat generating block (B). The heat generating block (B) may be positioned below the first surface (E11) and overlap with the second region (E112). The heat generating block (B) may be positioned below the boundary between the first region (E111) and the second region (E112). Heat generated in the heat generating block (B) may spread to the second electronic component (E2) through the first region (E111). Heat generated in the heat generating block (B) may spread to the second portion (432) of the heat dissipation member (430) through the second region (E112).

[0130] According to one embodiment of the present disclosure, the heat generating portion (B) may include a first heat generating portion (B1) and a second heat generating portion (B2). The first heat generating portion (B1) and the second heat generating portion (B2) may be positioned below the first surface (E11) and overlap with the second area (E112). As an example, the first heat generating portion (B1) may be a CPU of a processor (e.g., a processor (120) of FIG. 1), and the second heat generating portion (B2) may be a GPU of the processor (e.g., a processor (120) of FIG. 1).

[0131] FIG. 8 is a drawing showing a manufacturing process of a heat dissipation member (430) according to one embodiment of the present disclosure.

[0132] Referring to FIG. 8, according to one embodiment of the present disclosure, a heat dissipation member (430) may be formed by bonding a plurality (e.g., two) plates (P1, P2) to each other. The plates (P1, P2) may be formed of the same material as the heat dissipation member (430) described with reference to FIG. 5. The plates (P1, P2) may be in a solid state at a temperature lower than the phase transition temperature (Tc, see FIG. 5) and may be in a gel state at a temperature higher than the phase transition temperature (Tc, see FIG. 5).

[0133] According to one embodiment of the present disclosure, the first plate (P1) may include a hole (H). The hole (H) may have a shape corresponding to the second electronic component (E2). The second plate (P2) may have a shape corresponding to the first surface (E21, see FIG. 3) of the second electronic component (E2). The hole (H) may be an area corresponding to the receiving space (A, see FIG. 4) of the heat dissipation member (430).

[0134] According to one embodiment of the present disclosure, when a first plate (P1) is laminated on a second plate (P2) and heat is applied to the first plate (P1) and the second plate (P2), the first plate (P1) and the second plate (P2) may be bonded by the heat to form a third plate (P3). The first part (433) and the second parts (431, 432) of the heat dissipation member (430) may be formed integrally.

[0135] According to one embodiment of the present disclosure, the first plate (P1) and the second plate (P2) can be formed integrally without introducing an adhesive member or adhesive layer. Typically, the adhesive member or adhesive layer can function as a heat insulating layer. According to one embodiment of the present disclosure, the heat dissipation member (430) includes a matrix material and a phase change material, thereby bonding the plates (P1, P2) by heat without an adhesive member or adhesive layer, thereby improving the heat dissipation performance of the heat dissipation member (430).

[0136] According to one embodiment of the present disclosure, a heat dissipation member (430) including a first portion (433) and a second portion (431, 432) can be manufactured by cutting a third plate (P3) along a predetermined cutting line (CL) surrounding a hole (H).

[0137] According to one embodiment of the present disclosure, the cutting line (CL) can at least partially surround the hole (H). For example, as illustrated in FIG. 8, the cutting line (CL) may partially overlap the hole (H) or may be partially located inside the hole (H). A portion of the cutting line (CL) located outside the hole (H) and the hole (H) may correspond to a second portion (431, 432) of the heat dissipation member (430). Depending on the shape of the hole (H) and the cutting line (CL) or the number of plates, the shape of the heat dissipation member (430) may vary.

[0138] According to one embodiment of the present disclosure, the first plate (P1) and the second plate (P2) may be formed of different materials. The compositions of the first plate (P1) and the second plate (P2) may be different. For example, the second plate (P2) may be conductive by including carbon, and the first plate (P1) may be non-conductive by not including carbon. Accordingly, the second portion (431, 432) of the heat dissipation member (430) may be non-conductive, and the first portion (433) of the heat dissipation member (430) may be conductive. Accordingly, the shielding performance may be improved through the first portion (433) of the heat dissipation member (430), and the second portion (431, 432) may be formed non-conductively to prevent and / or reduce short circuits of the electronic components (E1, E2).

[0139] According to one embodiment of the present disclosure, the first plate (P1) and the second plate (P2) may have different thermal conductivities. For example, the thermal conductivity of the second portion (431, 432) of the heat dissipation member (430) may be higher than the thermal conductivity of the first portion (433) of the heat dissipation member (430). Accordingly, heat generated from the first electronic component (E1) can be more effectively dissipated through the second portion (431, 432) of the heat dissipation member (430).

[0140] According to one embodiment of the present disclosure, the second portions (431, 432) of the heat dissipation member (430) may be plural. The plurality of second portions (431, 432) may be positioned symmetrically with respect to the receiving area (A). The plurality of second portions (431, 432) may extend along the second surface (E22, see FIG. 5) of the second electronic component (E2). As an example, the plurality of second portions (431, 432) may extend in parallel with each other along two opposing side surfaces of the second electronic component (E2).

[0141] FIG. 9 illustrates a heat dissipation member (430) and a conductive layer (440) according to one embodiment of the present disclosure.

[0142] Referring to FIG. 9, according to one embodiment of the present disclosure, a heat dissipation member (430) may be attached to a second surface of a first conductive sheet (441). The heat dissipation member (430) may be positioned inside a second opening (443) of a second conductive sheet (442). The heat dissipation member (430) may be partially accommodated in the second opening (443) of the second conductive sheet (442). An edge (436) of the heat dissipation member (430) may be spaced apart from an edge (444) of the second opening (443) of the second conductive sheet (442).

[0143] According to one embodiment of the present disclosure, the heat dissipation member (430) can be attached to the conductive layer (440) and positioned as a single body on the second electronic component (E2, see FIG. 4). Since the edge (436) of the heat dissipation member (430) is spaced inwardly from the edge (444) of the second opening (443) of the second conductive sheet (442), misassembly problems such as the conductive layer (440) riding on the heat dissipation member (430) can be prevented and / or reduced.

[0144] Fig. 10 is a perspective view of a heat dissipation member (1430) having a slot (S, S1) formed therein according to one embodiment of the present disclosure. Fig. 11 is a cross-sectional view of a region of a heat dissipation member (1430) having a slot (S) formed therein according to one embodiment of the present disclosure.

[0145] The description of the heat dissipation member (430) described with reference to FIGS. 3 to 9 can be applied equally to the heat dissipation member (1430) of the same name described with reference to FIGS. 10 and 11, to the extent that they are not arranged with each other.

[0146] Referring to FIGS. 10 and 11 , a heat dissipation member (1430) according to one embodiment of the present disclosure may include at least one elongated slot (S1). The slot (S1) may be formed in a first portion (433) of the heat dissipation member (1430). The slot (S1) may penetrate the first portion (433) of the heat dissipation member (1430). The slot (S1) may be connected from a second surface (435) of the first portion (433) of the heat dissipation member (1430) to a first surface (434).

[0147] According to one embodiment of the present disclosure, when the heat dissipation member (430) is attached to the first conductive sheet (441), air (F) between the heat dissipation member (430) and the first conductive sheet (441) can easily flow to the outside through the slot (S1). If air remains between the second surface of the heat dissipation member (430) and the first conductive sheet (441), air bubbles may be formed between the heat dissipation member (430) and the first conductive sheet (441), which may deteriorate the heat dissipation performance of the electronic components (E1, E2). Therefore, by the slot (S, S1) according to one embodiment of the present disclosure, the first conductive sheet (441) and the heat dissipation member (430) can be brought into close contact with each other, and heat can be spread from the heat dissipation member (430) to the first conductive sheet (441).

[0148] According to one embodiment of the present disclosure, the slot (S1) may have a cross shape in which two slots intersect each other, but the shape of the slot (S1) is not limited to the cross shape. There may be a plurality of slots (S1). The plurality of slots (S1) may be located in the first portion (433) of the heat dissipation member (1430). As an example, the plurality of slots (S1) may be arranged at regular intervals.

[0149] According to one embodiment of the present disclosure, when the heat dissipation member (1430) is changed into a gel phase and compressed by the conductive layer (440) (see FIG. 7), the height (h1) of the first portion (433) of the heat dissipation member (1430) may be reduced to a third height (h3). When the heat dissipation member (1430) is changed into a gel phase and compressed by the conductive layer (440), the internal space of the slot (S) may be filled by the heat dissipation member (1430) in the gel phase. When the heat dissipation member (1430) is changed into a gel phase and compressed by the conductive layer (440), the slot (S) may not be visually exposed to the outside. When the heat dissipation member (1430) on the gel is compressed, the slot (S) of the heat dissipation member (1430) does not completely disappear, but may remain inside the first part (433) of the heat dissipation member (1430) in the form of an interface, as shown in FIG. 11.

[0150] Fig. 12 is a cross-sectional view of a region in which a slot (S) of a heat dissipation member (1430) is formed according to one embodiment of the present disclosure. Fig. 13 is a cross-sectional view of a region in which a slot (S) of a heat dissipation member (1430) is formed according to one embodiment of the present disclosure.

[0151] Referring to FIGS. 11 to 13, a heat dissipation member (1430) according to one embodiment of the present disclosure may include at least one interface portion (I1, I2, I3). The interface portion (I1, I2, I3) may be a surface where two areas of the first portion (433) located on both sides of the slot (S) come into contact with each other. Some of the plurality of slots (S, S1) may not remain as the interface portion (I1, I2, I3), and other parts may remain as the interface portion (I1, I2, I3).

[0152] According to one embodiment of the present disclosure, at least one of the plurality of slots (S, S1, S2, S3) may remain inside the first portion (433) in the form of any one of the various shapes of interface portions (I1, I2, I3) illustrated in FIGS. 11 to 13. However, the shape of the interface portions (I1, I2, I3) is not limited to the shapes illustrated in FIGS. 11 to 13 and may remain in various shapes.

[0153] According to one embodiment of the present disclosure, interface portions (I1, I2, I3) may be positioned at the positions of slots (S, S1). Interface portions (I1, I2, I3) may be positioned at the first portion (433) of the heat dissipation member (1430). As an example, interface portions (I1, I2, I3) may be arranged at regular intervals at positions corresponding to a plurality of slots (S, S1).

[0154] Referring to FIG. 11, according to one embodiment of the present disclosure, the first interface portion (I1) may be configured to connect the second surface (435) and the first surface (434) of the first portion (433) of the heat dissipation member (1430). The first interface portion (I1) may extend in a curved manner between the second surface (435) and the first surface (434) of the first portion (433).

[0155] Referring to FIG. 12, according to one embodiment of the present disclosure, a second interface portion (I2) extends between the second surface (435) and the first surface (434) of the first portion (433) of the heat dissipation member (1430), and may be in a form of at least one break. The second interface portion (I2) may extend in a curved manner between the second surface (435) and the first surface (434) of the first portion (433).

[0156] Referring to FIG. 13, according to one embodiment of the present disclosure, the third interface portion (I3) may be spaced apart from the second surface (435) and the first surface (434) of the first portion (433) of the heat dissipation member (1430), and may be formed to extend between the second surface (435) and the first surface (434) of the first portion (433). The third interface portion (I3) may extend in a curved manner between the second surface (435) and the first surface (434) of the first portion (433).

[0157] Fig. 14 is a perspective view of a heat dissipation member (2430) having a slot (S2) formed therein, according to one embodiment of the present disclosure. Fig. 15 is a perspective view of a heat dissipation member (3430) having a slot (S3) formed therein, according to one embodiment of the present disclosure.

[0158] The description of the heat dissipation member (430) described with reference to FIGS. 3 to 9 can be applied equally to the heat dissipation members (2430, 3430) of the same name described with reference to FIGS. 14 and 15, to the extent that they are not arranged with each other.

[0159] The description of the slot (S) described with reference to FIGS. 10 to 13 can be applied equally to the slots (S1, S2) of the same name described with reference to FIGS. 14 and 15, to the extent that they are not arranged with each other.

[0160] Referring to Fig. 14, a plurality of slots (S2) may extend in a direction intersecting the longitudinal direction of the second portion (431, 432) of the heat dissipation member (2430). The plurality of slots (S2) may extend in parallel to each other. Referring to Fig. 15, a plurality of slots (S3) may extend along the longitudinal direction of the second portion (431, 432) of the heat dissipation member (2430). The plurality of slots (S3) may extend in parallel to each other. The extending direction of the slots (S2, S3) may be any one of the extending directions of the first portion (433), and the plurality of slots (S2, S3) may extend in different directions.

[0161] FIG. 16 is a perspective view of a heat dissipation member (4430) according to one embodiment of the present disclosure.

[0162] The description of the components (heat dissipation member (430), receiving area (A)) described with reference to FIGS. 3 to 9 can be equally applied to the components of the same name described with reference to FIGS. 16 and 17 (heat dissipation members (4430, 5430), receiving areas (A1, A2)) to the extent that they are not arranged with each other.

[0163] Referring to FIG. 16, according to one embodiment of the present disclosure, a heat dissipation member (4430) may include a plurality of second portions (4431, 4432, 4433). The plurality of second portions (4431, 4432, 4433) may extend along a second surface (E22) of a second electronic component (E2, see FIG. 7). The plurality of second portions (4431, 4432, 4433) may be connected to each other. The first portion (4434) of the heat dissipation member (4430) and the plurality of second portions (4431, 4432, 4433) may form an accommodation space (A1). The second electronic component (E2) may be accommodated in the accommodation space (A1) of the heat dissipation member (4430).

[0164] According to one embodiment of the present disclosure, a plurality of second portions (4431, 4432, 4433) may face a second surface (E22) of a second electronic component (E2, see FIG. 7). A plurality of second portions (4431, 4432, 4433) may contact a first surface of a first electronic component (E1) (e.g., a first surface (E11) of the first electronic component (E1) of FIG. 3).

[0165] Fig. 17 is a perspective view of a heat dissipation member (5430) according to one embodiment of the present disclosure. Fig. 18 illustrates views of electronic components (E1, E2) and the heat dissipation member (5430) of Fig. 17 disposed on the electronic components (E1, E2) from two directions according to one embodiment of the present disclosure.

[0166] The description of the components (heat dissipation member (430), first part (433) of heat dissipation member (430), second part (431, 432) of heat dissipation member (430), receiving area (A), first area (E111), and second area (E112)) described with reference to FIGS. 3 to 9 can be equally applied to the components (heat dissipation member (5430), first part (5432) of heat dissipation member (5430), second part (5431) of heat dissipation member (5430), receiving area (A2), first area (E111`), and second area (E112`)) of the same name described with reference to FIGS. 17 and 18, to the extent that they are not arranged with each other.

[0167] Referring to FIGS. 17 and 18, a first surface (E11) of a first electronic component (E1) according to one embodiment of the present disclosure may include a first region (E111`) and a second region (E112`). The first region (E111`) may be located at an edge of the first surface (E11). As an example, the first surface (E11) may be divided into two by the first region (E111`) and the second region (E112`).

[0168] According to one embodiment of the present disclosure, the second electronic component (E2) may be disposed in the first area (E111`) of the first surface (E11). The second part (5431) of the heat dissipation member (5430) may be in contact with the second area (E112`) of the first surface (E11).

[0169] According to one embodiment of the present disclosure, a heat dissipation member (5430) may include a first portion (5432) and a second portion (5431). The first portion (5432) of the heat dissipation member (5430) may be disposed on a second electronic component (E2). The first portion (5432) of the heat dissipation member (5430) may contact one surface of the second electronic component (E2) (e.g., the first surface (E21) of the second electronic component (E2) of FIG. 3). The second portion (5431) may protrude from one side of the first portion (5432).

[0170] According to one embodiment of the present disclosure, the second portion (5431) may protrude from the first portion (5432) toward the second region (E112`). The second portion (5431) may extend along the second surface (E22) of the second electronic component (E2, see FIG. 7). The second portion (5431) may face the second surface (E22) of the second electronic component (E2, see FIG. 7). The second portion (5431) of the heat dissipation member (5430) may be configured to contact the second surface (E22) of the second electronic component (E2). As an example, when the temperature of the heat dissipation member (5430) rises and exceeds a threshold temperature (Tc, see FIG. 5), the gel-like heat dissipation member (5430) may come into close contact with the side surface (E22) of the second electronic component (E2).

[0171] According to one embodiment of the present disclosure, a first portion (5434) and a second portion (5431) of a heat dissipation member (5430) can form a receiving space (A2). A second electronic component (E2) can be received in the receiving space (A2) of the heat dissipation member (5430). The second portion (5431) can contact a first surface (E11) of the first electronic component (E1).

[0172] According to one embodiment of the present disclosure, the first electronic component (E1) may include a heat generating block (B). The heat generating block (B) may be positioned below the first surface (E11) and may overlap with the second region (E112). The heat generating block (B) may be positioned below the boundary between the first region (E111) and the second region (E112). Heat generated in the heat generating block (B) may spread to the second electronic component (E2) through the first region (E111). Heat generated in the heat generating block (B) may spread to the second part (432) of the heat dissipation member (430) through the second region (E112).

[0173] According to one embodiment of the present disclosure, the heat generating portion (B) may include a first heat generating portion (B1) and a second heat generating portion (B2). The first heat generating portion (B1) and the second heat generating portion (B2) may be positioned below the first surface (E11) and overlap with the second area (E112). As an example, the first heat generating portion (B1) may be a CPU of a processor (e.g., a processor (120) of FIG. 1), and the second heat generating portion (B2) may be a GPU of the processor (e.g., a processor (120) of FIG. 1).

[0174] FIG. 19 is a perspective view of a heat dissipation member (6430) according to one embodiment of the present disclosure. FIG. 20 is a side view of a heat dissipation member (6430) and electronic components (E1, E2) according to one embodiment of the present disclosure.

[0175] The description of the components (heat dissipation member (430), first part (433) of heat dissipation member (430), second part (431, 432) of heat dissipation member (430), receiving area (A)) described with reference to FIGS. 3 to 9 can be equally applied to the components of the same name described with reference to FIGS. 19 and 20 (heat dissipation member (6430), first part (6433) of heat dissipation member (6430), second part (6431, 6432) of heat dissipation member (6430), receiving area (A3)) to the extent that they are not mutually arranged.

[0176] Referring to FIGS. 19 and 20 , a heat dissipation member (6430) according to one embodiment of the present disclosure may include a third portion (6434, 6435) extending from a second portion (6431, 6432) toward a printed circuit board (410). The third portion (6434, 6435) of the heat dissipation member (6430) may be configured to contact a second surface (E12) of a first electronic component (E1). The surface (E11, E12) of the first electronic component (E1) may include a first surface (E11) and a second surface (E12). As an example, the first surface (E11) of the first electronic component (E1) may be a top surface, and the second surface (E12) of the first electronic component (E1) may be a side surface of the first electronic component (E1).

[0177] According to one embodiment of the present disclosure, the second portion (6431, 6432) of the heat dissipation member (6430) can contact the second area (E112) of the first surface (E11) of the first electronic component (E1). When the temperature of the heat dissipation member (6430) rises to a temperature higher than the phase transition temperature (Tc, see FIG. 5), the second portion (6431, 6432) of the heat dissipation member (6430) can change into a gel state and come into close contact with the second surface (E22) of the second electronic component (E2).

[0178] According to one embodiment of the present disclosure, the heat dissipation member (6430) may include a third portion (6434, 6435) protruding from the second portion (6431, 6432) toward the printed circuit board (410). The third portion (6434, 6435) may be configured to contact at least a portion of the second surface (E12) of the first electronic component (E1). The third portion (6434, 6435) may face at least a portion of the second surface (E12) of the first electronic component (E1). When the temperature of the heat dissipation member (6430) rises above a limit temperature (Tc, see FIG. 5), the third portion (6434, 6435) of the heat dissipation member (6430) may change into a gel state and come into close contact with the second surface (E12) of the first electronic component (E1). The first part (6433), the second part (6431, 6432), and the third part (6434, 6435) of the heat dissipation member (6430) can form a receiving space (A3) in which the first electronic component (E1) and the second electronic component (E2) are received.

[0179] According to one embodiment of the present disclosure, the widths of the second portion (6431, 6432) and the third portion (6434, 6435) of the heat dissipation member (6430) may be different from each other. As an example, the width of the third portion (6434, 6435) may be smaller than the width of the second portion (6431, 6432).

[0180] FIG. 21 is a cross-sectional view of a conductive layer (440) according to one embodiment of the present disclosure.

[0181] According to one embodiment of the present disclosure, the conductive layer (440) may include a first conductive sheet (441). The first conductive sheet (441) may include a conductive layer (441) disposed on a heat dissipation member (430). As an example, the first conductive sheet (441) may be a copper thin film. A first surface of the first conductive sheet (441) may be disposed on the heat dissipation member (430).

[0182] According to one embodiment of the present disclosure, a second surface of the first conductive sheet (441) opposite to the first surface may be coated with a heat dissipating material (450). The second surface (top surface) of the first conductive sheet (441) may be coated with a heat dissipating material (450). The coating layer (450) may include a non-conductive heat dissipating material.

[0183] According to one embodiment of the present disclosure, a heat dissipating material (450) coated on the first surface (top surface) of the first conductive sheet (441) may be referred to as a coating layer (450). The heat dissipating material (450) is a material having a low compressibility, and can minimize and / or reduce the problem of being impressed by a nozzle during a mounter process. The heat dissipating material (450) is a material having a low adhesive strength, and can minimize and / or reduce the problem of being adsorbed to a nozzle during a mounter process. As an example, the heat dissipating material (450) may include an electrical insulator such as aluminum oxide (Al2O3) or aluminum nitride (AlN). As another example, the heat dissipating material (450) may be carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), or manganese oxide (ZnO).

[0184] According to one embodiment of the present disclosure, the conductive layer (440) may include a second conductive sheet (442). The second conductive sheet (442) may include a second opening (443). The second conductive sheet (442) may include a plurality of conductive layers (442a, 442b, 442c). The plurality of conductive layers (442a, 442b, 442c) may include a material having compressibility. For example, the second conductive sheet (442) may be thicker than the first conductive sheet (441). For example, the compressibility of the second conductive sheet (442) may be greater than the compressibility of the first conductive sheet (441). As an example, the second conductive sheet (442) including a plurality of conductive layers (442a, 442b, 442c) may have a compressibility higher than that of the gel-type heat dissipation member (430) (e.g., about 35% or more). The compressed second conductive sheet (442) may exhibit a higher shielding effect than the second conductive sheet (442) before being compressed.

[0185] FIG. 22 is a cross-sectional view of a portion of an electronic device (e.g., the electronic device (101) of FIG. 2), according to one embodiment of the present disclosure, illustrating a substrate assembly (1400). FIG. 23 is a cross-sectional view of a conductive layer (1440) illustrated in FIG. 22, according to one embodiment of the present disclosure.

[0186] The description of the substrate assembly (400) and the conductive layer (440) described with reference to FIGS. 3 to 9 and FIG. 21 can be equally applied to the substrate assembly (1400) and the conductive layer (1440) of the same name described with reference to FIGS. 22 and 23, to the extent that they are not arranged with each other.

[0187] Referring to FIGS. 22 and 23, a substrate assembly (1400) according to one embodiment of the present disclosure may include a conductive layer (1440). The conductive layer (1440) may partially cover the heat dissipation member (430). As an example, the conductive layer (1440) may cover a top surface (e.g., the top surface (434) of the heat dissipation member (430) of FIG. 4) and a portion of a side surface (e.g., the side surface (430o) of the heat dissipation member (430)) of the heat dissipation member (430).

[0188] According to one embodiment of the present disclosure, the conductive layer (1440) may be interposed between the metal cover (M) and the shield can (420). The second portion (1442) may be interposed between the first portion (1441) and the shield can (420). The conductive layer (1440) may have compressibility. When the substrate assembly (1400) is assembled, the gel-like heat dissipation member (430) and the conductive layer (1440) may be compressed.

[0189] According to one embodiment of the present disclosure, the conductive layer (1440) may include a first portion (1441) and a second portion (1442). The first portion (1441) and the second portion (1442) of the conductive layer (1440) may contact the heat dissipation member (430). The second portion (1442) of the conductive layer (1440) may at least partially surround a side surface of the heat dissipation member (430) (e.g., the side surface (430o) of the heat dissipation member (430) of FIG. 4 ). As an example, the first portion (1441) may cover at least a portion of a top surface (e.g., a top surface (434) of the heat dissipation member (430) in FIG. 4) and a side surface (e.g., a side surface (430o) of the heat dissipation member (430)) of the heat dissipation member (430), and may be in contact with the top surface and the side surface of the heat dissipation member (430). According to one embodiment of the present disclosure, the conductive layer (1440) may include a recessed space (1443) in which the heat dissipation member (430) is at least partially accommodated. The conductive layer (1440) may include a recess forming the recessed space (1443). The recess of the conductive layer (1440) may face the top surface (434, see FIG. 4) of the heat dissipation member (430). The second portion (1442) of the challenge layer (1440) can surround the sunken space (1443).

[0190] As electronic components (e.g., processors, memory, etc.) become more integrated and their performance becomes more advanced, the amount of heat generated by these components increases. Failure to reduce the temperature of these components due to heat generation can impact the operation of electronic devices (e.g., performance degradation due to throttling). Consequently, extensive research is being conducted on the heat dissipation structures of electronic components.

[0191] A problem to be solved in the present disclosure may be to provide a heat dissipation structure for an electronic component that contacts multiple outer surfaces of the electronic component.

[0192] A problem to be solved in the present disclosure may be to provide a heat dissipation structure for a plurality of electronic components stacked on top of each other.

[0193] A problem to be solved in the present disclosure may be to increase the contact area between a heat dissipation member and an electronic component.

[0194] A problem to be solved in the present disclosure may be to provide a heat dissipation structure that does not impair the shielding performance of a surrounding shielding structure.

[0195] A problem to be solved in the present disclosure may be to provide a heat dissipation member that is easy to place and assemble.

[0196] The problem to be solved in the present disclosure may be to increase the contact area between a heat dissipation member and an electronic component through a phase change of the heat dissipation member.

[0197] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0198] An electronic device according to various embodiments of the present disclosure can effectively dissipate heat from a plurality of stacked electronic components (e.g., two) since a heat dissipation member contacts each of the stacked electronic components.

[0199] Electronic devices according to various embodiments of the present disclosure can increase the contact area between the heat dissipation member and the electronic component, since the heat dissipation member absorbs heat and changes from a solid phase to a gel phase.

[0200] An electronic device according to various embodiments of the present disclosure can provide a heat dissipation structure that does not impair the shielding performance of a surrounding shielding structure, since a heat dissipation member or a material constituting the heat dissipation member does not flow between shielding members.

[0201] Electronic devices according to various embodiments of the present disclosure can provide heat dissipation members that are easy to place and assemble, since the heat dissipation members change from a solid phase that is easy to place to a gel phase that has a high compressibility.

[0202] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the above description.

[0203] According to one embodiment of the present disclosure, an electronic device (101) may include a first electronic component (E1) disposed on a printed circuit board (410).

[0204] According to one embodiment of the present disclosure, the electronic device (101) may include a second electronic component (E2) mounted on a first surface (E11) of a first electronic component (E1).

[0205] According to one embodiment of the present disclosure, the second electronic component (E2) can be placed on a first area (E111) of a surface (E11, E12) of the first electronic component (E1).

[0206] According to one embodiment of the present disclosure, the electronic device (101) may include a heat-reactive heat-dissipating member (430) including a heat-dissipating material and in contact with the first electronic component (E1) and the second electronic component (E2).

[0207] According to one embodiment of the present disclosure, the heat dissipation member (430) can contact the second area (E112) of the surface (E11, E12) of the first electronic component (E1).

[0208] According to one embodiment of the present disclosure, the heat dissipation member (430) can contact the top surface of the second electronic component (E2).

[0209] According to one embodiment of the present disclosure, the second electronic component (E2) may include a first surface (E21) spaced apart from the first surface (E11) of the first electronic component (E1).

[0210] According to one embodiment of the present disclosure, the second electronic component (E2) may include a second surface (E22) extending from the first surface (E21) of the second electronic component (E2) toward the first surface (E11) of the first electronic component (E1).

[0211] According to one embodiment of the present disclosure, the heat dissipation member (430) may include a first portion (433) that contacts a first surface (top surface, E21) of the second electronic component (E2).

[0212] According to one embodiment of the present disclosure, the heat dissipation member (430) may include a second portion (431, 432) extending from the first portion (433) toward the first surface (E11) of the first electronic component (E1).

[0213] According to one embodiment of the present disclosure, the second portion (431, 432) can contact the first surface (E11) of the first electronic component (E1).

[0214] According to one embodiment of the present disclosure, the second portion (431, 432) may face the second surface (E22) of the second electronic component (E2).

[0215] According to one embodiment of the present disclosure, the second portion (431, 432) can contact the second surface (E22) of the second electronic component (E2).

[0216] According to one embodiment of the present disclosure, the heat dissipation member (430) may be in a solid phase at room temperature (Tr).

[0217] According to one embodiment of the present disclosure, the heat dissipation member (430) may be configured to soften when the temperature of the heat dissipation member (430) rises above a threshold temperature (Tc) higher than the room temperature (Tr).

[0218] According to one embodiment of the present disclosure, the heat dissipation member (430) may be configured to have a compression ratio of 35% or more when the temperature rises above the limit temperature (Tc).

[0219] According to one embodiment of the present disclosure, the heat dissipation member (430) may be configured to at least partially become a gel phase when the temperature rises above the limit temperature (Tc).

[0220] According to one embodiment of the present disclosure, the second part (431, 432) of the heat dissipation member (430) may be configured to contact the second surface (E22) of the second electronic component (E2) when the temperature of the heat dissipation member (430) becomes higher than the limit temperature (Tc).

[0221] According to one embodiment of the present disclosure, the heat dissipation member (430) may include a phase change material that is in a solid phase at room temperature (Tr).

[0222] According to one embodiment of the present disclosure, the phase change material can change from a solid phase to a liquid phase or a gel phase at the phase transition temperature (Tc).

[0223] According to one embodiment of the present disclosure, the phase change material may include a paraffin-based material.

[0224] According to one embodiment of the present disclosure, the heat dissipation member (430) may include a matrix material configured to maintain the heat dissipation member (430) in a gel phase at a temperature higher than the phase transition temperature (Tc).

[0225] According to one embodiment of the present disclosure, the limit temperature (Tc) may be lower than a throttling temperature (Tt) of the first electronic component (E1).

[0226] According to one embodiment of the present disclosure, the first electronic component (E1) may include a plurality of processing cores.

[0227] According to one embodiment of the present disclosure, the limit temperature (Tc) may be lower than the throttling temperatures of the plurality of processing cores.

[0228] According to one embodiment of the present disclosure, the first surface (E11) of the first electronic component (E1) may include a first area (E111) in which the second electronic component (E2) is arranged.

[0229] According to one embodiment of the present disclosure, the first surface (E11) of the first electronic component (E1) may include a second area (E112) that at least partially surrounds the first area (E111).

[0230] According to one embodiment of the present disclosure, the second region (E112) can be in contact with the second portion (431, 432) of the heat dissipation member (430).

[0231] According to one embodiment of the present disclosure, the second part (431, 432) of the heat dissipation member (430) may protrude from the edge of the first part (433) of the heat dissipation member (430) toward the second area (E112) of the surface (E11, E12) of the first electronic component (E1).

[0232] According to one embodiment of the present disclosure, the heat dissipation member (430) may include at least one interface portion (I1, I2, I3) positioned on a first portion (433) of the heat dissipation member (430) and extending between a first surface (434) and a second surface (435) of the first portion (433).

[0233] According to one embodiment of the present disclosure, the first part (433) and the second part (431, 432) of the heat dissipation member (430) can be bonded to each other by heat.

[0234] According to one embodiment of the present disclosure, the second portion (431, 432) of the heat dissipation member (430) may be non-conductive, and the first portion (433) of the heat dissipation member (430) may be conductive.

[0235] According to one embodiment of the present disclosure, the surface (E11, E12) of the first electronic component (E1) may include a first surface (E11) including the first region (E111) and the second region (E112), and a second surface (E12) curved from the first surface.

[0236] According to one embodiment of the present disclosure, the heat dissipation member (6430) may include a third portion (6434, 6435) protruding from the second portion (6431, 6432) toward the printed circuit board (410).

[0237] According to one embodiment of the present disclosure, the third portion (6434, 6435) can contact at least a portion of the second surface (E12) of the first electronic component (E1).

[0238] According to one embodiment of the present disclosure, the thermal conductivity of the second part (431, 432) of the heat dissipation member (430) may be higher than the thermal conductivity of the first part (433) of the heat dissipation member (430).

[0239] According to one embodiment of the present disclosure, the electronic device (101) may include a conductive layer (440; 1440) covering the opening (421) of the shield can (420) and contacting the first surface (434) and the second surface (430o) of the heat dissipation member (430).

[0240] According to one embodiment of the present disclosure, the electronic device (101) may include a coating layer (450) coated on a second surface opposite to the first surface of the conductive layer (440; 1440) that contacts the heat dissipation member (430), and including a non-conductive heat dissipation material.

[0241] According to one embodiment of the present disclosure, the conductive layer (440) may include a first conductive sheet (441) that contacts the first surface (434) of the heat dissipation member (430).

[0242] According to one embodiment of the present disclosure, the second conductive sheet (442) surrounds the second surface (430o) of the heat dissipation member (430) and can contact the second surface (430o) of the heat dissipation member (430).

[0243] According to one embodiment of the present disclosure, the electronic device (101) may include a shield can (420) disposed on the printed circuit board (410).

[0244] According to one embodiment of the present disclosure, the shield can (420) can surround the first electronic component (E1) and the second electronic component (E2).

[0245] According to one embodiment of the present disclosure, the shield can (420) may include a first opening (opening, 421) in which the heat dissipation member (430) is received.

[0246] According to one embodiment of the present disclosure, the electronic device (101) may include a second conductive sheet (442) interposed between the shield can (420) and the first conductive sheet (441).

[0247] According to one embodiment of the present disclosure, the second challenge sheet (442) may include a second opening (443) in which the heat dissipation member (430) is received.

[0248] According to one embodiment of the present disclosure, the second conductive sheet (442) may have lower thermal conductivity than the first conductive sheet (441).

[0249] According to one embodiment of the present disclosure, the edge of the second opening (443) can contact the heat dissipation member (430).

[0250] According to one embodiment of the present disclosure, the first electronic component (E1) may include at least one processing core (processing core B).

[0251] According to one embodiment of the present disclosure, the second electronic component (E2) is operatively connected to the at least one processing core, and instructions to be executed by the at least one processing core can be stored.

[0252] According to one embodiment of the present disclosure, the at least one processing core (B) may at least partially overlap with a second area (E112) of the surface (E11, E12) of the first electronic component (E1).

[0253] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In electronic devices, Printed circuit board (410); A first electronic component (E1) mounted on the printed circuit board (410); A second electronic component (E2) arranged on a first area (E111) of a surface (E11, E12) of the first electronic component (E1); and A heat dissipation member (430) comprising a heat dissipation material and in contact with a second region (E112) of a surface (E11, E12) of the first electronic component (E1) and a top surface of the second electronic component (E2), An electronic device wherein the heat dissipation member is formed in a solid state and configured to soften based on the temperature of the heat dissipation member.

2. In paragraph 1, The above heat dissipation member (430) is An electronic device that is in a solid phase at room temperature (Tr) and is configured to soften based on the temperature of the heat dissipation member (430) rising above a threshold temperature (Tc) higher than the room temperature (Tr).

3. In either paragraph 1 or paragraph 2, The above heat dissipation member (430) is An electronic device configured to have a compression ratio of 35% or greater based on a temperature increase above the above limit temperature (Tc).

4. In any one of paragraphs 1 to 3, The above heat dissipation member (430) is An electronic device configured to at least partially form a gel phase when the temperature rises above the above-described limit temperature (Tc).

5. In any one of paragraphs 1 to 4, The above heat dissipation member (430) is: A first part (433) that contacts the top surface (E21) of the second electronic component (E2); and It includes a second part (431, 432) protruding from the first part toward the second area (E112) of the surface (E11, E12) of the first electronic component (E1), The second part (431, 432) of the above heat dissipation member (430) is An electronic device configured to contact a lateral surface (E22) of the second electronic component (E2) based on the temperature of the heat dissipation member (430) being higher than the limit temperature (Tc).

6. In any one of paragraphs 1 to 5, The above heat dissipation member (430) is: An electronic device comprising a phase change material of the paraffin series which is in a solid phase at room temperature (Tr) and changes from a solid phase to a liquid phase or a gel phase at the limit temperature (Tc).

7. In any one of paragraphs 1 to 6, The above first electronic component (E1) includes a plurality of processing cores, An electronic device wherein the above limit temperature (Tc) is lower than the throttling temperatures of the plurality of processing cores.

8. In any one of paragraphs 1 to 7, The above heat dissipation member (430) is An electronic device comprising at least one interface portion (I1, I2, I3) positioned on a first portion (433) of the heat dissipation member (430) and extending between a first surface (434) and a second surface (435) of the first portion (433).

9. In any one of paragraphs 1 to 8, An electronic device wherein the second part (431, 432) of the heat dissipation member (430) is non-conductive and the first part (433) of the heat dissipation member (430) is conductive.

10. In any one of paragraphs 1 to 9, The surface (E11, E12) of the first electronic component (E1) is A first surface (E11) including the first region (E111) and the second region (E112), and a second surface (E12) bent from the first surface, The above heat dissipation member (6430) is An electronic device including a third portion (6434, 6435) protruding from the second portion (6431, 6432) toward the printed circuit board (410) and contacting at least a portion of the second surface (E12) of the first electronic component (E1).

11. In any one of paragraphs 1 to 10, An electronic device in which the thermal conductivity of the second part (431, 432) of the heat dissipation member (430) is higher than the thermal conductivity of the first part (433) of the heat dissipation member (430).

12. In any one of paragraphs 1 to 11, A shield can (shield can, 420) disposed on the printed circuit board (410), surrounding the first electronic component (E1) and the second electronic component (E2), and including an opening (opening, 421) in which the heat dissipation member (430) is received; and An electronic device further comprising a conductive layer (440; 1440) covering the opening (421) of the shield can (420) and contacting the first surface (434) and the second surface (430o) of the heat dissipation member (430).

13. In any one of paragraphs 1 to 12, The above challenge layer (440) is: A first conductive sheet (441) contacting the first surface (434) of the above heat dissipation member (430); and A second conductive sheet (442) interposed between the shield can (420) and the first conductive sheet (441), surrounding the second surface (430o) of the heat dissipation member (430), and in contact with the second surface (430o) of the heat dissipation member (430), An electronic device wherein the thermal conductivity of the second challenge sheet (442) is lower than that of the first challenge sheet (441).

14. In any one of paragraphs 1 to 13, An electronic device further comprising a coating layer (450) comprising a non-conductive heat-dissipating material, the coating layer being coated on a second surface opposite to the first surface of the conductive layer (440; 1440) that contacts the heat-dissipating member (430).

15. In any one of paragraphs 1 to 14, The above first electronic component (E1) includes at least one processing core, The second electronic component (E2) is operatively connected to the at least one processing core, and stores instructions to be performed by the at least one processing core. At least one of the above processing cores, An electronic device in which the second area (E112) of the surface (E11, E12) of the first electronic component (E1) at least partially overlaps with the second area (E112).

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