IGBT module packaging structure and packaging method therefor

Abstract

An IGBT module packaging structure and a packaging method therefor. The IGBT module packaging structure comprises an IGBT module main body (1), and further comprises a base plate (211) and a packaging shell (212), wherein the IGBT module main body (1) is located at the top end of the base plate (211), and the packaging shell (212) is connected to the top of the base plate (211) by means of a limiting mechanism; the limiting mechanism comprises an engagement block (214), a fixing sleeve (215), an engagement slot (216), a rack plate (217) and a recess (218), the engagement block (214) being fixed to an outer wall of the packaging shell (212), the fixing sleeve (215) being fixed to the top end of the base plate (211), the engagement slot (216) that allows vertical movement of the engagement block (214) being provided at the top of the fixing sleeve (215), and the recess (218) being provided in a side wall of the engagement block (214). In the IGBT module packaging structure and the packaging method therefor, the packaging shell (212) is sleeved on the base plate (211) and the IGBT module main body (1), the engagement block (214) is inserted into the engagement slot (216), and finally a knob (225) is released to drive rebounding of the rack plate (221) under the elasticity of a telescopic spring (221); thus, the rack plate (217) may be inserted into the recess (218) inside the engagement block (214) to restrict upward movement of the engagement block (214), enabling the packaging shell (212) to be easily limited, enhancing the device packaging stability.

Description

IGBT module packaging structure and packaging method thereof Technical Field

[0001] The present invention relates to the technical field of packaging structures, and in particular to an IGBT module packaging structure and a packaging method thereof. Background Art

[0002] With the continuous development of power electronics technology, power modules have been increasingly widely used in industries such as aerospace, rail transportation, new energy vehicles, wind power generation, and photovoltaic power generation. The mainstream power module on the market today is the IGBT (Insulated Gate Bipolar Transistor) power module. Traditional IGBT power module packaging primarily involves soldering the collector of the power chip and the anode of the anti-parallel diode chip (FRD) to a copper-clad ceramic substrate (DBC) using lead-free solder. Wire bonding is then used to electrically interconnect the chips and the DBC board. A copper substrate is connected to the other side of the DBC, which is connected to a heat sink via thermal grease to dissipate heat from the power module. An IGBT module generally consists of components such as an IGBT chip, an FRD chip, a DBC, solder, a substrate, aluminum / copper-aluminum wire, and components.

[0003] For example, a Chinese patent application, with publication number CN219267635U, discloses an IGBT module packaging structure comprising a substrate and a housing covering the substrate. The substrate and the interior of the housing form a housing for accommodating electronic devices. The structure further comprises a first chip, a second chip, and an electromagnetic wave absorbing silicone layer located within the housing cavity. The first chip and the second chip are both connected to bonding wires. The electromagnetic wave absorbing silicone layer fills the housing cavity and completely covers the first chip, the second chip, and the bonding wires. The electromagnetic wave absorbing silicone layer in the IGBT module packaging structure of the present invention completely covers the first chip, the second chip, and the bonding wires, providing long-term and effective protection for the IGBT power supply and electronic components. The electromagnetic wave absorbing silicone layer encapsulated in the housing cavity has a certain thickness, giving it good mechanical properties structurally and eliminating stress caused by shock and vibration within a wide temperature and humidity range.

[0004] The above packaging structure is inconvenient to disassemble and assemble during use, and the operation is relatively cumbersome during the disassembly and assembly process. In addition, the packaging shell is easily caused to fall off during use, which reduces the packaging efficiency of the device and affects the packaging effect.

[0005] Summary of the Invention

[0006] (1) Technical problems solved

[0007] In response to the deficiencies in the prior art, the present invention provides an IGBT module packaging structure and a packaging method thereof, wherein the packaging shell is sleeved on the base plate and the IGBT module body, the card block is inserted into the card slot, and finally the knob is loosened to drive the rack plate to rebound under the elasticity of the telescopic spring. The rack plate is used to be inserted into the groove inside the card block to limit the upward movement of the card block, which can facilitate the limiting processing of the packaging shell, enhances the stability of the device packaging, and solves the problems raised in the background technology.

[0008] (2) Technical solution

[0009] To achieve the above objectives, the present invention provides the following technical solutions: an IGBT module packaging structure and a packaging method thereof, comprising an IGBT module body, a base plate, and a packaging shell, wherein the IGBT module body is located on top of the base plate, and the packaging shell is connected to the top of the base plate via a limiting mechanism;

[0010] The limiting mechanism includes a card block, a fixing sleeve, a card slot, a rack plate and a groove. The card block is fixed to the outer wall of the packaging shell, the fixing sleeve is fixed to the top of the bottom plate, the top of the fixing sleeve is provided with a card slot for the card block to move up and down, the side wall of the card block is provided with a groove, and the top of the bottom plate is slidably connected to the rack plate corresponding to the groove;

[0011] A transparent plate is fixed in the middle position of the packaging shell, and a cleaning mechanism is provided at the top of the packaging shell. The cleaning mechanism includes a movable plate, a cleaning pad and a driving component. The movable plate is connected to the top of the packaging shell through the driving component, and a cleaning pad corresponding to the transparent plate is fixed at the bottom of the movable plate.

[0012] Preferably, a first fixing plate is fixed to the top of the bottom plate, a fixing rod is fixed to the outer wall of the first fixing plate, and the rack plate is sleeved on the outer wall of the fixing rod.

[0013] Preferably, a telescopic spring is wound around the outer wall of the fixing rod, one end of the telescopic spring is connected to the first fixing plate, and the other end is connected to the rack plate.

[0014] Preferably, a second fixing plate is fixed to the top of the bottom plate, and a rotating rod is rotatably connected to the inner wall of the second fixing plate. A rotating gear meshing with the rack plate is fixed to one end of the rotating rod, and a knob is fixed to the other end.

[0015] Preferably, the driving component includes a connecting plate, a screw and a threaded sleeve. Two groups of connecting plates are fixed at the front and rear ends of the packaging shell respectively. The inner walls of the two groups of connecting plates are rotatably connected to the screw, and the outer wall of the screw is threadedly connected to the threaded sleeve fixedly connected to the movable plate.

[0016] Preferably, a pulley is fixed to the outer wall of the screw rod, and the two groups of pulleys are connected by belt transmission. A rotating handle is fixed to the end of any group of screw rods away from the pulley.

[0017] Preferably, a fixed cylinder is fixed to the bottom end of the base plate, a movable cylinder is fixed to the bottom end of the fixed cylinder, and a pad is fixed to the bottom end of the movable cylinder.

[0018] Preferably, a first connecting rod is fixed between the adjacent movable cylinders on the left and right sides, and a second connecting rod is fixed to the opposite side of the two groups of the first connecting rods.

[0019] Preferably, an adjusting screw is fixed to the bottom end of the base plate, a rotating screw sleeve corresponding to the thread of the adjusting screw is rotatably connected to the bottom end of the second connecting rod, and a baffle is fixed to the bottom end of the adjusting screw.

[0020] An IGBT module packaging method includes the following steps:

[0021] Step 1: Place the IGBT module body on the base plate, and rotate the knob to drive the rotating rod and the rotating gear to rotate, driving the rack plate to move to the left and compressing the telescopic spring;

[0022] Step 2: Then put the package shell on the base plate and the IGBT module body, and insert the card block into the card slot;

[0023] Step 3: Finally, loosen the knob and drive the rack plate to rebound under the elasticity of the telescopic spring. The rack plate is used to be inserted into the groove inside the card block to limit the upward movement of the card block.

[0024] (3) Beneficial effects

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. By setting a base plate, a packaging shell, a transparent plate, a card block, a fixing sleeve, a card slot, a rack plate and a groove in combination, the packaging shell is sleeved on the base plate and the IGBT module body, and the card block is inserted into the card slot. Finally, the knob is loosened to drive the rack plate to rebound under the elasticity of the telescopic spring. The rack plate is used to be inserted into the groove inside the card block to limit the upward movement of the card block, which can facilitate the limiting processing of the packaging shell and enhance the stability of the device packaging.

[0027] 2. By setting up a connecting plate, a screw rod, a threaded sleeve, a movable plate, a cleaning pad, a pulley, a belt and a rotating handle in combination, the screw rod is driven to rotate by rotating the rotating handle, and the two sets of pulleys and the belt are rotated. Under the action of the thread, the threaded sleeve, the movable plate and the cleaning pad are driven to move laterally. The cleaning pad can wipe and clean the outer wall of the transparent plate, which is convenient for staff to observe.

[0028] 3. By setting up a fixed cylinder, a movable cylinder, a pad, a first connecting rod, a second connecting rod, an adjusting screw, a rotating screw sleeve and a baffle for use in combination, the rotating screw sleeve is used to drive the second connecting rod, the first connecting rod and the four sets of movable cylinders to move upward under the action of the thread, which can reduce the distance between the bottom plate and the supporting surface, reduce the packaging height of the equipment, and save time and effort in operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic diagram of the three-dimensional structure of the present invention;

[0030] FIG2 is a schematic structural diagram of the limiting mechanism of the present invention;

[0031] FIG3 is an enlarged structural diagram of point A in FIG2 of the present invention;

[0032] FIG4 is a schematic structural diagram of a cleaning pad according to the present invention;

[0033] FIG5 is a schematic diagram of the structure of the adjusting screw of the present invention;

[0034] FIG6 is a schematic structural diagram of the rotary handle of the present invention.

[0035] In the figure: 1. IGBT module body; 211. Base plate; 212. Package shell; 213. Transparent plate; 214. Block; 215. Fixed sleeve; 216. Slot; 217. Rack plate; 218. Groove; 219. First fixed plate; 220. Fixed rod; 221. Telescopic spring; 222. Second fixed plate; 223. Rotating rod; 224. Rotating gear; 225. Knob; 311. Connecting plate; 312. Screw rod; 313. Threaded sleeve; 314. Moving plate; 315. Cleaning pad; 316. Pulley; 317. Belt; 318. Rotating handle; 411. Fixed cylinder; 412. Movable cylinder; 413. Pad; 414. First connecting rod; 415. Second connecting rod; 416. Adjusting screw; 417. Rotating sleeve; 418. Baffle. DETAILED DESCRIPTION

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] Example

[0038] 1-6 , an IGBT module packaging structure and packaging method thereof include an IGBT module body 1 , a base plate 211 , and a packaging shell 212 . The IGBT module body 1 is located at the top of the base plate 211 , and the packaging shell 212 is connected to the top of the base plate 211 through a limiting mechanism.

[0039] The limiting mechanism includes a block 214, a fixing sleeve 215, a slot 216, a rack plate 217 and a groove 218. The block 214 is fixed to the outer wall of the packaging shell 212, and a fixing sleeve 215 is fixed to the top of the bottom plate 211. A slot 216 for the block 214 to move up and down is provided on the top of the fixing sleeve 215. A groove 218 is provided on the side wall of the block 214. A rack plate 217 corresponding to the groove 218 is slidably connected to the top of the bottom plate 211. The rack plate 217 can slide horizontally to enter and exit the groove 218. When the rack plate 217 is inserted into the groove 218, it can be used to limit the block 214 from being disengaged from the slot 216. When the rack plate 217 is disengaged from the groove 218, the packaging shell 212 can be disassembled and removed by pulling it upward, thereby achieving the purpose of easy disassembly and assembly. A first fixed plate 219 is fixed to the top of the base plate 211. A fixed rod 220 is fixed to the outer wall of the first fixed plate 219. A rack plate 217 is sleeved on the outer wall of the fixed rod 220, which can provide good stability. A telescopic spring 221 is wound around the outer wall of the fixed rod 220. One end of the telescopic spring 221 is connected to the first fixed plate 219 and the other end is connected to the rack plate 217. The provision of the telescopic spring 221 has a good elastic effect. A second fixed plate 222 is fixed to the top of the base plate 211. The inner wall of the second fixed plate 222 is rotatably connected to a rotating rod 223. A rotating gear 224 that meshes with the rack plate 217 is fixed to one end of the rotating rod 223, and a knob 225 is fixed to the other end. Rotating the knob 225 can drive the rotating rod 223 and the rotating gear 224 to rotate. The rotating gear 224 can be used to drive the rack plate 217 to move back and forth laterally, achieving a good driving effect.

[0040] A transparent plate 213 is fixed in the middle of the package shell 212. The transparent plate 213 can be made of glass or transparent PVC, which can facilitate the observation of the IGBT module body 1 by the staff. A cleaning mechanism is provided at the top of the package shell 212. The cleaning mechanism includes a movable plate 314, a cleaning pad 315, and a driving component. The movable plate 314 is connected to the top of the package shell 212 via the driving component. A cleaning pad 315 corresponding to the transparent plate 213 is fixed to the bottom of the movable plate 314. When the movable plate 314 and the cleaning pad 315 move, they can drive the cleaning pad 315 to wipe and clean the surface of the transparent plate 213. The cleaning pad 315 can be made of sponge material, which has a good cleaning effect.

[0041] The drive components include a connecting plate 311, a screw rod 312, and a threaded sleeve 313. Two sets of connecting plates 311 are fixed to the front and rear ends of the encapsulation shell 212. The inner walls of the two sets of connecting plates 311 are rotatably connected to the screw rods 312. The outer walls of the screw rods 312 are threadedly connected to the threaded sleeve 313 fixedly connected to the movable plate 314. The rotating screw rod 312 can drive the threaded sleeve 313, the movable plate 314, and the cleaning pad 315 to move back and forth horizontally under the action of the thread, achieving a relatively stable driving purpose. A pulley 316 is fixed to the outer wall of the screw rod 312. The two sets of pulleys 316 are connected by a belt 317. This arrangement ensures that the two sets of screw rods 312 can rotate synchronously. A rotating handle 318 is fixed to the end of each set of screw rods 312 away from the pulleys 316. The provision of the rotating handle 318 facilitates the rotation of the screw rods 312.

[0042] A fixed cylinder 411 is fixed to the bottom end of the bottom plate 211, a movable cylinder 412 is fixed to the bottom end of the fixed cylinder 411, and a pad 413 is fixed to the bottom end of the movable cylinder 412. The pad 413 can be made of rubber material with good wear resistance. The movable cylinder 412 can move inside the fixed cylinder 411 and is used to adjust the use height of the packaging shell 212. A first connecting rod 414 is fixed between the adjacent movable cylinders 412 on the left and right sides, and a second connecting rod 415 is fixed to the opposite side of the two groups of first connecting rods 414. An adjusting screw 416 is fixed to the bottom end of the bottom plate 211, and a rotating screw sleeve 417 corresponding to the thread of the adjusting screw 416 is rotatably connected to the bottom end of the second connecting rod 415. A baffle 418 is fixed to the bottom end of the adjusting screw 416. Rotating the rotating screw sleeve 417 can drive the second connecting rod 415 to adjust up and down under the action of the thread, and can synchronously drive the four groups of movable cylinders 412 to move up and down, making the operation more efficient.

[0043] An IGBT module packaging method includes the following steps:

[0044] Step 1: Place the IGBT module body 1 on the base plate 211, and rotate the knob 225 to drive the rotating rod 223 and the rotating gear 224 to rotate, thereby moving the rack plate 217 to the left and compressing the telescopic spring 221;

[0045] Step 2: Then, the package shell 212 is sleeved on the base plate 211 and the IGBT module body 1, and the card block 214 is inserted into the card slot 216;

[0046] Step 3: Finally, release the knob 225 to drive the rack plate 217 to rebound under the elasticity of the telescopic spring 221. The rack plate 217 is used to be inserted into the groove 218 inside the block 214 to limit the upward movement of the block 214.

[0047] Working principle: When packaging is required, the IGBT module body 1 is placed on the base plate 211, and the knob 225 is rotated to drive the rotating rod 223 and the rotating gear 224 to rotate, driving the rack plate 217 to move leftward and compressing the telescopic spring 221. Then, the packaging shell 212 is sleeved on the base plate 211 and the IGBT module body 1, so that the block 214 is inserted into the slot 216. Finally, the knob 225 is released to drive the rack plate 217 to rebound under the elasticity of the telescopic spring 221. The rack plate 217 is used to be inserted into the groove 218 inside the block 214 to limit the upward movement of the block 214.

[0048] When the transparent plate 213 needs to be cleaned, the rotating handle 318 is rotated to drive the screw 312 to rotate, and the two sets of pulleys 316 and the belt 317 are rotated. Under the action of the thread, the threaded sleeve 313, the movable plate 314 and the cleaning pad 315 are driven to move horizontally. The cleaning pad 315 can wipe and clean the outer wall of the transparent plate 213, making it convenient for staff to observe.

[0049] When the height of the base plate 211 needs to be adjusted, the rotating sleeve 417 is used to drive the second connecting rod 415, the first connecting rod 414 and the four sets of movable cylinders 412 to move upward under the action of the thread, which can reduce the distance between the base plate 211 and the supporting surface, reduce the packaging height of the equipment, and save time and effort in operation.

[0050] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An IGBT module packaging structure, comprising an IGBT module body (1), characterized in that: It also comprises a bottom plate (211) and a packaging shell (212), wherein the IGBT module body (1) is located at the top of the bottom plate (211), and the packaging shell (212) is connected to the top of the bottom plate (211) via a limiting mechanism; The limiting mechanism comprises a clamping block (214), a fixing sleeve (215), a clamping groove (216), a rack plate (217) and a groove (218); the clamping block (214) is fixed to the outer wall of the packaging shell (212); the fixing sleeve (215) is fixed to the top of the bottom plate (211); the top of the fixing sleeve (215) is provided with a clamping groove (216) for the clamping block (214) to move up and down; the side wall of the clamping block (214) is provided with a groove (218); the top of the bottom plate (211) is slidably connected with a rack plate (217) corresponding to the groove (218); A transparent plate (213) is fixed in the middle of the packaging shell (212); a cleaning mechanism is arranged at the top of the packaging shell (212); the cleaning mechanism comprises a moving plate (314), a cleaning pad (315) and a driving component; the moving plate (314) is connected to the top of the packaging shell (212) via the driving component; a cleaning pad (315) corresponding to the transparent plate (213) is fixed at the bottom of the moving plate (314).

2. An IGBT module packaging structure according to claim 1, characterized in that: A first fixing plate (219) is fixed to the top of the bottom plate (211), a fixing rod (220) is fixed to the outer wall of the first fixing plate (219), and the rack plate (217) is sleeved on the outer wall of the fixing rod (220).

3. An IGBT module packaging structure according to claim 2, characterized in that: A telescopic spring (221) is wound around the outer wall of the fixing rod (220); one end of the telescopic spring (221) is connected to the first fixing plate (219), and the other end is connected to the rack plate (217).

4. The IGBT module packaging structure according to claim 3, characterized in that: A second fixed plate (222) is fixed to the top of the bottom plate (211); a rotating rod (223) is rotatably connected to the inner wall of the second fixed plate (222); a rotating gear (224) meshing with the rack plate (217) is fixed to one end of the rotating rod (223); and a knob (225) is fixed to the other end.

5. The IGBT module packaging structure according to claim 1, characterized in that: The driving component comprises a connecting plate (311), a screw rod (312) and a threaded sleeve (313); two groups of connecting plates (311) are respectively fixed at the front and rear ends of the packaging shell (212); the inner walls of the two groups of connecting plates (311) are rotatably connected to the screw rod (312); and the outer wall of the screw rod (312) is threadedly connected to the threaded sleeve (313) fixedly connected to the moving plate (314).

6. The IGBT module packaging structure according to claim 5, characterized in that: A pulley (316) is fixed on the outer wall of the screw rod (312), and two groups of pulleys (316) are connected by belts (317). A rotating handle (318) is fixed on one end of any group of screw rods (312) away from the pulley (316).

7. The IGBT module packaging structure according to claim 1, characterized in that: A fixed cylinder (411) is fixed to the bottom end of the bottom plate (211), a movable cylinder (412) is fixed to the bottom end of the fixed cylinder (411), and a pad (413) is fixed to the bottom end of the movable cylinder (412).

8. An IGBT module packaging structure according to claim 7, characterized in that: A first connecting rod (414) is fixed between the adjacent movable cylinders (412) on the left and right sides, and a second connecting rod (415) is fixed to the opposite side of the two groups of the first connecting rods (414).

9. The IGBT module packaging structure according to claim 8, characterized in that: An adjusting screw (416) is fixed to the bottom end of the bottom plate (211), a rotating screw sleeve (417) corresponding to the thread of the adjusting screw (416) is rotatably connected to the bottom end of the second connecting rod (415), and a baffle (418) is fixed to the bottom end of the adjusting screw (416).

10. A packaging method based on an IGBT module packaging structure according to any one of claims 1 to 9, characterized in that: The steps are as follows: Step 1: Place the IGBT module body (1) on the bottom plate (211), and rotate the knob (225) to drive the rotating rod (223) and the rotating gear (224) to rotate, thereby driving the rack plate (217) to move leftward and driving the telescopic spring (221) to be compressed; Step 2: Then, the packaging shell (212) is sleeved on the base plate (211) and the IGBT module body (1), and the card block (214) is inserted into the card slot (216); Step 3: Finally, the knob (225) is released to drive the rack plate (217) to rebound under the elasticity of the telescopic spring (221). The rack plate (217) is used to be inserted into the groove (218) inside the block (214) to limit the upward movement of the block (214).

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