Electroplating apparatus and electroplating method for non-circular substrate

Abstract

An electroplating apparatus for a non-circular substrate, comprising: a central electrode region, which is circular, wherein the size of the central electrode region is an inscribed circle of a non-circular substrate, a central electrode is provided in the central electrode region, and the central electrode region is filled with the central electrode; a peripheral electrode region, which is arranged to surround the central electrode region, wherein the peripheral size of the peripheral electrode region is a circumscribed circle of the non-circular substrate, a peripheral electrode is arranged in the peripheral electrode region, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode region; a power source module, which comprises a plurality of power sources for supplying power to the central electrode and the peripheral electrode; and a control module, which is configured to detect a rotation position of the substrate, calculate the amplitude of a current required by each current block electrode at present, and feed back the amplitude of the current to the power source module so as to adjust the amplitude of the current.

Description

Electroplating device and electroplating method for non-circular substrate Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to an electroplating process in semiconductor manufacturing technology. Background Art

[0002] Most traditional substrates are round, while chips are mostly square. Forming a square chip on a round substrate will lead to waste of substrate corner area due to shape mismatch. Therefore, the area utilization rate of producing square chips on a round substrate is not high, which also affects the chip production efficiency to a certain extent.

[0003] With the increasing popularity of panel-level packaging and changes in substrate materials, the use of square substrates is increasing. Square substrates better match the shape of chips and can accommodate more chips on the same substrate area than circular substrates. Chips can also be placed in the edge areas of square substrates. Therefore, square substrate area utilization is improved, while also improving chip production efficiency.

[0004] When electroplating a square substrate, vertical electroplating is generally adopted. The existing vertical electroplating method is generally to clamp the substrate to a special fixture, and immerse the substrate and the fixture one by one in multiple different plating tanks. During electroplating, the current is output to the fixture, and then conducted to the substrate surface through the metal clamping point of the fixture, so that the copper ions in the chemical solution adhere to the surface to complete the electroplating. The square substrate after the vertical electroplating is completed cannot achieve the same effect as the circular substrate, such as poor surface flatness, and COP (Crystal Originated Particles) defects will be more obvious. In addition, during the vertical electroplating process, the substrate and the fixture are switched between different plating tanks together, and the problem of cross-contamination of the plating solution cannot be avoided, which will also affect the stability of the chemical solution and the coating. At the same time, vertical electroplating cannot effectively adjust the upper and lower differences in the electroplating effect of the square substrate.

[0005] Moreover, directly using the existing electroplating device to perform horizontal electroplating on the square substrate will cause the problem of the edge being too thick. As shown in Figures 1A-1B and 2A-2B, the electrode 1 of the existing electroplating device is mostly circular or annular. When the electroplating process is performed on a square substrate or a rectangular substrate, the substrate cannot cover all the electrode areas because the shape does not match the electrode. During the rotation of the square substrate w, the central area 101 of the electrode 1 will always be covered by the substrate w. However, at the same time, only part of the electrode area of ​​the edge area of ​​the electrode 1 is covered by the substrate w, thereby forming a situation where the edge of the substrate w cuts the electric field, which will cause uneven electroplating and greatly increase the height of the copper column at the edge of the substrate.

[0006] Summary of the Invention

[0007] The object of the present invention is to provide an electroplating device and an electroplating method for a non-circular substrate.

[0008] To achieve the above and other related purposes, the present invention provides an electroplating device for a non-circular substrate, comprising:

[0009] a central electrode region, which is circular and has a size equal to an inscribed circle of the non-circular substrate, wherein a central electrode is disposed in the central electrode region and fills the central electrode region;

[0010] a peripheral electrode region, arranged around the central electrode region, wherein the outer perimeter of the peripheral electrode region is the circumscribed circle of the non-circular substrate, and peripheral electrodes are arranged in the peripheral electrode region, wherein the peripheral electrodes are a plurality of block-shaped electrodes that fill the peripheral electrode region;

[0011] a power supply module, comprising a plurality of power supplies, for supplying power to the central electrode and the peripheral electrodes;

[0012] The control module is used to detect the rotation position of the substrate, calculate the current required by each block electrode and notify the power module to adjust the current.

[0013] Preferably, the current required by the block electrode is Wherein, S' is the area of ​​the block electrode covered by the substrate, S is the area of ​​the block electrode, and I is the current supplied by the power module to the central electrode area.

[0014] Preferably, there are multiple peripheral electrode areas, and the multiple peripheral electrode areas are concentric rings.

[0015] Preferably, the block electrode is obtained by dividing the peripheral electrode into N equal parts, where N is a multiple of 4.

[0016] Preferably, the control module includes an angle sensor and a projection simulator, the angle sensor is used to track the angle of rotation of the substrate, and the projection simulator simulates the current position of each vertex of the substrate according to the angle of rotation of the substrate to determine the projection area of ​​the substrate in the peripheral electrode area, and further calculates the area of ​​each block electrode covered by the substrate.

[0017] Preferably, the control module includes an angle sensor and a controller, the angle sensor is used to track the rotation of the substrate to identify the angle of rotation of the substrate, and the controller presets the current size that needs to be adjusted for each corresponding block electrode based on the substrate rotation angle interval. When the angle sensor identifies that the substrate rotates at each angle interval, the controller feeds back the preset current size to the power supply module to adjust the corresponding current.

[0018] Preferably, each block electrode is powered by a corresponding one of the plurality of power supplies.

[0019] Preferably, the non-circular substrate is square.

[0020] Preferably, every two centrosymmetrical block electrodes form a group, to obtain a plurality of electrode groups, and each electrode group is powered by a power supply.

[0021] Preferably, the non-circular substrate is square.

[0022] Preferably, the number of power supplies provided in each peripheral electrode region is the maximum number of block electrodes that can be covered by any corner of the substrate in each peripheral electrode region.

[0023] The present invention also provides an electroplating method for a non-circular substrate, characterized by comprising:

[0024] Dividing the electrode area includes dividing the electrode area into a central electrode area and a peripheral electrode area, wherein the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, and the central electrode fills the central electrode area, and a peripheral electrode area is arranged around the central electrode area, and an outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, and a peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area;

[0025] Tracking the rotational position of the substrate;

[0026] Calculate the current required for each block electrode based on the effective area of ​​each block electrode covered by the substrate;

[0027] The current required by each block electrode is adjusted and supplied to the corresponding block electrode.

[0028] The present invention also provides an electroplating method for a non-circular substrate, characterized by comprising:

[0029] Dividing the electrode area includes dividing the electrode area into a central electrode area and a peripheral electrode area, wherein the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, and the central electrode fills the central electrode area, and a peripheral electrode area is arranged around the central electrode area, and an outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, and a peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area;

[0030] Preset the current parameters required for each block electrode corresponding to each rotation angle interval of the substrate;

[0031] Tracking the rotational position of the substrate;

[0032] When the substrate rotates at each angular interval, the current is adjusted according to the preset power parameters and supplied to the corresponding block electrodes.

[0033] As described above, the electroplating apparatus and method provided by the present invention divides the electrode into a central electrode region and a peripheral electrode region, and arranges multiple small electrode blocks within the peripheral electrode region to fill the peripheral electrode region. By measuring the change in the area covered by each small electrode block during substrate rotation and adjusting the current supplied to each small electrode block, the problem of uneven electroplating and excessively high edge copper pillars on non-circular substrates caused by existing electroplating apparatus can be solved.

[0034] Summary of the Figures

[0035] FIG1A is a schematic diagram showing a conventional electroplating apparatus performing an electroplating process on a square substrate;

[0036] FIG1B is a schematic diagram showing a square substrate rotated at a certain angle on a conventional electroplating apparatus;

[0037] FIG2A is a schematic diagram showing a conventional electroplating apparatus performing an electroplating process on a rectangular substrate;

[0038] FIG2B is a schematic diagram showing a rectangular substrate rotated at a certain angle on a conventional electroplating apparatus;

[0039] FIG3A is a schematic diagram showing a peripheral electrode of a non-circular substrate electroplating apparatus divided into four equal parts according to an embodiment of the present invention;

[0040] FIG3B is a schematic diagram showing a non-circular substrate electroplating apparatus divided into eight equal parts according to an embodiment of the present invention;

[0041] FIG3C is a schematic diagram showing a peripheral electrode of a non-circular substrate electroplating apparatus divided into sixteen equal parts according to an embodiment of the present invention;

[0042] FIG4 is a schematic diagram showing a power supply control of a non-circular substrate electroplating device according to an embodiment of the present invention;

[0043] FIG5A is a schematic diagram showing the change in the area of ​​the square substrate w covering the peripheral electrode region during the rotation process;

[0044] FIG5B is a schematic diagram showing the change in the area of ​​the rectangular substrate w covering the peripheral electrode region during the rotation process;

[0045] FIG6A is a schematic diagram showing a power supply control method of a rectangular substrate electroplating device according to an embodiment of the present invention;

[0046] FIG6B is a schematic diagram showing a power supply control method of a square substrate electroplating device according to an embodiment of the present invention;

[0047] 7A-7E are schematic diagrams showing changes in the area of ​​the peripheral electrodes covered by the electroplating apparatus for a square substrate according to an embodiment of the present invention, which are divided into eight, twelve, sixteen, twenty, and twenty-four equal parts, respectively;

[0048] FIG8 shows a table showing the minimum number of power supplies corresponding to different numbers of electrode partitions around a square substrate;

[0049] FIG9 is a schematic table showing the current required for each block electrode corresponding to different numbers of electrode partitions around a square substrate;

[0050] FIG. 10 is a flow chart showing a method for electroplating a non-circular substrate according to an embodiment of the present invention.

[0051] Preferred embodiments of the present invention

[0052] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0053] It should be noted that the illustrations provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Although the illustrations only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation, the form, quantity, and proportion of each component in actual implementation may be varied arbitrarily, and the component layout may be more complex. Furthermore, parts with the same reference numerals in multiple figures represent identical or equivalent parts or components.

[0054] Figures 3A-3C disclose schematic diagrams of various specific implementations of an electroplating device for a non-circular substrate according to an embodiment of the present invention. The non-circular substrate in the present invention can be a regular shape such as a square, triangle, or diamond. The current mainstream non-circular substrate is a square substrate, that is, a square and rectangular substrate. Therefore, the present invention focuses on a square substrate as an example. The electroplating device for the non-circular substrate includes a central electrode area 101 and a peripheral electrode area 102. The central electrode area 101 is circular, and the size of the central electrode area 101 is the inscribed circle of the non-circular substrate w. A central electrode is provided in the central electrode area 101, and the central electrode fills the central electrode area 101. Because the central electrode fills the entire central electrode area, in this article and the accompanying drawings, the reference numeral 101 represents both the central electrode area and the central electrode. The central electrode can be a single circular electrode, and the single circular electrode alone fills the central electrode area 101. The central electrode can also be a combination of multiple small electrodes that fill the central electrode area 101.

[0055] The peripheral electrode area 102 is arranged around the central electrode area 101, and the outer peripheral size of the peripheral electrode area 102 is the circumscribed circle of the non-circular substrate. A peripheral electrode is arranged in the peripheral electrode area 102, and the peripheral electrode fills the peripheral electrode area 102. There are several peripheral electrode areas, and the several peripheral electrode areas are concentric rings. The several peripheral electrode areas start from the central electrode area 101 and surround outward in sequence, and the size of the outermost peripheral electrode area is the circumscribed circle of the non-circular substrate. Because the peripheral electrode fills the entire peripheral electrode area, in this article and the accompanying drawings, the figure mark 102 represents both the peripheral electrode area and the peripheral electrode. As shown in Figures 3A-3C, two peripheral electrode areas are arranged in sequence around the central electrode area 101, namely, a first peripheral electrode area 121 and a second peripheral electrode area 122. In the illustrated embodiment, the widths of the two peripheral electrode areas are equal. In other embodiments, the widths of the multiple peripheral electrode areas may be unequal.

[0056] The peripheral electrode is composed of a plurality of block electrodes 1021 and fills the peripheral electrode area 102. The plurality of block electrodes 1021 can be obtained by dividing the peripheral electrode of the peripheral electrode area 102 into N equal parts, where N is a multiple of 4, such as four equal parts, eight equal parts, and sixteen equal parts, corresponding to Figures 3A, 3B, and 3C, respectively. The electrode bisection lines of the plurality of peripheral electrode areas 102 can overlap, as shown in Figures 3A and 3B, and the electrode bisection lines of the plurality of electrode areas 102 can also be staggered, as shown in Figure 3C. The block electrodes 1021 are preferably obtained by dividing the peripheral electrodes into eight equal parts or sixteen equal parts. This embodiment facilitates the precise control of each block electrode, and the computing power required to control each block electrode separately will not be too large.

[0057] The electroplating apparatus for non-circular substrates provided in this embodiment also includes a power module 103 and a control module 104. The power module 103 includes multiple independent power supplies, such as 103a, 103b, ..., 103n in Figure 4. Each block electrode 1021 is assigned a corresponding power supply. The control module 104 calculates the current I' required for each block electrode 1021 and provides it to the power module 103. The corresponding power module 103 then adjusts the current and supplies it to the block electrode 1021.

[0058] Figures 5A and 5B are schematic diagrams of the changes in the coverage area of ​​a square substrate and a rectangular substrate when they are rotated on the electroplating device of the present invention, respectively. The dotted line in the figure shows the substrate at the first position. It can be seen that the area covered by the substrate w on the peripheral electrode area at this time. The solid line in the figure shows that the substrate w reaches the second position after rotating a certain angle. The striped filling part is the area covered by the substrate w on the peripheral electrode area at the second position. Since the central electrode 101 is the inscribed circle of the square substrate w, the central electrode 101 is always covered by the substrate w and does not change due to the rotation of the substrate w. The peripheral electrode area 102 is only covered by the four corners of the substrate w. It can be seen that at different times, due to the rotation of the substrate w, the area covered by the substrate w of the same block electrode 1021 is different. Therefore, it is necessary to determine the area S' covered by the substrate w of each block electrode 1021 and adjust the amount of current supplied to each block substrate 1021.

[0059] Returning to Figure 4 , to implement the above process, the control module 104 includes an angle sensor 141 and a projection simulator 142. Any corner of the substrate w is used as a reference vertex angle, with the initial position of the reference vertex angle being 0°. The remaining three vertex angles have angular differences of 90 degrees, 180 degrees, and 270 degrees from the reference vertex angle. The angle sensor 141 is disposed within the electroplating chamber and is used to track the rotation angle of the reference vertex angle of the substrate w. Based on the rotation angle of the substrate w determined by the angle sensor 141, the angle of the reference vertex angle of the substrate w can be determined and used to calculate the angles of the remaining three vertex angles. The projection simulator 142 obtains the rotation angle of the substrate w from the angle sensor 141 and determines the positions of each vertex angle based on the rotation angle of the substrate w. After determining the positions of each vertex angle, the projection area covered by the substrate in the peripheral electrode region is simulated by connecting the vertex angles, further determining the area covered by each block electrode 1021. In one embodiment, the projection simulator 142 is built-in software within hardware such as a processor or controller. The control module 104 calculates the current required for each block electrode 1021 based on the area covered by each block electrode 1021 and feeds it back to the power supply module 103 for adjustment. Specifically, since the central electrode 101 is always covered by the substrate w during the process, the current supplied to the central electrode 101 by the current device 103 remains unchanged throughout the process, which is recorded as I. After the control module 104 calculates the area S' covered by the substrate w for each block electrode 1021, it can calculate the current required for each block electrode 1021. Where S is the total area of ​​the bulk electrodes. The power supply corresponding to each bulk electrode 1021 adjusts the current according to the calculated required current. The control module 104 can monitor the rotation angle of the substrate w in real time to adjust the current required for each bulk electrode in real time. Alternatively, the control module 104 can calculate and adjust the current required for each bulk electrode through the above steps for each rotation angle of the substrate w.

[0060] FIG6A is a schematic diagram showing a second configuration of a power module of an electroplating device when the substrate is rectangular. In the second configuration, the non-circular substrate w is rectangular. Referring to FIG5B , when the substrate w is rectangular, the area covered by the substrate w for every two centrally symmetrical block electrodes 1021 in the same peripheral electrode area 102 is the same. Therefore, every two centrally symmetrical block electrodes 1021 in the same peripheral electrode area 102 constitute an electrode group, and the current required by the block electrodes 1021 in each electrode group is the same, which can be controlled by one power supply, as shown in FIG6A . Therefore, compared with the first configuration of the power module, the power supply can be reduced by half. When the substrate w is square, since the area covered by the substrate w for every two axially symmetrical block electrodes 1021 in the same peripheral electrode area 102 is the same, this configuration of the power module can also be applied.

[0061] FIG6B is a schematic diagram of a third configuration of a power module for an electroplating device when the substrate is square. In the third configuration, when the non-circular substrate w is square, in order to save the amount of power used by the power module 103, the block electrodes 1021 are first grouped according to the number of peripheral electrode areas. As shown in FIG6B , there are a total of two peripheral electrode areas, divided into a first peripheral electrode area group and a second peripheral electrode area group. The minimum number of power supplies set for each group can be set based on the maximum number of block electrodes 1021 that can be covered by any corner of the substrate w in each peripheral electrode area 102. FIG8 shows the minimum number of power supplies that can be set for the first peripheral electrode area 121 and the second peripheral electrode area 122 under different commonly used equal division methods of the peripheral electrode area 102. FIG7A-7E are schematic diagrams of the number of block electrodes covered by the peripheral electrode areas of a square substrate divided into eight, twelve, sixteen, twenty, and twenty-four equal parts, respectively. Taking FIG7B as an example, each peripheral electrode region is divided into twelve equal parts to obtain 12 block electrodes in the first peripheral electrode region 121 and 12 block electrodes in the second peripheral electrode region 122. The maximum number of block electrodes covered by any corner of the substrate w in the first peripheral electrode region 121 is 2, and the maximum number of block electrodes covered in the second peripheral electrode region 122 is 3. Therefore, the power supply module 103 of the twelve equally divided peripheral electrode regions can use at least five power supplies: two for the first peripheral electrode region 121 and three for the second peripheral electrode region 122, the same number as shown in the table in FIG8.

[0062] The electroplating device for non-circular substrates of the present invention can also be configured to not control the current flow in real time, but to adjust the current once every time the substrate rotates a certain angle α. An interval angle α is set, and within the range of 0°-90° rotation of substrate w, the area covered by each block electrode is calculated when substrate w rotates α, 2α...nα...90°. The current required for each block electrode is calculated based on the area covered by each block electrode and recorded in the table of Figure 9. In this embodiment, the control module 104 includes an angle sensor 141 and a controller, and the data in Figure 9 is preset in the controller. The controller is configured so that every time substrate w rotates an interval angle α, the power module adjusts the power supply current corresponding to each block electrode. During the process, the angle sensor 141 monitors the angle of rotation of substrate w in real time. When substrate w rotates 0, α, 2α...nα...90°, the angle sensor 141 feeds back to the controller, and the controller transmits a signal to the power module based on the preset current value, controlling the power module to adjust the current to the corresponding value. When the substrate w rotates to 90°, the angle is reset, and the substrate w rotation angle is calculated cyclically and the corresponding current is adjusted.

[0063] The present invention also discloses a method for electroplating a non-circular substrate, which can also be understood as the working process of the electroplating device for the non-circular substrate. Figure 10 is a flow chart of the electroplating method for a non-circular substrate according to one embodiment of the present invention. The electroplating method for a non-circular substrate includes the following steps:

[0064] S1: Divide the electrode area.

[0065] The electrode area is divided into a central electrode area and a peripheral electrode area. The central electrode area is circular and its size is the inscribed circle of the non-circular substrate. The central electrode is set in the central electrode area and fills the central electrode area. The peripheral electrode area surrounds the central electrode area and its outer circumference is the circumscribed circle of the non-circular substrate. The peripheral electrode area is annular and consists of multiple block electrodes equally divided by annular shapes.

[0066] S2: Track the rotational position of the substrate.

[0067] S3: Calculate the current required for the bulk electrode based on the effective area of ​​the bulk electrode covered by the substrate.

[0068] Since the current I supplied to the central electrode remains constant, the area S' of each block electrode covered by the substrate is calculated according to the rotation position of the substrate, and the current I' required for each block electrode is further obtained. Where S' is the area of ​​the block electrode currently covered by the substrate, S is the total area of ​​the block electrode, and I is the current supplied to the central electrode.

[0069] S4: adjusting the current supplied by the power supply to the bulk electrode according to the calculated current required by the bulk electrode.

[0070] In this method, the current required by each block electrode can be calculated in real time and the current can be adjusted in real time. An angle interval can also be preset, and S2 will perform S3 and S4 every time the substrate rotates by an angle interval.

[0071] The present invention also discloses a method for electroplating a non-circular substrate, comprising:

[0072] S1: Divide the electrode area;

[0073] S2: preset the current parameters required for each block electrode corresponding to each rotation angle interval of the substrate;

[0074] S3: Tracking the rotation position of the substrate;

[0075] S4: When the substrate rotates by an angle interval, the current is adjusted according to the preset power parameters and supplied to the corresponding block electrodes.

[0076] It should be noted that, provided that the technical solutions are logically accurate, the above-mentioned embodiments can be combined with each other to form new solutions, that is, certain features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined. These new solutions will not be described in detail here.

[0077] The present invention, through the above-described embodiments and related illustrations, has specifically and fully disclosed the relevant technologies, enabling those skilled in the art to implement the invention accordingly. The above-described embodiments are intended only to illustrate the present invention and are not intended to limit the present invention. The scope of the present invention is defined by the claims. Any changes in the number of components described herein or substitution of equivalent components shall remain within the scope of the present invention.

[0078] At the same time, the present invention uses specific terms to describe embodiments of the present invention. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the present invention. Therefore, it should be emphasized and noted that the mention of "one embodiment," "an embodiment," or "an alternative embodiment" two or more times in different places in this specification does not necessarily refer to the same embodiment.

[0079] Similarly, it should be noted that, in order to simplify the presentation of the present disclosure and facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of the invention sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not imply that the subject matter of the invention requires more features than those recited in the claims. In practice, an embodiment may have fewer features than the totality of the features of a single embodiment disclosed above.

Claims

1. An electroplating device for a non-circular substrate, characterized in that: include: A central electrode region is circular and has a size equal to an inscribed circle of the non-circular substrate, wherein a central electrode is arranged in the central electrode region and the central electrode fills the central electrode region; A peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is the circumscribed circle of the non-circular substrate, and peripheral electrodes are arranged in the peripheral electrode area, and the peripheral electrodes are multiple block electrodes filling the peripheral electrode area; A power module, comprising a plurality of power supplies, for supplying power to the central electrode and the peripheral electrodes; The control module is used to detect the rotation position of the substrate, calculate the current required by each block electrode and notify the power module to adjust the current.

2. The electroplating device for a non-circular substrate according to claim 1, characterized in that: The current required by the block electrode is Wherein, S' is the area of ​​the block electrode covered by the substrate, S is the area of ​​the block electrode, and I is the current supplied by the power module to the central electrode area.

3. The electroplating device for a non-circular substrate according to claim 2, characterized in that: There are multiple peripheral electrode areas, and the multiple peripheral electrode areas are concentric rings.

4. The electroplating device for a non-circular substrate according to claim 3, characterized in that: The block electrode is obtained by dividing the peripheral electrode into N equal parts, where N is a multiple of 4.

5. The electroplating device for a non-circular substrate according to claim 2, characterized in that: The control module includes an angle sensor and a projection simulator. The angle sensor is used to track the rotation angle of the substrate. The projection simulator simulates the current position of each vertex of the substrate according to the rotation angle of the substrate to determine the projection area of ​​the substrate in the peripheral electrode area, and further calculates the area of ​​each block electrode covered by the substrate.

6. The electroplating device for a non-circular substrate according to claim 2, characterized in that: The control module includes an angle sensor and a controller. The angle sensor is used to track the rotation of the substrate to identify the angle of rotation of the substrate. The controller presets the current size that needs to be adjusted for each corresponding block electrode according to the angle interval of substrate rotation. When the angle sensor recognizes that the substrate rotates at each angle interval, the controller feeds back to the power supply module according to the preset current size to adjust the corresponding current.

7. The electroplating device for a non-circular substrate according to claim 4, characterized in that: Each block electrode is powered by a corresponding one of the plurality of power supplies.

8. The electroplating device for a non-circular substrate according to claim 4, characterized in that: The non-circular substrate is square.

9. The electroplating device for a non-circular substrate according to claim 8, characterized in that: Every two centrally symmetrical block electrodes form a group, so as to obtain a plurality of electrode groups, and each electrode group is powered by a power supply.

10. The electroplating device for a non-circular substrate according to claim 4, characterized in that: The non-circular substrate is square.

11. The electroplating device for a non-circular substrate according to claim 10, characterized in that: The number of power supplies provided in each peripheral electrode region is the maximum number of block electrodes that can be covered by any corner of the substrate in each peripheral electrode region.

12. A method for electroplating a non-circular substrate, characterized in that: include: Dividing the electrode area, including dividing the electrode area into a central electrode area and a peripheral electrode area, the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, the central electrode fills the central electrode area, and the peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, the peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area; Tracking the rotational position of the substrate; Calculate the required current of each block electrode according to the effective area of ​​each block electrode covered by the substrate; The current required by each block electrode is adjusted and supplied to the corresponding block electrode.

13. A method for electroplating a non-circular substrate, characterized in that: include: Dividing the electrode area, including dividing the electrode area into a central electrode area and a peripheral electrode area, the central electrode area is circular and has a size of an inscribed circle of a non-circular substrate, a central electrode is arranged in the central electrode area, the central electrode fills the central electrode area, and the peripheral electrode area is arranged around the central electrode area, the outer circumference of the peripheral electrode area is a circumscribed circle of the non-circular substrate, the peripheral electrode is arranged in the peripheral electrode area, and the peripheral electrode is composed of a plurality of block electrodes and fills the peripheral electrode area; The current parameters required for each block electrode corresponding to each rotation angle interval of the preset substrate; Tracking the rotational position of the substrate; When the substrate rotates at each angular interval, the current is adjusted according to the preset power supply parameters and supplied to the corresponding block electrodes.

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