Anhydride functionalized cyclic polyorganosiloxane
An anhydride functionalized cyclic polyorganosiloxane compound addresses the need for improved adhesion promoters by enhancing the adhesion of silicone-based compositions to various substrates, achieving a notable increase in peel strength.
Patent Information
- Application Number
- PCT/US2024/054664
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-22
- Filing Date
- 2024-11-06
- Publication Date
- 2025-05-30
AI Technical Summary
There is a need for alternative adhesion promoters that can effectively enhance the adhesion of silicone-based compositions to various substrates such as glass, metal, and plastics, as existing solutions may not provide optimal performance across all applications.
The development of an anhydride functionalized cyclic polyorganosiloxane compound, specifically represented by Formula 1, which includes C3-C12-alkyl anhydride groups and a mono- or diradical of Formula 2, serving as an adhesion promoter for polyorganosiloxane compositions.
The compound effectively improves the adhesion of organopolysiloxane to substrates like paper, metal, plastic, or glass, as demonstrated by a significant increase in peel strength from 0 N/mm to 2.28 N/mm in comparative testing.
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Figure US2024054664_30052025_PF_FP_ABST
Abstract
Description
[0001] Anhydride Functionalized Cyclic Polyorganosiloxane
[0002] Background of the Invention
[0003] The present invention relates to a compound which is an anhydride functionalized cyclic polyorganosiloxane. The compound of the present invention is useful as an adhesion promoter in a composition suitable as an encapsulant for a variety of applications including automotive, electrical, electronic and medical applications.
[0004] The adhesion of silicone-based compositions to substrates such as glass, metal, and a variety of plastics is facilitated with an adhesion promoter, which includes functionalized organosiloxanes.
[0005] For example, US 6,887,932 B2 (Azechi) discloses a vast number of adhesion promoters that are functionalized polyorganosiloxanes containing Si-H groups. CN 103467965 A (Shinetsu) discloses adhesion promoters that are cyclic organosiloxanes containing Si-H, anhydride, and fluoroalkyl groups. Similarly, EP 3 850 049 Bl (Felder) discloses adhesion promoters that are acid anhydride functionalized polyorganosiloxanes containing Si-H groups.
[0006] WO 2021 / 262830 (Santos) discloses a telechelic anhydride terminated polyorganosiloxane of the following formula: where n is from 2 to 20.
[0007] There is still a need to develop alternative solutions for adhesion promoters.
[0008] Summary of the Invention
[0009] The present invention addresses a need in the art by providing a compound of Formula 1 :
[0010] Formula 1 where each R is a Cs-Cn-alkyl anhydride group; the sum of m and n is in the range of from 1 to 4; and -DHX- is a mono- or diradical of the compound of Formula 2:
[0011] Formula 2 where x is from 3 to 10, and y is x - 3.
[0012] The compound of the present invention is useful as an adhesion promoter for polyorganosiloxane compositions. Detailed Description of the Invention
[0013] The present invention addresses a need in the art by providing a compound of Formula 1:
[0014] Formula 1 where each R is a C3-Ci2-alkyl anhydride group; the sum of m and n is in the range of from
[0015] 1 to 4; and -DHX- is a mono- or diradical of the compound of Formula 2:
[0016]
[0017] Formula 2 where x is from 3 to 10, and y is x - 3. In another embodiment, x is from 4 to 6.
[0018] Examples of suitable anhydride substituents include succinic anhydride, maleic anhydride, oxalic anhydride, and phthalic anhydride groups. Where the anhydride group is a succinic anhydride group, R is represented by the following fragment: where z is from 1 to 10, and where the dotted line represents the point of attachment to the DHXdiyl group.
[0019] DHXis represented by the compound of Formula 2. When x is 4, y is 1 . Thus, DH4 is represented by the compound of Formula 2a:
[0020] Formula 2a
[0021] In one embodiment, R1is phenyl, m is 1, n is 1, y is 1, and z is 1. Accordingly, a possible configuration of a compound of the present invention is represented by Formula 3:
[0022] Formula 3
[0023] It is understood that the R groups can be attached to any of the Si atoms of the DHXgroups and that the DHXgroups may be a blend of DHXgroups. For example, DHXmay be a mixture of DH4, DH5, and DH6. It is further understood that the compound of Formula 1 may comprise a blend of mono-, di-, tri-, and tetrasubstituted alkyl anhydride groups. In one embodiment, the compound of Formula 1 comprises a blend of mono- and disubstituted alkyl anhydride groups; i.e., m + n is in the range of 1 to 2.
[0024] The compound of Formula 1 (where m is 1 and n is 1) can be prepared in 2-steps, as illustrated: where Formula lois represented by the following formula:
[0025] Formula l0and Anh is an anhydride group. An example of a suitable acid catalyst is tris(pentafluorophenyl)borane (BCF).
[0026] The compound of the present invention has been found to be suitable as an adhesion promoter in a composition used to improve the adhesion of an organopolysiloxane to a substrate such as paper, metal, plastic, or glass.
[0027] Examples
[0028] Intermediate Example 1 - Preparation of Formula l0
[0029] A compound of Formula 2 (99.97 g, y is predominantly 1) then anhydrous toluene (49.97 g) were added to a N2 purged 1-L 3-neck round bottom flask equipped with a thermocouple, an overhead stirrer, and a septum. The contents of the flask were stirred, then BCF catalyst solution (0.32 g, 1% wt.% in toluene) was added. Diphenyldisilanol (56.07 g) was added in 4 portions over the course of ~1.5 h while maintaining a reaction temperature < 30 °C. The contents were stirred for an additional 1.5 h after addition was complete. A clear solution was obtained and treated with 36 pL of phenyl acetylene before volatiles were removed in vacuo at 80 °C.
[0030] Example - Preparation of a Compound of Formula 3
[0031] The compound of Formula lo(81.0 g) was charged into a three-neck round bottom flask and heated to 75 °C under N2 with stirring. Karstedt’s catalyst (5 ppm) was added, followed by the gradual addition of an allyl succinic anhydride solution (29.0 g in 7 g toluene). The addition rate was controlled so that the reaction mixture temperature did not exceed 80 °C. After completion of the addition, the reaction mixture was stirred at 75 °C under N2 for additional 1 h being allowed to cool to room temperature. 1-Ethynyl-l -cyclohexanol (0.43 g) was added to the mixture, after which time volatiles were removed in vacuo. Preparation of Liquid Silicone Rubber Formulations
[0032] Comparative Example - Preparation of a Liquid Silicone Rubber Formulation without Adhesion Promoter
[0033] A liquid silicone rubber (LSR) formulation was prepared by first forming two master batches generally in accordance with the procedure described in US 5,679,727, column 6. A first master batch (MB1) was prepared by combining fumed silica (surface area 300 m2 / g, 22.4 pbw) with a vinyl-terminated poly dimethylsiloxane (viscosity7= 53,000 mPa s at 25°C, 70.8 pbw), and contacting the blend with hexamethyldisilazane and water. A second master batch (MB2) was prepared by combining the fumed silica (24.8 pbw) with the vinyl-terminated polydimethylsiloxane (68.0 pbw), and contacting this blend with hexamethyldisilazane and l,l,3,3-tetramethyl-l,3-divinyldisilazane and water to give a vinyl functionalization of 0.08 mmol / g.
[0034] A portion of MB1 (17.7 pbw) was blended with a portion of MB2 (70.32 pbw) along with additional vinyl-terminated polydimethylsiloxane (6.52 pbw). Then, a vinyl-terminated polydimethylsiloxane-co-methylvinylsiloxane (1.16% vinyl functionality, viscosity = 370 mPa s at 25 °C, 5.06 pbw) was blended into the mixture along with Karstedt’s catalyst (0.0025 pbw), trimethyl-terminated polymethylhydrogen dimethylsiloxane (viscosity = 30 mPa s at 25 °C, 0.80 pbw), and ethinyl-cyclohexanol (0.04 pbw). The LSR was used shortly after preparation to prevent premature curing.
[0035] Example - Preparation of a Liquid Silicone Rubber Formulation with Adhesion Promoter
[0036] The example (LSR) formulation can be prepared as described above except for the following changes. The compound of Formula 3 (1.65 pbw) was added to the formulation at the last step, the amount of trimethyl-terminated polymethylhydrogen dimethylsiloxane was reduced to 0.39 pbw, and the amount of the additional vinyl-terminated polydimethylsiloxane was reduced to 5.29 pbw.
[0037] Peel Strength Testing Procedure
[0038] Two thermoplastic Ultradur B 4300 G4 Polybutylene Terephthalate 25 -mm x 100-mm substrates with a thickness of 3 mm were cleaned with isopropanol and dried for 18 h at 120 °C. The thermoplastic substrates were preheated at 150 °C for 5 min prior to overmolding with the LSR. Substrates were overmolded with a 3-mm layer of the LSR formulation, and compression molded for 5 min at 150 °C at a pressure of 300 bar.
[0039] Adhesion was tested in a 90° peel test using a floating roller device as described in DIN EN ISO 22631 (“Adhesives - Test method for adhesives for floor and wall coverings”). A tensile tester was used at a pulling speed of 100 mm / min. The peel strength was calculated as the average peel force, divided by the sample width (25 mm), and reported in N / mm. The adhesion test specimen containing the LSR that did not contain any adhesion promoter exhibited a peel strength of 0 N / mm, while the LSR containing the compound of Formula 3 exhibited a peel strength of 2.28 N / mm.
Claims
Claims:
1. A compound of Formula 1 :Formula 1 where each R is a Cs-Cn-alkyl anhydride group; the sum of m and n is in the range of from 1 to 4; and -DHX- is a mono- or diradical of the compound of Formula 2:Formula 2 where x is from 3 to 10; and y is x - 3.
2. The compound of Claim 1 wherein x is in the range of from 4 to 6; and m + n is in the range of from 1 to 2.
3. The compound of Claim 2 where x is 4.
4. The compound of Claim 1 which is represented by the following Formula 3:
Citation Information
Patent Citations
Curable composition for encapsulating optical semiconductor and optical semiconductor apparatus using the same
CN103467965A
Functional polysiloxanes
EP3850049B1
Curable organosiloxane composition with improved hysteresis characteristics
US5679727A
Silicone rubber adhesive composition and integrally molded article thereof
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Silicone elastomer compositions
WO2021262830A1