Antenna array modules with multiple antenna elements

Abstract

A phased array antenna may include an array of antenna modules each including a module substrate, a plurality of radiating elements, one or more integrated circuit (IC) chips adhered to a lower surface of the module substrate, and one or more final stages of a plurality of stages of a beam forming network (BFN) circuit. Each IC chip can include a circuit to adjust a signal communicated with the plurality of radiating elements. The phased array antenna may also include a multi-layer substrate underlying the array of antenna modules, where the multi-layer substrate may include a remainder of the plurality of stages of the BFN circuit. The remainder of the plurality of stages may be in electrical communication with the final stages through one or more conductive traces of each module substrate and a conductive bonding material, or through a direct connection with the conductive bonding material.

Description

ANTENNA ARRAY MODULES WITH MULTIPLE ANTENNA ELEMENTSTECHNICAL FIELD

[0001] The following relates generally to communications, including antenna array modules with multiple antenna elements.BACKGROUND

[0002] An antenna array (or array antenna) may be a set of multiple connected antenna elements that work together as a single antenna to transmit or receive radio waves. Individual antenna elements (often referred to simply as “elements”) can be connected to a receiver or transmitter by feedlines that feed a signal (or power) to the elements in a specific phase relationship. Radio waves radiated by each individual antenna element can combine and superpose with each other, adding together (interfering constructively) to enhance the signal radiated in desired directions, and cancelling (interfering destructively) to reduce the signal radiated in other directions. Similarly, when used for receiving, the separate radio frequency currents from individual antenna elements can combine in the receiver with the correct phase relationship to enhance signals received from the desired directions and cancel signals from undesired directions.

[0003] An antenna array can achieve an elevated gain (directivity) with a narrower beam of radio waves, than could be achieved by a single antenna element. In general, a relatively larger quantity of individual antenna elements may result in a relatively higher gain and relatively narrower beam. Some antenna arrays (such as phased array radars) can be composed of thousands of individual antenna elements. Arrays can be used to achieve higher gain (which can increase communication reliability), to cancel interference from specific directions, to steer a radio beam electronically to point in different directions and for radio direction finding (RDF).SUMMARY

[0004] The described techniques relate to improved methods, systems, devices, and apparatuses that support antenna array modules with multiple antenna elements. One example relates to a phased array antenna that includes an array of antenna modules (e.g., an array of antenna array modules). Each of the array of antenna modules may include a module substrate having a lower surface with one or more conductive traces and a plurality ofradiating elements disposed above an upper surface of the module substrate. An antenna module can also include one or more integrated circuit (IC) chips adhered to the lower surface of the module substrate and connected to the one or more conductive traces. Each of the one or more IC chips can include a circuit to adjust a signal communicated with the plurality of radiating elements through the module substrate by phase shifting and / or amplifying the signal to steer a beam formed by the phased array antenna. Each antenna module can also include one or more final stages of a plurality of stages of a beam forming network (BFN) circuit. Additionally, or alternatively, the phased array antenna may include a multi-layer substrate underlying the array of antenna modules, where the multi-layer substrate can include a remainder of the plurality of stages of the BFN circuit formed on one or more layers of the multi-layer substrate. In some examples, the remainder of the BFN circuit can be in electrical communication with the one or more final stages of the BFN circuit through the one or more conductive traces of each respective module substrate through one or more first instances of conductive bonding material extending between an upper surface of the multilayer substrate to the one or more conductive traces.

[0005] Another example relates to a phased array antenna that includes an array of antenna modules. Each of the array of antenna modules may include a module substrate, a plurality of radiating elements disposed above an upper surface of the module substrate, one or more IC chips adhered to a lower surface of the module substrate, and one or more final stages of a plurality of stages of a BFN circuit. In some examples, the one or more IC chips can each include a circuit to adjust a signal communicated with the plurality of radiating elements through the module substrate by phase shifting and / or amplifying the signal to steer a beam formed by the phased array antenna. The phased array antenna may also include a multi-layer substrate underlying the array of antenna modules, where the one or more IC chips may be adhered to an upper surface of the multi-layer substrate. The multi-layer substrate can also include a remainder of the plurality of stages of the BFN circuit formed on one or more layers of the multi-layer substrate. Additionally, or alternatively, the remainder of the BFN circuit may be in electrical communication with the one or more final stages of the BFN circuit through a direct connection with one or more first instances of conductive bonding material extending between the upper surface of the multi-layer substrate to a lower surface of the one or more IC chips.BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIGs. 1 A and IB show a block diagram and a plan view of an example phased array antenna that supports antenna array modules with multiple antenna elements in accordance with examples described herein.

[0007] FIG. 2 shows a portion of an example phased array antenna that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure.

[0008] FIG. 3 shows a portion of an example phased array antenna that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure.

[0009] FIG. 4 shows a top view of an example antenna module that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure.

[0010] FIG. 5 shows a portion of an example phased array antenna that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure.

[0011] FIG. 6 shows a block diagram of an example phased array antenna that supports antenna array modules with multiple antenna elements in accordance with examples described herein.DETAILED DESCRIPTION

[0012] A device or system may include multiple antennas in a phased antenna array that can be used together to transmit and receive signals, direct signal direction, as well as enhance communication gain and directionality. Some phased array antennas may also include a substrate including a beam-forming network (BFN) circuit among other circuitry that may be coupled with one or more transmit and receive chains and corresponding radiating elements (e.g., antennas). Further, various circuity may be implemented within one or more integrated circuit (IC) chips (e.g., radio frequency IC (RFIC) chips, monolithic microwave integrated circuits (MMICs)), which may be adhered to the substrate for supporting radiating elements. For example, IC chips may implement phase shifters, amplifiers, attenuators, analog-to-digital converters (ADCs), digital-to-analog converters(DACs), mixers, control circuitry etc. In some cases, IC chips may be implemented in a digital array architecture. Additionally, or alternatively, in a modular design, IC chips may be adhered to one or more modules separate from the multi-layer substrate that may each couple with one or more final stages of the BFN circuit to simplify manufacture, increase performance, and reduce cost. However, there may be opportunities for further disaggregation of components and die area savings.

[0013] This disclosure describes a phased array antenna including a plurality of antenna modules (e.g., antenna element modules) that may each include multiple IC chips and / or antenna elements, as well as one or more final stages of a BFN. For example, the plurality of antenna modules may be mounted on a multi-layer substrate in a split-level architecture. Each antenna module may include a module substrate (e.g., a dielectric substrate) having a respective set of multiple radiating elements (e.g., antennas) and one or more embedded or attached IC chips. For example, in each antenna module, the one or more IC chips may be adhered to a first (e.g., lower) surface of the module substrate. Each IC chip may also include circuitry for adjusting (e.g., amplifying, filtering and / or phase shifting) a signal communicated between one or more radiating elements and circuitry in the multi-layer substrate. Additionally, each antenna module may include one or more final stages of a BFN circuit within the module substrate, within the one or more IC chips, or both. In some cases, the final stages may be passive circuits for dividing and / or combining signals between the IC chips and the multi-layer substrate, and for routing signals between the IC chips and the antenna elements. In some examples, the multi-layer substrate may underly the array of antenna modules and may include a remainder of stages of the BFN circuit formed on a layer of the multi-layer substrate. The remainder of the stages of the BFN circuit may be in electrical communication with the one or more final stages of the BFN circuit through one or more conductive traces and a conductive bonding material, or directly via a conductive bonding material, where each IC chip can be adhered to an upper surface of the multi-layer substrate.

[0014] The phased array antenna described herein may allow for reduced usage of die area of one or more devices. For example, by including one or more final stages of the BFN in each antenna module, input / output (VO) circuitry and overall die size may be reduced by using a single VO circuit per module. Reducing a die area may allow for additional circuitry to be built and for relatively smaller and denser component and chip design, while reducing a material used in fabricating VO circuitry. Further, including multiple radiating elementswithin each antenna module (e.g., adhered to a surface of a module substrate) may enable denser configuration of components while saving additional die area. Additionally, implementing a modular design can allow for lower cost and higher performance of the resultant phased array antenna. For instance, including a portion of the BFN circuit within each antenna array module may permit each circuit board to have a relatively lower complexity and thus the entire resultant assembly can be lower cost as compared to use of a single circuit board including a full BFN circuit. Further, such a modular design may reduce cost of manufacturing, as well as cost related to defective components by spreading circuitry across multiple devices.

[0015] Aspects of the disclosure are illustrated by and described with reference to block diagrams, plan views, portions of example phased array antennas, and top views that relate to antenna array modules with multiple antenna elements.

[0016] FIGs. 1A and IB show a block diagram and a plan view, respectively, of an example phased array antenna 2 that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure. The phased array antenna 2 may facilitate wireless communication between a local system 4 and a remote system 6. The local system 4 can be wired to the phased array antenna 2. As some examples, the local system 4 can be implemented on a terrestrial station or an airborne station (e.g., an aircraft or satellite). Additionally, the phased array antenna 2 can be in wireless communication with the remote system 6. The remote system 6 can be an airborne station (e.g., an aircraft or satellite). Alternatively, the remote system 6 can be a terrestrial station. The local system 4 and the remote system 6 can be representative of computing systems (e.g., servers) and / or routers that can process, transmit and receive data.

[0017] FIG. 1A may illustrate a block diagram of the phased array antenna 2 with a split- level architecture. In particular, the phased array antenna 2 can include a plurality of antenna modules 8 (e.g., antenna-on-chip (AoC) modules) that can be mounted on a multi-layer substrate 10. The multi-layer substrate 10 can be implemented, for example, as a multi-layer circuit board with multiple layers of circuit board materials (e.g., dielectric materials, electrically conductive materials, etc.). Each antenna module 8 can include one or more radiating elements 12 and one or more IC chips 14 (e.g., RFIC chips, MMIC chips). For example, an antenna module 8 may include multiple radiating elements 12 (e.g., two or more), where each radiating element 12 can be disposed on or integrated with a module substrate 13 (e.g., a dielectric substrate, a single or multi-layer circuit board, a wide-angleimpedance matching metamaterial (WAIM), etc.), in FIG. 1A. In some examples, each radiating element 12 can be implemented as a patch antenna or a type of microstrip antenna (e.g., a slot antenna) formed on a top layer or embedded in the module substrate 13. Alternatively, each radiating element 12 can be implemented as a discrete antenna mounted on the module substrate 13.

[0018] Each IC chip 14 can be adhered to a first (e.g., lower) surface of the module substrate 13. Each antenna module 8 can be disposed above a second (e.g., an upper) surface 16 of the multi-layer substrate 10 (e.g., adhered or mounted on an upper or top surface, adhered or mounted on one or more materials that is adhered or mounted on the upper surface). In some examples, each antenna module 8 can couple (e.g., via a direct connection, via a passive coupling, via a feedline extending through the substrate 13) each IC chip 14 with one or more radiating elements 12. In some examples, each radiating element 12 of FIG. 1 A can be a single radiating element or multiple radiating elements. In some examples, there may be an equal quantity of IC chips 14 and radiating elements 12 across the phased array antenna 2, so that each IC chip 14 is coupled with a respective radiating element 14, and includes a respective circuitry 26 for supporting the radiating element. Additionally, or alternatively, each IC chip 14 can include multiple instances of circuitry 26 for individually adjusting signals communicated between multiple respective radiating elements 12 and an IC chip 14.

[0019] For purposes of simplification of explanation, the terms “upper” and “lower” may be employed to denote relative positions in the selected orientation. Similarly, the terms “top” and “bottom” may be employed throughout this disclosure to denote opposing surfaces in a selected orientation. Further, the terms “underlying” and “overlay” (as well as derivative words) may be employed to denote a relative position of two adjacent surfaces or elements in the selected orientation. In fact, the examples used throughout this disclosure denote one selected orientation. However, in the described examples, the selected orientation is arbitrary, and other orientations may be possible (e.g., upside down, rotated by 90 degrees, etc.) within the scope of the present disclosure.

[0020] The phased array antenna 2 can also include a BFN circuit 18 split across multiple components. For example, the BFN circuit 18 may be split between the multi-layer substrate 10 and one or more of the antenna modules 8. The BFN circuit 18 can be implemented with stages 23 with combiner / dividers in the multi-layer substrate 10, and stages 25 with combiner / dividers in antenna modules 8. For example, the stages 23 and 25 may be illustratedin FIG. 1 A as split lines, and may combine or divide signals communicated between the IC chips 14 and the multi-layer substrate 10, as well as route signals between the IC chips 14 and the antenna elements 12. In some examples, the stages 23 of the BFN circuit 18 can be in electrical communication with the stages 25. Further, the BFN circuit 18 can be in electrical communication with each IC chip 14 of each antenna module 8.

[0021] The stages 25 may be examples of one or final stages of the BFN circuit 18, where the combiners / dividers of the stages 25 may couple with circuitry 26 for supporting radiating elements 8. For example, one or more stages 25 may be formed on one or more interior layers and / or on one or more exterior layers of the module substrate 13 of an antenna module 8, or within a package of an antenna module 8. In some examples, a stage 25 of an antenna module 8 may couple with two IC chips 14 that may correspond to two respective radiating elements 12. Additionally, or alternatively, one or more stages 25 can be formed within circuitry or a package of each IC chip 14. For example, an IC chip 14 that is coupled with multiple radiating elements 12 may include a combiner / divider of a stage 25 that is coupled with respective circuitry 26 for different radiating elements 12. In some cases, one or more stages 25 can be formed in both the IC chips 14 and the module substrate 13 or package of an antenna module 8. For example, an antenna module 302 may include a first IC chip 14 with first and third circuits 26 coupled with first and third radiating elements 12, and a second IC chip 14 with second and fourth circuits 26 coupled with second and fourth radiating elements 12. A first stage 25 of the first IC chip may couple with both the first and third circuits 26, and a second stage 25 of the second IC chip may couple with both the second and third circuits 26. Additionally, or alternatively, a final stage within the substrate 13 of the module 8 may couple with each of the first and second stages 25.

[0022] The stages 23 may be examples of one or more initial or remaining stages of the BFN circuit 18, where the combiners / dividers of the stages 23 may be coupled with the local system 4. In some cases, the stages 23 may be formed on a layer (or layers) of the multi-layer substrate 10, such as formed on an interior layer of the multi-layer substrate 10, or formed on an exterior layer, such as a top layer or bottom layer. In the example illustrated in FIG. 1 A, there may be three (3) such stages, but in other examples, there may be more stages or fewer stages (as few as one (1) stage) of combiner / dividers of stages 23 and 25. Each combiner / divider circuit 28 of the stages 23 and 25 can be implemented as a power combiner / divider circuit, such as a Wilkinson power divider, a hybrid coupler, a directional coupler, or any other circuit that can combine and / or divide signals. Each combiner / dividercan combine or divide signals passing through the BFN circuit 18. For instance, when used for receiving, signals communicated between the antenna elements 12, the IC chips 14, and the local system 4 can be combined by each stage of the combiner / divider circuits 28. Additionally, or alternatively, when used for transmitting, signals communicated from the local system 4 to the antenna elements 12 via the IC chips 14 can be divided by each stage of the combiner / divider circuits 28 of the stages 23 and 25 of the BFN circuit 18.

[0023] As described herein, the BFN circuit 18 may operate as a combiner and / or divider circuit that combines and / or divides signals in-phase. In some examples, the BFN circuit 18 can combine the element signals in-phase or out of phase. Additionally, or alternatively, the BFN circuit 18 can combine the element signals equally or unequally. In general, the architecture of the BFN circuit 18 can be designed for nearly any form of signal combining and / or dividing. In some examples, the BFN circuit 18 can be a passive circuit. As used herein, the term “passive circuit” may indicate that the BFN circuit 18 may include circuit components, (e.g., resistive traces, capacitors and / or inductors) that may not be supplied power from a power supply.

[0024] The local system 4 can include the controller 20 that can control an operating mode of the phased array antenna 2. As one example, the controller 20 can be implemented as a microcontroller with embedded instructions. In another example, the controller 20 can be implemented as a computing device with a processing unit (e.g., one or more processor cores) that executes machine code stored in a non-transitory memory. In some examples, the controller 20 can provide control signals via control lines (not shown) or wirelessly to the IC chips 14, that cause the IC chips 14 to set (e.g., via circuitry 26) an amplitude and / or phase adjustment level of signals communicated between a BFN circuit 18 and the radiating elements 12 of the antenna modules 8. As such, the controller 20 can control the signal adjustment of the IC chips 14. Additionally, or alternatively, in some examples, the controller 20 can provide control signals to the IC chips 14 that cause the phase array antenna 2 to operate in a receiving mode, a transmitting mode, or both at the same time (e.g., a full duplex mode of operation). Additionally, for purposes of simplification of explanation, in examples described herein the controller 20 also provides power signals to the IC chips 14 of the antenna modules. However, in other examples, other sources can provide power for the IC chips 14.

[0025] In operation, in some examples, the phased array antenna 2 architecture can be designed to operate exclusively in the receiving mode or the transmitting mode. In otherexamples, as described herein, the phased array antenna 2 architecture can be designed to operate in half-duplex mode or polarization duplex mode, wherein the phased array antenna 2 may switch between the receiving mode and the transmitting mode. In still other examples, the phased array antenna 2 architecture can be designed to operate in a frequency division multiplexing mode, such that the phased array antenna 2 can operate in the receiving mode and the transmitting mode concurrently. In the receiving mode, RF signals can be received from the remote system 6 by the radiating elements 12 on each of the plurality of antenna modules 8, or some subset thereof. The radiating elements 12 can transfer the received signal to a corresponding IC chip 14 of a respective antenna module 8. Each corresponding IC chip 14 can include circuitry 26 that can adjust the received signal to output an element signal. In particular, each IC chip 14 can amplify, filter and / or phase shift the received signal to form the element signal.

[0026] Moreover, different IC chips 14 can provide different levels and types of adjustment. For example, a first IC chip 14 (or first circuitry 26 of the first IC chip) of a first antenna module 8 can amplify the received signal with a first gain and / or phase shift the received signal by a first phase shift. Additionally, a second IC chip 14 (or second circuitry 26 of the first IC chip) of a second antenna module 8 can amplify the received signal with a second gain and / or phase shift the received signal by a second phase shift. In this manner, the plurality of element signals output by the IC chips 14 can have specific properties to facilitate combination by the BFN circuit 18. Each of the element signals output by the circuitry 26 of the IC chips 14 can be provided to the BFN circuit 18. The BFN circuit 18 can combine the element signals to form a received beam signal. The received beam signal can be provided to the local system 4 through a connection port that can be located at a lower surface 22 (e.g., a bottom surface) of the multi-layer substrate 10, or other location. The local system 4 can process (e.g., demodulate) the received beam signal and consume decoded data.

[0027] In the transmitting mode, the local system 4 can provide a transmit beam signal to the BFN circuit 18 that is intended to be transmitted to the remote system 6. The BFN circuit 18 may divide the transmit beam signal to form a plurality of divided signals, which may be referred to as element signals. The element signals can be provided to the circuitry 26 of the IC chips 14 of the antenna modules 8. Each IC chip 14 can adjust (e.g., amplify, filter and / or phase shift), via circuitry 26, a received element signal, and output an adjusted signal for a corresponding radiating element 12. In the transmitting mode, each IC chip 14 can be configured to provide a different level of adjustment than the adjustment in the receivingmode, including examples where the phased array antenna 2 may operate in the receiving mode and the transmitting mode concurrently. For example, a given IC chip 14 can provide a different level of gain, a different phase shift and / or a different passband in the transmitting mode than in the receiving mode. Additionally, or alternatively, adjustment parameters (e.g., bandpass, gain and / or phase shift) of each IC chip 62 can be set by the controller 20 operating at the local system 4.

[0028] The radiating element 12 of each antenna module 8 may transmit the adjusted element signal provided by the corresponding IC chip 14, which may superimpose with the transmissions of the other radiating elements 12 to form a beam of the transmit beam signal that propagates through free space to the remote system 6, as indicated by an arrow 24. The remote system 6 can demodulate the received transmit beam signal and process the resulting data. The phased array antenna 2 can be designed such that the transmit signals constructively and destructively interfere to produce the beam of the transmit beam signal with a radiation pattern having desired properties (e.g., a desired direction of maximum gain, and / or polarization). Additionally, in some examples, the adjustment (e.g., amplification and / or phase shift) by the plurality of IC chips 14 of each antenna module 8 can be controllable by the controller 20 to steer the beam of the transmit beam signal in a desired direction. In examples where the phased array antenna 20 is designed to operate in the receiving mode and the transmitting mode, bi-directional wireless communication between the remote system 6 and the local system 4 can be established. Alternatively, in examples where the phased array antenna 20 is designed to operating in only the receiving mode or only the transmitting mode, unidirectional wireless communication between the remote system 6 and the local system 4 can be established. In still other examples, the phased array antenna 2 can operate in a full duplex mode (e.g., frequency division duplex mode), where the phased array antenna 2 can operate in the transmitting mode and the receiving mode concurrently.

[0029] FIG. IB may illustrate a plan view of the example phased array antenna 2 with split-level architecture for transmitting and / or receiving RF signals, and may employ the same reference numbers as FIG. 1 A to denote the same structure. Moreover, unless noted otherwise, reference to elements of the phased array antenna 2 may apply to both FIGs. 1 A and IB.

[0030] In some examples, the phased array antenna 2 can be fabricated as modules and assembled. In particular, the phased array antenna 2 can include N antenna modules 8 mounted on a multi-layer substrate 54. A module substrate 13 can include one or more layersand can be implemented, for example, as a circuit board or a WAIM. In some examples, the multi-layer substrate 10 can include patterned mounting interfaces (e.g., etchings and / or conductive pads) for receiving each of the N antenna modules 8 and / or patterned conductive interfaces with vias to permit passage of signals between stages of the BFN circuit 18 and the IC chips 14 and / or module substrates 13 of the N antenna modules 8. In some cases, the N antenna modules 8 can be mounted at the pattern mounting interfaces.

[0031] In some examples, the N antenna modules 8 can be arranged in an ordered array. In some examples, as explained in detail herein, each IC chip 14 can be mounted on the multi-layer substrate 10 with an electrical bonding material (e.g., solder). In other examples, a lower surface of each module substrate 13 can be mounted on the multi-layer substrate 10 with an electrical bonding material, and a traces of a lower surface or another surface and / or vias in each module substrate 13 can couple (e.g., connect) a corresponding IC chip 14 and / or stages 25 of the BFN circuit 18 to a connection pad on the multi-layer substrate 10. The multi-layer substrate 10 can also include vias extending therethrough for connecting components at different layers of the multi-layer substrate 10. For instance, if stages 23 of the BFN circuit 18 can be formed on an interior layer of the multi-layer substrate 10, the multilayer substrate 10 can include vias for electrically connecting the stages 23 of the BFN circuit 18 to stages 25 (and consequently to circuitry 26 and antenna elements 12) of the antenna modules 8. Such vias can be coupled to the remaining stages of the BFN circuit 18 at signal interfaces to couple the antenna modules 8 to the remainder of the BFN circuit 18.

[0032] By implementing the phased array antenna 2 of FIGs. 1 A and IB, a relatively simple, low cost phased array antenna can be fabricated. For example, splitting the BFN circuit 18 to include one or more stages 25 in antenna modules 8 may reduce a complexity in fabricating the antenna modules 8, which may reduce a quantity of defective chips as well as a cost of manufacture (e.g., due to reduced via count). Further, including final BFN stages in an antenna module 8 may allow for reduced area of one or more devices by reducing TO circuitry and therefore overall die size, allowing for additional circuitry to be built, for smaller and denser component and chip design, and reducing a quantity of material used for fabricating I / O area for each module. Additionally, integration of IC chips 14 with each antenna module 8 may position IC chips 14 in relatively close proximity with radiating elements 12 so that via lengths between the IC chips 14 and the radiating elements 12 can be reduced. Further, including multiple IC chips 14 in each module may increase density and thus performance.

[0033] Furthermore, as noted above, the patterned conductive interfaces may define locations of the N antenna modules 8, and accordingly, the antenna modules 8 can be fabricated at a different time and / or facility from the multi-layer substrate 10. Further, each antenna module 8 may be made up of one or several different materials with an air gap to enhance efficiency of the antenna elements 12. Additionally, or alternatively, a pattern of an upper surface and / or layer of the multi-layer substrate 10 may ensure that a free space gap separates each IC chip 14. Free space gaps may introduce index of refraction discontinuities in an upper layer between the IC chips 14. These index of refraction discontinuities may reduce the propagation of surface waves across the upper conductive layer of the multi- layer substrate 10.

[0034] FIG. 2 shows a portion of an example phased array antenna 100 that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure. For example, the portion of the example phased array antenna 100 may have an example architecture for mounting a plurality of antenna modules 102 on a multilayer substrate 104 (e.g., a motherboard). The phased array antenna 100 can be employed to implement the phased array antenna 2 of FIGs. 1 A and IB. Each antenna module 102 can include a module substrate 106 with multiple radiating elements 108 (e.g., two or more) disposed on (e.g., on a top surface of) or integrated with the module substrate 106. Each radiating element 108 can be implemented, for example, as a patch antenna or a slot antenna (only some of which are labeled in detail in FIG. 2).

[0035] One, or multiple (e.g., two or more) IC chips 110 (e.g., RFIC chips) can be adhered (e.g., mounted) to a first (e.g., lower) surface of the module substrate 106.Additionally, or alternatively, each IC chip 110 can be adhered to an upper surface 114 (e.g., a conductive layer) of the multi-layer substrate 104. In some examples, each IC chip 110 can be adhered to the upper surface 114 of the multi-layer substrate 104 via an electrical bonding material (e.g., solder). The multi-layer substrate 104 can include circuits, including one or more initial or remaining stages of a BFN circuit. Additionally, the multi-layer substrate 104 can be coupled to power circuits and / or controllers that can provide signals to the IC chips 110. Additionally, or alternatively, the module substrate 106 can include one or more final stages of the BFN circuit, each IC chip 110 may include one or more final stages of the BFN circuit, or both. In some examples, each IC chip 1 10 can include an upper IC chip interface 116 that can provide a signal interface between the module substrate 106 and the IC chip 110. Additionally, each IC chip 110 can include a lower IC chip interface 118 that can provide asignal interface between the IC chip 110 and the multi-layer substrate 104. The IC chips 110 can include one or more through-chip vias (e.g., through-silicon vias (TSVs)) that may pass completely through the IC chips 110 to provide conductive interfaces at both interfaces 118, 116. Additionally, or alternatively, each interface 116 and 118 may include one VO interface, or multiple I / O interfaces, respectively.

[0036] In some examples, the lower IC chip interface 118 can be coupled to circuits in the multi-layer substrate 104 (such as stages of a BFN circuit) through vias. For instance, a solder joint between solder pads on the top surface 114 of the multi-layer substrate 104 and each IC chip 110 (e.g., extending between the upper surface of the multi-layer substrate 104 and the lower surface of the one or more IC chips 110) can provide the direct electrical connection. In this manner, each IC chip 110 can be directly coupled to the multi-layer substrate 104. In some examples, one or more final stages of the BFN circuit in each IC chip 110 may be in electrical communication with one or more remaining stages of the BFN circuit in the substrate 104 through the direct connection, or through one or more conductors or vias routed through the substrate 106 that may couple with conductors or vias extending from the interface 116 to the interface 118. Additionally, or alternatively, one or more final stages in the module substrate 106 may be coupled with the remaining stages using the vias and / or conductors extending between the interfaces 116 and 118, where the final stages in the module substrate 106 may couple with circuitry 26 in each IC chip 110 supporting radiating elements 108. Additionally, or alternatively, final stages may be included in both the module substrate 106 and the IC chips 110, where a final stage in the module substrate may couple with final stages in the IC chips 110, which may in turn be coupled with circuitry 26. In some examples, each final stage may be coupled with at least two radiating elements 108.

[0037] In operation, each IC chip 110 may interpose signals communicated between a corresponding radiating element 108 and the multi-layer substrate 104 (including the remaining stages of the BFN circuit). Specifically, the signals communicated between each IC chip 1 10 and the multi-layer substrate 104 can pass through the lower IC chip interface 118. Additionally, the signals communicated between the IC chip 110 and the radiating element 108 can pass through the upper IC chip interface 116. Each IC chip 110 can adjust (e.g., amplify, filter and / or phase shift) signals communicated between the multi-layer substrate 104 and the module substrate 106.

[0038] By employment of the architecture illustrated for the phased array antenna 100 ofFIG. 2, a direct electrical connection between the multi-layer substrate 104 and IC chips 110can be achieved. In this manner, the IC chips 110 of the antenna modules 102 can be directly coupled to vias and / or traces connected remaining stages of the BFN circuit and / or power and control systems of the multi-layer substrate 104. The architecture of the phased array antenna 100 of FIG. 2 curtails losses by positioning each IC chip 110 in relatively close proximity to a respective radiating element 108. Further, in some examples, such losses can be further curtailed by providing the direct electrical connection between the multi-layer substrate 104 and the IC chip 110.

[0039] Additionally or alternatively, the upper IC chip interface 116 can be configured to provide capacitive coupling between the module substrate 106 and the circuitry 26. For example, some portion (or all) of the upper IC chip interface 116 can be designed to not provide a direct electrical contact, but still provide a capacitive plate for the capacitive coupling. Additionally, or alternatively, the lower IC chip interface 118 can be configured to provide capacitive coupling between the circuitry 26 and the module substrate 106. For example, some portion (or all) of the lower IC chip interface 118 can be designed to not provide a direct electrical contact, but still provide for the capacitive coupling. Additionally, or alternatively, other couplings described herein may be capacitive couplings.

[0040] FIG. 3 shows a portion of an example phased array antenna 150 that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure. For example, the portion of an example phased array antenna 150 may include another example architecture for mounting a plurality of antenna modules 152 on a multi-layer substrate 154. The phased array antenna 150 can be employed to implement the phased array antenna 2 of FIGs. 1A and IB. Each antenna module 152 can include a module substrate 156 with multiple radiating elements 158 disposed on the module substrate 156. Each radiating element 158 can be implemented, for example, as a patch antenna or a slot antenna.

[0041] One or more IC chips 160 can be mounted to a lower surface 162 of the module substrate 156. Each module substrate 156 can be mounted to an upper surface 164 (e.g., a conductive layer) of a multi-layer substrate 154 through a conductive bonding material 166, such as solder balls or pillars. Each IC chip 160 can be spaced apart from the upper surface 164 of the multi-layer substrate 154. In other words, a free space gap (e.g., air or a void) can separate a surface of each IC chip 160 from the upper surface 164 of the multi-layer substrate 154. Additionally, the amount of conductive bonding material 166 (e.g., solder) can provide a desired spacing (e.g., a size of the free space gap or air gap) between the IC chips 160 and themulti-layer substrate 154. In some examples, each IC chip 160 can be circumscribed by a corresponding module substrate 156. In such a situation, an electrical connection formed by the conductive bonding material 166 can be formed near a periphery of the corresponding module substrate 156. In some examples, an antenna module 152 may be made up of one or several different materials with an air gap to enhance efficiency of the antenna elements 158.

[0042] The multi-layer substrate 154 can include circuits, including one or more initial or remaining stages of a BFN circuit. Additionally, the multi-layer substrate 154 can be coupled to power circuits and / or controllers that can provide signals to the IC chips 160. In some examples, the module substrate 106 can include one or more final stages of the BFN circuit, each IC chip 110 may include one or more final stages of the BFN circuit, or both. In operation, each IC chip 160 can adjust (e.g., amplify, filter and / or phase shift) signals communicated between the multi-layer substrate 154 and the radiating element 158. Additionally, or alternatively, the multi-layer substrate 154 may include one or more components 161. In some cases, the components 161 may be air-filled or empty cavities (e.g., voids) to reduce a thermal load on the IC chips 160 and other components. Additionally, or alternatively, the components 161 may be conductive materials (e.g., thermal vias, conductive components) operable to conduct heat away from the IC chips 160 or other components to reduce a thermal load. Additionally, or alternatively, similar components may be included in the multi-layer substrate 104 in FIG. 2. Further, although the components 161 may be shown in a few example configurations, any shape or location of the components 161 may be considered.

[0043] Each IC chip 160 may include an IC chip interface 168 that can provide a conductive interface between the module substrate 156 and the IC chip 160. In some examples, each IC chip 110 can be flipped and attached to the lower surface 162 of the module substrate 156. This architecture may curtail signal or power losses by positioning the IC chip 160 in relatively close proximity to the radiating element 158. Additionally, the module substrate 156 can include vias and / or traces (e.g., of a lower surface) that provide an electrical path between the multi-layer substrate 154 and the IC chip 160. In this manner, signals provided from the multi-layer substrate 154 to the IC chip 160 can be routed through the module substrate 156. Specifically, signals communicated between the multi-layer substrate 154 and an IC chip 160 can pass through the conductive bonding material 166, through the vias and / or traces of the module substrate 156 and through the IC chip interface 168. Additionally, signals communicated between the IC chip 160 and the radiating element158 can pass through the IC chip interface 168 and through the module substrate 156. In some examples, the conductive bonding material 166 may be a single instance (e.g., a single I / O interface), or multiple instances of the conductive bonding material 166. Additionally, or alternatively, the IC chip interface 168 may be one interface or multiple interfaces.

[0044] In some examples, one or more final stages of the BFN circuit in one or more IC chips 160 may be in electrical communication with one or more remaining stages of the BFN circuit in the multi-layer substrate 154 through the vias and / or conductive traces of each respective module substrate 106 through the conductive bonding (e.g., solder balls) material 166 extending between the upper surface of the multi-layer substrate 154 to the one or more conductive traces. Additionally, or alternatively, one or more final stages of the BFN in the module substrate 156 may couple with the remaining stages using the conductive bonding material 166 and / or traces, and may also couple with circuitry 26 and / or additional final stages in each IC chip 160. In some examples, each final stage may be coupled with at least two radiating elements 158.

[0045] By employment of the architecture illustrated for the phased array antenna 150 of FIG. 3, an electrical path between the multi-layer substrate 154 and the IC chip 160 can be achieved with the single IC chip interface 168 on one side of the IC chip 160. Further, by employment of the architecture illustrated for the phased array antenna 150 of FIG. 3, the IC chip 160 of each antenna module 152 can be indirectly coupled to vias and / or traces connecting final stages of the module substrate 156 and / or remaining stages of the BFN circuit of the multi-layer substrate 154, and well as power and control systems / lines of the multi-layer substrate 154. Additionally, separating the antenna modules 152 with free space (e.g., air or a void) may avoid a continuous dielectric material between the radiating elements 158. In this manner, unwanted surface wave propagation of signals may be suppressed / curtailed (reduced and / or eliminated), thereby elevating a performance (signal to noise ratio) of the phased array antenna 150. For example, surface waves that would otherwise propagate parallel with a continuous surface of dielectric material can be suppressed / curtailed.

[0046] FIG. 4 shows a top view of an example antenna module 152 that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure. The illustrated example includes various groups of conductive bonding material 166 (e.g., solder balls, pillars, etc.) between a lower surface 162 of the module substrate 156 and a multi-layer substrate (e.g., multi-layer substrate 154 of FIG. 3).

[0047] In the illustrated example, conductive bonding material 166-b may be arranged along the periphery of the lower surface 162 of the module substrate 156. The conductive bonding material 166 can provide the desired spacing between one or more IC chips 160 and the multi-layer substrate as discussed above with respect to FIG. 3. For example, some or all of the conductive bonding material 166-b can be coupled to ground to provide shielding of multiple IC chips 160 from external electromagnetic sources. As another example, one or more of the conductive bonding material 166-b may be coupled to a supply voltage (or multiple supply voltages) that may be used to provide power for the IC chips 160 through one or more conductive traces (not shown) coupled to corresponding ports of the IC chip. As yet another example, one or more of the conductive bonding material 166-b may be coupled to a control line in the multi-layer substrate to provide control signals to each IC chip 160 through one or more conductive traces (not shown) coupled to corresponding ports of the IC chips. Although shown in the illustrated example as being arranged along the periphery, in other examples the conductive bonding material 166-b can be arranged in a different manner.

[0048] In the illustrated example, the electrical path for communication of signals between the multi-layer substrate and a port (e.g., a pad, lead, etc.) on each IC chip 160 may be provided through conductive bonding material 166-a, conductive trace 167, and conductive bonding material 169-a (e.g., solder, etc.). As such, the conductive bonding material 166-a extends between the upper surface of the multi-layer substrate to the conductive trace 167 (e.g., patterned metal material) on the lower surface 162 of the module substrate 156. The conductive bonding material 166-a may be surrounded by conductive bonding material 166-c coupled to ground to provide shielding. The conductive trace 167 may connect with multiple IC chips 160. For example, the conductive trace 167 may include multiple traces, or may be formed so that the conductive trace 167 extends between the conductive bonding material 166-a and multiple conductive bonding materials 169-a, which may be each adhered to a respective port on a respective IC chip 160. Alternatively, the manner in which the electrical paths may be established may be different.

[0049] In the illustrated example, the electrical path for communication of signals between one or more ports of the IC chips 160 and respective radiating elements (not shown) may be provided by conductive bonding material (e.g., solder) 169-b that extends between the lower (e.g., bottom) surface of the module substrate 156 and the upper surface of the IC chip 160. In the illustrated example, each radiating element may be a dual-polarized antenna having two ports and thus a first signal (e.g., corresponding to horizontal polarization) may becommunicated between a first port of each IC chip 160 and a first port of the radiating element through conductive bonding material 169-bl, and a second signal (e.g., corresponding to vertical polarization) may be communicated between a second port of each IC chip 160 and a second port of the radiating element through conductive bonding material 169-bl. Alternatively, the manner in which an electrical path may be established between each IC chip 160 and one or more radiating elements may be different.

[0050] In the illustrated example, additional conductive bonding material may be arranged along the periphery of each IC chip 160 to provide additional electrical paths between other ports on the IC chip 160 and the multi-layer substrate, such as to provide ground, DC supply voltage(s), etc. through conductive bonding material 166-b and conductive traces (not shown) as mentioned above. Further, although not shown, the module 152 may include any quantity of IC chips 160. For example, the conductive bonding material 166-a and trace 167 may couple with four IC chips 160 arranged in an array under the module substrate 156.

[0051] By implementing the conductive bonding material 166 and other circuitry described in FIG. 4, a quantity of I / O connections may be reduced, enabling multiple IC chips 160 to be included a single antenna module 152. For example, as a space between antenna elements decreases, room may be limited for antenna modules and I / O circuitry. Thus, by adding multiple IC chips 160 and using a trace 167 and one conductive bonding material 166-a as illustrated, multiple IC circuits may be adhered to a single antenna module 152, which may reduce I / O circuitry, increasing performance, and support smaller components as well as closer spacing between antenna elements. In some cases, closer spacing between antenna elements may enable higher frequency communications.

[0052] FIG. 5 shows a portion of an example phased array antenna 200 that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure. For example, the portion of an example phased array antenna 200 may include another example architecture for mounting a plurality of antenna modules 202 on a multi-layer substrate 204. The phased array antenna 200 can be employed to implement the phased array antenna 2 of FIGs. 1 A and IB. Each antenna module 202 can include a module substrate 156 with multiple radiating elements 208 disposed on the module substrate 206. Each radiating element 208 can be implemented, for example, as a patch antenna or a slot antenna. In some cases, one or more IC chips 210 may be mounted on a lower surface of the module substrate 206 and on an upper surface of the multi-layer substrate 204 as describedherein with reference to FIG. 2, or may be indirectly coupled with circuitry of the multi-layer substrate 204 with one or more air gaps as described herein with reference to FIG. 3.

[0053] In some examples, an insulative layer 209 (e.g., a rad layer, a radiating layer, a radiation layer) may be disposed at the upper surface of each module substrate 206. In some cases, the multiple radiating elements 208 may be disposed at an upper surface of the insulative layer 209 and may be conductively (or communicatively) coupled with one or more final stages of a BFN circuit (e.g., in the IC chips 210 or module substrate 206) using one or more conductors and / or vias in the module substrate 206, a conductive bonding material 217 extending between an upper surface of the module substrate 206 to a lower surface of the insulative layer 209, and one or more conductors, vias, and / or couplers in the insulative layer 209. Additionally, or alternatively, the connection to radiating elements 208 may be based on a non-contact coupling (e.g., aperture coupling).

[0054] By including an insulative layer 209, a thickness of each antenna module 202 may be increased, thereby improving a radiation pattern bandwidth. Further, the insulative layer 209 may provide protection for stacked elements of the phased array antenna 200 from additional materials deposited that may affect one or more stacked elements during manufacture. Further, adding an insulative layer 209 may free up space for additional circuitry and functionality.

[0055] FIG. 6 shows block diagram of an example phased array antenna 300 that supports antenna array modules with multiple antenna elements in accordance with aspects of the present disclosure. For example, the phased array antenna 300 may depict the logical interconnection of the phased array antenna 2 of FIGs. 1 A and IB operating in one or more different modes (e.g., receiving, transmitting, half duplex, full duplex, frequency division duplex, polarization duplex). Moreover, the architecture of the phased array antenna 100 of FIG. 2, the phased array antenna 150 of FIG. 3, or the phased array antenna 200 of FIG. 5 could be employed to implement the phased array antenna 300 of FIG. 6. In the illustrated example, N antenna modules 302 may communicate with one or more stages 304 (e.g., remaining stages) of a BFN circuit 303 via one or more stages 305 (e.g., final stages) of each antenna module 302.

[0056] In some cases, FIG. 6 may illustrate the phased array antenna 300 operating in a half-duplex mode. For example, each of the N antenna modules 302 can include a module substrate 306 with one or multiple radiating elements 308 (e.g., patch antennas or slotantennas) that can be disposed or integrated with the module substrate. Each of the N antenna modules 302 also can include one or multiple IC chips 310. In the illustrated example, an example IC chip 310 in each antenna module 302 can include one or more receiving paths 312 and one or more transmitting paths 314 (e.g., circuitry 26 described in FIG. 1 A). For example, a receiving path 312 can include a receiving amplifier 316 and a receiving phase shifter 318 for adjusting signals received from a corresponding radiating element 308. Similarly, a transmitting path 314 can include a transmitting amplifier 320 and a transmitting phase shifter 322 for adjusting a corresponding element signal 326 provided from the BFN circuit 303. Each IC chip 310 may also include ADCs, DACs, mixers, control circuitry, or other components for adjusting signals or controlling other components.

[0057] In some examples, in half-duplex mode, the phased array antenna 300 may switch between a receiving mode and a transmitting mode. For example, each IC chip 310 also can include switches 324 (e.g., transistor switches) for switching between the receiving mode and the transmitting mode. The IC chips 310 can receive control signals 328 from a controller 330 that can be implemented on an external system (e.g., a local system). The control signals 328 can control a state of the switches 324 to switch the phased array antenna 300 from the receiving mode to the transmitting mode, or vice-versa. Additionally, in some examples, the control signals 328 provided from the controller 330 can control a variable amount of amplitude adjustment applied by each receiving amplifier 316 and each transmitting amplifier 320. Thus, in some examples, each receiving amplifier 316 and each transmitting amplifier 320 can be implemented as a variable gain amplifier, a switched attenuator circuit, etc. Similarly, in some examples, the control signals provided from the controller 330 can control a variable amount of phase adjustment applied by each receiving phase shifter 318 and each transmitting phase shifter 322.

[0058] In operation in the receiving mode, the controller 330 may set the switches 324 of the IC chips 310 to route signals through the receiving path 312. Moreover, in the receiving mode an RF signal received by each of the N radiating elements 308 (or some subset thereof) can be provided to a corresponding IC chip 310 for adjustment. Each receiving amplifier 316 of the IC chips 310 may amplify the provided signal and each receiving phase shifter 318 may apply a phase shift to output N element signals, which can alternatively be referred to as adjusted signals. The N element signals can be provided to the stages 305 and 304 of the BFN circuit 303. The BFN circuit 303 can combine the N element signals to form a received beam signal that can be provided to the local system for demodulating and processing.

[0059] In operation in the transmitting mode, the controller 330 may set the switches 324 to the transmitting path 314 to transmit a beam signal provided from the local system to the BFN circuit 303. The stages 304 of the BFN circuit 303 may divide the transmit beam signal into N element signals that can be provided to other respective circuitry of each IC chip 310 associated with each antenna. Each IC chip 310 of the N antenna modules 302 can adjust a corresponding element signal to generate an adjusted signal that can be provided to a corresponding radiating element 308 via the respective circuitry. In the example illustrated, the adjusting can include the transmitting phase shifter 322 phase shifting the element signal and the transmitting amplifier 320 amplifying the element signal. Each radiating element 308 may propagate the corresponding adjusted signal as an RF signal into free space.

[0060] In the half-duplex mode, the phased array antenna 300 may switch between the receiving mode and the transmitting mode. In this manner, the same antenna modules 302 can be employed for both the transmission and the reception of RF signals. Additionally, or alternatively, the phased array antenna 300 may support separate or dedicated receive circuitry (not shown) in IC chips 310 including stages of and coupled with remaining stages of a receiving BFN circuit, or may support a separate or dedicated transmit circuitry (not shown) in IC chips 310 coupled with stages of a transmitting BFN circuit, where receive or transmit circuitry may similarly include one or more amplifiers and / or phase shifters.

[0061] Additionally, or alternatively, the phased array antenna 300 may operate in frequency division duplex mode. For example, in frequency division duplex mode, the phased array antenna 300 may include circuitry for processing RF signals received within a receiving band and for propagating RF signals in a transmitting band, such as one or more filters (not shown). For example, each receiving path 312 can include an input receiving filter and an output receiving filter. The input receiving filter and the output receiving filter can be implemented as relatively narrow band pass filters that remove signals with frequencies outside the receiving band. Accordingly, the input receiving filter and the output receiving filter can have a passband set to the reconceiving band. Similarly, the transmitting path 314 can include an input transmitting filter and an output receiving filter. The input transmitting filter and the output transmitting filter can be implemented as relatively narrow band pass filters that remove signals with frequencies outside the transmitting band. Accordingly, the input transmitting filter and the output transmitting filter can have a passband set to the transmitting band. In some cases, in the phased array antenna 300, the frequency of traversing signals may control the routing of signals throughthe phased array antenna 300. In this manner, the same antenna element modules 302 can be employed for both the transmission and the reception of RF signals. Further, the phased array antenna 300 can have an architecture that intermittently switches between the transmitting mode and the receiving mode to provide half-duplexing.

[0062] Additionally, or alternatively, the phased array antenna 300 may operate in polarization duplex mode, which can be a particular configuration of half-duplex mode. For example, in polarization duplex mode, the phased array antenna 300 can include circuitry for processing RF signals received with a first polarization and for propagating RF signals in a second polarization, orthogonal to the first polarization. In some cases, each radiating element 308 can be representative of a set of orthogonally arranged radiating elements, such as slot antennas, or multiple radiating elements 308 may be used. In some cases, each receiving path 312 can be coupled to a first port (not shown) of a respective radiating element 308 and each transmitting path 314 can be coupled to a respective second port (not shown) of the radiating element 308. The first port can be configured to output RF signals received at the radiating element 308 that may be in a first polarization, and the second port can be configured to transmit signals received at the radiating element 308 with a second polarization, orthogonal to the first polarization. For instance, the first polarization can be vertical polarization and the second polarization can be horizontal polarization, or vice versa. Alternatively, the first polarization can be right hand circular polarization (RHCP) and the second polarization can be left hand circular polarization (LHCP) or vice versa. Additionally, or alternatively, in the polarization duplex mode, the phased array antenna 300 may switch between the receiving mode and the transmitting mode. By leveraging the orthogonal relationship of signals at a first port and signals at a second port of a radiating elements 308, each antenna module 302 can be implemented with a single switch (e.g., switch 324) to reduce losses. Additionally, in this manner, the same antenna element modules 302 can be employed for both the transmission and the reception of RF signals.

[0063] Additionally or alternatively, the phased array antenna 300 may operate according to a digital architecture. For example, element signals 326 may be digital signals, and the IC chips 310 may include ADCs and DACs to convert between the element signals 326 and RF signals for communication via the radiating elements 308.

[0064] In some examples, one or more formation processes may be performed for forming the structures described herein. For example, a method may include forming aplurality of antenna element modules including one or more final stages of a BFN circuit, forming a multi-layer substrate including one or more remaining stages of a BFN circuit, and mounting each of the antenna element modules on the multi-layer substrate. An electrical bonding material (e.g., solder) can be applied to patterned mounting interfaces of the multi-layer substrate to facilitate the mounting. In this manner, the vias and / or traces in the multi-layer substrate may electrically couple the IC chips of the antenna element modules with the BFN circuit. Additionally, or alternatively, the present examples may not be limited by a described order, as some actions can in other examples occur in different orders, multiple times and / or concurrently / combined from that described herein. Moreover, it is not necessary that all described actions be performed as described herein.

[0065] Information and signals described herein may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0066] The various illustrative blocks and modules described in connection with the disclosure herein may be implemented or performed with a general purpose processor, a DSP, an ASIC, an FPGA, or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0067] The functions described herein may be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions may be stored on or transmitted over as one or more instructions or code on a computer readable medium. Other examples and implementations are within the scope of the disclosure and appended claims. For example, due to the nature of software, functions described herein can be implemented using software executed by a processor, hardware, firmware, hardwiring, or combinations of any of these. Features implementing functions may also be physically located at various positions, including being distributed such that portions of functions are implemented at different physical locations.

[0068] Computer readable media includes both non transitory computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A non-transitory storage medium may be any available medium that can be accessed by a general purpose or special purpose computer. By way of example, and not limitation, non-transitory computer readable media may include RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory, compact disk read-only memory (CDROM) or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other non-transitory medium that can be used to carry or store desired program code means in the form of instructions or data structures and that can be accessed by a general purpose or special purpose computer, or a general purpose or special purpose processor. Also, any connection is properly termed a computer readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, include CD, laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above are also included within the scope of computer readable media.

[0069] As used herein, including in the claims, “or” as used in a list of items (e.g., a list of items prefaced by a phrase such as “at least one of’ or “one or more of’) indicates an inclusive list such that, for example, a list of at least one of A, B, or C means A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Also, as used herein, the phrase “based on” shall not be construed as a reference to a closed set of conditions. For example, an exemplary step that is described as “based on condition A” may be based on both a condition A and a condition B without departing from the scope of the present disclosure. In other words, as used herein, the phrase “based on” shall be construed in the same manner as the phrase “based at least in part on.”

[0070] In the appended figures, similar components or features may have the same reference label. Further, various components of the same type may be distinguished by following the reference label by a dash and a second label that distinguishes among the similar components. If just the first reference label is used in the specification, the descriptionis applicable to any one of the similar components having the same first reference label irrespective of the second reference label, or other subsequent reference label.

[0071] The description set forth herein, in connection with the appended drawings, describes example configurations and does not represent all the examples that may be implemented or that are within the scope of the claims. The term “exemplary” used herein means “serving as an example, instance, or illustration,” and not “preferred” or “advantageous over other examples.” The detailed description includes specific details for the purpose of providing an understanding of the described techniques. These techniques, however, may be practiced without these specific details. In some instances, well known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the described examples.

[0072] The description herein is provided to enable a person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein but is to be accorded the broadest scope consistent with the principles and novel features disclosed herein.

Claims

CLAIMSWhat is claimed is:

1. A phased array antenna (2, 100, 150, 200, 300) comprising: an array of antenna modules (8, 102, 152, 202, 302), each of the array of antenna modules (8, 102, 152, 202, 302) comprising: a module substrate (13, 106, 156, 206, 306) having a lower surface (162) with one or more conductive traces (167); a plurality of radiating elements (12, 108, 158, 208, 308) disposed above an upper surface of the module substrate (13, 106, 156, 206, 306); one or more integrated circuit (IC) chips (14, 110, 160, 210, 310) adhered to the lower surface (162) of the module substrate ( 13, 106, 156, 206, 306) and connected to the one or more conductive traces (167), the one or more IC chips (14, 110, 160, 210, 310) each including a circuit (26) to adjust a signal communicated with the plurality of radiating elements (12, 108, 158, 208, 308) through the module substrate (13, 106, 156, 206, 306) by phase shifting and / or amplifying the signal to steer a beam formed by the phased array antenna (2, 100, 150, 200, 300); and one or more final stages (25, 305) of a plurality of stages of a beam forming network (BFN) circuit (18, 303); and a multi-layer substrate (10, 104, 154, 204) underlying the array of antenna modules (8, 102, 152, 202, 302), the multi-layer substrate (10, 104, 154, 204) including a remainder (23, 304) of the plurality of stages of the BFN circuit (18, 303) formed on one or more layers of the multi-layer substrate (10, 104, 154, 204), the remainder (23, 304) of the BFN circuit (18, 303) being in electrical communication with the one or more final stages (25, 305) of the BFN circuit (18, 303) through the one or more conductive traces (167) of each respective module substrate (13, 106, 156, 206, 306) through one or more first instances of conductive bonding material (166, 217) extending between an upper surface (114, 164) of the multi-layer substrate (10, 104, 154, 204) to the one or more conductive traces (167).

2. The phased array antenna (2, 100, 150, 200, 300) of claim 1, wherein the module substrate (13, 106, 156, 206, 306) of each antenna module (8, 102, 152, 202, 302) comprises a final stage (25, 305) of the one or more final stages of theBFN circuit (18, 303), wherein the final stage (25, 305) is coupled with two radiating elements (12, 108, 158, 208, 308) of the plurality of radiating elements.

3. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 1-2, wherein at least one IC chip (14, 110, 160, 210, 310) of each antenna module (8, 102, 152, 202, 302) comprises a final stage (25, 305) of the one or more final stages of the BFN circuit (18, 303) in a package of the at least one IC chip (14, 110, 160, 210, 310), wherein the final stage (25, 305) is coupled with two radiating elements (12, 108, 158, 208, 308) of the plurality of radiating elements.

4. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 1-3, wherein the one or more IC chips (14, 110, 160, 210, 310) comprise: a first IC chip (14, 110, 160, 210, 310) coupled with a first radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a first circuit (26) to adjust a signal communicated with the first radiating element (12, 108, 158, 208, 308); and a second IC chip (14, 110, 160, 210, 310) coupled with a second radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a second circuit (26) to adjust a signal communicated with the second radiating element (12, 108, 158, 208, 308).

5. The phased array antenna (2, 100, 150, 200, 300) of claim 4, the first IC chip (14, 110, 160, 210, 310) being further coupled with a third radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a third circuit (26) to adjust a signal communicated with the third radiating element (12, 108, 158, 208, 308), and the second IC chip (14, 110, 160, 210, 310) being further coupled with a fourth radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and further comprising a fourth circuit (26) to adjust a signal communicated with the fourth radiating element (12, 108, 158, 208, 308), wherein the first IC chip (14, 110, 160, 210, 310) includes a first final stage (25, 305) of the one or more final stages of the BFN circuit (18, 303) and the second IC chip (14, 110, 160, 210, 310) includes a second final stage (25, 305) of the one or more final stages, and wherein the module substrate (13, 106, 156, 206, 306) of an antenna module (8, 102, 152, 202, 302) comprising the first IC chip (14, 110, 160, 210, 310) and the second IC chip (14, 110, 160, 210, 310) comprises a third final stage (25, 305) of the one or morefinal stages of the BFN circuit (18, 303) that is coupled with the first final stage (25, 305) and the second final stage (25, 305).

6. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 1-5, wherein the one or more IC chips (14, 1 10, 160, 210, 310) comprise: a first IC chip (14, 110, 160, 210, 310) coupled with a first radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a first circuit (26) to adjust a signal communicated with the first radiating element (12, 108, 158, 208, 308), the first IC chip (14, 110, 160, 210, 310) being further coupled with a second radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and further comprising a second circuit (26) to adjust a signal communicated with the second radiating element (12, 108, 158, 208, 308).

7. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 1-6, further comprising: an insulative layer (209) disposed at the upper surface of the module substrate (13, 106, 156, 206, 306), wherein the plurality of radiating elements (12, 108, 158, 208, 308) are disposed at an upper surface of the insulative layer (209) and are communicatively coupled with the one or more final stages (25, 305) of the BFN circuit (18, 303) using one or more conductors and / or vias in the module substrate (13, 106, 156, 206, 306), one or more conductors, vias, and / or couplers in the insulative layer (209), and one or more second instances of the conductive bonding material (166, 217) extending between the upper surface of the module substrate (13, 106, 156, 206, 306) to a lower surface of the insulative layer (209).

8. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 1-7, wherein the BFN circuit (18, 303) is a passive circuit that divides or combines signals in-phase that are communicated with one or more radiating elements (12, 108, 158, 208, 308) of the plurality of radiating elements of each antenna module (8, 102, 152, 202, 302) of the array of antenna modules.

9. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 1-8, wherein each first instance of the conductive bonding material (166, 217) is surrounded by conductive bonding material (166, 217) coupled with a ground.

10. A phased array antenna (2, 100, 150, 200, 300) comprising: an array of antenna modules (8, 102, 152, 202, 302), each of the array of antenna modules (8, 102, 152, 202, 302) comprising: a module substrate (13, 106, 156, 206, 306); a plurality of radiating elements (12, 108, 158, 208, 308) disposed above an upper surface of the module substrate (13, 106, 156, 206, 306); one or more integrated circuit (IC) chips (14, 110, 160, 210, 310) adhered to a lower surface (162) of the module substrate (13, 106, 156, 206, 306), the one or more IC chips (14, 110, 160, 210, 310) each including a circuit (26) to adjust a signal communicated with the plurality of radiating elements (12, 108, 158, 208, 308) through the module substrate (13, 106, 156, 206, 306) by phase shifting and / or amplifying the signal to steer a beam formed by the phased array antenna (2, 100, 150, 200, 300); and one or more final stages (25, 305) of a plurality of stages of a beam forming network (BFN) circuit (18, 303); and a multi-layer substrate (10, 104, 154, 204) underlying the array of antenna modules (8, 102, 152, 202, 302), the one or more IC chips (14, 110, 160, 210, 310) adhered to an upper surface (114, 164) of the multi-layer substrate (10, 104, 154, 204), the multi-layer substrate (10, 104, 154, 204) including a remainder (23, 304) of the plurality of stages of the BFN circuit (18, 303) formed on one or more layers of the multi-layer substrate (10, 104, 154, 204), and the remainder (23, 304) of the BFN circuit (18, 303) being in electrical communication with the one or more final stages (25, 305) of the BFN circuit (18, 303) through a direct connection with one or more first instances of conductive bonding material (166, 217) extending between the upper surface (1 14, 164) of the multi-layer substrate (10, 104, 154, 204) to a lower surface of the one or more lC chips (14, 110, 160, 210, 310).1 1. The phased array antenna (2, 100, 150, 200, 300) of claim 10, wherein the module substrate (13, 106, 156, 206, 306) of each antenna module (8, 102, 152, 202, 302) comprises a final stage (25, 305) of the one or more final stages of the BFN circuit (18, 303), wherein the final stage (25, 305) is coupled with two radiating elements (12, 108, 158, 208, 308) of the plurality of radiating elements, and wherein the final stage (25, 305) is coupled with the remainder (23, 304) of the plurality of stages ofthe BFN circuit (18, 303) using one or more vias or one or more conductors extending through the one or more IC chips (14, 110, 160, 210, 310).

12. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 10-11, wherein at least one IC chip (14, 110, 160, 210, 310) of each antenna module (8, 102, 152, 202, 302) comprises a final stage (25, 305) of the one or more final stages of the BFN circuit (18, 303) in a package of the at least one IC chip (14, 110, 160, 210, 310), wherein the final stage (25, 305) is coupled with two radiating elements (12, 108, 158, 208, 308) of the plurality of radiating elements.

13. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 10-12, wherein the one or more IC chips (14, 110, 160, 210, 310) comprise: a first IC chip (14, 110, 160, 210, 310) coupled with a first radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a first circuit (26) to adjust a signal communicated with the first radiating element (12, 108, 158, 208, 308); and a second IC chip (14, 110, 160, 210, 310) coupled with a second radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a second circuit (26) to adjust a signal communicated with the second radiating element (12, 108, 158, 208, 308).

14. The phased array antenna (2, 100, 150, 200, 300) of claim 13, the first IC chip (14, 110, 160, 210, 310) being further coupled with a third radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a third circuit (26) to adjust a signal communicated with the third radiating element (12, 108, 158, 208, 308), and the second IC chip (14, 110, 160, 210, 310) being further coupled with a fourth radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and further comprising a fourth circuit (26) to adjust a signal communicated with the fourth radiating element (12, 108, 158, 208, 308), wherein the first IC chip (14, 110, 160, 210, 310) includes a first final stage (25, 305) of the one or more final stages of the BFN circuit (18, 303) and the second IC chip (14, 110, 160, 210, 310) includes a second final stage (25, 305) of the one or more final stages, and wherein the module substrate (13, 106, 156, 206, 306) of an antenna module (8, 102, 152, 202, 302) comprising the first IC chip (14, 110, 160, 210, 310) and the second IC chip (14, 110, 160, 210, 310) comprises a third final stage (25, 305) of the one or morefinal stages of the BFN circuit (18, 303) that is coupled with the first final stage (25, 305) and the second final stage (25, 305).

15. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 10-14, wherein the one or more IC chips (14, 110, 160, 210, 310) comprise: a first IC chip (14, 110, 160, 210, 310) coupled with a first radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and comprising a first circuit (26) to adjust a signal communicated with the first radiating element (12, 108, 158, 208, 308), the first IC chip (14, 110, 160, 210, 310) being further coupled with a second radiating element (12, 108, 158, 208, 308) of the plurality of radiating elements and further comprising a second circuit (26) to adjust a signal communicated with the second radiating element (12, 108, 158, 208, 308).

16. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 10-15, further comprising: an insulative layer (209) disposed at the upper surface of the module substrate (13, 106, 156, 206, 306), wherein the plurality of radiating elements (12, 108, 158, 208, 308) are disposed at an upper surface of the insulative layer (209) and are electrically coupled with the one or more final stages (25, 305) of the BFN circuit (18, 303) using one or more conductors and / or vias in the module substrate (13, 106, 156, 206, 306), one or more conductors, vias, and / or couplers in the insulative layer (209), and one or more second instances of the conductive bonding material (166, 217) extending between the upper surface of the module substrate (13, 106, 156, 206, 306) to a lower surface of the insulative layer (209).

17. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 10-16, wherein the BFN circuit (18, 303) is a passive circuit that divides or combines signals in-phase that are communicated with one or more radiating elements (12, 108, 158, 208, 308) of the plurality of radiating elements of each antenna module (8, 102, 152, 202, 302) of the array of antenna modules.

18. The phased array antenna (2, 100, 150, 200, 300) of any one of claims 10-17, wherein each first instance of the conductive bonding material (166, 217) is surrounded by conductive bonding material (166, 217) coupled with a ground.

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