Electrochemical apparatus and electrical device

By setting up an adhesive assembly between the electrode assembly and the housing of the electrochemical device and adjusting the bonding method, the problems of electrode assembly squirting and outer ring electrode sheet tearing when the electrochemical device falls are solved, which significantly improves the safety and reliability of the device.

WO2025112068A1PCT designated stage expired Publication Date: 2025-06-05NINGDE AMPEREX TECHNOLOGY LTD
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Patent Information

Application Number
PCT/CN2023/135987
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-01
Publication Date
2025-06-05

AI Technical Summary

Technical Problem

When existing electrochemical devices fall, internal short circuits and top seal breaks due to the squirming of the electrode assembly, which poses a high risk of failure.

Method used

By providing an adhesive assembly between the electrode assembly and the housing and canceling the bonding assembly to the first region, the electrode assembly is bonded to the adhesive assembly through the second region and the third region to buffer the pulling force of the housing and reduce the risk of tearing the outer ring of the electrode assembly.

Benefits of technology

It effectively suppresses the movement of the electrode assembly when the electrochemical device is impacted and tear of the outer ring electrode sheet, improving the safety and reliability of the electrochemical device.

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Abstract

An electrochemical apparatus and an electrical device. The electrochemical apparatus comprises a housing, an electrode assembly and a bonding assembly. The housing comprises a first side wall, and the electrode assembly is arranged in the housing and comprises a first side surface adjacent to the first side wall, the first side surface comprising a second area, a first area and a third area which are successively arranged in a first direction. The bonding assembly is located between the housing and the electrode assembly, and comprises a first surface and a second surface which are opposite to each other; the first surface comprises a first bonding region bonded to the first side wall; the second surface comprises a second bonding region bonded to the second area, a third bonding region bonded to the third area, and a first non-bonding region located between the second bonding region and the third bonding region. In a second direction, the projection of the first bonding region overlaps with the first non-bonding region, the second direction being the direction in which the first side wall is opposite to the first side surface. Eliminating bonding between the bonding assembly and the first area helps to reduce the risk of damage to the electrode assembly.
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Description

Electrochemical devices and electrical equipment Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to an electrochemical device and electrical equipment. Background Art

[0002] In order to improve the failure problems of internal short circuit, breaking of top seal, etc. caused by the movement of internal electrode assemblies when electrochemical devices such as lithium-ion batteries fall, the electrode assemblies inside the electrochemical device are usually connected to the shell with double-sided tape to suppress the movement of the electrode assemblies. This reduces the failure risk of the electrochemical device when it falls to a certain extent and improves the safety of the electrochemical device.

[0003] Summary of the Invention

[0004] However, the inventors of the present application have discovered that the existing structure of bonding the electrode assembly to the shell with double-sided tape can suppress the movement of the electrode assembly when the electrochemical device falls, but there is a risk of easily tearing the foil on the outer ring of the electrode assembly, causing an internal short circuit.

[0005] In view of this, the present application provides an electrochemical device, which aims to reduce the risk of tearing of the outer ring electrode sheet of the electrode assembly when it falls and improve the safety of the electrochemical device.

[0006] In a first aspect, the present application provides an electrochemical device comprising a housing, an electrode assembly, and an adhesive assembly. The housing comprises a first sidewall, the electrode assembly being disposed within the housing. The electrode assembly comprises a first side surface adjacent to the first sidewall, the first side surface comprising a first region, a second region, and a third region, with the first region being located between the second and third regions along a first direction. The adhesive assembly is disposed between the housing and the electrode assembly and comprises a first surface and a second surface facing away from the housing. The first surface comprises a first bonding region bonded to the first sidewall, the second surface comprises a second bonding region bonded to the second region, a third bonding region bonded to the third region, and a first non-bonding region located between the second and third bonding regions. A projection of the first bonding region overlaps the first non-bonding region along a second direction, the second direction being the direction from the first sidewall to the first side surface.

[0007] The present application sets a bonding component between the electrode assembly and the shell, cancels the bonding between the bonding component and the first area, and bonds the electrode assembly to the bonding component through the second area and the third area. While suppressing the movement of the electrode assembly when the electrochemical device is impacted, the pulling force of the shell can be buffered through the first non-bonding area and then transmitted to the electrode assembly through the second bonding area and the third bonding area, thereby helping to reduce the risk of tearing of the outer ring electrode of the electrode assembly when the electrochemical device is impacted.

[0008] In any of the above optional embodiments, the first surface further includes a second non-adhesive area and a third non-adhesive area, wherein along the first direction, the first adhesive area is located between the second non-adhesive area and the third non-adhesive area; along the second direction, the projection of the second non-adhesive area overlaps with the second adhesive area, and the projection of the third non-adhesive area overlaps with the third adhesive area. This arrangement allows the electrochemical device to better buffer the pulling force transmitted by the casing when subjected to an impact, reduces the pulling of the adhesive assembly on the second and third areas of the electrode assembly, and thereby reduces the risk of tearing of the outer ring electrode sheet of the electrode assembly.

[0009] In any of the above optional embodiments, the adhesive assembly includes a first single-sided adhesive tape, a second single-sided adhesive tape, and a third single-sided adhesive tape, the first single-sided adhesive tape includes a first adhesive surface and a first non-adhesive surface relative to each other, the first adhesive surface includes a fourth adhesive area, a fifth adhesive area, and a first adhesive area located between the fourth adhesive area and the fifth adhesive area. The second single-sided adhesive tape includes a second adhesive surface and a second non-adhesive surface relative to each other, the second adhesive surface is bonded to the fourth adhesive area and the second area. The third single-sided adhesive tape includes a third adhesive surface and a third non-adhesive surface relative to each other, the third adhesive surface is bonded to the fifth adhesive area and the third area. In this way, the bonding of the first single-sided adhesive, the second single-sided adhesive and the third single-sided adhesive can form the first bonding area, the second bonding area, the third bonding area, the first non-bonding area, the second non-bonding area and the third non-bonding area in the bonding assembly, which has the advantages of simple operation, high efficiency and low cost; at the same time, the bonding section between the second single-sided adhesive and the fourth bonding area in the first single-sided adhesive, and the bonding section between the third single-sided adhesive and the fifth bonding area in the first single-sided adhesive can further buffer the pulling force of the shell through deformation, thereby further reducing the risk of tearing of the outer ring pole piece of the electrode assembly.

[0010] In any of the above optional embodiments, the adhesive assembly includes a first double-sided adhesive tape, a fourth single-sided adhesive tape, a fifth single-sided adhesive tape, and a sixth single-sided adhesive tape. The first double-sided adhesive tape includes a seventh adhesive surface and an eighth adhesive surface relative to each other; the seventh adhesive surface includes a sixth adhesive area, a seventh adhesive area, and a first adhesive area located between the sixth adhesive area and the seventh adhesive area; the eighth adhesive surface includes a second adhesive area, a third adhesive area, and an eighth adhesive area located between the second adhesive area and the third adhesive area. The fourth single-sided adhesive tape includes a fourth adhesive surface and a fourth non-adhesive surface relative to each other, and the fourth adhesive surface is bonded to the sixth adhesive area; the fifth single-sided adhesive tape includes a fifth adhesive surface and a fifth non-adhesive surface relative to each other, and the fifth adhesive surface is bonded to the seventh adhesive area; the sixth single-sided adhesive tape includes a sixth adhesive surface and a sixth non-adhesive surface relative to each other, and the sixth adhesive surface is bonded to the eighth adhesive area. This arrangement allows the production method for forming adhesive areas and non-adhesive areas to have the advantages of simple operation, high efficiency, and low cost. At the same time, by adjusting the size and position of the fourth single-sided tape, the fifth single-sided tape and the sixth single-sided tape, the relative sizes of the first bonding area, the second bonding area, the third bonding area, the first non-bonding area, the second non-bonding area and the third non-bonding area can be conveniently controlled, thereby conveniently adjusting the firmness of the bonding between the shell and the electrode assembly and the cushioning of the bonding assembly.

[0011] In any of the above optional embodiments, the first single-sided adhesive tape includes a first colloid and a second colloid that are separately arranged, the second single-sided adhesive tape is bonded to the first colloid, and the third single-sided adhesive tape is bonded to the second colloid.

[0012] In any of the above optional embodiments, the second single-sided adhesive tape includes a third colloid and a fourth colloid that are separately arranged, and the third colloid and the fourth colloid are arranged along a third direction, which is perpendicular to the first direction and the second direction.

[0013] In any of the above optional embodiments, the third single-sided adhesive tape includes a fifth colloid and a sixth colloid that are separately arranged, and the fifth colloid and the sixth colloid are arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0014] In any of the above optional embodiments, the electrode assembly further includes a second side, a third side and a fourth side, the second side and the first side are arranged opposite to each other along the second direction, and the third side and the fourth side are arranged opposite to each other along the first direction.

[0015] In any of the above optional embodiments, the second one-sided adhesive is bonded to both the second area and the third side surface.

[0016] In any of the above optional embodiments, the third one-sided adhesive tape is bonded to both the third area and the fourth side surface.

[0017] In any of the above optional embodiments, the eighth bonding surface further includes a ninth bonding area, the second bonding area is located between the ninth bonding area and the eighth bonding area, and the ninth bonding area is bonded to the third side surface.

[0018] In any of the above optional embodiments, the eighth bonding surface further includes a tenth bonding area, the third bonding area is located between the tenth bonding area and the eighth bonding area, and the tenth bonding area is bonded to the fourth side surface.

[0019] The above arrangement enables the adhesive assembly to transmit the pulling force of the shell to the third side or the fourth side of the electrode assembly, which helps to reduce the risk of tearing of the outer ring electrode sheet of the electrode assembly when the electrochemical device is impacted.

[0020] In any of the above optional embodiments, the second one-sided adhesive is also bonded to the second side surface.

[0021] In any of the above optional embodiments, the third one-sided adhesive is also bonded to the second side surface.

[0022] In any of the above optional embodiments, the ninth bonding area is also bonded to the second side surface.

[0023] In any of the above optional embodiments, the tenth bonding area is also bonded to the second side surface.

[0024] The above-mentioned arrangement increases the bonding area between the adhesive assembly and the electrode assembly, thereby helping to improve the firmness of the connection between the shell and the electrode assembly; at the same time, it can reduce the pulling of the shell on the electrode assembly, which is helpful to reduce the risk of tearing of the outer ring electrode of the electrode assembly when the electrochemical device is impacted.

[0025] In any of the above optional embodiments, along the second direction, the first non-bonding area covers the projection of the first bonding area, the projection of the second non-bonding area covers the second bonding area, and the projection of the third non-bonding area covers the third bonding area. This arrangement eliminates the need for the bonding assembly to be bonded to both the housing and the electrode assembly on both sides, thereby better cushioning the pull of the housing on the electrode assembly and reducing the risk of tearing of the outer ring electrode sheet of the electrode assembly.

[0026] In any of the above optional embodiments, along the second direction, the projection of the first adhesive area covers the first non-adhesive area. Further, in some embodiments, along the second direction, the projection of the first adhesive area covers the first non-adhesive area, the second adhesive area, and the third adhesive area.

[0027] In any of the above optional embodiments, the adhesive assembly includes a first single-sided adhesive tape, a second double-sided adhesive tape and a third double-sided adhesive tape, the first single-sided adhesive tape includes a first bonding surface and a first non-bonding surface relative to each other, the first bonding surface includes a fourth bonding area, a fifth bonding area and an eleventh bonding area located between the fourth bonding area and the fifth bonding area. The second double-sided adhesive tape includes a ninth bonding surface and a tenth bonding surface relative to each other, the ninth bonding surface is bonded to the fourth bonding area and the second area, and the tenth bonding surface is bonded to the first side wall. The third double-sided adhesive tape includes an eleventh bonding surface and a twelfth bonding surface relative to each other, the eleventh bonding surface is bonded to the fifth bonding area and the third area, and the twelfth bonding surface is bonded to the first side wall. Such an arrangement is conducive to making the first surface of the adhesive assembly bonded to the first side wall of the shell, which is conducive to improving the firmness of the connection between the adhesive assembly and the shell.

[0028] In any of the above optional embodiments, the adhesive assembly includes a first double-sided adhesive tape and a sixth single-sided adhesive tape. The first double-sided adhesive tape includes a seventh adhesive surface and an eighth adhesive surface relative to each other; the seventh adhesive surface is bonded to the first side wall; the eighth adhesive surface includes a second adhesive area, a third adhesive area, and an eighth adhesive area located between the second adhesive area and the third adhesive area. The sixth single-sided adhesive tape includes a sixth adhesive surface and a sixth non-adhesive surface relative to each other; the sixth adhesive surface is bonded to the eighth adhesive area. With this arrangement, while the entire first surface of the adhesive assembly is bonded to the first side wall of the shell, the amount of adhesive can be further reduced, which is beneficial to improving manufacturing efficiency.

[0029] In any of the above optional embodiments, the first single-sided adhesive tape includes a first colloid and a second colloid that are separately arranged, the second double-sided adhesive tape is bonded to the first colloid, and the third double-sided adhesive tape is bonded to the second colloid.

[0030] In any of the above optional embodiments, the second double-sided adhesive tape includes a third colloid and a fourth colloid that are separately arranged, and the third colloid and the fourth colloid are arranged along a third direction, which is perpendicular to the first direction and the second direction.

[0031] In any of the above optional embodiments, the third double-sided adhesive tape includes a fifth colloid and a sixth colloid that are separately arranged, and the fifth colloid and the sixth colloid are arranged along a third direction, which is perpendicular to the first direction and the second direction.

[0032] In any of the above optional embodiments, along the first direction, the width of the electrode assembly is W, along the third direction, the length of the electrode assembly is L, and the third direction is perpendicular to the first direction and the second direction.

[0033] In any of the above optional embodiments, along the first direction, the distance between the center of the first bonding area and the center of the first side surface is D1, and D1 ≤ 0.1 W. This facilitates more uniform pulling of the housing on the electrode assembly and reduces the risk of damage to the outer ring electrode of the electrode assembly.

[0034] In any of the above optional embodiments, along the third direction, the distance between the center of the first bonding area and the center of the first side surface is D2, satisfying: D2 ≤ 0.1L. This facilitates more uniform pulling of the housing on the electrode assembly and reduces the risk of damage to the outer ring electrode of the electrode assembly.

[0035] In any of the above optional embodiments, along the first direction, the width of the first bonding area is S1, which satisfies: 0.1W≤S1≤0.85W. This helps reduce the risk of movement of the electrode assembly.

[0036] In any of the above optional embodiments, along the third direction, the length of the first bonding area is L1, which satisfies: 0.3L≤L1≤0.9L. This helps reduce the risk of movement of the electrode assembly.

[0037] In any of the above optional embodiments, along the first direction, the width of the first non-adhesive area is W1, which satisfies: 0.3W≤W1≤0.85W. This helps to better buffer the pulling of the housing on the electrode assembly and reduce the risk of damage to the outer ring electrode of the electrode assembly.

[0038] In any of the above optional embodiments, along the third direction, the length of the first non-adhesive area is l1, which satisfies: 0.3L≤l1≤0.9L.

[0039] In any of the above optional embodiments, along the first direction, the width of the second bonding area bonded to the second region is H1, and H1 ≥ 0.05 W. This can reduce the risk of electrode assembly movement. In any of the above optional embodiments, H1 ≤ 0.3 W.

[0040] In any of the above optional embodiments, along the first direction, the distance between the second bonding area and the first bonding area is H2, and H2 ≥ 0.05W1. This helps to better cushion the pulling of the housing on the electrode assembly and reduce the risk of damage to the outer ring electrode of the electrode assembly. In any of the above optional embodiments, H2 ≤ 0.4W1.

[0041] In any of the above optional embodiments, along the first direction, the distance between the third bonding area and the first bonding area is H3, satisfying H3 ≥ 0.05W1. This helps to better cushion the pulling of the housing on the electrode assembly and reduce the risk of damage to the outer ring electrode of the electrode assembly. In any of the above optional embodiments, H3 ≤ 0.4W1.

[0042] In any of the above optional embodiments, along the first direction, the width of the bond between the third bonding area and the third region is H4, and H4 ≥ 0.05W. This can reduce the risk of electrode assembly movement. In any of the above optional embodiments, H4 ≤ 0.3W.

[0043] In any of the above optional embodiments, along the third direction, the length of the second bonding area is L2, and L2≥0.4L1. In this way, the risk of movement of the electrode assembly can be reduced.

[0044] In any of the above optional embodiments, along the third direction, the length of the third bonding area is L3, and L3≥0.4L1. In this way, the risk of movement of the electrode assembly can be reduced.

[0045] In a second aspect, the present application provides an electrical device comprising the electrochemical device of any of the above embodiments. During a drop test of the electrochemical device, the risk of electrode assembly movement and electrode sheet tearing is reduced, thereby improving the safety of the electrical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] FIG1 is a schematic structural diagram of an electrochemical device provided in one embodiment of the present application.

[0047] FIG2 is an exploded schematic diagram of the electrochemical device in FIG1 .

[0048] FIG3 is a cross-sectional view of an electrochemical device provided in one embodiment of the present application.

[0049] FIG4 is an exploded schematic diagram of an adhesive assembly provided in one embodiment of the present application.

[0050] FIG5 is an exploded schematic diagram of an adhesive assembly provided in another embodiment of the present application.

[0051] FIG6 is a cross-sectional view of an adhesive assembly and an electrode assembly provided in one embodiment of the present application.

[0052] FIG7 is a cross-sectional view of an adhesive assembly and an electrode assembly provided in another embodiment of the present application.

[0053] FIG8 is a cross-sectional view of an adhesive assembly and an electrode assembly provided in yet another embodiment of the present application.

[0054] FIG9 is a cross-sectional view of an adhesive assembly and an electrode assembly provided in yet another embodiment of the present application.

[0055] FIG10 is a cross-sectional view of an adhesive assembly and an electrode assembly provided in yet another embodiment of the present application.

[0056] FIG11 is a schematic diagram of an exploded view of an adhesive assembly provided in another embodiment of the present application.

[0057] FIG12 is a schematic diagram of a split configuration of a first single-sided adhesive tape provided in an embodiment of the present application.

[0058] FIG13 is a schematic diagram of the separate arrangement of the second single-sided adhesive tape and the third single-sided adhesive tape provided in one embodiment of the present application.

[0059] FIG14 is a top view of the bonding assembly and the electrode assembly provided in one embodiment of the present application.

[0060] FIG15 is a top view of an adhesive assembly and an electrode assembly provided in another embodiment of the present application.

[0061] FIG16 is a schematic diagram of an electrical device provided in an embodiment of the present application.

[0062] DESCRIPTION OF KEY EMBODIMENTS Electrochemical device 100 Housing 10 First sidewall 11 Second sidewall 12 Third sidewall 13 Fourth sidewall 14 Fifth sidewall 15 Sixth sidewall 16 Electrode assembly 20 First side surface 21 First region 211 Second region 212 Third region 213 Second side surface 22 Third side surface 23 Fourth side surface 24 Fifth side surface 25 Sixth side surface 26 Adhesive assembly 30 First surface 31 First adhesive region 311 Second non-adhesive region 312 Third non-adhesive region 313 Second surface 32 First non-adhesive region 321 Second adhesive region 322 Third adhesive region 323 First single-sided adhesive tape 33 First adhesive surface 331 Fourth adhesive region 3311 Fifth adhesive region 3312 Eleventh adhesive region 3313 First non-adhesive surface332 First adhesive 33a Second adhesive 33b Second single-sided tape 34 Second adhesive surface 341 Second non-adhesive surface 342 Third adhesive 34a Fourth adhesive 34b Third single-sided tape 35 Third adhesive surface 351 Third non-adhesive surface 352 Fifth adhesive 35a Sixth adhesive 35b First double-sided tape 36 Seventh adhesive surface 361 Sixth adhesive area 3611 Seventh adhesive area 3612 Eighth adhesive surface 362 Eighth adhesive area 3621 Ninth adhesive area 3622 Tenth adhesive area 3623 Fourth single-sided tape 37 Fourth adhesive surface 371 Fourth non-adhesive surface 372 Fifth single-sided tape 38 Fifth adhesive surface 381 Fifth non-adhesive surface 382 Sixth single-sided tape 39 Sixth adhesive surface 391 Sixth non-adhesive surface 392 Second double-sided tape 41 Ninth adhesive surface 411 Tenth adhesive surface 412 The third double-sided tape 42Eleventh bonding surface 421 Twelfth bonding surface 422 Tab 50 Device body 200 Electrical device 1000 First direction X Second direction Y Third direction Z DETAILED DESCRIPTION

[0063] The technical solutions in the embodiments of the present application will be described below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0064] It should be noted that, in this application, the center of a region refers to the center of gravity of the planar shape of the region when the region is a continuous entity. It is understood that the center of gravity of a planar shape can be determined by the hanging method: suspend the planar shape with a thin wire, draw a straight line vertically from the starting point of the thin wire, suspend the planar shape again with a different endpoint from the first, and draw another straight line using the same method. The intersection of the two straight lines is the center of gravity of the planar shape. When the region is composed of multiple discrete regions, the center of the region is the center of the minimum circumscribed circle containing the multiple discrete regions. It is understood that the minimum circumscribed circle is the circle with the smallest radius that contains the multiple discrete regions.

[0065] It will be understood that when a component is referred to as being "connected to" another component, it may be directly connected to the other component or there may be an intervening component. When a component is referred to as being "disposed on" another component, it may be directly disposed on the other component or there may be an intervening component. The terms "top," "bottom," and similar expressions used herein are for illustrative purposes only.

[0066] The terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implying the quantity, specific order or primary and secondary relationship of the technical features indicated.

[0067] The term "perpendicular" is used to describe an ideal relationship between two components. In actual production or use, two components can be approximately perpendicular to each other. The two components described as "perpendicular" do not necessarily need to be absolutely straight lines or planes; they can be roughly straight lines or planes. From a macroscopic perspective, a component is considered "straight" or "planar" if its overall extension is a straight line or plane.

[0068] It should be understood that the sizes and thicknesses of the components shown in the drawings are for better understanding and more convenient description, and the present application is not limited to the sizes and thicknesses shown in the drawings.

[0069] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0070] The following will describe some embodiments of the present application in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0071] Referring to Figures 1 and 2 , an embodiment of the present application provides an electrochemical device 100, which includes a housing 10, an electrode assembly 20, and an adhesive assembly 30. The electrode assembly 20 is disposed within the housing 10, and the adhesive assembly 30 is disposed within the housing 10, and the adhesive assembly 30 is located between the housing 10 and the electrode assembly 20, and the adhesive assembly 30 adheres the housing 10 and the electrode assembly 20.

[0072] In some embodiments, referring to FIG. 3 , the housing 10 includes a first side wall 11 and a second side wall 12 that are opposite to each other, and the electrode assembly 20 is located between the first side wall 11 and the second side wall 12 .

[0073] In some embodiments, referring to Figures 1 and 3 , the housing 10 further includes a third sidewall 13, a fourth sidewall 14, a fifth sidewall 15, and a sixth sidewall 16. The third sidewall 13 and the fourth sidewall 14 are disposed opposite each other along a first direction X, the first sidewall 11 and the second sidewall 12 are disposed opposite each other along a second direction Y, and the fifth sidewall 15 and the sixth sidewall 16 are disposed opposite each other along a third direction Z. The first direction X is perpendicular to both the second direction Y and the third direction Z. The first sidewall 11, the second sidewall 12, the third sidewall 13, the fourth sidewall 14, the fifth sidewall 15, and the sixth sidewall 16 enclose a space for accommodating the electrode assembly 20.

[0074] In some embodiments, the housing 10 is an aluminum-plastic film, but the housing 10 is not limited to the aluminum-plastic film.

[0075] In some embodiments, the electrode assembly 20 includes a positive electrode sheet, a negative electrode sheet and a separator. The positive electrode sheet, the negative electrode sheet and the separator can be stacked to form a laminated structure, or the positive electrode sheet, the negative electrode sheet and the separator can be stacked and wound to form a wound structure.

[0076] In some embodiments, the positive electrode sheet includes a positive electrode current collector and a positive electrode active material layer disposed on the positive electrode current collector; the negative electrode sheet includes a negative electrode current collector and a negative electrode active material layer disposed on the negative electrode current collector.

[0077] In some embodiments, a portion of the positive electrode collector is provided with a positive electrode active material layer, and a portion of the positive electrode collector is not provided with a positive electrode active material layer; a portion of the negative electrode collector is provided with a negative electrode active material layer, and a portion of the negative electrode collector is not provided with a negative electrode active material layer.

[0078] Among them, the positive electrode current collector and the negative electrode current collector can be a metal layer. As an illustrative example, the positive electrode current collector can be a metal layer including at least one of aluminum, nickel, tantalum, and titanium, such as aluminum foil. The positive electrode active material layer includes a positive electrode active material, and the positive electrode active material can include at least one of lithium cobalt oxide, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide, lithium iron phosphate, lithium manganese iron phosphate, or lithium manganese oxide. The negative electrode current collector can be a metal layer including at least one of copper, nickel, tantalum, and titanium, such as copper foil. The negative electrode active material layer includes a negative electrode active material, and the negative electrode active material can include at least one of graphite, hard carbon, soft carbon, silicon, silicon-oxygen material, and silicon-carbon material.

[0079] In some embodiments, the outermost ring of the electrode assembly 20 has a positive electrode current collector layer without a positive electrode active material layer, and the positive electrode current collector is aluminum foil.

[0080] In some embodiments, referring to FIG. 3 , the electrode assembly 20 includes a first side surface 21 adjacent to the first side wall 11 , the first side surface 21 includes a first region 211 , a second region 212 , and a third region 213 , and along the first direction X, the first region 211 is located between the second region 212 and the third region 213 .

[0081] In some embodiments, referring to FIG. 3 , the electrode assembly 20 further includes a second side surface 22, a third side surface 23, and a fourth side surface 24. The first side surface 21 and the second side surface 22 are disposed opposite each other along the second direction Y. The first side surface 21 is adjacent to the first sidewall 11 relative to the second side surface 22. The first side surface 21 is also disposed opposite the first sidewall 11, and the second side surface 22 faces away from the first sidewall 11. The third side surface 23 and the fourth side surface 24 are disposed opposite each other along the first direction X. When the electrode assembly 20 is in a wound structure, the third side surface 23 and the fourth side surface 24 are arcuate side surfaces.

[0082] In some embodiments, referring to FIG. 2 , the electrode assembly 20 further includes a fifth side surface 25 and a sixth side surface 26 , and the fifth side surface 25 and the sixth side surface 26 are disposed opposite to each other along the third direction Z.

[0083] In some embodiments, referring to Figures 1 and 2 , the electrochemical device 100 further includes a tab 50 , which is connected to the electrode assembly 20 . The tab 50 extends out of the housing 10 along the third direction Z, from the fifth side surface 25 or the sixth side surface 26 of the electrode assembly 20 , to direct the polarity of the electrode assembly 20 . When the tab 50 is connected to the positive electrode tab of the electrode assembly 20 , it is a positive electrode tab 50 ; when the tab 50 is connected to the negative electrode tab of the electrode assembly 20 , it is a negative electrode tab 50 . The tab 50 can be made of copper or aluminum, without specific limitation herein.

[0084] In some embodiments, referring to FIG. 3 , the adhesive assembly 30 includes a first surface 31 and a second surface 32 disposed opposite each other. The first surface 31 is adjacent to the housing 10, while the second surface 32 faces away from the housing 10. The first surface 31 includes a first adhesive region 311 bonded to the first sidewall 11. The second surface 32 includes a second adhesive region 322 bonded to the second region 212, a third adhesive region 323 bonded to the third region 213, and a first non-adhesive region 321 located between the second adhesive region 322 and the third adhesive region 323. Along the second direction Y, the projection of the first adhesive region 311 overlaps with the first non-adhesive region 321. The second direction Y is the direction in which the first sidewall 11 faces the first side surface 21.

[0085] The present application sets an adhesive component 30 between the electrode assembly 20 and the shell 10, cancels the bonding between the adhesive component 30 and the first area 211, and bonds the electrode assembly 20 to the adhesive component 30 through the second area 212 and the third area 213. While suppressing the electrode assembly 20 from moving when the electrochemical device 100 is impacted, the pulling force of the shell 10 can be buffered through the first non-bonding area 321 and then transmitted to the electrode assembly 20 through the second bonding area 322 and the third bonding area 323, thereby helping to reduce the risk of the outer ring electrode of the electrode assembly 20 being torn when the electrochemical device 100 is impacted.

[0086] In some embodiments, referring to FIG. 3 , the first surface 31 further includes a second non-adhesive region 312 and a third non-adhesive region 313. Along the first direction X, the first adhesive region 311 is located between the second non-adhesive region 312 and the third non-adhesive region 313. Along the second direction Y, the projection of the second non-adhesive region 312 overlaps with the second adhesive region 322, and the projection of the third non-adhesive region 313 overlaps with the third adhesive region 323. This arrangement allows the electrochemical device 100 to better buffer the pulling force transmitted by the housing 10 when impacted, reducing the pulling force of the adhesive assembly 30 on the second region 212 and the third region 213 of the electrode assembly 20, thereby reducing the risk of tearing of the outer electrode sheet of the electrode assembly 20.

[0087] In some embodiments, along the second direction Y, the first non-bonding area 321 covers the projection of the first bonding area 311, the projection of the second non-bonding area 312 covers the second bonding area 322, and the projection of the third non-bonding area 313 covers the third bonding area 323. This arrangement prevents the adhesive assembly 30 from being partially bonded to both the housing 10 and the electrode assembly 20 on both sides, which helps to better cushion the pulling of the housing 10 on the electrode assembly 20, thereby reducing the risk of tearing of the outer electrode sheets of the electrode assembly 20.

[0088] In some embodiments, referring to Figures 3 and 4 , the adhesive assembly 30 includes a first single-sided adhesive tape 33, a second single-sided adhesive tape 34, and a third single-sided adhesive tape 35. The first single-sided adhesive tape 33 includes a first adhesive surface 331 and a first non-adhesive surface 332. The first adhesive surface 331 includes a fourth adhesive area 3311, a fifth adhesive area 3312, and a first adhesive area 311 located between the fourth adhesive area 3311 and the fifth adhesive area 3312. The second single-sided adhesive tape 34 includes a second adhesive surface 341 and a second non-adhesive surface 342. The second adhesive surface 341 is bonded to the fourth adhesive area 3311 and the second area 212. The third single-sided adhesive tape 35 includes a third adhesive surface 351 and a third non-adhesive surface 352. The third adhesive surface 351 is bonded to the fifth adhesive area 3312 and the third area 213.

[0089] It can be understood that the first non-adhesive surface 332 of the first one-sided adhesive tape 33 forms a first non-adhesive area 321 ; the second non-adhesive surface of the second one-sided adhesive tape 34 forms a second non-adhesive area 312 ; and the third non-adhesive surface 352 of the third one-sided adhesive tape 35 forms a third non-adhesive area 313 . By bonding the first single-sided adhesive 33, the second single-sided adhesive 34 and the third single-sided adhesive 35 to each other, the adhesive assembly 30 can form a first bonding area 311, a second bonding area 322, a third bonding area 323, a first non-bonding area 321, a second non-bonding area 312 and a third non-bonding area 313, which has the advantages of simple operation, high efficiency and low cost; at the same time, the bonding section of the second single-sided adhesive 34 and the fourth bonding area 3311 in the first single-sided adhesive 33, and the bonding section of the third single-sided adhesive 35 and the fifth bonding area 3312 in the first single-sided adhesive 33 can further buffer the pulling force of the shell 10 through deformation, thereby further reducing the risk of tearing of the outer ring electrode of the electrode assembly 20.

[0090] In some embodiments, referring to Figures 3 and 4 , along the second direction Y, the projection of the second non-adhesive region 312 overlaps with the first non-adhesive region 321, and the projection of the third non-adhesive region 313 overlaps with the first non-adhesive region 321. The overlapping areas of the second non-adhesive region 312 and the first non-adhesive region 321, as well as the overlapping areas of the third non-adhesive region 313 and the first non-adhesive region 321, represent the areas of the adhesive component 30 where both sides are non-adhesive. With this arrangement, the tensile force of the housing 10 can be dissipated during transmission to the electrode assembly 20 through the deformation of these areas where both sides are non-adhesive. This reduces the tensile force transmitted by the adhesive component 30 to the second and third areas 212, 213, thereby reducing the risk of tearing of the outer electrode plates of the electrode assembly 20.

[0091] In some embodiments, referring to Figures 3 and 5, the adhesive assembly 30 includes a first double-sided adhesive tape 36, a fourth single-sided adhesive tape 37, a fifth single-sided adhesive tape 38, and a sixth single-sided adhesive tape 39. The first double-sided adhesive tape 36 includes a seventh adhesive surface 361 and an eighth adhesive surface 362 that are opposed to each other. The seventh adhesive surface 361 includes a sixth adhesive area 3611, a seventh adhesive area 3612, and a first adhesive area 311 located between the sixth adhesive area 3611 and the seventh adhesive area 3612. The eighth adhesive surface 362 includes a second adhesive area 322, a third adhesive area 323, and an eighth adhesive area 3621 located between the second adhesive area 322 and the third adhesive area 323. The fourth single-sided adhesive tape 37 includes a fourth adhesive surface 371 and a fourth non-adhesive surface 372 that are opposed to each other. The fourth adhesive surface 371 is bonded to the sixth adhesive area 3611. The fifth single-sided adhesive tape 38 includes a fifth adhesive surface 381 and a fifth non-adhesive surface 382. The fifth adhesive surface 381 is bonded to the seventh adhesive region 3612. The sixth single-sided adhesive tape 39 includes a sixth adhesive surface 391 and a sixth non-adhesive surface 392. The sixth adhesive surface 391 is bonded to the eighth adhesive region 3621.

[0092] It can be understood that by providing the first double-sided tape 36 and the fourth single-sided tape 37, the fifth single-sided tape 38, and the sixth single-sided tape 39 bonded to the first double-sided tape 36, the adhesive assembly 30 can be formed into a first adhesive area 311, a second adhesive area 322, a third adhesive area 323, a first non-adhesive area 321, a second non-adhesive area 312, and a third non-adhesive area 313, so that the production method of forming the adhesive area and the non-adhesive area has the advantages of simple operation, high efficiency, and low cost. In addition, by adjusting the size and position of the fourth single-sided tape 37, the fifth single-sided tape 38, and the sixth single-sided tape 39, the relative sizes of each adhesive area and the non-adhesive area can be conveniently controlled, thereby conveniently adjusting the firmness of the bond between the shell 10 and the electrode assembly 20 and the cushioning property of the adhesive assembly 30.

[0093] In some embodiments, referring to FIG. 5 , along the second direction Y, the projection of the fourth single-sided adhesive tape 37 overlaps with the sixth single-sided adhesive tape 39 , and the projection of the fifth single-sided adhesive tape 38 overlaps with the sixth single-sided adhesive tape 39 . The area where the projection of the fourth single-sided adhesive tape 37 overlaps with the sixth single-sided adhesive tape 39 and the area where the fifth single-sided adhesive tape 38 overlaps with the sixth single-sided adhesive tape 39 are local areas of the adhesive component 30 where both sides are not adhesive. With this arrangement, the pulling force of the housing 10 can be dissipated during the process of being transmitted to the electrode assembly 20 through the deformation of the local areas where both sides are not adhesive, thereby reducing the pulling force transmitted by the adhesive component 30 to the second area 212 and the third area 213, thereby helping to reduce the risk of tearing of the outer ring electrode sheet of the electrode assembly 20.

[0094] In other embodiments, along the second direction Y, the projection of the fourth single-sided tape 37 does not overlap with the sixth single-sided tape 39, and the projection of the fifth single-sided tape 38 does not overlap with the sixth single-sided tape 39. In this way, the adhesive assembly 30 may have a double-sided adhesive portion, for example, along the second direction Y, the projection of the fourth single-sided tape 37 or the projection of the fifth single-sided tape 38 is separated from the sixth single-sided tape 39; or it may not have a double-sided adhesive portion, for example, along the second direction Y, the projection of the fourth single-sided tape 37 or the projection of the fifth single-sided tape 38 is respectively in contact with the sixth single-sided tape 39.

[0095] In some embodiments, as shown in Figure 6 , the second adhesive surface 341 of the second single-sided adhesive tape 34 is bonded to both the second region 212 and the third side surface 23. This configuration enables the adhesive assembly 30 to transfer the pulling force of the housing 10 to the third side surface 23 of the electrode assembly 20, thereby reducing the risk of tearing of the outer electrode sheet of the electrode assembly 20.

[0096] In some embodiments, as shown in Figure 6 , the third adhesive surface 351 of the third single-sided adhesive tape 35 is bonded to both the third region 213 and the fourth side surface 24. This configuration enables the adhesive assembly 30 to transfer the pulling force of the housing 10 to the fourth side surface 24 of the electrode assembly 20, thereby reducing the risk of tearing of the outer electrode sheet of the electrode assembly 20.

[0097] In an embodiment where the second bonding surface 341 is bonded to both the second region 212 and the third side 23, and the third bonding surface 351 is bonded to both the third region 213 and the fourth side 24, the bonding component 30 is able to transfer the pulling force of the shell 10 to both sides of the electrode assembly 20 in the first direction X, which is beneficial to improving the uniformity of the force applied to the electrode assembly 20.

[0098] In some embodiments, referring to FIG7 , the eighth bonding surface 362 further includes a ninth bonding area 3622. The second bonding area 322 is located between the ninth bonding area 3622 and the eighth bonding area 3621. The ninth bonding area 3622 is bonded to the third side surface 23. This configuration enables the bonding assembly 30 to transfer the pulling force of the housing 10 to the third side surface 23 of the electrode assembly 20, thereby reducing the risk of tearing of the outer electrode sheet of the electrode assembly 20.

[0099] In some embodiments, referring to FIG7 , the eighth bonding surface 362 further includes a tenth bonding area 3623. The third bonding area 323 is located between the tenth bonding area 3623 and the eighth bonding area 3621. The tenth bonding area 3623 is bonded to the fourth side surface 24. This arrangement enables the bonding assembly 30 to transfer the pulling force of the housing 10 to the fourth side surface 24 of the electrode assembly 20, thereby reducing the risk of tearing of the outer electrode sheet of the electrode assembly 20.

[0100] In some embodiments, referring to FIG8 , the second bonding surface 341 of the second single-sided adhesive 34 is also bonded to the second side surface 22 . This arrangement increases the bonding area between the adhesive assembly 30 and the electrode assembly 20 , thereby facilitating the improvement of the firmness of the connection between the shell 10 and the electrode assembly 20 . At the same time, it can reduce the pulling of the shell 10 on the electrode assembly 20 , thereby reducing the risk of tearing of the outer ring electrode of the electrode assembly 20 .

[0101] In some embodiments, referring to FIG8 , the third bonding surface 351 of the third single-sided adhesive 35 is also bonded to the second side surface 22 . This arrangement increases the bonding area between the bonding assembly 30 and the electrode assembly 20 , thereby facilitating the improvement of the firmness of the connection between the shell 10 and the electrode assembly 20 . At the same time, it can reduce the pulling of the shell 10 on the electrode assembly 20 , thereby reducing the risk of tearing of the outer ring electrode of the electrode assembly 20 .

[0102] In some embodiments, referring to FIG9 , the ninth bonding area 3622 is also bonded to the second side surface 22 , thereby increasing the bonding area between the bonding component 30 and the electrode component 20 , thereby facilitating improvement of the firmness of the connection between the shell 10 and the electrode component 20 ; at the same time, it can reduce the pulling of the shell 10 on the electrode component 20 , thereby reducing the risk of tearing of the outer ring electrode of the electrode component 20 .

[0103] In some embodiments, referring to FIG9 , the tenth bonding area 3623 is also bonded to the second side surface 22 , thereby increasing the bonding area between the bonding component 30 and the electrode component 20 , thereby facilitating improvement of the firmness of the connection between the shell 10 and the electrode component 20 ; at the same time, it can reduce the pulling of the shell 10 on the electrode component 20 , thereby reducing the risk of tearing of the outer ring electrode of the electrode component 20 .

[0104] In some embodiments, referring to FIG10 , along the second direction Y, the projection of the first adhesive region 311 covers the first non-adhesive region 321. This configuration helps increase the area of ​​the first adhesive region 311, thereby improving the secure connection between the adhesive assembly 30 and the housing 10. Furthermore, referring to FIG10 , along the second direction Y, the projection of the first adhesive region 311 covers the first non-adhesive region 321, the second adhesive region 322, and the third adhesive region 323.

[0105] In some embodiments, referring to FIG. 11 , the adhesive assembly 30 includes a first single-sided adhesive tape 33, a second double-sided adhesive tape 41, and a third double-sided adhesive tape 42. The first single-sided adhesive tape 33 includes a first adhesive surface 331 and a first non-adhesive surface 332 that are opposite to each other. The first adhesive surface 331 includes a fourth adhesive area 3311, a fifth adhesive area 3312, and an eleventh adhesive area 3313 located between the fourth adhesive area 3311 and the fifth adhesive area 3312. The second double-sided adhesive tape 41 includes a ninth adhesive surface 411 and a tenth adhesive surface 412 that are opposite to each other. The ninth adhesive surface 411 is bonded to the fourth adhesive area 3311 and the second area 212, and the tenth adhesive surface 412 is bonded to the first sidewall 11. The third double-sided tape 42 includes an eleventh bonding surface 421 and a twelfth bonding surface 422 opposite to each other. The eleventh bonding surface 421 is bonded to the fifth bonding area 3312 and the third region 213 , and the twelfth bonding surface 422 is bonded to the first side wall 11 .

[0106] It can be understood that the eleventh bonding area 3313, the tenth bonding surface 412, and the twelfth bonding surface 422 together form the first bonding area 311. This arrangement facilitates the entire first surface 31 of the adhesive assembly 30 to be bonded to the first sidewall 11 of the housing 10, thereby enhancing the secure connection between the adhesive assembly 30 and the housing 10.

[0107] In some embodiments, referring to FIG. 10 , the adhesive assembly 30 includes a first double-sided adhesive tape 36 and a sixth single-sided adhesive tape 39. The first double-sided adhesive tape 36 includes a seventh adhesive surface 361 and an eighth adhesive surface 362, with the seventh adhesive surface 361 being bonded to the first sidewall 11. The eighth adhesive surface 362 includes a second adhesive region 322, a third adhesive region 323, and an eighth adhesive region 3621 located between the second adhesive region 322 and the third adhesive region 323. The sixth single-sided adhesive tape 39 includes a sixth adhesive surface 391 and a sixth non-adhesive surface 392, with the sixth adhesive surface 391 being bonded to the eighth adhesive region 3621. This configuration allows the entire first surface 31 of the adhesive assembly 30 to be bonded to the first sidewall 11 of the housing 10 while further reducing the amount of adhesive, thereby improving manufacturing efficiency.

[0108] In some embodiments, referring to FIG. 12 , the first one-sided adhesive tape 33 includes a first colloid 33 a and a second colloid 33 b that are separately provided. The second one-sided adhesive tape 34 is bonded to the first colloid 33 a , and the third one-sided adhesive tape 35 is bonded to the second colloid 33 b .

[0109] It can be understood that the two opposite surfaces of the first colloid 33 a and the two opposite surfaces of the second colloid 33 b together form a first adhesive surface 331 and a first non-adhesive surface 332 .

[0110] In some embodiments, the first colloid 33 a and the second colloid 33 b are arranged along a first direction X; in another embodiment, the first colloid 33 a and the second colloid 33 b are arranged along a third direction Z.

[0111] In some embodiments, referring to FIG. 13 , the second single-sided adhesive tape 34 includes a third adhesive 34 a and a fourth adhesive 34 b that are separately provided. The third adhesive 34 a and the fourth adhesive 34 b are arranged along a third direction Z.

[0112] It can be understood that the two opposite surfaces of the third colloid 34 a and the two opposite surfaces of the fourth colloid 34 b jointly form the second adhesive surface 341 and the second non-adhesive surface 342 .

[0113] In other embodiments, the second single-sided adhesive tape 34 may further include more separately arranged adhesives, which will not be described in detail here.

[0114] In some embodiments, referring to FIG. 13 , the third single-sided adhesive tape 35 includes a fifth adhesive 35 a and a sixth adhesive 35 b that are separately provided. The fifth adhesive 35 a and the sixth adhesive 35 b are arranged along the third direction Z.

[0115] It can be understood that the two opposite surfaces of the fifth colloid 35 a and the two opposite surfaces of the sixth colloid 35 b jointly form a third adhesive surface 351 and a third non-adhesive surface 352 .

[0116] In other embodiments, the third single-sided adhesive tape 35 may further include more separately arranged adhesives, which will not be described in detail here.

[0117] In some embodiments, referring to FIG14 , along the first direction X, the width of the electrode assembly 20 is W, along the third direction Z, the length of the electrode assembly 20 is L, and along the first direction X, the distance between the center of the first bonding area 311 and the center of the first side surface 21 is D1, satisfying: D1≤0.1W. This is conducive to making the force on the electrode assembly 20 more uniform and reducing the risk of damage to the outer ring electrode of the electrode assembly 20.

[0118] In some embodiments, referring to FIG. 14 , along the third direction Z, the distance D2 between the center of the first bonding area 311 and the center of the first side surface 21 satisfies the following condition: D2 ≤ 0.1 L. This helps to make the force applied to the electrode assembly 20 more uniform and reduces the risk of damage to the outer electrode sheet of the electrode assembly 20.

[0119] 15 , in some embodiments, along the first direction X, the width of the first bonding area 311 is S1, which satisfies: 0.1W≤S1≤0.85W. This helps reduce the risk of movement of the electrode assembly 20.

[0120] 15 , in some embodiments, along the third direction Z, the length of the first bonding area 311 is L1, which satisfies: 0.3L≤L1≤0.9L. This helps reduce the risk of movement of the electrode assembly 20.

[0121] In some embodiments, referring to FIG. 15 , along the first direction X, the width of the first non-bonding area 321 is W1, satisfying: 0.3W≤W1≤0.85W. This helps to better buffer the pulling of the shell 10 on the electrode assembly 20 and reduce the risk of damage to the outer ring electrode of the electrode assembly 20.

[0122] In some embodiments, referring to FIG. 15 , along the third direction Z, the length of the first non-adhesive region 321 is l1, satisfying: 0.3L≤l1≤0.9L.

[0123] In some embodiments, referring to FIG. 15 , along the first direction X, the width of the second bonding area 322 bonded to the second region 212 is H1, satisfying H1 ≥ 0.05 W. This reduces the risk of movement of the electrode assembly 20. In some embodiments, H1 ≤ 0.3 W.

[0124] In some embodiments, referring to Figure 15 , along the first direction X, the distance between the second bonding area 322 and the first bonding area 311 is H2, satisfying H2 ≥ 0.05W1. This helps to better cushion the pulling of the housing 10 on the electrode assembly 20, reducing the risk of damage to the outer electrode sheet of the electrode assembly 20. In some embodiments, H2 ≤ 0.4W1.

[0125] In some embodiments, referring to Figure 15 , along the first direction X, the distance between the third bonding area 323 and the first bonding area 311 is H3, satisfying H3 ≥ 0.05W1. This helps to better cushion the pulling of the housing 10 on the electrode assembly 20, reducing the risk of damage to the outer electrode sheet of the electrode assembly 20. In some embodiments, H3 ≤ 0.4W1.

[0126] In some embodiments, referring to FIG. 15 , along the first direction X, the width of the bond between the third bonding area 323 and the third region 213 is H4, satisfying H4 ≥ 0.05 W. This reduces the risk of movement of the electrode assembly 20. In some embodiments, H4 ≤ 0.3 W.

[0127] 15 , along the third direction Z, the length of the second bonding area 322 is L2, satisfying L2 ≥ 0.4L1. This can reduce the risk of the electrode assembly 20 moving.

[0128] 15 , along the third direction Z, the length of the third bonding area 323 is L3, satisfying L3 ≥ 0.4L1. This can reduce the risk of movement of the electrode assembly 20.

[0129] To verify the effects of the adhesive and non-adhesive regions of the adhesive assembly 30 on the electrochemical device 100, the following tests were conducted using a lithium-ion soft-pack battery as an example:

[0130] A lithium-ion soft-pack battery with a rectangular maximum projection surface is selected, wherein the wound electrode assembly 20 inside the lithium-ion soft-pack battery has a length L of 87 mm, a width W of 64 mm, and a thickness of 4.8 mm.

[0131] In Examples 1-21, the adhesive assembly 30 includes a first single-sided adhesive tape 33, a second single-sided adhesive tape 34, and a third single-sided adhesive tape 35. The center of the first single-sided adhesive tape 33 coincides with the center of the first side surface of the electrode assembly 20. The dimensional parameters of the adhesive assembly 30 are shown in Table 1 below. Specifically, in Example 7, the second single-sided adhesive tape 34 and the third single-sided adhesive tape 35 are respectively bonded to the third side surface 23 and the fourth side surface 24 of the electrode assembly 20. In Examples 8-12, the second single-sided adhesive tape 34 and the third single-sided adhesive tape 35 are further bonded to the second side surface 22 of the electrode assembly 20.

[0132] In Example 22, the difference from Example 1 is that the adhesive assembly 30 includes a first double-sided tape 36 and a sixth single-sided tape 39. The first double-sided tape 36 has a length of 50 mm and a width of 52 mm, and the sixth single-sided tape 39 has a length of 50 mm and a width of 42 mm.

[0133] In the comparative example, a first double-sided tape 36 with a length of 50 mm and a width of 42 mm is used to bond the electrode assembly 20 to the housing 10 made of an aluminum-plastic film.

[0134] Each group took 20 batteries to conduct a drop pass rate comparison experiment. The batteries were set to be tested in the order of six sides and four corners, and the drop height was 1.8m. After the drop was completed, the shell 10 was observed to see if it was broken or leaking, and the number of batteries with broken or leaking shells 10 was counted; if the shell 10 was not broken or leaking, the lithium-ion soft-pack battery was disassembled to observe whether the outer ring of the electrode assembly 20 was torn or damaged, and the number of batteries with torn or damaged outer ring pole pieces was counted.

[0135] If the 10 is not broken or leaking, and the outer ring electrode is not torn or damaged, it is considered to have passed the test; otherwise, it is considered to have failed the test. Pass rate = number of passes / 20 × 100%.

[0136] Table 1: Test results of the dimensions of the first one-sided adhesive tape 33, the second one-sided adhesive tape 34, and the third one-sided adhesive tape 35 and the structural changes of the adhesive assembly 30

[0137] As can be seen from the comparison of the embodiment and the comparative example in Table 1, the adhesive assembly 30 of the embodiment of the present application eliminates the bonding with the first region 211 and bonds the electrode assembly 20 to the adhesive assembly 30 via the second region 212 and the third region 213. While suppressing the movement of the electrode assembly 20 during a battery drop, it can buffer the pulling force of the housing 10 through the first non-bonding region 321 and then transmit it to the electrode assembly 20 through the second bonding region 322 and the third bonding region 323. This helps reduce the risk of tearing the outer electrode sheet of the electrode assembly 20 during a battery drop, thereby significantly improving the drop test pass rate and enhancing the safety of the battery. Furthermore, a comparison of Example 1 with Example 22 shows that the bonding sections of the second single-sided adhesive 34 and the first single-sided adhesive 33, and the bonding sections of the third single-sided adhesive 35 and the first single-sided adhesive 33, can further buffer the pulling force of the housing 10 through deformation, thereby further reducing the risk of tearing the outer electrode sheet of the electrode assembly 20.

[0138] Please refer to FIG. 16 . An embodiment of the present application further provides an electrical device 1000 . The electrical device 1000 includes the electrochemical device 100 described above.

[0139] In some embodiments, referring to FIG. 16 , the power-consuming device 1000 further includes a device body 200 , and the electrochemical device 100 is installed in the device body 200 to supply power to the device body 200 .

[0140] In some embodiments, the power-consuming device 1000 may be a Bluetooth headset, a Bluetooth speaker, a mobile phone, a laptop computer, a tablet computer, an e-book player, an electric toy, a game console, a video recorder, a portable recorder, a radio, a smart watch, a lighting lamp, or a calculator, etc., which are not listed here one by one.

[0141] Since the electrical equipment 1000 adopts the technical solution of any embodiment of the electrochemical device 100, it at least has the beneficial effects brought by the technical solution of any embodiment of the electrochemical device 100, which will not be described in detail here.

[0142] In addition, those skilled in the art should recognize that the above embodiments are merely intended to illustrate the present application and are not intended to limit the present application. As long as they are within the substantive scope of the present application, appropriate changes and modifications to the above embodiments are within the scope disclosed in the present application.

Claims

1. An electrochemical device, characterized in that, it includes: a housing, the housing including a first side wall; an electrode assembly, the electrode assembly being disposed within the housing, the electrode assembly including a first side adjacent to the first side wall, the first side including a first region, a second region, and a third region, along a first direction, the first region being located between the second region and the third region; an adhesive assembly, the adhesive assembly being located between the housing and the electrode assembly, the adhesive assembly including opposite first and second faces, the first face being adjacent to the housing, the second face facing away from the housing; the first face including a first adhesive region adhesively bonded to the first side wall; the second face including a second adhesive region adhesively bonded to the second region, a third adhesive region adhesively bonded to the third region, and a first non - adhesive region located between the second adhesive region and the third adhesive region; along a second direction, a projection of the first adhesive region overlaps with the first non - adhesive region, the second direction being the direction in which the first side wall faces the first side.

2. The electrochemical device according to claim 1, characterized in that, the first face further includes a second non - adhesive region and a third non - adhesive region, along the first direction, the first adhesive region being located between the second non - adhesive region and the third non - adhesive region; along the second direction, a projection of the second non - adhesive region overlaps with the second adhesive region, and a projection of the third non - adhesive region overlaps with the third adhesive region.

3. The electrochemical device according to claim 2, characterized in that, the electrochemical device satisfies any one of the following conditions: (1) The adhesive assembly includes a first single - sided adhesive, a second single - sided adhesive, and a third single - sided adhesive, the first single - sided adhesive including opposite first adhesive and first non - adhesive faces, the first adhesive face including a fourth adhesive region, a fifth adhesive region, and the first adhesive region located between the fourth adhesive region and the fifth adhesive region; the second single - sided adhesive includes opposite second adhesive and second non - adhesive faces, the second adhesive face being adhesively bonded to the fourth adhesive region and the second region; the third single - sided adhesive includes opposite third adhesive and third non - adhesive faces, the third adhesive face being adhesively bonded to the fifth adhesive region and the third region; (2) The adhesive assembly includes a first double - sided adhesive, a fourth single - sided adhesive, a fifth single - sided adhesive, and a sixth single - sided adhesive; the first double - sided adhesive includes opposite seventh and eighth adhesive faces; the seventh adhesive face includes a sixth adhesive region, a seventh adhesive region, and the first adhesive region located between the sixth adhesive region and the seventh adhesive region; the eighth adhesive face includes the second adhesive region, the third adhesive region, and an eighth adhesive region located between the second adhesive region and the third adhesive region; the fourth single - sided adhesive includes opposite fourth adhesive and fourth non - adhesive faces, the fourth adhesive face being adhesively bonded to the sixth adhesive region; the fifth single - sided adhesive includes opposite fifth adhesive and fifth non - adhesive faces, the fifth adhesive face being adhesively bonded to the seventh adhesive region; The sixth single-sided adhesive includes a sixth adhesive surface and a sixth non-adhesive surface that are opposite to each other, and the sixth adhesive surface is adhered to the eighth adhesive area.

4. The electrochemical device according to claim 3, wherein, the adhesive assembly satisfies at least one of the following conditions: (1) The first single-sided adhesive includes a first colloid and a second colloid that are separately arranged, the second single-sided adhesive is adhered to the first colloid, and the third single-sided adhesive is adhered to the second colloid; (2) The second single-sided adhesive includes a third colloid and a fourth colloid that are separately arranged, the third colloid and the fourth colloid are arranged along a third direction, and the third direction is perpendicular to each of the first direction and the second direction; (3) The third single-sided adhesive includes a fifth colloid and a sixth colloid that are separately arranged, the fifth colloid and the sixth colloid are arranged along a third direction, and the third direction is perpendicular to each of the first direction and the second direction.

5. The electrochemical device according to claim 3, wherein, the electrode assembly further includes a second side surface, a third side surface, and a fourth side surface, the second side surface is oppositely arranged with the first side surface along the second direction, the third side surface is oppositely arranged with the fourth side surface along the first direction, and satisfies at least one of the following conditions: (1) The second single-sided adhesive is adhered to both the second area and the third side surface; (2) The third single-sided adhesive is adhered to both the third area and the fourth side surface; (3) The eighth adhesive surface further includes a ninth adhesive area, the second adhesive area is located between the ninth adhesive area and the eighth adhesive area, and the ninth adhesive area is adhered to the third side surface; (4) The eighth adhesive surface further includes a tenth adhesive area, the third adhesive area is located between the tenth adhesive area and the eighth adhesive area, and the tenth adhesive area is adhered to the fourth side surface.

6. The electrochemical device according to claim 5, wherein, it satisfies at least one of the following conditions: (1) The second single-sided adhesive is further adhered to the second side surface; (2) The third single-sided adhesive is further adhered to the second side surface; (3) The ninth adhesive area is further adhered to the second side surface; (4) The tenth adhesive area is further adhered to the second side surface.

7. The electrochemical device according to claim 2, wherein, along the second direction, the first non-adhesive area covers the projection of the first adhesive area, the projection of the second non-adhesive area covers the second adhesive area, and the projection of the third non-adhesive area covers the third adhesive area.

8. The electrochemical device according to claim 1, wherein, along the second direction, the projection of the first adhesive area covers the first non-adhesive area.

9. The electrochemical device according to claim 8, wherein, the electrochemical device satisfies any one of the following conditions: (1) The bonding assembly includes a first single-sided adhesive tape, a second double-sided adhesive tape, and a third double-sided adhesive tape. The first single-sided adhesive tape includes an opposite first bonding surface and a first non-bonding surface. The first bonding surface includes a fourth bonding region, a fifth bonding region, and an eleventh bonding region located between the fourth bonding region and the fifth bonding region; The second double-sided adhesive tape includes an opposite ninth bonding surface and a tenth bonding surface. The ninth bonding surface is bonded to the fourth bonding region and the second region; The third double-sided adhesive tape includes an opposite eleventh bonding surface and a twelfth bonding surface. The eleventh bonding surface is bonded to the fifth bonding region and the third region; (2) The bonding assembly includes a first double-sided adhesive tape and a sixth single-sided adhesive tape; The first double-sided adhesive tape includes an opposite seventh bonding surface and an eighth bonding surface; The seventh bonding surface is bonded to the first side wall; the eighth bonding surface includes the second bonding region, the third bonding region, and an eighth bonding region located between the second bonding region and the third bonding region; The sixth single-sided adhesive tape includes an opposite sixth bonding surface and a sixth non-bonding surface. The sixth bonding surface is bonded to the eighth bonding region.

10. The electrochemical device according to claim 9, wherein, the bonding assembly satisfies at least one of the following conditions: (1) The first single-sided adhesive tape includes a first colloid and a second colloid arranged separately. The second double-sided adhesive tape is bonded to the first colloid, and the third double-sided adhesive tape is bonded to the second colloid; (2) The second double-sided adhesive tape includes a third colloid and a fourth colloid arranged separately. The third colloid and the fourth colloid are arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction in pairs; (3) The third double-sided adhesive tape includes a fifth colloid and a sixth colloid arranged separately. The fifth colloid and the sixth colloid are arranged along a third direction, and the third direction is perpendicular to the first direction and the second direction in pairs.

11. The electrochemical device according to any one of claims 1 to 10, wherein, along the first direction, the width of the electrode assembly is W, and along the third direction, the length of the electrode assembly is L. The third direction is perpendicular to the first direction and the second direction in pairs; satisfies at least one of the following conditions: (1) Along the first direction, the distance between the center of the first bonding area and the center of the first side is D 1 , satisfying: D 1 ≤0.1W; (2) Along the third direction, the distance between the center of the first bonding area and the center of the first side is D 2 , satisfying: D 2 ≤0.1L; (3) Along the first direction, the width of the first bonding area is S 1 , satisfying: 0.1W ≤ S 1 ≤ 0.85W; (4) Along the third direction, the length of the first bonding area is L 1 , satisfying: 0.3L ≤ L 1 ≤ 0.9L; (5) Along the first direction, the width of the first non-bonding area is W 1 , satisfying: 0.3W ≤ W 1 ≤ 0.85W; (6) Along the third direction, the length of the first non-bonding area is l 1 , satisfying: 0.3L ≤ l 1 ≤ 0.9L.

12. The electrochemical device according to claim 11, wherein, In the first direction, the width of the second bonding area bonded to the second region is H 1 , the distance between the second bonding area and the first bonding area is H 2 , the distance between the third bonding area and the first bonding area is H 3 , the width of the third bonding area bonded to the third region is H 4 ; in the third direction, the length of the second bonding area is L 2 , the length of the third bonding area is L 3 , the electrochemical device satisfies at least one of the following conditions: (1)H 1 ≥0.05W; (2)H 1 ≤0.3W; (3)H 4 ≥0.05W; (4)H 4 ≤0.3W; (5)H 2 ≥0.05W 1 ; (6)H 2 ≤0.4W 1 ; (7)H 3 ≥0.05W 1 ; (8)H 3 ≤0.4W 1 ; (9)L 2 ≥0.4L 1 ; (10)L 3 ≥0.4L 1 。 13. An electrical equipment, wherein, it includes the electrochemical device according to any one of claims 1 to 12.

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