Transparent light-emitting module and transparent display screen

Abstract

A transparent light-emitting module (100) and a transparent display screen (1000). The transparent light-emitting module (100) comprises a light-transmitting substrate (1) and a light-transmitting cover plate (2), wherein light-transmitting holes corresponding to each other are arranged in an array in the light-transmitting substrate (1) and the light-transmitting cover plate (2), and the regions outside the light-transmitting holes form non-light-transmitting regions; the light-transmitting holes in the light-transmitting substrate (1) are first light-transmitting holes (11), and the light-transmitting holes in the light-transmitting cover plate (2) are second light-transmitting holes (21); the light-transmitting substrate (1) is provided with a driving circuit and pixel bonding pads, and the pixel bonding pads are arranged in an array in a non-light-transmitting region outside the first light-transmitting holes (11); several light-emitting pixels (12) are mounted on the pixel bonding pads and are connected to the driving circuit by means of the pixel bonding pads; each light-emitting pixel (12) comprises a driving chip (121) and a light-emitting wafer; and pixel through holes (22) are arranged in an array in a non-light-transmitting region outside the second light-transmitting holes (21) in the light-transmitting cover plate (2), and the pixel through holes (22) correspond to the pixel bonding pads, such that the light-emitting pixels (12) are located in the pixel through holes (22). The transparent display screen (1000) comprises a light-transmitting motherboard (3) and one or more transparent light-emitting modules (100) mounted on the light-transmitting motherboard (3), wherein the light-transmitting motherboard (3) is provided with a light-transmitting region and a non-light-transmitting region, and the non-light-transmitting region is provided with a transmission circuit for providing a power source and a signal for the transparent light-emitting modules (100); and each transparent light-emitting module (100) is electrically connected to the light-transmitting motherboard (3).

Description

Transparent light-emitting module and transparent display screen

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 1, 2023, with application number 202323308207.9, and invention name “A transparent light-emitting module and a transparent display screen”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of transparent display screens, and in particular to the field of transparent display screens with light-transmitting holes arranged on a circuit board. Background Art

[0003] Transparent LED display screens have gradually been widely used in the market and have developed into various product forms. One method is to use a PCB board, cut it into rows or columns to form transparent areas and non-light-transmitting areas with row or column spacing, and arrange light beads in an array on the non-light-transmitting areas. In this way, a translucent effect of a transparent luminous display can be formed. As an improvement, the applicant has previously provided an optimized and improved solution, in which a thin strip of PCB board is pre-made, and light strips are installed on the side of the PCB board to form light strips. The light strips are then installed at a certain distance. In this way, a similar translucent effect as mentioned above can also be achieved. However, the transparency effect of the above two solutions is poor.

[0004] As a further improvement, a transparent LED display technology emerged, which used LEDs arrayed on a transparent glass panel. The inventors realized that this type of transparent display offered the best transparency, but it was difficult to form circuits on the glass panel, resulting in a complex process and high costs.

[0005] As one of the alternatives, the art currently discloses a transparent display screen 100' as shown in Figures 1 to 6, which includes a circuit substrate 1', on which a plurality of through holes 10' are provided through the front and back of the circuit substrate 1' to form a light-transmitting area and a non-light-transmitting area on the circuit substrate 1'; the LED lamp beads 2' are arranged in an array on the non-light-transmitting area on the front, and the LED lamp beads 2' are protrudingly mounted on the lamp bead pads on the front of the circuit substrate 1'. Such LED lamp beads 2' generally include a driver chip and a light-emitting chip, so the internal circuit of the circuit substrate 1' is relatively simple, and generally no other electronic components need to be installed, making the screen thin and neat and clean. This method of directly installing the LED lamp beads 2' on the circuit substrate 1' provided with a uniform array of through holes 10' achieves both display and transparency.

[0006] The inventors realized that this transparent display screen 100' also has obvious defects. In many application scenarios, for example, as shown in Figures 1 to 4, when it is installed on the transparent glass 3', since the surface of the LED lamp beads 2' protrudes from the circuit substrate 1', it is easy to cause collisions, resulting in damage or falling; and it is impossible to fit smoothly on the surface of the transparent glass 3'. At the same time, the pins of the LED lamp beads 2' welded to the circuit substrate 1' are fully exposed to the air, and the static electricity and moisture in the air cause the LED lamp beads 2' to be damaged. In addition, as shown in Figures 5 and 6, due to the size of the LED lamp beads 2', the resolution and transparency of the transparent display screen 100' need to be further improved.

[0007] Application Contents

[0008] In order to overcome the problems in the prior art of transparent display screens where LED lamp beads are easily damaged, difficult to install flatly and tightly, and the resolution and transparency need to be further improved, the present application provides a transparent light-emitting module and a transparent display screen.

[0009] In one aspect, an embodiment of the present application provides a transparent light-emitting module, comprising a light-transmitting substrate and a light-transmitting cover plate; the light-transmitting substrate and the light-transmitting cover plate are both provided with corresponding light-transmitting holes in an array, and the area outside the light-transmitting holes forms a non-light-transmitting area;

[0010] The light-transmitting hole on the light-transmitting substrate is a first light-transmitting hole, and the light-transmitting hole on the light-transmitting cover is a second light-transmitting hole;

[0011] The light-transmitting substrate is provided with a driving circuit and pixel pads, and the pixel pads are arranged in an array in a non-light-transmitting area outside the first light-transmitting hole; wherein a plurality of light-emitting pixels are mounted on the pixel pads and connected to the driving circuit through the pixel pads; the light-emitting pixels include a driving chip and a light-emitting chip;

[0012] Pixel through holes are arranged in an array on the non-light-transmitting area outside the second light-transmitting hole on the light-transmitting cover plate, and the pixel through holes correspond to the pixel pads so that the light-emitting pixels are located in the pixel through holes.

[0013] The present application uses the above-mentioned method to arrange the luminous pixels in the pixel through-holes formed by the above-mentioned transparent cover plate, and the luminous pixels are not easily damaged by bumps. The luminous pixels can be made without additional exposed solder joints, which makes it easy to achieve waterproof and moisture-proof. The luminous display surface of the transparent luminous module is a transparent cover plate, and its luminous display surface is flat. The luminous display surface can be directly attached to flat products such as glass. At the same time, under the same spacing conditions, the area occupied by the luminous pixels of the present application is smaller than that of the prior art, so it can also improve the display density and the resolution of the transparent display screen.

[0014] Another embodiment of the present application provides a transparent display screen, comprising a transparent motherboard and one or more transparent light-emitting modules mounted on the transparent motherboard; the transparent motherboard is provided with a light-transmitting area and a non-light-transmitting area, and the non-light-transmitting area is provided with a transmission circuit for providing power and signals to the transparent light-emitting modules; each of the transparent light-emitting modules is electrically connected to the transparent motherboard;

[0015] The transparent light-emitting module includes a light-transmitting substrate and a light-transmitting cover plate; the light-transmitting substrate and the light-transmitting cover plate are both provided with corresponding light-transmitting holes in an array, and the projections of the light-transmitting holes are located in the light-transmitting area on the light-transmitting motherboard; the area outside the light-transmitting holes forms a non-light-transmitting area;

[0016] The light-transmitting hole on the light-transmitting substrate is a first light-transmitting hole, and the light-transmitting hole on the light-transmitting cover is a second light-transmitting hole;

[0017] The light-transmitting substrate is provided with a driving circuit and pixel pads, and the pixel pads are arranged in an array in a non-light-transmitting area outside the first light-transmitting hole; wherein a plurality of light-emitting pixels are mounted on the pixel pads and connected to the driving circuit through the pixel pads; the light-emitting pixels include a driving chip and a light-emitting chip;

[0018] Pixel through holes are arranged in an array on the non-light-transmitting area outside the second light-transmitting hole on the light-transmitting cover plate, and the pixel through holes correspond to the pixel pads so that the light-emitting pixels are located in the pixel through holes.

[0019] The transparent display screen provided in this example can arrange the light-emitting pixels in the pixel through-holes formed by the above-mentioned transparent cover plate, so that the light-emitting pixels are not easily damaged by bumps. The light-emitting pixels can have no additional exposed solder joints, making it easy to achieve waterproof and moisture-proof. The light-emitting display surface of the transparent light-emitting module is a transparent cover plate, and its light-emitting display surface is flat. The light-emitting display surface can be directly attached to flat products such as glass. At the same time, under the same spacing conditions, the area occupied by the light-emitting pixels in this application is smaller than that of the prior art, thereby improving the display density and the resolution of the transparent display screen.

[0020] The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below, and other features and advantages of the disclosure will be apparent from the description, the drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a perspective schematic diagram of a transparent display screen provided in the prior art;

[0022] Figure 2 is an enlarged schematic diagram of point A in Figure 1;

[0023] FIG3 is a schematic cross-sectional view of a transparent display screen provided in the prior art;

[0024] FIG4 is an enlarged schematic diagram of point B in FIG3 ;

[0025] FIG5 is a schematic front view of a transparent display screen provided in the prior art;

[0026] FIG6 is an enlarged schematic diagram of point C in FIG5;

[0027] FIG7 is an exploded perspective schematic diagram of a transparent light-emitting module provided in a specific embodiment of the present application;

[0028] FIG8 is a perspective schematic diagram of a transparent light-emitting module provided in a specific embodiment of the present application;

[0029] FIG9 is a schematic top view of a transparent light-emitting module provided in a specific embodiment of the present application;

[0030] FIG10 is a schematic diagram of a light-emitting pixel in the enlarged view at point D in FIG9 ;

[0031] FIG11 is another schematic diagram of the light-emitting pixel in the enlarged view at point D in FIG9 ;

[0032] FIG12 is a perspective schematic diagram of another transparent light-emitting module provided in a specific embodiment of the present application;

[0033] FIG13 is an exploded perspective schematic diagram of a transparent display screen provided in a specific embodiment of the present application;

[0034] FIG14 is an enlarged schematic diagram of point E in FIG13;

[0035] FIG15 is a perspective schematic diagram of a transparent display screen provided in a specific embodiment of the present application;

[0036] FIG16 is an enlarged schematic diagram of point F in FIG15 ;

[0037] FIG17 is a schematic cross-sectional view of a transparent display screen provided in a specific embodiment of the present application;

[0038] FIG18 is an enlarged schematic diagram of point G in FIG17;

[0039] FIG19 is a schematic front view of a light-transmitting motherboard provided in a specific embodiment of the application;

[0040] FIG20 is an enlarged schematic diagram of point H in FIG19;

[0041] FIG21 is a schematic front view of a transparent display screen provided in a specific embodiment of the present application;

[0042] FIG22 is an enlarged schematic diagram of point I in FIG21;

[0043] FIG23 is an enlarged schematic diagram of point J in FIG21;

[0044] FIG24 is an exploded perspective schematic diagram of a second transparent display screen provided in a specific embodiment of the present application;

[0045] FIG25 is an exploded perspective schematic diagram of a third transparent display screen provided in a specific embodiment of the present application;

[0046] FIG26 is a cross-sectional schematic diagram of a fourth further improved transparent display screen provided in a specific embodiment of the present application;

[0047] FIG27 is a schematic diagram of power supply and signal control for a transparent display screen provided in a specific embodiment of the present application.

[0048] The reference numerals in the background art are as follows: 100', transparent display screen; 1', circuit substrate; 2', LED lamp beads; 3', transparent glass; 10', through hole;

[0049] The drawings of the specific implementation are as follows: 100, transparent light emitting module; 1000, transparent display screen; 101, peripheral non-transparent area;

[0050] 1. Translucent substrate; 2. Translucent cover; 3. Translucent motherboard; 4. Transparent carrier; 5. Hollow reinforcement sheet; 6. Signal module; 7. Power module;

[0051] 11. First light-transmitting hole; 12. Luminous pixel; 13. Electrical connection part; 21. Second light-transmitting hole; 22. Pixel through-hole; 221. Light-transmitting glue; 11a. Center light-transmitting hole; 11b. Adjacent edge light-transmitting hole; 11c. Adjacent corner light-transmitting hole; 121. Driver chip; 12R. Red light-emitting chip; 12G. Green light-emitting chip; 12B. Blue light-emitting chip; 31. Third light-transmitting hole; 32. External connection area; 32v. Positive power supply line; 32g. Negative power supply line; 32d. Signal line; 321. Connection PIN pin; 33. Module connection part; 331. Electrical connection part; 34. Non-transparent frame; 31A. Hollow light-transmitting area. DETAILED DESCRIPTION

[0052] In order to make the technical problems, technical solutions and beneficial effects solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0053] In the description of this application, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting this application. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0054] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0055] Example 1

[0056] As shown in Figures 7 to 9, this example provides a transparent light-emitting module 100, including a transparent substrate 1 and a transparent cover plate 2; the transparent substrate 1 and the transparent cover plate 2 are both provided with an array of corresponding light-transmitting holes, and the area outside the light-transmitting holes forms a non-light-transmitting area; generally, the greater the ratio of the area of ​​the light-transmitting area to the area of ​​the non-light-transmitting area, the higher the transparency of the transparent light-emitting module 100 and the better the transmittance. In this application, the transparent substrate 1 is generally formed of a non-transparent material, for example, it is generally directly a printed circuit board, which is composed of at least two circuit layers, and the circuit layers thereon form a driving circuit, which provides power and signals to each light-emitting pixel 12.

[0057] For the sake of distinction, the light-transmitting hole provided on the light-transmitting substrate 1 is referred to as the first light-transmitting hole 11, and the light-transmitting hole formed on the light-transmitting cover plate 2 is referred to as the second light-transmitting hole 21; the shape of the light-transmitting hole can be a circular through hole as shown in the figure, or it can be a triangle, a quadrilateral or other polygon or any other regular or irregular form, preferably a circular through hole.

[0058] The light-transmitting substrate 1 is provided with a driving circuit and pixel pads, which are arranged in an array in the non-light-transmitting area outside the first light-transmitting hole 11. A number of light-emitting pixels 12 are mounted on the pixel pads and connected to the driving circuit via the pixel pads. The light-emitting pixels 12 include a driver chip 121 and a light-emitting chip. The light-emitting chips in this application are well known to the public. Common light-emitting chips include a red light-emitting chip 12R, a green light-emitting chip 12G, and a blue light-emitting chip 12B. Each light-emitting pixel 12 in this application includes a driver chip 121. Therefore, its driver chip 121 is not independently provided like in conventional LED display devices, but is integrated into each light-emitting pixel 12. The light-emitting pixels 12 in this example can be LED lamp beads with integrated lamp cups. As a preferred embodiment, the light-emitting pixels 12 in this example differ from conventional LED lamp beads that contain lamp cups. The driver chip 121 and light-emitting chip without lamp cups can be directly mounted on the light-transmitting substrate 1 as bare lamp beads without lamp cups. As shown in Figure 10, the red light-emitting chip 12R, blue light-emitting chip 12B and green light-emitting chip 12G in this example can be independently installed outside the driving chip 121, or as shown in Figure 11, the red light-emitting chip 12R, green light-emitting chip 12G and blue light-emitting chip 12B can be installed on the driving chip 121; the light-emitting chip and the driving chip 121 can be connected by bonding wires (or solid crystal wires or gold solder wires).

[0059] Pixel through holes 22 are arranged in an array on the non-transparent area outside the second light-transparent hole 21 on the transparent cover plate 2. The pixel through holes 22 correspond to the pixel pads so that the luminous pixels 12 are located in the pixel through holes 22; the pixel through holes 22 are used to accommodate the luminous pixels 12, so their number is consistent with the number of luminous pixels 12.

[0060] In this embodiment, as a preferred method, as shown in FIG8 , a light-transmitting adhesive 221 is potted within the pixel through-hole 22 to transparently encapsulate the light-emitting pixel 12 within the pixel through-hole 22 ; the light-emitting pixel 12 and the light-transmitting adhesive 221 form an LED package housed within the pixel through-hole 22 . Potting with the light-transmitting adhesive 221 provides further protection, and the encapsulated transparent light-emitting module 100 is more airtight and waterproof and moisture-proof, further protecting the light-emitting pixel 12 within the pixel through-hole 22 .

[0061] The transparent substrate 1 is provided with an electrical connection portion 13 for inputting power and signals from outside the transparent light-emitting module 100. The transparent light-emitting module 100 in this example can be used directly as a display panel for a display screen, for example, by directly connecting to an external power module and signal module to input power and signals. Alternatively, it can be used as a small unit and then mounted on a larger motherboard to form a larger transparent display screen 1000. This will be described in detail in subsequent embodiments of this application and will not be described in detail in this example.

[0062] In this example, the electrical connection portion 13 includes a plurality of power connection structures and signal connection structures disposed in a non-transparent area on the transparent substrate 1 .

[0063] The power connection structure is a first power connection hole, and the signal connection structure is a first signal connection hole. The power connection structure and the signal connection structure of the electrical connection portion 13 are centrally or dispersedly arranged at any position in the non-transparent area of ​​the transparent substrate 1. Preferably, the power connection structure and the signal connection structure of the electrical connection portion 13 are centrally or dispersedly arranged at a corner or edge of the transparent substrate 1.

[0064] As shown in Figures 7-9, a non-transparent structure is further provided at one or more first light-transmitting holes 11 of the transparent substrate 1 as an electrical connection portion 13. In this example, one of the first light-transmitting holes 11 is made into a non-transparent structure. In this way, the power connection structure and the signal connection structure can be centrally arranged in one place, making the electrical connection simpler and easier to implement with only a slight loss of light transmittance.

[0065] Among them, in this example, as shown in Figures 7 to 9, among the light-transmitting holes on the light-transmitting substrate 1 and the light-transmitting cover plate 2, taking the first light-transmitting hole as an example, it includes a central light-transmitting hole 11a with a full hole shape set in the central area, adjacent light-transmitting holes 11b with half holes at the four sides, and adjacent corner light-transmitting holes 11c with a quarter hole shape at the corners; the adjacent light-transmitting holes 11b of two adjacent light-emitting modules can be combined to form a full hole shape; the adjacent corner light-transmitting holes 11c of four light-emitting modules are combined to form a full hole shape.

[0066] The size of the light-transmitting hole can be optimized according to actual needs during the production process, and a balance can be found between maintaining transparency and ensuring product display performance. For those skilled in the art, since the idea has been introduced in this example, they can obtain it without any creative work.

[0067] The light-transmitting cover plate 2 is preferably formed by die-molding a plastic material, or a plate-like structure made of any other material, which can be glued to the light-transmitting substrate 1. It can also be a printed circuit board, and preferably a printed circuit board without an internal circuit is used as the light-transmitting cover plate. Alternatively, it is preferred that both the light-transmitting cover plate 2 and the light-transmitting substrate 1 are made of printed circuit boards to form a composite circuit board structure, and the light-transmitting cover plate 2 and the light-transmitting cover plate 2 are pressed or bonded together. The material of the light-transmitting cover plate 2 can be a non-transparent structure as a whole, and light is only transmitted at the second light-transmitting hole 21, or the light-transmitting cover plate 2 can also be a transparent material as a whole.

[0068] In this example, the light-emitting pixels 12 can be arranged in the pixel through-holes 22 formed by the above-mentioned transparent cover plate 2 in the above-mentioned manner, and the light-emitting pixels 12 are not easily damaged by bumps. It can be made so that the light-emitting pixels 12 have no additional exposed solder joints, and it is easy to achieve waterproof and moisture-proof. The light-emitting display surface of the transparent light-emitting module 100 is a transparent cover plate 2, and its light-emitting display surface is flat. The light-emitting display surface can be directly attached to flat products such as glass (see Figures 17 and 18). At the same time, as shown in Figure 23, under the same spacing conditions, the area occupied by the light-emitting pixels 12 is smaller than that of the prior art, so it can also improve the display density and improve the resolution of the transparent display screen 1000.

[0069] Example 2

[0070] The other structures in this example are identical to those in Example 1, but the arrangement of the light-transmitting holes in the transparent substrate 1 and transparent cover plate 2 differs slightly. As shown in Figure 12 , the light-transmitting holes in both the transparent substrate 1 and transparent cover plate 2 are all central, full-bore light-transmitting holes 11a, with no light-transmitting holes arranged around the perimeter, forming a peripheral, non-transparent area 101. Because this peripheral, non-transparent area 101 has sufficient area for accommodating the electrical connection portion 13, a more preferred arrangement in this example is to disperse the first power connection hole and the first signal connection hole in the electrical connection portion 13 within the peripheral, non-transparent area 101. Of course, these holes can also be integrated into a single edge or corner.

[0071] In this example, the edges around the transparent cover plate 2 and the transparent substrate 1 are set as non-perforated areas, which is beneficial to the flatness and stability of the transparent light-emitting module 100. There is enough wiring space around the edges, which is beneficial for processing and also makes the internal wiring more reasonable and reliable.

[0072] Example 3

[0073] This example provides a transparent display screen 1000, as shown in Figures 13 to 22, comprising a transparent motherboard 3 and one or more transparent light-emitting modules 100 mounted on the transparent motherboard 3. The transparent motherboard 3 is provided with a light-transmitting area and a non-light-transmitting area. The non-light-transmitting area is provided with a transmission circuit for providing power and signals to the transparent light-emitting modules 100. Each transparent light-emitting module 100 is electrically connected to the transparent motherboard 3.

[0074] The transparent light-emitting module 100 includes a transparent substrate 1 and a transparent cover plate 2. Both the transparent substrate 1 and the transparent cover plate 2 are arrayed with corresponding light-transmitting holes, with the projections of the light-transmitting holes located within the light-transmitting area of ​​the transparent motherboard 3. The area outside the light-transmitting holes forms a non-light-transmitting area. The light-transmitting and non-light-transmitting areas on the transparent motherboard 3 described in this example do not necessarily correspond one-to-one with the light-transmitting holes and non-light-transmitting areas on the transparent light-emitting module 100. Instead, the projections of the light-transmitting holes on the transparent light-emitting module 100 are located within the light-transmitting areas of the transparent motherboard 3. Because the transparent motherboard 3 does not need to be arrayed with the light-emitting pixels 12, only a relatively small non-light-transmitting area is required for arranging the transmission circuitry. Therefore, the light-transmitting area on the transparent motherboard 3 can be large or small. For example, as an embodiment, as shown in FIG13 , the light-transmitting area of ​​the light-transmitting motherboard 3 includes third light-transmitting holes 31 arranged in an array thereon; the area outside the third light-transmitting holes 31 forms a non-light-transmitting area; the third light-transmitting holes 31 are arranged in a one-to-one correspondence with the first light-transmitting holes 11 and the second light-transmitting holes 21.

[0075] The light-transmitting hole provided on the light-transmitting substrate 1 is a first light-transmitting hole 11, and the light-transmitting cover plate 2 is formed with a second light-transmitting hole 21;

[0076] The transparent substrate 1 is provided with a driving circuit and pixel pads. The pixel pads are arranged in an array in a non-transparent area outside the first light-transmitting hole 11. Among them, a number of light-emitting pixels 12 are mounted on the pixel pads and connected to the driving circuit through the pixel pads. The light-emitting pixels 12 include a driving chip 121 and a light-emitting chip.

[0077] Pixel through holes 22 are arranged in an array on the non-transparent area outside the second light-transparent hole 21 on the light-transparent cover plate 2. The pixel through holes 22 correspond to the pixel pads so that the light-emitting pixels 12 are located in the pixel through holes 22.

[0078] Preferably, the transparent substrate 1 in this example is the transparent substrate 1 shown in Example 1, and the contents in Example 1 can be replicated and described in this example. To avoid repetition, some contents already described in the above Example 1 will not be described again.

[0079] In this application, the transparent light-emitting module 100 is separated from the transparent motherboard 3. Because the transparent light-emitting module 100 is generally small, typically ranging from 80 to 160 mm in length and width, it is within the machining range of precision machining equipment. This ensures that the transparent light-emitting module 100 can be manufactured more conveniently, efficiently, and with more stable quality. While the transparent motherboard 3 can be manufactured in larger sizes, its relatively simple internal circuit structure makes it easier to maintain stable quality.

[0080] In this example, an electrical connection portion 13 is provided on the transparent substrate 1; as shown in Figures 13, 14, and 20, a module connection portion 33 is provided on the transparent motherboard 3, and the module connection portion 33 on the transparent motherboard 3 is electrically connected to the electrical connection portion 13 on the transparent substrate 1; so as to input power and signals from the transparent motherboard 3 to the transparent light-emitting module 100.

[0081] In this example, the power connection structure on the transparent substrate 1 is a first power connection hole, and the signal connection structure is a first signal connection hole; the power connection structure on the transparent motherboard 3 is a second power connection hole, and the signal connection structure is a second signal connection hole; the first power connection hole and the second power connection hole, as well as the first signal connection hole and the second signal connection hole are connected by electrical connectors 331. In this example, the electrical connector 331 is a metal needle-shaped or metal column-shaped connector. It is welded by metal needle-shaped or metal column-shaped connectors. Of course, the power connection structure and signal connection structure on the above-mentioned transparent substrate 1, as well as the power connection structure and signal connection structure on the transparent template 3 can also be other electrical connection methods. As long as they can ultimately achieve electrical connection between the transparent substrate 1 and the transparent template 3.

[0082] In this example, a non-transparent structure is provided at one or more first light-transmitting holes 11 in the transparent substrate 1 as an electrical connection portion 13. Similarly, in this example, a non-transparent structure is provided at one or more third light-transmitting holes 31 in the transparent motherboard 3 as a module connection portion 33. The electrical connection portion 13 of the transparent substrate 1 and the module connection portion 33 in the transparent motherboard 3 are correspondingly connected.

[0083] Both the transparent substrate 1 and the transparent motherboard 3 are printed circuit boards, consisting of at least two circuit layers. The circuit layers on the transparent motherboard 3 form a transmission circuit, which provides power and signals to the transparent substrate 1. The circuit layers on the transparent substrate 1 form a driver circuit, which provides power and signals to each luminescent pixel 12. Specifically, the transmission circuit on the transparent motherboard 3 is electrically connected to the electrical connection portion 13 on the transparent substrate 1 via the module connection portion 33, transmitting the power and signals from the transmission circuit to the driver circuit on the transparent substrate 1. The driver circuit provides power and signals to each luminescent pixel 12.

[0084] Similarly, as shown in Figures 13 to 16, the light-transmitting holes on the light-transmitting substrate 1 and the light-transmitting cover plate 2, taking the first light-transmitting hole as an example, include a central light-transmitting hole 11a in the shape of a full hole in the central area, adjacent light-transmitting holes 11b in the shape of half holes at the four sides, and adjacent corner light-transmitting holes 11c in the shape of a quarter hole at the corners; the adjacent light-transmitting holes 11b of two adjacent light-emitting modules can be combined to form a full hole, and the adjacent corner light-transmitting holes 11c of four light-emitting modules can be combined to form a full hole.

[0085] As shown in Figures 13, 15, 19, and 20, the transparent motherboard 3 also includes an external connector area 32 for connecting to the power module and the signal module. Connecting pins 321 are provided on the external connector area 32 for connecting to the power module 7 and the signal module 6. As shown in Figure 27, the connecting pins 321 on the external connector area 32 are internally connected to the transmission circuit on the transparent motherboard 3, and are connected to the external power module 7 and the signal module 6 via these connecting pins 321. This transmission circuit includes power transmission lines and signal transmission lines. The power transmission lines include a positive power line 32v and a negative power line 32g, each connected to each transparent light-emitting module 100 to provide power. The signal transmission lines include a plurality of signal lines 32d connected to each transparent light-emitting module 100 to provide signals to each transparent light-emitting module 100.

[0086] As a further preferred embodiment, the transparent light emitting module 100 is bonded to the transparent motherboard 3. This not only realizes the electrical connection between the transparent motherboard 3 and the transparent light emitting module 100, but also enhances the mechanical strength of the transparent motherboard 3 and the transparent light emitting module 100.

[0087] The transparent display screen 1000 provided in this example can arrange the luminous pixels 12 in the pixel through-holes 22 formed by the above-mentioned transparent cover plate 2, and the luminous pixels 12 are not easily damaged by bumps. It can be made so that the luminous pixels 12 have no additional exposed solder joints, and it is easy to achieve waterproof and moisture-proof. The luminous display surface of the transparent light-emitting module 100 is a transparent cover plate 2, and its luminous display surface is flat. The luminous display surface can be directly attached to flat products such as glass (see Figures 17 and 18). At the same time, as shown in Figure 23, under the same spacing conditions, the area occupied by the luminous pixels 12 is smaller than that of the prior art, so it can also improve the display density and improve the resolution of the transparent display screen 1000.

[0088] At the same time, because each light-emitting pixel 12 is provided with a driver chip to directly drive the light-emitting chip, the internal circuit of the transparent light-emitting module 100 becomes very simple. Generally, in addition to the power supply line, all the light-emitting pixels 12 in the transparent light-emitting module 100 can be connected in series with one to two signal lines. N transparent light-emitting modules 100 are mounted on the transparent motherboard 3. The signal lines required on the transparent motherboard 3 can be as few as N and at most 2N. Therefore, neither the transparent light-emitting module 100 nor the transparent motherboard 3 requires the installation of additional electronic components, making the entire product clean and tidy.

[0089] Example 4

[0090] As shown in FIG25 , most of the contents of this example are the same as those of Example 3, with the only difference being that the light-transmitting holes on the light-transmitting substrate 1 and the light-transmitting cover 2 are both full-hole central light-transmitting holes 11 a , and no light-transmitting holes are set on the four edges thereof to form a circle of peripheral non-transmitting area 101 .

[0091] In this example, the edges around the transparent cover plate 2 and the transparent substrate 1 are set as non-perforated areas, which is beneficial to the flatness and stability of the transparent light-emitting module 100. There is enough wiring space around the edges, which is beneficial for processing and also makes the internal wiring more reasonable and reliable.

[0092] Example 5

[0093] This example is largely identical to the above-mentioned Example 4, as shown in FIG25 , with the only difference being the arrangement of the light-transmitting areas in the light-transmitting motherboard 3. Assuming that the number of transparent light-emitting modules 100 is N, the light-transmitting motherboard 3 includes a non-transparent frame 34 and N hollow light-transmitting areas 31A formed in the non-transparent frame 34. Each hollow light-transmitting area 31A corresponds to a transparent light-emitting module 100.

[0094] The transparent motherboard 3 can be hollowed out in this way, and the transparent motherboard 3 and the transparent light-emitting module 100 can be welded through the electrical connection parts distributed in the four corners, which on the one hand provides power and signals to the transparent light-emitting module 100, and on the other hand also realizes the mechanical connection of the transparent light-emitting module 100.

[0095] Example 6

[0096] This embodiment incorporates the contents of Examples 3-5 as a whole. As a preferred embodiment, as shown in FIG26 , a hollow reinforcement sheet is further included. Furthermore, as a preferred embodiment, the hollow reinforcement sheet is disposed on the back of the transparent motherboard 3. The hollow reinforcement sheet has a hollowed-out area that projects over the light-transmitting areas of the transparent motherboard 3 and the transparent light-emitting module 100. The hollow reinforcement sheet can be made of, for example, stainless steel or other metal materials with similar or higher strength. The hollow reinforcement sheet is attached to the side of the transparent motherboard 3 facing away from the transparent light-emitting module 100. The hollowed-out area of ​​the hollow reinforcement sheet preferably has the same pattern as the light-transmitting area of ​​the transparent motherboard 3. This further enhances the strength of the finished transparent display screen 1000.

[0097] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A transparent light-emitting module, wherein: It comprises a light-transmitting substrate and a light-transmitting cover plate; the light-transmitting substrate and the light-transmitting cover plate are both provided with light-transmitting holes corresponding to each other in an array, so that the transparent light-emitting module presents a transparent effect; the area outside the light-transmitting holes forms a non-light-transmitting area; The light-transmitting hole on the light-transmitting substrate is a first light-transmitting hole, and the light-transmitting hole on the light-transmitting cover plate is a second light-transmitting hole; The light-transmitting substrate is provided with a driving circuit and a pixel pad, and the pixel pad is arranged in an array in a non-light-transmitting area outside the first light-transmitting hole; wherein a plurality of light-emitting pixels are mounted on the pixel pads and connected to the driving circuit through the pixel pads; the light-emitting pixels include a driving chip and a light-emitting chip; Pixel through holes are arranged in an array on the non-light-transmitting area outside the second light-transmitting hole on the light-transmitting cover plate, and the pixel through holes correspond to the pixel pads so that the light-emitting pixels are located in the pixel through holes.

2. The transparent light-emitting module according to claim 1, wherein: The pixel through hole is filled with a light-transmitting glue to transparently encapsulate the light-emitting pixel in the pixel through hole; the light-emitting pixel and the light-transmitting glue form an LED package accommodated in the pixel through hole.

3. The transparent light emitting module according to claim 1, wherein: The transparent substrate is provided with an electrical connection portion for inputting power and signals from outside the transparent light-emitting module; The electrical connection portion includes a plurality of power connection structures and signal connection structures arranged in a non-light-transmitting area on the light-transmitting substrate.

4. The transparent light-emitting module according to claim 3, wherein: The power connection structure is a first power connection hole, and the signal connection structure is a first signal connection hole.

5. The transparent light-emitting module according to claim 3, wherein: The power connection structure and the signal connection structure of the electrical connection part are centrally or dispersedly arranged at a corner or edge of the light-transmitting substrate.

6. The transparent light emitting module according to claim 2, wherein: A non-light-transmitting structure is provided at one or more of the first light-transmitting holes of the light-transmitting substrate as an electrical connection portion.

7. The transparent light-emitting module according to claim 1, wherein: The light-transmitting substrate is a printed circuit board, which is composed of at least two circuit layers, and the circuit layers thereon form a driving circuit, and the driving circuit provides power and signals for each of the light-emitting pixels.

8. The transparent light emitting module according to claim 1, wherein: The light-transmitting holes on the light-transmitting substrate and the light-transmitting cover plate include a central light-transmitting hole in the shape of a full hole in the central area, adjacent light-transmitting holes in the shape of half holes at the four sides, and adjacent corner light-transmitting holes in the shape of a quarter hole at the corners; the adjacent light-transmitting holes of two adjacent light-emitting modules can be combined to form a full hole; the adjacent corner light-transmitting holes of four light-emitting modules can be combined to form a full hole.

9. The transparent light emitting module according to claim 1, wherein: The light-transmitting holes on the light-transmitting substrate and the light-transmitting cover are all full-hole central light-transmitting holes, and no light-transmitting holes are arranged on the four peripheral edges thereof, so as to form a circle of peripheral non-transmitting areas.

10. The transparent light emitting module according to claim 1, wherein: The light-transmitting cover plate and the light-transmitting cover plate are formed by pressing or bonding.

11. A transparent display screen, wherein: The invention comprises a light-transmitting motherboard and one or more transparent light-emitting modules mounted on the light-transmitting motherboard; the light-transmitting motherboard is provided with a light-transmitting area and a non-light-transmitting area, and the non-light-transmitting area is provided with a transmission circuit for providing power and signals to the transparent light-emitting modules; each of the transparent light-emitting modules is electrically connected to the light-transmitting motherboard; The transparent light-emitting module comprises a light-transmitting substrate and a light-transmitting cover plate; the light-transmitting substrate and the light-transmitting cover plate are both provided with mutually corresponding light-transmitting holes in an array, and the projections of the light-transmitting holes are located in the light-transmitting area on the light-transmitting mother plate; the area outside the light-transmitting holes forms a non-light-transmitting area; The light-transmitting hole on the light-transmitting substrate is a first light-transmitting hole, and the light-transmitting hole on the light-transmitting cover plate is a second light-transmitting hole; The light-transmitting substrate is provided with a driving circuit and a pixel pad, and the pixel pad is arranged in an array in a non-light-transmitting area outside the first light-transmitting hole; wherein a plurality of light-emitting pixels are mounted on the pixel pads and connected to the driving circuit through the pixel pads; the light-emitting pixels include a driving chip and a light-emitting chip; Pixel through holes are arranged in an array on the non-light-transmitting area outside the second light-transmitting hole on the light-transmitting cover plate, and the pixel through holes correspond to the pixel pads so that the light-emitting pixels are located in the pixel through holes.

12. The transparent display screen according to claim 11, wherein: The pixel through hole is filled with a light-transmitting glue to transparently encapsulate the light-emitting pixel in the pixel through hole; the light-emitting pixel and the light-transmitting glue form an LED package accommodated in the pixel through hole.

13. The transparent display screen according to claim 11, wherein: The transparent substrate is provided with an electrical connection part; the transparent motherboard is provided with a module connection part, and the module connection part on the transparent motherboard is electrically connected to the electrical connection part on the transparent substrate; so as to input power and signals from the transparent motherboard to the transparent light-emitting module.

14. The transparent display screen according to claim 13, wherein: The cell connection parts on the light-transmitting substrate and the module connection parts on the light-transmitting motherboard are both correspondingly provided with a plurality of power connection structures and signal connection structures.

15. The transparent display screen according to claim 14, wherein: The power connection structure on the transparent substrate is a first power connection hole, and the signal connection structure is a first signal connection hole; the power connection structure on the transparent motherboard is a second power connection hole, and the signal connection structure is a second signal connection hole; the first power connection hole and the second power connection hole, as well as the first signal connection hole and the second signal connection hole are connected by electrical connectors.

16. The transparent display screen according to claim 13, wherein: The power connection structure and the signal connection structure on the light-transmitting substrate are centrally or dispersedly arranged at the corners or edges of the light-transmitting substrate.

17. The transparent display screen according to claim 13, wherein: A non-light-transmitting structure is arranged at one or more of the first light-transmitting holes in the light-transmitting substrate as an electrical connection part; a non-light-transmitting structure is arranged at one or more of the third light-transmitting holes in the light-transmitting motherboard as a module connection part, and the electrical connection part on the light-transmitting substrate and the module connection part on the light-transmitting motherboard are connected correspondingly.

18. The transparent display screen according to claim 11, wherein: The transparent substrate and the transparent motherboard are both printed circuit boards, consisting of at least two circuit layers; the circuit layer on the transparent motherboard forms the transmission circuit, which is used to provide power and signals for the transparent substrate; the circuit layer on the transparent substrate forms a driving circuit, and the driving circuit provides power and signals for each of the light-emitting pixels.

19. The transparent display screen according to claim 11, wherein: The light-transmitting area of ​​the light-transmitting motherboard includes third light-transmitting holes arranged in an array thereon; the area outside the third light-transmitting holes forms the non-light-transmitting area; the third light-transmitting holes are arranged in a one-to-one correspondence with the first light-transmitting holes and the second light-transmitting holes.

20. The transparent display screen according to claim 19, wherein: The light-transmitting holes on the light-transmitting substrate and the light-transmitting cover plate include a central light-transmitting hole in the shape of a full hole in the central area, adjacent light-transmitting holes in the shape of half holes at the four sides, and adjacent corner light-transmitting holes in the shape of a quarter hole at the corners; the adjacent light-transmitting holes of two adjacent light-emitting modules can be combined to form a full hole, and the adjacent corner light-transmitting holes of four light-emitting modules can be combined to form a full hole.

21. The transparent display screen according to claim 19, wherein: The light-transmitting holes on the light-transmitting substrate and the light-transmitting cover are all full-hole central light-transmitting holes, and no light-transmitting holes are arranged on the four peripheral edges thereof, so as to form a circle of peripheral non-transmitting areas.

22. The transparent display screen according to claim 21, wherein: The number of the transparent light-emitting modules is N, wherein the light-transmitting motherboard includes a non-transparent frame and N hollow light-transmitting areas formed in the non-transparent frame, and each hollow light-transmitting area is correspondingly provided with one of the transparent light-emitting modules.

23. The transparent display screen according to claim 11, wherein: It also includes a hollow reinforcement sheet, which is arranged on the back of the light-transmitting motherboard; a hollow area is formed on the hollow reinforcement sheet, and the hollow area corresponds to the projection covering the light-transmitting motherboard and the light-transmitting area of ​​the transparent light-emitting module.

24. The transparent display screen according to claim 11, wherein: The transparent motherboard is also provided with an external connection interface area connected with the power module and the signal module; the external connection interface area is provided with connection PIN pins connected with the power module and the signal module.

25. The transparent display screen according to claim 11, wherein: The transparent light emitting module is bonded and connected to the light-transmitting motherboard.

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