Thermal management component, system, and vehicle

Abstract

A thermal management component (100, 1001, 1101), a system (1000), and a vehicle (1100). The thermal management component (100, 1001, 1101) comprises a base plate (110), a thermal management device (130) and a thermal management controller (120), wherein the thermal management device (130) is arranged on the base plate (110), and the thermal management device (130) comprises one or more of: a water valve, a water pump, a cooler and a condenser; and the thermal management controller (120) is embedded in the base plate (110), and the thermal management controller (120) is electrically connected to the thermal management device (130) by means of wires.

Description

Thermal management components, systems and vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 30, 2023, with application number 202311637611.2, and priority to the Chinese patent application entitled “Thermal Management Components, Systems and Vehicles,” all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of thermal management technology, and in particular, to a thermal management component, system and vehicle. Background Art

[0003] With the continuous development of vehicle applications, users are seeking increasingly more usable space during vehicle use. For example, the front compartment (also known as the trunk) has become a highly sought-after space. However, vehicle components such as the engine and thermal management system are primarily located in the front compartment, occupying a significant amount of space. Reducing the space occupied by vehicle components in the front compartment is an urgent issue.

[0004] Summary of the Invention

[0005] The present application provides a thermal management component, system and vehicle, which can reduce the space occupied by vehicle components in the front cabin.

[0006] In a first aspect, the present application provides a thermal management component, which includes a substrate, a thermal management device, and a thermal management controller;

[0007] The aforementioned thermal management device is arranged on the aforementioned substrate, and the aforementioned thermal management device includes one or more of the following: a water valve, a water pump, a cooler and a condenser;

[0008] The thermal management controller is embedded in the substrate, and is electrically connected to the thermal management device via a wire.

[0009] Optionally, the thermal management controller is partially embedded in the substrate, or the thermal management controller is fully embedded in the substrate.

[0010] This solution integrates the thermal management controller and other thermal management components onto a substrate, reducing the overall size of the thermal management components and shortening the length of the connecting wires between the thermal management controller and the thermal management components, thus lowering costs. This overall miniaturization and lightweighting of the thermal management components can reduce the space occupied by vehicle components in the front cabin.

[0011] In a possible implementation manner, a first flow channel is provided on the substrate, and the first flow channel is used to circulate fluid to dissipate heat for the thermal management controller.

[0012] Optionally, a second flow channel is provided in the thermal management controller, and the second flow channel is connected to the first flow channel.

[0013] Optionally, the aforementioned second flow channel is a flow channel formed by a tube or a cavity.

[0014] In the above solution, the heat dissipation of the thermal management controller can be dissipated by liquid cooling, thereby improving the heat dissipation efficiency of the thermal management controller.

[0015] In a possible implementation manner, the first flow channel is disposed adjacent to the thermal management controller.

[0016] In the above solution, the flow channel may not be provided in the thermal management controller. Instead, the thermal management controller may be placed close to the flow channel in the substrate, and the heat of the thermal management controller may be taken away through the flow channel, thereby saving the cost of providing the flow channel.

[0017] In a possible implementation, the housing of the thermal management controller is a plastic housing or a metal housing without heat dissipation teeth.

[0018] The above solution uses liquid cooling to cool the thermal management controller, eliminating the need for heat dissipation through heat sinks, thereby reducing the weight of the thermal management controller. In addition, the use of a plastic housing can further reduce the weight of the thermal management controller.

[0019] In one possible embodiment, the substrate includes a water channel substrate, and the thermal management device disposed on the water channel substrate includes the water valve and the water pump; the thermal management controller, the water valve, and the water pump are disposed on the same side of the water channel substrate.

[0020] In the above solution, the thermal management controller is arranged on the water channel substrate, and the thermal management controller, the water valve and the water pump are arranged on the same side of the water channel substrate, which can save space and reduce flow resistance.

[0021] In one possible embodiment, the aforementioned first flow channel belongs to a coolant flow channel in a target thermal management circuit in a thermal management system, the aforementioned target thermal management circuit is a passenger compartment thermal management circuit, a battery heat dissipation circuit or an electric drive heat dissipation circuit, and the aforementioned thermal management system includes the aforementioned thermal management component.

[0022] In the above solution, the existing thermal management loop is used to assist the thermal management controller in dissipating heat, thereby reducing the cost and volume of deploying an additional heat dissipation loop.

[0023] In a possible implementation, the substrate further includes a refrigerant substrate, and the thermal management device disposed on the refrigerant substrate includes a cooler and a condenser.

[0024] In the above solution, when the thermal management controller is arranged on the water channel substrate, the thermal management component can also be integrated with the refrigerant substrate to improve the integration of the thermal management system and reduce the volume occupied by the thermal management system.

[0025] In one possible embodiment, the substrate includes a refrigerant substrate, and the thermal management device disposed on the refrigerant substrate includes the cooler and the condenser.

[0026] The thermal management controller, the cooler, and the condenser are arranged on the same side of the refrigerant substrate.

[0027] In the above solution, the thermal management controller is arranged on the refrigerant substrate, and the thermal management controller, the cooler and the condenser are arranged on the same side of the refrigerant substrate, which can save space and reduce the length of the wires.

[0028] In a possible implementation manner, the first flow channel is a refrigerant flow channel in the refrigerant substrate.

[0029] In the above solution, the existing refrigerant flow channel is used to assist the thermal management controller in dissipating heat, reducing the cost and volume of deploying an additional heat dissipation circuit.

[0030] In a possible implementation manner, the thermal management controller and the substrate are sealed by a sealing ring.

[0031] In the above solution, sealing with a sealing ring can achieve a tight connection between the thermal management controller and the substrate, reducing friction and wear.

[0032] In a second aspect, the present application provides a thermal management system, which includes the thermal management component as described in any one of the first aspects above.

[0033] In a third aspect, the present application provides a vehicle, which includes the thermal management component as described in any one of the first aspects above, or the aforementioned vehicle includes the thermal management system as described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is a schematic diagram of the structure of a thermal management component provided in an embodiment of the present application;

[0035] 2 and 3 are schematic diagrams showing a thermal management controller embedded in a substrate according to an embodiment of the present application;

[0036] FIG4 is a schematic structural diagram of a waterway substrate provided in an embodiment of the present application;

[0037] FIG5 is a schematic structural diagram of a refrigerant substrate provided in an embodiment of the present application;

[0038] 6 to 9 are schematic diagrams showing heat dissipation of a thermal management controller according to an embodiment of the present application;

[0039] FIG10 is a schematic diagram showing the structure of a thermal management system provided in an embodiment of the present application;

[0040] FIG11 is a schematic structural diagram of a vehicle provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] In the embodiment of the present application, "multiple" refers to two or more. In the embodiment of the present application, "and / or" is used to describe the association relationship of associated objects, indicating three relationships that can exist independently. For example, A and / or B can be expressed as follows: A exists alone, B exists alone, or A and B exist at the same time. The description methods such as "at least one of a1, a2, ... and an" adopted in the embodiment of the present application include the situation where any one of a1, a2, ... and an exists alone, and also include any combination of any multiple of a1, a2, ... and an, each of which can exist alone; for example, the description method of "at least one of a, b and c" includes the situation where a is alone, b is alone, c is alone, a and b combination, a and c combination, b and c combination, or abc combination.

[0042] In this application, the terms "first," "second," and the like are used to distinguish between identical or similar items having substantially the same function or effect. It should be understood that "first," "second," and "nth" do not have a logical or temporal dependency, nor do they limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," and the like to describe various elements, these elements should not be limited by these terms. These terms are simply used to distinguish one element from another.

[0043] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between the various embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0044] The thermal management components and thermal management systems provided in the embodiments of the present application (the thermal management system includes the thermal management components) are applicable to vehicles, and are also applicable to thermal management scenarios with other cooling (heat dissipation) and / or heating requirements. For example, the thermal management components and thermal management systems provided in the embodiments of the present application can be applied to electric vehicles. Specifically, the electric vehicle is a vehicle suitable for driving by an electric drive. The electric vehicle can be a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV) or a new energy vehicle (NEV), etc.

[0045] The thermal management system of the embodiment of the present application can use water to heat or dissipate heat from the managed object. In some possible implementations, the managed object may be a passenger compartment, a battery, an electric drive, and a control system, etc. In the present application, water is used to transfer heat energy. In some possible implementations, the thermal management system of the present application can also use coolants such as water and refrigerants to heat or dissipate heat from the managed object. Among them, the refrigerant can transfer heat through evaporation and condensation. It should be understood that water can also be replaced by other coolants to transfer heat energy, and the embodiment of the present application does not specifically limit this.

[0046] In a specific implementation, to meet user needs for front trunk space, an embodiment of the present application provides a highly integrated thermal management component. This achieves a miniaturized and lightweight thermal management system. For example, Figure 1 shows a schematic diagram of the structure of a thermal management component provided by an embodiment of the present application.

[0047] As shown in FIG1 , a thermal management component 100 provided in an embodiment of the present application includes a substrate 110 , a thermal management controller 120 , and N thermal management devices 130 . N can be an integer greater than 0. The N thermal management devices exemplarily shown in FIG1 include thermal management device 1 , thermal management device 2 , thermal management device 3 , …, and thermal management device N. The thermal management controller 120 and the N thermal management devices 130 are disposed on the substrate 110 .

[0048] Exemplarily, the thermal management controller 120 is embedded in the substrate 110. The thermal management controller 120 may be partially embedded in the substrate 110. Alternatively, the thermal management controller 120 may be fully embedded in the substrate 110. For ease of understanding, please refer to FIG. 2 and FIG. 3 for example.

[0049] In Figures 2 and 3, X represents the thickness of the substrate 110, and Y represents the thickness of the thermal management controller 120. Figure 2 shows a schematic diagram of a thermal management controller 120 partially embedded in the substrate 110. As shown in Figure 2, Y1 represents the depth of the recess on the substrate 110 for embedding the thermal management controller 120. Y1 < Y. The thermal management controller 120 is partially embedded in the substrate 110, with the unembedded portion protruding from the substrate 110, as shown in Figure 2, for example. Figure 3 shows a schematic diagram of a thermal management controller 120 fully embedded in the substrate 110. As shown in Figure 3, Y2 represents the depth of the recess on the substrate 110 for embedding the thermal management controller 120. Y2 ≥ Y. If the thermal management controller 120 is fully embedded in the substrate 110, no portion of the thermal management controller 120 protrudes from the substrate 110, as shown in Figure 3, for example. Figure 3 uses Y2 = Y as an example. By way of example, if Y2 > Y, the thermal management controller 120 is fully embedded in the substrate 110. X, Y, Y1 and Y2 are all greater than 0. The specific values ​​are set according to actual application requirements and are not limited in this embodiment of the present application.

[0050] In one possible implementation, regardless of whether the thermal management controller 120 is partially embedded in the substrate 110 or fully embedded in the substrate 110, the thermal management controller 120 and the substrate 110 can be compressed and sealed by a sealing ring. The sealing ring can achieve a tight connection between the thermal management controller 120 and the substrate 110, reducing friction and wear. Exemplarily, for example, bolts can be driven between the thermal management controller 120 and the substrate 110 to compress the sealing ring. Alternatively, for example, the thermal management controller 120 and the substrate 110 can be integrally formed by die casting or forging to compress the sealing ring. Alternatively, no sealing ring is required between the thermal management controller 120 and the substrate 110, and the thermal management controller 120 and the substrate 110 can be integrally formed by die casting or forging to seal the connection. It will be understood that the description here is only an example and does not constitute a limitation to the embodiments of the present application. In a specific implementation, other methods can also be used to integrate the thermal management controller 120 and the substrate 110.

[0051] Exemplarily, the N thermal management devices 130 may include one or more of the following: a water valve, a water pump, a cooler, a condenser, and an electronic expansion valve. Exemplarily, the water valve may include a one-way valve, a three-way valve, or other multi-way valves (e.g., a nine-way valve, etc.). Exemplarily, the N thermal management devices 130 may be provided on the substrate 110 by detachable connection methods such as threaded connection, snap connection, hinge connection, or by non-detachable connection methods such as die-casting, welding, or forging. The embodiment of the present application does not limit the connection method between the N thermal management devices 130 and the substrate 110.

[0052] Exemplarily, the thermal management controller 120 is electrically connected to the thermal management device 130 via a wire. Exemplarily, the wire may be, for example, an electrical wire (e.g., a wire harness) or a printed circuit board (PCB) layout trace, etc., though this is not a limitation in the present embodiment. Because the thermal management controller 120 is disposed within the substrate 110, the length of the wire connecting the thermal management controller 120 and the thermal management device 130 is significantly shortened, saving costs.

[0053] For example, if the thermal management device 130 is a water valve, the thermal management controller 120 can be used to control the opening and closing of the interface of the water valve to achieve switching management of the water path.

[0054] For example, if the thermal management device 130 is a water pump, the thermal management controller 120 can be used to control the water pump to achieve driving of the water path and flow control to ensure the heat exchange efficiency of the system.

[0055] For example, if the thermal management device 130 is a cooler, the thermal management controller 120 may be configured to control the cooler to cool the fluid.

[0056] For example, if the thermal management device 130 is a condenser, the thermal management controller 120 may be used to control the condenser to convert gas into liquid and remove heat from the gas.

[0057] For example, if the thermal management device 130 is an electronic expansion valve, the thermal management controller 120 can be used to control the opening and closing of the electronic expansion valve. An electronic expansion valve uses an electrical signal generated by a regulated parameter to control the voltage or current applied to the electronic expansion valve, thereby controlling the flow of the refrigerant. When the electronic expansion valve is open, it can throttle and reduce pressure.

[0058] Exemplarily, the substrate 110 may be a water channel substrate (also referred to as a coolant substrate), a refrigerant substrate, or a combination of a water channel substrate and a refrigerant substrate. Exemplarily, a coolant flow channel (or coolant channel) is arranged in the water channel substrate. The coolant flow channel can replace the water pipes in the existing thermal management system. The refrigerant flow channel (or refrigerant channel) is arranged in the refrigerant substrate. The refrigerant flow channel can replace the air conditioning pipes in the existing thermal management system.

[0059] Exemplarily, the combination of the above-mentioned water channel substrate and the refrigerant substrate can be referred to as an integrated substrate. Exemplarily, in the integrated substrate, the refrigerant substrate and the water channel substrate can be combined together, for example, in a nested manner. For example, the refrigerant substrate is arranged on one side of the water channel substrate. The refrigerant substrate is provided with through holes corresponding to the interfaces provided on one side of the water channel substrate. The interfaces provided on one side of the water channel substrate pass through the respective corresponding through holes on the refrigerant substrate. Alternatively, exemplarily, the refrigerant substrate and the water channel substrate can also be combined together, for example, by welding, die-casting or forging, and the embodiments of the present application do not limit this.

[0060] In one possible implementation, the substrate 110 is, for example, a waterway substrate. In this case, the thermal management device 130 provided on the waterway substrate may include the water valve and the water pump. The thermal management controller 120, the water valve, and the water pump are provided on the same side of the waterway substrate. For ease of understanding, please refer to FIG4 for example. As can be seen in FIG4, the thickness of the waterway substrate is X, and the waterway substrate includes two sides (a first side and a second side). The thermal management controller 120, the water valve (for example, including a three-way valve and a nine-way valve, etc.), and the water pump (three are shown as an example) can be provided on the first side of the waterway substrate. It will be understood that FIG4 is merely an example, and the thermal management controller 120, the three-way valve, the nine-way valve, and the water pump shown in FIG4 are merely examples, and their shapes are only for differentiation. The embodiments of the present application do not limit the specific shapes and structures of these components. In addition, the positions and layouts of these components on the first side of the waterway substrate in FIG4 are merely illustrative. In a specific implementation, the specific positions and layouts can be set according to actual application needs, and the embodiments of the present application do not limit this. The shape of the waterway substrate shown in FIG4 is for illustration only, and the present embodiment does not limit the specific shape of the waterway substrate. In one possible implementation, the first side of the waterway substrate shown in FIG4 can be provided with more or fewer components, and the present embodiment does not limit this.

[0061] In one possible implementation, the substrate 110 is, for example, a refrigerant substrate. In this case, the thermal management device 130 disposed on the refrigerant substrate may include the cooler, condenser, and electronic expansion valve. The thermal management controller 120, the cooler, condenser, and electronic expansion valve are disposed on the same side of the refrigerant substrate. For ease of understanding, please refer to FIG5 for example. As shown in FIG5 , the thickness of the refrigerant substrate is X, and the refrigerant substrate includes two sides (a first side and a second side). The thermal management controller 120, the cooler, the condenser, and the electronic expansion valve may be disposed on the first side of the refrigerant substrate. It will be understood that FIG5 is merely an example, and the thermal management controller 120, the cooler, the condenser, and the electronic expansion valve depicted in FIG5 are merely examples, with their shapes serving only as distinctions. The embodiments of this application do not limit the specific shapes and structures of these components. Furthermore, the positions and layout of these components on the first side of the refrigerant substrate in FIG5 are merely illustrative. In a specific implementation, the specific positions and layouts may be determined based on actual application needs, and the embodiments of this application do not impose any restrictions on this. The shape of the refrigerant substrate shown in FIG5 is for illustration only, and the present embodiment does not impose any limitation on the specific shape of the refrigerant substrate. In one possible implementation, the first side of the refrigerant substrate shown in FIG5 may be provided with more or fewer components, such as a refrigerant container (e.g., a liquid storage tank), and the present embodiment does not impose any limitation on this.

[0062] In one possible implementation, the above-mentioned substrate 110 is, for example, the above-mentioned integrated substrate. Based on the above introduction, the integrated substrate is a combination of a waterway substrate and a refrigerant substrate. For ease of understanding, take the waterway substrate shown in Figure 4 and the refrigerant substrate shown in Figure 5 as examples. Then the integrated substrate can be, for example, a substrate obtained by connecting the second side of the waterway substrate shown in Figure 4 and the second side of the refrigerant substrate shown in Figure 5. The manner of connection can be referred to the above introduction to the integrated substrate and will not be repeated here. For example, if the substrate 110 is an integrated substrate, the above-mentioned thermal management controller 120 can be arranged on the waterway substrate (for example, as shown in Figure 4), or can be arranged on the refrigerant substrate (for example, as shown in Figure 5). The specific method can be determined according to the actual application, and the embodiment of the present application does not impose any restrictions on this.

[0063] In one possible implementation, a first flow channel is provided on the substrate 110. The first flow channel is used to circulate a fluid to dissipate heat from the thermal management controller 120. For example, the fluid flowing in the first flow channel may be a coolant or a refrigerant (in liquid or gaseous form). The following describes different scenarios.

[0064] In one possible embodiment, the substrate 110 is, for example, a water channel substrate. In this case, the first flow channel may be a coolant flow channel in the water channel substrate. For example, in one possible implementation, a second flow channel is provided in the thermal management controller 120. The second flow channel may be connected to the first flow channel. When the coolant flowing through the first flow channel flows through the second flow channel, the heat of the thermal management controller 120 may be exchanged to carry away the heat of the thermal management controller 120, thereby achieving liquid cooling of the thermal management controller 120. For ease of understanding, please refer to Figures 6 and 7 for example.

[0065] FIG6 takes the method in which the thermal management controller 120 shown in FIG3 is completely embedded in the substrate 110 (for example, a water channel substrate) as an example. As can be seen in FIG6, a first flow channel is provided in the water channel substrate, and a second flow channel is provided in the thermal management controller 120. After the thermal management controller 120 is embedded in the water channel substrate, the second flow channel is connected to the first flow channel. After being connected, the coolant in the first flow channel can flow through the second flow channel to dissipate heat for the thermal management controller 120. Specifically, as shown in FIG6, after the interface a of the second flow channel is connected to the interface c of the first flow channel, and the interface c of the second flow channel is connected to the interface d of the first flow channel, the second flow channel is connected to the first flow channel. Exemplarily, the interface a and the interface c can be connected by hot plate welding. Alternatively, the interface a and the interface c can be sealed by inserting the interface a into the interface c and then pressing the sealing ring. Alternatively, the interface a and the interface c can be integrally molded and shipped. The connection method between the interface b and the interface d is similar and will not be repeated. It will be understood that the connection method of the interface here is merely an example and does not constitute a limitation to the embodiments of the present application.

[0066] In another possible embodiment, the first flow channel, the second flow channel, and the connection method of the two flow channels can be shown in Figure 7. As can be seen, the second flow channel can be connected in series with the first flow channel. The specific connection method of the two flow channels can be referred to the above description and will not be repeated here.

[0067] It is understandable that the thermal management controller 120 is partially embedded in the implementation of the water channel substrate. The thermal management controller 120 can also be provided with a second flow channel communicating with the first flow channel in the water channel substrate, which will not be described in detail here.

[0068] Exemplarily, the second flow channel may be a metal cavity or a flow channel formed by a plastic tube, for example.

[0069] For example, in another possible implementation, the first flow channel can be disposed adjacent to the thermal management controller 120, so that when the coolant flows through the first flow channel, it can transfer heat away from the thermal management controller 120, thereby achieving liquid cooling of the thermal management controller 120. For easier understanding, please refer to Figures 8 and 9 for examples.

[0070] Figures 8 and 9 still use the method shown in Figure 3 above where the thermal management controller 120 is fully embedded in the substrate 110 (e.g., a water channel substrate) as an example. As can be seen in Figure 8, a first flow channel is provided in the water channel substrate, while a flow channel may not be provided in the thermal management controller 120. The first flow channel is provided adjacent to the thermal management controller 120. For example, the distance Z between the first flow channel and the thermal management controller 120 can be between 0 and 2 centimeters. As can be seen in Figure 9, the first flow channel is provided around the thermal management controller. For example, the distance between the first flow channel and the thermal management controller 120 in Figure 9 can also be between 0 and 2 centimeters. In Figures 8 and 9, since the first flow channel can be provided adjacent to the thermal management controller 120, the heat exchange efficiency between the thermal management controller and the coolant in the first flow channel can be improved, thereby effectively achieving heat dissipation of the thermal management controller 120. It is understandable that in the implementation scheme where the thermal management controller 120 is partially embedded in the water channel substrate, the first flow channel can also be provided adjacent to the thermal management controller 120, which will not be described in detail here.

[0071] In one possible implementation, the thermal management system includes thermal management devices and coolant flow channels disposed on the aforementioned water channel substrate. These thermal management devices and coolant flow channels may contribute to the passenger compartment thermal management circuit, battery cooling circuit, or electric drive cooling circuit within the thermal management system. Therefore, the aforementioned first flow channel may be a coolant flow channel within the passenger compartment thermal management circuit, battery cooling circuit, or electric drive cooling circuit. In other words, the thermal management circuit within the existing thermal management system can assist in heat dissipation by the thermal management controller 120, reducing the cost and volume of deploying additional cooling circuits.

[0072] In one possible embodiment, the substrate 110 is, for example, a refrigerant substrate. In this case, the first flow channel may be a refrigerant flow channel in the refrigerant substrate. Similarly, in one possible implementation, a second flow channel is provided in the thermal management controller 120. The second flow channel may be connected to the first flow channel. When the refrigerant flowing through the first flow channel flows through the second flow channel, it can exchange heat to take away the heat of the thermal management controller 120, so as to achieve liquid cooling of the thermal management controller 120. In another possible implementation, the first flow channel may be provided adjacent to the thermal management controller 120, so that when the refrigerant flows through the first flow channel, it can exchange heat to take away the heat of the thermal management controller 120, so as to achieve liquid cooling of the thermal management controller 120. The specific implementation can be exemplified by referring to the introduction of Figures 6 to 9 above, which will not be repeated here.

[0073] In one possible implementation, regardless of whether the thermal management controller 120 is provided with the second flow channel, the housing of the thermal management controller 120 can be made of a material such as plastic or carbon fiber composite. This reduces the weight of the housing and achieves a lightweight thermal management controller. Furthermore, in one possible embodiment, the housing of the thermal management controller 120 may not include heat dissipation teeth, further reducing the overall weight of the thermal management controller 120. For example, the housing of an existing thermal management controller is made of an aluminum alloy and provided with heat dissipation teeth, which is relatively heavy. This design facilitates heat dissipation from the thermal management controller. In the embodiments of the present application, heat dissipation from the thermal management controller 120 can be achieved through the aforementioned liquid cooling method. Therefore, the housing of the thermal management controller 120 does not need to be made of the heavier aluminum alloy. Instead, it can be made of a lighter material such as plastic or carbon fiber composite. Alternatively, the housing of the thermal management controller 120 may not include heat dissipation teeth, further reducing the overall weight of the thermal management controller 120.

[0074] In another possible implementation, even if the aforementioned liquid cooling method is used to dissipate heat from the thermal management controller 120, heat dissipation teeth may be provided on the housing of the thermal management controller 120 to enhance the heat dissipation function. Whether heat dissipation teeth are provided on the housing of the thermal management controller 120 in a specific implementation can be determined based on actual application requirements and is not limited in this embodiment of the present application.

[0075] In another possible implementation, when the thermal management controller 120 is cooled by the aforementioned liquid cooling method, the housing of the thermal management controller 120 can still be made of metal materials such as aluminum alloy, magnesium alloy, titanium alloy, steel, or iron. These metal materials can help the thermal management controller 120 dissipate heat naturally, and combined with the liquid cooling method, the heat dissipation efficiency of the thermal management controller 120 can be improved.

[0076] In summary, on the one hand, in the embodiment of the present application, the thermal management controller and the above-mentioned thermal management device are integrated with the substrate, which can improve the integration of the thermal management system, realize the integration, miniaturization and lightweight of the thermal management controller and the central integrated module (including the substrate and the thermal management device), and reduce the space occupied by vehicle components in the front cabin. On the second hand, in the embodiment of the present application, liquid cooling can be used to achieve efficient heat dissipation of the thermal management controller. In addition, the heat dissipation teeth of the thermal management control housing can be reduced or eliminated, and the housing material can be made of a lighter material, thereby reducing the weight of the thermal management controller as a whole and realizing the lightweighting of the thermal management controller. On the third hand, since the thermal management controller and the above-mentioned thermal management device are integrated together on the substrate, the length of the wire connecting the point between the thermal management controller and the thermal management device can be greatly shortened, saving costs.

[0077] The present application also provides a thermal management system, as shown in FIG10 . The thermal management system 1000 may include a thermal management component 1001. The thermal management component 1001 may be, for example, a thermal management component in any of the possible embodiments described above. For details, please refer to the aforementioned description and will not be repeated here.

[0078] The present application also provides a vehicle, as shown in FIG11 . Vehicle 1100 may include a thermal management component 1101 . Thermal management component 1101 may be, for example, any of the possible embodiments described above. For details, see the preceding description and are omitted here.

[0079] It should be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0080] It will also be understood that the term “comprise” (also known as “includes,” “including,” “comprises,” and / or “comprising”) when used in this specification specifies the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0081] It should also be understood that references throughout this specification to "one embodiment," "an embodiment," or "one possible implementation" mean that specific features, structures, or characteristics associated with that embodiment or implementation are included in at least one embodiment of the present application. Therefore, the appearance of "in one embodiment," "in an embodiment," or "one possible implementation" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermal management component, characterized in that: The thermal management component includes a substrate, a thermal management device and a thermal management controller; The thermal management device is arranged on the substrate, and the thermal management device includes one or more of the following: a water valve, a water pump, a cooler and a condenser; The thermal management controller is embedded in the substrate, and the thermal management controller is electrically connected to the thermal management device through a wire.

2. The thermal management component according to claim 1, characterized in that: The substrate is provided with a first flow channel, and the first flow channel is used for circulating fluid to dissipate heat for the thermal management controller.

3. The thermal management component according to claim 2, characterized in that: A second flow channel is provided in the thermal management controller, and the second flow channel is communicated with the first flow channel.

4. The thermal management component according to claim 3, characterized in that: The second flow channel is a flow channel formed by a tube or a cavity.

5. The thermal management component according to claim 2, characterized in that: The first flow channel is disposed adjacent to the thermal management controller.

6. The thermal management component according to any one of claims 2 to 5, characterized in that: The shell of the thermal management controller is a plastic shell or a metal shell without heat dissipation teeth.

7. The thermal management component according to any one of claims 2 to 6, characterized in that: The substrate comprises a water channel substrate, and the thermal management device arranged on the water channel substrate comprises the water valve and the water pump; The thermal management controller, the water valve and the water pump are arranged on the same side of the water channel substrate.

8. The thermal management component according to claim 7, characterized in that: The first flow channel belongs to a coolant flow channel in a target thermal management circuit in a thermal management system, the target thermal management circuit is a passenger compartment thermal management circuit, a battery cooling circuit or an electric drive cooling circuit, and the thermal management system includes the thermal management component.

9. The thermal management component according to claim 7 or 8, characterized in that: The substrate further includes a refrigerant substrate, and the thermal management device disposed on the refrigerant substrate includes a cooler and a condenser.

10. The thermal management component according to any one of claims 2 to 6, characterized in that: The substrate includes a refrigerant substrate, and the thermal management device disposed on the refrigerant substrate includes the cooler and the condenser; The thermal management controller, the cooler, and the condenser are arranged on the same side of the refrigerant substrate.

11. The thermal management component according to claim 10, characterized in that: The first flow channel belongs to the refrigerant flow channel in the refrigerant substrate.

12. The thermal management component according to any one of claims 1 to 11, characterized in that: The thermal management controller is partially embedded in the substrate, or the thermal management controller is fully embedded in the substrate.

13. The thermal management component according to any one of claims 1 to 12, characterized in that: The thermal management controller and the substrate are sealed by a sealing ring.

14. A thermal management system, characterized in that: The thermal management system comprises the thermal management component according to any one of claims 1-13.

15. A vehicle, characterized in that: The vehicle comprises the thermal management component according to any one of claims 1 to 13 , or the vehicle comprises the thermal management system according to claim 14 .

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