Display control method and electronic device

Abstract

The present application belongs to the technical field of communications. Disclosed are a display control method and an electronic device. The electronic device comprises a display structure and an image sensor chip, wherein the display structure comprises a substrate layer and a display panel layer which are arranged in a stacked mode, and the display structure further comprises a display chip; the display panel layer and the display chip are located on the same side of the substrate layer; the image sensor chip uses the substrate layer as a chip base, the image sensor chip and display chip are located on different sides of the substrate layer, and the image sensor chip is connected to the display chip by means of a signal line; and the signal line is used for transmitting image information between the image sensor chip and the display chip.

Description

Display control method and electronic device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on November 28, 2023, with application number 202311598221.9 and title “Display Control Method and Electronic Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application belongs to the field of communication technology, and specifically relates to a display control method and electronic equipment. Background Art

[0004] With the development of science and technology, the functions of electronic devices are becoming more and more perfect. Electronic devices are usually equipped with image sensor chips and display screens. After the electronic devices capture the real image through the image sensor chip, they transmit it to the main control chip, and then transmit it from the main control chip to the display screen of the electronic device. Since the transmission takes a long time, the display delay of the electronic device is relatively serious. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a display control method and an electronic device, which can solve the problem of severe display delay in electronic devices.

[0006] In a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a display structure and an image sensor chip, the display structure comprising: a stacked substrate layer and a display panel layer, the display structure further comprising a display chip;

[0007] Among them, the display panel layer and the display chip are located on the same side of the substrate layer, the image sensor chip uses the substrate layer as the chip base, and the image sensor chip and the display chip are located on different sides of the substrate layer. The image sensor chip and the display chip are connected through a signal line, and the signal line is used to transmit image information between the image sensor chip and the display chip.

[0008] In a second aspect, an embodiment of the present application provides a display control method, applied to the electronic device described in the first aspect, the method comprising:

[0009] Acquiring image information through the image sensor chip;

[0010] The image information is transmitted to the display structure through the signal line for display.

[0011] In a third aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the method described in the second aspect are implemented.

[0012] In a fourth aspect, an embodiment of the present application provides a chip, which includes a processor and a communication interface, the communication interface and the processor are coupled, and the processor is used to run programs or instructions to implement the method described in the second aspect.

[0013] In an embodiment of the present application, the electronic device includes a display structure and an image sensor chip. The display structure includes: a stacked substrate layer and a display panel layer, and the display structure also includes a display chip. The display panel layer and the display chip are located on the same side of the substrate layer. The image sensor chip uses the substrate layer as a chip base, and the image sensor chip and the display chip are located on different sides of the substrate layer. The image sensor chip and the display chip are connected via signal lines, and the signal lines are used to transmit image information between the image sensor chip and the display chip. In this way, image information is directly transmitted via the signal lines between the image sensor chip and the display chip, without having to transmit the image information through the main control chip, which can reduce transmission time and display delay. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG1 is a schematic diagram of a structure of an electronic device provided in an embodiment of the present application;

[0015] FIG2 is a second structural diagram of an electronic device provided in an embodiment of the present application;

[0016] FIG3 is a third structural diagram of an electronic device provided in an embodiment of the present application;

[0017] FIG4 is a fourth structural diagram of an electronic device provided in an embodiment of the present application;

[0018] FIG5 is a schematic diagram of a structure of an MR device provided by the related art;

[0019] FIG6 is a second structural diagram of an MR device provided by the related art;

[0020] FIG7 is a schematic structural diagram of an image sensor chip provided in an embodiment of the present application;

[0021] FIG8 is a schematic structural diagram of a display structure provided in an embodiment of the present application;

[0022] FIG9 is a schematic diagram of a usage scenario of an MR device provided in an embodiment of the present application;

[0023] FIG10 is a flowchart of a display control method provided in an embodiment of the present application. Specific embodiments

[0024] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0026] In the description of the present application, it should be understood that the terms "length", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0027] In the description of this application, it should be noted that, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, it can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean internal communication between two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood by those skilled in the art in specific circumstances.

[0028] The display control method and electronic device provided in the embodiments of the present application are described in detail below with reference to specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0029] As shown in FIG1 to FIG4 , an embodiment of the present application provides an electronic device, the electronic device including a display structure 10 and an image sensor chip 20 . The display structure 10 includes: a substrate layer 11 and a display panel layer 12 that are stacked, and the display structure 10 also includes a display chip 13 .

[0030] Among them, the display panel layer 12 and the display chip 13 are located on the same side of the substrate layer 11, the image sensor chip 20 uses the substrate layer 11 as the chip base, and the image sensor chip 20 and the display chip 13 are located on different sides of the substrate layer 11. The image sensor chip 20 and the display chip 13 are connected through a signal line 30, and the signal line 30 is used to transmit image information between the image sensor chip 20 and the display chip 13.

[0031] It should be noted that the image sensor chip 20 and the display chip 13 are directly connected via a signal line 30 .

[0032] The display chip 13 may use the substrate layer 11 as a chip base.

[0033] The signal line 30 may be provided through the substrate layer 11 . Specifically, a via hole 111 may be provided on the substrate layer 11 . The signal line 30 passes through the via hole 111 to connect the image sensor chip 20 and the display chip 13 .

[0034] The image sensor chip 20 is connected to the display chip 13 via a signal line 30 . One end of the signal line 30 may be connected to the image sensor chip 20 , and the other end of the signal line 30 may be connected to the display chip 13 .

[0035] In one embodiment, as shown in Figures 2 to 4, the image sensor chip 20 includes an image sensor core module, an image signal processing (ISP) module, and an image interface module, and the display chip 13 includes a display digital-to-analog conversion module, a display numerical control module, and a display interface module. Any one of the image sensor core module, the image signal processing module, and the image interface module is connected to any one of the display digital-to-analog conversion module, the display numerical control module, and the display interface module via a signal line 30.

[0036] It should be noted that the image sensor chip 20 and the display structure 10 may share the substrate layer 11 , that is, the substrate layer 11 serves as both the base of the image sensor chip 20 and the base of the display structure 10 .

[0037] The image sensor chip 20 may be a complementary metal oxide semiconductor image sensor (CMOS image sensor, CIS) chip for a camera, or other types of image sensor chips, which are not limited in this embodiment. The image sensor chip 20 may also be described as a camera chip.

[0038] The display structure 10 may be an OLED display structure or a LED display screen structure.

[0039] It should be noted that the image sensor chip 20 and the display structure 10 share the substrate layer 11 , thereby enabling an integrated design of the image sensor chip 20 and the display structure 10 .

[0040] It should be noted that a signal compatibility module can be added to the display structure 10 or the image sensor chip 20 to solve the signal timing or compatibility problems that may be introduced by direct transmission of image signals between different modules, thereby achieving high-speed and delay-free video recording and transmission.

[0041] It should be noted that the image sensor chip 20 and the display structure 10 are directly fabricated on both sides of the substrate layer, leaving more space for arranging various compatible processing modules, thereby increasing the transmission speed.

[0042] It should be noted that a hole can be directly opened on the substrate layer (such as silicon base) at the bottom of the image sensor chip 20, and the signal line 30 passes through the hole. The image signal is directly transmitted to the position of the corresponding module of the display chip 13 through the signal line 30, realizing high-speed connection signal transmission.

[0043] As shown in FIG1 , the electronic device may further include a flexible printed circuit (FPC) 40 and a connector 50 for connecting to a main control chip. The main control chip may be a system on chip (SOC) chip. The SOC chip may be the main control chip of a mobile phone or a mixed reality (MR) device, such as a Qualcomm 888 chip or a MediaTek DX-1 chip.

[0044] It should be noted that virtual reality (VR), also known as virtual reality or virtual reality technology, is a brand-new practical technology developed in the 20th century. VR technology encompasses computer, electronic information, and simulation technologies. Its fundamental implementation is primarily computer-based, utilizing and integrating the latest advances in high-tech technologies such as 3D graphics, multimedia, simulation, display, and servo technology. Using computers and other devices, it creates a realistic 3D virtual world with multiple sensory experiences, including visual, tactile, and olfactory experiences. This creates an immersive experience for those in the virtual world. With the continuous development of social productivity and science and technology, the demand for VR technology is growing rapidly across all industries. VR technology has also made significant progress and is gradually becoming a new field of science and technology.

[0045] MR is a further development of virtual reality. By introducing real-world scene information into a virtual environment, this technology establishes an interactive feedback loop between the virtual and real worlds and the user, enhancing the realism of the user experience. Mixed reality is a combination of technologies that not only offers new viewing methods but also new input methods. These methods, when combined, drive innovation.

[0046] In related technologies, to implement MR technology, as shown in Figures 5 and 6, MR devices require multiple cameras and displays. The cameras capture real-world images, transmit them to a main control chip, and then transmit them from the main control chip to the MR display. This transmission process takes time and introduces a certain amount of latency, resulting in a poor user experience. Furthermore, the large number of cameras increases costs.

[0047] The embodiment of the present application provides a signal transmission method for a display camera module that integrates a display and a camera. The method combines the camera's complementary metal oxide semiconductor image sensor (CMOS image sensor, CIS) chip with a silicon-based organic light-emitting diode (OLED) or light-emitting diode (LED) display screen. The image signal captured by the camera is directly transmitted to the internal module of the display chip for processing and display, skipping the main control chip. This improves the transmission and display speed, achieves the lowest latency, and realizes synchronization between the MR device and the outside world. In addition, in terms of physical transmission, the camera and the display structure 10 share a wafer chip. The CIS of the shared camera has a larger area, wider accuracy and range, which can reduce the number of cameras and the number of wafers, thereby reducing costs.

[0048] In an embodiment of the present application, the electronic device includes: a substrate layer 11, the substrate layer 11 including a first side and a second side facing each other; an image sensor chip 20, the image sensor chip 20 including the image sensor chip 20 disposed on the first side; and a display structure 10, the display structure 10 including a display chip 13 disposed on the second side, the substrate being formed of both the substrate and the substrate of the display chip 13. The image sensor chip 20 and the display chip 13 are connected via a signal line 30, which is used to transmit image information between the image sensor chip 20 and the display chip 13. Thus, image information is directly transmitted via the signal line 30 between the image sensor chip 20 and the display chip 13, without having to pass through a main control chip, thereby reducing transmission time and display latency.

[0049] Optionally, as shown in FIG2 to FIG4 , the image sensor chip 20 includes an image sensor core module, an image signal processing module and an image interface module, and the image sensor core module is connected to the image interface module via the image signal processing module;

[0050] The image sensor chip 20 is connected to the display chip 13 via at least one of the image sensor core module, the image signal processing module, and the image interface module.

[0051] The image sensor core module includes an image array submodule and an analog-to-digital converter (ADC) submodule. The image interface module includes a first-in-first-out (FIFO) submodule and a mobile industry processor interface (MIPI) submodule. The image array submodule can also be described as an image sensing array submodule. The ADC submodule is a module that converts continuous variable analog signals into discrete digital signals. The image interface module is an interface module for the image sensor chip 20. The FIFO submodule is a memory module used for asynchronous data transmission.

[0052] In this embodiment, the image sensor chip 20 includes an image sensor core module, an image signal processing module, and an image interface module. The image sensor core module is connected to the image interface module via the image signal processing module. Furthermore, the image sensor chip 20 is connected to the display chip 13 via at least one of the image sensor core module, the image signal processing module, and the image interface module. Thus, at least one of the image sensor core module, the image signal processing module, and the image interface module is connected to the display chip 13 via the signal line 30. Image information is transmitted between the at least one of the image sensor core module, the image signal processing module, and the image interface module and the display chip 13, further reducing transmission time and display latency.

[0053] Optionally, as shown in FIG2 to FIG4 , the display chip 13 includes a display digital-to-analog conversion (Display DAC) module, a display numerical control module, and a display interface module, and the display digital-to-analog conversion module is connected to the display interface module via the display numerical control module;

[0054] The display chip 13 is connected to the image sensor chip 20 via at least one of the display digital-to-analog conversion module, the display digital control module, and the display interface module.

[0055] Among them, the image sensor core module can be connected to the display digital-to-analog conversion module through the signal line 30; or the image sensor core module can be connected to the display numerical control module through the signal line 30; or the image sensor core module can be connected to the display interface module through the signal line 30; or the image signal processing module can be connected to the display digital-to-analog conversion module through the signal line 30; or the image signal processing module can be connected to the display numerical control module through the signal line 30; or the image signal processing module can be connected to the display interface module through the signal line 30; or the image interface module can be connected to the display digital-to-analog conversion module through the signal line 30; or the image interface module can be connected to the display numerical control module through the signal line 30; or the image interface module can be connected to the display interface module through the signal line 30; and so on. This embodiment does not limit the specific implementation of the connection between the image sensor chip 20 and the display chip 13 through the signal line 30.

[0056] The display value control module may include a random access memory (RAM) submodule. The display interface module may include a MIPI submodule, which is an interface module for the display chip 13. The RAM submodule is a fast storage and random access memory module. The display digital-to-analog conversion module is a module that converts digital signals into analog signals.

[0057] In this embodiment, the display chip 13 includes a display digital-to-analog conversion module, a display numerical control module, and a display interface module. The display digital-to-analog conversion module is connected to the display interface module via the display numerical control module. Furthermore, the display chip 13 is connected to the image sensor chip 20 via at least one of the display digital-to-analog conversion module, the display numerical control module, and the display interface module. Thus, at least one of the display digital-to-analog conversion module, the display numerical control module, and the display interface module is connected to the image sensor chip 20 via the signal line 30. Image information is transmitted between at least one of the display digital-to-analog conversion module, the display numerical control module, and the display interface module and the image sensor chip 20, further reducing transmission time and display latency.

[0058] Optionally, as shown in FIG2 , the image signal processing module and the display value control module are connected via the signal line 30 ;

[0059] The image signal processing module is used to process the image information output by the image sensor core module and transmit the processed image information to the display value control module through the signal line 30;

[0060] The display numerical control module is used to transmit the processed image information to a display panel (Display panel) for display through the display digital-to-analog conversion module.

[0061] The image array submodule in the image sensor core module collects image information, processes the collected image information through the ADC submodule, and transmits the processed information to the image signal processing module.

[0062] In addition, the image signal processing module can be in communication connection with the main control chip, and the main control chip outputs an enable signal (ES) to control the image signal processing module to transmit image information to the display value control module.

[0063] It should be noted that the display digital-to-analog conversion module outputs a source signal to the display panel for display.

[0064] In one embodiment, the captured image signal, after passing through the ISP, is directly transmitted from the image sensor chip 20 to the numerical control module RAM storage module of the display chip 13 for direct display. The main control chip can be enabled in real-time transmission mode, in which case the main control chip will not transmit to the display chip 13. The main control chip can also add an ES output control ISP module to directly transmit the signal to the display numerical control module. The camera can also simultaneously transmit image information to the main control chip, which stores it, but does not output it to the display chip 13.

[0065] In this embodiment, the image signal processing module and the display numerical control module are connected via the signal line 30. The image signal processing module processes the image information output by the image sensor core module and transmits the processed image information to the display numerical control module via the signal line 30. The display numerical control module then transmits the processed image information to the display panel via the display digital-to-analog conversion module for display. Thus, image information is transmitted between the image signal processing module and the display numerical control module via the signal line 30, eliminating the need for the image information to be transmitted through the image interface module, main control chip, and display interface module, further reducing transmission time and display latency. Furthermore, the image information is processed by the image signal processing module, resulting in a better display effect. Furthermore, the display numerical control module controls the transmission and display of the image information, facilitating display control.

[0066] Optionally, as shown in FIG3 , the image sensor core module is connected to the display digital-to-analog conversion module via the signal line 30 ;

[0067] The image sensor core module is used to collect image information and transmit the collected image information to the display digital-to-analog conversion module through the signal line 30;

[0068] The display digital-to-analog conversion module is used to transmit the collected image information to the display panel for display.

[0069] Among them, the image array submodule in the image sensor core module collects image information, processes the collected image information through the ADC submodule, and transmits it to the display digital-to-analog conversion module through signal line 30. The display digital-to-analog conversion module transmits the image information output by the ADC submodule to the display panel for display.

[0070] In addition, the image sensor core module may be in communication connection with a main control chip, and the main control chip outputs an enable signal to control the image sensor core module to transmit image information to the display digital-to-analog conversion module.

[0071] In one embodiment, the ADC module of the image sensor chip 20 transmits image signals to the DAC module of the display chip 13. The main control chip can be enabled in real-time transmission mode, in which case the main control chip will not transmit to the display chip 13. The main control chip can also add an ES output control ADC module to directly transmit signals to the display DAC module. The camera can also simultaneously transmit image information to the main control chip, which stores it, but does not output it to the display chip 13.

[0072] In this embodiment, the image sensor core module and the display digital-to-analog conversion module are connected via signal line 30. The image sensor core module is configured to capture image information and transmit the captured image information to the display digital-to-analog conversion module via signal line 30. The display digital-to-analog conversion module is configured to transmit the captured image information to the display panel for display. Thus, image information is transmitted between the image sensor core module and the display digital-to-analog conversion module via signal line 30, eliminating the need for image information to pass through the image signal processing module, image interface module, main control chip, display numerical control module, and display interface module, further reducing transmission time and display latency.

[0073] Optionally, as shown in FIG4 , the image interface module and the display interface module are connected via the signal line 30 ;

[0074] The image interface module is used to transmit the image information output by the image signal processing module to the display interface module through the signal line 30;

[0075] The display interface module is used to transmit the image information transmitted by the image interface module to the display panel for display through the display value control module and the display digital-to-analog conversion module.

[0076] The image array submodule in the image sensor core module collects image information, processes the collected image information through the ADC submodule, and transmits it to the image signal processing module; the image signal processing module processes the image information and outputs the processed image information to the FIFO submodule of the image interface module; the FIFO submodule transmits the image information to the display interface module; the display interface module transmits the image information transmitted by the image interface module to the display numerical control module; the display numerical control module stores the image information and controls the image information to be output to the display digital-to-analog conversion module for processing; the display digital-to-analog conversion module transmits the processed image information to the display panel for display.

[0077] In addition, the image interface module may be in communication connection with a main control chip, and the main control chip outputs an enable signal to control the image interface module to transmit image information to the display interface module.

[0078] In one embodiment, the camera's FIFO submodule transmits image signals to the MIPI submodule of the display chip 13. The main control chip can be enabled in real-time transmission mode, in which case the main control chip will not transmit to the display chip 13. The main control chip adds an ES output control FIFO submodule to directly transmit signals to the MIPI submodule of the display chip 13. The camera can also simultaneously transmit image information to the main control chip, which stores it, but does not output it to the display chip 13.

[0079] It should be noted that the display chip 13 receives the digital signal from the camera chip and directly converts it into an analog signal for display. The chip needs to keep the frame rate synchronized. If it is not synchronized, the camera's ADC can be transferred to the display RAM for storage, and then displayed after the queue signal is processed.

[0080] In this embodiment, the image interface module and the display interface module are connected via the signal line 30. The image interface module is configured to transmit the image information output by the image signal processing module to the display interface module via the signal line 30. The display interface module is configured to transmit the image information transmitted by the image interface module to the display panel via the display numerical control module and the display digital-to-analog conversion module for display. Thus, by transmitting image information between the image interface module and the display interface module via the signal line 30, the transmission of image information does not need to pass through the main control chip, further reducing transmission time and display latency. Furthermore, the image information is processed by the image signal processing module, achieving a better display effect. The transmission and display of the image information is controlled by the display numerical control module, facilitating display control. Furthermore, the provision of the signal line 30 between the image interface module and the display interface module simplifies hardware implementation.

[0081] Optionally, as shown in FIG. 2 to FIG. 4 , the display panel layer 12 is connected to the display digital-to-analog conversion module.

[0082] In this embodiment, the display panel layer is connected to the display digital-to-analog conversion module, and the display panel layer is disposed on the substrate layer 11 , so as to facilitate the integration of the camera module and the display module.

[0083] Optionally, as shown in FIG. 1 , the substrate layer 11 is provided with a via 111 , and the signal line 30 passes through the via 111 to be connected to the image sensor chip 20 and the display chip 13 respectively.

[0084] In this embodiment, the substrate layer 11 is provided with a via 111 , and the signal line 30 passes through the via 111 to be connected to the image sensor chip 20 and the display chip 13 , respectively, thereby enabling the design of a shorter signal line 30 .

[0085] Optionally, the electronic device further includes a main control chip, which is connected to the image sensor chip 20 , and is used to control the image sensor chip 20 to output image information to the display chip 13 through the signal line 30 .

[0086] The main control chip can be connected to the image sensor chip 20 via an enable signal (ES) line. The main control chip outputs an enable signal via the ES line to control the image sensor chip 20 to output image information to the display chip 13 via a signal line 30 .

[0087] In addition, when the image signal processing module is connected to the display numerical control module through the signal line 30, the main control chip is connected to the image signal processing module through the ES line; or, when the image sensor core module is connected to the display digital-to-analog conversion module through the signal line 30, the main control chip is connected to the image sensor core module through the ES line; or, when the image interface module is connected to the display interface module through the signal line 30, the main control chip is connected to the image interface module through the ES line.

[0088] It should be noted that the main control chip can be connected to the image interface module of the image sensor chip 20 and the display interface module of the display chip 13 respectively.

[0089] In this embodiment, the electronic device further includes a main control chip, which is connected to the image sensor chip 20. The main control chip is used to control the image sensor chip 20 to output image information to the display chip 13 through the signal line 30, thereby enabling image information transmission through the main control chip.

[0090] Optionally, the electronic device is mixed reality MR glasses.

[0091] In related technologies, the signal transmission method within MR devices is: camera analog signal > analog-to-digital conversion > digital signal > MIPI transmission to the SOC, which stores and sends it to the display > MIPI > display IC > digital signal processing > digital-to-analog conversion > analog signal output to the display, which then displays the image. When using MR devices to talk or meet with people, signal transmission time causes a delay, resulting in a delay between the image seen in MR and the real world, affecting the user's MR experience.

[0092] The present invention provides a signal transmission method that enhances real-time MR transmission, enabling fast and minimally delayed signal transmission. The backside of a silicon-based display screen serves as the substrate for a camera chip, with the display structure 10 and the camera sharing a single silicon-based wafer. Camera data can be directly transmitted to the display screen for display, minimizing latency.

[0093] In the embodiment of the present application, the display chip 13 and the image sensor chip 20 share a silicon-based wafer, and an additional signal path is added for transmitting the real-time camera signal to the display chip 13. When MR transmits the external environment image in real time, the signal transmission time is reduced, thereby improving the user's MR usage experience.

[0094] As a specific embodiment, taking the substrate layer 11 as a silicon-based wafer as an example, the electronic device of the embodiment of the present application includes a silicon-based wafer, a CIS for a camera is disposed on one side of the silicon-based wafer, and a display is disposed on the other side of the silicon-based wafer. The display can be a silicon-based organic OLED or a silicon-based micro-LED, i.e., an inorganic LED. The image sensor chip 20 and the display structure 10 share the same silicon-based wafer. The camera signal can be directly transmitted to the display panel for display via a signal line 30 passing through a silicon-based via.

[0095] In addition, the image sensor chip 20 and display structure 10 in the electronic device of the present invention can share a connector to transmit data to the CPU of the MR device. The display chip 13 and the display pixel driver circuit of the display screen can both be arranged on a silicon-based wafer, rather than as a separate display IC.

[0096] For example, as shown in FIG7 , from bottom to top, the image sensor chip 20 may include: a substrate layer 11 (bulk silicon), metal leads, a photodiode, a filter array, and a microlens.

[0097] In addition, the display panel layer may include: an anode electrode, an organic electro-luminescence (EL) layer, a cathode electrode, a protective film, an on-chip color filter (OCCF), a microlens, a resin layer, and a glass cover.

[0098] For example, as shown in FIG8 , from bottom to top, the display structure 10 may include: a substrate layer 11 (such as a silicon substrate), an anode electrode, an organic EL layer, a cathode electrode, a protective film, an OCCF, a microlens, a resin layer and a glass cover, etc.

[0099] For example, as shown in FIG9 , the image sensor chip 20 performs image capture, and the human eye views the image captured by the image sensor chip 20 through the display structure 10 .

[0100] Through the embodiments of the present application, a display screen and camera integrated module can be realized, which reduces the delay from MR imaging to display, improves the user's MR usage experience through low-latency real-time transmission, and reduces costs by reducing the number of wafers.

[0101] It should be noted that the electronic device of the embodiment of the present application can be used not only by MR devices, but also by all devices that require low latency, such as devices used for real-time camera and display during driving of a car.

[0102] As shown in FIG10 , an embodiment of the present application further provides a display control method, which is applied to the electronic device described in the embodiment of the present application. The method includes:

[0103] Step 101: Acquire image information through the image sensor chip 20;

[0104] Step 102: Transmit the image information to the display structure 10 via the signal line 30 for display.

[0105] In the embodiment of the present application, image information is acquired by the image sensor chip 20 and transmitted to the display structure 10 for display via the signal line 30. Direct transmission of image information via the signal line 30 between the image sensor chip 20 and the display structure 10 eliminates the need for transmission via the main control chip, thereby reducing transmission time and display latency.

[0106] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0107] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising a display structure and an image sensor chip, wherein the display structure comprises: A substrate layer and a display panel layer are stacked, and the display structure also includes a display chip; Among them, the display panel layer and the display chip are located on the same side of the substrate layer, the image sensor chip uses the substrate layer as the chip base, and the image sensor chip and the display chip are located on different sides of the substrate layer, the image sensor chip and the display chip are connected through a signal line, and the signal line is used to transmit image information between the image sensor chip and the display chip.

2. The electronic device according to claim 1, wherein: The image sensor chip comprises an image sensor core module, an image signal processing module and an image interface module, and the image sensor core module is connected to the image interface module through the image signal processing module; The image sensor chip is connected to the display chip via at least one of the image sensor core module, the image signal processing module and the image interface module.

3. The electronic device according to claim 2, wherein: The display chip includes a display digital-to-analog conversion module, a display numerical control module and a display interface module, and the display digital-to-analog conversion module is connected to the display interface module through the display numerical control module; Wherein, the display chip is connected to the image sensor chip through at least one of the display digital-to-analog conversion module, the display numerical control module and the display interface module.

4. The electronic device according to claim 3, wherein: The image signal processing module is connected to the display value control module via the signal line; The image signal processing module is used to process the image information output by the image sensor core module, and transmit the processed image information to the display value control module through the signal line; The display numerical control module is used to transmit the processed image information to the display panel for display through the display digital-to-analog conversion module.

5. The electronic device according to claim 3, wherein: The image sensor core module is connected to the display digital-to-analog conversion module via the signal line; Wherein, the image sensor core module is used to collect image information, and transmit the collected image information to the display digital-to-analog conversion module through the signal line; The display digital-to-analog conversion module is used to transmit the collected image information to the display panel for display.

6. The electronic device according to claim 3, wherein: The image interface module is connected to the display interface module via the signal line; Wherein, the image interface module is used to transmit the image information output by the image signal processing module to the display interface module through the signal line; The display interface module is used to transmit the image information transmitted by the image interface module to the display panel for display through the display value control module and the display digital-to-analog conversion module.

7. The electronic device according to any one of claims 3 to 6, wherein: The display panel layer is connected to the display digital-to-analog conversion module.

8. The electronic device according to any one of claims 1 to 6, wherein: The substrate layer is provided with vias, and the signal lines pass through the vias and are respectively connected to the image sensor chip and the display chip.

9. The electronic device according to claim 1, characterized in that: The electronic device further comprises a main control chip, wherein the main control chip is connected to the image sensor chip, and the main control chip is used to control the image sensor chip to output image information to the display chip through the signal line.

10. The electronic device according to claim 1, wherein: The electronic device is mixed reality MR glasses.

11. A display control method, applied to the electronic device according to any one of claims 1 to 10, the method comprising: Acquiring image information through the image sensor chip; The image information is transmitted to the display structure through the signal line for display.

12. A readable storage medium storing a program or an instruction, wherein the program or the instruction, when executed by a processor, implements the steps of the display control method according to claim 11.

13. A chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the steps of the display control method according to claim 11.

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