Use of a trifunctional epoxy compound in order to improve properties of a chemical wall plug

Abstract

The invention relates to an epoxy resin mixture for epoxy / amine systems for fastening purposes and describes the use of at least one trifunctional epoxy compound as reactive diluent in a chemical wall plug. The at least one trifunctional epoxy compound is selected from the group consisting of trifunctional epoxy compounds with an epoxy equivalent weight (EEW) of less than 130 g / eq and any mixtures of two or more thereof. Through this specific trifunctional epoxy compound, the failure load of a chemical wall plug at a substrate temperature of approximately 30°C to approximately 90°C is reduced compared to a chemical wall plug which contains monofunctional or difunctional reactive diluents, or trifunctional reactive diluents with an EEW of at least 130 g / eq.

Description

[0001] Use of a trifunctional epoxy compound to improve the properties of a chemical anchor

[0002] DESCRIPTION

[0003] The present invention relates to the use of at least one trifunctional epoxy compound as a reactive diluent in a chemical anchor. The at least one trifunctional epoxy compound is selected from the group consisting of trifunctional epoxy compounds with an epoxy equivalent weight (EEW) of less than or equal to 130 g / eq and any mixtures of two or more thereof. This specific trifunctional epoxy compound increases the failure load of a chemical anchor at a substrate temperature of approximately 30°C to approximately 90°C compared to a chemical anchor containing the same proportion of a trifunctional reactive diluent from an alternative synthesis route and thus with an EEW of greater than 130 g / eq.

[0004] The present invention further relates to a multi-component fixing mortar system comprising an epoxy resin component (A) containing at least one curable epoxy resin and the at least one trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq as a reactive diluent, and a hardener component (B) containing at least one amine reactive toward epoxy groups, as well as its use for fixing anchoring elements. The present invention further relates to a method for fixing an anchoring element in a hole or gap in a building substrate using the multi-component fixing mortar system.

[0005] Furthermore, the present invention relates to the use of a combination of (i) at least one epoxy resin selected from the group consisting of bisphenyl A diglycidyl ether, bisphenol F diglycidyl ether and novolak epoxy resin and mixtures thereof and (ii) one or a mixture of trifunctional epoxy compounds as reactive diluents with an epoxy equivalent weight (EEW) of less than 130 g / eq as a resin component of a multi-component fixing mortar system for increasing the bond stress, in particular at elevated temperature of a chemical anchor at a substrate temperature of about 30°C to about 90°C compared to a chemical anchor which contains this trifunctional epoxy compound from an alternative synthesis route and thereby with an EEW of greater than 130 g / eq.

[0006] Multi-component adhesives and mortar systems are frequently used in construction applications. Such systems often consist of one component containing a mixture of various epoxies and an amine hardener as part of a second component. After mixing and curing, the system produces a highly cross-linked polymer.

[0007] One application of such multi-component systems is as chemical anchors, in which an anchor rod or reinforcing iron is fixed to a substrate such as concrete, masonry, or wood. Very rigid systems are required for this application. This rigidity is achieved in the first component by epoxies containing aromatic base structures, such as bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, and / or epoxy-modified novolaks. To facilitate processing, reactive diluents are usually added to reduce the viscosity and improve miscibility with the hardener component. The viscosity of a reactive diluent must therefore be lower than that of the epoxy resin to be diluted, and it must contain groups that lead to a reaction with the hardener.When using bisphenol A diglycidyl ether and bisphenol F diglycidyl ether, the reactive diluent should have a viscosity of less than 2000 mPas, preferably less than 1000 mPas, and particularly preferably less than 800 mPas. Difunctional and sometimes also trifunctional reactive diluents, as described in EP 1118628 A1, are typically added. Trifunctional reactive diluents alone are generally not used, as their diluting effect is significantly lower than that of difunctional diluents.

[0008] A disadvantage of using difunctional and non-reactive thinners is that they do not increase the degree of crosslinking of the polymer compared to the aromatic base structure. This also does not increase the stiffness of the polymer, but at best remains at the same level. The same applies to the glass transition temperature of systems based on epoxy resin mixtures with difunctional and non-reactive thinners. The addition of these thinners generally leads to a lower glass transition temperature compared to epoxies with purely aromatic base structures. This leads to a reduction in bond stress, especially at elevated temperatures.

[0009] Chemical anchors typically cure at the intended location at the ambient temperatures prevailing in the subsurface. Since chemical anchors are typically used in construction, the ambient temperatures correspond to the outside temperatures. These typically range from approximately -10°C to approximately 60°C. Depending on solar radiation and other influences, significantly higher temperatures are possible in the subsurface, for example, from approximately 40°C to approximately 90°C.

[0010] The mechanical properties of chemical anchors can be affected by the ambient temperature. For example, a drop in temperature during the curing reaction can lead to a significant reduction in the load-bearing capacity of the subsequently cured chemical anchor. On the other hand, an increase in temperature after the chemical anchor has cured can also lead to a significant reduction in the load-bearing capacity of the chemical anchor.

[0011] The chemical anchor is also repeatedly exposed to fluctuating temperatures throughout its service life. In particular, elevated temperatures over a prolonged period can impair the load-bearing capacity of a chemical anchor. Even significantly fluctuating short-term substrate temperatures, but especially long-term elevated substrate temperatures, can have an adverse effect on the material properties of a chemical anchor during its service life.

[0012] In particular, so-called "creep," or deformation of a chemical anchor, occurs more frequently. At elevated substrate temperatures of approximately 30°C to approximately 90°C, a chemical anchor can slowly move or become permanently deformed within a period of just a few hours under the influence of sustained mechanical stresses, such as permanent loads. The load-bearing capacity is thus reduced.

[0013] Since buildings in different climate zones are exposed to significant temperature fluctuations, it is advantageous if the rigidity of the mortar anchorage remains consistently high over a wide temperature range. With increasing global warming, higher ambient temperatures in the subsurface due to strong solar radiation can be expected in the future, even in zones with previously temperate climates. This can cause the subsurface to heat up to a subsurface temperature of approximately 40°C or higher, depending on the outside temperature and weather conditions. Multi-component resin systems described in the state of the art often prove unable to meet these challenges.

[0014] To counteract the creep tendency of chemical anchors, the development of new multi-component resin systems for use at elevated temperatures, particularly from approximately 30°C to approximately 90°C, is desirable. Epoxy-amine systems with a high glass transition temperature are therefore preferred. An elevated glass transition temperature generally leads to higher bond stresses in anchor pullout tests at temperatures above room temperature.

[0015] There is therefore a need for fixing mortars that have higher bond strength after curing at higher temperatures.

[0016] An object underlying the invention is therefore to provide a multi-component fixing mortar system which, when used as a chemical anchor, exhibits improved creep behavior of the cured mortar at an elevated substrate temperature, such as from about 30°C to about 90°C.

[0017] A further object underlying the invention is to provide a multi-component fixing mortar system for a chemical anchor that, after curing, has a high compressive strength and thus a higher bond stress compared to a chemical anchor that contains a lower proportion of the at least one trifunctional epoxy compound or does not contain the at least one trifunctional epoxy compound. A further object underlying the invention is to provide a multi-component fixing mortar system for a chemical anchor that has a high glass transition temperature after post-curing, for example, up to approximately 90°C for the amine VestaminO TMD.

[0018] The objects underlying the invention are achieved by the uses defined in the independent claims. Preferred embodiments of the invention are defined in the dependent claims, whose features can be freely combined with one another unless otherwise stated.

[0019] A first aspect of the invention is the use of at least one trifunctional epoxy compound having an epoxy equivalent weight (EEW) of less than 130 g / eq to increase the failure load of a cured chemical anchor at a substrate temperature of about 30°C to about 90°C compared to a chemical anchor containing a trifunctional epoxy compound having an EEW of greater than 130 g / eq. The cured chemical anchor was produced by mixing the components (A) and (B) of a multi-component fixing mortar system and subsequent curing, wherein the multi-component fixing mortar system consists of: an epoxy resin component (A) comprising at least one curable epoxy resin and the tri-functional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq as reactive diluent, and a hardener component (B) comprising at least one amine reactive towards epoxy groups.According to the invention, the proportion of the at least one trifunctional epoxy compound is about 5 wt.% to about 30 wt.%, based on the curable epoxy resin component.

[0020] A second object of the invention is the use of at least one trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq as a reactive diluent for increasing the bond stress of the cured mortar at a substrate temperature of about 30°C to about 90°C compared to a chemical anchor of similar viscosity with a lower or no proportion of the at least one trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq.The cured chemical anchor was produced by mixing components (A) and (B) of a multi-component fixing mortar system and subsequent curing. The multi-component fixing mortar system consists of: an epoxy resin component (A) comprising at least one curable epoxy resin and the trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq as a reactive diluent, and a hardener component (B) comprising at least one amine reactive toward epoxy groups. The proportion of the at least one trifunctional epoxy compound is from approximately 5 wt.% to approximately 30 wt.%, based on the at least one curable epoxy resin.

[0021] A third aspect of the invention is a multi-component fixing mortar system comprising an epoxy resin component (A) containing at least one curable epoxy resin and at least one trifunctional epoxy compound as a reactive diluent, and a hardener component (B) containing at least one amine reactive toward epoxy groups, wherein the trifunctional epoxy compound is selected from compounds having an epoxy equivalent weight (EEW) of less than 130 g / eq, with the proviso that the multi-component fixing mortar system does not contain any mono- and / or difunctional or trifunctional epoxy compound having an epoxy equivalent weight (EEW) of greater than 130 g / eq. A fourth aspect of the invention is the use of a multi-component fixing mortar system as defined above as a chemical anchor for fixing a structural element or anchoring means in a recess in a substrate.

[0022] Surprisingly, it was found that the use of at least one trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq in a proportion of about 5 wt% to about 30 wt% in the absence of mono- and difunctional epoxy compounds and of trifunctional epoxy compounds with an epoxy equivalent weight (EEW) of greater than or equal to 130 g / eq (> 130 g / eq), the creep behavior and the bond stress (also failure load) of a cured chemical anchor at a substrate temperature of about 30°C to about 90°C can improve or increase compared to a chemical anchor with a lower or no proportion of the at least one trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq.

[0023] The invention enables improved creep behavior and increased bond stresses at temperatures above room temperature, especially at temperatures of 70°C and above, of chemical anchors, which makes the chemical anchors particularly suitable for use in building substrates exposed to high temperatures (e.g. due to strong solar radiation).

[0024] Essential to the invention is that the fixing mortar system does not contain any other reactive diluents with lower functionality. This means that, in addition to the specified trifunctional reactive diluents, no other di- and / or monofunctional reactive diluents and no other trifunctional reactive diluents with an EEW greater than or equal to 130 g / eq (> 130 g / eq) are contained in the fixing mortar system.

[0025] For the purposes of the invention, the terms used here and in the following description have the following meaning: "aliphatic compounds" are acyclic or cyclic, saturated or unsaturated carbon compounds, excluding aromatic compounds,

[0026] "Cycloaliphatic compounds" are compounds with a carbocyclic ring structure, excluding benzene derivatives or other aromatic systems,

[0027] "aromatic compounds" are compounds that follow the Hückel (4n+2) rule, and

[0028] "Amines" are compounds derived from ammonia by replacing one, two or three hydrogen atoms with hydrocarbon groups and having the general structures RNH2 (primary amines), R2NH (secondary amines) and R3N (tertiary amines) (see: IUPAC Compendium of Chemical Terminology, 2 ndEd. (the "Gold Book'), Compiled by AD McNaught and A. Wilkinson, Blackwell Scientific Publications, Oxford (1997)).

[0029] Unless otherwise stated, all standards cited in this text (e.g., DIN standards) were used in the current version as of the filing date of this application. All trade names correspond to the products available under these trade names at the time of the filing date of this application.

[0030] The fixing mortar system according to the present invention is a multi-component system. A multi-component fixing mortar system contains several components stored separately from one another, so that the ingredients contained in the components only harden after all components have been mixed. In particular, the multi-component fixing mortar system according to the invention contains at least one component (A) (also epoxy resin component), which contains a reactive synthetic resin based on epoxy resin, and at least one further component (B) (also hardener component), which contains a hardener. In a preferred embodiment, the fixing mortar system according to the invention is a two-component system (“2K system”). Trifunctional epoxy compound with EEW < 130 q / eq

[0031] According to the invention, a trifunctional epoxy compound or a mixture of several trifunctional epoxy compounds is used, wherein the trifunctional epoxy compound(s) has / have, due to their synthesis, a particularly low epoxy equivalent weight (EEW), i.e., an epoxy equivalent weight (EEW) of less than 130 g / eq. A mixture of such trifunctional epoxy compounds also has an epoxy equivalent weight (EEW) of less than 130 g / eq.

[0032] Trifunctional epoxy compounds with a short aliphatic chain are preferred. For example, trimethylolethane triglycidyl ether is preferred over trimethylolpropane triglycidyl ether, provided these reactive diluents have an epoxy equivalent weight (EEW) of less than 130 g / eq.

[0033] These epoxy compounds can be obtained using various catalysts. The usual reaction is the reaction of an alcohol / polyol with epichlorohydrin in the presence of a Lewis acid, such as AlCl3, SbCl5, SnCl4, FeCl3, SnCl2, or BF3, as a catalyst. In the second step, dehydrohalogenation occurs by adding sodium hydroxide. EP 0495339 A1 further describes the use of divalent tin halides as catalysts, preferably in the form of SnF2. The use of divalent tin halides leads to reaction products that differ from those from synthesis with conventional Lewis acids. Their chlorine content is lower, and the epoxide equivalent weight (EEW) of the reaction product is also lower.

[0034] The trifunctional reactive diluents can be prepared according to the invention by a process described, for example, in EP 0495339 A1, using trimethylolpropane, trimethylolethane, or glycerol. For example, using the alcohols mentioned, it can be carried out as follows (the specific details (indicated by "e.g.") refer to the reactive diluents used in the examples):

[0035] A reactor equipped with a stirrer, reflux condenser, dropping funnel and thermometer is charged with, for example, trimethylolpropane (e.g. 1 mol) and tin(II) fluoride (e.g. 0.03 mol) and heated to 130°C. Epichlorohydrin (e.g. 3.3 mol) is then added with stirring over a period of two hours at a temperature of 130 to 140°C. After approximately three hours at this temperature, the mixture is cooled to 50°C and, for example, 350 mL of xylene is added, followed by, for example, 30 g of Celite (filter aid, manufacturer: Imerys). After stirring for 15 minutes, the suspension is filtered and the solvent is then removed from the filtrate using a rotary evaporator. The liquid chlorohydrin ether is heated to 55°C and, for example, For example, 252 g of a 50% NaOH solution (e.g., 3.15 mol NaOH) is slowly added while stirring over 30 minutes at this temperature. After a further 2.5 hours at 50-60°C and cooling to room temperature, the suspension is filtered, and the filtrate is washed with xylene.The organic phase is separated and dried over magnesium sulfate. After further filtration, the solvent is removed using a rotary evaporator, yielding the product, e.g., trimethylolpropane triglycidyl ether. The epoxide equivalent weight (EEW) of the product is 128 g / eq.

[0036] The trifunctional epoxy compounds described above can be used according to the invention as reactive diluents in a multi-component fixing mortar system.

[0037] As stated above, it is essential to the invention that the multi-component fixing mortar system, in addition to the trifunctional epoxy compounds with an EEW of less than 130 g / eq and the epoxy resins described below, contains no further epoxy compounds, in particular no further mono- and / or difunctional epoxy compounds and no trifunctional epoxy compounds with an EEW of greater than or equal to 130 g / eq (>130 g / eq).

[0038] Accordingly, the invention further provides a multi-component fixing mortar system comprising an epoxy resin component (A) containing at least one curable epoxy resin and at least one trifunctional epoxy compound as a reactive diluent, and a hardener component (B) containing at least one amine reactive toward epoxy groups, wherein the trifunctional epoxy compound is selected from compounds having an epoxy equivalent weight (EEW) of less than 130 g / eq. To act as a reactive diluent, the trifunctional epoxy compound should have a viscosity of less than 2000 mPas, preferably less than 1000 mPas, and particularly preferably less than 800 mPas.

[0039] Curable epoxy resin

[0040] The epoxy resin component (A) (component (A)) of the multi-component fixing mortar system of the invention comprises at least one reactive synthetic resin based on epoxy resin.

[0041] Suitable curable epoxy resins for use in component (A) of the present invention include a variety of commercially available compounds known to those skilled in the art, which contain an average of more than one epoxy group, preferably two epoxy groups, per molecule. These epoxy resins can be saturated or unsaturated, as well as aliphatic, alicyclic, aromatic, or heterocyclic, and can also contain hydroxyl groups. They can also contain substituents that do not cause disruptive side reactions under the mixing or reaction conditions, for example, alkyl or aryl substituents, ether groups, and the like. Trimeric and tetrameric epoxides are also suitable within the scope of the invention.

[0042] The epoxy resins are preferably glycidyl ethers derived from polyhydric alcohols, in particular from polyhydric phenols such as bisphenols and novolaks, in particular those having an average glycidyl group functionality of 1.5 or greater, in particular of 2 or greater, for example from 2 to 10.

[0043] The epoxy resins may have an epoxy equivalent weight (EEW) of 120 to 2000 g / EQ, preferably 140 to 400, in particular 155 to 195, for example 165 to 185.

[0044] Mixtures of several epoxy resins can also be used. Examples of polyhydric phenols used to produce epoxy resins are resorcinol, hydroquinone, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), isomer mixtures of dihydroxyphenylmethane (bisphenol F), tetrabromobisphenol A, novolaks, 4,4'-dihydroxyphenylcyclohexane, and 4,4'-dihydroxy-3,3'-dimethyldiphenylpropane.

[0045] In a further preferred embodiment, the at least one curable epoxy resin is an epoxy resin produced from renewable sources. Such epoxy resins from renewable sources are, for example, isosorbide diglycidyl ether (CAS 13374-44-2), limonene 1,2:8,9-dioxide (LDO, CAS 96-08-2), vanillin diglycidyl ether (DGEVA, CAS 1584677-14-4), phloroglycinol triglycidyl ether (PTHE, CAS 4223-14-7), vanillic acid bisepoxide (CAS 1393710-63-8), and epoxidized vegetable oil, such as. E.g. epoxidized castor oil (CAS 105839-17-6, commercially available as Erisys GE 35-H from Huntsman, Belgium) and epoxidized cardanol oil (mixture containing, among others, CAS 1260636-34-7 and CAS 63284-28-6).In addition to Erisys GE 35-H, examples of bio-based polyepoxides commercially available in larger quantities that can be used in the context of the invention include Erisys GE 60 and GE 61 (epoxy resin based on sorbitol; Huntsman, Belgium) and Araldite DY-S (epoxy resin based on polyglycerol; Huntsman, Belgium).

[0046] Suitable epoxy resins can also be found in the standard work by Michael Dornbusch, Ulrich Christ, and Rob Rasing, "Epoxidharze," Vincentz Network GmbH & Co KG (2015), ISBN 13: 9783866308770. These compounds are incorporated herein by reference.

[0047] The epoxy resin is preferably a diglycidyl ether of bisphenol A or bisphenol F, or a mixture thereof. Particularly preferred are liquid diglycidyl ethers based on bisphenol A and / or F with an EEW of 150 to 300 g / eq.

[0048] A preferred example of a commercially available bisphenol F-based epoxy resin containing bisphenol F diglycidyl ether is Araldite GY 282. An example of a commercially available bisphenol A-based epoxy resin containing bisphenol A diglycidyl ether is Araldite GY 240. The proportion of epoxy resin in the epoxy resin component (A) is >0 to 95 wt.%, preferably 10 to 70 wt.% and particularly preferably 30 to 60 wt.%, based on the total weight of the epoxy resin component (A).

[0049] The proportion of trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq is preferably present in an amount of about 5 to about 30 wt.%, more preferably from 5 to 20 wt.% and even more preferably from 10 to 20 wt.%, in each case based on the total weight of the epoxy resin component (A).

[0050] The proportion of the epoxy resin component (A) in the total mass of the multi-component epoxy resin system is preferably 5 to 90 wt.%, in particular 20 to 80 wt.%, 30 to 70 wt.% or 40 to 60 wt.%.

[0051] The hardener component (B) of the multi-component fixing mortar system comprises at least one hardener. The hardener contains at least one compound commonly used for epoxy hardening (reactant in the polyaddition). The term "hardener" preferably means at least one compound commonly used for epoxy hardening, with or without filler additives and / or other additives, such as water, thickeners, and / or other additives—in other words, the complete hardener component. Conventional additives may be added, such as fillers, as already described above in connection with component (A), and / or (particularly for producing a paste or emulsion) solvents, such as benzyl alcohol and / or water. Water may serve as a reactant for the hydrolysis of silanes or siloxanes containing hydrolyzable groups, and is preferably only present if the hardener component (B) is otherwise free of silanes or siloxanes.The further additives of the hardener component of an epoxy-based fixing mortar system according to the invention can be provided, for example, in a total weight proportion of 0.01 to 70 wt. %, e.g., from 1 to 40 wt. %, based on the hardener component (B). The compounds commonly used for epoxy curing (which act as reactants in the polyaddition) are, in particular, those containing two or more groups selected from amino, imino, and mercapto, for example, corresponding amines, thiols, or aminothiols, or mixtures thereof, for example as mentioned in Lee H and Neville K, "Handbook of Epoxy Resins" (New York: McGraw-Hill), 1982.

[0052] The compounds (generally) used for epoxy curing include, for example, in one embodiment of the invention di- or polyamines such as in particular aliphatic, heteroaliphatic, cycloaliphatic, cycloheteroaliphatic and aromatic di- or polyamines, amidoamines, amine adducts (e.g. Bucherer adducts as disclosed in the document EP 0 824 124), polyetherdiamines, polyphenyl / polymethylene polyamines or Mannich bases.

[0053] According to the present invention, diamines, polyamines or Mannich bases are preferably used in the curing agent component (B).

[0054] Examples of particularly suitable di- or polyamines are 1,2-diaminoethane (ethylenediamine), 1,2-propanediamine, 1,3-propanediamine, 1,4-diaminobutane, 2,2-dimethyl-1,3-propanediamine (neopentanediamine), diethylaminopropylamine (DEAPA), 2-methyl-1,5-pentamethylenediamine (Dytek A), 1,3-diaminopentane, 2,2,4- or 2,4,4-trimethyl-1,6-diaminohexane and mixtures thereof (TMD), 1,2-bis(aminomethyl)cyclohexane, hexamethylenediamine (HMD), 1,4-diaminocyclohexane (1,4-DACH), bis(4-amino-3-methylcyclohexyl)methane, diethylenetriamine (DETA), 4-azaheptane-1, 7-diamine, 1,11-diamino-3, 6,9-trioxundecane, 1,8-diamino-3, 6-dioxaoctane, 1,5-diamino-methyl-3-azapentane, 1,10-diamino-4, 7-dioxadecane, bis(3-aminopropyl)amine, 1 ,13-diamino-4,7, 10-trioxatridecane, 4-aminomethyl-1, 8-diaminooctane, 2-butyl-2-ethyl-1, 5-diaminopentane, N, N-bis-(3-aminopropyl)methylamine, 3-aminomethyl-3,5,5-trimethylcyclohexane (IPDA), 1 ,3-Cyclohexanedimethanamine (1,3-BAC), triethylenetetramine (TETA),Tetraethylenpentamin (TEPA), Pentaethylenhexamin (PEHA), 1 ,3-Benzoldimethanamin (m- Xylylendiamin, mXDA), 1 ,4-Benzoldimethanamin (p-Xylylendiamin, pXDA), 5- (Aminomethyl)bicyclo[[2.2.1]hept-2-yl]methylamin (NBDA, Norbornandiamin),

[0055] Dimethyldipropylentriamin, Dimethylaminopropyl-aminopropylamin (DMAPAPA), Diethylmethylbenzoldiamin (DETDA), 4,4’-Diaminodiphenylsulfon (Dapson), gemischte polycyclische Amine (MPCA) (z.B. Ancamine 2168), Dimethyldiaminodicyclohexylmethan (Laromin C260), 2,2-Bis(4-aminocyclohexyl)propan,

[0056] (3(4),8(9)bis(aminomethyldicyclo[5.2.1.02,6]decane (mixture of isomers, tricyclic primary amines; TCD diamine), methylcyclohexyl diamine (Baxxodur EC 210, MDACH), N,N'-diaminopropyl-2-methyl-cyclohexane-1,3-diamine, N,N'-diaminopropyl-4-methyl-cyclohexane-1,3-diamine, N-(3-aminopropyl)cyclohexylamine, and 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine. Preferred polyamines are mXDA, Dytek A, TMD, IPDA, 1,3-BAC and MDACH.

[0057] The Mannich bases to be used according to the invention are the reaction products of phenols, such as phenol, pyrocatechol, resorcinol, hydroquinone, hydroxyhydroquinone, phloroglucinol, pyrogallol, o-cresol, m-cresol, p-cresol, or bisphenols, such as bisphenol F or bisphenol A, in particular phenol, or of styrenated phenols, as defined below, with the above-defined di- or polyamines and aldehydes or compounds which yield aldehydes by decomposition, in particular aliphatic aldehydes, such as in particular formaldehyde (whereby this term can also include compounds which yield formaldehyde by decomposition, such as trioxane or paraformaldehyde), wherein the aldehydes are advantageously added and reacted as an aqueous solution (in particular at elevated temperature, such as at 50 to 90 °C).

[0058] The Mannich bases can be prepared according to the invention by conventional methods, using the suitable amines defined above. For example, using the above-mentioned amines, it can be carried out as follows (the specific details (indicated by "e.g." and "for example") refer to the Mannich bases used in the examples):

[0059] An amine (e.g., 2 mol) is initially charged (e.g., in a 250 ml three-necked flask equipped with a thermometer, a dropping funnel, and a stirrer). While stirring, phenol or styrenated phenol (e.g., 1 mol) is added to the amine. The mixture is heated (e.g., to 80 °C). When the temperature is reached (e.g., within 45 min), formaldehyde is added dropwise (e.g., 0.7 mol as a 37% formaldehyde solution), particularly with vigorous stirring. After the addition is complete, heating is continued (e.g., to 105 °C), and the reaction conditions are maintained for some time (e.g., 120 min). Subsequently, water is distilled off at a suitable temperature (e.g., under increasing vacuum) at a suitable temperature (e.g., approx. 110 °C). As soon as the pressure is reduced sufficiently (e.g., to 50 mbar), the temperature is further increased (e.g., to 130 °C) and then maintained for a while (e.g., 60 min).

[0060] The proportion of all amines (diamines, polyamines or Mannich bases) reactive towards epoxy groups in the hardener composition (B) is preferably from 30 to 98 wt.%, more preferably from 40 to 80 wt.%, based on the total weight of the hardener composition

[0061] (B).

[0062] In an advantageous embodiment, the hardener component (B) has an AHEW (Amine Hydrogen Equivalent Weight) of 20 to 1000 g / EQ, preferably of 30 to 500 g / EQ, more preferably of 40 to 350 g / EQ, even more preferably of 50 to 225 g / EQ and particularly preferably of 50 to 150 g / EQ.

[0063] For a simple amine, the calculation of the AHEW is explained using meta-xylylenediamine as an example:

[0064] General formula: used: The AHEW value can be obtained experimentally by determining the glass transition temperature (Tg) of a mixture of epoxy resin (with known EEW) and an amine component. The glass transition temperatures of epoxy resin / amine mixtures with different ratios are determined. The sample is cooled from 21 to -70°C at a heating rate of -20 K / min, heated to 250°C in a first heating run (heating rate 10 K / min), then cooled again to -70°C (heating rate -20 K / min), and finally heated to 200°C (20 K / min). The mixture with the highest glass transition temperature in the second heating run ("Tg2") has the optimal ratio of epoxy resin to amine. The AHEW value can also be calculated from the known EEW and the optimal epoxy resin / amine ratio.

[0065] Example: EEW = 158 g / mol

[0066] Mixture of amine / epoxy resin with maximum Tg2: 1 g amine with 4.65 g epoxy resin

[0067] AHEW (amine) = 1*158 / 4.65 = 33.9785

[0068] Accelerators are typically also present in the hardener component (B). The proportion of accelerator added depends on the specific accelerator, the curing time required for the application, and the amines used. Triflates, for example, accelerate the most, followed by nitrates and thiocyanates. Iodides accelerate somewhat less. Due to the strong accelerating effect of the inorganic salts, concentrations between 1 and 10% are sufficient to achieve satisfactory curing after 24 hours. Other well-known accelerators are novolaks (including bisphenols), styrenated phenol, para-toluenesulfonic acid, and salicylic acid. These accelerators can also be combined; well-known combinations include novolak and inorganic salt, novolak and styrenated phenol, bisphenol F and p-toluenesulfonic acid, or styrenated phenol and salicylic acid.

[0069] A polyphenol (novolak) is represented by the general formula (I) or a copolymer of various alkylphenol or aralkylphenol units,

[0070] wherein in formula (I), R1, R2, R3, R4, each independently of one another, represent H, branched or unbranched alkyl radicals, or branched or unbranched aralkyl radicals containing 1 to 15 carbon atoms; n is 0 to 15.

[0071] Preferred novolak resins are those in which, in formula (I), R1, R2, R3, and R4 are either hydrogen, or one or two of the radicals R1 to R4 is / are the CH3 radical, or one of the radicals R1 to R4 is the tert-butyl radical or a straight-chain or branched C1-C15 alkyl radical. Preferred novolak resins are also those with n between 1 and 15.

[0072] As a co-accelerator, the hardener component (B) may also contain 2,4,6-tris(dimethylaminomethyl)phenol (e.g. Ancamine K54, Air Products, NL) or benzyl alcohol.

[0073] Furthermore, fillers and thixotropic agents, as already described above in connection with the epoxy resin component (A), may be present in the hardener component (B).

[0074] Other components of the multi-component fixing mortar system

[0075] Both the epoxy resin component (A) and the hardener component (B), as well as both components (A) and (B), typically comprise at least one further component in addition to the curable epoxy resin or the curing agent. Other common components include, in particular, fillers, rheology additives (thixotropic agents), adhesion promoters, and solvents. Depending on the desired effect of a further component, it may be preferable for the at least one further component to be contained only in the epoxy resin component (A), only in the hardener component (B), or in both components.

[0076] The use of an adhesion promoter improves the cross-linking of the borehole wall with the mortar mass, so that the adhesion in the cured state is increased.

[0077] Suitable adhesion promoters for the epoxy resin component (A) are selected from the group of silanes which have at least one Si-bonded hydrolyzable group, such as, for example, 3-glycidyloxypropyltrialkoxysilane, such as 3-glycidyloxypropyltrimethoxysilane (GLYMO) or -ethoxysilane, glycidyloxymethyltrialkoxysilane, such as glycidyloxymethyltrimethoxysilane or glycidyloxymethyltriethoxysilane, 3-glycidyloxypropylmethyldi-alkoxysilane, such as 3-glycidyloxypropylmethyldimethoxysilane or 3-glycidyloxypropylmethyldi-ethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and / or tetraalkoxysilane, such as tetramethoxysilane, tetraethoxysilane or tetrapropoxysilane, or a mixture of two or more thereof. Particularly preferred as silane (S) is, for example, 3-glycidyloxypropyltrimethoxysilane, e.g. Dynasylan GLYMO from Evonik Industries, Germany.

[0078] The adhesion promoter may be present in an amount of up to 6 wt.%, preferably 0.1 to 4 wt.%, more preferably 2.0 to 3.5 wt.%, based on the total weight of the hardener component (A).

[0079] Suitable adhesion promoters for the hardener component (B) are selected from the group of silanes having at least one Si-bonded hydrolyzable group, such as, for example, N-2-(aminoethyl)-3-aminopropylmethyldiethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminoethyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, and 3-mercaptopropylmethyldimethoxysilane. Particularly preferred adhesion promoters are 3-aminopropyltrimethoxysilane (AMMO), 3-aminopropyltriethoxysilane (AMEO), 2-aminoethyl-3-aminopropyltrimethoxysilane (DAMO), and trimethoxysilylpropyldiethylenetetramine (TRIAMO). Further silanes are described, for example, in EP3000792 A1. The adhesion promoter can be present in an amount of up to 10 wt.%, preferably 0.1 to 8 wt.%, more preferably 2.0 to 6 wt.%, based on the total weight of the hardener component (B).Furthermore, the epoxy resin component (A) and the hardener component (B) can contain conventional additives, in particular fillers or thixotropic agents (thickeners). Preferred fillers are inorganic fillers, in particular quartz, aluminum oxides, glass, corundum, porcelain, earthenware, barite, light spar, gypsum, talc, cements (such as Portland cement or aluminate cement), and / or chalk, as well as mixtures thereof. The inorganic fillers can be added in the form of particles (for example, in the form of powders, sands, or flours) or shaped bodies (the latter preferably in the form of fibers or spheres). By appropriately selecting the fillers with regard to type and particle size distribution, particle size, or (fiber) length, application-relevant properties such as rheological behavior, extrusion forces, internal strength, tensile strength, pull-out forces, and impact strength can be controlled.Suitable fillers include non-surface-treated quartz flours, fine quartz flours, and ultra-fine quartz flours, such as Millisil® W3, Millisil® W6, Millisil® W8, and Millisil® W12, preferably Millisil® W12. Silanized quartz flours, fine quartz flours, and ultra-fine quartz flours can also be used. These are commercially available, for example, as part of the Silbond product series from Quarzwerke. The product series Silbond® EST (epoxysilane-treated) and Silbond® AST 25 (aminosilane-treated) are particularly preferred. Furthermore, aluminum oxide-based fillers such as ultrafine aluminum oxide filler type ASFP from Denka, Japan, (d50 = 0.3 µm) or grades such as DAW or DAM with the type designations 45 (d50 < 0.44 µm), 07 (d50 > 8.4 µm), 05 (d50 < 5.5 µm), 03 (d50 < 4.1 µm) can be used.Furthermore, surface-treated fine and ultra-fine fillers such as Aktisil AM 30 (aminosilane-treated, d50 = 2.2 µm) and Aktisil EM (epoxysilane-treated, d50 = 2.2 µm) from Hoffman Mineral can be used. The fillers can be used individually or in any desired mixture. Non-surface-treated quartz powder, especially Millisil® W12, is particularly preferred.

[0080] Non-surface-treated quartz flour and / or alumina can be used as fillers. Preferred fillers are those with a mean particle size d50 of <50 pm, particularly preferred are those with a mean particle size d50 of <20 pm.

[0081] The proportion of fillers is preferably 0 to 75 wt.%, for example 10 to 75 wt.%, preferably 15 to 75 wt.% and more preferably 20 to 60 wt.%, even more preferably 30 to 55 wt.%, based on the total weight of the epoxy resin component (A) or the hardener component (B).

[0082] Further conceivable additives to the epoxy resin component (A) and the hardener component (B) are thixotropic agents, such as optionally organically post-treated pyrogenic silica, bentonites, cellulose, alkyl and methyl celluloses and castor oil derivatives, plasticizers such as phthalic acid or sebacic acid esters, stabilizers, antistatic agents, thickeners, flexibilizers, curing catalysts, rheology aids, wetting agents, coloring additives such as dyes or pigments, for example for differently coloring the components to better control their mixing, as well as wetting agents, phlegmatizing agents, dispersants and other reaction rate control agents, or mixtures of two or more thereof.

[0083] Furthermore, solvents can be used in the two-component resin system, for example, to specifically slow down curing times or to change the gel time. Preferred solvents can include monohydric, dihydric, or polyhydric alcohols, preferably a dihydric alcohol. A polyhydric alcohol is understood here to be a trihydric or higher alcohol. Components (A) or (B) can very preferably comprise a dihydric alcohol, in particular dipropylene glycol. Alternatively, component (A) or (B) can very preferably comprise benzyl alcohol. For optimization, wetting and dispersing agents, desensitizers, surface additives, plasticizers such as phthalic acid or sebacic acid esters, wax additives, stabilizers, antistatic agents, flexibilizers, curing catalysts, other reaction rate controllers, defoamers and deaerators, viscosity reducers, or other process additives can also be added.

[0084] Coloring additives such as dyes or pigments are also conceivable, for example to color the components differently to better control their mixing.

[0085] use

[0086] A multi-component fixing mortar system is understood to mean, in particular, a kit with two or more components (preferably a 2K system) with a component (A) which contains one or more reactive synthetic resins and a reactive thinner based on epoxy resin, as further described below, and hardener (component (B)), wherein additional additives can be provided in one or both of the components, wherein the mutually reactive components (A) and (B) and, if applicable,further separate components are included in such a way that they cannot react with each other during storage, preferably in such a way that they do not come into contact with each other before use, but which makes it possible to mix and, if necessary, introduce components (A) and (B) and, if appropriate, further components for fastening at the desired location, for example directly in front of or in a hole or gap, so that the curing reaction can take place there.Also suitable are cartridges, for example made of plastic, ceramic or, in particular, glass, in which the components are arranged separated from one another by destructible boundary walls (for example when driving an anchoring element into a hole or gap, such as a drill hole) or integrated, separate destructible containers, for example as nested cartridges, such as ampoules; and in particular multi-component or preferably two-component cartridges, in whose chambers the preferably two components (in particular components (A) and (B)) of the fixing mortar according to the invention are contained for storage before use, wherein a static mixer can preferably also be included in the corresponding kit. The use of a fixing mortar according to the invention at the desired location is then carried out by mixing the associated components.

[0087] Components (A) and (B) are preferably mixed in a ratio that results in a balanced stoichiometry according to the EEW and AHEW values. For the intended use of the multi-component fixing mortar system, the epoxy resin component (A) and the hardener component (B) are emptied from the separate chambers and mixed in a suitable device, such as a static mixer or a dissolver. The mixture of epoxy resin component (A) and hardener component (B) is then injected into the previously cleaned borehole using a known injection device. The component to be fixed is then inserted into the mortar compound and adjusted. The reactive components of the hardener component (B) react with the epoxy resins of the resin component (A) by polyaddition, so that the epoxy resin compound cures under ambient conditions within the desired time.

[0088] The multi-component fixing mortar system according to the invention is preferably used for construction purposes. The term "for construction purposes" means the construction bonding of concrete / concrete, steel / concrete, or steel / steel, or one of the aforementioned materials, to other mineral materials; the structural reinforcement of components made of concrete, masonry, and other mineral materials; the reinforcement applications of building objects with fiber-reinforced polymers; the chemical fixing to surfaces made of concrete, steel, or other mineral materials, in particular the chemical fixing of structural elements and anchoring devices, such as anchor rods, anchor bolts, (threaded) rods, (threaded) sleeves, reinforcing bars, screws, and the like, in drilled holes in various substrates, such as (reinforced) concrete, masonry, other mineral materials, metals (e.g., steel), ceramics, plastics, glass, and wood.

[0089] The multi-component fixing mortar systems according to the invention are particularly preferably used for chemically fixing anchoring elements in a hole or gap in a building substrate. The invention further relates to a method for fixing an anchoring element in a hole or gap in a building substrate, in which a multi-component fixing mortar system as defined above and an anchoring element are introduced into the hole or gap and allowed to harden.

[0090] Furthermore, the present invention relates to the use of a combination of (i) at least one epoxy resin from the group consisting of bisphenyl A diglycidyl ether, bisphenol F diglycidyl ether and novolak epoxy resin and (ii) a trifunctional reactive diluent selected from trimethylolpropane triglycidyl ether (TMPTGE) and trimethylolethane triglycidyl ether (TMETGE) or a mixture of these, each having an epoxy equivalent weight of less than 130 g / eq, as an epoxy resin mixture in a component of a multi-component fixing mortar system for increasing the bond stress, in particular at elevated temperature.

[0091] Further advantages of the invention will become apparent from the following description of preferred embodiments, which, however, are not to be understood as limiting in any way. All embodiments of the invention can be combined with one another within the scope of the invention.

[0092] EXAMPLES OF IMPLEMENTATION

[0093] All chemicals and components of the compositions listed in Tables 1, 2 and 3 are commercially available and were used in commercially available quality, unless otherwise stated.

[0094] The determination of the epoxy equivalent weight values ​​(EEW; epoxy equivalent weight, i.e. the amount of resin in g containing 1 mol of epoxy groups) and amine hydrogen equivalent weight values ​​(AHEW; amine hydrogen equivalent weight, i.e. the amount of amine in g containing 1 mol of reactive H) in the following examples is carried out in a manner known to the person skilled in the art based on the formulation of the reaction mixture from the known H equivalents of the starting materials and raw materials used, from which they are calculated. The EEW values ​​are usually stated on the starting materials by the manufacturers or they are determined according to known

[0095] Methods determined or calculated.

[0096] Table 1 : chemicals used | | ( | | | \ ji ! (

[0097] Table 2: Epoxies used

[0098] 5 Table 3: Amines used

[0099] Determination of glass transition temperatures of mixtures of epoxy resin and trifunctional

[0100] Epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq

[0101] 5 Table 4: Epoxy resin mixtures, composition in wt.%

[0102] To prepare the epoxy resin mixtures in Table 4, the respective components were placed in a plastic container and mixed in a speed mixer for 30 seconds at 1500 rpm.

[0103] The glass transition temperatures (Tg2) of the epoxy resin mixtures from Table 4 were determined as follows:

[0104] The epoxy resin component from Table 4 was weighed with the respective amine from Table 5 in a ratio resulting in a stoichiometry of 1:1 (based on the EEW and AHEW values ​​specified for the raw materials in Tables 2 and 3). Both were mixed in a speed mixer at 1500 rpm for 60 seconds. The samples were transferred to a silicone mold for curing, resulting in samples with a thickness of 1 mm. After curing for 24 hours at 23°C and 50% RH, 7 mg pieces were punched and placed in the DSC crucible.

[0105] In the DSC, the sample was cooled to -20.0°C at a rate of -10.0 K / min and held at this temperature for 2 min. Subsequently, it was heated to 200.0°C at a heating rate of 10.0 K / min, and the temperature was held for 1 min. The sample was then cooled to 25.0°C at a rate of -10.0 K / min and held there for 2 min. In the second heating run, heating to 200.0°C also took place at a rate of 10.0 K / min. The stated glass transition temperatures (Tg2) were determined in the second heating run.

[0106] Table 5: Glass transition temperatures (Tg2 in °C)

[0107] Production of multi-component fixing mortar systems

[0108] Preparation of calcium nitrate tetrahydrate solution:

[0109] Calcium nitrate tetrahydrate was added to glycerol and stirred until completely dissolved.

[0110] The solution thus prepared contained 80.0% calcium nitrate tetrahydrate.

[0111] The solution is used as an accelerator in some of the examples below.

[0112] Table 6: Component (A), composition in wt.%

[0113] Table 7: Component (B), composition in wt.%

[0114] Components A and B from Tables 6 and 7 are weighed at a stoichiometry of 1:1 (based on EEW and AHEW) and mixed in a speed mixer (Hauschild DAC 800). The resulting mortar mixture is then filled into a 1 K cartridge and injected into the borehole.

[0115] For pull-out tests with threaded rods M12, the following procedure is followed, according to EAD 330499-00-0601:

[0116] First, drill holes (14 mm diameter; approx. 62 mm depth) are drilled into a horizontally positioned concrete test specimen (strength class C20 / 25) using a hammer drill. The drill holes are cleaned. The number and type of cleaning steps depend on the type of test (see specific test). The drill holes are then filled two-thirds full, starting from the bottom of the hole, with the hardenable mortar to be tested for fastening purposes. A threaded rod is manually inserted into each drill hole. The excess mortar is removed using a spatula. After the time and temperature specified for the respective test, the threaded rod is pulled until failure, while the failure load is measured.

[0117] The experimental conditions were as follows:

[0118] RI

[0119] Dry concrete; hammer drilled

[0120] Cleaning: 2x blowing out (compressed air) 6 bar, 2x brushing, 2x blowing out (compressed air 6 bar) Embedding depth: 60 mm

[0121] Curing: 24 h at 23°C

[0122] Support: narrow B3 80°C

[0123] Dry concrete; hammer drilled

[0124] Cleaning: 2x blowing out (compressed air) 6 bar, 2x brushing, 2x blowing out (compressed air 6 bar)

[0125] Embedment depth: 60 mm Curing: 24 h at 23°C, then 48 h at 80°C

[0126] Extracts at 80°C

[0127] Support: narrow

[0128] Table 8: Results of the pull-out tests and the Tg2 measurement

Claims

PATENT CLAIMS 1. Use of at least one trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq to reduce the failure load of a cured chemical anchor at a substrate temperature of about 30°C to about 90°C in comparison to a chemical anchor with a trifunctional epoxy compound of similar viscosity and with an epoxy equivalent weight (EEW) of greater than or equal to 130 g / eq, wherein the cured chemical anchor was produced by mixing components (A) and (B) of a multi-component fixing mortar system and subsequent curing, wherein the multi-component fixing mortar system consists of: an epoxy resin component (A) comprising at least one curable epoxy resin and the trifunctional epoxy compound with an epoxy equivalent weight (EEW) of less than 130 g / eq as reactive diluent, and a hardener component (B) comprising at least one Epoxy group reactive amine,wherein the proportion of the at least one trifunctional epoxy compound in the epoxy resin component (A) is from about 5 wt.% to about 30 wt.%, and with the proviso that the multi-component fixing mortar system does not comprise a monofunctional and / or difunctional reactive diluent and / or trifunctional reactive diluent with an EEW of greater than or equal to 130 g / eq in the epoxy resin component.

2. The use according to claim 1, wherein the substrate temperature is from about 35°C to about 85°C, preferably from about 40°C to about 80°C.

3. The use according to claim 1 or 2, wherein the at least one trifunctional epoxy compound having an epoxy equivalent weight (EEW) of less than 130 g / eq is selected from the group consisting of trimethylolpropane triglycidyl ether, trimethylolethane triglycidyl ether, glycerol triglycidyl ether and glycerol triglycidyl ether, each having an EEW of less than 130 g / eq, and a mixture thereof.

4. The use according to claim 3, wherein the at least one trifunctional epoxy compound having an epoxy equivalent weight (EEW) of less than 130 g / eq is selected from the group consisting of trimethylolpropane triglycidyl ether and trimethylolethane triglycidyl ether, each having an EEW of less than 130 g / eq, and a mixture thereof 5. Multi-component fixing mortar system comprising an epoxy resin component (A) containing at least one curable epoxy resin and at least one trifunctional epoxy compound as reactive diluent, and a hardener component (B) containing at least one amine reactive towards epoxy groups, wherein the trifunctional epoxy compound is selected from compounds having an epoxy equivalent weight (EEW) of less than 130 g / eq, with the proviso that the multi-component fixing mortar system does not contain a monofunctional and / or bifunctional reactive diluent and / or a trifunctional reactive diluent having an epoxy equivalent weight (EEW) of greater than or equal to 130 g / eq.

6. Multi-component fixing mortar system according to claim 5, wherein the at least one trifunctional epoxy compound is present in an amount of about 5 wt.% to about 30 wt.%, based on the epoxy resin component (A).

7. Multi-component fixing mortar system according to claim 5 or 6, wherein the at least one trifunctional epoxy compound is selected from the group consisting of trimethylolpropane triglycidyl ether, trimethylolethane triglycidyl ether, glycerol triglycidyl ether and glycerol triglycidyl ether, each having an EEW of less than 130 g / eq, and a mixture thereof.

8. Multi-component fixing mortar system according to claim 7, wherein the at least one trifunctional epoxy compound is selected from the group consisting of trimethylolpropane triglycidyl ether, trimethylolethane triglycidyl ether, glycerol triglycidyl ether and glycerol triglycidyl ether, each having an EEW of less than 130 g / eq, and a mixture thereof.

9. Multi-component fixing mortar system according to any one of the preceding claims 5 to 8, wherein the at least one curable epoxy resin is a compound selected from the group consisting of glycidyl ethers of polyhydric phenols having a glycidyl group functionality of about 1.5 or greater and epoxidized vegetable oils, and mixtures of two or more thereof.

10. Multi-component fixing mortar system according to claim 9, wherein the at least one curable epoxy resin is a compound selected from the group consisting of glycidyl ethers based on resorcinol, bisphenol A, bisphenol F, and mixtures of two or more thereof.

11. Multi-component fixing mortar system according to any one of the preceding claims 5 to 10, wherein the at least one curable epoxy resin is present after mixing of components (A) and (B) in about 30 wt.% to about 70 wt.% based on the total weight of components (A) and (B).

12. Multi-component fixing mortar system according to any one of the preceding claims 5 to 11, wherein the two-component resin system additionally comprises at least one additive and / or a filler, wherein the additive and the filler, each independently of each other, either in component (A) or in component (B) or in both components (A) and (B).

13. Use of a multi-component fixing mortar system according to one of the preceding claims 5 to 12 as a chemical anchor for fixing a Structural element or anchoring means in a recess in a subsoil.

14. The use according to claim 13 for chemically fixing a structural element or anchoring means selected from the group consisting of anchor rods, anchor bolts, threaded strands, threaded sleeves, concrete iron, reinforcing iron and screws in a substrate selected from the group consisting of concrete, masonry, steel, ceramics, plastics, glass, wood, and any combinations thereof.

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