Package and method for manufacturing package

Abstract

With this invention, a package in which a chip is provided in a hollow portion can be made adequately air-permeable without processing for penetrating the package.　The package is provided with the chip, a sealing material for sealing the chip so that the hollow portion is positioned above the chip, and a hollow tube penetrating the sealing material and reaching the hollow portion. The package may further include a transparent member disposed above the chip via the hollow portion and supported by the sealing material. The package may further include a package baseboard in which a cavity is provided and the chip is mounted in the cavity.

Description

Package and method for manufacturing the package

[0001] The present technology relates to a package and a method for manufacturing the package. More specifically, the present technology relates to a package in which a chip is disposed in a hollow portion and a method for manufacturing the package.

[0002] Hollow packages are sometimes used to package sensor chips. In these cases, the hollow packages are sometimes made breathable to prevent damage to the sealing material caused by the difference in air pressure inside and outside the hollow package during solder reflow. For example, a semiconductor device has been proposed in which a semiconductor element is encapsulated in a hollow package and a ventilated portion is formed in part of the package (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2002-124589

[0004] However, in the above-mentioned conventional technology, if the ventilation portion is made finer to prevent the intrusion of dust and the like, there is a risk that this will lead to an increase in the difficulty of processing the package.

[0005] This technology was developed in light of these circumstances, and aims to ensure breathability in a package in which a chip is placed in a hollow portion, without requiring any piercing processing of the package.

[0006] The present technology has been made to solve the above-mentioned problems, and a first aspect thereof is a package including a chip, a sealant that seals the chip so that a hollow portion is located above the chip, and a hollow tube that penetrates the sealant and reaches the hollow portion, thereby ensuring breathability of the hollow portion via the hollow tube.

[0007] In addition, in the first aspect, a transparent member may be further provided that is disposed on the chip via the hollow portion and supported by the sealing material, thereby enabling light reception at the chip while ensuring breathability of the hollow portion.

[0008] In addition, in the first aspect, the package substrate may further include a cavity provided therein, and the chip is mounted in the cavity. This provides the effect of ensuring ventilation of the cavity while mounting the chip.

[0009] In the first aspect, the hollow tube may have a bent portion that bends from an end of the sealing surface of the package substrate to a side surface, thereby making it difficult for the hollow tube to be blocked by the sealing material.

[0010] In the first aspect, the bending angle of the bending portion may be 90°. This provides the effect of increasing the distance between the end of the hollow tube and the sealing material while suppressing an increase in the protrusion of the hollow tube from the package substrate.

[0011] In the first aspect, the package substrate may include a groove for positioning the hollow tube, thereby suppressing variations in the position of the hollow tube within the sealing material.

[0012] In the first aspect, the groove may be disposed on the sealing surface of the package substrate, thereby providing an effect of positioning the hollow tube within the sealing material while suppressing variation in the position of the hollow tube within the sealing material.

[0013] In the first aspect, the hollow tube may be disposed at the center of a long side, the center of a short side, or a corner of the package substrate, thereby improving the uniformity of ventilation within the hollow portion of the package substrate.

[0014] In the first aspect, one or more hollow tubes may be disposed in the package substrate, thereby providing an effect of controlling the air permeability of the package.

[0015] In addition, in the first aspect, the hollow tubes may be arranged to be line-symmetrical about the center of a side of the package substrate or to face opposite sides of the package substrate, thereby improving the uniformity of the thickness of the sealant in the hollow portion of the package substrate, i.e., the uniformity of the parallelism between the transparent member and the chip.

[0016] In the first aspect, the outer diameter of the hollow tube may be equal to the thickness of the sealing material, thereby providing the effect of allowing the hollow tube to be disposed within the sealing material while suppressing an increase in the thickness of the sealing material.

[0017] In the first aspect, the hollow tube may be disposed at an upper part, a lower part, or a center part in a thickness direction of the sealing material, thereby improving the degree of freedom in arranging the hollow tube in the sealing material.

[0018] In the first aspect, the outer end of the hollow tube may be located outside the bleed of the sealing material, thereby providing an effect of suppressing the intrusion of the sealing material into the hollow tube.

[0019] In the first aspect, the distance between the end of the hollow tube and the sealing material may be 300 μm or more, thereby providing the effect of suppressing the intrusion of the sealing material into the hollow tube.

[0020] In the first aspect, the hollow tube may have an inner diameter of 10 μm or less, thereby ensuring breathability of the package and preventing dust and the like from entering the hollow portion of the package.

[0021] In the first aspect, a secondary tube may be provided inside the hollow tube, thereby suppressing the intrusion of dust and the like into the hollow portion of the package while increasing the outer diameter of the hollow tube.

[0022] In the first aspect, the cross-sectional shape of the hollow tube may be a circle, an ellipse, a polygon, or a flattened shape thereof, thereby providing the effect of optimizing the cross-sectional shape of the hollow tube depending on the size and use of the package.

[0023] In the first aspect, the material of the hollow tube may be the same as the filler contained in the sealing material. This improves the affinity between the hollow tube and the sealing material. For example, the material of the hollow tube and the filler contained in the sealing material may be SiO ２ This can reduce the difficulty in processing the hollow tube and improve the affinity between the hollow tube and the sealing material.

[0024] In the first aspect, the chip may be formed with a light receiving element, a light emitting element, a display element, or a MEMS (Micro Electro Mechanical Systems), thereby ensuring the functionality of the element in the package while sealing the element in the package.

[0025] A second aspect of the present invention is a method for manufacturing a package, comprising the steps of: die-bonding a chip to a package substrate having a cavity formed therein; arranging a transparent member on the package substrate via an uncured sealant arranged so that the hollow tube passes through; and curing the uncured sealant arranged so that the hollow tube passes through. This reduces the pressure difference between the inside and outside of the package during solder reflow without forming a through-hole in the package substrate.

[0026] 1 is a diagram illustrating an example of a configuration of a package according to a first embodiment. FIG. 1 is a cross-sectional view illustrating a first example of a method for manufacturing a package according to the first embodiment. FIG. 2 is a cross-sectional view illustrating a second example of a method for manufacturing a package according to the first embodiment. FIG. 3 is a diagram illustrating a third example of a method for manufacturing a package according to the first embodiment. FIG. 4 is a plan view illustrating another example of a configuration of a package according to the first embodiment. FIG. 5 is a plan view illustrating yet another example of a configuration of a package according to the first embodiment. FIG. 6 is a cross-sectional view illustrating yet another example of a configuration of a package according to the first embodiment. FIG. 7 is a cross-sectional view illustrating another example of a configuration of a hollow tube according to the first embodiment. FIG. 8 is a cross-sectional view illustrating an example of a configuration of a package according to a second embodiment. FIG. 9 is a cross-sectional view illustrating an example of a method for manufacturing a package according to the second embodiment. FIG. 10 is a cross-sectional view illustrating another example of a configuration of a package according to the second embodiment. FIG. 11 is a cross-sectional view illustrating an example of a configuration of a package according to a third embodiment. FIG. 12 is a cross-sectional view illustrating an example of a configuration of a package according to a fourth embodiment. FIG. 13 is a diagram illustrating an example of a method for manufacturing a package according to the fourth embodiment. FIG. 14 is a cross-sectional view illustrating an example of a method for manufacturing a package according to the fourth embodiment. FIG. 15 is a cross-sectional view illustrating an example of a method for manufacturing a package according to the fourth embodiment. FIG. 16 is a cross-sectional view illustrating an example of a configuration of a package according to a fifth embodiment. FIG. 17 is a diagram illustrating an example of a method for manufacturing a package according to the fifth embodiment. FIG. 18 is a cross-sectional view illustrating an example of a method for manufacturing a package according to the fifth embodiment. FIG. 10 is a cross-sectional view showing an example of a manufacturing method for a package according to a fifth embodiment. FIG. 11 is a cross-sectional view showing an example of a configuration of a package according to a sixth embodiment. FIG. 12 is a cross-sectional view showing an example of a manufacturing method for a package according to the sixth embodiment. FIG. 13 is a diagram showing an example of a configuration of a package according to a seventh embodiment. FIG. 14 is a cross-sectional view showing an example of a manufacturing method for a package according to the seventh embodiment. FIG. 15 is a cross-sectional view showing another example of a configuration of a package according to the seventh embodiment. FIG. 16 is a cross-sectional view showing yet another example of a configuration of a package according to the seventh embodiment. FIG. 17 is a cross-sectional view showing yet another example of a configuration of a package according to the seventh embodiment. FIG. 18 is a cross-sectional view showing yet another example of a configuration of a package according to the eighth embodiment.It is a block diagram showing a schematic configuration example of a vehicle control system.It is an explanatory diagram showing an example of an installation position of an imaging unit.

[0027] Modes for carrying out the present technology (hereinafter referred to as embodiments) will be described below. The description will be made in the following order: 1. First embodiment (an example in which a hollow tube is provided that penetrates a sealant between a package substrate having a cavity and a transparent substrate to reach the cavity) 2. Second embodiment (an example in which a hollow tube is provided that penetrates a sealant of an iBGA (Interstitial Ball Grid Array) to reach the hollow portion) 3. Third embodiment (an example in which a hollow tube is provided that penetrates a sealant between a package substrate having a cavity and a transparent substrate to reach the cavity, and a sensor chip is mounted face-down in the cavity) 4. Fourth embodiment (an example in which a hollow tube is provided that penetrates a sealant of a WLCSP (Wafer Level Chip Size Package) on which a back-illuminated image sensor is mounted to reach the hollow portion, and a support substrate is provided to support the sensor substrate) 5. Fifth embodiment (an example in which a hollow tube is provided that penetrates a sealant of a WLCSP on which a back-illuminated image sensor is mounted to reach the hollow portion) 6. 6. Sixth embodiment (an example in which a hollow tube is provided that penetrates the sealant between a package substrate in which a cavity is formed and a transparent substrate to reach the cavity, and the end of the hollow tube is bent in a direction away from the sealant) 7. Seventh embodiment (an example in which a hollow tube is provided that penetrates the sealant between a package substrate in which a cavity is formed and a transparent substrate to reach the cavity, and a groove for positioning the hollow tube is provided in the package substrate) 8. Eighth embodiment (an example in which a package substrate in which a cavity is formed and a transparent substrate are directly bonded, and a groove formed in the package substrate is used as a vent for the cavity) 9. Application to a moving body

[0028] 1. First Embodiment Fig. 1 is a diagram showing an example of the configuration of a package according to a first embodiment. Note that "a" in the figure is a cross-sectional view showing the example of the configuration obtained by cutting the package 100 vertically at the position of the hollow tube 106, and "b" in the figure is a plan view showing the example of the configuration of the package 100. "a" in the figure is cut along line A1-A2 in "b" in the figure. Note that the drawings used in the following description may differ in scale and shape from the actual structure in order to make each component easier to understand.

[0029] In the figure, the package 100 includes a package substrate 101, a chip 102, a sealing material 104, a transparent substrate 105, and a hollow tube 106. In this case, the package 100 can form a hollow package in which the chip 102 is mounted.

[0030] A chip 102 is mounted on the package substrate 101. A cavity CAV is formed in the package substrate 101 to house the chip 102. The cavity CAV is an example of a hollow portion as defined in the claims. The base material of the package substrate 101 may be, for example, ceramic or resin. Wiring is formed in the package substrate 101. A through electrode or the like may be formed in the package substrate 101. A bonding pad RTA is formed in the cavity CAV of the package substrate 101. The material of the bonding pad RTA may be, for example, an Fe-Ni-Co alloy or a metal such as Cu. A plating layer of Ni, Au, or the like may be formed on the bonding pad RTA.

[0031] Land electrodes 107 are formed on the back surface of the package substrate 101. Protruding electrodes 108 are formed on the land electrodes 107. The protruding electrodes 108 can be electrically connected to bonding pads RTA. The protruding electrodes 108 can be used as external connection terminals for connecting the package 100 to a motherboard or the like. The protruding electrodes 108 may be, for example, solder balls or pillar electrodes made of a conductor. In this case, the package 100 can be mounted on the motherboard via the protruding electrodes 108, for example, by solder reflow.

[0032] The chip 102 is mounted in a cavity CAV of the package substrate 101. The chip 102 is connected to the package substrate 101 via bonding wires 103. At this time, pad electrodes BPD to which the bonding wires 103 are connected can be formed on the chip 102. The bonding wires 103 can be made of a metal such as Au or Al.

[0033] A semiconductor element, an optical element, or a MEMS (Micro Electro Mechanical Systems) may be formed on the chip 102. The substrate used for the chip 102 may be a semiconductor substrate, a dielectric substrate, or an organic substrate.

[0034] The light receiving element may be an image sensor such as a CCD (Charged Coupled Device) sensor, a CMOS (Complementary Metal-Oxide Semiconductor) sensor, or a SPAD (Single Photon Avalanche Diode) sensor. The light received by the image sensor may be visible light, near infrared light (NIR), short wavelength infrared light (SWIR), ultraviolet light, or X-rays. The optical element may be a light receiving element such as a PD (Photo Diode), or a light emitting element such as an LD (Laser Diode), an LED (Light Emitting Diode), or a VCSEL (Vertical Cavity Surface Emitting Laser). The optical element may be an optical switch or a DMD (Digital Micromirror Device). The optical element may be a display element such as a liquid crystal element or an organic EL (Electroluminescence) element. The material used for the optical element may be a semiconductor such as Si, GaAs, or InGaAs, or LiNbO ３ , or may be a dielectric material such as glass or transparent resin.

[0035] The semiconductor element may include a transistor, a resistor, a capacitor, etc. The semiconductor element may form a memory, a processor, a signal processing circuit, a data processing circuit, or an interface circuit. The semiconductor element may form a hardware circuit such as an FPGA (Field-Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit). The material used for the semiconductor element may be Si, GaAs, SiC, GaN, InGaAs, InP, InGaAsP, etc.

[0036] For example, a CMOS image sensor can be formed on the chip 102. In this case, a light receiving region MK is provided on the chip 102. In the light receiving region MK, pixels and pixel transistors are arranged in a matrix along the row and column directions. Photodiodes can be formed in the pixels. The CMOS image sensor may be a back-illuminated image sensor, a front-illuminated image sensor, or a LOFIC (Lateral Overflow Integration Capacitor) type image sensor.

[0037] The transparent substrate 105 is disposed on the chip 102 via a cavity CAV. At this time, the transparent substrate 105 is supported on the chip 102 via a sealing material 104 and bonded to the package substrate 101. The transparent substrate 105 may be a glass substrate, a quartz substrate, or a transparent resin substrate such as acrylic or polycarbonate. The transparent substrate 105 is formed of Al or Cr according to the wavelength of light received by the chip 102. ２ O ３ , CaF ２ , MgF ２ Alternatively, LiF may be used. The transparent substrate 105 is an example of a transparent member as defined in the claims.

[0038] The sealant 104 is positioned between the chip 102 and the transparent substrate 105. At this time, the sealant 104 can support the transparent substrate 105 on the chip 102 via a cavity CAV. The sealant 104 can be continuously disposed along the outer periphery of the package substrate 101. The sealant 104 can transition from an uncured state to a cured state while supporting the transparent substrate 105 on the chip 102. At this time, the sealant 104 can adhere to the package substrate 101 and the transparent substrate 105, thereby fixing the transparent substrate 105 to the package substrate 101. The width WD of the sealant 104 can be set, for example, within a range of 0.1 to 1.0 mm. The thickness TD of the sealant 104 can be set, for example, within a range of 0.01 to 0.5 mm. The material of the sealant 104 may be a thermosetting resin or an ultraviolet-curing resin. For example, the material of the sealant 104 can be a resin such as a siloxane-based resin, an acrylic-based resin, or an epoxy-based resin. The sealant 104 may contain an inorganic or organic filler to improve reliability. The filler material may be glass. The sealant 104 may be blackened or comprise an opaque layer to reduce flare on the light-receiving surface MK. For example, the sealant 104 may contain a black pigment such as carbon black, or a filler such as carbon fiber.

[0039] The hollow tube 106 has an air vent surrounded by an outer shell. The hollow tube 106 may be a tube or a pipe. The hollow tube 106 is disposed at a position where it penetrates the sealing material 104 and reaches the cavity CAV. At this time, the center of the hollow tube 106 can be embedded in the sealing material 104 while the sealing material 104 is still uncured, and the sealing material 104 can be cured to fix the package 100. At this time, the cavity CAV is ventilated with the outside of the package 100 via the hollow tube 106. Therefore, the pressure difference between the outside of the package substrate and the cavity CAV during solder reflow can be reduced without forming a through-hole in the package substrate 101 for ventilating the cavity CAV.

[0040] The hollow tube 106 may be disposed at the center of a long side of the package substrate 101, at the center of a short side of the package substrate 101, or at a corner of the package substrate 101. One or more hollow tubes 106 may be disposed in the package substrate 101. The hollow tubes 106 may be disposed so as to be line-symmetrical about the center of a side of the package substrate 101, or so as to face opposite sides of the package substrate 101. The hollow tube 106 may be disposed at an upper part of the sealing material 104 in the thickness direction, at a lower part of the sealing material 104 in the thickness direction, or at the center of the sealing material 104 in the thickness direction. The outer end of the hollow tube 106 may be located outside the bleed of the sealing material 104.

[0041] The outer diameter of the hollow tube 106 may be equal to or smaller than the thickness of the sealing material 104. The distance between the end of the hollow tube 106 and the sealing material 104 is preferably 300 μm or more. Since the bleed width is usually about 200 μm or less, by making the distance between the end of the hollow tube 106 and the sealing material 104 300 μm or more, it is possible to prevent the bleed from entering the hollow tube 106. The outer diameter of the hollow tube 106 may be the same as the outer diameter of the filler contained in the sealing material 104.

[0042] The inner diameter of hollow tube 106 is preferably set so as to prevent dust and the like from entering cavity CAV while ensuring breathability. From the viewpoint of preventing dust and the like from entering cavity CAV, the inner diameter of hollow tube 106 is preferably 10 μm or less. In this case, to ensure breathability of hollow tube 106, the inner diameter of hollow tube 106 is preferably within the range of 5 to 10 μm.

[0043] The cross-sectional shape of the hollow tube 106 may be circular, elliptical, polygonal, or flattened. The outer shape of the hollow tube 106 may be straight, curved, or wavy. The hollow tube 106 may have a secondary tube therein. The inner diameter of the secondary tube is preferably within the range of 5 to 10 μm. The material of the hollow tube 106 may be glass, ceramic, metal such as stainless steel, or resin such as epoxy. The material of the hollow tube 106 may be the same as the material of the filler contained in the sealing material 104.

[0044] 2 and 3 are cross-sectional views showing a first example of a method for manufacturing a package according to the first embodiment.

[0045] 2A, the chip 102 is die-bonded onto the package substrate 101. At this time, the chip 102 can be fixed onto the package substrate 101 via a die-bonding material. The die-bonding material may be an adhesive or a paste material such as Ag paste.

[0046] Next, as shown in FIG. 2B, the chip 102 and the package substrate 101 are electrically connected via bonding wires 103.

[0047] 2c, the hollow tube 106 is placed on the sealing surface of the package substrate 101. At this time, the hollow tube 106 can be placed at a position perpendicular to the outer periphery of the package substrate 101. The hollow tube 106 may be adhered to the package substrate 101 via an adhesive.

[0048] Next, as shown in FIG. 3A, uncured sealing material 104 is placed on the sealing surface of package substrate 101 so that the central portion in the longitudinal direction of hollow tube 106 is embedded.

[0049] 3B, the transparent substrate 105 is placed on the uncured sealant 104, and the sealant 104 is cured. At this time, the transparent substrate 105 can be separated from the chip 102 via the cavity CAV.

[0050] Next, as shown in Fig. 3c, protruding electrodes 108 are formed on the land electrodes 107 on the back surface of the package substrate 101. Then, for example, the package 100 with the protruding electrodes 108 formed thereon is mounted on a motherboard 109 based on solder reflow. At this time, the gas in the cavity CAV is released to the outside via the hollow tube 106, thereby reducing the pressure difference between the inside and outside of the package 100. This makes it possible to suppress damage to the sealant 104 caused by the pressure difference between the inside and outside of the package 100 during solder reflow.

[0051] FIG. 4 is a cross-sectional view showing a second example of the method for manufacturing the package according to the first embodiment.

[0052] 4A, after the steps a and b in FIG. 2, an uncured sealing material 104 is placed on the sealing surface of the package substrate 101. In FIG.

[0053] Next, as shown in FIG. 4b, a hollow tube 106 is placed on the uncured sealant 104 so as to cross the sealant 104.

[0054] Next, as shown in FIG. 4c, a transparent substrate 105 is placed on the uncured sealant 104 with the hollow tubes 106 arranged thereon, and the sealant 104 is cured.

[0055] FIG. 5 is a diagram showing a third example of the method for manufacturing the package according to the first embodiment.

[0056] 5A, after the steps A and B in FIG. 2, the uncured sealant 104 is placed on the transparent substrate 105. At this time, the uncured sealant 104 can be placed continuously along the outer periphery of the transparent substrate 105.

[0057] Next, as shown in FIG. 5B, a hollow tube 106 is placed on the uncured sealant 104 so as to cross the sealant 104 .

[0058] Next, as shown in FIG. 5c, the transparent substrate 105 is placed on the package substrate 101 via the uncured sealant 104 in which the hollow tubes 106 are placed, and the sealant 104 is cured.

[0059] FIG. 6 is a plan view showing another example of the configuration of the package according to the first embodiment.

[0060] 1, the hollow tube 106 is disposed in the center of the long side of the package substrate 101, but as shown in Fig. 6a, the hollow tube 106 may be disposed in the center of the short side of the package substrate 101. Alternatively, as shown in Fig. 6b, the hollow tube 106 may be disposed in a corner of the package substrate 101.

[0061] FIG. 7 is a plan view showing still another example of the configuration of the package according to the first embodiment.

[0062] 1, only one hollow tube 106 is arranged in the center of the long side of the package substrate 101, but as shown in Fig. 7a, multiple hollow tubes 106 may be arranged in the center of the long side of the package substrate 101. Alternatively, as shown in Fig. 7b, multiple hollow tubes 106 may be arranged on the long and short sides of the package substrate 101. Here, by arranging multiple hollow tubes 106 on the long and short sides of the package substrate 101, the uniformity of the pressure applied to the cavity CAV during solder reflow can be improved.

[0063] FIG. 8 is a cross-sectional view showing still another example of the configuration of the package according to the first embodiment.

[0064] In the configuration example of FIG. 1 , the hollow tube 106 is disposed between the package substrate 101 and the sealing material 104, but as shown in FIG. 8 a, the hollow tube 106 may be disposed between the transparent substrate 105 and the sealing material 104. Alternatively, as shown in FIG. 8 b, the hollow tube 106 may be disposed within the sealing material 104. In this case, the hollow tube 106 can be spaced apart from the package substrate 101 and the transparent substrate 105. Alternatively, as shown in FIG. 8 c, the hollow tube 106 may be disposed between the package substrate 101 and the transparent substrate 105. In this case, the outer diameter of the hollow tube 106 can be made equal to the thickness of the sealing material 104.

[0065] FIG. 9 is a cross-sectional view showing another example of the configuration of the hollow tube according to the first embodiment.

[0066] The hollow tube 106 may be a hollow tube 106A having a circular cross section as shown in Fig. 9a, a hollow tube 106B having a flattened circle as shown in Fig. 9b, or a hollow tube 106C having a square cross section as shown in Fig. 9c. Alternatively, as shown in Fig. 9d, the hollow tube 106 may be a hollow tube 106D having a secondary tube 106E provided therein.

[0067] As described above, in the first embodiment, hollow tube 106 is provided, which penetrates sealant 104 between package substrate 101, on which cavity CAV is formed, and transparent substrate 105, and reaches cavity CAV. In this case, hollow tube 106 can penetrate sealant 104 based on the fluidity of sealant 104 before it hardens, making it unnecessary to process sealant 104. Therefore, the ventilation portion can be made finer without increasing the difficulty of processing package 100, and the air pressure difference between the inside and outside of package 100 can be equalized while suppressing the intrusion of dust and the like into cavity CAV.

[0068] 2. Second Embodiment In the above-described first embodiment, hollow tube 106 is provided to reach cavity CAV by penetrating sealant 104 between package substrate 101, on which cavity CAV is formed, and transparent substrate 105. In this second embodiment, hollow tube 106 is provided to penetrate the sealant of iBGA and reach the hollow portion.

[0069] FIG. 10 is a cross-sectional view showing an example of the configuration of a package according to the second embodiment.

[0070] In the figure, the package 200 includes a package substrate 201, a chip 202, sealing materials 204 and 209, a transparent substrate 105, and a hollow tube 106. In this case, the package 200 can constitute a hollow package in which the chip 202 is mounted.

[0071] A chip 202 is mounted on the package substrate 201. An iBGA can be used as the package substrate 201. For example, a PGA (Pin Grid Array) can also be used as the package substrate 201. The package substrate 201 can be a multilayer substrate. The package substrate 201 can be shaped like a flat plate. By shaping the package substrate 201 in a flat plate shape, the height of the package 200 can be reduced. The base material of the package substrate 201 can be, for example, ceramic or resin. Wiring and bonding pads are formed on the package substrate 201. A through electrode or the like may be formed on the package substrate 201.

[0072] Land electrodes 207 are formed on the back surface of the package substrate 201. Protruding electrodes 208 are formed on the land electrodes 207. At this time, the package 200 can be mounted on a motherboard via the protruding electrodes 208, for example, by solder reflow.

[0073] The chip 202 is mounted on a package substrate 201. The chip 202 is connected to the package substrate 201 via bonding wires 203. A semiconductor element, an optical element, or a MEMS may be formed on the chip 202.

[0074] For example, a CMOS image sensor can be formed on the chip 202. At this time, a light receiving region MK is provided on the chip 202. A color filter 211 is formed on the light receiving region MK for each pixel. An on-chip lens 212 is formed on the color filter 211 for each pixel. The material of the color filter 211 and the on-chip lens 212 is, for example, SiO ２An insulating film such as SiN or SiCN, or a transparent resin such as acrylic or polycarbonate can be used. The color filter 211 may contain a pigment. The color filter 211 may have, for example, a Bayer array or a Quad Bayer array. The color filter 211 may include an RGB filter, a complementary color filter, or a white filter. A lens, a color splitter, or a deflector made of a metasurface may be formed on the light receiving region MK.

[0075] The sealing surface of the tip 202 may have a recess or groove formed therein for positioning the hollow tube 106 .

[0076] The transparent substrate 105 is placed on the chip 202 via the hollow portion. At this time, the transparent substrate 105 is supported on the chip 202 via the sealing material 204 and bonded to the chip 202.

[0077] The sealant 204 is positioned between the chip 202 and the transparent substrate 105. At this time, the sealant 204 can support the transparent substrate 105 on the chip 202 via a hollow portion. The sealant 204 can be disposed continuously along the outer periphery of the chip 202. At this time, the sealant 204 may be disposed at a position where the tip portions of the bonding wires 203 are embedded. The sealant 204 can transition from an uncured state to a cured state while supporting the transparent substrate 105 on the chip 202. At this time, the sealant 204 adheres to the chip 202 and the transparent substrate 105, and can fix the transparent substrate 105 on the chip 202.

[0078] The sealant 209 is formed on the package substrate 201 outside the chip 202 and the sealant 204. In this case, the sealant 209 can be continuously arranged in a position surrounding the outer periphery of the chip 202 and the sealant 204. The sealant 209 may be arranged in a position where the rear ends of the bonding wires 203 are embedded. The sealant 209 may be in contact with the side surface of the transparent substrate 105. The material of the sealant 209 may be a thermosetting resin or an ultraviolet curing resin. The material of the sealant 209 may be different from the material of the sealant 204. In this case, the material of the sealant 209 may be selected so as to mitigate warpage of the package substrate 201.

[0079] The hollow tube 106 is disposed at a position where it penetrates the sealing materials 204 and 209 and reaches the hollow portion above the chip 202. At this time, the hollow portion above the chip 202 is ventilated with the outside of the package 200 via the hollow tube 106.

[0080] FIG. 11 is a cross-sectional view showing an example of a method for manufacturing a package according to the second embodiment.

[0081] 11A, a chip 202 is die-bonded onto a package substrate 201. At this time, the chip 202 can be fixed onto the package substrate 201 via a die-bonding material.

[0082] Next, as shown in FIG. 11B, the chip 202 and the package substrate 201 are electrically connected via bonding wires 203 .

[0083] Next, as shown in Fig. 11c, hollow tube 106 is placed on the sealing surface of chip 202. At this time, hollow tube 106 can be placed at a position perpendicular to the outer periphery of chip 202. Also, hollow tube 106 can be made to protrude horizontally outward from the end of chip 202. Then, uncured sealing material 204 is placed on the sealing surface of package substrate 201 so that hollow tube 106 on the sealing surface of chip 202 is embedded.

[0084] 11d, the transparent substrate 105 is placed on the uncured sealing material 204, and the sealing material 204 is cured. At this time, the transparent substrate 105 can be separated from the chip 202 via the hollow portion.

[0085] 10, a sealant 209 is formed on the package substrate 201 outside the chip 202 and the sealant 204. Then, protruding electrodes 208 are formed on the land electrodes 207 on the back surface of the package substrate 201.

[0086] FIG. 12 is a cross-sectional view showing another example of the configuration of the package according to the second embodiment.

[0087] 10. In this figure, a package 200' includes sealing materials 204' and 209' instead of the sealing materials 204 and 209 of the package 200 in FIG.

[0088] The sealing material 204' is disposed inside the bonding wires 203. At this time, the bonding wires 203 can be prevented from being embedded in the sealing material 204'.

[0089] The sealing material 209' is formed on the outside of the chip 202 and the sealing material 204' on the package substrate 201. At this time, the bonding wires 203 can be entirely embedded in the sealing material 209'.

[0090] In this way, in the second embodiment described above, hollow tube 106 is provided which penetrates sealing materials 204 and 209 of package 200 and reaches the hollow portion above chip 202. This makes it possible to miniaturize the ventilation portion without increasing the difficulty of processing package 200, and also makes it possible to reduce the height of package 200.

[0091] 3. Third Embodiment In the first embodiment described above, the hollow tube 106 provided in the package 100 ensures ventilation of the cavity CAV, and bonding wires 103 are provided to connect the chip 102 to the package substrate 101. In this third embodiment, the hollow tube 106 provided in the package 100 ensures ventilation of the cavity CAV, and the sensor chip is flip-chip mounted.

[0092] FIG. 13 is a cross-sectional view showing an example of the configuration of a package according to the third embodiment.

[0093] In the figure, package 300 includes a package substrate 301 and a chip 302 instead of package substrate 101 and chip 102 of the first embodiment described above. Other configurations of package 300 of the third embodiment are similar to those of package 100 of the first embodiment described above.

[0094] A chip 302 is mounted on a package substrate 301. A cavity CAV for accommodating the chip 302 is formed in the package substrate 301. Bonding electrodes 311 used for wiring and flip-chip mounting are formed in the package substrate 301. A through electrode or the like may be formed in the package substrate 301.

[0095] Land electrodes 107 are formed on the back surface side of the package substrate 301. Protruding electrodes 108 are formed on the land electrodes 107. The protruding electrodes 108 can be electrically connected to bonding electrodes 311. The rest of the configuration of the package substrate 301 is the same as the configuration of the package substrate 101 of the first embodiment described above.

[0096] The chip 302 is mounted in the cavity CAV of the package substrate 301. For example, a CMOS image sensor can be formed on the chip 302. At this time, a light receiving region MK is provided on the chip 302. The light receiving region MK can be formed on the back side of the chip 302. A protruding electrode 312 used for flip-chip mounting is formed on the front side of the chip 302. The protruding electrode 312 is bonded to a bonding electrode 311.

[0097] As described above, in the third embodiment, the air permeability of the cavity CAV is ensured via the hollow tube 106 provided in the package 300, and the chip 302 is flip-chip mounted. This makes it possible to miniaturize the air permeable portion without increasing the difficulty of processing the package 200, and also makes it possible to connect the chip 302 to the package substrate 301 without using wire bonding.

[0098] 4. Fourth Embodiment In the second embodiment described above, hollow tube 106 is provided to penetrate seal materials 204, 209 of iBGA and reach the hollow portion. In this fourth embodiment, hollow tube 106 is provided to penetrate seal material of WLCSP on which a sensor chip supported by a support substrate is mounted and reach the hollow portion.

[0099] FIG. 14 is a cross-sectional view showing an example of the configuration of a package according to the fourth embodiment.

[0100] In the figure, the package 400 includes a chip 402, a sealant 404, a transparent substrate 105, a hollow tube 106, and a support substrate 410. In this case, the package 400 can constitute a hollow package in which the chip 402 is mounted.

[0101] The chip 402 is stacked on a support substrate 410. The chip 402 may have a semiconductor element, an optical element, or a MEMS formed thereon.

[0102] For example, a CMOS image sensor can be formed on the chip 402. At this time, a light receiving region MK is provided on the chip 402. A color filter 211 is formed on the light receiving region MK for each pixel. An on-chip lens 212 is formed on the color filter 211 for each pixel. In addition, a bonding electrode 412 to which a through electrode penetrating a support substrate 410 is bonded is formed on the chip 402.

[0103] The sealing surface of the tip 402 may have a recess or groove formed therein for positioning the hollow tube 106 .

[0104] The transparent substrate 105 is placed on the chip 402 via the hollow portion. At this time, the transparent substrate 105 is supported on the chip 402 via the sealing material 404 and bonded to the chip 402.

[0105] The sealant 404 is positioned between the chip 402 and the transparent substrate 105. At this time, the sealant 404 can support the transparent substrate 105 on the chip 402 via a hollow portion. The sealant 404 can be continuously disposed along the outer periphery of the chip 402. The sealant 404 can transition from an uncured state to a cured state while supporting the transparent substrate 105 on the chip 402. At this time, the sealant 404 adheres to the chip 402 and the transparent substrate 105, and can fix the transparent substrate 105 on the chip 402.

[0106] The hollow tube 106 is disposed at a position where it penetrates the sealing material 404 and reaches the hollow portion above the chip 402. At this time, the hollow portion above the chip 402 is ventilated with the outside of the package 400 via the hollow tube 106.

[0107] The support substrate 410 supports the chip 402. A through electrode bonded to the bonding electrode 412 is formed in the support substrate 410. The through electrode may have a two-layer structure of a seed layer 403 and a plating layer 407. An insulating layer 401 is formed on the support substrate 410. The insulating layer 401 can cover the side of the through hole in which the through electrode is embedded. A solder resist film 409 is formed on the insulating layer 401 so as to cover the plating layer 407. A protruding electrode 408 connected to the plating layer 407 through the solder resist film 409 is formed on the plating layer 407. At this time, the package 400 can be mounted on a motherboard via the protruding electrode 408, for example, by solder reflow.

[0108] Here, the planar size and shape of the transparent substrate 105 can be made equal to those of the chip 402. Also, the planar size and shape of the support substrate 410 can be made equal to those of the chip 402. At this time, the positions of the horizontal edges of the transparent substrate 105, the chip 402, and the support substrate 410 can be made to coincide with one another. This allows the package 400 to constitute a WLCSP packaged at the wafer level.

[0109] The support substrate 410 may be an insulating substrate or a semi-insulating substrate. The semi-insulating substrate may be, for example, a non-doped semiconductor substrate. The insulating substrate may be made of, for example, glass, ceramic, resin, AlN, BN, or diamond. The semi-insulating substrate may be made of, for example, Si, GaAs, GaN, or SiC.

[0110] The material of the insulating layer 401 is, for example, SiO ２ , SiN, SiCN, or other inorganic material, or a resin such as polyimide. The material of the bonding electrode 412 may be, for example, a metal such as Al, Cu, AlCu, AlSiCu, or Co. The material of the through electrode may be, for example, a metal such as Cu, Ti, Ta, Al, W, Ni, Ru, or Co, or may be a layered structure of multiple materials.

[0111] 15 to 17 are diagrams showing an example of a method for manufacturing a package according to the fourth embodiment. Note that Fig. 16 and Fig. 17 show an excerpt of a method for manufacturing four packages 400.

[0112] 15 , the laminated wafers 400W are provided with partition areas RA. The partition areas RA are partitioned along scribe lines SBL. Packages 400 are cut out from each partition area RA. At this time, the laminated wafers 400W can be separated into individual packages 400 by cutting along the scribe lines SBL.

[0113] In forming the laminated wafer 400W, as shown in FIG. 16A, a support substrate wafer 410W is bonded to the front side of a semiconductor wafer 402W. Chips 402, each divided into divided regions RA, are integrally formed on the semiconductor wafer 402W. At this time, a color filter 211 and an on-chip lens 212 are formed in each divided region RA. Then, hollow tubes 106 are arranged on the back side of the semiconductor wafer 402W for each divided region RA. The hollow tubes 106 may be fixed to the semiconductor wafer 402W via an adhesive.

[0114] 16B, the uncured sealant 404 is placed on the transparent substrate wafer 105W for each divided region RA. At this time, the uncured sealant 404 can be placed continuously along the outer periphery of each divided region RA.

[0115] Next, as shown in FIG. 16c, the transparent substrate wafer 105W is placed on the semiconductor wafer 402W via the uncured sealant 404 in which the hollow tubes 106 are placed, and the sealant 404 is cured.

[0116] 17A, the support substrate wafer 410W is thinned. The support substrate wafer 410W may be thinned by chemical mechanical polishing (CMP), etch-back, or back grinding.

[0117] Next, as shown in FIG. 17B, through holes are formed in the support substrate wafer 410W for each partitioned region RA, positioned so that the bonding electrodes 412 are exposed. An insulating layer 401 is then formed on the support substrate wafer 410W so that the inner surfaces of the through holes are covered. The insulating layer 401 is then selectively etched to expose the bonding electrodes 412. A seed layer 403, connected to the bonding electrodes 412 via the through holes, is then formed by a method such as sputtering. A resist pattern with openings formed in the positions of the through electrodes is then formed on the seed layer 403, and a plating layer 407 is then formed on the seed layer 403 through the openings. The resist pattern on the seed layer 403 is then removed, and the seed layer 403 is selectively etched using the plating layer 407 as an etching mask to separate the through electrodes.

[0118] 17C, a solder resist film 409 is formed on the insulating layer 401 so as to cover the plated layer 407. Then, a protruding electrode 408 is formed on the plated layer 407, the protruding electrode 408 being connected to the plated layer 407 through the solder resist film 409.

[0119] In this way, in the fourth embodiment described above, hollow tube 106 is provided which reaches the hollow portion by penetrating sealing material 404 of WLCSP on which chip 402 supported by support substrate 410 is mounted. This makes it possible to miniaturize the ventilation portion and reduce the size of package 400 without increasing the difficulty of processing package 400.

[0120] 5. Fifth Embodiment In the above-described fourth embodiment, hollow tube 106 is provided to reach the hollow portion by penetrating sealant 404 of WLCSP on which chip 402 supported by support substrate 410 is mounted. In this fifth embodiment, hollow tube 106 is provided to reach the hollow portion by penetrating sealant 404 of WLCSP on which wiring layer 501 used for flip-chip mounting is formed on chip 402.

[0121] FIG. 18 is a cross-sectional view showing an example of the configuration of a package according to the fifth embodiment.

[0122] In the figure, the package 500 includes a wiring layer 501 instead of the support substrate 410 of the fourth embodiment. The other configuration of the package 500 of the fifth embodiment is similar to the configuration of the package 400 of the fourth embodiment.

[0123] The wiring layer 501 is formed on the chip 402. Wiring 511 and land electrodes 507 are formed on the wiring layer 501. The land electrodes 507 are connected to the bonding electrodes 412 via the wiring 511. A solder resist film 409 is formed on the wiring layer 501 so as to cover the land electrodes 507. Protruding electrodes 408 are formed on the land electrodes 507 and connected to the land electrodes 507 through the solder resist film 409. At this time, the package 500 can be mounted on a motherboard via the protruding electrodes 408, for example, by solder reflow.

[0124] The material of the insulating layer used for the wiring layer 501 is, for example, SiO ２ , SiN, or SiCN can be used. The wiring 511 and the land electrode 507 can be made of a metal such as Al, Cu, AlCu, AlSiCu, or Co.

[0125] 19 to 21 are diagrams showing an example of a method for manufacturing a package according to the fifth embodiment.

[0126] 19 , the laminated wafers 500W are provided with partition regions RB. The partition regions RB are partitioned along scribe lines SBL. Packages 500 are cut out from each partition region RB. At this time, the laminated wafers 500W can be separated into individual packages 500 by cutting along the scribe lines SBL.

[0127] 20A, in forming the laminated wafer 500W, a support substrate wafer 510W is bonded to the front surface side of the semiconductor wafer 402W via an adhesive layer 513. The chips 402 partitioned into partition regions RB are integrally formed on the semiconductor wafer 402W.

[0128] Next, the semiconductor wafer 402W is thinned from the backside as shown in Fig. 20B. The semiconductor wafer 402W may be thinned by CMP, etch-back, or back grinding.

[0129] Next, as shown in FIG. 20c, a color filter 211 and an on-chip lens 212 are formed for each chip 402 cut out from each partition region RB.

[0130] 20d, the hollow tubes 106 are arranged in each partitioned region RB on the rear surface of the semiconductor wafer 402W. The hollow tubes 106 may be fixed to the semiconductor wafer 402W with an adhesive.

[0131] 21A, the uncured sealant 404 is placed on the transparent substrate wafer 105W for each partition region RB. At this time, the uncured sealant 404 can be placed continuously along the outer periphery of each partition region RB.

[0132] Next, as shown in FIG. 21b, the transparent substrate wafer 105W is placed on the semiconductor wafer 402W via the uncured sealant 404 in which the hollow tubes 106 are placed, and the sealant 404 is cured.

[0133] Next, the semiconductor wafer 402W is thinned from the front surface side as shown in Fig. 21C. The thinning of the semiconductor wafer 402W may be performed by CMP, etch-back, or back grinding.

[0134] 21d, a wiring layer 501 is formed on the semiconductor wafer 402W. At this time, wiring 511 connected to the bonding electrodes 412 and land electrodes 507 connected to the wiring 511 are formed on the wiring layer 501. Then, a solder resist film 409 covering the land electrodes 507 is formed on the wiring layer 501, and protruding electrodes 408 connected to the land electrodes 507 through the solder resist film 409 are formed on the wiring layer 501.

[0135] As described above, in the fifth embodiment, the wiring layer 501 used for flip-chip mounting is provided with the hollow tube 106 that penetrates the sealing material 404 of the WLCSP formed on the chip 402 and reaches the hollow portion. This makes it possible to miniaturize the ventilation portion without increasing the difficulty of processing the package 500, and also makes it possible to connect the chip 402 to the outside without forming a through electrode.

[0136] In the fifth embodiment, a hollow tube is provided to ventilate the hollow portion by penetrating the sealing material of the WLCSP. Alternatively, a hollow tube may be provided to ventilate the hollow portion by penetrating the sealing material of a FOWLP (Fan Out Wafer Level Package).

[0137] 6. Sixth Embodiment In the first embodiment described above, hollow tube 106 is provided, which penetrates sealant 104 between package substrate 101, in which cavity CAV is formed, and transparent substrate 105, and reaches cavity CAV. In this sixth embodiment, the end of hollow tube 106, which penetrates sealant 104 between package substrate 101, in which cavity CAV is formed, and transparent substrate 105, and reaches cavity CAV, is bent in a direction away from sealant 104.

[0138] FIG. 22 is a cross-sectional view showing an example of the configuration of a package according to the sixth embodiment.

[0139] In the package of the first embodiment, a hollow tube 606A may be used instead of the hollow tube 106, as shown in FIG. 1A. The hollow tube 606A has a bent portion whose end is bent in a direction away from the sealing material 104. In this case, the bent portion bends from the sealing surface of the package substrate 101 to the side, allowing it to straddle the sealing surface of the package substrate 101. The bend angle of the bent portion can be set to 90°. The side shape of the hollow tube 606A may be U-shaped. This prevents the hollow tube 606A from shifting in the longitudinal direction. The width WH of the sealing surface of the package substrate 101 can be set, for example, within a range of 1 to 2 mm. The distance LD between the leading end of the package substrate 101 and the sealing material 104 in the thickness direction of the sealing material 104 can be set, for example, to approximately 0.5 mm. The curvature Φ of the bent portion can be set, for example, to several tens of μm.

[0140] As shown in Fig. 1B, in the package of the first embodiment described above, a hollow tube 606B may be used in place of the hollow tube 106. The bending angle of the hollow tube 606B at the bending portion can be made larger than 90°.

[0141] As shown in Fig. 1C, in the package of the first embodiment described above, a hollow tube 606C may be used in place of the hollow tube 106. The hollow tube 606C has a bent portion at only one end.

[0142] 23 is a cross-sectional view showing an example of a method for manufacturing a package according to the sixth embodiment, in which the hollow tube 606B shown in FIG.

[0143] 2, after the steps a and b in Fig. 2, the hollow tube 606B is placed on the sealing surface of the package substrate 101. At this time, the hollow tube 606B can be placed in a position that straddles the sealing surface of the package substrate 101. The hollow tube 606B may be adhered to the package substrate 101 via an adhesive.

[0144] Next, as shown in FIG. 23b, uncured sealing material 104 is placed on the sealing surface of package substrate 101 so that the central portion in the longitudinal direction of hollow tube 606B is embedded.

[0145] 23c, a transparent substrate 105 is placed on the uncured sealant 104, and the sealant 104 is cured. At this time, the transparent substrate 105 can be separated from the chip 102 via the cavity CAV.

[0146] As described above, in the sixth embodiment, hollow tube 606A penetrates sealant 104 between package substrate 101, in which cavity CAV is formed, and transparent substrate 105, to reach cavity CAV, and is bent such that the end of hollow tube 606A moves away from sealant 104. This makes it possible to miniaturize the ventilation portion without increasing the difficulty of processing package 100, and also makes it possible to prevent sealant 104 from entering hollow tube 606A while suppressing an increase in the amount of horizontal protrusion of hollow tube 606A.

[0147] Each of the hollow tubes 606A to 606C may be arranged on a long side of the package substrate 101, on a short side of the package substrate 101, or at a corner of the package substrate 101, as shown in Fig. 6. Furthermore, a plurality of each of the hollow tubes 606A to 606C may be arranged on the package substrate 101, as shown in Fig. 7. The cross-sectional shape of each of the hollow tubes 606A to 606C may be a circle, a flattened circle, or a rectangle, as shown in Fig. 9. Each of the hollow tubes 606A to 606C may have a sub-tube inside.

[0148] 7. Seventh Embodiment In the above-described first embodiment, hollow tube 106 is provided to reach cavity CAV by penetrating sealant 104 between package substrate 101 in which cavity CAV is formed and transparent substrate 105. In this seventh embodiment, hollow tube 106 is provided to reach cavity CAV by penetrating sealant 104 between package substrate 101 in which cavity CAV is formed and transparent substrate 105, and a groove for positioning hollow tube 106 is provided in the package substrate.

[0149] 24 is a diagram showing an example of the configuration of a package according to the seventh embodiment, where "a" in the figure is a cross-sectional view showing an example of the configuration in which the package 701A is cut vertically at the position of the hollow tube 106A, and "b" in the figure is a view of the hollow tube 106A of the package 701A as seen from the direction of the arrow A.

[0150] In the figure, package 700 includes a package substrate 701A and hollow tube 106A instead of package substrate 101 and hollow tube 106 of the first embodiment described above. Other configurations of package 700 of the seventh embodiment are similar to those of package 100 of the first embodiment described above.

[0151] The package substrate 701A has a groove MZA that positions the hollow tube 106A. The groove MZA is arranged on the sealing surface of the package substrate 701A. At this time, the groove MZA can cross the sealing surface of the package substrate 701A. The groove MZA may be formed by blade dicing, by laser processing, or by molding using a mold die.

[0152] A hollow tube 106A is placed in the groove MZA. At this time, the sealant 104 is placed between the package substrate 701A and the transparent substrate 105 so as to be positioned above the groove MZA. The sealant 104 may penetrate into the groove MZA.

[0153] FIG. 25 is a cross-sectional view showing an example of a method for manufacturing a package according to the seventh embodiment.

[0154] 25a, after the steps of a and b in Fig. 2, the hollow tube 106A is placed in the groove MZA of the package substrate 701A. The hollow tube 106A may be adhered to the package substrate 701A via an adhesive.

[0155] Next, as shown in FIG. 25b, an uncured sealant 104 is placed on the sealing surface of the package substrate 701A so as to be positioned above the groove MZA.

[0156] 25c, a transparent substrate 105 is placed on the uncured sealant 104, and the sealant 104 is cured. At this time, the transparent substrate 105 can be separated from the chip 102 via the cavity CAV.

[0157] 26 to 29 are cross-sectional views showing other configuration examples of the package according to the seventh embodiment.

[0158] 26A, a groove MZB having a curved inner surface may be formed in the sealing surface of the package substrate 701B. In this case, a hollow tube 106A having a circular cross section may be placed in the groove MZB. The depth of the groove MZB may be equal to the diameter of the hollow tube 106A.

[0159] As shown in FIG. 26B, a groove MZC having a rectangular cross section may be formed in the sealing surface of the package substrate 701C. In this case, a hollow tube 106F having a semicircular cross section may be disposed in the groove MZC. The depth of the groove MZC may be equal to the radius of the hollow tube 106F. Here, the semicircular portion of the hollow tube 106F may be disposed at the bottom of the groove MZC. This allows the flat surface of the hollow tube 106F to be adjacent to the sealing surface of the package substrate 701C. This improves the flatness of the sealing surface of the package substrate 701C and prevents a decrease in the controllability of the application of the sealant 104.

[0160] 27A, a groove MZD having a rectangular cross section may be formed in the sealing surface of the package substrate 701D. In this case, a hollow tube 106B having a flattened circular cross section may be placed in the groove MZD. The depth of the groove MZD may be equal to the minor axis of the hollow tube 106B.

[0161] 27b, a groove MZE having a triangular cross section may be formed in the sealing surface of the package substrate 701E. In this case, a hollow tube 106G having a triangular cross section may be placed in the groove MZE. The depth of the groove MZE may be equal to the height of the hollow tube 106G.

[0162] As shown in Figure 28a, a groove MZF with a square cross section may be formed in the sealing surface of the package substrate 701F. In this case, a hollow tube 106C with a square cross section can be placed in the groove MZF. The depth of the groove MZF can be made equal to the length of one side of the hollow tube 106C. Here, by placing the hollow tube 106C with a square cross section in the groove MZF, the sealing surface of the package substrate 701F can be flattened, and a decrease in controllability of application of the sealant 104 can be prevented.

[0163] As shown in Fig. 28b, a groove MZG having a rectangular cross section may be formed in the sealing surface of the package substrate 701G. In this case, a hollow tube 106C having a square cross section may be placed in the groove MZG. The depth of the groove MZG may be equal to the length of one side of the hollow tube 106C. The width of the groove MZF may be greater than the length of one side of the hollow tube 106C. In this case, the groove MZF may be filled with a sealing material 104.

[0164] As shown in Figure 29a, a groove MZH with a rectangular cross section may be formed in the sealing surface of the package substrate 701H. In this case, a hollow tube 106C with a square cross section can be placed in the groove MZH. The depth of the groove MZH can be smaller than the length of one side of the hollow tube 106C. In this case, a portion of the hollow tube 106C can protrude from the groove MZH.

[0165] As shown in Fig. 29b, a groove MZI having a rectangular cross section may be formed on the sealing surface of the package substrate 701I. In this case, a hollow tube 106C having a square cross section may be placed in the groove MZI. The depth of the groove MZI may be greater than the length of one side of the hollow tube 106C. In this case, a sealing material 104 may be filled in the groove MZI.

[0166] Each of the grooves MZA to MZI may be arranged on the long side of each of the package substrates 701A to 701I, on the short side of each of the package substrates 701A to 701I, or at the corner of each of the package substrates 701A to 701I. Also, a plurality of each of the grooves MZA to MZI may be arranged in each of the package substrates 701A to 701I. A plurality of hollow tubes may be arranged in each of the grooves MZA to MZI.

[0167] As described above, in the seventh embodiment, hollow tube 106A is provided, which penetrates sealant 104 between package substrate 701A, in which cavity CAV is formed, and transparent substrate 105, and reaches cavity CAV, and groove MZA for positioning hollow tube 106A is provided in package substrate 701A. This makes it possible to miniaturize the ventilation portion without increasing the difficulty of processing package 700, and also makes it possible to prevent displacement of hollow tube 106A.

[0168] 8. Eighth Embodiment In the above-described first embodiment, hollow tube 106 is provided, which penetrates sealant 104 between package substrate 101 in which cavity CAV is formed and transparent substrate 105 to reach cavity CAV. In this eighth embodiment, package substrate 101 in which cavity CAV is formed and transparent substrate 105 are directly bonded together, and groove MZA formed in package substrate 701A is used as a vent for cavity CAV.

[0169] FIG. 30 is a cross-sectional view showing an example of the configuration of a package according to the eighth embodiment.

[0170] In the figure, the package 800 is the package 700 of the seventh embodiment described above, with the sealing material 104 removed. The other configuration of the package 800 of the eighth embodiment is the same as the configuration of the package 700 of the seventh embodiment described above. At this time, the transparent substrate 105 is directly bonded to the package substrate 701A so as to be positioned above the groove MZA.

[0171] The direct bonding between the transparent substrate 105 and the package substrate 701A can be performed by compression bonding between oxides. This compression bonding can be performed, for example, at a temperature of 250° C. or less after plasma activation of the bonding surfaces. In this case, an oxide may be formed on the bonding surfaces between the transparent substrate 105 and the package substrate 701A.

[0172] For example, in plasma activation using glass as the transparent substrate 105, oxygen plasma or nitrogen plasma can be irradiated onto the bonding surfaces to hydrophilize them. Then, the bonding surfaces can be bonded together based on hydrogen bonds between OH groups formed on the bonding surfaces by adsorption of moisture from the air. Then, heat treatment decomposes the OH groups, and the resulting hydrogen diffuses into the interface layer, achieving direct bonding based on Si-O-Si bonds mediated by oxygen. Plasma activation of the bonding surfaces before heat treatment can improve the moisture adsorption properties of the bonding surfaces, and the bonding strength required to ensure the reliability of the package 800 can be achieved even with heat treatment at temperatures below 250°C.

[0173] As described above, in the eighth embodiment, the package substrate 101 in which the cavity CAV is formed is directly bonded to the transparent substrate 105, and the groove MZA formed in the package substrate 701A is used as a ventilation hole for the cavity CAV. This makes it possible to miniaturize the ventilation portion without increasing the difficulty of processing the package 800, and also improves the positioning accuracy of the ventilation portion.

[0174] 9. Application Examples to Mobile Bodies The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0175] FIG. 31 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0176] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 31 , the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0177] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0178] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0179] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0180] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0181] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0182] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0183] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0184] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12020 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0185] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying information to vehicle occupants or the outside of the vehicle. In the example of Fig. 31, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0186] FIG. 32 is a diagram showing an example of the installation position of the imaging unit 12031.

[0187] In FIG. 32, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0188] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0189] 32 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0190] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0191] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which runs autonomously without relying on driver operation.

[0192] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0193] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0194] The above describes an example of a vehicle control system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to the imaging unit 12031 among the above-described configurations. Specifically, for example, each of the packages 100 to 800 according to the above-described embodiments can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the vehicle control system 12000, the reliability of the imaging unit 12031 can be improved without affecting the structural design of the board or housing of the imaging unit 12031.

[0195] Note that the above-described embodiment shows an example for realizing the present technology, and the matters in the embodiment and the matters specifying the invention in the claims correspond to each other. Similarly, the matters specifying the invention in the claims and the matters in the embodiment of the present technology with the same title correspond to each other. However, the present technology is not limited to the embodiment, and can be realized by applying various modifications to the embodiment within the scope of the gist. Furthermore, the effects described in this specification are merely examples and are not limited, and other effects may also be present.

[0196] The present technology may also be configured as follows: (1) A package comprising: a chip; a sealant that seals the chip so that a hollow portion is located over the chip; and a hollow tube that penetrates the sealant and reaches the hollow portion. (2) The package according to (1), further comprising: a transparent member that is placed over the chip via the hollow portion and supported by the sealant. (3) The package according to (2), further comprising: a package substrate that is provided with a cavity and in which the chip is mounted. (4) The package according to (3), wherein the hollow tube comprises a bent portion that bends from an end of a sealing surface of the package substrate to a side surface. (5) The package according to (4), wherein the bent portion has a bend angle of 90°. (6) The package according to any one of (3) to (5), wherein the package substrate comprises a groove that positions the hollow tube. (7) The package according to (6), wherein the groove is located on the sealing surface of the package substrate. (8) The package according to any one of (3) to (7), wherein the hollow tube is arranged at the center of a long side, a center of a short side, or a corner of the package substrate. (9) The package according to any one of (3) to (8), wherein one or more hollow tubes are arranged on the package substrate. (10) The package according to any one of (3) to (9), wherein the hollow tubes are arranged so as to be line-symmetrical about the center of a side of the package substrate, or so as to face each other on an opposing side of the package substrate. (11) The package according to any one of (1) to (10), wherein the outer diameter of the hollow tube is equal to the thickness of the sealing material. (12) The package according to any one of (1) to (11), wherein the hollow tube is arranged at the upper, lower, or central portion in the thickness direction of the sealing material. (13) The package according to any one of (1) to (12), wherein the outer end of the hollow tube is located outside the bleed of the sealing material. (14) The package according to any one of (2) to (13), wherein the distance between the end of the hollow tube and the sealing material is 300 μm or more. (15) The package according to any one of (1) to (14), wherein the inner diameter of the hollow tube is 10 μm or less.(16) The package according to any one of (1) to (15), further comprising a sub-tube disposed inside the hollow tube. (17) The package according to any one of (1) to (16), further comprising a cross-sectional shape of the hollow tube that is a circle, an ellipse, a polygon, or a flattened shape thereof. (18) The package according to any one of (1) to (17), further comprising a filler contained in the sealing material. (19) The package according to any one of (1) to (18), further comprising a light-receiving element, a light-emitting element, a display element, or a MEMS (Micro Electro Mechanical Systems) formed on the chip. (20) A method for manufacturing a package, further comprising: die-bonding a chip to a package substrate having a cavity formed therein; arranging a transparent member on the package substrate via an uncured sealing material disposed so that the hollow tube passes through; and curing the uncured sealing material disposed so that the hollow tube passes through.

[0197] 100 Package 101 Package substrate 102 Chip 103 Bonding wire 104 Sealant 105 Transparent substrate 106 Hollow tube 107 Land electrode 108 Protruding electrode CAV Cavity MK Light receiving surface

Claims

1. A package comprising: a chip; a sealant for sealing the chip so that a hollow portion is located above the chip; and a hollow tube that passes through the sealant and reaches the hollow portion.

2. The package according to claim 1, further comprising a transparent member disposed on said chip through said hollow portion and supported by said sealing material.

3. The package according to claim 2, further comprising a package substrate having a cavity therein, the chip being mounted within the cavity.

4. The package according to claim 3, wherein the hollow tube has a bent portion that bends from an end of the sealing surface of the package substrate to a side surface.

5. The package according to claim 4, wherein the bend angle of the bent portion is 90°.

6. The package according to claim 3, wherein the package substrate is provided with a groove for positioning the hollow tube.

7. The package of claim 6, wherein the groove is disposed on a sealing surface of the package substrate.

8. The package according to claim 3, wherein the hollow tube is disposed at the center of a long side, the center of a short side, or a corner of the package substrate.

9. The package according to claim 3, wherein one or more of said hollow tubes are disposed on said package substrate.

10. The package according to claim 3, wherein the hollow tubes are arranged so as to be line-symmetrical about the center of a side of the package substrate or so as to face opposite sides of the package substrate.

11. The package of claim 1, wherein the outer diameter of the hollow tube is equal to the thickness of the sealant.

12. The package according to claim 1, wherein the hollow tube is disposed at the upper, lower or central portion in the thickness direction of the sealing material.

13. The package of claim 1, wherein the outer end of the hollow tube is located outside the bleed of the sealant.

14. The package according to claim 1, wherein the distance between the end of the hollow tube and the sealing material is 300 μm or more.

15. The package of claim 1, wherein the hollow tube has an inner diameter of 10 μm or less.

16. The package of claim 1 further comprising a secondary tube disposed within said hollow tube.

17. The package according to claim 1, wherein the cross-sectional shape of the hollow tube is a circle, an ellipse, a polygon, or a flattened shape thereof.

18. The package according to claim 1, wherein the material of the hollow tube is the same as the filler contained in the sealing material.

19. The package according to claim 1, wherein the chip is formed with a light receiving element, a light emitting element, a display element or a MEMS (Micro Electro Mechanical Systems).

20. A method for manufacturing a package, comprising the steps of: die-bonding a chip to a package substrate having a cavity formed therein; arranging a transparent member on the package substrate via an uncured sealant arranged so that the hollow tube passes through; and curing the uncured sealant arranged so that the hollow tube passes through.

Images