Connection apparatus and connection method

Abstract

This connection apparatus connects a frame to a mask. The connection apparatus includes a first pressing plate, a suction device, a second pressing plate, and a pressing device. The first pressing plate has a first support surface that supports the mask. On the first pressing plate, a first suction hole that opens to the first support surface is formed. The suction device suctions the inside of the first suction hole. The second pressing plate has a second support surface for supporting the frame. The second support surface faces the first support surface. The pressing device moves the first pressing plate and / or the second pressing plate to press the first pressing plate and the second pressing plate against each other.

Description

Connection device and connection method

[0001] SUMMARY OF THE INVENTION An embodiment of the present disclosure relates to a connecting device and a connecting method for connecting a frame to a mask.

[0002] Vapor deposition is known as a method for forming precise patterns. In vapor deposition, a mask with openings formed therein is first combined with a substrate. Then, a vapor deposition material is applied to the substrate through the openings in the mask. As a result, a vapor deposition layer containing the vapor deposition material is formed on the substrate in a pattern corresponding to the pattern of the openings in the mask. Vapor deposition is used, for example, as a method for forming pixels of organic electroluminescence (EL) display devices. Patent Document 1 discloses a mask used in vapor deposition.

[0003] JP 2009-062565 A

[0004] If openings are formed close to the outer edge of the mask, the outer edge becomes easily damaged, making the mask difficult to handle. Furthermore, when openings are formed close to the outer edge, the outer edge of the mask is narrow. As a result, when gripping the mask, there is a risk that not only the outer edge but also the region inside the outer edge, i.e., the region of the mask where the openings are formed, will be gripped. In this case, there is a risk that the region of the mask where the openings are formed will be contaminated. On the other hand, there is a demand for forming openings close to the outer edge of the mask, which enables the deposition layer to be formed over a wider area of ​​the substrate using a single mask.

[0005] Attaching a frame to the outer edge of the mask is thought to prevent damage to the mask. However, if the mask is attached to the frame in a bent or distorted state, a large gap may occur between the mask and the substrate during the vapor deposition process. This gap may prevent the deposition material from being deposited accurately on the substrate. In fact, according to the findings of the present inventors, in a framed mask manufactured by manually connecting the mask to the frame, the surface of the mask facing the substrate is not flat. For example, the height difference between various parts of the mask surface facing the substrate can be a maximum of 50 μm or more. Therefore, there is a need to improve the flatness of framed masks.

[0006] An object of the embodiments of the present disclosure is to provide a connection device and a connection method that can effectively solve such problems.

[0007] A connection device according to an embodiment of the present disclosure is a connection device for connecting a frame to an outer region of a mask including an inner region having a plurality of openings and an outer region surrounding the inner region. The connection device may include: a first pressure platen having a first support surface for supporting the mask, the first pressure platen having first suction holes opening into the first support surface, a suction device for suctioning the first suction holes, a second pressure platen having a second support surface for supporting the frame, the second pressure platen having a second support surface facing the first support surface, and a pressing device for moving the first pressure platen and / or the second pressure platen to press the first pressure platen and the second pressure platen against each other.

[0008] A connection method according to an embodiment of the present disclosure is a connection method for connecting a frame to an outer region of a mask, the outer region including an inner region having a plurality of openings and an outer region surrounding the inner region, using the connection device according to the embodiment. The connection method may include the steps of placing the mask on the first support surface of the first pressure platen and sucking the mask onto the first support surface by using the suction device to draw in the first suction holes, placing the frame on the second support surface of the second pressure platen, forming a connection layer on the outer region of the mask or a region of the frame facing the outer region, and using the pressure device to move the first pressure platen to which the mask is adsorbed and / or the second pressure platen supporting the frame to press the first pressure platen and the second pressure platen against each other, thereby connecting the mask and the frame via the connection layer.

[0009] A connecting device according to a modified embodiment of the present disclosure is a connecting device for connecting a frame to an outer region of a mask including an inner region having a plurality of openings and an outer region surrounding the inner region. The connecting device may include a first pressure platen having a first support surface for supporting the mask, a second pressure platen having a second support surface for supporting the frame, the second support surface facing the first support surface, and a pressing device that moves the first pressure platen and / or the second pressure platen to press the first pressure platen and the second pressure platen against each other, and at least a portion of the first support surface of the first pressure platen may be covered with a bonding layer.

[0010] A connecting method according to a modified embodiment of the present disclosure is a connecting method for connecting a frame to an outer region of a mask, the outer region including an inner region having a plurality of openings and an outer region surrounding the inner region, using a connecting device according to the modified embodiment. The connecting method may include the steps of placing the mask on the first support surface of the first press platen and bonding the mask to the bonding layer, placing the frame on the second support surface of the second press platen, forming a connecting layer on the outer region of the mask or a region of the frame facing the outer region, and using the pressing device to move the first press platen and / or the second press platen supporting the frame to which the mask is bonded, thereby pressing the first press platen and the second press platen against each other, thereby connecting the mask and the frame via the connecting layer.

[0011] According to the embodiments of the present disclosure, the flatness of a framed mask can be improved.

[0012] 5A is a plan view showing an example of an organic device; FIG. 5B is a diagram showing an example of a vapor deposition apparatus equipped with a framed mask; FIG. 5C is a plan view showing an example of a framed mask when viewed from the incident surface side; FIG. 5D is a plan view showing an example of a framed mask when viewed from the exit surface side; FIG. 5E is a cross-sectional view of the framed mask taken along line V-V of FIG. 3; FIG. 5F is an enlarged view of the portion surrounded by the two-dot chain line in the cross section shown in FIG. 5A; FIG. 5G is a cross-sectional view showing the overall configuration of a connection device; FIG. 5H is a cross-sectional view showing the overall configuration of a connection device; FIG. 5I is a cross-sectional view showing the overall configuration of a connection device; FIG. 5J is a cross-sectional view showing the overall configuration of a connection device; FIG. 5J is a cross-sectional view showing the overall configuration of a connection device; FIG. 5J is a cross-sectional view showing the overall configuration of a connection device; FIG. 5I ... Fig. 11 is a diagram corresponding to Fig. 7 and shows a modified example of the connection device. Fig. 12 is a diagram corresponding to Fig. 7 and shows a modified example of the connection device.

[0013] In this specification and drawings, unless otherwise specified, terms that refer to the materials that form the basis of a certain configuration, such as "substrate," "sheet," and "film," are not to be distinguished from one another solely on the basis of differences in name.

[0014] In this specification and drawings, unless otherwise specified, terms that specify shapes, geometric conditions, and their degrees, such as "parallel" and "orthogonal," and values ​​of lengths and angles, are not bound by strict meanings, but are interpreted to include a range within which similar functions can be expected.

[0015] In this specification and drawings, unless otherwise specified, when a certain component, such as a certain region, is referred to as "above" or "below," "upper" or "lower," or "upward" or "below" another component, such as another region, this includes cases where the component is in direct contact with the other component. It also includes cases where another component is contained between the component and the other component, i.e., cases where the components are in indirect contact. Furthermore, unless otherwise specified, the terms "above," "upper side," or "upper," or "under," "lower side," or "lower" may be used in the up-down direction.

[0016] In this specification and drawings, unless otherwise specified, the state in which the surface of element A is "opposed to" the surface of element B includes not only the case in which the surface of element A is in contact with the surface of element B, but also the case in which element C is located between the surfaces of element A and element B. In other words, the term "opposed to" is a term that indicates the orientation of two surfaces.

[0017] In this specification and drawings, unless otherwise specified, the same or similar symbols are used to designate the same parts or parts having similar functions, and repeated explanations may be omitted. Furthermore, for the sake of convenience, the dimensional ratios of the drawings may differ from the actual ratios, and some components may be omitted from the drawings.

[0018] In this specification and drawings, unless otherwise specified, one embodiment of this specification may be combined with other examples to the extent that no contradiction occurs. In addition, other examples may also be combined with each other to the extent that no contradiction occurs.

[0019] Unless otherwise specified, in the present specification and drawings, when two or more steps or processes are disclosed in a method such as a manufacturing method, other steps or processes that are not disclosed may be performed between the disclosed steps or processes. In addition, the order of the disclosed steps or processes is arbitrary within the range that does not cause a contradiction.

[0020] In one embodiment of the present specification, an example will be described in which a mask is used to form an organic layer or an electrode on a substrate when manufacturing an organic electroluminescence (EL) display device. However, the use of the mask is not particularly limited, and this embodiment can be applied to masks used for various purposes. For example, the mask of this embodiment may be used to form electrodes of a device for displaying or projecting images or videos to express virtual reality (VR) or augmented reality (AR). The mask of this embodiment may also be used to form electrodes of a display device other than an organic electroluminescence (EL) display device, such as an electrode of a liquid crystal display device. The mask of this embodiment may also be used to form electrodes of an organic device other than a display device, such as an electrode of a pressure sensor.

[0021] A first aspect of the present disclosure is a connection device for connecting a frame to an outer region of a mask including an inner region in which a plurality of openings are formed and an outer region surrounding the inner region, the connection device comprising: a first pressure plate having a first support surface for supporting the mask, the first pressure plate having a first suction hole that opens into the first support surface; a suction device for suctioning the first suction hole; a second pressure plate having a second support surface for supporting the frame, the second support surface facing the first support surface; and a pressing device for moving the first pressure plate and / or the second pressure plate to press the first pressure plate and the second pressure plate against each other.

[0022] In the connection device according to the second aspect in accordance with the first aspect described above, at least a portion of the first support surface of the first pressing platen may be covered with a porous layer.

[0023] In the connection device according to the third aspect in accordance with the first or second aspect described above, the second pressure plate may be formed with a second suction hole that opens to the second support surface, and the suction device may apply suction to the inside of the second suction hole.

[0024] A fourth aspect of the present disclosure is a connection device for connecting a frame to an outer region of a mask, the outer region including an inner region in which a plurality of openings are formed and an outer region surrounding the inner region, the connection device comprising: a first pressure platen having a first support surface for supporting the mask; a second pressure platen having a second support surface for supporting the frame, the second support surface facing the first support surface; and a pressing device that moves the first pressure platen and / or the second pressure platen to press the first pressure platen and the second pressure platen against each other, wherein at least a portion of the first support surface of the first pressure platen is covered with a bonding layer.

[0025] In the connection device according to the fifth aspect in accordance with the fourth aspect described above, the second pressure plate may be formed with a second suction hole that opens into the second support surface, and the connection device may further include a suction device that draws suction inside the second suction hole.

[0026] In the connection device according to a sixth aspect which is in accordance with any one of the first aspect to the fifth aspect described above, a first recess may be formed in the first support surface to accommodate at least a portion of the mask in the thickness direction.

[0027] In the connecting device according to the seventh aspect in accordance with the sixth aspect described above, the depth of the first recess may be greater than 0 μm and not greater than 1000 μm.

[0028] In the connection device according to an eighth aspect which is in accordance with any one of the first aspect to the seventh aspect described above, a second recess may be formed in the second support surface to accommodate at least a portion of the frame in the thickness direction.

[0029] In the connecting device according to the ninth aspect in accordance with the eighth aspect described above, the second recess may have a depth of 500 μm or more and 30 mm or less.

[0030] The connection device according to the tenth aspect, which is in accordance with any of the first aspect to the ninth aspect described above, may further include a heating heater provided inside the first pressure plate and / or the second pressure plate.

[0031] The connection device according to an eleventh aspect, which is in accordance with any one of the first aspect to the tenth aspect described above, may further include a chamber that accommodates the first pressure platen and the second pressure platen, and a pressure reducing device that reduces the pressure inside the chamber.

[0032] In the connection device according to the twelfth aspect, which is in accordance with any of the first aspect to the eleventh aspect described above, the second pressure plate may be formed with an alignment opening that penetrates the second pressure plate in the thickness direction, and the connection device may further include an alignment camera that can photograph the area between the second support surface and the first support surface through the alignment opening.

[0033] A thirteenth aspect of the present disclosure is a connection method for connecting a frame to an outer region of a mask, the outer region including an inner region in which a plurality of openings are formed and an outer region surrounding the inner region, using the connection device according to the first aspect described above, the connection method comprising the steps of: placing the mask on the first support surface of the first pressure platen, and adsorbing the mask to the first support surface by using the suction device to suck inside the first suction holes; placing the frame on the second support surface of the second pressure platen; forming a connection layer in the outer region of the mask or in a region of the frame facing the outer region; and using the pressure device to move the first pressure platen to which the mask is adsorbed and / or the second pressure plate supporting the frame to press the first pressure platen and the second pressure platen against each other, thereby connecting the mask and the frame via the connection layer.

[0034] The connecting method according to the fourteenth aspect in accordance with the thirteenth aspect described above may further include a step of stopping suction in the first suction hole by the suction device after connecting the mask and the frame.

[0035] A fifteenth aspect of the present disclosure is a connection method for connecting a frame to an outer region of a mask, the outer region including an inner region in which a plurality of openings are formed and an outer region surrounding the inner region, using the connection device according to the fourth aspect described above, the connection method comprising the steps of: placing the mask on the first support surface of the first pressure platen and bonding the mask to the bonding layer; placing the frame on the second support surface of the second pressure platen; forming a connection layer in the outer region of the mask or in a region of the frame facing the outer region; and using the pressing device to move the first pressure platen and / or the second pressure plate supporting the frame to which the mask is bonded, thereby pressing the first pressure platen and the second pressure platen against each other, thereby connecting the mask and the frame via the connection layer.

[0036] In the connection method according to the 16th aspect which is in accordance with any of the 13th aspect to the 15th aspect described above, the second pressure plate may be formed with a second suction hole which opens into the second support surface, the connection device may be equipped with a suction device which draws air into the second suction hole, and the connection method may further comprise the step of, after placing the frame on the second pressure plate, drawing air into the second suction hole with the suction device.

[0037] In the connection method according to the 17th aspect, which is in accordance with any one of the 13th aspect to the 16th aspect described above, a heating heater may be provided inside the first pressure plate and / or the second pressure plate, and during the step of pressing the first pressure plate and the second pressure plate against each other, the first pressure plate and / or the second pressure plate may be heated by the heating heater.

[0038] In the connection method according to the 18th aspect, which is in accordance with any one of the 13th aspect to the 17th aspect described above, the connection device may further include a chamber that accommodates the first pressure platen and the second pressure platen, and a pressure reducing device that reduces the pressure inside the chamber, and during the process of pressing the first pressure platen and the second pressure platen against each other, the pressure inside the chamber may be reduced by the pressure reducing device.

[0039] In the connection method according to the 19th aspect, which is in accordance with any of the 13th aspect to the 18th aspect described above, alignment marks may be formed on the mask and the frame, respectively, and the second pressure plate may have an alignment opening formed therein that penetrates the second pressure plate in the thickness direction, and the connection device may further include an alignment camera that can capture an image of the area between the second support surface and the first support surface through the alignment opening, and during the step of placing the frame on the second support surface of the second pressure plate, the alignment marks on the mask and the frame may be photographed by the alignment camera through the alignment opening, thereby aligning the mask and the frame.

[0040] An embodiment will be described with reference to Figures 1 to 9. First, an organic device 100 including an organic layer formed using a mask will be described. Figure 1 is a cross-sectional view showing an example of the organic device 100.

[0041] The organic device 100 includes a substrate 110 and a plurality of elements 115 arranged along an in-plane direction of the substrate 110. The substrate 110 includes a first surface 111 and a second surface 112 located on the opposite side of the first surface 111. The elements 115 are located on the first surface 111. The elements 115 are, for example, pixels. The substrate 110 may include two or more types of elements 115. For example, the substrate 110 may include a first element 115A and a second element 115B. Although not shown, the substrate 110 may also include a third element. The first element 115A, the second element 115B, and the third element are, for example, a red pixel, a blue pixel, and a green pixel.

[0042] The element 115 may have a first electrode 120 , an organic layer 130 overlying the first electrode 120 , and a second electrode 140 overlying the organic layer 130 .

[0043] The organic device 100 may include an insulating layer 160 located between two adjacent first electrodes 120 in a planar view. The insulating layer 160 includes, for example, polyimide. The insulating layer 160 may overlap an edge of the first electrode 120. "Planar view" means viewing an object along the normal direction to the surface of a plate-like member such as the substrate 110.

[0044] The substrate 110 may be an insulating member. Examples of materials that can be used for the substrate 110 include rigid materials such as silicon, quartz glass, Pyrex (registered trademark) glass, and synthetic quartz plates, as well as flexible materials such as resin films, optical resin plates, and thin glass. The substrate 110 may have a planar shape similar to that of silicon wafers used in semiconductor manufacturing. In this case, the substrate 110 can be processed using equipment used in semiconductor manufacturing processes. For example, the first electrode 120, the insulating layer 160, and the like can be formed on the substrate 110 using equipment used in semiconductor manufacturing processes.

[0045] The element 115 is configured to realize some function by applying a voltage between the first electrode 120 and the second electrode 140 or by causing a current to flow between the first electrode 120 and the second electrode 140. For example, if the element 115 is a pixel of an organic EL display device, the element 115 can emit light that forms an image.

[0046] The first electrode 120 includes a conductive material. For example, the first electrode 120 includes a metal, a conductive metal oxide, or another conductive inorganic material. The first electrode 120 may include a transparent and conductive metal oxide such as indium tin oxide.

[0047] The organic layer 130 includes an organic material. When the organic layer 130 is energized, the organic layer 130 can perform some function. "Electrification" means that a voltage is applied to the organic layer 130 or that a current flows through the organic layer 130. The organic layer 130 may be, for example, a light-emitting layer that emits light when energized, or a layer whose light transmittance or refractive index changes when energized. The organic layer 130 may include an organic semiconductor material.

[0048] 1 , the organic layer 130 may include a first organic layer 130A and a second organic layer 130B. The first organic layer 130A is included in the first element 115A. The second organic layer 130B is included in the second element 115B. Although not shown, the organic layer 130 may include a third organic layer included in a third element. The first organic layer 130A, the second organic layer 130B, and the third organic layer are, for example, a red light-emitting layer, a blue light-emitting layer, and a green light-emitting layer.

[0049] When a voltage is applied between the first electrode 120 and the second electrode 140, the organic layer 130 located therebetween is driven. If the organic layer 130 is an emitting layer, light is emitted from the organic layer 130 and extracted to the outside from the second electrode 140 side or the first electrode 120 side.

[0050] The organic layer 130 may further include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and the like.

[0051] The second electrode 140 may include a conductive material such as a metal. Examples of materials that can be used for the second electrode 140 include platinum, gold, silver, copper, iron, tin, chromium, aluminum, indium, lithium, sodium, potassium, calcium, magnesium, chromium, carbon, and alloys thereof. As shown in FIG. 1 , the second electrode 140 may extend across two adjacent organic layers 130 in a plan view.

[0052] Next, a method for forming the organic layer 130 on the substrate 110 by vapor deposition will be described. Fig. 2 is a diagram showing a vapor deposition apparatus 10. The vapor deposition apparatus 10 performs a vapor deposition process for depositing a vapor deposition material on an object.

[0053] 2 , the vapor deposition apparatus 10 may include therein a vapor deposition source 6, a heater 8, and a framed mask 15. The vapor deposition apparatus 10 may further include an exhaust unit for creating a vacuum atmosphere inside the vapor deposition apparatus 10. The vapor deposition source 6 is, for example, a crucible. The vapor deposition source 6 contains a vapor deposition material 7 such as an organic material or a metal material. The heater 8 heats the vapor deposition source 6 to evaporate the vapor deposition material 7 under a vacuum atmosphere.

[0054] The framed mask 15 includes a mask 20 and a frame 60 attached to the mask 20. The mask 20 includes an incident surface 201, an exit surface 202, and a second opening 41. The exit surface 202 is located opposite the incident surface 201. The framed mask 15 is supported by a mask holder 9. The framed mask 15 is arranged so that the incident surface 201 faces the deposition source 6 and the exit surface 202 faces the first surface 111 of the substrate 110. A portion of the deposition material 7 that enters the mask 20 from the exit surface 202 passes through the second opening 41 and exits from the exit surface 202. The deposition material 7 that exits from the exit surface 202 adheres to the first surface 111 of the substrate 110. The exit surface 202 of the mask 20 may be in contact with the first surface 111 of the substrate 110.

[0055] As shown in FIG. 2 , the deposition apparatus 10 may include a magnet 5 disposed on the second surface 112 side of the substrate 110. When the mask 20 includes a metal material, the magnet 5 can magnetically attract the mask 20 toward the substrate 110. As a result, the gap between the mask 20 and the substrate 110 can be reduced or eliminated. This can prevent shadows from occurring during the deposition process. In this application, a shadow refers to a phenomenon in which the thickness of the organic layer 130 formed near the wall surface of the second opening 41 is smaller than the thickness of the organic layer 130 formed at the center of the second opening 41. The shadow occurs due to the deposition material 7 adhering to the wall surface of the mask 20, the deposition material 7 entering the gap between the mask 20 and the substrate 110, or the like.

[0056] Next, the framed mask 15 will be described in detail. Fig. 3 is a plan view showing an example of the framed mask 15 when viewed from the side of the incident surface 201. Fig. 4 is a plan view showing an example of the framed mask 15 when viewed from the side of the exit surface 202. Fig. 5A is a cross-sectional view taken along line V-V of the framed mask 15 in Fig. 3. Fig. 5B is an enlarged view of the portion surrounded by the two-dot chain line in the cross section of Fig. 5A.

[0057] First, the mask 20 will be described in detail. As shown in Fig. 5A, the mask 20 includes a first layer 30 and a second layer 40 arranged in this order from the incident surface 201 toward the exit surface 202. The first layer 30 may be made of, for example, silicon, a silicon compound, glass, or aluminum oxide (Al ２ O ３ ) The silicon compound is, for example, silicon carbide (SiC). As shown in FIG. 5A, the mask 20 may further include an intermediate layer 50. The intermediate layer 50 is disposed between the first layer 30 and the second layer 40. Each layer will be described below.

[0058] 5B , the first layer 30 includes a first surface 301, a second surface 302, a first opening 31, and a first wall surface 32. The first surface 301 may constitute the incident surface 201. The second surface 302 is located on the opposite side of the first surface 301.

[0059] The first opening 31 penetrates the first layer 30 from the first surface 301 to the second surface 302. As shown in Fig. 3 , the first layer 30 may include a plurality of first openings 31. The plurality of first openings 31 may be aligned in a first direction D1 and a second direction D2. The second direction D2 may be perpendicular to the first direction D1.

[0060] The first opening 31 may correspond to one screen of the organic EL display device. The mask 20 shown in Fig. 3 can simultaneously form organic layer patterns corresponding to multiple screens on the substrate 110. As shown in Fig. 3, the first opening 31 may have a rectangular outline in a plan view.

[0061] The first wall surface 32 is the surface of the first layer 30 facing the first opening 31. In the example shown in FIG.

[0062] As shown in Fig. 3 , the region of the first layer 30 where no first openings 31 are formed may be divided into an outer region 35 and an inner region 36. The inner region 36 is a region located between two adjacent first openings 31 in a plan view. The outer region 35 is a region located between an outer edge 303 of the first layer 30 and the first openings 31 in a plan view. As shown in Fig. 3 , the inner region 36 may extend in a first direction D1 and a second direction D2. The outer region 35 includes a connection region 37 to which the frame 60 is connected.

[0063] 4 , the first layer 30 may include alignment marks 39. The alignment marks 39 are formed, for example, on the first surface 301. The alignment marks 39 are used, for example, to adjust the relative position of the frame 60 with respect to the mask 20. If the frame 60 has a property of transmitting visible light, the alignment marks 39 can be seen through the frame 60.

[0064] 3 and 4, the alignment mark 39 may have a circular outline in a plan view. Although not shown, the alignment mark 39 may have an outline other than a circle, such as a rectangle or a cross. The alignment mark 39 may be located in the outer region 35.

[0065] When the first layer 30 includes silicon or a silicon compound, the first layer 30 may be fabricated, for example, by processing a silicon wafer. As shown in FIG. 3 , an outer edge 303 of the first layer 30 may include a linear portion. The linear portion is also referred to as an orientation flat. Although not shown, a notch may be formed in the outer edge 303. The notch is also referred to as a notch. When the first layer 30 is fabricated by processing a silicon wafer, the orientation flat and the notch represent the crystal orientation of the silicon wafer.

[0066] The maximum dimension S1 of the first layer 30 in a planar view may be, for example, 100 mm or more, 150 mm or more, or 200 mm or more. The dimension S1 may be, for example, 300 mm or less, 400 mm or less, or 500 mm or less. The range of the dimension S1 may be defined by a first group consisting of 100 mm, 150 mm, and 200 mm and / or a second group consisting of 300 mm, 400 mm, and 500 mm. The range of the dimension S1 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the dimension S1 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the dimension S1 may be defined by a combination of any two of the values ​​included in the second group described above. The dimension S1 may be, for example, 100 mm or more and 500 mm or less, 100 mm or more and 400 mm or less, 100 mm or more and 300 mm or less, 100 mm or more and 200 mm or less, 100 mm or more and 150 mm or less, 150 mm or more and 500 mm or less, 150 mm or more and 400 mm or less, 150 mm or more and 300 mm or less, 150 mm or more and 200 mm or less, 200 mm or more and 500 mm or less, 200 mm or more and 400 mm or less, 200 mm or more and 300 mm or less, 300 mm or more and 500 mm or less, 300 mm or more and 400 mm or less, or 400 mm or more and 500 mm or less.

[0067] The dimension S2 of the first openings 31 in the direction in which the first openings 31 are arranged may be, for example, 3 mm or more, 10 mm or more, or 20 mm or more. The dimension S2 may be, for example, 30 mm or less, 50 mm or less, or 100 mm or less. The range of the dimension S2 may be defined by a first group consisting of 3 mm, 10 mm, and 20 mm and / or a second group consisting of 30 mm, 50 mm, and 100 mm. The range of the dimension S2 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the dimension S2 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the dimension S2 may be defined by a combination of any two of the values ​​included in the second group described above. The dimension S2 may be, for example, 3 mm or more and 100 mm or less, 3 mm or more and 50 mm or less, 3 mm or more and 30 mm or less, 3 mm or more and 20 mm or less, 3 mm or more and 10 mm or less, 10 mm or more and 100 mm or less, 10 mm or more and 50 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 20 mm or less, 20 mm or more and 100 mm or less, 20 mm or more and 50 mm or less, 20 mm or more and 30 mm or less, 30 mm or more and 100 mm or less, 30 mm or more and 50 mm or less, or 50 mm or more and 100 mm or less.

[0068] The spacing S3 between two first openings 31 in the direction in which the first openings 31 are arranged may be, for example, 0.1 mm or more, 0.5 mm or more, or 1.0 mm or more. The spacing S3 may be, for example, 10 mm or less, 15 mm or less, or 20 mm or less. The range of the spacing S3 may be defined by a first group consisting of 0.1 mm, 0.5 mm, and 1.0 mm and / or a second group consisting of 10 mm, 15 mm, and 20 mm. The range of the spacing S3 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the spacing S3 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the spacing S3 may be defined by a combination of any two of the values ​​included in the second group described above. The spacing S3 may be, for example, 0.1 mm or more and 20 mm or less, 0.1 mm or more and 15 mm or less, 0.1 mm or more and 10 mm or less, 0.1 mm or more and 1.0 mm or less, 0.1 mm or more and 0.5 mm or less, 0.5 mm or more and 20 mm or less, 0.5 mm or more and 15 mm or less, 0.5 mm or more and 10 mm or less, 0.5 mm or more and 1.0 mm or less, 1.0 mm or more and 20 mm or less, 1.0 mm or more and 15 mm or less, 1.0 mm or more and 10 mm or less, 10 mm or more and 20 mm or less, 10 mm or more and 15 mm or less, or 15 mm or more and 20 mm or less.

[0069] The thickness of the first layer 30 is defined as the maximum thickness T1 of the outer region 35. The thickness T1 may be, for example, 50 μm or more, 100 μm or more, or 200 μm or more. The thickness T1 may be, for example, 600 μm or less, 800 μm or less, or 1000 μm or less. The range of the thickness T1 may be defined by a first group consisting of 50 μm, 100 μm, and 200 μm, and / or a second group consisting of 600 μm, 800 μm, and 1000 μm. The range of the thickness T1 may be defined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The range of the thickness T1 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the thickness T1 may be defined by a combination of any two of the values ​​included in the second group described above. The thickness T1 may be, for example, 50 μm or more and 1000 μm or less, 50 μm or more and 800 μm or less, 50 μm or more and 600 μm or less, 50 μm or more and 200 μm or less, 50 μm or more and 100 μm or less, 100 μm or more and 1000 μm or less, 100 μm or more and 800 μm or less, 100 μm or more and 600 μm or less, 100 μm or more and 200 μm or less, 200 μm or more and 1000 μm or less, 200 μm or more and 800 μm or less, 200 μm or more and 600 μm or less, 600 μm or more and 1000 μm or less, 600 μm or more and 800 μm or less, or 800 μm or more and 1000 μm or less.

[0070] Next, the second layer 40 will be described. The second layer 40 includes a third surface 401, a fourth surface 402, and a plurality of second openings 41. The third surface 401 faces the second surface 302 of the first layer 30. The fourth surface 402 is located on the opposite side of the third surface 401.

[0071] The second openings 41 penetrate the second layer 40 from the third surface 401 to the fourth surface 402. One second opening 41 corresponds to one organic layer 130. A group of the regularly arranged second openings 41 corresponds to one screen of the organic EL display device. As shown in Figures 3 and 4 , a group of the regularly arranged second openings 41 may overlap one first opening 31 in a plan view. The groups of the second openings 41 are supported by the first layer 30 formed by processing a single member such as a silicon wafer.

[0072] The second layer 40 may be divided into a peripheral region 43 and an effective region 44. The peripheral region 43 is a region that overlaps with the first layer 30 in a planar view. The effective region 44 is a region where a group of a plurality of regularly arranged second openings 41 is distributed. The peripheral region 43 may be further divided into an outer region 45 and an inner region 46. The outer region 45 is a region that overlaps with the outer region 35 of the first layer 30 in a planar view. The inner region 46 is a region that overlaps with the inner region 36 of the first layer 30 in a planar view.

[0073] The thickness of the second layer 40 is smaller than the thickness T1 of the first layer 30. The thickness of the second layer 40 may be, for example, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more. The thickness of the second layer 40 may be, for example, 5 μm or less, 10 μm or less, or 25 μm or less. The thickness range of the second layer 40 may be defined by a first group consisting of 0.5 μm, 1.0 μm, and 2.0 μm and / or a second group consisting of 5 μm, 10 μm, and 25 μm. The thickness range of the second layer 40 may be defined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The thickness range of the second layer 40 may be defined by a combination of any two of the values ​​included in the first group described above. The thickness range of the second layer 40 may be defined by a combination of any two of the values ​​included in the second group described above. The thickness of the second layer 40 may be, for example, 0.5 μm to 25 μm, 0.5 μm to 10 μm, 0.5 μm to 5 μm, 0.5 μm to 2.0 μm, 0.5 μm to 1.0 μm, 1.0 μm to 25 μm, 1.0 μm to 10 μm, 1.0 μm to 5 μm, 1.0 μm to 2.0 μm, 2.0 μm to 25 μm, 2.0 μm to 10 μm, 2.0 μm to 5 μm, 5 μm to 25 μm, 5 μm to 10 μm, or 10 μm to 25 μm. Having a thickness of 25 μm or less of the second layer 40 can suppress the occurrence of shadows. By making the thickness of the second layer 40 0.5 μm or more, it is possible to prevent defects such as pinholes and deformation from occurring in the second layer 40 .

[0074] The dimension S4 of the second opening 41 in plan view may be, for example, 1 μm or more, 2 μm or more, or 3 μm or more. The dimension S4 may be, for example, 5 μm or less, 10 μm or less, or 25 μm or less. The range of the dimension S4 may be defined by a first group consisting of 1 μm, 2 μm, and 3 μm, and / or a second group consisting of 5 μm, 10 μm, and 25 μm. The range of the dimension S4 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the dimension S4 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the dimension S4 may be defined by a combination of any two of the values ​​included in the second group described above. The dimension S4 may be, for example, 1 μm or more and 25 μm or less, 1 μm or more and 10 μm or less, 1 μm or more and 5 μm or less, 1 μm or more and 3 μm or less, 1 μm or more and 2 μm or less, 2 μm or more and 25 μm or less, 2 μm or more and 10 μm or less, 2 μm or more and 5 μm or less, 2 μm or more and 3 μm or less, 3 μm or more and 25 μm or less, 3 μm or more and 10 μm or less, 3 μm or more and 5 μm or less, 5 μm or more and 25 μm or less, 5 μm or more and 10 μm or less, or 10 μm or more and 25 μm or less.

[0075] The spacing S5 between two second openings 41 in the direction in which the second openings 41 are arranged may be, for example, 1 μm or more, 2 μm or more, or 3 μm or more. The spacing S5 may be, for example, 5 μm or less, 10 μm or less, or 25 μm or less. The range of the spacing S5 may be determined by a first group consisting of 1 μm, 2 μm, and 3 μm and / or a second group consisting of 5 μm, 10 μm, and 25 μm. The range of the spacing S5 may be determined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the spacing S5 may be determined by a combination of any two of the values ​​included in the first group described above. The range of the spacing S5 may be determined by a combination of any two of the values ​​included in the second group described above. The spacing S5 may be, for example, 1 μm or more and 25 μm or less, 1 μm or more and 10 μm or less, 1 μm or more and 5 μm or less, 1 μm or more and 3 μm or less, 1 μm or more and 2 μm or less, 2 μm or more and 25 μm or less, 2 μm or more and 10 μm or less, 2 μm or more and 5 μm or less, 2 μm or more and 3 μm or less, 3 μm or more and 25 μm or less, 3 μm or more and 10 μm or less, 3 μm or more and 5 μm or less, 5 μm or more and 25 μm or less, 5 μm or more and 10 μm or less, or 10 μm or more and 25 μm or less.

[0076] Next, the intermediate layer 50 will be described. The intermediate layer 50 includes a layer that performs some function for the first layer 30 or the second layer 40. For example, the intermediate layer 50 may function as a stopper layer that stops etching in the process of processing the first layer 30 by etching. When the intermediate layer 50 is a stopper layer, the intermediate layer 50 may contain aluminum, an aluminum alloy, titanium, or a titanium alloy. When the intermediate layer 50 is a stopper layer, the intermediate layer 50 may contain an inorganic compound such as silicon oxide. Alternatively, the intermediate layer 50 may function to bond the first layer 30 and the second layer 40. For example, the intermediate layer 50 may be a bonding layer containing an adhesive.

[0077] The thickness of the intermediate layer 50 is not particularly limited as long as it can exhibit the above-described functions. For example, the thickness of the intermediate layer 50 may be smaller than or equal to the thickness of the second layer 40. The thickness of the intermediate layer 50 may be, for example, 5 nm or greater, 50 nm or greater, or 75 nm or greater. The thickness of the intermediate layer 50 may be, for example, 1 μm or less, 10 μm or less, or 100 μm or less. The thickness range of the intermediate layer 50 may be defined by a first group consisting of 5 nm, 50 nm, and 75 nm, and / or a second group consisting of 1 μm, 10 μm, and 100 μm. The thickness range of the intermediate layer 50 may be defined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The thickness range of the intermediate layer 50 may be defined by a combination of any two of the values ​​included in the first group described above. The thickness range of the intermediate layer 50 may be determined by a combination of any two of the values ​​included in the second group described above. The thickness of the intermediate layer 50 may be, for example, 5 nm to 100 μm, 5 nm to 10 μm, 5 nm to 1 μm, 5 nm to 75 nm, 5 nm to 50 nm, 50 nm to 100 μm, 50 nm to 10 μm, 50 nm to 1 μm, 50 nm to 75 nm, 75 nm to 100 μm, 75 nm to 10 μm, 75 nm to 1 μm, 75 nm to 1 μm, 1 μm to 100 μm, 1 μm to 10 μm, or 10 μm to 100 μm.

[0078] Preferably, the intermediate layer 50 is positioned so as not to overlap the second opening 41 in a plan view. As a result, the occurrence of a shadow due to the intermediate layer 50 can be suppressed.

[0079] In the above-described mask 20, a region including the region where the first opening 31 is formed, the region where the second opening 41 is formed (effective region 44), and the inner regions 36, 46 will hereinafter also be referred to as the inner region 26 of the mask 20. Also, a region including the outer regions 35, 45 will be referred to as the outer region 25 of the mask 20. The outer region 25 surrounds the inner region 26.

[0080] Next, the frame 60 will be described in detail. The frame 60 is attached to the mask 20 for the purpose of being gripped when handling the mask 20, for example, when moving the mask 20. As shown in FIG. 3 and other figures, the mask 20 has second openings 41, and therefore the first openings 31, formed up to the vicinity of its outer edge. When handling the mask 20, for example, when moving the mask 20, it is desirable to grip the outer region 35 of the first layer 30 to prevent deformation of the second openings 41 of the second layer 40 or to prevent contamination of the second layer 40. However, because the first openings 31 are formed up to the vicinity of the outer edge 303 of the first layer 30, the width of the outer region 35 is insufficient for gripping the outer region 35. Furthermore, because the first openings 31 are formed up to the vicinity of the outer edge 303 of the first layer 30, the outer region 35 is narrow. The narrow outer region 35 is easily damaged. The outer region 35 is particularly susceptible to damage when the first layer 30 contains silicon or a silicon compound. By attaching the frame 60 to the outer region 25 of the mask 20, the frame 60 can be grasped when handling the mask 20, and the risk of damage to the first layer 30 is reduced. As a result, the mask 20 can be easily handled.

[0081] 3 to 5B, the frame 60 includes a fifth surface 601 and a sixth surface 602. The fifth surface 601 faces the same side as the fourth surface 402. The sixth surface 602 is located on the opposite side of the fifth surface 601. In the illustrated example, the fifth surface 601 and the first surface 301 face each other.

[0082] 5A and 5B , the frame 60 is connected to the first surface 301 of the outer region 35 of the first layer 30. In the illustrated example, a connecting layer 70 is disposed between the first surface 301 of the outer region 35 and the fifth surface 601 of the frame 60. The frame 60 is connected to the first layer 30 via the connecting layer 70. In a plan view, the frame 60 does not overlap with the first opening 31. In addition, in a plan view, at least a portion of the frame 60 extends to the outside of the outer edge 303 of the first layer 30. Therefore, the frame 60 expands the area for gripping when handling the mask 20.

[0083] The frame 60 includes a glass material or a metal material. The glass material is quartz glass, borosilicate glass, alkali-free glass, soda glass, or the like. The metal material is invar or stainless steel such as SUS430 or SUS304. When the frame 60 includes these materials, the rigidity of the frame 60 can be made higher than that of the first layer 30. The material of the frame 60 may be determined so that the frame 60 has the required rigidity, taking into consideration the gripping strength of an operator or robot hand that handles the framed mask 15.

[0084] Furthermore, it is preferable that the linear thermal expansion coefficient of the frame 60 is approximately the same as the linear thermal expansion coefficient of the first layer 30. As a result, when the framed mask 15 is heated, the elongation rates of the frame 60 and the first layer 30 can be approximately the same. As a result, the risk of damage to the first layer 30 is reduced. Specifically, the absolute value of the difference between the linear thermal expansion coefficient of the frame 60 and the linear thermal expansion coefficient of the first layer 30 is 15 ppm / °C or less, or may be 10 ppm / °C or less, or may be 5.0 ppm / °C or less.

[0085] In the illustrated example, the frame 60 is formed in an annular shape. The frame 60 has a region that extends circumferentially outside the outer edge 303 of the first layer 30 in a plan view. This effectively reduces the risk of damage to the outer region 35 of the first layer 30 when handling the mask 20. More specifically, a third opening 61 that penetrates from the fifth surface 601 to the sixth surface 602 is formed in the center of the frame 60. In the illustrated example, the third opening 61 has a shape similar to the outer edge 303 of the first layer 30. The maximum dimension S9 of the third opening 61 is smaller than the maximum dimension S1 of the outer edge 303 of the first layer 30. In a plan view, the third opening 61 overlaps the inner region 26 of the mask 20.

[0086] The shape and dimensions of the outer edge 603 of the frame 60 are not particularly limited. The shape and dimension S10 of the outer edge 603 of the frame 60 may be determined based on the dimensions and shape of the hand of a worker or robot hand that handles the framed mask 15 and the dimensions and shape of the mask holder 9 of the deposition apparatus 10. The outer edge 603 of the frame 60 may be rectangular or another polygonal shape. The dimension S10 of the outer edge 603 of the frame 60 may be, for example, 100 mm or more, 150 mm or more, or 200 mm or more. The dimension S10 may be, for example, 300 mm or less, 400 mm or less, or 500 mm or less. The range of the dimension S10 may be defined by a first group consisting of 100 mm, 150 mm, and 200 mm, and / or a second group consisting of 300 mm, 400 mm, and 500 mm. The range of dimension S10 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of dimension S10 may be defined by a combination of any two of the values ​​included in the first group described above. The range of dimension S10 may be defined by a combination of any two of the values ​​included in the second group described above. The dimension S10 may be, for example, 100 mm or more and 500 mm or less, 100 mm or more and 400 mm or less, 100 mm or more and 300 mm or less, 100 mm or more and 200 mm or less, 100 mm or more and 150 mm or less, 150 mm or more and 500 mm or less, 150 mm or more and 400 mm or less, 150 mm or more and 300 mm or less, 150 mm or more and 200 mm or less, 200 mm or more and 500 mm or less, 200 mm or more and 400 mm or less, 200 mm or more and 300 mm or less, 300 mm or more and 500 mm or less, 300 mm or more and 400 mm or less, or 400 mm or more and 500 mm or less.

[0087] The distance S11 between the outer edge 603 of the frame 60 and the outer edge 303 of the first layer 30 may also be determined based on the dimensions and shape of the hand of a worker or robot hand handling the framed mask 15 and the dimensions and shape of the mask holder 9 of the vapor deposition apparatus 10. The distance S11 may be, for example, 5 mm or more, 10 mm or more, or 15 mm or more. The distance S11 may be, for example, 30 mm or less, 60 mm or less, or 100 mm or less. The range of the distance S11 may be defined by a first group consisting of 5 mm, 10 mm, and 15 mm and / or a second group consisting of 30 mm, 60 mm, and 100 mm. The range of the distance S11 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the distance S11 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the distance S11 may be determined by a combination of any two of the values ​​included in the second group. The distance S11 may be, for example, 5 mm to 100 mm, 5 mm to 60 mm, 5 mm to 30 mm, 5 mm to 15 mm, 5 mm to 10 mm, 10 mm to 100 mm, 10 mm to 60 mm, 10 mm to 30 mm, 10 mm to 15 mm, 15 mm to 100 mm, 15 mm to 60 mm, 15 mm to 30 mm, 30 mm to 100 mm, 30 mm to 60 mm, or 60 mm to 100 mm.

[0088] As shown in FIG. 5B , the frame 60 includes a connection region 67 around the third opening 61 to which the mask 20 is connected. The connection region 67 overlaps the connection region 37 of the first layer 30 in a plan view. The width S12 of the connection regions 37, 67 may be determined, for example, taking into consideration the bonding strength between the mask 20 and the frame 60. The width S12 may be, for example, 1 mm or more, 5 mm or more, or 10 mm or more. The width S12 may be, for example, 20 mm or less, 25 mm or less, or 30 mm or less. The range of the width S12 may be defined by a first group consisting of 1 mm, 5 mm, and 10 mm and / or a second group consisting of 20 mm, 25 mm, and 30 mm. The range of the width S12 may be defined by a combination of any one of the values ​​included in the first group described above and any one of the values ​​included in the second group described above. The range of the width S12 may be defined by a combination of any two of the values ​​included in the first group described above. The range of the width S12 may be determined by a combination of any two of the values ​​included in the second group. The width S12 may be, for example, 1 mm to 30 mm, 1 mm to 25 mm, 1 mm to 20 mm, 1 mm to 10 mm, 1 mm to 5 mm, 5 mm to 30 mm, 5 mm to 25 mm, 5 mm to 20 mm, 5 mm to 10 mm, 10 mm to 30 mm, 10 mm to 25 mm, 10 mm to 20 mm, 20 mm to 30 mm, 20 mm to 25 mm, or 25 mm to 30 mm.

[0089] The thickness T2 of the frame 60 is also not particularly limited. It may be determined based on the dimensions and shape of the hand of a worker or robot hand handling the framed mask 15 and the dimensions and shape of the mask holder 9 of the deposition apparatus 10. The thickness T2 may be, for example, 500 μm or more, 2 mm or more, or 5 mm or more. The thickness T2 may be, for example, 10 mm or less, 20 mm or less, or 30 mm or less. The range of the thickness T2 may be defined by a first group consisting of 500 μm, 2 mm, and 5 mm, and / or a second group consisting of 10 mm, 20 mm, and 30 mm. The range of the thickness T2 may be defined by a combination of any one of the values ​​included in the first group and any one of the values ​​included in the second group. The range of the thickness T2 may be defined by a combination of any two of the values ​​included in the first group. The range of the thickness T2 may be defined by a combination of any two of the values ​​included in the second group. The thickness T2 may be, for example, 500 μm or more and 30 mm or less, 500 μm or more and 20 mm or less, 500 μm or more and 10 mm or less, 500 μm or more and 5 mm or less, 500 μm or more and 2 mm or less, 2 mm or more and 30 mm or less, 2 mm or more and 20 mm or less, 2 mm or more and 10 mm or less, 2 mm or more and 5 mm or less, 5 mm or more and 30 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 20 mm or less, or 20 mm or more and 30 mm or less.

[0090] By determining the shape and dimensions of the outer edge 603 of the frame 60 and the thickness T2 of the frame 60 based on the dimensions and shape of the robot hand that handles the framed mask 15 and the dimensions and shape of the mask holder 9 of the vapor deposition apparatus 10, the shape and dimensions of the framed mask 15 can be made to be suitable for an existing robot hand or an existing vapor deposition apparatus 10. In other words, there is no need to make the shape and dimensions of the mask 20 suitable for an existing robot hand or an existing vapor deposition apparatus 10, and the degree of freedom in designing the mask 20 is improved.

[0091] In the illustrated example, the fifth surface 601 of the frame 60 is located closer to the first surface 301 of the first layer 30 than the fourth surface 402 of the second layer 40. In other words, the second layer 40 protrudes from the fifth surface 601 of the frame 60. Therefore, when a deposition layer is formed on the substrate 110 or a component on the substrate 110 through the mask 20, the second layer 40 can come into contact with the substrate 110 or a component on the substrate 110.

[0092] 3, the frame 60 may include an alignment mark 69. As a result, when the frame 60 is attached to the mask 20, it is easy to position the mask 20 with respect to the frame 60. For example, the position of the frame 60 with respect to the mask 20 can be adjusted while observing the alignment mark 69 of the frame 60 and the alignment mark 39 of the mask 20.

[0093] As shown in FIGS. 5A and 5B , the frame 60 is connected to the first layer 30 via a connection layer 70. The connection layer 70 fixes the frame 60 to the first layer 30 by adhesion, pressure-sensitive adhesive, or welding. The connection layer 70 may include a glass material, an inorganic material, a metal material, or a resin material. The connection layer 70 may be formed of glass frit, glass paste, solder paste, conductive paste, epoxy resin, polyimide, acrylic resin, or the like. The connection layer 70 may be formed of a UV-curable adhesive, a thermosetting adhesive, or the like. In this case, for example, the UV-curable epoxy resin "XNR5516Z-B1" manufactured by Nagase ChemteX Co., Ltd. can be used as the UV-curable adhesive. Furthermore, for example, the NK ester "BEP-500" manufactured by Shin-Nakamura Chemical Co., Ltd. or "ASF400" manufactured by Nippon Steel Chemical Co., Ltd. can be used as the thermosetting adhesive. Furthermore, in order to suppress outgassing from the connection layer 70 during the vapor deposition process in the vapor deposition apparatus 10, for example, a high-heat-resistant epoxy adhesive "AlemcoBond 526N" manufactured by Aremco Products, Inc. or a UV-curable adhesive "WORLDROCK (registered trademark) 5910 (product number)" or "WORLDROCK (registered trademark) 8723K9B (product number)" manufactured by Kyoritsu Chemical Industries Co., Ltd. can be used as the material for forming the connection layer 70. Furthermore, by using a highly solvent-resistant material for forming the connection layer 70, it is possible to suppress the risk of the connection layer 70 coming into contact with a cleaning solution and the frame 60 separating from the mask 20 when the framed mask 15 used in the vapor deposition process is cleaned to remove the vapor deposition material. In this case, for example, a UV-curable adhesive "ThreeBond (registered trademark) 3026E (product name)" manufactured by ThreeBond Co., Ltd. can be used as the material for forming the connection layer 70. Furthermore, by using a material for the connection layer 70 that can be peeled off from the frame 60 and the mask 20, the frame 60 and the mask 20 can be reused.In this case, for example, the double-sided peel-off adhesive "BBX100 (product name)" manufactured by Cemedine Co., Ltd., the visible light curing adhesive "Clearpresto (registered trademark) CP4374 (product name)" or "Clearpresto (registered trademark) K40 (product name)" manufactured by Sekisui Fuller Co., Ltd., or the cyanoacrylate instant adhesive "Skylock (registered trademark) R-4" manufactured by Nikka Seiko Co., Ltd. can be used as the material for forming the connection layer 70.

[0094] The thickness of the connection layer 70 may be, for example, 0.05 μm or more, 5 μm or more, or 10 μm or more. The thickness of the connection layer 70 may be, for example, 20 μm or less, 50 μm or less, or 100 μm or less. The thickness range of the connection layer 70 may be defined by a first group consisting of 0.05 μm, 5 μm, and 10 μm and / or a second group consisting of 20 μm, 50 μm, and 100 μm. The thickness range of the connection layer 70 may be defined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The thickness range of the connection layer 70 may be defined by a combination of any two of the values ​​included in the first group described above. The thickness range of the connection layer 70 may be defined by a combination of any two of the values ​​included in the second group described above. The thickness of the connection layer 70 may be, for example, 0.05 μm or more and 100 μm or less, 0.05 μm or more and 50 μm or less, 0.05 μm or more and 20 μm or less, 0.05 μm or more and 10 μm or less, 0.05 μm or more and 5 μm or less, 5 μm or more and 100 μm or less, 5 μm or more and 50 μm or less, 5 μm or more and 20 μm or less, 5 μm or more and 10 μm or less, 10 μm or more and 100 μm or less, 10 μm or more and 50 μm or less, 10 μm or more and 20 μm or less, 20 μm or more and 100 μm or less, 20 μm or more and 50 μm or less, or 50 μm or more and 100 μm or less.

[0095] As shown in FIG. 4 , the framed mask 15 may further include alignment marks 16. The alignment marks 16 are formed, for example, on the exit surface 202 of the mask 20. The alignment marks 16 are used to adjust the relative position of the framed mask 15 with respect to the substrate 110. That is, the alignment marks 16 are used to adjust the relative position of the mask 20 with respect to the substrate 110. If the substrate 110 has the property of transmitting visible light, the alignment marks 16 can be viewed through the substrate 110. The alignment marks 16 may be formed in the second layer 40, or in a layer other than the second layer 40. The alignment marks 16 may be located in the outer region 25 or the inner region 26 of the mask 20.

[0096] The thickness of each layer, the dimensions of each component, the spacing, etc. can be measured by observing an image of the cross section of the mask 20 using a scanning electron microscope.

[0097] (Laminating Device) Next, a connecting device 80 according to this embodiment will be described with reference to Figs. 6A to 9. The connecting device 80 is used to connect the mask 20 to the frame 60. Figs. 6A to 6E are cross-sectional views of the connecting device 80. Fig. 7 is an enlarged view of the portion surrounded by the two-dot chain line in Fig. 6A. Fig. 7 omits illustration of a heater 89, an alignment camera 88, and an alignment opening 825, which will be described later.

[0098] 6A to 6E , the connection device 80 includes a first pressure platen 81, a second pressure platen 82, a pressing device 83, and a suction device 84. The first pressure platen 81 and the second pressure platen 82 face each other. In the illustrated example, the first pressure platen 81 is disposed above the second pressure platen 82. The pressing device 83 presses the first pressure platen 81 and the second pressure platen 82 against each other. The connection device 80 may further include a chamber 85, an opening / closing device 86, a decompression device 87, and an alignment camera 88. The chamber 85 houses the first pressure platen 81 and the second pressure platen 82. The opening / closing device 86 opens and closes the chamber 85. The decompression device 87 decompresses the chamber 85. The connection device 80 may further include a support 99 that supports the pressure plates 81 and 82, the pressure device 83, the chamber 85, the opening and closing device 86, and the like.

[0099] The first press plate 81 supports the mask 20. The first press plate 81 is formed in a flat plate shape overall and has a first support surface 811 on which the mask 20 is placed. The mask 20 is placed on the first support surface 811 so that its emission surface 202 faces the first support surface 811. The first support surface 811 has an inner region 812 on which the mask 20 is placed and an outer region 813 surrounding the inner region 812 (see FIGS. 8A and 8B ). The inner region 812 of the first support surface 811 is flat. As shown in FIG. 7 , the first press plate 81 is formed with first suction holes 814 that open to the first support surface 811. The first suction holes 814 open to the inner region 812 of the first support surface 811. The mask 20 can be adsorbed to the first support surface 811 by suctioning the inside of the first suction holes 814 with the suction device 84. By adsorbing the mask 20 to the first support surface 811, the mask 20 can be held on the first pressure plate 81. This prevents the mask 20 from accidentally falling off the first pressure plate 81 and being damaged. Furthermore, by adsorbing the mask 20 to the flat inner region 812, the exit surface 202 of the mask 20 can be made flat.

[0100] 8A and 8B are plan views showing the first support surface 811. In FIGS. 8A and 8B, the mask 20 is indicated by dashed lines. As shown in FIG. 8A, the first suction holes 814 may be open to a region of the first support surface 811 that faces the outer region 45 of the second layer 40. Alternatively, as shown in FIG. 8B, the first suction holes 814 may be open to a region of the first support surface 811 that faces the peripheral region 43 of the second layer 40. Therefore, the suction device 84 can suck the gap between the first support surface 811 and the second layer 40 through the first suction holes 814, and can adsorb the exit surface 202 of the mask 20 to the first support surface 811.

[0101] The second pressure plate 82 supports the frame 60. The second pressure plate 82 is formed in a generally flat plate shape and has a second support surface 821 on which the frame 60 is placed. The frame 60 is placed on the second support surface 821 so that its sixth surface 602 faces the second support surface 821. The second support surface 821 has an inner region 822 on which the frame 60 is placed and an outer region 823 surrounding the inner region 822 (see FIG. 9 ). The inner region 822 of the second support surface 821 is flat. As shown in FIG. 7 , the second pressure plate 82 is formed with second suction holes 824 that open to the second support surface 821. The second suction holes 824 open to the inner region 822 of the second support surface 821. The frame 60 can be adsorbed to the second support surface 821 by applying suction to the inside of the second suction holes 824 with the suction device 84. By adsorbing the frame 60 to the second support surface 821, the frame 60 can be held on the second pressure platen 82. As a result, it is possible to reduce the risk of the frame 60 unintentionally falling from the second pressure platen 82 and being damaged. Furthermore, by adsorbing the frame 60 to the second support surface 821, the mask 20 can be separated from the first pressure platen 81 after being connected to the frame 60.

[0102] Fig. 9 is a plan view showing the second support surface 821. In Fig. 9, the frame 60 is indicated by a dashed line. As shown in Fig. 9, the second suction holes 824 may be open to an area of ​​the second support surface 821 that faces the frame 60. Therefore, the suction device 84 can suck the gap between the second support surface 821 and the frame 60 through the second suction holes 824, and can adsorb the frame 60 to the second support surface 821.

[0103] In the illustrated example, an alignment opening 825 is formed in the second press platen 82. The alignment opening 825 penetrates the second press platen 82 in the thickness direction of the second press platen 82. The alignment opening 825 is formed in a position facing the alignment mark 69 of the frame 60. An alignment camera 88 is also disposed opposite the alignment opening 825. The alignment camera 88 can photograph the area between the second support surface 821 and the first support surface 811 through the alignment opening 825. When the frame 60 is transparent, the alignment camera 88 can be used to observe the alignment mark 69 of the frame 60 and the alignment mark 39 of the mask 20, which are disposed on the second support surface 821, and adjust the position of the frame 60 relative to the mask 20.

[0104] 6A, a heater 89 may be provided inside the first pressing platen 81 and / or the second pressing platen 82. In this case, the mask 20 and the frame 60 can be connected while being heated by the heater 89.

[0105] The first pressure platen 81 and the second pressure platen 82 are made of, for example, cast iron. In this case, the first pressure platen 81 and the second pressure platen 82 have high rigidity. Therefore, the risk of the first pressure platen 81 and the second pressure platen 82 being deformed when pressed against each other is reduced. Furthermore, the first pressure platen 81 and the second pressure platen 82 made of cast iron have high heat resistance. Therefore, the risk of the first pressure platen 81 and the second pressure platen 82 being thermally deformed when heated by the heater 89 is reduced. Of course, the material constituting the first pressure platen 81 and the second pressure platen 82 is not limited to cast iron. The material constituting the first pressure platen 81 and the second pressure platen 82 can also be other materials, such as metals other than cast iron.

[0106] In the illustrated example, the first pressing platen 81 is fixed to the support body 99. The first pressing platen 81 is fixed to the inside of a first chamber element 851, which will be described later. The second pressing platen 82 is not fixed to the support body 99. The second pressing platen 82 is disposed inside a second chamber element 852, which will be described later.

[0107] The pressing device 83 moves the first pressing platen 81 and / or the second pressing platen 82 to press the first pressing platen 81 and the second pressing platen 82 against each other. The first pressing platen 81 supporting the mask 20 and the second pressing platen 82 supporting the frame 60 are pressed against each other, thereby pressing the mask 20 and the frame 60 against each other. In the illustrated example, the pressing device 83 can move the second pressing platen 82 in a direction toward the first pressing platen 81 and a direction away from the first pressing platen 81. The pressing device 83 may be a driving device such as an air cylinder.

[0108] By pressing the frame 60 against the mask 20 while the mask 20 is attached to the first pressing plate 81, the mask 20 can be connected to the frame 60 in a flat state. As a result, the flatness of the mask 20 in the framed mask 15 is improved. By pressing the mask 20 and the frame 60 against each other using the pressing plates 81 and 82, it is possible to apply a uniform pressing force to the connection regions 37 and 67 of the mask 20 and the frame 60. This also improves the flatness of the mask 20 in the framed mask 15.

[0109] The chamber 85 has a first chamber element 851 and a second chamber element 852. The first chamber element 851 houses the first pressing platen 81. In the illustrated example, the first chamber element 851 is fixed to the support 99 together with the first pressing platen 81. The second chamber element 852 houses the second pressing platen 82. The second chamber element 852 is not fixed to the support 99.

[0110] The opening and closing device 86 moves the first chamber element 851 and / or the second chamber element 852 to bring the first chamber element 851 and the second chamber element 852 into close contact with each other or to move them away from each other. When the first chamber element 851 and the second chamber element 852 come into close contact with each other, the chamber 85 is closed and an enclosed space is formed inside the chamber 85. In the illustrated example, the opening and closing device 86 moves the second chamber element 852 in a direction toward the first chamber element 851 and a direction away from the first chamber element 851. The opening and closing device 86 may be a driving device such as an air cylinder.

[0111] In the illustrated example, the movement of the second chamber element 852 by the opening / closing device 86 and the movement of the second pressure platen 82 by the pressing device 83 are performed independently. In other words, the opening and closing of the chamber 85 by the opening / closing device 86 and the pressing of the first and second pressure platens 81, 82 by the pressing device 83 are performed independently of each other. Therefore, as shown in FIG. 6B , the opening / closing device 86 can be operated to bring the second chamber element 852 into close contact with the first chamber element 851 and close the chamber 85, and then the pressing device 83 can be operated to press the second pressure platen 82 against the first pressure platen 81, as shown in FIG. 6C . Furthermore, as shown in FIG. 6D , the pressing device 83 can be operated to move the second pressure platen 82 away from the first pressure platen 81, and then the opening / closing device 86 can be operated to move the second chamber element 852 away from the first chamber element 851 and open the chamber 85, as shown in FIG. 6E .

[0112] The pressure reducing device 87 reduces the pressure inside the closed chamber 85. By connecting the mask 20 to the frame 60 with the chamber 85 in a reduced pressure state, the risk of air bubbles forming between the connecting layer 70 and the mask 20 or the frame 60 is reduced. This also improves the flatness of the mask 20 in the framed mask 15.

[0113] (Method of Connecting Mask and Frame) Next, a method of connecting the mask 20 and the frame 60 according to this embodiment will be described with reference to FIGS. 6A to 6E.

[0114] First, the mask 20 and the frame 60 are prepared. Then, the opening / closing device 86 is operated to separate the first chamber element 851 and the second chamber element 852 from each other, thereby opening the chamber 85. Then, the pressing device 83 is operated to separate the first pressing platen 81 and the second pressing platen 82 from each other.

[0115] 6A , the mask 20 is placed on the first support surface 811 of the first press platen 81 so that the emission surface 202 faces the first support surface 811. The mask 20 is placed in the inner region 812 of the first support surface 811. Thereafter, the suction device 84 is operated to suck the inside of the first suction holes 814, and the mask 20 is adsorbed to the first press platen 81. As a result, the mask 20 is held on the first press platen 81. Furthermore, by adsorbing the mask 20 to the first press platen 81, the emission surface 202 of the mask 20 comes into close contact with the flat inner region 812 of the first press platen 81 and becomes flat.

[0116] Furthermore, the frame 60 is placed on the second support surface 821 of the second pressing platen 82 so that the sixth surface 602 faces the second support surface 821. The frame 60 is placed in the inner region 822 of the second support surface 821.

[0117] Next, the alignment marks 39 on the mask 20 and the alignment marks 69 on the frame 60 are observed through the alignment openings 825. The alignment marks 39 and 69 are observed using an alignment camera 88. The position of the frame 60 on the second press platen 82 is then adjusted so that the alignment marks 39 and 69 overlap. Thereafter, the suction device 84 applies suction to the second suction holes 824, and the frame 60 is adsorbed onto the second press platen 82. As a result, the frame 60 is held on the second press platen 82.

[0118] Furthermore, a connection layer 70 is formed in the connection region 37 of the mask 20 or the connection region 67 of the frame 60. The connection layer 70 is formed on the first surface 301 of the first layer 30 or the fifth surface 601 of the frame 60. The connection layer 70 may be formed before the mask 20 and / or the frame 60 are placed on the first pressing platen 81 and / or the second pressing platen 82, or may be formed after the mask 20 and / or the frame 60 are placed on the first pressing platen 81 and / or the second pressing platen 82.

[0119] 6B, the opening and closing device 86 is operated to bring the second chamber element 852 into close contact with the first chamber element 851, thereby closing the chamber 85. Thereafter, the pressure reducing device 87 is operated to reduce the pressure inside the chamber 85.

[0120] Next, as shown in FIG. 6C , the pressing device 83 is operated to press the second pressing plate 82 against the first pressing plate 81. As a result, the frame 60 is connected to the mask 20 via the connecting layer 70. At this time, because the exit surface 202 of the mask 20 is adsorbed to the first pressing plate 81, the mask 20 is pressed against the frame 60 with the exit surface 202 flat. Furthermore, a uniform pressing force is applied to the connection regions 37, 67 of the mask 20 and the frame 60 by the first pressing plate 81 and the second pressing plate 82. This also allows the mask 20 to be connected to the frame 60 with the exit surface 202 flat. Furthermore, because the frame 60 is connected to the mask 20 with the pressure inside the chamber 85 reduced, the risk of air bubbles forming between the connecting layer 70 and the mask 20 or the frame 60 is reduced. When the second pressing platen 82 is pressed against the first pressing platen 81 , the first pressing platen 81 and the second pressing platen 82 may be heated by a heater 89 .

[0121] Next, the suction of the first suction hole 814 by the suction device 84 is stopped. Thereafter, as shown in Fig. 6D, the second pressure plate 82 is moved away from the first pressure plate 81 while the suction of the second suction hole 824 by the suction device 84 continues. As a result, the mask 20 is separated from the first pressure plate 81 and moves together with the second pressure plate 82 while remaining connected to the frame 60. Thereafter, the suction of the second suction hole 824 by the suction device 84 is stopped.

[0122] 6E, the opening / closing device 86 is operated to separate the second chamber element 852 from the first chamber element 851, thereby opening the chamber 85. Thereafter, the connecting layer 70 is hardened by cooling or the like, thereby fixing the mask 20 and the frame 60 to each other. In this manner, the framed mask 15 can be obtained.

[0123] The above-described embodiment can be modified in various ways. Below, modified examples will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, parts that can be configured similarly to the above-described embodiment will be designated by the same reference numerals as those used for corresponding parts in the above-described embodiment. Duplicate descriptions will be omitted. Furthermore, if it is clear that the effects obtained in the above-described embodiment can also be obtained in modified examples, the description of those effects may be omitted.

[0124] 10 , a first recess 816 that accommodates at least a portion of the mask 20 in the thickness direction may be formed in the first support surface 811 of the first pressing platen 81. The first recess 816 is formed in the inner region 812 of the first pressing platen 81. By forming the first recess 816, the position of the mask 20 on the first support surface 811 can be easily adjusted when placing the mask 20 on the first support surface 811. In other words, the position of the mask 20 on the first support surface 811 can be roughly adjusted simply by fitting the mask 20 into the first recess 816. The first suction hole 814 may open into the first recess 816.

[0125] 10 , a second recess 826 that accommodates at least a portion of the frame 60 in the thickness direction may be formed in the second support surface 821 of the second pressing platen 82. The second recess 826 is formed in an inner region 822 of the second pressing platen 82. By forming the second recess 826, the position of the frame 60 on the second support surface 821 can be easily adjusted when placing the frame 60 on the second support surface 821. In other words, the position of the frame 60 on the second support surface 821 can be roughly adjusted simply by fitting the frame 60 into the second recess 826. The second suction hole 824 and the alignment opening 825 may open into the second recess 826.

[0126] By roughly adjusting the position of the mask 20 on the first support surface 811 and roughly adjusting the position of the frame 60 on the second support surface 821, it is possible to roughly adjust the positions of the mask 20 and the frame 60 relative to each other. In other words, it is possible to roughly align the mask 20 and the frame 60 relative to each other. As a result, it is easy to adjust the positions of the mask 20 and / or the frame 60 on the press plates 81 and 82 so that the alignment marks 39 and 69 overlap.

[0127] The depth of the first recess 816 may be equal to the thickness of the mask 20 or may be a depth that does not interfere with bonding of the mask 20 and the frame 60. That is, the depth of the first recess 816 may be greater than 0 mm and less than the thickness of the mask 20, or, if a connecting layer 70 is formed on the mask 20, less than the sum of the thickness of the mask 20 and the thickness of the connecting layer 70. The depth of the first recess 816 may be, for example, 0.01 mm or more, 0.05 mm or more, or 0.1 mm or more. The depth of the first recess 816 may be, for example, 0.8 mm or less, 1 mm or less, or 2 mm or less. The range of the depth of the first recess 816 may be defined by a first group consisting of 0.01 mm, 0.05 mm, and 0.1 mm, and / or a second group consisting of 0.8 mm, 1 mm, and 2 mm. The range of depths of the first recesses 816 may be determined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The range of depths of the first recesses 816 may be determined by a combination of any two of the values ​​included in the first group described above. The range of depths of the first recesses 816 may be determined by a combination of any two of the values ​​included in the second group described above. The depth of the first recess 816 may be, for example, 0.01 mm or more and 2 mm or less, 0.01 mm or more and 1 mm or less, 0.01 mm or more and 0.8 mm or less, 0.01 mm or more and 0.1 mm or less, 0.01 mm or more and 0.05 mm or less, 0.05 mm or more and 2 mm or less, 0.05 mm or more and 1 mm or less, 0.05 mm or more and 0.8 mm or less, 0.05 mm or more and 0.1 mm or less, 0.1 mm or more and 2 mm or less, 0.1 mm or more and 1 mm or less, 0.1 mm or more and 0.8 mm or less, 0.8 mm or more and 2 mm or less, 0.8 mm or more and 1 mm or less, or 1 mm or more and 2 mm or less.

[0128] The depth of the second recess 826 may be equal to the thickness T2 of the frame 60 or may be a depth that does not interfere with bonding of the mask 20 and the frame 60. That is, the depth of the second recess 826 may be greater than 0 mm and less than the thickness T2 of the frame 60, or, if a connecting layer 70 is formed on the frame 60, less than the sum of the thickness T2 of the frame 60 and the thickness of the connecting layer 70. The depth of the second recess 826 may be, for example, 500 μm or more, 2 mm or more, or 5 mm or more. The depth of the second recess 826 may be, for example, 10 mm or less, 20 mm or less, or 30 mm or less. The range of the depth of the second recess 826 may be defined by a first group consisting of 500 μm, 2 mm, and 5 mm, and / or a second group consisting of 10 mm, 20 mm, and 30 mm. The range of depths of the second recesses 826 may be determined by a combination of any one of the values ​​included in the first group described above with any one of the values ​​included in the second group described above. The range of depths of the second recesses 826 may be determined by a combination of any two of the values ​​included in the first group described above. The range of depths of the second recesses 826 may be determined by a combination of any two of the values ​​included in the second group described above. The depth of the second recess 826 may be, for example, 500 μm or more and 30 mm or less, 500 μm or more and 20 mm or less, 500 μm or more and 10 mm or less, 500 μm or more and 5 mm or less, 500 μm or more and 2 mm or less, 2 mm or more and 30 mm or less, 2 mm or more and 20 mm or less, 2 mm or more and 10 mm or less, 2 mm or more and 5 mm or less, 5 mm or more and 30 mm or less, 5 mm or more and 20 mm or less, 5 mm or more and 10 mm or less, 10 mm or more and 30 mm or less, 10 mm or more and 20 mm or less, or 20 mm or more and 30 mm or less.

[0129] 11 , at least a portion of the first support surface 811 of the first press platen 81 may be covered with a porous layer 90. In the illustrated example, the porous layer 90 covers the entire inner region 812 of the first support surface 811. In this case, the suction device 84 can suck the inside of the first suction holes 814 and the inside of the holes of the porous layer 90, and adsorb the mask 20 to the first press platen 81 via the porous layer 90. By adsorbing the mask 20 to the first press platen 81 via the porous layer 90, a uniform suction force can be applied to the entire surface of the exit surface 202 of the mask 20, and the flatness of the mask 20 can be improved.

[0130] 12, at least a portion of the first support surface 811 of the first pressing plate 81 may be covered with a bonding layer 91. The bonding layer 91 may be an adhesive layer or a sticky layer. The bonding layer 91 may be formed of a material that can be bonded at low temperatures. In the illustrated example, the bonding layer 91 covers the entire inner region 812 of the first support surface 811. In this case, the mask 20 can be held on the first pressing plate 81 by bonding the mask 20 to the first support surface 811 with the bonding layer 91. Furthermore, by bonding the mask 20 to the flat inner region 812, the exit surface 202 of the mask 20 can be flat. Therefore, in the example shown in FIG. 12, the first suction hole 814 does not have to be formed in the first pressing plate 81. Note that the bonding layer 91 is preferably slightly sticky. As a result, the mask 20 can be separated from the first pressing plate 81 after being bonded to the connecting layer 70. Alternatively, the bonding strength of the bonding layer 91 may be reduced by application of heat, ultraviolet light, or laser light. In this case, after the mask 20 is bonded to the connection layer 70, the mask 20 can be separated from the first pressing plate 81 by applying heat, ultraviolet light, or laser light to the bonding layer 91. After the mask 20 is bonded to the connection layer 70, the second pressing plate 82 may be separated from the first pressing plate 81 by moving the second pressing plate 82 away from the first pressing plate 81 while the frame 60 remains adhered to the second pressing plate 82.

[0131] The connection device 80 according to the embodiment described above is a device that connects the frame 60 to the mask 20. The mask 20 has an inner region 26 and an outer region 25 that surrounds the inner region 26. A plurality of openings 31 and 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connection device 80 has a first pressure platen 81, a suction device 84, a second pressure platen 82, and a pressing device 83. The first pressure platen 81 has a first support surface 811 that supports the mask 20. The first pressure platen 81 has first suction holes 814 that open to the first support surface 811. The suction device 84 applies suction to the inside of the first suction holes 814. The second pressure platen 82 has a second support surface 821 that supports the frame 60. The second support surface 821 faces the first support surface 811. The pressing device 83 moves the first pressing platen 81 and / or the second pressing platen 82 to press the first pressing platen 81 and the second pressing platen 82 against each other.

[0132] The connection method according to the embodiment described above is a method of connecting the frame 60 to the mask 20 using the connection device 80 according to the embodiment. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31 and 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connection method includes the steps of placing the mask 20 on the first support surface 811 of the first press plate 81 and sucking the first suction holes 814 with the suction device 84 to adsorb the mask 20 to the first support surface 811. The connection method also includes the step of placing the frame 60 on the second support surface 821 of the second press plate 82. The connection method also includes the step of forming a connection layer 70 in the outer region 25 of the mask 20 or in the region 67 of the frame 60 facing the outer region 25. The above-mentioned connection method also includes a step of connecting the mask 20 and the frame 60 via the connection layer 70 by using a pressing device 83 to move the first pressing plate 81 to which the mask 20 is adsorbed and / or the second pressing plate 82 supporting the frame 60, thereby pressing the first pressing plate 81 and the second pressing plate 82 against each other.

[0133] According to the connection device 80 and connection method of this embodiment, the flatness of the mask 20 in the framed mask 15 can be improved.

[0134] Furthermore, a connecting device 80 according to a modification of the embodiment described above is a device for connecting a frame 60 to a mask 20. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31, 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connecting device 80 has a first pressing platen 81, a second pressing platen 82, and a pressing device 83. The first pressing platen 81 has a first support surface 811 that supports the mask 20. The second pressing platen 82 has a second support surface 821 that supports the frame 60. The second support surface 821 faces the first support surface 811. The pressing device 83 moves the first pressing platen 81 and / or the second pressing platen 82 to press the first pressing platen 81 and the second pressing platen 82 against each other. At least a portion of the first support surface 811 of the first pressing platen 81 is covered with a bonding layer 91 .

[0135] The connection method according to the modified embodiment described above is a method of connecting a frame 60 to a mask 20 using a connection device 80 according to the modified embodiment. The mask 20 has an inner region 26 and an outer region 25 surrounding the inner region 26. A plurality of openings 31, 41 are formed in the inner region 26. The frame 60 is connected to the outer region 25. The connection method includes the steps of placing the mask 20 on a first support surface 811 of a first press platen 81 and bonding the mask 20 to a bonding layer 91. The connection method also includes the step of placing the frame 60 on a second support surface 821 of a second press platen 82. The connection method also includes the step of forming a connection layer 70 in the outer region 25 of the mask 20 or in a region 67 of the frame 60 facing the outer region 25. The above-mentioned connection method also includes a step of connecting the mask 20 and the frame 60 via the connection layer 70 by using a pressing device 83 to move the first pressing plate 81 to which the mask 20 is joined and / or the second pressing plate 82 supporting the frame 60, thereby pressing the first pressing plate 81 and the second pressing plate 82 against each other.

[0136] According to the connecting device 80 and the connecting method according to this modified example of the embodiment, the flatness of the mask 20 in the framed mask 15 can be improved.

[0137] It is also possible to combine the multiple components disclosed in the above-described embodiments and modifications as needed, or to delete some of the components disclosed in the above-described embodiments and modifications.

Claims

1. A connection device for connecting a frame to an outer region of a mask, the outer region including an inner region having a plurality of openings formed therein and an outer region surrounding the inner region, the connection device comprising: a first pressure plate having a first support surface for supporting the mask, the first pressure plate having a first suction hole opening into the first support surface; a suction device for drawing air through the first suction hole; a second pressure plate having a second support surface for supporting the frame, the second pressure plate having a second support surface facing the first support surface; and a pressing device for moving the first pressure plate and / or the second pressure plate to press the first pressure plate and the second pressure plate against each other.

2. The connection device of claim 1, wherein at least a portion of said first support surface of said first pressing platen is covered with a porous layer.

3. A connection device as described in claim 1, wherein the second pressure plate has a second suction hole that opens to the second support surface, and the suction device draws air into the second suction hole.

4. A connection device for connecting a frame to an outer region of a mask, the outer region including an inner region in which a plurality of openings are formed and an outer region surrounding the inner region, comprising: a first pressure plate having a first support surface for supporting the mask; a second pressure plate having a second support surface for supporting the frame, the second support surface facing the first support surface; and a pressing device for moving the first pressure plate and / or the second pressure plate to press the first pressure plate and the second pressure plate against each other, wherein at least a portion of the first support surface of the first pressure plate is covered with a bonding layer.

5. A connection device as described in claim 4, wherein the second pressure plate has a second suction hole that opens into the second support surface, and the connection device further comprises a suction device that draws air into the second suction hole.

6. A connection device as described in claim 1 or 4, wherein a first recess is formed in said first support surface to accommodate at least a portion of said mask in its thickness direction.

7. The connection device according to claim 6, wherein the depth of said first recess is greater than 0 μm and not greater than 1000 μm.

8. A connection device as claimed in claim 1 or 4, wherein a second recess is formed in said second support surface to accommodate at least a portion of said frame in its thickness direction.

9. The connection device according to claim 8, wherein the depth of said second recess is greater than 0 μm and equal to or less than 30 mm.

10. A connection device according to claim 1 or 4, further comprising a heater provided inside said first pressure plate and / or said second pressure plate.

11. The connection device according to claim 1 or 4, further comprising: a chamber that houses the first pressure plate and the second pressure plate; and a pressure reducing device that reduces the pressure inside the chamber.

12. A connection device as described in claim 1 or 4, wherein the second pressure plate has an alignment opening formed therein that penetrates the second pressure plate in the thickness direction, and the connection device further includes an alignment camera capable of photographing the area between the second support surface and the first support surface through the alignment opening.

13. A connection method for connecting a frame to an outer region of a mask, the outer region including an inner region having a plurality of openings formed therein and an outer region surrounding the inner region, using the connection device of claim 1, comprising the steps of: placing the mask on the first support surface of the first pressure plate, and adhering the mask to the first support surface by sucking inside the first suction holes with the suction device; placing the frame on the second support surface of the second pressure plate; forming a connection layer on the outer region of the mask or on the region of the frame facing the outer region; and connecting the mask and the frame via the connection layer by using the pressure device to move the first pressure plate to which the mask is adhering and / or the second pressure plate supporting the frame, thereby pressing the first pressure plate and the second pressure plate against each other.

14. The connection method according to claim 13, further comprising the step of stopping suction within said first suction hole by said suction device after said mask and said frame are connected.

15. A connection method for connecting a frame to an outer region of a mask, the outer region including an inner region in which a plurality of openings are formed and an outer region surrounding the inner region, using the connection device described in claim 4, comprising the steps of: placing the mask on the first support surface of the first pressure plate and bonding the mask to the bonding layer; placing the frame on the second support surface of the second pressure plate; forming a connection layer in the outer region of the mask or in a region of the frame facing the outer region; and using the pressing device to move the first pressure plate to which the mask is bonded and / or the second pressure plate supporting the frame to press the first pressure plate and the second pressure plate against each other, thereby connecting the mask and the frame via the connection layer.

16. A connection method as described in claim 13 or 15, wherein the second pressure plate has a second suction hole that opens into the second support surface, the connection device includes a suction device that draws air into the second suction hole, and the connection method further includes a step of, after placing the frame on the second pressure plate, drawing air into the second suction hole with the suction device.

17. A connection method as described in claim 13 or 15, wherein a heater is provided inside the first pressing plate and / or the second pressing plate, and during the process of pressing the first pressing plate and the second pressing plate against each other, the first pressing plate and / or the second pressing plate are heated by the heater.

18. A connection method as described in claim 13 or 15, wherein the connection device further comprises: a chamber that accommodates the first pressure plate and the second pressure plate; and a pressure reducing device that reduces the pressure inside the chamber, and during the process of pressing the first pressure plate and the second pressure plate against each other, the pressure inside the chamber is reduced by the pressure reducing device.

19. A connection method as described in claim 13 or 15, wherein alignment marks are formed on the mask and the frame, an alignment opening is formed in the second pressing plate which penetrates the second pressing plate in the thickness direction, the connection device further comprises an alignment camera capable of capturing an image of the area between the second support surface and the first support surface through the alignment opening, and during the process of placing the frame on the second support surface of the second pressing plate, the alignment marks of the mask and the frame are captured by the alignment camera through the alignment opening, thereby aligning the mask and the frame.

Images