Sticking device, film formation device, sticking method, and production method

Abstract

Provided is a sticking device characterized by having: a substrate support part that supports a peripheral edge part of a first surface of a substrate, which includes the first surface and a second surface on the side reverse of the first surface; a sticking plate that sticks to the second surface of the substrate supported by the substrate support part; a first adjustment part that adjusts the relative inclination of the sticking plate and either a mask for forming a pattern on the first surface of the substrate or a mask stand on which the mask is placed; a plurality of pressing members that are provided so as to face each of a plurality of sites on a peripheral edge part of the second surface of the substrate and that are for pressing the substrate from the second surface side; and a second adjustment unit that, in a state in which the sticking plate is inclined by the first adjustment unit, adjusts the pressing force by which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support unit in accordance with the inclination of the sticking plate.

Description

Adsorption apparatus, film forming apparatus, adsorption method, and manufacturing method

[0001] The present invention relates to an adsorption apparatus, a film forming apparatus, an adsorption method, and a manufacturing method.

[0002] Organic EL display devices (organic EL displays) are applied to, for example, smartphones, televisions, automotive displays, VR HMDs (Virtual Reality Head Mount Displays), etc. In the process of manufacturing organic EL display devices, a film formation apparatus is generally used when forming organic light-emitting elements (organic EL elements: OLEDs) on a substrate.

[0003] The film forming device deposits a deposition material (film forming material) emitted from a deposition source onto a substrate through a mask on which a pattern corresponding to the pixel pattern is formed, thereby forming (forming) a film such as an organic film or a metal film. During this process, it is necessary to align (align) the substrate and the mask with high precision.

[0004] Techniques relating to the alignment of a substrate and a mask have been proposed in the past (see Patent Documents 1 and 2). Patent Document 1 discloses a technique for suppressing a decrease in alignment accuracy by adjusting the relative tilt between an adsorption plate that adsorbs a substrate and a mask table on which a mask is placed. Patent Document 2 discloses a technique for reducing deflection of a substrate supported by a substrate support unit by pressing multiple points (corners) of the substrate before the adsorption plate adsorbs the substrate.

[0005] Japanese Patent Application Laid-Open No. 2022-57673

[0006] However, in the conventional technology, when the suction plate is tilted in accordance with the tilt of the mask table, the substrate supported by the substrate support unit is pressed at multiple locations, and then the substrate is suctioned (adhered) to the suction plate, the number of substrate suction failures increases. The suction failures of the substrate on the suction plate increase the process time (Tact Time), which is a factor in reducing yield and productivity.

[0007] The present invention provides an advantageous technique for reducing the failure of a substrate to be attracted to an attraction plate.

[0008] According to one aspect of the present invention, there is provided a suction device comprising: a substrate support section that supports a peripheral portion of a first surface of a substrate, the first surface including a first surface and a second surface opposite the first surface; a suction plate that suctions the second surface of the substrate supported by the substrate support section; a first adjustment section that adjusts the relative tilt of the suction plate and a mask table on which a mask for forming a pattern on the first surface of the substrate is placed or the mask; a plurality of pressing members that are provided opposite each of a plurality of locations on the peripheral portion of the second surface of the substrate and that press the substrate from the side of the second surface; and a second adjustment section that adjusts the pressing force with which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support section in accordance with the tilt of the suction plate when the suction plate is tilted by the first adjustment section.

[0009] According to the present invention, for example, it is possible to provide a technique that is advantageous for reducing the occurrence of poor suction of a substrate on an attraction plate.

[0010] Other features and advantages of the present invention will become apparent from the following description taken in conjunction with the accompanying drawings, in which the same or similar elements are designated by the same reference numerals.

[0011] The accompanying drawings are included in the specification and constitute a part thereof, illustrate embodiments of the present invention, and are used to explain the principles of the present invention together with the description thereof.

[0023] Figure 1 is a diagram schematically showing a part of the configuration of a manufacturing line for electronic devices. Figure 2 is a diagram schematically showing the configuration of a film forming apparatus. Figure 3 is a diagram schematically showing the configuration of an adjustment unit. Figure 4 is a diagram showing the positional relationship between a through hole formed in an attraction plate and a pressing member. Figure 5 is a diagram schematically showing an example of a pressing area of ​​the pressing member on the second surface of the substrate. Figure 6 is a diagram showing an example of a pressing area of ​​the pressing member on the second surface of the substrate. Figure 7 is a diagram showing an example of a configuration of a pressing adjustment unit in this embodiment. Figure 8 is a diagram showing an example of a configuration of a pressing adjustment unit in this embodiment. Figure 9 is a diagram for explaining an organic EL display device as an electronic device. Figure 10 is a diagram for explaining an organic EL display device as an electronic device.

[0012] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention as claimed, and not all combinations of features described in the embodiments are necessarily essential to the invention. Two or more of the features described in the embodiments may be combined in any desired manner. Furthermore, the same reference numerals are used to designate identical or similar components, and redundant descriptions will be omitted.

[0013] 1 is a diagram schematically illustrating a portion of the configuration (layout) of a manufacturing line for electronic devices to which a film forming apparatus according to one aspect of the present invention can be applied. The manufacturing line shown in FIG. 1 is used, for example, to manufacture display panels for organic EL display devices for smartphones. Substrates 100 are sequentially transported to a film forming block 301 (film forming unit), and an organic EL film is formed on the substrates 100.

[0014] In the film formation block 301, a plurality of film formation chambers 303a to 303d that perform film formation processing on substrates 100 and a mask storage chamber 305 that stores masks used in the film formation processing are arranged around a transfer chamber 302 that has an octagonal shape in a plan view. A transfer robot 302a that transports the substrates 100 is provided in the transfer chamber 302. The transfer robot 302a includes a hand that holds the substrate 100 and an articulated arm that moves the hand horizontally. In other words, the film formation block 301 is a cluster-type film formation unit in which a plurality of film formation chambers 303a to 303d are arranged around the transfer robot 302a. When the film formation chambers 303a to 303d are referred to collectively or when no particular distinction is made between the film formation chambers 303a to 303d, they are referred to as film formation chambers 303.

[0015] In the transport direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308 are disposed upstream and downstream of the deposition block 301, respectively. During the manufacturing process, the deposition chamber 303, the mask storage chamber 305, the buffer chamber 306, the swirl chamber 307, and the delivery chamber 308 are each maintained in a vacuum state (vacuum atmosphere). While only one deposition block 301 is shown in FIG. 1 , this is not limiting. For example, a manufacturing line may have multiple deposition blocks 301, and the multiple deposition blocks 301 may be connected by a connecting device composed of the buffer chamber 306, the swirl chamber 307, and the delivery chamber 308. However, the connecting device may be composed of, for example, only the buffer chamber 306 or the delivery chamber 308.

[0016] The transfer robot 302a carries the substrate 100 from the upstream delivery chamber 308 into the transfer chamber 302 and transports the substrate 100 between the multiple film formation chambers 303a to 303d. The transfer robot 302a also transports the mask between the mask storage chamber 305 and the film formation chamber 303 and transports the substrate 100 from the transfer chamber 302 to the downstream buffer chamber 306.

[0017] The buffer chamber 306 is a chamber for temporarily storing substrates 100 depending on the operating status of the production line. The buffer chamber 306 is provided with a substrate storage shelf, also called a cassette, and an elevator mechanism. The substrate storage shelf has a multi-tier structure that can store multiple substrates 100 while maintaining a state (horizontal state) with the first surface (film formation surface) of the substrate 100 facing downward in the direction of gravity (vertical direction). The elevator mechanism raises and lowers the substrate storage shelf to align the tier for loading or unloading the substrate 100 with the transport position. In this way, the buffer chamber 306 has the function of temporarily storing and retaining multiple substrates 100.

[0018] The swirl chamber 307 is provided with a transfer robot as a mechanism for changing the orientation of the substrate 100. In this embodiment, the orientation of the substrate 100 is rotated 180 degrees in the swirl chamber 307 by the transfer robot provided in the swirl chamber 307. The transfer robot provided in the swirl chamber 307 rotates 180 degrees while supporting the substrate 100 loaded from the buffer chamber 306 and loads it into the delivery chamber 308, thereby switching the front and rear ends of the substrate 100 between the buffer chamber 306 and the delivery chamber 308. Therefore, the orientation of the substrate 100 loaded into the film formation chamber 303 is the same in each film formation block 301, so that the scan direction and the orientation of the mask in the film formation process on the substrate 100 can be aligned in each film formation block 301. This allows the orientation of the masks stored in the mask storage chamber 305 to be aligned in each film formation block 301, simplifying mask management and improving usability.

[0019] The production line has, as its control system, a host device 300 that controls the entire line as a host computer, and control devices 14a-14d, 309, and 310 that control each component. The host device 300 and control devices 14a-14d, 309, and 310 can communicate with each other via a wired or wireless communication line 300a. The control devices 14a-14d are provided corresponding to each of the multiple film formation chambers 303a-303d, and control the film formation apparatus 1 provided in each film formation chamber. When the control devices 14a-14d are referred to collectively or when no particular distinction is made, they are referred to as the control device 14.

[0020] The control device 309 controls the transfer robot 302a. The control device 310 controls the devices provided in the swirl chamber 307. The host device 300 transmits information about the substrate 100 and instructions such as transfer timing to the control devices 14, 309, and 310. The control devices 14, 309, and 310 control each device based on the instructions received from the host device 300.

[0021] FIG. 2 is a schematic diagram illustrating the configuration of a film forming apparatus 1 according to one aspect of the present invention. The film forming apparatus 1 is installed in a film forming chamber 303. The film forming apparatus 1 performs a film forming process in which a deposition material is deposited (deposited) on a substrate 100 to form a film. In this embodiment, a predetermined pattern (a thin film of the deposition material) is deposited on the first surface 100A of the substrate 100 through a mask 101. The material of the substrate 100 can be selected from glass, resin, metal, and other materials, and a glass substrate having a resin layer such as polyimide formed thereon is preferably used. The deposition material may be an organic material or an inorganic material (e.g., metal, metal oxide, etc.). The film forming apparatus 1 can be used in manufacturing equipment for manufacturing electronic devices such as display devices (e.g., flat panel displays), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), as well as optical components. The film forming apparatus 1 is particularly suitable for manufacturing organic EL panels. Here, an example will be described in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition, but the present invention is not limited to this, and various film forming processes (film forming methods) such as sputtering and CVD can be applied. In each figure, arrow Z indicates the vertical direction (direction of gravity), and arrows X and Y indicate horizontal directions that are orthogonal to each other.

[0022] The film forming apparatus 1 has a box-shaped vacuum chamber 3. An internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown) to maintain the internal space 3a in a vacuum atmosphere. Note that "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, i.e., a reduced pressure state. The vacuum chamber 3 defines the internal space 3a that accommodates the substrate support unit 6, the mask table 5 on which the mask 101 is placed, the film forming unit 4, the plate unit 9, and the suction plate 15.

[0023] The mask 101 has an opening pattern corresponding to the pattern (thin film) to be formed on the first surface 100A of the substrate 100. The mask 101 is placed on a mask table 5 and fixed in a predetermined position. The mask table 5 can be replaced with another mechanism for fixing the mask 101 in a predetermined position. The mask 101 may be a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded to a frame-shaped mask frame. The material of the mask 101 is not particularly limited, but it is preferable to use a metal with a low thermal expansion coefficient, such as Invar. The film formation process is performed by placing the substrate 100 on the mask 101 and overlapping the substrate 100 and the mask 101.

[0024] The plate unit 9 includes a cooling plate 10 and a magnet plate 11. The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction relative to the magnet plate 11. The cooling plate 10 is a plate-shaped member that cools the substrate 100 attracted to the attraction plate 15 by contacting the attraction plate 15 during the film formation process. The cooling plate 10 is not limited to a plate that actively cools the substrate 100 by including a water cooling mechanism or the like. It may also be a plate that does not include a water cooling mechanism but instead cools the substrate 100 by removing heat from the substrate 100 by contacting the attraction plate 15. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force. The magnet plate is disposed above the second surface 100B of the substrate 100, opposite the first surface 100A, and improves adhesion between the substrate 100 and the mask 101 during the film formation process. However, the cooling plate 10 and the magnet plate 11 (plate unit 9) are not necessarily required. For example, if the attraction plate 15 is provided with a cooling mechanism, the cooling plate 10 does not need to be provided. Also, if the attraction plate 15 attracts the mask 101, the magnet plate 11 does not need to be provided.

[0025] The film formation unit 4 includes a heater, a shutter, a driving mechanism, an evaporation rate monitor, etc., and is an evaporation source that adheres (evaporates) an evaporation material to the substrate 100. In this embodiment, the film formation unit 4 is embodied as a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction and each nozzle ejects an evaporation material upward, and is driven to reciprocate in the Y direction.

[0026] The film forming apparatus 1 includes a substrate support unit 6, an adsorption plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, a first measurement unit 7, a second measurement unit 8, and an adjustment unit 17. The film forming apparatus 1 also includes a plurality of pressing members 80 and a control device 14 (control unit).

[0027] The substrate supporting unit 6 (substrate supporting portion) supports, in a horizontal position, the substrate 100 that has been carried into the film forming apparatus 1 by the transfer robot 302a. The substrate supporting unit 6 includes a base portion 61 that forms an outer frame thereof, and a plurality of supporting portions 62 that protrude inward from the base portion 61.

[0028] The multiple support portions 62 are arranged on the base portion 61 at intervals along the peripheral edge of the substrate 100. The multiple support portions 62 have the function of supporting the peripheral edge of the first surface 100A of the substrate 100, and are also referred to as "receiving claws" or "fingers." Note that the "peripheral edge" does not necessarily include the peripheral edge of the substrate 100. For example, the multiple support portions 62 may support the substrate 100 by not contacting the peripheral edge of the first surface 100A of the substrate 100, but by contacting a portion that is a predetermined distance away from the peripheral edge toward the center of the substrate 100.

[0029] In this embodiment, the plurality of support portions 62 are formed of leaf springs. Therefore, when the substrate 100 supported by the plurality of support portions 62 is attached to the suction plate 15, the elastic force of the leaf springs can press the substrate 100 against the suction plate 15. Alternatively, a configuration may be adopted in which a plurality of clamp portions corresponding to the plurality of support portions 62 are provided, and the substrate 100 is supported by being sandwiched between the plurality of support portions 62 and the plurality of clamp portions.

[0030] The suction plate 15 is provided above the substrate support unit 6 (plurality of support portions 62) in the internal space 3a of the vacuum chamber 3, and adsorbs the second surface 100B of the substrate 100 supported by the substrate support unit 6. As shown in FIG. 2 , the suction plate 15 is provided between the substrate support unit 6 and the plate unit 9, and is supported by one or more support shafts R1. In this embodiment, the suction plate 15 is supported by four support shafts R1. The support shafts R1 are, for example, cylindrical shafts.

[0031] In this embodiment, the attraction plate 15 is embodied as an electrostatic chuck that attracts the substrate 100 by electrostatic force. For example, the attraction plate 15 has a structure in which an electrical circuit, such as metal electrodes, is embedded inside a ceramic matrix (base). When positive (+) and negative (-) voltages are applied to the metal electrodes arranged in the electrode arrangement region, a polarization charge is induced in the substrate 100 via the matrix. As a result, the substrate 100 is attracted (fixed) to the attraction surface 150 of the attraction plate 15 by the electrostatic attraction (electrostatic force) between the substrate 100 and the attraction plate 15. The attraction surface 150 of the attraction plate 15 may be provided with multiple electrode arrangement regions spaced apart from one another. Alternatively, one electrode arrangement region may be provided over substantially the entire surface of the attraction surface 150 of the attraction plate 15.

[0032] A plurality of touch sensors 1621 are embedded in the suction plate 15, more specifically, in the suction surface 150, as sensors for detecting contact between the suction plate 15 and the substrate 100. By providing the touch sensors 1621 at a plurality of locations on the suction surface 150 of the suction plate 15, it becomes possible to detect (confirm) that the entire second surface 100B of the substrate 100 has been suctioned to the suction surface 150. The number and arrangement of the touch sensors 1621 can be set as appropriate.

[0033] In this embodiment, the touch sensor 1621 mechanically detects contact between the suction plate 15 and the substrate 100. For example, the tip of the touch sensor 1621 is biased by a spring or the like, and is provided so that the tip protrudes from the suction surface 150 when not in contact with the substrate 100 (the second surface 100B of the substrate 100). When the substrate 100 comes into contact with the tip of the touch sensor 1621, the tip is pressed into the substrate 100, moves inward toward the suction surface 150, and comes into contact with an internal contact point to output a predetermined electrical signal. In this way, the touch sensor 1621 can essentially detect contact between the suction plate 15 and the substrate 100. The multiple touch sensors 1621 also function as a detection unit that detects the inclination (parallelism) between the suction plate 15 and the mask table 5.

[0034] The position adjustment unit 20 adjusts the relative position of the substrate 100 supported by the substrate support unit 6 or the substrate 100 adsorbed by the adsorption plate 15, and the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 or the adsorption plate 15 on the XY plane. In other words, the position adjustment unit 20 adjusts the relative horizontal position of the mask 101 and the substrate 100. For example, the position adjustment unit 20 is configured to displace the substrate support unit 6 in rotational directions around axes in the X, Y, and Z directions. In this embodiment, the position of the mask 101 is fixed, and the relative position of the mask 101 and the substrate 100 is adjusted by displacing the substrate 100. However, the relative position of the mask 101 and the substrate 100 may be adjusted by displacing the mask 101, or the relative position of the mask 101 and the substrate 100 may be adjusted by displacing both the substrate 100 and the mask 101.

[0035] The position adjustment unit 20 includes, for example, a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 arranged between the fixed plate 20a and the movable plate 20b. The fixed plate 20a is fixed to the upper wall 30 of the vacuum chamber 3. A frame-shaped base 21 is placed on the movable plate 20b. The base 21 supports a distance adjustment unit 22 and a plate unit lifting unit 13. When the actuator 201 displaces the movable plate 20b in the horizontal direction relative to the fixed plate 20a, the base 21, distance adjustment unit 22, and plate unit lifting unit 13 are displaced together.

[0036] The multiple actuators 201 include, for example, an actuator that can displace the movable plate 20b in the X direction and an actuator that can displace the movable plate 20b in the Y direction. By driving (controlling) the multiple actuators 201, it is possible to displace the movable plate 20b in rotational directions around axes in the X direction, Y direction, and Z direction. For example, each of the multiple actuators 201 includes a motor as a drive source and a ball screw mechanism that converts the driving force of the motor into linear motion.

[0037] The distance adjustment unit 22 has the function of adjusting the distance between the suction plate 15 and the substrate support unit 6 and the mask table 5 by raising and lowering the suction plate 15 and the substrate support unit 6. In this embodiment, the distance adjustment unit 22 moves the substrate 100 and the mask 101 closer to or farther apart in the thickness direction (Z direction) of the substrate 100. In other words, the distance adjustment unit 22 moves the substrate 100 and the mask 101 closer to each other in the overlapping direction and farther apart in the opposite direction. The "distance" adjusted by the distance adjustment unit 22 is the vertical distance. Therefore, it can also be said that the distance adjustment unit is a unit that adjusts the relative positions of the mask 101 and the substrate 100 in the vertical direction.

[0038] As shown in FIG. 2 , the distance adjustment unit 22 includes a first lift plate 220. The first lift plate 220 is configured to be able to move up and down in the Z direction along a guide rail 21a formed on a side of the pedestal 21 and extending in the Z direction. The first lift plate 220 supports the suction plate 15 via a plurality of support shafts R1. When the first lift plate 220 moves up and down, the suction plate 15 moves up and down accordingly. In detail, because the first lift plate 220 supports the plurality of support shafts R1 that support the suction plate 15, the plurality of support shafts R1 move up and down in synchronous with the movement of the first lift plate 220, and the suction plate 15 moves up and down while maintaining its parallelism.

[0039] Furthermore, the first lift plate 220 supports the substrate support unit 6 via a plurality of actuators 65 and a plurality of support shafts R3. When the first lift plate 220 moves up and down, the substrate support unit 6 moves up and down accordingly. The plurality of actuators 65 are connected to the plurality of support shafts R3. The actuators 65 include, for example, motors or ball screw mechanisms, and drive the support shafts R3 in the vertical direction. The substrate support unit 6 is driven by the plurality of actuators 65 relative to the suction plate 15 in the vertical direction.

[0040] The distance adjustment unit 22 includes a drive unit 221 that is supported by the frame 21 and functions as an actuator for raising and lowering the first lift plate 220. The drive unit 221 is a transmission mechanism that transmits the driving force of a motor 221a (drive source) to the first lift plate 220. In this embodiment, the drive unit 221 employs a ball screw mechanism including a ball screw shaft 221b and a ball nut 221c as the transmission mechanism. The ball screw shaft 221b extends in the Z direction and rotates around its axis in the Z direction by the driving force of the motor 221a. The ball nut 221c is fixed to the first lift plate 220 and engages with the ball screw shaft 221b. The first lift plate 220 can be raised and lowered in the Z direction by rotating the ball screw shaft 221b and switching the rotation direction of the ball screw shaft 221b. The amount of lifting of the first lifting plate 220 is controlled based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 221 a, thereby controlling the position in the Z direction of the suction plate 15 that suctions the substrate 100, and thereby controlling the contact and separation between the substrate 100 and the mask 101.

[0041] In this embodiment, the distance adjustment unit 22 adjusts the distance in the Z direction between the mask table 5 and the substrate support unit 6 and suction plate 15 by fixing the position of the mask table 5 and displacing the substrate support unit 6 and suction plate 15. However, the distance between the mask table 5 and the substrate support unit 6 and suction plate 15 may also be adjusted by fixing the position of the substrate support unit 6 or the suction plate 15 and displacing the mask table 5. Alternatively, the distance between the mask table 5 and the substrate support unit 6 and suction plate 15 may also be adjusted by displacing each of the substrate support unit 6, suction plate 15, and mask table 5.

[0042] The plate unit lifting unit 13 lifts and lowers the second lift plate 12, which is located outside the vacuum chamber 3, thereby lifting and lowering the plate unit 9, which is connected to the second lift plate 12 and located inside the vacuum chamber 3. The plate unit 9 is connected to the second lift plate 12 via one or more support shafts R2. In this embodiment, the plate unit 9 is supported by two support shafts R2. The support shafts R2 extend upward from the magnet plate 11 and pass through openings in the upper wall portion 30, the openings in the fixed plate 20a and the movable plate 20b, and the opening in the first lift plate 220, before being connected to the second lift plate 12.

[0043] The second lift plate 12 is configured to be able to move up and down in the Z direction along the guide shaft 12a. The plate unit lift unit 13 is supported by the frame 21 and includes a drive mechanism that lifts and lowers the second lift plate 12. The plate unit lift unit 13 is a transmission mechanism that transmits the driving force of a motor 13a (drive source) to the second lift plate 12. In this embodiment, the plate unit lift unit 13 employs a ball screw mechanism including a ball screw shaft 13b and a ball nut 13c as the transmission mechanism. The ball screw shaft 13b extends in the Z direction and rotates around an axis in the Z direction due to the driving force of the motor 13a. The ball nut 13c is fixed to the second lift plate 12 and engages with the ball screw shaft 13b. The second lift plate 12 can be lifted and lowered in the Z direction by rotating the ball screw shaft 13b and switching the rotation direction of the ball screw shaft 13b. The amount of lifting of the second lifting plate 12 is controlled based on the detection results of a sensor such as a rotary encoder that detects the rotation amount of each motor 13 a, thereby controlling the position of the plate unit 9 in the Z direction and controlling the contact and separation between the plate unit 9 and the substrate 100.

[0044] The openings in the upper wall 30 of the vacuum chamber 3, through which the support shafts R1 to R3 pass, have dimensions that allow the support shafts R1 to R3 to be displaced in the X and Y directions. In order to maintain the airtightness of the vacuum chamber 3, bellows or the like are provided in the openings in the upper wall 30 through which the support shafts R1 to R3 pass. For example, the support shaft R1 that supports the first lifting plate 220 is covered with a bellows.

[0045] The first measurement unit 7 and the second measurement unit 8 function as measurement units that measure the positional misalignment between the substrate 100 and the mask 101 supported by the substrate support unit 6. In this embodiment, the first measurement unit 7 and the second measurement unit 8 include an imaging device (camera) that captures an image of the substrate 100 or the mask 101. The first measurement unit 7 and the second measurement unit 8 are disposed above the upper wall 30, and capture an image of the substrate 100 or the mask 101 placed in the internal space 3a of the vacuum chamber 3 through a window (not shown) formed in the upper wall 30.

[0046] The first measurement unit 7 includes a low-magnification CCD camera (rough camera) with a relatively wide field of view and low resolution. The first measurement unit 7 captures images of the rough alignment marks formed on the substrate 100 and the rough alignment marks formed on the mask 101, and measures the rough misalignment between the substrate 100 and the mask 101 from the relative positions of these marks.

[0047] The second measurement unit 8 includes a high-magnification CCD camera (fine camera) with a relatively narrow field of view and high resolution (for example, on the order of several μm). The second measurement unit 8 captures images of the fine alignment marks formed on the substrate 100 and the fine alignment marks formed on the mask 101, and measures the misalignment between the substrate 100 and the mask 101 with high precision from the relative positions of these marks.

[0048] In this embodiment, rough alignment and fine alignment are performed in this order to align the substrate 100 and the mask 101 under the control of the control device 14. In the rough alignment, the relative positions of the substrate 100 and the mask 101 are roughly adjusted based on the measurement results of the first measurement unit 7. In the fine alignment, the relative positions of the substrate 100 and the mask 101 are precisely adjusted based on the measurement results of the second measurement unit 8.

[0049] The adjustment unit 17 (first adjustment section) has a function of adjusting the relative tilt between the suction plate 15 and the mask table 5. In this embodiment, the adjustment unit 17 adjusts the relative tilt between the suction plate 15 and the mask table 5 by tilting (driving) the suction plate 15 with respect to the mask table 5. Specifically, the adjustment unit 17 adjusts the axial positions of at least some of the support axes R1 among the multiple support axes R1, thereby adjusting the relative tilt between the suction plate 15 and the mask table 5.

[0050] FIG. 3 is a schematic diagram illustrating the configuration of the adjustment unit 17. As shown in FIG. 3 , the adjustment unit 17 includes a bending portion 18 provided between the support shaft R1 and the suction plate 15. The bending portion 18 connects the support shaft R1 and the suction plate 15 so that the angle of the suction plate 15 relative to the support shaft R1 can be adjusted. In this embodiment, the multiple support shafts R1 are configured to be drivable only in the vertical direction (axial direction). Therefore, the angle of the suction plate 15 relative to the support shaft R1 differs between a state in which the suction plate 15 is maintained horizontal, as shown in state ST1 on the left side of FIG. 3 , and a state in which the suction plate 15 is tilted, as shown in state ST2 on the right side of FIG. 3 . In this embodiment, the suction plate 15 bends relative to the support shaft R1 at the bending portion 18, allowing the support shaft R1 to support the suction plate 15 even when the suction plate 15 is tilted. Note that the bending portion 18 can be appropriately configured to connect two components, such as a universal joint, so that the connection angle can be adjusted. In addition, it is preferable to provide a floating portion 19 between the bent portion 18 and the suction plate 15 in order to reduce the load applied to the mask 101 when the suction plate 15 comes into contact with the mask 101 and to ensure that the suction plate 15 can escape when it comes into contact with the mask 101.

[0051] The pressing members 80 are provided above the suction plate 15, facing each of a plurality of locations on the periphery of the second surface 100B of the substrate 100 supported by the substrate support unit 6. In this embodiment, the pressing members 80 are pin-shaped members for pressing corners of the second surface 100B of the substrate 100 supported by the substrate support unit 6 from the side of the second surface 100B of the substrate 100, and include contact ends 81 that contact (abut) with the second surface 100B of the substrate 100. Therefore, as shown in FIG. 4 , the suction plate 15 has through-holes 151 that penetrate the suction plate 15 between the suction surface 150 and the surface opposite the suction surface, corresponding to each of the plurality of pressing members 80. In this way, the pressing members 80 are configured to be able to press the substrate 100 from the side of the second surface 100B by causing the contact ends 81 to protrude from the suction surface 150 of the suction plate 15 through the through-holes 151. It should be noted that the corners of the substrate 100 do not necessarily mean "corners" in the mathematically strict sense, but may be rounded corners obtained by, for example, rounding. Fig. 4 is a diagram showing the positional relationship between the through-hole 151 formed in the suction plate 15 and the pressing member 80. In Fig. 4, in order to more clearly show the technical features of this embodiment, only the suction plate 15 and the substrate support unit 6 (support portion 62) are simply illustrated.

[0052] In this embodiment, the suction plate 15 adsorbs the substrate 100 pressed by the pressing members 80. In other words, before the suction plate 15 adsorbs the second surface 100B of the substrate 100, the plurality of pressing members 80 press the substrate 100 from the side of the second surface 100B. This allows the substrate 100, whose peripheral edge is supported by the substrate support unit 6, to lift the central portion of the substrate 100 that has been bending downward due to its own weight, and allows the substrate 100 to be adsorbed to the suction plate 15 in a state in which the bending of the substrate 100 is reduced or eliminated. This not only shortens the time required to adsorb the substrate 100 to the suction plate 15, but also prevents wrinkles from remaining in the substrate 100 adsorbed to the suction plate 15.

[0053] In this embodiment, the pressing area of ​​the second surface 100B where the pressing member 80 presses the substrate 100 is located at a corner of the substrate 100. Therefore, the pressing member 80 is provided at a position facing the corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6. Specifically, the pressing area of ​​the pressing member 80 is located at at least two of the four corners of the substrate 100. For example, as shown in FIG. 5 , the pressing area 80a of the pressing member 80 is provided to face a pair of diagonally opposite corners of the four corners of the substrate 100. This makes it possible to effectively press the substrate 100 while minimizing the number of pressing members 80. Alternatively, as shown in FIG. 6 , the pressing area 80a of the pressing member 80 may be provided to face all four corners of the substrate 100. In this way, by pressing two or four corners of the substrate 100 with the pressing member 80, the warp in the central portion of the substrate 100 supported by the substrate support unit 6 is lifted, thereby reducing the warp of the substrate 100 and making it approximately flat. In particular, by pressing the corners away from the central portion where the warp of the substrate 100 is greatest with the pressing member 80, the warp of the substrate 100, particularly the warp in the central portion, can be effectively reduced. Figures 5 and 6 are diagrams schematically showing an example of the pressing region 80a of the pressing member 80 on the second surface 100B of the substrate 100.

[0054] As shown in Figures 5 and 6, the pressing member 80 is provided at a position facing a corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6. Therefore, the pressing region 80a of the pressing member 80 and the support region 6a, which is the region of the first surface 100 where the substrate support unit 6 (support portion 62) supports the substrate 100, do not overlap when viewed from a direction perpendicular to the first surface 10A or the second surface 100B (vertical direction). Furthermore, as shown in Figure 6, the projection region of the support region 6a perpendicularly projected onto the second surface 100B of the substrate 100 and the pressing region 80a are aligned along the imaginary line L that forms a rectangle. This allows the pressing member 80 to sufficiently press the substrate 100 without being restricted by the substrate support unit 6 (support portion 62).

[0055] The control device 14 controls the entire film forming apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input / output interface (I / O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 includes a processor, such as a CPU, and controls the film forming apparatus 1 by executing a program stored in the storage unit 142. The storage unit 142 includes storage devices, such as a ROM, a RAM, and a HDD, and stores programs executed by the processing unit 141 and various control information. The I / O 143 is an interface for transmitting and receiving signals between the processing unit 141 and external devices. The communication unit 144 is a communication device for communicating with the host device 300 or the control devices 14, 309, and 310 via a communication line 300a. The processing unit 141 receives information from the host device 300 or transmits information to the host device 300 via the communication unit 144. The display unit 145 includes, for example, a liquid crystal display and displays various information. The input unit 146 includes, for example, a keyboard and a pointing device and accepts various inputs from the user. Note that all or part of the control devices 14, 309, and 310 and the upper device 300 may be configured using a PLC, an ASIC, or an FPGA.

[0056] In the film forming apparatus 1, when aligning the substrate 100 and the mask 101, the relative tilt between the suction plate 15 and the mask table 5 may affect the alignment accuracy. For example, the alignment accuracy can be improved by bringing the substrate 100 and the mask 101 closer to each other when performing the alignment. However, if there is a relative tilt between the suction plate 15 and the mask table 5, a portion of the substrate 100 may come into contact with the mask 101, damaging the substrate 100. Therefore, in order to avoid damaging the substrate 100, it becomes necessary to separate the substrate 100 and the mask 101, and the longer the distance between the substrate 100 and the mask 101, the lower the alignment accuracy.

[0057] To prevent such a decrease in alignment accuracy, in the film forming apparatus 1, the relative tilt between the suction plate 15 and the mask table 5 is generally adjusted so that the suction plate 15 and the mask table 5 are parallel to each other when the internal space 3 a of the vacuum chamber 3 is in an atmospheric pressure environment. Such an adjustment is performed, for example, by inserting a shim into the connecting portion of the substrate support unit 6.

[0058] On the other hand, even if the suction plate 15 and the mask table 5 are adjusted to be parallel in an atmospheric pressure environment, when the internal space 3a of the vacuum chamber 3 is made into a vacuum atmosphere, the pressure difference between the inside and outside of the vacuum chamber 3 may cause distortion in the vacuum chamber 3. If the vacuum chamber 3 is distorted, a tilt will occur between the suction plate 15 and the mask table 5. However, when the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere, the tilt between the suction plate 15 and the mask table 5 cannot be adjusted in the same way as in an atmospheric environment.

[0059] Therefore, in this embodiment, the adjustment unit 17 adjusts the tilt between the suction plate 15 and the mask table 5 while the internal space 3 a of the vacuum chamber 3 is in a vacuum atmosphere. This adjustment is performed when the mask 101 is not placed on the mask table 5, the substrate 100 is not being suctioned to the suction plate 15, and the substrate 100 is not being supported by the substrate support unit 6. Specifically, while the distance adjustment unit 22 lowers the suction plate 15, the timing of contact between the suction plate 15 and the mask table 5 is monitored for each of the multiple touch sensors 1621, thereby detecting the tilt of the mask table 5, i.e., the tilt between the suction plate 15 and the mask table 5. Then, based on the tilt detected by the touch sensors 1621, the adjustment unit 17 adjusts the axial position of at least some of the multiple support axes R1 so that the suction plate 15 and the mask table 5 are parallel, thereby tilting the suction plate 15 with respect to the mask table 5.

[0060] 7 is a diagram showing a state in which the substrate 100 is supported by the substrate support unit 6 (support portion 62) after the tilt between the suction plate 15 and the mask table 5 has been adjusted so that they are parallel to each other in a vacuum atmosphere. Referring to FIG. 7 , the suction plate 15 and the mask table 5 are parallel, but the suction plate 15 is tilted to match the tilt of the mask table 5. In this state, as described above, consider the case in which the substrate 100 is pressed from the second surface 100B side by multiple pressing members 80 before the suction plate 15 adsorbs the second surface 100B of the substrate 100. In this case, if each of the multiple pressing members 80 is displaced vertically (in the Z direction) by the same amount relative to the suction plate 15, the positions of the contact ends 81 of the pressing members 80 protruding from the suction surface 150, i.e., the protrusion amounts, will differ due to the tilt of the suction plate 15. This means that the pressing force applied to the second surface 100B of the substrate 100 by each of the multiple pressing members 80 is different (i.e., the pressing force of each pressing member 80 is different with respect to the second surface 100B of the substrate 100). If the pressing forces of the pressing members 80 vary and become uneven within the plane of the second surface 100B of the substrate 100, it becomes impossible to press the substrate 100 uniformly. Therefore, it becomes difficult to effectively reduce the bending of the substrate 100 supported by the substrate support unit 6, which leads to poor suction of the substrate 100 on the suction plate 15.

[0061] Therefore, in this embodiment, a pressure adjustment unit 90 (second adjustment unit) is provided that adjusts the pressure with which each of the multiple pressing members 80 presses against the second surface 100B of the substrate 100 in accordance with the inclination of the suction plate 15 when the suction plate 15 is tilted by the adjustment unit 17. The pressure adjustment unit 90 displaces the position of the contact end 81 of each of the multiple pressing members 80 in the vertical direction (Z direction) in accordance with the inclination of the suction plate 15 so that the pressing forces of each pressing member 80 become uniform (equal) within the plane of the second surface 100B of the substrate 100. Specifically, the pressure adjustment unit 90 displaces the position of the contact end 81 of each pressing member 80 in the vertical direction (Z direction) so that the protruding amounts of the contact ends 81 of each of the multiple pressing members 80 protruding from the suction surface 150 of the suction plate 15 become equal. As a result, even when the suction plate 15 is tilted, the contact ends 81 of the pressing members 80 protrude equally from the suction surface 150, and the pressing force of each pressing member 80 is uniform within the plane of the second surface 100B of the substrate 100. Therefore, in this embodiment, it is possible to effectively reduce the bending of the substrate 100 supported by the substrate support unit 6, and to reduce poor suction of the substrate 100 on the suction plate 15.

[0062] While the present embodiment has been described with reference to a case where the tilt between the suction plate 15 and the mask table 5 is adjusted, from the viewpoint of suppressing a decrease in alignment accuracy, it is also possible to adjust the tilt between the suction plate 15 and the mask 101 placed on the mask table 5. In this case, the adjustment unit 17 adjusts the tilt between the suction plate 15 and the mask 101 placed on the mask table 5 with the internal space 3 a of the vacuum chamber 3 in a vacuum atmosphere. This adjustment is performed in a state where the mask 101 is placed on the mask table 5, the substrate 100 is not being suctioned to the suction plate 15, and the substrate 100 is not being supported by the substrate support unit 6. Specifically, while the distance adjustment unit 22 is lowering the suction plate 15, the timing of contact between the suction plate 15 and the mask 101 is monitored for each of the multiple touch sensors 1621, thereby detecting the tilt of the mask 101, i.e., the tilt between the suction plate 15 and the mask 101. Then, based on the tilt detected by the touch sensor 1621, the adjustment unit 17 adjusts the axial position of at least some of the support axes R1 among the multiple support axes R1 so that the suction plate 15 and the mask 101 are parallel, and tilts the suction plate 15 relative to the mask 101.

[0063] A specific configuration for realizing the above-described functions by the pressure adjustment unit 90 will be described below.

[0064] 7 , the pressing force adjustment unit 90 includes a plurality of operation units 901 that are operated by a user (operator) to displace the contact ends 81 of the plurality of pressing members 80 in the vertical direction (Z direction). The operation units 901 are provided outside the vacuum chamber 3, for example, on the upper wall portion 30, corresponding to the plurality of pressing members 80. By providing the operation units 901 outside the vacuum chamber 3, the user can perform adjustments using the pressing force adjustment unit 90 even when the internal space 3 a of the vacuum chamber 3 is in a vacuum atmosphere.

[0065] The operation unit 901 is embodied as an adjusting nut that displaces (drives) the pressing member 80 in the vertical direction. The adjusting nut is configured to engage with a thread formed on the pressing member 80 (or a shaft supporting the pressing member 80). Therefore, when a user operates the operation unit 901 (turning the adjusting nut), the corresponding pressing member 80 is displaced in the vertical direction independently of the other pressing members 80. In other words, the multiple operation units 901 can independently adjust the vertical position of the contact end 81 of the corresponding pressing member 80. Therefore, by operating the operation unit 901 by the user in accordance with the inclination of the suction plate 15, the amount of protrusion of the contact end 81 of each pressing member 80 from the suction surface 150 (the pressing force of each pressing member 80 from the suction surface 150) is optimized. From the viewpoint of the degree of freedom in adjusting the vertical position of the contact end 81 of the pressing member 80, it is preferable to provide an operation unit 901 for each of the multiple pressing members 80.

[0066] 8A and 8B , the pressing force adjustment unit 90 may be embodied as an adjustment mechanism including a plurality of shafts 912 and a plurality of motors 914. Referring to FIG. 8A , the plurality of pressing members 80 are each held above the suction plate 15 via a guide member GM supported by the suction plate 15 so as to be drivable in the vertical direction (Z direction). A shaft 912 is provided corresponding to each of the plurality of pressing members 80, and is provided via the upper wall portion 30 of the vacuum chamber 3 so that one end is located inside the vacuum chamber 3 and the other end is located outside the vacuum chamber 3. The shaft 912 is configured as an axial member whose end located inside the vacuum chamber 3 is connectable to (abut against) the pressing member 80. The motor 914 is provided outside the vacuum chamber 3 so as to correspond to each of the plurality of pressing members 80 (the plurality of shafts 912), and is configured as a stepping motor or a servo motor that drives each of the plurality of shafts 912.

[0067] The rotational motion of the motor 914 is converted into linear motion of the shaft 912 via a rack-and-pinion system, a belt-pulley system, or another mechanical combination system. In this embodiment, the motor 914 and the shaft 912 are configured so that the rotation (drive) of the motor 914 drives the shaft 912 in the vertical direction (Z direction). Therefore, by driving the shaft 912 in the vertical direction by the motor 914, the shaft 912 comes into contact with the pressing member 80, which is held by the guide member GM so as to be drivable in the vertical direction, as shown in FIG. 8B . With the shaft 912 and the pressing member 80 in contact, further driving the shaft 912 in the vertical direction by the motor 914 makes it possible to displace the contact end 81 of the pressing member 80 in the vertical direction. In this way, when the motor 914 is driven (rotated), the pressing member 80 abutting against the corresponding shaft 912 is displaced in the vertical direction independently of the other pressing members 80. In other words, the multiple motors 914 can independently adjust the vertical position of the contact end 81 of the pressing member 80 via the corresponding shaft 912. As a result, by driving the motors 914 in accordance with the inclination of the attraction plate 15, the amount of protrusion of the contact end 81 of each pressing member 80 from the attraction surface 150 (the pressing force of each pressing member 80 from the attraction surface 150) is optimized via the shafts 912. From the viewpoint of the degree of freedom in adjusting the vertical position of the contact end 81 of the pressing member 80, it is preferable to provide a motor 914 and a shaft 912 for each of the multiple pressing members 80.

[0068] 8A and 8B , the control device 14 can control the drive amount of each of the multiple shafts 912 driven by each of the multiple motors 914 based on the inclination of the suction plate 15. In other words, under the control of the control device 14, the adjustment of the pressing force of each pressing member 80 within the second surface 100B of the substrate 100 can be automated. In this case, the inclination of the suction plate 15 may be input by a user via the input unit 146. However, from the perspective of automating the adjustment of the pressing force of the pressing member 80, it is preferable to provide a detection unit 92 that detects the inclination of the suction plate 15. Specifically, as the detection unit 92, a touch sensor 922 is provided on the contact end 81 of each of the multiple pressing members 80. The touch sensor 922 provided on the contact end 81 of each of the multiple pressing members 80 detects contact with the second surface 100 of the substrate 100 supported by the substrate support unit 6 (support portion 62).

[0069] While the pressure adjustment unit 90 lowers the pressing members 80, the timing of contact between each of the plurality of touch sensors 922 provided on the contact end 81 of each pressing member 80 and the second surface 100B of the substrate 100 is monitored, thereby detecting the tilt of the suction plate 15. Then, based on the tilt of the suction plate 15 detected by the touch sensors 922, the control device 14 controls the drive amount of each shaft 912 driven by each motor 914 so that the protrusion amounts of the contact end 81 of each pressing member 80 from the suction surface 150 are equal. This makes the pressing force of each pressing member 80 uniform within the plane of the second surface 100B of the substrate 100, effectively reducing deflection of the substrate 100 supported by the substrate support unit 6 and reducing poor suction of the substrate 100 on the suction plate 15.

[0070] The touch sensor 922 constituting the detection unit 92 that detects the tilt of the suction plate 15 can be replaced with a distance measuring sensor. Specifically, a distance measuring sensor that detects the distance between the contact end 81 of the pressing member 80 and the second surface 100B of the substrate 100 supported by the substrate support unit 6 is provided on the contact end 81 of each of the multiple pressing members 80. In this case, it is not necessary to lower the pressing member 80 by the pressure adjustment unit 90, and the tilt of the suction plate 15 can be obtained from the distance detected by each distance measuring sensor.

[0071] Next, a method for adsorbing the substrate 100 using the adsorption plate 15 in the film forming apparatus 1 will be described. In this adsorption method, in a first step, the peripheral portion of the first surface 100A of the substrate 100 is supported by the substrate support unit 6 (support portion 62). Then, in a second step, the adjustment unit 17 adjusts the relative tilt between the adsorption plate 15 and the mask table 5. Next, in a third step, with the adsorption plate 15 tilted, the substrate 100 is pressed from the second surface 100B side by the multiple pressing members 80. At this time, the pressure adjustment unit 90 adjusts the pressure with which each of the multiple pressing members 80 presses the substrate 100 in accordance with the tilt of the adsorption plate 15 so that the pressing force of each pressing member 80 is uniform within the plane of the second surface 100B of the substrate 100. Then, after the third step, in a fourth step, the substrate 100 pressed by the multiple pressing members 80 is adsorbed by the adsorption plate 15. According to the suction method of this embodiment, even if the suction plate 15 is tilted, the substrate 100 can be suctioned to the suction plate 15 with the bending of the substrate 100 reduced or removed. Therefore, not only can the time required to suction the substrate 100 to the suction plate 15 be shortened, but also wrinkles can be prevented from remaining on the substrate 100 suctioned to the suction plate 15.

[0072] In the film formation process (film formation method) in the film formation apparatus 1, a pattern is formed on the first surface 100A of the substrate 100, which has been attracted to the suction plate 15 as described above, via the mask 101 (fifth step). At this time, the substrate 100 is attracted to the suction plate 15 without any wrinkles, so that a highly accurate pattern can be formed on the first surface 100A of the substrate 100.

[0073] Next, a manufacturing method for manufacturing an electronic device using (a manufacturing line having) the film forming apparatus 1 of this embodiment will be described. Here, an organic EL display device will be described as an example of the electronic device.

[0074] First, an organic EL display device will be described. Fig. 9A is a diagram showing the overall configuration of an organic EL display device 50. Fig. 9B is a diagram showing the cross-sectional structure of one pixel of the organic EL display device 50.

[0075] As shown in FIG. 9A , the organic EL display device 50 has a display area 51 in which pixels 52, each including a plurality of light-emitting elements, are arranged in a matrix. As described below, each of the plurality of light-emitting elements has a structure including an organic layer (organic film) sandwiched between a pair of electrodes. In this embodiment, a pixel refers to the smallest unit capable of displaying a predetermined color in the display area 51. For example, in the organic EL display device 50, a pixel 52 is configured by a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, which are capable of displaying different colors. The pixel 52 is typically configured by a combination of red, green, and blue light-emitting elements, but is not limited thereto. For example, the pixel 52 may be configured by a combination of yellow, cyan, and white light-emitting elements, as long as it is configured by light-emitting elements of at least one color.

[0076] FIG. 9B is a partial cross-sectional view taken along line A-B in FIG. 9A . Each pixel 52 is composed of an organic EL element having an anode 54, a hole transport layer 55, one of light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a cathode 58 on a substrate 53. Of these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The anode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the cathode 58 may be formed in common with the plurality of light-emitting layers 56R, 56G, and 56B, or may be formed for each light-emitting element. An insulating layer 59 is provided between the electrodes to prevent the anode 54 and the cathode 58 from shorting due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer PL is provided to protect the organic EL element from moisture and oxygen.

[0077] 9B , the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but they may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL element. Furthermore, a hole injection layer having an energy band structure for facilitating the injection of holes from the anode 54 to the hole transport layer 55 may be formed between the anode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the cathode 58 and the electron transport layer 57.

[0078] A method for manufacturing an organic EL display device will now be described.

[0079] First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and an anode 54 are formed is prepared.

[0080] Next, an acrylic resin is formed by spin coating on the substrate 53 on which the anode 54 has been formed, and is patterned by lithography so that an opening is formed in the portion of the acrylic resin where the anode 54 has been formed, thereby forming an insulating layer 59. Such an opening corresponds to a light-emitting region where the light-emitting element actually emits light.

[0081] The substrate 53 with the patterned insulating layer 59 is carried into the film-forming apparatus 1 (first film-forming chamber) of the production line, and a hole transport layer 55 is formed as a common layer on the anode 54 of the display region 51. The hole transport layer 55 is formed by, for example, vacuum deposition. Since the hole transport layer 55 is actually formed to be larger than the display region 51, a high-resolution mask is not required.

[0082] Next, the substrate 53 on which the hole transport layer 55 has been formed is carried into the film forming apparatus 1 (second film forming chamber). The substrate 53 and a mask are aligned, and a red light-emitting layer 56R is formed through the mask on the portion of the substrate 53 where a red light-emitting element is to be formed.

[0083] Similar to the formation of the light-emitting layer 56R, the light-emitting layer 56G that emits green light is formed in the film-forming apparatus 1 (third film-forming chamber), and then the light-emitting layer 56B that emits blue light is formed in the film-forming apparatus 1 (fourth film-forming chamber). After the light-emitting layers 56R, 56G, and 56B are formed, the electron transport layer 57 is formed over the entire display area 51 in the film-forming apparatus 1 (fifth film-forming chamber). The electron transport layer 57 is formed as a layer common to the three light-emitting layers 56R, 56G, and 56B.

[0084] Next, the substrate 53 on which the electron transport layer 57 has been formed is carried into the film forming apparatus 1 (sixth film forming chamber), and the cathode 58 is formed.

[0085] Then, the substrate 53 on which the cathode 58 has been formed is carried into a sealing device, and the protective layer PL is formed by plasma CVD (sealing process), thereby completing the organic EL display device 50. Here, the protective layer PL is formed by the CVD method, but the method is not limited to this. For example, the protective layer PL may be formed by the ALD method or the inkjet method.

[0086] If the substrate 53 having the patterned insulating layer 59 is exposed to an atmosphere containing moisture or oxygen after being carried into the film forming apparatus 1 and before the protective layer PL is formed, the light-emitting layer made of an organic EL material may deteriorate. Therefore, it is preferable that the substrate 53 be carried into and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0087] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

[0088] This application claims priority based on Japanese Patent Application No. 2023-202139, filed November 29, 2023, the entire contents of which are incorporated herein by reference.

Claims

1. An adsorption device comprising: a substrate support part that supports a peripheral portion of a first surface of a substrate, the first surface including a first surface and a second surface opposite to the first surface; an adsorption plate that adsorbs the second surface of the substrate supported by the substrate support part; a first adjustment part that adjusts the relative tilt between the adsorption plate and a mask table on which a mask for forming a pattern on the first surface of the substrate is placed or the mask; a plurality of pressing members that are provided opposite each of a plurality of points on the peripheral portion of the second surface of the substrate and press the substrate from the second surface side; and a second adjustment part that adjusts the pressing force with which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support part in accordance with the tilt of the adsorption plate when the adsorption plate is tilted by the first adjustment part.

2. The suction device described in claim 1, characterized in that each of the multiple pressing members includes a contact end that contacts the second surface of the substrate supported by the substrate support portion, and the second adjustment portion adjusts the pressing force by vertically displacing the position of each of the contact ends of the multiple pressing members.

3. The suction plate includes an suction surface that suctions the second surface of the substrate, and each of the multiple pressing members presses the substrate from the second surface side by causing the contact end to protrude from the suction surface via a through hole that penetrates the suction plate between the suction surface and the surface opposite the suction surface, and the second adjustment unit displaces the position of the contact end of each of the multiple pressing members in the vertical direction so that the protruding amounts of the contact ends of each of the multiple pressing members protruding from the suction surface are equal.

4. The suction device according to claim 2, characterized in that the second adjustment portion includes an operating portion for vertically displacing the contact ends of each of the plurality of pressing members.

5. The suction device according to claim 4, further comprising a chamber that defines a space for accommodating the substrate support portion, the suction plate and the mask table and maintains the space in a vacuum atmosphere, and the operation portion is provided outside the chamber.

6. The suction device described in claim 2, characterized in that the second adjustment unit includes: a plurality of shafts provided corresponding to each of the multiple pressing members and connectable to each of the multiple pressing members; and a plurality of motors provided corresponding to each of the multiple pressing members and driving each of the multiple shafts, wherein the contact ends of each of the multiple pressing members are displaced in the vertical direction by driving each of the multiple shafts with the multiple motors.

7. The suction device according to claim 6, further comprising a chamber defining a space for accommodating the substrate support portion, the suction plate and the mask table and maintaining the space in a vacuum atmosphere, and the plurality of motors are provided outside the chamber.

8. The suction device according to claim 7, further comprising: a detection unit that detects the inclination of the suction plate; and a control unit that controls the driving amount of each of the multiple shafts driven by each of the multiple motors based on the inclination of the suction plate detected by the detection unit.

9. The suction plate includes an adsorption surface that adsorbs the second surface of the substrate, and each of the multiple pressing members presses the substrate from the second surface side by protruding its contact end from the adsorption surface via a through hole that penetrates the suction plate between the adsorption surface and the surface opposite the adsorption surface, and the control unit controls the driving amount of each of the multiple shafts driven by each of the multiple motors so that the protruding amounts of the contact ends of each of the multiple pressing members protruding from the adsorption surface are equal.

10. The suction device according to claim 1, further comprising a detection unit for detecting the inclination of the suction plate.

11. The suction device described in claim 10, characterized in that each of the multiple pressing members includes a contact end that contacts the second surface of the substrate supported by the substrate support portion, and the detection portion includes a touch sensor provided at the contact end of each of the multiple pressing members to detect contact with the second surface.

12. The suction device described in claim 10, characterized in that each of the multiple pressing members includes a contact end that contacts the second surface of the substrate supported by the substrate support portion, and the detection portion includes a distance measuring sensor provided at the contact end of each of the multiple pressing members and that detects the distance between the contact end and the second surface.

13. The suction device according to claim 1, characterized in that, before the second surface of the substrate is suction-held by the suction plate, the substrate is pressed from the side of the second surface by the plurality of pressing members.

14. The suction device described in claim 1, characterized in that a support area, which is an area on the first surface where the substrate support portion supports the substrate, and a pressing area, which is an area on the second surface where the multiple pressing members press the substrate, do not overlap when viewed from a direction perpendicular to the first surface or the second surface.

15. A film forming apparatus comprising: an adsorption device according to any one of claims 1 to 14; and a film forming section which forms a pattern on a first surface of a substrate adsorbed by an adsorption plate of the adsorption device.

16. A suction method comprising: a first step of supporting a peripheral portion of a first surface of a substrate, the peripheral portion including a first surface and a second surface opposite to the first surface, with a substrate support portion; a second step of adjusting a relative inclination between an adsorption plate which adsorbs the second surface of the substrate and a mask table on which a mask for forming a pattern on the first surface of the substrate is placed or the mask; a third step of pressing the substrate from the second surface side with a plurality of pressing members provided opposite each of a plurality of locations on the peripheral portion of the second surface of the substrate while the adsorption plate is inclined in the second step; and a fourth step of, after the third step, adsorbing the substrate pressed by the plurality of pressing members with the adsorption plate, wherein the third step includes a step of adjusting a pressing force with which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support portion in accordance with the inclination of the adsorption plate.

17. The chucking method according to claim 16, further comprising a fifth step of forming the pattern on the first surface of the substrate chucked by the chucking plate.

18. A manufacturing method for manufacturing an electronic device, comprising using the film forming apparatus according to claim 15.

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