Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

A one-component, solvent-free, non-halogenated heat-curable composition addresses the instability and environmental concerns of existing encapsulation materials by providing stable and reliable encapsulation for electrical components.

WO2025116899A1PCT designated stage expired Publication Date: 2025-06-05UNISEAL +3
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
PCT/US2023/081574
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-29
Publication Date
2025-06-05

AI Technical Summary

Technical Problem

Existing encapsulation materials for electrical components often require multiple components, halogenated solvents, and are not stable during storage, posing challenges in reliability and environmental safety.

Method used

Development of one-component, solvent-free, non-halogenated, heat-curable compositions that provide stable encapsulation for electrical components, utilizing specific monomers and crosslinking agents to ensure robust adhesion and protection.

Benefits of technology

The solution offers improved storage stability and environmental safety while ensuring effective encapsulation and adhesion, enhancing the reliability of electrical components.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure US2023081574_05062025_PF_FP_ABST
    Figure US2023081574_05062025_PF_FP_ABST
Patent Text Reader

Abstract

A storage stable, one-component, solvent-free, non-halogenated, heat curable composition which cures to form a cured product for use in encapsulation of electrical components, including: (a) an epoxy resin; (b) a non-halogenated flame retardant based on phosphorus containing epoxy resin; (c) a cyclic anhydride hardening agent; (d) a catalyst; (e) a rheology modifier; (f) a heat stabilizing agent; and (g) wherein the composition is fast gelling / curing and exhibits a high glass transition temperature, and excellent mechanical, electrical, and flame-retardant properties.
Need to check novelty before this filing date? Find Prior Art

Description

[0001].- - ,,- , - , - . . . . .., ,, ,, , ,, ,, -,,-,, , , , - ,- ., , ,: , , .,.,g, .., , , , .,., , . . , , , , : ,, .- ,, " " ," " ," ," ,,,, , , " ," ,, " ,, " ," ," ,, " , ," , ," ,, " ," " , , " – " .,, , , , , . ,, ... . . . . . , .- ,, . . .. . . . , , . ,, . : , , . , , , ,, >, , > =,1. , ,, . , , , , .. . , . .. ,, : ,- - , .- . : ,,, ., - , .- . - ,, , , - , - . , . , . , , - ,: - - . . , - °., , °. , - . . , , <= <= , . .- , °.*, - -<=. , - ,,- ,, -,- - , ,- , , . , , , . , . . ,. -,- , - , , : , , - , , - . , ,. °° ,. ., .-.. , ,, .. .14,.., , ., . ,.. °, .. °,°,°, . °. ., .. , - , , . , , , ,,- ,,- -, , . , , - . , , , , .- . , , , . , , , ,- ,.,- ,--- , . ., , . . . . .. , . ° °. , , -,- , , - , : , , - ,. : .- OH O O . . . - - : – - .., - -. , . , , ,. , . ,- , , .-,-, , , , , .- , , - . , , , , - .., ,, , ,, ,, , , . , : , - ,- , . , -,.- , , , ,, , ,, , , ,, ,- , ,,,- . ,,- . , , - . - , ,, , , , , , , , , , ,, ,, ,, - , . .- , : OH O ..,- , , ..,- ..,- . ..,- . , . , , O : 4- 2- .- ..,- , ..,-. , . ..,- . , O 7 7a1: O 6 7 O21,3-dione O 7 7a 1O O21,3-dione O 4 2 1-methyl-4- 8-ene-3,5-dione O 1 2 O O .- , , , , , , . , , , , , , , , , , , ., , – ,, " . , , , , , , . , ., , , , . ,. .. ,- ,- .., ..,- , . ..,- . , , , , , , , , - ,, , . .- : - 5 1 HN - , - -- -,- ,-, ,,- ,- ,- -- ,- -- , ,- -- ’ ..,- - , -- ,- -- , -- ---- ,’ - --′ -′--- ..,,- -- ,,- --′--′-,,- --′--′--- -′-- -,,- , ,- ,,- -- ’-.-.,- -,,- , - -- -- ,-,- ,..,- ---,,- ,,- -- ,- , - ,,- --′-,,- -′--- - . , - . , , .- - . ,,-, , ,,,- , ,. ..,-. ., ..,- .- ..,-... ..,- , . , . - - - . .., , ..,-. -. . ..,-. . , . ..,-. - .. , --- -- ---- -- - -- -- -- . , , , ., - : methylphenyl)propanoate) .- C ..,-. ., ..,-. ..,-. . ,-. . .., . ., ° ° ° : -° °, . ° °. . . . .- . . . . , . . –-° . - .° - . .st.nd.st,nd. . . , . , .- N1o. KuomNoamYmeDerc1a2Bsem- encoareAsensucretoonxEx 441 Ex 2 Ex Ex 474 Ex 47 E 47 Ex 477 , -, . - - , , . ,. , , , -, , , , , °-°° , , , - .- ° , . ° . , , . ,- - ,- , ,. , , , , , . , -, , , , , , °-°° , , - ° , . ° , , . . , . - , -, , , , , , . - ,, , . , , , °-° , , , .- ° , - ° , . , , , . ° . - - , . , , . , , -,, , , , °-° , , , ° . - ,. , ° , . , , . ° - - , , , , , . , . -, , , , °- , , °° ., .- . ,,, ° , . , , . ° - - , , , , , . , . -, , , , °- , , °° . , - , ° , ., , , . ° . - - , . , , , , . , -, , , , °- , , °° , --- . – .- . ,,, ° , . , , . ° T Vess°ctosrPotaeasrtt2es Rme Teoetmsot– eter E 1x 1 E 1x 2 Ex E 2x414 E 2x E 2x4 E 2x27sc14s .28 1425 .- –. °° °° . ., .... .. .... , . . . .. - . , , . . - . , , .. – . , , . .- , . , . . , , , , , , - , . , , , " .," " , ,," " ," , , , " " . . . " " . . , , , . , . ., , ., .- ,, . , . , , , .. - , , , , , , , ",, . , " " ," " ," " ," , . , , , . , , , , . . .

Claims

.-. , - , -, - , -, : - - - - - - -, , , - . . . . , °°. . ,.,.. , . , .. , . , ., .14.., , ....-. °, . ., °, °,°, . °. . , . . .., . , . - . , , , ,- ,,- ,,- , , . , . , - . . , , , , , , , ..-. . , , , ,- , ,- ,- . -- ,. . , . . . . , . . . . , .. ° . °. , . , - , -, - , -, : - - - - - - ..- . , : OH O O. . . , - , , .- , . , . . , , , .

Citation Information

Patent Citations

  • Epoxy resin composition for sealing optical semiconductor, and optical semiconductor device sealed with its cured material

    JP2002012743A

  • Phosphorus epoxy compound and method for preparing the same, epoxy composition comprising the same

    KR102587599B1

  • Phosphorated anhydride containing epoxy resin

    US11479638B2

  • Phosphorus-containing epoxy resin

    US20120302727A1

  • Rapid curing epoxy adhesive compositions

    US20170088664A1