Chip bonding device and bonding method

Abstract

A chip bonding device and a bonding method. The device comprises: a movable object pick-up table, configured to move a first element; a support platform, configured to support and move a second element; a calibration assembly, configured to provide a calibration marker and maintain a fixed distance from the first element or the second element; and an image acquisition device, configured to read an alignment marker of the first element and the calibration marker, and determine a first relative positional relationship between the first element and the calibration assembly on the basis of the alignment marker of the first element and the calibration marker, and configured to read an alignment marker of the second element and the calibration marker, and determine a second relative positional relationship between the second element and the calibration assembly on the basis of the alignment marker of the second element and the calibration marker. On the basis of an alignment difference, the bonding device drives the movable object pick-up table and / or the support platform to make adjustments.

Description

Chip bonding device and bonding method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 7, 2023, with application number 202311685313.0 and invention name “A chip bonding device and bonding method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of semiconductor manufacturing, and in particular to a chip bonding device and bonding method. Background Art

[0004] As semiconductor technology enters the post-Moore era, chip structures are evolving toward three-dimensional structures to meet the demands of high integration and high performance. Bonding technology, enabling the fabrication of stacked chips, is a key enabler of this "beyond Moore's Law" initiative. Bonding accuracy is a crucial parameter in the bonding process, significantly impacting its application.

[0005] Summary of the Invention

[0006] According to various embodiments of the present application, a chip bonding device and a chip bonding method are provided.

[0007] The present application provides a chip bonding device, comprising: a movable object-picking table, configured to move a first component; a carrying platform, configured to carry and move a second component; a correction component, configured to provide a correction mark, wherein the correction component maintains a fixed distance from the first component or the second component; an image acquisition device, configured to read the alignment mark of the first component and the correction mark of the correction component, and determine a first relative position relationship between the first component and the correction component based on the alignment mark of the first component and the correction mark, and configured to read the alignment mark of the second component and the correction mark of the correction component, and determine a second relative position relationship between the second component and the correction component based on the alignment mark of the second component and the correction mark; wherein the bonding device determines the alignment difference between the first component and the second component based on the first relative position relationship and the second relative position relationship, and drives the movable object-picking table and / or the carrying platform to adjust based on the alignment difference to perform an alignment compensation operation, so that the first component and the second component are aligned and bonded.

[0008] On the other hand, the present application provides a bonding method, which is applied to a bonding device, including: obtaining an alignment mark of a first element and a correction mark of a correction component, and determining a first relative position relationship between the first element and the correction component based on the coordinate information of the alignment mark of the first element and the coordinate information of the correction mark; obtaining an alignment mark of a second element and a correction mark of a correction component, and determining a second relative position relationship between the second element and the correction component based on the coordinate information of the alignment mark of the second element and the coordinate information of the correction mark, wherein the correction component and the first element or the second element maintain a fixed distance; determining an alignment difference between the first element and the second element based on the first relative position relationship and the second relative position relationship; the bonding device drives the first element and / or the second element to adjust based on the alignment difference to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded.

[0009] The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0011] FIG1 is a schematic structural diagram of a first embodiment of a bonding device in the present application;

[0012] FIG2 is a schematic structural diagram of a second embodiment of a bonding device in the present application;

[0013] FIG3 is a schematic diagram of a first coordinate system of a calibration mark corresponding to the bonding device in the present application;

[0014] FIG4 is a schematic diagram of a first coordinate system of two calibration marks corresponding to the bonding device in this application;

[0015] FIG5 is a schematic diagram of a second coordinate system of a calibration mark corresponding to the bonding device in the present application;

[0016] FIG6 is a schematic diagram of a second coordinate system of two calibration marks corresponding to the bonding device in this application;

[0017] FIG7 is a schematic flow chart of an embodiment of a bonding method in the present application;

[0018] FIG8 is a schematic diagram of a bonding coordinate system corresponding to the bonding device of the present application;

[0019] FIG9 is a schematic diagram of the bonding process of the first element and the second element in the present application;

[0020] FIG10 is a schematic diagram of coordinate information of the first element and the second element after bonding in the bonding coordinate system in the present application.

[0021] In the accompanying drawings, there are a bonding device 10, a movable pickup table 100, a first drive assembly 110, a first drive member 111, a second drive member 112, a third drive member 113, a correction assembly 200, a carrying platform 300, a second drive assembly 310, an image acquisition device 400, a first image acquisition device 410, a second image acquisition device 420, a machine table 500, a base 510, a machine table frame 520, a supply platform 600, a first component 20, and a second component 30. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0024] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] The technical solution of the present application is described in detail below with reference to the accompanying drawings and embodiments.

[0026] Please refer to FIG1 , which is a schematic structural diagram of a first embodiment of a bonding device provided in the present application.

[0027] As shown in Figure 1, the bonding device 10 includes: a movable object-picking table 100, a correction component 200, a carrying platform 300, and an image acquisition device 400; the movable object-picking table 100 is configured to pick up and move the first component 20; the correction component 200 is configured to provide a correction mark, and the correction component 200 maintains a fixed distance from the first component 20 or the second component 30; the carrying platform 300 is configured to carry and move the second component 30; the image acquisition device 400 is configured to read the alignment mark of the first component 20 and the correction mark of the correction component 200, and determine the first relative position relationship between the first component 20 and the correction component 200 based on the alignment mark of the first component 20 and the correction mark of the correction component 200, and is configured to read the alignment mark of the second component 30 and the correction mark of the correction component 200, and determine the second relative position relationship between the second component 30 and the correction component 200 based on the alignment mark of the second component 30 and the correction mark of the correction component 200.

[0028] In which, the bonding device 10 determines the alignment difference between the first component 20 and the second component 30 based on the first relative position relationship and the second relative position relationship, and drives the movable object picking table 100 and / or the supporting platform 300 to adjust based on the alignment difference to perform an alignment compensation operation, so that the first component 20 and the second component 30 are aligned and then bonded.

[0029] In some embodiments, after the first component 20 and the second component 30 are aligned, the movable platform 100 needs to be driven to move in the height direction, such as downward, so that the movable platform carries the first component 20 downward to contact the second component 30 for bonding.

[0030] In other embodiments, the first component 20 and the second component 30 may be aligned while the movable platform is driven to move in the height direction, so that the first component 20 and the second component 30 are brought into contact and bonded.

[0031] In other embodiments, the first component 20 and the second component 30 may be driven to the bonding position first, and then the first component 20 and the second component 30 may be adjusted to perform an alignment compensation operation on the first component 20 and the second component 30 .

[0032] In some embodiments, the bonding device further includes a machine platform 500, which includes a base 510 and a machine frame 520; the machine frame is arranged on the base, the movable object-picking platform 100 is arranged on the machine frame, and the carrying platform 300 is arranged under the machine frame.

[0033] Among them, the base can be a separate support for the machine frame; the base can also be an entire supporting surface for supporting the machine frame and the carrying platform 300, that is, a movable picking table 100 is set on the machine frame and facing the base, and the carrying platform 300 is set on the base and facing the machine frame.

[0034] It should be noted that Figure 1 only shows an embodiment in which the movable pickup table 100 is arranged on the top of the machine frame and the carrying platform 300 is arranged on the base; in another embodiment, the movable pickup table 100 can be arranged on the base, and the carrying platform 300 is arranged on the machine frame, specifically to achieve moving the first component 20 and the second component 30 to the bonding position. Therefore, the positions of the movable pickup table 100 and the carrying platform 300 are not limited in this application.

[0035] In some embodiments, the correction component 200 is detachably disposed on a movable pickup table; in response to the bonding device performing an alignment compensation operation, the correction component 200 is configured to be driven to a first position or a second position together with the movable pickup table 100, and the image acquisition device 400 is configured to read the alignment mark of the first element 20 in the first position and the correction mark of the correction component 200, and determine a first relative position relationship between the first element 20 and the correction component 200; or the image acquisition device is configured to read the alignment mark of the second element 30 in the second position and the correction mark of the correction component 200 to determine a second relative position relationship between the second element 30 and the correction component 200; at this time and in subsequent driving processes, the correction component maintains a fixed distance from the first element, such as maintaining a first relative position relationship between the correction component 200 and the first element 20.

[0036] In which, the image acquisition device 400 includes a first field of view and a second field of view. In response to the bonding device performing an alignment compensation operation, the image acquisition device 400 is configured to use the first field of view to identify the alignment mark of the first element 20 and the correction mark of the correction component 200, and is configured to use the second field of view to identify the alignment mark of the second element 30 and the correction mark of the correction component 200.

[0037] For example, the image acquisition device 400 includes a single-viewing angle image acquisition unit. When identifying the alignment mark of the first element and the correction mark of the correction component, the viewing angle of the image acquisition device is toward the first element and the correction component in the first position; when identifying the alignment mark of the second element and the correction mark of the correction component, the viewing angle of the image acquisition device is toward the second element and the correction component in the second position; in some embodiments, the image acquisition device 400 can be an image acquisition unit with upper and lower viewing angles.

[0038] The second field of view of the image capture device 400 is located in the same direction as the calibration assembly 200 and the first element 20 / second element 30. For example, when the second field of view is a downward viewing angle, the calibration assembly 200, the first element 20, and the second element 30 are vertically downward in the height direction. That is, the horizontal height of the image capture device 400 is higher than the horizontal heights of the calibration assembly 200, the first element 20, and the second element 30. Because it may be necessary to see through the calibration assembly 200 to obtain the alignment mark of the second element 30, the calibration assembly 200 can be a transparent, translucent, or calibration sheet with a through hole.

[0039] In some embodiments, the second field of view of the image acquisition device 400 is located between the calibration assembly 200 and the first element 20 / second element 30. For example, if the image acquisition device 400 is located between the calibration assembly 200 and the second element 30, the calibration mark of the calibration assembly 200 and the alignment mark of the second element 30 can be respectively acquired and formed into a single coordinate system. In this case, the calibration assembly 200 does not need to be viewed through. Therefore, the calibration assembly 200 can be an opaque flat plate without a through hole, as long as the calibration mark on the calibration assembly 200 can be acquired. It is understood that the first viewing angle can also have a similar configuration.

[0040] In order to facilitate the replacement of the correction component 200 , the correction component 200 may be detachably provided, for example, the correction component 200 may be detachably provided on the movable pickup table 100 or detachably provided on the carrying platform 300 .

[0041] It should be noted that Figure 1 only shows that the correction component 200 is set on the movable object collection platform 100 and moves together with the movable object collection platform 100. The correction component 200 moves with the movable object collection platform 100, enters the first field of view of the first image acquisition device 410, and enters the second field of view of the second image acquisition device 420; in other embodiments, the correction component 200 can also be fixedly set on the machine frame, the movable object collection platform 100 carries the first component 20 to the first field of view, and the carrying platform 300 carries the second component 30 to the second field of view; in other embodiments, the correction component 200 can also be set together with the carrying platform 300; the correction component 200 can also be provided with a movable part, which can be moved into the first field of view and into the second field of view. Specifically, the first image acquisition device 410 can simultaneously acquire the alignment mark of the first element 20 and the correction mark of the correction component 200 in the first field of view, and the second image acquisition device 420 can simultaneously acquire the alignment mark of the second element 30 and the correction mark of the correction component 200 in the second field of view.

[0042] It is understandable that, in some embodiments, the first component 20 may be a wafer to be bonded or a chip to be bonded; correspondingly, the second component 30 may be a wafer to be bonded or a chip to be bonded.

[0043] There is at least one alignment mark on the first component, and if there are two, they are such as the first alignment mark B1 and the second alignment mark B2. There is at least one correction mark on the correction component, and if there are two, they are such as the first correction mark D1 and the second correction mark D2. There is at least one alignment mark on the second component 30, and if there are two, they are such as the third alignment mark T1 and the fourth alignment mark T2.

[0044] Specifically, in response to the bonding device 10 performing a picking operation, the movable picking stage 100 is driven to the picking position and picks up the first component 20. After determining that the movable picking stage 100 has picked up the first component 20 to be bonded, the movable picking stage 100 is driven to the first position. At this time, the correction component 200 also follows the movable picking stage 100 to the first position, and then the image acquisition device 400 identifies the first alignment mark B1 on the first component 20 in the first field of view and the correction mark D1 on the correction component 200 at the alignment position, and then determines the first relative position relationship corresponding to the first component 20 and the correction component 200 in the first field of view.

[0045] After determining the first relative position relationship, the bonding device 10 drives the movable picking stage 100 to move to the second position, that is, the movable picking stage 100 carries the correction component 200 to the second position; at the same time, it drives the carrying platform 300 to carry the second component 30 to the second position, and drives the image acquisition device 400 to identify the third alignment mark T1 on the second component 30 in the second field of view at the bonding position, and identify the first correction mark D1 on the correction component 200, because the first correction mark D1 and the third alignment mark T1 are in the second field of view at this time, and then determine the second relative position relationship corresponding to the second component 30 and the correction component 200 in the second field of view.

[0046] Among them, the first position is the position where the first element 20 and the correction component 200 are located when obtaining the alignment mark of the first element 20 and the correction mark of the correction component 200, and the second position is the position where the second element 30 and the correction component 200 are located when obtaining the alignment mark of the second element 30 and the correction mark of the correction component 200.

[0047] In some embodiments, there can be at least two correction marks on the correction component 200, and there can also be at least two alignment marks on the first element 20 and the second element 30, such as the first correction mark D1 and the second correction mark D2, which can more clearly indicate the positional relationship between the first correction mark D1 and the second correction mark D2 and the first alignment mark B1 and the second alignment mark B2 of the first element, respectively, as well as the positional relationship between the correction mark D1 and the second correction mark D2 and the third alignment mark T1 and the fourth alignment mark T2, and determine the difference between the first alignment mark B1 and the second alignment mark B2 and the third alignment mark T1 and the fourth alignment mark T2.

[0048] After obtaining the first relative position relationship and the second relative position relationship, the alignment difference between the first element 20 and the second element 30 is determined based on the correction component 200 and the first relative position relationship and the second relative position relationship, and then the movable picking table 100 and / or the carrying platform 300 are driven to adjust based on the alignment difference to perform the alignment compensation operation; that is, the movable picking table 100 and / or the carrying platform 300 are driven to perform the alignment compensation operation at the bonding position so that the first element 20 and the second element 30 are aligned, and then the movable picking table 100 is driven to carry the first element 20 and move along the height direction, such as moving down, so that the aligned first element 20 and the second element 30 are bonded.

[0049] That is, it is only necessary to obtain the first relative position relationship between the first element 20 and the correction component 200, and the second relative position relationship between the second element 30 and the correction component 200 once, so that the alignment difference between the first element 20 and the second element 30 can be determined based on the first relative position relationship and the second relative position relationship. Then, based on the alignment difference, the alignment between the first element 20 and the second element 30 can be completed once, avoiding the time-consuming problem caused by multiple alignment, measurement, adjustment, re-alignment measurement and other operations.

[0050] The picking position is the position where the movable pick-up stage 100 can pick up the first component 20. The alignment position is the position corresponding to the first alignment mark B1 and the second alignment mark B2, as well as the first correction mark D1 and the second correction mark D2, on the first component 20 when the first image acquisition device 400 captures the first component 20 in the first position. The bonding position is the position corresponding to the third alignment mark T1 and the fourth alignment mark T2, as well as the correction mark D1, on the second component 30 when the second image acquisition device 420 captures the second component 30 in the second position. The bonding position is the position where the first component 20 and the second component 30 can be bonded after the movable pick-up stage 100 and / or the supporting platform 300. In some embodiments, when the first component 20 and the second component 30 are in the bonding position, the alignment marks of the first component 20 and the second component 30 are substantially aligned one-to-one.

[0051] In this embodiment, a correction component for reference is set up to obtain a first relative position relationship between the first element and the correction component, and a second relative position relationship between the second element and the correction component, and then the alignment difference between the first element and the second element is determined based on the first relative position relationship and the second relative position relationship, so that the bonding device completes the alignment of the first element and the second element based on the alignment difference and performs bonding. At the same time, there is no need to perform multiple alignments on each second element to be bonded, which effectively shortens the time consumption, and is conducive to improving the bonding efficiency and increasing the yield.

[0052] Please refer to FIG. 2 , which is a schematic structural diagram of a second embodiment of the bonding device provided in this application.

[0053] As shown in Figure 2, the bonding device 10 includes: a movable object-picking table 100, a correction component 200, a carrying platform 300, an image acquisition device 400, and a machine 500; wherein, the machine 500 includes a base 510 and a machine frame 520; the machine frame 520 is set on the base 510, the movable object-picking table 100 is set on the machine frame 520 and faces the base 510, the image acquisition device 400 may include a first image acquisition device 410 and a second image acquisition device 420, the first image acquisition device 410 can be set on the base 510 and face the machine frame 520, the second image acquisition device 420 can be set on the machine frame 520 and face the base 510, and the carrying platform 300 is set on the base 510.

[0054] The movable picking table 100 is configured to be movable along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane, that is, the movable picking table 100 can carry the first component 20 and the correction component 200 to move along the X direction, Y direction, and height direction Z, and to rotate in a vertical plane perpendicular to the horizontal plane; the carrying platform 300 is configured to be movable along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane, that is, the carrying platform 300 can carry the second component 30 to move along the X direction, Y direction, and height direction Z, and to rotate in a vertical plane perpendicular to the horizontal plane, and the first image acquisition device 410 is set on the base 510 and corresponds to the first position, and the second image acquisition device 420 is set on the machine frame 520 and corresponds to the second position.

[0055] It should be noted that Figure 2 only shows an embodiment in which the correction component 200 is set on the movable picking platform 100, maintaining a fixed distance from the first element 20; in another embodiment, the correction component 200 can also be set on the supporting platform 300, maintaining a fixed distance from the second element 30; or the correction component 200 moves synchronously with the movable picking platform 100 or the supporting platform 300, specifically, to achieve a fixed distance between the correction component 200 and the first element 20, or a fixed distance between the correction component 200 and the second element 30.

[0056] It should be noted that Figure 2 only shows an embodiment in which the first image acquisition device 410 is arranged on the base 510 and the second image acquisition device 420 is arranged on the machine frame 520; in another embodiment, the first image acquisition device 410 can be hoisted on the machine frame 520, and the second image acquisition device 420 can be arranged on the base 510. Specifically, the first image acquisition device 410 can obtain the alignment mark of the first component 20 and the calibration mark of the calibration component 200, and the second image acquisition device 420 can obtain the alignment mark of the second component 30 and the calibration mark of the calibration component 200. Therefore, the positions of the first image acquisition device 410 and the second image acquisition device 420 are not limited in this application.

[0057] The X direction and the Y direction are intersecting directions in the same horizontal plane. If the X direction and the Y direction are perpendicular to each other in the same horizontal plane, the height direction Z is the direction perpendicular to the horizontal plane.

[0058] In some embodiments, the movable picking table 100 can be a picking piece that can be flipped, that is, after picking up the first component 20 at the picking position, it is flipped so that the bonding surface of the first component 20 faces upward. After reaching the bonding position, the picking piece is flipped again so that the bonding surface of the first component 20 faces the second component 30, to avoid the bonding surface of the first component 20 being damaged during the movement.

[0059] In some embodiments, a vibration isolation and shock absorbing device may be further provided at the bottom of the base 510 to eliminate vibrations caused by the carrying platform 300 when moving the second element 30 to be bonded and during the bonding process, thereby improving the stability of the bonding device 10.

[0060] In some embodiments, the first image acquisition device 410 includes at least one first image acquisition unit, which is a top-view image acquisition unit. Taking a calibration marker and an alignment marker as an example, in response to the movable access platform 100 being driven to the first position, the top-view image acquisition unit is configured to identify the first alignment marker B1 on the first component 20 and the calibration marker D1 on the calibration assembly 200 carried by the movable access platform 100 in the first position. Because both the first alignment marker B1 and the calibration marker D1 are within the first field of view, a first coordinate system can be established based on the first alignment marker B1 and the calibration marker D1, and the coordinate information of each marker in the first coordinate system can be determined, thereby determining the first relative positional relationship between the first component 20 and the calibration assembly 200.

[0061] Among them, the upward view image acquisition unit can be one or more. When one upward view image acquisition unit cannot simultaneously obtain the first alignment mark B1 of the first element and the correction mark of the correction component 200, or cannot simultaneously obtain multiple alignment marks and multiple correction marks, it can be set to two or more upward view image acquisition units to meet the requirements of simultaneously obtaining the first alignment mark B1 of the first element and the correction mark of the correction component 200.

[0062] The first coordinate system includes an X-axis and a Y-axis. In the first coordinate system, the coordinate information of the first alignment mark B1 on the first element 20 is B1 (x B1 ,y B1 ), the coordinate information of the calibration mark D1 on the calibration component 200 is D1(x D1 ,y D1 ).

[0063] If two calibration marks and two alignment marks are used as an example, the first coordinate system includes an X-axis and a Y-axis. In the first coordinate system, the coordinate information of the first alignment mark B1 on the first element 20 is B1(x B1 ,y B1 ), the coordinate information of the second alignment mark B2 is B2(x B2 ,y B2 ), the coordinate information of the first calibration mark D1 on the calibration component 200 is D1(x D1 ,y D1 ), the coordinate information of the second calibration mark D2 is D2(x D2 ,y D2 ).

[0064] In some embodiments, the second image acquisition device 420 includes at least one second image acquisition unit, which is a downward-viewing image acquisition unit. In response to the bonding device performing an alignment compensation operation, the carrying platform 300 is driven to the second position, and the movable object pickup stage 100 is driven to carry the calibration assembly 200 to the second position. The downward-viewing image acquisition unit is then configured to identify the second alignment mark T1 on the second component 30 in the second position, as well as the calibration mark D1 on the calibration assembly 200. Because the second alignment mark T1 and the first calibration mark D1 are both within the second field of view, a second coordinate system can be established based on the second alignment mark T1 and the calibration mark D1, and the coordinate information of each mark in the second coordinate system can be determined, thereby determining the second relative position relationship between the second component 30 and the calibration assembly 200.

[0065] The second coordinate system includes an X-axis and a Y-axis. In the second coordinate system, the coordinate information of the second alignment mark T1 on the second element 30 is T1(x T1 ,y T1), the coordinate information of the calibration mark D1 on the calibration component 200 is D3(x D3 ,y D3 ).

[0066] If there are two calibration marks and two alignment marks, then the second coordinate system includes an X-axis and a Y-axis. In the second coordinate system, the coordinate information of the second alignment mark T1 on the second element 30 is T1(x T1 ,y T1 ), the coordinate information of the fourth alignment mark T2 is T2(x T2 ,y T2 ), the coordinate information of the first calibration mark D1 on the calibration component 200 is D3(x D3 ,y D3 ), the coordinate information of the second calibration mark D2 is D4(x D4 ,y D4 ).

[0067] In some embodiments, in response to the bonding device 10 performing a bonding operation, the bonding device adjusts the movable pick-up table 100 and / or the carrying platform 300 based on the alignment difference to perform an alignment compensation operation on the first element 20 and the second element 30 in the second position, and then moves the movable pick-up table 100 and / or the carrying platform 300 in the height direction so that the first element 20 and the second element 30 are driven to the bonding position.

[0068] In response to the bonding device 10 performing a bonding operation, the bonding device 10 moves the movable pick-up table 100 and / or the carrying platform 300 in the height direction so that the first element 20 and the second element 30 are driven to the bonding position, and at the same time, the movable pick-up table 100 and / or the carrying platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first element 20 and the second element 30.

[0069] The bonding position is the position where the first component 20 and the second component 30 are bonded.

[0070] In some embodiments, the bonding device 10 also includes a first drive component 110 and a second drive component 310, wherein the first drive component 110 is arranged on the machine frame and connected to the movable picking table, and the first drive component 110 is configured to carry the movable picking table 100 to move along the X direction, Y direction, and height direction of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane; the second drive component 310 is arranged on the base and connected to the carrying platform 300, and the second drive component is configured to carry the carrying platform 300 to move along the X direction, Y direction, and height direction Z of the horizontal plane, and to rotate in a vertical plane perpendicular to the horizontal plane.

[0071] Furthermore, the first driving assembly 110 may include a first driving member 111 , a second driving member 112 and a third driving member 113 .

[0072] Specifically, the first driving member 111 is movably arranged on the machine frame 520 and faces the base 510. The second driving member 112 is connected to the first driving member 111 and faces the base 510. The third driving member 113 is connected to the second driving member 112 and the movable pickup table 100 respectively, that is, the upper part of the third driving member 113 is connected to the second driving member 112, and the lower part of the third driving member 113 is connected to the movable pickup table 100. The movable pickup table 100 and the third driving member 113 are movable. It is a detachable connection and can be replaced in time when a fault occurs; wherein, the first driving member 111 is configured to carry the second driving member 112, the third driving member 113 and the movable collection platform 100 to move along the X direction and Y direction of the horizontal plane, the second driving member 112 is configured to carry the third driving member 113 and the movable collection platform 100 to move along the height direction, and the third driving member 113 is configured to carry the movable collection platform 100 to rotate in the rotation direction of the horizontal plane.

[0073] In some embodiments, in order to facilitate timely replacement when a fault occurs, the first driving member 111 can be detachably arranged on the machine frame 520; the second driving member 112 and the first driving member 111 can also be detachably connected, and the third driving member 113 and the second driving member 112 can also be detachably connected.

[0074] In some embodiments, the first driving member 111 can be an X / Y-axis macro-motion driving member, which is used to realize the movement of the first driving member 111 in the X and Y directions of the horizontal plane, and perform nanometer-level coarse positioning; the second driving member 112 can be a Z-axis driving member, which is used to realize the second driving member 112 driving the movable collection platform 100 to move in the height direction; the third driving member 113 can be a rotation driving member, which is used to realize the third driving member 113 driving the movable collection platform 100 to rotate in a vertical plane perpendicular to the horizontal plane, and realize precise positioning of the movable collection platform 100, wherein the third driving member 113 can achieve micro-radian positioning accuracy.

[0075] Furthermore, the second drive component 310 can be an X / Y-axis high-precision motion drive component, which is movably arranged on the base 510, and the carrying platform 300 is arranged on the second drive component 310. The second drive component 310 is configured to carry the carrying platform 300 to move in the X and Y directions of the horizontal plane, that is, the second drive component 310 drives the carrying platform 300 to move on the base 510 and perform nanometer-level coarse positioning, so that the second element 30 on the carrying platform 300 is aligned with the first element 20 sucked by the movable picking table 100.

[0076] It should be noted that the first drive member 111, the second drive member 112, the third drive member 113 and the second drive assembly 310 may also include: a motor, for example, a linear motor or a rotary motor, to provide power to the corresponding drive members respectively. It is understandable that the structural design of the first drive member 111 in the embodiment of the present application may also refer to the specific structure in the relevant technology. As long as the function of moving the movable pickup table 100 along the X direction and the Y direction in the horizontal plane and achieving nanometer-level precision positioning can be achieved, this application does not make specific restrictions. Accordingly, the structural design of the second drive member 112, the third drive member 113 and the second drive assembly 310 may also refer to the specific structure in the relevant technology, as long as the corresponding functions can be achieved.

[0077] Optionally, the X direction, the second Y direction, and the Z direction (height direction) are perpendicular to each other. Specifically, the Y direction can be a direction parallel to the Y axis, the X direction can be a direction parallel to the X axis, and the Z direction can be a direction parallel to the Z axis. Accordingly, the first drive member 111 is referred to as the X / Y axis macro motion drive member. The second drive member 112 and the third drive member 113 can also be referred to as the Z axis drive member and the rotation drive member, respectively. The second drive assembly 310 can also be referred to as the X / Y high-precision motion drive member.

[0078] Optionally, the carrying platform 300 can also be a single-stage motion mechanism or other types of motion mechanisms, as long as it can move the second element 30 to be bonded to the preset surface position corresponding to the first element 20 to be bonded and bond it to the preset surface position of the first element 20 to be bonded while meeting specific precision requirements.

[0079] In some embodiments, the bonding device 10 may further include a supply platform 600, which is disposed on the base 510 and is configured to provide the first component 20 to be bonded to the movable picking platform 100, that is, a plurality of first components 20 to be bonded are placed on the supply platform 600, and the movable picking platform 100 picks up the first component 20 on the supply platform 600 at the picking position, and then carries the first component 20 to the alignment position, so that the first image acquisition device 410 obtains the first alignment mark B1 on the first component 20 and the correction mark D1 on the correction component 200.

[0080] The following describes the working process of the bonding device 10.

[0081] Specifically, the first image acquisition device 410 has a first viewing angle and is configured to read at least one alignment mark on the first component 20 to be bonded and at least one calibration mark on the correction component 200 at the alignment position; and the second image acquisition device 420 has a second viewing angle and is configured to read at least one alignment mark on the second component 30 to be bonded and at least one calibration mark on the correction component 200 at the alignment position; the first component has a first alignment mark B1, the correction component 200 has a calibration mark D1, and the second component 30 has a third alignment mark T1 as an example for explanation.

[0082] In response to determining the alignment difference between the first element 20 and the second element 30, the correction mark of the correction component 200 maintains a first relative positional relationship with the alignment mark of the first element 20, and the first element 20 is driven to the second position. The image acquisition device 400 is configured to identify the alignment mark of the second element 30 and the correction mark of the correction component 200, and obtain the difference between the alignment mark of the first element 20 and the alignment mark of the second element 30 as the alignment difference, so as to perform an alignment compensation operation; or in response to determining the alignment difference between the first element 20 and the second element 30, the correction mark of the correction component 200 maintains a second relative positional relationship with the alignment mark of the second element 30, and the first element 20 is driven to the second position. The image acquisition device 400 is configured to identify the alignment mark of the first element 20 and the correction mark of the correction component 200, and obtain the difference between the alignment mark of the first element 20 and the alignment mark of the second element 30 as the alignment difference, so as to perform an alignment compensation operation.

[0083] In addition, in response to the bonding device performing the bonding operation, the bonding device adjusts the movable pick-up table 100 and / or the carrying platform 300 based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30 in the second position, and then moves the movable pick-up table 100 and / or the carrying platform 300 in the height direction so that the first component 20 and the second component 30 are driven to the bonding position; or in response to the bonding device performing the bonding operation, the bonding device moves the movable pick-up table 100 and / or the carrying platform 300 in the height direction so that the first component 20 and the second component 30 are driven to the bonding position. While the two components 30 are driven to the bonding position, the movable pick-up table 100 and / or the carrying platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30; or in response to the bonding device performing a bonding operation, the bonding device moves the movable pick-up table 100 and / or the carrying platform 300 in the height direction so that the first component 20 and the second component 30 are driven to the bonding position, and the movable pick-up table 100 and / or the carrying platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30.

[0084] The supply platform 600 and the first image acquisition device 410 are arranged on the base 510. When performing the bonding task, the bonding device 10 drives the first driving component 110 to carry the movable pick-up table 100 to the picking position corresponding to the supply platform 600, and drives the second driving component 112 to move the movable pick-up table 100 in the height direction, so as to move downward, so that the movable pick-up table 100 picks up the first component 20 to be bonded, and then drives the movable pick-up table 100 to move to the alignment position, that is, the identification position corresponding to the first image acquisition device 410; wherein, the correction component 200 moves with the movable pick-up table 100, so that the first alignment mark B1 on the first component 20 can be identified within the first camera field of view by the first image acquisition device 410, and the first calibration mark D1 on the correction component 200 can be identified, and a first coordinate system can be established, and then the coordinate information of each mark in the first coordinate system can be determined.

[0085] Please refer to FIG3 , which is a schematic diagram of a first coordinate system of a calibration mark corresponding to the bonding device in this application.

[0086] As shown in FIG3 , the first coordinate system includes an X-axis and a Y-axis. The coordinate information of the first alignment mark B1 in the first coordinate system is determined as B1 (x B1 ,y B1 ), the coordinate information of the first calibration mark D1 is D1(x D1 ,y D1 ), and then determine the first relative position relationship corresponding to the first element 20 and the calibration component 200 according to the difference in coordinate information.

[0087] Continuing to refer to FIG3 , in the first coordinate system, the first line between the first alignment mark B1 of the first component 20 to be bonded and the first calibration mark D1 of the calibration assembly 200 is set as L1. Based on the distance relationship between the first line L1 and the angular relationship between the first line L1 and the X-axis and Y-axis, the first relative position relationship corresponding to the first component 20 and the calibration assembly 200 can be determined.

[0088] Please refer to FIG4 , which is a schematic diagram of a first coordinate system of two calibration marks corresponding to the bonding device in this application.

[0089] As shown in FIG4 , the first coordinate system includes an X-axis and a Y-axis. The coordinate information of the first alignment mark B1 in the first coordinate system is determined as B1 (x B1 ,y B1 ), the coordinate information of the second alignment mark B2 is B2(x B2 ,y B2 ), the coordinate information of the first calibration mark D1 is D1(x D1 ,y D1 ), the coordinate information of the second calibration mark D2 is D2(x D2 ,yD2 ), and then determine the first relative position relationship corresponding to the first element 20 and the calibration component 200 according to the difference in coordinate information.

[0090] Continuing to refer to Figure 4, in the first coordinate system, the second line between the first alignment mark B1 and the second alignment mark B2 of the first element 20 to be bonded is set to L2, and the first angle between the second line L2 and the X-axis direction in the first coordinate system is α1; the third connection between the first correction mark D1 and the second correction mark D2 of the correction component 200 is set to L3, and the second angle between the third line L3 and the X-axis direction in the first coordinate system is α2. Then, the first angular deviation △α1 of the first element 20 to be bonded and the correction component 200 in the first coordinate system is the difference between the first angle α1 and the second angle α2, that is: △α1 is the absolute value of (α2-α1).

[0091] Specifically, after obtaining the coordinate information of the first alignment mark B1 and the second alignment mark B2 of the first element 20, and the first calibration mark D1 and the second calibration mark D2 of the calibration component 200, a difference calculation is performed, that is, the first X-axis difference △x1 between B1 and D1 on the X-axis is obtained, △x1=(x B1 -x D1 ), the second X-axis difference between B2 and D2 on the X-axis is △x2, △x2=(x B2 -x D2 ) and the first Y-axis difference △y1 between B1 and D1 on the Y-axis, △y1=(y B1 -y D1 ), the second Y-axis difference between B2 and D2 on the X-axis is △y2, △y2=(y B2 -y D2 ), and obtain the absolute value of the first angular deviation △α1 between the second line L2 and the third line L3, △α1 = the absolute value of (α2-α1), and then according to the first X-axis difference △x1, the second X-axis difference △x2, the first Y-axis difference △y1, the second Y-axis difference △y2 and the first angular deviation △α1, the first relative position relationship between the first element 20 and the correction component 200 can be determined.

[0092] After determining the first relevant position relationship, the bonding device 10 drives the carrying platform 300 to carry the second component 30 to the second position, and at the same time drives the movable object picking platform 100 to carry the correction component 200 to the second position, that is, the position corresponding to the second image acquisition device 420 when it is in the alignment position, and then drives the second image acquisition device 420 to identify the third alignment mark T1 on the second component 30 and the first calibration mark D1 on the correction component 200 in the second field of view, and establish a second coordinate system, and then determine the coordinate information of each mark in the second coordinate system.

[0093] Please refer to FIG5 , which is a schematic diagram of the second coordinate of a calibration mark corresponding to the bonding device in this application.

[0094] As shown in FIG5 , the second coordinate system includes an X-axis and a Y-axis. The coordinate information of the third alignment mark T1 in the second coordinate system is determined as T1 (x T1 ,y T1 ), the coordinate information of the calibration mark D1 is D3(x D3 ,y D3 ), and then determine the second relative position relationship corresponding to the second element 30 and the calibration component 200 according to the difference in coordinate information.

[0095] Continuing with FIG. 5 , in the second coordinate system, a fourth line between the third alignment mark T1 of the second component 30 to be bonded and the first calibration mark D1 of the calibration assembly 200 is set as L4. Based on the distance relationship of the fourth line L4 and the angular relationship between the fourth line L4 and the X-axis and Y-axis, the second relative position relationship corresponding to the second component 30 and the calibration assembly 200 can be determined.

[0096] Please refer to FIG. 6 , which is a schematic diagram of a second coordinate system of two calibration marks corresponding to the bonding device in this application.

[0097] As shown in FIG6 , the second coordinate system includes an X-axis and a Y-axis. The coordinate information of the third alignment mark T1 in the second coordinate system is determined as T1 (x T1 ,y T1 ), the coordinate information of the fourth alignment mark T2 is T2(x T2 ,y T2 ), the coordinate information of the first calibration mark D1 is D3(x D3 ,y D3 ), the coordinate information of the second calibration mark D2 is D4(x D4 ,y D4 ), and then determine the second relative position relationship corresponding to the second element 30 and the calibration component 200 according to the difference in coordinate information.

[0098] Continuing to refer to Figure 6, in the second coordinate system, the fifth line between the third alignment mark T1 and the fourth alignment mark T2 of the second element 30 to be bonded is set to L5, and the third angle between the fifth line L5 and the X-axis direction in the second coordinate system is α3; the sixth connection between the first correction mark D1 and the second correction mark D2 of the correction component 200 is set to L6, and the fourth angle between the sixth line L6 and the X-axis direction in the second coordinate system is α4, then the second angular deviation △α2 of the second element 30 to be bonded and the correction component 200 in the second coordinate system is the difference between the third angle α3 and the fourth angle α4, that is: △α2 is the absolute value of (α4-α3).

[0099] Specifically, after obtaining the coordinate information of the third alignment mark T1 and the fourth alignment mark T2 of the second element 30 and the first calibration mark D1 and the second calibration mark D2 of the calibration component 200 in the second coordinate system, a difference calculation is performed, that is, a third X-axis difference △x3 between T1 and D1 on the X-axis is obtained, △x3=(x T1 -x D3 ), the fourth X-axis difference between T2 and D2 on the X-axis is △x4, △x4=(x T2 -x D4 ) and the third Y-axis difference △y3 between T1 and D1 on the Y-axis, △y3=(y T1 -y D3 ), the fourth Y-axis difference △y4 between T2 and D2 on the X-axis, △y4=(y T2 -y D4 ), and obtain the absolute value of the second angular deviation △α2 between the fifth line L5 and the sixth line L6, △α2 = the absolute value of (α4-α3), and then according to the third X-axis difference △x3, the fourth X-axis difference △x4, the third Y-axis difference △y3, the fourth Y-axis difference △y4 and the second angular deviation △α2, the second relative position relationship between the second element 30 and the correction component 200 can be determined.

[0100] Then, the first calibration mark D1 of the calibration component 200 is used as a reference, and the first coordinate system and the second coordinate system are merged into a bonded coordinate system, that is, the coordinate information D1 (x D1 ,y D1 ) is equal to the coordinate information D3(x D3 ,y D3 ), and then obtain the coordinate information of the first alignment mark B1 of the first element 20 and the third alignment mark T1 of the second element 30 in the bonding coordinate system, and then perform difference calculation based on the coordinate information to determine the alignment difference between the first element 20 and the second element 30. Therefore, the movable object picking table and / or the carrying platform can be driven to adjust according to the alignment difference to perform the alignment compensation operation, so that the first element 20 and the second element 30 are aligned and then bonded; that is, the alignment difference between the first element 20 and the second element 30 is determined, and then the alignment between the first element 20 and the second element 30 can be completed at one time based on the alignment difference, thereby avoiding the time-consuming problem caused by multiple alignments.

[0101] Similarly, when the calibration assembly 200 has multiple calibration marks and the first component 20 and the second component 30 have multiple alignment marks, the first coordinate system and the second coordinate system can also be merged into a bonded coordinate system according to the above method.

[0102] In this embodiment, the first relative position relationship between the first element and the correction component can be obtained, and the second relative position relationship between the second element and the correction component can be obtained by using the correction component as a reference object, and then the alignment difference between the first element and the second element can be determined based on the first relative position relationship and the second relative position relationship, so that the bonding device completes the alignment of the first element and the second element based on the alignment difference and performs bonding. At the same time, there is no need to perform multiple alignments on each second element to be bonded, which effectively shortens the time consumption, and is conducive to improving the bonding efficiency and increasing the yield.

[0103] Furthermore, in the present application, the identification of the first component 20 and the calibration assembly 200 is acquired within the first field of view, and the identification of the second component 30 and the calibration assembly 200 is acquired within the second field of view. The distribution of the alignment mark of the first component 20 to be bonded and the alignment mark of the second component 30 to be bonded is not restricted. Therefore, the influence of the camera's field of view on the alignment mark of the first component 20 to be bonded and the alignment mark of the second component 30 to be bonded is effectively reduced.

[0104] Furthermore, the bonding device in the present application forms a closed motion loop through the cooperation of the first drive component and the second drive component, so that the carrier platform can achieve nanometer-level precision positioning, thereby effectively improving the bonding accuracy.

[0105] It can be understood that the bonding device in the embodiment of the present application can not only be applied to chip-to-wafer bonding technology (C2W), that is: in the bonding device described in the above embodiment, through the cooperation between the machine frame 520, the base 510, the carrying platform 300 and the movable picking table 100 in the machine 500, a high-precision mobile platform is formed, and a motion closed loop is formed, so that the chip to be bonded is moved to the preset surface position of the wafer to be bonded, and bonded to the preset surface position of the wafer to be bonded. In some embodiments, the bonding device in the embodiments of the present application can also be applied to wafer-to-wafer bonding technology (wafer-to-wafer, W2W), that is: in the bonding device described in the above embodiments, through the cooperation between the machine frame 520, the base 510, the carrying platform 300 and the movable picking table 100 in the machine 500, a high-precision mobile platform is formed, and a motion closed loop is formed, so that the first wafer to be bonded is moved to the preset surface position of the second wafer to be bonded, and bonded to the preset surface position of the second wafer to be bonded. Its working principle and the technical effect to be achieved are basically the same as those applied to chip-to-wafer bonding technology (chip-to-wafer, C2W). For specific contents, please refer to the relevant description in the above embodiments. Similarly, the bonding device in the embodiment of the present application can also be applied to chip-to-chip bonding technology (chip-to-chip, C2C). Its working principle and technical effects to be achieved are basically the same as those applied to chip-to-wafer bonding technology (chip-to-wafer, C2W). For specific contents, please refer to the relevant description in the above embodiment.

[0106] Based on the above bonding device, a method for bonding the second component 30 and the first component 20 using the above bonding device will be described below.

[0107] Refer to Figure 7, which is a flow chart of an embodiment of a bonding method in the present application. The following describes in detail the various steps of the bonding method provided in the embodiment of the present application in conjunction with the figure.

[0108] Specifically, as shown in FIG7 , the bonding method can be applied to the bonding device in any of the above embodiments, and the bonding method includes the following steps:

[0109] S10, acquiring an alignment mark of the first component and a correction mark of the correction assembly, and determining a first relative positional relationship between the first component and the correction assembly based on coordinate information of the alignment mark of the first component and the correction mark.

[0110] The operation flow of step S10 in an embodiment is as follows:

[0111] In response to the bonding device performing a bonding operation, the movable picking table of the bonding device is driven to pick up the first component; the movable picking table of the bonding device is driven to a first position, and the image acquisition device of the bonding device is used to identify the alignment mark of the first component and the correction mark of the correction component; based on the coordinate information of the alignment mark of the first component and the coordinate information of the correction mark, a first relative position relationship is determined.

[0112] In order to reduce multiple alignment operations, it is necessary to obtain the alignment mark of the first element and the correction mark of the correction component in advance within the first field of view; the correction component can be a correction piece that is transparent, translucent or has a through hole.

[0113] Specifically, the bonding device 10 drives the movable pick-up table 100 to move to the picking position, and drives the movable pick-up table 100 to move in the height direction, such as moving downward, through the second driving member 112, to pick up the first component 20 to be bonded on the supply platform 600, and after picking up the first component 20 to be bonded, the second driving member 112 drives the movable pick-up table 100 to move in the height direction, such as moving upward, and drives the first driving member 111 to carry the movable pick-up table 100 to the first position, and then identifies the first alignment mark B1 of the first component 20 and the first calibration mark D1 of the calibration component in the first field of view through the image acquisition device 400 in the alignment position; and establishes a first coordinate system based on the first alignment mark B1 and the first calibration mark D1, and obtains the coordinate information of each mark in the first coordinate system, wherein, in the first coordinate system, the coordinate information of the first alignment mark B1 is B1(x B1 ,y B1 ), the coordinate information of the first calibration mark D1 is D1(x D1 ,y D1 ).

[0114] Continuing to refer to FIG. 3 , in the first coordinate system, a first line between the first alignment mark B1 of the first component 20 to be bonded and the first calibration mark D1 of the calibration assembly is set as L1. Based on the distance relationship between the first line L1, the first relative position relationship corresponding to the first component 20 and the calibration assembly 200 can be determined. In some embodiments, the first relative position relationship corresponding to the first component 20 and the calibration assembly 200 can be further accurately determined based on the angular relationship between the first line L1 and the X-axis and the Y-axis.

[0115] If the first element 20 and the calibration assembly have multiple alignment marks and calibration marks respectively, the first relative position relationship between the first element 20 and the calibration assembly 200 is determined according to the coordinate relationship in FIG. 4 .

[0116] S20. Obtain the alignment mark of the second element and the correction mark of the correction component, and determine a second relative position relationship between the second element and the correction component based on the alignment mark and coordinate information of the second element and the coordinate information of the correction mark, wherein the correction component and the first element or the second element maintain a fixed distance.

[0117] The operation flow of step S20 in an embodiment is as follows:

[0118] In response to the bonding device performing a bonding operation, the carrying platform 300 of the bonding device is driven to the second position, and the movable picking table 100 is driven to carry the correction component 200 to the second position, and the image acquisition device 400 of the bonding device is used to identify the alignment mark of the second element 30 and the correction mark of the correction component; based on the coordinate information of the alignment mark of the second element and the coordinate information of the correction mark, the second relative position relationship is determined.

[0119] Among them, alignment is required before bonding. In order to avoid multiple alignments, it is necessary to obtain the alignment mark of the second element and the correction mark of the correction component in advance to determine the second relative position relationship between the second element and the correction component; or in order to speed up bonding, alignment can be performed while bonding.

[0120] Specifically, after obtaining the first relative position relationship, the carrying platform 300 is driven to carry the second component 30 to be bonded to the second position, and the first driving member is driven to drive the movable object-picking platform 100 to carry the correction component 200 to the second position, and then the third alignment mark T1 of the second component 30 and the first correction mark D1 of the correction component are identified in the second field of view by the second image acquisition device 420; and a second coordinate system is established based on the third alignment mark T1 and the first correction mark D1, and the coordinate information of each mark in the second coordinate system is obtained, wherein, in the second coordinate system, the coordinate information of the third alignment mark is T1(x T1 ,y T1 ), the coordinate information of the first calibration mark D1 is D3(x D3 ,y D3 ), and then determine the second relative position relationship corresponding to the second element 30 and the calibration component 200 according to the difference in coordinate information.

[0121] Continuing to refer to FIG5 , in the second coordinate system, the fourth line between the third alignment mark T1 of the second component 30 to be bonded and the first correction component D1 of the correction component 200 is set to L4. Then, based on the distance relationship of the fourth line L4, the second relative position relationship corresponding to the second component 30 and the correction component 200 can be determined; further, based on the angular relationship between the fourth line L4 and the X-axis and the Y-axis, the second relative position relationship corresponding to the second component 30 and the correction component 200 can be further accurately determined.

[0122] In some embodiments, in response to the bonding device performing an alignment compensation operation, the correction component 200 is driven to the second position, and the image acquisition device 400 of the bonding device is used to identify the alignment mark of the second element 30 and the correction mark of the correction component 200 to obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform the alignment compensation operation; wherein, the correction mark of the correction component maintains a first relative position relationship with the alignment mark of the first element.

[0123] In some embodiments, a movable picking table and / or a carrying platform are used to move the first component and the second component to the second position, and an alignment compensation operation is performed to align the first component and the second component driven to the second position; specifically, the movable picking table 100 and / or the carrying platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30 in the second position, and then the movable picking table 100 and / or the carrying platform 300 are moved in the height direction to drive the first component 20 and the second component 30 to the bonding position; or the movable picking table 100 and / or the carrying platform 300 are moved in the height direction to drive the first component 20 and the second component 30 to the bonding position, and at the same time, the movable picking table 100 and / or the carrying platform 300 are adjusted based on the alignment difference to perform an alignment compensation operation on the first component 20 and the second component 30.

[0124] S30 , determining an alignment difference between the first component and the second component according to the first relative position relationship and the second relative position relationship.

[0125] The operation flow of step S30 in an embodiment is as follows:

[0126] Determine an angular deviation between the first element and the second element based on the first relative position relationship and the second relative position relationship; correct the relative position of the first element and the second element based on the angular deviation; and determine an alignment difference between the first element and the second element based on the corrected relative position.

[0127] In order to obtain and determine the relative relationship between the first element and the second element, it is necessary to merge the first coordinate system and the second coordinate system into a bonding coordinate system.

[0128] Specifically, the first calibration mark D1 of the calibration component is used as a reference, and the first coordinate system and the second coordinate system are merged into a bonded coordinate system, that is, the coordinate information D1 (x D1 ,y D1 ) is equal to the coordinate information D3(x D3 ,y D3), and then obtain the coordinate information of the first alignment mark B1 of the first element 20 and the third alignment mark T1 of the second element 30 in the bonding coordinate system, such as the coordinate information given above, and then perform difference calculation based on the coordinate information.

[0129] If in the case of one correction mark, the coordinate information of the correction mark in the first coordinate system is equal to the coordinate information of the correction mark in the second coordinate system, and then based on the first alignment mark of the first element 20 and the third alignment mark of the second element 30, the coordinate difference between the first element 20 and the second element 30 is determined as the alignment difference.

[0130] Please refer to FIG8 , which is a schematic diagram of the bonding coordinate system corresponding to the bonding device of the present application.

[0131] As shown in FIG8 , in the bonding coordinate system, based on the coordinate information (x B1 ,y B1 ), coordinate information of the third alignment mark T1 (x T1 ,y T1 ), the X-axis difference and the Y-axis difference between the first element 20 and the second element 30 can be determined, and then the alignment difference between the first element and the second element can be determined based on the X-axis difference and the Y-axis difference.

[0132] S40 , based on the alignment difference, driving the first element and / or the second element to adjust to perform an alignment compensation operation, so that the first element and the second element are aligned and bonded.

[0133] 9 and 10 , FIG9 is a schematic diagram of the bonding process of the first element and the second element in the present application, and FIG10 is a schematic diagram of the coordinate information of the first element and the second element in the bonding coordinate system after bonding in the present application.

[0134] As shown in FIG. 9 , after the alignment difference is obtained, the first element and / or the second element may be driven to perform bonding.

[0135] In response to determining the alignment difference between the first element 20 and the second element 30, the correction mark of the correction component 200 maintains a first relative position relationship with the alignment mark of the first element 20, and the first element 20 is driven to the second position. The image acquisition device is configured to identify the alignment mark of the second element 30 and the correction mark of the correction component 200, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform an alignment compensation operation; or, in response to determining the alignment difference between the first element 20 and the second element 30, the correction mark of the correction component 200 and the alignment mark of the second element 30 mark a second relative position, and the first element is driven to the second position. The image acquisition device is configured to identify the alignment mark of the first element 20 and the correction mark of the correction component 200, and obtain the difference between the alignment mark of the first element and the alignment mark of the second element as the alignment difference to perform an alignment compensation operation.

[0136] That is, the correction mark of the correction component 200 can maintain a first relative position relationship with the alignment mark of the first element 20, or the correction mark of the correction component 200 can maintain a second relative position relationship with the alignment mark of the second element 30, which can be set according to actual conditions.

[0137] In some embodiments, after obtaining the alignment difference, the first drive member 111 and the third drive member 113 can be driven to drive the first element 20 on the movable object picking platform 100 to be adjusted, wherein the first drive component 110 is driven according to the X-axis difference and the Y-axis difference to perform the alignment compensation operation between the first element 20 and the second element 30, so that the first element 20 is aligned with the second element 30.

[0138] In other embodiments, after obtaining the alignment difference, the second drive component 310 can be driven according to the X-axis difference and the Y-axis difference to drive the second element on the carrying platform 300 to adjust, and perform the alignment compensation operation of the first element 20 and the second element 30, so that the first element 20 is aligned with the second element 30; and the first drive component 110 and / or the second drive component 310 can be driven to adjust the angle of the first element 20 and the second element 30 according to the angular deviation determined by the first relative position relationship and the second relative position relationship.

[0139] In other embodiments, after obtaining the alignment difference, the first drive component 110 and the second drive component 310 can be driven simultaneously to drive the first element 20 and the second element 30 to adjust, and the alignment compensation operation of the first element 20 and the second element 30 can be performed more quickly, so that the first element 20 is aligned with the second element 30.

[0140] After the first component 20 is aligned with the second component 30, the first driving component 110 is driven to drive the movable picking platform 100 to carry the first component 20 and move in the height direction, that is, move downward, so that the first component 20 after moving downward contacts and bonds with the second component, so that the bonding position of the first component 20 is further bonded with the bonding position of the second component, as shown in Figure 10.

[0141] In this embodiment, the first relative position relationship corresponding to the first element 20 and the correction component 200 in the first field of view is obtained, and the second relative position relationship corresponding to the second element 30 and the correction component 200 in the second field of view is obtained, and the alignment difference between the first element and the second element is determined based on the first relative position relationship and the second relative position relationship, and then the first element and / or the second element is adjusted based on the alignment difference to align the first element and the second element; that is, the bonding method in the present application is applied to the above-mentioned bonding device, and therefore has the same beneficial effects as the bonding device, which will not be repeated here.

[0142] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A bonding device for a chip, characterized in that, it includes: A movable pick-up stage configured to move a first component; A carrier platform configured to carry and move a second component; A calibration component configured to provide a calibration mark, and the calibration component maintains a fixed distance from the first component or the second component; An image acquisition device configured to read the alignment mark of the first component and the calibration mark of the calibration component, and determine a first relative position relationship between the first component and the calibration component based on the alignment mark of the first component and the calibration mark, and configured to read the alignment mark of the second component and the calibration mark of the calibration component, and determine a second relative position relationship between the second component and the calibration component based on the alignment mark of the second component and the calibration mark; Wherein, the bonding device determines an alignment difference between the first component and the second component based on the first relative position relationship and the second relative position relationship, and drives the movable pick-up stage and / or the carrier platform to perform an adjustment to execute an alignment compensation operation based on the alignment difference, so that the first component and the second component are aligned and bonded.

2. The bonding device according to claim 1, characterized in that, it includes: The calibration component is arranged on the movable pick-up stage; In response to the bonding device performing the alignment compensation operation, the calibration component is configured to be driven to a first position or a second position together with the movable pick-up stage, and the image acquisition device is configured to read the alignment mark of the first component and the calibration mark of the calibration component at the first position to determine the first relative position relationship; Or the image acquisition device is configured to read the alignment mark of the second component and the calibration mark of the calibration component at the second position to determine the second relative position relationship; Wherein, the calibration component maintains a fixed distance from the first component.

3. The bonding device according to claim 1, characterized in that, it includes: The calibration component is arranged on the carrier platform; In response to the bonding device performing the alignment compensation operation, the calibration component is configured to be driven to a first position or a second position together with the carrier platform, so that the image acquisition device reads the alignment mark of the first component and the calibration mark of the calibration component at the first position to determine the first relative position relationship; or the image acquisition device reads the alignment mark of the second component and the calibration mark of the calibration component at the second position to determine the second relative position relationship; Wherein, the calibration component maintains a fixed distance from the second component.

4. The bonding device according to claim 1, characterized in that, it includes: The image acquisition device includes a first field of view and a second field of view; In response to the bonding device performing the alignment compensation operation, the image acquisition device is configured to identify the alignment mark of the first component and the calibration mark of the calibration component using the first field of view, and to identify the alignment mark of the second component and the calibration mark of the calibration component using the second field of view.

5. The bonding device according to claim 4, wherein, the second field of view of the image acquisition device is simultaneously located in the same direction of the calibration component, the first component, and the second component; in response to the bonding device performing the alignment compensation operation, the calibration component is configured as a calibration sheet that is transparent, semi-transparent, or has a through hole.

6. The bonding device according to claim 5, wherein, the calibration component is detachably disposed on the movable pick-up stage or the carrier platform.

7. The bonding device according to claim 4, wherein, the image acquisition device includes a first image acquisition device and a second image acquisition device; in response to the bonding device performing the alignment compensation operation, the movable pick-up stage and the calibration component are driven to a first position, and the first image acquisition device is configured to identify the alignment mark of the first component and the calibration mark of the calibration component in the first field of view; then the movable pick-up stage and the calibration component are driven to a second position, and the second image acquisition device is configured to identify the alignment mark of the second component and the calibration mark of the calibration component in the second field of view.

8. The bonding device according to claim 7, wherein, the first image acquisition device includes at least one first image acquisition unit, and the at least one first image acquisition unit determines the first field of view; the second image acquisition device includes at least one second image acquisition unit, and the at least one second image acquisition unit determines the second field of view.

9. The bonding device according to claim 1, wherein, in response to determining the alignment difference between the first component and the second component, when the calibration mark of the calibration component maintains the first relative position relationship with the alignment mark of the first component, driving the first component to a second position, the image acquisition device is configured to identify the alignment mark of the second component and the calibration mark of the calibration component, and obtain the difference between the alignment mark of the first component and the alignment mark of the second component as the alignment difference to perform the alignment compensation operation; in response to determining the alignment difference between the first component and the second component, when the calibration mark of the calibration component maintains the second relative position relationship with the alignment mark of the second component, driving the first component to a second position, the image acquisition device is configured to identify the alignment mark of the first component and the calibration mark of the calibration component, and obtain the difference between the alignment mark of the first component and the alignment mark of the second component as the alignment difference to perform the alignment compensation operation.

10. The bonding device according to claim 9, wherein, In response to the bonding device performing a bonding operation, the bonding device adjusts the movable pick-up platform and / or the carrier platform based on the alignment difference to perform the alignment compensation operation on the first element and the second element in the second position, and then moves the movable pick-up stage and / or the carrier platform in the height direction to drive the first element and the second element to the bonding position; In response to the bonding device performing the bonding operation, while moving the movable pick-up platform and / or the carrier platform in the height direction to drive the first element and the second element to the bonding position, the bonding device adjusts the movable pick-up stage and / or the carrier platform based on the alignment difference to perform the alignment compensation operation on the first element and the second element; In response to the bonding device performing the bonding operation, the bonding device moves the movable pick-up platform and / or the carrier platform in the height direction to drive the first element and the second element to the bonding position, and adjusts the movable pick-up stage and / or the carrier platform based on the alignment difference to perform the alignment compensation operation on the first element and the second element.

11. The bonding device according to claim 1, wherein, further comprising: a machine base, including a base and a machine base frame, wherein the machine base frame is arranged on the base, the movable pick-up stage is arranged on the machine base frame, the carrier platform is arranged on the base, and the movable pick-up platform and / or the carrier platform are configured to be movable along the X direction, Y direction, and height direction Z, and rotatable in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the movable pick-up platform and / or the carrier platform.

12. The bonding device according to claim 11, wherein, further comprising: a first driving assembly, arranged on the machine base frame and connected to the movable pick-up stage, the first driving assembly being configured to carry the movable pick-up stage movable along the X direction, Y direction, and height direction Z of the horizontal plane, and rotatable in a vertical plane perpendicular to the horizontal plane; a second driving assembly, arranged on the base and connected to the carrier platform, the second driving assembly being configured to carry the carrier platform movable along the X direction, Y direction, and height direction Z of the horizontal plane, and rotatable in a vertical plane perpendicular to the horizontal plane.

13. A bonding method, wherein, applied to a bonding device, comprising: acquiring an alignment mark of a first element and a calibration mark of a calibration component, and determining a first relative position relationship between the first element and the calibration component according to the coordinate information of the alignment mark of the first element and the coordinate information of the calibration mark; Obtain the alignment mark of the second component and the calibration mark of the calibration component, and determine the second relative position relationship between the second component and the calibration component according to the coordinate information of the alignment mark of the second component and the coordinate information of the calibration mark, wherein the calibration component and the first component or the second component maintain a fixed distance; Determine the alignment difference between the first component and the second component according to the first relative position relationship and the second relative position relationship; Based on the alignment difference, the bonding device drives the first component and / or the second component to perform an adjustment to execute an alignment compensation operation, so that the first component and the second component are aligned and bonded.

14. The bonding method according to claim 13, wherein, The determining the first relative position relationship between the first component and the calibration component includes: In response to the bonding device performing the alignment compensation operation, driving the movable pick-up stage of the bonding device and the calibration component to a first position, and using the image acquisition device of the bonding device to identify the alignment mark of the first component and the calibration mark of the calibration component; Determine the first relative position relationship according to the coordinate information of the alignment mark of the first component and the coordinate information of the calibration mark.

15. The bonding method according to claim 13, wherein, Use the carrier platform of the bonding device to carry and move the second component; The determining the second relative position relationship between the second component and the calibration component includes: In response to the bonding device performing the alignment compensation operation, driving the carrier platform of the bonding device and the calibration component to a second position, and using the image acquisition device of the bonding device to identify the alignment mark of the second component and the calibration mark of the calibration component; Determine the second relative position relationship according to the coordinate information of the alignment mark of the second component and the coordinate information of the calibration mark.

16. The bonding method according to claim 13, wherein, In response to determining the alignment difference between the first component and the second component, the calibration mark of the calibration component and the alignment mark of the first component maintain the first relative position relationship, drive the first component to a second position, the image acquisition device is configured to identify the alignment mark of the second component and the calibration mark of the calibration component, and obtain the difference between the alignment mark of the first component and the alignment mark of the second component as the alignment difference to perform the alignment compensation operation; In response to determining the alignment difference between the first component and the second component, the calibration mark of the calibration component and the alignment mark of the second component maintain the second relative position relationship, drive the first component to a second position, the image acquisition device is configured to identify the alignment mark of the first component and the calibration mark of the calibration component, and obtain the difference between the alignment mark of the first component and the alignment mark of the second component as the alignment difference to perform the alignment compensation operation.

17. The bonding method according to claim 13, wherein, In response to the bonding device performing a bonding operation, the first element is configured as a chip or a wafer to be bonded, and the second element is configured as a wafer or a chip to be bonded; Using the movable pick-up stage and / or the carrier platform, move the first element and the second element to a second position and perform an alignment compensation operation to align the first element and the second element driven to the second position.

18. The bonding method according to claim 17, wherein, The step of using the movable pick-up stage and / or the carrier platform to move the first element and the second element to a second position and perform an alignment compensation operation to align the first element and the second element driven to the second position includes: Based on the alignment difference, adjust the movable pick-up stage and / or the carrier platform to perform an alignment compensation operation on the first element and the second element at the second position, and then move the movable pick-up stage and / or the carrier platform in the height direction so that the first element and the second element are driven to the bonding position; or While moving the movable pick-up stage and / or the carrier platform in the height direction so that the first element and the second element are driven to the bonding position, based on the alignment difference, adjust the movable pick-up stage and / or the carrier platform to perform an alignment compensation operation on the first element and the second element; or Move the movable pick-up platform and / or the carrier platform in the height direction so that the first element and the second element are driven to the bonding position, and based on the alignment difference, adjust the movable pick-up stage and / or the carrier platform to perform the alignment compensation operation on the first element and the second element.

19. The bonding method according to claim 13, wherein, The step of determining the alignment difference between the first element and the second element according to the first relative position relationship and the second relative position relationship includes: Determine the angular deviation between the first element and the second element according to the first relative position relationship and the second relative position relationship; According to the angular deviation, correct the relative positions of the first element and the second element; According to the corrected relative positions, determine the alignment difference between the first element and the second element.

Images