Heating device and semiconductor substrate processing apparatus

Abstract

The present invention relates to the technical field of semiconductor machining apparatuses, and especially relates to a heating device and a semiconductor substrate processing apparatus. The semiconductor substrate processing apparatus comprises a heating device, wherein the heating device comprises a heating disk, a support shaft, a first electrode post and an air cooling mechanism, the support shaft being connected to an end surface of the heating disk and being provided with a mounting cavity, the first electrode post being disposed in the mounting cavity and being connected to the heating disk, and the air cooling mechanism being disposed on the support shaft and configured to blow air into the mounting cavity. The heating device can use the air cooling mechanism to blow air into the mounting cavity of the support shaft, and take away heat generated by the first electrode post, thereby achieving good cooling and temperature reduction effects; in addition, it is not necessary to reduce the heat generated by the first electrode post by means of current shunting, such that there is no need to assemble more first electrode posts in the mounting cavity, thereby saving the space of the mounting cavity and reducing the assembly difficulty of the first electrode post.

Description

Heating device and semiconductor substrate processing equipment Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a heating device and semiconductor substrate processing equipment. Background Art

[0002] The processing of semiconductor substrates by semiconductor substrate processing equipment generally includes etching, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), plasma enhanced atomic layer deposition (PEALD), pulsed deposition layer (PDL), plasma enhanced pulsed deposition layer (PEPDL) and resist removal, etc.

[0003] The semiconductor substrate processing equipment provided by the related art includes a heating device, which includes a heating plate, a support shaft, and an electrode column. The support shaft is connected to the heating plate, and the electrode column is disposed within a mounting cavity of the support shaft and connected to the heating plate. During operation of the heating device, the electrode column generally generates a large amount of heat. To reduce this heat generation, the related art generally employs a method of current diversion by providing at least two electrode columns.

[0004] However, the method of using multiple electrode columns to shunt the current to reduce the generated heat is not ideal. The increased number of electrode columns will occupy more space in the support shaft, and the space in the support shaft is narrow, making it inconvenient to assemble.

[0005] Summary of the Invention

[0006] The object of the present invention is to provide a heating device and a semiconductor substrate processing device, which can use an air cooling mechanism to blow air into the installation cavity of the support shaft to take away the heat generated by the first electrode column, thereby achieving a good cooling and temperature reduction effect, and does not need to reduce the heat generated by the first electrode column by current diversion. Therefore, there is no need to install more first electrode columns in the installation cavity, which can save space in the installation cavity and reduce the difficulty of assembling the first electrode column.

[0007] The embodiment of the present invention is achieved as follows:

[0008] In a first aspect, the present invention provides a heating device comprising:

[0009] heating plate;

[0010] A support shaft connected to the end surface of the heating plate, the support shaft being provided with a mounting cavity;

[0011] a first electrode column, the first electrode column being disposed in the mounting cavity and connected to the heating plate; and

[0012] The air cooling mechanism is arranged on the supporting shaft and is used for blowing air into the installation cavity.

[0013] In an optional embodiment, the air cooling mechanism includes at least two air inlets, both of which are configured to blow air toward the first electrode column, and the at least two air inlets are at different heights.

[0014] In an optional embodiment, the air cooling mechanism includes a base and at least two air inlet pipes, the base is arranged on the support shaft, and the at least two air inlet pipes are plugged into the base and extend into the installation cavity; each air inlet pipe is provided with an air inlet.

[0015] In an optional embodiment, the base is provided with an air outlet communicating with the installation cavity, for allowing the air in the installation cavity to flow out.

[0016] In an optional embodiment, the number of air inlets is less than or equal to the number of air outlets.

[0017] In an optional embodiment, the heating device further includes a connecting assembly, which is disposed in the mounting cavity, the first electrode column having a first end and a second end away from the first end, the first end of the first electrode column being connected to the heating plate, and the connecting assembly being connected to the second end of the first electrode column; at least two air inlets are distributed relative to the second end of the first electrode column.

[0018] In an optional embodiment, the heating device further includes a second electrode column, one end of which extends into the installation cavity and is connected to the connection assembly; the other end of the second electrode column is used to connect to the filter.

[0019] In an optional embodiment, the connecting assembly includes two spring plates, and the two spring plates jointly clamp the second end of the first electrode column and the second electrode column.

[0020] In an optional embodiment, the spring clip includes a first section, an arc section, and a second section connected in sequence, the first sections of the two spring clips jointly clamp the second end of the first electrode column, and the second sections of the two spring clips jointly clamp the second electrode column.

[0021] In an optional embodiment, at least one of the two spring pieces is made of conductive metal.

[0022] In an optional embodiment, both spring sheets are made of conductive metal, and the distance between the two spring sheets is greater than or equal to 4.3 mm.

[0023] In a second aspect, the present invention provides a semiconductor substrate processing device comprising the heating device of any one of the aforementioned embodiments.

[0024] The beneficial effects of the heating device according to the embodiment of the present invention include: the heating device provided by the embodiment of the present invention includes a heating disk, a support shaft, a first electrode column, and an air cooling mechanism, the support shaft being connected to the end surface of the heating disk and provided with a mounting cavity; the first electrode column being disposed within the mounting cavity and connected to the heating disk; and the air cooling mechanism being provided on the support shaft and configured to blow air into the mounting cavity. The air cooling mechanism blows air into the mounting cavity to remove heat generated by the first electrode column, achieving a good cooling effect. Furthermore, there is no need to reduce the heat generated by the first electrode column by current shunting, thus eliminating the need to install more first electrode columns within the mounting cavity, thereby saving space in the mounting cavity and reducing the difficulty of assembling the first electrode column.

[0025] The semiconductor substrate processing device of an embodiment of the present invention includes the aforementioned heating device, and it includes all the beneficial effects of the heating device, for example: blowing air into the installation cavity through an air cooling mechanism to take away the heat generated by the first electrode column, thereby achieving good cooling and temperature reduction effects, and there is no need to reduce the heat generated by the first electrode column by current diversion, so there is no need to install more first electrode columns in the installation cavity, which can save space in the installation cavity and reduce the difficulty of assembling the first electrode column. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0027] FIG1 is a schematic structural diagram of a heating device according to an embodiment of the present invention;

[0028] FIG2 is a schematic structural diagram of an air cooling mechanism, a first electrode column, and a second electrode column in a first viewing angle according to an embodiment of the present invention;

[0029] FIG3 is a schematic structural diagram of the air cooling mechanism, the first electrode column, and the second electrode column in a second viewing angle according to an embodiment of the present invention;

[0030] FIG4 is a schematic structural diagram of the air cooling mechanism, the first electrode column, and the second electrode column in an embodiment of the present invention at a third viewing angle.

[0031] Icons: 010-heating device; 100-heating plate; 200-support shaft; 210-installation cavity; 300-first electrode column; 400-air cooling mechanism; 410-air inlet pipe; 411-air inlet; 420-base; 421-air outlet; 500-connecting assembly; 510-spring; 511-first section; 512-arc section; 513-second section; 600-second electrode column. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0035] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate and simplify the description of the present invention and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," etc., etc., are used solely for distinction and should not be construed as indicating or implying relative importance.

[0036] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, or electrical connections; direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0037] This embodiment provides a semiconductor substrate processing device, which may be a plasma enhanced chemical vapor deposition device, a physical vapor deposition device, an atomic layer deposition device, etc., and is not specifically limited here.

[0038] The semiconductor substrate processing equipment includes a reaction chamber and a heating device 010 (as shown in Figure 1) arranged in the reaction chamber; the heating device 010 includes a heating disk 100, a support shaft 200 and a first electrode column 300; one end of the support shaft 200 is connected to one end surface of the heating disk 100, and the other end surface of the heating disk 100 can be used to support the substrate, and the support shaft 200 is provided with an installation cavity 210; the first electrode column 300 is inserted into the installation cavity 210 and connected to the heating disk 100.

[0039] It should be noted that the structure of the reaction chamber and other structures of the semiconductor substrate processing equipment are similar to those in the related art and will not be described in detail here.

[0040] Optionally, the heating plate 100 is made of ceramic material, and the first electrode column 300 is connected to the heating plate 100 by welding; specifically, the first electrode column 300 is connected to the heating plate 100 by brazing.

[0041] In other embodiments, the first electrode column 300 may also be plugged into or threadedly connected to the heating plate 100 , which is not specifically limited here.

[0042] In order to cool the first electrode column 300, referring to Figures 1 and 2, the heating device 010 of this embodiment further includes an air cooling mechanism 400. The air cooling mechanism 400 is disposed on the support shaft 200 and is used to blow air into the mounting cavity 210 of the support shaft 200. The air cooling mechanism 400 blows air into the mounting cavity 210 to remove heat generated by the first electrode column 300, achieving a good cooling and temperature reduction effect. Furthermore, there is no need to reduce the heat generated by the first electrode column 300 by current diversion. Therefore, there is no need to install more first electrode columns 300 in the mounting cavity 210, which can save space in the mounting cavity 210 and reduce the difficulty of assembling the first electrode column 300.

[0043] 3 and 4 , the air cooling mechanism 400 includes an air inlet 411 , and the air inlet 411 is configured to blow air toward the first electrode column 300 to reliably remove heat generated by the first electrode column 300 .

[0044] The number of air inlets 411 can be selected as needed. In this embodiment, the air cooling mechanism 400 includes two air inlets 411, both of which are configured to blow air toward the first electrode column 300. The two air inlets 411 are at different heights, that is, one higher and one lower, blowing air toward the first electrode column 300. This arrangement can improve cooling efficiency.

[0045] Optionally, in other embodiments, the number of the air inlets 411 may be one, three, etc., which is not specifically limited here.

[0046] It should be noted that the heating device 010 of this embodiment includes a first electrode column 300 , and the two air inlets 411 are opposite to the first electrode column 300 , so that the air from the two air inlets 411 can be used to take away the heat generated by the first electrode column 300 .

[0047] In other embodiments, the number of first electrode columns 300 of the heating device 010 may be two or more; when the number of first electrode columns 300 increases, the number of air inlets 411 may also increase accordingly. For example, when the heating device 010 includes two first electrode columns 300, the number of air inlets 411 of the air cooling mechanism 400 may also be four, and two of the air inlets 411 are distributed opposite to one of the first electrode columns 300, and the other two air inlets 411 are distributed opposite to the other first electrode column 300; or, when the heating device 010 includes two first electrode columns 300, the number of air inlets 411 of the air cooling mechanism 400 may also be three, and two of the air inlets 411 are distributed opposite to one of the first electrode columns 300, and the other air inlet 411 is distributed opposite to the other first electrode column 300, etc. The number and distribution of the air inlets 411 and the first electrode columns 300 are not listed one by one here.

[0048] Please refer to Figures 2, 3 and 4. In this embodiment, the air cooling mechanism 400 includes a base 420 and two air inlet pipes 410. The base 420 is arranged on the support shaft 200. The two air inlet pipes 410 are both plugged into the base 420 and extend into the installation cavity 210; each air inlet pipe 410 is provided with an air inlet 411.

[0049] Furthermore, the two air inlet pipes 410 are arranged opposite to each other and spaced apart, and the air inlets 411 of the two air inlet pipes 410 are both opposite to the first electrode column 300. This arrangement ensures the cooling efficiency of the first electrode column 300.

[0050] Furthermore, the first electrode column 300 and the two air inlet pipes 410 are arranged in a triangular pattern. This arrangement allows the air inlets 411 provided on the two air inlet pipes 410 to blow air approximately from both sides of the first electrode column 300, improving cooling efficiency and uniformity. Furthermore, the narrow mounting cavity 210 can be fully utilized to accommodate the two air inlet pipes 410, eliminating the need to increase the size of the mounting cavity 210 and the support shaft 200. Consequently, there is no need to design and manufacture the support shaft 200, thus reducing the design and production costs of the heating device 010.

[0051] Optionally, the lines connecting the first electrode column 300 and the two air inlet pipes 410 are distributed at angles with the first electrode column 300 as the vertex, and the angles include but are not limited to 160°, 145°, and 120°.

[0052] It should be understood that in other embodiments, the two air inlet pipes 410 may also be distributed on the left and right sides of the first electrode column 300 , that is, the first electrode column 300 and the two air inlet pipes 410 are distributed on the same straight line.

[0053] It should be noted that, in this embodiment, each air inlet pipe 410 is provided with only one air inlet 411. Of course, in other embodiments, one air inlet pipe 410 may also be provided with two, three, or other numbers of air inlets 411, which is not specifically limited here.

[0054] It should also be noted that in an embodiment where the number of air inlets 411 is greater than two, the same number of air inlet pipes 410 as the air inlets 411 can be set, and each air inlet pipe 410 is provided with an air inlet 411; or, the number of air inlet pipes 410 is less than the air inlets 411, and at least one of the air inlet pipes 410 is provided with greater than or equal to two air inlets 411.

[0055] Optionally, the semiconductor substrate processing equipment also includes an air outlet mechanism (not shown in the figure), which includes a shell and a fan arranged in the shell. The air inlet pipe 410 is connected to the shell, and the air inlet of the air inlet pipe 410 is connected to the inner cavity of the shell. The fan is used to blow air into the air inlet of the air inlet pipe 410, and enable the wind entering the air inlet pipe 410 to be blown into the installation cavity 210 from the air inlet 411.

[0056] Furthermore, the air outlet mechanism can also include a heat exchange component, which is arranged in the shell and is used to exchange heat from the air; in this way, the fan can be used to blow the cold air after heat exchange into the air inlet of the air inlet pipe 410, and blown into the installation cavity 210 through the air inlet pipe 410, so as to improve the heat dissipation effect by using cold air.

[0057] 4 , the base 420 of this embodiment is provided with an air outlet 421 that communicates with the mounting cavity 210. The air outlet 421 is used to allow air within the mounting cavity 210 to flow out. This arrangement enables air circulation within the mounting cavity 210, thereby quickly and reliably removing heat generated by the first electrode column 300.

[0058] Furthermore, the number of the air inlets 411 is the same as the number of the air outlets 421 . This configuration can effectively achieve pressure balance inside and outside the installation cavity 210 and ensure that the heat generated by the first electrode column 300 is reliably removed.

[0059] Of course, in other embodiments, the number of the air inlets 411 may be smaller than the number of the air outlets 421 , which is not specifically limited here.

[0060] It should be noted that directly setting the air outlet 421 on the base 420 can reduce the number of pipelines, reduce costs, and save installation steps.

[0061] Optionally, the support shaft 200 includes a first shaft body (not shown) and a second shaft body (not shown). The first shaft body is connected between the heating plate 100 and the second shaft body. The first shaft body is provided with a first cavity, and the second shaft body is provided with a second cavity. The first cavity and the second cavity are connected, that is, the installation cavity 210 includes a first cavity and a second cavity that are connected to each other. The first end of the first electrode column 300 passes through the first cavity and is connected to the heating plate 100, and the second end of the first electrode column 300, away from the first end, extends into the second cavity. The base 420 is assembled with the second shaft body, and the air inlet pipe 410 plugged into the base 420 extends into the second cavity. This arrangement ensures easy assembly.

[0062] Furthermore, part of the base 420 is plugged into the end of the second cavity away from the first cavity and is interference fit with the second shaft. This arrangement ensures assembly stability and ease of operation.

[0063] Furthermore, the first shaft body and the second shaft body are connected by fasteners such as bolts to ensure the connection stability of the first shaft body and the second shaft body.

[0064] It should be understood that in other embodiments, the connection method between the base 420 and the second axis body can also be clamping, connection through fasteners such as bolts, threaded connection, etc., and the connection method between the first axis body and the second axis body can also be threaded connection, clamping, etc., which is not specifically limited here.

[0065] Referring to Figure 2 , the heating device 010 of this embodiment further includes a connecting assembly 500, which is disposed within the mounting cavity 210. Specifically, the connecting assembly 500 is disposed within the second cavity. The connecting assembly 500 is connected to the second end of the first electrode column 300, and both air inlets 411 are disposed opposite the second end of the first electrode column 300. A significant amount of heat is generated at the connection between the first electrode column 300 and the connecting assembly 500. If heat cannot be dissipated promptly and reliably, the connection between the first electrode column 300 and the connecting assembly 500 may melt. Disposing the air inlets 411 opposite the second end of the first electrode column 300 ensures that air entering the second cavity from the air inlets 411 is reliably directed toward the connection between the second end of the first electrode column 300 and the connecting assembly 500, thereby reliably and promptly dissipating the significant amount of heat generated at the connection between the first electrode column 300 and the connecting assembly 500.

[0066] Furthermore, the semiconductor substrate processing equipment also includes a filter; the heating device 010 also includes a second electrode column 600, one end of which is connected to the filter, and the other end of the second electrode column 600 extends into the installation cavity 210 and is connected to the connecting assembly 500. That is, the second electrode column 600 is connected to the first electrode column 300 through the connecting assembly 500, and the filter is connected to the first electrode column 300 through the second electrode column 600 and the connecting assembly 500. By extending the other end of the second electrode column 600 into the installation cavity 210 and connecting it to the first electrode column 300 through the connecting assembly 500, the air cooling mechanism 400 can also be used to simultaneously remove heat generated at the connection between the second electrode column 600 and the connecting assembly 500, ensuring good heat dissipation performance and reducing the problem of melting at the connection between the second electrode column 600 and the connecting assembly 500.

[0067] The structure of the connection assembly 500 can be customized. In this embodiment, the connection assembly 500 includes two spring clips 510, which jointly clamp the second end of the first electrode column 300 and the end of the second connection column away from the filter. By simultaneously clamping the first electrode column 300 and the second electrode column 600 with the two spring clips 510, the elastic deformation of the spring clips 510 can ensure the connection stability between the first electrode column 300 and the second electrode column 600 in the event of shaking or vibration.

[0068] Furthermore, the spring clip 510 includes a first section 511, an arcuate section 512, and a second section 513, which are connected in sequence. The first sections 511 of the two spring clips 510 jointly clamp the second end of the first electrode column 300, and the second sections 513 of the two spring clips 510 jointly clamp the end of the second electrode column 600 away from the filter. The provision of the arcuate section 512 can ensure the deformation capability of the spring clip 510.

[0069] Furthermore, both springs 510 are made of conductive metal; such a configuration can also ensure that the first electrode column 300 and the second electrode column 600 are reliably electrically connected through the connecting assembly 500, and ensure the ease of operability of electrically connecting the first electrode column 300 and the second electrode column 600.

[0070] Of course, in other embodiments, one of the two springs 510 is made of conductive metal; or, in other embodiments, both springs 510 are made of insulating material, and the first electrode column 300 and the second electrode column 600 can also be electrically connected via a conductive wire.

[0071] The conductive metal includes but is not limited to copper, iron, or alloys, etc., which are not specifically limited here.

[0072] In this embodiment, the spacing between the two spring clips 510 is equal to 4.3 mm. Specifically, the spacing between the first sections 511 of the two spring clips 510 is 4.3 mm, the spacing between the second sections 513 of the two spring clips 510 is 4.3 mm, and the spacing between the arc sections 512 of the two spring clips 510 is 4.3 mm. Such an arrangement can ensure a safe creepage distance.

[0073] Of course, in other embodiments, the distance between the two spring pieces 510 may be larger than 4.3 mm, for example, 4.4 mm, 4.5 mm, 5 mm, etc., which is not specifically limited here.

[0074] To ensure the stability of the two spring clips 510 clamping the first electrode column 300, the first electrode column 300 is connected to at least one of the two spring clips 510 via fasteners such as bolts; similarly, to ensure the stability of the two spring clips 510 clamping the second electrode column 600, the second electrode column 600 is connected to at least one of the two spring clips 510 via fasteners such as bolts.

[0075] When the heating device 010 of the semiconductor substrate processing equipment of this embodiment is in use, the air cooling mechanism 400 can blow air into the mounting cavity 210 of the support shaft 200 to remove heat generated by the first electrode column 300 .

[0076] To sum up, the heating device 010 can use the air cooling mechanism 400 to blow air into the installation cavity 210 of the support shaft 200 to take away the heat generated by the first electrode column 300, thereby achieving a good cooling and temperature reduction effect, and there is no need to reduce the heat generated by the first electrode column 300 by current diversion. Therefore, there is no need to assemble more first electrode columns 300 in the installation cavity 210, which can save space in the installation cavity 210 and reduce the difficulty of assembling the first electrode column 300.

[0077] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A heating device, characterized in that: include: A heating plate (100); A support shaft (200), the support shaft (200) being connected to an end surface of the heating plate (100), and the support shaft (200) being provided with a mounting cavity (210); a first electrode column (300), the first electrode column (300) being disposed in the installation cavity (210) and connected to the heating plate (100); and, An air cooling mechanism (400) is arranged on the support shaft (200) and is used for blowing air into the installation cavity (210).

2. The heating device according to claim 1, characterized in that The air cooling mechanism (400) comprises at least two air inlets (411), and the at least two air inlets (411) are configured to blow air toward the first electrode column (300), and the at least two air inlets (411) have different heights.

3. The heating device according to claim 2, characterized in that: The air cooling mechanism (400) comprises a base (420) and at least two air inlet pipes (410); the base (420) is arranged on the support shaft (200); at least two air inlet pipes (410) are plugged into the base (420) and extend into the installation cavity (210); each of the air inlet pipes (410) is provided with the air inlet port (411).

4. The heating device according to claim 3, characterized in that: The base (420) is provided with an air outlet (421) in communication with the installation cavity (210) and is used to allow air in the installation cavity (210) to flow out.

5. The heating device according to claim 4, characterized in that: The number of the air inlets (411) is less than or equal to the number of the air outlets (421).

6. The heating device according to claim 2, characterized in that: The heating device further comprises a connecting component (500), wherein the connecting component (500) is arranged in the installation cavity (210), the first electrode column (300) has a first end and a second end away from the first end, the first end of the first electrode column (300) is connected to the heating plate (100), and the connecting component (500) is connected to the second end of the first electrode column (300); at least two of the air inlets (411) are distributed opposite to the second end of the first electrode column (300).

7. The heating device according to claim 6, characterized in that The heating device further comprises a second electrode column (600), one end of the second electrode column (600) extending into the installation cavity (210) and connected to the connection assembly (500); the other end of the second electrode column (600) is used for connecting a filter.

8. The heating device according to claim 7, characterized in that: The connection assembly (500) comprises two spring sheets (510), and the two spring sheets (510) jointly clamp the second end of the first electrode column (300) and the second electrode column (600).

9. The heating device according to claim 8, characterized in that The spring sheet (510) comprises a first section (511), an arc section (512) and a second section (513) which are connected in sequence; the first sections (511) of the two spring sheets (510) jointly clamp the second end of the first electrode column (300); and the second sections (513) of the two spring sheets (510) jointly clamp the second electrode column (600).

10. The heating device according to claim 8, characterized in that At least one of the two spring sheets (510) is made of conductive metal.

11. The heating device according to claim 10, characterized in that The two spring sheets (510) are both made of conductive metal, and the distance between the two spring sheets (510) is greater than or equal to 4.3 mm.

12. A semiconductor substrate processing device, characterized in that: The heating device comprises the heating device according to any one of claims 1 to 11.

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