Electronic device module, controller, and vehicle

Abstract

A vehicle comprises a controller, wherein the controller comprises an electronic device module. The electronic device module comprises two functional modules, wherein each functional module is provided with a first terminal and a second terminal, the first terminal and the second terminal both extend toward the other functional module, end portions of every two first terminals are connected, and end portions of every two second terminals are connected; and in the thickness direction of the first terminals, the projection of the second terminals on the first terminals is at least partially received in the first terminals.

Description

Electronic device modules, controllers and vehicles

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 8, 2023, with application number 202311689423.4 and invention name “Electronic device module, controller and vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of electronic device modules, and in particular to an electronic device module, a controller including the electronic device module, and a vehicle including the controller. Background Art

[0003] A vehicle controller generally includes a DC link capacitor and a power module that are electrically connected to each other. In the prior art, the terminals of the DC link capacitor are generally electrically connected to the terminals of the power module via nuts.

[0004] However, due to the limited extension length of the terminals required for the nut connection, longer terminals increase the inductive loop between the DC link capacitor and the power module. Furthermore, due to the poor reliability of the nut connection, loosening the nut can create a gap between the two connected terminals, further increasing stray inductance. High stray inductance can cause large oscillations in the circuit system, leading to energy attenuation and component damage. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the present disclosure aims to provide an electronic device module capable of reducing stray inductance, a controller including the electronic device module, and a vehicle including the controller. Specifically, the present disclosure includes the following technical solutions:

[0006] In a first aspect, an embodiment of the present disclosure provides an electronic device module, comprising two functional modules, each functional module being provided with a first terminal and a second terminal, both of which extend toward the other functional module, the ends of the first terminals of the two functional modules being conductive, and the ends of the second terminals of the two functional modules being conductive; along the thickness direction of the first terminal, the projection of the second terminal on the first terminal is at least partially accommodated in the first terminal.

[0007] The electronic device module disclosed herein is configured such that the two terminals of the two functional modules are arranged between the two functional modules, and the projection of the second terminal on the first terminal is at least partially contained within the first terminal, so that the magnetic field generated by the current flowing in the two first terminals can at least partially offset the magnetic field generated by the current flowing to the two second terminals, thereby reducing the generation of stray inductance.

[0008] In one embodiment, the sum of the lengths of the two first terminals of the two functional modules is greater than or equal to the maximum spacing distance between the two functional modules, and the ends of the two first terminals of the two functional modules are overlapped and conductively connected.

[0009] In one embodiment, the sum of the lengths of the two first terminals of the two functional modules is L1, the maximum spacing distance between the two functional modules is D1, and the thickness of the first terminal of each functional module is H1; wherein, L1 < D1, and D1 - L1 ≤ H1 / 2; the ends of the two first terminals of the two functional modules are filled and conductively connected by melting.

[0010] In one embodiment, the electronic device module further includes a connecting member, and the ends of the two second terminals of the two functional modules are conductively connected through the connecting member; the connecting member includes a connecting portion and two docking portions, the connecting portion is located between the two docking portions, and each docking portion is conductively connected to one second terminal respectively.

[0011] In one embodiment, the sum of the lengths of the connecting portion and the two docking portions is greater than or equal to the maximum spacing distance between the two second terminals of the two functional modules, and each docking portion is overlapped and conductively connected to one second terminal of one functional module respectively.

[0012] In one embodiment, the sum of the lengths of the connecting portion and the two docking portions is L2, the maximum spacing distance between the two second terminals of the two functional modules is D2, and the thickness of the second terminal of each functional module is H2; wherein, L2 < D2, and D2 - L2 < H2 / 2; each docking portion is filled and conductively connected to one second terminal of one functional module by melting.

[0013] In one embodiment, the first terminal of at least one functional module includes a plurality of first sub - terminals, and along the width direction of the first terminal, the first sub - terminals are spaced apart from each other; and / or, the second terminal of at least one functional module includes a plurality of second sub - terminals, and along the width direction of the second terminal, the second sub - terminals are spaced apart from each other.

[0014] In one embodiment, the first terminal of at least one functional module includes a plurality of first sub - terminals, and along the width direction of the first terminal, the width of the first sub - terminal located at the edge of the plurality of first sub - terminals is greater than the width of the remaining first sub - terminals.

[0015] In one embodiment, the first terminal of the same functional module includes a plurality of first sub - terminals, and the second terminal includes a plurality of second sub - terminals. The number of the first sub - terminals is equal to the number of the second sub - terminals. Along the thickness direction of the first terminal, the projection of each second sub - terminal on the first sub - terminal is at least partially accommodated within one first sub - terminal.

[0016] In one embodiment, the ratio of the width of the first terminal to the width of the second terminal is between 0.8 and 1.2.

[0017] In one embodiment, the electronic device module further includes two insulating members, each of which is fixed between a first terminal and a second terminal of a functional module and extends toward another functional module respectively, and the extension length of each insulating member is between the extension length of the first terminal and the extension length of the second terminal.

[0018] In one embodiment, the electronic device module further includes a second insulating member, which is provided on the surface of the connector facing the first terminal. Along the thickness direction of the first terminal, the projection of the second insulating member on the first terminal covers the first terminal exposed between the two second terminals of the two functional modules; along the length direction of the first terminal, the length of the second insulating member is greater than or equal to the distance between the two insulating members of the two functional modules; along the width direction of the first terminal, the width of the second insulating member is greater than or equal to the width of the connector.

[0019] In one embodiment, the electronic device module further includes an insulating layer, the insulating layer being coated on a surface of the connector facing the first terminal, and a projection of the first terminal exposed between the two second terminals of the two functional modules on the insulating layer along a thickness direction of the first terminal being accommodated within the insulating layer;

[0020] Along the length direction of the first terminal, the length of the insulating layer is greater than or equal to the distance between the two insulating members of the two functional modules.

[0021] In one embodiment, at least one insulating member is provided with an insulating protrusion, which is exposed between the second terminals of the two functional modules and extends in a direction away from the first terminals. The insulating protrusion is spaced apart from the connecting member.

[0022] In one embodiment, at least one groove is provided on a surface of the insulating protrusion away from the first terminal; and / or at least one groove is provided on a surface of the insulating protrusion away from the second terminal.

[0023] In one embodiment, a positioning column is protruded from the surface of the insulating protrusion away from the first terminal, and the positioning column is spaced apart from the first terminal and the second terminal along the width direction of the first terminal; a positioning hole is provided on the connector, and the positioning column can extend into the positioning hole to achieve positioning of the connector.

[0024] In one embodiment, the ends of the first terminals of the two functional modules are connected using a contactless energy source scanning connection technology; along the thickness direction of the first terminals, the distance between the ends of the first terminals of the two functional modules is less than or equal to 0.2 mm.

[0025] In one embodiment, the end of the second terminal of at least one functional module is connected to the connector using a non-contact energy source scanning connection technology; along the thickness direction of the second terminal, the distance between the end of the second terminal and the connector using the non-contact energy source scanning connection technology is less than or equal to 0.2 mm.

[0026] In a second aspect, an embodiment of the present disclosure provides a controller including an electronic device module, wherein two functional modules of the electronic device module are a DC support capacitor and a power module.

[0027] In a third aspect, an embodiment of the present disclosure provides a vehicle including a controller.

[0028] It can be understood that the controller provided in the second aspect of the present disclosure and the vehicle provided in the third aspect both have the effect of reducing stray inductance due to the adoption of the electronic device module provided in the first aspect of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic structural diagram of a vehicle provided in one embodiment of the present disclosure;

[0030] FIG2 is a schematic structural diagram of an electronic device module provided in one embodiment of the present disclosure;

[0031] FIG3 is a schematic structural diagram of a first functional module of an electronic device module provided in one embodiment of the present disclosure;

[0032] FIG4 is a schematic structural diagram of a second functional module of an electronic device module provided in one embodiment of the present disclosure;

[0033] FIG5 is a schematic diagram of the main structure of an electronic device module provided in one embodiment of the present disclosure;

[0034] FIG6 is an enlarged schematic diagram of an electronic device module provided in one embodiment of the present disclosure;

[0035] FIG7 is another enlarged schematic diagram of an electronic device module provided in one embodiment of the present disclosure;

[0036] FIG8 is another enlarged schematic diagram of an electronic device module provided in one embodiment of the present disclosure;

[0037] FIG9 is a schematic structural diagram of a connector provided in one embodiment of the present disclosure;

[0038] FIG10 is a partially enlarged schematic diagram of an electronic device module provided in one embodiment of the present disclosure;

[0039] FIG11 is another partially enlarged schematic diagram of an electronic device module provided in one embodiment of the present disclosure;

[0040] FIG12 is an enlarged schematic diagram of a first functional module of an electronic device module provided in one embodiment of the present disclosure;

[0041] FIG13 is an enlarged schematic diagram of a second functional module of an electronic device module provided in one embodiment of the present disclosure;

[0042] FIG14 is another partially enlarged schematic diagram of an electronic device module provided in one embodiment of the present disclosure;

[0043] FIG15 is another enlarged schematic diagram of the second functional module of the electronic device module provided in one embodiment of the present disclosure. DETAILED DESCRIPTION

[0044] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure.

[0045] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present disclosure can be used to implement. The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present disclosure include direct and indirect connections (couplings) unless otherwise specified. The directional terms mentioned in the present disclosure, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present disclosure, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0046] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. A person of ordinary skill in the art will understand the specific meanings of the above terms in this disclosure based on the specific circumstances. It should be noted that the terms "first," "second," and so on, in the specification, claims, and accompanying drawings of this disclosure are used to distinguish between different objects, not to describe a specific order. Furthermore, the terms "include," "may include," "comprise," or "may include" used in this disclosure indicate the presence of the corresponding functions, operations, components, etc. disclosed, and do not limit the presence or absence of one or more additional functions, operations, components, etc. Furthermore, the terms "include" or "comprising" indicate the presence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and do not exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusions.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0048] FIG1 is a schematic structural diagram of a vehicle provided in an embodiment of the present disclosure.

[0049] As shown in FIG1 , the vehicle 300 of the present disclosure includes a battery pack 301 , a controller 200 and an electric motor 302 . The controller 200 is electrically connected between the battery pack 301 and the electric motor 302 to control the output of the electric motor 302 by controlling the electric energy from the battery pack 301 to the electric motor 302 .

[0050] The controller 200 disclosed herein includes a control module 201 and an electronic device module 100 . The electronic device module 100 includes a first functional module 10 and a second functional module 20 that are electrically connected. The first functional module 10 is a DC support capacitor, and the second functional module 20 is a power module.

[0051] As shown in Figure 1, when a user inputs a drive signal to the control module 201, the drive signal is transmitted to the battery pack 301, causing the battery pack 301 to output current to the first functional module 10. After being processed by the first functional module 10, the current is output to the second functional module 20. The second functional module 20, acting as a power module, converts the DC power processed by the first functional module 10 into three-phase AC power and transmits it to the motor 302. The motor 302 rotates under the action of the three-phase AC power and transmits signals such as its own speed and torque to the control module 201. The control module 201 processes the current and then feeds it back to the user.

[0052] The first functional module 10 , which serves as a DC support capacitor, protects the electronic device module 100 of the present disclosure by absorbing ripples, thereby preventing the electronic device module 100 of the present disclosure from being broken down due to high voltage.

[0053] For ease of description, the first functional module 10 of the electronic device module 100 disclosed herein is a DC link capacitor, and the second functional module 20 is a power module. It is understood that in another embodiment, the first functional module 10 may be a power module, and the second functional module 20 may be a DC link capacitor. In other embodiments, the first functional module and the second functional module may also be other functional devices. This disclosure does not impose any particular limitations on this.

[0054] Figure 2 is a structural schematic diagram of an electronic device module provided in an embodiment of the present disclosure, Figure 3 is a structural schematic diagram of a first functional module of an electronic device module provided in an embodiment of the present disclosure, and Figure 4 is a structural schematic diagram of a second functional module of an electronic device module provided in an embodiment of the present disclosure.

[0055] As shown in Figures 2-4, the electronic device module 100 of the present disclosure includes a first functional module 10 and a second functional module 20. The first functional module 10 and the second functional module 20 are arranged in an alternating pattern. The surface of the first functional module 10 facing the second functional module 20 is provided with a first terminal 31 and a second terminal 32, both of which extend toward the second functional module 20. The surface of the second functional module 20 facing the first functional module 10 is also provided with a first terminal 31 and a second terminal 32, both of which extend toward the first functional module 10.

[0056] As shown in Figure 3, the first functional module 10 includes a first main body 11, the first terminal 31 set in the first functional module 10 is a first capacitor terminal 31a, and the second terminal 32 set in the first functional module is a second capacitor terminal 32a. The first capacitor terminal 31a and the second capacitor terminal 32a are both electrically connected to the internal structure of the first main body 11.

[0057] The first capacitor terminal 31a and the second capacitor terminal 32a are both sheet-shaped, and along the thickness direction of the first capacitor terminal 31a, the projection of the second capacitor terminal 32a on the first capacitor terminal 31a is at least partially accommodated in the first capacitor terminal 31a.

[0058] As shown in Figure 4, the second functional module 20 includes a second main body 21, the first terminal 31 set in the second functional module 20 is a first power terminal 31b, and the second terminal 32 set in the second functional module 20 is a second power terminal 32b. The first power terminal 31b and the second power terminal 32b are both electrically connected to the internal structure of the second main body 21.

[0059] The first power terminal 31b and the second power terminal 32b are both sheet-shaped, and along the thickness direction of the first power terminal 31b, the projection of the second power terminal 32b on the first power terminal 31b is at least partially accommodated in the first power terminal 31b.

[0060] The first terminal 31 and the second terminal 32 are both sheet-shaped. For ease of description, in FIG. 2 and subsequent figures, the extension direction of the first terminal 31 and the second terminal 32 is set as a first direction 001 , the thickness direction of the first terminal 31 and the second terminal 32 is set as a second direction 002 , and the width direction of the first terminal 31 and the second terminal 32 is set as a third direction 003 .

[0061] FIG5 is a schematic diagram of the main structure of an electronic device module provided in one embodiment of the present disclosure, and FIG6 is an enlarged schematic diagram of the electronic device module provided in one embodiment of the present disclosure.

[0062] As shown in Figures 4 to 6, along the first direction 001, the first capacitor terminal 31a and the first power terminal 31b are located between the first body portion 11 and the second body portion 21, and the sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is greater than the maximum separation distance between the first body portion 11 and the second body portion 21. This allows the end of the first capacitor terminal 31a to overlap the end of the first power terminal 31b, thereby achieving electrical continuity between the first capacitor terminal 31a and the second capacitor terminal 32a.

[0063] As shown in Figures 4 to 6, along the first direction 001, the second capacitor terminal 32a and the second power terminal 32b are also located between the first body portion 11 and the second body portion 21, wherein the sum of the lengths of the second capacitor terminal 32a and the second power terminal 32b is less than the spacing distance between the first body portion 11 and the second body portion 21.

[0064] The electronic device module 100 of the present disclosure further includes a connector 40 bridging the second capacitor terminal 32 a and the second power terminal 32 b , so that the second capacitor terminal 32 a and the second power terminal 32 b can be electrically connected via the connector 40 .

[0065] Among them, the first capacitor terminal 31a can be used as the positive output terminal of the DC support capacitor, and the second capacitor terminal 32a can be used as the negative output terminal of the DC support capacitor. Correspondingly, the first power terminal 31b can be used as the positive input terminal of the power module, and the second power terminal 32b can be used as the negative input terminal of the power module.

[0066] That is, in the electronic device module 100 of the present disclosure, the current flows between the first capacitor terminal 31a and the first power terminal 31b from the first capacitor terminal 31a to the first power terminal 31b, while the current flows between the second capacitor terminal 32a and the second power terminal 32b from the second power terminal 32b to the first power terminal 31b through the connector 40.

[0067] Since the direction of current flow within a conductor is related to the direction of the magnetic field generated by the conductor, and the generation of stray inductance is also related to changes in the magnetic field, it is understandable that the two first terminals 31 are electrically connected to each other, and the two second terminals 32 are electrically connected to each other. This allows the magnetic field generated by the current flowing through the two first terminals 31 to offset the magnetic field generated by the current flowing through the two second terminals 32 and the connector 40, thereby reducing the generation of stray inductance.

[0068] At the same time, because both the first terminal 31 and the second terminal 32 are sheet-shaped, the magnetic field generated by the current in the first terminal 31 and the second terminal 32 also extends along the third direction 003. It is understandable that by at least partially accommodating the projection of the second capacitor terminal 32a on the first capacitor terminal 31a within the first capacitor terminal 31a, and by at least partially accommodating the projection of the second power terminal 32b on the first power terminal 31b within the first power terminal 31b, the overlapping area of ​​the first terminal 31 and the second terminal 32 can be increased, the spacing between the first terminal 31 and the second terminal 32 can be reduced, and thus the equivalent inductance loop formed between the first terminal 31 and the second terminal 32 can be reduced.

[0069] Because longer inductive loops generate higher stray inductance, stray inductance can lead to circuit system losses or signal attenuation. In power modules, stray inductance can increase voltage fluctuations, potentially damaging the module. When electronic device module 100 operates at high frequencies, stray inductance can also increase switching losses in the power module.

[0070] Therefore, the electronic device module 100 disclosed herein can reduce the generation of stray inductance while improving the service life of the electronic device module 100 disclosed herein by connecting the first terminal 31 and the second terminal 32 of the first functional module 10 and the second functional module 20 to each other and making the projection of each second terminal 32 on the first terminal 31 at least partially accommodated in the first terminal 31.

[0071] In another embodiment, the first capacitor terminal 31a can serve as the negative output terminal of the DC support capacitor, and the second capacitor terminal 32a can serve as the positive output terminal of the DC support capacitor. Correspondingly, the first power terminal 31b can serve as the negative input terminal of the power module, and the second power terminal 32b can serve as the positive input terminal of the power module.

[0072] At this point, the current flowing between the first capacitor terminal 31a and the first power terminal 31b is still in the opposite direction to the current flowing between the second capacitor terminal 32a and the second power terminal 32b. The magnetic fields generated by the currents in the two first terminals 31 and the magnetic fields generated by the currents in the two second terminals 32 can still cancel each other out, thus reducing stray inductance.

[0073] It is understandable that in other embodiments, other structures may be used to achieve conduction between the second capacitor terminal 32a and the second power terminal 32b, and this disclosure does not impose any particular limitation on this.

[0074] FIG. 7 is another enlarged schematic diagram of the electronic device module provided in one embodiment of the present disclosure.

[0075] As shown in FIG7 , along the first direction 001, the sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is equal to the maximum spacing between the first body portion 11 and the second body portion 21. Accordingly, the end of the first capacitor terminal 31a can be abutted against the end of the first power terminal 31b to achieve electrical conduction therebetween.

[0076] FIG8 is another enlarged schematic diagram of the electronic device module provided in one embodiment of the present disclosure.

[0077] As shown in FIG. 8 , along the first direction 001 , the sum of the lengths of the first capacitor terminal 31 a and the first power terminal 31 b is smaller than the maximum spacing distance between the first body portion 11 and the second body portion 21 .

[0078] The sum of the lengths of the first capacitor terminal 31a and the first power terminal 31b is L1, the maximum separation distance between the first body portion 11 and the second body portion 21 is D1, and the thickness of the first terminal 31 is H1. Where D1 - L1 ≤ H1 / 2. Accordingly, the end of the first capacitor terminal 31a and the end of the first power terminal 31b are electrically connected using a fused fill method.

[0079] It can be understood that setting D1-L1≤H1 / 2 avoids the situation where the first capacitor terminal 31a and the first power terminal 31b are difficult to conduct due to the large distance between them, thereby ensuring the electrical connection between the two first terminals 31.

[0080] Among them, in the embodiment of the present disclosure and subsequent embodiments, the overlapping conduction representation is to stagger the two structures in space, and place one structure on the surface of the other structure, so that there is an overlapping area between the two structures, and then act on the overlapping area of ​​the two structures through electrical connection means to connect the two structures into one.

[0081] Exemplarily, the overlapping connection between the first capacitor terminal 31a and the first power terminal 31b is achieved by staggering the first capacitor terminal 31a and the first power terminal 31b along the first direction 001, and placing the surface of the first capacitor terminal 31a facing the first power terminal 31b in contact with the surface of the first power terminal 31b facing the first capacitor terminal 31a, thereby creating an overlapping region between the first capacitor terminal 31a and the first power terminal 31b in the first direction 001. The overlapping regions of the first capacitor terminal 31a and the first power terminal 31b are then connected together to achieve overlapping connection between the first capacitor terminal 31a and the first power terminal 31b.

[0082] In the embodiment of the present disclosure and subsequent embodiments, butt-joint conduction indicates that two structures extend toward each other respectively, and the end faces of each structure close to the other structure are in contact with each other, and then the two structures are connected into one by electrical connection means.

[0083] Exemplarily, the first capacitor terminal 31a and the first power terminal 31b are docked and connected, that is, the end face of the first capacitor terminal 31a facing the second main body portion 21 is in contact with the end face of the first power terminal 31b facing the first main body portion 11, and the end faces of the first capacitor terminal 31a and the first power terminal 31b that are in contact with each other are connected as a whole to achieve docking and conduction between the first capacitor terminal 31a and the first power terminal 31b.

[0084] In the embodiment of the present disclosure and subsequent embodiments, the molten filling conduction characterizes that two structures extend toward each other, and each structure is spaced apart from each other near the end face of the other structure, and then the gap between the two end faces is filled with molten material, and the corresponding electrical connection means are used to melt the molten material to achieve the purpose of connecting the two structures into one.

[0085] Exemplarily, the first capacitor terminal 31a and the first power terminal 31b are melt-filled and conductive, that is, the end surface of the first capacitor terminal 31a facing the second body portion 21 and the end surface of the first power terminal 31b facing the first body portion 11 are spaced apart from each other, and a molten material (not shown in the figure) is filled between the first capacitor terminal 31a and the first power terminal 31b along the first direction 001. The molten material is melted at a high temperature to connect the molten material to the first capacitor terminal 31a and the first power terminal 31b respectively, and to ensure that the molten material fills the gap between the first capacitor terminal 31a and the first power terminal 31b, so that the first capacitor terminal 31a and the first power terminal 31b can be conductive under the action of the molten material. Melt-filled conductive connection is achieved between the first capacitor terminal 31a and the first power terminal 31b.

[0086] In one embodiment, the first capacitor terminal 31a and the first power terminal 31b are connected using a contactless energy source scanning connection technology. As shown in Figures 4-6 , the length of the first capacitor terminal 31a is greater than the length of the second capacitor terminal 32a, and the length of the first power terminal 31b is also greater than the length of the second power terminal 32b. That is, a portion of the first capacitor terminal 31a is exposed outside the second capacitor terminal 32a, and a portion of the first power terminal 31b is also exposed outside the second power terminal 32b.

[0087] As shown in Figures 4 to 6, along the first direction 001, the overlapping portion of the first capacitor terminal 31a and the first power terminal 31b is located between the second capacitor terminal 32a and the second power terminal 32b, so that an external energy source can scan the overlapping portion of the first capacitor terminal 31a and the first power terminal 31b, and make the overlapping portions of the first capacitor terminal 31a and the first power terminal 31b melt into one, thereby achieving conduction between the first capacitor terminal 31a and the first power terminal 31b.

[0088] As can be appreciated, the connection between the two first terminals 31 in the electronic device module 100 of the present disclosure utilizes a non-contact energy source scanning connection technology, which can prevent the vibration of the external structure from affecting the connection effect during the connection process. This ensures the stability of the connection between the two first terminals 31 of the electronic device module 100 of the present disclosure.

[0089] In other embodiments, the connection between the two first terminals 31 in the electronic device module 100 of the present disclosure may also be in other ways, which are not particularly limited in the present disclosure.

[0090] FIG9 is a schematic structural diagram of a connector provided in an embodiment of the present disclosure.

[0091] As shown in Figures 2, 6, and 9, connector 40 includes a connecting portion 43 and two docking portions. The two docking portions are a first docking portion 41 and a second docking portion 42. Along a first direction 001, first docking portion 41 and second docking portion 42 are located on opposite sides of connecting portion 43, and the sum of the lengths of first docking portion 41, second docking portion 42, and connecting portion 43 is greater than the maximum separation distance between second capacitor terminal 32a and second power terminal 32b.

[0092] The first docking portion 41 overlaps the surface of the second capacitor terminal 32a and is electrically connected to the second capacitor terminal 32a, while the second docking portion 42 overlaps the surface of the second power terminal 32b and is electrically connected to the second power terminal 32b, thereby achieving electrical connection between the second capacitor terminal 32a and the second power terminal 32b, which are spaced apart from each other.

[0093] In one embodiment, as shown in Figures 4-6 , the opposite ends of the connector 40 are also connected using a contactless energy source scanning connection technique. It will be appreciated that the second capacitor terminal 32a and the second power terminal 32b extend by the length of the corresponding first body portion 11 and second body portion 21, so that an external energy source can scan the connection between the connector 40 and the second capacitor terminal 32a and the second power terminal 32b, thereby achieving electrical conduction between the connector 40 and the second capacitor terminal 32a and the second power terminal 32b.

[0094] As will be appreciated, the connection between the two second terminals 32 in the electronic device module 100 disclosed herein utilizes a non-contact energy source scanning connection technique, which can prevent the influence of external structure vibration on the connection effect during the connection process. This ensures the stability of the connection between each second terminal 32 and the connector 40 in the electronic device module 100 disclosed herein.

[0095] In other embodiments, each second terminal 32 in the electronic device module 100 of the present disclosure may be connected to the connector 40 in other ways, which is not particularly limited in the present disclosure.

[0096] FIG10 is a partially enlarged schematic diagram of an electronic device module provided in an embodiment of the present disclosure, wherein, in order to facilitate description of the connection relationship between the second docking portion 42 and the second power terminal 32 b, some structures are omitted in FIG10 .

[0097] As shown in FIG. 10 , the sum of the lengths of the first docking portion 41 , the second docking portion 42 and the connecting portion 43 is equal to the maximum spacing distance between the second capacitor terminal 32 a and the second power terminal 32 b .

[0098] Among them, the end of the first docking portion 41 is in butt - joint conduction with the end of the second capacitor terminal 32a, and the end of the second docking portion 42 is in butt - joint conduction with the end of the second power terminal 32b. To achieve the conduction of the second capacitor terminal 32a and the second power terminal 32b that are spaced apart from each other.

[0099] FIG. 11 is another partially enlarged schematic view of the electronic device module provided in an embodiment of the present disclosure. Among them, in order to facilitate the description of the connection relationship between the second docking portion 42 and the second power terminal 32b, some structures are omitted in FIG. 11.

[0100] As shown in FIG. 11, the sum of the lengths of the first docking portion 41, the second docking portion 42, and the connecting portion 43 is less than the maximum spacing distance between the second capacitor terminal 32a and the second power terminal 32b.

[0101] The sum of the lengths of the first docking portion 41, the second docking portion 42, and the connecting portion 43 is L2, the maximum spacing distance between the second capacitor terminal 32a and the second power terminal 32b is D2, and the thickness of the second terminal 32 is H2. Among them, D2 - L2 < H2 / 2. Correspondingly, the ends of the second capacitor terminal 32a and the second power terminal 32b are conducted in a molten filling manner.

[0102] It can be understood that setting D2 - L2 ≤ H2 / 2 avoids the situation that it is difficult to conduct between the second capacitor terminal 32a and the second power terminal 32b due to the excessive spacing between the second capacitor terminal 32a and the second power terminal 32b, and ensures the electrical connection between the two second terminals 32.

[0103] In one embodiment, as shown in FIGS. 2, FIG. 6, and FIG. 9, there are multiple first docking portions 41, and along the third direction 003, the respective first docking portions 41 are spaced apart from each other and are sequentially connected to the connecting portion 43.

[0104] Since an external force needs to be applied to the first docking portion 41 when connecting the first docking portion 41 and the second capacitor terminal 32a, and the first docking portion 41 is deformed to reduce the spacing between the first docking portion 41 and the second capacitor terminal 32a in the second direction 002. It can be understood that setting multiple first docking portions 41 can reduce the stress concentration compared to one first docking portion 41, thereby reducing the difficulty of deformation of each first docking portion 41. It is beneficial to achieve the conduction between the first docking portion 41 and the second capacitor terminal 32a. Furthermore, the connection stability of the electronic device module 100 of the present disclosure is improved.

[0105] At the same time, there are multiple second docking portions 42, and along the third direction 003, the respective second docking portions 42 are spaced apart from each other and are sequentially connected to the connecting portion 43.

[0106] When connecting the second docking portion 42 and the second power terminal 32b, an external force must be applied to the second docking portion 42, causing it to deform in order to reduce the distance between the second docking portion 42 and the second power terminal 32b in the second direction 002. As will be appreciated, providing multiple second docking portions 42 can reduce stress concentration compared to a single second docking portion 42, thereby making it easier for each second docking portion 42 to deform. This facilitates electrical conduction between the second docking portion 42 and the second power terminal 32b, thereby improving the connection stability of the electronic device module 100 disclosed herein.

[0107] In one embodiment, the number of the first docking portions 41 is the same as the number of the second docking portions 42 to facilitate the manufacture of the connector 40. It is understood that in other embodiments, the number of the first docking portions 41 and the number of the second docking portions 42 may be different. This disclosure does not specifically limit this.

[0108] In one embodiment, referring back to Figures 3, 4, and 6, the first terminals 31 of the two functional modules include multiple first sub-terminals 311. Specifically, in the first functional module 10, the first capacitor terminal 31a includes multiple first capacitor sub-terminals 311a, each of which is spaced apart along the third direction 003. In the second functional module 20, the first power terminal 31b includes multiple first power sub-terminals 311b, each of which is spaced apart along the third direction 003.

[0109] Because the first power terminal 31b and the first capacitor terminal 31a are overlapped with each other, and while connecting the first capacitor terminal 31a and the first power terminal 31b, it is also necessary to apply external force to the first power terminal 31b and the first capacitor terminal 31a to generate deformation, thereby reducing the distance between the first power terminal 31b and the first capacitor terminal 31a.

[0110] As can be appreciated, providing multiple first power sub-terminals 311b and multiple first capacitor sub-terminals 311a can reduce stress concentration on the first power terminals 31b and first capacitor terminals 31a, thereby reducing the difficulty of deformation of each first power sub-terminal 311b and first capacitor sub-terminal 311a. This facilitates conductive connection between the first power sub-terminal 311b and first capacitor sub-terminal 311a, thereby improving the connection stability of the electronic device module 100 disclosed herein.

[0111] In one embodiment, along the second direction 002, in the overlapping region of the first capacitor terminal 31a and the first power terminal 31b, the gap between the first capacitor terminal 31a and the first power terminal 31b is less than or equal to 0.2 mm. This ensures that when the energy source scans the overlapping region, the melted first capacitor terminal 31a and the first power terminal 31b can completely fill the gap, thereby ensuring a sufficient connection between the first capacitor terminal 31a and the first power terminal 31b and avoiding the occurrence of cracks and cold solder joints. This further ensures the connection stability of the electronic device module 100 disclosed herein.

[0112] In one embodiment, along the second direction 002, in the overlapping region between the first docking portion 41 and the second capacitor terminal 32a, the gap between the first docking portion 41 and the second capacitor terminal 32a is less than or equal to 0.2 mm. In the overlapping region between the second docking portion 42 and the second power terminal 32b, the gap between the second docking portion 42 and the second power terminal 32b is less than or equal to 0.2 mm. This ensures sufficient connection between the first docking portion 41 and the second capacitor terminal 32a, and between the second docking portion 42 and the second power terminal 32b. This ensures the connection stability of the electronic device module 100 disclosed herein.

[0113] In one embodiment, as shown in FIG3 , FIG4 and FIG6 , the number of the first power sub-terminals 311 b is the same as the number of the first capacitor sub-terminals 311 a , and each first capacitor sub-terminal 311 a is connected to and conducted with one first power sub-terminal 311 b .

[0114] It is understood that in other embodiments, since the first capacitor terminal 31a is connected to the first power terminal 31b, the number of first capacitor sub-terminals 311a can be greater than the number of first power sub-terminals 311b, and there may be a situation where multiple first capacitor sub-terminals 311a are connected to one first power sub-terminal 311b. In other embodiments, the number of first capacitor sub-terminals 311a and first power sub-terminals 311b can also be other.

[0115] In one embodiment, for the first functional module 10, along the third direction 003, the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is between 0.8 and 1.2. When the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is less than 0.8, the projection of the second capacitor terminal 32a on the first capacitor terminal 31a does not increase in the area of ​​the first capacitor terminal 31a, so that a portion of the magnetic field generated by the first capacitor terminal 31a cannot be offset by the magnetic field generated by the second capacitor terminal 32a, and the magnetic field generated by the second capacitor terminal 32a cannot relatively offset the magnetic field generated by the first capacitor terminal 31a. This results in stray inductance.

[0116] When the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a is greater than 1.2, the projection of the first capacitor terminal 31a on the second capacitor terminal 32a does not increase in the area of ​​the second capacitor terminal 32a, so that a portion of the magnetic field generated by the second capacitor terminal 32a cannot be effectively offset by the magnetic field generated by the first capacitor terminal 31a, and the magnetic field generated by the first capacitor terminal 31a cannot be relatively offset by the magnetic field generated by the second capacitor terminal 32a, thereby generating stray inductance.

[0117] That is, setting the ratio of the width of the first capacitor terminal 31a to the width of the second capacitor terminal 32a between 0.8 and 1.2 can increase the offset ratio of the magnetic field generated by the current in the first capacitor terminal 31a and the magnetic field generated by the current in the second capacitor terminal 32a, thereby further ensuring the effect of reducing stray inductance of the electronic device module 100 disclosed in the present invention.

[0118] In one embodiment, a ratio of a width of the first capacitor terminal 31 a to a width of the second capacitor terminal 32 a is 1, and the first capacitor terminal 31 a and the second capacitor terminal 32 a are aligned.

[0119] In one embodiment, for the second functional module 20, along the third direction 003, the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is between 0.8 and 1.2. When the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is less than 0.8, the projection of the second power terminal 32b on the first power terminal 31b does not increase in the area of ​​the first power terminal 31b. This causes a portion of the magnetic field generated by the first power terminal 31b to not be offset by the magnetic field generated by the second power terminal 32b, and also causes the magnetic field generated by the second power terminal 32b to not relatively offset the magnetic field generated by the first power terminal 31b. This results in stray inductance.

[0120] When the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b is greater than 1.2, the projection of the first power terminal 31b on the second power terminal 32b does not increase in the area of ​​the second power terminal 32b, so that part of the magnetic field generated by the second power terminal 32b cannot be offset by the magnetic field generated by the first power terminal 31b, and the magnetic field generated by the first power terminal 31b cannot relatively offset the magnetic field generated by the second power terminal 32b, thereby generating stray inductance.

[0121] That is, setting the ratio of the width of the first power terminal 31b to the width of the second power terminal 32b between 0.8-1.2 can increase the offset ratio of the magnetic field generated by the current in the first power terminal 31b and the magnetic field generated by the current in the second power terminal 32b, thereby further ensuring the effect of reducing stray inductance of the electronic device module 100 disclosed in the present invention.

[0122] In one embodiment, a ratio of the width of the first power terminal 31 b to the width of the second power terminal 32 b is 1, such that the first power terminal 31 b and the second power terminal 32 b are aligned with each other.

[0123] In one embodiment, the electronic device module 100 of the present disclosure further includes an insulating member 50 , wherein two insulating members 50 are provided, namely a capacitor insulating member 50 a and a power insulating member 50 b .

[0124] Specifically, FIG12 is an enlarged schematic diagram of a first functional module of an electronic device module provided in an embodiment of the present disclosure.

[0125] As shown in Figures 3 and 12, the capacitor insulating member 50a is fixed between the first capacitor terminal 31a and the second capacitor terminal 32a and is in contact with the first capacitor terminal 31a and the second capacitor terminal 32a. Along the first direction 001, the extending length of the capacitor insulating member 50a is between the first capacitor terminal 31a and the second capacitor terminal 32a.

[0126] It can be understood that the setting of the capacitor insulation 50a can prevent the voltage from breaking through the gap between the first capacitor terminal 31a and the second capacitor terminal 32a, and prevent the short circuit caused by the first capacitor terminal 31a and the second capacitor terminal 32a being too close in the second direction 002, thereby protecting the safety of the electronic device module 100 disclosed in the present invention.

[0127] At the same time, the setting of the capacitor insulating member 50a can also reduce the distance between the first capacitor terminal 31a and the second capacitor terminal 32a while ensuring a safe distance between the first capacitor terminal 31a and the second capacitor terminal 32a in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 disclosed in the present invention, and further reducing the stray inductance of the electronic device module 100 disclosed in the present invention.

[0128] In one embodiment, as shown in Figures 3 and 12, the capacitor insulating member 50a includes a first insulating portion 51a and a first insulating protrusion 52a. The first insulating portion 51a is disposed between the first capacitor terminal 31a and the second capacitor terminal 32a. The first insulating protrusion 52a is disposed at an end of the first insulating portion 51a. The first insulating protrusion 52a is exposed on the surface of the second capacitor terminal 32a and extends in a second direction 002 away from the first capacitor terminal 31a. In the second direction 002, the first insulating protrusion 52a is spaced apart from the connector 40.

[0129] It can be understood that the provision of the first insulating protrusion 52a increases the creepage distance between the end of the second capacitor terminal 32a and the first capacitor terminal 31a, thereby preventing the current at the end of the second capacitor terminal 32a from directly extending along the surface of the capacitor insulating member 50a and connecting with the current of the first capacitor terminal 31a. Thus, while reducing the spacing between the first capacitor terminal 31a and the second capacitor terminal 32a in the second direction 002, the creepage distance between the first capacitor terminal 31a and the second capacitor terminal 32a is increased, further ensuring the safe use of the electronic device module 100 disclosed herein and further reducing the generation of stray inductance.

[0130] In one embodiment, as shown in Figures 3 and 12, a first groove 521a is provided on the surface of the first insulating protrusion 52a away from the first capacitor terminal 31a, and a first groove 521a is also provided on the surface of the first insulating protrusion 52a away from the second capacitor terminal 32a. It can be understood that the provision of the first groove 521a further increases the creepage distance between the first capacitor terminal 31a and the second capacitor terminal 32a, further ensuring the safety of the electronic device module 100 of the present disclosure and further reducing the generation of stray inductance.

[0131] In one embodiment, the number of the first grooves 521a can be multiple. In another embodiment, the first grooves 521a can also be provided only on the surface of the first insulating protrusion 52a away from the first capacitor terminal 31a or the surface of the first insulating protrusion 52a away from the second capacitor terminal 32a. This disclosure does not impose any particular limitation on this.

[0132] FIG13 is an enlarged schematic diagram of a second functional module of an electronic device module provided in an embodiment of the present disclosure.

[0133] As shown in Figures 4 and 13, the power insulating member 50b is fixed between the first power terminal 31b and the second power terminal 32b and is in contact with the first power terminal 31b and the second power terminal 32b. Along the first direction 001, the power insulating member 50b extends between the first power terminal 31b and the second power terminal 32b.

[0134] It can be understood that the setting of the power insulation part 50b can prevent the voltage from breaking through the gap between the first power terminal 31b and the second power terminal 32b, and prevent the short circuit caused by the first power terminal 31b and the second power terminal 32b being too close in the second direction 002, thereby protecting the safety of the electronic device module 100 disclosed in the present invention.

[0135] At the same time, the setting of the power insulation part 50b can also reduce the distance between the first power terminal 31b and the second power terminal 32b while ensuring the safe distance between the first power terminal 31b and the second power terminal 32b in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 disclosed in the present invention, and further reducing the stray inductance of the electronic device module 100 disclosed in the present invention.

[0136] In one embodiment, as shown in Figures 4 and 13 , the power insulating member 50b includes a second insulating portion 51b and a second insulating protrusion 52b. The second insulating portion 51b is disposed between the first power terminal 31b and the second power terminal 32b. The second insulating protrusion 52b is disposed at the end of the second insulating portion 51b. The second insulating protrusion 52b is exposed on the surface of the second power terminal 32b and extends away from the first power terminal 31b along a second direction 002. In the second direction 002, the second insulating protrusion 52b is spaced apart from the connector 40.

[0137] As can be understood, the provision of the second insulating protrusion 52b increases the creepage distance between the end of the second power terminal 32b and the first power terminal 31b, thereby preventing the current at the end of the second power terminal 32b from directly extending along the surface of the power insulating member 50b and connecting with the current of the first power terminal 31b. This reduces the spacing between the first power terminal 31b and the second power terminal 32b in the second direction 002 while increasing the creepage distance between the first power terminal 31b and the second power terminal 32b, further ensuring the safe use of the electronic device module 100 of the present disclosure and further reducing the generation of stray inductance.

[0138] In one embodiment, as shown in Figures 4 and 13 , a second groove 521b is provided on the surface of the second insulating protrusion 52b away from the first power terminal 31b, and a second groove 521b is also provided on the surface of the second insulating protrusion 52b away from the second power terminal 32b. It will be appreciated that the provision of the second groove 521b further increases the creepage distance between the first power terminal 31b and the second power terminal 32b, further ensuring the safe use of the electronic device module 100 of the present disclosure and further reducing the generation of stray inductance.

[0139] In one embodiment, the number of the second grooves 521b can be multiple. In another embodiment, the second groove 521b can also be provided only on the surface of the second insulating protrusion 52b away from the first power terminal 31b or the surface of the second insulating protrusion 52b away from the second power terminal 32b. This disclosure does not impose any particular limitation on this.

[0140] In one embodiment, as shown in Figures 2 and 6, the electronic device module 100 of the present disclosure further includes a second insulating member 61, which is fixed to the surface of the connecting portion 43 facing the first terminal 31. Since the current in the first terminal 31 and the second terminal 32 flows in different directions, the connecting member 40 is conductive with the second terminal 32. It can be understood that the provision of the second insulating member 61 can prevent the voltage from breaking through the gap between the connecting portion 43 and the first terminal 31, thereby preventing a short circuit caused by the connecting portion 43 and the first terminal 31 being too close in the second direction 002. This protects the safety of the electronic device module 100 of the present disclosure.

[0141] At the same time, the provision of the second insulating member 61 can also reduce the spacing between the connecting portion 43 and the first terminal 31 while ensuring a safe distance between the connecting portion 43 and the first terminal 31 in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 disclosed in the present invention, so that the magnetic fields generated by the connecting portion 43 and the first terminal 31 can offset each other in a larger proportion, thereby reducing the stray inductance of the electronic device module 100 disclosed in the present invention.

[0142] In one embodiment, as shown in Figures 2 and 6 , the length of the second insulating member 61 along the first direction 001 is greater than or equal to the distance between the capacitor insulating member 50a and the power insulating member 50b. This allows the second insulating member 61 to cooperate with the capacitor insulating member 50a and the power insulating member 50b, further preventing voltage breakdown in the gap between the connecting portion 43 and the first terminal 31. This further ensures the safety of the electronic device module 100 disclosed herein.

[0143] At the same time, the distance between the connecting portion 43 and the first terminal 31 can be further reduced, so as to further reduce the inductance loop of the electronic device module 100 of the present disclosure, thereby further reducing the stray inductance of the electronic device module 100 of the present disclosure.

[0144] In one embodiment, as shown in Figures 2 and 6 , along the third direction 003 , the width of the second insulating member 61 is greater than or equal to the width of the connector 40 . That is, along the third direction 003 , the opposite ends of the second insulating member 61 extend beyond the end surface of the connector 40 , further preventing voltage from penetrating the gap between the connecting portion 43 and the first terminal 31 . This further ensures the safety of the electronic device module 100 of the present disclosure.

[0145] FIG14 is another partially enlarged schematic diagram of the electronic device module provided in one embodiment of the present disclosure.

[0146] As shown in FIG14 , the electronic device module 100 of the present disclosure further includes an insulating layer 62, which is applied to the surface of the connecting portion 43 facing the first terminal 31. As will be appreciated, the provision of the insulating layer 62 prevents voltage from breaking through the gap between the connecting portion 43 and the first terminal 31, thereby preventing a short circuit caused by the connecting portion 43 and the first terminal 31 being too close in the second direction 002. This ensures the safety of the electronic device module 100 of the present disclosure.

[0147] At the same time, the provision of the insulating layer 62 can also reduce the distance between the connecting portion 43 and the first terminal 31 while ensuring a safe distance between the connecting portion 43 and the first terminal 31 in the second direction 002, thereby reducing the inductance loop of the electronic device module 100 of the present disclosure, so that the magnetic fields generated by the connecting portion 43 and the first terminal 31 can offset each other to a greater extent, thereby reducing the stray inductance of the electronic device module 100 of the present disclosure.

[0148] In one embodiment, as shown in Figures 6 and 13, the electronic device module 100 of the present disclosure further includes a support member 70, which is disposed on a side of the first power terminal 31b away from the second power terminal 32b to support the first power terminal 31b and the first capacitor terminal 31a connected to the first power terminal 31b.

[0149] In one embodiment, as shown in FIG. 4 , FIG. 6 and FIG. 10 , along the third direction 003 , portions of the structures on opposite sides of the support member 70 extend along opposite sides of the first power terminal 31 b and are integrally connected to the power insulating member 50 b .

[0150] It is understandable that in other embodiments, when the first power terminal 31b is overlapped on the first capacitor terminal 31a, the support member 70 is arranged on the side of the first capacitor terminal 31a away from the second capacitor terminal 32a to support the first capacitor terminal 31a and the first power terminal 31b.

[0151] In one embodiment, referring back to Figures 2, 7, and 10, the electronic device module 100 of the present disclosure further includes positioning posts 80. Positioning holes 431 are defined on the connection portion 43, and the number of positioning holes 431 is equal to the number of positioning posts 80. The positioning posts 80 are disposed on the second groove 521b. When the connector 40 is connected to the second capacitor terminal 32a and the second power terminal 32b, the positioning posts 80 can extend into the positioning holes 431 to achieve positioning of the connector 40.

[0152] FIG15 is another enlarged schematic diagram of the second functional module of the electronic device module provided in one embodiment of the present disclosure.

[0153] As shown in Figures 4 and 15 , the first power terminal 31b includes a plurality of first power sub-terminals 311b, and the second power terminal 32b includes a plurality of second power sub-terminals 321b. Along the third direction 003, the plurality of first power sub-terminals 311b and the plurality of second power sub-terminals 321b are spaced apart from each other, and the number of first power sub-terminals 311b is equal to the number of second power sub-terminals 321b.

[0154] As shown in Figures 4 and 15 , multiple positioning posts 80 are provided, each spaced apart between two adjacent first power sub-terminals 311b. Each positioning post 80 is also positioned between two adjacent second power sub-terminals 321b. This prevents the positioning posts 80 from damaging the creepage distance between the first power sub-terminals 311b and the second power sub-terminals 321b, further ensuring the safety of the electronic device module 100 disclosed herein.

[0155] At the same time, the mutual matching of the plurality of positioning posts 80 and the positioning holes 431 on the connecting portion 43 can further achieve the positioning of the connector 40, thereby preventing the position deviation of the connector 40 during the connection process from affecting the connection reliability between the connector 40 and the second terminal 32. This improves the connection reliability of the electronic device module 100 of the present disclosure.

[0156] In another embodiment, the positioning post 80 may be disposed on the first groove 521a of the first insulating protrusion 52a. Accordingly, the second capacitor terminal 32a also includes a plurality of second capacitor sub-terminals (not shown) to prevent the positioning post 80 from damaging the creepage distance between the first capacitor terminal 31a and the second capacitor terminal 32a.

[0157] In one embodiment, as shown in FIG2-4 , along the third direction 003 , the widths of the first capacitor sub-terminal 311 a and the first power sub-terminal 311 b located on opposite sides of the first body portion 11 are greater than the widths of the remaining first capacitor sub-terminals 311 a and the first power sub-terminal 311 b.

[0158] During the operation of the controller disclosed in the present invention, there is a cooling pipeline passing between the first body part 11 and the second body part 21 along the third direction 003. Along the flow direction of the coolant in the cooling pipeline, the temperature of the coolant gradually increases and the heat absorption capacity gradually decreases. It can be understood that widening the width of the first capacitor sub-terminal 311a and the first power sub-terminal 311b on the opposite sides of the first body part 11 can reduce the overall resistance of the first capacitor sub-terminal 311a and the first power sub-terminal 311b of this part, thereby reducing the heat generated by the first capacitor sub-terminal 311a and the first power sub-terminal 311b. In conjunction with the flow direction of the cooling pipeline, the temperature equalization effect of the electronic device module 100 disclosed in the present invention is improved.

[0159] In one embodiment, as shown in Figures 2-4 , the width of the first capacitor terminal 31a overlapping the first power terminal 31b is greater than or equal to the width of the overlapped first power terminal 31b. This ensures the overlap width between the first power terminal 31b and the first capacitor terminal 31a, thereby ensuring the overcurrent capability of the electronic device module 100 of the present disclosure.

[0160] In one embodiment, the color of the material of the first insulating protrusion 52a, the second insulating protrusion 52b and the positioning post 80 is white or other light colors close to white. Based on the electronic device module 100 disclosed in the present invention, when the connection technology of non-contact energy source scanning is adopted, the energy source can be absorbed by the dark material. It can be understood that the color of the material of the first insulating protrusion 52a, the second insulating protrusion 52b and the positioning post 80 is white or other light colors close to white, which can reduce the heat absorbed by the energy source during scanning and avoid damage due to excessive heat of the self. The structural stability and electrical insulation safety of the first insulating protrusion 52a, the second insulating protrusion 52b and the positioning post 80 are guaranteed.

[0161] In one embodiment, as shown in FIG3 , the first functional module 10 further includes a first input terminal 12 and a second input terminal 13 . The first input terminal 12 and the second input terminal 13 are located on a side of the first body 11 away from the first terminal 31 and the second terminal 32 . The first input terminal 12 is connected to the negative electrode of the external battery pack, and the second input terminal 13 is connected to the positive electrode of the external battery pack. The first input terminal 12 and the second input terminal 13 provide power to the first functional module 10 .

[0162] In one embodiment, as shown in FIG3 , the first functional module 10 further includes a first boost terminal 14 and a second boost terminal 15. The first boost terminal 14 is located on the same side as the first input terminal 12 and the second input terminal 13, and the second boost terminal 15 is located on a side wall of the first body portion 11 and is connected to the internal structure of the first body portion 11 via the surface of the first body portion 11 where the first terminal 31 is provided.

[0163] The first boost terminal 14 and the second boost terminal 15 are connected to a boost capacitor (not shown) housed in the first body 11 and to an external boost circuit to increase the voltage input from the external power source to the battery pack.

[0164] In one embodiment, as shown in FIG3 , the first functional module 10 further includes a ground terminal 16. The ground terminal 16 is located on a side wall of the first body 11 and is disposed opposite the second boost terminal 15. The ground terminal 16 is also connected to the internal structure of the first body 11 via the surface of the first body 11 where the first terminal 31 is disposed. The ground terminal 16 is used to connect to the ground structure to protect the safety of the first functional module 10 and enhance the anti-interference capability of the first functional module 10.

[0165] In one embodiment, as shown in FIG4 , the second functional module 20 further includes three three-phase output terminals 22 . Three three-phase output terminals 22 are provided and spaced apart on a surface of the second body portion 21 away from the first terminal 31 to output three-phase current.

[0166] It should be understood that the terms "first," "second," etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0167] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0168] It should be understood that the application of the present disclosure is not limited to the above examples. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the scope of protection of the appended claims of the present disclosure. Those skilled in the art will understand that implementing all or part of the processes of the above embodiments and making equivalent changes in accordance with the claims of the present disclosure still fall within the scope of the present disclosure.

Claims

1. An electronic device module (100), characterized in that: It includes two functional modules. Each of the functional modules is provided with a first terminal (31) and a second terminal (32). The first terminal (31) and the second terminal (32) both extend towards the other functional module. The ends of the two first terminals (31) of the two functional modules are electrically connected, and the ends of the two second terminals (32) of the two functional modules are electrically connected. Along the thickness direction of the first terminal (31), the projection of the second terminal (32) on the first terminal (31) is at least partially received within the first terminal (31).

2. The electronic device module (100) according to claim 1, characterized in that: The sum of the lengths of the two first terminals (31) of the two functional modules is greater than or equal to the maximum spacing distance between the two functional modules, and the ends of the two first terminals (31) of the two functional modules overlap and are electrically connected.

3. The electronic device module (100) according to claim 1, characterized in that: The sum of the lengths of the two first terminals (31) of the two functional modules is L1, the maximum spacing distance between the two functional modules is D1, and the thickness of the first terminal (31) of each functional module is H1. Wherein, L1 < D1, and D1 - L1 ≤ H1 / 2. The ends of the two first terminals (31) of the two functional modules are electrically connected by melting and filling.

4. The electronic device module (100) according to claim 1, characterized in that: The electronic device module (100) further includes a connecting member (40). The ends of the two second terminals (32) of the two functional modules are electrically connected through the connecting member (40). The connecting member (40) includes a connecting portion (43) and two docking portions (41, 42). The connecting portion (43) is located between the two docking portions (41, 42), and each docking portion (41, 42) is electrically connected to one second terminal (32) respectively.

5. The electronic device module (100) according to claim 4, characterized in that: The sum of the lengths of the connecting portion (43) and the two docking portions (41, 42) is greater than or equal to the maximum spacing distance between the two second terminals (32) of the two functional modules, and each docking portion (41, 42) overlaps and is electrically connected to one second terminal (32) of one functional module respectively.

6. The electronic device module (100) according to claim 4, characterized in that: The sum of the lengths of the connecting portion (43) and the two docking portions (41, 42) is L2, the maximum spacing distance between the two second terminals (32) of the two functional modules is D2, and the thickness of the second terminal (32) of each functional module is H2. Wherein, L2 < D2, and D2 - L2 < H2 / 2. Each docking portion (41, 42) is electrically connected to one second terminal (32) of one functional module by melting and filling.

7. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The first terminal (31) of at least one of the functional modules includes a plurality of first sub-terminals (311), and along the width direction of the first terminal (31), the first sub-terminals (311) are spaced apart; and / or, The second terminal (32) of at least one functional module includes a plurality of second sub-terminals (321), and along the width direction of the second terminal (32), the second sub-terminals (321) are spaced apart.

8. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The first terminal (31) of at least one of the functional modules comprises a plurality of first sub-terminals (311), and along the width direction of the first terminal (31), the width of the first sub-terminal (311) located at the edge of the plurality of first sub-terminals (311) is greater than the width of the remaining first sub-terminals (311).

9. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The first terminal (31) of the same functional module includes a plurality of first sub-terminals (311), and the second terminal (32) includes a plurality of second sub-terminals (321), the number of the first sub-terminals (311) is equal to the number of the second sub-terminals (321), and along the thickness direction of the first terminal (31), the projection of each second sub-terminal (321) on the first sub-terminal (311) is at least partially accommodated in one of the first sub-terminals (311).

10. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The ratio of the width of the first terminal (31) to the width of the second terminal (32) is between 0.8 and 1.

2.

11. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The electronic device module (100) further comprises two insulating members (50), each of the insulating members (50) being fixed between the first terminal (31) and the second terminal (32) of one of the functional modules and extending respectively towards the other functional module, and the extension length of each of the insulating members (50) being between the extension length of the first terminal (31) and the extension length of the second terminal (32).

12. The electronic device module (100) according to claim 11, characterized in that: The electronic device module (100) further comprises a second insulating member (61), the second insulating member (61) being arranged on a surface of the connecting member (40) facing the first terminal (31), and along a thickness direction of the first terminal (31), a projection of the second insulating member (61) on the first terminal (31) covers the first terminal (31) exposed between the two second terminals (32) of the two functional modules; Along the length direction of the first terminal (31), the length of the second insulating member (61) is greater than or equal to the distance between the two insulating members (50) of the two functional modules; Along the width direction of the first terminal (31), the width of the second insulating member (61) is greater than or equal to the width of the connecting member (40).

13. The electronic device module (100) according to claim 11, characterized in that: The electronic device module (100) further comprises an insulating layer (62), the insulating layer (62) being coated on a surface of the connector (40) facing the first terminal (31), and a projection of the first terminal (31) exposed between the two second terminals (32) of the two functional modules on the insulating layer (62) being accommodated in the insulating layer (62) along the thickness direction of the first terminal (31); Along the length direction of the first terminal (31), the length of the insulating layer (62) is greater than or equal to the distance between the two insulating members (50) of the two functional modules.

14. The electronic device module (100) according to claim 11, characterized in that: At least one of the insulating members (50) is provided with an insulating protrusion (52a, 52b), the insulating protrusion (52a, 52b) is exposed between the second terminals (32) of the two functional modules and extends in a direction away from the first terminal (31), and the insulating protrusion (52a, 52b) and the connecting member (40) are spaced apart from each other.

15. The electronic device module (100) according to claim 14, characterized in that: The surface of the insulating protrusion (52a, 52b) away from the first terminal (31) is provided with at least one groove; and / or, At least one groove is provided on the surface of the insulating protrusion (52a, 52b) away from the second terminal (32).

16. The electronic device module (100) according to claim 14, characterized in that: A positioning column (80) is protruding from a surface of the insulating protrusion (52a, 52b) away from the first terminal (31); along the width direction of the first terminal (31), the positioning column (80) is spaced from the first terminal (31) and the second terminal (32); The connecting member (40) is provided with a positioning hole (431), and the positioning column (80) can extend into the positioning hole (431) to achieve positioning of the connecting member (40).

17. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The ends of the first terminals (31) of the two functional modules are connected using a non-contact energy source scanning connection technology; Along the thickness direction of the first terminal (31), the distance between the ends of the first terminals (31) of the two functional modules is less than or equal to 0.2 mm.

18. The electronic device module (100) according to any one of claims 4 to 6, characterized in that: The end of the second terminal (32) of at least one of the functional modules is connected to the connector (40) by using a non-contact energy source scanning connection technology; Along the thickness direction of the second terminal (32), the distance between the end of the second terminal (32) and the connecting piece (40) connected by a connection technology using a non-contact energy source scanning is less than or equal to 0.2 mm.

19. A controller (200), characterized in that: It comprises the electronic device module (100) according to any one of claims 1 to 18, wherein two functional modules of the electronic device module (100) are respectively a DC support capacitor and a power module.

20. A vehicle (300), characterized in that: Comprising a controller (200) as claimed in claim 19.

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