Laser and laser device

Abstract

A laser (10) and a laser device. The laser (10) comprises: a mounting substrate (130), comprising a connection pattern, multiple connection pads (132), and multiple in-board connection lines (1301), wherein the multiple connection pads (132) are electrically connected to the connection pattern by means of the multiple in-board connection lines (1301); an light-emitting unit comprises tube housings (110, 120) and light-emitting chips (113) arranged in the tube housings (110, 120); a conductive structure (114) is arranged on the tube housings (110, 120) at the side facing the mounting substrate (130); the connection pattern comprises conductive patterns (1311, 1312); the light-emitting unit is fixed on the conductive patterns (1311, 1312) and is electrically connected to the conductive patterns (1311, 1312); side wall connecting lines (117) are provided in a side wall (140) of the tube housings (110, 120), and the light-emitting chips (113) are electrically connected to the side wall connecting lines (117); the light-emitting chips (113) in the light-emitting unit include at least two types of chips (113) that emit light having different colors; the connection pads (132) include a group of two connection pads (132) respectively corresponding to the light-emitting chips (113) of each color, and each group of connection pads (132) is electrically connected to the light-emitting chip (113) of the corresponding color.

Description

Lasers and laser equipment

[0001] This application claims priority to the Chinese patent application filed on December 8, 2023, with application number 202311683844.6, with invention name “Light-emitting device and laser equipment”, and filed on August 14, 2024, with application number 202411117893.8, with invention name “Laser component and projection device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optoelectronic technology, and in particular to a laser and laser equipment. Background Art

[0003] The laser projection industry is currently experiencing rapid growth, with lasers, as one of its core components, playing an irreplaceable role. Semiconductor lasers are manufactured by encapsulating the chip after chip production. Therefore, laser packaging capabilities significantly impact the laser's application, cost, performance, and other indicators. Driven by the development of lasers and the demand for color display, laser packaging strives to produce high-quality beams. This is intended to minimize the use of optical path components when applied to the optical path, leading to a more compact and simplified laser display device. Summary of the Invention

[0004] The embodiments of the present application provide a laser and a laser device, and their technical solutions are described as follows.

[0005] In one aspect, a laser is provided, comprising:

[0006] A mounting substrate includes a connection pattern, a plurality of connection pads, and a plurality of intra-board connection lines, wherein at least four of the connection pads are electrically connected to the connection pattern via the plurality of intra-board connection lines;

[0007] a light-emitting unit comprising at least one tube shell and a plurality of light-emitting chips disposed within the at least one tube shell, the at least one tube shell being provided with a conductive structure on a side facing the mounting substrate, the connection pattern comprising a conductive pattern corresponding to the light-emitting unit, the light-emitting unit being fixed to and electrically connected to the corresponding conductive pattern, at least one sidewall connecting wire being provided within a sidewall of the at least one tube shell, and at least one light-emitting chip being electrically connected to one of the sidewall connecting wires within the sidewall of the tube shell;

[0008] Among them, the light-emitting chip in the light-emitting unit includes at least two chips with different luminous colors, and the multiple connecting pads include a group of connecting pads corresponding to the light-emitting chip of each color in the light-emitting unit, each group of connecting pads includes two connecting pads, and each group of connecting pads is electrically connected to the light-emitting chip of the corresponding color.

[0009] On the other hand, a laser device is provided, which includes any one of the above-mentioned lasers, a light valve assembly and a lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] FIG1 is a diagram showing the working principle of a laser in the related art;

[0012] FIG2 is a circuit diagram of a common anode routing method of a laser in the related art;

[0013] FIG3 is a circuit diagram of a common cathode wiring method of a laser in the related art;

[0014] FIG4 is a schematic diagram of the appearance structure of a laser provided in an embodiment of the present application;

[0015] FIG5 is a schematic diagram of an explosion structure of a laser provided in an embodiment of the present application;

[0016] FIG6 is a schematic side cross-sectional view of a laser provided in an embodiment of the present application;

[0017] FIG7 is a schematic diagram of the surface structure of a tube shell facing the mounting substrate in a laser provided by an embodiment of the present application;

[0018] FIG8 is a schematic top view of a mounting substrate in a laser provided in an embodiment of the present application;

[0019] FIG9 is a schematic side cross-sectional structural diagram of a tube shell in a laser provided in an embodiment of the present application;

[0020] FIG10 is a circuit diagram of a laser provided in an embodiment of the present application;

[0021] FIG11 is a schematic diagram of a top plan structure of a laser provided in an embodiment of the present application;

[0022] FIG12 is a schematic diagram of a top view of another laser provided in an embodiment of the present application;

[0023] FIG13 is a schematic diagram of a top view of another laser provided in an embodiment of the present application;

[0024] FIG14 is a schematic diagram of a top view of another laser provided in an embodiment of the present application;

[0025] FIG15 is a schematic diagram showing the connection relationship between a tube and a housing of another laser provided in an embodiment of the present application;

[0026] FIG16 is a schematic diagram of the internal electrical connections of another laser tube shell provided in an embodiment of the present application;

[0027] FIG17 is a schematic diagram of the internal structure of a laser tube shell provided in another embodiment of the present application;

[0028] FIG18 is a schematic side cross-sectional structural diagram of a tube shell of another laser provided in an embodiment of the present application;

[0029] FIG19 is a schematic diagram of the internal electrical connections of another laser tube shell provided in an embodiment of the present application;

[0030] FIG20 is a schematic diagram of the internal structure of a laser tube shell provided in an embodiment of the present application;

[0031] FIG21 is a schematic side cross-sectional structural diagram of a tube shell of another laser provided in an embodiment of the present application;

[0032] FIG22 is a schematic structural diagram of a laser tube shell provided in an embodiment of the present application;

[0033] FIG23 is a schematic diagram of a top view of another laser provided in an embodiment of the present application;

[0034] FIG24 is a schematic diagram of a top plan structure of another laser provided in an embodiment of the present application;

[0035] FIG25 is a schematic diagram of the surface structure of a tube shell facing the mounting substrate in another laser provided by an embodiment of the present application;

[0036] FIG26 is a schematic structural diagram of a laser tube shell according to another embodiment of the present application;

[0037] FIG27 is a schematic diagram of a top view of another laser provided in an embodiment of the present application;

[0038] FIG28 is a schematic top plan view of a tube shell of another laser provided in an embodiment of the present application;

[0039] FIG29 is a schematic diagram of a top plan structure of another laser provided in an embodiment of the present application;

[0040] FIG30 is a schematic diagram of the surface structure of a tube shell facing the mounting substrate in another laser provided by an embodiment of the present application;

[0041] FIG31 is a schematic diagram of a top plan structure of another laser provided in an embodiment of the present application;

[0042] FIG32 is a schematic diagram of a top plan structure of another laser provided in an embodiment of the present application;

[0043] FIG33 is a schematic diagram of the internal structure of a light-emitting unit in a laser provided in an embodiment of the present application;

[0044] FIG34 is a schematic diagram of the cross-sectional structure of a tube shell in a laser provided in an embodiment of the present application;

[0045] FIG35 is a schematic diagram of an exploded structure of a tube shell in a laser provided in an embodiment of the present application;

[0046] FIG36 is a schematic diagram of the internal structure of a laser tube shell provided in an embodiment of the present application;

[0047] FIG37 is a schematic diagram of the internal structure of a tube shell in another laser provided in an embodiment of the present application;

[0048] FIG38 is a schematic diagram of the internal structure of a tube shell in another laser provided in an embodiment of the present application;

[0049] FIG39 is a schematic structural diagram of a laser device provided in an embodiment of the present application;

[0050] Figure 40 is a schematic structural diagram of a laser provided in an embodiment of the present application. DETAILED DESCRIPTION

[0051] In order to make the purpose and implementation of this application clearer, the exemplary implementation of this application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only part of the embodiments of this application, not all of the embodiments.

[0052] It should be noted that the brief descriptions of terms in this application are only for the purpose of facilitating the understanding of the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their ordinary and usual meanings.

[0053] The terms "comprise," "include," and "have," and any variations thereof, are intended to cover but not exclude inclusion; for example, a product or device comprising a list of components is not necessarily limited to all the components expressly listed but may include other components not expressly listed or inherent to such product or device.

[0054] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0055] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0057] Figure 1 is a diagram of the operating principle of a laser in the related art, Figure 2 is a circuit diagram of a common anode wiring method for a laser in the related art, and Figure 3 is a circuit diagram of a common cathode wiring method for a laser in the related art. As shown in Figure 1, in the related art, a driver circuit board is used to transmit a drive signal to the three-color laser, and a power supply board is used to supply power to the laser (for example, providing an operating voltage VDD). When the laser is powered on, it emits light based on the received drive signal. As shown in Figures 2 and 3, three-color light-emitting chips (represented by diode symbols) form a three-color laser, and resistors R_T, G_T, and B_T represent the drive circuit of the three-color laser. When multiple three-color lasers are required to operate simultaneously to increase brightness, as the number of lasers increases, the number of drive circuits also increases (for example, as shown by resistors R_T0, G_T0, B_T0, ..., R_Tn, G_Tn, B_Tn in Figures 2 and 3). The increase in drive circuits leads to increased costs.

[0058] To solve the above technical problems, embodiments of the present application provide a laser and a laser device, the laser comprising: a mounting substrate comprising a connection pattern, a plurality of connection pads, and a plurality of intra-board connection lines, at least four of the connection pads being electrically connected to the connection pattern via the plurality of intra-board connection lines; a light-emitting unit, the light-emitting unit comprising at least one housing and a plurality of light-emitting chips disposed within the at least one housing, the at least one housing being provided with a conductive structure on a side facing the mounting substrate, the connection pattern comprising a conductive pattern corresponding to the light-emitting unit, the light-emitting unit being fixed to and electrically connected to the corresponding conductive pattern, at least one sidewall connection line being provided within a sidewall of the at least one housing, at least one light-emitting chip being electrically connected to one of the sidewall connection lines within the sidewall of the housing; wherein the light-emitting chips in the light-emitting unit include at least two chips emitting light of different colors, the plurality of connection pads including a group of connection pads corresponding to each color of the light-emitting chip in the light-emitting unit, each group of connection pads including two connection pads, and each group of connection pads being electrically connected to a light-emitting chip of a corresponding color. With this arrangement, the light-emitting unit is fixed on the conductive pattern of the connection pattern of the mounting substrate, and the light-emitting chip of each color is electrically connected to the corresponding two connection pads through the side wall connection wires, the conductive structure, the conductive pattern and the internal board connection wires, thereby realizing separate power supply for light-emitting chips of different colors, solving the problem that the number of light-emitting chips used is limited by the driving circuit. The number of driving circuits will not increase while the number of light-emitting chips is increased, effectively improving the working efficiency of the driving circuit and reducing costs.

[0059] It should be noted that the light-emitting unit described in the embodiment of the present application refers to the smallest repeating unit in the laser that contains a light-emitting chip of each color. In different implementations, the laser may include only one light-emitting unit or multiple light-emitting units. In one example, multiple light-emitting units are arranged in a row / column / multiple rows and columns on the same substrate, and each light-emitting unit has the same structure. In different implementations, in each light-emitting unit, multiple light-emitting chips of different colors can be arranged in the same tube shell, or they can be arranged separately in tube shells of each color, or they can be distributed in multiple different tube shells in any other way.

[0060] Figure 4 is a schematic diagram of the appearance structure of a laser provided in an embodiment of the present application, and Figure 5 is a schematic diagram of the exploded structure of a laser provided in an embodiment of the present application. The lasers shown in Figures 4 and 5 are lasers that only include a double-tube light-emitting unit. As shown in Figure 4, the laser 10 includes a mounting substrate 130 and a light-emitting unit (including a first tube shell 110 and a second tube shell 120). The mounting substrate 130 includes a plurality of connection pads 1303 (eight are shown as an example in Figure 4). As shown in Figure 5, the first tube shell 110 and the second tube shell 120 are each provided with a plurality of light-emitting chips 113 (five light-emitting chips 113 arranged in a row are shown as an example in Figure 5). The top of each tube shell 110 / 120 is provided with a light-transmitting component 160 and a lens assembly 170. The lens assembly 170 is used to angularly compress the divergent light beam emitted by the light-emitting chip 113 to achieve collimation.

[0061] FIG6 is a schematic side view of a cross-sectional structure of a laser provided in an embodiment of the present application. Referring to FIG6 , the XY plane is a plane parallel to the plane of the mounting substrate, the Z axis is a direction perpendicular to the plane of the mounting substrate, the X axis is the direction in which the light-emitting chips 113 are arranged within each housing (i.e., the row direction of the light-emitting chips 113 arranged in a row), and the Y axis is the direction in which the two housings are arranged. As shown in FIG6 , the mounting substrate 130 includes a connection pattern (including a conductive pattern corresponding to each light-emitting unit, each conductive pattern including multiple transfer pads and a conductive base corresponding to each housing; FIG6 shows a conductive pattern including two conductive bases 1312 and multiple transfer pads 1311). The sidewall 140 of each housing in the first housing 110 and the second housing 120, together with the housing base 116 at the bottom and the light-transmitting component 160 at the top, form an enclosed space for accommodating the multiple light-emitting chips 113 and the multiple reflective components 150 therein. 5 and 6 , a reflective component 150 is provided on the light-emitting side of each light-emitting chip 113 within each housing. The reflective component 150 is used to reflect the laser beam from the light-emitting chip 113 and direct it toward the top translucent component 160 and lens assembly 170, thereby enabling the laser beam of the laser 10 to be emitted. In some examples, connecting wires may be provided in the housing base plate 116 and / or the sidewalls 140. In some examples, the housing base plate 116 and / or the sidewalls 140 are formed of metal (e.g., a copper substrate) or ceramic material. In one example, the light-emitting directions of the multiple light-emitting chips 113 are parallel to the upper surface of the housing base plate 116. Therefore, the laser beam emitted by the light-emitting chip 113 is also reflected by the reflective component 150 to change the light-emitting direction, causing the laser beam to be emitted upward in a direction away from the housing base plate 116. The reflected laser light is then sequentially emitted through the translucent component 160 (e.g., translucent glass) and the lens assembly 170. The light-transmitting component 160 is connected to the upper end of the sidewall 140 of the housing. The light-transmitting component 160 is made of, for example, sapphire and is soldered to the upper end of the ceramic housing sidewall 140 via gold-tin soldering. In one example, the enclosed space formed by the light-transmitting component 160, the housing sidewall 140, and the housing base 116 can be filled with nitrogen to provide a reliable internal operating environment for the laser light-emitting chip.

[0062] As shown in FIG6 , each light-emitting unit further includes a plurality of heat sinks 112 corresponding one-to-one with the plurality of light-emitting chips 113. Each light-emitting chip 113 is mounted (e.g., by local soldering) on ​​the conductive pattern corresponding to the light-emitting unit (the conductive base 1312 corresponding to the housing) via the corresponding heat sink 112. Furthermore, as shown in FIG6 , each housing has a conductive structure (including a plurality of bottom solder pads 114) on the side facing the mounting substrate 130. The plurality of transfer pads 1311 corresponding to each light-emitting unit are connected one-to-one to the plurality of bottom solder pads 114 of the conductive structure.

[0063] When the light-emitting chip 113 is operating, it generates a large amount of heat, which needs to be quickly dissipated to prevent heat accumulation and affect the light-emitting chip's luminous efficiency. As shown in Figure 6, a heat sink 112 is disposed below the light-emitting chip 113. The light-emitting chip 113 is fixedly connected to the heat sink by welding. Heat sink 112 can be made of a material with a higher thermal conductivity than oxygen-free copper, such as aluminum nitride. Leveraging its higher thermal conductivity, heat generated by the light-emitting chip 113 during its light-emitting process can be quickly transferred to the copper heat sink housing base plate 116 below. Housing base plate 116 is typically made of oxygen-free copper. Leveraging its large heat dissipation area, housing base plate 116 quickly dissipates heat generated by the light-emitting chip 113 to the surrounding environment, reducing the junction temperature of the light-emitting chip 113. In some examples, housing base plate 116 can also form a conductive trace within the housing to transmit the driving current to the light-emitting chip 113. Due to its size and weight being much larger than that of the light-emitting chip 113, heat sink 112 can also be made of materials such as aluminum, copper, and diamond copper. Among them, insulating materials such as ALN and SIC are more commonly used when there is a requirement for insulation under the light-emitting chip 113 .

[0064] In one example, the light emitting chip 113 is soldered to the heat sink 112 via a solder layer. In some specific examples, the light emitting chip 113 is soldered to the heat sink 112 via an AuSn solder layer using a high-precision eutectic soldering machine. The AuSn solder layer mainly consists of Au and Sn materials, such as Au75Sn25 or Au80Sn20, and is adjusted according to different specifications. The thickness is approximately 1-10 μm.

[0065] In one example, the heat sink 112 comprises a multilayer structure. For example, along the direction away from the light-emitting chip 113, it comprises Ti / Pt / Au layers, with the Au layer adjacent to the AuSn solder layer, followed by the Pt and Ti layers. The Au layer is primarily used for soldering gold wires, while the Pt layer is positioned adjacent to the Au layer to provide bonding. The Ti layer not only provides bonding to the other two layers but also has a certain degree of thermal conductivity.

[0066] The thickness of the Ti / Pt / Au three layers depends on the actual application, but in most cases is less than 1 μm, in order to conduct heat to the side wall 140 of the tube shell as quickly as possible.

[0067] In some embodiments, the heat sink 112 has a high thermal conductivity, which can quickly dissipate the heat generated by the light emitting chip 113, thereby preventing the heat from damaging the light emitting chip 113. For example, the material of the heat sink 112 can include one or more of aluminum nitride and silicon carbide.

[0068] And, for a light-emitting chip 113, it is mounted on the heat sink 112 in a three-dimensional strip shape. Among them, the surface in contact with the heat sink 112 is the bottom surface, and the projection of the bottom surface on the surface of the heat sink 112 is a rectangle. The light-emitting surface of the light-emitting chip 113 is the side surface perpendicular to the bottom surface, also known as the side light-emitting surface. The light-emitting surface of the light-emitting chip 113 is rectangular, and the emitted laser beam has different divergence angles along the short side and long side of the rectangular light-emitting surface. Usually, the fast axis direction and slow axis direction of the laser beam are used to correspond to the directions of the laser beam with different divergence angles. The direction with a larger divergence angle emitted from the light-emitting surface is usually called the fast axis direction, and correspondingly, the direction with a smaller divergence angle is the slow axis direction.

[0069] In this example, the multiple light-emitting chips 113 are all light-emitting chips 113 that emit red light. Since there are two light-emitting points on the light-emitting surface of a red light-emitting chip, the divergence angle of the red laser beam in both the fast axis direction and the slow axis direction is larger than that of the blue laser beam emitted from the light-emitting surface of the blue light-emitting chip and the green laser beam emitted from the light-emitting surface of the green light-emitting chip.

[0070] As shown in FIG6 , multiple light-emitting chips 113 are soldered to the bottom plate 116 of the housing via heat sinks 112. Since a portion of the metal wires of the multiple light-emitting chips 113 are connected to the light-emitting chip itself, achieving electrical connection to one electrode of the light-emitting chip, and the other portion is connected to the corresponding heat sink 112, the area on the heat sink 112 used for connecting the metal wires is in a conductive relationship or corresponding relationship with another electrode of the light-emitting chip 113. For each light-emitting chip 113, electrical connection to the outside world can be achieved through two metal wires connected to the light-emitting chip itself and the heat sink below the light-emitting chip.

[0071] Figure 7 is a schematic diagram of the surface structure of a tube shell in a laser provided in an embodiment of the present application, facing the mounting substrate. Figure 8 is a schematic diagram of the top view of the mounting substrate in a laser provided in an embodiment of the present application. Referring to Figure 7, the side of the tube shell facing the mounting substrate 130 (i.e., the lower surface of the tube shell) is provided with a conductive structure (including multiple bottom pads 114, with eight bottom pads 114 shown as an example in Figure 7) and a connecting layer 115. In one example, the connecting layer 115 is a metal film layer with a generally rectangular shape. Referring to FIG8 , the mounting substrate 130 includes a connection pattern (including a conductive pattern corresponding one-to-one to each light-emitting unit, each conductive pattern including multiple transfer pads and a conductive base corresponding one-to-one to the housing; FIG8 shows a conductive pattern including two conductive bases 1312 and 16 transfer pads 1311), multiple connecting pads 132 (eight connecting pads 132 are used as an example in FIG8 ), and multiple intra-board connecting wires 1301. The connecting pads 132 are electrically connected to the transfer pads 1311 in the connection pattern via the intra-board connecting wires 1301. The connecting pads 132 are used to connect to the driving circuit and power supply (for example, the connecting pads 132 can be connected to the power supply via a connector, a flexible substrate, a glass epoxy substrate, a spring terminal, or the like). The conductive base 1312 is a structure for connecting to the light-emitting chip 113. When viewed from above, it is generally rectangular in shape and matches the shape, size, and position of the connection layer 115. As an example, as shown in FIG8 , among the eight connection pads 132 arranged in a row in FIG8 , the second connection pad 132 on the left is connected to the transfer pad 1311 numbered P1 by a separate intra-board connection line 1301, the third connection pad 132 on the left is connected to the transfer pad 1311 numbered P2 by a separate intra-board connection line 1301, and the fourth connection pad 132 on the left is connected to the transfer pad 1311 numbered P3 by a separate intra-board connection line 1301. , transfer pad 1311 numbered P4 and transfer pad 1311 numbered Q5, the second right connection pad 132 is connected to transfer pad 1311 numbered Q8 via a separate intra-board connection line 1301, the third right connection pad 132 is connected to transfer pad 1311 numbered Q7 via a separate intra-board connection line 1301, and the fourth right connection pad 132 is connected to transfer pad 1311 numbered Q6 via a separate intra-board connection line 1301. In addition, transfer pads 1311 numbered P5, P6, P7, P8, Q1, Q2, Q3, and Q4 are connected together via an intra-board connection line 1301.

[0072] In one example, referring to FIG8 , eight bottom pads 114 and one connection layer 115 are respectively provided at the bottom of the first tube shell and the second tube shell. The total of 16 bottom pads 114 and two connection layers 115 at the bottom of the tube shell are in relative contact with and electrically connected to a conductive pattern (including 16 transfer pads 1311 and 2 conductive bases 1312) on the mounting substrate 130—the eight bottom pads in each tube shell are electrically connected to the corresponding eight transfer pads 1311 in a one-to-one correspondence, and the connection layer 115 in each tube shell is electrically connected to the corresponding conductive base 1312.

[0073] In an embodiment of the present application, the light-emitting chip 113 in each light-emitting unit of the laser 10 includes at least two chips emitting light of different colors. The connection pads 132 on the mounting substrate 130 include a group of connection pads 132 corresponding to each color of the light-emitting chip in each light-emitting unit, each group of connection pads 132 including two connection pads 132, and each group of connection pads 132 is electrically connected to the corresponding color of the light-emitting chip. In one example, referring to FIG6, each color of the light-emitting chip 113 is sequentially connected to the corresponding group of connection pads 132 via the sidewall connection wire 117 (and / or the connection wire provided in the tube shell bottom plate 116), the bottom pad 114, the transfer pad 1311 and the internal board connection wire 1301, thereby achieving separate power supply for each color of the light-emitting chip 113. Each group of connection pads 132 includes two connection pads 132.

[0074] FIG9 is a schematic diagram of a side cross-sectional structure of a tube shell in a laser provided in an embodiment of the present application. Referring to FIG9 , the multiple light-emitting chips 113 of the second tube shell 120 include a first type of light-emitting chip 1131 and a second type of light-emitting chip 1132. The first type of light-emitting chip 1131 emits blue laser light, and the second type of light-emitting chip 1132 emits red or green laser light. The first type of light-emitting chip 1131 is electrically connected to two corresponding connection pads 132, and the second type of light-emitting chip 1132 is electrically connected to two corresponding connection pads 132. Therefore, at least four connection pads 132 need to be provided on the mounting substrate 130. It should be noted that FIG9 only exemplarily shows that the laser includes two light-emitting chips with different light-emitting colors, but does not limit the number of color types of light-emitting chips included in the laser of the embodiment of the present application. In another example, the laser includes three light-emitting chips of three colors, each emitting laser light of a different color. The three light-emitting chips 113 are electrically connected to the corresponding connection pads 132 through the side wall connection wires 117 of the second tube shell 120 and are powered separately.

[0075] FIG10 is a circuit diagram of a laser provided in an embodiment of the present application. Referring to FIG10 , the laser includes three light-emitting chips 113: red, green, and blue (RGB). Each color of light-emitting chip 113 is connected in series with a corresponding power supply VDD and a drive circuit R_T0, G_T0, or B_10. Comparing the circuit structures shown in FIG2 or FIG3 , it can be seen that in the embodiment of the present application, regardless of how the number of light-emitting chips 113 is increased, the number of required drive circuits remains unchanged. This solves the problem of the number of light-emitting chips being limited by the number of drive circuits, effectively improving the efficiency of the drive circuit and reducing costs.

[0076] In some embodiments, in order to achieve separate power supply and meet the requirements of miniaturization design, the mounting substrate 130 uses a copper substrate (e.g., a copper printed circuit board). The copper substrate is a single-sided board (i.e., a single-sided board). This allows sufficient space on the back of the copper substrate for heat dissipation, which is beneficial to the heat dissipation of the laser. This embodiment does not limit the size of the mounting substrate 130 and can be flexibly set according to needs. In some possible implementations, the mounting substrate 130 uses a 15.8mm×26mm copper substrate with a thickness of 1.6mm.

[0077] In some possible implementations, the thickness of the electrical connection portion of the mounting substrate 130 on the side closest to the housing is 2 oz (approximately 70 microns). In one example, the thickness of any one or more of the intra-board connection wires 1301, the connection pads 132, the transfer pads 1311, and the conductive base 1312 is 70 microns.

[0078] In some possible implementations, as shown in FIG8 , on a plane perpendicular to the mounting substrate 130, the orthographic projection of the connecting pad 132 at least partially overlaps with the orthographic projection of the intra-board connecting line 1301, the orthographic projection of the connecting pattern (transfer pad 1311 and conductive base 1312) at least partially overlaps with the orthographic projection of the intra-board connecting line 1301, and the orthographic projection of the conductive structure (bottom pad 114 overlapping with transfer pad 1311) at least partially overlaps with the orthographic projection of the connecting pattern (transfer pad 1311 and conductive base 1312). The connecting pad 132, the intra-board connecting line 1301, and the connecting pattern (transfer pad 1311 and conductive base 1312) are all located on the surface of the mounting substrate 130 facing the light-emitting unit.

[0079] In a direction perpendicular to the plane where the substrate 130 is mounted, there is an overlapping area between the connecting pad 132 and the intra-board connecting line 1301. The overlapping area is the connection area between the connecting pad 132 and the intra-board connecting line 1301. The larger the overlapping area between the connecting pad 132 and the intra-board connecting line 1301, the more conducive it is to improving the stability of the electrical connection and reducing the contact resistance. The situation where the connecting pad 132 and the intra-board connecting line 1301 at least partially overlap includes: the orthographic projection of the connecting pad 132 is completely within the orthographic projection of the intra-board connecting line 1301 (as shown in Figure 8), or the connecting pad 132 and the intra-board connecting line 1301 partially overlap and partially do not overlap.

[0080] In a direction perpendicular to the plane where the substrate 130 is mounted, there is an overlapping area between the connection pattern (transfer pad 1311 and conductive base 1312) and the intra-board connection line 1301. The overlapping area is the connection area between the connection pattern (transfer pad 1311 and conductive base 1312) and the intra-board connection line 1301. The larger the overlapping area between the connection pattern (transfer pad 1311 and conductive base 1312) and the intra-board connection line 1301, the more conducive it is to improving the stability of the electrical connection and reducing the contact resistance. The situation where the connection pattern (transfer pad 1311 and conductive base 1312) and the intra-board connection line 1301 at least partially overlap includes: the orthographic projection of the transfer pad 1311 is completely within the orthographic projection of the intra-board connection line 1301 (as shown in Figure 8), or, the transfer pad 1311 and the intra-board connection line 1301 partially overlap and partially do not overlap.

[0081] As shown in Figure 8 , within the plane of mounting substrate 130, connection pads 132 are located on the same side of mounting substrate 130, that is, on the same side of all the housings. This not only ensures the miniaturization of the entire laser, but also enhances the appearance of the laser and improves the operability of manual soldering. In other possible implementations, connection pads 132 can also be distributed on opposite sides of the housing, still enabling independent power supply for each color of the light-emitting chip, but this is not conducive to miniaturization.

[0082] Figure 11 is a schematic top-down view of a laser device according to an embodiment of the present invention. In this embodiment, the laser device includes three light-emitting chips of different colors. Each light-emitting chip is one of a first-type light-emitting chip 1131, a second-type light-emitting chip 1132, and a third-type light-emitting chip 1133, each emitting a different color. As an example, referring to Figure 9, light-emitting chips 113 of the same color within the same housing are connected in series and connected to two connection pads in a corresponding set of connection pads 132, respectively, to connect to the corresponding driver circuit R_T0, G_T0, or B_T0 (and power supply VDD). As an example, referring to Figure 11, the first housing 110 encapsulates the first-type light-emitting chip 1131 and the second-type light-emitting chip 1132, while the second housing 120 encapsulates the third-type light-emitting chip 1133. The first-type light-emitting chip 1131, the second-type light-emitting chip 1132, and the third-type light-emitting chip 1133 each have different central wavelengths and emit laser beams of different colors. Furthermore, the central wavelength of the third-type light-emitting chip 1133 is greater than the central wavelength of the first-type light-emitting chip 1131 and the second-type light-emitting chip 1132, and the central wavelength of the first-type light-emitting chip 1131 is smaller than the central wavelength of the second-type light-emitting chip 1132. As an example, the second tube shell 120 encapsulates five third-type light-emitting chips 1133 emitting red light, and the second tube shell 120 encapsulates two first-type light-emitting chips 1131 emitting blue light, and three second-type light-emitting chips 1132 emitting green light. In this embodiment of the present application, the sum of the number of the first-type light-emitting chips 1131 and the second-type light-emitting chips 1132 is the same as the number of the third-type light-emitting chips 1133.

[0083] Due to differences in the light-emitting mechanism, the photoelectric conversion efficiency and photothermal conversion efficiency of laser chips of different colors are different. For example, the thermal conversion power of the red laser light-emitting chip is high but the light-emitting efficiency is relatively low, and the visual sensory function is lower than that of green. That is, at the same light-emitting power, the human eye is more likely to perceive green. In order to meet the white balance color and brightness required for the screen display, the number of the above three types of light-emitting chips can be set so that the number of red light-emitting chips is greater than the number of green light-emitting chips and blue light-emitting chips. And, the number of green light-emitting chips is greater than the number of blue light-emitting chips. As an example, the laser shown in Figure 11 includes 2 blue light-emitting chips, 3 green light-emitting chips and 5 red light-emitting chips.

[0084] In one example, the lens assembly 170 is disposed above the light-transmitting component 160, and is connected to the light-transmitting component by, for example, dispensing glue around it. In this example, the lens assembly 170 is a plurality of integrally formed collimating lens units, which are used to compress the angle of the laser light beam with a large divergence angle emitted from the laser light-emitting chip to achieve beam collimation. In some specific implementations, for the sake of process consistency, lens assemblies of the same curvature and size can be used for the first type of light-emitting chip, the second type of light-emitting chip, and the third type of light-emitting chip. In this example, since the number of the third type of light-emitting chips is equal to the sum of the number of the first type of light-emitting chips and the second type of light-emitting chips, the two light-emitting units can use the same lens assembly, thereby reducing mold opening costs and improving the versatility of optical components. In this example, the curvature setting of the lens assembly 170 can correspond to the third type of light-emitting chip, that is, the red light-emitting chip setting. This is because the red light-emitting chip, with its two light-emitting points, has a greater divergence angle in both the fast and slow axis directions than the other two types of light-emitting chips. The divergence angle of the red laser beam significantly affects the combined light divergence angle. Therefore, when setting up a universal lens assembly, priority is given to collimating the divergence angle of the red light-emitting chip. This lens assembly is then applied to the upper light output path of the red light-emitting chip, as well as the upper light output paths of the blue and green light-emitting chips.

[0085] In some examples, lens assemblies with corresponding curvatures can be provided for different types or colors of light-emitting chips, respectively, so as to reduce the divergence angle of each color light beam accordingly and achieve a better collimation effect. In some examples, the third type of light-emitting chip includes multiple red light-emitting chips with different center wavelengths. For example, the third type of light-emitting chip includes five red light-emitting chips. In some specific examples, the five red light-emitting chips emit light beams with at least two different center wavelengths, such as center wavelengths of 639nm and 643nm, or 643nm and 647nm, or 639nm and 647nm. In other examples, the five light-emitting chips can also emit light beams with three different center wavelengths, including corresponding center wavelengths of 639nm, 643nm, and 647nm. The number of red light-emitting chips corresponding to the three different center wavelengths can be 1, 2, or 2, 2, or 1. This is for illustrative purposes only. The sum of the number of light-emitting chips corresponding to the above different center wavelengths satisfies the aforementioned 5, and the specific number of light-emitting chips corresponding to each center wavelength is not specifically limited. For laser beams of the same color, by setting multiple center wavelengths, the coherence characteristics between the laser beams can be reduced.

[0086] In some examples, light-emitting chips with different central wave plates are arranged in order of increasing central wavelength, or two light-emitting chips with different central wavelengths are arranged adjacent to each other, and two light-emitting chips with the same central wavelength are arranged alternately.

[0087] In one example, two blue light-emitting chips and three green light-emitting chips are sequentially arranged within the second tube shell along the length of the second tube shell. In some specific examples, the central wavelength of the blue light-emitting chip is 465nm, and the central wavelength of the green light-emitting chip is 525nm. Within the second tube shell, the central wavelengths of the red light-emitting chips sequentially arranged along the length of the second tube shell tend to decrease. The first tube shell and the second tube shell are arranged parallel to each other, and the length, width, and height dimensions of the shell are substantially the same. In a direction perpendicular to the length of the tube shell, the blue light-emitting chip is arranged adjacent to the light-emitting chip with the longer central wavelength among the multiple red light-emitting chips, and the green light-emitting chip is arranged adjacent to the light-emitting chip with the shorter central wavelength among the multiple red light-emitting chips. Since the longer the central wavelength of the red light-emitting chip, the higher the thermal conversion efficiency, that is, the easier it is to generate heat, and the thermal efficiency of the blue light-emitting chip is lower than that of the green light-emitting chip and the red light-emitting chip, so under the same driving current, the heat generation of the blue light-emitting chip is relatively insignificant. Therefore, in the double-tube shell three-color laser provided in this example, the blue light-emitting chip in the first tube shell and the red light-emitting chip with a longer central wavelength in the second tube shell are arranged adjacent to each other, and the green light-emitting chip in the first tube shell and the red light-emitting chip with a relatively short wavelength in the second tube shell are arranged adjacent to each other. For the laser as a whole, the heat distribution is relatively balanced, which is conducive to dissipating heat for the laser as a whole and reducing the difficulty of heat dissipation control.

[0088] Moreover, since the luminous efficiency of the red light-emitting chip will deteriorate due to the influence of temperature, through the above-mentioned arrangement, at least the heat accumulation in the thermal environment of the red light-emitting chip with a longer central wavelength is not easy to rise rapidly, because in addition to the red light-emitting chip itself, the thermal efficiency of the blue light-emitting chip adjacent to it is relatively low, and it is not easy to undergo rapid thermal changes. This is conducive to the stability of the luminous efficiency of the red light-emitting chip and makes the color of the red laser beam less likely to be deviated.

[0089] In some possible implementations, the number of connection pads 132 corresponding to each housing is twice the number of colors of the light-emitting chips 113 in the housing. Two connection pads 132 in each group of connection pads 132 are respectively a positive polarity pad and a negative polarity pad. Two connection pads 132 in a group of connection pads 132 connected to light-emitting chips 113 of the same color are adjacent to each other. Furthermore, in some possible implementations, within each light-emitting unit, among all the connection pads 132 connected to the light-emitting chips 113, one of the two adjacent connection pads 132 is a positive polarity pad and the other is a negative polarity pad.

[0090] As shown in FIG11 , as an example, the number of connection pads 132 corresponding to the first tube shell 110 is twice the number of color types of the light-emitting chip 113 in the tube shell, that is, two; the number of connection pads 132 corresponding to the second tube shell 120 is twice the number of color types of the light-emitting chip 113 in the tube shell, that is, four; a group of connection pads 132R corresponding to the third type of light-emitting chip 1133 in the first tube shell 110 includes a red positive polarity pad R+ and a red negative polarity pad R-, and ... A group of connecting pads 132B corresponding to the first type light-emitting chip 1131 in 120 includes a blue positive polarity pad B+ and a blue negative polarity pad B-, and a group of connecting pads 132B corresponding to the second type light-emitting chip 1132 in the second tube shell 120 includes a green positive polarity pad G+ and a green negative polarity pad G-, and two connecting pads 132 in the same group of these connecting pads 132 are adjacent to each other, and the two adjacent connecting pads 132 are always a combination of a positive polarity pad and a negative polarity pad.

[0091] 11 , as an example, four third-type light-emitting chips 1133 in the first tube shell 110 are connected in series through a metal wire 111 (made of, for example, gold Au), and the two ends of the series circuit line are electrically connected to the step portions 126 on both sides respectively. A metal film is provided on the upper surface of the step portion 126, and the metal film is electrically connected to the corresponding bottom pad 114 in the conductive structure through a side wall connection line 117. The bottom pad 114 is electrically connected to the corresponding transfer pad 1311 in the conductive pattern of the connection pattern. The transfer pad 1311 is electrically connected to the corresponding connection pad 132R through the intra-board connection line 1301, thereby realizing the electrical connection between the third-type light-emitting chip 1133 and the corresponding group of connection pads 132R; the two first-type light-emitting chips 1131 in the second tube shell 120 are connected in series through the metal wire 111, and the two ends of the series circuit line are electrically connected to a metal film on the upper surface of the step portion 126, and are connected to the corresponding group of connection pads 132R in the conductive structure through the side wall connection line 117. The corresponding bottom pads 114 are electrically connected, and the bottom pads 114 are electrically connected to the corresponding transfer pads 1311 in the conductive pattern of the connection pattern. The transfer pads 1311 are electrically connected to the corresponding connection pads 132B through the intra-board connection wires 1301, thereby realizing the electrical connection between the first type light-emitting chip 1131 and the corresponding group of connection pads 132B; the three second type light-emitting chips 1132 in the second tube shell 120 are connected in series into one circuit through the metal wires 111, and the two ends of the series circuit line are electrically connected to another metal film on the upper surface of the step portion 126, and are electrically connected to the corresponding bottom pads 114 in the conductive structure through the sidewall connection wires 117. The bottom pads 114 are electrically connected to the corresponding transfer pads 1311 in the conductive pattern of the connection pattern, and the transfer pads 1311 are electrically connected to the corresponding connection pads 132G through the intra-board connection wires 1301, thereby realizing the electrical connection between the first type light-emitting chip 1131 and the corresponding group of connection pads 132G.

[0092] It should be noted that the above example shows that the laser includes two tube shells, but the embodiments of the present application are not limited to this. In other possible implementations, the laser 10 includes a tube shell, and the first type light-emitting chip 1131, the second type light-emitting chip 1132, and the third type light-emitting chip 1133 are located in the same tube shell; or the laser 10 includes three tube shells, and the first type light-emitting chip 1131, the second type light-emitting chip 1132, and the third type light-emitting chip 1133 are located in three tube shells respectively, and the light-emitting chips 113 with the same light-emitting color are located in the same tube shell.

[0093] It should also be noted that the light-emitting chip 113 within the housing can be led out by forming a metal film conductive area on the inner surface of the housing's sidewall 140. This conductive area is used for soldering gold wires and is connected to the sidewall connection line 117. When the conductive area connects the positive and negative electrodes, or the anode and cathode, of the light-emitting chip, there are two conductive areas, which are not connected to each other. These two conductive areas are connected to two traces of opposite polarity distributed within the housing. Another lead-out method can be to form an inward step on the housing's sidewall 140, such as the step 126 shown in Figure 6, with the metal film conductive area provided on the surface. The provision of the step 126 can shorten the required metal wire length or reduce the difficulty of soldering the metal wire to the metal conductive area. In some examples, the housing is made of ceramic and the housing base 116 is made of oxygen-free copper. When the housing is mounted on a mounting substrate 130, solder pads are provided only in the area corresponding to the housing, while the area corresponding to the housing base is an insulating area. In some examples, the sidewall connection line 117 of the first housing may also be located in the sidewall 140 of the housing and the housing bottom plate 116 . The material of the sidewall connection line 117 may be tungsten, a metal material with good electrical conductivity.

[0094] In the example of FIG11 , different types of light-emitting chips each have their own electrode pair, meaning they are independently powered and do not share a common anode or cathode. Therefore, anode R+ and cathode R- for the red light-emitting chip, anode B+ and cathode B for the blue light-emitting chip, and anode G+ and cathode G- for the green light-emitting chip are provided on the side edges of the mounting substrate 130. Independent power supply for light-emitting chips of different types or colors improves power supply reliability and increases the versatility of the mounting substrate. The number of chips to be accommodated within the package is optional; for example, within a volume that can accommodate up to five chips, three or five chips can be accommodated. Furthermore, the number of light-emitting chips of the same color can be flexible. For example, within the first package, the number of blue and green light-emitting chips can be two, three, one, four, or two each. All can be electrically connected to the corresponding electrode pair pads via internal wiring.

[0095] FIG12 is a schematic top view of another laser structure provided in an embodiment of the present application. Referring to FIG12 , similar to the laser shown in FIG11 , the mounting substrate 130 includes four groups of connection pads 132 , namely: a thermistor positive pad NTC+ and a thermistor negative pad NTC-; a ​​red positive pad R+ and a red negative pad R-; a blue positive pad B+ and a blue negative pad B-; and a green positive pad G+ and a green negative pad G-. Different from the laser shown in FIG11 , in order to prevent the positive and negative poles from being short-circuited due to welding errors, the positions of the connecting pads 132 are arranged according to the principle of adjacent ones with the same polarity. The arrangement order of the eight connecting pads 132 from left to right is: thermistor positive polarity pad NTC+, red positive polarity pad R+, red negative polarity pad R-, blue negative polarity pad B-, blue positive polarity pad B+, green positive polarity pad G+, green negative polarity pad G- and thermistor negative polarity pad NT-, that is, the thermistor positive polarity pad NTC+ is adjacent to the red positive polarity pad R+, the red negative polarity pad R- is adjacent to the blue negative polarity pad B-, the blue positive polarity pad B+ is adjacent to the green positive polarity pad G+, and the green negative polarity pad G- is adjacent to the thermistor negative polarity pad NTC-.

[0096] In the embodiment of the present application, the type of the connecting pad 132 can be set to, for example, a cross pad (as shown in FIG12 ), or can be set to any type of pad known to those skilled in the art.

[0097] In some possible implementations, as shown in FIG12 , the laser further includes a thermistor 134 connected to a corresponding set of connection pads 132 via connecting wires. Thermistor 134 is used to detect heating of the light-emitting chip. Thermistor 134 may include a negative temperature coefficient (NTC) thermistor, or other types of thermistors known to those skilled in the art, without limitation.

[0098] Exemplarily, as shown in Figure 12, the thermistor 134 is located on one side of the conductive base 1312 close to the connecting pad 132, and the eight connecting pads 132 are symmetrically distributed on both sides of the thermistor 134. A group of connecting pads 132 corresponding to the thermistor 134 (i.e., NTC+ and NTC-) is located on the outermost side, and the two ends of the thermistor 134 are respectively connected to the thermistor positive polarity pad NTC+ and the thermistor negative polarity pad NTC- through corresponding connecting wires on the mounting substrate 130.

[0099] In one example, the third-type light-emitting chip 1133 emits red laser light, corresponding to a wavelength range of 6113 nm to 760 nm, the first-type light-emitting chip 1131 emits blue laser light, corresponding to a wavelength range of 435 nm to 450 nm, and the second-type light-emitting chip 1132 emits green laser light, corresponding to a wavelength range of 492 nm to 577 nm. In other possible implementations, one or more of the first-type light-emitting chip 1131, the second-type light-emitting chip 1132, and the third-type light-emitting chip 1133 may also emit laser light of other colors.

[0100] Referring to Figure 12 , for assembly purposes, positioning holes 135 are typically provided on mounting substrate 130. However, when the distance between the housing and positioning holes 135 is reduced to 0.5 mm, wiring cannot be arranged. Therefore, in this embodiment, bottom pads 114 are provided only on the side of the housing near connection pads 132. Bottom pads 114 are electrically connected to corresponding connection pads 132 via transfer pads 1311 located on the side of mounting substrate 130 near connection pads 132 and intra-board connection wires 1301.

[0101] In other possible implementations, under the condition that the spacing between the positioning hole 135 and the tube shell and the spacing between the tube shells meet the minimum trace width, a bottom pad 114 can also be provided on the side of the tube shell away from the connecting pad 132. In this case, an intra-board connecting line 1301 can also be provided in the area between the positioning hole 135 and the tube shell on the mounting substrate 130, and / or an intra-board connecting line 1301 can be provided in the area between two tube shells on the mounting substrate 130, so that the transfer pads 1311 close to each other can be interconnected through the above-mentioned intra-board connecting line 1301 and then electrically connected to the connecting pad 132, thereby increasing the trace width and reducing the resistance.

[0102] Exemplarily, as shown in FIG12 , the laser includes two tube shells (ie, a first tube shell 110 and a second tube shell 120 ), eight connection pads 132 are located on the same side of the two tube shells, and four bottom pads 114 are provided on one side of each tube shell close to the connection pads 132 . The mounting substrate corresponding to the first tube shell 110 and the second tube shell 120 is shown in Figure 8. Referring to Figures 8 and 12, the transfer pad 1311 numbered P1 in the laser is connected to the red positive polarity pad R+ through the intra-board connecting line 1301, and the transfer pad 1311 numbered P2 is connected to the red negative polarity pad R- through the intra-board connecting line 1301; the transfer pads 1311 numbered P3, P4 and Q5 are connected to the blue negative polarity pad B- through the intra-board connecting line 1301, the transfer pad 1311 numbered Q6 is connected to the blue positive polarity pad B+, the transfer pad 1311 numbered Q7 is connected to the green positive polarity pad G+ through the intra-board connecting line 1301, and the transfer pad 1311 numbered Q8 is connected to the green negative polarity pad G-.

[0103] For example, as shown in FIG12 , due to wiring space limitations and the addition of thermistor 134, it is difficult to route wiring between transfer pad 1311 numbered Q5 and blue negative polarity pad B-. This would either reduce the area of ​​other wiring or cause the wiring to overlap with the thermistor, resulting in a short circuit. Therefore, by electrically connecting transfer pads 1311 numbered P3 and P4 and transfer pad 1311 numbered Q5 to blue negative polarity pad B- via the same intra-board connection line 1301, the wiring width is increased, thereby reducing resistance and helping to improve the luminous intensity of light-emitting chip 113. Furthermore, the placement of thermistor 134 and connection pad 132 is not affected, making the overall structure appear simpler.

[0104] FIG13 is a schematic diagram of a top-down planar structure of another laser provided in an embodiment of the present application. As another example, referring to FIG13 , the transfer pad 1311 numbered P4 and the transfer pad 1311 numbered Q5 are electrically connected to the blue negative polarity pad B- via the same intra-board connection line 1301, thereby achieving an electrical connection between the blue light-emitting chip and the blue negative polarity pad B-; the transfer pad 1311 numbered P3 and the transfer pad 1311 numbered P2 are electrically connected to the red negative polarity pad R- via the same intra-board connection line 1301, thereby achieving an electrical connection between the red light-emitting chip and the red negative polarity pad R-. With this arrangement, the trace widths of the red negative polarity pad R- and the blue negative polarity pad B- can be doubled, thereby reducing resistance and increasing the luminous brightness of the light-emitting chip 113, without affecting the placement of the thermistor 134 and the connection pad 132, making the overall structure look more concise.

[0105] Figure 14 is a schematic top-down plan view of another laser structure provided by an embodiment of the present application. As another example, referring to Figure 14, with the position of the thermistor as the dividing line, only the red positive pad R+ and the red negative pad R- can be placed on its left side, while the blue negative pad B-, blue positive pad B+, green positive pad G+, and green negative pad G- can all be placed on its right side, and basically aligned with the bottom pad of the tube shell to ensure a relatively uniform trace width. In this structure, the thermistor positive pad NTC+ and the thermistor negative pad NTC- can both be placed on the left side. With this arrangement, the bottom pad 114 of each tube shell can be directly electrically connected to its adjacent connecting pad 132. However, the routing between the connecting pad 132 and the thermistor 134 needs to be readjusted. For example, the space on the lower side of the mounting substrate 130 needs to be increased to accommodate this routing. Alternatively, the positive polarity pad NTC+ and the negative polarity pad NTC- of the thermistor are still arranged on the left and right sides respectively, with different numbers of connecting pads 132 on both sides. This either reduces the area of ​​the right connecting pad 132, which may lead to reduced welding reliability, or increases the area of ​​the right mounting substrate 130, which is not conducive to miniaturization.

[0106] In other possible implementations, if the space requirement of the thermistor is not considered, the transfer pads 1311 corresponding to the various light-emitting chips 113 may be aligned and distributed equidistantly with respect to the bottom pads of the package.

[0107] FIG15 is a schematic diagram illustrating the circuit connections of another laser housing according to an embodiment of the present application. For example, as shown in FIG15 , first housing 110 and second housing 120 have the same structure. Second housing 120 is obtained by rotating first housing 110 180° clockwise. Their connections are identical to those shown in FIG8 and FIG11 , and are not further described here.

[0108] FIG16 is a schematic diagram of the internal electrical connections within another laser housing according to an embodiment of the present application. Referring to FIG16 , illustratively, three third-type light-emitting chips 1133 are disposed within the first housing 110. All of the third-type light-emitting chips 1133 are connected in series to form a circuit (not shown in FIG16 ). The cathode and anode electrodes of the third-type light-emitting chips 1133 connected in series to the circuit are connected to a bottom pad 114 provided at the bottom of the first housing 110 via a sidewall connection wire 117 within the first housing 110. The bottom pad 114 is then electrically connected to a transfer pad 1311 on the mounting substrate 130.

[0109] Figure 17 is a schematic diagram of the internal structure of another laser tube shell provided in an embodiment of the present application. As shown in Figure 17 , four third-type light-emitting chips 1133 are illustratively disposed within the first tube shell 110. All third-type light-emitting chips 1133 are connected in series via metal wires. The third-type light-emitting chips 1133 are mounted on corresponding heat sinks 112 and have corresponding reflective components 150 disposed on one side.

[0110] FIG18 is a schematic side cross-sectional view of another laser housing according to an embodiment of the present application. Referring to FIG18 , for example, three third-type light-emitting chips 1133 are disposed within the first housing 110. Each third-type light-emitting chip 1133 is mounted on a corresponding heat sink 112. All third-type light-emitting chips 1133 are connected in series via metal wires. The cathode and anode electrodes of the series of third-type light-emitting chips 1133 are connected to the exterior of the housing via sidewall connection wires 117 within the first housing 110.

[0111] In some possible implementations, four or three third-type light-emitting chips 1133 are provided in the first tube shell 110, and all the third-type light-emitting chips 1133 are connected in series to form a circuit. The cathode and anode of the third-type light-emitting chips 1133 connected in series to form a circuit are respectively connected to the bottom pad 114 provided at the bottom of the first tube shell 110 through the side wall connection line 117 in the first tube shell 110. The bottom pad 114 is electrically connected to the transfer pad 1311 of the mounting substrate 130. The transfer pad 1311 is electrically connected to the connection pad 132 through the intra-board connection line 1301, thereby realizing the electrical connection between the third-type light-emitting chip and the mounting substrate 130. As an example, the side wall connection line 117 in the first tube shell 110 is located in the side wall 140 and the tube shell bottom plate 116.

[0112] FIG19 is a schematic diagram of the internal electrical connections of another laser housing provided by an embodiment of the present application. Referring to FIG19 , illustratively, a first-type light-emitting chip 1131 and two second-type light-emitting chips 1132 are arranged in series within the second housing 120. All of the second-type light-emitting chips 1132 are connected in series (not shown in FIG19 ). There is no connection between the first-type light-emitting chips 1131 and the second-type light-emitting chips 1132. The positive and negative electrodes of the first-type light-emitting chips 1131 are electrically connected to the bottom pads 114 at the bottom of the second housing 120 via sidewall connection wires 117 within the second housing 120. The bottom pads 114 are electrically connected to the transfer pads 1311 on the mounting substrate 130. The positive and negative electrodes of the second-type light-emitting chips 1132 arranged in series are electrically connected to the bottom pads 114 at the bottom of the second housing 120 via sidewall connection wires 117 within the second housing 120. The bottom pads 114 are electrically connected to the transfer pads 1311 on the mounting substrate 130.

[0113] FIG20 is a schematic diagram of the internal structure of another laser housing provided by an embodiment of the present application. Referring to FIG20 , for example, three first-type light-emitting chips 1131 and two second-type light-emitting chips 1132 are disposed within the second housing 120. All first-type light-emitting chips 1131 are connected in series via metal wires. The three first-type light-emitting chips 1131 and the two second-type light-emitting chips 1132 are mounted on their respective heat sinks 112, and corresponding reflective components 150 are disposed on the same side.

[0114] FIG21 is a schematic side cross-sectional view of another laser housing according to an embodiment of the present application. Referring to FIG21 , for example, a first-type light-emitting chip 1131 and two second-type light-emitting chips 1132 are mounted on corresponding heat sinks 112 within the second housing 120. All second-type light-emitting chips 1132 are connected in series via metal wires. There is no connection between the first-type light-emitting chips 1131 and the second-type light-emitting chips 1132. The positive and negative electrodes of the first-type light-emitting chips 1131 are connected to the exterior of the housing via sidewall connecting wires 117 within the second housing 120. The positive and negative electrodes of the second-type light-emitting chips 1132 connected in series are connected to the exterior of the housing via sidewall connecting wires 117 within the second housing 120.

[0115] In some possible implementations, at least one first-type light-emitting chip 1131 and at least one second-type light-emitting chip 1132 are provided in the second tube shell 120. All the first-type light-emitting chips 1131 are connected in series to form a path, and all the second-type light-emitting chips 1132 are connected in series to form a path. There is no connection between the first-type light-emitting chips 1131 and the second-type light-emitting chips 1132. The positive and negative electrodes of the first-type light-emitting chips 1131 connected in series to form a path are electrically connected to the bottom pad 114 at the bottom of the second tube shell 120 through the side wall connection line 117 in the second tube shell 120, respectively. The bottom pad 114 is electrically connected to the transfer pad 1311 of the mounting substrate 130, and the transfer pad 1311 is electrically connected to the transfer pad 1311 of the mounting substrate 130 through the internal board connection line 1301. The positive and negative electrodes of the second type light-emitting chips 1132 connected in series are electrically connected to the bottom pads 114 at the bottom of the second tube shell 120 through the side wall connecting wires 117 in the second tube shell 120, respectively. The bottom pads 114 are electrically connected to the transfer pads 1311 of the mounting substrate 130. The transfer pads 1311 are connected to the corresponding transfer pads 1311 through the intra-board connecting wires 1301, thereby realizing the electrical connection between the first type light-emitting chip 1131 and the mounting substrate 130, as well as the electrical connection between the second type light-emitting chip and the mounting substrate 130; as an example, the side wall connecting wires 117 in the second tube shell 120 are located in the side wall 140 and the tube shell bottom plate 116.

[0116] FIG22 is a schematic diagram of the structure of another laser housing provided by an embodiment of the present application. As shown in FIG22 , three different color light-emitting chips within a single light-emitting unit are illustratively disposed within three different housings. The housings, facing the mounting substrate 130, include two bottom pads 114 arranged side by side near a connection pad 132 on each housing. The two bottom pads 114 below each housing are connected to corresponding transfer pads 1311.

[0117] FIG23 is a schematic top view of another laser device provided in an embodiment of the present application. Referring to FIG22 , for example, three different colored light-emitting chips within a single light-emitting unit are disposed within three different housings, with each housing housing a light-emitting chip 113 of a different color. The housings are arranged in the same direction as the connection pads 132. The housings are arranged on the side facing the mounting substrate 130, including two bottom pads 114 disposed side by side near the connection pads 132. The two bottom pads 114 below each housing are connected to a set of connection pads 132 via transfer pads 1311 and internal board connection wires 1301. Specifically, the conductive pattern of the connection pattern of the mounting substrate 130 includes three repeating units corresponding to the tube shell, and each repeating unit includes two transfer pads 1311 arranged side by side near the side of the connecting pad 132, and each transfer pad 1311 is electrically connected to the corresponding connecting pad 132 through the internal board connecting wire 1301; the transfer pad 1311 is connected to the bottom pad 114 of the tube shell in a one-to-one correspondence, and the bottom pad 114 is electrically connected to the light-emitting chip 113 located in the tube shell through the side wall connecting wire 117 in the tube shell, thereby realizing the electrical connection between the light-emitting chip 113 and the corresponding connecting pad 132.

[0118] For example, as shown in Figure 23, the left tube shell is used to encapsulate the red light-emitting chip, and the corresponding two bottom pads 114 are connected to the red positive polarity pad R+ and the red negative polarity pad R- respectively through the adapter pad 1311 and the internal board connection line 1301; the middle tube shell is used to encapsulate the blue light-emitting chip, and the corresponding two bottom pads 114 are connected to the blue negative polarity pad B- and the blue positive polarity pad B+ respectively through the adapter pad 1311 and the internal board connection line 1301; the right tube shell is used to encapsulate the green light-emitting chip, and the corresponding two bottom pads 114 are connected to the green positive polarity pad G+ and the green negative polarity pad G- respectively through the adapter pad 1311 and the internal board connection line 1301.

[0119] FIG24 is a schematic diagram of a top-down planar structure of another laser provided in an embodiment of the present application. Referring to FIG24 , illustratively, the laser includes three tube shells, with each color of light-emitting chip 113 individually encapsulated in a tube shell. That is, the light-emitting chips 113 in each tube shell have the same light-emitting color, and the light-emitting chips 113 in each tube shell are connected in series. Specifically, all first-type light-emitting chips 1131 are disposed in the same tube shell, and all first-type light-emitting chips 1131 are connected in series; all second-type light-emitting chips 1132 are disposed in the same tube shell, and all second-type light-emitting chips are connected in series; and third-type light-emitting chips 1133 are disposed in the same tube shell, and all third-type light-emitting chips 1133 are connected in series. The connection pads 132 are located on the same side of the three tube shells, and the connection pads 132 and the tube shells are arranged in the same direction. Two bottom pads 114 are provided on one side of each tube shell near the connection pads 132 , and the arrangement direction of the two bottom pads 114 is the same as that of the connection pads 132 ; the two bottom pads 114 of each tube shell are electrically connected to a corresponding group of connection pads 132 .

[0120] Figure 25 is a schematic diagram of the surface structure of a housing in another laser device provided in an embodiment of the present application, facing the mounting substrate. Referring to Figure 25 , the conductive pattern on the bottom of each housing illustratively includes four bottom pads 114 and a connecting layer 115 (two of which are not connected). The bottom pads 114 are located at the four corners of the rectangular housing, and the connecting layer 115 is located in the center of the housing.

[0121] In other possible implementations, bottom pads 114 may be provided on both the side of the tube shell close to the connecting pad 132 and the side away from the connecting pad 132. Correspondingly, transfer pads 1311 may be provided on both the side of the mounting substrate 130 close to the connecting pad 132 and the side away from the connecting pad 132. Under the condition that the spacing between the positioning hole and the tube shell and the spacing between the tube shells meet the minimum trace width, an intra-board connecting line 1301 may be provided between the positioning hole and the tube shell and / or between the tube shells to electrically connect the transfer pad 1311 on the side away from the connecting pad 132 and the transfer pad 1311 on the side close to the connecting pad 132, so as to increase the trace width and thereby reduce the resistance.

[0122] FIG26 is a schematic diagram of the structure of another laser housing provided in an embodiment of the present application. Referring to FIG26 , for example, the three color light-emitting chips 113 of a single light-emitting unit (i.e., the first type light-emitting chip 1131, the second type light-emitting chip 1132, and the third type light-emitting chip 1133) are packaged within the same housing. Each color light-emitting chip within the housing is connected to a corresponding bottom pad, which in turn connects to a corresponding connection pad on the mounting substrate.

[0123] Figure 27 is a top-down schematic diagram of another laser device provided in an embodiment of the present application. Referring to Figure 27 , for example, in this laser device, a single housing houses three light-emitting chips 113 of different colors. The housing includes four bottom pads 114 arranged side by side on at least a first side proximate to connection pads 132, and one bottom pad 114 on each of a second and third side adjacent to the first side, with the second and third sides positioned opposite each other. The six bottom pads 114 of the housing are connected to three groups of connection pads 132, respectively. As shown in Figure 27, the mounting substrate 130 includes a transfer pad 1311 and an intra-board connecting line 1301. The conductive pattern of the connection pattern includes four transfer pads 1311 on one side close to the connecting pad 132 (corresponding to the first side of the tube shell), and one transfer pad 1311 on the left and right sides (corresponding to the second side and the third side of the tube shell). These six transfer pads 1311 are connected to the six bottom pads 114 in a one-to-one correspondence; the transfer pads 1311 are electrically connected to the corresponding connecting pads 132 through the intra-board connecting line 1301, thereby realizing the corresponding connection between the six bottom pads 114 and the six connecting pads 132. The specific connection relationship is as follows: the bottom pad 114 on the second side (taking the left side as an example) is electrically connected to the red positive polarity pad R+ through the transfer pad 1311 and the intra-board connecting line 1301; optionally, the three transfer pads 1311 can be connected to the red positive polarity pad R+ through the same intra-board connecting line 1301 The first bottom pad 114 on the left end of the first side is electrically connected to the red negative polarity pad R+; the first bottom pad 114 on the left end of the first side is electrically connected to the red negative polarity pad R- through the transfer pad 1311 and the internal connection line 1301; the second bottom pad 114 on the left end of the first side is electrically connected to the blue negative polarity pad B- through the transfer pad 1311 and the internal connection line 1301; the second bottom pad 114 on the right end of the first side is electrically connected to the blue positive polarity pad B- through the transfer pad 1311 and the internal connection line 1301 The first bottom pad 114 on the right end of the first side is electrically connected to the green positive polarity pad G+ through the adapter pad 1311 and the internal connecting line 1301 on the board, and the bottom pad on the third side (taking the right side as an example) is electrically connected to the green negative polarity pad G- through the adapter pad 1311 and the internal connecting line 1301 on the board; optionally, the three adapter pads 1311 can also be electrically connected to the green negative polarity pad G- through the same internal connecting line 1301 on the board.

[0124] FIG28 is a schematic diagram of a top-down planar structure of another laser housing provided in an embodiment of the present application. Referring to FIG28 , for example, the first-type light-emitting chip 1131, the second-type light-emitting chip 1132, and the third-type light-emitting chip 1133 are located within the same housing. The three-color light-emitting chips 113 are arranged in a row from left to right and are each connected to the sidewall of the housing via a gold (Au) metal wire and electrically connected to the sidewall connection wires. If the third-type light-emitting chip 1133 is a red light-emitting chip, the first-type light-emitting chip 1131 is a blue light-emitting chip, and the second-type light-emitting chip 1132 is a green light-emitting chip, the blue and green light-emitting chips require an anti-static device 118. However, the red light-emitting chip material has a stronger anti-static capability, so the red light-emitting chip is not equipped with an anti-static device 118. The laser also includes a reflective component 150 and a heat sink 112. The light-emitting chip 113 and the anti-static device 118 are arranged above the heat sink 112. The reflective component 150 is located on the light-emitting side of the light-emitting chip 113, and the reflective surface of the reflective component 150 is aligned with the light-emitting chip 113. The light-emitting chips 113 can be arranged in a one-to-one correspondence with the heat sink 112, or multiple light-emitting chips 113 with the same luminous color can be arranged on the same heat sink 112, without limitation.

[0125] In other possible implementations, the red positive polarity pad R+ can also be connected to three adjacent transfer pads 1311 through the intra-board connecting line 1301; similarly, the green negative polarity pad G- can be connected to three adjacent transfer pads 1311 through the intra-board connecting line 1301, and can be set according to the relative position and size of the mounting substrate 130, the tube shell and the positioning hole 135, which is not limited here.

[0126] Figure 29 is a schematic top-down view of another laser device according to an embodiment of the present application. Referring to Figure 29 , for example, the side of the housing near the connection pad 132 is the first side, with the second and third sides located on the left and right sides, respectively, adjacent to the first side. Four bottom pads 114 are arranged side by side on the first side of the housing, one bottom pad 114 is arranged on the second side, and one bottom pad 114 is arranged on the third side.

[0127] As shown in Figure 29, the mounting substrate 130 includes a transfer pad 1311 and an intra-board connecting line 1301. The conductive pattern of the connection pattern includes four transfer pads 1311 on one side close to the connecting pad 132 (corresponding to the first side of the tube shell), and one transfer pad 1311 on the left and right sides (corresponding to the second side and the third side of the tube shell). These six transfer pads 1311 are connected to the six bottom pads 114 in a one-to-one correspondence; the transfer pads 1311 are electrically connected to the corresponding connecting pads 132 through the intra-board connecting line 1301, thereby realizing the corresponding connection between the six bottom pads 114 and the six connecting pads 132. The specific connection relationship is as follows: the bottom pad 114 on the second side (taking the left side as an example) is electrically connected to the red positive polarity pad R+ through the transfer pad 1311 and the intra-board connecting line 1301; optionally, the three transfer pads 1311 can be connected to the red positive polarity pad R+ through the same intra-board connecting line 1301 The first bottom pad 114 on the left end of the first side is electrically connected to the red negative polarity pad R+; the first bottom pad 114 on the left end of the first side is electrically connected to the red negative polarity pad R- through the transfer pad 1311 and the internal connection line 1301; the second bottom pad 114 on the left end of the first side is electrically connected to the blue negative polarity pad B- through the transfer pad 1311 and the internal connection line 1301; the second bottom pad 114 on the right end of the first side is electrically connected to the blue positive polarity pad B- through the transfer pad 1311 and the internal connection line 1301 The first bottom pad 114 on the right end of the first side is electrically connected to the green positive polarity pad G+ through the adapter pad 1311 and the internal connecting line 1301 on the board, and the bottom pad on the third side (taking the right side as an example) is electrically connected to the green negative polarity pad G- through the adapter pad 1311 and the internal connecting line 1301 on the board; optionally, the three adapter pads 1311 can also be electrically connected to the green negative polarity pad G- through the same internal connecting line 1301 on the board.

[0128] In other possible implementations, the red positive polarity pad R+ can also be connected to three adjacent transfer pads 1311 through the intra-board connecting line 1301; similarly, the green negative polarity pad G- can be connected to three adjacent transfer pads 1311 through the intra-board connecting line 1301, and can be set according to the relative position and size of the mounting substrate 130, the tube shell and the positioning hole 135, which is not limited here.

[0129] In some possible implementations, as shown in Figures 29 and 30, the tube shell also includes a fourth side arranged opposite to the first side, and includes four bottom solder pads 114 arranged side by side on the fourth side; two of the bottom solder pads 114 on the fourth side are connected together through the same intra-board connecting line 1301, and the other two bottom solder pads 114 are connected together through the same intra-board connecting line 1301.

[0130] In this embodiment, the fourth side of the tube housing is a side away from the connecting pads 132 , and four bottom pads 114 are also provided on this side. Correspondingly, as shown in Figure 27, four transfer pads 1311 are also provided on the side of the connection pattern 13 away from the connection pad 132, and the four transfer pads 1311 are connected one-to-one with the four bottom pads on the fourth side of the tube shell; the two transfer pads 1311 on the left are electrically connected to a transfer pad 1311 located on the left side of the connection pattern 13, so that the three transfer pads 1311 are electrically connected to the red positive polarity pad R+ through the same intra-board connection line 1301, so that the two bottom pads 114 on the fourth side of the tube shell are connected to the bottom pad 114 on the second side through the same intra-board connection line 1301; the two transfer pads 1311 on the right are connected to a transfer pad 1311 located on the right side of the connection pattern 13, so that the three transfer pads 1311 are electrically connected to the green negative polarity pad G- through the same intra-board connection line 1301. With this arrangement, the red positive-polarity pad R+ and the green negative-polarity pad G- are both connected to three transfer pads 1311, allowing the two bottom pads 114 on the fourth side of the package to be connected to the bottom pads 114 on the third side via the same intra-board connection line 1301. This arrangement increases the width of the intra-board connection line 1301, which helps reduce resistance.

[0131] It should be noted that Figures 27 and 29 only exemplarily show that the transfer pads 1311 on the side of the mounting substrate 130 away from the connecting pad 132 are divided into two groups, with two transfer pads 1311 in each group, but do not constitute a limitation on the laser provided in the embodiment of the present application.

[0132] Figure 30 is a schematic diagram of the surface structure of a tube shell facing the mounting substrate in another embodiment of the present application. Referring to Figure 30 , the conductive pattern at the bottom of the tube shell illustratively includes eight bottom solder pads 114 (not connected to each other) and a connecting layer 115. The eight bottom solder pads 114 are located around the rectangular tube shell (four bottom solder pads 114 are located on the first side, one bottom solder pad 114 is located on each of the second and third sides, and four bottom solder pads 114 are located on the fourth side). The connecting layer 115 is located in the center of the tube shell.

[0133] In some possible implementations, within the plane of the mounting substrate 130 , the length of the connecting pads 132 in the arrangement direction of the connecting pads 132 is 1.3 mm to 1.7 mm; along the arrangement direction of the connecting pads 132 , the spacing between adjacent connecting pads 132 is 0.8 mm to 1.2 mm.

[0134] In some possible implementations, within the plane of the mounting substrate 130 , the long side length of the transfer pad 1311 is 1.1 mm to 1.5 mm, and the short side length is 0.4 mm to 0.8 mm; along the arrangement direction of the transfer pad 1311 , the spacing between adjacent transfer pads 1311 is 0.1 mm to 0.5 mm.

[0135] The present application does not limit the size of the tube shell (including length and width), and the size of the tube shell can be set according to the requirements of the laser. For example, the size of the tube shell is 10.6 mm × 6.4 mm.

[0136] Figure 31 is a top plan view of another laser provided in an embodiment of the present application. Unlike the example in Figure 11, the first type light emitting chip 1131, the second type light emitting chip 1132, and the third type light emitting chip 1133 are arranged in different positions within the tube shell shown in Figure 31. In FIG31 , the two light-emitting chips connected in series at the top are first-type light-emitting chips 1131, i.e., blue light-emitting chips, and the three light-emitting chips connected in series at the bottom are second-type light-emitting chips 1132, i.e., green light-emitting chips. Furthermore, in this example, a third-type light-emitting chip 1133 is mounted on the bottom side of the corresponding heat sink (i.e., the side near the set of connection pads 132 corresponding to the third-type light-emitting chip 1133). The metal wires corresponding to the third-type light-emitting chip 1133 extend to the top side of the heat sink as shown in the figure. Thus, the third-type light-emitting chips 1133 and their corresponding metal wires are arranged side by side along the length of the heat sink and are located in different regions along the width of the heat sink. In this case, the heat sink corresponding to the third-type light-emitting chip 1133 is elongated. By distributing the light-emitting chips and the corresponding metal wires on opposite sides of the elongated heat sink, heat conduction can be ensured by varying the area of ​​the elongated heat sink. Furthermore, the width of the heat sink can be reduced, thereby allowing more light-emitting chips to be accommodated within the limited internal space of the tube package. 11 and 31 also differ in that the metal wires of the light-emitting chips of different colors in the second tube shell are different, the corresponding transfer pads 1311 on the mounting substrate 130 are different, and the on-board connection lines 1301 connected through the transfer pads 1311 on the mounting substrate 130 are also different.

[0137] In some examples, as shown in Figures 11 and 31, the number of temperature detection components NTC (such as thermistor 134) can be one, which is disposed on the mounting substrate 130 and located between the first tube shell and the second tube shell, and is used to measure the temperature rise of the area between the two tube shells to reflect the temperature rise data of the light-emitting chips in the two tube shells.

[0138] In some implementations, the two electrodes of the temperature detection component and the multiple electrodes of the light-emitting chips are arranged in the same place, and are located on either side of the multiple electrodes of the multiple light-emitting chips. As shown in Figure 11, the temperature detection component NTC is also provided with corresponding connection pads 132d on the mounting substrate 130. There are two connection pads 132d, one on either side of the corresponding connection pads of the multiple light-emitting chips. This allows for a longer wiring path for the temperature detection component, but can shorten the wiring paths for different light-emitting chips, improving power supply reliability.

[0139] FIG32 is a schematic diagram of a top-down planar structure of another laser provided in an embodiment of the present application. In some embodiments, referring to FIG32 , the laser 10 includes a first tube shell 110 and a second tube shell 120, wherein the composition structure of the first tube shell 110 and the second tube shell 120, as well as the relevant introduction to the electrical connection between the first tube shell 110 and the second tube shell 120 and the mounting substrate can be referred to the relevant description of the laser corresponding to FIG11 . Also, the electrical connection relationship between the second tube shell 120 and the mounting substrate in the example of FIG32 can also be referred to the relevant introduction in the example of FIG4 , which will not be repeated here. Compared with the laser illustrated in FIG11 , in the example of FIG32 , the connection method between the metal wires of the multiple red light-emitting chips of the second tube shell 120 and the heat sink is different from that in the example of FIG4 .

[0140] Referring to FIG32 , the second tube shell 120 includes a first-type light-emitting chip 1131 and a second-type light-emitting chip 1132. During the series connection of multiple first-type light-emitting chips 1131 and multiple second-type light-emitting chips 1132, one light-emitting chip is connected to the side of the heat sink of an adjacent light-emitting chip via a metal wire, as shown in the heat sink side region 112B in FIG32 . This connection method requires sufficient space in the width direction of the heat sink, thereby reserving a bonding position in the side region of the heat sink to connect the metal wires of adjacent light-emitting chips thereto. This connection method provided in this example can provide a better heat conduction and radiation path for the light-emitting chip, because generally, the wider the width of the heat sink, the longer the heat conduction path to the outside of the light-emitting chip, but this usually results in an increase in the length of the tube shell.

[0141] As for the first tube shell 110, it includes multiple third-type light-emitting chips, all of which are connected in series. Unlike the second tube shell 120, the metal wire of one third-type light-emitting chip is connected to the rear end of the heat sink 112 of an adjacent third-type light-emitting chip, as shown in the heat sink rear end area 112A in Figure 32. It should be noted that the front end and rear end of the heat sink are relative to the light-emitting end face of the light-emitting chip, or relative to the setting position of the reflective component 150. On the heat sink, the heat sink area close to the light-emitting end face of the light-emitting chip 113, or the heat sink area close to the reflective component 150, is called the front end of the heat sink, and the heat sink area far from the light-emitting end face of the light-emitting chip, or far from the reflective component, is called the rear end of the heat sink. In the connection method provided in this example, the heat sink is in the form of an elongated strip, that is, it is narrower in width than the heat sink in the first tube shell 110 in the example of FIG32 . By providing a heat sink in the form of an elongated strip, a certain heat sink heat conduction area can be provided, and when the same number of light-emitting chips are arranged, the size can be reduced accordingly along the arrangement direction of the light-emitting chips, that is, along the length direction of the tube shell. In some examples, the size of the tube shell in the length direction is reduced, which will only slightly increase or even not increase the size of the tube shell in the width direction. In addition, in some examples, the elongated strip heat sink structure can also ensure a reasonable spacing between the light-emitting chips without changing the size of the tube shell, thereby arranging more light-emitting chips in a limited space.

[0142] Figure 33 is a schematic diagram of the internal structure of a tube shell in a laser device according to an embodiment of the present application. For better illustration, referring to Figure 33 , H represents the width of heat sink 112, and L represents the length of heat sink 112. A represents the distance between the central axes of the two light-emitting chips, which can also be considered the distance between the two light-emitting chips.

[0143] In this example, the outer contour of the sidewall 140 of the tube shell is rectangular. In some examples, the tube shell has a length dimension of approximately 8.5 mm to 9.0 mm, a width dimension of 5.9 mm to 6.9 mm, and a wall thickness of approximately 1 mm.

[0144] The sidewall 140 of the housing has a certain thickness, and the projection of the inner space of the sidewall 140 is also approximately rectangular, hereinafter referred to as the inner rectangle. The inner rectangle is approximately 5.5 mm long and approximately 3.5 mm to 4.5 mm short, forming a roughly similar shape to the outer rectangular outline of the housing.

[0145] Along the length direction of the sidewall 140 of the tube shell, or the length direction of the rectangle inside the tube shell, such as the X direction shown in FIG. 33 , a plurality of heat sinks 112 are arranged in rows, with a gap between two adjacent heat sinks 112 .

[0146] In some examples, the spacing between the multiple heat sinks is 1.0 mm to 1.25 mm. Taking one of the heat sinks as an example, the width H of the heat sink is 0.85 mm to 0.95 mm.

[0147] The width of heat sink 112 is related to the size of light-emitting chip 113 and the processing requirements. In some specific examples, the width of light-emitting chip 113 above heat sink 112 is approximately 500 μm, and the AuSn solder layer used to solder the light-emitting chip to the heat sink is approximately 550 μm to 600 μm wide. In some examples, a Zener diode is also required on the heat sink as the aforementioned anti-static device. The Zener diode is arranged in parallel with the light-emitting chip, so the width of heat sink 112 is at least greater than the width of the light-emitting chip and the Zener diode.

[0148] According to the above description, a reflective component 150 is further provided in front of the light emitting chip 113 . The light emitting chip 113 and the reflective component 150 are arranged along the width direction of the tube shell, or in other words, along the short side direction of the rectangle inside the tube shell.

[0149] The length direction of the heat sink 112 is parallel to the width direction of the sidewall 140 of the package or the short side direction of the rectangle inside the package (the Y direction in the figure).

[0150] In some examples, a ratio of the length of the heat sink 112 to the width of the heat sink 112 is set between 1-3.5.

[0151] In some embodiments, the ratio of the length of the heat sink 112 to its width is between 1.5 and 3.5. In one specific embodiment, L = 2.1 mm and H = 0.65 mm, resulting in a ratio of 3.2 for the length of the heat sink 112 to its width. The heat sink is in a long, thin strip shape, suitable for situations where a Zener diode is not present, such as a red light-emitting chip, or suitable for arranging Zener diodes and light-emitting chips along the length of the heat sink. With the above arrangement, given the same internal space and spacing within the tube shell, the smaller the width of the heat sink, the more light-emitting chips can be arranged, thereby increasing the density of the light-emitting chips, the higher the capacity of the light-emitting elements within the tube shell, and the higher the optical power. However, the higher the density of the light-emitting chips, the higher the heat dissipation requirements. Therefore, in the above situation, the heat sink can be made of a material with a higher thermal conductivity, such as diamond copper. Alternatively, the tube shell base plate and the heat sink can be integrated, using the same material to reduce the thermal resistance problem caused by the combination of different materials.

[0152] In another specific implementation, L=1.7mm, H=1.1mm, and the ratio of the length of the heat sink 112 to the width of the heat sink 112 is 1.5, then the shape of the heat sink is approximately square, which is conducive to arranging the Zener diode and the light-emitting chip side by side. In addition, since the heat conduction of the light-emitting chip is in multiple directions, downward and outward, the closer the shape of the heat sink is to a centrally symmetrical figure, the better the balance of the heat conduction of the light-emitting chip in all directions. For example, in the above example, the dimensions of the long side and the short side of the heat sink are comparable, such as a square, or the shape of the heat sink is circular, or the shape of the heat sink is polygonal. In this example, in order to increase the arrangement density of the light-emitting chips, when the width of the heat sink is larger than that of the previous example, it is possible to consider reducing the spacing between adjacent heat sinks. For example, in this example, the spacing between the heat sinks can be 1.0mm, which can also increase the number of light-emitting chips accommodated under the same space conditions within the tube shell.

[0153] Through the above embodiments, a high-power laser light-emitting component can be provided.

[0154] FIG34 is a schematic diagram of the cross-sectional structure of a tube shell in a laser provided in an embodiment of the present application; FIG35 is a schematic diagram of the exploded structure of a tube shell in a laser provided in an embodiment of the present application.

[0155] As shown in FIG35 , the laser 10 further includes a lens assembly 170 and a reflective component 150. The sidewall 140 of the housing is annular and surrounds the plurality of heat sinks 112, the plurality of light-emitting chips 113, and the plurality of reflective components 150. The lens assembly 170 is located on the side of the housing sidewall 140 away from the mounting substrate 130. The upper portion of the housing sidewall 140 is connected to the light-transmitting component 160 to form a sealed space.

[0156] The multiple light-emitting chips 113 correspond one-to-one to the multiple reflective components 150, and each reflective component 150 is located on the light-emitting side of the corresponding light-emitting chip 113. The reflective component 150 is used to reflect the light emitted by the corresponding light-emitting chip 113 to the lens assembly 170 corresponding to the light-emitting chip 113, and then the lens assembly 170 collimates the light. Among them, the reflective component 150 can be specifically a reflective prism, or a reflective lens with a supporting structure. The reflection point position of a reflective component 150 corresponds to the center of a corresponding collimating lens in the lens assembly 170. In this example, the multiple light-emitting chips 113 correspond one-to-one to the multiple reflective components 150, and the multiple reflective components 150 correspond one-to-one to the multiple collimating lens units in the lens assembly 170, so that the number of light-emitting chips 113 is the same as the number of reflective components 150 and the number of collimating lens units in the lens assembly 170.

[0157] Some embodiments of the housing will be described below with reference to the accompanying drawings.

[0158] FIG34 is a cross-sectional view of the tube shell viewed from above. As shown in FIG33 , the sidewall 140 of the tube shell has a thickness, and a plurality of conductive areas 124 are formed inside the tube shell.

[0159] 4 and 5 , a plurality of packages are disposed on a mounting substrate 130 .

[0160] 6, for each tube shell, the light emitting assembly consisting of a heat sink and a light emitting chip, a lens assembly 170 and a reflective component 150 are arranged in an accommodation space. The tube shell has a certain height and is connected to the tube shell bottom plate and the light-transmitting component to form the above-mentioned accommodation space.

[0161] 35 , the sidewall 140 of the housing has an upper surface 122 and a plurality of outer side surfaces. When viewed from above, the outer contour of the sidewall 140 of the housing is rectangular, and the inner contour of the sidewall 140 of the housing is also rectangular.

[0162] In some embodiments, the sidewall 140 of the housing is made of a ceramic material. The sidewall 140 of the housing is not limited to ceramic and may also be formed primarily of a metal or a composite containing a metal. For example, among ceramics, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide may be used as the primary material for the sidewall 140 of the housing.

[0163] The sidewall 140 of the tube shell may also be made of metal materials, such as a composite of copper, aluminum, and iron, or copper-molybdenum, copper-diamond composite material, copper-tungsten, etc. as the main material of the sidewall 140 of the tube shell.

[0164] Here, the main material refers to the material that accounts for the largest proportion by mass or volume in the object being formed.

[0165] In this example, the sidewall 140 of the tube shell is made of ceramic material. As shown in FIG6 , a conductive area is formed in the inner wall of the sidewall 140 of the tube shell. The light emitting chip 113 is electrically connected to the conductive area 124 of the sidewall 140 of the tube shell.

[0166] In other embodiments, the material of the sidewall 140 of the tube shell can include one or more of oxygen-free copper and ceramic materials. When the mounting substrate 130 is a PCB board including oxygen-free copper, since oxygen-free copper has a relatively high thermal conductivity, the mounting substrate 130 can assist the heat sink 112 in conducting heat generated by the light-emitting chip 113.

[0167] In some embodiments, the number of the plurality of light emitting chips 113 is at least five, and the plurality of light emitting chips 113 are arranged in the sidewall 140 of the tube shell along a first direction, wherein the first direction is the length direction of the sidewall 140 of the tube shell.

[0168] It should be noted that such a setting not only achieves the miniaturization of the device, but also improves the thermal management efficiency, optimizes the circuit design and layout, reduces production costs, and improves the performance and reliability of the device.

[0169] The first direction may be the length direction of the side wall 140 of the tube shell, and the plurality of light emitting chips 113 may be spaced apart along the length direction of the side wall 140 of the tube shell.

[0170] As shown in FIG. 35 , X represents a first direction, ie, a length direction of the sidewall 140 of the package tube.

[0171] FIG36 is a schematic diagram of the internal structure of another tube shell in the laser provided in an embodiment of the present application.

[0172] As shown in FIG36 , the sidewall 140 of the housing has a stepped portion 126, on which a conductive region 124 is disposed. Multiple conductive regions 124 are located on a portion of the surface of the stepped portion 126 and are isolated and disconnected by an insulating region. Conductive regions 124 are used to connect the light-emitting chip 113 to the conductive traces within the sidewall 140 of the housing.

[0173] In some embodiments, the sidewall 140 of the package has one or more step portions 126 , and the conductive region 124 is disposed on the one or more step portions 126 .

[0174] As shown in FIG36 , the step portion 126 may be formed around the inner side wall of the side wall 140 of the tube shell and protrude toward the inside of the side wall 140 of the tube shell. The step portion 126 may also be located only on one inner side wall of the tube shell or two opposite inner side walls, or on two adjacent inner side walls.

[0175] FIG37 is a schematic diagram of the internal structure of another tube shell in the laser provided in an embodiment of the present application.

[0176] As shown in FIG37 , a transfer platform 1161 is further provided. The transfer platform 1161 is located on the bottom plate 116 of the tube shell between the side wall 140 of the tube shell and the light-emitting chip 113 . The transfer platform 1161 has a conductive area for connecting the metal wires of the light-emitting chip 113 and the conductive area for wiring inside the side wall 140 of the tube shell.

[0177] The transfer pad 1161 can reduce the risk of metal wire breakage in the light-emitting chip and reduce the difficulty of wire bonding. The metal wire of the light-emitting chip can first be connected to the transfer pad, and then the transfer pad is connected to the conductive area inside the tube shell wall to achieve communication between the light-emitting chip and the conductive area of ​​the tube shell.

[0178] In some embodiments, there may be multiple transfer platforms 1161 to provide transfer paths for multiple metal wires and reduce the difficulty of wire bonding.

[0179] The following describes the red light emitting chip as an example with reference to the accompanying drawings.

[0180] In this example, the ratio of the length of the heat sink 112 corresponding to the red light-emitting chip to the width of the heat sink 112 is between 1 and 1.7.

[0181] When the light-emitting chip 113 is a red light-emitting chip, the heat transferred by the light-emitting chip 113 is transmitted downward at an angle θ starting from the edge angle, that is, θ is the heat conduction angle from the light-emitting chip to the heat sink. Therefore, the width L of the heat sink is ≥ (L0 + 2tanθ * D), where L0 is the width of the light-emitting chip and D is the layer thickness of the heat sink. The layer thickness of the heat sink 112 is generally about 300μm, and the width of the light-emitting chip 113 is about 0.5mm. When heat radiation or heat transfer is transmitted at a 45° angle, the width L of the heat sink is about 1.1mm. This configuration can effectively conduct heat generated by the light-emitting chip during the light-emitting process, thereby reducing heat accumulation.

[0182] In this example, the heat sink length H = Ho * K1 + K2, where Ho is the length of the light-emitting chip, ranging from 1.2mm to 1.5mm; K1 is the capacitance coefficient, ranging from 1.06 to 1.12; and K2 is a constant, ranging from 0.05 to 0.1. In one specific implementation, Ho = 1.5mm, K1 = 1.067, and K2 = 0.05mm, resulting in a heat sink length H = 1.65mm.

[0183] In some embodiments, the ratio of the width of a heat sink 112 to the width of the sidewall 140 of the housing is between 0.05 and 0.2. It should be noted that the width of the housing here refers to the length of the short side of the outer rectangle of the housing.

[0184] The ratio of the sum of the widths of all the heat sinks 112 to the width of the sidewall 140 of the package is between 0.4 and 0.8.

[0185] Through the above configuration, the capacity of the heat sink 112 in the inner space of the side wall 140 of the tube shell can be increased, thereby facilitating the arrangement of more light-emitting chips.

[0186] Furthermore, since the heat conduction performance of the heat sink is generally better than that of the shell base plate and the shell, the capacity of the heat sink in the shell is improved, which is also conducive to accelerating heat conduction in the limited shell space.

[0187] In some specific implementations, the width of the heat sink 112 is 1.05 mm, the width of the sidewall 140 of the housing is 8.5 mm, and the ratio of the width of the heat sink 112 to the width of the sidewall 140 of the housing is 0.12.

[0188] In some other specific implementations, the width of the heat sink 112 is 0.8 mm, and the ratio of the width of the heat sink 112 to the width of the sidewall 140 of the tube shell is 0.09.

[0189] Furthermore, the total width of the heat sink 112 may be limited according to the number of light-emitting chips 113 actually mounted.

[0190] In some implementations, a ratio of the width of the heat sink 112 to the width of the sidewall 140 of the housing is between 0.07 and 0.12.

[0191] In some implementations, a ratio of the width of the heat sink 112 to the width of the sidewall 140 of the package is between 0.1 and 0.15.

[0192] In some examples, the width of the sidewall 140 of the tube shell is 8.5 mm, and the width of the heat sink 112 is between 0.6 mm and 1 mm, so that five light-emitting chips 113 can be mounted. In this case, the ratio of the width of a heat sink 112 to the width of the sidewall 140 of the tube shell is between 0.07 and 0.12.

[0193] In theory, increasing the width of the heat sink 112 and the corresponding width of the tube shell's sidewall 140 is also a solution. This can improve the heat dissipation effect of the light-emitting chip, but it will increase the tube shell and, therefore, the size of the light-emitting unit. For the case of five light-emitting chips, increasing the width of the heat sink 112 and the size of the arrangement will achieve better heat dissipation. For example, if the heat sink 112 is 1.3mm wide, the tube shell's sidewall 140 needs to be increased to approximately 10mm to accommodate five light-emitting chips. In this case, the ratio of the width of a heat sink 112 to the width of the tube shell's sidewall 140 is between 0.1 and 0.15.

[0194] 33 , A represents the distance between the light-emitting points of two adjacent light-emitting chips 113. In some implementations, the ratio of the distance between the light-emitting points of two adjacent light-emitting chips 113 to the width of the sidewall 140 of the package is between 0.08 and 0.2.

[0195] The spacing between the light-emitting points is composed of two components: the size of the heat sink 112 and the spacing between the two heat sinks 112. The width of the heat sink 112 can range from 0.8mm to 1.3mm, with a larger size providing better heat dissipation. Considering process and design miniaturization, the spacing between the two heat sinks 112 can be between 0.1mm and 0.2mm. While larger spacing is possible, it is not ideal for miniaturization.

[0196] Based on this, the value of A in FIG33 can be between 0.9 mm and 1.5 mm. The ratio of the light-emitting point spacing A to the width of the sidewall 140 of the tube shell can be between 0.08 and 0.2. Within this range, the arrangement of different numbers of light-emitting chips 113 can be guaranteed, which helps to realize a miniaturized and integrated laser.

[0197] Furthermore, some embodiments of the reflective component 150 are described with reference to the accompanying drawings.

[0198] As shown in Figure 35, the laser includes a plurality of reflective components 150. In some examples, the distance between two adjacent reflective components 150 is between 0.35 mm and 0.45 mm.

[0199] The reflective component 150 is arranged on the bottom plate 116 of the tube shell, for example, by being fixed by bonding. The reflective component 150 can be a reflective prism or a reflective lens. In some embodiments, a plurality of reflective components 150 are respectively configured corresponding to a plurality of light-emitting chips 113. When a plurality of light-emitting chips are arranged in the tube shell and the plurality of light-emitting chips are arranged in a row, the distance between the emitting end face of each group of light-emitting chips 113 and the corresponding reflective component 150 is usually set to be the same, so that the positions of the reflected light-emitting points on the plurality of reflective components 150 are consistent along the arrangement direction of the light-emitting chips, and finally correspond better to the one-piece lens assembly 170, specifically to the center position of the one-piece multiple collimating lenses.

[0200] Of course, in some implementations, due to differences in light emitting characteristics of light emitting chips, the distance between the reflective component 150 and the corresponding light emitting surface of the light emitting chip can be adjusted to improve the position consistency of the light emitting point on the reflective surface.

[0201] Furthermore, in some embodiments, one reflective component 150 may be configured to correspond to a plurality of light emitting chips 113. In this case, the reflective component 150 may be in a long strip shape and have at least one reflective surface.

[0202] Reflecting member 150 includes a lower surface and a light reflecting surface for reflecting light. Furthermore, the light reflecting surface is inclined relative to the lower surface. That is, the light reflecting surface is neither perpendicular nor parallel when viewed from the lower surface. The straight line connecting the lower and upper ends of the light reflecting surface is inclined relative to the lower surface of reflecting member 150. The angle of the light reflecting surface relative to the lower surface, or the angle of the straight line connecting the lower and upper ends of the light reflecting surface relative to the lower surface, is referred to as the inclination angle of the light reflecting surface.

[0203] In the illustrated reflective member 150, the light reflecting surface is a plane and is inclined at a 45-degree angle relative to the lower surface of the reflective member 150. It should be noted that the light reflecting surface may not be a plane, for example, it may be a curved surface. Furthermore, the light reflecting surface may also have an inclination angle other than 45 degrees.

[0204] The reflective surface of the reflective member 150 is formed with a film to provide a light-reflecting function. The primary material of the reflective member 150 may be glass such as quartz or BK7 (borosilicate glass), a metal such as aluminum, or silicon. The light-reflective film may be made of a material with high light reflectivity, such as a metal such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2. Furthermore, if the reflective member 150 is primarily formed of a material with high light reflectivity, such as metal, the light-reflective film may be omitted.

[0205] The majority of the light emitted from the light-emitting chip 113 is irradiated by the corresponding light-reflecting surface of the reflective component 150. The light emitted from the light-emitting chip 113 passes through the reflective component 150, thereby lengthening the optical path length of the light incident on the lens compared to a case where the reflective component 150 is not interposed. This longer optical path length can reduce the effects of misalignment in the mounting of the reflective component 150 and the light-emitting chip 113. Alternatively, the reflective component 150 may be omitted, and the emission end face of the light-emitting chip 113 may be directed upwards toward the first housing 110.

[0206] On the light-reflecting surface, the reflectivity relative to the peak wavelength of light irradiating the light-reflecting surface is 90% or greater. Alternatively, the reflectivity may be 95% or greater. Alternatively, the reflectivity may be 99% or greater. The light reflectivity is 100% or less or lower.

[0207] In some implementations, the spacing between the reflective component 150 and the light-emitting surface of the corresponding light-emitting chip is generally designed to be between 0.2mm and 0.5mm, and preferably between 0.35mm and 0.45mm. This is not theoretically limited, but from the perspectives of application and miniaturization, this range is optimal for reflective systems.

[0208] If the distance between the reflective component 150 and the corresponding light-emitting chip's light-emitting surface is too small, for example, less than 0.2mm, the tolerance margin will be small, making the process difficult to implement. If the distance is too large, for example, greater than 0.5mm, the light beam emitted from the light-emitting chip's light-emitting surface will have a larger spot size incident on the reflective surface of the reflective component due to the divergence angle, resulting in a certain loss of optical efficiency. Therefore, considering both process and efficiency, the range of 0.35mm-0.45mm can combine the advantages of both aspects to achieve a compact and high-efficiency system.

[0209] Some embodiments of the light-transmitting component 160 are described below with reference to the accompanying drawings.

[0210] As shown in FIG6 or FIG35, in some optional embodiments, the laser 10 further includes a light-transmitting member 160, which is welded to the sidewall 140 of the housing to form a sealed space. The light-transmitting member 160 can be entirely light-transmitting, or it can be partially light-transmitting relative to the light-emitting area, such as the central area, while a light-shielding film is provided in other areas, such as the surrounding area near the welding with the housing, to prevent light transmission.

[0211] The light-transmitting member 160 is generally formed using glass as a main material, but is not limited to glass. For example, sapphire may be used as a main material.

[0212] The light-transmitting component 160 is bonded on its lower surface to the upper surface 122 of the sidewall 140 of the housing (housing upper surface 122). A metal film is applied to the bonding area between the light-transmitting component 160 and the housing sidewall 140, and the bond is secured via AuSn soldering. The second housing 120 is bonded to the housing sidewall 140 to form an enclosed space. This enclosed space is hermetically sealed. This hermetically sealed second housing 120 prevents the collection of organic matter and other substances on the light-emitting end face of the light-emitting chip 113.

[0213] Some embodiments of the lens assembly 170 are described below with reference to the accompanying drawings.

[0214] The lens assembly 170 is generally composed of a plurality of integrally formed collimating lens units.

[0215] The lens assembly 170 includes an active area and an inactive area.

[0216] In some examples, the spacing between the light-emitting points of adjacent light-emitting chips 113, as shown in Figure 33, that is, A is 1.25 mm. Correspondingly, the center distance between two adjacent collimating lens units is 1.25 mm, and the effective aperture of the lens is 3.4 mm. The ratio between the center distance of the lenses and the effective aperture of the lenses is 0.37.

[0217] In some other embodiments provided in the present application, the center distance between two adjacent collimating lens units is 1 mm, the effective aperture of the lens remains unchanged, and the ratio between the center distance of the lenses and the effective aperture of the lenses is 0.29.

[0218] 35 , the lens assembly 170 is located above the light exit path of the light-transmitting member 160. The lens assembly 170 is formed integrally with a collimating lens unit 171 having a lens shape and a rectangular base member 172 supporting the collimating lens unit 171.

[0219] The centers of the plurality of collimating lens units 171 correspond to the light exit points on the reflective surface of the reflective component 150 . Each collimating lens unit 171 collimates the light beam emitted from the corresponding light emitting chip 113 and reflected by the reflective component 150 .

[0220] The collimating lens unit 171 and the base member 172 of the lens assembly 170 are both light-transmissive. The lens assembly 170 can be formed using glass such as BK7 or B270.

[0221] In some embodiments, the lens assembly 170 may be a cylindrical lens, which is only used to collimate the divergence angle of the laser beam in one direction.

[0222] In some embodiments, the lens assembly 170 has a light incident surface and a light emitting surface, and at least one of the light incident surface and the light emitting surface has a lens structure.

[0223] The lens assembly 170 has one or more lens surfaces. The one or more lens surfaces are disposed on the upper surface side of the lens assembly 170. It should be noted that the one or more lens surfaces may also be disposed on the lower surface side of the lens assembly 170.

[0224] In some embodiments, the lens assembly 170 may be integrated with the light-transmitting component 160 .

[0225] Furthermore, the present invention also provides a schematic diagram of the internal structure of a housing. As shown in FIG38 , multiple light-emitting chips 113 are disposed inside the housing and arranged in two rows. The number of light-emitting chips in the two rows can be the same or different.

[0226] In a specific example, all the light-emitting chips 113 emit light of one color, such as red laser light. Furthermore, the center wavelengths of the multiple red light-emitting chips can be set to be different. Specifically, when there are five light-emitting chips, two light-emitting chips are set in the first row and three light-emitting chips are set in the second row. The light-emitting chips in the first and second rows are connected in series and connected to the conductive area 124 of the side wall 140 of the tube shell via metal wires. The conductive area 124 includes a pair of connecting pads to connect the positive and negative electrodes of the light-emitting chips.

[0227] In another specific embodiment, the plurality of light-emitting chips 113 include light-emitting chips of different colors, such as a blue light-emitting chip and a green light-emitting chip. Referring again to FIG. 38 , in one specific embodiment, the first row is provided with two blue light-emitting chips, all of which are connected in series and connected to the conductive area 124 of the side wall 140 of the tube shell via metal wires. Furthermore, the second row is provided with three green light-emitting chips, all of which are connected in series and connected to the conductive area 124 of the side wall 140 of the tube shell via metal wires. The conductive area 124 of the side wall 140 of the tube shell must be provided with at least two sets of connection pads, one for each of the blue light-emitting chip and the other for the green light-emitting chip.

[0228] Furthermore, in some examples, the conductive region 124 of the sidewall 140 of the package may have one positive electrode and two negative electrodes, so that the blue light-emitting chip and the green light-emitting chip share a common anode. Furthermore, in other examples, the conductive region 124 of the sidewall 140 of the package may have one negative electrode and two positive electrodes, so that the blue light-emitting chip and the green light-emitting chip share a common cathode.

[0229] In the package structure shown in FIG. 38 , by arranging the light-emitting chips in two rows, the size of the package in the longitudinal direction can be reduced.

[0230] Furthermore, it should be noted that the laser 10 described in the embodiment of the present application can be used in projectors, vehicle headlights, head-mounted displays, lighting, displays, and the like.

[0231] In addition, an embodiment of the present application also provides a laser device, including a laser light source, an optical machine, and a lens, wherein the laser light source includes the above-mentioned laser 10.

[0232] The optical machine is used to receive the light beam emitted by the laser 10. The lens is set on the optical machine, and the lens will form an image based on the light beam processed by the optical machine.

[0233] The specific structure, working principle and function of the laser 10 have been described in detail in the aforementioned embodiment 1 and will not be repeated here.

[0234] It should be noted that the laser device 200 includes a laser 10, a light valve component 20, and a lens 30. The light valve component uses, for example, a DMD (Digital Micromirror Device) chip. Furthermore, the laser device 200 also includes a main control circuit board, an audio processing system, speakers, and a heat sink.

[0235] The laser 10 is used to emit laser beams to the light valve component 20. Typically, the three-color laser beams emitted by the laser 10 undergo shaping before reaching the light valve component 20, such as by passing through a light homogenizing component 21 and a lens assembly 22, to achieve a size and angle consistent with the incident size and angle of the light valve component 20.

[0236] In the laser device 200 , the light valve component is connected to the display control chip in the main control circuit, and the main control circuit is also used to drive the laser 10 to emit light.

[0237] In this example, the laser 10 is driven to sequentially emit three-color laser beams, which are shaped by the system's optical components to form an illumination beam, which is then modulated by the light valve component 20. Driven by the display control chip, the light valve component 20 receives the three-color illumination beams and, through reflection from thousands of small mirrors on the light valve surface, projects an image beam carrying the image signal onto the lens. The lens then amplifies the image beam through a lens assembly to form an image.

[0238] In the laser device 200 provided in this example, three-color laser beams are emitted by the laser 10, so that the projected image has higher brightness and better color gamut.

[0239] As shown in FIG39 , since the laser 10 encapsulates three-color lasers of different high luminous powers through two tube shells, it occupies a small space when assembling the optical path system, and the corresponding heat dissipation components and drive control components can also be miniaturized accordingly. After the light beam is emitted from the light source, the rear-end optical path system also has the conditions for miniaturization, which is conducive to the miniaturization of the entire laser equipment.

[0240] It can be seen that the laser device includes any of the above-mentioned lasers and has corresponding beneficial effects. In order to avoid repeated description, it will not be repeated here.

[0241] FIG40 is a schematic diagram of the structure of a laser provided in an embodiment of the present application. Referring to FIG40 , a plurality of light-emitting units 100 are provided on the mounting substrate 130 of the laser, wherein the internal structure of each light-emitting unit 100 can be implemented with reference to the internal structure of any light-emitting unit described above. In one example, the plurality of light-emitting units 100 on the mounting substrate 130 are arranged in an array (e.g., two rows and two columns are used as an example in FIG40 ), and the internal structure of each light-emitting unit 100 is exactly the same, and the mounting substrate 130 has exactly the same internal structure in the area corresponding to each light-emitting unit 100; for example, each light-emitting unit 100 can have a light-emitting unit structure having a first tube shell 110 and a second tube shell 120 as shown in FIG5 , FIG6 , or FIG11 , and the mounting substrate 130 has a row of connection pads 132 corresponding to each light-emitting unit 100. In addition, not shown in FIG40 , the connection pattern of the mounting substrate 130 can include a conductive pattern corresponding to each light-emitting unit 100, and each light-emitting unit 100 is fixed to and electrically connected to the corresponding conductive pattern. In other examples, different light emitting units 100 on the same mounting substrate 130 may have different internal structures.

[0242] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0243] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0244] Those skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware, or by a program to instruct the relevant hardware, and the program may be stored in a computer-readable storage medium, which may be a read-only memory, a disk, or an optical disk, etc.

[0245] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A laser comprising: A mounting substrate, comprising a connection pattern, a plurality of connection pads and a plurality of intra-board connection lines, wherein at least four of the connection pads are electrically connected to the connection pattern through the plurality of intra-board connection lines; A light-emitting unit, the light-emitting unit comprising at least one tube shell and a plurality of light-emitting chips arranged in the at least one tube shell, the at least one tube shell being provided with a conductive structure on a side facing the mounting substrate, the connection pattern comprising a conductive pattern, the light-emitting unit being fixed on the conductive pattern and being electrically connected to the conductive pattern, at least one sidewall connecting wire being provided in a sidewall of the at least one tube shell, and at least one of the light-emitting chips being electrically connected to one of the sidewall connecting wires in the sidewall of the tube shell; Among them, the light-emitting chip in the light-emitting unit includes at least two chips with different luminous colors, the multiple connecting pads include a group of connecting pads corresponding to the light-emitting chip of each color in the light-emitting unit, each group of connecting pads includes two connecting pads, and each group of connecting pads is electrically connected to the light-emitting chip of the corresponding color.

2. The laser according to claim 1, characterized in that The light-emitting unit further includes a plurality of heat sinks corresponding to the plurality of light-emitting chips, and each of the light-emitting chips is mounted on the conductive pattern through the corresponding heat sink.

3. The laser according to claim 2, characterized in that The conductive pattern includes at least one conductive base corresponding to the at least one tube shell, and each of the light-emitting chips is mounted on the conductive base corresponding to the tube shell through the corresponding heat sink.

4. The laser according to claim 2, characterized in that The multiple light-emitting chips in each of the tube shells are arranged in at least one row, and the ratio of the length to the width of each of the heat sinks is between 1 and 3.

5.

5. The laser according to claim 4, characterized in that The ratio of the length of the heat sink to the width of the heat sink is between 1.5-3.5; or, the ratio of the length to the width of each heat sink is between 1-1.

7.

6. The laser according to claim 4 or 5, characterized in that: The length of the heat sink is H=Ho*K1+K2, where Ho is the length of the light emitting chip, K1 is the capacity coefficient, and K2 is a constant; and / or, The width L of the heat sink is ≥(L0+2tanθ*D), wherein L0 is the width of the light emitting chip, D is the thickness of the heat sink, and θ is the heat conduction angle from the light emitting chip to the heat sink.

7. The laser according to claim 2, characterized in that The ratio of the width of each heat sink to the width of the tube shell is between 0.05-0.2; and / or the ratio of the sum of the widths of the heat sinks in each tube shell to the width of the tube shell is between 0.4-0.

8.

8. The laser according to claim 7, characterized in that The ratio of the width of each heat sink to the width of the tube shell is between 0.07-0.12; and / or the ratio of the sum of the widths of the heat sinks in each tube shell to the width of the tube shell is between 0.1-0.

15.

9. The laser according to claim 1, characterized in that More than one light-emitting chip of the same color in the light-emitting unit has at least two different central wavelengths, and the difference between any two central wavelengths of the at least two different central wavelengths is greater than or equal to 3 nm.

10. The laser according to claim 9, characterized in that Any two light-emitting chips in the same tube shell have different central wavelengths.

11. The laser according to claim 9, characterized in that The number of light-emitting chips of the same color that is greater than three in the light-emitting unit has three different central wavelengths, the difference between any two of the three different central wavelengths is greater than or equal to 3nm, and the number of light-emitting chips with intermediate central wavelengths in the light-emitting unit is greater than the number of light-emitting chips with maximum central wavelengths in the light-emitting unit and the number of light-emitting chips with minimum central wavelengths in the light-emitting unit.

12. The laser according to claim 9, characterized in that The light-emitting unit comprises two tube shells, wherein the light-emitting chips in one tube shell are arranged in a row with increasing central wavelengths, and the light-emitting chips in the other tube shell are arranged in a row with decreasing central wavelengths in the same direction.

13. The laser according to claim 1, characterized in that Each of the light-emitting chips has a plurality of light-emitting points, and the ratio of the distance between the light-emitting points of two adjacent light-emitting chips in the same tube shell to the width of the tube shell is between 0.08-0.2; and / or, The light-emitting unit further comprises a plurality of reflective components arranged in the at least one tube shell, and the distance between two adjacent reflective components in the same tube shell is between 0.35 mm and 0.45 mm.

14. The laser according to claim 1, characterized in that The orthographic projections of the plurality of connection pads in the plane where the mounting substrate is located at least partially overlap with the orthographic projections of the plurality of intra-board connection lines in the plane where the mounting substrate is located, the orthographic projections of the connection pattern in the plane where the mounting substrate is located at least partially overlap with the orthographic projections of the plurality of intra-board connection lines in the plane where the mounting substrate is located, and the orthographic projections of the conductive structure in the plane where the mounting substrate is located at least partially overlap with the orthographic projections of the connection pattern in the plane where the mounting substrate is located; In the plane where the mounting substrate is located, the plurality of connection pads are located on the same side of the mounting substrate.

15. The laser according to claim 14, characterized in that The length of each of the connecting pads in the arrangement direction of the multiple connecting pads is 1.3 mm to 1.7 mm; along the arrangement direction of the multiple connecting pads, the spacing between adjacent connecting pads is 0.8 mm to 1.2 mm.

16. The laser according to any one of claims 1 to 15, characterized in that Each of the light-emitting chips is one of the first type of light-emitting chip, the second type of light-emitting chip and the third type of light-emitting chip, each of which emits light of different colors; The light-emitting chips of the same color located in the same tube shell are connected in series and are respectively connected to two connection pads in a corresponding group of connection pads; Among them, the number of connecting pads corresponding to each tube shell is twice the number of color types of the light-emitting chip in the tube shell, the two connecting pads in each group of connecting pads are respectively a positive polarity pad and a negative polarity pad, and the two connecting pads in a group of connecting pads connecting the light-emitting chip of the same color are adjacent to each other.

17. The laser according to claim 16, characterized in that The conductive structure includes a plurality of bottom pads, the conductive pattern includes a plurality of transfer pads, the plurality of transfer pads are electrically connected to the plurality of bottom pads of the conductive structure in a one-to-one correspondence, and at least one of the plurality of bottom pads is electrically connected to one of the side wall connection lines in the side wall of the tube shell.

18. The laser according to claim 16, characterized in that The light emission wavelength of the third type of light emitting chip is greater than the light emission wavelengths of the first type of light emitting chip and the second type of light emitting chip; At least one of the light-emitting units comprises a first tube shell and a second tube shell arranged side by side, each light-emitting chip in the first tube shell is a light-emitting chip of the third type, and each light-emitting chip in the second tube shell is one of the light-emitting chip of the first type and the light-emitting chip of the second type.

19. The laser according to claim 18, characterized in that The light-emitting unit also includes a plurality of heat sinks corresponding one-to-one to the plurality of light-emitting chips, each of the light-emitting chips is mounted on the conductive pattern through the corresponding heat sink, and each of the third-type light-emitting chips is mounted on one side of the corresponding heat sink close to a group of connecting pads corresponding to the third-type light-emitting chip.

20. The laser according to claim 18, characterized in that The light-emitting unit also includes a plurality of heat sinks corresponding to the plurality of light-emitting chips one by one, each of the light-emitting chips is mounted on the conductive pattern through the corresponding heat sink, and a Zener diode is provided on the heat sink corresponding to the first type of light-emitting chip and the heat sink corresponding to the second type of light-emitting chip.

21. The laser according to claim 16, characterized in that Each of the light-emitting units includes a plurality of tube shells, a plurality of light-emitting chips in each of the tube shells have the same color, and an arrangement direction of the plurality of tube shells is the same as an arrangement direction of the plurality of connection pads.

22. The laser according to claim 16, characterized in that The plurality of light-emitting chips in the at least one tube shell may have three colors.

23. A laser device, characterized in that: It comprises the laser, light valve assembly and lens as described in any one of claims 1 to 22.

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