Assembly for an electronic computing device, comprising at least one power module and a heat sink for cooling the power module

Abstract

The invention relates to an assembly (10) for an electronic computing device, comprising at least one power module (12) and a heat sink (14) for cooling the power module (12), characterized in that a steam chamber device (44) is formed between the power module (12) and the heat sink (14), with at least one side (36) of the steam chamber device (44) being delimited by the power module (12), and at least one further side (50) of the steam chamber device (44) being delimited by the heat sink (14).

Description

[0001] Description

[0002] Arrangement for an electronic computing device with at least one power module and a heat sink for cooling the power module

[0003] The following invention relates to an arrangement for an electronic computing device with at least one power module and a heat sink for cooling the power module.

[0004] Power electronic modules are increasingly characterized by extreme power densities. This poses the challenge of effectively dissipating the resulting heat loss. A key weak point in the structures is the transition between the power module and the heat sinks, which are required for convective heat dissipation to air. These interfaces generally represent a limiting factor.

[0005] In the prior art, this problem is countered, for example, by taking the limitations into account and designing the overall system accordingly. For example, the power loss density is limited or the heat transfer surfaces are made correspondingly large. Furthermore, the connection of the modules via large-area soldered or sintered connections and with thermally conductive pastes is known. Furthermore, the heat sink, particularly in the so-called interface area, can be made of materials with very good thermal conductivity. Furthermore, non-overlapping surface vapor chamber devices for lateral heat spreading in the heat sink are known.

[0006] The object of the present invention is to create an arrangement that achieves improved heat dissipation of a power module of an electronic computing device. This object is achieved by an arrangement according to the independent patent claim. Advantageous embodiments are specified in the subclaims.

[0007] One aspect of the invention relates to an arrangement for an electronic computing device with at least one power module and a heat sink for cooling the power module.

[0008] It is provided that a vapor chamber device is formed between the power module and the heat sink, wherein at least one side of the vapor chamber device is delimited by the power module and at least one further side of the vapor chamber device is delimited by the heat sink.

[0009] In particular, a cross-interface vapor chamber device, also referred to as vapor chamber, can be realized for a thermally optimized heat flow by eliminating contact-related thermal resistances.

[0010] In the current technology, where the power module is not bonded to the heat sink, the surfaces to be joined can only be brought closer together to a limited extent, which is why a compensation medium is necessary to close the gap. This is usually achieved using thermal pastes or gap pads, which are associated with increased thermal contact resistance and problematic long-term stability of the connection due to aging and extrusion of the material. Large-area metallurgical connection using soldered / sintered joints, on the other hand, places high process-technological demands on low defects (for example, avoiding defects such as voids). In addition, the stability of this guide with regard to thermo-mechanical loads is critical.The use of heat sink inlays made of copper and special materials as well as the integration of non-interface-spanning near-surface vapor chambers improves the heat spreading, but not the previously mentioned challenges regarding the transition between the solid-state interfaces.

[0011] The inventive solution offers a significant performance increase by addressing all of the aforementioned problems. In particular, the cross-boundary vapor chamber allows for optimized heat transfer between the power module and the heat sink.

[0012] In particular, the solid-state interfaces can be eliminated by designing a common vapor chamber between the power module and the heat sink. Furthermore, lateral heat spreading is improved by expanding the condensation surface within the heat sink. Furthermore, functional integration of the lower metallization layer of the power module can be achieved by designing it as an upper half-shell, particularly on the evaporation side, with the appropriate topography. Furthermore, a production-friendly design for the use of a cover plate joined to the heat sink can also be realized.

[0013] Cooling using a vapor chamber is a heat distribution technique that utilizes the evaporation and condensation of liquid to cool an electronic component. In particular, the vapor chamber device is combined with the heat sink to support the cooling process.

[0014] The vapor chamber device is therefore basically a flat metal housing lined with a wick structure. The vapor chamber device is filled with a small amount of liquid, in particular the fluid, and vacuum sealed. The low pressure within the vapor chamber device allows the liquid to evaporate at temperatures below the normal boiling point. When the vapor chamber device is heated by an electronic component, such as the power module, the liquid evaporates. This vapor then circulates by convection and moves freely through the vapor chamber device. When it encounters a cool surface, in particular the heat sink, it condenses and gives off the absorbed heat. The condensed liquid then moves through the wick material and back to the warmer side.And this process continues as long as the electronic component , especially the power module , is hot .

[0015] According to an advantageous embodiment, cooling fins are formed on the side of the power module. In particular, the cooling fins protrude at least partially into the vapor chamber device. This allows an increase in the surface area of ​​the side to be achieved. Furthermore, the cooling fin structure can improve the capillary action of the

[0016] A steam chamber device can be realized. The cooling fins can also be column-shaped. In particular, this allows for increased heat input from the power module into the steam chamber device. This allows for increased heat dissipation.

[0017] A further advantageous embodiment provides for additional cooling fins to be formed on the other side of the heat sink. Thus, the surface area on the heat sink side can also be increased accordingly, particularly in the direction of the vapor chamber device. This allows for improved heat transfer from the vapor chamber device to the heat sink, thereby enabling greater heat dissipation of the assembly.

[0018] It has also proven advantageous if the side facing the power module has a smaller surface area than the other side facing the heat sink. In particular, this allows the heat sink to be larger than the power module. This allows for improved heat dissipation from the power module to the heat sink.

[0019] In a further advantageous embodiment, a sealing element is arranged at at least one contact point between the power module and the heat sink. In particular, the power module and the heat sink are thus formed in multiple pieces. In particular, a sealing element is then arranged between the power modules in the heat sink, so that the vapor chamber device can be sealed. This prevents fluid loss and, at the same time, improves heat transfer from the power module to the heat sink.

[0020] It has also proven advantageous if the power module has at least one metallic component, and the metallic component forms the side facing the steam chamber device. In particular, the power module has a plurality of different layers. The metallic component is to be regarded in particular as the lower layer of the power module and essentially protrudes into the steam chamber device or forms one side of the steam chamber device. Thus, improved heat transfer into the steam chamber device can be achieved directly via the metallic component.

[0021] It has also proven advantageous if the metallic component is made of copper. In other words, the side that shares the vapor chamber device with the power module is made of copper. Copper has a very high coefficient of thermal conductivity, so that the heat that is generated, for example, by the power chip of the power module can be transferred more effectively via the metallic component, in particular the copper component, into the vapor chamber device. It has also proven advantageous if the metallic component is electrically insulated from a power chip of the power component. In particular, this can prevent currents within the power chip or voltages within the power chip from being transferred via the metallic component into the vapor chamber device. This can prevent short circuits in particular.

[0022] In a further advantageous embodiment, the electrical insulation is formed as a ceramic layer. Ceramic, in particular, has a very good heat transfer coefficient and, at the same time, an insulating effect. Thus, the heat from the power module, in particular from the power chip, can be transferred reliably and without heat transfer loss to the vapor chamber device and thus to the heat sink. This allows for improved cooling of the power module.

[0023] A further advantageous embodiment provides for the heat sink to be made of aluminum. Aluminum, in particular, is very cost-effective and lightweight, yet still has a suitable thermal conductivity coefficient to ensure reliable heat dissipation of the power module.

[0024] According to a further advantageous embodiment, the power module is soldered to the heat sink at the contact point. This allows a reliable connection between the power module and the heat sink to be realized. Furthermore, reliable heat transfer can be achieved via the soldering point. Furthermore, a seal between the power module and the heat sink can be reliably realized via the soldering point, so that the vapor chamber device can be operated reliably. It is also advantageous if a sintered connection is formed between the power module and the heat sink at the contact point. This allows a reliable connection between the power module and the heat sink to be realized. Furthermore, reliable heat transfer can be realized via the sintered connection.Furthermore, the sintered connection can reliably create a seal between the power module and the heat sink, so that the vapor chamber device can be operated reliably.

[0025] In a further advantageous embodiment, the heat sink has an elevation on one edge of the other side, wherein the power module can be arranged on the elevation. In particular, the heat sink has a receiving area which is designed to receive the power module essentially in areas. For this purpose, the elevation is again provided on the edge of this receiving area. This can prevent the power module from being received entirely in the receiving area. In this way, a distance can be created between the heat sink and the power module, which distance in turn then forms the receiving area for the cooling fluid of the steam chamber device. In this way, improved cooling of the power module can be achieved.

[0026] In a further advantageous embodiment, it is provided that the arrangement has at least one connecting element which connects the side of the power module to the elevation. In particular, since the power module is significantly smaller in area than the heat sink, a connection can be created via the connecting element which can simultaneously be used as part of the steam chamber device and continues to reliably form a connection and thus a seal between the heat sink and the power module. Furthermore, it can be provided that the at least one connecting element has further cooling fins on a side facing the steam chamber device. In particular, the cooling fins then project into the steam chamber device. In this way, the surface area can be increased and heat can also be transferred via the connecting element into the steam chamber device.This allows for improved heat dissipation of the power module.

[0027] A further aspect of the invention relates to an electronic computing device having an arrangement according to the preceding aspect. An electronic computing device can be considered, in particular, a control device and / or power electronics.

[0028] Advantageous embodiments of the arrangement are to be regarded as advantageous embodiments of the electronic computing device.

[0029] A computing unit can be understood, in particular, as a data processing device that contains a processing circuit. The computing unit can therefore, in particular, process data to perform computing operations. This may also include operations for performing indexed access to a data structure, for example, a look-up table (LUT).

[0030] The computing unit can in particular contain one or more computers, one or more microcontrollers and / or one or more integrated circuits, for example one or more application-specific integrated circuits (AS ICs), one or more field-programmable gate arrays (FPGAs), and / or one or more single-chip systems (SoCs). The computing unit can also contain one or more processors, for example one or more microprocessors, one or more central processing units (CPUs), one or more graphics processing units (GPUs), and / or one or more signal processors, in particular one or more digital signal processors (DSPs).The computing unit may also include a physical or virtual network of computers or other of the aforementioned units.

[0031] In various embodiments, the computing unit includes one or more hardware and / or software interfaces and / or one or more memory units.

[0032] A memory unit can be a volatile data memory, for example a dynamic random access memory (DRAM) or a static random access memory (SRAM), or a non-volatile data memory, for example a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a flash memory or flash EEPROM, a ferroelectric random access memory (FRAM), a magnetoresistive random access memory,MRAM (magnetoresistive random access memory) or phase-change random access memory, PCRAM (phase-change random access memory).

[0033] Regardless of the grammatical gender of a particular term, persons of male, female, or other gender identity are included. Further features and combinations of features of the invention emerge from the figures and their description, as well as from the claims. In particular, further embodiments of the invention do not necessarily have to contain all features of one of the claims. Further embodiments of the invention may have features or combinations of features that are not mentioned in the claims.

[0034] Showing:

[0035] FIG 1 is a schematic sectional view of an embodiment of an arrangement in an unassembled state; and

[0036] FIG 2 shows a further schematic sectional view of an embodiment of the arrangement in an assembled state.

[0037] The invention is explained in more detail below with reference to specific exemplary embodiments and associated schematic drawings. In the figures, identical or functionally equivalent elements may be provided with the same reference numerals. The description of identical or functionally equivalent elements may not necessarily be repeated for different figures.

[0038] FIG. 1 shows a schematic sectional view of an embodiment of an arrangement 10 for an electronic computing device (not shown). In particular, the arrangement 10 is shown in an unassembled state.

[0039] In the present exemplary embodiment, the arrangement 10 comprises, in particular, a power module 12 and a heat sink 14. In the present exemplary embodiment, the power module 12 is formed, in particular, by a printed circuit board 52 and a power chip 16. The power chip 16 is coupled to the printed circuit board 52 via a corresponding contact 18. For this purpose, corresponding components 20, for example, the gate and source, of the power chip 16 are coupled, in particular, to the printed circuit board 52.

[0040] The power chip 16 is in turn coupled to a first metallic component 22. The first metallic component 22 serves in particular to absorb the heat of the power chip 16.

[0041] The first metallic component 22 is in turn formed with a ceramic layer 24. The ceramic layer 24, in particular, forms electrical insulation for the power chip 16.

[0042] Furthermore, the ceramic layer 24 is in turn coupled to a second metallic component 26. Connecting elements 28 are also shown.

[0043] Furthermore, it is shown that the heat sink 14 has at least one elevation 30. The elevation 30 is in turn designed to correspond with the second metallic component 26 in a first exemplary embodiment or, in the present exemplary embodiment, to correspond with the connecting elements 28.

[0044] Furthermore, the present exemplary embodiment shows that, for example, the second metallic component 26 can be coupled to the connecting elements 28 via a first sealing element 32. This can be realized, for example, in the form of a soldered connection or a sintered connection.

[0045] Furthermore, the present exemplary embodiment shows that the connecting elements 28 can be connected to the heat sink 14 via a further sealing component 34. This also serves, in particular, as a seal, and can also be provided as a soldered connection or as a sintered connection. The first metallic component 22, the second metallic component 26, and the connecting elements 28 can be formed, in particular, from copper. The heat sink 14 is preferably formed from aluminum.

[0046] Furthermore, FIG. 1 shows that at least one side 36, in particular on the second metallic component 26, has cooling fins 38. Furthermore, the heat sink 14 can also have additional cooling fins 40. Furthermore, the present exemplary embodiment shows that the connecting elements 28 can also have additional cooling fins 42.

[0047] FIG. 2 again shows the arrangement from FIG. 1 in the assembled state. In particular, FIG. 2 shows that a vapor chamber device 44 is now formed between the power module 12 and the heat sink 14. In particular, a corresponding fluid 46 is provided in an interior space between the power module 12 and the heat sink 14, which fluid is in turn designed for the operation of the vapor chamber device 44. Corresponding arrows 48 in FIG. 2 show in particular a heat transfer from the power module 12 to the heat sink 14.

[0048] In particular, it is thus provided that at least the side 36 of the steam chamber device 44 is delimited by the power module 12 and a further side 50 of the steam chamber device 44 is delimited by the heat sink 14.

[0049] Furthermore, FIG. 2 shows that the side 36 facing the power module 14 has a smaller area than the other side 50 facing the heat sink 14.

[0050] In particular, Figures 1 and 2 show an elimination of the solid-state interfaces by designing a common vapor chamber, in particular the vapor chamber device 44, between the power module 12 and the heat sink 14. This enables an improvement in lateral heat spreading by expanding the contact area within the heat sink 14. Furthermore, a functional integration of the lower metallization layer of the power module 12 can be realized by designing it as an upper half-shell, in particular as an evaporation side, with corresponding topography, for example with the cooling fins 38. Furthermore, the production-ready design can also be carried out by application to a cover plate joined to the heat sink 14.

[0051] Reference symbol list

[0052] 10 Arrangement

[0053] 12 Power module

[0054] 14 heat sinks

[0055] 16 power chips

[0056] 18 Connection

[0057] 20 components

[0058] 22 first metallic component

[0059] 24 ceramic layer

[0060] 26 second metallic component

[0061] 28 Connecting element

[0062] 30 Survey

[0063] 32 Sealing element

[0064] 34 additional sealing element

[0065] 36 pages

[0066] 38 cooling fins

[0067] 40 additional cooling fins

[0068] 42 additional cooling fins

[0069] 44 Steam chamber device

[0070] 46 Fluid

[0071] 48 Heat transfer

[0072] 50 more pages

[0073] 52 circuit board

Claims

Patent claims 1. Arrangement (10) for an electronic computing device with at least one power module (12) and a heat sink (14) for cooling the power module (12), characterized in that a steam chamber device (44) is formed between the power module (12) and the heat sink (14), wherein at least one side (36) of the steam chamber device (44) is delimited by the power module (12) and at least one further side (50) of the steam chamber device (44) is delimited by the heat sink (14).

2. Arrangement (10) according to claim 1, characterized in that cooling fins (38) are formed on the side (36) of the power module (12).

3. Arrangement (10) according to claim 1 or 2, characterized in that further cooling fins (40) are formed on the further side (50) of the heat sink (14).

4. Arrangement (10) according to one of the preceding claims, characterized in that the side (36) towards the power module (12) has a smaller area than the further side (50) towards the heat sink (14).

5. Arrangement (10) according to one of the preceding claims, characterized in that a sealing element (32) is arranged at at least one contact point of the power module (12) with the heat sink (14).

6. Arrangement (10) according to one of the preceding claims, characterized in that the power module (12) forms at least one metallic component (22, 26) as a boundary to the steam chamber device (44).

7. Arrangement (10) according to claim 6, characterized in that the metallic component (22, 26) is made of copper.

8. Arrangement (10) according to one of claims 6 or 7, characterized in that the metallic component (22, 26) is electrically insulated from a power chip (16) of the power module (12).

9. Arrangement (10) according to claim 8, characterized in that the electrical insulation is formed as a ceramic layer (24).

10. Arrangement (10) according to one of the preceding claims, characterized in that the heat sink (14) is made of aluminum.

11. Arrangement (10) according to one of the preceding claims, characterized in that the power module (12) is soldered to the heat sink (14) at a contact point.

12. Arrangement (10) according to one of claims 1 to 10, characterized in that a sintered connection between the power module (12) and the heat sink (14) is formed at a contact point.

13. Arrangement (10) according to one of the preceding claims, characterized in that the heat sink (14) has an elevation (30) on one edge of the further side, wherein the power module (12) can be arranged on the elevation (30).

14. Arrangement (10) according to claim 13, characterized in that the arrangement (10) has at least one connecting element (28) which connects the side (36) facing the power module (12) to the elevation (30).

15. The arrangement (10) according to claim 14, characterized in that the at least one connecting element (28) has further cooling fins (42) on a side facing the steam chamber device (44).

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