Wafer transfer device

Abstract

This wafer transfer device is provided with: a wafer transfer chamber for performing wafer exchange between a FOUP in which a wafer is stored and a processing device for processing the wafer; an FFU chamber installed above the wafer transfer chamber in the vertical direction and provided with an FFU for supplying inert gas into the wafer transfer chamber; an electrical chamber which is installed above the FFU chamber in the vertical direction and in which a power supply and an electrical component are housed; a suction port provided on the floor side of a side surface of the electrical chamber to take in cooling air from the outside into the electrical chamber; and a partition plate provided above the suction port in the vertical direction and below the electrical component in the vertical direction so that the cooling air flows along the floor of the electrical chamber. Thus, there is provided a wafer transfer device capable of efficiently cooling a power supply and an electrical component in an electrical chamber and suppressing the transfer of heat of the electrical chamber to an FFU chamber compared with conventional configurations.

Description

Wafer Transfer Device

[0001] The present invention relates to a wafer transport device.

[0002] As an example of a transfer chamber that can transport objects in a clean state even when gas is circulated inside, Patent Document 1 describes a transfer chamber that is an EFEM device for transferring objects to and from a processing device using a transfer robot inside a housing.The housing has a transfer space that houses the transfer robot, a gas processing space that houses a gas processing device, and a gas return space that can return gas from the transfer space to the gas processing space, and the transfer space, gas processing space, and gas return space are connected to form a single sealed space, constituting a circulation path, and multiple fans are provided in the circulation path to create a circulating flow.

[0003] Japanese Patent Application Laid-Open No. 2021-7172

[0004] The wafer transport device is a machine that transports wafers stored in a FOUP to a processing chamber.

[0005] An FFU chamber containing a FFU (Fan Filter Unit) is provided above the wafer transfer chamber in the wafer transfer device, and the FFU is used to blow air onto the wafers to reduce the adhesion of impurities to the wafers.

[0006] With the advancement of wafer microfabrication technology, the use of inert gas as a gas sprayed onto wafers to suppress unintended chemical reactions of materials during the manufacturing process is being considered. However, since inert gas is expensive, when using inert gas, a system is being considered in which the wafer transport device is sealed and the inert gas is circulated within the wafer transport device.

[0007] A common circulation system is one in which inert gas is injected into an FFU room where an FFU is installed, the FFU blows the inert gas into the wafer transfer chamber, and the pillars of the wafer transfer chamber are hollowed out to form a flow path for the inert gas to return to the FFU room. The return flow path made by the hollow pillars is called a return duct.

[0008] Patent Document 1 describes a method of circulating the inert gas by forming a return duct for the inert gas in the wall of the wafer transfer chamber and providing a plurality of fans at the inlet of the return duct.

[0009] Here, in a system in which the wafer transport device is sealed and inert gas is circulated internally between the FFU chamber and the wafer transport chamber through a return duct, the power consumption of the fan that circulates the inert gas and the power consumption of the robot that removes the wafers from the FOUP and transports them to the processing chamber become heat sources, causing the temperatures inside the FFU chamber and the wafer transport chamber to rise.

[0010] It is known that if heated wafers are handed over to the wafer transport device for processing after the wafer transport device, the time for the post-processing will be extended, and shortening the time for the post-processing is an issue. To solve this, it is necessary to control the temperature of the wafer transport device.

[0011] Above the FFU room is an electrical equipment room that houses the power supplies that supply electricity to the robots in the wafer transport room and the electrical components that control the wafer transport device system. These power supplies and electrical components generate heat and therefore need to be cooled.

[0012] In particular, in sealed wafer transport devices, temperature rise in the FFU chamber and wafer transport chamber becomes a problem, so a design is required to reduce the transfer of heat generated in the electrical equipment chamber to the FFU chamber installed below the electrical equipment chamber.

[0013] The present invention proposes a wafer transport device that can efficiently cool the power supply and electrical components in the electrical equipment room and suppress the transfer of heat from the electrical equipment room to the FFU room compared to conventional configurations.

[0014] The present invention includes multiple means for solving the above problems, and one example thereof includes a wafer transport chamber for transferring wafers between a FOUP in which the wafers are stored and a processing device that processes the wafers; a fan filter unit chamber installed vertically above the wafer transport chamber and equipped with a fan that circulates inert gas into the wafer transport chamber; an electrical equipment chamber installed vertically above the fan filter unit chamber and housing electrical components; an intake port installed on the bottom side of the electrical equipment chamber for taking in cooling air from the outside into the electrical equipment chamber; and a partition installed vertically above the intake port and vertically below the electrical components so that the cooling air flows along the bottom surface of the electrical equipment chamber.

[0015] According to the present invention, the power supply and electrical components in the electrical equipment compartment can be efficiently cooled, and the heat transfer from the electrical equipment compartment to the FFU compartment can be suppressed compared to conventional configurations. Other problems, configurations, and effects will become clear from the following description of the embodiments.

[0016] FIG. 1 is a diagram showing an outline of the configuration of a wafer transport apparatus of Example 1. FIG. 2 is a diagram showing a state in which an inlet in the wafer transport apparatus of Example 1 is installed in an electrical equipment room. FIG. 3 is a diagram showing another form in which an inlet in the wafer transport apparatus of Example 1 is installed in an electrical equipment room. FIG. 4 is a diagram showing a state in which an inlet in the wafer transport apparatus of Example 2 is installed in an electrical equipment room. FIG. 5 is a diagram showing a state in which an inlet in the wafer transport apparatus of Example 3 is installed in an electrical equipment room. FIG. 6 is a perspective view of the electrical equipment room in the wafer transport apparatus of Example 3. FIG. 7 is a perspective view of another form of the electrical equipment room in the wafer transport apparatus of Example 3.

[0017] An embodiment of the wafer transport device of the present invention will be described below with reference to the drawings. In the drawings used in this specification, identical or similar reference numerals are used to designate identical or corresponding components, and repeated explanations of these components may be omitted.

[0018] First Embodiment A first embodiment of a wafer transport device according to the present invention will be described with reference to FIGS. 1 to 3. FIG.

[0019] First, the overall configuration of the wafer transfer device will be described with reference to Fig. 1. Fig. 1 shows an overall view of the wafer transfer device.

[0020] The wafer transfer device 50 shown in FIG. 1 includes a wafer transfer chamber 1, an FFU chamber 5, a return duct 7, an electrical equipment chamber 9, an intake port 10, a partition plate 11, an exhaust fan 27, a power supply and electrical components 40, and the like.

[0021] The wafer transport chamber 1 is a space for transferring wafers W between a FOUP 2 in which the wafers W are stored and a processing device 3 that processes the wafers W, and a robot 4 is installed in the wafer transport chamber 1 to take out the wafers W stored in the FOUP 2 and transport them to the processing device 3 that processes the wafers W.

[0022] The robot 4 also plays a role in taking out the wafer W processed in the processing device 3 from the processing device 3 and returning it to the FOUP 2 .

[0023] The FFU chamber 5 is installed vertically above the wafer transfer chamber 1, and is provided with an FFU 6 that flows an inert gas into the wafer transfer chamber 1 to spray the gas onto the wafers W.

[0024] When the wafer transfer chamber 1 is sealed and inert gas is circulated inside, inert gas is injected into the FFU chamber 5. This inert gas is sent to the wafer transfer chamber 1 by the FFU 6. The inert gas sent to the wafer transfer chamber 1 passes through a return duct 7, which is formed by hollowing out a pillar inside the wafer transfer chamber 1 and forming a ventilation path for the inert gas to pass through. While FIG. 1 shows an example in which the return duct 7 is provided on the pillar, the return duct 7 may also be provided on the door or wall of the wafer transfer chamber 1. The inert gas returns to the FFU chamber 5 through this return duct 7 and is sent to the wafer transfer chamber 1 again by the FFU 6.

[0025] Since an inert gas circulates inside the sealed FFU chamber 5 and wafer transfer chamber 1, the power consumption of the FFU 6 and robot 4 becomes a heat source, causing a significant rise in the temperatures of the FFU chamber 5 and wafer transfer chamber 1.

[0026] Furthermore, vertically above the FFU chamber 5, an electrical equipment room 9 is installed, which houses power supplies and electrical components 40, including a power supply that supplies power to the robot 4 installed in the wafer transfer chamber 1, a control board that controls the system of the wafer transfer device 50, and its power supply.

[0027] These power supplies and electrical components 40 generate heat and therefore need to be cooled. Furthermore, in the sealed wafer transport device 50, the temperature rise in the FFU chamber 5 and wafer transport chamber 1 becomes significant, so a design is required to reduce the transfer of heat generated in the electrical equipment chamber 9 to the FFU chamber 5 installed below the electrical equipment chamber 9.

[0028] Therefore, the wafer transfer device 50 of the present invention is provided with the suction port 10 and the partition plate 11 .

[0029] The intake port 10 is provided on the floor 12 side of the electrical equipment room 9 and is an opening for taking cooling air into the electrical equipment room 9 from the outside.

[0030] The partition plate 11 is a flat plate parallel to the floor 12 of the electrical equipment compartment 9, and is provided vertically above the intake port 10 and vertically below the power supply and electrical components 40 so that cooling air flows along the floor 12 of the electrical equipment compartment 9. This partition plate 11 extends to the front surface 24 of the electrical equipment compartment so that an opening to the space on the power supply and electrical components 40 side is formed on the side of the front surface 24 of the electrical equipment compartment opposite the rear surface 19 of the electrical equipment compartment where the intake port 10 is provided, among the rear surface 19 of the electrical equipment compartment, the left side surface 20 of the electrical equipment compartment (see FIG. 2), the right side surface 21 of the electrical equipment compartment (see FIG. 2), and the front surface 24 of the electrical equipment compartment 9.

[0031] With this structure, the cooling air drawn into the electrical equipment chamber 9 from the intake port 10 provided on the bottom surface of the electrical equipment chamber 9 flows along the bottom surface of the electrical equipment chamber 9, so that the power supply and electrical components 40 in the electrical equipment chamber 9 can be cooled using air taken in from the outside. In addition, an air layer with low thermal conductivity is created on the bottom surface of the electrical equipment chamber 9, so that the transfer of heat from the electrical equipment chamber 9 to the FFU chamber 5 located below the electrical equipment chamber 9 can be reduced.

[0032] If this air layer is not formed on the bottom surface of the electrical equipment room 9, there is a risk that the heat inside the electrical equipment room 9 will heat the ceiling 8 of the FFU room 5 below, raising the temperature of the FFU room 5. In contrast, the structure of the intake port 10 and partition plate 11 of the present invention makes it possible to cool the power supply and electrical components 40 in the electrical equipment room 9 while reducing the transfer of heat from the electrical equipment room 9 to the FFU room 5.

[0033] The exhaust fan 27 is a fan that takes in air through the intake port 10 and exhausts it outside the electrical compartment 9 after cooling the power supply, electrical components 40, etc. This exhaust fan 27 allows outside air to be taken in through the intake port 10.

[0034] Although FIG. 1 illustrates an example in which the exhaust fan 27 is provided on the rear surface 19 of the electrical equipment compartment, the present invention is not limited to this. For example, it can be preferably provided on one or more of the rear surface 19, left side surface 20, right side surface 21, and front surface 24 of the electrical room 9, where the intake port 10 is provided, or on the rear surface 19 side of the left side surface 20 and right side surface 21 of the electrical room when the two left side surfaces 20 and right side surfaces 21 adjacent to the rear surface 19 of the electrical room are divided into the rear surface 19 side of the electrical room and the front surface 24 side of the electrical room opposite the rear surface 19 of the electrical room.However, it may also be provided on the top surface of the electrical room 9 or the front surface 24 side of the left side surface 20 and right side surface 21 of the electrical room when the left side surface 20 and right side surface 21 of the electrical room are divided into the rear surface 19 side of the electrical room and the front surface 24 side of the electrical room opposite the rear surface 19 of the electrical room, or even on the front surface 24 of the electrical room.

[0035] Figure 2 is a cross-sectional view of the wafer transport device 50 as seen from the direction of arrow A-A in Figure 1. Figure 2 shows a case where five suction ports 10 are installed at equal intervals. The number and installation positions of the suction ports 10 can be set arbitrarily.

[0036] For example, FIG. 3 shows a diagram in which the intake ports 10 are concentrated in the high temperature area of ​​the FFU room 5.

[0037] In addition to temperature rise, a problem specific to wafer transfer devices is non-uniformity in the temperature distribution in the wafer transfer chamber 1. The inert gas flowing through the return duct 7 is at a high temperature, and this high-temperature gas returns to the FFU chamber 5 and collides with the ceiling 8. Because the temperature distribution in the ceiling 8 becomes non-uniform, the temperature inside the FFU chamber 5 becomes non-uniform, which in turn causes non-uniform temperature distribution in the gas blown from the FFU 6 to the wafer transfer chamber 1, resulting in non-uniform temperature distribution in the wafer transfer chamber 1.

[0038] 3, the number of suction ports 10 can be concentrated in an area of ​​the ceiling 8 where the temperature is particularly high. Because the air flowing in from the suction ports 10 has a lower temperature than the FFU chamber 5, it also has the effect of cooling the FFU chamber 5. By concentrating the number of suction ports 10 in the high-temperature area of ​​the ceiling 8, the non-uniform temperature distribution of the ceiling 8 can be alleviated, and the temperature distribution of the FFU chamber 5 can be made uniform.

[0039] Next, the effects of this embodiment will be described.

[0040] The wafer transport device 50, 50A of the first embodiment of the present invention described above includes: a wafer transport chamber 1 for transferring wafers W between the FOUP 2 storing the wafers W and the processing device 3 for processing the wafers W; an FFU chamber 5 installed vertically above the wafer transport chamber 1 and equipped with an FFU 6 for flowing inert gas into the wafer transport chamber 1; an electrical equipment room 9 installed vertically above the FFU chamber 5 and accommodating a power supply and electrical components 40; an intake port 10 installed on the floor 12 side of the electrical equipment room 9 for taking in cooling air from the outside into the electrical equipment room 9; and a partition plate 11 installed vertically above the intake port 10 and vertically below the power supply and electrical components 40 so that the cooling air flows along the floor 12 of the electrical equipment room 9.

[0041] This structure makes it possible to cool the power supply and electrical components 40 in the electrical equipment chamber 9 using air taken in from outside, and also makes it possible to form an air layer with low thermal conductivity on the bottom surface of the electrical equipment chamber 9, thereby reducing the transfer of heat from the electrical equipment chamber 9 to the FFU chamber 5 located below the electrical equipment chamber 9. In other words, the temperature rise in the wafer transport device 50 can be suppressed compared to the conventional configuration.

[0042] Furthermore, since the partition plate 11 is made of a flat plate parallel to the floor 12 of the electrical equipment room 9, the structure can be simplified.

[0043] Furthermore, an exhaust fan 27 is provided for the electrical room 9, and the exhaust fan 27 is provided on at least one of the rear side 19 of the electrical room, the left side 20 of the electrical room, the right side 21 of the electrical room, and the front side 24 of the electrical room that make up the electrical room 9, on the rear side 19 of the electrical room where the intake port 10 is provided, and the two left side sides 20 of the electrical room that contact the rear side 19, and the right side 21 of the electrical room when the rear side 19 side is divided into the rear side 19 side of the electrical room and the front side 24 side of the electrical room that faces the rear side 19 of the electrical room. This allows a large amount of cooling air to pass through to the space above, separated by the partition plate 11, where the power supply and electrical components 40 are arranged, so that the power supply and electrical components 40 can be cooled more efficiently and the amount of heat that may be transmitted to the FFU room 5 side can be further reduced, thereby more effectively suppressing the transmission of heat from the electrical room 9 to the FFU room 5.

[0044] Furthermore, the partition plate 11 extends to the front surface 24 of the electrical equipment chamber so that an opening is formed on the side of the front surface 24 of the electrical equipment chamber opposite the rear surface 19 of the electrical equipment chamber where the intake port 10 is provided, among the rear surface 19 of the electrical equipment chamber, the left side surface 20 of the electrical equipment chamber, the right side surface 21 of the electrical equipment chamber, and the front surface 24 of the electrical equipment chamber that make up the electrical equipment chamber 9. This allows the power supply and electrical components 40 to be cooled efficiently, and also allows the area of ​​the air layer with low thermal conductivity formed on the bottom surface of the electrical equipment chamber 9 to be made larger, thereby further suppressing the transfer of heat from the electrical equipment chamber 9 to the FFU chamber 5.

[0045] Second Embodiment A wafer transfer apparatus according to a second embodiment of the present invention will be described with reference to Fig. 4. Fig. 4 shows an overall view of the wafer transfer apparatus according to the second embodiment.

[0046] The wafer transfer device 50B of this embodiment shown in FIG. 4 has a fin-type structure in which the floor 12b of the electrical equipment room 9b is provided with an uneven shape, thereby increasing the heat transfer area.

[0047] As shown in Figure 4, an intake port 10 is provided on the floor 12b, which is the bottom surface of the electrical equipment room 9b, and a partition plate 11 is installed above the intake port 10 so that the air flowing in from the intake port 10 flows along the floor 12b of the electrical equipment room 9b.

[0048] Since the temperature inside the FFU room 5 is higher than the temperature of the air flowing into the electrical equipment room 9b from the intake port 10, the air layer formed below the partition plate 11 not only reduces the heat from the electrical equipment room 9b being transferred to the FFU room 5, but also has the effect of allowing the air flowing in from the intake port 10 to cool the FFU room 5 through the floor 12b of the electrical equipment room 9b.

[0049] By making the floor 12b not a flat plate but having an uneven cross section as shown in FIG. 4, the heat transfer area is increased, and cooling by the air flowing in from the intake port 10 is promoted.

[0050] The cross-sectional shape of the floor is not limited to the uneven shape shown in FIG. 4, but may be any shape that can increase the heat transfer area.

[0051] Furthermore, although the embodiment in which the uneven shape is provided only on the floor 12b of the electrical equipment room 9b has been shown, the uneven shape may be provided only on the ceiling surface of the FFU room 5, or on both the floor 12b of the electrical equipment room 9b and the ceiling surface of the FFU room 5.

[0052] Furthermore, although the configuration in which the uneven shape is formed over the entire surface of the floor 12b has been shown, the uneven shape or any other shape that can increase the heat transfer area may be provided in a part of the floor, such as a part close to the heat source.

[0053] The other configurations and operations are substantially the same as those of the wafer transfer device 50 or wafer transfer device 50A of the first embodiment, and details thereof will be omitted.

[0054] The wafer transfer apparatus 50B of the second embodiment of the present invention also provides substantially the same effects as the wafer transfer apparatus 50 or the wafer transfer apparatus 50A of the first embodiment described above.

[0055] Furthermore, by providing an uneven shape on either the floor 12b of the electrical equipment room 9b or the ceiling surface of the FFU room 5, the transfer of heat from the electrical equipment room 9b to the FFU room 5 can be further suppressed.

[0056] A wafer transport apparatus according to a third embodiment of the present invention will be described with reference to Figures 5 to 7. Figure 5 shows an outline of the overall configuration of the wafer transport apparatus according to the third embodiment, Figure 6 shows the configuration of the electrical equipment room in the wafer transport apparatus according to the third embodiment, and Figure 7 shows the configuration of the electrical equipment room in the wafer transport apparatus according to the third embodiment.

[0057] The wafer transfer device 50C of this embodiment shown in FIG. 5 is installed on the floor 12c of the electrical equipment room 9 and further includes a cooling unit using a Peltier element 14 for cooling the FFU room 5.

[0058] Therefore, unlike the flat partition plate 11 in Examples 1 and 2, the partition section is composed of a duct 26 consisting of a horizontal partition plate 17 and a vertical partition plate 18 located vertically above the intake port 10 on the floor 12c side of the electrical equipment room 9 so that the cooling air flows along the floor 12c of the electrical equipment room 9 and avoids the cooling unit using the Peltier element 14.

[0059] Specifically, as shown in FIG. 5, a cooling unit consisting of a cooling heat sink 13, a Peltier element 14, a heat dissipation heat sink 15, and a heat dissipation heat sink cooling fan 16 is installed on the bottom surface of the electrical equipment compartment 9c.

[0060] The cooling heat sink 13 protruding from the ceiling 8c side into the FFU chamber 5 comes into contact with the low-temperature portion of the Peltier element 14, thereby cooling the inside of the FFU chamber 5. The heat dissipation heat sink 15 dissipates heat generated from the high-temperature portion of the Peltier element 14 to the electrical equipment chamber 9c, and exists in the electrical equipment chamber 9c as a new heat source other than the power supply and electrical components 40.

[0061] Therefore, an intake port 10 is installed on the bottom surface of the electrical equipment room 9c, as in Example 1, etc., and a duct 26 is formed by combining and installing a horizontal partition plate 17 and a vertical partition plate 18 above and to the side of the intake port 10 so that the air flowing in from the intake port 10 flows along the bottom surface of the electrical equipment room 9c.

[0062] This allows an air layer with low thermal conductivity to be provided in the area on the bottom of the electrical equipment room 9c where no cooling unit is present, thereby reducing the transfer of heat from the power supply and electrical components 40 and also from the heat dissipation heat sink 15 to the FFU room 5.

[0063] 6 and 7 are perspective views of an example in which a partition plate is installed in an electrical equipment compartment 9c equipped with two cooling units. In Fig. 6, the walls of the top, front 24, and left side 20 of the electrical equipment compartment are cut out so that the inside of the electrical equipment compartment 9c can be seen, while in Fig. 7, the walls of the top, rear 19, and left side 20 of the electrical equipment compartment are cut out so that the inside of the electrical equipment compartment 9c can be seen.

[0064] As shown in Figure 6, the air intake 10 is provided in the wall of the rear 19 of the electrical equipment compartment, and a horizontal partition 17 and a vertical partition 18 extend from the rear 19 of the electrical equipment compartment toward the front 24 of the electrical equipment compartment. Air flows between the horizontal partition 17, the vertical partition 18, and the floor 12c. The horizontal partition 17 and the vertical partition 18 do not extend to the front 24 of the electrical equipment compartment, but end midway, and the air coming out of the partition outlet 23 cools the power supply, electrical components 40, and heat sink 15 inside the electrical equipment compartment 9c.

[0065] 7, air flows between the floor 12c and a duct 26c formed by a horizontal partition plate 17c and a vertical partition plate 18, just like the configuration in FIG. 6, but differs in that the intake port 10 is provided in the wall of the rear surface 19 of the electrical equipment compartment, and the horizontal partition plate 17c and the vertical partition plate 18 extend from the rear surface 19 of the electrical equipment compartment until they contact the front surface 24 of the electrical equipment compartment. In addition, the horizontal partition plate 17c is provided with a partition plate intake port 25, and the air passing through this partition plate intake port 25 cools the power supply, electrical components 40, and heat dissipation heat sink 15 in the electrical equipment compartment 9c.

[0066] The other configurations and operations are substantially the same as those of the wafer transfer device 50 or wafer transfer device 50A of the first embodiment, and details thereof will be omitted.

[0067] The wafer transfer apparatus 50C of the third embodiment of the present invention also provides substantially the same effects as the wafer transfer apparatus 50 or the wafer transfer apparatus 50A of the first embodiment described above.

[0068] Furthermore, the electrical equipment room 9c is further provided with a cooling unit that is installed on the floor 12c and uses a Peltier element 14 to cool the FFU room 5, and the partition plate is configured with ducts 26, 26c that are made up of horizontal partition plates 17, 17c and vertical partition plate 18 that are located vertically above the intake port 10 on the floor 12c side of the electrical equipment room 9c so that the cooling air flows along the floor 12c of the electrical equipment room 9c and avoids the cooling unit, thereby achieving a configuration that further improves cooling performance.

[0069] In this embodiment, too, it is possible to provide a concave-convex shape or any shape capable of increasing the heat transfer area on at least one of the top surfaces on the electrical equipment chamber 9c side and the FFU chamber 5 side as in the second embodiment.

[0070] <Others> The present invention is not limited to the above-described examples, and includes various modifications. The above-described examples have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those having all of the described configurations.

[0071] It is also possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of one embodiment to the configuration of another embodiment.It is also possible to add, delete, or replace part of the configuration of each embodiment with the configuration of another embodiment.

[0072] DESCRIPTION OF SYMBOLS 1...Wafer transfer chamber 2...FOUP 3...Processing device 4...Robot 5...FFU chamber 6...FFU (fan filter unit) 7...Return duct 8, 8c...Ceiling 9, 9b, 9c...Electrical equipment room 10...Intake port 11...Partition plate (partition section) 12, 12b, 12c...Floor (bottom surface) 13...Cooling heat sink 14...Peltier element 15...Heat dissipation heat sink 16...Heat dissipation heat sink cooling fan 17, 17c...Horizontal partition plate (partition section, duct) 18...Vertical partition plate (partition section, duct) 19...Rear surface of electrical equipment room (side surface, first surface) 20...Left side surface of electrical equipment room (side surface) 21...Right side surface of electrical equipment room (side surface) 23...Partition plate outlet 24...Front surface of electrical equipment room (side surface, second surface) 25: Partition plate intake port 26, 26c: Duct 27: Exhaust fan 40: Power supply and electrical components 50, 50A, 50B, 50C: Wafer transport device W: Wafer

Claims

1. A wafer transfer device comprising: a wafer transfer chamber configured to transfer a wafer between a hoop storing the wafer and a processing apparatus for processing the wafer; a fan filter unit chamber installed vertically above the wafer transfer chamber and provided with a fan for flowing an inert gas into the wafer transfer chamber; an electrical equipment chamber installed vertically above the fan filter unit chamber and storing electrical components; an air inlet provided at the bottom side of a side surface of the electrical equipment chamber for taking in cooling air from the outside into the electrical equipment chamber; and a partition provided vertically above the air inlet and vertically below the electrical components so that the cooling air flows along the bottom surface of the electrical equipment chamber.

2. The wafer transfer device according to claim 1, wherein the partition is constituted by a flat plate parallel to the bottom surface of the electrical equipment chamber.

3. The wafer transfer device according to claim 1, further comprising a cooling unit using a Peltier element installed on the bottom surface of the electrical equipment chamber for cooling the fan filter unit chamber, wherein the partition is constituted by a duct located vertically above the air inlet on the bottom surface side of the electrical equipment chamber so that the cooling air flows along the bottom surface of the electrical equipment chamber while avoiding the cooling unit.

4. The wafer transfer device according to claim 2 or 3, wherein an uneven shape is provided on either the bottom surface of the electrical equipment chamber or the top surface of the fan filter unit chamber.

5. The wafer transfer device according to claim 2 or 3, further comprising an exhaust fan for the electrical equipment chamber, wherein the exhaust fan is provided on at least one of: a first surface provided with the air inlet among the side surfaces constituting the electrical equipment chamber; and a first surface side when the first surface is divided into two on the first surface side and a second surface side opposite to the first surface among two side surfaces in contact with the first surface.

6. The wafer transfer device according to claim 5, wherein the air inlet is provided on a side surface of the wafer transfer device on the side of the processing apparatus.

7. In the wafer transfer device according to claim 2 or 3, the partition portion extends to the second surface side so that an opening portion is formed on the second surface side of the side surface constituting the electrical equipment chamber, which faces the first surface provided with the suction port. Wafer transfer device.

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