Cover device, process chamber and semiconductor process apparatus

Abstract

Disclosed in the present application are a cover device, a process chamber and a semiconductor process apparatus. The cover device comprises a cover, a connection seat and a cover seat; a first end of the cover seat is rotationally connected to the connection seat; the cover seat has a first state and a second state; a second end of the cover seat can rotate around the first end of the cover seat, so as to switch the cover seat between the first state and the second state; in the first state of the cover seat, the cover is inclined relative to a preset plane, and the cover is movable relative to the cover seat; in the second state of the cover seat, the cover is parallel to the preset plane. The described solution can solve the problem of inadequate sealing of process chambers in the prior art.

Description

Cover device, process chamber and semiconductor process equipment Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a cover device, a process chamber, and semiconductor process equipment. Background Art

[0002] The process chamber is an important component of semiconductor process equipment. The process chamber is used to implement semiconductor processes, such as cleaning processes, thin film deposition processes, etc. During the semiconductor process, the process chamber needs to be sealed to prevent the process space in the process chamber from communicating with the external environment of the process chamber. Once the process space in the process chamber is connected to the external environment of the process chamber, it is more likely to cause process failure. In addition, some processes (such as cleaning processes) require highly toxic gases. Once these toxic gases leak into the external environment of the process chamber, it is more likely to cause poisoning of workers.

[0003] Therefore, it can be seen that the sealing design of the process chamber is the top priority in the process chamber structure design. However, the process chamber involved in the related art still has the problem of poor sealing. Summary of the Invention

[0004] The present application discloses a cover device, a process chamber and semiconductor process equipment to solve the problem of poor sealing of the process chamber involved in the related art.

[0005] In order to solve the above technical problems, this application provides the following technical solutions:

[0006] In a first aspect, an embodiment of the present application discloses a cover device, comprising a cover, a connecting base, and a cover base, wherein a first end of the cover base is rotatably connected to the connecting base, the cover base has a first state and a second state, and a second end of the cover base is rotatable around the first end of the cover base to switch the cover base between the first state and the second state;

[0007] In the first state of the cover seat, the cover is inclined relative to a preset plane, and the cover seat moves relative to the cover seat; in the second state of the cover seat, the cover is parallel to the preset plane.

[0008] In a second aspect, an embodiment of the present application discloses a process chamber, comprising a first sealing ring, a chamber body, and the cover device described in the first aspect, wherein the chamber body is provided with an opening, the first end of the cover seat is away from the opening, the second end of the cover seat is close to the opening, and the predetermined plane is the plane where the opening is located;

[0009] In a first state of the cover seat, the cover is tilted relative to the plane where the opening is located, and the cover is movable between a position avoiding the opening and a position opposite to the opening;

[0010] When the cover is located opposite to the opening, the cover seat can drive the cover to rotate to the second state where the cover is parallel to the plane where the opening is located and drive the cover to squeeze the first sealing ring.

[0011] In a third aspect, an embodiment of the present application discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes the process chamber described in the second aspect.

[0012] The technical solution adopted in this application can achieve the following technical effects:

[0013] The cover device disclosed in the embodiment of the present application can rotate the cover body under the drive of the cover body seat, thereby changing the inclination angle of the cover body, and can move when the cover body is inclined relative to a preset plane. During this process, since the cover body can be tilted and thus move away from the first sealing ring for sealing the opening of the chamber body or drive the first sealing ring for sealing the opening of the chamber body away from the chamber body, it can avoid the wear of the first sealing ring caused by the movement of the cover body. Ultimately, the wear of the first sealing ring can be alleviated, and the cover body and the chamber body can be better sealed through the first sealing ring. It can be seen that the cover device disclosed in the embodiment of the present application is conducive to improving the sealing performance of the process chamber.

[0014] At the same time, during this process, the first end of the cover seat only rotates relative to the connecting seat, so that the first end of the cover seat does not need to occupy a large movable space, which is beneficial to further reduce the space occupied by the process chamber above it. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG1 is a schematic diagram of a process chamber involved in the related art, in which the cover is not fully opened;

[0016] FIG2 is an exploded schematic diagram of a partial structure of a process chamber disclosed in one embodiment of the present application with the cover in an open state;

[0017] FIG3 is a schematic diagram of a process chamber disclosed in one embodiment of the present application with the cover in an open state;

[0018] FIG4 is a top view of FIG3;

[0019] Figure 5 is a right side view of Figure 2;

[0020] FIG6 is a schematic diagram of a process chamber disclosed in another embodiment of the present application;

[0021] FIG7 is a partial schematic diagram of the chamber body disclosed in an embodiment of the present application;

[0022] FIG8 is a schematic diagram of a portion of the structure of a process chamber disclosed in an embodiment of the present application. FIG8 is essentially a perspective view, with some outlines indicated by dotted lines;

[0023] FIG9 is an exploded view of the joint between the lifting structure and the sealing cavity disclosed in an embodiment of the present application;

[0024] FIG10 is a schematic diagram of FIG9 after assembly;

[0025] FIG11 is a top view of FIG10;

[0026] Figure 12 is a right side view of Figure 10;

[0027] FIG13 is a schematic structural diagram of a process chamber disclosed in an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 001-chamber body, 002-cover, 003-drive device,

[0030] 10-sealed cavity, 11-chamber body, 111-enclosing plate, 12-cover, 13-first sealing ring,

[0031] 20-cleaning tank, 21-first switch valve,

[0032] 31-drying gas input pipe, 32-water film removal gas input pipe, 33-cleaning liquid input pipe, 301-fifth switch valve,

[0033] 41-connecting seat, 42-cover seat, 43-first driving mechanism, 44-track, 45-second driving mechanism, 46-first limit buffer, 47-second limit buffer, 48-closing detection sensor, 49-closing detection trigger, 401-opening detection sensor, 402-opening detection trigger, 404-connecting piece, 405-moving frame, 406-hinge shaft,

[0034] 50-lifting mechanism, 51-first base plate, 52-cover, 53-first connecting piece, 54-telescopic sleeve, 55-third sealing ring, 56-fourth sealing ring, 57-fifth sealing ring, 58-second base plate, 581-avoidance hole, 59-lifting rod, 501-second connecting piece, 502-third connecting piece, 503-leveling device,

[0035] 60-pressing mechanism, 61-third driving mechanism, 62-pressing member, 601-first right angle side, 602-second right angle side, 63-fourth driving mechanism,

[0036] 70-waste liquid output pipe, 71-main pipe, 72-first branch pipe, 73-second branch pipe, 74-third branch pipe, 75-second switch valve, 76-third switch valve, 77-drainage buffer tank, 78-negative pressure exhaust pipe, 79-negative pressure pump, 701-fourth switch valve, 702-connecting pipe,

[0037] 80-carrying frame,

[0038] 90-wafer,

[0039] 01-process space, 02-opening, 03-pipeline, 04-mounting hole, 05-sealing plate, 06-second sealing ring, 07-connecting hole, 08-sealing joint. DETAILED DESCRIPTION

[0040] To make the objectives, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0041] The technical solutions disclosed in various embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0042] As described in the background technology of this patent application, the sealing design of the process chamber is of utmost importance in the structural design of the process chamber. Based on this, the process chamber involved in the related art includes a chamber body, a cover body and a first sealing ring for sealing the opening of the chamber body, wherein the first sealing ring can be fixed on the cover body, or the first sealing ring can be fixedly arranged at the opening position of the chamber body. The cover body moves relative to the chamber body, thereby switching between an open state and a closed state. However, during the design process, the inventors of this application found that in the process of closing or opening the cover body, since the cover body moves close to the opening position of the chamber body, the cover body will cause greater friction with the first sealing ring arranged at the opening position of the chamber body, or the process of the cover body driving the first sealing ring to move will cause greater friction between the first sealing ring and the opening of the chamber body, thereby causing the first sealing ring to wear faster, resulting in the first sealing ring being unable to perform a good sealing function.

[0043] Based on this, the inventors of the present application further improved the structure of the process chamber. As shown in FIG1 , the improved process chamber still includes a chamber body 001 , a cover body 002 and a first sealing ring.

[0044] The chamber body 001 is the primary peripheral component that encloses the process space of the process chamber. It has an opening that communicates with the interior of the chamber body 001. The lid 002 is rotatably mounted on the chamber body 001, allowing it to switch between an open and closed state by rotating relative to the chamber body 001.

[0045] In the open state, the cover 002 is rotated to a position where the opening is exposed and offset from the opening, and the internal space of the chamber body 001 is connected to the external environment of the process chamber, so that the operator can perform corresponding operations, such as maintenance operations, taking and placing wafers, etc.

[0046] In the closed state, the lid 002 rotates to a position covering the opening and can compress the first sealing ring, thereby compressing the first sealing ring between the lid 002 and the chamber body 001, thereby achieving a seal between the lid 002 and the chamber body 001. In this case, the lid 002, the first sealing ring, and the chamber body 001 enclose a process space. The first sealing ring facilitates the sealed isolation between the process space and the external environment of the process chamber.

[0047] The process chamber shown in FIG1 may further include a drive device 003, which connects the cover 002 and the chamber body 001 and is used to drive the cover 002 to rotate relative to the chamber body 001. When designing the structure of the process chamber, the inventors of the present application further discovered that in the process chamber with such a structure, the cover 002 will not rub against the first sealing ring or drive the first sealing ring to rub against the chamber body 001 during the rotation of the cover 002. However, the cover 002 needs to be rotated by a large angle to fully open ( FIG1 only illustrates the opening process of the cover 002, and the cover 002 in FIG1 is not in a fully opened state). As a result, a large space needs to be reserved above the process chamber for the rotation of the cover 002. This actually results in the process chamber needing to occupy a large space above the process chamber. The space above the process chamber is often where a transport device (such as a robot) for carrying wafers is arranged. If the process chamber needs to occupy a large space above the process chamber, the transport device cannot be arranged compactly above the process chamber.

[0048] Based on this, the inventors of this application have further improved the structure of the process chamber to address the aforementioned issues. Referring to Figures 2 to 4 , this application discloses a cover device. The disclosed cover device can be used as part of a process chamber. The disclosed cover device can adjust the cover's posture to avoid wear on the first sealing ring during opening and closing.

[0049] The cover device disclosed in the embodiment of the present application may include a cover 12, a connecting seat 41 and a cover seat 42. The cover 12 is movably provided on the cover seat 42, so that it can move relative to the cover seat 42. The cover seat 42 not only provides a mounting base for the cover 12, but also can drive the cover 12 to rotate by its own rotation to adjust the posture of the cover 12. Specifically, the first end of the cover seat 42 is rotatably connected to the connecting seat 41, and the cover seat 42 has a first state and a second state. The second end of the cover seat 42 is rotatable around the first end of the cover seat 42 to switch the cover seat 42 between the first state and the second state.

[0050] In the first state of the cover seat 42, the cover 12 is tilted relative to a predetermined plane. In the embodiment of the present application, the predetermined plane can be a plane parallel to the plane where the opening 02 of the chamber body 11 is located, or the plane where the opening 02 is located, or a surface substantially parallel to the plane where the opening 02 of the chamber body 11 is located. Of course, in the first state of the cover seat 42, the cover 12 is tilted relative to the predetermined plane, so that the cover 12 does not cause wear to the first sealing ring 13 during movement.

[0051] In the second state of the cover seat 42, the cover 12 is parallel to the predetermined plane. When the cover 12 is in the second state and is positioned opposite the opening 02 of the chamber body 11, the cover 12 is able to squeeze and tighten the first sealing ring 13, thereby sealing the opening 02 of the chamber body 11. In other words, by rotating the second end of the cover seat 42 around the first end of the cover seat 42, the cover seat 42 can cause the cover 12 thereon to switch between being inclined relative to the predetermined plane and being relatively parallel to the predetermined plane.

[0052] As described above, the process chambers involved in the embodiments of the present application include a first sealing ring. In some embodiments, the first sealing ring 13 can be fixedly connected to the cover 12 and move with the cover 12 relative to the chamber body 11. When the cover 12 tilts relative to a predetermined plane, the cover 12 causes the first sealing ring 13 to tilt with it, causing the first sealing ring 13 to move away from the chamber body 11. This prevents the cover 12 from causing friction with the first sealing ring 13 during movement. In other embodiments, the first sealing ring 13 can be fixedly connected to the chamber body 11 and disposed around the opening 02. The first sealing ring 13 does not move with the cover 12. In this case, when the cover 12 tilts relative to the predetermined plane, the cover 12 can tilt relative to the first sealing ring 13 and the chamber body 11, causing the cover 12 to move away from the first sealing ring 13. This prevents friction with the first sealing ring 13 during movement, thereby preventing wear of the first sealing ring 13.

[0053] The cover device disclosed in the embodiment of the present application can enable the cover 12 to rotate under the drive of the cover seat 42, thereby changing the inclination angle of the cover 12, and can move when the cover 12 is inclined relative to the preset plane. In this process, since the cover 12 can be tilted away from the first sealing ring 13 for sealing the opening 02 of the chamber body 11, or the cover 12 drives the first sealing ring 13 thereon for sealing the opening 02 of the chamber body 11 away from the chamber body 11 by tilting, it can avoid the wear of the first sealing ring 13 caused by the movement of the cover 12. Finally, the wear of the first sealing ring 13 can be alleviated, so that the cover 12 and the chamber body 11 can be better sealed through the first sealing ring 13. It can be seen that the cover device disclosed in the embodiment of the present application is conducive to improving the sealing performance of the process chamber.

[0054] In order to improve the degree of automation of the cover device, in some embodiments, the cover device disclosed in the embodiment of the present application may further include a first drive mechanism 43, which is provided on the cover seat 42 and is connected to the cover 12. The first drive mechanism 43 is used to drive the cover 12 to move when the cover seat 42 is in the first state. The first drive mechanism 43 can be a linear motor, a telescopic cylinder, a telescopic hydraulic cylinder, etc. The embodiment of the present application does not limit the specific type of the first drive mechanism 43. Specifically, as shown in Figure 2, the first drive mechanism 43 can be connected to the cover 12 through a connecting piece 404. During the driving process, the first drive mechanism 43 can drive the connecting piece 404 to move. The movement of the connecting piece 404 will drive the cover 12 to move, thereby realizing the driving of the cover 12 to move.

[0055] In some embodiments, the cover seat 42 may further include a guide portion. For example, the guide portion may be a track 44. One end of the track 44 is adjacent to the first end of the cover seat 42, and the other end of the track 44 is adjacent to the second end of the cover seat 42. The cover 12 may be guided and engaged with the track 44 to guide the movement of the cover 12 when the cover seat 42 is in the first state. The track 44 has a guiding function, thereby being able to guide the cover 12 to move in a more standardized manner, thereby improving the movement accuracy of the cover 12.

[0056] In some embodiments, there can be one track 44, while in other embodiments, there can be at least two tracks 44. When there are at least two tracks 44, the at least two tracks 44 are spaced apart on the cover base 42 and respectively guide and cooperate with the cover 12. In this case, the at least two tracks 44 can both guide the cover 12, thereby further improving the accuracy of the movement of the cover 12.

[0057] In some embodiments of the present application, the rotation of the cover body seat 42 relative to the connecting seat 41 can be achieved by manual drive. Of course, in order to improve the degree of automation of the process chamber, in the embodiments shown in Figures 2 and 3, the cover body device disclosed in the embodiments of the present application may also include a second drive mechanism 45. The second drive mechanism 45 can be fixedly connected to the outer wall of the chamber body 11, or of course can be fixedly connected to other mounting bases, and the embodiments of the present application are not limited thereto. Specifically, the second drive mechanism 45 is connected to the second end of the cover body seat 42, and the second drive mechanism 45 is used to drive the second end of the cover body seat 42 to rotate around the first end of the cover body seat 42 so that the cover body seat 42 switches between the first state and the second state. Exemplarily, the second drive mechanism 45 can be a linear motor, a telescopic cylinder, a telescopic hydraulic cylinder, etc., and the embodiments of the present application do not limit the specific type of the second drive mechanism 45. Specifically, the second drive mechanism 45 can be rotatably connected to the second end of the cover body seat 42 to adapt to the rotation of the cover body seat 42.

[0058] As described above, during operation, the cover 12 moves relative to the cover seat 42. The cover 12 has a first preset position and a second preset position relative to the cover seat 42. When the cover 12 moves to the first preset position, the cover 12 moves away from the first end of the cover seat 42. When the cover 12 moves to the second preset position, the cover 12 moves closer to the first end of the cover seat 42. To prevent excessive movement of the cover 12, in one embodiment, the second end of the cover seat 42 may be provided with a first stop. When the cover 12 moves to the first preset position, the cover 12 can come into contact with the first stop, thereby preventing excessive movement of the cover 12 along the cover seat 42. It should be noted that when the cover 12 moves to the first preset position, the cover 12 moves to a position opposite the opening 02. At this point, the distance between the cover 12 and the rotational connection point of the cover seat 42 is the first distance.

[0059] Furthermore, the first limiting portion can be a first limiting buffer portion 46, which is an elastic structural component (such as a rubber block, a spring, etc.) and has a buffering function, so that the first limiting buffer portion 46 not only plays a limiting function in the process of limiting contact with the cover body 12, but also plays a buffering function to avoid rigid collision.

[0060] In other embodiments, the first end of the cover body seat 42 may be provided with a second limiting portion, and when the cover body 12 moves to the second preset position, the cover body 12 can be in limited contact with the second limiting portion, thereby preventing the cover body 12 from excessively moving along the cover body seat 42. It should be noted that when the cover body 12 moves to the second preset position of the cover body seat 42, the cover body 12 is in a position to avoid the opening 02. At this time, the distance between the cover body 12 and the rotational connection of the cover body seat 42 is the second distance, and the first distance is greater than the second distance. It should be noted that since the first end of the cover body seat 42 is rotatably connected to the connecting seat 41, the distance between the cover body 12 and the rotational connection of the cover body seat 42 is equivalent to the distance between the cover body 12 and the first end of the cover body seat 42. When the cover body 12 moves to the first preset position, the cover body 12 is located opposite to the opening 02. Therefore, the cover body 12 is farther away from the first end of the cover body seat 42, and therefore, the corresponding first distance is larger; and when the cover body 12 moves to the second preset position, the cover body 12 is in a position to avoid the opening 02. Therefore, it is closer to the first end of the cover body seat 42, and therefore, the corresponding second distance is smaller.

[0061] It should be noted that the first limiting portion and the second limiting portion have opposite limiting directions. Similarly, further, the second limiting portion can be a second limiting buffer portion 47, which is an elastic structural member (such as a rubber block, spring, etc.) and has a buffering function. In this way, the second limiting buffer portion 47 can also play a buffering role during the limiting contact process with the cover body 12 to avoid rigid collision.

[0062] The second end of the cover body seat 42 can be provided with a closing detection sensor 48, and the cover body 12 can be provided with a closing detection trigger 49. When the cover body 12 moves to the first preset position, the closing detection trigger 49 triggers the closing detection sensor 48, so that the closing detection sensor 48 sends a signal indicating that the cover body 12 is closed, and the first drive mechanism 43 can be closed after receiving this signal.

[0063] An opening detection sensor 401 may be provided at the first end of the cover base 42, and an opening detection trigger 402 may be provided at the cover 12. When the cover 12 moves to the second preset position, the opening detection trigger 402 triggers the opening detection sensor 401, causing the opening detection sensor 401 to emit a signal indicating that the cover 12 is open. The first drive mechanism 43 may be closed upon receiving this signal.

[0064] Specifically, the closing detection trigger 49 and the opening detection trigger 402 can be directly mounted on the cover body 12 and move with the cover body 12. Of course, the closing detection trigger 49 and the opening detection trigger 402 can also be indirectly mounted on the cover body 12. For the convenience of installation, further, the cover body device disclosed in the embodiment of the present application can also include a mobile frame 405, as shown in Figure 2, the closing detection trigger 49 and the opening detection trigger 402 can be mounted on the mobile frame 405, and the mobile frame 405 is connected to the cover body 12 and can move with the cover body 12. In other words, the mobile frame 405 can realize the indirect installation of the closing detection trigger 49 and the opening detection trigger 402 on the cover body 12. During the movement of the cover body 12, the mobile frame 405 can carry the closing detection trigger 49 and the opening detection trigger 402 to different positions, thereby exerting different triggering functions.

[0065] Referring again to Figures 2 to 13 , the present embodiment discloses a process chamber. The disclosed process chamber includes a chamber body 11, a cover 12, and a first sealing ring 13. Furthermore, the process chamber disclosed in the present embodiment may also include a connecting seat 41 and a cover seat 42. In other words, the process chamber disclosed in the present embodiment includes the cover device described in the above embodiment.

[0066] Specifically, the first end of the cover seat 42, which is away from the opening 02, is rotatably connected to the connecting seat 41. The cover seat 42 has a first state and a second state. The second end of the cover seat 42, which is adjacent to the opening 02, is rotatable around the first end of the cover seat 42 to switch between the first state and the second state. The second end of the cover seat 42 is located between the first end of the cover seat 42 and the opening 02 of the chamber body 11.

[0067] In the first position of the cover seat 42, the cover 12 is tilted relative to the plane of the opening 02 (for example, tilted 0.7-0.8 degrees relative to the plane). In the second position of the cover seat 42, the cover 12 is parallel to the plane of the opening 02. In essence, the cover seat 42 can change the angle between the cover 12 and the plane of the opening 02 by rotating.

[0068] In the first state of the cover seat 42, the cover 12 is tilted relative to the plane where the opening 02 is located, and the cover 12 is movable between a position avoiding the opening 02 and a position opposite to the opening 02. It should be noted that when the cover 12 is in the position opposite to the opening 02, the cover 12 is located directly above the opening 02, and the orthographic projection of the cover 12 on the opening 02 can cover the opening 02.

[0069] When the cover 12 is in a position opposite to the opening 02, the cover seat 42 can rotate to the first position, thereby preparing the cover 12 to move toward the open position. Alternatively, the cover seat 42 drives the cover 12 to rotate to the second position so that it is parallel to the plane where the opening 02 is located, and drives the cover 12 to press against the first sealing ring 13, so that the first sealing ring 13 can be clamped between the cover 12 and the chamber body 11, ultimately placing the cover 12 in the closed position. In other words, when the cover seat 42 drives the cover 12 to rotate to the second position, the cover seat 42 drives the cover 12 to squeeze and compress the first sealing ring 13.

[0070] Specifically, during the process of switching the cover 12 from the open state to the closed state, the cover seat 42 is in the first state by rotating. At this time, the cover 12 is in a state of being tilted relative to the plane where the opening 02 is located (for example, tilted 0.7 to 0.8 degrees relative to the plane where the opening 02 is located) driven by the cover seat 42. Then, the cover 12 moves relative to the cover seat 42 to a position opposite to the opening 02 so as to be located above the opening 02. Then, the cover seat 42 rotates to the second state, thereby causing the cover 12 to rotate to a position parallel to the plane where the opening 02 is located, thereby pressing the first sealing ring 13. The first sealing ring 13 can be pressed between the cover 12 and the chamber body 11 under the action of the cover 12, thereby achieving a seal between the cover 12 and the chamber body 11. During this process, the cover 12 is in a tilted state and will not cause relative friction with the first sealing ring 13 during movement, or will not cause relative friction between the first sealing ring 13 and the chamber body 11 during movement.

[0071] During the process of switching the cover 12 from the closed state to the open state, the cover seat 42 switches from the second state (at this time, the cover 12 is in the closed state where it seals and presses the first sealing ring 13, so that the first sealing ring 13 seals and connects the cover 12 and the chamber body 11) to the first state by rotating, thereby separating the cover 12 from the first sealing ring 13 or driving the first sealing ring 13 to separate from the chamber body 11. Then, the cover 12 moves relative to the cover seat 42 to a position offset from the opening 02, thereby placing the cover 12 in the open state. During this process, the cover 12 separates from the first sealing ring 13 by tilting or drives the first sealing ring 13 to separate from the chamber body 11 by tilting, thereby preventing the cover 12 from rubbing against the first sealing ring 13 during movement or preventing the first sealing ring 13 from rubbing against the chamber body 11 during movement.

[0072] From the description of the above working process, it can be known that the process chamber disclosed in the embodiment of the present application movably sets the cover body 12 on the rotatable cover body seat 42, so that the cover body seat 42 can guide the cover body 12 to move obliquely relative to the plane where the opening 02 is located in the first state, thereby moving between a position avoiding the opening 02 and a position opposite to the opening 02, so that the cover body 12 will not cause the first sealing ring 13 to wear during the process of opening or closing, thereby avoiding the problem of poor sealing caused by the wear of the first sealing ring 13. At the same time, in the process of realizing the switching of the cover body 12 between the open state and the closed state, the process chamber disclosed in the embodiment of the present application only needs the cover body seat 42 to drive the cover body 12 to rotate to an inclined position that can separate the cover body 12 from the first sealing ring 13 or that can drive the cover body 12 to separate the first sealing ring 13 from the chamber body 11, without driving the cover body 12 to rotate too large an angle, thereby alleviating the occupation of the upper space of the process chamber.

[0073] At the same time, during this process, the first end of the cover seat 42 only rotates relative to the connecting seat 41, so that the first end of the cover seat 42 does not need to occupy a large movable space, which is beneficial to further reduce the space occupied by the process chamber above it.

[0074] As described above, the first sealing ring 13 can be fixed to the cover 12, thereby following the movement of the cover 12 relative to the chamber body 11. The first sealing ring 13 can also be fixed to the chamber body 11, thereby allowing the cover 12 to move relative to the chamber body 11 and the first sealing ring 13. The embodiments of the present application do not limit whether the first sealing ring 13 is specifically installed on the cover 12 or the chamber body 11, as long as the first sealing ring 13 can be compressed by the cover 12 when the cover 12 is closed and sealed between the cover 12 and the chamber body 11.

[0075] When the first sealing ring 13 is provided in the chamber body 11, to facilitate the installation of the first sealing ring 13, the chamber body 11 may include a surrounding plate 111 surrounding the opening 02. The surrounding plate 111 has a large area, thereby facilitating the placement of the first sealing ring 13. Furthermore, the surrounding plate 111 may have an annular groove surrounding the opening 02, and the first sealing ring 13 may be fixed in the annular groove, thereby achieving stable installation.

[0076] In the embodiment of the present application, the rotational connection between the cover base 42 and the connecting base 41 can be achieved through various structures. For example, the first end of the cover base 42 can be rotatably connected to the connecting base 41 by means of an axis hinge. As shown in FIG2 , the connecting base 41 can be installed with a hinge axis 406, and the first end of the cover base 42 can be rotatably connected to the connecting base 41 by means of the hinge axis 406. For another example, the first end of the cover base 42 can be rotatably mounted on the connecting base 41 by means of a flexible member or an elastic member. The embodiment of the present application does not limit the specific rotational connection method between the first end of the cover base 42 and the connecting base 41.

[0077] When the cover device includes rails 44, all rails 44 and cover seats 42 can be located on the side of the same edge of the opening 02, as shown in Figure 2. This distribution method can avoid the rails 44 occupying the side where the other edges of the opening 02 are located, which is conducive to making the process chamber occupy a smaller space in other directions.

[0078] In some embodiments, when the cover device includes a first limiting portion, the cover 12 can be brought into limiting contact with the first limiting portion when it moves to a position opposite to the opening 02 (i.e., the first preset position), thereby preventing the cover 12 from excessively moving along the cover seat 42.

[0079] In other embodiments, when the cover device includes a second limiting portion, the cover 12 may come into limiting contact with the second limiting portion when it moves to a position avoiding the opening 02 (ie, the second preset position).

[0080] A closing detection sensor 48 is provided at the second end of the cover seat 42 , and a closing detection trigger 49 is provided on the cover 12 . When the cover 12 moves to a position opposite to the opening 02 , the closing detection trigger 49 triggers the closing detection sensor 48 .

[0081] An opening detection sensor 401 may be provided at the first end of the cover seat 42 , and an opening detection trigger 402 may be provided on the cover 12 . When the cover 12 moves to a position misaligned with the opening 02 , the opening detection trigger 402 triggers the opening detection sensor 401 .

[0082] As described above, when the cover body seat 42 rotates to the second state, the cover body 12 can compress the first sealing ring 13, thereby achieving the sealing between the cover body 12 and the chamber body 11 by the first sealing ring 13. In order to improve the sealing effect, the process chamber disclosed in the embodiment of the present application may further include a pressing mechanism 60, which can be fixed on the outer wall of the chamber body 11. When the cover body 12 is in a position opposite to the opening 02 and parallel to the plane where the opening 02 is located, the pressing mechanism 60 is used to apply pressure to the cover body 12 to squeeze the first sealing ring 13, so that the cover body 12 can better compress the first sealing ring 13, and finally the first sealing ring 13 can be better compressed to perform the sealing function.

[0083] In some embodiments of the present application, there may be one pressing mechanism 60, while in other embodiments, there may be at least two pressing mechanisms 60. The embodiments of the present application do not limit the specific type of the pressing mechanism 60. When there are at least two pressing mechanisms 60, the pressing mechanisms 60 may be arranged at intervals on the outer wall of the chamber body 11.

[0084] There can be many types of the clamping mechanism 60. For example, the clamping mechanism 60 can be a clamping mechanism. As long as it can drive the cover body 12 to press the first sealing ring 13 onto the chamber body 11, it can be used as the clamping mechanism 60 in the embodiment of the present application. Please refer to Figures 2 to 5 again. In the embodiment of the present application, the clamping mechanism 60 may include: a third driving mechanism 61 and a clamping member 62. The third driving mechanism 61 can be fixedly connected to the outer wall of the chamber body 11, and the clamping member 62 is connected to the telescopic end of the third driving mechanism 61 to achieve drive cooperation. The third driving mechanism 61 is used to drive the clamping member 62 to switch between a loose state and a clamped state. Among them, in the clamped state, part of the structure of the clamping member 62 abuts against the side of the cover body 12 facing away from the chamber body 11, and presses the cover body 12 toward the chamber body 11 to squeeze the first sealing ring 13. In the released state, the pressing member 62 is at least separated from the cover body 12 , thereby providing conditions for the movement of the cover body 12 . At this time, the pressing member 62 no longer abuts against the cover body 12 .

[0085] Specifically, when the cover 12 moves to the position covering the opening 02, the edge of the cover 12 is located between the portion of the structure of the pressing member 62 that is used to abut against the cover 12 and the chamber body 11. Since the cover 12 moves relative to the chamber body 11, the portion of the structure of the pressing member 62 that is used to abut against the cover 12 is located above the cover 12, and the chamber body 11 is located below the cover 12. Under the drive of the third driving mechanism 61, the pressing member 62 can be tightened, so that the pressing member 62 presses the cover 12 against the chamber body 11. Of course, the third driving mechanism 61 pushes the pressing member 62 upward to separate the structure of the pressing member 62 located above the cover 12 from the cover 12, thereby loosening the cover 12.

[0086] The structure of the pressing member 62 can be various. In some embodiments, the pressing member 62 can be an L-shaped structural member and include a first right-angled side 601 and a second right-angled side 602 that are perpendicular to each other. The first right-angled side 601 is connected to the telescopic end of the third driving mechanism 61 to achieve a driving connection. When the cover 12 moves to the position covering the opening 02, the edge of the cover 12 is located between the second right-angled side 602 and the chamber body 11. Of course, the angle between the first right-angled side 601 and the second right-angled side 602 can be adjusted to change the structure of the pressing member 62, and the purpose of compression can also be achieved. The embodiment of the present application does not limit the specific structure of the pressing member 62. This structure enables the pressing member 62 to switch between a released state and a compressed state only by telescopically moving the third driving mechanism 61. The structure is simple and the operation is relatively simple.

[0087] When the clamping member 62 is an L-shaped structural member, the first right-angled side 601 and the second right-angled side 602 can be an integral structure (note: manufactured by an integrated processing technology), or they can be split structures and assembled and connected by welding, connecting parts, etc., which is not limited in the embodiment of the present application.

[0088] In other embodiments, please refer to Figure 6, the clamping mechanism 60 may further include: a fourth driving mechanism 63, the fourth driving mechanism 63 can be fixed to the telescopic end of the third driving mechanism 61, so that the third driving mechanism 61 drives the fourth driving mechanism 63 to move through the telescopic end. The clamping member 62 is provided at the telescopic end of the fourth driving mechanism 63, and the fourth driving mechanism 63 is used to drive the clamping member 62 to switch between the first position and the second position. When the clamping member 62 is in the first position, the clamping member 62 is located on the side of the cover body 12 facing away from the chamber body 11, and the third driving mechanism 61 can drive the clamping member 62 to switch between the clamped state and the released state through the fourth driving mechanism 63. In the clamped state, the cover body 12 can clamp the first sealing ring 13, and in the released state, the cover body 12 can release the first sealing ring 13.

[0089] When the pressing member 62 is in the second position, the pressing member 62 and the cover body 12 are staggered, that is, the pressing member 62 avoids the side of the cover body 12 facing away from the chamber body 11. In this case, the pressing member 62 will not interfere with the rotation of the cover body 12 with the cover body seat 42, nor will it interfere with the movement of the cover body 12.

[0090] It should be noted that the movement direction of the telescopic end of the third drive mechanism 61 can be different from the movement direction of the telescopic end of the fourth drive mechanism 63. In other words, the movement direction of the telescopic end of the third drive mechanism 61, which drives the pressing member 62 to move via the fourth drive mechanism 63, is different from the movement direction of the telescopic end of the fourth drive mechanism 63 driving the pressing member 62 to move. For example, the movement direction of the telescopic end of the third drive mechanism 61 can be perpendicular to the movement direction of the telescopic end of the fourth drive mechanism 63.

[0091] Since the fourth driving mechanism 63 can drive the pressing member 62 to switch between the first position and the second position, there is no need for excessive restrictions on the structure of the pressing member 62. For example, the pressing member 62 can be a flat plate-shaped structural member, or other structural members.

[0092] The types and structures of the third drive mechanism 61 and the fourth drive mechanism 63 can be the same or different, and are not limited in this embodiment. The third drive mechanism 61 and the fourth drive mechanism 63 can be hydraulic telescopic components, pneumatic telescopic components, linear motors, etc., and are not limited in this embodiment.

[0093] When performing semiconductor processes, process gases, such as deposition gas, drying gas, etc., need to be introduced into the process space 01. In order to better ensure the sealed isolation between the process space 01 and the external environment of the process chamber, please refer to Figure 7. In one embodiment, the process chamber disclosed in the embodiment of the present application may also include: a pipeline 03, a sealing plate 05, a second sealing ring 06 and a sealing joint 08. The chamber body 11 may be provided with a mounting hole 04. The sealing plate 05 is detachably fixed on the mounting hole 04 on the chamber body 11, and the mounting hole 04 is sealed by the second sealing ring 06. The sealing plate 05 is provided with a connecting hole 07. The pipeline 03 can be detachably connected to the connecting hole 07 through the sealing joint 08 to communicate with the internal space of the chamber body 11.

[0094] Furthermore, there can be one or at least two pipelines 03, and the sealing plate 05 can be provided with at least two communication holes 07 corresponding one to each of the pipelines 03. Multiple pipelines 03 are sealedly connected to the corresponding communication holes 07 via corresponding sealing joints 08. Specifically, the functions of the pipelines 03 can be the same or different, and this embodiment of the application is not limited thereto.

[0095] It should be noted that the pipeline 03 in the embodiment of the present application may include the drying gas input pipe 31, the water film removal gas input pipe 32, the cleaning liquid input pipe 33, the waste liquid output pipe 70, etc. described later. Of course, it may also include pipelines with other functions configured in the process chamber, which is not limited by the embodiment of the present application.

[0096] The embodiment of the present application does not limit the specific type of process chamber, and the process chamber may be a chemical vapor deposition process chamber, an atomic layer deposition process chamber, etc. Of course, the process chamber may also be a cleaning chamber for performing a cleaning process to clean the wafer 90 .

[0097] In the case where the process chamber disclosed in the embodiment of the present application is a cleaning chamber, please refer to Figures 8 to 13. The process chamber disclosed in the embodiment of the present application includes a sealed chamber 10, a cleaning tank 20, a lifting mechanism 50, and a carrier 80 for carrying a wafer 90. The sealed chamber 10 includes the chamber body 11, the cover 12, and the first sealing ring 13 described above. The cleaning tank 20 and the carrier 80 are disposed within the chamber body 11 and are also located in the process space 01 enclosed by the cover 12, the first sealing ring 13, and the chamber body 11.

[0098] The space above the cleaning tank 20 within the sealed chamber 10 can be a dry space. The space within the cleaning tank 20 is a cleaning space. The lifting mechanism 50 is at least partially disposed within the sealed chamber 10 and is connected to the carrier 80. The lifting mechanism 50 is used to drive the carrier 80 to move up and down between the dry space and the cleaning space. The sealed chamber 10 has an overflow space, which is lower than the overflow port of the cleaning tank 20 (this overflow port can be the notch of the cleaning tank 20, or an overflow hole slightly lower than the notch of the cleaning tank 20). The overflow space is located outside the cleaning tank 20.

[0099] The lifting mechanism 50 can be located entirely within the sealed chamber 10, or partially within the sealed chamber 10 and partially outside the sealed chamber 10, as shown in Figures 8 to 12. Considering that the power source of the lifting mechanism 50 is not suitable for being in a special environment, in some embodiments, a portion of the lifting mechanism 50 can be located within the sealed chamber 10, and the other portion, which at least includes the power source, can be located outside the sealed chamber 10. Of course, in this case, the lifting mechanism 50 needs to be sealed from the sealed chamber 10 to prevent the connection between the lifting mechanism 50 and the sealed chamber 10 from connecting to the process space 01 and the external environment of the process chamber.

[0100] Based on this, please refer to Figures 9 to 12 again. In some embodiments, the lifting mechanism 50 may include a first base plate 51, a cap 52, a first connecting member 53, a lifting rod 59, a telescopic sleeve 54, a third sealing ring 55, a fourth sealing ring 56 and a fifth sealing ring 57.

[0101] The first end of the lifting rod 59 is located outside the sealed cavity 10 and is used to connect to a power source. The power source can be a hydraulic telescopic element, a pneumatic telescopic element, a linear motor, etc., and its function is to drive the lifting rod 59 to move up and down. The second end of the lifting rod 59 extends into the sealed cavity 10 and is connected to the first substrate 51 via the first connecting member 53. The cap 52 is sealed by the third sealing ring 55 over the portion of the first connecting member 53 exposed on the first surface of the first substrate 51. The third sealing ring 55 seals and isolates the assembly gap between the first connecting member 53 and the first substrate 51 from the process space 01. In other words, the first substrate 51 has a first surface and a second surface disposed opposite each other. The third sealing ring 55 is mounted on the outer peripheral wall of the lifting rod 59. The cap 52 is sealed by the third sealing ring 55 over the portion of the first connecting member 53 exposed on the first surface. By way of example, the first connecting member 53 can be a screw, a bolt, a rivet, etc., and the embodiments of the present application do not limit the specific type of the first connecting member 53.

[0102] The telescopic sleeve 54 can be located within the sealed chamber 10 and positioned outside the lifting rod 59. In other words, the lifting rod 59 is disposed within the telescopic sleeve 54. The first end of the telescopic sleeve 54 is sealedly connected to the second surface of the first substrate 51 via a fourth sealing ring 56. In other words, the fourth sealing ring 56 is also mounted on the outer peripheral wall of the lifting rod 59. The first end of the telescopic sleeve 54 is sealedly connected to the second surface of the first substrate 51 via the fourth sealing ring 56. The fourth sealing ring 56 seals the first end of the telescopic sleeve 54 with the second surface, thereby achieving a sealed isolation between the interior space of the telescopic sleeve 54 (which is essentially connected to the external environment of the process chamber) and the process space 01 at the location of the first end of the telescopic sleeve 54. The second end of the telescopic sleeve 54 is sealedly connected to the sealed chamber 10 via a fifth sealing ring 57 mounted outside the lifting rod 59. In other words, the fifth sealing ring 57 is mounted on the outer peripheral wall of the lifting rod 59. The second end of the telescopic sleeve 54 is sealedly connected to the sealed chamber 10 via the fifth sealing ring 57. The first substrate 51 is connected to the carrier 80. The fifth sealing ring 57 enables sealing between the second end of the telescopic sleeve 54 and the sealing cavity 10 , thereby enabling sealed isolation between the inner space of the telescopic sleeve 54 and the process space 01 at the position where the second end of the telescopic sleeve 54 is located.

[0103] In this case, the telescopic sleeve 54 is sealed and docked with the second plate surface of the first substrate 51 through the fourth sealing ring 56, and the second end of the telescopic sleeve 54 is sealed and docked with the sealed cavity 10 through the fifth sealing ring 57. The second end of the lifting rod 59 extending into the sealed cavity 10 is connected to the first substrate 51 through the first connecting member 53, and the cap 52 is covered on the part of the first connecting member 53 exposed to the first plate surface of the first substrate 51 through the third sealing ring 55. Ultimately, the lifting rod 59, one part of which is located outside the sealed cavity 10 and the other part is located inside the sealed cavity 10, is ensured to be connected to the carrier 80 while also ensuring the sealed isolation between the process space 01 and the external environment of the process chamber.

[0104] The second end of the telescopic sleeve 54 can be fixedly connected to the sealed cavity 10 via multiple second connectors 501. The fifth sealing ring 57 can surround the multiple second connectors 501, thereby preventing the process space 01 from communicating with the connection gaps between the multiple second connectors 501, ultimately ensuring a seal. For example, the second connectors 501 can be screws, bolts, rivets, etc., and the specific type of the second connectors 501 is not limited in this embodiment of the present application.

[0105] For example, the cap 52 can be connected to the first substrate 51 via a plurality of third connectors 502 surrounding the third sealing ring 55. The first connector 53 inside the cap 52 and the plurality of third connectors 502 outside the cap 52 are sealed and isolated by the third sealing ring 55. For example, the third connector 502 can be a screw, a bolt, a rivet, etc., and the specific type of the third connector 502 is not limited in this embodiment of the present application.

[0106] Furthermore, multiple third connecting members 502 can pass through the first substrate 51 and be connected to the first end of the telescopic sleeve 54. The multiple third connecting members 502 are distributed around the fourth sealing ring 56. Under the premise of ensuring the isolation function of the fourth sealing ring 56, the multiple third connecting members 502 can be simultaneously connected to the first substrate 51, the cap 52 and the first end of the telescopic sleeve 54, thereby achieving the purpose of multiple connections using fewer third connecting members 502.

[0107] At the same time, the portion where the lifting rod 59 and the sealing chamber 10 are slidably engaged is isolated outside the process space 01 , so that particles are not generated during the lifting and lowering process of the lifting rod 59 to contaminate the process space 01 .

[0108] Referring again to FIG. 9 , the lifting mechanism 50 may further include a second base plate 58 , which may be parallel to the first base plate 51 and have a clearance hole 581 , which clears the first end of the telescopic sleeve 54 . The lifting mechanism 50 may further include a leveling device 503 , which is used to adjust the level of the carrier 80 and thereby indirectly level the wafer 90 subsequently carried.

[0109] In the embodiment of the present application, the cleaning tank 20 may be provided with a first on-off valve 21. In the draining state, the first on-off valve 21 is used to discharge the waste liquid in the cleaning tank 20 into an overflow space located outside the cleaning tank 20 within the sealed chamber 10, and ultimately drain the waste liquid through the overflow space. This structure allows the waste liquid after cleaning in the cleaning tank 20 and the waste liquid overflowing during the cleaning process to enter the overflow space and ultimately drain the waste liquid through the overflow space, thereby eliminating the need to design separate drainage structures for the overflow space and the cleaning tank 20, which helps to simplify the structure of the process chamber.

[0110] In the case where the process chamber is a cleaning chamber, the process chamber disclosed in the embodiment of the present application may further include a drying gas inlet pipe 31 and a water film removal gas inlet pipe 32. The drying gas inlet pipe 31 and the water film removal gas inlet pipe 32 may be in communication with the sealed chamber 10. The drying gas inlet pipe 31 is used to deliver drying gas to the drying space. The drying gas may be an inert gas such as nitrogen or argon, or other gas that does not affect the process and can be used to dry the wafer 90. The embodiment of the present application does not limit the specific type of drying gas.

[0111] The water film removal gas inlet pipe 32 is used to deliver a water film removal gas, such as isopropyl alcohol, to the drying space. The water film removal gas has low surface tension and is highly volatile. This allows it to quickly displace the high-surface-tension cleaning liquid on the surface of wafer 90 after wafer 90 is removed from the cleaning liquid, thereby rapidly removing the cleaning liquid and facilitating the subsequent drying of wafer 90 with a dry gas. Of course, the present embodiment does not limit the type of water film removal gas used.

[0112] Because isopropyl alcohol is a carcinogen and volatile, once released into the environment outside the process chamber, it can easily mix with the air in the surrounding environment, forming an explosive mixture, which poses a significant safety hazard. Therefore, the process chamber disclosed in the embodiments of this application, due to its improved sealing performance, is more suitable for cleaning chambers that use isopropyl alcohol as a water film to remove gases.

[0113] As described above, the used cleaning liquid that overflows into the overflow space during the cleaning process is waste liquid, and the cleaning liquid remaining in the cleaning tank 20 to be discharged after cleaning is completed is also waste liquid. The waste liquid needs to be eventually discharged from the process chamber. Based on this, the process chamber disclosed in the embodiment of the present application can also include a waste liquid output pipe 70, which is used to discharge the waste liquid from the process chamber. The waste liquid output pipe 70 can be a simple one-pipe structure or a structure of at least two pipes, which is not limited by the embodiment of the present application.

[0114] In one embodiment, the waste liquid output pipe 70 may include a main pipe 71 and at least two branch pipes, wherein the first end of the main pipe 71 is connected to the overflow space of the sealed chamber 10. One end of the at least two branch pipes is connected in parallel to the second end of the main pipe 71, and the at least two branch pipes can be used to discharge different types of waste liquids respectively. The main pipe 71 is provided with a second switch valve 75, which is used to control the on / off of the main pipe 71 and is also the main switch of the waste liquid output pipe 70. Each branch pipe is provided with a third switch valve 76. All the third switch valves 76 are coordinated by on / off to achieve the separate discharge of waste liquid from a branch pipe. This structure enables the process chamber to use different cleaning liquids for the cleaning process, and the waste liquids generated after using different types of cleaning liquids can be finally discharged through the corresponding branch pipes.

[0115] Of course, when the process chamber uses the same type of cleaning fluid for the cleaning process, wastewater from different stages can be discharged through corresponding branch pipes. In one embodiment, the at least two branch pipes may include a first branch pipe 72, a second branch pipe 73, and a third branch pipe 74. The first branch pipe 72, the second branch pipe 73, and the third branch pipe 74 can be used to discharge organic wastewater, general industrial wastewater, and recycled water, respectively. This structure enables the classified discharge of wastewater, thereby reducing wastewater treatment costs at the plant level and increasing energy efficiency.

[0116] Furthermore, the at least two branches can be provided with a drainage buffer tank 77, which plays a buffering role during the drainage process to avoid the occurrence of unstable drainage problems caused by sudden changes in flow in the corresponding branch pipes, and also to prevent the discharged waste liquid from returning to the process space 01.

[0117] Please refer to Figure 13 again. The process chamber disclosed in the embodiment of the present application may also include a negative pressure exhaust pipe 78. The negative pressure exhaust pipe 78 is provided with a negative pressure pump 79 and a fourth switch valve 701. In one embodiment, the first end of the negative pressure exhaust pipe 78 can be connected to the overflow space. Alternatively, in another embodiment, the first end of the negative pressure exhaust pipe 78 can extend into the sealed cavity 10 and be connected to the cleaning tank 20. The negative pressure exhaust pipe 78 is used to perform negative pressure exhaust on the process space 01 so that all toxic gases in the process space 01 are completely exhausted after the cleaning process is completed, thereby avoiding the residual toxic gas from overflowing when the cover 12 is opened to remove the wafer 90, causing safety problems.

[0118] The process chamber disclosed in the embodiment of the present application may further include a cleaning liquid inlet pipe 33 for supplying cleaning liquid into the cleaning tank 20. Specifically, the cleaning liquid inlet pipe 33 may be connected to the bottom of the cleaning tank 20 so that the cleaning liquid is gradually filled up the cleaning tank 20 by supplying cleaning liquid to the bottom of the cleaning tank 20 and subsequently overflowing. This bottom-up supply of cleaning liquid allows particles washed off the wafer 90 to be more easily discharged from the cleaning tank 20 via overflow during the cleaning process.

[0119] In a more feasible embodiment, one end of the cleaning liquid input pipe 33 can be connected between the two ends of the negative pressure exhaust pipe 78. The cleaning liquid input pipe 33 can be equipped with a fifth on-off valve 301. The fifth on-off valve 301 is used to control the on-off of the cleaning liquid input pipe 33, thereby controlling the input of the cleaning liquid. In this case, the cleaning liquid input pipe 33 can be connected to the cleaning tank 20 through a section (i.e., a portion of the pipe section) of the negative pressure exhaust pipe 78, thereby supplying cleaning liquid into the cleaning tank 20. During operation, the fourth on-off valve 701 can be closed and the fifth on-off valve 301 can be opened. The cleaning liquid in the cleaning liquid input pipe 33 will enter the cleaning tank 20 through the section of the negative pressure exhaust pipe 78. Of course, after the cleaning process is completed, the waste liquid in the cleaning tank 20 is discharged into the overflow space through the first switch valve 21. Then, the fifth switch valve 301 can be closed, and the fourth switch valve 701 can be opened after the waste liquid is discharged, so that the negative pressure exhaust pipe 78 is connected to the empty cleaning tank 20, and then negative pressure exhaust is performed on the entire process space 01.

[0120] This structure enables the cleaning liquid inlet pipe 33 and the negative pressure exhaust pipe 78 to share a portion of the pipe section, thereby streamlining the structure of the process chamber.

[0121] Please refer to Figure 13 again. Furthermore, the process chamber disclosed in the embodiment of the present application may also include a connecting pipe 702. The first end of the connecting pipe 702 can be connected between the two ends of the negative pressure exhaust pipe 78 and is located on the side of the fourth switch valve 701 away from the negative pressure pump 79. The second end of the connecting pipe 702 can be directly connected to the overflow space, or the second end of the connecting pipe 702 can be connected to the main pipe 71 and connected to the overflow space through the main pipe 71. In this case, during the process of negative pressure exhaust by the negative pressure pump 79, the negative pressure pump 79 can also perform negative pressure exhaust on the overflow space through the connecting pipe 702, so that the negative pressure pump 79 can not only perform negative pressure exhaust through the pipe section shared with the cleaning liquid input pipe 33, but also perform negative pressure exhaust through the connecting pipe 702, which can undoubtedly improve the negative pressure exhaust efficiency.

[0122] Of course, when the second end of the connecting pipe 702 is connected to the main pipe 71 and is connected to the overflow space through the main pipe 71, the connecting pipe 702 is equivalent to borrowing a part of the pipe section of the main pipe 71 to achieve communication with the overflow space, and there is no need to design the connecting pipe 702 to be too long, which is conducive to saving consumables of the connecting pipe 702 and can also streamline the piping structure of the process chamber.

[0123] It should be noted that in the embodiments of the present application, the process chamber may be a cleaning chamber. The cleaning liquid involved in the cleaning chamber may be water (e.g., ultrapure water), an acidic solution, or other cleaning liquids applicable to the semiconductor cleaning field. The embodiments of the present application do not limit the specific type of cleaning liquid.

[0124] Please refer to Figure 13 again. The following takes the example of nitrogen as the drying gas, isopropyl alcohol as the water film removal gas, and ultrapure water as the cleaning liquid to explain in detail the cleaning process when the process chamber is a cleaning chamber: before cleaning, the cover 12 is moved to a closed state so that the cover 12 seals the opening 02 of the chamber body 11. After the cover 12 is in the closed state, the drying gas input pipe 31 sprays nitrogen into the process space 01, and the lifting mechanism 50 drives the carrier 80 to rise to the drying space, and then prepares to receive the wafer 90. During this process, the drying gas input pipe 31 continuously sprays nitrogen, and the fifth switch valve 301 is opened so that the cleaning liquid input pipe 33 inputs ultrapure water into the cleaning tank 20 (the fourth switch valve 701 is closed at this time). As ultrapure water continues to be input, it gradually fills the cleaning tank 20, causing the cleaning tank 20 to begin to be in a small overflow state. At this time, the second switch valve 75 and the third switch valve 76 on the third branch pipe 74 are opened to realize the recovery of ultrapure water (Note: at this time, since the ultrapure water has not yet cleaned the wafer 90, it can be recovered as recycled water). Then, the cover 12 is opened. The front and rear drying gas inlet pipes 31 of the cover 12 are opened to continuously spray nitrogen. The nitrogen occupies the internal space of the chamber body 11 to ensure that the gas in the external environment of the process chamber does not invade the chamber body 11. Then, after receiving the wafer 90, the carrier 80 descends. Driven by the carrier 80, the wafer 90 falls into the ultrapure water in the cleaning tank 20. After that, the cover 12 is closed.

[0125] Next, the water flow rate of the cleaning liquid inlet pipe 33 is adjusted to a preset flow rate (greater than the water flow rate in the small overflow state) to continuously rinse the wafers 90, and the drying gas inlet pipe 31 is adjusted to output a preset flow rate of nitrogen. After the first preset flushing period, the water film removal gas inlet pipe 32 is opened and isopropyl alcohol is sprayed into the process space 01. At this time, the fifth on-off valve 301 can be closed. In this case, the drying gas inlet pipe 31 and the water film removal gas inlet pipe 32 respectively deliver nitrogen and isopropyl alcohol to the process space 01. During the cleaning process, the third on-off valve 76 of the first branch pipe 72 is opened and the third on-off valve 76 of the third branch pipe 74 is closed. Waste liquid overflowing into the overflow space is discharged from the overflow space through the first branch pipe 72. The waste liquid at this stage can be used as organic wastewater. After the second preset spraying period, the lifting mechanism 50 is controlled to raise the carrier 80 to move the wafers 90 out of the cleaning tank 20.

[0126] Drying gas inlet pipe 31 and water film removal gas inlet pipe 32 continuously spray nitrogen and isopropyl alcohol. Meanwhile, lifting mechanism 50 raises wafer 90 to a predetermined position. During this process, isopropyl alcohol quickly removes the water film on wafer 90, preparing for subsequent drying with drying gas. When lifting mechanism 50 has brought wafer 90 to the predetermined position, drying gas inlet pipe 31 sprays nitrogen to dry the wafer, while water film removal gas inlet pipe 32 stops spraying isopropyl alcohol. At this point, first on-off valve 21 opens, allowing waste liquid in cleaning tank 20 to drain into the overflow space. Subsequently, the waste liquid in the overflow space is drained through first branch pipe 72. Once the waste liquid has been drained, second on-off valve 75 closes.

[0127] Then, the dry gas inlet pipe 31 stops supplying nitrogen, and the negative pressure pump 79 and the fourth switch valve 701 are opened to evacuate the air (Note: at this time, the fifth switch valve 301 is closed, so that the cleaning liquid inlet pipe 33 no longer supplies cleaning liquid into the cleaning tank 20). When the pressure in the process space 01 reaches a preset value, the negative pressure pump 79 and the fourth switch valve 701 are closed, so that the residual isopropyl alcohol in the process space 01 is completely exhausted. Then, the dry gas inlet pipe 31 is opened again to supply nitrogen into the process space 01 so that the gas pressure in the process space 01 is consistent with the atmospheric pressure in the external environment of the process chamber, thereby facilitating the opening of the cover 12. The cover 12 is then opened again, and the wafer 90 is removed by a transport device (e.g., a robot), and the cover 12 is finally closed.

[0128] Of course, when the cleaning liquid is an acidic liquid, the waste liquid overflowing during the cleaning process can be discharged as industrial wastewater through the second branch pipe 73.

[0129] From the above cleaning process, it can be seen that during the cleaning process, the dry gas sprayed from the dry gas inlet pipe 31 not only plays the function of preventing the intrusion of gas from the external environment of the process chamber, but also plays the drying function. At the same time, it can also play the role of regulating the pressure in the process space 01. By timely inflating the process space 01 after the negative pressure pumping work is completed, the pressure in the process space 01 will not be too low, and ultimately the problem of the cover 12 being difficult to open due to the pressure in the process space 01 being too low can be avoided.

[0130] Based on the process chamber disclosed in the embodiment of the present application, the embodiment of the present application further discloses a semiconductor process equipment. The disclosed semiconductor process equipment includes the process chamber described in the embodiment above.

[0131] The above embodiments of this application focus on the differences between the various embodiments. As long as the different technical features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0132] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A cover device, characterized in that: The cover body seat comprises a cover body, a connecting base and a cover body seat, wherein the first end of the cover body seat is rotatably connected to the connecting base, the cover body seat has a first state and a second state, and the second end of the cover body seat is rotatable around the first end of the cover body seat to switch the cover body seat between the first state and the second state; In the first state of the cover seat, the cover is tilted relative to a preset plane, and the cover is movable relative to the cover seat; In the second state of the cover base, the cover is parallel to the preset plane.

2. The cover device according to claim 1, wherein: The cover device further includes a first driving mechanism, which is disposed on the cover seat and connected to the cover, and is used for driving the cover to move when the cover seat is in the first state.

3. The cover device according to claim 1, wherein: The cover seat is provided with a guide portion, and the cover is in guiding cooperation with the guide portion to guide the cover to move when the cover seat is in the first state.

4. The cover device according to claim 3, wherein: There are at least two guide parts, which are distributed on the cover seat at intervals.

5. The cover device according to claim 1, wherein: The cover device also includes: a second driving mechanism, which is connected to the cover seat and is used to drive the second end of the cover seat to rotate around the first end of the cover seat to switch the cover seat between the first state and the second state.

6. The cover device according to claim 1, wherein: The cover body has a first preset position relative to the cover body seat, and when the cover body moves to the first preset position, the cover body is away from the first end of the cover body seat; the cover body seat is provided with a first limiting buffer portion, and the first limiting buffer portion is used to cooperate with the cover body moved to the first preset position; and / or, The cover body has a second preset position relative to the cover body seat. When the cover body moves to the second preset position, the cover body is close to the first end of the cover body seat. The cover body seat is provided with a second limiting buffer portion, and the second limiting buffer portion is used to cooperate with the cover body moved to the second preset position.

7. The cover device according to claim 1, wherein: The cover body has a first preset position relative to the cover body seat, and when the cover body moves to the first preset position, the cover body is away from the first end of the cover body seat; The cover seat is provided with a closing detection sensor, and the cover is provided with a closing detection trigger, wherein the closing detection trigger is used to trigger the closing detection sensor when the cover moves to the first preset position; and / or, The cover body has a second preset position relative to the cover body seat, and when the cover body moves to the second preset position, the cover body is close to the first end of the cover body seat; The cover seat is provided with an opening detection sensor, and the cover is provided with an opening detection trigger, and the opening detection trigger is used to trigger the opening detection sensor when the cover moves to the second preset position.

8. A process chamber, characterized in that: A cover device comprising a first sealing ring, a chamber body, and any one of claims 1 to 7, wherein the chamber body is provided with an opening, the first sealing ring is used to seal the opening, a first end of the cover seat is away from the opening, a second end of the cover seat is close to the opening, and the predetermined plane is parallel to the plane where the opening is located; In the first state of the cover seat, the cover is tilted relative to the plane where the opening is located, and the cover is movable between a position avoiding the opening and a position opposite to the opening; When the cover is located opposite to the opening, the cover seat can drive the cover to rotate to the second state where the cover is parallel to the plane where the opening is located and drive the cover to squeeze the first sealing ring.

9. The process chamber according to claim 8, wherein: The process chamber further includes: a clamping mechanism connected to the outer wall of the chamber body, and when the cover is in a position opposite to the opening and parallel to the plane where the opening is located, the clamping mechanism is used to apply pressure to the cover to squeeze the first sealing ring.

10. The process chamber according to claim 9, wherein: There are at least two pressing mechanisms, which are arranged at intervals on the outer wall of the chamber body.

11. The process chamber according to claim 9, wherein: The clamping mechanism includes: a third driving mechanism and a clamping member, the third driving mechanism is connected to the chamber body, the clamping member is driven and cooperated with the third driving mechanism, and the third driving mechanism is used to drive the clamping member to switch between a loose state and a clamping state. In the compressed state, a portion of the compression member abuts against a side of the cover facing away from the chamber body, and presses the cover toward the chamber body, so that the cover squeezes the first sealing ring; In the released state, the pressing member is at least separated from the cover body.

12. The process chamber according to claim 11, wherein: The cover is movable relative to the chamber body. When the cover moves to a position covering the opening, an edge of the cover is located between a portion of the pressing member that is used to abut against the cover and the chamber body.

13. The process chamber according to claim 12, wherein: The clamping member is an L-shaped structural member and includes a first right-angled side and a second right-angled side that are perpendicular to and connected to each other. The first right-angled side is driven and connected to the third driving mechanism. When the cover body moves to a position covering the opening, the edge of the cover body is located between the second right-angled side and the chamber body.

14. The process chamber according to claim 11, wherein: The clamping mechanism further includes: a fourth driving mechanism, the fourth driving mechanism is connected to the telescopic end of the third driving mechanism, the clamping member is connected to the telescopic end of the fourth driving mechanism, the third driving mechanism drives the clamping member to switch between the clamping state and the loosening state through the fourth driving mechanism; the fourth driving mechanism is used to drive the clamping member to switch between the first position and the second position, In the first position of the pressing member, the pressing member is located on a side of the cover body facing away from the chamber body; In the second position of the pressing member, the pressing member and the cover body are staggered, and the moving direction of the pressing member driven by the third driving mechanism is different from the moving direction of the pressing member driven by the fourth driving mechanism.

15. The process chamber according to claim 14, wherein: The pressing member is a flat plate-shaped structural member.

16. The process chamber according to claim 8, wherein: The process chamber further includes: a pipeline, a sealing plate, a second sealing ring and a sealing joint. The chamber body is provided with a mounting hole. The sealing plate is detachably fixed to the mounting hole of the chamber body and seals the mounting hole through the second sealing ring. The sealing plate is provided with a communicating hole. The pipelines are all detachably connected to the communicating hole through the sealing joint to communicate with the chamber body.

17. The process chamber according to claim 16, wherein: There are multiple pipelines, and the sealing plate is provided with at least two communicating holes corresponding to the pipelines one by one. The multiple pipelines are respectively sealed and connected to the corresponding communicating holes through the corresponding sealing joints.

18. The process chamber according to claim 16, wherein: The sealing joint is sealed and connected with the corresponding communicating hole by means of sealing thread matching.

19. The process chamber according to any one of claims 8 to 18, characterized in that The process chamber includes a sealed cavity, which includes the chamber body, the cover and the first sealing ring. The process chamber also includes a cleaning tank, a lifting mechanism and a carrier for carrying wafers, wherein: The cleaning tank and the supporting frame are arranged in the sealed cavity, the space above the cleaning tank in the sealed cavity is a drying space, and the space in the cleaning tank is a cleaning space. The lifting mechanism is at least partially arranged in the sealed cavity and connected to the supporting frame. The lifting mechanism is used to drive the supporting frame to rise and fall and switch between the drying space and the cleaning space. The sealed cavity has an overflow space, which is lower than the overflow port of the cleaning tank and is located outside the cleaning tank.

20. The process chamber according to claim 19, wherein: The lifting mechanism includes: a first base plate, a cover cap, a first connecting member, a lifting rod and a telescopic sleeve, wherein: The first substrate has a first plate surface and a second plate surface that are opposite to each other. The first end of the lifting rod is located outside the sealed cavity, the second end of the lifting rod extends into the sealed cavity and is connected to the first substrate via the first connecting member, and the cap sealing cover is located on a portion of the first connecting member exposed to the first plate surface; The telescopic sleeve is located in the sealed cavity and is sleeved outside the lifting rod. The first end of the telescopic sleeve is sealed and docked with the second plate surface. The second end of the telescopic sleeve is sealed and connected to the sealed cavity, and the first substrate is connected to the supporting frame.

21. The process chamber according to claim 19, wherein: The cleaning tank is provided with a first switch valve, and the first switch valve is used to discharge the waste liquid in the cleaning tank into the overflow space in a draining state.

22. The process chamber according to claim 19, wherein: The process chamber also includes: a drying gas input pipe and a water film removal gas input pipe, the drying gas input pipe and the water film removal gas input pipe are connected to the sealed cavity, the drying gas input pipe is used to transport drying gas into the drying space, and the water film removal gas input pipe is used to transport water film removal gas into the drying space.

23. The process chamber according to claim 19, wherein: The process chamber further includes: a waste liquid output pipe, which includes: a main pipe and at least two branch pipes, wherein a first end of the main pipe is connected to the overflow space of the sealed cavity, and one end of the at least two branch pipes is connected in parallel to the second end of the main pipe, and the at least two branch pipes are respectively used to discharge different types of waste liquids, the main pipe is provided with a second switch valve, and each of the branch pipes is provided with a third switch valve.

24. The process chamber according to claim 23, wherein: The at least two branch pipes include: a first branch pipe, a second branch pipe and a third branch pipe, and the first branch pipe, the second branch pipe and the third branch pipe are used for discharging organic wastewater, industrial wastewater and recycled water respectively.

25. The process chamber according to claim 24, wherein: The at least two branch pipes are each provided with a drainage buffer tank.

26. The process chamber according to claim 23, wherein: The process chamber also includes: a negative pressure exhaust pipe, which is provided with a negative pressure pump and a fourth switch valve, the first end of the negative pressure exhaust pipe is connected to the overflow space or the first end of the negative pressure exhaust pipe extends into the sealed cavity and is connected to the cleaning tank, and the second end of the negative pressure exhaust pipe is connected to at least one of the at least two branches.

27. The process chamber according to claim 26, wherein: The process chamber further includes: a cleaning liquid input pipe, one end of which is connected between the two ends of the negative pressure exhaust pipe, and the cleaning liquid input pipe is provided with a fifth switch valve.

28. The process chamber according to claim 26, wherein: The process chamber also includes: a connecting pipe, a first end of the connecting pipe is connected between the two ends of the negative pressure exhaust pipe and is located on the side of the fourth switch valve away from the negative pressure pump, and a second end of the connecting pipe is connected to the main pipe and communicates with the overflow space through the main pipe.

29. A semiconductor process equipment, characterized in that: A process chamber comprising the process chamber according to any one of claims 8 to 28.

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