Vibration-resistant structure for electronic component and heat medium heating device comprising same

Abstract

[Problem] To provide a vibration-resistant structure for an electronic component, said vibration-resistant structure improving the vibration resistance and heat dissipation of the electronic component. [Solution] A vibration-resistant structure for a capacitor 26 for controlling an electric heater, said structure being used in a heat medium heating device 1 provided with a heat medium flow path, which is formed within flow path parts 6, 7 of a housing 2, and the electric heater, which heats the heat medium flowing through the heat medium flow path, and comprising: a wall part 51 that is formed in the housing 2 and that surrounds the periphery of the capacitor 26; and a heat dissipation material 52 that fills between the wall part 51 and the capacitor 26.

Description

Vibration-resistant structure for electronic components and heat transfer medium heating device equipped with the same

[0001] The present invention relates to a vibration-resistant structure of electronic components used in a heat medium heating device that uses an electric heater to heat a heat medium flowing through a heat medium flow path formed inside a housing, and to a heat medium heating device equipped with the same.

[0002] A conventional heat medium heating device used for air conditioning the interior of a vehicle has a heat medium flow path formed in a housing, and a cylindrical electric heater called a cartridge heater is arranged in this heat medium flow path to heat the heat medium flowing through the heat medium flow path. In this case, for example, two heat medium flow paths are provided in the housing, and one end of each heat medium flow path is connected by a communication path, and an electric heater is arranged in each heat medium flow path, and the heat medium flowing in through a heat medium inlet port formed at the other end of one heat medium flow path is heated by each electric heater and then flows out from a heat medium outlet port formed at the other end of the other heat medium flow path (see, for example, Patent Document 1).

[0003] Special table 2016-536197 publication

[0004] In recent years, this type of heat transfer medium heater has been required to be compatible with high voltages (e.g., 800 V, etc.), and there is a demand for heat transfer medium heaters that are designed for use in higher voltage ranges than before. In order to support such high voltages, the current and voltage applied to electronic components such as IGBTs, capacitors (film capacitors), and coils for controlling the electric heater also increase, which results in the size of compatible electronic components.

[0005] On the other hand, since the heat medium heating device is expected to be installed in a vehicle, high vibration resistance is required. However, as the electronic components become larger as described above, the height of the electronic components relative to the control board increases, and the distance from the control board to the center of gravity of the electronic components increases, making them more susceptible to vibration, which poses an issue regarding the strength of the joint between the electronic components and the control board.

[0006] Furthermore, as electronic components become larger, the amount of heat they generate also increases. Conventionally, heat was dissipated through the air, which caused a problem of temperature rise and destruction when the ambient temperature was high.

[0007] The present invention has been made to solve the above-mentioned conventional technical problems, and aims to provide a vibration-resistant structure for electronic components that improves the vibration resistance and heat dissipation of electronic components, and a heat transfer medium heating device equipped with the same.

[0008] The present invention is used in a heat medium heating device having a heat medium flow path formed within a housing and an electric heater that heats the heat medium flowing through the heat medium flow path, and is a vibration-resistant structure for an electronic component that controls the electric heater, characterized in that it comprises a wall portion formed in the housing that surrounds the periphery of the electronic component, and a heat dissipation material filled between the wall portion and the electronic component.

[0009] The vibration-resistant structure for electronic components according to the invention of claim 2 is characterized in that in the above invention, the heat dissipation material is a two-component curing resin.

[0010] The vibration-resistant structure for electronic components of the invention of claim 3 is characterized in that in the invention of claim 1, the electronic component is a capacitor.

[0011] The vibration-resistant structure for electronic components of the invention of claim 4 is characterized in that in the invention of claim 1, the electronic component is a coil.

[0012] A heat medium heating device according to a fifth aspect of the present invention comprises the vibration-resistant structure of the electronic components of each of the above-described inventions, at least two heat medium flow paths arranged side by side within a housing, a communication path connecting one end of each heat medium flow path, a heat medium inlet port formed at the other end of one of the heat medium flow paths, a heat medium outlet port formed at the other end of the other heat medium flow path, an electric heater, and a control board provided within the housing and on which electronic components are mounted, wherein the heat medium flow paths are arranged spaced apart from each other, and the electronic components are arranged within the spaces between the heat medium flow paths.

[0013] The heat medium heating device of the present invention according to claim 6 is characterized in that in the above invention, the wall portion is capable of exchanging heat with the heat medium flowing through each heat medium flow path and the communication flow path.

[0014] The heat transfer medium heating device of the invention of claim 7 is characterized in that in the above invention, the housing has at least two flow path sections in which a heat transfer medium flow path is formed, and a communicating section in which a communicating flow path is formed, and the wall section is formed integrally with the flow path sections and / or the communicating section.

[0015] According to the present invention, a heat transfer medium heating device includes a heat transfer medium flow path formed within a housing and an electric heater for heating the heat transfer medium flowing through the heat transfer medium flow path. The vibration-resistant structure for an electronic component for controlling the electric heater includes a wall formed in the housing to surround the electronic component, and a heat dissipation material is filled between the wall and the electronic component. This structure improves vibration resistance even for large electronic components. This prevents damage to the joint between the electronic component and the control board due to vibration, making the device extremely suitable for vehicle-mounted heat transfer medium heating devices that require high vibration resistance.

[0016] In addition, the heat dissipation material filled between the wall and the electronic components ensures that the amount of heat dissipated from the electronic components is also sufficient, so that even if the electronic components become larger and the amount of heat dissipated increases, the temperature can be maintained at an appropriate range.

[0017] In this case, as in the invention of claim 2, a two-component curing resin with a relatively high thermal conductivity can be used as the heat dissipation material. In particular, by using a two-component curing resin, the position of the electronic components can be easily adjusted immediately after the heat dissipation material is filled, and after curing, the joints between the electronic components and the control board can be prevented from being damaged by vibration, thereby improving assembly ease and vibration resistance. Furthermore, by using a two-component curing resin, the holding time until curing is shortened, thereby improving the productivity of the device.

[0018] The electronic components include, for example, a capacitor as in the third aspect of the invention and a coil as in the fourth aspect of the invention.

[0019] The heat medium heating device of the invention of claim 5 comprises the vibration-resistant structure of the electronic components of each of the above inventions, at least two heat medium flow paths arranged side by side within a housing, a communicating flow path connecting one end of each heat medium flow path, a heat medium inlet port formed at the other end of one of the heat medium flow paths, a heat medium outlet port formed at the other end of the other heat medium flow path, an electric heater, and a control board provided within the housing and on which electronic components are mounted, and since each heat medium flow path is arranged at a distance from each other, it is possible to prevent heat exchange between the heat medium flowing through the heat medium inlet port and the heat medium outlet port.

[0020] In particular, since the electronic components are arranged within the spaces between the heat medium flow paths, the dead space between the heat medium flow paths can be effectively utilized for arranging the electronic components used to control the electric heater, thereby making it possible to reduce the size of the heat medium heating device.

[0021] Furthermore, if the wall portion is capable of exchanging heat with the heat medium flowing through each heat medium flow path and the communicating flow path as in the invention of claim 6, the electronic components can exchange heat with the heat medium via the heat dissipation material and the wall portion on three sides surrounded by each heat medium flow path and the communicating flow path, and the electronic components can be reliably cooled to below the allowable temperature.

[0022] In this case, for example, as in the invention of claim 7, by integrating at least two flow path sections provided in the housing and having a heat medium flow path therein, and all or any of the communicating sections having a communicating flow path therein, with the wall section, it is possible to further improve the heat exchange performance between the electronic component and the heat medium.

[0023] Fig. 2 is a perspective view showing the appearance of a heat medium heating device of an embodiment to which the vibration-resistant structure of an electronic component of the present invention is applied. Fig. 3 is a schematic cross-sectional plan view for explaining a flow path of a heat medium in the heat medium heating device of Fig. 1. Fig. 4 is a plan view showing the inside of the heat medium heating device of Fig. 1. Fig. 5 is a transparent plan view of a control board of the heat medium heating device in Fig. 3. Fig. 6 is a vertical cross-sectional side view of the heat medium heating device of Fig. 1. Fig. 7 is a circuit block diagram of a control device of the heat medium heating device of Fig. 1.

[0024]

[0023] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a perspective view showing the appearance of a heat medium heating device 1 according to an embodiment of the present invention, Fig. 2 is a schematic cross-sectional plan view illustrating the flow of heat medium within the heat medium heating device 1, Fig. 3 is a plan view showing the inside of the main body 3 of the housing 2 with the cover 4 of the heat medium heating device 1 of Fig. 1 removed, Fig. 4 is a see-through view of the control board 21 of Fig. 3, Fig. 5 is a longitudinal side cross-sectional view of the heat medium heating device 1, and Fig. 6 is a circuit block diagram of a control device 31.

[0025] (1) Heat Medium Heating Device 1 The heat medium heating device 1 of the embodiment is used to air-condition the interior of a vehicle (not shown), and has a housing 2 composed of a main body 3 made of a metal having high thermal conductivity, such as iron or aluminum, and a cover 4 also made of metal attached to the main body 3. In the embodiment, two flow path sections 6 and 7 (also made of metal) are provided in the main body 3 of the housing 2, spaced apart from each other at a distance 8, and form part of the main body 3, with heat medium flow paths 9 and 11 formed therein, respectively. That is, the heat medium flow paths 9 and 11 are arranged side by side in the housing 2, spaced apart from each other at the distance 8.

[0026] A communication section 13 having a communication flow path 12 formed therein is connected to one end of the flow path sections 6, 7, and constitutes part of the main body 3, and one end of both heat medium flow paths 9, 11 are connected to each other by this communication flow path 12. A heat medium inlet section 16 is connected to the other end of one heat medium flow path 9, and a heat medium outlet section 17 is connected to the other end of the other heat medium flow path 11.

[0027] In each figure, reference numerals 18 and 19 denote rod-shaped electric heaters (heat generating elements) constituted by cartridge heaters (cylindrical heaters) in this embodiment, and electric heater (electric heater 1) 18 is inserted into one heat medium flow path 9 with a gap between it and the inner surface of flow path portion 6, while electric heater (electric heater 2) 19 is inserted into the other heat medium flow path 11 with a gap between it and the inner surface of flow path portion 7.

[0028] A control board 21 is attached to the cover 4 side of each of the flow passage sections 6, 7 in the main body 3. Mounted on this control board 21 are a power switching element 22 (IGBT1) for controlling the supply of electricity to the electric heater 18, a power switching element 23 (IGBT2) for controlling the supply of electricity to the electric heater 19, and a power switching element 24 (IGBT3) for adjusting the overall power of each of the electric heaters 18, 19. In this embodiment, the plurality of power switching elements 22 to 24 are configured by IGBTs.

[0029] Also mounted on the control board 21 are a capacitor 26 (film capacitor) as an electronic component constituting the noise filter 25, and a choke coil 27 as a coil, which is also an electronic component. The capacitor 26 and choke coil 27 are electronic components larger in size than the power switching elements 22 to 24. The power switching elements 22 to 24, the capacitor 26, the choke coil 27, etc. constitute a control device 31 (FIG. 6) for controlling the electric heaters 18, 19, etc. of the heat medium heating device 1.

[0030] Furthermore, each of the power switching elements 22 to 24 is mounted on the surface of the control board 21 facing the flow path sections 6 and 7, and is attached in a heat exchange relationship with the flow path section 6. As a result, each of the power switching elements 22 to 24 is arranged in a heat exchange relationship with the heat medium flowing in the heat medium flow path 9. Furthermore, the power switching element 24 (a specific power switching element) is arranged upstream of the other power switching elements 22 and 23 with respect to the flow of the refrigerant (FIG. 3).

[0031] Furthermore, a capacitor 26 and a choke coil 27 are also mounted on the surface of the control board 21 on the side of each of the flow path sections 6 and 7, and are inserted and arranged in the gap 8 between the flow path section 6 (heat medium flow path 9) and the flow path section 7 (heat medium flow path 11) (FIGS. 3 to 5).

[0032] 3 to 5, a wall portion 51 (made of metal) stands up from the main body 3 at a position corresponding to the periphery of the capacitor 26 within the gap 8 and is formed integrally with the main body 3. In the embodiment, this wall portion 51 comprises a vertical wall 51A on the flow path portion 6 side, a vertical wall 51B on the communication portion 13 side that is continuous with one end of the vertical wall 51A, a vertical wall 51C on the flow path portion 7 side that is continuous with one end of the vertical wall 51B, and a vertical wall 51D that connects one end of the vertical wall 51C to the other end of the vertical wall 51A, and is open on the control board 21 side.

[0033] In addition, the wall portion 51 has an inner dimension sufficient to surround the periphery of the capacitor 26 with a gap therebetween, and the outer surface of the vertical wall 51A abuts in a heat-exchanging manner against the outer surface of the flow path portion 6, so as to be in a heat-exchanging relationship, the outer surface of the vertical wall 51B abuts in a heat-exchanging manner against the outer surface of the communication portion 13, so as to be in a heat-exchanging relationship, and the vertical wall 51C abuts in a heat-exchanging manner against the outer surface of the flow path portion 7, so as to be in a heat-exchanging relationship.

[0034] Capacitor 26 is inserted into wall portion 51 through an opening in said wall portion 51, and heat dissipation material 52 is filled between capacitor 26 and wall portion 51. In this embodiment, heat dissipation material 52 is made of a two-component curing resin such as epoxy resin, and has relatively high conductivity.

[0035] When assembling the thermal medium heating device 1, first, one liquid (fluidity) of the heat dissipation material 52 is poured into the wall 51. Then, when attaching the control board 21 to the main body 3, the capacitor 26 is inserted into the wall 51 and immersed in the heat dissipation material 52 poured into the wall 51. Next, the other liquid of the heat dissipation material 52 is poured into the wall 51, and the heat dissipation material 52 is hardened. As a result, the capacitor 26 is buried in the heat dissipation material 52, and is surrounded by the heat dissipation material 52 and the wall 51.

[0036] As another assembly method, for example, a heat dissipation material 52 in a two-liquid mixture may be injected into the wall portion 51, and the capacitor 26 may be inserted into the wall portion 51 and embedded in the heat dissipation material 52 before it hardens.

[0037] In this way, using a two-component curing resin as the heat dissipation material 52 allows it to harden in a shorter time at room temperature than a one-component resin. That is, by using a two-component curing resin as the heat dissipation material 52, it is possible to easily adjust the position of the capacitor 26 immediately after filling the heat dissipation material 52, and after hardening, it is possible to prevent the joint between the capacitor 26 and the control board 21 from being damaged by vibration, thereby improving assembly ease and vibration resistance. Furthermore, using a two-component curing resin shortens the holding time until hardening, thereby improving the productivity of the heat medium heating device 1.

[0038] (3) Control Device 31 Next, Figure 6 shows the circuit block of the control device 31. The noise filter 25 mentioned above is connected to the vehicle battery (DC power source) (not shown). The power switching element 22 and the electric heater 18 are connected in series, and the power switching element 23 and the electric heater 19 are connected in series, with these two series circuits being connected in parallel. The power switching element 24 is connected in series to these parallel circuits, and a current sensor 32 is connected in series to the power switching element 24.

[0039] The power switching elements 22 and 23 are connected to the positive electrode side of the noise filter 25, and the current sensor 32 is connected to the negative electrode side. As a result, the currents that flow through the two power switching elements 22 and 23 join together and flow through the power switching element 24.

[0040] 6, reference numeral 36 denotes a control unit configured by a microcomputer, and drivers 37, 38, and 39 are connected to the output of this control unit 36. Driver 37 is connected to the gate of power switching element 22, and driver 38 is connected to the gate of power switching element 23. Driver 39 is connected to the gate of power switching element 24.

[0041] The control unit 36 ​​receives the output of the current sensor 32, as well as the outputs of the inlet temperature sensor 41 and the outlet temperature sensor 42. The inlet temperature sensor 41 detects the temperature of the heat medium flowing into the heat medium flow path 9 from the heat medium inlet portion 16, and the outlet temperature sensor 42 detects the temperature of the heat medium flowing out from the heat medium outlet portion 17. In this application, the heat medium flowing in from the heat medium inlet portion 16 means the heat medium immediately before or immediately after entering the heat medium inlet portion 16, and the heat medium flowing out from the heat medium outlet portion 17 means the heat medium immediately before or immediately after exiting the heat medium outlet portion 17.

[0042] (4) Operation of Heat Medium Heating Device 1 With the above configuration, next we will explain the operation of the heat medium heating device 1. A heat medium circuit (not shown) is connected to the heat medium inlet portion 16, and a heat medium (water in this embodiment) flows from the heat medium inlet portion 16 into the heat medium flow path 9 by a pump (not shown). The heat medium that has flowed into the heat medium flow path 9 flows into the heat medium flow path 11 via the communication flow path 12, and then flows out of the heat medium outlet portion 17 into the heat medium circuit described above.

[0043] Meanwhile, the control unit 36 ​​of the control device 31 controls the switching of the power switching elements 22 to 24 by the drivers 37 to 39 based on the outputs of the inlet temperature sensor 41, the outlet temperature sensor 42, and the current sensor 32. As a result, the electric heaters 18, 19 are energized and generate heat, so that the heat medium that has flowed into the heat medium flow path 9 is heated as it passes around the electric heater 18, and is further heated as it enters the heat medium flow path 11 and passes around the electric heater 19.

[0044] A heater core disposed in the HV unit of the vehicle is connected to the heat medium circuit, and the heat medium heated by the heat medium heating device 1 is circulated through this heater core. Air supplied to the vehicle cabin is passed through the heater core, thereby heating the cabin.

[0045] The control unit 36 ​​controls the switching of the power switching elements 22, 23 based on the temperature of the inflowing heat medium detected by the inlet temperature sensor 41 and the temperature of the outflowing heat medium detected by the outlet temperature sensor 42, and controls the supply of electricity to each of the electric heaters 18, 19. The currents flowing through these power switching elements 22, 23 (electric heaters 18, 19) join together and flow to a power switching element (specific power switching element) 24. The control unit 36 ​​controls the switching of the power switching element 24 based on the value of this joined current detected by the current sensor 32, and adjusts the overall power of each of the electric heaters 18, 19.

[0046] Here, the currents flowing through the power switching elements 22, 23 are joined together and flow through the power switching element 24 (specific power switching element), so the power switching element 24 generates more heat than the power switching elements 22, 23 and generates the greatest amount of heat. However, because the power switching element 24 is arranged upstream of the other power switching elements 22, 23 with respect to the flow of the heat medium, it exchanges heat with the heat medium that has the lowest temperature and has flowed into the heat medium flow path 9.

[0047] As a result, the heat from the power switching element 24, which generates the most heat, is smoothly transferred to the heat medium, so that the power switching element 24 is effectively cooled and the temperature of the heat medium is efficiently increased by the heat from the power switching element 24. Note that the heat generated by the power switching elements 22 and 23 is also transferred to the heat medium downstream of the power switching element 24, so that the power switching elements 22 and 23 are also cooled and the temperature of the heat medium further increases.

[0048] (5) Effects of the arrangement of the heat medium flow paths 9, 11 and the power switching elements 22 to 24 As a result, the heat medium can be efficiently heated, and all of the power switching elements 22 to 24 can be maintained in an appropriate temperature range, thereby preventing failure of the power switching elements 22 to 24.

[0049] That is, by arranging the power switching elements 22 to 24 in a heat exchange relationship with the heat medium, the heat medium is heated by the heat generated by the power switching elements 22 to 24, and the power switching elements 22 to 24 themselves can be cooled.

[0050] As described above, in the heat medium heating device 1, the heat medium flow paths 9, 11 are arranged at a distance from each other, so that heat exchange between the heat medium flow paths 9, 11 does not occur. Therefore, even when the temperature of the heat medium flowing in from the heat medium inlet portion 16 is detected by the inlet temperature sensor 41 as in the embodiment and the electric heaters 18, 19 are controlled based on the temperature, it is possible to avoid the inconvenience of detecting an erroneous temperature.

[0051] Furthermore, even when the electric heaters 18, 19 are disposed in the heat medium flow paths 9, 11, respectively, to heat the heat medium flowing in from the heat medium inlet portion 16 and cause the heat medium to flow out from the heat medium outlet portion 17, as in the embodiment, it is possible to avoid the inconvenience of the outflowing refrigerant being cooled by the inflowing refrigerant.

[0052] (6) Effects of Arrangement of Capacitor 26 and Vibration-Resistant Structure Furthermore, the control board 21 on which electronic components constituting the control device 31 for controlling the electric heaters 18, 19 are mounted is provided inside the housing 2, and the capacitor 26 and choke coil 27, which are electronic components constituting the noise filter 25 of this control board 21, are arranged within the gap 8 between each heat medium flow path 9, 11. Therefore, the dead space (gap 8) between each heat medium flow path 9, 11 can be effectively used for arranging the electronic components, and the heat medium heating device 1 can be made smaller.

[0053] Furthermore, in this embodiment, the capacitor 26 and the choke coil 27, which are electronic components larger in size than the power switching elements 22 to 24, are arranged within the space 8, which effectively reduces the size of the entire device. Also, even if it becomes necessary to change the capacitor 26 or the choke coil 27 to meet the required specifications, the heat medium heating device 1 can be accommodated within the space 8 without increasing its size, which increases the degree of freedom in design.

[0054] In particular, in the present invention, a wall 51 is formed in the housing 2 so as to surround the periphery of the capacitor 26, which is an example of an electronic component, and a heat dissipation material 52 is filled between the wall 51 and the capacitor 26, thereby improving vibration resistance even in the case of a large capacitor 26. This makes it possible to prevent the joint between the capacitor 26 and the control board 21 from being damaged by vibration, making the present invention extremely suitable for a vehicle-mounted heat medium heating device 1 that requires high vibration resistance.

[0055] In addition, the heat dissipation material 52 filled between the wall portion 51 and the capacitor 26 also ensures the amount of heat dissipation from the capacitor 26, so that even if the capacitor 26 becomes larger and the amount of heat dissipation increases, it becomes possible to maintain the temperature at an appropriate range.

[0056] In this embodiment, the vertical walls 51A, 51C, and 51B constituting the wall portion 51 are in a heat exchange relationship with the flow path portions 6 and 7 and the communicating portion 13, and are configured to be able to exchange heat with the heat medium flowing through the heat medium flow paths 9 and 11 and the communicating flow path 12. As a result, the capacitor 26 can exchange heat with the heat medium via the heat dissipation material 52 and the wall portion 51 on three sides surrounded by the heat medium flow paths 9 and 11 and the communicating flow path 12, and the capacitor 26 can be reliably cooled to a temperature equal to or lower than the allowable temperature.

[0057] In the embodiment, the capacitor 26 is used as an electronic component, but the present invention is not limited to this and the vibration-resistant structure of the present invention is also effective for the choke coil 27 (electronic component).

[0058] In addition, in the embodiment, the wall portion 51 is formed integrally with the main body 3, but this is not limiting, and the vertical wall 51A of the wall portion 51 may be formed integrally with the flow path portion 6, the vertical wall 51B may be formed integrally with the communication portion 13, and the vertical wall 51C may be formed integrally with the flow path portion 7. With such a configuration, it is possible to further improve the heat exchange performance between the capacitor 26 and the heat medium.

[0059] In addition, in the embodiment, the capacitor 26 and the choke coil 27 are arranged within the gap 8, but only the capacitor 26 may be arranged, or if a vibration-resistant structure is applied to the choke coil 27, only the choke coil 27 may be arranged. Furthermore, in the embodiment, the inlet temperature sensor 41 and the outlet temperature sensor 42 are provided to control the energization of the electric heaters 18, 19, but control may be performed using only the inlet temperature sensor 41 or only the outlet temperature sensor 42.

[0060] Furthermore, although the embodiment has been described as including two heat medium flow paths 9 and 11, the present invention is also effective when more heat medium flow paths are configured and arranged at a distance from each other. Also, although the embodiment has been described as including IGBTs as the power switching elements 22 to 24, they may be configured as MOSFETs or the like.

[0061] Furthermore, although the embodiment has been described taking as an example a heat medium heating device used for vehicle air conditioning, the vibration-resistant structure of the present invention is not limited to this and is effective for heat medium heating devices in various heating systems.

[0062] REFERENCE SIGNS LIST 1 Heat medium heating device 2 Housing 8 Spacing 9, 11 Heat medium flow path 12 Communication flow path 16 Heat medium inlet portion 17 Heat medium outlet portion 18, 19 Electric heater 21 Control board 22 to 24 Power switching element 25 Noise filter 26 Capacitor (electronic component) 27 Choke coil (electronic component) 31 Control device 32 Current sensor 36 Control unit 41 Inlet temperature sensor 42 Outlet temperature sensor 51 Wall portion 51A to 51D Vertical wall 52 Heat dissipation material

Claims

1. A vibration-resistant structure for an electronic component used in a heat medium heating device having a heat medium flow path formed in a housing and an electric heater for heating the heat medium flowing through the heat medium flow path, the vibration-resistant structure for an electronic component for controlling the electric heater, comprising: a wall portion formed in the housing and surrounding the periphery of the electronic component; and a heat dissipation material filled between the wall portion and the electronic component.

2. The vibration-resistant structure for electronic components according to claim 1, wherein the heat dissipation material is a two-component curing resin.

3. The vibration-resistant structure for electronic components according to claim 1, wherein the electronic component is a capacitor.

4. The vibration-resistant structure for electronic components according to claim 1, wherein the electronic component is a coil.

5. A heat medium heating device with a vibration-resistant structure for electronic components as defined in any of claims 1 to 4, comprising at least two of the heat medium flow paths arranged side by side within the casing, a communicating flow path connecting one end of each of the heat medium flow paths, a heat medium inlet section formed at the other end of one of the heat medium flow paths, a heat medium outlet section formed at the other end of the other of the heat medium flow paths, the electric heater, and a control board provided within the casing and on which the electronic components are mounted, wherein the heat medium flow paths are arranged spaced apart from each other, and the electronic components are arranged within the spaces between the heat medium flow paths.

6. The heat medium heating device according to claim 5, wherein the wall portion is capable of exchanging heat with the heat medium flowing through each of the heat medium flow paths and the communicating flow path.

7. The heat medium heating device according to claim 6, characterized in that the housing has at least two flow path sections in which the heat medium flow path is formed, and a communication section in which the communication flow path is formed, and the wall section is integrally formed with the flow path sections and / or the communication section.

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