Clamp for clamping a substrate, carrier for holding a substrate in a vacuum deposition process, and method of clamping a substrate to a carrier

Abstract

A clamp for clamping a substrate to a carrier for a vacuum deposition apparatus, including a base plate, the base plate being mountable to the carrier; a top plate including a protrusion for contacting the substrate; a bushing with a shaft provided between the base plate and the top plate, the shaft defining an axis, the top plate being rotatable about the shaft to pivot about the axis; at least one first magnet, the first magnet being fixed to the top plate; and at least one second magnet, the second magnet being fixed to the base plate. An interaction of magnetic fields of the first magnet and the second magnet causes a first torque between the top plate and the base plate, the first torque causing the top plate to rotate about the axis to urge the protrusion against a surface of the substrate.

Description

CLAMP FOR CLAMPING A SUBSTRATE, CARRIER FOR HOLDING A SUBSTRATE IN A VACUUM DEPOSITION PROCESS, AND METHOD OF CLAMPING A SUBSTRATE TO A CARRIERTECHNICAL FIELD

[0001] Embodiments of the present invention relate to a clamp for clamping substrates to a substrate carrier, particularly for a vacuum deposition process. Embodiments of the present invention specifically relate to a clamp for clamping a substrate to a carrier for a vacuum deposition apparatus, a carrier for holding a substrate in a vacuum deposition process, and a method of clamping a substrate to a carrier in a vacuum deposition process.BACKGROUND

[0002] Several methods are known for the deposition of a material on a substrate. For example, a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. A substrate on which material is deposited, i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system. For example, a coating process can take place in the vacuum chamber.

[0003] Coating processes, i.e. material deposition processes, may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc. The tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems.

[0004] In a coating process, substrates may be held in a substrate support. Couplings of a substrate to a substrate support can involve clamps which perform a clamping function. The substrate might be masked by a mask such as an edgeexclusion mask. For example, the mask might mask an edge of a substrate, and / or particularly an edge of a display device to be manufactured on a substrate. Typically, a substrate is clamped at the edges of the substrate.

[0005] Some substrate processing applications, particularly during display manufacturing, include a horizontal substrate loading and a vertical substrate processing. Accordingly, a substrate swing module or substrate rotation module to change the substrate orientation from horizontal to vertical and vice versa, is provided in a substrate processing apparatus. Adequate clamping is generally beneficial in substrate loading and processing.

[0006] Known clamps for clamping the substrate often include mechanical springs to urge a protrusion of the clamp against the substrate while the clamp is in a closed state. When actuating the clamp, the spring tension is overcome, a portion of the clamp pivots and the protrusion disengages the substrate. Following the actuation, the clamp typically moves back into the closed state, e.g. to clamp another substrate.

[0007] Actuating the clamp may cause flexing and friction, particularly within the spring and / or portions of the clamp engaging with the mechanical spring, which may lead to particle generation. Particles, such as metal residue, may negatively affect the deposition process and / or the resulting product, and are undesirable.

[0008] In view of the above, it is beneficial to provide an improved clamp having reduced particle generation. The products and processes described herein solve the above-stated problem at least in part.SUMMARY

[0009] The invention is set out in the appended set of claims.

[0010] According to one embodiment, a clamp for clamping a substrate to a carrier for a vacuum deposition apparatus is provided. The clamp includes a base plate, the base plate being mountable to the carrier; a top plate including a protrusion for contacting the substrate; a bushing with a shaft provided between the base plateand the top plate, the shaft defining an axis, the top plate being rotatable about the shaft to pivot about the axis; at least one first magnet, the first magnet being fixed to the top plate; and at least one second magnet, the second magnet being fixed to the base plate. An interaction of magnetic fields of the first magnet and the second magnet causes a first torque between the top plate and the base plate, the first torque causing the top plate to rotate about the axis to urge the protrusion against a surface of the substrate.

[0011] According to one embodiment, a carrier for holding a substrate in a vacuum deposition process is provided. The carrier includes a frame defining a substrate holding area; and at least one clamp of a plurality of clamps according to embodiments described herein provided about the frame, the base plate of the clamp being mounted to the frame.

[0012] According to one embodiment, a method of clamping a substrate to a carrier in a vacuum deposition process is provided. The method includes providing a carrier according to embodiments described herein; disengaging the clamp, the disengaging causing the top plate to pivot with respect to the base plate so that the protrusion moves in a direction opposite the base plate; placing a substrate in the substrate holding area; and engaging the clamp. The engaging includes causing the torque between the top plate and the base plate by the interaction of the magnetic fields of the first magnet and the second magnet, the torque urging the protrusion against the substrate.BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features can be understood in detail, a more particular description, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments and are described in the following:Fig. 1 shows a schematic sectional side view of a clamp according to embodiments in a closed state (A) and in an open state (B);Fig. 2 shows a schematic sectional side view of a clamp according to embodiments in a closed state (A) and in an open state (B);Fig. 3 shows a schematic sectional side view of a clamp according to embodiments in a closed state (A) and in an open state (B);Fig. 4 shows a schematic plan view of a clamp according to embodiments; andFig. 5 shows a method of clamping a substrate to a carrier according to embodiments.DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation and is not meant as a limitation. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0015] Embodiments described herein particularly relate to the handling and / or processing of substrates in a deposition process for the deposition of materials, e.g. for display manufacturing on large area substrates, particularly glass substrates. According to some embodiments, large area substrates or substrate carriers supporting one or more substrates may have a size of 0.5 m2or larger, particularly of 1 m2or larger. For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 4.5, which corresponds to about 0.67 m2of substrate (0.73 m x 0.92 m), GEN 5, which corresponds to approximately 1 .4 m2 (1 .1 m x 1 .3 m), GEN 6, which corresponds to approximately 2.7 m2 (1 .5 m x about 1.8 m), GEN 7.5, which corresponds to approximately 4.29 m2 (1.95 m x 2.2 m), GEN 8.5, which corresponds to approximately 5.7 m2 (2.2 m x 2.5 m), or even GEN 10, which corresponds to approximately 8.7 m2 (2.85 m x 3.05 m). Evenlarger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be implemented. According to yet further implementations, half sizes of the above-mentioned substrate generations can be processed. Alternatively or additionally, semiconductor wafers may be processed and coated in deposition systems according to the present disclosure.

[0016] Fig. 1 shows a schematic sectional side view of a clamp 100 illustrating some embodiments of the present disclosure. The clamp 100 is configured for clamping a substrate to a carrier. Clamping the substrate to the carrier may allow the substrate to be processed in a vacuum deposition apparatus. In particular, the carrier may be configured for securing and / or holding the substrate, and may interface with a transporting system for transporting the substrate through a deposition apparatus.

[0017] The clamp includes a base plate 110. The base plate is mountable to the carrier. For example, the base plate 110 may be fixed and / or fixable to a carrier, e.g. a carrier frame. In some embodiments, fixing the base plate 110 to the carrier may include providing fasteners, screws, clips, slots, or other fastening means. In some embodiments, mounting the base plate to the carrier may include integrally forming the base plate 110 as a part of the carrier, e.g. during manufacturing of the carrier.

[0018] According to some embodiments, the base plate 110 includes a mounting surface. The mounting surface may include an essentially flat portion, such as a flat surface, configured for being provided essentially parallel to a surface of the substrate and / or essentially parallel to a surface of a carrier configured for holding a substrate.

[0019] The clamp 100 further includes a top plate 120. The top plate includes a protrusion 122 for contacting the substrate. In some embodiments, the top plate 120 may include a plurality of protrusions, such as 2 or more protrusions, or even 3 or more protrusions. The protrusion 122 may be integrally formed in the top plate 120. The protrusion 122 may be attached and / or connected to the top plate 120. In some embodiments, the protrusion 122 may be made from a flexible material, such as a sheet metal. Accordingly, the protrusion 122 may be a sheet metal holder. Theprotrusion 122 extends from a main body of the top plate 120 towards the substrate and / or a substrate holding area.

[0020] The clamp 100 further includes a bushing 130 with a shaft. The bushing 130 is provided between the base plate 110 and the top plate 120. In particular, the bushing 130 may be provided so that the shaft defines an axis, the top plate 120 being rotatable about the shaft to pivot about the axis, particularly so that the top plate 120 may pivot relative to the base plate 110. The top plate 120 may have a single degree of freedom with respect to the base plate 110, particularly a single degree of rotational freedom. One or more bushings may be provided in the top plate 120 and / or the base plate 110. The shaft may extend through bushings provided in the base plate 110 and the top plate 120. The bushing 130 may include and / or form at least one bearing. The bushing 130 and / or the shaft may form a hinge. Accordingly, the shaft may be a pin, and the bushing 130 may be one or more knuckles.

[0021] According to embodiments, the shaft may extend essentially parallel to a surface of the substrate. In particular, the shaft may extend essentially parallel to an edge of the substrate, particularly such that a rotation of the top plate with respect to the substrate has an axis of rotation essentially parallel to an edge of the substrate. In particular, the mounting surface of the clamp 100 may be configured for mounting the clamp on a carrier so that the shaft is essentially parallel to an edge of the substrate. Accordingly, the shaft may extend along a direction essentially parallel to the mounting surface.

[0022] Fig. 1 shows the clamp 100 in a closed state A and an open state B. In the closed state A, the protrusion points towards a substrate surface at an angle of about -5° to -20° with respect to a surface plane of the substrate, such as about -15°. At a 0° angle, the base plate is essentially horizontally aligned with the substrate surface, and / or the protrusion 122 extends essentially parallel to a surface of the substrate. In the open state, the protrusion points away from a surface of the substrate at an angle of about 30° to 70° with respect to a surface plane of the substrate, such as at an angle of about 30°, 40°, 50° or 60°. The clamp 100 may transition from the closed state A into the open state B upon actuating the clamp 100, e.g. by applyinga force to the top plate 120 at the end 123 opposite the protrusion 122, the force urging the end 123 towards the base plate. As shown in the Figure, a transition between the open state B and the closed state A includes the top plate pivoting about the axis defined by the shaft and / or the bushing 130.

[0023] According to embodiments, the clamp 100 is devoid of a mechanical spring. In particular, the clamp 100 is devoid of a spring, such as a torsion spring, providing a biasing force urging the protrusion against a surface of a substrate and / or biasing the top plate 120 towards the closed state A. According to embodiments, some or all of the functions of a mechanical spring may be obtained by providing magnets, such as the first magnet, second magnet, third magnet and / or fourth magnet according to embodiments described herein.

[0024] The clamp 100 includes a first magnet 140 provided in the top plate 120. The first magnet 140 is fixed to the top plate 120, and may move together with the top plate 120, e.g. when the top plate 120 pivots about the axis. The clamp 100 further includes a second magnet 142 provided in or at the base plate 110. The second magnet 142 is fixed to the base plate 110.

[0025] In the embodiment shown in Fig. 1 , the clamp 100 further includes a third magnet 150 fixed to the top plate 120, and a fourth magnet 152 fixed to the base plate 110. In some embodiments, the third magnet 150 and / or the fourth magnet 152 may be optional.

[0026] As shown in Fig. 1 , the first magnet 140 is arranged in the top plate 120 in between the axis and the protrusion 122, particularly fixed to the top plate 120. Accordingly, when the clamp 100 moves from the open state B to the closed state A, the first magnet 140 moves towards the base plate 110. As shown in Fig. 1 , the third magnet 150 is arranged in the top plate 120 in between the axis and the end 123 opposite the protrusion 122, particularly fixed to the top plate 120. Accordingly, when the clamp 100 moves from the open state B to the closed state A, the third magnet 150 moves away from the base plate.

[0027] As shown in Fig. 1 , the second magnet 142 is provided in the base plate 110 essentially opposite the first magnet 140, and the fourth magnet 152 is provided in the base plate 110 essentially opposite the third magnet 150.

[0028] An interaction of magnetic fields of the first magnet 140 and the second magnet 142 causes a first torque between the top plate and the base plate. In particular, the first torque may be the result of the interaction of magnetic fields of the first magnet 140 and the second magnet 142, causing an attractive force 144 between the first magnet 140 and the second magnet 142. An attractive force 144 may be considered a force having an attractive force component suitable for causing the torque.

[0029] Embodiments of the present beneficially allow for the reduction of particle generation by providing a clamp devoid of mechanical spring.

[0030] In the embodiment shown in Fig. 1 , in addition to the attractive force component 144 between the first magnet 140 and the second magnet 142, the third magnet 150 and the fourth magnet 152 contribute to the torque between the top plate and the base plate, e.g. by causing a second torque or torque component. The interaction of the magnetic fields of the third magnet 150 and the fourth magnet 152 may cause a repelling force 146 between the third magnet 150 and the fourth magnet 152. A repelling force may be considered a force having a repelling force component suitable for causing the second torque. The second torque may have the same direction as the first torque, caused by the magnetic interaction between the first magnet 140 and the second magnet 142.

[0031] An attractive force between the first magnet 140 and the second magnet 142 may be caused by providing the first magnet 140 and the second magnet 142 so that opposite magnetic poles face each other. For example, as shown in Fig. 1 , the S-pole of the first magnet 140 faces the N-pole of the second magnet 142. Alternatively, the magnetic poles may be reversed.

[0032] A repelling force 146 between the third magnet 150 and the fourth magnet 152 may be caused by providing the third magnet 150 and the fourth magnet 152so that the same magnetic poles face each other. For example, as shown in Fig. 1 , the S-pole of the third magnet 150 faces the S-pole of the fourth magnet 152. Alternatively, the magnetic poles may be reversed.

[0033] According to embodiments, the first magnet 140, the second magnet 142, the third magnet 150 and / or the fourth magnet 152 may be provided so that the magnetic poles are aligned essentially normal to the shaft, essentially normal to the mounting surface, and / or essentially normal to a surface of the substrate.

[0034] In some embodiments, the first magnet 140, the second magnet 142, the third magnet 150 and / or the fourth magnet 152 may be provided as inserts within a cavity provided within the base plate 110 and / or the top plate 120. The inserts may be fixed within the cavity by a holder, such as a bracket.

[0035] The torque causes the top plate 120 to rotate about the axis to urge the protrusion 122 against a surface of the substrate. In particular, the torque may promote the clamp 100 to enter the closed state A, e.g. from the open state B. Additionally, e.g. while the clamp 100 is in the closed state A, further rotation may be stopped, e.g. due to the clamp being in a force equilibrium. In the force equilibrium state, the torque may cause the protrusion 122 to exert a force onto the surface of the substrate, particularly for clamping the substrate.

[0036] According to embodiments, an attractive force component, e.g. between the first magnet 140 and the second magnet 142, may be larger than a repelling force component, e.g. between the third magnet 150 and the fourth magnet 152, depending on the configuration and / or state of the clamp 100. In particular, in the closed state A, due to the first magnet 140 and the second magnet 142 being spatially closer than the third magnet 150 and the fourth magnet 152, the attractive force component caused by the magnetic interaction between the first magnet 140 and the second magnet 142 and / or the first torque may be larger than the repelling force component caused by the magnetic interaction between the third magnet 150 and the fourth magnet 152 and / or the second torque. Accordingly, a clamping force, i.e. the force exerted onto the substrate surface by the protrusion 122, may beessentially defined by the magnetic interaction between the first magnet 140 and the second magnet 142.

[0037] In the open state B, due to the first magnet 140 and the second magnet 142 being spatially further apart than the third magnet 150 and the fourth magnet 152, the repelling force component caused by the magnetic interaction between the third magnet 150 and the fourth magnet 152 and / or the second torque may be larger than the attractive force component caused by the magnetic interaction between the first magnet 140 and the second magnet 142 and / or the first torque. Accordingly, in the open state B, a torque causing the clamp 100 to transition from the open state B to the closed state A may be essentially defined by the magnetic interaction between the third magnet 150 and the fourth magnet 152.

[0038] Beneficially, the magnetic interaction between the first magnet 140 and the second magnet 142, and the magnetic interaction between the third magnet 150 and the fourth magnet 152, may be chosen, adjusted and / or tuned such that the sum of the first torque and the second torque is defined at different angles of the top plate 120. Likewise, a position of the first magnet 140 and the second magnet 142, and a position of the third magnet 150 and the fourth magnet 152, may be chosen, adjusted and / or tuned relative to the axis such that the sum of the first torque and the second torque is defined at different angles of the top plate 120, particularly by applying the known principles of the lever rule. In particular, when actuating the clamp 100 to transition from the closed state A to the open state B, the sum of the first torque and the second torque may be non-linear over the actuated angle range. Beneficially, for the same clamping force, less force and / or work may be required to actuate the clamp 100 when compared to a clamp utilizing a mechanical spring, the mechanical spring typically causing an essentially linear torque increase during actuation from the closed state A to the open state B.

[0039] Referring now to Fig. 2, a clamp 200 illustrating some embodiments of the present disclosure is shown. The clamp 200 shares several of the features of the clamp 100 described with reference to Fig. 1 , and only the differences with respect to the clamp 100 will be described.

[0040] The clamp 200 includes a first magnet 240 and a second magnet 242. A first portion of the first magnet 240 is provided in the pivotable portion of the top plate 120 proximate the protrusion 122, and a second portion of the first magnet 240 is provided in the pivotable portion of the top plate 120 opposite the protrusion 122. The second portion is smaller than the first portion. When the clamp 200 moves from the open state B to the closed state A, the first portion of the first magnet 240 moves towards the second magnet, and the second portion moves away from the second magnet 242. The pivotable portion of the top plate 120 proximate the protrusion may range from a point and / or line in the top plate radially projecting from the axis and the protrusion 122. The pivotable portion of the top plate 120 opposite the protrusion may range from a point and / or line in the top plate radially projecting from the axis and the end 123 opposite the protrusion 122, particularly in between the axis and the end 123 opposite the protrusion 122. The point and / or line radially projecting from the axis may be a surface normal of a surface of the top plate 120.

[0041] The second magnet 242 is fixedly provided in the base plate 110. The second magnet 242 may, in a plan view of the clamp 200 such as the view shown in Fig. 4, be congruent with the first magnet 240 when the top plate is in a level position, i.e. a position in-between the open state B and a closed state A, such as a state in which the angle relative to a substrate surface is 0°.

[0042] According to embodiments, a magnetic force between the first magnet 240 and the second magnet has an attractive force component 144, and may particularly be essentially devoid of a repelling force component. In particular, the first magnet 240 and the second magnet 242 may have opposite poles facing one another. The second magnet 242 may be provided within the base plate 110 essentially opposite the first magnet 240, a magnetic pole of the first magnet facing an opposite magnetic pole of the second magnet.

[0043] Beneficially, even when the first portion of the first magnet 240 moves away from the second magnet 242, e.g. while the clamp 200 is in an open state B, the second portion remains in the vicinity of the second magnet 242 so that an attractive force component 144 causes a (first) torque. Thus, in the open state B, and at any position between the open state B and the closed state A, the top plate 120 is biasedtowards entering the closed state A due to the torque caused by the magnetic interaction between the first magnet 240 and the second magnet 242. Beneficially, the design of the clamp 200 may be simplified, e.g. when compared to clamp 100. In particular, a lower number of magnets, magnet holders or other features associated with casing a second torque may be provided, which may simplify manufacturing and / or maintenance of the clamp 200.

[0044] Referring now to Fig. 3, a clamp 300 illustrating some embodiments of the present disclosure is shown. The clamp 300 shares several of the features of the clamp 100 and / or the clamp 300 described with reference to Fig. 1 and / or Fig. 2, and only the differences with respect to the clamp 100 and / or the clamp 200 will be described.

[0045] The clamp 300 has a first magnet 340 and a second magnet 342. The first magnet 340 is provided in the top plate 120, similar and / or identical to the first magnet 240 described with reference to Fig. 2. A first portion of the first magnet 340 is provided in the pivotable portion of the top plate 120 proximate the protrusion 122, and a second portion of the first magnet 340 is provided in the pivotable portion of the top plate 120 opposite the protrusion 122, particularly in between the axis and the end 123 opposite the protrusion 122. The second portion being smaller than the first portion. In some embodiments, the second portion may be omitted, e.g. by only providing a first portion and / or by providing a second portion having a size of zero.

[0046] The second magnet 342 is provided in the base plate 110 at a position in between the axis and a side of the base plate 110 opposite the substrate and / or the protrusion 122. In particular, the second magnet 342 is provided such that the second magnet 342 does not face the first magnet 340. As shown in Fig. 3, the second magnet 342 may be provided offset from the first magnet 340, particularly offset towards the end 123 opposite the protrusion 122. Magnetic poles of the first magnet 340 and magnetic poles of the second magnet 342 are rotated with respect to one another along an axis parallel to the axis of the shaft by an angle of at least 60°, such as an angle of about 90°.

[0047] In the embodiment shown in Fig. 3, a first torque 344 between the top plate 120 and the base plate 110 is caused by the interaction of the magnetic fields of the first magnet 340 and the second magnet 342. The magnetic interaction may include and / or cause an attractive force component and / or a repelling force component. Additionally, due to the relative rotation of the magnetic poles of the first magnet and the second magnet, the magnetic interaction may, at least in some positions of the clamp 300 such as the closed position A, directly cause a first torque 344, the attractive and / or repelling force component being minor compared to the first torque and / or cancelled due to no degree of freedom being available along the direction of the attractive or repelling force component.

[0048] In some positions of the clamp 300, such as the open position B, the magnetic interaction may include a repelling force component 346, which may contribute to the first torque 344. As shown in Fig. 3, in the closed position, the repelling force component 346 may bias the top plate 120 towards the closed position. The repelling force component may be caused by opposing magnetic poles of the first magnet 340 and the second magnet 342 being rotated towards facing one another when the top plate 120 is in the open position B.

[0049] As shown in Fig. 3, the second magnet 342 is provided distant to the substrate and / or the protrusion 122, e.g. when compared to the embodiments shown in Fig. 1 and / or Fig. 2. Accordingly, a magnetic field caused by the second magnet 342 may be lower within the substrate holding area. Beneficially, the embodiment shown in Fig. 3 may be particularly suitable for applications in which a strong magnetic field may potentially interfere with substrate processing, such as in a deposition process depositing charged particles in the vicinity of the clamp 300.

[0050] Referring now to Fig. 4, a clamp 400 according to embodiments is shown in a plan view. The clamp 400 includes features described with reference to the clamp 100 shown in Fig. 1 , the clamp 200 shown in Fig. 2, and the clamp 300 shown in Fig. 3. Some features have been omitted or simplified in the Figure for clarity. Features described with reference to Fig. 4 may, individually or in combination, apply to a clamp 100, 200, 300 according to embodiments described herein.

[0051] The clamp 400 has a base plate 110 provided on a carrier frame 430. For example, a mounting surface of the clamp 400 may be mounted to the carrier frame 430. The protrusions 122 point towards a substrate holding area 420. Accordingly, a substrate may be provided in the substrate holding area 420. A top plate 120 is rotatably attached to the base plate 110 and rotatable and / or tiltable about the axis 410. The axis 410 may be defined by a bushing 130 and / or a shaft provided in the bushing, as e.g. explained with reference to Fig. 1 , Fig. 2 and / or Fig. 3. In the plan view shown in Fig. 4, the clamp 400 is shown with the top plate 120 essentially parallel to the base plate 110, however, it should be noted that the clamp 400 may transition into a closed state A and / or into an open state B, such as shown in Fig. 1 , Fig. 2 and / or Fig. 3.

[0052] According to embodiments, the clamp 400 includes a contacting portion 440. The contacting portion 440 protrudes from a main body of the top plate 120 towards the end 123 opposite the protrusion 122, and may include and / or define the end 123. The contacting portion 440 may be configured for being actuated, e.g. by an actuator. For example, an actuator may apply a force within the contacting portion 440 to push the contacting portion towards the base plate 110. Applying the force may actuate the clamp 400 to transition into an open state, e.g. transition from the closed state A into the open state B as shown in e.g. Fig. 1 , Fig. 2 and / or Fig. 3.

[0053] The clamp 400 includes a first magnet 140, a second magnet 142, a third magnet 150 and a fourth magnet 152, e.g. as described for the clamp 100 shown in Fig. 1 . In the embodiment, the magnets are provided centrally along a length of the clamp, the length extending along the axis 410. For example, the magnets may be provided with a spacing from a center of the axis 410, e.g. offset towards the protrusion 122 and the end 123 opposite the protrusion. In the plan view shown in Fig. 4, the first magnet 140 and the second magnet 142 face one another such that the first magnet 140, provided in the top plate 120, is congruent with the second magnet 142, provided in the base plate 110 in the plan view. In the plan view shown in Fig. 4, the third magnet 150 and the fourth magnet 152 face one another such that the third magnet 150, provided in the top plate 120, is congruent with the fourth magnet 152, provided in the base plate 110 in the plan view.

[0054] The clamp 400 includes two first magnets 240 and two second magnets 242, e.g. as described for the clamp 200 shown in Fig. 2. The magnets are provided towards axial ends of the clamp 400, e.g. symmetrically offset from the middle point of the axis 410 towards ends of the shaft and / or the axis 410. In the plan view shown in Fig. 4, the first magnets 240 and the second magnets 242 face one another such that the first magnets 240, provided in the top plate 120, are congruent with the second magnets 242, provided in the base plate 110 in the plan view.

[0055] The clamp 400 includes two first magnets 340 and two second magnets 342, e.g. as described for the clamp 300 shown in Fig. 3. The first magnets 340 are provided towards axial ends of the clamp 400, e.g. symmetrically offset from the middle point of the axis 410 towards ends of the shaft and / or the axis 410. The second magnets 342 are provided in or on the base plate 110 so that, in the plan view shown in Fig. 4, the second magnets 342 are provided outside an area covered by a body of the top plate 120. As shown in the figure, the second magnets 342 are provided adjacent the end 123 opposite the protrusions 122.

[0056] According to embodiments, as shown in Fig. 4, different types of magnets and / or magnet shapes may be suitable. For example, the first magnet 140, the second magnet 142, the third magnet 150 and the fourth magnet 152, e.g. as described for the clamp 100 shown in Fig. 1 , may be provided as essentially cylindrical magnets, a pole of the magnet being provided at the flat bases of the cylinder. Likewise, other shapes may be equally suitable for the magnets 140, 142, 150, 152, such as plates, rods, cuboids, cubes, tori, or other known magnet shapes.

[0057] For example, the first magnets 240, 340, e.g. as described with reference to Fig. 2 or Fig. 3, may be provided as flat magnets having e.g. a quadratic or rectangular base surface, the first magnets 240, 340 having e.g. an essentially platelike, cuboid and / or ribbon-like shape. Beneficially, providing the first magnets 240 and / or 340 as flat magnets may simplify providing a first portion of the magnet towards the protrusion 122 and a second portion of the magnet towards the end 123 opposite the protrusion. A second magnet 242, e.g. as described with reference to Fig. 2, may have a similar or essentially the same shape and / or properties as the first magnet 240.

[0058] The second magnet 342 may have a similar or essentially the same shape as the first magnet 340. For example, the second magnet 342 may have an essentially cuboid shape, two faces of the cuboid defining the poles of the second magnet, a first face facing the protrusion 122 and a second face facing opposite the protrusion 122. A smaller face of the cuboid may contact the base plate 110. The cuboid may have a height, the height being the length of the cuboid by which it extends away from a surface of the base plate 110.

[0059] It should be noted that the clamp 400 includes the magnet configurations shown for each of the embodiments shown in Fig. 1 , Fig. 2 and Fig. 3. In some embodiments, only one of the magnet configurations shown in either Fig. 1 , Fig. 2 or Fig. 3 may be provided for the clamp 400.

[0060] According to embodiments, a carrier for holding a substrate in a vacuum deposition process is described. The carrier may include a carrier frame, such as the carrier frame 430 described with reference to Fig. 4. The carrier frame 430 may define a substrate holding area 420. The carrier includes a least one clamp of a plurality of clamps according to embodiment described herein, the clamps being provided about the carrier frame. A base plate of the clamp is mounted to the frame. Beneficially, a clamp according to embodiments described herein may be compatible with known clamp designs and / or replace a known clamp design without modification to the carrier. Accordingly, the carrier according to embodiments may be utilized in a known and / or established deposition process, without requiring modification to the deposition process.

[0061] Referring now to Fig. 5, a method 500 of clamping a substrate to a carrier in a vacuum deposition process is described. The method 500 includes providing 510 a carrier. The carrier includes a clamp according to embodiments described herein, such as the clamp 100, 200, 300, 400 described with reference to Fig. 1 to Fig. 4. In particular, the clamp includes at least one first magnet being fixed to a top plate of the clamp, and a second magnet being fixed to a base plate of the clamp. The clamp includes a protrusion for contacting the substrate.

[0062] The method 500 includes disengaging 520 the clamp. Disengaging the clamp causes the top plate to pivot with respect to the base plate so that the protrusion moves in a direction opposite the base plate and / or away from the base plate, such as an angle above 0°, such as an angle of about 40° or more. In particular, disengaging may include transitioning from a closed state, such as the closed state A shown in Fig. 1 to Fig. 3, into an open state, such as the open state B shown in Fig. 1 to Fig. 3.

[0063] The method 500 includes placing 530 a substrate in a substrate holding area, such as the substrate holding area 420 described with reference to Fig. 4. The substrate holding area may be an area defined by the carrier, such as a frame of the carrier.

[0064] The method 500 includes engaging 540 the clamp. Engaging the clamp includes causing a torque between the top plate and the base plate by an interaction of the magnetic fields of the first magnet and the second magnet. The torque may bias the clamp towards a closed state, such as the closed state A shown in Fig. 1 to Fig. 3. In the closed state, the torque may urge the protrusion against the substrate.

[0065] In some embodiments, disengaging 520 may include providing a mechanical force to the clamp. Providing the mechanical force may include actuating the clamp, particularly with an actuator. In some embodiments, engaging 540 may include removing the mechanical force, e.g. by deactivating and / or retreating an actuator. In particular, engaging 540 may include the clamp autonomously transitioning, through interaction of the magnetic fields, into a closed state when no external and / or mechanical force is applied to the clamp.

[0066] According to embodiments, the magnets described herein may be magnets having a useable temperature of at least 200 °C, at least 250 °C, at least 300 °C, at least 350 °C, or even at least 400 °C. For example, the Curie temperature of the magnet may be at least 500 °C, at least 550 °C, at least 600 °C, or even at least 650 °C. This may beneficially allow the use of the clam according to embodimentsin a high-temperature deposition process. For example, the magnets may be samarium-cobalt magnets.

[0067] According to some embodiments, the magnets described herein may include a plating, such as a metal plating, such as a nickel plating. The plating may beneficially reduce particle generation and / or increase the stability of the magnet.

[0068] While the foregoing is directed to some embodiments, other and further embodiments may be devised without departing from the basic scope, and the scope is determined by the claims that follow.

Claims

CLAIMS1 . A clamp for clamping a substrate to a carrier for a vacuum deposition apparatus, comprising: a base plate, the base plate being mountable to the carrier; a top plate comprising a protrusion for contacting the substrate; a bushing with a shaft provided between the base plate and the top plate, the shaft defining an axis; the top plate being rotatable about the shaft to pivot about the axis; at least one first magnet, the first magnet being fixed to the top plate; and at least one second magnet, the second magnet being fixed to the base plate; wherein an interaction of magnetic fields of the first magnet and the second magnet causes a first torque between the top plate and the base plate, the first torque causing the top plate to rotate about the axis to urge the protrusion against a surface of the substrate.

2. The clamp according to claim 1 , wherein the shaft extends along a direction parallel to the mounting surface.

3. The clamp according to claim 1 or 2, wherein the clamp is devoid of a mechanical spring.

4. The clamp according to any one of the preceding claims, wherein the interaction of magnetic fields of the first magnet and the second magnet comprises an attractive force component.

5. The clamp according to any one of the preceding claims, wherein, when the clamp is in an open state, the interaction of magnetic fields of the first magnet and the second magnet comprises a repelling force component.

6. The clamp according to any one of the preceding claims, wherein the first magnet is arranged in the top plate in between the axis and the protrusion; the carrier further comprising at least one third magnet, the third magnet being arranged in the top plate in between the axis and an end opposite the protrusion; and at least one fourth magnet, the fourth magnet being fixed to the base plate.

7. The clamp according to claim 6, wherein an interaction of the magnetic fields of the third magnet and the fourth magnet causes a second torque having the same direction as the first torque.

8. The clamp according to claim 6 or 7, wherein the interaction of magnetic fields of the third magnet and the fourth magnet comprises a repelling force component.

9. The clamp according to any one of the preceding claims, wherein, when the clamp is in a closed state, an attractive force component is larger than a repelling force component, and wherein, when the clamp is in an open state, a repelling force component is larger than an attractive force component.

10. The clamp according to any one of claims 1 to 3, wherein a first portion of the first magnet is provided in the pivotable portion of the top plate proximate the protrusion, and a second portion of the first magnet is provided in the pivotable portion of the top plate opposite the protrusion, the second portion being smaller than the first portion.

11. The clamp according to claim 10, wherein the second magnet is provided within the base plate essentially opposite the first magnet, a magnetic pole of the first magnet facing an opposite magnetic pole of the second magnet.

12. The clamp according to any one of claims 1 to 3, wherein the second magnet is provided in the base plate at a position in between the axis and a side opposite the substrate.

13. The clamp according to claim 12, wherein magnetic poles of the first magnet and magnetic poles of the second magnet are rotated with respect to one another along an axis parallel to the axis of the shaft by an angle of at least 60°.

14. A carrier for holding a substrate in a vacuum deposition process, the carrier comprising a frame defining a substrate holding area; and at least one clamp of a plurality of clamps according to any one of claims 1 to 13 provided about the frame, the base plate of the clamp being mounted to the frame.

15. Method of clamping a substrate to a carrier in a vacuum deposition process; the method comprising: providing a carrier according to claim 14; disengaging the clamp, the disengaging causing the top plate to pivot with respect to the base plate so that the protrusion moves in a direction opposite the base plate; placing a substrate in the substrate holding area; engaging the clamp, wherein the engaging comprises causing the torque between the top plate and the base plate by the interaction of the magnetic fields of the first magnet and the second magnet, the torque urging the protrusion against the substrate.

16. The method according to claim 15, wherein the disengaging comprises providing a mechanical force to the clamp, and wherein the engaging comprises removing the mechanical force.

17. The method according to claim 16, wherein providing the mechanical force comprises actuating the clamp.

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