Work assistance device and work assistance method

Abstract

This work assistance device comprises an acquisition unit and a generation unit. The acquisition unit acquires an analysis result obtained by collecting and analyzing production information about a substrate work machine for producing a product substrate by performing predetermined substrate work on a substrate. The generation unit automatically generates, in accordance with the analysis result acquired by the acquisition unit, a workflow that defines an operation procedure of a production information analysis device that assists corrective work for improving the substrate work performed by the substrate work machine.

Description

Work support device and work support method

[0001] This specification discloses techniques relating to a work assistance device and a work assistance method.

[0002] The substrate-related operation machine support device described in Patent Document 1 includes a unit program storage unit, an support processing program creation unit, and an support processing execution unit, and performs support processing to support measures to deal with abnormalities that occur in the substrate-related operation machine. Specifically, the unit program storage unit is a program that can configure an support processing program for executing the support processing, and stores multiple unit programs for executing parts of the support processing. The support processing program creation unit allows an operator of the substrate-related operation machine support device to select any one or more unit programs from the multiple unit programs, thereby creating an arbitrary support processing program. The support processing execution unit executes the support processing in accordance with the created support processing program.

[0003] Japanese Patent Application Laid-Open No. 2005-12077

[0004] The production information analysis device analyzes production information of a substrate-related operation machine, derives corrective actions to improve substrate-related operations performed by the substrate-related operation machine, and supports the corrective actions. It is difficult for an operator to create a workflow that defines the operating procedures of the production information analysis device so that the production information analysis device can support the corrective actions in accordance with the analysis results of the production information.

[0005] In view of the above circumstances, this specification discloses a work support device and a work support method that can automatically generate a workflow that defines the operating procedure of a production information analysis device that supports countermeasure work.

[0006] This specification discloses a work support device including an acquisition unit and a generation unit. The acquisition unit acquires analysis results by collecting and analyzing production information of a substrate-related performing machine that performs a predetermined substrate-related performing operation on a substrate to produce a product substrate. The generation unit automatically generates a workflow that defines an operating procedure of a production information analysis device that supports corrective operations to improve the substrate-related performing operation performed by the substrate-related performing machine, based on the analysis results acquired by the acquisition unit.

[0007] This specification also discloses a work support method including an acquisition step and a generation step. The acquisition step acquires analysis results by collecting and analyzing production information of a substrate-related performing machine that performs a predetermined substrate-related performing operation on a substrate to produce a product substrate. The generation step automatically generates a workflow that defines an operating procedure of a production information analysis device that supports corrective operations to improve the substrate-related performing operation performed by the substrate-related performing machine, based on the analysis results acquired in the acquisition step.

[0008] This specification discloses a technical idea in claim 6 of the claims originally attached to the application (hereinafter referred to as the "initial claims"), where "the work support device according to any one of claims 2 to 4" is changed to "the work support device according to any one of claims 2 to 5." This specification also discloses a technical idea in claim 7 of the original claims, where "the work support device according to claim 1" is changed to "the work support device according to any one of claims 1 to 6."

[0009] Furthermore, this specification discloses a technical idea in claim 8 originally claimed in which "the work support device according to claim 1" is changed to "the work support device according to any one of claims 1 to 7." Furthermore, this specification discloses a technical idea in claim 9 originally claimed in which "the work support device according to claim 1" is changed to "the work support device according to any one of claims 1 to 8." Furthermore, this specification discloses a technical idea in claim 10 originally claimed in which "the work support device according to claim 1" is changed to "the work support device according to any one of claims 1 to 9."

[0010] According to the above-described work assistance device, a workflow that defines the operating procedures of a production information analysis device that assists in countermeasure work can be automatically generated in accordance with the analysis results of the production information. What has been described above about the work assistance device can also be said about the work assistance method.

[0011] 1 is a configuration diagram showing an example of the configuration of a substrate-related work line. FIG. 2 is a plan view showing an example of the configuration of a component mounting machine. FIG. 3 is a block diagram showing an example of a control block of a work support device. FIG. 4 is a flowchart showing an example of a control procedure by the work support device. FIG. 5 is a schematic diagram showing an example of an error code occurrence situation. FIG. 6 is a schematic diagram showing an example of setting of operating conditions for a production information analysis device according to an analysis result of an error code occurrence situation. FIG. 7 is a schematic diagram showing an example of a workflow. FIG. 8 is a schematic diagram showing an example of guidance for a corrective work. FIG. 9 is a schematic diagram showing an example of load balancing. FIG. 10 is a schematic diagram showing an example of setting of operating conditions for a production information analysis device according to an analysis result of load balancing. FIG. 11 is a schematic diagram showing an example of waiting time for waiting for work. FIG. 12 is a schematic diagram showing an example of setting of operating conditions for a production information analysis device according to an analysis result of waiting time for waiting for work.

[0012] 1. Embodiment 1-1. Configuration Example of Substrate-Related Work Line WL0 In the substrate-related work line WL0, substrate-related work machines WM0 perform predetermined substrate-related work on substrates 90 to produce product substrates 900. The types and number of substrate-related work machines WM0 that make up the substrate-related work line WL0 are not limited. As shown in Figure 1, the substrate-related work line WL0 of the embodiment is equipped with multiple substrate-related work machines WM0, including a printer WM1, a print inspection machine WM2, a component placement machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrates 90 are transported in the above order by a board transport device.

[0013] The printer WM1 prints solder at the mounting positions of the components 91 on the board 90. The print inspection machine WM2 inspects the printing condition of the solder printed by the printer WM1. As shown in FIG. 2, the component mounting machine WM3 mounts the components 91 on the board 90 on which the solder has been printed by the printer WM1. There may be one or more component mounting machines WM3. As shown in FIG. 1, when multiple component mounting machines WM3 (three in the figure) are provided, the multiple component mounting machines WM3 can share the mounting work of the components 91.

[0014] The reflow furnace WM4 heats the board 90 on which components 91 have been mounted by the component mounting machine WM3, melting the solder and performing soldering. The visual inspection machine WM5 inspects the mounting state of the components 91 mounted by the component mounting machine WM3. In this way, the board-related work line WL0 uses multiple board-related work machines WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce the product board 900. Note that the board-related work line WL0 can also be equipped with other board-related work machines WM0 as needed, such as a function inspection machine, a buffer device, a board supply device, a board inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device.

[0015] The substrate-related performing machines WM0 and the line management device LC0 that make up the substrate-related performing line WL0 are communicatively connected by a communication unit. The line management device LC0 and the management device HC0 are communicatively connected by the communication unit. The communication unit can communicatively connect them by wire or wirelessly, and various communication methods can be used.

[0016] In the embodiment, a wireless local area network (LAN) is configured by the plurality of substrate-related performing machines WM0, the line management device LC0, and the management device HC0. Therefore, the plurality of substrate-related performing machines WM0 can communicate wirelessly with each other via a communication unit. Furthermore, the plurality of substrate-related performing machines WM0 can communicate wirelessly with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate wirelessly with each other via the communication unit.

[0017] The line management device LC0 controls the plurality of substrate-related performing machines WM0 that make up the substrate-related performing line WL0 and monitors the operating status of the substrate-related performing line WL0. The line management device LC0 stores various control data for controlling the plurality of substrate-related performing machines WM0. The line management device LC0 transmits the control data to each of the plurality of substrate-related performing machines WM0. Furthermore, each of the plurality of substrate-related performing machines WM0 transmits its operating status and production status to the line management device LC0.

[0018] The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the substrate-related performing machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as needed. The management device HC0 is provided with a storage device (e.g., a database). The storage device can store various acquired data acquired by the substrate-related performing machine WM0. For example, various image data captured by the substrate-related performing machine WM0 is included in the acquired data. Records of operating status (log data) acquired by the substrate-related performing machine WM0 are also included in the acquired data. The storage device can collect and store various production information related to the production of such product substrates 900.

[0019] 1-2. Example of the configuration of component mounting machine WM3 The component mounting machine WM3 mounts components 91 on a board 90. As shown in Figure 2, the component mounting machine WM3 includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, a control device 16, and a display device 17.

[0020] The board transport device 11 is configured, for example, by a belt conveyor or the like, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transport device 11 transports the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position within the machine. After the component mounting machine WM3 has completed the mounting process of the components 91, the board transport device 11 transports the board 90 out of the component mounting machine WM3.

[0021] The component supply device 12 supplies components 91 to be mounted on the board 90. The component supply device 12 includes a plurality of feeders 12a arranged along the conveyance direction (X-axis direction) of the board 90. Each of the plurality of feeders 12a is equipped with a reel. A carrier tape containing components 91 is wound around the reel. The feeder 12a pitch-feeds the carrier tape to supply the components 91 so that they can be picked up at a supply position located at the tip of the feeder 12a. The component supply device 12 can also supply electronic components (e.g., lead components) that are relatively large compared to chip components and the like, arranged on a tray.

[0022] The component transfer device 13 includes a head driver 13a and a movable table 13b. The head driver 13a is configured to move the movable table 13b in the X-axis direction and the Y-axis direction (a direction perpendicular to the X-axis direction in a horizontal plane) using a linear motion mechanism. A mounting head 20 is detachably (replaceably) attached to the movable table 13b using a clamping member. The mounting head 20 uses at least one holding member 30 to pick up and hold components 91 supplied by the component supply device 12 and mount the components 91 on the board 90 positioned by the board transport device 11. The holding member 30 may be, for example, a suction nozzle or a chuck.

[0023] The component camera 14 and the board camera 15 may be known imaging devices. The component camera 14 is fixed to the base of the component mounting machine WM3 so that its optical axis faces upward in the vertical direction (Z-axis direction, which is perpendicular to the X-axis and Y-axis directions). The component camera 14 can capture images of the components 91 held by the holding members 30 from below. The board camera 15 is mounted on the movable stage 13b of the component transfer device 13 so that its optical axis faces downward in the vertical direction (Z-axis direction). The board camera 15 can capture images of the board 90 and the like from above. The component camera 14 and the board camera 15 capture images based on control signals sent from the control device 16. Image data of the images captured by the component camera 14 and the board camera 15 is sent to the control device 16.

[0024] The control device 16 includes a known arithmetic unit and a storage device, and functions as a control circuit. The control device 16 receives information, image data, and the like output from various sensors provided in the component mounting machine WM3. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions that have been set in advance.

[0025] For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 91.

[0026] The control device 16 moves the holding member 30 above the intended placement position that is set in advance by a control program or the like. The control device 16 also corrects the intended placement position based on the positioning state of the board 90, the holding posture of the component 91, and the like, and sets the placement position where the component 91 will actually be placed. The intended placement position and the placement position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

[0027] Control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of holding member 30 to match the mounting position. Control device 16 lowers holding member 30 at the corrected rotation angle in the corrected target position to mount components 91 on board 90. Control device 16 repeats the above pick-and-place cycle to perform the mounting process of mounting multiple components 91 on board 90. The time it takes for board-related operation machine WM0 to perform the operation is referred to as cycle time TS0.

[0028] For example, the time required for the substrate-related operation can exclude the time required for the operation of transporting the substrate 90. In this case, the cycle time TS0 refers to the time from when the substrate 90 is carried into the substrate-related operation machine WM0 until the substrate-related operation is performed in the substrate-related operation machine WM0 and the substrate 90 is carried out. For example, when the substrate-related operation machine WM0 is the component mounting machine WM3, the cycle time TS0 per one substrate 90 in this case corresponds to the time required for a predetermined number of pick-and-place cycles.

[0029] The time required for performing the substrate-related operation can also include the time required for the operation of transporting the substrate 90. For example, when the substrate-related operation machine WM0 is the component mounting machine WM3, the cycle time TS0 per one substrate 90 in this case corresponds to the total time required for loading the substrate 90, the time required for a predetermined number of pick-and-place cycles, and the time required for unloading the substrate 90.

[0030] The display device 17 can display various types of information. Any known display device can be used as the display device 17 as long as it can display various types of information. Specifically, the display device 17 has a display unit that displays various types of data so that the worker can visually recognize them. In addition, for example, the display unit is configured with a touch panel, and also functions as an input device that accepts various operations by the worker.

[0031] 1-3. Configuration example of work support device 70 As shown in FIG. 1, the production facility is provided with a production information analysis device 80. As described above, various production information related to the production of product boards 900 is collected and stored in the storage device of management device HC0. Production information analysis device 80 analyzes the production information stored in the storage device, derives corrective actions to improve substrate-related work performed by substrate-related performing machine WM0, and supports the corrective actions. Production information analysis device 80 may take various forms as long as it has the above functions.

[0032] For example, the production information analysis device 80 can statistically process the production information to grasp the trends of events related to the production information. The statistical processing method is not limited. For example, the production information analysis device 80 can statistically process the production information using statistical process control (SPC) to grasp the trends of events related to the production information. Statistical process control (SPC) is a type of control aimed at improving manufacturing variations, and can control the process using two indices: the mean and variance (standard deviation).

[0033] In this way, production information analysis device 80 can grasp the trends of events related to the production information and derive countermeasures. However, the production information includes various information related to the production of product boards 900, and the analysis results of the production information and countermeasures vary widely. Therefore, it is difficult for an operator to create a workflow WF0 that defines the operating procedures of production information analysis device 80 so that production information analysis device 80 can support countermeasures in accordance with the analysis results of the production information.

[0034] Therefore, the production facility of the embodiment is provided with a work support device 70. The work support device 70 automatically generates a workflow WF0 that defines the operating procedures of a production information analysis device 80 that supports the response work, based on the analysis results of the production information. Specifically, the work support device 70 includes an acquisition unit 71 and a generation unit 72. The work support device 70 can also include an execution unit 73. The work support device 70 can also include a deletion unit 74. As shown in FIG. 3 , the work support device 70 of the embodiment includes the acquisition unit 71, the generation unit 72, the execution unit 73, and the deletion unit 74.

[0035] The acquisition unit 71, the generation unit 72, the execution unit 73, and the deletion unit 74 can be provided in various control devices and management devices. For example, at least one of the acquisition unit 71, the generation unit 72, the execution unit 73, and the deletion unit 74 can be provided in the line management device LC0, the management device HC0, the production information analysis device 80, etc. At least one of the acquisition unit 71, the generation unit 72, the execution unit 73, and the deletion unit 74 can also be formed on the cloud. As shown in FIG. 3 , in the work support device 70 of the embodiment, the acquisition unit 71, the generation unit 72, the execution unit 73, and the deletion unit 74 are provided in the production information analysis device 80.

[0036] Furthermore, the work support device 70 of the embodiment executes control in accordance with the flowchart shown in Fig. 4. The acquisition unit 71 performs the process shown in step S11. The generation unit 72 performs the process shown in step S12. The execution unit 73 performs the process shown in step S13. The deletion unit 74 performs the judgment and process shown in steps S14 and S15. The matters described in this specification can be selected and applied as appropriate. The matters described in this specification can be combined as appropriate.

[0037] Acquisition unit 71 acquires the analysis results obtained by collecting and analyzing production information of substrate-related performing machine WM0 (step S11 shown in FIG. 4). Furthermore, generation unit 72 automatically generates workflow WF0 in accordance with the analysis results acquired by acquisition unit 71 (step S12). Workflow WF0 defines the operation procedure of production information analysis device 80 that supports corrective work for improving substrate-related work performed by substrate-related performing machine WM0.

[0038] As described above, the production information may be information relating to the production of product substrates 900 and may include a variety of information. Similarly, the substrate-related performing machine WM0 and the method of analyzing the production information are not limited. Furthermore, the corrective action may include a variety of actions as long as it improves the substrate-related performing action performed by the substrate-related performing machine WM0. Similarly, the workflow WF0 may take a variety of forms as long as it defines the operating procedure of the production information analysis device 80. As described below, one example of these is described in this specification.

[0039] For example, the production information may include an error code EC0 indicating a type of abnormality in a substrate-related operation performed by the substrate-related operation machine WM0. In this embodiment, when the acquisition unit 71 acquires an analysis result indicating that the occurrence frequency of the error code EC0 exceeds a predetermined level LV1, the generation unit 72 automatically generates a workflow WF0 that supports a response operation to improve the abnormality indicated by the error code EC0 exceeding the predetermined level.

[0040] 5 shows an example of the occurrence status of error code EC0. The horizontal axis of the figure represents error code EC0, and the vertical axis represents the occurrence frequency of error code EC0 (e.g., the number of occurrences, the occurrence rate, etc.). Broken line L1 is a straight line connecting the occurrence frequencies of ten types of error code EC0, for example, error code EC1 to error code EC10, and shows an example of the occurrence status of error code EC0.

[0041] The five types of error codes EC0, error code EC1 to error code EC5, indicate that the occurrence status of error code EC0 is lower than the predetermined level LV1 and is within the normal range (no abnormal trends are observed). Similarly, the four types of error codes EC0, error code EC7 to error code EC10, indicate that the occurrence status of error code EC0 is lower than the predetermined level LV1 and is within the normal range (no abnormal trends are observed).

[0042] In contrast, error code EC6 indicates that the occurrence of error code EC0 is higher than the predetermined level LV1, exceeding the normal range (indicating an abnormal trend). Therefore, in this case, the acquisition unit 71 acquires an analysis result indicating that the occurrence frequency of error code EC6 exceeds the predetermined level LV1. The predetermined level LV1, which is a threshold for determining whether or not an abnormal trend exists, can be set arbitrarily based on, for example, past production results. Furthermore, the predetermined level LV1 can be set to a different value for each type of error code EC0.

[0043] In the above example, when the acquisition unit 71 acquires an analysis result indicating that the occurrence frequency of the error code EC6 exceeds the predetermined level LV1, the generation unit 72 automatically generates a workflow WF0 that supports a countermeasure operation to improve the abnormality indicated by the error code EC6 that exceeds the predetermined level LV1. The generation unit 72 may take various forms as long as it can automatically generate the above workflow WF0. For example, the generation unit 72 can automatically generate a workflow WF0 for each of the items MD0 used in the substrate-related operation machine WM0 and related to the abnormality in the substrate-related operation.

[0044] The item MD0 is not limited to any particular item as long as it is used by the substrate-related operation machine WM0 and is related to an abnormality in the substrate-related operation. For example, the substrate-related operation machine WM0 may include a component mounting machine WM3 that mounts components 91 on a board 90. In this embodiment, the substrate-related operation includes, for example, a supply operation in which components 91 are supplied from a component supply device 12, a picking operation in which components 91 supplied by the component supply device 12 are picked up and held by a holding member 30, and a mounting operation in which components 91 picked up and held by the holding member 30 are mounted on the board 90.

[0045] The component supply device 12, the holding member 30, and the component 91 may be related to abnormalities in these substrate-related operations. Therefore, the item MD0 may be at least one of the component supply device 12 that supplies the component 91, the holding member 30 that collects and holds the component 91 supplied by the component supply device 12, and the component 91. Figure 6 shows an example of setting operating conditions for the production information analysis device 80 in accordance with the analysis results of the occurrence status of the error code EC0. This figure shows an example of a display screen 81a of the display device 81 provided in the production information analysis device 80, and the same applies to other setting examples of operating conditions and display examples of the workflow WF0 described below.

[0046] In the scope (the range in which the workflow WF0 is automatically generated) in the figure, it is possible to set at least one of the component supply device 12, the holding member 30, and the component 91 included in the item MD0. The generation unit 72 can set, for example, the feeder 12a and the tray unit included in the component supply device 12 in the scope. The generation unit 72 can also set, for example, the suction nozzle and the chuck included in the holding member 30 in the scope. Furthermore, the generation unit 72 can also set, for example, the type of the component 91 in the scope.

[0047] The generation unit 72 can also set an error code (corresponding to the error code EC0), a sub-error (an arbitrary code added to the error code EC0), etc. In the example described above, the generation unit 72 sets the error code EC6 in the error code. Note that a wildcard (an arbitrary code) is set for the sub-error. The generation unit 72 can also set an upper limit number of times (corresponding to the predetermined level LV1 described above), a designated parameter (the number of production information items used to determine whether the frequency of occurrence of the error code EC0 is abnormal), etc. In the same figure, the upper limit number of times is set to an upper limit number UN1, and the designated parameter is set to a designated parameter BS1. The upper limit number of times UN1 and the designated parameter BS1 can be set arbitrarily.

[0048] Furthermore, the generating unit 72 can set the notification content to be notified to the worker in the notification content. Furthermore, the condition list displays a list of at least one operating condition set by the generating unit 72. In this way, the setting values ​​of the operating conditions of the production information analyzing device 80 are automatically set by the generating unit 72 to predetermined values ​​(for example, manufacturer-recommended values ​​for the substrate-related operating machine WM0). The fact that the setting values ​​of the operating conditions of the production information analyzing device 80 are automatically set by the generating unit 72 can also be applied to other operating conditions described below.

[0049] Note that the worker can change the above operating conditions after the workflow WF0 is automatically generated by the generating unit 72. In this case, the worker selects the operating condition of the production information analysis device 80 that the worker wants to change in the condition list, changes the operating condition, and then operates the update icon. The worker can also add an operating condition of the production information analysis device 80. In this case, the worker operates the add icon to add the operating condition of the production information analysis device 80. The worker can also delete an operating condition of the production information analysis device 80. In this case, the worker selects the operating condition of the production information analysis device 80 that the worker wants to delete in the condition list, and then operates the delete icon. The fact that the setting values ​​of the operating conditions of the production information analysis device 80 can be changed by the worker is also true for other operating conditions described below.

[0050] The workflow WF0 is a program file that can execute, for example, at least one of the tasks to be performed by the substrate-related performing machine WM0 and the task guidance to the worker who will perform the corresponding task. In this case, it is difficult for the worker to recognize the content of the workflow WF0 automatically generated by the generation unit 72. Therefore, the generation unit 72 can display the content of the automatically generated workflow WF0 using icons or the like on, for example, the display screen 81a of the display device 81. Figure 7 shows an example of the workflow WF0, in which the content of the workflow WF0 automatically generated by the generation unit 72 is represented by icons.

[0051] The generation unit 72 can automatically generate a workflow WF0 in which, for example, icons IC11, IC2, IC3, IC2, and IC4 are executed in this order. In the figure, the order of programs to be executed is indicated by arrows. Icon IC11, which indicates the program to be executed first, represents a program that detects an abnormal trend and performs error analysis. For example, the error analysis is performed based on the operating conditions of the production information analysis device 80 shown in FIG. 6 in the occurrence situation of the error code EC0 shown in FIG. 5, which has already been described.

[0052] Icon IC2, which is executed after icon IC11, represents a program for displaying a message on the display screen 81a. For example, the production information analysis device 80 can display the analysis results of the production information acquired by the acquisition unit 71 on the display screen 81a. The production information analysis device 80 can also display work guidance for workers performing corrective work on the display screen 81a. The production information analysis device 80 can also display work to be performed by the substrate-related performing machine WM0 on the display screen 81a. Icon IC3, which is executed after icon IC2, represents a program for temporarily suspending the substrate-related performing work by the substrate-related performing machine WM0.

[0053] For example, if the substrate-related operation performing machine WM0 is component mounting machine WM3, component mounting machine WM3 executes a cycle stop, which temporarily suspends the mounting process during a predetermined cycle of the pick-and-place cycle. The execution of the cycle stop is included in the operations to be executed by the substrate-related operation performing machine WM0. Then, icon IC2 is executed again after icon IC3. For example, the production information analysis device 80 can display, on at least one of the display screen 81a of the production information analysis device 80 and the display device of the substrate-related operation performing machine WM0 (e.g., display device 17 of component mounting machine WM3), that the substrate-related operation performed by the substrate-related operation performing machine WM0 has been temporarily suspended.

[0054] This enables the production information analysis device 80 to prompt the worker to take corrective action. The program represented by icon IC3 can also be omitted. Icon IC4 defines the end of the workflow WF0 and indicates the end of a series of programs. In this way, the workflow WF0 may be a program file including at least one unit program obtained by dividing the program for each predetermined operation unit of the production information analysis device 80.

[0055] The execution unit 73 reads the workflow WF0 and operates the production information analysis device 80 (step S13 shown in FIG. 4 ). This allows the production information analysis device 80 to support the countermeasure work. The production information analysis device 80 can, for example, display work guidance for the worker performing the countermeasure work on the display screen 81a. FIG. 8 shows an example of the countermeasure work guidance. As shown in the figure, the production information analysis device 80 can provide specific guidance on the countermeasure work along with text information of the warning on the display screen 81a. The production information analysis device 80 can display, for example, the date and time of the event occurrence, the line name (the name of the substrate-related work line WL0), the equipment name (the name of the substrate-related work machine WM0), and a message (specific details of the countermeasure work). This information can be displayed, for example, in the order of the date and time of the event occurrence.

[0056] The production information analysis device 80 can also display the module number (for example, an identification number for identifying multiple (three in FIG. 1 ) component placement machines WM3), the location of the event, and the work target (for example, the feeder 12a, the holding member 30, etc.). The production information analysis device 80 can also provide audio guidance on how to handle the problem. Furthermore, the production information analysis device 80 can also provide guidance on how to handle the problem using a mobile terminal or the like owned by the worker.

[0057] As described above, for example, the generation unit 72 can automatically generate a workflow WF0 for each of the items MD0 used in the substrate-related operation machine WM0 and related to an abnormality in the substrate-related operation. In addition, when the substrate-related operation machine WM0 includes a component mounting machine WM3, the items MD0 may be at least one of the component supply device 12 that supplies the components 91, the holding member 30 that picks up and holds the components 91 supplied by the component supply device 12, and the components 91.

[0058] The execution unit 73, for example, reads the workflow WF0 generated for the feeder 12a related to the abnormality and operates the production information analysis device 80. As a result, the production information analysis device 80 can notify the worker of the possibility of an abnormality in the feeder 12a (for example, a malfunction of a sprocket that pitch-feeds the carrier tape) and have the worker perform maintenance work on the feeder 12a. The production information analysis device 80 provides guidance on corrective work, such as, for example, "There have been many failures in picking up parts 91. Please perform maintenance work on the feeder 12a."

[0059] When an operator deals with the above-described abnormality of the feeder 12a, the operator removes the feeder 12a from the component supply device 12 of the component mounting machine WM3, performs maintenance work on the feeder 12a, and then reattaches the feeder 12a to the component supply device 12 of the component mounting machine WM3. The maintenance work on the feeder 12a involves, for example, setting the feeder 12a in a maintenance unit and checking the operation of the feeder 12a.

[0060] The execution unit 73 can also, for example, read the workflow WF0 generated for the holding member 30 related to the abnormality and operate the production information analysis device 80. This allows the production information analysis device 80 to notify the worker of the possibility of an abnormality in the holding member 30 (for example, a clogged suction nozzle or adhesion of foreign matter), and have the worker perform maintenance work on the holding member 30. The production information analysis device 80 provides guidance on corrective work, such as, for example, "There have been many failures in picking up parts 91. Please perform maintenance work on the holding member 30."

[0061] When a worker addresses the abnormality in the holding member 30, the worker removes the holding member accommodation device that houses the holding member 30 from the base of the component mounting machine WM3, performs maintenance on the holding member 30, and then reinstalls the holding member accommodation device on the base of the component mounting machine WM3. The holding member accommodation device includes, for example, a nozzle station that houses a suction nozzle. Thus, the troubleshooting work includes removing the object MD0 used in the substrate-related operation from the substrate-related operation machine WM0 and performing maintenance on the removed object MD0.

[0062] As already described, the control device 16 of the component mounting machine WM3 causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the holding orientation of the component 91. The control device 16 uses component information in the image processing. The component information can include various information related to the component 91.

[0063] For example, the component information may include shape-related information that includes at least information about the shape of the component 91. The information about the shape of the component 91 includes information about the size of the component 91. If the component 91 is a lead component, the information about the shape of the component 91 includes information about the number, position (coordinates), orientation, length, width, pitch, etc. of the leads. If the component 91 is a BGA (Ball Grid Array) component or the like, the information about the shape of the component 91 includes information about the number, position (coordinates), diameter, pitch, etc. of the bumps. If the component 91 has a direction check mark, the information about the shape of the component 91 includes information about the position, brightness, etc. of the direction check mark.

[0064] The shape-related information may also include information related to image processing of image data of the component 91. For example, the information related to image processing may include information about an algorithm for processing image data of the component 91 captured by an imaging device. The shape-related information may also include information related to handling of the component 91 (handling information). For example, the handling information may include information related to the holding member 30 used to hold the component 91 (e.g., the nozzle diameter of the suction nozzle). The shape-related information may also include information related to the imaging conditions for capturing an image of the component 91, information related to the electrical characteristics of the component 91, and the like.

[0065] If the control device 16 performs the image processing described above using part information (e.g., shape-related information) that does not match the part 91 supplied from the feeder 12a, the control device 16 may not be able to accurately recognize the part 91, which may result in an abnormality in the image processing. Therefore, the execution unit 73 may read, for example, the workflow WF0 generated for the part 91 related to the abnormality, and operate the production information analysis device 80.

[0066] As a result, the production information analysis device 80 can notify the worker of the possibility of an abnormality in the component 91 (for example, an abnormality in the image processing described above) and have the worker carry out work to change the component information. The production information analysis device 80 provides guidance on corrective work, such as, for example, "There have been many failures in picking the component 91. Please check the component information." In this case, the worker changes the component information by editing the software in which the component information is set. In this way, the corrective work can also include parameter change work to change the control parameters that control the substrate-related work.

[0067] The substrate-related operation machine WM0 may also include a component mounting machine WM3 that mounts components 91 on the board 90, and a visual inspection machine WM5 that inspects the mounting state of the components 91 mounted by the component mounting machine WM3. In this configuration, the production information may include an error code EC0 of the component mounting machine WM3 that is obtained from the visual inspection machine WM5 and that is related to a defective mounting state of the components 91. For example, the visual inspection machine WM5 can inspect for missing components 91, i.e., when no components 91 are mounted on the board 90. The visual inspection machine WM5 can also inspect for misalignment, i.e., when the mounting position of the components 91 mounted on the board 90 exceeds an acceptable range.

[0068] Therefore, similarly to the error code EC0 already described, the generation unit 72 can also automatically generate a workflow WF0 based on, for example, an error code EC0 indicating that a component 91 is not installed. The generation unit 72 can also automatically generate a workflow WF0 based on, for example, an error code EC0 indicating that a component 91 is installed improperly. As shown in Fig. 7 , the generation unit 72 can automatically generate a workflow WF0 in which, for example, icons IC12, IC2, IC3, IC2, and IC4 are executed in this order.

[0069] In the above workflow WF0, the previously described icon IC11 has been changed to icon IC12. Icon IC12 represents a program that issues a notification when the visual inspection machine WM5 detects that a component 91 has not been installed. Similarly, the above workflow WF0 can also include a program that issues a notification when the visual inspection machine WM5 detects that a component 91 has been installed incorrectly. The program represented by icon IC3 can also be omitted. Furthermore, the execution unit 73 can read the above workflow WF0 and operate the production information analysis device 80, similar to the previously described embodiment. Furthermore, the production information analysis device 80 can guide the worker to take corrective action, similar to the previously described embodiment, and the worker can carry out the corrective action.

[0070] The substrate-related operation machine WM0 may also include a component mounting machine WM3 that mounts components 91 on the substrate 90 and a print inspection machine WM2 that inspects the state of solder printing printed on the substrate 90 by the printer WM1. In this configuration, the production information may include an error code EC0 of the component mounting machine WM3 related to a defect in the state of solder printing obtained from the print inspection machine WM2. For example, the print inspection machine WM2 may inspect for printing misalignment, in which the printing position of the solder printed on the substrate 90 exceeds an acceptable range. When the component mounting machine WM3 mounts components 91 on the solder printed on the substrate 90, misalignment of the solder printing may result in misplacement of the components 91.

[0071] In this case as well, the generation unit 72 can automatically generate a workflow WF0 based on the error code EC0 indicating a misplaced mounting of the component 91. As shown in Fig. 7, the generation unit 72 can automatically generate a workflow WF0 in which, for example, the icons IC13, IC2, IC3, IC2, and IC4 are executed in this order. In the above workflow WF0, the previously described icon IC11 is changed to icon IC13.

[0072] Icon IC13 represents a program that notifies when misalignment of solder printing is detected by the print inspection machine WM2. Note that in this case as well, the program represented by icon IC3 can be omitted. Furthermore, the execution unit 73 can read the above workflow WF0 and operate the production information analysis device 80, similar to the previously described embodiment. Furthermore, the production information analysis device 80 can guide the worker to take corrective action, similar to the previously described embodiment, and the worker can carry out the corrective action.

[0073] As shown in Figure 1, product substrates 900 are produced by sequentially transporting substrates 90 along a substrate-related work line WL0 equipped with a plurality of substrate-related work machines WM0. The uniformity of the cycle time TS0, which is the time it takes for a substrate-related work to be performed by the substrate-related work machine WM0, along the substrate-related work line WL0 is referred to as load balance LD0. For example, the substrate-related work line WL0 shown in Figure 1 is equipped with a plurality of (three in this figure) component mounters WM3. Figure 9 shows an example of the load balance LD0 in this case.

[0074] The horizontal axis in the figure represents modules, and the vertical axis represents cycle time TS0. Module M1 represents the component placement machine WM3 that is located most upstream of the multiple (three) component placement machines WM3. Module M2 represents the component placement machine WM3 that is located in the center of the multiple (three) component placement machines WM3. Module M3 represents the component placement machine WM3 that is located most downstream of the multiple (three) component placement machines WM3. Broken line L2 connects the cycle times TS0 of modules M1 to M3 with a straight line, and represents an example of load balance LD0.

[0075] Modules M1 and M3 indicate that the cycle time TS0 is within the range from upper limit LV21 to lower limit LV22, and that the load balance LD0 is within the predetermined range. In contrast, module M2 indicates that the cycle time TS0 is outside the range from upper limit LV21 to lower limit LV22, and that the load balance LD0 is not within the predetermined range. In this way, if the load balance LD0 is not within the predetermined range, the overall work efficiency of the multiple (three) component placement machines WM3 may decrease.

[0076] Therefore, the production information can include a load balance LD0 that is the uniformity of a cycle time TS0, which is the time it takes for a substrate-related operation to be performed by the substrate-related operation machine WM0, on the substrate-related operation line WL0. In this embodiment, when the acquisition unit 71 acquires an analysis result that indicates that the load balance LD0 is outside a predetermined range, the generation unit 72 automatically generates a workflow WF0 that supports corrective work to improve the cycle time TS0 of the substrate-related operation machine WM0 that is outside the predetermined range.

[0077] In the above example, the cycle time TS0 of the component placement machine WM3 of module M2 exceeds the range between the upper limit LV21 and the lower limit LV22, and the acquisition unit 71 acquires an analysis result indicating that the load balance LD0 is outside the predetermined range. Note that the predetermined range for determining the load balance LD0 can be set arbitrarily based on, for example, past production results. In addition, in the above example, the generation unit 72 automatically generates a workflow WF0 that supports corrective actions to improve the cycle time TS0 of the component placement machine WM3 of module M2.

[0078] 10 shows an example of setting operating conditions for the production information analysis device 80 according to the analysis results of the load balance LD0. On the setting screen shown in the figure, the generation unit 72 can set the specified number, lower limit, and so on. The specified number refers to the minimum number of product boards 900 for determining the load balance LD0. The lower limit refers to the lower limit of the load balance LD0. In this case, the load balance LD0 can be expressed as a percentage obtained by dividing the average cycle time TS0 of all modules (in the above example, modules M1 to M3) by the average cycle time TS0 of the bottleneck module (in the above example, module M2), and multiplying the result by 100.

[0079] In the figure, the specified number is set to a specified number BN1, and the lower limit is set to a lower limit LN1. The specified number BN1 and the lower limit LN1 can be set arbitrarily. In the setting example shown in the figure, if the number of product boards 900 produced exceeds the specified number BN1 and the load balance LD0 is smaller than the lower limit LN1, this is treated as an error input. Also, as shown in FIG. 7, the generation unit 72 can automatically generate a workflow WF0 in which, for example, icon IC14, icon IC2, and icon IC4 are executed in this order.

[0080] Icon IC14 represents a program that detects an abnormality in the load balancer LD0 and performs error analysis. For example, the error analysis is performed in the load balancer LD0 shown in FIG. 9, as described above, based on the operating conditions of the production information analysis device 80 shown in FIG. 10. Furthermore, the execution unit 73 can read the workflow WF0 and operate the production information analysis device 80, as in the previously described embodiment. Furthermore, the production information analysis device 80 can guide users on how to handle the problem, as in the previously described embodiment.

[0081] In this case, the production information analysis device 80 provides guidance on corrective action, such as, for example, "Production efficiency is declining. Please check the bottleneck module (module M2 in the above example)." The worker then performs corrective action on the bottleneck module (module M2 in the above example). For example, the worker can change the control program or the placement of the feeder 12a so that the load balance LD0 falls within a predetermined range.

[0082] Furthermore, product substrates 900 are produced by sequentially transporting substrates 90 on a substrate-related operation line WL0 equipped with a plurality of substrate-related operation machines WM0. In this case, when one of the plurality of substrate-related operation machines WM0 is used as a reference, if a waiting time occurs in a substrate-related operation machine WM0 for a previous process on the upstream side or a substrate-related operation machine WM0 for a subsequent process on the downstream side, the efficiency of the substrate-related operation by the one substrate-related operation machine WM0 may decrease depending on the waiting time TW0.

[0083] 11 shows an example of the waiting time TW0 for waiting for work. The horizontal axis of the figure represents the substrate-related operation machine WM0, and the vertical axis represents the waiting time TW0 for waiting for work. The broken line L3 is a straight line connecting the waiting times TW0 for waiting for work at each of the substrate-related operation machines WM0 from the printing machine WM1 to the visual inspection machine WM5, and shows an example of the waiting time TW0 for waiting for work. For the printing machine WM1, the print inspection machine WM2, and the multiple (three) component placement machines WM3, the waiting time TW0 for waiting for work is shorter than the specified level LV3, indicating that the waiting time TW0 for waiting for work is within the acceptable range.

[0084] In contrast, in the reflow furnace WM4 and the visual inspection machine WM5, the waiting time TW0 for waiting for work is longer than the specified level LV3, indicating that the waiting time TW0 for waiting for work exceeds the allowable range. In this way, the production information can include the occurrence status of waiting for work in the upstream substrate-related operation machine WM0 in the pre-process or the downstream substrate-related operation machine WM0 in the post-process, based on one of the multiple substrate-related operation machines WM0.

[0085] In this embodiment, when the acquisition unit 71 acquires an analysis result showing that the operation waiting time TW0 exceeds the specified level LV3, the generation unit 72 automatically generates a workflow WF0 that supports corrective work to improve the operation waiting time TW0 of the substrate-related operation machine WM0 that has exceeded the specified level LV3. In the above example, the operation waiting time TW0 of the reflow furnace WM4 and the visual inspection machine WM5 is longer than the specified level LV3, and the acquisition unit 71 acquires analysis results showing that the operation waiting time TW0 of the reflow furnace WM4 and the visual inspection machine WM5 has exceeded the specified level LV3.

[0086] The specified level LV3 can be set arbitrarily based on, for example, past production results. In the above example, the generation unit 72 automatically generates a workflow WF0 that supports corrective actions to improve the waiting time TW0 of the downstream reflow furnace WM4 and the visual inspection machine WM5, which are downstream of the multiple (three) component mounting machines WM3. Figure 12 shows an example of setting operating conditions for the production information analysis device 80 based on the analysis results of the waiting time TW0 for tasks. On the setting screen shown in the figure, the generation unit 72 can set the detection items, upper limit time, upper limit number of times, specified parameter, etc.

[0087] The detection item can be selected as "waiting for the previous process" or "waiting for the next process." In the above example, the waiting time TW0 for the downstream reflow furnace WM4 and visual inspection machine WM5 exceeds the specified level LV3, based on the component mounting machine WM3 that is located furthest downstream among the multiple (three) component mounting machines WM3. Therefore, in this case, the detection item is selected as "waiting for the next process." The upper limit time is set to the allowable time for the waiting time TW0 for the waiting time. In the above example, the upper limit time corresponds to the specified level LV3.

[0088] Furthermore, if the number of times the upper limit time is exceeded exceeds the upper limit count, it is treated as an error input. The designated parameter refers to the number of product boards 900 produced that are used to count the upper limit count. In the figure, the upper limit count is set to the upper limit count UN2, and the designated parameter is set to the designated parameter BS2. The upper limit count UN2 and the designated parameter BS2 can be set arbitrarily. In the setting example shown in the figure, if the number of product boards 900 produced exceeds the designated parameter BS2 and the upper limit count exceeds the upper limit count UN2, it is treated as an error input.

[0089] 7, the generation unit 72 can automatically generate a workflow WF0 in which, for example, icons IC15, IC2, and IC4 are executed in this order. Icon IC15 represents a program that detects an abnormality during the operation waiting time TW0 and performs error analysis. For example, the error analysis is performed during the operation waiting time TW0 shown in FIG. 11, based on the operating conditions of the production information analysis device 80 shown in FIG. 12.

[0090] The execution unit 73 can also read the workflow WF0 and operate the production information analysis device 80, similar to the previously described embodiment. Furthermore, the production information analysis device 80 can also guide users to take corrective action, similar to the previously described embodiment. In this case, the production information analysis device 80 provides guidance on corrective action, such as, "There are frequent wait times in the downstream process. Please check the reflow furnace WM4 and the visual inspection machine WM5 downstream of the component placement machine WM3." The worker performs corrective action on the substrate-related operation machine WM0 (in the above example, the reflow furnace WM4 and the visual inspection machine WM5) that has exceeded the specified level LV3. For example, the worker can change the transport interval of the substrate 90 so that the waiting time TW0 is shorter than the specified level LV3.

[0091] Furthermore, for example, if the production environment of product board 900 to be produced is changed, the necessity of workflow WF0 automatically generated by generation unit 72 may decrease. Therefore, if the necessity of workflow WF0 automatically generated by generation unit 72 has decreased (if Yes in step S14 shown in FIG. 4), deletion unit 74 can delete workflow WF0 whose necessity has decreased (step S15). The necessity of workflow WF0 can be determined, for example, by the frequency of use of workflow WF0 (for example, the number of times it is used in a predetermined period).

[0092] Then, the control by the work support device 70 is temporarily terminated. If the workflow WF0 automatically generated by the generation unit 72 is needed (No in step S14), the control by the work support device 70 is temporarily terminated without executing the process shown in step S15. Note that the control by the work support device 70 can be repeatedly executed at a predetermined cycle. Furthermore, the worker can also change the workflow WF0 automatically generated by the generation unit 72 as needed.

[0093] For example, the worker can change the workflow WF0 to suit the production environment of the product board 900 to be produced. The worker can also change the workflow WF0 to suit the error code EC0, etc., whose occurrence frequency the worker wants to check. Specifically, the worker can change the workflow WF0 by changing at least one of the icon type, connection, and setting value shown in FIG. 7.

[0094] The worker can also change the workflow WF0 by moving commands in area AR1 shown in FIG. 7 to area AR2. The commands in area AR1 include, for example, programs with input functions (such as obtaining inspection results for defects in substrate-related operations), device operation functions (such as operations to be performed by the substrate-related operation machine WM0), and output functions (such as displaying warnings). The commands in area AR1 are displayed as icons, similar to the programs already described. In this way, the worker can also customize the workflow WF0 automatically generated by the generation unit 72.

[0095] 2. Work Support Method What has already been described about the work support device 70 also applies to the work support method. Specifically, the work support method includes an acquisition process and a generation process. The acquisition process corresponds to the control performed by the acquisition unit 71. The generation process corresponds to the control performed by the generation unit 72. The work support method can also include an execution process. The execution process corresponds to the control performed by the execution unit 73. The work support method can also include a deletion process. The deletion process corresponds to the control performed by the deletion unit 74. Note that duplicated explanations will be omitted in this specification.

[0096] 3. Example of Effect of the Embodiment According to the work support device 70, a workflow WF0 that defines the operating procedure of the production information analysis device 80 that supports the response work can be automatically generated in accordance with the analysis results of the production information. What has been described above about the work support device 70 can also be said about the work support method.

[0097] 12: Component supply device, 30: Holding member, 70: Work support device, 71: Acquisition unit, 72: Generation unit, 73: Execution unit, 74: Deletion unit, 80: Production information analysis device, 90: Board, 91: Part, 900: Product board, EC0: Error code, LD0: Load balance, TW0: Waiting time, MD0: Item, TS0: Cycle time, WF0: Workflow, LV1: Predetermined level, LV3: Specified level, WL0: Board-related work line, WM0: Board-related work machine, WM1: Printing machine, WM2: Printing inspection machine, WM3: Parts placement machine, WM5: Appearance inspection machine.

Claims

1. An acquisition unit that acquires an analysis result obtained by collecting and analyzing production information of a substrate processing machine that produces a product substrate by performing a predetermined substrate processing on a substrate; and a generation unit that automatically generates a workflow that defines an operation procedure of a production information analysis apparatus that supports a countermeasure operation for improving the substrate processing by the substrate processing machine, according to the analysis result acquired by the acquisition unit. A work support apparatus comprising:

2. The production information includes an error code indicating a type of abnormality in the substrate processing by the substrate processing machine. The generation unit automatically generates the workflow that supports the countermeasure operation for improving the abnormality indicated by the error code exceeding a predetermined level when the analysis result in which the occurrence frequency of the error code exceeds the predetermined level is acquired by the acquisition unit. The work support apparatus according to claim 1.

3. The generation unit automatically generates the workflow for each of the articles used in the substrate processing machine and related to the abnormality in the substrate processing. The work support apparatus according to claim 2.

4. The substrate processing machine includes a component mounting machine that mounts components on the substrate. The article is at least one of a component supply device that supplies the components, a holding member that picks up and holds the components supplied by the component supply device, and the components. The work support apparatus according to claim 3.

5. The substrate processing machine includes a component mounting machine that mounts components on the substrate and an appearance inspection machine that inspects the mounting state of the components mounted by the component mounting machine. The production information includes the error code of the component mounting machine related to the defect in the mounting state of the components obtained from the appearance inspection machine. The work support apparatus according to any one of claims 2 to 4.

6. The substrate processing machine includes a component mounting machine that mounts components on the substrate and a printing inspection machine that inspects the printing state of solder printed on the substrate by a printing machine. The production information includes the error code of the component mounting machine related to the defect in the printing state of the solder obtained from the printing inspection machine. The work support apparatus according to any one of claims 2 to 4.

7. The product substrate is produced by sequentially conveying the substrate in a substrate pair working line including a plurality of the substrate pair working machines, the production information includes a load balance which is the degree of equality in the substrate pair working line of the cycle time that is the time when the substrate pair working is performed in the substrate pair working machine, and when the analysis result in which the load balance deviates from a predetermined range is acquired by the acquisition unit, the generation unit automatically generates the workflow for assisting the countermeasure operation for improving the cycle time of the substrate pair working machine that has deviated from the predetermined range. The work support device according to claim 1.

8. The product substrate is produced by sequentially conveying the substrate in a substrate pair working line including a plurality of the substrate pair working machines, the production information includes the occurrence status of work waiting in the substrate pair working machine in the previous process on the upstream side or the substrate pair working machine in the subsequent process on the downstream side with respect to one of the plurality of substrate pair working machines as a reference, and when the analysis result in which the waiting time of the work waiting exceeds a prescribed level is acquired by the acquisition unit, the generation unit automatically generates the workflow for assisting the countermeasure operation for improving the waiting time of the substrate pair working machine that has exceeded the prescribed level. The work support device according to claim 1.

9. The workflow is a program file capable of executing at least one of the work to be executed on the substrate pair working machine and the work guidance to the worker who performs the countermeasure operation, and the work support device according to claim 1 includes an execution unit that reads the workflow and operates the production information analysis device.

10. The work support device according to claim 1 includes a deletion unit that deletes the workflow in which the necessity has decreased when the necessity of the workflow automatically generated by the generation unit has decreased.

11. An acquisition step of acquiring an analysis result obtained by collecting and analyzing production information of a substrate pair working machine that performs a predetermined substrate pair working on a substrate to produce a product substrate, and a generation step of automatically generating a workflow that defines an operation procedure of a production information analysis device for assisting a countermeasure operation for improving the substrate pair working by the substrate pair working machine according to the analysis result acquired in the acquisition step. A work support method.

Images